Sensor Device

Abstract

To more surely cover a bent lead-out portion of electric wire with an outside resin molding portion.SOLUTION: A sensor device 10 includes: an internal component 20 including a sensor element 12; a wire 30 extending from the internal component 20; an outer resin molded portion 40 including a component covering portion 42 covering at least a portion of the internal component and a wire covering portion 44 covering a portion of the wire extending from the internal component; and a bracket 50 including a surrounding portion 52 surrounding the wire covering portion and a fixing portion 58 protruding outward from the surrounding portion, where the wire has a bent pull out portion 38 from a place in which the wire is bent in the wire covering portion to a place in which the wire is pulled out from the wire covering portion, and the bracket 50 includes a receiving portion 54 having a receiving surface 54f for receiving at least a part of an outer circumference of the bent pull out portion 38 in the wire covering portion 44.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a sensor device. [Background technology]

[0002] Patent Document 1 discloses a composite molded part that includes an internal part, a primary molded part, and a secondary molded part. In this composite molded part, a screw fastening part is also integrally formed in the secondary molded part. An electric wire extending from the internal part passes through the primary molded part and the secondary molded part and is drawn out to the outside. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-146663 Summary of the Invention [Problem to be solved by the invention]

[0004] It is conceivable that the electric wire is kept in a bent state within the secondary molding portion. In this case, it is desirable that the bent portion can be more reliably covered by the secondary molding portion.

[0005] Therefore, an object of the present disclosure is to make it possible to more reliably cover the bent lead-out portion of the electric wire with the outer resin molded portion. [Means for solving the problem]

[0006] The sensor device of the present disclosure includes an outer resin molded portion having an internal component including a sensor element, electric wires extending from the internal component, a component covering portion covering at least a portion of the internal component, and an electric wire covering portion covering a portion of the electric wires extending from the internal component; and an enclosing portion surrounding the electric wire covering portion. Parts with The electric wire has a bent lead-out portion from a portion where the electric wire is bent in the electric wire covering portion to a portion where the electric wire is led out of the electric wire covering portion, partsThe sensor device further includes a receiving portion, which is provided within the wire covering portion and has a receiving surface that receives at least a part of the outer periphery of the bent lead-out portion. [Effects of the Invention]

[0007] According to the present disclosure, the bent lead-out portion of the electric wire can be more reliably covered by the outer resin molded portion. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing a sensor device according to an embodiment. [Figure 2] FIG. 2 is a perspective view showing a bracket of the sensor device. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described.

[0010] The sensor device of the present disclosure is as follows.

[0011] (1) A sensor device comprising: an internal component including a sensor element; an outer resin molded portion having an electric wire extending from the internal component; a component covering portion covering at least a portion of the internal component; and an electric wire covering portion covering the portion of the electric wire extending from the internal component; and a bracket having an enclosure portion surrounding the electric wire covering portion and a fixing portion protruding outward from the enclosure portion, wherein the electric wire has a bent pull-out portion from a point where it bends within the electric wire covering portion to a point where it is pulled out from the electric wire covering portion, and the bracket has a receiving portion having a receiving surface within the electric wire covering portion that receives at least a portion of the outer periphery of the bent pull-out portion.

[0012] According to this sensor device, the wire covering portion can be molded with the receiving surface receiving at least a portion of the outer periphery of the bent lead-out portion, which stabilizes the position of the bent lead-out portion within the wire covering portion and ensures that the bent lead-out portion is covered by the outer resin molding portion.

[0013] (2) In the sensor device of (1), the receiving surface may be shaped to contact a part of the bent lead-out portion in the circumferential direction, thereby making it easier for the bent lead-out portion to come into contact with the receiving surface.

[0014] (3) In the sensor device of (1) or (2), the outer resin molding portion may have a gate mark through which molten resin is injected, and at least a portion of the bent pull-out portion may be located between the gate mark and the receiving surface.

[0015] In this case, the resin pressure generated when the molten resin is injected from the gate is effectively received by the receiving surface, thereby stabilizing the position of the bent drawn-out portion within the outer resin molding portion.

[0016] (4) In the sensor device according to any one of (1) to (3), the receiving surface may receive at least a portion of the bent lead-out portion from an inner peripheral side of the bent lead-out portion.

[0017] In this case, by pressing at least a part of the bent lead-out portion against the receiving surface, it is easy to keep the electric wire in a bent state within the mold.

[0018] (5) In the sensor device according to any one of (1) to (4), the receiving portion may have an exposed surface that is exposed from the outer resin molded portion.

[0019] This allows the exposed surface to be brought into contact with a mold for molding the outer resin molded portion, and the receiving surface can receive the electric wire with the receiving portion in contact with the mold.

[0020] (6) In the sensor device of (5), the receiving portion may have a plurality of the exposed surfaces, and the portions of the receiving portion between the plurality of exposed surfaces may be covered by the outer resin molded portion.

[0021] In this case, since the portions between the multiple exposed surfaces are covered by the outer resin molded portion, the receiving portion is difficult to separate from the outer resin molded portion.

[0022] (7) In the sensor device according to any one of (1) to (6), at least a part of the bent portion of the bent lead-out portion may be located within the enclosure portion.

[0023] This stabilizes the position of the bent lead-out portion within the wire covering portion even when at least a part of the bent portion of the bent lead-out portion is located within the enclosing portion.

[0024] [Details of the embodiments of the present disclosure] Specific examples of the sensor device of the present disclosure will be described below with reference to the drawings. Note that the present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0025] [Embodiment] The sensor device according to the embodiment will be described below. Fig. 1 is a perspective view showing a sensor device 10. Fig. 2 is a perspective view showing a bracket 50 of the sensor device. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1. Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 1. In Figs. 3 and 4, the outer shapes of the internal component 20 and the electric wire 30 are shown in cross section. Fig. 3 shows the outer shape of a mold 90 for molding the outer resin molded portion 40.

[0026] The sensor device 10 comprises an internal component 20, an electric wire 30, an outer resin molded portion 40, and a bracket 50. The internal component 20 has a sensor element 12 (see FIG. 3). The sensor element 12 is connected to an end of the electric wire 30 within the internal component 20. The outer resin molded portion 40 covers the internal component 20 and the portion of the electric wire 30 extending from the internal component 20. The bracket 50 is integrated with the outer periphery of the outer resin molded portion 40. The bracket 50 protrudes outward from the outer resin molded portion 40. The sensor device 10 is fixed to an object to which the sensor device 10 is fixed via the bracket 50. The electric wire 30 is bent within the outer resin molded portion 40. The direction in which the electric wire 30 extends from the outer resin molded portion 40 is determined by the angle of the electric wire 30. but The direction in which the electric wire 30 is drawn out is different from the direction in which it is drawn out from the internal component 20. The direction in which the electric wire 30 is drawn out from the outer resin molding part 40 is set depending on the path of the electric wire 30 in the object to which the sensor device 10 is fixed and the position of the connection destination of the electric wire 30. The object to which the sensor device 10 is fixed may be, for example, a vehicle, more specifically, a component near the wheel.

[0027] More specifically, the internal component 20 is the component that contains the sensor element 12 .

[0028] The sensor element 12 is an element that detects physical quantities such as magnetism, light, temperature, etc., or changes therein. Here, the sensor element 12 includes an element body 13 and lead portions 14. The element body 13 is formed, for example, in a rectangular shape. The lead portions 14 are elongated portions made of metal or the like. The lead portions 14 extend outward from the element body 13. An output signal from the sensor element 12 is output to the outside via an electric wire 30. The sensor device 10 is used, for example, as a sensor that detects the rotational speed of a wheel in a vehicle. More specifically, the sensor device 10 may be used as a sensor for an ABS (antilock braking system).

[0029] The internal component 20 includes an internal holder portion 26. The internal holder portion 26 is a resin portion that covers the sensor element 12 and the connection portion with the electric wire 30. The internal holder portion 26 is, for example, a resin-molded portion that is molded using a die with the sensor element 12 and the connection portion between the lead portion 14 and the electric wire 30 as insert portions.

[0030] It is not essential that the internal holder portion 26 is a molded part with the sensor element 12 and the like as an insert portion. For example, the internal holder portion 26 may be molded into a shape into which the sensor element 12 can be fitted, and the sensor element 12 may be fitted into it. It is also not essential that the sensor device 10 includes the internal holder portion 26. The outer resin molded portion 40 may directly cover the sensor element 12.

[0031] The electric wires 30 are connected to the sensor element 12 and extend from the internal component 20. The electric wires 30 include a core wire 30a, which is a conductor, and an insulating coating 30b that covers the core wire 30a. The sensor device 10 includes the same number of electric wires 30 as the number of lead portions 14 of the sensor element 12. For example, if the sensor element 12 has two lead portions 14, the sensor device 10 includes two electric wires 30. The multiple electric wires 30 are bundled and covered with a sheath 34. The sheath 34 is a coating formed of resin or the like. The multiple electric wires 30 extend from the end of the sheath 34. The core wires 30a are exposed at the end of the multiple electric wires 30. The core wires 30a at each end of the multiple electric wires 30 are connected to the lead portion 14. The connection between the core wires 30a and the lead portion 14 may be made by, for example, soldering or crimping. The sensor device 10 may include one electric wire 30. The plurality of electric wires 30 may not be covered by a sheath.

[0032] The internal holder portion 26 covers the sensor element 12, the connection portion between the lead portion 14 and the electric wire 30, and the end of the electric wire 30 on the sensor element 12 side, and the electric wire 30 extends from the internal part 20.

[0033] The longitudinal direction of the internal component 20 coincides with the longitudinal direction of the lead portion 14 of the sensor element 12. In this embodiment, the direction in which the electric wire 30 extends from the internal component 20 coincides with the longitudinal direction of the internal component 20, but this is not essential.

[0034] The outer resin molded part 40 is a resin part molded by a mold with the internal component 20 and the part of the electric wire 30 drawn out from the internal component 20 as insert parts. The outer resin molded part 40 covers the sensor element 12 via the internal holder part 26, thereby improving the watertightness of the sensor element 12.

[0035] The outer resin molded portion 40 has a component covering portion 42 and an electric wire covering portion 44. The component covering portion 42 covers at least a portion of the internal component 20. The electric wire covering portion 44 covers a portion of the electric wires 30 that extends from the internal component 20.

[0036] More specifically, the component covering portion 42 is formed in an elongated shape, here a rectangular parallelepiped shape, that covers the internal component 20. The component covering portion 42 preferably covers the entire outer periphery of the internal component 20. A portion of the internal component 20 may not be covered by the component covering portion 42 and may be exposed to the outside.

[0037] The wire covering portion 44 is connected to the end of the component covering portion 42 from which the wires 30 extend, and covers the end of the wires 30. In this embodiment, the wire covering portion 44 includes a covering main body 46 and a drawer covering portion 48. The covering main body 46 extends linearly from the component covering portion 42. The drawer covering portion 48 is connected to the cover main body 46 on the opposite side of the component covering portion 42. The drawer covering portion 48 extends in an arc relative to the component covering portion 42. The end of the drawer covering portion 48 faces in a direction that forms an obtuse angle with respect to the covering main body 46.

[0038] The electric wire 30 extends linearly from the internal part 20 to partway through the covering body 46 and then bends in an arc partway through the covering body 46. For example, the bent portion 38a of the electric wire 30 is bent so as to form an angle of 90° or less, e.g., 80° or less. A portion of the bent portion 38a of the electric wire 30 is embedded in the covering body 46, and the remaining portion is embedded in the drawing-out covering portion 48. The portion of the electric wire 30 opposite the internal part 20 with respect to the bent portion 38a is a straight portion 38b that extends linearly and is embedded in the end portion of the drawing-out covering portion 48. The portion of the electric wire 30 from the point where it starts to bend within the wire covering portion 44 to the point where it is drawn out from the wire covering portion 44 is the bent drawing-out portion 38. In this embodiment, the bent drawing-out portion 38 includes the bent portion 38a and the straight portion 38b.

[0039] The bracket 50 has an enclosing portion 52 and a fixing portion 58. The bracket 50 is, for example, a resin portion molded by die molding with the outer resin molded portion 40 as an insert portion.

[0040] The surrounding portion 52 surrounds the wire covering portion 44 of the outer resin molded portion 40. In this embodiment, the surrounding portion 52 has a through hole 52h in which a portion of the wire covering portion 44 in the longitudinal direction can be disposed. More specifically, the surrounding portion 52 has a portion 52a having a U-shaped outer shape and a protrusion 52b protruding outward from one side of the U-shaped portion. The through hole 52h is formed as an elongated hole extending from the center of the portion 52a of the surrounding portion 52 to the protrusion 52b. The through hole 52h is semicircular on the portion 52a side of the surrounding portion 52 and rectangular on the protrusion 52b side. A portion of the wire covering portion 44 in the longitudinal direction is disposed within the through hole 52h. In other words, the surrounding portion 52 surrounds a portion of the outer periphery of the wire covering portion 44 in the longitudinal direction. The surrounding portion 52 has a surrounding protrusion 52p that protrudes from the opening edge of the through-hole 52h.

[0041] The portion of the drawer cover 48 opposite the sensor element 12 protrudes from the surface of the bracket 50 opposite the sensor element 12. The end of the drawer cover 48 opposite the sensor element 12 is formed as an end cover 49 that protrudes further outward from the protrusion 52b.

[0042] An extension tubular portion 53 extends from around the through hole 52h of the enclosure portion 52 toward the internal component 20. The extension tubular portion 53 is integrally connected to the enclosure portion 52 and surrounds the wire covering portion 44.

[0043] The enclosing portion 52 is positioned so as to surround at least a portion of the bent portion 38a of the bent draw-out portion 38 via the wire covering portion 44. In other words, in the longitudinal direction of the covering body 46, the range of the enclosing portion 52 and the range of the bent portion 38a overlap with each other.

[0044] The outer resin molded portion 40 is molded using the bracket 50 as an insert portion. Therefore, the inner peripheral surface of the through hole 52h of the bracket 50 is integrally joined to the outer peripheral surface of the bracket 50, and the bracket 50 is integrated with the outer resin molded portion 40.

[0045] The fixing portion 58 is connected to a part of the outer periphery of the enclosure 52 and extends outward from that part of the outer periphery of the enclosure 52. In this embodiment, the enclosure 52 and the fixing portion 58 are connected to form an oval plate shape. A through hole 58h for screw fixation is formed in the fixing portion 58. A screw is inserted into the through hole 58h and threaded into a screw hole in the fixing object, thereby screwing and fixing the sensor device 10 to the fixing object. The fixing structure of the fixing portion 58 to the fixing object is not limited to the above example. For example, the fixing portion 58 may be fitted and fixed to the fixing object.

[0046] The bracket 50 includes a receiving portion 54 having a receiving surface 54f. The receiving surface 54f is a surface that receives at least a part of the outer periphery of the bent lead-out portion 38 within the wire covering portion 44.

[0047] That is, suppose the electric wire runs straight through the outer resin molded portion. In this case, when the outer resin molded portion is molded, the electric wire can be positioned so that it is pulled straight from the internal component. This reduces the variation in the position of the electric wire within the outer resin molded portion, allowing the electric wire to be more reliably covered by the outer resin molded portion. On the other hand, as described in this embodiment, if the electric wire 30 is bent within the outer resin molded portion 40, it may be difficult to position the bent lead-out portion 38 in a consistent position within the outer resin molded portion 40 when molding the outer resin molded portion 40. Furthermore, resin pressure may cause the bent lead-out portion 38 to move within the mold. This may result in the position of the bent lead-out portion 38 varying within the outer resin molded portion 40, potentially exposing the bent lead-out portion 38 midway through the outer resin molded portion 40. In this case, the electric wire 30 would be exposed near the internal component 20.

[0048] Therefore, the receiving surface 54f receives at least a part of the outer periphery of the bent lead-out portion 38 when the outer resin molded portion 40 is molded using a die. The receiving surface 54f positions the bent lead-out portion 38 at a fixed position within the outer resin molded portion 40. This ensures that the end of the electric wire 30 near the sensor element 12 is covered by the outer resin molded portion 40 more reliably.

[0049] More specifically, the receiving portion 54 includes a partial cylindrical portion 55 and a partial protruding portion 56 .

[0050] The partial cylindrical portion 55 protrudes outward from a portion of the circumferential direction of the opening edge of the through hole 52h. In this embodiment, the base end of the partial cylindrical portion 55 is continuous with a rectangular portion (protrusion 52b) of the opening edge of the through hole 52h. The partial cylindrical portion 55 protrudes from the protrusion 52b in a direction away from the center of the through hole 52h. In this embodiment, the protruding direction of the fixing portion 58 and the protruding direction of the receiving portion 54 are perpendicular to each other when viewed along the central axis of the through hole 52h.

[0051] Furthermore, the partial cylindrical portion 55 extends in a direction oblique to the central axis of the through hole 52h. Here, the partial cylindrical portion 55 is inclined away from the sensor element 12 with respect to a direction perpendicular to the central axis of the through hole 52h. The extending direction of the central axis of the through hole 52h coincides with the longitudinal direction of the internal part 20 and also coincides with the longitudinal direction of the linear portion of the electric wire 30 that extends from the internal part 20 to the bent lead-out portion 38.

[0052] The inner circumferential surface of the partial cylindrical portion 55, i.e., the surface opposite to the sensor element 12, is formed as a receiving surface 54f having an arcuate cross section. The cross section is a cross section taken along a plane perpendicular to the longitudinal direction of the partial cylindrical portion 55. The radius of curvature of the receiving surface 54f is set to a size that matches the outer shape of the electric wire 30 extending from the sensor element 12, for example. For example, the radius of curvature of the receiving surface 54f is set to the same as the radius of the sheath 34. Like the longitudinal direction of the partial cylindrical portion 55, the longitudinal direction of the receiving surface 54f is inclined away from the sensor element 12 with respect to the central axis of the through hole 52h.

[0053] As a result, the receiving surface 54f of the partial cylindrical portion 55 is formed into a shape that contacts a portion of the circumferential direction of the bent lead-out portion 38. Here, since the receiving surface 54f is formed in an arc-shaped cross section, it can come into surface contact with a portion of the outer circumferential surface of the bent lead-out portion 38. The receiving surface 54f preferably has an arc-shaped cross section that is smaller than a semicircle. This allows the electric wire 30 to easily come into contact with the receiving surface 54f. The receiving surface 54f may have an arc-shaped U-shaped cross section.

[0054] It is not essential that the receiving surface 54f be formed in the above-described shape. The receiving surface may be formed as a flat surface. A plurality of protrusions may be formed at intervals along the circumferential direction of the bent drawn-out portion 38, and a receiving surface may be formed at the tip of each of the plurality of protrusions.

[0055] The bent lead-out portion 38 is bent toward the receiving portion 54 at the through hole 52h and at the portion where it exits the through hole 52h. Therefore, the receiving surface 54f can receive at least a portion of the bent lead-out portion 38 from the inner periphery of the bent lead-out portion 38. For example, with the electric wire 30 passed through the through hole 52h of the bracket 50, the portion of the electric wire 30 opposite the sensor element 12 is pushed toward the sensor element 12 or is bent and pulled. Then, the portion of the bent lead-out portion 38 exiting the through hole 52h is pushed toward the receiving surface 54f. As a result, the inner periphery of the bent lead-out portion 38 is pressed against the receiving surface 54f, and the bent lead-out portion 38 is stably positioned.

[0056] The contact point between the receiving surface 54f and the bent drawn-out portion 38 is located within the end cover portion 49. In this embodiment, of the contact surfaces between the receiving surface 54f and the bent drawn-out portion 38, both circumferential edges and the base end edge of the bent drawn-out portion 38 are located within the end cover portion 49. In other words, the receiving surface 54f of the receiving portion 54 contacts part of the outer periphery of the bent drawn-out portion 38 within the end cover portion 49. As a result, the part of the bent drawn-out portion 38 positioned by the receiving portion 54 is embedded, together with the receiving portion 54, within the end cover portion 49 of the draw-out portion 48. Near the receiving portion 54, part of the outer periphery of the bent drawn-out portion 38 is covered by the receiving portion 54, and the remaining part of the outer periphery of the bent drawn-out portion 38 is covered by the end cover portion 49.

[0057] The partial protrusion 56 partially protrudes from the outer peripheral surface of the partial cylindrical portion 55. The outer peripheral surface of the partial cylindrical portion 55, except for the partial protrusion 56, is formed by the end cover portion 4. to 9 The tip end surface of the partial cylindrical portion 55 is an exposed surface 56 f that is exposed from the end cover portion 49 of the outer resin molded portion 40 .

[0058] In this embodiment, a plurality of (three in this example) partial protrusions 56 are formed circumferentially on the outer peripheral surface of the partial cylindrical portion 55. Gaps are formed between the plurality of partial protrusions 56. The portions of the partial cylindrical portion 55 between the plurality of partial protrusions 56 are covered by the end cover portion 49 of the outer resin molded portion 40. The tip end surface of each of the plurality of partial protrusions 56 is exposed and continues continuously with the outer peripheral surface of the end cover portion 49.

[0059] An example of a process for molding the outer resin molded portion 40 will be described. As shown in FIG. 3, a mold 90 having a mold surface 92 corresponding to the outer shape of the outer resin molded portion 40 is prepared. The mold 90 is formed with a positioning surface 93 for positioning the bracket 50 and an electric wire positioning surface 94 for positioning the electric wires 30 while drawing them out. The mold 90 may also be formed with a positioning pin for positioning the internal component 20. The mold 90 is formed with a gate 95 for injecting molten resin into the mold 90. The gate 95 is formed, for example, so as to open at a position on the mold surface 92 that faces the receiving portion 54 relative to the bent drawing portion 38.

[0060] With the internal component 20, the wire 30, and the bracket 50 positioned within the mold surface 92, molten resin is injected into the mold 90 through the gate 95. The molten resin contacts the bent lead-out portion 38 of the wire 30 from the side opposite the receiving portion 54 and flows into the space within the mold surface 92. This presses the bent lead-out portion 38 toward the receiving portion 54, and the force is received by the receiving surface 54f. This keeps the bent lead-out portion 38 pressed against the receiving surface 54f. In other words, it is less likely that the bent lead-out portion 38 will move within the mold surface 92 and come into contact with the mold surface 92, and a gap between the bent lead-out portion 38 and the mold surface 92 is more reliably maintained. This ensures that the bent lead-out portion 38 is covered by the outer resin molding portion 40.

[0061] After the molten resin hardens within the mold surface 92, the sensor device 10 is demolded from the mold 90. A gate mark 59 is expected to be formed in a portion of the outer resin molded portion 40 of the demolded sensor device 10 that corresponds to the gate 95. The gate mark 59 is a separation mark from the hardened resin within the gate 95, and is expected to present unevenness as a cutting mark or a milling mark. The gate mark 59 is expected to be formed, for example, at a position on the outer surface of the outer resin molded portion 40 that faces the receiving surface 54f. In this case, at least a portion of the bent lead-out portion 38 is located between the gate mark 59 and the receiving surface 54f.

[0062] According to the sensor device 10 configured as described above, the electric wire 30 has the bent lead-out portion 38, and the bracket 50 has a receiving portion 54 having a receiving surface 54f that receives at least a part of the outer periphery of the bent lead-out portion 38 within the electric wire covering portion 44. Therefore, the electric wire covering portion 44 can be molded with a die in a state where at least a part of the outer periphery of the bent lead-out portion 38 is received by the receiving surface 54f. Therefore, the position of the bent lead-out portion 38 within the electric wire covering portion 44 is Stable , the bent lead-out portion 38 is more reliably covered by the outer resin molding portion 40. This allows the electric wire 30 to be covered by the outer resin molding portion 40 at a length suitable for waterproofing, ensuring the desired waterproofing. Since the outer resin molding portion does not need to be molded in multiple steps to ensure that the electric wire is covered reliably with resin, productivity is improved and costs can be reduced.

[0063] Furthermore, the receiving surface 54f comes into contact with a portion of the circumferential direction of the bent lead-out portion 38. When the bent lead-out portion is positioned by an annular receiving surface, the electric wire is passed through the annular receiving surface. Compared to such a case, the receiving surface 54f can be brought into contact with the bent lead-out portion 38 more easily.

[0064] Furthermore, at least a portion of the bent drawn portion 38 is located between the gate trace 59 and the receiving surface 54f. Therefore, when the resin pressure generated when injecting molten resin during molding of the outer resin molded portion 40 pushes against the bent drawn portion 38, the pushing force is effectively received by the receiving surface 54f. This further stabilizes the position of the bent drawn portion 38 within the outer resin molded portion 40. This ensures that the bent drawn portion 38 is covered by the outer resin molded portion 40 more reliably.

[0065] The receiving surface 54f receives at least a part of the bent lead-out portion 38 from the inner circumferential side of the bent lead-out portion 38. Therefore, it is easy to keep the electric wire 30 in a bent state in the mold 90 by pressing at least a part of the bent lead-out portion 38 against the receiving surface 54f. For example, by positioning the electric wire 30 at an outer position of the mold surface 92 by pulling it or pressing it toward the inner circumferential side, the electric wire 30 can be kept in a state pressed against the receiving surface 54f.

[0066] Furthermore, by injecting molten resin through a gate 95 formed on the outer periphery of the bent drawn-out portion 38 in the mold 90, the bent drawn-out portion 38 can be pressed against the receiving surface 54f.

[0067] Furthermore, the receiving portion 54 has an exposed surface 56f that is exposed from the outer resin molded portion 40. This allows the exposed surface 56f to be pressed against the mold surface 92 when the outer resin molded portion 40 is molded with a mold. Therefore, when the receiving portion 54 is in contact with the mold surface 92, the receiving surface 54f can receive the bent drawn portion 38, making the position of the bent drawn portion 38 more stable.

[0068] Furthermore, receiving portion 54 has a plurality of exposed surfaces 56f, and the portions of receiving portion 54 between the plurality of exposed surfaces 56f are covered by outer resin molded portion 40. Therefore, receiving portion 54 is difficult to separate from outer resin molded portion 40.

[0069] Furthermore, at least a portion of the bent portion 38a of the bent lead-out portion 38 is located within the enclosure 52. This makes it easier to increase the length of the bent portion 38a and the minimum bending radius. Even in this case, the position of the bent lead-out portion 38 within the wire covering portion 44 is stable.

[0070] In the above embodiment, the position of the receiving portion 54 is arbitrary. The receiving portion may contact the bent-out portion 38 on the outer periphery of the bent-out portion 38, or may contact the bent-out portion 38 from a direction perpendicular to the plane through which the bent-out portion 38 passes.

[0071] In addition, the receiving portion 54 part The receiving portion may not be exposed from the outer resin molded portion 40, and the entire receiving portion may be embedded within the outer resin molded portion.

[0072] The configurations described in the above embodiment and modifications can be combined as appropriate as long as they are not mutually contradictory. [Explanation of symbols]

[0073] 10 Sensor device 12 Sensor element 13 Element body 14 Lead section 20 Internal Parts 26 Internal holder part 30 Electric wire 30a core wire 30b Insulation coating 34 Sheath 38 Bent drawer 38a Bent part 38b Straight section 40 Outer resin molding part 42 Parts cover 44 Wire cover 46 Cover body 48 Drawer cover 49 End cover 50 bracket 52 Enclosure 52h through hole 52p Enclosure protrusion 53 Extension cylinder part 54 Receptacle 54f receiving surface 55 Partial cylinder part 56f Exposed surface 56 Partial protrusion 58 Fixed part 58h through hole 59 Gate Remains 90 Molds 92 Mold surface 93 Locating Surface 94 Wire positioning surface Gate 95

Claims

1. an internal component including a sensor element; an electric wire extending from the internal component; an outer resin molded portion including a component covering portion that covers at least a portion of the internal component and an electric wire covering portion that covers a portion of the electric wire extending from the internal component; a component having an enclosure that surrounds the wire covering portion; Equipped with the electric wire has a bent pull-out portion from a portion where the electric wire is bent in the electric wire covering portion to a portion where the electric wire is pulled out from the electric wire covering portion, The component includes a receiving portion having a receiving surface that receives at least a portion of the outer periphery of the bent lead-out portion within the wire covering portion.

2. The sensor device according to claim 1, The receiving surface is shaped to contact a part of the bent drawn-out portion in the circumferential direction.

3. The sensor device according to claim 1 or 2, the outer resin molding portion has a gate mark through which molten resin is injected, A sensor device, wherein at least a portion of the bent drawn-out portion is located between the gate mark and the receiving surface.

4. The sensor device according to any one of claims 1 to 3, The receiving surface receives at least a portion of the bent lead-out portion from an inner peripheral side of the bent lead-out portion.

5. The sensor device according to any one of claims 1 to 4, The receiving portion has an exposed surface exposed from the outer resin molded portion.

6. The sensor device according to claim 5, The receiving portion has a plurality of the exposed surfaces, A sensor device, wherein the portion of the receiving portion between the plurality of exposed surfaces is covered by the outer resin molded portion.

7. The sensor device according to any one of claims 1 to 6, At least a portion of the bent portion of the bent lead-out portion is located within the enclosure portion.

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