Sensors and Sensor Systems

Abstract

To provide a sensor and a sensor system that can improve characteristics.SOLUTION: A sensor comprises an element portion including a first base and a first element. The first element includes a first fixed member fixed to the first base, a first connecting member supported by the first fixed member, and a first film portion supported by the first connecting member. A first gap is provided between the first base and the first film portion. The first film portion includes a first resistance layer, a first conductive layer, and a first conductive member. The first resistance layer does not overlap the first conductive layer in a first direction from the first base to the first fixed member. The first conductive member overlaps the first resistance layer and the first conductive layer in the first direction. First electrical resistance of the first resistance layer changes according to a state of a detection target around the first element.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD OF THE INVENTION Embodiments of the present invention relate to sensors and sensor systems. [Background technology]

[0002] For example, there is a sensor for detecting gas, and it is desirable to improve the characteristics of the sensor. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-152451 Summary of the Invention [Problem to be solved by the invention]

[0004] Embodiments of the present invention provide sensors and sensor systems that can provide improved performance. [Means for solving the problem]

[0005] According to an embodiment of the present invention, a sensor includes an element unit including a first base and a first element. The first element includes a first fixing member fixed to the first base, a first connecting member supported by the first fixing member, and a first membrane unit supported by the first connecting member. A first gap is provided between the first base and the first membrane unit. The first membrane unit includes a first resistive layer, a first conductive layer, and a first conductive member. The first resistive layer does not overlap the first conductive layer in a first direction from the first base to the first fixing member. The first conductive member overlaps the first resistive layer and the first conductive layer in the first direction. A first electrical resistance of the first resistive layer changes depending on the state of a detection target around the first element. [Brief explanation of the drawings]

[0006] [Figure 1]FIG. 1 is a schematic plan view illustrating the sensor according to the first embodiment. [Figure 2] 2A and 2B are schematic cross-sectional views illustrating the sensor according to the first embodiment. [Figure 3] 3A and 3B are schematic cross-sectional views illustrating the sensor according to the first embodiment. [Figure 4] 4A and 4B are schematic cross-sectional views illustrating the sensor according to the first embodiment. [Figure 5] FIG. 5 is a schematic plan view illustrating a part of the sensor according to the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, etc. are not necessarily the same as those in reality. Even when the same part is shown, the dimensions and ratios may be different depending on the drawing. In this specification and in each drawing, elements similar to those previously described with reference to the previous drawings are designated by the same reference numerals, and detailed descriptions thereof will be omitted where appropriate.

[0008] (First embodiment) FIG. 1 is a schematic plan view illustrating the sensor according to the first embodiment. 2A and 2B are schematic cross-sectional views illustrating the sensor according to the first embodiment. Fig. 2(a) is a cross-sectional view taken along the line A1-A2 in Fig. 1. Fig. 2(b) is a cross-sectional view taken along the line A3-A4 in Fig. 1.

[0009] 1, 2(a) and 2(b), a sensor 110 according to the embodiment includes an element section 10E. The element section 10E includes a first base body 51s and a first element 10A.

[0010] The first substrate 51s may include, for example, a silicon substrate, etc. The first substrate 51s may include an electronic circuit such as a transistor.

[0011] The first element 10A includes a first fixing member 21F fixed to the first base 51s, a first connecting member 21C supported by the first fixing member 21F, and a first membrane portion 11F supported by the first connecting member 21C.

[0012] A first gap g1 is provided between the first base 51s and the first film portion 11F. A first direction D1 from the first base 51s to the first fixing member 21F is defined as the Z-axis direction. A direction perpendicular to the Z-axis direction is defined as the X-axis direction. A direction perpendicular to the Z-axis direction and the X-axis direction is defined as the Y-axis direction.

[0013] The first base 51s includes a first surface 51F. The first surface 51F is along the XY plane. The first fixing member 21F is fixed to the first surface 51F.

[0014] The first film portion 11F includes a first resistance layer 11a, a first conductive layer 11b, and a first conductive member 11c. The first resistance layer 11a does not overlap with the first conductive layer 11b in the first direction D1. The first conductive member 11c overlaps with the first resistance layer 11a and the first conductive layer 11b in the first direction D1.

[0015] Since the first resistance layer 11a does not overlap the first conductive layer 11b, for example, electromagnetic coupling between the first resistance layer 11a and the first conductive layer 11b is suppressed.

[0016] The first electrical resistance R1 of the first resistance layer 11a changes depending on the state of the detection target around the first element 10A.

[0017] As shown in FIG. 1, the sensor 110 may be provided with a control unit 70. The control unit 70 may be included in the sensor 110. The control unit 70 may be provided separately from the sensor 110. The control unit 70 is capable of supplying a first power to the first conductive layer 11b and detecting a first electrical resistance R1. The supply of the first power increases the temperature of the first film portion 11F. The first conductive member 11c overlaps with the first resistance layer 11a and the first conductive layer 11b, thereby efficiently conducting heat from the first conductive layer 11b to the first resistance layer 11a. The first conductive member 11c functions as a thermal conductor.

[0018] Heat from the first film portion 11F propagates, for example, from the first film portion 11F to its surroundings. Part of the heat propagates to the first base 51s via the first gap g1. Another part of the heat propagates upward from the first film portion 11F. The first conductive member 11c may function as a heat sink.

[0019] For example, heat propagation (heat dissipation) changes depending on the state of the detection target around the first element 10A. The detection target is, for example, a gas. For example, the thermal conductivity of the gas around the first element 10A depends on the elements (and / or molecules) contained in the gas and their concentration. The heat dissipation property changes depending on the state of the detection target (type and concentration of gas), and as a result, the first electrical resistance R1 of the first resistance layer 11a changes. By detecting the first electrical resistance R1, the state of the detection target (changes in the gas and gas concentration) can be detected.

[0020] As described above, in the embodiment, in a state in which the temperature of the first film portion 11F is increased by the first power supplied to the first conductive layer 11b, the first electrical resistance R1 changes depending on the state of the detection object.

[0021] The detection target is present in the first gap g1. The first electrical resistance R1 changes depending on the state of the detection target between the first base 51s and the first film portion 11F.

[0022] In such a sensor 110, when the first resistive layer 11a overlaps with the first conductive layer 11b, it has been found that the signal obtained from the first resistive layer 11a (the signal corresponding to the first electrical resistance R1) is likely to contain noise. For example, due to a temperature rise, a large current is supplied to the first conductive layer 11b. It is believed that the noise contained in the large current causes noise in the signal obtained from the first resistive layer 11a.

[0023] In the embodiment, the first resistance layer 11a and the first conductive layer 11b are arranged so as not to overlap each other in the first direction D1. This suppresses coupling and reduces noise. The provision of the first conductive member 11c allows the temperature of the first resistance layer 11a to be efficiently and uniformly increased. Noise is suppressed in the signal obtained from the first resistance layer 11a. This allows the detection target to be detected with high accuracy. The embodiment can provide a sensor with improved characteristics.

[0024] The potential of the first conductive member 11c may be fixed. For example, the potential of the first conductive member 11c is fixed to ground potential. This further reduces the influence on the first resistance layer 11a from the first conductive layer 11b via the first conductive member 11c. Noise can be further reduced. The first conductive member 11c with a fixed potential functions as a shield. The detection object can be detected with higher accuracy.

[0025] In the embodiment, for example, when the first power is supplied, the first conductive layer current flowing through the first conductive layer 11b is large. This allows the first film portion 11F to be heated effectively. On the other hand, when the first electrical resistance R1 is detected, the first resistive layer current flowing through the first resistive layer 11a is relatively small. For example, the first conductive layer current is larger than the first resistive layer current.

[0026] When the first conductive layer current is larger than the first resistance layer current, noise is likely to occur. In the embodiment, even in such a state where noise is likely to occur, the first resistance layer 11a and the first conductive layer 11b do not overlap each other, thereby effectively suppressing noise.

[0027] For example, the first conductive layer current is at least twice the first resistive layer current, and may be at least five times the first resistive layer current.

[0028] The first conductive member 11c may be electrically connected to the first base 51s. The first base potential of the first base 51s may be substantially the same as the potential of the first conductive member 11c.

[0029] As shown in FIG. 2(a), in this example, the distance da1 between the first base 51s and the first resistance layer 11a along the first direction D1 is shorter than the distance db1 between the first base 51s and the first conductive layer 11b along the first direction D1. The first resistance layer 11a and the first conductive layer 11b are located between the first base 51s and the first conductive member 11c. The proximity of the first conductive layer 11b to the first conductive member 11c, for example, facilitates the spread of heat. The proximity of the first resistance layer 11a to the first gap g1 facilitates detection of changes in gas in the first gap g1. As will be described later, the distance da1 may be substantially the same as the distance db1.

[0030] In the embodiment, the electrical resistance of the first conductive layer 11b may be lower than the electrical resistance of the first resistive layer 11a, and the first conductive layer 11b can be heated efficiently.

[0031] The material of the first conductive layer 11b may be substantially the same as the material of the first resistive layer 11a. For example, the first conductive layer 11b and the first resistive layer 11a may include at least one selected from the group consisting of Au, Al, Ti, TiN, and Pt.

[0032] As shown in FIG. 1, a portion of the first conductive member 11c overlaps with the first conductive layer 11b and the first resistance layer 11a in the first direction D1. The other portion of the first conductive member 11c does not overlap with the first conductive layer 11b and the first resistance layer 11a in the first direction D1. For example, in a plane (XY plane) intersecting the first direction D1, at least a portion of the outer edge 11r of the first conductive member 11c is outside the first conductive layer 11b and the first resistance layer 11a. For example, the area of ​​the first conductive member 11c is larger than the area of ​​the first conductive layer 11b and larger than the area of ​​the first resistance layer 11a. Such a first conductive member 11c makes the temperature of the first film portion 11F more uniform.

[0033] As shown in FIG. 1, the first connecting member 21C extends along the second direction D2. The second direction D2 intersects with the first direction D1. The width of the first connecting member 21C in the third direction D3 is defined as the first connecting member width w21C. The third direction D3 intersects with a plane including the first direction D1 and the second direction D2. The width of the first membrane portion 11F in the third direction D3 is defined as the first membrane portion width w11F. The first connecting member width w21C is narrower than the first membrane portion width w11F. This prevents heat from the first membrane portion 11F from propagating through the first connecting member 21C. The temperature of the membrane portion can be increased with low energy consumption.

[0034] 1 and 2(b), the first element 10A may further include a first other fixing member 21FA fixed to the first base 51s and a first other connecting member 21CA supported by the first other fixing member 21FA. The first other connecting member 21CA supports the first film portion 11F. A first conductive layer wiring 11bL electrically connected to the first conductive layer 11b passes through the first connecting member 21C and the first other connecting member 21CA. The control unit 70 may be electrically connected to the first conductive layer 11b via the first conductive layer wiring 11bL.

[0035] As shown in Figures 1, 2(a) and 2(b), the first element 10A may further include a first resistor fixing member 21aF fixed to the first base 51s, a first resistor connecting member 21aC supported by the first resistor fixing member 21aF, a first other resistor fixing member 21aFA fixed to the first base 51s, and a first other resistor connecting member 21aCA supported by the first other resistor fixing member 21aFA.

[0036] The first resistor connecting member 21aC and the first other resistor connecting member 21aCA support the first film portion 11F. The first resistor layer wiring 11aL electrically connected to the first resistor layer 11a passes through the first resistor connecting member 21aC and the first other resistor connecting member 21aCA. The control unit 70 may be electrically connected to the first resistor layer 11a via the first resistor layer wiring 11aL.

[0037] 1, the first element 10A may further include a first conductive fixing member 21cF fixed to the first base 51s and a first conductive connecting member 21cC supported by the first conductive fixing member 21cF. The first conductive connecting member 21cC supports the first film portion 11F. A first conductive member wiring 21cL electrically connected to the first conductive member 11c extends along the first conductive connecting member 21cC. The first conductive member 11c may be set to a fixed potential via the first conductive member wiring 21cL.

[0038] 3A and 3B are schematic cross-sectional views illustrating the sensor according to the first embodiment. 3(a) and 3(b) are cross-sectional views corresponding to the A1-A2 line and the A3-A4 line in FIG. 3(a) and 3(b), in the sensor 112 according to the embodiment, the first conductive member 11c is located between the first base 51s and the first resistance layer 11a, and between the first base 51s and the first conductive layer 11b. Except for this, the configuration of the sensor 112 may be similar to the configuration of the sensor 110.

[0039] By having the first conductive member 11c between the first base 51s and the first resistance layer 11a, and between the first base 51s and the first conductive layer 11b, for example, the number of wiring layers is reduced, making manufacturing easier.

[0040] 4A and 4B are schematic cross-sectional views illustrating the sensor according to the first embodiment. 4(a) and 4(b) are cross-sectional views corresponding to the A1-A2 line and the A3-A4 line in FIG. 4(a) and 4(b), in the sensor 113 according to the embodiment, the first film portion 11F further includes a first other conductive member 11cA. Except for this, the configuration of the sensor 113 may be similar to the configuration of the sensor 110.

[0041] In the sensor 113, the first other conductive member 11cA overlaps with the first resistance layer 11a and the first conductive layer 11b in the first direction D1. The first resistance layer 11a and the first conductive layer 11b are provided between the first conductive member 11c and the first other conductive member 11cA.

[0042] For example, the potentials of the first conductive member 11c and the first other conductive member 11cA are fixed. The potentials of the first conductive member 11c and the first other conductive member 11cA may be electrically connected to the first base 51s. The first other conductive member 11cA has, for example, a function of a ground plane. The first conductive member 11c has, for example, a function of a ground plane and a function of a heat sink. Noise can be further suppressed. Higher accuracy detection is possible.

[0043] FIG. 5 is a schematic plan view illustrating a part of the sensor according to the first embodiment. 5, in the sensor 120 according to the embodiment, the element unit 10E includes a second base 52s and a second element 10B in addition to the first base 51s and the first element 10A (omitted in FIG. 5) described with reference to FIG. 1. In the sensor 120, the configurations of the first base 51s and the first element 10A may be similar to those of the sensor 110.

[0044] The second element 10B includes a second fixing member 22F fixed to a second base 52s, a second connecting member 22C supported by the second fixing member 22F, and a second membrane portion 12F supported by the second connecting member 22C. The second base 52s may be continuous with the first base 51s. The boundary between the second base 52s and the first base 51s may be clear or unclear.

[0045] A second gap g2 is provided between the second base 52s and the second film portion 12F. The second film portion 12F includes a second resistance layer 12a. The control unit 70 is capable of outputting a value corresponding to the difference between the second electrical resistance R2 of the second resistance layer 12a and the first electrical resistance R1 (see FIG. 1). The control unit 70 includes, for example, a differential amplifier.

[0046] The second element 10B is, for example, a reference element. For example, the influence of fluctuations in the ambient temperature and the like is suppressed, enabling detection with higher accuracy.

[0047] In this example, the second film portion 12F includes a second conductive layer 12b. No power may be supplied to the second conductive layer 12b. The second conductive layer 12b may not be used for detection.

[0048] In this example, the second film portion 12F includes a second conductive member 12c. The second conductive member 12c overlaps, for example, the second resistance layer 12a and the second conductive layer 12b. For example, the potential of the second conductive member 12c may be fixed. The second conductive member 12c allows the temperature of the second film portion 12F to be uniform.

[0049] In the embodiment, the second conductive layer 12b and the second conductive member 12c may be omitted. Alternatively, the configuration of the second element 10B may be substantially the same as the configuration of the first element 10A. The first element 10A and the second element 10B have substantially the same heat capacity, enabling detection with higher accuracy.

[0050] In the sensor 120, the second element 10B may further include a second other fixing member 22FA fixed to the second base 52s and a second other connecting member 22CA supported by the second other fixing member 22FA. The second other connecting member 22CA supports the second membrane portion 12F. The second membrane portion 12F is supported more stably. Power may be supplied to the second conductive layer 12b via the second connecting member 22C and the second other connecting member 22CA.

[0051] In the sensor 120, the second element 10B may further include a second resistance fixing member 22aF fixed to the second base 52s, a second resistance connecting member 22aC supported by the second resistance fixing member 22aF, a second other resistance fixing member 22aFA fixed to the second base 52s, and a second other resistance connecting member 22aCA supported by the second other resistance fixing member 22aFA.

[0052] The second resistor connecting member 22aC and the second other resistor connecting member 22aCA support the second film portion 12F. A second electrical resistance R2 of the second resistor layer 12a may be detected via the second resistor connecting member 22aC and the second other resistor connecting member 22aCA.

[0053] (Second embodiment) The second embodiment relates to a sensor system. As shown in Fig. 1 to Fig. 5, sensor systems 210, 212, 213, and 220 according to the embodiment include sensors (sensors 110, 112, 113, and 120) according to the embodiment, and a communication unit 75. The communication unit 75 can transmit a signal corresponding to a change in the first electrical resistance R1. According to the embodiment, a low-noise sensor signal can be acquired from a remote location.

[0054] The communication unit 75 can supply signals to the outside, for example, by at least one of wired and wireless means. The communication unit 75 may also be able to acquire control signals from the outside. The control unit 70 may be controlled by control signals from the outside.

[0055] The embodiment may include the following configurations (e.g., technical solutions). (Configuration 1) an element portion including a first substrate and a first element; The first element is a first fixing member fixed to the first base; a first connecting member supported by the first fixing member; a first membrane portion supported by the first connection member; Including, a first gap is provided between the first base and the first film portion; the first film portion includes a first resistive layer, a first conductive layer, and a first conductive member; the first resistance layer does not overlap the first conductive layer in a first direction from the first base to the first fixing member, the first conductive member overlaps the first resistance layer and the first conductive layer in the first direction; A sensor in which the first electrical resistance of the first resistive layer changes depending on the state of an object to be detected around the first element.

[0056] (Configuration 2) The sensor of configuration 1, wherein when the temperature of the first film portion is increased by the first power supplied to the first conductive layer, the first electrical resistance changes depending on the state of the object to be detected.

[0057] (Configuration 3) The sensor according to configuration 1 or 2, wherein the first electrical resistance changes depending on the state of the detection target between the first substrate and the first film portion.

[0058] (Configuration 4) The sensor of any one of configurations 1 to 3, wherein the distance along the first direction between the first substrate and the first resistive layer is shorter than the distance along the first direction between the first substrate and the first conductive layer.

[0059] (Configuration 5) The sensor of any one of configurations 1 to 3, wherein the distance along the first direction between the first substrate and the first resistive layer is substantially the same as the distance along the first direction between the first substrate and the first conductive layer.

[0060] (Configuration 6) the first film portion further includes a first other conductive member, the first other conductive member overlaps the first resistance layer and the first conductive layer in the first direction; The sensor according to any one of configurations 1 to 5, wherein the first resistive layer and the first conductive layer are provided between the first conductive member and the first other conductive member.

[0061] (Configuration 7) 7. The sensor according to any one of configurations 1 to 6, wherein the first conductive member is electrically connected to the first substrate.

[0062] (Configuration 8) 8. The sensor according to any one of configurations 1 to 7, wherein a first substrate potential of the first substrate is substantially the same as the potential of the first conductive member.

[0063] (Configuration 9) The sensor according to any one of configurations 1 to 8, wherein the electrical resistance of the first conductive layer is lower than the electrical resistance of the first resistive layer.

[0064] (Configuration 10) The sensor according to any one of configurations 1 to 9, wherein at least one of the first conductive layer and the first resistive layer includes at least one selected from the group consisting of Au, Al, Ti, TiN, and Pt.

[0065] (Configuration 11) a portion of the first conductive member overlaps with the first conductive layer and the first resistive layer in the first direction; 11. The sensor according to any one of configurations 1 to 10, wherein the other portion of the first conductive member does not overlap the first conductive layer and the first resistive layer in the first direction.

[0066] (Configuration 12) The sensor of any one of configurations 1 to 11, wherein in a plane intersecting the first direction, at least a portion of the outer edge of the first conductive member is outside the first conductive layer and the first resistive layer.

[0067] (Configuration 13) the first connecting member extends along a second direction intersecting the first direction, A sensor described in any one of configurations 1 to 12, wherein the first connecting member width of the first connecting member in a third direction intersecting a plane including the first direction and the second direction is narrower than the first membrane portion width of the first membrane portion in the third direction.

[0068] (Configuration 14) The first element is a first other fixing member fixed to the first base; a first other connecting member supported by the first other fixing member; further comprising the first other connection member supports the first membrane portion, 14. The sensor according to any one of configurations 1 to 13, wherein a first conductive layer wiring electrically connected to the first conductive layer passes through the first connecting member and the first other connecting member.

[0069] (Configuration 15) The first element is a first resistor fixing member fixed to the first base; a first resistor connecting member supported by the first resistor fixing member; a first other resistor fixing member fixed to the first base; a first other resistor connecting member supported by the first other resistor fixing member; further comprising the first resistor connecting member and the first other resistor connecting member support the first film portion, 15. The sensor according to any one of configurations 1 to 14, wherein a first resistance layer wiring electrically connected to the first resistance layer passes through the first resistance connecting member and the first other resistance connecting member.

[0070] (Configuration 16) The first element is a first conductive fixing member fixed to the first base; a first conductive connecting member supported by the first conductive fixing member; further comprising the first conductive connection member supports the first film portion, 16. The sensor according to any one of configurations 1 to 15, wherein a first conductive member wiring electrically connected to the first conductive member extends along the first conductive connecting member.

[0071] (Configuration 17) Further comprising a control unit, the control unit is capable of supplying the first power to the first conductive layer; 3. The sensor according to claim 2, wherein the control unit is capable of outputting a signal corresponding to the first electrical resistance.

[0072] (Configuration 18) The sensor of configuration 17, wherein a first conductive layer current flowing through the first conductive layer during the supply of the first power is greater than a first resistive layer current flowing through the first resistive layer during the detection of the first electrical resistance.

[0073] (Configuration 19) the element portion further includes a second base and a second element, The second element is a second fixing member fixed to the second base; a second connecting member supported by the second fixing member; a second membrane portion supported by the second connection member; Including, a second gap is provided between the second base and the second film portion; the second film portion includes a second resistive layer, 19. The sensor of claim 17 or 18, wherein the control unit is capable of outputting a value corresponding to the difference between the second electrical resistance of the second resistive layer and the first electrical resistance.

[0074] (Configuration 20) The sensor according to configuration 1; a communication unit capable of transmitting a signal corresponding to the change in the first electrical resistance; A sensor system comprising:

[0075] According to the embodiment, a sensor and a sensor system capable of improving characteristics can be provided.

[0076] The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the specific configurations of each element included in the sensor and sensor system, such as the substrate, element unit, fixing member, connecting member, membrane unit, and control unit, are within the scope of the present invention as long as a person skilled in the art can implement the present invention in a similar manner and obtain similar effects by appropriately selecting them from known ranges.

[0077] Any combination of two or more elements of each embodiment to the extent technically possible is also included within the scope of the present invention as long as it encompasses the gist of the present invention.

[0078] In addition, all sensors and sensor systems that can be implemented by a person skilled in the art by appropriately modifying the design based on the sensors and sensor systems described above as embodiments of the present invention also fall within the scope of the present invention, as long as they include the gist of the present invention.

[0079] In addition, within the scope of the concept of the present invention, a person skilled in the art may come up with various modifications and alterations, and it will be understood that these modifications and alterations also fall within the scope of the present invention.

[0080] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0081] 10A, 10B: first and second elements, 10E: element portion, 11F, 12F: first and second film portions, 11a, 12a: first and second resistance layers, 11aL: first resistance layer wiring, 11b, 12b: first and second conductive layers, 11bL: first conductive layer wiring, 11c, 12c: first and second conductive members, 11cA: first other conductive member, 11r: outer edge, 21C, 22C: first and second connecting members, 21CA, 22CA: first and second other connecting members, 21F, 22F: first and second fixing members, 21FA, 22FA: first and second other fixing members, 21aC, 22aC: first and second resistance connecting members, 21aCA, 22aCA: first and second other resistor connecting members, 21aF, 22aF: first and second resistor fixing members, 21aFA, 22aFA: first and second other resistor fixing members, 21cC: first conductive connecting member, 21cF: first conductive fixing member, 21cL: first conductive member wiring, 51F: first surface, 51s, 52s: first and second bases, 70: control unit, 75: communication unit, 110, 112, 113, 120: sensors, 210, 212, 213, 220: sensor system, D1 to D3: first to third directions, da1, db1: distance, g1, g2: first and second gaps, w11F: first film portion width, w21C: first connecting member width

Claims

1. an element portion including a first base and a first element; The first element is a first fixing member fixed to the first base; a first connecting member supported by the first fixing member; a first membrane portion supported by the first connection member; Including, a first gap is provided between the first base and the first film portion; the first film portion includes a first resistive layer, a first conductive layer, and a first conductive member, the first resistance layer does not overlap the first conductive layer in a first direction from the first base to the first fixing member, the first conductive member overlaps the first resistance layer and the first conductive layer in the first direction; A sensor in which the first electrical resistance of the first resistive layer changes depending on the state of an object to be detected around the first element.

2. The sensor according to claim 1 , wherein, when the temperature of the first film portion is increased by the first power supplied to the first conductive layer, the first electrical resistance changes depending on the state of the object to be detected.

3. 3. The sensor of claim 1, wherein a distance along the first direction between the first substrate and the first resistive layer is shorter than a distance along the first direction between the first substrate and the first conductive layer.

4. 3. The sensor of claim 1, wherein the distance along the first direction between the first substrate and the first resistive layer is substantially the same as the distance along the first direction between the first substrate and the first conductive layer.

5. the first film portion further includes a first other conductive member, the first other conductive member overlaps the first resistance layer and the first conductive layer in the first direction; The sensor according to claim 1 , wherein the first resistive layer and the first conductive layer are provided between the first conductive member and the first other conductive member.

6. the first connecting member extends along a second direction intersecting the first direction, The sensor of claim 1, wherein the first connecting member width of the first connecting member in a third direction intersecting a plane including the first direction and the second direction is narrower than the first membrane portion width of the first membrane portion in the third direction.

7. The first element is a first other fixing member fixed to the first base; a first other connecting member supported by the first other fixing member; further comprising the first other connection member supports the first membrane portion, The sensor according to claim 1 , wherein a first conductive layer wiring electrically connected to the first conductive layer passes through the first connecting member and the first other connecting member.

8. The first element is a first resistor fixing member fixed to the first base; a first resistor connecting member supported by the first resistor fixing member; a first other resistor fixing member fixed to the first base; a first other resistor connecting member supported by the first other resistor fixing member; further comprising the first resistor connecting member and the first other resistor connecting member support the first film portion, The sensor according to claim 1 , wherein a first resistor layer wiring electrically connected to the first resistor layer passes through the first resistor connecting member and the first other resistor connecting member.

9. The first element is a first conductive fixing member fixed to the first base; a first conductive connecting member supported by the first conductive fixing member; further comprising the first conductive connection member supports the first film portion, The sensor according to claim 1 , wherein a first conductive member wiring electrically connected to the first conductive member extends along the first conductive connection member.

10. The sensor of claim 1; a communication unit capable of transmitting a signal corresponding to the change in the first electrical resistance; A sensor system comprising:

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