Fluid control device for vacuum removal in wafer polishing equipment

Abstract

To provide a fluid control device for vacuum removal of a wafer polishing facility.SOLUTION: This fluid control device comprises: a linear driver that drives a positioning pedestal so as to vertically move; a plurality of conduits respectively installed in the positioning pedestals; several elastic covers that respectively cover the conduits; an adaptor pedestal installed on a holding base; and several flow diverters spaced apart from each other on the holding base. Several relay paths are formed inside the adaptor pedestal. The elastic covers are formed sequentially corresponding to the upper and lower relay paths. The other ends of the relay paths are made to communicate with some relay tubes. Each relay tube is made to communicate with each flow diverter. The individual flow diverters are connected to some transportation tubes in a corresponding manner. Thus, control is performed so as to cause a fluid to enter between an upper polishing tray of a wafer polishing facility and a waver thin plate which receives its polishing.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an assembly part of a wafer polishing equipment, and more particularly to a fluid control device for vacuum removal of a wafer polishing equipment. After the polishing process of the wafer thin plate is completed, the fluid control device controls the fluid to enter between the upper polishing tray and the polished wafer thin plate, thereby releasing the state in which the upper polishing tray and the wafer thin plate are mutually adsorbed. [Background technology]

[0002] Wafer polishing equipment is a type of equipment for polishing wafer thin plates, and is equipped with a wafer holder driving mechanism, an upper polishing tray, and a lower polishing tray, among which one to several unequal wafer thin plates are placed on the wafer holder, and a robot arm transfers one to several unequal wafer holders to the wafer holder driving mechanism, and the upper polishing tray and the lower polishing tray perform polishing processing on the upper and lower surfaces of each of the wafer thin plates, respectively.

[0003] After one polishing process is completed, the operation of the upper polishing tray, the lower polishing tray, and the wafer holder drive mechanism is stopped, and the upper polishing tray is raised to expose the wafer holder, and the robot arm can replace the wafer holder on which the wafer thin plate is placed.

[0004] When polishing of the upper surface located below the upper polishing dish is completed, the vacuum suction phenomenon causes the upper polishing dish and the wafer thin plate to adhere to each other, making it difficult to separate them.In order to prevent this from happening, when the upper polishing dish rises and the wafer thin plate moves upward along with it, it is necessary to inject a fluid between the upper polishing dish and the upper surface after the polishing process is completed.By releasing the mutual adsorption between the upper polishing dish and the wafer thin plate, the mutual adsorption between the upper polishing dish and the wafer thin plate is prevented, which causes the wafer thin plate to move upward along with the upper polishing dish.The fluid may be water or air, and the operation of injecting the fluid to release the mutual adsorption between the upper polishing dish and the wafer thin plate is usually called vacuum removal.

[0005] The fluid control device for controlling the fluid to perform the vacuum removal comprises several linear actuators, several positioning pedestals, several flow guide pipes, several flow diverters, and several transport pipes, wherein the linear actuators are installed at intervals on the wafer polishing equipment, which provides a machine frame, machine stand, or other assembly part for installing and positioning each component, the flow diverters are arranged at intervals along a circular path, the positioning pedestals are respectively connected to the linear actuators, and the linear actuators move closer to or farther away from the top edge of the upper polishing tray in response to driving the positioning pedestals to move up and down, and the flow guide pipes are respectively Each of the positioning pedestals is positioned on the upper polishing tray, and each of the flow pipes is connected to a fluid source, and each of the flow pipes is formed to be vertically opposite each of the flow diverters. When each of the positioning pedestals is lowered, each of the flow pipes is connected to each of the flow diverters, and when each of the positioning pedestals is raised, each of the flow pipes is separated from each of the flow diverters. Each of the flow diverters is arranged at intervals along a separate circular path, and each of the flow diverters is correspondingly connected to several of the transport pipes, and each of the transport pipes is connected to one of several passages inside the upper polishing tray, and each of the passages extends to the bottom end of the upper polishing tray.

[0006] After the polishing process is completed, each linear driver drives each positioning platform to descend toward the top edge of the upper polishing tray, and each of the flow guide pipes is connected to each of the flow diverters, and then the fluid passes through each of the flow guide pipes and enters each of the flow diverters, and the fluid is diverted and flows into each of the flow diverters, passes through each of the transport pipes and each of the passages and is released between the upper polishing tray and the wafer thin plate, and the fluid releases the mutual adsorption state between the upper polishing tray and the wafer thin plate and forms a pressing and abutting action against the upper polishing tray and the wafer thin plate, and the wafer polishing equipment is used to synchronize with the operation of a drive device that brakes the rise and fall of the upper polishing tray, controls the upper polishing tray to rise and prevents the wafer thin plate from rising along with the upper polishing tray, and separates the upper polishing tray and the wafer thin plate from each other.

[0007] In order to enable the fluid to be released in a balanced manner at multiple points onto the bottom edge of the upper polishing dish, each of the flow diverters is arranged at intervals along the circular path, and the axial direction of the upper polishing dish extends through the radial center of the circular path, and each of the positioning pedestals is arranged at intervals to match each of the flow diverters and is opposite each of the flow diverters above and below, which complicates the arrangement of each of the positioning pedestals and each of the flow guide pipes. Summary of the Invention [Problem to be solved by the invention]

[0008] An elastic cover body is formed at the end of each of the flow conduits. When each of the flow conduits is lowered and connected to each of the flow diverters, each cover body is pressed against each of the flow diverters to form a tight fit. When the fluid passes through each of the flow conduits and each of the cover bodies and enters each of the flow diverters, the dynamic pressure of the fluid prevents each cover body from separating from its corresponding flow diverter. To prevent this, each cover body undergoes repeated elastic deformation and recovery over a long period of use, gradually causing elastic fatigue. The elastic material constituting the cover body becomes brittle over time, making it necessary to replace each cover body in a timely manner. However, because the multiple positioning pedestals and multiple flow conduits are arranged at intervals along a circular path, the operator must necessarily move around the radial exterior of the upper polishing dish to sequentially maintain or replace each of the flow conduits or each cover body, which creates inconvenience in maintenance and assembly replacement.

[0009] SUMMARY OF THE INVENTION It is a primary object of the present invention to provide a fluid control system for vacuum removal in wafer polishing equipment. [Means for solving the problem]

[0010] To achieve the above objectives, the present invention adopts the following technical solutions:

[0011] A fluid control device for vacuum removal of wafer polishing equipment, the wafer polishing equipment having an upper polishing tray used for polishing the upper surface of a wafer thin plate, the upper polishing tray having several passages penetrating therethrough, each of the passages extending to the top end and bottom end of the upper polishing tray, the fluid control device being used to control fluid to pass through each of the passages and enter between the upper polishing tray and the wafer thin plate, thereby releasing the mutual adsorption state between the upper polishing tray and the wafer thin plate, the fluid being water or air;

[0012] The fluid control device includes a linear actuator fixedly installed on the wafer polishing equipment, a positioning base connected to the linear actuator, several inlet pipes positioned and installed on the positioning base, an adapter base installed on a holder, and several diverters arranged at intervals on the holder, and the positioning base is located between the linear actuator and the top edge side of the upper polishing tray, and the linear actuator:

[0013] The positioning base is driven to move up and down, thereby approaching or moving away from the top edge of the upper polishing dish, each of the flow tubes is connected to a fluid supply source and extends toward the top edge of the upper polishing dish, several elastic covers are respectively fitted to one end of each of the flow tubes facing the top edge, and each of the elastic covers has a conical space formed therein that communicates with each of the flow tubes, and the holding base is connected to the upper polishing dish,

[0014] a plurality of relay passages formed inside the adapter base in accordance with each of the flow guide pipes, one end of each relay passage extending to the top edge of the adapter base, each of the conical spaces corresponding to each of the relay passages in the vertical direction, the other end of each relay passage extending to one side of the adapter base and connected to several relay pipes, each of the relay pipes connected to each of the flow dividers, each of the flow dividers corresponding to several transport pipes, each of the transport pipes connected to each of the passages, allowing the fluid to pass through each of the passages and enter between the upper polishing tray and the wafer thin plate. [Effects of the Invention]

[0015] The main effects and advantages of the present invention are that the flow pipes are positioned centrally on one positioning base, simplifying the arrangement of the positioning base and the flow pipes, and the relay pipes are connected centrally to the adapter base, allowing an operator to maintain and replace each of the flow pipes and each of the elastic covers simply by being near the positioning base, thereby improving the convenience of maintenance and replacement of assembly parts. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a perspective view showing the arrangement of a preferred embodiment of the present invention in a wafer polishing facility. [Figure 2] FIG. 2 is a partially enlarged view of FIG. [Figure 3] 1 is a partial front view of a preferred embodiment of the present invention, in which the obstruction wall is partially cut away. [Figure 4] FIG. 4 is a cross-sectional view taken along line 4-4 in FIG. [Figure 5] 1 is a partial front view of a preferred embodiment of the present invention in an operating state, in which the obstruction wall is partially cut away. DETAILED DESCRIPTION OF THE INVENTION

[0017] Referring to the accompanying drawings, which show preferred embodiments of the fluid control device for vacuum removal in wafer polishing equipment of the present invention, these embodiments are for illustrative purposes only, and the claims are not limited to this structure.

[0018] As shown in Figure 1, the wafer polishing equipment has an upper polishing tray 11 used to polish the upper surface of a wafer thin plate (not shown in the figure), and several passages (not shown in the figure) are formed through the upper polishing tray 11, each of which extends to the top and bottom ends of the upper polishing tray 11, respectively.The fluid control device is used to control the fluid to pass through each of the passages and enter between the upper polishing tray 11 and the wafer thin plate, thereby releasing the mutual adsorption state between the upper polishing tray 11 and the wafer thin plate, and the fluid may be water or air.

[0019] As shown in Figures 1 to 5, a preferred embodiment of such a fluid control device comprises a linear actuator 20, a positioning base 30, several flow guide pipes 40, an adapter base 50, and several flow diverters 60, of which the linear actuator 20 is configured using a pneumatic cylinder or a hydraulic cylinder, and the linear actuator 20 is fixedly installed on the frame or base of the wafer polishing equipment, or on other structures used to position and install various assembly components. In this example, the linear actuator 20 is selectively installed on the tray base 12, and the positioning base 30 is connected to the linear actuator 20. The positioning base 30 is located between the linear actuator 20 and the top edge side 13 of the upper polishing tray 11, and the linear actuator 20 drives the positioning base 30 to move up and down, thereby moving the positioning base 30 closer to or away from the top edge side 13.

[0020] Each of the flow pipes 40 is positioned and installed on the positioning base 30, and each of the flow pipes 40 is connected to a fluid supply source (not shown in the figure). Each of the flow pipes 40 extends toward the top edge side 13 of the upper polishing dish 11. Several elastic covers 42 are fitted to one end of each of the flow pipes 40 facing the top edge side 13, and each of the elastic covers 42 has a conical space 44 formed therein that connects each of the flow pipes 40.

[0021] The adapter base 50 is installed on the holder 14, and the holder 14 is connected to the upper polishing dish 11 so that the holder 14 can rotate and stop rotating together with the upper polishing dish 11. The adapter base 50 may be made of a resin material. Several relay paths 52 are formed inside the adapter base 50 to match each of the flow guide pipes 40, and one end of each relay path 52 extends to the top edge of the adapter base 50. Each of the conical spaces 44 is formed to correspond sequentially to each of the relay paths 52, and the other end of each relay path 52 extends to one side of the adapter base 50 and is connected to several relay pipes 54.

[0022] The diverters 60 are spaced apart on the support table 14, and each of the relay pipes 54 is connected to a corresponding diverter 60. Each diverter 60 is connected to several transport pipes 62, and each of the transport pipes 62 is connected to a corresponding passage, allowing the fluid to pass through each passage and enter between the upper polishing tray 11 and the wafer thin plate.

[0023] When the polishing process of the wafer thin plate is completed, the upper polishing tray 11 and the holder 14 stop rotating synchronously, and by using a drive device that controls the rotation of the upper polishing tray 11, each of the relay paths 52 can be positioned corresponding to the lower part of each of the flow pipes 40. Thereafter, the linear actuator 20 drives the positioning base 30 to lower, so that each of the elastic covers 42 can cover the top edge of each of the adapter bases 50. Each of the flow pipes 40 passes through each of the elastic covers 42 and communicates with each of the relay paths 52 so that an adsorption state can be formed between each of the elastic covers 42 and the adapter base 50 due to the material elasticity of each of the elastic covers 42. The fluid passes through each of the flow guide pipes 40, each of the relay paths 52 and each of the relay pipes 54 and flows into each of the diverters 60, and the subsequent diverted flow of the fluid that enters each of the diverters 60 passes through each of the transport pipes 62 and enters between the upper polishing tray 11 and the wafer thin plate, releasing the mutual adsorption state between the upper polishing tray 11 and the wafer thin plate, and the fluid forms a pressing and abutting action against the upper polishing tray 11 and the wafer thin plate, respectively. The wafer polishing equipment is used to synchronize with the operation of a drive device that brakes the rise of the upper polishing tray 11, controlling the upper polishing tray 11 to rise and separate from the wafer thin plate, and preventing the wafer thin plate from rising along with the upper polishing tray 11.

[0024] The flow pipes 40 are positioned together on one positioning base 30, simplifying the arrangement of the positioning base 30 and the flow pipes 40, and the relay pipes 54 are connected together to one adapter base 50, so that when performing maintenance or replacement of the flow pipes 40 and the elastic covers 42, an operator only needs to be near the positioning base 30 to perform maintenance or replacement of the individual flow pipes 40 and the individual elastic covers 42, thereby improving the convenience of maintenance and replacement of assembly parts.

[0025] The positioning base 30 has a support base 32, each of the flow tubes 40 is positioned on the support base 32, each of the elastic covers 42 is located between the support base 32 and the adapter base 50, and each of the elastic covers 42 is closely adjacent to the support base 32.

[0026] Each side of the support base 32 is connected to two contact pressure elements 34, each extending toward the adapter base 50. The linear actuator 20 drives the positioning base 30 to move downward. When each contact pressure element 34 contacts the adapter base 50, the adapter base 50 can urge the linear actuator 20 to stop operating by the force that passes through each contact pressure element 34 and feeds back toward the positioning base 30, thereby avoiding excessive compressive deformation of each elastic cover 42 and improving the service life of each elastic cover 42.

[0027] The two obstruction walls 70 respectively abut on opposite sides of the adapter base 50, and each of the elastic covers 42 is located between each of the obstruction walls 70. More specifically, each of the obstruction walls 70 is an annular plate, and each of the obstruction walls 70 is installed coaxially, and the axial direction of the upper grinding tray 11 extends through the radial center of each of the obstruction walls 70. The obstruction walls 70 shown in Figures 3 and 5 are partially cut out, which is convenient for displaying each of the elastic covers 42.

[0028] When water is selected as the fluid and the fluid passes through the elastic cover 42 and enters the relay path 52, if a small amount of the fluid passes between the elastic cover 42 and the adapter base 50 and splashes outward, each of the obstruction walls 70 will form an obstruction barrier against the fluid, preventing other structures or assembly parts surrounding the preferred embodiment of the wafer polishing equipment from being affected by the fluid. For example, each of the obstruction walls 70 can prevent the fluid from splashing outward and causing contamination to the cutting fluid. [Explanation of symbols]

[0029] 11: Upper polishing plate 12:Plate pedestal 13: Apex side 14: Holding stand 20: Linear drive 30: Positioning base 32: Support stand 34: Contact pressure element 40: Flow guide tube 42: Elastic cover 44: Cone-shaped space 50: Adapter base 52: Relay route 54: Relay pipe 60: Flow divider 62: Transport pipe 70: Obstruction Wall

Claims

1. A fluid control device for vacuum removal of wafer polishing equipment, the wafer polishing equipment having an upper polishing tray used for polishing the upper surface of a wafer thin plate, the upper polishing tray having several passages penetrating therethrough, each of the passages extending to the top end and bottom end of the upper polishing tray, the fluid control device being used to control fluid to pass through each of the passages and enter between the upper polishing tray and the wafer thin plate, thereby releasing the mutual adsorption state between the upper polishing tray and the wafer thin plate, the fluid being water or air; The fluid control device includes a linear actuator fixed to the wafer polishing equipment, a positioning base connected to the linear actuator, several flow pipes positioned and installed on the positioning base, an adapter base installed on a holder, and several flow diverters arranged at intervals on the holder, the positioning base being located between the linear actuator and the top edge of the upper polishing tray, the linear actuator driving the positioning base to move the positioning base up and down, thereby moving the positioning base closer to or farther away from the top edge of the upper polishing tray, each of the flow pipes being connected to a supply source of the fluid, each of the flow pipes extending toward the top edge of the upper polishing tray, several elastic covers being fitted to one end of each of the flow pipes facing the top edge, each of the front and rear ends of the flow pipes being fitted to one end of the flow pipes facing the top edge, a plurality of conical spaces formed inside the elastic covers, each of which communicates with each of the guide pipes; the holder connected to the upper polishing tray; several relay passages formed inside the adapter base to correspond to each of the guide pipes; one end of each relay passage extending to the top edge of the adapter base; each of the conical spaces corresponding to each of the relay passages, one above the other; the other end of each relay passage extending to one side of the adapter base and communicating with several relay pipes; each of the relay pipes communicating with each of the diverters; each of the diverters corresponding to several transport pipes, each of the transport pipes communicating with each of the passages, allowing the fluid to pass through each of the passages and enter between the upper polishing tray and the wafer thin plate.

2. 2. The fluid control device for vacuum removal of wafer polishing equipment as described in claim 1, characterized in that the positioning base has a support base, each of the flow pipes is positioned on the support base, a portion of each of the elastic covers is located between the support base and the adapter base, and each of the elastic covers is closely adjacent to the support base.

3. The fluid control device for vacuum removal of wafer polishing equipment as described in claim 2, characterized in that both sides of the support base are connected to two contact pressure elements, and each of the contact pressure elements extends toward the adapter base.

4. 4. A fluid control device for vacuum removal of wafer polishing equipment as described in claim 1, claim 2 or claim 3, characterized in that two obstruction walls abut on opposite sides of the adapter base, respectively, and each of the elastic covers is located between each of the obstruction walls.

5. 5. The fluid control device for vacuum removal of wafer polishing equipment as described in claim 4, characterized in that each of the coaxially installed obstruction walls is an annular plate, and the extension of the rotation axis of the upper polishing tray passes through the radial center of each of the obstruction walls.

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