Sealing resin composition

Abstract

To obtain a sealing material which achieves both a low linear expansion coefficient and a low elastic modulus.SOLUTION: A sealing resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a triglyceride having an unsaturated fatty acid residue and is used for sealing a wafer level package (WLP) or a panel level package (PLP).SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to an encapsulating resin composition. [Background technology]

[0002] Patent Document 1 (JP 2002-146163 A) describes a technology relating to encapsulating resin compositions. This document describes an encapsulating resin composition containing epoxy resin, phenolic resin, polyglycerol fatty acid ester, and inorganic filler as essential components, with the polyglycerol fatty acid ester and inorganic filler each contained in a specific ratio relative to the resin composition (claim 1). Specifically, the polyglycerol fatty acid ester is described as decaglyceryl pentaoleate (paragraph 0013, examples 1-3). This document also describes that the encapsulating resin composition described therein has excellent moldability, excellent electrical properties, and good filling and workability, and therefore, using this resin composition to encapsulate electronic components can improve both the workability and performance of semiconductor encapsulation devices (paragraph 0034). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-146163 Summary of the Invention [Problem to be solved by the invention]

[0004] The present inventors have studied the techniques described in the above patent documents and have found that there is room for improvement in terms of achieving both a low linear expansion coefficient and a low elastic modulus in the cured product. [Means for solving the problem]

[0005] According to the present invention, (A) epoxy resin, (B) a curing agent; (C) inorganic fillers, and (D) Triglycerides with unsaturated fatty acid residues Including, An encapsulating resin composition is provided for use in encapsulating a wafer level package (WLP) or a panel level package (PLP).

[0006] According to the present invention, (A) epoxy resin, (B) a curing agent; (C) inorganic fillers, and (D) Triglycerides with unsaturated fatty acid residues Including, A granular encapsulating resin composition is provided.

[0007] According to the present invention, there is provided a cured product which is a cured product of the encapsulating resin composition of the present invention.

[0008] According to the present invention, there is provided a wafer level package in which a plurality of electronic components are collectively encapsulated with the encapsulating resin composition of the present invention. According to the present invention, there is provided a panel level package in which a plurality of electronic components are encapsulated together with the encapsulating resin composition of the present invention.

[0009] According to the present invention, there is also provided an electronic device obtained by dividing the wafer level package or panel level package of the present invention. [Effects of the Invention]

[0010] According to the present invention, it is possible to obtain an encapsulating material that has both a low linear expansion coefficient and a low elastic modulus. [Brief explanation of the drawings]

[0011] [Figure 1] 1A to 1C are cross-sectional views schematically illustrating an example of a method for manufacturing an electronic device according to an embodiment. [Figure 2]1A to 1C are cross-sectional views schematically illustrating an example of a method for manufacturing an electronic device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] In this embodiment, the composition may contain each component either alone or in combination of two or more. In this specification, the symbol "to" indicating a numerical range means "greater than or equal to" or "less than or equal to," and both of the numerical values ​​at both ends are included.

[0013] (Sealing resin composition) In this embodiment, the encapsulating resin composition (hereinafter also simply referred to as "resin composition") contains the following components (A) to (D). (A) epoxy resin, (B) a curing agent; (C) inorganic fillers, and (D) Triglycerides with unsaturated fatty acid residues

[0014] The resin composition is preferably used for encapsulating a wafer level package (WLP) or a panel level package (PLP). WLP typically refers to a package in which all processes, including rewiring, electrode formation, resin sealing, and dicing, are carried out during the wafer process, and the size of the semiconductor chips obtained by finally cutting the wafer is the same as the size of the package. Specifically, PLP is a technology for manufacturing electronic devices in bulk using panel-shaped substrates that are larger than the regular wafers (for example, 12-inch wafers) used in WLP. Both WLP and PLP involve the bulk encapsulation of a large area substrate, rather than the encapsulation of each relatively small semiconductor chip.

[0015] In this embodiment, the resin composition contains a combination of components (A) to (D), and therefore the linear expansion coefficient and elastic modulus of the cured product, which are inherently in a trade-off relationship, can be reduced in an appropriate manner, thereby effectively suppressing warpage of the substrate even when large-area sealing is required, such as in WLP and PLP.

[0016] The resin composition is, for example, in the form of particles, and is preferably in the form of granules from the viewpoint of ensuring favorable manufacturing stability during molding even when forming an encapsulant on a large-area substrate. Specifically, the granular resin composition is an aggregate formed by solidifying powders (particulate kneaded products) of the resin composition together, or a granulated product obtained by a known granulation method.

[0017] From the viewpoint of improving the handleability of the resin composition, the average particle size of the resin composition is preferably 0.03 mm or more, more preferably 0.05 mm or more, and even more preferably 0.1 mm or more. From the viewpoint of improving filling properties, the average particle size of the resin composition is preferably 3.0 mm or less, more preferably 2.5 mm or less, and even more preferably 2.0 mm or less.

[0018] Here, the particle size distribution of the resin composition can be measured on a volume basis by using a commercially available laser diffraction particle size distribution measuring device (for example, SALD-7000 manufactured by Shimadzu Corporation).

[0019] (coefficient of linear expansion) From the viewpoint of suppressing warpage, the coefficient of linear expansion CTE of the resin composition at a temperature below the glass transition temperature is preferably 10.0 ppm / °C or less, more preferably 8.0 ppm / °C or less, and even more preferably 6.0 ppm / °C or less. There is no lower limit to the CTE, but it is preferably equal to or greater than the linear expansion coefficient of the silicon wafer used, and may be, for example, 3.5 ppm / °C or greater. Specifically, the linear expansion coefficient is measured by the following method.

[0020] (Method for measuring linear expansion coefficient) The resin composition was injected into a transfer molding machine at a mold temperature of 175°C, injection pressure of 9.8 MPa, and a cure time of 180 seconds to obtain test specimens measuring 15 mm long x 4.5 mm short x 3 mm thick. The test specimens were post-cured at 175°C for 4 hours and then measured in compression mode using a thermomechanical analyzer (Hitachi High-Tech Science, TMA7100) at a temperature range of -60°C to 400°C and a heating rate of 5°C / min. The average linear expansion coefficient from 50°C to 70°C was calculated from the measurement results to determine the CTE.

[0021] (flexural modulus) From the viewpoint of improving handleability, the flexural modulus at 25° C. of the cured product of the resin composition is preferably 5 GPa or more, more preferably 10 GPa or more, and even more preferably 15 GPa or more. From the viewpoint of suppressing warpage, the flexural modulus at 25° C. of the cured product of the resin composition is preferably 35 GPa or less, more preferably 30 GPa or less, and even more preferably 26 GPa or less. The flexural modulus of the cured product is measured by the following method.

[0022] (Method for measuring flexural modulus) The resin composition was injected into a transfer molding machine at a mold temperature of 175°C, an injection pressure of 9.8 MPa, and a curing time of 180 seconds to obtain a molded product measuring 10 mm wide, 4 mm thick, and 80 mm long. The molded product was post-cured at 175°C for 4 hours to obtain a test piece. The flexural modulus of the resulting test piece at 25°C was measured in accordance with JIS K 6911. Next, the components contained in the resin composition will be described.

[0023] (Component (A)) Component (A) is an epoxy resin. Examples of epoxy resins include biphenyl-type epoxy resins; bisphenol-type epoxy resins such as bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, and tetramethylbisphenol F-type epoxy resins; stilbene-type epoxy resins; novolac-type epoxy resins such as phenol novolac-type epoxy resins and cresol novolac-type epoxy resins; polyfunctional epoxy resins such as triphenylmethane-type epoxy resins exemplified by triphenolmethane-type epoxy resins and alkyl-modified triphenolmethane-type epoxy resins; phenol aralkyl-type epoxy resins having a phenylene skeleton, naphthol aralkyl-type epoxy resins having a phenylene skeleton, and the like. the epoxy resins are one or more selected from the group consisting of phenol aralkyl epoxy resins such as phenol aralkyl epoxy resins having a biphenylene skeleton and naphthol aralkyl epoxy resins having a biphenylene skeleton; naphthol epoxy resins such as dihydroxynaphthalene epoxy resins and epoxy resins obtained by glycidyl etherifying a dihydroxynaphthalene dimer; triazine nucleus-containing epoxy resins such as triglycidyl isocyanurate and monoallyl diglycidyl isocyanurate; and bridged cyclic hydrocarbon compound-modified phenolic epoxy resins such as dicyclopentadiene-modified phenolic epoxy resins.

[0024] From the viewpoint of suppressing warpage of the cured product of the resin composition and improving the balance of various properties such as filling ability, heat resistance, and moisture resistance, component (A) preferably contains one or more resins selected from the group consisting of triphenylmethane type epoxy resins, biphenyl aralkyl type epoxy resins, and biphenyl type epoxy resins.

[0025] From the viewpoint of improving moldability, the content of component (A) in the resin composition is preferably 1% by mass or more, more preferably 2% by mass or more, and even more preferably 3% by mass or more, based on the total mass of the resin composition. Furthermore, from the viewpoint of suppressing shrinkage during molding, the content of component (A) in the resin composition is preferably 15 mass % or less, more preferably 10 mass % or less, even more preferably 8 mass % or less, and even more preferably 6 mass % or less, based on the total resin composition.

[0026] (Component (B)) Component (B) is a curing agent. Examples of the curing agent include linear aliphatic diamines having 2 to 20 carbon atoms, such as ethylenediamine, trimethylenediamine, tetramethylenediamine, and hexamethylenediamine, and amines such as metaphenylenediamine, paraphenylenediamine, paraxylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl sulfone, 4,4'-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, metaxylenediamine, paraxylenediamine, 1,1-bis(4-aminophenyl)cyclohexane, and dicyanodiamide; resole-type phenolic resins such as aniline-modified resole resins and dimethyl ether resole resins; Novolac-type phenolic resins such as phenol novolac resin, cresol novolac resin, tert-butylphenol novolac resin, and nonylphenol novolac resin; Multifunctional phenolic resins such as trihydroxyphenylmethane phenolic resins; phenol aralkyl resins such as phenylene skeleton-containing phenol aralkyl resins and biphenylene skeleton-containing phenol aralkyl resins; Phenolic resins with condensed polycyclic structures such as naphthalene and anthracene skeletons; Phenolic resins other than those mentioned above; Polyoxystyrenes such as polyparaoxystyrene; Acid anhydrides including alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA), and aromatic acid anhydrides such as trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), and benzophenonetetracarboxylic acid (BTDA); Polymercaptan compounds such as polysulfides, thioesters, and thioethers; isocyanate compounds such as isocyanate prepolymers and blocked isocyanates; and One or more selected from the group consisting of organic acids such as carboxylic acid-containing polyester resins can be used. Furthermore, component (B) preferably contains at least one selected from the group consisting of phenol novolac resin, trisphenylmethane mixed phenol resin, and biphenyl aralkyl phenol resin, and more preferably contains trisphenylmethane mixed phenol resin and biphenyl aralkyl phenol resin.

[0027] From the viewpoint of improving the curing properties, the content of component (B) in the resin composition is preferably 0.3 mass% or more, more preferably 0.5 mass% or more, even more preferably 1 mass% or more, even more preferably 1.5 mass% or more, and even more preferably 2 mass% or more, based on the total mass of the resin composition. Furthermore, from the viewpoint of improving the fluidity and filling property during molding, the content of component (B) in the resin composition is preferably 10.0 mass% or less, more preferably 7.0 mass% or less, even more preferably 5.0 mass% or less, and even more preferably 3.0 mass% or less, based on the total resin composition.

[0028] (Component (C)) Component (C) is an inorganic filler, and examples of component (C) include silica such as fused silica and crystalline silica, alumina, talc, titanium oxide, silicon nitride, and aluminum nitride. From the viewpoint of excellent versatility, component (C) preferably contains silica, and more preferably is silica. Examples of the shape of silica include spherical silica such as fused spherical silica, and crushed silica.

[0029] Average particle size of component (C) d 50 From the viewpoint of suppressing shrinkage during molding, the thickness is preferably 0.5 μm or more, and more preferably 1.0 μm or more. In addition, from the viewpoint of improving the filling property during molding, the average particle size d 50is preferably 20 μm or less, more preferably 15 μm or less, even more preferably 12 μm or less, and even more preferably 10 μm or less.

[0030] Here, the average particle size of component (C) d 50 is the average particle size measured using a commercially available laser particle size distribution analyzer (for example, SALD-7000 manufactured by Shimadzu Corporation).

[0031] From the viewpoint of suppressing warping, the content of component (C) in the resin composition is preferably 70% by mass or more, more preferably 80% by mass or more, even more preferably 85% by mass or more, and still more preferably 88% by mass or more, based on the total resin composition. Furthermore, from the viewpoint of improving fluidity and filling properties during molding, the content of component (C) in the resin composition is preferably 98 mass% or less, more preferably 96 mass% or less, even more preferably 95 mass% or less, and even more preferably 92 mass% or less, based on the total resin composition.

[0032] (Component (D)) Component (D) is a triglyceride having unsaturated fatty acid residues. The number of unsaturated fatty acid residues (acyl groups) in one triglyceride molecule is at least 1 and at most 3. Component (D) may contain one unsaturated fatty acid residue and two saturated fatty acid residues, two unsaturated fatty acid residues and one saturated fatty acid residue, or three unsaturated fatty acid residues. Furthermore, when one triglyceride molecule contains multiple unsaturated fatty acid residues, the multiple unsaturated fatty acid residues may be the same or different.

[0033] The number of carbon atoms of the unsaturated fatty acid in the unsaturated fatty acid residue is, for example, 8 or more, preferably 10 or more, more preferably 12 or more, even more preferably 14 or more, and still more preferably 16 or more, and is, for example, 24 or less, preferably 22 or less, and more preferably 20 or less. Specific examples of unsaturated fatty acids in the unsaturated fatty acid residue include oleic acid (number of carbon atoms: number of double bonds = C18:1), linoleic acid (C18:2), and linolenic acid (C18:3).

[0034] Component (D) may further contain a saturated fatty acid residue, wherein the number of carbon atoms of the saturated fatty acid in the saturated fatty acid residue is, for example, 8 or more, preferably 10 or more, more preferably 12 or more, even more preferably 14 or more, and still more preferably 16 or more, and for example, 24 or less, preferably 22 or less, and more preferably 20 or less. Specific examples of saturated fatty acid residues include palmitic acid (C16:0) and stearic acid (C18:0).

[0035] From the viewpoint of improving dispersibility in the composition, component (D) is liquid at 25°C, that is, has flowability at 25°C. From the same viewpoint, the iodine value of component (D) is preferably 100 or more, more preferably 105 or more, and even more preferably 110 or more. From the viewpoint of improving heat resistance, the iodine value of component (D) is preferably 250 or less, preferably 230 or less, more preferably 210 or less, and even more preferably 180 or less.

[0036] It is also preferred that the resin composition comprises a mixture of two or more components (D). Furthermore, from the viewpoint of improving dispersibility in the composition, component (D) is preferably a vegetable oil. Specific examples of vegetable oils include one or more selected from the group consisting of soybean oil, linseed oil, rapeseed oil, sunflower oil, corn oil, olive oil, safflower oil, rice oil, palm oil, coconut oil, sesame oil, and perilla oil. From the viewpoint of improving dispersibility in the composition, component (D) is preferably one or more selected from the group consisting of soybean oil, linseed oil, rapeseed oil, and sunflower oil.

[0037] From the viewpoint of suppressing warping, the content of component (D) in the resin composition is preferably 0.1 mass% or more, more preferably 0.5 mass% or more, even more preferably 1.0 mass% or more, and still more preferably 1.2 mass% or more, based on the total mass of the resin composition. Furthermore, from the viewpoint of improving mechanical strength, the content of component (D) in the resin composition is preferably 2 mass % or less, more preferably 1.8 mass % or less, and even more preferably 1.6 mass % or less, based on the total resin composition.

[0038] The resin composition may further contain components other than the components (A) to (D). For example, the resin composition preferably further contains the following component (E).

[0039] (Component (E)) Component (E) is a silicone oil. Specific examples of component (E) include organopolysiloxanes. Here, the organopolysiloxanes used may have functional groups such as epoxy groups, amino groups, methoxy groups, phenyl groups, carboxy groups, hydroxy groups, alkyl groups, vinyl groups, mercapto groups, and polyether groups introduced into their structure. The functional group introduced into the organopolysiloxane structure is preferably at least one selected from the group consisting of carboxy groups, epoxy groups, and polyether groups. Commercially available products containing component (E) include FZ-3730 and BY-750 manufactured by Dow-Toray.

[0040] From the viewpoint of suppressing warping, the content of component (E) in the resin composition is preferably 0.1 mass% or more, more preferably 0.2 mass% or more, even more preferably 0.4 mass% or more, and still more preferably 0.6 mass% or more, based on the total resin composition. Furthermore, from the viewpoint of improving the balance between the warpage suppression effect and the improvement in adhesion and filling ability, the content of component (E) in the resin composition is preferably 2 mass% or less, more preferably 1.8 mass% or less, and even more preferably 1.6 mass% or less, based on the total resin composition.

[0041] From the viewpoint of suppressing warpage, the total content of components (D) and (E) in the resin composition is preferably 0.5 mass% or more, more preferably 0.8 mass% or more, and even more preferably 1 mass% or more, based on the total resin composition. Furthermore, from the viewpoint of improving mechanical strength, the total content of components (D) and (E) in the resin composition is preferably 2 mass% or less, more preferably 1.8 mass% or less, and even more preferably 1.6 mass% or less, based on the total resin composition.

[0042] The resin composition may further contain components other than those described above. For example, the resin composition may further contain one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, an ion catcher, a colorant, and other additives.

[0043] (curing accelerator) The curing accelerator may be, for example, one that accelerates the crosslinking reaction between the epoxy resin (component A) and the curing agent (component B). Examples of the curing accelerator include one or more selected from phosphorus atom-containing compounds such as organic phosphines, tetra-substituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, and adducts of phosphonium compounds and silane compounds; and nitrogen atom-containing compounds such as amidines and tertiary amines, exemplified by 1,8-diazabicyclo[5.4.0]undecene-7, benzyldimethylamine, and 2-methylimidazole, as well as quaternary salts of the above amidines and amines.

[0044] From the viewpoint of improving curability, the content of the curing accelerator in the resin composition is preferably 0.05% by mass or more, and more preferably 0.1% by mass or more, based on the total mass of the resin composition. Furthermore, from the viewpoint of improving the production stability of the cured product, the content of the curing accelerator in the resin composition is preferably 1 mass % or less, more preferably 0.5 mass % or less, and even more preferably 0.3 mass % or less, based on the total mass of the resin composition.

[0045] (coupling agent) The coupling agent may include one or more types selected from known coupling agents such as aminosilanes such as epoxysilane, mercaptosilane, and phenylaminosilane, various silane-based compounds such as alkylsilane, ureidosilane, vinylsilane, and methacrylsilane; titanium-based compounds; aluminum chelates; and aluminum / zirconium-based compounds. From the viewpoint of improving the strength and toughness of the cured product in a well-balanced manner, the coupling agent is preferably a silane coupling agent, and more preferably at least one of aminosilane and epoxysilane.

[0046] From the viewpoint of improving curability, the content of the coupling agent in the resin composition is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, and even more preferably 0.3% by mass or more, based on the total mass of the resin composition. Furthermore, from the viewpoint of improving the production stability of the cured product, the content of the coupling agent in the resin composition is preferably 2% by mass or less, more preferably 1% by mass or less, and even more preferably 0.7% by mass or less, based on the total resin composition.

[0047] The release agent may include one or more selected from natural waxes such as carnauba wax; synthetic waxes such as oxidized polyethylene wax, Montan acid ester wax, and reaction products of polycondensates of 1-alkene (C>10)·maleic anhydride with stearyl alcohol; higher fatty acids such as zinc stearate and metal salts thereof; and paraffin. From the viewpoint of obtaining more favorable releasability and curing characteristics, the content of the release agent in the resin composition is preferably 0.05% by mass or more, more preferably 0.1% by mass or more, and is preferably 2% by mass or less, more preferably 1% by mass or less, based on the total mass of the resin composition.

[0048] The ion catcher includes, for example, hydroxytalcite. From the viewpoint of improving the reliability of the cured product, the content of the ion catcher in the resin composition is preferably 0.01 mass% or more, more preferably 0.05 mass% or more, and is preferably 1 mass% or less, more preferably 0.5 mass% or less, based on the total resin composition.

[0049] The colorant includes, for example, one or more selected from the group consisting of carbon black, black titanium oxide, red iron oxide, and organic dyes. From the viewpoint of improving the appearance of the cured product, the content of the colorant in the resin composition is preferably 0.05% by mass or more, more preferably 0.1% by mass or more, and is preferably 1% by mass or less, more preferably 0.5% by mass or less, based on the total mass of the resin composition.

[0050] Other additives include, for example, flame retardants, low stress materials, and antioxidants other than the components (A) to (E).

[0051] Next, a method for producing the resin composition will be described. In this embodiment, the resin composition can be obtained, for example, by mixing the above-mentioned components by known means, melt-kneading them in a kneader such as a roll, kneader, or extruder, cooling, and then pulverizing them. If necessary, the pulverization in the above method may be followed by tableting to obtain a particulate resin composition. The degree of dispersion, flowability, etc. of the obtained resin composition may also be adjusted as appropriate.

[0052] (hardened body) The present cured product is a cured product of the resin composition of the present embodiment. The cured product is suitably used, for example, as a sealant.

[0053] (WLP, PLP) In the WLP and PLP, a plurality of electronic components are encapsulated together with the resin composition of this embodiment. The electronic device is obtained by dividing the WLP or PLP into individual pieces.

[0054] An example of a method for manufacturing an electronic device will be described below with reference to the drawings. 1(a) to 1(f) are schematic diagrams showing the steps of obtaining a WLP or PLP in which multiple electronic components are encapsulated together using the resin composition of this embodiment, and then dicing the WLP or PLP to obtain an electronic device 50 (FIG. 1(f)).

[0055] 1(a), first, in the disposing step, a plurality of electronic components (not shown) are disposed on the substrate 10. In this way, a circuit surface 21 is formed. Various types of substrates known in the field of electronic devices can be used for the substrate 10. Typically, SiN or the like is exposed on the circuit surface 21. The size and shape of the substrate 10 is, for example, a circle with a diameter of 12 inches in the case of a WLP, and is, for example, a substantially rectangular shape with a length of 300 to 800 mm and a width of 300 to 800 mm in the case of a PLP.

[0056] Next, bumps 22 such as metal posts are formed on the circuit surface 21 (FIG. 1(b)) to electrically connect solder balls 96 (FIG. 1(e)) described below to electronic components. Next, in the sealing step, the resin composition of this embodiment is used to form a sealant layer 30 so as to cover the circuit surface 21 (FIG. 1(c)). Then, the encapsulant layer 30 is removed to expose the bumps 22 from the encapsulant layer 30 (FIG. 1(d)). When forming the encapsulant layer 30, if the encapsulant layer 30 is formed so that the bumps 22 are exposed, as shown in FIG. 1(d), the encapsulant layer 30 does not need to be removed. Next, in the wiring process, solder balls 96 are connected to the bumps 22 (FIG. 1(e)). Then, in the singulation process, the encapsulant layer 30 and the base material 10 are cut to obtain the electronic devices 50 (FIG. 1(f)). A dicing blade, a laser, or the like can be used for the cutting. Note that the number of bumps 22 and solder balls 96 connected to the singulated electronic devices 50 is not limited and can be set according to the type of electronic device 50.

[0057] 2(a) to 2(g) are schematic diagrams showing the steps for obtaining an electronic device 52 (FIG. 2(g)), which is different from the electronic device 50 shown in FIG. 1(f). This step is preferably applied to the manufacture of electronic devices in a so-called FaN-Out type package.

[0058] First, a sacrificial material 70 is prepared, which has a release layer 71 provided on a substrate 10. Then, in the disposing step, a plurality of electronic components 20 are disposed on the release layer 71 of the sacrificial material 70 so as to be spaced apart from one another (FIG. 2(a)). For example, an adhesive with low adhesive strength or a resin containing a foaming agent can be used as the release layer 71. This allows the release layer 71 to be easily peeled from the electronic component 20 and the encapsulant layer 30 in the peeling step described below.

[0059] Next, in the encapsulation step, the resin composition of this embodiment is used to fill gaps between adjacent electronic components, and further to encapsulate the electronic components so as to cover the release layer 71 and the surfaces of all electronic components 20. This forms an encapsulant layer 30 (FIG. 2(b)).

[0060] Next, in the peeling step, the peeling layer 71 is peeled off from the sealing material layer 30 (FIG. 2(c)). The peeling can be performed by foaming the release layer 71 made of a thermally foamable adhesive by, for example, heat treatment, electron beam irradiation, ultraviolet irradiation, etc. Furthermore, when the release layer 71 is made of an adhesive with low adhesive strength, the peeling step can be performed without foaming or the like.

[0061] Next, as a wiring step, a rewiring insulating resin layer 80 is formed on the surface of the sealing material layer 30 on the side of the electronic component 20 (FIG. 2(d)). The rewiring insulating resin layer 80 is formed, for example, by forming a pattern by photolithography using a photosensitive resin composition and then performing a curing process. The photosensitive resin composition may contain a polyimide resin, a polybenzooxide resin, a benzocyclobutene resin, or the like. Via holes 82 may be formed in the rewiring insulating resin layer 80.

[0062] 2(e), a power supply layer is formed on the entire surface of the rewiring insulating resin layer 80 by a method such as sputtering, and then a resist layer is formed on the power supply layer, which is exposed to light and developed into a predetermined pattern, and then vias 92 and rewiring circuits 94 are formed by electrolytic copper plating.The resist layer is then peeled off, and the power supply layer can be etched. 2(f), for example, in a wiring step, solder balls 96 can be mounted on the rewiring circuit 94. Next, a solder resist layer 98 can be formed so as to cover the rewiring circuit 94 and a portion of the solder balls 96.

[0063] Next, as a singulation process, the sealing material layer 30, the rewiring insulating resin layer 80, and the solder resist layer 98 are cut to obtain singulated electronic devices, thereby obtaining electronic devices 52 (FIG. 2(g)). The number of electronic components 20 included in the electronic device 52 is not limited and can be set according to the type of the electronic device 52 .

[0064] Although the embodiments of the present invention have been described above with reference to the drawings, these are merely examples of the present invention, and various other configurations can also be adopted. Below, examples of reference forms are added. 1. (A) Epoxy resin, (B) a curing agent; (C) inorganic fillers, and (D) Triglycerides with unsaturated fatty acid residues Including, An encapsulating resin composition used for encapsulating wafer level packages (WLP) or panel level packages (PLP). 2. (A) Epoxy resin, (B) a curing agent; (C) inorganic fillers, and (D) Triglycerides with unsaturated fatty acid residues Including, The encapsulating resin composition is in a granular form. 3. The encapsulating resin composition according to 2., wherein the encapsulating resin composition has an average particle size of 0.03 mm or more and 3.0 mm or less. 4. The encapsulating resin composition according to any one of 1. to 3., wherein the component (D) is liquid at 25°C. 5. The encapsulating resin composition according to any one of 1. to 4., wherein the iodine value of the component (D) is 100 or more and 250 or less. 6. The encapsulating resin composition according to any one of 1. to 5., wherein the component (D) is a vegetable oil. 7. The encapsulating resin composition according to 6., wherein the component (D) is one or more oils selected from the group consisting of soybean oil, linseed oil, rapeseed oil and sunflower oil. 8. The encapsulating resin composition according to any one of 1. to 7., wherein the content of the component (D) in the encapsulating resin composition is 0.1% by mass or more and 2% by mass or less, based on the total mass of the encapsulating resin composition. 9. The encapsulating resin composition according to any one of 1. to 8., further comprising component (E): silicone oil. 10. The encapsulating resin composition according to 9., wherein the total content of the components (D) and (E) in the encapsulating resin composition is 0.5% by mass or more and 2% by mass or less, based on the total mass of the encapsulating resin composition. 11. The encapsulating resin composition according to any one of 1. to 10., wherein the component (A) comprises one or more resins selected from the group consisting of triphenylmethane-type epoxy resins, biphenylaralkyl-type epoxy resins, and biphenyl-type epoxy resins. 12. A cured product obtained by curing the encapsulating resin composition described in any one of 1. to 11. 13. A wafer level package in which a plurality of electronic components are encapsulated together with the encapsulating resin composition according to any one of 1. to 11. 14. A panel level package in which a plurality of electronic components are encapsulated together with the encapsulating resin composition according to any one of 1. to 11. 15. An electronic device obtained by dividing the wafer level package according to 13. or the panel level package according to 14. [Example]

[0065] The present embodiment will be specifically described below with reference to examples, but the present embodiment is not limited to these examples.

[0066] (Examples 1 to 8 and Comparative Examples 1 to 4) For each example, the components shown in Table 1 were mixed in a mixer. The resulting mixture was then roll-kneaded, and the kneaded product was then cooled and pulverized to obtain a granular resin composition.

[0067] The resin composition obtained in each example or its cured product was measured for the coefficient of linear expansion (CTE) and flexural modulus at 25° C. In addition, warpage was measured for some of the examples. The measurement results are also shown in Table 1. "ND" in Table 1 indicates that warpage was not measured.

[0068] Details of each component in Table 1 are as follows: (Inorganic filler) (C) Inorganic filler 1: Silica, TS-6026, manufactured by Micron Corporation, average particle size 9.0 μm (C) Inorganic filler 2: Silica, SC-2500-SQ, manufactured by Admatechs Co., Ltd., average particle size 0.5 μm (C) Inorganic filler 3: Silica, SC-5500-SQ, manufactured by Admatechs Co., Ltd., average particle size 1.5 μm

[0069] (coupling agent) Coupling agent 1: Phenylaminopropyltrimethoxysilane, CF-4083, manufactured by Dow-Toray Coupling agent 2: Hydrolyzed product of γ-glycidoxypropylmethyldimethoxysilane, KE-6137, manufactured by Kyushu Sumitomo Bakelite Co., Ltd.

[0070] (epoxy resin) (A) Epoxy resin 1: a mixture of trisphenylmethane epoxy resin and biphenyl epoxy resin, YL6677, manufactured by Mitsubishi Chemical Corporation (A) Epoxy resin 2: biphenyl aralkyl type epoxy resin, NC3000, manufactured by Nippon Kayaku Co., Ltd. (A) Epoxy resin 3: a mixture of biphenylene skeleton-containing phenol aralkyl epoxy resin and biphenyl epoxy resin, CER-3000L, manufactured by Nippon Kayaku Co., Ltd. (A) Epoxy resin 4: Biphenyl type epoxy resin, YX4000K, manufactured by Mitsubishi Chemical Corporation

[0071] (hardening agent) (B) Hardener 1: Trisphenylmethane mixed phenolic resin, HE910-20, manufactured by Air Water Co., Ltd. (B) Curing agent 2: biphenyl aralkyl phenolic resin, MEH-7851SS, manufactured by Meiwa Kasei Co., Ltd.

[0072] (curing accelerator) Curing accelerator 1: Tetraphenylphosphonium 4,4'-sulfonyldiphenolate, manufactured by Sumitomo Bakelite Co., Ltd. Curing accelerator 2: Tetraphenylphosphonium bis(naphthalene-2,3-dioxy)phenyl silicate, manufactured by Sumitomo Bakelite Co., Ltd.

[0073] (coloring agent) Colorant 1: Carbon black, manufactured by Mitsubishi Chemical Corporation, Carbon #5

[0074] (Ion Catcher) Ion Catcher 1: Hydrotalcite, DHT-4H, manufactured by Kyowa Chemical Industry Co., Ltd.

[0075] (Triglycerides with unsaturated fatty acid residues) (D) Triglyceride 1: soybean oil, manufactured by Nisshin Oillio Group Co., Ltd. (D) Triglyceride 2: Flaxseed oil, manufactured by Nisshin Oillio Group Co., Ltd. (D) Triglyceride 3: Mixed vegetable oil, manufactured by Sanwa Synthetic Chemical Industry Co., Ltd.

[0076] (silicone oil) (E) Silicone oil 1: Polyether-modified silicone oil, FZ-3730, manufactured by Dow-Toray

[0077] (Measurement and evaluation methods) (coefficient of linear expansion) The resin composition obtained in each example was injection molded using a transfer molding machine at a mold temperature of 175°C, an injection pressure of 9.8 MPa, and a curing time of 180 seconds to obtain test pieces with long sides of 15 mm, short sides of 4.5 mm, and a thickness of 3 mm. The obtained test pieces were post-cured at 175°C for 4 hours, and then measured using a thermomechanical analyzer (Hitachi High-Tech Science, TMA7100) in compression mode under the conditions of a measurement temperature range of -60°C to 400°C and a heating rate of 5°C / min. From the measurement results, the average coefficient of linear expansion from 50°C to 70°C was calculated and used as the CTE.

[0078] (flexural modulus) The resin composition obtained in each example was injection molded using a transfer molding machine at a mold temperature of 175°C, injection pressure of 9.8 MPa, and curing time of 180 seconds to obtain molded articles measuring 10 mm wide x 4 mm thick x 80 mm long. The molded articles were post-cured at 175°C for 4 hours to obtain test specimens. The flexural modulus of the obtained test piece at 25°C was measured in accordance with JIS K 6911.

[0079] (warp) The encapsulating resin composition was compression molded onto one side of a silicon wafer with a thickness of 0.775 mm and a diameter of 300 mm (12 inches) under conditions of a mold temperature of 150°C, a molding pressure of 6 MPa, and a curing time of 5 minutes. The molded resin thickness was adjusted to 0.5 mm. The molded product was then cured in an oven for 4 hours without load. This resulted in a wafer-level package. The obtained wafer-level package was placed on a flat plate with the resin surface facing up. Eight points were determined at equal distances around the periphery of the resin surface, and the heights of these eight points from the flat plate were measured using a laser displacement meter (Keyence Corporation, Multicolor Laser Coaxial Displacement Meter CL-3000). The average value of the measured heights, excluding the silicon wafer and resin, was taken as the amount of warpage.

[0080] [Table 1]

[0081] From Table 1, it can be seen that between Examples 1 and 5 to 8 and Comparative Example 1, between Example 2 and Comparative Example 2, between Example 3 and Comparative Example 3, and between Example 4 and Comparative Example 4, the Examples were able to achieve both a low linear expansion coefficient and a low elastic modulus compared to the Comparative Examples. [Explanation of symbols]

[0082] 10 Base material 20 Electronic Components 21 Circuit side 22 Bump 30 Encapsulant layer 50 Electronic equipment 52 Electronic equipment 70 Sacrificial Material 71 Peeling layer 80 Rewiring insulating resin layer 82 Beer Hall 92 Beer 94 Rewiring circuit 96 solder balls 98 Solder resist layer

Claims

1. (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) Triglycerides having unsaturated fatty acid residues Including, the component (A) comprises one or more resins selected from the group consisting of triphenylmethane-type epoxy resins, biphenylaralkyl-type epoxy resins, and biphenyl-type epoxy resins, the content of the component (A) in the encapsulating resin composition is 1% by mass or more and 15% by mass or less with respect to the entire encapsulating resin composition, the content of the component (C) in the encapsulating resin composition is 80% by mass or more and 95% by mass or less with respect to the entire encapsulating resin composition, the content of the component (D) in the encapsulating resin composition is 0.1% by mass or more and 2% by mass or less with respect to the entire encapsulating resin composition, An encapsulating resin composition used for encapsulating a wafer level package (WLP) or a panel level package (PLP).

2. (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) Triglycerides having unsaturated fatty acid residues Including, the component (A) comprises one or more resins selected from the group consisting of triphenylmethane-type epoxy resins, biphenylaralkyl-type epoxy resins, and biphenyl-type epoxy resins, the content of the component (A) in the encapsulating resin composition is 1% by mass or more and 15% by mass or less with respect to the entire encapsulating resin composition, the content of the component (C) in the encapsulating resin composition is 80% by mass or more and 95% by mass or less with respect to the entire encapsulating resin composition, the content of the component (D) in the encapsulating resin composition is 0.1% by mass or more and 2% by mass or less with respect to the entire encapsulating resin composition, The encapsulating resin composition is in a granular form.

3. The encapsulating resin composition according to claim 2 , wherein the average particle size of the encapsulating resin composition is 0.03 mm or more and 3.0 mm or less.

4. The encapsulating resin composition according to claim 1 , wherein the component (D) is liquid at 25° C.

5. The encapsulating resin composition according to claim 1 , wherein the component (D) has an iodine value of 100 or more and 250 or less.

6. The encapsulating resin composition according to claim 1 , wherein the component (D) is a vegetable oil.

7. 7. The encapsulating resin composition according to claim 6, wherein the component (D) is one or more oils selected from the group consisting of soybean oil, linseed oil, rapeseed oil, and sunflower oil.

8. The encapsulating resin composition according to claim 1 , further comprising a component (E): a silicone oil.

9. 9. The encapsulating resin composition according to claim 8, wherein the total content of the components (D) and (E) in the encapsulating resin composition is 0.5 mass % or more and 2 mass % or less with respect to the entire encapsulating resin composition.

10. A cured product, which is a cured product of the encapsulating resin composition according to claim 1 .

11. A wafer level package in which a plurality of electronic components are encapsulated together with the encapsulating resin composition according to claim 1 .

12. A panel level package in which a plurality of electronic components are encapsulated together with the encapsulating resin composition according to claim 1 .

13. An electronic device obtained by singulating the wafer level package according to claim 11 or the panel level package according to claim 12.

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