Pad Carrier Assembly for Horizontal Pre-Wash Module

Abstract

A pad carrier assembly including a bonding base and a pad carrier coupled to the bonding base, the bonding base and the pad carrier configured to support a buffing pad by a mechanical clamping mechanism.

Description

[Technical Field]

[0001]

[0001] The embodiments described herein relate generally to equipment used in the manufacture of electronic devices, and more particularly to horizontal pre-clean (HPC) modules that can be used to clean the surface of a substrate in a semiconductor device manufacturing process. [Background technology]

[0002]

[0002] In the fabrication of high-density integrated circuits, chemical-mechanical polishing (CMP) is commonly used to planarize or polish a material layer deposited on a substrate. In the horizontal pre-cleaning (HPC) module used in the CMP process, a rotating buffing pad is pressed against the material layer on the substrate surface, and material is removed throughout the material layer through a combination of chemical and mechanical activity provided by the polishing fluid and the relative motion of the buffing pad and the substrate. Compared to conventional buffing pads made of materials such as poromeric materials and filled or unfilled polymeric materials, buffing pads made of polyvinyl alcohol (PVA) material provide high shear forces for chemical and mechanical polishing due to their mechanical strength and abrasion resistance. PVA material is absorbent, soft, and elastic, and is inherently thicker and larger than conventional materials. Furthermore, larger buffing pads improve performance in chemical-mechanical cleaning and reduce buffing time. However, due to their inherent thickness and large size, buffing pads made of PVA material may sag when supported by a pad carrier.

[0003] Therefore, what is needed is a system and method for supporting large, thick, water-absorbent buffing pads while preventing the buffing pad from sagging. Summary of the Invention

[0004]

[0004] Embodiments of the present disclosure also provide a pad carrier assembly for use in a horizontal pre-clean module. The pad carrier assembly includes a bonding base and a pad carrier coupled to the bonding base. The bonding base and pad carrier are configured to support a buffing pad by a mechanical clamping mechanism.

[0005]

[0005] An embodiment of the present disclosure further provides a method of supporting a buffing pad in a horizontal pre-cleaning module, the method including mechanically clamping the buffing pad at a periphery of the buffing pad with a lip portion of a mating base and a tapered portion of a pad carrier, the mating base and the pad carrier being mated and positioned within the horizontal pre-cleaning module to support the buffing pad and prevent sagging of the buffing pad through the use of one or more pad retention features.

[0006]

[0006] Embodiments of the present disclosure may further provide a pad carrier for use in a polishing or cleaning process, comprising: a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm; and a support plate including a support body. The pad carrier assembly comprises a clamp plate including a clamp body, the clamp body including one or more ferromagnetic or paramagnetic material-containing elements disposed within the clamp body and a first retention surface disposed on a first side of the clamp body. The support body of the support plate includes a second retention surface disposed on the first side of the support body and a plurality of support plate retention features. Each support plate retention feature is configured to receive a pad retention feature formed on a buffing pad when the lip of the buffing pad is positioned between the first retention surface and the second retention surface. The pad carrier may further include a bonding base including a bonding body including one or more ferromagnetic or paramagnetic material-containing elements disposed within the body, wherein each of the one or more ferromagnetic or paramagnetic material-containing elements in the bonding body of the bonding base is configured to face each of the one or more ferromagnetic or paramagnetic material-containing elements in the support body of the support plate when the bonding base is positioned on the second side of the support body of the support plate, the second side of the support body of the support plate being opposite the first side. The one or more ferromagnetic or paramagnetic material-containing elements of the bonding base or the clamping plate may include ferromagnetic or paramagnetic material-containing elements formed in a toroidal shape.

[0007]

[0007] Embodiments of the present disclosure may further provide a pad carrier for use in a polishing or cleaning process, comprising a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm. The pad carrier assembly includes a coupling base including a coupling body and a support plate including a support body. The coupling body of the coupling base includes an array of magnets and a first retention surface disposed on a first side of the coupling body. The support body of the support plate includes an array of magnets disposed therein, a second retention surface disposed on the first side of the support body, and a plurality of support plate retention features. Each support plate retention feature is configured to receive a pad retention feature formed on a buffing pad when the lip of the buffing pad is positioned between the first retention surface and the second retention surface.

[0008]

[0008] Embodiments of the present disclosure may further provide a pad carrier for use in a polishing or cleaning process, comprising a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm. The pad carrier assembly includes a clamp plate including a clamp body and a support plate including a support body. The clamp body of the clamp plate includes one or more magnets disposed within the clamp body and a first retention surface disposed on a first side of the clamp body. The support body of the support plate includes a second retention surface disposed on the first side of the support body and a plurality of support plate retention features. Each support plate retention feature is configured to receive a pad retention feature formed on a buffing pad when a lip of the buffing pad is positioned between the first retention surface and the second retention surface.

[0009]

[0009] Embodiments of the present disclosure may further provide a pad carrier for use in a polishing or cleaning process, comprising a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm. The pad carrier assembly includes a support plate including a coupling base including a first retention surface disposed on a first side of the coupling body and a support body including a second retention surface disposed on the first side of the support body. The support plate has a plurality of support plate retention features, each support plate retention feature configured to receive a pad retention feature formed on a buffing pad when a lip portion of the buffing pad is positioned between the first retention surface and the second retention surface.

[0010]

[0010] In order that the above-described features of the present disclosure may be understood in detail, the above-summarized disclosure will be more particularly described by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings depict only typical embodiments of the present disclosure and therefore should not be considered as limiting the scope of the present disclosure, which may also admit of other equally effective embodiments. [Brief explanation of the drawings]

[0011] [Figure 1A] 1 is a schematic plan view of an exemplary chemical mechanical polishing (CMP) processing system using a horizontal pre-clean (HPC) module described herein in accordance with one or more embodiments. [Figure 1B] 1B is a top isometric view of an exemplary CMP processing system that may correspond to the schematic diagram shown in FIG. 1A, according to one or more embodiments. [Figure 1C] 1B is a top elevation view of the CMP processing system of FIG. 1B, which may correspond to the schematic diagram shown in FIG. 1A, according to one or more embodiments. [Figure 2] FIG. 1A is a top isometric view of one side of an exemplary HPC module according to one or more embodiments, and FIG. 1B is a side cross-sectional view of an exemplary pad carrier positioning arm according to one or more embodiments. [Figure 3A-B]1A-1D are cross-sectional side views of a docking base and a pad carrier according to one or more embodiments. [Figure 3C-D] 1A-1D are cross-sectional side views of a docking base and a pad carrier according to one or more embodiments. [Figure 3E] FIG. 1 illustrates a top isometric view of a pad carrier according to one or more embodiments. [Figure 3F] FIG. 1 is a top exploded view of components within a pad carrier according to one or more embodiments. [Figure 4A] FIG. 1 is a cross-sectional side view of an exemplary docking base and pad carrier according to one or more embodiments. [Figure 4B-C] 1A and 1B are top and side cross-sectional views of a pad carrier according to one or more embodiments. [Figure 4D] FIG. 1 is a side cross-sectional view of a pad carrier according to one or more embodiments. [Figure 4E-F] FIG. 2 is a top view of a buffing pad according to one or more embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0012]

[0023] To facilitate understanding, wherever possible, the same reference numerals have been used to designate identical elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0013]

[0024] The embodiments described herein relate generally to equipment used in the manufacture of electronic devices, and more particularly to horizontal pre-clean (HPC) modules that may be used to clean the surface of a substrate during part of a semiconductor device manufacturing processing sequence.

[0014]

[0025] During the cleaning process, buffing pads made of polyvinyl alcohol (PVA) material are used to provide high shear forces across the surface of the substrate being cleaned, removing residue from the surface of the substrate due to the material's mechanical strength and abrasion resistance. However, because PVA material is absorbent, soft, and elastic, and is inherently thicker and larger than conventional pad materials, buffing pads made of PVA material may sag when supported by a pad carrier.

[0015]

[0026] In the embodiments described herein, the pad carrier supports large, thick, absorbent buffing pads during the chemical-mechanical cleaning process while preventing sagging of the buffing pads through the use of mechanical clamping mechanisms, interlocking features, magnetic clamping mechanisms, and / or suction clamping mechanisms.

[0016]

[0027] FIG. 1A is a schematic plan view of an exemplary chemical-mechanical polishing (CMP) processing system 100 that uses a horizontal pre-clean (HPC) module described herein, according to one or more embodiments. FIG. 1B is a top isometric view of an exemplary CMP processing system 100 that may correspond to the schematic view shown in FIG. 1A, according to one or more embodiments. FIG. 1C is a top elevation view of the CMP processing system 100 of FIG. 1B, which may correspond to the schematic view shown in FIG. 1A, according to one or more embodiments. In FIGS. 1B and 1C, certain portions of a housing and certain other internal and external components have been omitted to more clearly illustrate the HPC module within the CMP processing system 100. Here, the CMP processing system 100 includes a first portion 105 and a second portion 106 that is coupled to and integral with the first portion 105. The first portion 105 is a substrate polishing portion that includes multiple polishing stations (not shown).

[0017]

[0028] The second section 106 includes one or more post-CMP cleaning systems 110, multiple system loading stations 130, one or more substrate handlers, such as a first robot 124 and a second robot 150, one or more metrology stations 140, one or more location specific polishing (LSP) modules 142, one or more HPC modules 200, and one or more drying units 170. The HPC modules 200 are configured to process substrates 120 positioned in a substantially horizontal orientation (i.e., in the xy plane). In some embodiments, the second section 106 optionally includes one or more vertical cleaning modules 112 configured to process substrates 120 positioned in a substantially vertical orientation (i.e., in the zy plane).

[0018]

[0029] Each LSP module 142 is typically configured to polish only a portion of the substrate surface using a polishing member (not shown) having a surface area smaller than the surface area of ​​the substrate 120 to be polished. LSP modules 142 are often used to finish, e.g., remove additional material, from a relatively small portion of the substrate 120 after the substrate 120 has been polished in the polishing module.

[0019]

[0030] Metrology station 140 is used to measure the thickness of a material layer disposed on substrate 120 before and / or after polishing, to inspect polished substrate 120 to determine whether a material layer has been removed from its field surface, and / or to inspect the substrate surface before and / or after polishing for defects. In these embodiments, based on the measurement results or surface inspection results obtained using metrology station 140, substrate 120 may be returned to the LSP module for further polishing and / or may be directed to a different substrate processing module or station, such as a polishing module or LSP module 142 in first section 105. As shown in FIG. 1A , metrology station 140 and LSP module 142 are located in an area of ​​second section 106 above (in the Z direction) one of the sections of post-CMP cleaning system 110.

[0020]

[0031] The first robot 124 is positioned to transfer the substrate 120 between the multiple system loading stations 130, for example, between the multiple system loading stations 130 and the second robot 150, and / or between the post-CMP cleaning system 110 and the multiple system loading stations 130. In some embodiments, the first robot 124 is positioned to transfer the substrate 120 between any of the system loading stations 130 and a processing system positioned proximate thereto. For example, in some embodiments, the first robot 124 may be used to transfer the substrate 120 between one of the system loading stations 130 and the metrology station 140.

[0021]

[0032] The second robot 150 is used to transfer the substrate 120 between the first portion 105 and the second portion 106. For example, here, the second robot 150 is positioned to transfer the substrate 120 to be polished received from the first robot 124 to the first portion 105 for polishing there. The second robot 150 is then used to transfer the polished substrate 120 from the first portion 105, for example, from a transfer station (not shown) within the first portion 105 to one of the HPC modules 200 and / or between different stations and modules located within the second portion 106. Alternatively, the second robot 150 transfers the substrate 120 from a transfer station within the first portion 105 to one of the LSP modules 142 or the metrology station 140. The second robot 150 can also transfer the substrate 120 from either the LSP module 142 or the metrology station 140 to the first portion 105 for further polishing there.

[0022]

[0033] The CMP processing system 100 of FIG. 1A includes two post-CMP cleaning systems 110, one on each side of the second robot 150. In FIG. 1A, at least some modules of one of the post-CMP cleaning systems 110, such as one or more vertical cleaning modules 112, are located below (in the Z direction) the metrology station 140 and the LSP module 142 and are therefore not shown. The metrology station 140 and the LSP module 142 are not shown in FIG. 1C. In some other embodiments, the CMP processing system 100 includes only one post-CMP cleaning system 110, where each post-CMP cleaning system 110 includes an HPC module 200, one or more vertical cleaning modules 112, such as a brush or spray box, a drying unit 170, and a substrate handler 180 for transferring substrates 120 therebetween. Here, each HPC module 200 is located in the second section 106 proximate to the first section 105.

[0023]

[0034] Typically, the HPC module 200 receives the polished substrate 120 from the second robot 150 through a first opening (not shown) formed in a side panel of the HPC module 200, for example, through a door or slit valve located in the side panel. The substrate 120 is received in a horizontal orientation by the HPC module 200 for positioning on a horizontally disposed substrate support surface therein. The HPC module 200 then performs a pre-cleaning process, such as a buffing process, on the substrate 120 before the substrate 120 is transferred therefrom using the substrate handler 180.

[0024]

[0035] Substrate 120 is transferred from HPC module 200 through a second opening, here opening 224 (FIG. 1B), which is typically a horizontal slot disposed through a second side panel of HPC module 200 that can be closed with a door, e.g., a slit valve. Thus, substrate 120 is still in a horizontal orientation when transferred from HPC module 200. After substrate 120 is transferred from HPC module 200, substrate handler 180 pivots substrate 120 to a vertical position for further processing in vertical cleaning module 112 of post-CMP cleaning system 110.

[0025]

[0036] In this example, the HPC module 200 has a first end 202 facing the first portion 105 of the CMP processing system 100, a second end 204 facing the opposite side of the first end 202, a first side 206 facing the second robot 150, and a second side 208 facing the opposite side of the first side 206. The first and second sides 206, 208 extend orthogonally between the first and second ends 202, 204.

[0026]

[0037] A plurality of vertical cleaning modules 112 are located within the second section 106. The one or more vertical cleaning modules 112 are any one or combination of contact and non-contact cleaning systems, such as a spray box and / or a brush box, for removing polishing by-products from the surface of the substrate.

[0027]

[0038] The drying unit 170 is used to dry the substrate 120 after it has been processed by the vertical cleaning module 112 and before it is transferred to the system loading station 130 by the first robot 124. Here, the drying unit 170 is a horizontal drying unit and is configured to receive the substrate 120 through an opening (not shown) while the substrate 120 is positioned in a horizontal orientation.

[0028]

[0039] In this specification, the substrate 120 is moved between the HPC module 200 and the vertical cleaning module 112, between individual vertical cleaning modules 112, and between the vertical cleaning module 112 and the drying unit 170 using the substrate handler 180.

[0029]

[0040] In embodiments herein, operation of the CMP processing system 100, including the substrate handler 180, is directed by a system controller 160. The system controller 160 includes a programmable central processing unit (CPU) 161 operable with memory 162 (e.g., non-volatile memory) and support circuits 163. The support circuits 163 conventionally include cache, clock circuits, input / output subsystems, power supplies, etc., and combinations thereof, coupled to the CPU 161 and coupled to various components of the CMP processing system 100 to facilitate its control. The CPU 161 is one of any form of general-purpose computer processor used in industrial environments, such as a programmable logic controller (PLC), to control the various components and sub-processors of the processing system. The memory 162 coupled to the CPU 161 is non-transitory and is typically one or more of readily available memory, such as random access memory (RAM), read-only memory (ROM), a floppy disk drive, a hard disk, or any other form of digital storage, local or remote.

[0030]

[0041] Typically, memory 162 is in the form of a non-transitory computer-readable storage medium containing instructions (e.g., non-volatile memory) that, when executed by CPU 161, facilitate operation of CMP processing system 100. The instructions in memory 162 are in the form of a program product, such as a program, that implements the methods of the present disclosure. The program code may conform to any one of a number of different programming languages. In one example, the present disclosure may be implemented as a program product stored on a computer-readable storage medium for use with a computer system. The program(s) in the program product define functions of embodiments (including the methods described herein).

[0031]

[0042] Exemplary non-transitory computer-readable storage media include, but are not limited to, (i) non-writable storage media on which information may be permanently stored (e.g., a CD-ROM disk readable by a CD-ROM drive, a flash memory, a ROM chip, or any type of solid-state non-volatile semiconductor memory device, e.g., a read-only memory device in a computer such as a solid-state drive (SSD)), and (ii) writable storage media on which changeable information is stored (e.g., a floppy disk in a diskette drive or hard disk drive, or any type of solid-state random-access semiconductor memory). Such computer-readable storage media, when carrying computer-readable instructions that direct the functions of the methods described herein, are embodiments of the present disclosure. In some embodiments, the methods described herein, or portions thereof, are performed by one or more application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other types of hardware implementations. In some other embodiments, the substrate processing and / or handling methods described herein are performed by a combination of software routines, ASIC(s), FPGAs, and / or other types of hardware implementations. One or more system controllers 160 may be used with one or any combination of the various modular polishing systems described herein and / or with individual polishing modules thereof.

[0032]

[0043] 2A is a top isometric view of a second side 208 of an exemplary HPC module 200 that may be used in the CMP processing system 100 described herein. In FIG. 2A, the service access panel has been omitted to more clearly show the internal components of the HPC module 200.

[0033]

[0044] Generally, HPC module 200 includes a chamber 210 formed by a number of side panels that collectively define a processing region 212, a collection area 214, and a lid 216.

[0034]

[0045] A first side panel 218 is formed on a first side 206 of the HPC module 200 facing the second robot 150 and includes a first substrate handler access door (not shown) used to position a substrate 120 on the rotary vacuum table 230 using the second robot 150. A second side panel 222 is formed on a second end 204 of the HPC module 200 facing away from the first portion 105. The second side panel 222 includes a second substrate handler access door opening 224 used to remove a substrate 120 from the rotary vacuum table 230 using the substrate handler 180. A third side panel 226 is formed on a second side 208 of the HPC module 200. The third side panel 226 includes a service access panel opening 228. The symmetry of the first substrate handler access door and the service access panel opening 228 formed in opposing side panels of the HPC module 200 beneficially provides for a horizontal buffing module that can be installed on either side of the processing system 100, as shown in FIG. 1C.

[0035]

[0046] HPC module 200 further includes a rotary vacuum table 230 disposed within processing region 212 for vacuum chucking substrate 120, an annular substrate lift mechanism 270 disposed radially outward of rotary vacuum table 230, a pad conditioning station 280 disposed proximate rotary vacuum table 230, and a pad carrier positioning arm 300 movable between a first position on rotary vacuum table 230 and a second position on pad conditioning station 280. Rotary vacuum table 230, annular substrate lift mechanism 270, pad conditioning station 280, and pad carrier positioning arm 300 are each independently mounted to water collection area 214.

[0036]

[0047] FIG. 2B is a side cross-sectional view of an exemplary pad carrier positioning arm 300 that may be used in the HPC module 200 of FIG. 2A. The pad carrier positioning arm 300 is positioned proximate the rotary vacuum table 230 and the pad conditioning station 280 (FIG. 2A). A distal end 302 of the pad carrier positioning arm 300 includes a vertically movable pad carrier assembly 304 for supporting a buffing pad 306 at its lower end. The pad carrier assembly 304 includes a head motor 308 for rotating the buffing pad 306 about an axis c2 aligned substantially with the direction of gravity. The pad carrier assembly 304 is coupled to the head motor 308 via a shaft 311 and includes a coupling base 310 that couples a pad carrier 314 to the head motor 308. In some embodiments, the pad carrier 314 is sized to support a buffing pad 306 having a diameter of about 40 mm to 150 mm, e.g., about 70 mm to 150 mm, e.g., about 134 mm, which is larger than conventional buffing pads used in similar cleaning modules. In some embodiments, the pad carrier positioning arm 300 of the present disclosure supports a larger buffing pad 306 compared to conventional pre-cleaning modules.

[0037]

[0048] During processing in the HPC module 200, the substrate 120 is positioned on the rotary vacuum table 230 by transferring the substrate 120 through an opening formed in the first side panel 226 using the second robot 150 and positioning the substrate 120 on a plurality of lift pins in the lift pin assembly 203. The lift pin assembly 203 includes a plurality of lift pins that can be raised and lowered using a lift pin actuator (not shown) to allow the substrate 120 to be positioned on and removed from the surface of the rotary vacuum table 230. A pump 219 can then be used to generate a vacuum between the substrate 120 and the opening formed in the surface of the rotary vacuum table 230. A head motor 308 and actuator assembly 217 are then used to bring a rotating buffing pad 306 into contact with the surface of the substrate. In some embodiments, the rotary vacuum table 230 and substrate 120 are also rotated during processing using a rotation actuator 227. The rotating buffing pad 306 may then be translated across the surface of the substrate 120 in an oscillatory arc motion through the use of the rotary actuator 213. In some embodiments, the rotary actuator 213 may rotate the buffing pad 306 in an oscillatory rotational motion that covers less than a full 360-degree rotation. While the rotating buffing pad 306 is translating across the surface of the substrate 120, a first processing fluid, such as ion-exchanged water and / or one or more first cleaning solutions, may be flowed from a fluid source 221 onto the surface of the substrate 120. After processing for a desired period of time, processing is stopped and the substrate is removed from the HPC module 200 by performing the steps described above in reverse order. However, as described below, the substrate is beneficially removed from the HPC module 200 through the opening 209 through the use of a second robot 150 or a third robot (not shown).

[0038]

[0049] 3A is a cross-sectional side view of a pad carrier 314 according to one embodiment of the present disclosure that may be used in the pad carrier assembly 304 of FIG. 2A . The pad carrier 314 includes a mating base 310, a support plate 315, and a buffing pad 306. In some embodiments, the mating between the mating base 310 and the support plate 315 is achieved through magnetic attraction between a plurality of magnets 318 disposed within the support plate 315 and a plurality of magnets 316 disposed within the mating base 310. The plurality of magnets 318 disposed within the support plate 315 and the plurality of magnets 316 disposed within the mating base 310 are also configured to provide a clamping force between the mating base 310 and the support plate 315 that is used to compress the lip 306A of the buffing pad 306. In some embodiments, the mating base 310 is a flexible element configured to receive the support plate 315. In some embodiments, the magnet 316 of the coupling base 310 is an electromagnet that receives power from an external power source (not shown) connected to an electromagnet located within the coupling base 310 by a slip ring coupled to the rotating shaft 311 of the head motor 308. In some embodiments, either the magnet 318 or the magnet 316 can be replaced with a ferromagnetic material or some paramagnetic material that is attracted by an opposing magnet, such as either the magnet 316 or the magnet 318, respectively. In some embodiments, the magnets 316 and 318 are similarly positioned in an array distributed about the central axis of the pad carrier 314 (e.g., an axis coinciding with axis c2 shown in FIG. 2B ). In some embodiments, either the array of magnets 316 or the array of magnets 318 is replaced by a toroidal-shaped element that is ferromagnetic or paramagnetic and has a central axis coinciding with the central axis of the pad carrier 314. Alternatively, as shown in FIG. 3B , the support plate 315 includes a threaded hole 363 on the top surface of the support plate 315. The bonding base 310 and the support plate 315 are coupled together by a plurality of fasteners 320 and threaded holes 363 that are also configured to provide a clamping force between the bonding base 310 and the support plate 315 that is used to compress the lip portion 306A of the buffing pad 306.In some embodiments, both magnets and fasteners are used to couple the support plate 315 to the coupling base 310. In one embodiment, the coupling base 310 may be coupled to the shaft 311 by a quick release attachment (not shown) so that the pad carrier 314 can be easily removed for replacement of the buffing pad 306 on the pad carrier 314, and then quickly reattached to the shaft 311, as shown in FIG.

[0039]

[0050] 3C-3D, pad carrier 314 includes a coupling base 310 and support plate 315 described above with respect to FIGS. 3A and 3B, and further includes a clamping plate 312 that, in combination, is configured to clamp and hold lip portion 306A of buffing pad 306. FIG. 3E further illustrates a top isometric view of one embodiment of clamping plate 312 coupled to buffing pad 306. Clamping plate 312 includes a body 312E that includes an array of enclosed regions 312F, each of which includes magnets 318, countersunk regions 312C, recesses 312D, and surface 312A. 3C, 3D, and 3E, the coupling base 310, clamping plate 312, and support plate 315 can be positioned, coupled, and aligned relative to one another by using positioning elements 312B and / or mating elements in a central region, such as recess 312D in clamping plate 312 and mating element 310B in coupling base 310. In some embodiments, the mating elements in the central region are formed in a non-cylindrical or non-circular shape, such as a rectangle, oval, or star shape, in the XY plane so that the mating elements can transfer torque between the coupling base 310 and clamping plate 312. In some embodiments, as shown in FIG. 3C, the coupling base 310 and clamping plate 312 are coupled together via magnetic attraction generated by multiple magnets 318 disposed in clamping plate 312 and multiple magnets 316 disposed in coupling base 310. Alternatively, in one embodiment shown in FIG. 3D, the clamping plate 312 includes multiple countersunk screw holes 362, each configured to receive a fastener 320. The mating of the coupling base 310 and the clamping plate 312 is coupled via a number of fasteners 320 and threaded holes 362. In some embodiments, both magnets and fasteners are used to couple the clamping plate 312 to the coupling base 310.

[0040]

[0051] 3F is an exploded view of one embodiment of a support plate 315 and buffing pad 306. The support plate 315 includes a plurality of support plate retention features 315C, a surface 315A, and may optionally include a plurality of threaded features configured to receive portions of fasteners 320. In some embodiments, the support plate 315 further includes a plurality of enclosed areas (not shown), each including a magnet 318, as also described above. In some embodiments, the support plate 315 further includes one or more interlocking features, shown as recesses 315D, on the periphery of the support plate 315. The recesses 315D are provided to further improve retention of the lip 306A of the buffing pad 306 between the support plate 315 and the coupling base 310, or, in some embodiments, between the support plate 315 and the clamp plate 312. In some embodiments, the buffing pad 306 is overmolded onto the support plate 315, resulting in an inseparable assembly.

[0041]

[0052] In some embodiments, the buffing pad 306 is made of polyvinyl alcohol (PVA) material. PVA material is hydrophilic and can absorb and retain water. When wet, PVA material is resilient, flexible, and soft, and has mechanical strength and abrasion resistance. Compared to conventional materials used as buffing pads, such as poromeric materials or filled or unfilled polymeric materials, PVA material provides high shear forces for chemical mechanical cleaning. The buffing pad 306 made of PVA material has a diameter of over 70 mm, which is larger than the diameter of a typical buffing pad made of conventional materials, which is approximately 67 mm. The larger buffing pad improves performance in chemical mechanical cleaning and reduces buffing time. Furthermore, the buffing pad 306 made of PVA material is thicker than a typical buffing pad made of conventional materials. The pad carrier 314 is designed to support the large, thick, absorbent buffing pad 306 while preventing sagging of the buffing pad 306 through mechanical clamping and support mechanisms.

[0042]

[0053] 3A , when positioned relative to the bonding base 310 and ready to perform the buffing process, the lip 306A of the buffing pad 306 is compressed between the two surfaces 310A and 315A of the bonding base 310 and the support plate 315, respectively. A magnetic attraction between the magnet 318 of the support plate 315 and the magnet 316 of the bonding base 310 is used to generate a force that compresses the lip 306A of the buffing pad 306 between the surface 315A of the support plate 315 and the surface 310A of the bonding base 310. In one embodiment, the two surfaces 310A and 315A are substantially parallel to one another. In some embodiments, the surface 315A and / or the opposing surface of the lip 306A include one or more interlocking features, shown in FIG. 3F as a recess 315D in the support plate 315. Interlocking features are provided to further improve retention of lip 306A of buffing pad 306 between surfaces 310A and 315A. In some embodiments, the clamping area of ​​surfaces 310A and 315A between which lip 306A is disposed during processing is oriented perpendicular to the direction in which magnets 318 and 316 are aligned (i.e., the Z direction) and / or parallel to polishing surface 306D of buffing pad 306 (e.g., the XY plane). In some embodiments, as shown in FIGS. 3B, 3C, and 3D, multiple fasteners 320 are configured to provide the clamping force used to compress lip 306A of buffing pad 306. In some embodiments, fasteners 320 may include one or more alignment pins. In either configuration of magnets 316 and 318 or fastener 320, the material in lip 306A may be compressed to about 5% to about 95% of its uncompressed state, for example, about 20% to about 80%, or about 40% to about 60% of the original thickness of the material (e.g., PVA) of lip 306A of buffing pad 306.

[0043]

[0054] 3A-3D and 3F, in some embodiments, the pad carrier 314 includes a plurality of retention features 335 that allow pad retention features 306C of the buffing pad 306 to engage with support plate retention features 315C of the support plate 315. The retention features 335 form part of a mechanical clamping mechanism and are used to position and maintain the position of the buffing pad 306 relative to the support plate 315 during processing, and thus after the buffing pad 306 is immersed in processing chemicals and / or while various shear and compressive loads are applied during processing. The retention features 335 are also used to prevent sagging of portions of the buffing pad 306 relative to the support plate 315. Sagging of the buffing pad 306 would undesirably cause the sagging portions of the buffing pad 306 to contact the surface of the substrate when the substrate is moved relative to the pad carrier 314 before or after a buffing process is performed on the substrate.

[0044]

[0055] 3F, in some embodiments, the buffing pad 306 and the support plate 315 each include a pad retention feature 306C and a support plate retention feature 315C, respectively, formed in a desired mating pattern to minimize or prevent sagging of the buffing pad 306 and mechanically clamp the pad 306 to the support plate to reliably handle loads applied to the buffing pad 306 during processing. In some embodiments, the retention feature 335 may be formed such that the pad retention feature 306C and the support plate retention feature 315C form an overlapping and / or interference fit that can substantially fix the position of the buffing pad 306 relative to the support plate 315. As shown in FIGS. 3A-3D, the pad retention feature 306C may be formed in an inverted cone shape, and the support plate retention feature 315C may be formed in a countersunk configuration such that the top of the pad retention feature 306C overlaps the bottom of the support plate retention feature 315C. In some embodiments, the pad retention features 306C and support plate retention features 315C of each retention feature 335 of the plurality of retention features are formed in a circular, elliptical, spiral, or slot-shaped configuration. In some configurations, the array or pattern of retention features 335 includes two or more different retention feature shapes.

[0045]

[0056] FIG. 4A is a side cross-sectional view of an exemplary pad carrier 314 including a mating base 310 and a support plate 315 that may be used in the pad carrier assembly 304 of FIG. 2B. In some embodiments, the mating base 310 includes magnets 316, and the support plate 315 includes magnets 318, such that the mating base 310 and the pad carrier 314 are coupled via magnetic forces. In some embodiments, the magnets 316 and 318 are similarly positioned in an array distributed about the central axis of the pad carrier 314 (e.g., an axis corresponding to axis c2 shown in FIG. 2B). In one embodiment, the magnets 316 and 318 include ferromagnetic or paramagnetic materials. In some embodiments, either the magnet array 316 or the magnet array 318 is replaced by a toroidal-shaped element that is ferromagnetic or paramagnetic and has a central axis corresponding to the central axis of the pad carrier 314. The mating base 310 and the support plate 315 are aligned via fasteners 320. In some embodiments, the fasteners 320 may include screws and bolts. In an alternative embodiment, the coupling base 310 and the support plate 315 are aligned via alignment or positioning pins.

[0046]

[0057] The pad carrier 314 may further include a lip ring 321 having a lip ring periphery 322 at the periphery of the lip ring 321. The support plate 315 includes a tapered portion 324 at the periphery of the support plate 315, tapering from the bottom surface to the top surface of the support plate 315 facing the coupling base 310 such that the tapered portion 324 is substantially parallel to the inner surface of the lip ring periphery 322 of the lip ring 321. The lip ring periphery 322 of the lip ring 321 and the tapered portion 324 of the support plate 315 together mechanically clamp the buffing pad 306 along the periphery of the lip portion 306A of the buffing pad. The support plate 315 has a diameter at the bottom of about 70 mm to 150 mm, e.g., about 128 mm, and a thickness of about 2 mm to 10 mm, or about 3 mm to 7 mm, e.g., about 4.2 mm. In some embodiments, the diameter of the support plate 315 at the top surface is about 1 mm to about 5 mm smaller than the diameter of the support plate 315 .

[0047]

[0058] 4B and 4C are plan and side cross-sectional views of a pad carrier 314 according to one embodiment. Also shown in FIG. 4C is a rip ring 321, a support plate 315, and a portion of a buffing pad 306. In some embodiments, the pad carrier 314 includes a plurality of retention features 335, where pad retention features 306C of the buffing pad 306 engage with support plate retention features 315C of the support plate 315. The support plate 315 includes support plate retention features 315C, where the pad retention features 306C are pressed into the support plate retention features 315C. The support plate retention features 315C are circular through-holes having a diameter of about 10 mm to about 25 mm, e.g., about 15 mm, and having a negative taper from the surface facing the bonding base 310 to the surface facing the buffing pad 306 (i.e., the diameter at the surface facing the bonding base 310 is larger than the diameter at the surface facing the buffing pad 306). The pad retention feature 306C is cylindrical with a diameter slightly larger than that of the support plate retention feature 315C so that the pad retention feature 306C is compressed when inserted into the support plate retention feature 315C. The bonding base 310, lip ring 321, and support plate 315 may be formed of a plastic or polymer such as polyetheretherketone (PEEK). The buffing pad 306 may be securely supported using a mechanical clamping mechanism including a lip periphery 322 of the lip ring 321, a tapered portion 324 on the periphery of the support plate 315, the support plate retention feature 315C, and the pad retention feature 306C. One circular support plate retention feature 315C and one cylindrical pad retention feature 306C are shown in Figures 4B and 4C. 3F, the support plate 315 may have multiple support plate retention features 315C, each of which receives one pad retention feature 306C and creates a retention force that holds the buffing pad 306 in position relative to the pad carrier 314. The pad retention features 306C may be any raised shape, and the support plate retention features 315C have a shape that matches the shape of the pad retention features 306C such that the pad retention features 306C and the support plate retention features 315C form an overlap and / or interference fit that is used to hold the buffing pad 306.

[0048]

[0059] 4D is a side cross-sectional view of another embodiment of a pad carrier 314. Similar to the embodiment shown in FIG. 4C, the pad carrier 314 includes a central support plate retaining feature 315C, with a pad retaining feature 306C pressed into the support plate retaining feature 315C. In this embodiment, a backing 330 that contacts the buffing pad 306 is disposed on the surface of the buffing pad 306. The backing 330 may be disposed on the surface of the buffing pad 306 facing the support plate 315. The backing 330 may be formed of plastic and adds rigidity to the buffing pad 306, further preventing sagging of the buffing pad 306. In some embodiments, the raised pad retaining feature 306C may include a cavity or hole 327 in the upper surface of the pad retaining feature 306C, into which a puck 328 that matches the shape of the hole 327 can be inserted. The hole in the pad can be any shape, preferably a shape that matches the shape of the pad retention feature 306C, and the puck 328 has a shape that matches the shape of the hole 327 but is slightly wider in diameter so that the hole 327 in the pad retention feature 306C and the puck 328 form an overlap and / or interference fit that is used to further form an enhanced pressure fit between the pad retention feature 306C and the support plate retention feature 315C. In this embodiment, the puck 328 may be formed from a plastic or polymer such as polyetheretherketone (PEEK) or other solid chemically resistant material such as ceramic, aluminum, or stainless steel.

[0049]

[0060] 4E and 4F are top views of a buffing pad 306 according to another embodiment. In these embodiments, the buffing pad 306 has raised pad retention features 306C formed on the surface of the buffing pad 306 facing the support plate 315. The support plate 315 has multiple support plate retention features 315C, each of which engages one of the pad retention features 306C. The pad retention features 306C of the buffing pad 306 are positioned to be inserted into the support plate retention features 315C of the support plate 315 and overlap and contact each other to create a retention force that holds the buffing pad 306 to the pad carrier 314. In FIG. 4E, the multiple raised pad retention features 306C are pillar-shaped, and each of the pad retention features 306C engages a corresponding support plate retention feature 315C of the support plate 315. In FIG. 4F, the pad retention feature 306C includes a central pad retention feature 306C in the shape of a pillar that engages with a circular support plate retention feature 315C that matches the shape of the pillar, and the pad retention feature 306C also includes radial spokes, each of which engages with a rectangular slot-shaped support plate retention feature 315C that matches the shape of the radial spokes.

[0050]

[0061] The embodiments described herein provide a pad carrier that supports large, thick, absorbent buffing pads, such as buffing pads made of polyvinyl alcohol (PVA) material, while preventing sagging of the buffing pads through a mechanical clamping mechanism during chemical mechanical cleaning. Buffing pads made of polyvinyl alcohol (PVA) material provide high shear forces for chemical mechanical polishing due to their mechanical strength and abrasion resistance. Large buffing pads improve cleaning performance.

[0051]

[0062]

[0006] Embodiments of the present disclosure may also provide a horizontal pre-cleaning module. The horizontal pre-cleaning module includes: a chamber including a water collection area and a lid that collectively define a processing region; a rotary vacuum table disposed in the processing region and including a substrate receiving surface; a pad conditioning station disposed proximate to the rotary vacuum table; a pad carrier positioning arm having a first end and a second end distal to the first end; a pad carrier assembly coupled to the first end of the pad carrier positioning arm; and an actuator coupled to the second end of the pad carrier positioning arm and configured to move the pad carrier assembly between a first position on the rotary vacuum table and a second position on the pad conditioning station. The pad carrier assembly includes a bonding base and a pad carrier coupled to the bonding base, and the bonding base and the pad carrier are configured to support a buffing pad via a mechanical clamping mechanism.

[0052]

[0063] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof as determined by the following claims.

Claims

1. 1. A pad carrier for use in a polishing or cleaning process, comprising: a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm, A clamping plate including a clamping body, the clamping body comprising: a first retaining surface disposed on a first side of the clamp body; a clamp plate including: A support plate including a support body, the support body comprising: a second holding surface disposed on the first side of the support body; Multiple support plate holding features and a support plate including Equipped with the first side surface of the clamp body and the first side surface of the support body face each other; Pad Carrier Assembly wherein each of the plurality of support plate retention features is configured to engage with a pad retention feature formed on the buffing pad when a lip portion provided on a periphery of the buffing pad opposite the polishing surface of the buffing pad is sandwiched between the first retention surface and the second retention surface.

2. The pad carrier further comprises a bonding base including a bonding plate body, the bonding plate body including one or more ferromagnetic or paramagnetic material-containing elements disposed within the bonding plate body; the clamp body further comprising one or more ferromagnetic or paramagnetic material-containing elements disposed within the clamp body; each of the one or more ferromagnetic or paramagnetic material-containing elements in the binding plate body of the binding base is configured to face each of the one or more ferromagnetic or paramagnetic material-containing elements in the clamp body of the clamping plate when the binding base is positioned on the second side of the clamp body of the clamping plate; the second side of the clamp body of the clamp plate is opposite the first side of the clamp body; The pad carrier of claim 1 .

3. The pad carrier of claim 2 , wherein the one or more ferromagnetic or paramagnetic material-containing elements of the coupling base or the clamping plate include a ferromagnetic or paramagnetic material-containing element formed in a toroidal shape.

4. A pad carrier as described in claim 2, wherein the one or more ferromagnetic or paramagnetic material-containing elements of the bonding base or the clamping plate include an array of ferromagnetic-containing elements having magnetic properties.

5. 2. The pad carrier of claim 1, wherein the support plate further includes one or more interlocking features on a periphery of the second support surface, the interlocking features assisting in retaining the lip portion between the first support surface and the second support surface.

6. 2. The pad carrier of claim 1, wherein the pad retention feature is formed in an inverted cone shape and the support plate retention feature is formed in a countersunk configuration such that a top of the pad retention feature overlaps a bottom of the support plate retention feature.

7. 1. A pad carrier for use in a cleaning process, comprising: a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm, A coupling base comprising a coupling body, the coupling body comprising: an array of magnets disposed within the coupling body; a first retaining surface disposed on a first side of the coupling body; a binding base including: A support plate including a support body, the support body comprising: an array of magnets disposed within the support body; a second holding surface disposed on the first side of the support body; Multiple support plate holding features and a support plate including Equipped with the first side surface of the coupling body and the first side surface of the support body face each other; Pad Carrier Assembly Equipped with each of the plurality of support plate retention features is configured to engage with a pad retention feature formed on the buffing pad when a lip portion provided on a periphery of the buffing pad on a side opposite to the polishing surface of the buffing pad is sandwiched between the first retention surface and the second retention surface; each magnet in the array of magnets in the coupling body of the coupling base is configured to face each magnet in the array of magnets in the support body of the support plate when the coupling base is positioned on the first side of the support body of the support plate; Pad carrier.

8. The pad carrier of claim 7 , wherein the array of magnets in the coupling body of the coupling base or the magnets in the support body of the support plate include ferromagnetic or paramagnetic containing elements.

9. The pad carrier of claim 7 , wherein the array of magnets in the coupling body of the coupling base and the array of magnets in the support body of the support plate are formed in a toroidal shape.

10. 8. The pad carrier of claim 7, wherein the pad retention features are formed in an inverted cone shape and the support plate retention features are formed in a countersunk configuration, such that the top of each of the pad retention features overlaps the bottom of each of the support plate retention features.

11. The pad carrier further comprises a coupling base including a coupling body including an array of magnets disposed within the coupling body; the clamp body further comprising an array of magnets disposed within the clamp body; when the coupling base is positioned on the second side of the clamp body of the clamp plate, each magnet in the array of magnets in the coupling body faces each magnet in the array of magnets in the clamp body of the clamp plate; the second side of the clamp body of the clamp plate is opposite the first side of the clamp body; The pad carrier of claim 1 .

12. The pad carrier of claim 11 , wherein the array of magnets in the coupling body of the coupling base or the array of magnets in the clamping body of the clamping plate includes ferromagnetic or paramagnetic containing elements.

13. The pad carrier of claim 11 , wherein the array of magnets in the coupling body of the coupling base and the array of magnets in the support body of the support plate are formed in a toroidal shape.

14. 1. A pad carrier for use in a polishing or cleaning process, comprising: a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm, A coupling base comprising a coupling body, the coupling body comprising: a first holding surface disposed on a first side of the coupling body; a binding base including: A support plate including a support body, the support body comprising: a second holding surface disposed on the first side of the support body; Multiple support plate holding features and a support plate including Equipped with the first side surface of the coupling body and the first side surface of the support body face each other; Pad Carrier Assembly Equipped with A pad carrier, wherein each of the plurality of support plate retaining features is configured to engage with a pad retaining feature formed on the buffing pad when a lip portion provided on the periphery of the buffing pad opposite the polishing surface of the buffing pad is clamped between the first retaining surface and the second retaining surface.

15. 15. The pad carrier of claim 14, wherein the support body has a plurality of countersunk screw holes arranged therein, each of the plurality of countersunk screw holes configured to receive a fastener, and the support body is configured to be coupled to the coupling base via the plurality of fasteners and the plurality of countersunk screw holes.

16. 15. The pad carrier of claim 14, wherein the pad retention features are formed in an inverted cone shape and the support plate retention features are formed in a countersunk configuration such that a top of each of the pad retention features overlaps a bottom of each of the support plate retention features.

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