Light receiving element, light emitting device

Abstract

To achieve a light-receiving element configured to reduce a length in a direction perpendicular to a direction in which light-receiving regions are arranged.SOLUTION: It is intended to achieve a light-receiving element configured to reduce a length in a direction perpendicular to a direction in which light-receiving regions are arranged. The light-receiving element includes a light-receiving surface provided with a plurality of light-receiving regions disposed side by side in a first direction, and a plurality of wiring regions electrically connected to the plurality of light-receiving regions. Of the plurality of wiring regions, a plurality of wiring regions electrically connected to the plurality of light-receiving regions are disposed in an end region that is a region except for a central region on the light-receiving surface.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a light receiving element and a light emitting device. [Background technology]

[0002] Conventionally, optical units have been known in which a light receiving element receives a portion of light emitted from a light emitting element and performs optical control based on the light receiving result. Patent Document 1 discloses a light receiving element in which three light receiving sections are arranged side by side and metal electrodes are provided for each light receiving section. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-311664 Summary of the Invention [Problem to be solved by the invention]

[0004] When a light receiving element is provided with a plurality of light receiving regions, there is room for improvement in the layout relationship between the plurality of light receiving regions and the wiring region associated with the plurality of light receiving regions. [Means for solving the problem]

[0005] The light-receiving element of the present disclosure is a light-receiving element having a light-receiving surface provided with a plurality of light-receiving regions arranged side by side in a first direction and a plurality of wiring regions electrically connected to the plurality of light-receiving regions, wherein the plurality of wiring regions that are electrically connected to two adjacent light-receiving regions among the plurality of wiring regions are provided in end regions of the light-receiving surface, which are regions excluding a central region, and the central region includes a region sandwiched between a straight line that passes through a midpoint of the width in the first direction of the light-receiving region that is arranged at one end of the light-receiving regions arranged at both ends on the light-receiving surface and extends in a second direction perpendicular to the first direction, and a straight line that passes through a midpoint of the width in the first direction of the light-receiving region that is arranged at the other end and extends in the second direction.

[0006] Furthermore, the light-receiving element of the present disclosure is a light-receiving element having a light-receiving surface provided with a plurality of light-receiving regions arranged in a first direction and a plurality of wiring regions electrically connected to the plurality of light-receiving regions, wherein the plurality of wiring regions electrically connected to the two light-receiving regions arranged at both ends of the plurality of wiring regions are provided in end regions of the light-receiving surface, which are regions excluding a central region, and are not provided in the central region, and the central region includes a region sandwiched between a straight line extending in a second direction perpendicular to the first direction and passing through an end point of the light-receiving region arranged at one end of the light-receiving regions arranged at both ends, the end point being located farthest from the light-receiving region at the other end, and a straight line extending in the second direction and passing through an end point of the light-receiving region arranged at the other end being located farthest from the light-receiving region at one end.

[0007] The light emitting device of the present disclosure includes a plurality of light emitting elements arranged in a first direction, each having an upper surface, a lower surface, and a side surface including an emission end surface from which light is emitted; a light receiving element arranged in the first direction and having a light receiving surface on which a plurality of light receiving regions onto which light emitted from the plurality of light emitting elements is irradiated and a plurality of first wiring regions are provided; a base having a plurality of second wiring regions and on which the plurality of light emitting elements and the light receiving element are arranged; and a base having one end joined to one of the plurality of first wiring regions and the other end joined to one of the plurality of second wiring regions. and a plurality of wirings joined to either one of the light receiving regions, the plurality of first wiring regions being provided in end regions of the light receiving surface excluding a central region, and the central region includes a region sandwiched in a top view between a straight line passing through an irradiation point of light passing through an optical axis of light irradiated to the light receiving region arranged at one end of the light receiving regions arranged at both ends on the light receiving surface, and a straight line passing through an irradiation point of light passing through an optical axis of light irradiated to the light receiving region arranged at the other end, and extending in the second direction. [Effects of the Invention]

[0008] According to the embodiment of the present disclosure, a light receiving element having a reduced length in a direction perpendicular to the direction in which the light receiving regions are arranged can be realized. Furthermore, by using this light receiving element, a light emitting device having a reduced height can be realized. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view of the light emitting device according to the first embodiment. [Figure 2] FIG. 2 is a perspective view of the light emitting device according to the first embodiment with the cover member removed. [Figure 3] FIG. 3 is a top view of the light emitting device according to the first embodiment with the cover member removed. [Figure 4] FIG. 4 is an enlarged view of a portion X in the top view of FIG. [Figure 5] FIG. 5 is a cross-sectional view of the light emitting device taken along the line VV in FIG. [Figure 6] FIG. 6 is a perspective view of the light receiving element according to the embodiment. [Figure 7] FIG. 7 is a top view of the light receiving element according to the embodiment. [Figure 8] FIG. 8 is a perspective view of the light emitting device according to the second embodiment. [Figure 9] FIG. 9 is a perspective view of the light emitting device according to the second embodiment with the cover member removed. DETAILED DESCRIPTION OF THE INVENTION

[0010] In this specification and claims, polygons such as triangles and quadrilaterals are referred to as polygons, including shapes in which the corners of the polygons have been rounded, chamfered, corner-cut, rounded, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle portions of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while retaining the polygonal base are included in the interpretation of "polygon" described in this specification and claims.

[0011] The same applies to words that describe specific shapes, such as trapezoids, circles, and irregularities, not just polygons. The same also applies when dealing with the sides that form the shape. In other words, even if the corners or middle part of a side are processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0012] Furthermore, in this specification or the claims, when there are multiple equivalents to a certain element and each is to be expressed separately, the element may be distinguished by adding "first" or "second" to the beginning of the element. Furthermore, when the objects or viewpoints distinguished between this specification and the claims are different, the same notation may not refer to the same object between the specification and the claims.

[0013] For example, if there are objects in this specification that are distinguished by being marked with "first," "second," or "third," and the claims are written with only the "first" and "third" in this specification as the subject matter, the objects marked with "first" and "second" in the claims may refer to the objects marked with "first" and "third" in this specification.

[0014] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, although the illustrated embodiments embody the technical concept of the present invention, they do not limit the present invention. Furthermore, in the following description, the same names and symbols indicate the same or similar components, and redundant explanations may be omitted as appropriate. Note that the size and positional relationship of components shown in each drawing may be exaggerated for ease of understanding.

[0015] First Embodiment A light emitting device 1 according to a first embodiment will be described. FIGS. 1 to 7 are drawings for explaining an exemplary embodiment of the light emitting device 1. FIG. 1 is a perspective view of the light emitting device 1. FIG. 2 is a perspective view of the light emitting device 1 with a cover member 80 removed. FIG. 3 is a top view similar to FIG. 2. FIG. 4 is an enlarged view of a portion X of the light receiving surface 42 of the light receiving element 40 in the top view of FIG. 3. FIG. 5 is a cross-sectional view taken along the VV cross-sectional line in FIG. 1. FIG. 6 is a perspective view of the light receiving element 40. FIG. 7 is a top view of the light receiving element 40.

[0016] In the top view of FIG. 3, the wiring region 14 provided on the step portion 13 of the base 10 is indicated by hatching. The dashed line indicating portion X is an imaginary line. In the enlarged view of FIG. 4, the elliptical region indicated by a dotted line on the light-receiving surface 42 indicates the region to which light is irradiated. In the enlarged view of FIG. 4, an example of the third central region 463 is indicated by large hatching, and the edge region 47 based on this third central region 463 is indicated by small hatching. The dashed-dotted line drawn as an auxiliary line to indicate the third central region 463 and the width Y is an imaginary line. In FIG. 7, the second central region 462 is indicated by large hatching, and the edge region 47 based on the second central region 462 is indicated by small hatching. Further, the dashed dotted lines additionally drawn to indicate the first central region 461, the second central region 462, the width S, the width T, and the midline P are imaginary lines.

[0017] The light emitting device 1 has multiple components including a base 10, a semiconductor laser element 20, a submount 30, a light receiving element 40, a support 50, a protective element 60, multiple wirings 70, and a cover member 80 (see Figure 5 in particular for the support 50).

[0018] In the illustrated example of the light emitting device 1, three semiconductor laser elements 20, a submount 30, a light receiving element 40, a support base 50, and a plurality of wirings 70 are arranged in a space surrounded by a base 10 and a lid member 80. Light emitted from the three semiconductor laser elements 20 arranged in the space is emitted to the outside of the light emitting device 1.

[0019] First, each component will be described. (base 10) The base 10 has an arrangement area where other components are arranged, and side walls surrounding the arrangement area. The base 10 also has a recess, which is formed by the arrangement area and the side walls. The recess is recessed from the top surface of the base 10 toward the bottom surface. Here, the surface that forms the bottom of the recess is called the bottom surface. The bottom surface can be a major part of the arrangement area.

[0020] When viewed from above, the outer shape of the base 10 is rectangular. When viewed from above, the outer shape of the recessed portion of the recess is rectangular. When viewed from above, the outer shape of the bottom surface of the base 10 is rectangular. The outer shape of the bottom surface is smaller than the outer shape of the recessed portion. Note that none of these outer shapes need to be rectangular.

[0021] The base 10 has a bottom surface portion 11 and a side surface portion 12. The bottom surface portion 11 is a portion that constitutes the bottom surface of the base 10. The bottom surface portion 11 also includes the bottom surface and lower surface of the base 10. The side surface portion 12 is a portion that constitutes the side wall of the base 10. Therefore, the side surface portion 12 surrounds the bottom surface of the base 10 and extends upward from the bottom surface. The side surface portion 12 includes one or more outer surfaces, one or more inner surfaces, and an upper surface that intersects with the outer and inner surfaces of the base 10.

[0022] Here, the number of inner or outer surfaces of the base 10 depends on the shape surrounding the bottom surface. For example, if the shape surrounding the bottom surface is rectangular, inner surfaces are formed corresponding to each of the four sides of the rectangle, and the number of inner surfaces is multiple. For example, if the shape surrounding the bottom surface is circular, inner surfaces are formed corresponding to one circle, and the number of inner surfaces is one. The same applies to the outer surfaces.

[0023] The base 10 has one or more step portions 13. The step portions 13 are formed in the recessed portions of the base 10. Here, the step portion 13 refers to a portion that is made up of only the upper surface and the inner side surface that intersects with the upper surface and extends downward. The step portion 13 is included in the side surface portion 12 of the base 10. The step portion 13 is provided below the upper surface of the base 10. In addition, the step portion 13 is formed between the outer shape of the recessed portion of the base 10 and the outer shape of the bottom surface when viewed from above.

[0024] The step portion 13 is formed along the inner side surface that intersects with the upper surface of the base 10. Therefore, the inner side surface that intersects with the upper surface of the base 10 intersects with the upper surface of the step portion 13. Furthermore, the step portion 13 is formed along a part of the inner side surface that intersects with the upper surface of the base 10. In other words, the step portion 13 is not provided along the entire periphery of the inner side surface that intersects with the upper surface of the base 10. However, the step portion 13 may be provided along the entire periphery.

[0025] In the illustrated example of the light emitting device 1, the outer shape of the inner surface that intersects with the upper surface of the base 10 is rectangular when viewed from above, and the step portion 13 is provided along three sides of this rectangle. In addition, the step portion 13 is not provided on one side of the rectangle except for the intersection with the other sides. Note that the number of sides along which the step portion 13 runs does not have to be three.

[0026] The step portion 13 is preferably provided along 50% or more of the entire circumference of the inner side surface that intersects with the upper surface of the base 10. This ensures that there is sufficient area in the step portion 13 for providing a wiring area. It is also preferable that the step portion 13 is 90% or less. By not providing the step portion 13 in areas that are not suitable for providing a wiring area, the base 10 can be designed to be compact. Alternatively, the step portion 13 may be provided along the entire circumference.

[0027] One or more wiring regions 14 are provided on the upper surface of the step portion 13. In the illustrated example of the light emitting device 1, a plurality of wiring regions 14 are provided. The wiring regions 14 pass through the inside of the base 10 and are electrically connected to wiring regions provided on the lower surface of the base 10. Note that the wiring regions electrically connected to the wiring regions 14 are not limited to being provided on the lower surface of the base 10, but can also be provided on the outer surfaces (upper surface, outer surface, and lower surface) of the base 10.

[0028] The base 10 can be formed primarily from ceramic, such as aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.

[0029] The base 10 can be formed by integrally forming the bottom portion 11 and the side portion 12. Alternatively, the base 10 may be formed by joining the bottom portion 11 and the side portion 12 that are formed separately using different materials as the main materials. In this case, for example, the bottom portion 11 can be made primarily of metal, and the side portion 12 can be made primarily of ceramic.

[0030] In this case, the metal used for the bottom portion 11 is preferably one that has better heat dissipation properties (higher thermal conductivity) than the ceramic used for the side portion 12. For example, copper, aluminum, iron, etc., or composites such as copper molybdenum, copper-diamond composite material, and copper tungsten can be used.

[0031] A metal film is provided on the wiring region 14 of the base 10 and on the areas corresponding to the wiring regions electrically connected thereto. Metal is also provided at the locations that pass through the interior for electrical connection, thereby achieving electrical connection.

[0032] (semiconductor laser element 20) The semiconductor laser element 20 has a rectangular outer shape when viewed from above. A side surface intersecting one of the two short sides of the rectangle serves as an emission end surface for light emitted from the semiconductor laser element 20. The upper and lower surfaces of the semiconductor laser element 20 have areas larger than that of the emission end surface.

[0033] The semiconductor laser element 20 is a multi-emitter having two or more emitters. However, it may also be a single-emitter having one emitter. In the example of the light-emitting device 1 shown in the figure, the semiconductor laser element 20 has two emitters. Furthermore, one electrode common to the two emitters is provided on either the top or bottom surface of the semiconductor laser element 20, and two electrodes corresponding to each emitter are provided on the other surface.

[0034] The light (laser light) emitted from each emitter of the semiconductor laser element 20 has a divergence and forms an elliptical far-field pattern (hereinafter referred to as "FFP") in a plane parallel to the light emitting end face. The FFP is the shape and light intensity distribution of the emitted light at a position away from the emitting end face.

[0035] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with peak intensity in the light intensity distribution of the FFP, is called the light traveling along the optical axis. Also, in the light intensity distribution of the FFP, the peak intensity value is 1 / e 2 The light having the above intensity is called the main part of the light.

[0036] The shape of the FFP of the light emitted from the semiconductor laser element 20 is an ellipse in which the stacking direction perpendicular to the layering direction of the multiple semiconductor layers including the active layer is longer than the layering direction of the multiple semiconductor layers including the active layer. Note that the layering direction is referred to as the horizontal direction of the FFP, and the stacking direction is referred to as the vertical direction of the FFP.

[0037] Based on the optical intensity distribution of the FFP, the angle corresponding to the full width at half maximum of the optical intensity distribution is defined as the optical divergence angle of the semiconductor laser element. The optical divergence angle in the vertical direction of the FFP is defined as the vertical divergence angle, and the optical divergence angle in the horizontal direction of the FFP is defined as the horizontal divergence angle.

[0038] For example, a semiconductor laser element that emits blue light, a semiconductor laser element that emits green light, or a semiconductor laser element that emits red light can be used as the semiconductor laser element 20. Also, a semiconductor laser element that emits light other than these may be used.

[0039] Here, blue light refers to light whose peak emission wavelength is in the range of 420 nm to 494 nm, green light refers to light whose peak emission wavelength is in the range of 495 nm to 570 nm, and red light refers to light whose peak emission wavelength is in the range of 605 nm to 750 nm.

[0040] Examples of semiconductor laser elements that emit blue light or green light include semiconductor laser elements that contain nitride semiconductors. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. Examples of semiconductor laser elements that emit red light include those that contain InAlGaP-based, GaInP-based, GaAs-based, and AlGaAs-based semiconductors.

[0041] (Submount 30) The submount 30 has two bonding surfaces and is configured in a rectangular parallelepiped shape. One bonding surface is provided on the opposite side of the other bonding surface. The distance between the two bonding surfaces is smaller than the distance between the other two opposing surfaces. The shape of the submount 30 is not limited to a rectangular parallelepiped. The submount 30 can be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. A metal film for bonding is provided on the bonding surfaces.

[0042] (Photodetector 40) The light receiving element 40 has a bonding surface 41 and a light receiving surface 42. The bonding surface 41 is the surface opposite the light receiving surface 42. However, it does not have to be the opposite surface. The light receiving element 40 has a top surface, a bottom surface, and one or more side surfaces. Here, the surface having the light receiving surface 42 is the top surface. The external shape of the light receiving element 40 is a rectangular parallelepiped, but is not limited to a rectangular parallelepiped.

[0043] A plurality of light receiving regions 43 are provided on the light receiving surface 42. In the illustrated example of the light receiving element 40, three light receiving regions 43 are provided. Note that the number of light receiving regions 43 does not have to be limited to three. The plurality of light receiving regions 43 are arranged side by side at a predetermined interval. Here, the direction in which the plurality of light receiving regions 43 are arranged is referred to as the first direction. The direction of the arrow 1D in FIG. 7 indicates the first direction based on the illustrated example of the light receiving element 40.

[0044] The light receiving surface 42 has a rectangular outer shape. The length of the light receiving surface 42 in the first direction is greater than the length in the second direction. The second direction is a direction perpendicular to the first direction in a top view. The direction of the 2D arrow in FIG. 7 indicates the second direction based on the example of the light receiving element 40 shown in the figure. Note that the length in the first direction and the length in the second direction may be the same. Also, the length in the second direction may be greater than the length in the first direction.

[0045] The multiple light receiving regions 43 are arranged close to each other at regular intervals. In other words, the light receiving regions 43 are spaced apart and do not overlap. The intervals do not have to be regular. The interval between adjacent light receiving regions 43 is smaller than the width in the first direction of either of the adjacent light receiving regions 43. This allows the intervals of light irradiated to each light receiving region 43 to be closer.

[0046] Each light receiving area 43 is formed with a rectangular outer shape on the light receiving surface 42. Note that the shape is not limited to a rectangle and may be appropriately designed depending on the shape of the light to be irradiated. In the example of the light receiving element 40 shown in the figure, each light receiving area 43 is formed with a rectangular outer shape. Of the two pairs of opposing sides that form the rectangle, one pair of two sides (the shorter sides in the case of a rectangle) are parallel to the first direction. Note that the parallelism here includes an error of ±5 degrees or less.

[0047] The length of the light receiving area 43 in the second direction is greater than the length in the first direction. In the example of the light emitting device 1 shown in the figure, all of the light receiving areas 43 satisfy this condition. Note that the light receiving area 43 may include light receiving areas 43 whose lengths in the first direction and the second direction are equal. Alternatively, the light receiving area 43 may include light receiving areas 43 whose length in the first direction is greater than the length in the second direction.

[0048] The plurality of light receiving regions 43 include two light receiving regions 43 having different lengths in the second direction on the light receiving surface 42. At least one of the light receiving regions 43 arranged at both ends has a shorter length in the second direction on the light receiving surface 42 than the light receiving region 43 arranged adjacent to it. The light receiving regions 43 arranged at both ends have different lengths in the second direction.

[0049] By arranging the short light receiving region 43 and the long light receiving region 43 side by side, a space due to the difference in length is created on the light receiving surface 42. By effectively utilizing this space, the light receiving element 40 can be made smaller.

[0050] In the illustrated example of the light receiving element 40, three light receiving regions 43 are arranged side by side in the first direction. Furthermore, the light receiving region 43 arranged at one of the two ends has a shorter length in the second direction than the other light receiving regions 43. A conductive region 45, which will be described later, is provided in the space created by the difference in length, thereby miniaturizing the light receiving element 40.

[0051] The lengths in the second direction of all the light receiving regions 43 may be the same. Furthermore, the lengths in the second direction of any of the light receiving regions 43 arranged at both ends on the light receiving surface 42 may be smaller than the light receiving region 43 arranged adjacent to it. Furthermore, the lengths in the second direction of the light receiving regions 43 arranged at both ends may be the same.

[0052] The light receiving regions 43 are arranged such that one of their ends in the second direction is aligned. In other words, a line connecting one of the end points of each light receiving region 43 in the second direction is parallel to the first direction. Note that "parallel" here includes a difference of ±5 degrees or less.

[0053] The plurality of light receiving regions 43 also includes two light receiving regions 43 arranged adjacent to each other. The plurality of light receiving regions 43 also includes two light receiving regions 43 arranged at both ends. The plurality of light receiving regions 43 also includes two light receiving regions 43 having different lengths in the second direction. The plurality of light receiving regions 43 may also include all of the light receiving regions 43. Aligning the position of one end can contribute to miniaturization of the light receiving element 40.

[0054] When the light receiving element 40 has two light receiving regions 43 with different lengths in the second direction, aligning one end of each light receiving region 43 causes the other end to become misaligned. In this case, the distance in the second direction between the other end of one light receiving region 43 and the other end of the other light receiving region 43 is the same as the difference in the lengths of the two light receiving regions 43 in the second direction.

[0055] In addition, the light receiving element 40 may have a plurality of light receiving regions 43 whose ends in the second direction are not aligned, in other words, a plurality of light receiving regions 43 whose ends are not parallel to the first direction at any of the straight lines connecting the ends of the light receiving regions 43.

[0056] Here, when there are two light receiving areas 43 with different lengths in the second direction and neither end of these two light receiving areas 43 is aligned, it is preferable in designing the light receiving element 40 to be compact that the light receiving area 43 with the shorter length in the second direction is sandwiched between a straight line passing through one end point of the light receiving area 43 with the longer length in the second direction and parallel to the first direction, and a straight line passing through the other end point and parallel to the first direction.

[0057] A plurality of wiring regions 44 are provided on the light-receiving surface 42 of the light-receiving element 40. The number of wiring regions 44 may be one or more. Furthermore, wiring regions may be provided not only on the light-receiving surface 42 but also on surfaces other than the light-receiving surface 42. Each wiring region is electrically connected to a light-receiving region 43.

[0058] The light-receiving surface 42 is provided with a plurality of wiring regions 44 electrically connected to the plurality of light-receiving regions 43. The plurality of light-receiving regions 43 includes two light-receiving regions 43 arranged adjacent to each other. The plurality of light-receiving regions 43 also includes two light-receiving regions 43 arranged at both ends. The plurality of light-receiving regions 43 also includes two light-receiving regions 43 with different lengths in the second direction. The plurality of light-receiving regions 43 also includes all of the light-receiving regions 43 provided on the light-receiving surface 42.

[0059] In the illustrated example of the light-receiving element 40, a plurality of wiring regions 44 are provided that are electrically connected to all of the light-receiving regions 43 arranged on the light-receiving surface 42. Specifically, there are four wiring regions 44 that are electrically connected to three light-receiving regions 43. In other words, the light-receiving surface 42 is provided with more wiring regions 44 than the number of light-receiving regions 43.

[0060] Three of the four wiring regions 44 do not overlap each other and are electrically connected to the anode electrodes of any of the three light-receiving regions 43. The remaining one is electrically connected to the cathode electrode common to the three light-receiving regions 43.

[0061] The multiple wiring regions 44 are provided in edge regions 47 of the light-receiving surface 42 (shown in FIG. 7). The edge regions 47 are regions of the light-receiving surface 42 excluding the central region 46. By providing the wiring regions 44 in the edge regions 47, it is possible to prevent the light-receiving element 40 from becoming larger in the second direction. It also makes it easier to connect wiring that extends in the first direction and joins to the light-receiving element 40.

[0062] Here, a first central region 461 and a second central region 462 are defined as the central region 46. The first central region 461 is a region on the light-receiving surface 42 that is sandwiched between a line that passes through the midpoint of the width in the first direction of the light-receiving region 43 that is located at one end of the light-receiving regions 43 that are located at both ends and that extends in the second direction, and a line that passes through the midpoint of the width in the first direction of the light-receiving region 43 that is located at the other end and that extends in the second direction.

[0063] The second central region 462 is a region sandwiched between a straight line extending in the second direction and passing through the end point of the light receiving region 43 located at one end of the light receiving regions 43 located at both ends of the light receiving surface 42, which is located farthest from the light receiving region 43 at the other end, and a straight line extending in the second direction and passing through the end point of the light receiving region 43 located at the other end, which is located farthest from the light receiving region 43 at one end.

[0064] The first central region 461 is included in the second central region 462. Therefore, when the second central region 462 is defined as the central region 46, the edge region 47 is included in the edge region 47 when the first central region 461 is defined as the central region 46. Note that the central region 46 may be a region that includes at least the first central region 461 or the second central region 462.

[0065] Among the multiple wiring regions 44, the multiple wiring regions 44 that are electrically connected to two adjacent light receiving regions 43 are provided in the edge regions 47. In addition, they are not provided in the central region 46. The central region 46 here may be either the first central region 461 or the second central region 462.

[0066] Among the multiple wiring regions 44, the multiple wiring regions 44 electrically connected to the two light receiving regions 43 arranged at both ends are provided in the end regions 47. In addition, they are not provided in the central region 46. The central region 46 here may be either the first central region 461 or the second central region 462.

[0067] Among the multiple wiring regions 44, the multiple wiring regions 44 that are electrically connected to two light receiving regions 43 that have different lengths in the second direction are provided in the end regions 47. In addition, they are not provided in the central region 46. The central region 46 here may be either the first central region 461 or the second central region 462.

[0068] All of the wiring regions 44 are provided in the edge regions 47. None of the wiring regions 44 are provided in the central region 46. The central region 46 here may be either the first central region 461 or the second central region 462.

[0069] The end region 47 is divided into two regions separated by the central region 46. One region separated by the central region 46 will be referred to as the first portion of the end region 47, and the other region will be referred to as the second portion of the end region 47.

[0070] One or more wiring regions 44 are provided in a first portion of the end region 47, and one or more wiring regions 44 are provided in a second portion of the end region 47. By providing wiring regions 44 on both sides, wiring is not concentrated in one side portion, allowing the spacing between the wiring to be increased and making wiring easier. Note that multiple wiring regions 44 may be provided in either the first portion or the second portion, and no wiring region 44 may be provided in the other portion.

[0071] It is preferable that the number of wiring regions 44 provided in the first portion of the edge region 47 and the number of wiring regions 44 provided in the second portion of the edge region 47 are the same or differ by one. By providing an equal number of wiring regions 44 in this way, the spacing between the wires can be increased, making wiring easier. In the example of the light-emitting device 1 shown in the figures, two wiring regions 44 are provided in each of the first and second portions of the edge region 47.

[0072] The light-receiving element 40 has a plurality of conductive regions 45 provided on the light-receiving surface 42. Note that there may be only one conductive region 45, or the conductive region 45 may be absent. The conductive region 45 connects the light-receiving region 43 and the wiring region 44. This electrically connects the light-receiving region 43 and the wiring region 44.

[0073] Here, the wiring region 44 and the conductive region 45 will be described. The wiring region 44 and the conductive region 45 may be made of different materials, or may be made of the same material. If they are made of the same material, there may be no apparent boundary between the wiring region 44 and the conductive region 45. In such a case, the wiring region 44 may be defined as follows to identify the boundary between the wiring region 44 and the conductive region 45.

[0074] The plurality of wiring regions 44 are regions where wiring for electrically connecting the light receiving regions 43 is bonded. For example, a bonding device identifies the positions where the wiring regions 44 are to be provided and bonds the wiring. Therefore, the wiring regions 44 can be defined as regions where the wiring is actually bonded based on the bonding relationship with the wiring.

[0075] From the viewpoint of designing the light-receiving element 40, the wiring region 44 is provided in a predetermined shape as a target for the bonding position of the wiring. When providing multiple wiring regions 44, it is efficient to provide them in the same shape. Therefore, the wiring region 44 can be defined as a region having the same external shape and size that is common to multiple regions provided on the light-receiving surface 42 for electrically connecting the light-receiving regions 43.

[0076] In the illustrated example of the light-receiving element 40, there are four regions provided on the light-receiving surface 42 to electrically connect the light-receiving regions 43. One of the regions is a wiring region 44 that is electrically connected to the cathode electrode of the light-receiving region 43. The remaining three regions are combined wiring regions 44 and conductive regions 45 that are connected to each other and electrically connected to the anode electrode of the light-receiving region 43. Each light-receiving region 44 has a rectangular outer shape of the same shape and size.

[0077] The shapes of the areas provided as targets for the wiring bonding positions do not need to be the same. Even in this case, a minimum area must be secured for wiring bonding. Therefore, if there is no commonality in the outer shapes, the maximum overlapping area of ​​all the areas provided on the light-receiving surface 42 for electrically connecting the light-receiving areas 43 can be defined as the wiring area 44 when they are overlapped. In the example of the light-receiving element 40 shown in the figure, the maximum overlapping area of ​​all four areas is the wiring area 44.

[0078] Based on the wiring region 44 defined in this way, the region provided on the light-receiving surface 42 for electrically connecting the light-receiving regions 43 excluding the wiring region 44 can be defined as a conductive region 45 .

[0079] The boundary between the wiring region 44 and the conductive region 45 is not limited to the method described here, but may be determined in any reasonable manner, such as when the boundary can be clearly distinguished from the viewpoint of appearance or material, or when the boundary can be clearly distinguished from the manufacturing process of the light-receiving element 40.

[0080] The length in the second direction of each of the conductive regions 45 is shorter than the length in the second direction of the light-receiving region 43. The length in the second direction of each of the conductive regions 45 is also shorter than the length in the second direction of the wiring region 44. The plurality of conductive regions 45 includes a conductive region 45 whose length in the first direction is longer than the length in the first direction of one of the light-receiving regions 43. The plurality of conductive regions 45 also includes a conductive region 45 whose length in the first direction is shorter than the length in the first direction of one of the light-receiving regions 43.

[0081] The light-receiving surface 42 is provided with a plurality of conductive regions 45 that connect the plurality of light-receiving regions 43 and the plurality of wiring regions 44. The plurality of light-receiving regions 43 includes two light-receiving regions 43 that are arranged adjacent to each other. The plurality of light-receiving regions 43 also includes two light-receiving regions 43 that are arranged at both ends. The plurality of light-receiving regions 43 also includes two light-receiving regions 43 that have different lengths in the second direction.

[0082] The plurality of light-receiving regions 43 include all light-receiving regions 43 provided on the light-receiving surface 42. The plurality of wiring regions 44 does not include one or more wiring regions 44 among all wiring regions 44 provided on the light-receiving surface 42. However, all wiring regions 44 provided on the light-receiving surface 42 may be included.

[0083] In the illustrated example of the light-receiving element 40, a plurality of conductive regions 45 are provided which are connected to all of the light-receiving regions 43 arranged on the light-receiving surface 42. Specifically, there are three conductive regions 45 which are connected to three light-receiving regions 43. In other words, the number of light-receiving regions 43 arranged on the light-receiving surface 42 is equal to the number of conductive regions 45.

[0084] Furthermore, the conductive region 45 connects the light-receiving region 43 to a wiring region 44 that is electrically connected to the anode electrode of the light-receiving region 43. On the other hand, the wiring region 44 that is electrically connected to the cathode electrode of the light-receiving region 43 is not connected to the conductive region 45. The wiring region 44 is electrically connected to the cathode electrode of the light-receiving region 43 inside the light-receiving element 40.

[0085] By electrically connecting a part of the wiring region 44 to the light-receiving region 43 inside the light-receiving element 40, it is possible to reduce the number of conductive regions 45 provided on the light-receiving surface 42, thereby contributing to the compact design of the light-receiving element 40. Note that a conductive region 45 connecting the cathode electrode of the light-receiving region 43 and the wiring region 44 may be provided.

[0086] The plurality of conductive regions 45 includes a conductive region 45 that is provided from the central region 46 to the end region 47. The plurality of conductive regions 45 also includes a conductive region 45 that is provided in the end region 47 and is not provided in the central region 46. Note that the central region 46 here may be either the first central region 461 or the second central region 462.

[0087] The plurality of conductive regions 45 include a conductive region 45 connected to one of the two adjacent light receiving regions 43 and provided from the central region 46 to the end region 47, and a conductive region 45 connected to the other light receiving region 43 and provided in the end region 47 but not in the central region 46. The other light receiving region 43 is a light receiving region 43 that is provided at the end of the plurality of light receiving regions 43 arranged side by side in the first direction.

[0088] Of the two conductive regions 45 connected to the two adjacent light-receiving regions 43, the conductive region 45 provided from the central region 46 to the edge region 47 and the conductive region 45 not provided in the central region 46 but provided in the edge region 47 both extend in the first direction from the position where they connect to the light-receiving regions 43 and connect to the wiring region 44. Either of the wiring regions 44 is provided in the first or second part of the edge region 47, whichever is closer to the light-receiving region 43 arranged at the edge.

[0089] The conductive region 45 extending from the central region 46 to the edge region 47 is connected to one of the two opposing sides of the two adjacent light-receiving regions 43. The conductive region 45 extends in the first direction from the position connected to this side in parallel with the first direction, and is connected to the wiring region 44.

[0090] The light-receiving element 40 has a light-receiving region 43 sandwiched between a straight line that passes through one end of a conductive region 45 extending from a central region 46 to an end region 47 and is parallel to the second direction, and a straight line that passes through the other end of the conductive region 45 and is parallel to the second direction and is connected to a wiring region 44. In the example of Fig. 7, the light-receiving region 43 having a shorter length in the second direction is provided within the range of width S shown in the figure.

[0091] Here, the conductive region 45, which is electrically connected to one of two adjacent light-receiving regions 43 and is provided from the central region 46 to the end region 47, is not electrically connected to the other light-receiving region 43. One method for avoiding electrical connection is to provide an insulating region in part of the other light-receiving region 43 and provide the conductive region 45 on the insulating region. Because the insulating region is provided on the light-receiving region 43, the position where the insulating region is provided can be adjusted.

[0092] There is also a method of providing a conductive region 45 in a portion where the two light-receiving regions 43 are misaligned in the second direction. Since the conductive region 45 is provided in a position where there is no light-receiving region 43, there is no need to provide a separate insulating region above the light-receiving region 43 on the light-receiving surface 42.

[0093] When an insulating region is provided, the insulating region reduces the size of the light-receiving region 43 on the light-receiving surface 42. As a result, a misalignment occurs in the arrangement of two adjacent light-receiving regions 43 in the second direction. In other words, in either method, the conductive region 45 is connected to one light-receiving region 43 at a portion that protrudes more than the other light-receiving region 43 in the second direction, and extends in a direction parallel to the first direction to connect to the wiring region 44.

[0094] In addition, the conductive region 45, which is not provided in the central region 46 but is provided in the end region 47, is connected to the side of the light receiving region 43 located at the end of two adjacent light receiving regions 43 opposite to the side facing the adjacent light receiving region 43.

[0095] It is desirable that the conductive region 45 provided from the central region 46 to the edge region 47 be connected to the light receiving region 43 near the upper or lower end of the light receiving region 43. This is because the closer to the edge, the less the other light receiving region 43 is reduced in size, and a wider light receiving region can be secured.

[0096] Furthermore, on the light-receiving surface 42, the wiring region 44 is preferably provided within a region sandwiched between a line passing through one of the ends of the multiple light-receiving regions 43 that is furthest in the second direction and extending in the first direction, and a line passing through the other end and extending in the first direction. This can prevent the light-receiving element 40 from becoming larger in the second direction. In the example of FIG. 7, all of the wiring regions 44 are contained within the range of width T shown in the figure. The same can be said even if the wiring regions 44 are replaced with conductive regions 45.

[0097] Furthermore, on the light-receiving surface 42, the wiring region 44 is preferably provided not near the center of the light-receiving surface 42 but near one of the ends in the second direction.

[0098] For example, it is preferable that the wiring region 44 closest to one end of the plurality of light-receiving regions 43 in the second direction and the wiring region 44 closest to the other end are both closer to the one end than to the other end. Also, it is preferable that the same can be said even if the plurality of light-receiving regions 43 are replaced with the light-receiving surface 42.

[0099] Furthermore, for example, it is preferable that the wiring region 44 located closest to one of the two ends of the plurality of light-receiving regions 43 that is furthest in the second direction is provided closer to this one end than the center of the end, and that the wiring region 44 located closest to the other end is provided closer to the center of the end than the other end. It is also preferable that the same can be said even if the plurality of light-receiving regions 43 are replaced with the light-receiving surface 42.

[0100] In the example of FIG. 7, the imaginary line P shown in the figure indicates the center line of both ends of the multiple light-receiving regions 43 that are at the ends closest to each other in the second direction. The imaginary line P also indicates the center line of the light-receiving surface 42. One of the two wiring regions 44 in the first portion of the end region 47 is the wiring region 44 closest to one of the ends, and the other is the wiring region 44 closest to the other of the ends, and these conditions are met. The same can be said if the first portion is replaced with the second portion.

[0101] For example, a photodiode (hereinafter abbreviated as PD) can be used as the light receiving element 40. Furthermore, the light receiving element 40 reflects 80% or more of the light irradiated onto the light receiving region 43.

[0102] (Support stand 50) The support base 50 has a lower surface and an inclined surface 51 inclined relative to the lower surface. The inclined surface 51 is neither perpendicular nor parallel when viewed from the lower surface. For example, the inclined surface 51 is configured as a flat surface that forms an inclination angle of 40 degrees or more and 50 degrees or less with respect to the lower surface. In the example of the light-emitting device 1 shown in the figures, the inclined surface 51 is configured as a flat surface that forms an inclination angle of 45 degrees with respect to the lower surface. Note that the inclined surface 51 may be formed with an inclination angle in the range of 10 degrees or more and 80 degrees or less.

[0103] The inclined surface 51 is one or more inclined surfaces on the support base 50 that are inclined relative to the lower surface, and when there are multiple inclined surfaces, it is the inclined surface with the largest area. When viewed from above, the inclined surface 51 occupies 60% or more of the area of ​​the support base 50. When viewed from above, the width from the upper end to the lower end of the inclined surface 51 is 60% or more of the width of the support base 50 in the same direction. In other words, the inclined surface 51 occupies a major proportion of the support base 50.

[0104] The support base 50 can be made of, for example, ceramic, glass, or metal. For example, ceramic such as aluminum nitride, glass such as quartz or borosilicate glass, or metal such as aluminum can be used. Alternatively, the support base 50 can be made of Si or the like.

[0105] (protective element 60) The protective element 60 is intended to prevent a specific element (for example, the semiconductor laser element 20) from being destroyed by an excessive current flowing through it. An example of the protective element 60 is a Zener diode. The Zener diode may be made of Si.

[0106] (Wiring 70) The wiring 70 is configured in a linear shape with joints at both ends. In other words, both ends of the linear portion have joints that are joined to other components. The wiring 70 is, for example, a metal wire. Examples of metals that can be used include gold, aluminum, silver, and copper.

[0107] (Cover member 80) The lid member 80 has a bottom surface and a top surface, and is configured in the shape of a rectangular parallelepiped flat plate. However, it does not have to be a rectangular parallelepiped. The lid member 80 is also translucent, meaning that it transmits light. Here, translucency means that the light transmittance is 80% or more. However, it is not necessary for the lid member 80 to have a transmittance of 80% or more for all wavelengths of light. The lid member 80 may also have a non-translucent region (a region that does not have translucency) in part.

[0108] The cover member 80 can be made of sapphire. Sapphire is a light-transmitting material with a relatively high refractive index and relatively high strength. In addition to sapphire, other materials such as glass can also be used.

[0109] (Light-emitting device 1) Next, the light emitting device 1 will be described. The light emitting device 1 has a base 10, a semiconductor laser element 20 arranged on the base 10, a light receiving element 40 arranged on the base 10, a plurality of first wirings 71 for electrically connecting the semiconductor laser element 20 among the plurality of wirings 70, and a plurality of second wirings 72 for electrically connecting the light receiving element 40 among the plurality of wirings 70. Note that instead of the semiconductor laser element 20, other light emitting elements such as LEDs may be used.

[0110] In the light emitting device 1, the semiconductor laser element 20 is disposed on the base 10 via a submount 30. It may also be disposed directly on the bottom surface of the base 10 without the submount 30. When the submount 30 is not used, the outer shape of the semiconductor laser element 20 may be changed to adjust the light emission position (height) at the emission end face.

[0111] The light receiving element 40 is disposed on the base 10 via a support stand 50. It may also be disposed directly on the bottom surface of the base 10 without using the support stand 50. If the support stand 50 is not used, the external shape of the light receiving element 40 may be changed to adjust the position (height) or orientation (tilt) of the light receiving surface 42.

[0112] The light emitting device 1 also has a protection element 60 disposed on the base 10 to protect the semiconductor laser element 20. The light emitting device 1 also has a lid member 80 bonded to the base 10 to seal the space in which the semiconductor laser element 20 is disposed.

[0113] The semiconductor laser element 20 is disposed on the bottom surface (disposition region) of the base 10. A plurality of semiconductor laser elements 20 may be disposed. The plurality of semiconductor laser elements 20 are disposed side by side with their emission end faces facing the same direction. The side faces of adjacent semiconductor laser elements 20 that intersect with their emission end faces face each other.

[0114] Here, in the light emitting device 1, the direction in which the multiple semiconductor laser elements 20 are lined up when viewed from above is referred to as the first direction. Also, the direction perpendicular to the first direction when viewed from above is referred to as the second direction. The first direction and second direction based on the illustrated example of the light emitting device 1 are indicated by 1D and 2D, respectively, in FIG. 3. Note that when one semiconductor laser element 20 having multiple emitters is arranged, the direction in which the multiple emitters are lined up may also be referred to as the first direction.

[0115] In the illustrated example of the light emitting device 1, three semiconductor laser elements 20 are arranged. The first direction is parallel to the light emitting end faces of the semiconductor laser elements 20 in a top view. The side faces that intersect with the respective light emitting end faces and face each other between adjacent semiconductor laser elements 20 are parallel to each other in a top view.

[0116] The three semiconductor laser elements 20 are configured by a semiconductor laser element that emits blue light, a semiconductor laser element that emits green light, and a semiconductor laser element that emits red light. However, the configuration is not limited to this, and a configuration having a plurality of semiconductor laser elements that emit light of the same color, or a configuration having semiconductor laser elements that emit light of other colors, may also be used.

[0117] The submount 30 is bonded to the semiconductor laser element 20 at one bonding surface, and to the bottom surface of the base 10 at the other bonding surface on the opposite side. The light emitting device 1 may have multiple submounts 30. The number of semiconductor laser elements 20 arranged on one submount 30 may be one.

[0118] The light receiving element 40 is disposed on the bottom surface of the base 10. The light receiving surface 42 is disposed in a direction in which the light emitted from the semiconductor laser element 20 is irradiated. A plurality of light receiving regions 43 on the light receiving surface 42 are irradiated with a main portion of the light emitted from the semiconductor laser element 20. A single light receiving region 43 is irradiated with a main portion of the light in at least one laser beam. That is, a light receiving region 43 may be irradiated with a main portion of the light in two laser beams.

[0119] In the illustrated example of the light emitting device 1, light emitted from a plurality of semiconductor laser elements 20 is irradiated onto a plurality of light receiving regions 43 provided on a light receiving surface 42 of a light receiving element 40. One light receiving region 43 corresponds to one semiconductor laser element 20, and a main portion of light emitted from one semiconductor laser element 20 is irradiated onto one light receiving region 43.

[0120] Specifically, the three light-receiving regions 43 are irradiated with at least a main portion of the light emitted from the three semiconductor laser elements 20. Furthermore, one light-receiving region 43 is irradiated with two laser beams emitted from two emitters included in one semiconductor laser element 20.

[0121] The light receiving element 40 receives (absorbs) a portion of the light irradiated onto the light receiving area 43 and reflects a portion of the light. The light receiving area 43 receives 2% or more of the light irradiated onto the main portion. The light receiving area 43 also reflects 80% or more of the light irradiated onto the main portion. The sum of the received light and the reflected light is 100% or less.

[0122] Furthermore, the first direction in the light emitting device 1 and the first direction in the light receiving element 40 are the same direction and are parallel to each other. In addition, when viewed from above, the light emitting end surface of the semiconductor laser element 20 and the lower edge or the upper edge of the light receiving surface 42 of the light receiving element 40 are parallel to each other. Here, "parallel" includes a difference of 5 degrees or less. However, they do not have to be parallel.

[0123] The light-receiving region 43 reflects upward the light emitted laterally from the semiconductor laser element 20. Therefore, the light-receiving surface 42 is inclined with respect to the emitting end face and the optical axis. It is also inclined with respect to the bottom surface of the base 10. The light-receiving surface 42 is inclined at an angle of 40 degrees or more and 50 degrees or less with respect to the traveling direction of light passing through the optical axis. In the example of the light-emitting device 1 shown in the figures, the light-receiving surface 42 is inclined at an angle of 45 degrees. However, the light-receiving surface 42 may be inclined at an angle in the range of 10 degrees or more and 80 degrees or less.

[0124] The wiring region 44 of the light receiving element 40 is disposed at a position where it does not intrude into the optical path of the main portion of the light emitted from the semiconductor laser element 20. In addition, the second wiring 72 joined to the wiring region 44 is disposed at a position where it does not intrude into the optical path of the main portion of the light.

[0125] Therefore, the multiple wiring regions 44 are provided in edge regions 47 on the light-receiving surface 42. The edge regions 47 here are regions excluding the central region 46, and the central region 46 here defines a third central region 463.

[0126] The third central region 463 is, in a top view, a region sandwiched between a straight line extending in the second direction and passing through an irradiation point of light passing through the optical axis among light irradiated to the light-receiving region 43 arranged at one end of the light-receiving regions 43 arranged at both ends on the light-receiving surface 42, and a straight line extending in the second direction and passing through an irradiation point of light passing through the optical axis among light irradiated to the light-receiving region 43 arranged at the other end. Note that the third central region 463 may be a region that includes at least this region.

[0127] When a plurality of laser beams are irradiated onto one light receiving region 43, it is sufficient that the definition of the third central region 463 is satisfied based on at least one of the laser beams. Preferably, the definition of the third central region 463 is satisfied based on the laser beam irradiated to both ends in the first direction. In the example of Fig. 4, the third central region 463 when based on the laser beam irradiated to both ends is indicated by hatching.

[0128] Furthermore, when the plurality of light-receiving regions 43 in the light-receiving element 40 includes two light-receiving regions 43 having different lengths in the second direction, it is preferable to determine the light-receiving region 43 to be irradiated with the laser light in accordance with the vertical divergence angle of the plurality of laser light beams emitted from the semiconductor laser element 20. This is because the laser light beam having a larger vertical divergence angle forms a longer irradiation region in the second direction in the light-receiving region 43.

[0129] Therefore, it is preferable that the main portion of the laser beam having the largest divergence angle in the vertical direction among the plurality of laser beams is irradiated onto the longer of the two light-receiving regions 43 having different lengths in the second direction. In other words, it is preferable that the main portion of the laser beam having the largest divergence angle in the vertical direction among the plurality of laser beams is not irradiated onto the shorter of the two light-receiving regions 43 having different lengths in the second direction.

[0130] In the example of the light-emitting device 1 shown in the figure, the length in the second direction of the light-receiving area 43 located at one end of the light-receiving areas 43 located at both ends of the multiple light-receiving areas 43 arranged in the first direction is smaller than the length in the second direction of the light-receiving area 43 located adjacent to it.

[0131] Therefore, the semiconductor laser elements 20 and the light receiving elements 40 are arranged so that the main portion of light emitted from the semiconductor laser element 20 having the largest light spread angle in the vertical direction among the multiple semiconductor laser elements 20 is not irradiated onto the light receiving area 43 located at one of the two ends and having a shorter length in the second direction than the light receiving area 43 located adjacent to it, but is irradiated onto another light receiving area 43 having a length in the second direction greater than that of this light receiving area 43.

[0132] Specifically, of the three semiconductor laser elements 20, the main portion of the light emitted from the semiconductor laser element 20 that emits red light with the largest light spread angle in the vertical direction is irradiated onto the light receiving area 43 at the end that is longer in the second direction.

[0133] The light-receiving regions 43 sandwiched between both ends are also light-receiving regions 43 that are longer in the second direction, and it is preferable to arrange the semiconductor laser elements 20, which are more susceptible to heat than the others, at the ends. In the example of the light-emitting device 1 shown in the figure, the semiconductor laser element 20 that emits red light has light-emitting characteristics that make it more susceptible to heat than the semiconductor laser element 20 that emits blue light and the semiconductor laser element 20 that emits green light.

[0134] Furthermore, the conductive region 45 extending from the first central region 461 or the second central region 462 to the edge region 47 is also provided from the third central region 463 to the edge region 47. The conductive region 45 extending from the central region 46 to the edge region 47 is provided near the upper end of the light-receiving region 43 located at the edge of the light-emitting device 1. The conductive region 45 is also disposed at a position that does not intrude into the optical path of the main portion of light emitted from the semiconductor laser element 20.

[0135] Therefore, the conductive region 45 extending from the central region 46 to the edge region 47 is located on the light-receiving surface 42 below a straight line extending in the first direction that passes through the upper end of the light-receiving region 43 located next to the light-receiving region 43 located at the edge, and above the upper end of the main portion of light irradiated to the light-receiving region 43 located at the edge, connecting the adjacent light-receiving region 43 with the wiring region 44.

[0136] The conductive region 45 extending from the central region 46 to the edge region 47 may be provided near the lower end of the light-receiving region 43 located at the edge of the light-emitting device 1. In this case, the conductive region 45 is provided above a line extending in the first direction that passes through the lower end of the light-receiving region 43 located adjacent to the light-receiving region 43 located at the edge, and below the lower end of the main portion of light irradiated onto the light-receiving region 43 located at the edge, and connects the adjacent light-receiving region 43 and the wiring region 44.

[0137] The support base 50 is joined to the light-receiving element 40 at the inclined surface 51. In other words, the light-receiving element 40 is disposed on the inclined surface 51. The support base 50 is also disposed so that the inclined surface 51 faces the semiconductor laser element 20. By disposing the light-receiving element 40 via the support base 50, it is not necessary to form the light-receiving element 40 in a complex shape. For this reason, it is preferable to use a material for the support base 50 that is easier to shape than the light-receiving element 40.

[0138] Furthermore, the underside of support base 50 is joined to the bottom surface of base 10. By joining the underside of support base 50 to the bottom surface of base 10, inclined surface 51 is inclined with respect to the bottom surface. Furthermore, since the underside of support base 50 and the bottom surface of base 10 are parallel to each other, the inclination angle of inclined surface 51 with respect to the bottom surface of base 10 is the same as the inclination angle of inclined surface 51 with respect to the underside of support base 50.

[0139] Since the light receiving element 40 is irradiated with the light emitted from the semiconductor laser element 20 and spread, it is necessary to provide the light receiving surface 42 from a position lower than the light emission point of the semiconductor laser element 20 to a position higher than the light emission point of the semiconductor laser element 20. Therefore, the height of the lower end of the light receiving surface 42 of the light receiving element 40 arranged in the light emitting device 1 is lower than the light emission point of the semiconductor laser element 20, and the height of the upper end of the light receiving surface 42 is higher than the light emission point of the semiconductor laser element 20.

[0140] With the semiconductor laser element 20 and the light-receiving element 40 arranged on the base 10, the step portion 13 is provided at a position spaced apart in the first direction from the semiconductor laser element 20 or the light-receiving element 40. The step portion 13 is also provided at a position spaced apart in both directions in the first direction from the semiconductor laser element 20 or the light-receiving element 40. The step portion 13 is provided so as to sandwich the semiconductor laser element 20 and the light-receiving element 40 in parallel when viewed from above.

[0141] The step portion 13 is provided at a position spaced apart in the second direction from the semiconductor laser element 20 or the light receiving element 40. The step portion 13 is provided at a position spaced apart in the direction from the light receiving element 40 to the semiconductor laser element 20, out of both directions in the second direction. However, the step portion 13 does not necessarily have to be provided.

[0142] The step portions 13 provided at positions away from the semiconductor laser element 20 or the light receiving element 40 in both directions in the first direction and in one direction in the second direction are connected. However, they do not have to be connected. Furthermore, the step portions 13 are not provided at positions away from the semiconductor laser element 20 or the light receiving element 40 in the other direction in the second direction. However, they may be provided.

[0143] With the semiconductor laser element 20 and the light-receiving element 40 arranged on the base 10, the wiring region 14 is provided at a position spaced apart in the first direction from the semiconductor laser element 20 or the light-receiving element 40. The wiring region 14 is also provided at a position spaced apart in both directions in the first direction from the semiconductor laser element 20 or the light-receiving element 40.

[0144] The wiring region 14 is provided at a position spaced apart in the second direction from the semiconductor laser element 20 or the light receiving element 40. The wiring region 14 is provided at a position spaced apart in the direction from the light receiving element 40 to the semiconductor laser element 20, out of both directions in the second direction. However, the wiring region 14 does not necessarily have to be provided.

[0145] One end of the first wiring 71 is bonded to the wiring region 14. The other end is bonded to the upper surface of the semiconductor laser element 20 or the upper surface of the submount 30. A bonding region for bonding to the first wiring 71 is provided on the upper surface of the semiconductor laser element 20 or the upper surface of the submount 30.

[0146] Therefore, with the semiconductor laser element 20 and the submount 30 arranged on the base 10, it is preferable that the upper surface of the step portion 13 of the base 10 is higher than the upper surface of the submount 30 and lower than the upper surface of the semiconductor laser element 20 in the height direction (vertical direction). This makes it easier to connect the first wirings 71. Note that it is not necessary for all of the multiple first wirings 71 to be joined to the wiring region 14 of the step portion 13. One end of one or multiple first wirings 71 is joined to the wiring region 14.

[0147] Moreover, the first wiring 71 is joined to the wiring region 14 of the base 10 on the semiconductor laser element 20 side (the side including the side opposite to the light emission end face of the semiconductor laser element 20) with a boundary that is a straight line parallel to the light emission end face of the semiconductor laser element 20 in top view. This makes it easier to prevent the first wiring 71 from entering the optical path of light.

[0148] One end of the second wiring 72 is joined to the wiring region 14. The other end of the second wiring 72 is joined to the wiring region 44 of the light-receiving element 40. By providing the wiring region 44 in the end region 47, the distance between the wiring region 14 of the base 10 and the wiring region 44 of the light-receiving element 40 can be shortened, and the length of the second wiring 72 can be shortened. Furthermore, the height of the second wiring 72 can be reduced, thereby achieving a light-emitting device with a reduced height.

[0149] Furthermore, the plurality of second wirings 72 are joined to the wiring region 14 of the base 10 and the wiring region 44 of the light receiving element 40. Furthermore, all of the wirings used for the electrical connection of the light receiving element 40 are joined to the wiring region 14. Note that it is not necessary for all of the wirings used for the electrical connection of the light receiving element 40 to be joined to the wiring region 14. One end of one or more second wirings 72 is joined to the wiring region 14.

[0150] Moreover, the second wiring 72 is joined to the wiring region 14 of the base 10 on the light receiving element 40 side, with a boundary being a straight line parallel to the light emitting end face of the semiconductor laser element 20 in top view. This makes it easier to prevent the second wiring 72 from entering the optical path of light.

[0151] Furthermore, at least one or more of the multiple second wirings 72 are joined to the wiring region 14 of the base 10 in a region sandwiched between a line passing through one of the ends of the light receiving element 40 that is furthest in the second direction and extending in the first direction, and a line passing through the other end and extending in the first direction, in a top view. Preferably, multiple second wirings 72, and more preferably, all second wirings 72, are joined to the wiring region 14 in this region. This allows the length of the second wirings 72 to be reduced.

[0152] Furthermore, at least one or more of the multiple second wirings 72 are joined to the wiring region 14 of the base 10 in a region sandwiched between a line passing through one of the ends furthest in the second direction of the light receiving surface 42 and extending in the first direction, and a line passing through the other end and extending in the first direction, in a top view. Preferably, multiple second wirings 72, and more preferably, all second wirings 72, are joined to the wiring region 14 in this region. Similarly, the length of the second wirings 72 can be reduced.

[0153] 4, the region of width Y is shown as a region sandwiched between a straight line passing through one of the ends of the light-receiving surface 42 that is furthest in the second direction and extending in the first direction, and a straight line passing through the other end and extending in the first direction. In addition, in the region of width Y, all of the second wirings 72 are joined to the wiring region 14 of the base 10.

[0154] 5, in the example of the light-emitting device 1 shown, the height from the bottom surface of the base 10 to the joining point of the second wiring 72 in the wiring region 44 is greater than the height from the bottom surface of the base 10 to the top surface of the submount 30.

[0155] The wiring region 44 of the light-receiving element 40 is not located near the center but is located at one end. Therefore, the second wiring 72 can be bonded at a position located above the light-receiving element 40, and can be bonded at a position higher than the upper surface of the submount 30. When bonding the second wiring 72, it is necessary to position the bonding device so that it does not come into contact with the semiconductor laser element 20, but by positioning the wiring region 44 above the light-receiving element 40, the light-receiving element 40 can be positioned closer to the semiconductor laser element 20.

[0156] Furthermore, in the light emitting device 1, there is no wiring that passes directly above the upper end of the light receiving element 40. In other words, even if additional wiring is arranged in addition to the wiring 70, all of the wiring arranged in the recessed portion of the base 10 does not pass directly above the upper end of the light receiving element 40. Therefore, the second wiring 72 does not pass directly above the upper end of the light receiving element 40, but is joined to the wiring region 14 and the wiring region 44. This reduces the height of the wiring, and makes it possible to reduce the height of the light emitting device 1.

[0157] Furthermore, in the light emitting device 1, there is no wiring that passes through the region directly above the light receiving surface 42. Therefore, the second wiring 72 is joined to the wiring region 14 and the wiring region 44 without passing through the region directly above the light receiving surface 42. This makes it easier to prevent the second wiring 72 from entering the optical path of light.

[0158] In the illustrated example of the light emitting device 1, the number of first wirings 71 related to the electrical connection of the semiconductor laser element 20 is greater than the number of second wirings 72 related to the electrical connection of the light receiving element 40. By providing the wiring region 14 at a position away from the light receiving element 40 toward the semiconductor laser element 20 in both directions of the second direction, an area for joining the first wirings 71 is secured, making it easier to join the wirings.

[0159] The protective element 60 is disposed on the upper surface of the step portion 13. By disposing it on the step portion 13, the arrangement area can be made smaller, which contributes to the miniaturization of the light emitting device 1. Furthermore, a plurality of protective elements 60 are disposed on the upper surface of the step portion 13.

[0160] Moreover, when viewed from above, one or more protective elements 60 are arranged on both the semiconductor laser element 20 side and the light-receiving element 40 side, with a straight line parallel to the light-emitting end face of the semiconductor laser element 20 as the boundary. Moreover, the number of protective elements 60 arranged on the semiconductor laser element 20 side is greater than the number of protective elements 60 arranged on the light-receiving element 40 side. Since the semiconductor laser element 20 side has a larger area in which the wiring region 14 can be secured, it is easier to join the first wiring 71 and the second wiring 72.

[0161] Furthermore, when viewed from above, the second wiring 72 and the protective element 60 are arranged in this order in the wiring region 14 in the direction toward the light receiving element 40, with a straight line parallel to the light emitting end face of the semiconductor laser element 20 as the boundary. Arranging them in this order makes it easier to bond the second wiring 72 while keeping its length small. The order may be reversed.

[0162] The lid member 80 is disposed on the upper surface of the base 10. The lid member 80 is located above the step portion 13. By joining the lid member 80, a closed space surrounded by the base 10 and the lid member 80 is created. This space is the space in which the semiconductor laser elements 20 are disposed. In the example of the light-emitting device 1 shown in the figure, the lid member 80 and the base 10 are joined together, and the multiple semiconductor laser elements 20 disposed in the base 10 are sealed.

[0163] Furthermore, by joining the lid member 80 to the base 10 under a predetermined atmosphere, a hermetically sealed closed space is created. By hermetically sealing the space in which the semiconductor laser element 20 is disposed, quality deterioration due to dust collection can be suppressed. Furthermore, the lid member 80 is translucent to the light emitted from the semiconductor laser element 20.

[0164] In the light emitting device 1, 80% or more of the main light emitted from all the semiconductor laser elements 20 that are arranged in a line in the first direction and that irradiate the main light onto the light receiving element 40 is emitted upward to the outside.

[0165] In the light emitting device 1, the output of light emitted from the semiconductor laser element 20 can be controlled based on the result of light reception by the light receiving element 40. This allows the output of light emitted from the light emitting device 1 to be controlled.

[0166] Second Embodiment A light emitting device 2 according to a second embodiment will now be described. Figures 8 and 9 are diagrams for explaining an exemplary embodiment of the light emitting device 2. Figure 8 is a perspective view of the light emitting device 2. Figure 9 is a perspective view of the light emitting device 2 with the cover member 280 removed.

[0167] The light emitting device 2 has a plurality of components including a base 210, a semiconductor laser element 20, a submount 30, a light receiving element 40, a support stand 50, a plurality of wirings 70, and a lid member 280. The light emitting device 2 of the second embodiment differs from the light emitting device 1 of the first embodiment in that the shapes of the base 210 and the lid member 280 are different.

[0168] The base 210 does not have side portions 12. The base 210 is configured in a flat plate shape having an upper surface, a lower surface, and side surfaces. The surface on which the semiconductor laser element 20 is disposed and the surface on which the wiring region 14 is provided are on the same plane. However, they do not have to be on the same plane. For example, the base may have a step portion 13 but not have an upper surface above the step portion 13.

[0169] Since the base 210 does not have a side portion 12, when joining the wiring 70 to the wiring area 14, there is no need to take care to ensure a certain distance from the side portion 12 so that the joining device joining the wiring 70 does not come into contact with the side portion 12.

[0170] The lid member 280 is configured in a cap shape having side walls. The side walls surround the placement region and the wiring region 14. The side walls are formed up to a position higher than any of the semiconductor laser element 20, the light receiving element 40, and the wiring 70 arranged on the base 210. The lid member 280 is joined to the upper surface of the base 210, and the space in which the semiconductor laser element 20 is arranged becomes a hermetically sealed closed space.

[0171] Although the embodiments of the present invention have been described above, the light-emitting device of the present invention is not strictly limited to the light-emitting device of the embodiments. In other words, the present invention can be realized without being limited to the external shape and structure of the light-emitting device disclosed in the embodiments. For example, a light-emitting device without a protective element may be used. Furthermore, the present invention may be applied without necessarily including all necessary and sufficient components. For example, if the claims do not recite some of the components of a light-emitting device disclosed in the embodiments, the claims allow for the design freedom of those components by those skilled in the art, such as substitution, omission, modification of shape, and change of material, and specify that the invention described in the claims applies. [Industrial Applicability]

[0172] The light emitting device described in each embodiment can be used in head-mounted displays, projectors, vehicle headlights, lighting, displays, and the like. [Explanation of symbols]

[0173] 1, 2 Light-emitting device 10, 210 base 11 Bottom part 12 Side part 13 Step 14 Wiring area 20 Semiconductor laser element 30 Submount 40 Photodetector 41 Joint surface 42 Photosensitive surface 43 Light receiving area 44 Wiring area 45 Conduction area 46 Central area 461 1st central area 462 Second central area 463 Third central area 47 Edge area 50 Support stand 51 Slope 60 Protection element 70 Wiring 71 1st wiring 72 2nd wiring 80, 280 Lid member

Claims

1. a plurality of light emitting elements each having an upper surface, a lower surface, and a side surface including an emission end surface from which light is emitted, the light emitting elements being arranged side by side in a first direction; a light-receiving element arranged in the first direction and having a light-receiving surface on which a plurality of light-receiving regions onto which light emitted from the plurality of light-emitting elements is irradiated and a plurality of first wiring regions are provided; a base portion having a plurality of second wiring regions and on which the plurality of light emitting elements and the light receiving element are arranged; a plurality of wirings, each of which has one end connected to one of the plurality of first wiring regions and the other end connected to one of the plurality of second wiring regions; the plurality of light-emitting elements include a first light-emitting element and a second light-emitting element, and a spread angle of light of the first light-emitting element in the vertical direction is larger than a spread angle of light of the second light-emitting element in the vertical direction; the plurality of light receiving regions include a first light receiving region and a second light receiving region, and in a second direction that is a direction that passes through an irradiation point of light that passes through an optical axis among light that is irradiated to the first light receiving region and is perpendicular to the first direction in a top view, a length of the first light receiving region is longer than a length of the second light receiving region; a main portion of the light emitted from the first light-emitting element is not irradiated onto the second light-receiving region but is irradiated onto the first light-receiving region; a light emitting device, wherein a major portion of the light emitted from the second light emitting element is not irradiated onto the first light receiving region but is emitted onto the second light receiving region;

2. The light emitting device according to claim 1 , wherein the light emitted from the plurality of light emitting elements is light emitted to the outside.

3. The light emitting device according to claim 1 , wherein each of the plurality of light receiving regions is rectangular, and the length in the second direction is greater than the length in the first direction.

4. 4. The light-emitting device according to claim 1, wherein the second light-receiving region is sandwiched between a straight line passing through one end of the first light-receiving region in the second direction and parallel to the first direction, and a straight line passing through the other end of the first light-receiving region and parallel to the first direction.

5. the first light-emitting element is a semiconductor laser element that emits red light, The light emitting device according to claim 1 , wherein the second light emitting element is a semiconductor laser element that emits blue or green light.

6. The light emitting device according to claim 1 , wherein the plurality of light receiving regions are not arranged side by side in a direction perpendicular to the first direction.

7. the light receiving element has the light receiving surface tilted with respect to a traveling direction of light passing through an optical axis among the light emitted from the light emitting element, The light receiving element reflects a part of the light irradiated onto the light receiving region, The light emitting device according to claim 1 , wherein 80% or more of the main part of light emitted from the plurality of light emitting elements is emitted upward to the outside.

8. 8. The light-emitting device according to claim 1, wherein at least one of the plurality of wirings is joined to the second wiring region provided within a region sandwiched between a straight line extending in the first direction through one of the ends of the light-receiving element that is furthest from the other end in the second direction when viewed from above, and a straight line extending in the first direction through the other end.

9. 9. The light-emitting device according to claim 1, wherein the light-receiving element has, on the light-receiving surface, a conductive region connecting the first light-receiving region and the first wiring region, below a straight line passing through the upper end of the first light-receiving region and extending in the first direction, and above the upper end of the main portion of light irradiated to the second light-receiving region.

Images