Wafer position coordinate conversion method and inspection device

Abstract

To provide a method for converting wafer position coordinates, which can mutually convert between wafer position coordinates and stage coordinate system position coordinates without using an aligner. [Solution] In an inspection unit equipped with a stage for placing a wafer, an inspection means for inspecting the wafer, and a linear sensor capable of detecting the outer periphery of the wafer placed on the stage, a method is provided in which a wafer with an orientation flat or a notch is placed on the stage, the outer periphery of the wafer is measured by the linear sensor while rotating the stage, position information of the outer periphery of the wafer in the stage coordinate system is obtained, and the position information of the outer periphery of the wafer in the stage coordinate system is used to convert position coordinates within the plane of the wafer in the wafer coordinate system into position coordinates within the plane of the stage in the stage coordinate system, or convert position coordinates within the plane of the stage in the stage coordinate system into position coordinates within the plane of the wafer in the wafer coordinate system.

Description

[Technical Field]

[0001] The present invention relates to a method for converting wafer position coordinates and an inspection apparatus. [Background technology]

[0002] In defect inspection and film thickness measurement of semiconductor wafers, it is important to know the exact position on the wafer to identify problems in the device process and improve yield.

[0003] Conventionally, alignment of a wafer to be inspected has been performed using an aligner (alignment device) provided separately from the inspection unit (Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-258061 Summary of the Invention [Problem to be solved by the invention]

[0005] Conventionally, wafer alignment in measurement and inspection equipment is performed using an aligner (alignment unit) installed separately from the inspection unit (measurement unit). However, problems exist in that it is not possible to precisely target specific wafer coordinates for measurement or inspection due to the effects of repeatable errors (random errors) in the transport device after alignment using the aligner, poor teaching, and misalignment over time (systematic errors). Furthermore, using an aligner requires space within the measurement or inspection equipment, increasing the equipment's footprint. Furthermore, the increased frequency of wafer contact can lead to wafer contamination problems. Furthermore, the need for aligner maintenance poses a problem from the perspective of equipment maintenance.

[0006] The present invention has been made to solve the above problems, and aims to provide a method for converting wafer position coordinates, which can convert the position coordinates of a wafer placed on a stage of an inspection unit into position coordinates within the plane of the stage in a stage coordinate system, or convert position coordinates within the plane of the stage in a stage coordinate system into position coordinates within the plane of a wafer placed on a stage of an inspection unit, simply and with high accuracy, without using an aligner in the inspection device, and an inspection device that can use this conversion method. [Means for solving the problem]

[0007] The present invention has been made to achieve the above object, and provides a method for converting position coordinates within a wafer surface to be inspected by a wafer inspection device, comprising: In an inspection unit that includes a stage for placing a wafer, an inspection means for inspecting the wafer placed on the stage, and a linear sensor that can detect the outer periphery of the wafer placed on the stage, the wafer having an orientation flat or a notch is placed on the stage, and the outer periphery of the wafer is measured by the linear sensor while rotating the stage, and the center of the stage is set to an origin O. s and acquiring position information of the outer periphery of the wafer in a stage coordinate system defined as Using the position information of the outer periphery of the wafer in the stage coordinate system, the center of the wafer is set to the origin O w or converting the position coordinates of the stage in the stage coordinate system into position coordinates of the stage in the stage coordinate system by using the center of the wafer as the origin O w The present invention provides a method for converting wafer position coordinates into position coordinates within the wafer surface in a wafer coordinate system where

[0008] This method of converting wafer position coordinates allows wafer position coordinates to be acquired in the inspection section, eliminating the need to equip inspection and measurement equipment with wafer aligners, allowing the size of the inspection and measurement equipment to be reduced, resulting in a reduction in the equipment's floor space. It also reduces the load on the FFU inside the equipment, which is expected to have a power-saving effect. Furthermore, it can reduce equipment maintenance costs. Furthermore, reducing wafer contact and transportation is expected to reduce wafer contamination. By reducing the need for mechanical wafer alignment, improved throughput can also be expected.

[0009] Furthermore, since alignment deviations are addressed through coordinate transformation, rough teaching is sufficient. Furthermore, transfer robot errors can be canceled. Since inspection and measurement equipment do not require a separate aligner for each wafer diameter, it is possible to accommodate different wafer diameters. Furthermore, by using the distance from the center of the stage rotation axis to the center of the linear sensor's detection range as a fitting variable, it is possible to obtain information on equipment abnormalities. Furthermore, by using the wafer radius as a fitting variable, wafer diameter can be measured with the use of a standard wafer, and relative value changes can be measured even without a standard wafer, making it possible to apply this to wafer diameter measurement. Rotating the stage around the θ axis allows the stage to move to the target point in a shorter time than using only the X and Y axes, thereby increasing the speed of stage movement. Furthermore, using the θ axis rotation of the stage halves the distance moved along the X and Y axes, allowing for the X and Y stages to be made more compact.

[0010] At this time, the stage coordinate system is set with the center of the stage as the origin O s and X s axis and Y s X axis specified s Y s Assuming a Cartesian coordinate system, The wafer coordinate system is defined by setting the center of the wafer as the origin O. w and X are orthogonal to each other in the plane of the wafer based on the orientation flat or notch portion. waxis and Y w X axis specified w Y w This can be a method of converting the position coordinates of the wafer into an orthogonal coordinate system.

[0011] This makes it possible to more easily perform conversion from the wafer coordinate system to the stage coordinate system and the inverse conversion (stage coordinate system → wafer coordinate system).

[0012] At this time, the wafer coordinate system is set to the origin O W is set to coincide with the center of the wafer, and the stage coordinate system is set by translating and rotating the stage coordinate system based on the orientation flat or the notch portion, using actual measurement data including position information of the outer periphery of the wafer in the stage coordinate system measured by the linear sensor and logical data defined based on the outer periphery shape of a virtual wafer not provided with an orientation flat or notch portion, generating difference data between the actual measurement data and the logical data, and acquiring, based on the difference data, the center coordinates of the wafer in the stage coordinate system and angle information θ0 of the deviation in the rotational direction at which the orientation flat or notch portion is located; Based on the center coordinate of the wafer in the stage coordinate system and the angle information θ of the deviation, the position coordinates within the plane of the wafer in the wafer coordinate system are converted into position coordinates within the plane of the stage in the stage coordinate system, or the position coordinates within the plane of the stage in the stage coordinate system are converted into position coordinates within the plane of the stage in the stage coordinate system by using the center of the wafer as the origin O. w The present invention can be a method for converting wafer position coordinates into position coordinates within the wafer surface in a wafer coordinate system where

[0013] This allows conversion of the wafer position coordinates from the wafer coordinate system to the stage coordinate system and the inverse conversion (stage coordinate system → wafer coordinate system) to be performed with higher accuracy.

[0014] In this case, the wafer inspection method can be such that the wafer is inspected based on the position coordinates within the surface of the stage in the stage coordinate system obtained by the above-described method for converting wafer position coordinates.

[0015] This type of wafer inspection method does not use an aligner device, so it is possible to suppress contamination of the wafer and is a low-cost inspection method.

[0016] In this case, the method can be a wafer inspection method for measuring the thickness of the wafer and / or the thickness of a thin film provided on the wafer, or inspecting the wafer and / or the thin film provided on the wafer for defects.

[0017] The wafer inspection method according to the present invention can be particularly suitably applied to such measurements or inspections.

[0018] At this time, the wafer inspection includes inspecting the wafer and / or a thin film provided on the wafer for defects; The wafer inspection method may include converting the position coordinates of the detected defects within the surface of the stage in the stage coordinate system into position coordinates within the surface of the wafer in the wafer coordinate system and outputting the converted position coordinates.

[0019] This allows for highly accurate wafer position coordinates to be provided when further inspections are performed.

[0020] The present invention also provides an inspection apparatus for inspecting a wafer based on position information of the wafer, comprising: an inspection unit including a stage for placing the wafer thereon, stage driving means for driving the stage, inspection means for inspecting the wafer placed on the stage, and a linear sensor capable of detecting the outer periphery of the wafer placed on the stage; and a control unit that controls the operation of the stage and the linear sensor to acquire position information of the outer periphery of the wafer, which has an orientation flat or a notch, while rotating the stage, converts, using the position information of the outer periphery of the wafer in a stage coordinate system, which has the center of the stage as its origin Os, position coordinates within the plane of the wafer in a wafer coordinate system, which has the center of the wafer as its origin Ow, into position coordinates within the plane of the stage in the stage coordinate system, and controls the inspection unit based on the converted position coordinates in the stage coordinate system to inspect the wafer.

[0021] Because this type of inspection equipment can acquire wafer position coordinates in the inspection section, it is no longer necessary to equip the inspection equipment and measurement equipment with wafer aligners, which allows for the size of the inspection equipment and measurement equipment to be reduced, thereby reducing the equipment's floor space. It also reduces the load on the FFU inside the equipment, which is expected to have a power saving effect. It also reduces equipment maintenance costs. Furthermore, by reducing wafer contact and transportation, it is possible to reduce wafer contamination. By reducing the need for mechanical wafer alignment, it is also expected that throughput will improve.

[0022] Furthermore, since alignment deviations are addressed through coordinate transformation, rough teaching is sufficient. Furthermore, errors in the transfer robot can be canceled. The inspection device of the present invention can accommodate different wafer diameters because it does not require an aligner for each wafer diameter. Furthermore, since the distance from the center of the stage rotation axis to the center of the linear sensor's detection range can be monitored, information on equipment abnormalities can be obtained. Furthermore, by using the wafer radius as a fitting variable, the wafer diameter can be measured with the use of a standard wafer, and relative value changes can be measured even without a standard wafer, making it applicable to wafer diameter measurement. The stage's θ-axis rotation allows the stage to move to the target point in a shorter time than using only the X and Y axes, thereby increasing the speed of stage movement. Furthermore, using the θ-axis rotation of the stage reduces the distance moved in the X and Y axes by half, allowing the X and Y stages to be made more compact.

[0023] At this time, the stage coordinate system has the center of the stage as the origin O s and X s axis and Y s X axis specified s Y s It is a Cartesian coordinate system, The wafer coordinate system has the center of the wafer as the origin O w and X are orthogonal to each other in the plane of the wafer based on the orientation flat or notch portion. w axis and Y w X axis specified w Y w The inspection device may be an orthogonal coordinate system.

[0024] This makes it possible to more easily convert coordinates.

[0025] At this time, the wafer coordinate system has the origin O Wis a coordinate system set by translating and rotating the stage coordinate system with the orientation flat or notch portion as a reference so that the center of the wafer coincides with the center of the wafer, The control unit generating difference data between the actual measurement data and the logical data using actual measurement data including position information of the outer periphery of the wafer measured by the linear sensor and logical data defined based on the outer periphery shape of a virtual wafer not provided with an orientation flat or a notch; Based on the difference data, the center coordinates of the wafer in the stage coordinate system and angle information θ0 of the rotational deviation at which the orientation flat or notch portion is located are acquired; The inspection device can be one that is capable of converting position coordinates within the plane of the wafer in the wafer coordinate system into position coordinates within the plane of the stage in the stage coordinate system, or capable of converting position coordinates within the plane of the stage in the stage coordinate system into position coordinates within the plane of the wafer in the wafer coordinate system, based on the center coordinates of the wafer in the stage coordinate system and the deviation angle information θ0.

[0026] This makes it possible to perform conversion of wafer position coordinates from the wafer coordinate system to the stage coordinate system and the inverse conversion (stage coordinate system → wafer coordinate system) with higher accuracy.

[0027] In this case, the control unit can be an inspection device that is capable of controlling the inspection means to inspect the wafer based on the in-plane position coordinates of the wafer in the wafer coordinate system and the in-plane position coordinates of the stage in the converted stage coordinate system.

[0028] This makes it possible to inspect and measure wafers more easily and with higher accuracy.

[0029] In this case, the inspection means can be an inspection device that measures the thickness of the wafer and / or the thickness of a thin film provided on the wafer, or that can measure defects in the wafer and / or the thin film provided on the wafer.

[0030] As a result, the wafer inspection device according to the present invention can be particularly suitably applied to such inspections.

[0031] At this time, the inspection means inspects the wafer and / or a thin film provided on the wafer for defects, The control unit can be an inspection device that is capable of converting the position coordinates of the detected defects within the surface of the stage in the stage coordinate system into position coordinates within the surface of the wafer in the wafer coordinate system and outputting them.

[0032] This makes it possible to provide highly accurate position coordinates of defects on the wafer when further inspection is performed. [Effects of the Invention]

[0033] As described above, according to the wafer position coordinate conversion method of the present invention, wafer position coordinates can be acquired in the inspection unit, eliminating the need to equip the inspection and measurement equipment with wafer aligners, allowing the size of the inspection and measurement equipment to be reduced and the floor area of ​​the equipment to be reduced. It also reduces the load on the FFU inside the equipment, which is expected to have a power reduction effect. Furthermore, it is possible to reduce equipment maintenance costs. Furthermore, by reducing contact with and transport of wafers, it is expected that wafer contamination will be reduced. By reducing the need for mechanical alignment of wafers, it is also expected that throughput will be improved.

[0034] Furthermore, since alignment deviations are addressed through coordinate transformation, rough teaching is sufficient. Furthermore, it can cancel out errors in the transfer robot. Since inspection and measurement equipment do not require a separate aligner for each wafer diameter, it can accommodate different wafer diameters. Furthermore, since the distance from the center of the stage rotation axis to the center of the linear sensor's detection range can be monitored, information on equipment abnormalities can be obtained. Furthermore, by using the wafer radius as a fitting variable, wafer diameter can be measured with the use of a standard wafer. Even without a standard wafer, relative value changes can be measured, making it possible to apply this technology to wafer diameter measurement. The stage's θ-axis rotation allows the stage to move to the target point in a shorter time than using only the X and Y axes, thereby increasing the speed of stage movement. Furthermore, using the θ-axis rotation of the stage halves the distance traveled by the X and Y axes, allowing for a more compact XY stage.

[0035] Furthermore, the inspection device of the present invention makes it possible to implement the above-mentioned method for converting wafer position coordinates. That is, since wafer position coordinates can be acquired in the inspection unit, there is no need to equip the inspection device or measurement device with a wafer aligner, which allows the size of the inspection device or measurement device to be reduced and the floor area of ​​the device to be reduced. In addition, the load on the FFU inside the device can be reduced, which is expected to have a power reduction effect. Furthermore, the maintenance cost of the device can be reduced. Furthermore, by reducing contact with and transportation of the wafer, wafer contamination can be reduced. By reducing the mechanical alignment of the wafer, improvement in throughput can also be expected.

[0036] Furthermore, since alignment deviations are addressed through coordinate transformation, rough teaching is sufficient. Furthermore, errors in the transfer robot can be canceled. The inspection system of the present invention can accommodate different wafer diameters because it does not require an aligner for each wafer diameter. Furthermore, since the distance from the center of the stage rotation axis to the center of the linear sensor's detection range can be monitored, information on equipment abnormalities can be obtained. Furthermore, by using the wafer radius as a fitting variable, relative value changes can be measured even without a standard wafer, making it applicable to wafer diameter measurement. Rotating the stage around the θ axis allows the stage to move to the target point in a shorter time than using only the X and Y axes, thereby increasing stage movement speed. Furthermore, using the θ axis rotation of the stage reduces the distance moved along the X and Y axes by half, allowing the X and Y stages to be made more compact. [Brief explanation of the drawings]

[0037] [Figure 1] 1 is a diagram showing an inspection device according to the present invention. [Figure 2] 1 shows the relationship between the stage coordinate system and the wafer coordinate system. (A) shows the transformation from the wafer coordinate system to the stage coordinate system, and (B) shows the transformation from the stage coordinate system to the wafer coordinate system. [Figure 3] 1 shows the relationship between the stage coordinate system and the wafer coordinate system when the wafer is placed on the stage. [Figure 4] 10 is a diagram for explaining acquisition of actual wafer periphery data. [Figure 5] This is an algorithm that uses Ds (the distance from the center of the stage rotation axis to the center of the detection range of the linear sensor) as a fitting variable to find the conversion coefficients x0, y0, and θ0 when converting the position coordinates within the wafer surface in the wafer coordinate system into the position coordinates within the stage surface in the stage coordinate system. [Figure 6]The graph shows the actual measurement data for a 150 mm diameter wafer with an orientation flat, the fitting process, and the calculated position of the wafer on the stage when Ds is used as the fitting variable. [Figure 7] For a 200 mm diameter wafer with a notch, the graph shows the actual measurement data for coordinate transformation when Ds is used as the fitting variable, the fitting process, and the calculated position of the wafer on the stage. [Figure 8] This is an algorithm that uses Rw (radius of the wafer) as a fitting variable to find the conversion coefficients x0, y0, and θ0 when converting the position coordinates within the wafer surface in the wafer coordinate system into the position coordinates within the stage surface in the stage coordinate system. [Figure 9] The graph shows the actual measurement data for a 150 mm diameter wafer with an orientation flat, the fitting process, and the calculated position of the wafer on the stage when Rw is used as the fitting variable. [Figure 10] For a 200 mm diameter wafer with a notch, the graph shows the actual measurement data for coordinate transformation when Rw is used as a fitting variable, the fitting process, and the calculated position of the wafer on the stage. [Figure 11] 1 is a diagram illustrating an application to line scan measurement. DETAILED DESCRIPTION OF THE INVENTION

[0038] The present invention will be described in detail below, but the present invention is not limited thereto.

[0039] As described above, there has been a demand for a method for converting wafer position coordinates that can convert the position coordinates of a wafer placed on a stage of an inspection unit into position coordinates within the surface of the stage in a stage coordinate system simply and with high precision without using an aligner in a measurement device or inspection device, and an inspection device that can implement this conversion method.

[0040] As a result of extensive research into the above-mentioned problems, the present inventors have discovered a method for converting position coordinates within a wafer surface to be inspected by a wafer inspection device, which method comprises: In an inspection unit that includes a stage for placing a wafer, an inspection means for inspecting the wafer placed on the stage, and a linear sensor that can detect the outer periphery of the wafer placed on the stage, the wafer having an orientation flat or a notch is placed on the stage, and the outer periphery of the wafer is measured by the linear sensor while rotating the stage, and the center of the stage is set to an origin O. s and acquiring position information of the outer periphery of the wafer in a stage coordinate system defined as Using the position information of the outer periphery of the wafer in the stage coordinate system, the center of the wafer is set to the origin O w or converting the position coordinates of the stage in the stage coordinate system into position coordinates of the stage in the stage coordinate system by using the center of the wafer as the origin O w The inventors have found that by using a method for converting wafer position coordinates into position coordinates within the wafer plane in a wafer coordinate system as defined above, it is possible to obtain wafer position coordinates in the inspection unit, thereby eliminating the need to equip the inspection equipment and measurement equipment with wafer aligners, thereby enabling the size of the inspection equipment and measurement equipment to be reduced and the floor area of ​​the equipment to be reduced, the load on the FFU inside the equipment to be reduced and power consumption reduction effects can be expected, equipment maintenance costs can be reduced, wafer contamination can be reduced by reducing contact with and transportation of the wafer, and throughput can be expected to be improved by reducing mechanical alignment of the wafer, and have completed the present invention.

[0041] The method for converting wafer in-plane position coordinates of the present invention addresses alignment errors through coordinate transformation, necessitating rough teaching. Furthermore, it can cancel transfer robot errors. Since inspection and measurement equipment do not require separate aligners for each wafer diameter, it can accommodate different wafer diameters. Furthermore, the distance from the center of the stage rotation axis to the center of the linear sensor's detection range can be monitored, providing information on equipment abnormalities. Furthermore, by using the wafer radius as a fitting variable, wafer diameter can be measured with the use of a standard wafer, and relative value changes can be measured even without a standard wafer. This method can also be applied to wafer diameter measurement, where the stage's θ-axis rotation allows the stage to move to the target point in a shorter time than using only the X and Y axes, thereby increasing stage movement speed. Furthermore, using the θ-axis rotation of the stage reduces the distance traveled by the X and Y axes by half, allowing for a more compact XY stage.

[0042] The present inventors have also discovered an inspection apparatus for inspecting a wafer based on position information of the wafer, comprising: an inspection unit including a stage for placing the wafer thereon, stage driving means for driving the stage, inspection means for inspecting the wafer placed on the stage, and a linear sensor capable of detecting the outer periphery of the wafer placed on the stage; The operation of the stage and the linear sensor are controlled to acquire position information of the outer periphery of the wafer having an orientation flat or notch while rotating the stage, and the center of the stage is set to the origin O. s The center of the wafer is set as the origin O using the position information of the outer periphery of the wafer in the stage coordinate system. wand a control unit capable of converting position coordinates within the plane of the wafer in a wafer coordinate system defined as a wafer coordinate system into position coordinates within the plane of the stage in the stage coordinate system, and controlling the inspection unit based on the converted position coordinates in the stage coordinate system to inspect the wafer, thereby enabling the inspection unit to acquire the position coordinates of the wafer. This makes it possible to eliminate the need to equip the inspection unit with a wafer aligner, thereby reducing the size of the inspection unit and the floor area of ​​the unit. It has been found that this also reduces the load on the FFU within the unit and is expected to have a power reduction effect. It has also been found that this also reduces the maintenance costs of the unit. It is expected that wafer contamination will be reduced by reducing contact with and transportation of the wafer, and that improved throughput will also be expected by reducing mechanical alignment of the wafer.

[0043] The inspection system of the present invention also addresses alignment errors through coordinate transformation, making rough teaching sufficient. Furthermore, it can cancel errors in the transfer robot. The inspection system of the present invention can accommodate different wafer diameters because it does not require an aligner for each wafer diameter. Furthermore, it can monitor the distance from the center of the stage rotation axis to the center of the linear sensor's detection range, providing information on equipment abnormalities. Furthermore, by using the wafer radius as a fitting variable, the wafer diameter can be measured with the use of a standard wafer. Even without a standard wafer, the relative change can be measured, making it applicable to wafer diameter measurement. The stage's θ-axis rotation allows the stage to move to the target point in a shorter time than using only the X and Y axes, thereby increasing the speed of stage movement. Furthermore, using the θ-axis rotation of the stage reduces the distance traveled by the X and Y axes by half, allowing for a more compact XY stage.

[0044] The following description will be made with reference to the drawings.

[0045] [Inspection equipment] Figure 1 shows an inspection device according to the present invention. Figures 2(A) and 2(B) show the relationship between the stage coordinate system and the wafer coordinate system. Figure 3 shows the relationship between the stage coordinate system and the wafer coordinate system when a wafer is placed on the stage.

[0046] The inspection apparatus according to the present invention is an inspection apparatus that inspects a wafer based on position information of the wafer. As shown in FIG. 1, the inspection apparatus 100 according to the present invention includes an inspection unit 10 and a control unit 20.

[0047] (Inspection Department) The inspection section 10 includes a stage 1 for placing a wafer W thereon, a stage driving means 2 for driving the stage 1, an inspection means 3 for inspecting the wafer W placed on the stage 1, and a linear sensor 4 capable of detecting the outer periphery of the wafer W placed on the stage 1.

[0048] The inspection means 3 is not particularly limited, and may be any means for inspecting and measuring the wafer W. In particular, the inspection means 3 is preferably one that measures the thickness of the wafer W and / or the thickness of a thin film provided on the wafer W, or one that can measure defects in the wafer W and / or a thin film provided on the wafer W. The wafer inspection device according to the present invention is particularly suitable for use in such inspection and measurement.

[0049] (Control unit) The control unit 20 controls the operation of the stage 1 and the linear sensor 4 to acquire position information of the outer periphery of the wafer W having an orientation flat or notch while rotating the stage 1, and aligns the center of the stage 1 with the origin O. s Using the position information of the outer periphery of the wafer W in the stage coordinate system, the center of the wafer W is set as the origin O w The position coordinate (x w ,y w ) is the position coordinate (x S ,y S), and controls the inspection unit 10 based on the position coordinates in the converted stage coordinate system to inspect the wafer W. Also, the inspection device can be controlled to perform a method for converting wafer position coordinates and a method for inspecting a wafer, which will be described later.

[0050] Since the inspection device according to the present invention can acquire the position coordinates of the wafer in the inspection unit, it is not necessary to equip the inspection device with a wafer aligner, which allows the size of the inspection device to be reduced and the floor area of ​​the device to be reduced. It also reduces the load on the FFU inside the device, which is expected to have a power saving effect. Furthermore, it is possible to reduce the maintenance cost of the device. Furthermore, by reducing contact with and transportation of the wafer, it is possible to reduce wafer contamination. By reducing the mechanical alignment of the wafer, it is also expected that throughput will be improved.

[0051] Furthermore, since alignment deviations are addressed through coordinate transformation, rough teaching is sufficient. Furthermore, errors in the transfer robot can be canceled. The inspection device of the present invention can accommodate different wafer diameters because it does not require an aligner for each wafer diameter. Furthermore, since the distance from the center of the stage rotation axis to the center of the linear sensor's detection range can be monitored, information on equipment abnormalities can be obtained. Furthermore, by using the wafer radius as a fitting variable, the wafer diameter can be measured with the use of a standard wafer, and relative value changes can be measured even without a standard wafer, making it applicable to wafer diameter measurement. The stage's θ-axis rotation allows the stage to move to the target point in a shorter time than using only the X and Y axes, thereby increasing the speed of stage movement. Furthermore, using the θ-axis rotation of the stage reduces the distance moved in the X and Y axes by half, allowing the X and Y stages to be made more compact.

[0052] The types of the stage coordinate system and the wafer coordinate system are not particularly limited. Any known coordinate system, such as a Cartesian coordinate system or a polar coordinate system, can be used. The stage coordinate system has the center (rotation axis) of the stage 1 as the origin O, as shown in FIGS. 2(A) and 2(B), for example. s and X s axis and Y s X axis specified s Y s It is preferable to use an orthogonal coordinate system. The wafer coordinate system has the center of the wafer W as the origin O, as shown in FIGS. w The X axes are orthogonal to each other within the plane of the wafer W, with the orientation flat or notch as the reference. w axis and Y w X axis specified w Y w A rectangular coordinate system is preferable, as the adoption of such a coordinate system allows coordinate conversion to be performed more easily and with higher accuracy.

[0053] Furthermore, the wafer coordinate system has an origin O as shown in Figure 2(B). W The control unit 20 uses actual measurement data including position information of the outer periphery of the wafer W measured by the linear sensor 4 and logical data defined based on the outer periphery shape of a virtual wafer not provided with an orientation flat or notch to generate differential data between the actual measurement data and the logical data, and obtains, based on the differential data, the center coordinates of the wafer W in the stage coordinate system and angular information θ0 of the deviation in the rotation direction at which the orientation flat or notch is located, and calculates the position coordinates (x w ,y w ) is expressed as the position coordinate (x S ,y S) The control unit of the inspection apparatus according to the present invention can also be capable of converting position coordinates within the stage plane in the stage coordinate system into position coordinates within the wafer plane in the wafer coordinate system. This results in an inspection apparatus that can convert wafer position coordinates from the wafer coordinate system to the stage coordinate system and / or the reverse conversion (stage coordinate system → wafer coordinate system) with higher accuracy.

[0054] The control unit 20 calculates the position coordinates (x w ,y w ) is converted to the position coordinate (x S ,y S ) based on the above-described information, the inspection device 100 can control the inspection unit 10 to inspect the wafer W. The inspection device 100 equipped with such a control unit 20 can inspect the wafer more easily and with higher accuracy.

[0055] Furthermore, when the inspection means 3 inspects the wafer W and / or a thin film provided on the wafer W for defects, the control unit 20 can convert the position coordinates of the detected defects within the plane of the stage 1 in the stage coordinate system into position coordinates within the plane of the wafer W in the wafer coordinate system and output them. When the defects in the thin film inspected by the inspection device 100 according to the present invention are subjected to other inspections such as SEM or TEM, highly accurate defect position coordinates can be provided.

[0056] Furthermore, the control unit 20 of the inspection apparatus 100 according to the present invention is capable of implementing a method for converting wafer position coordinates as will be described later. All of the matters described in the method for converting wafer position coordinates as will be described later can be controlled by the control unit 20 of the inspection apparatus 100 according to the present invention.

[0057] [Wafer position coordinate conversion method] Next, a method for converting wafer position coordinates according to the present invention will be described. It goes without saying that the matters explained about the inspection apparatus above can be applied to the method for converting wafer position coordinates according to the present invention.

[0058] The method for converting wafer position coordinates according to the present invention is carried out in an inspection unit 10 that includes a stage 1 for placing a wafer W thereon, an inspection means 3 for inspecting the wafer W placed on the stage 1, and a linear sensor 4 that can detect the outer periphery of the wafer W placed on the stage 1. First, a wafer W with an orientation flat or a notch is placed on the stage 1, and the outer periphery of the wafer W is measured by the linear sensor 4 while rotating the stage 1, and the center of the stage 1 is set to the origin O. s The position information of the outer periphery of the wafer W in the stage coordinate system is acquired.

[0059] Then, using the position information of the outer periphery of the wafer W in the stage coordinate system, the center of the wafer W is set to the origin O w The position coordinate (x w ,y w ) is the position coordinate (x S ,y S ) or the position coordinates (x S ,y S ) and the center of the wafer W is the origin O w The position coordinate (x w ,y w In other words, the method for converting the position coordinates of the wafer according to the present invention converts the center of the wafer to the origin O using the position information of the outer periphery of the wafer in the stage coordinate system. w This is a method for converting wafer position coordinates that can mutually convert between position coordinates within the wafer surface in a wafer coordinate system and position coordinates within the stage surface in a stage coordinate system.

[0060] According to the wafer position coordinate conversion method of the present invention, the position coordinates of the wafer W can be acquired in the inspection unit 10, eliminating the need to equip the inspection device (measuring device) with a wafer aligner, allowing the size of the inspection device to be reduced and the floor area of ​​the device to be reduced. Also, the load on the FFU inside the device can be reduced, which is expected to have a power reduction effect. Furthermore, the maintenance cost of the device can be reduced. Furthermore, wafer contamination can be reduced by reducing contact with and transportation of the wafer. By reducing the mechanical alignment of the wafer, improved throughput can also be expected.

[0061] Furthermore, since alignment deviations are addressed through coordinate transformation, rough teaching is sufficient. Furthermore, it can cancel out errors in the transfer robot. Since inspection and measurement equipment do not require a separate aligner for each wafer diameter, it can accommodate different wafer diameters. Furthermore, since the distance from the center of the stage rotation axis to the center of the linear sensor's detection range can be monitored, information on equipment abnormalities can be obtained. Furthermore, by using the wafer radius as a fitting variable, relative value changes can be measured even without a standard wafer, making it applicable to wafer diameter measurement. Rotating the stage around the θ axis allows the stage to move to the target point in a shorter time than using only the X and Y axes, thereby increasing the speed of stage movement. Furthermore, using the θ axis rotation of the stage halves the distance moved along the X and Y axes, allowing for the X and Y stages to be made more compact.

[0062] The types of the stage coordinate system and the wafer coordinate system are not particularly limited. Any known coordinate system, such as a Cartesian coordinate system or a polar coordinate system, can be used. The stage coordinate system has the center of the stage 1 as the origin O, as shown in FIGS. 2(A) and 2(B), for example. s and X are perpendicular to each other on the wafer placement surface of stage 1. s axis and Y s X axis specified s Y s The wafer coordinate system can be an orthogonal coordinate system. For example, as shown in FIG. 2, the wafer coordinate system has the center of the wafer W as the origin O.w The X axes are orthogonal to each other within the plane of the wafer W, with the orientation flat or notch as the reference. w axis and Y w X axis specified w Y w The coordinate system can be an orthogonal coordinate system. By adopting such a coordinate system, coordinate conversion can be performed more easily.

[0063] Furthermore, it is more preferable to use a coordinate system as shown in Figures 2(A) and 2(B). w Y w Cartesian coordinate system) at the origin O W is assumed to coincide with the center of the wafer, and as shown in Figure 2(B), the stage coordinate system (X s Y s Cartesian coordinate system) is translated (X' w Y' w Cartesian coordinate system) and the coordinate system set by rotating and moving (X w Y w It is preferable to use a rectangular coordinate system.

[0064] Then, using actual measurement data including position information of the outer periphery of the wafer W in the stage coordinate system measured by the linear sensor 4 and logical data defined based on the outer periphery shape of a virtual wafer not provided with an orientation flat or notch, difference data between the actual measurement data and the logical data is generated, and based on the difference data, the center coordinate of the wafer W in the stage coordinate system and angular information θ0 of the deviation in the rotation direction where the orientation flat or notch is located are obtained, and based on the center coordinate of the wafer W in the stage coordinate system and the angular information θ0 of the deviation, the in-plane position coordinate (x W ,y W ) is expressed as the position coordinate (x S ,y S ) This allows the wafer position coordinates to be converted with higher accuracy.

[0065] The present invention will be described below based on more specific embodiments, but the present invention is not limited thereto.

[0066] Here, as shown in Figure 3, the stage coordinate system is set with the center of stage 1 (rotation axis point) as the origin O s and X s axis and Y s X axis specified s Y s The wafer coordinate system is set as an orthogonal coordinate system. The center of the wafer W is the origin O. w The X axes are orthogonal to each other within the plane of the wafer W, with the orientation flat or notch as the reference. w axis and Y w X axis specified w Y w The center of the wafer W is assumed to be at the coordinate (x0, y0) in the stage coordinate system. w Y w The Cartesian coordinate system is defined as the Y coordinate system of the wafer, as shown in Figure 3. w The notch of the wafer is used as the reference, assuming that it is located in the negative region of the Y axis. w The reference may be anywhere relative to the axis.

[0067] In other words, as shown in Figure 2(B), the stage coordinate system (X s Y s A coordinate system (X') is created by translating the rectangular coordinate system (X') with an offset of (x0, y0). w Y' w ) is further rotated by a deviation angle θ0 to set the coordinate system as the wafer coordinate system. Alternatively, as shown in FIG. 2(A), the wafer coordinate system (X w Y w The coordinate system (X') is a rectangular coordinate system rotated by an angle of θ0. w , Y' w ) is translated by an offset of (x0, y0) to form the stage coordinate system (X s Y s Cartesian coordinate system).

[0068] In this way, the stage coordinate system (X s Y s Cartesian coordinate system) and wafer coordinate system (X w Y w Cartesian coordinate system), the stage coordinate system (X s Y s Position coordinates (x s ,y s ) and wafer coordinate system (X w Y w Position coordinates (x w ,y w ) the position coordinate conversion between is as follows:

[0069] Stage coordinate system (X s Y s Position coordinates (x s ,y s ) to the wafer coordinate system (X w Y w Position coordinates (x w ,y w ) to: x w =(x s -x0)×cosθ0+(y s -y0)×sinθ0 y w =-(x s -x0)×sinθ0+(y s -y0)×cosθ0

[0070] Wafer coordinate system (X w Y w Position coordinates (x w ,y w ) to the stage coordinate system (X s Y s Position coordinates (x s ,y s ) to: x S =x W ×cosθ0-y W ×sinθ0+x0 y S =x W ×sinθ0+y W ×cosθ0+y0

[0071] (Actual measurement data) As shown in FIG. 4, the outer periphery of the wafer W is measured by the linear sensor 4 while rotating the stage 1, and the center of the stage 1 is set as the origin O. s The stage coordinate system (X s Y s Position information of the outer periphery of the wafer W in a Cartesian coordinate system is acquired. At this time, the number of measurements (acquisitions) is not particularly limited. The more measurement points there are, the higher the positional accuracy becomes, but it takes more time. The number of measurement points is preferably, for example, 360 or more per circumference of the wafer, and the number of measurement points can also be 720.

[0072] FIG. 4 shows the case where the wafer W is placed on the stage 1 with the center of the stage 1 and the center of the wafer W misaligned. The stage coordinate system (X s Y s 1 is a diagram for explaining acquisition of position information of the outer periphery of a wafer W in a Cartesian coordinate system.

[0073] The measurement value (reading value) of the linear sensor 4 is represented by Vs. Here, Rw is the radius of the wafer W, and Ds is the distance from the center of the stage rotation axis to the center of the detection range of the linear sensor. When the measurement value (reading value) of the linear sensor 4 is Vs(θ) when the stage 1 carrying the wafer W rotates by θ (counterclockwise), the position of the outer periphery of the wafer W where the linear sensor 4 reads the value is expressed as Vs(θ) in the stage coordinate system (X s Y s Coordinates (x s ,y s )teeth, x s =(Ds+Vs(θ))×cos(θ) y s =(Ds+Vs(θ))×sin(θ) This becomes:

[0074] The stage coordinate system (X s Y sWhen the coordinates in the Cartesian coordinate system are (x0, y0), the periphery of the wafer W is a circle with a radius Rw, as follows: (xs-x0) 2 +(ys-y0) 2 =Rw 2 It is expressed as:

[0075] First, the outer periphery of the wafer W is measured using the linear sensor 4 while rotating the stage 1, and the center of the stage 1 is set as the origin O. s The position information of the outer periphery of the wafer W in the stage coordinate system is acquired.

[0076] The reading of the linear sensor 4 is expressed as Vs(θ). When the stage is rotated and the stage coordinate system rotates by θ, the coordinate (x s ,y s ) is expressed as follows using the readings Vs and Ds of the linear sensor 4 and the rotation angle θ: x s =(Ds+Vs(θ))×cos(θ) y s =(Ds+Vs(θ))×sin(θ) In this way, the stage coordinate system (X s Y s It is possible to obtain actual measurement data including position information of the outer periphery of the wafer W in a Cartesian coordinate system.

[0077] (logical data) Also, logical data is prepared based on the peripheral shape of a virtual wafer that does not have an orientation flat or a notch. The logical data is defined as follows: (x0, y0): Offset to the center of the virtual wafer as seen from the center of the stage rotation axis Ds: Distance from the center of the stage rotation axis to the center of the linear sensor detection range. The data used is as follows.

[0078] Using these (x0, y0), Ds and wafer radius Rw, the logical formula is (x s -x0) 2 +(y s -y0) 2 =Rw 2 x s =(Ds+Vs(θ))×cos(θ) y s =(Ds+Vs(θ))×sin(θ) Either Ds or Rw can be used as a fitting variable. Note that logical data for other peripheral shapes such as ellipses, rectangles, and other shapes can also be used.

[0079] (Differential data) Based on the above actual measurement data and logical data, difference data between the actual measurement data and the logical data is generated, and based on this difference data, the center coordinate of the wafer in the stage coordinate system and angular information θ0 of the deviation in the rotational direction at which the orientation flat or notch is located are obtained. Then, based on the center coordinate of the wafer in the stage coordinate system and the angular information θ0 of the deviation, position coordinates within the wafer plane in the wafer coordinate system can be converted into position coordinates within the stage plane in the stage coordinate system.

[0080] More specifically, this can be done, for example, using the flow shown in Figure 5. Step (A) in Figure 5 can be done, for example, using sine regression. First, Ds is set to an appropriate initial value. Next, an approximate value for the center position (x0, y0) is calculated from the measured data. Next, logical data is generated. Then, differential data between the measured data and the logical data is generated. Next, the approximate area of ​​the orientation flat or notch is found from the differential data and excluded from subsequent fitting.

[0081] Next, step (B) in Figure 5 is performed. Step (B) in Figure 5 can be performed using, for example, the Gauss-Newton method. First, fitting is performed using x0, y0, and Ds obtained in (A). Next, logical data is generated from the fitting results x0, y0, and Ds, and then differential data is generated. The next fitting is performed by excluding any parts determined to be orientation flat / notch based on the differential data. Then, an error value is calculated and evaluated. For example, if the error value has worsened from the previous time or no further improvement is required, the process ends; if the error value has improved, the result is adopted and the loop continues.

[0082] Figures 6 and 7 show the process and results of actual coordinate transformation. Figure 6 shows the results of coordinate transformation for a 150 mm diameter wafer with an orientation flat, and Figure 7 shows the results for a 200 mm diameter wafer with a notch. In both Figures 6 and 7, (A) shows actual measurement data with the horizontal axis representing the rotation angle at sampling and the vertical axis representing the output value of the linear sensor. Figures 6 and 7 (B) show logical data with the horizontal axis representing the rotation angle θ at sampling and the vertical axis representing Vs. Figures 6 and 7 (C) show data plotted with the horizontal axis representing the rotation angle θ at sampling and the vertical axis representing the difference between the actual measurement data and the logical data. Note that for the rotation angle θ at sampling, the reverse rotation direction is considered positive. Figures 6 and 7 (D) show data plotted with the horizontal axis representing the rotation angle θ and the vertical axis representing the stage coordinate system (X s Y s X in Cartesian coordinate system s In (E) of Figures 6 and 7, the horizontal axis is the rotation angle θ, and the vertical axis is the stage coordinate system (X s Y s Y in Cartesian coordinate system s The data in Figures 6 and 7 (F) are plotted as the position of the stage coordinate system (X s Y s 6 and 7(G) are diagrams showing the state in which the outer periphery of the wafer W is superimposed on the rectangular coordinate system (orthogonal coordinate system), i.e., the state in which the wafer W is actually placed on the stage 1. Also, (G) of FIGS. 6 and 7 is a diagram showing the convergence of the fitting variables.

[0083] First, when the wafer W placed on the stage 1 is measured with a linear sensor, the actual measurement values ​​shown in Figures 6 and 7(A) can be obtained. As shown in Figures 6 and 7(A), the parts that deviate from the long-period curves are parts caused by orientation flats and notches.

[0084] Next, when the logical data is created as described above, the data shown in Figures 6 and 7(B) can be obtained. Since the virtual wafer used in the logical data does not have an orientation flat or a notch, the profile caused by the orientation flat or the notch as shown in Figures 6 and 7(A) is not observed.

[0085] By creating the difference data between the measured data and the theoretical data from the data in Figures 6, 7(A) and (B), we can obtain the data shown in Figures 6, 7(C). Figures 6, 7(C) show the angle at which the orientation flat and notch positions are misaligned.

[0086] Using Figures 6, 7(D), and (E), the position of the wafer on the stage can be plotted as shown in Figures 6 and 7(F). Note that the orientation flat appears in Figure 6(F). The notch position appears in the enlarged portion of Figure 7(F). In this way, the wafer position coordinate conversion method according to the present invention can convert the coordinates of a wafer placed on a measurement stage with high accuracy using a simple method.

[0087] The above example shows the case where Ds is used as the fitting variable, but the wafer radius Rw can also be used as the fitting variable. The algorithm for this case is shown in Figure 8. Figures 9 and 10 show the process and results for a 150mm diameter orientation flat wafer and a 200mm diameter notched wafer, respectively, as in Figures 6 and 7.

[0088] [Wafer inspection method] Next, a wafer inspection method according to the present invention will be described. In the wafer inspection method according to the present invention, the wafer W can be inspected based on the in-plane position coordinates of the stage 1 in the stage coordinate system obtained by the above-described method for converting wafer position coordinates. In this way, the wafer inspection method according to the present invention can suppress contamination of the wafer and is also a low-cost inspection method.

[0089] When inspecting a point (point of interest) at a specific coordinate on the wafer W to be inspected, the stage coordinate system (X s Y s Cartesian coordinate system) and wafer coordinate system (X w Y w It is also possible to use an inspection coordinate system (global coordinate system) different from the Cartesian coordinate system, and perform inspection by moving the point of interest to its origin. The global coordinate system is defined as a coordinate system fixed to the inspection equipment, and is used to specify the position of the inspection probe (defect detector, film thickness gauge). For example, if the inspection probe is at the origin, the stage can be moved so that the coordinate point (Xs, Ys) of the stage coordinate system becomes the origin (0,0) of the global coordinate system. Even if the inspection probe is not at the origin, the point of interest can be moved to that point in the same way.

[0090] The wafer inspection method of the present invention can be particularly suitably applied to measuring the thickness of the wafer W and / or the thickness of a thin film provided on the wafer W, or to inspecting defects in the wafer W and / or the thin film provided on the wafer W.

[0091] Furthermore, when inspecting defects in the wafer W and / or a thin film provided on the wafer W, the position coordinates of the detected defects within the plane of the stage 1 in the stage coordinate system can be converted into position coordinates within the plane of the wafer W in the wafer coordinate system and output. When defects in a thin film inspected by the wafer inspection method according to the present invention are subjected to other inspections such as SEM or TEM, the position coordinates of the detected defects can be provided with high accuracy.

[0092] 11(B), it can also be applied to line scan measurement of the entire wafer surface. That is, line scan can be performed by rotating the stage 1, aligning the X and Y axes of the wafer coordinate system with those of the inspection coordinate system (global coordinate system), aligning the X-axis center of the wafer W with the X-axis center of the line detection means 5, and then moving it in the Y-axis direction. Similarly, in the case of surface scan, surface scan measurement can be performed by rotating the stage 1, aligning the X and Y axes of the wafer coordinate system with those of the inspection coordinate system, and moving it in the Y-axis direction while moving it along the X-axis the required number of times (while keeping the rotation fixed).

[0093] The present specification includes the following aspects. [1]: A method for converting position coordinates within a wafer surface to be inspected by a wafer inspection device, comprising: In an inspection unit that includes a stage for placing a wafer, an inspection means for inspecting the wafer placed on the stage, and a linear sensor that can detect the outer periphery of the wafer placed on the stage, the wafer having an orientation flat or a notch is placed on the stage, and the outer periphery of the wafer is measured by the linear sensor while rotating the stage, and the center of the stage is set to an origin O. s and acquiring position information of the outer periphery of the wafer in a stage coordinate system defined as Using the position information of the outer periphery of the wafer in the stage coordinate system, the center of the wafer is set to the origin O w or converting the position coordinates of the stage in the stage coordinate system into position coordinates of the stage in the stage coordinate system by using the center of the wafer as the origin O w a wafer coordinate system in which the coordinates of the wafer are converted into position coordinates within the wafer surface in the wafer coordinate system; [2]: The stage coordinate system is set with the center of the stage as the origin O s and X s axis and Y s X axis specified s Ys Assuming a Cartesian coordinate system, The wafer coordinate system is defined by setting the center of the wafer as the origin O. w and X are orthogonal to each other in the plane of the wafer based on the orientation flat or notch portion. w axis and Y w X axis specified w Y w A method for converting the wafer position coordinates in the above [1] into a Cartesian coordinate system. [3]: The wafer coordinate system is set to the origin O W is set to coincide with the center of the wafer, and the stage coordinate system is set by translating and rotating the stage coordinate system based on the orientation flat or the notch portion, using actual measurement data including position information of the outer periphery of the wafer in the stage coordinate system measured by the linear sensor and logical data defined based on the outer periphery shape of a virtual wafer not provided with an orientation flat or notch portion, generating difference data between the actual measurement data and the logical data, and acquiring, based on the difference data, the center coordinates of the wafer in the stage coordinate system and angle information θ0 of the deviation in the rotational direction at which the orientation flat or notch portion is located; The method for converting wafer position coordinates according to [1] or [2] above, which converts position coordinates within the plane of the wafer in the wafer coordinate system into position coordinates within the plane of the stage in the stage coordinate system, or converts position coordinates within the plane of the stage in the stage coordinate system into position coordinates within the plane of the wafer in the wafer coordinate system, based on the center coordinates of the wafer in the stage coordinate system and the deviation angle information θ0. [4]: A wafer inspection method for inspecting a wafer based on the in-plane position coordinates of the stage in the stage coordinate system obtained by the method for converting wafer position coordinates according to [1], [2], or [3] above. [5]: A wafer inspection method according to [4] above, which measures the thickness of the wafer and / or the thickness of a thin film formed on the wafer, or inspects the wafer and / or the thin film formed on the wafer for defects. [6]: Inspecting the wafer includes inspecting the wafer and / or a thin film formed on the wafer for defects; A wafer inspection method according to [4] or [5] above, wherein the position coordinates of the detected defects within the surface of the stage in the stage coordinate system are converted into position coordinates within the surface of the wafer in the wafer coordinate system, and output. [7]: An inspection apparatus that inspects a wafer based on position information of the wafer, an inspection unit including a stage for placing the wafer thereon, stage driving means for driving the stage, inspection means for inspecting the wafer placed on the stage, and a linear sensor capable of detecting the outer periphery of the wafer placed on the stage; The operation of the stage and the linear sensor are controlled to acquire position information of the outer periphery of the wafer having an orientation flat or notch while rotating the stage, and the center of the stage is set to the origin O. s The center of the wafer is set as the origin O using the position information of the outer periphery of the wafer in the stage coordinate system. w and a control unit that is capable of converting position coordinates within the plane of the wafer in a wafer coordinate system defined as: [8]: The stage coordinate system has the center of the stage as the origin O s and X s axis and Y s X axis specified s Y s It is a Cartesian coordinate system, The wafer coordinate system has the center of the wafer as the origin O w and X are orthogonal to each other in the plane of the wafer based on the orientation flat or notch portion. w axis and Y w X axis specified w Y wThe inspection device described above in [7] is a Cartesian coordinate system. [9]: The wafer coordinate system has the origin O W is a coordinate system set by translating and rotating the stage coordinate system with the orientation flat or notch portion as a reference so that the center of the wafer coincides with the center of the wafer, The control unit generating difference data between the actual measurement data and the logical data using actual measurement data including position information of the outer periphery of the wafer measured by the linear sensor and logical data defined based on the outer periphery shape of a virtual wafer not provided with an orientation flat or a notch; Based on the difference data, the center coordinates of the wafer in the stage coordinate system and angle information θ0 of the rotational deviation at which the orientation flat or notch portion is located are acquired; The inspection apparatus of [7] or [8] above, which is capable of converting position coordinates within the plane of the wafer in the wafer coordinate system into position coordinates within the plane of the stage in the stage coordinate system, or converting position coordinates within the plane of the stage in the stage coordinate system into position coordinates within the plane of the wafer in the wafer coordinate system, based on the center coordinates of the wafer in the stage coordinate system and the deviation angle information θ0.

[10] : The inspection device of [7], [8] or [9], wherein the control unit is capable of controlling the inspection means to inspect the wafer based on the in-plane position coordinates of the wafer in the wafer coordinate system and the in-plane position coordinates of the stage in the converted stage coordinate system.

[11] : The inspection device according to [7], [8], [9] or

[10] , wherein the inspection means measures the thickness of the wafer and / or the thickness of a thin film provided on the wafer, or is capable of measuring defects in the wafer and / or the thin film provided on the wafer.

[12] : the inspection means inspects the wafer and / or a thin film provided on the wafer for defects, The inspection apparatus according to [7], [8], [9],

[10] or

[11] above, wherein the control unit is capable of converting the position coordinates of the detected defects within the surface of the stage in the stage coordinate system into position coordinates within the surface of the wafer in the wafer coordinate system and outputting the converted position coordinates.

[0094] The present invention is not limited to the above-described embodiments. The above-described embodiments are merely examples, and anything that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits similar effects is included within the technical scope of the present invention. [Explanation of symbols]

[0095] 1...stage, 2...stage driving means, 3...inspection means, 4...linear sensor, 5...line detection means, 10...inspection unit, 20...control unit, 100...inspection device. W...wafer.

Claims

1. A method for converting position coordinates within a wafer surface to be inspected by a wafer inspection device, comprising: In an inspection unit that includes a stage for placing a wafer, an inspection means for inspecting the wafer placed on the stage, and a linear sensor that can detect the outer periphery of the wafer placed on the stage, the wafer having an orientation flat or a notch is placed on the stage, and the outer periphery of the wafer is measured by the linear sensor while rotating the stage, and the center of the stage is set to the origin O. ｓ and acquiring position information of the outer periphery of the wafer in a stage coordinate system defined as Using the position information of the outer periphery of the wafer in the stage coordinate system, the center of the wafer is set to the origin O ｗ or converting the position coordinates of the stage in the stage coordinate system into position coordinates of the stage in the stage coordinate system by using the center of the wafer as the origin O ｗ and converting the coordinates into position coordinates within the wafer surface in a wafer coordinate system defined as 2. A method for converting wafer position coordinates, wherein the wafer inspection device does not include an aligner.

2. The stage coordinate system is set with the center of the stage as the origin O ｓ and X ｓ axis and Y ｓ X axis ｓ Y ｓ Assuming a Cartesian coordinate system, The wafer coordinate system is set with the center of the wafer as the origin O ｗ and X are orthogonal to each other in the plane of the wafer with the orientation flat or notch portion as a reference. ｗ axis and Y ｗ X axis ｗ Y ｗ 2. The method for converting wafer position coordinates according to claim 1, wherein the coordinate system is an orthogonal coordinate system.

3. The wafer coordinate system is defined by the origin O Ｗ is set to coincide with the center of the wafer, and the stage coordinate system is set by translating and rotating the stage coordinate system based on the orientation flat or the notch portion, Using actual measurement data including position information of the outer periphery of the wafer in the stage coordinate system measured by the linear sensor and logical data defined based on the outer periphery shape of a virtual wafer not provided with an orientation flat or notch portion, difference data between the actual measurement data and the logical data is generated, and based on the difference data, the center coordinates of the wafer in the stage coordinate system and angle information θ of the deviation in the rotation direction at which the orientation flat or notch portion is located are calculated. ０ Get The center coordinates of the wafer in the stage coordinate system and the angular information θ of the deviation ０ 2. The method for converting wafer position coordinates according to claim 1, further comprising converting position coordinates within the plane of the wafer in the wafer coordinate system into position coordinates within the plane of the stage in the stage coordinate system, or converting position coordinates within the plane of the stage in the stage coordinate system into position coordinates within the plane of the wafer in the wafer coordinate system, based on:

4. 2. A wafer inspection method, comprising the steps of: inspecting the wafer based on position coordinates within the surface of the stage in the stage coordinate system obtained by the method for converting wafer position coordinates according to claim 1.

5. 5. The wafer inspection method according to claim 4, further comprising measuring the thickness of the wafer and / or the thickness of a thin film formed on the wafer, or inspecting the wafer and / or the thin film formed on the wafer for defects.

6. Inspecting the wafer includes inspecting the wafer and / or a thin film provided on the wafer for defects; 6. A wafer inspection method according to claim 4, wherein the position coordinates of the detected defects within the surface of the stage in the stage coordinate system are converted into position coordinates within the surface of the wafer in the wafer coordinate system and output.

7. An inspection apparatus that inspects a wafer based on position information of the wafer, an inspection unit including a stage for placing the wafer thereon, stage driving means for driving the stage, inspection means for inspecting the wafer placed on the stage, and a linear sensor capable of detecting the outer periphery of the wafer placed on the stage; The operation of the stage and the linear sensor are controlled to acquire position information of the outer periphery of the wafer having an orientation flat or a notch while rotating the stage, and the center of the stage is set to the origin O. ｓ The center of the wafer is set as the origin O using the position information of the outer periphery of the wafer in the stage coordinate system. ｗ a control unit that converts position coordinates within the plane of the wafer in a wafer coordinate system into position coordinates within the plane of the stage in the stage coordinate system, and controls the inspection unit based on the converted position coordinates in the stage coordinate system to inspect the wafer, An inspection device characterized by not having an aligner.

8. The stage coordinate system has the center of the stage as the origin O ｓ and X ｓ axis and Y ｓ X axis ｓ Y ｓ It is a Cartesian coordinate system, The wafer coordinate system has the center of the wafer as the origin O ｗ and X are orthogonal to each other in the plane of the wafer with the orientation flat or notch portion as a reference. ｗ axis and Y ｗ X axis ｗ Y ｗ 8. The inspection apparatus according to claim 7, wherein the coordinate system is a Cartesian coordinate system.

9. The wafer coordinate system has the origin O Ｗ is a coordinate system set by translating and rotating the stage coordinate system with the orientation flat or notch portion as a reference so that the center of the wafer coincides with the center of the wafer, The control unit generating difference data between the actual measurement data and the logical data using actual measurement data including position information of the outer periphery of the wafer measured by the linear sensor and logical data defined based on the outer periphery shape of a virtual wafer not provided with an orientation flat or a notch; Based on the difference data, the center coordinates of the wafer in the stage coordinate system and angular information θ of the deviation in the rotation direction where the orientation flat or notch portion is located are calculated. ０ Get The center coordinates of the wafer in the stage coordinate system and the angular information θ of the deviation ０ 8. The inspection apparatus according to claim 7, wherein position coordinates within the plane of the wafer in the wafer coordinate system can be converted into position coordinates within the plane of the stage in the stage coordinate system, or position coordinates within the plane of the stage in the stage coordinate system can be converted into position coordinates within the plane of the wafer in the wafer coordinate system, based on

10. 8. The inspection apparatus according to claim 7, wherein the control unit is capable of controlling the inspection means to inspect the wafer based on the in-plane position coordinates of the wafer in the wafer coordinate system and the in-plane position coordinates of the stage in the converted stage coordinate system.

11. 8. The inspection apparatus according to claim 7, wherein the inspection means measures the thickness of the wafer and / or the thickness of a thin film provided on the wafer, or is capable of measuring defects in the wafer and / or the thin film provided on the wafer.

12. the inspection means inspects the wafer and / or a thin film provided on the wafer for defects, 12. The inspection apparatus according to claim 7, wherein the control unit is capable of converting the position coordinates of the detected defect within the surface of the stage in the stage coordinate system into position coordinates within the surface of the wafer in the wafer coordinate system and outputting the converted position coordinates.

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