Component mounting device, component mounting system, and calibration method

Abstract

To provide a component mounting device capable of correcting displacement of a nozzle in a horizontal direction with higher accuracy.SOLUTION: A component mounting device is a component mounting device for mounting a component onto a board that includes: a nozzle for holding a component; a mounting head with a nozzle capable of carrying components on the board; an imaging unit that picks up an image from below the nozzle positioned at a first height and a second height different from the first height; and a calculation unit that measures the first position of the nozzle at the first height and the second position of the nozzle at the second height on the basis of, the pick-up image picked up by the imaging unit and generates correction data for correcting the nozzle position in a horizontal direction approximately parallel to the mounting surface where the component is to be mounted on the board on the basis of, the first position and the second position of the measured nozzle. The calculation unit calculates the correction value for collecting horizontal misalignment of the nozzle due to the elevation of the nozzle between the component mounting height where the component is to be mounted on the board and the component recognition height where the component is recognized.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting apparatus, a component mounting system, and a calibration method. [Background technology]

[0002] Patent Document 1 discloses a mounting device that uses a nozzle to lift a component to a recognition height of a sensor unit for recognition, then lowers the nozzle to a mounting height to mount the component on a board. The mounting device includes a sensor unit that can be raised and lowered from the recognition height to the mounting height during calibration, and an elevation mechanism that raises and lowers the sensor unit. The mounting device measures the nozzle tip position by having the sensor unit recognize the nozzle tip shape when the component is at the recognition height and the nozzle tip shape when the component is at the mounting height. The mounting device calculates a correction value based on the horizontal deviation between the nozzle tip position measured at the recognition height and the nozzle tip position measured at the mounting height to correct for horizontal deviation of the nozzle caused by lifting from the recognition height to the mounting height. The mounting device corrects the horizontal deviation of the nozzle caused by lifting from the recognition height to the mounting height based on the correction value. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-37464 Summary of the Invention [Problem to be solved by the invention]

[0004] The mounting head moves vertically from the recognition height to the mounting height in conjunction with the shaft, and the rotation of the shaft rotates the nozzle attached to the tip of the shaft. However, due to machining precision, the shaft may be bent at a predetermined angle relative to the rotation axis or may be attached at an angle to the rotation mechanism that rotates the shaft. With such shafts, the nozzle may expand radially outward from the rotation axis as it moves vertically, resulting in a misalignment of the nozzle tip position. Therefore, when the mounting head lowers the nozzle from the recognition height to the mounting height, the nozzle tip position misaligns radially outward from the shaft's rotation axis, making it difficult to mount components in the desired position. Patent Document 1 therefore measures the nozzle tip position at the recognition height and the mounting height from the horizontal direction, and calculates a correction value to correct for the horizontal misalignment of the nozzle as it moves up and down from the recognition height to the mounting height based on the measured misalignment of the nozzle tip position between the recognition height and the mounting height. However, because the sensor unit measures the nozzle tip position from the horizontal direction, it was difficult to measure the tip positions of any nozzle other than the nozzle closest to the sensor unit in a mounting head in which multiple nozzles were mounted in a horizontal row, for example.

[0005] The present disclosure has been devised in view of the above-described conventional circumstances, and aims to provide a component mounting device, a component mounting system, and a calibration method that can correct misalignment of nozzles in the horizontal direction with higher precision. [Means for solving the problem]

[0006] The present disclosure relates to a component mounting device that mounts a component on a board, the device comprising: a nozzle that holds the component; a mounting head that is equipped with the nozzle and is capable of transporting the component onto the board; an imaging unit that images the nozzle from below, the nozzle being positioned at a first height and a second height that is different from the first height; and a calculation unit that measures a first position of the nozzle at the first height and a second position of the nozzle at the second height based on images captured by the imaging unit, and generates correction data for correcting a position of the nozzle in a horizontal direction that is approximately parallel to a mounting surface that mounts the component on the board based on the measured first and second positions of the nozzle. the imaging unit has a light guide on an imaging surface of an image sensor, and images the nozzle at the first height in a first region in which the light guide is arranged, and images the nozzle at the second height on the imaging surface and outside the first region; The calculation unit calculates a correction value based on the correction data to correct the horizontal positional deviation of the nozzle due to the raising and lowering of the nozzle between a component mounting height at which the component is mounted on the board and a component recognition height at which the component is recognized.

[0007] The present disclosure also provides a component mounting system including a component mounting device that mounts components on a board, and a computer that is communicably connected to the component mounting device, wherein the component mounting device: A light guide is provided on an imaging surface of an image sensor, and the light guide is located in a first region and at a first height; Hold the part The nozzle is imaged from below, and the nozzle is located on the imaging surface and outside the first region at a second height. The component mounting system includes: an image of a nozzle taken from below; and transmitting the image to a computer; the computer measures a first position of the nozzle at the first height and a second position of the nozzle at the second height based on the transmitted image; and, based on the measured first and second positions of the nozzle, generates correction data for correcting the position of the nozzle in a horizontal direction substantially parallel to a mounting surface where the component is mounted on the board, and transmits the correction data to the component mounting device; and the component mounting device calculates, based on the transmitted correction data, a correction value for correcting the horizontal positional deviation of the nozzle due to the raising and lowering of the nozzle between a component mounting height where the component is mounted on the board and a component recognition height where the component is recognized.

[0008] The present disclosure also provides a calibration method executed by a component mounting apparatus that mounts components on a board, the method comprising: the component mounting device has a light guide on an imaging surface of an image sensor, and is located in a first region and at a first height where the light guide is disposed; Hold the part The nozzle is imaged from below, and the nozzle is located on the imaging surface and outside the first region at a second height. Provided is a calibration method that captures an image of a nozzle from below, measures a first position of the nozzle at the first height and a second position of the nozzle at the second height based on the captured image, generates correction data based on the measured first and second positions of the nozzle to correct the position of the nozzle in a horizontal direction substantially parallel to a mounting surface at which the component is mounted on the board, and calculates a correction value based on the transmitted correction data to correct a misalignment of the nozzle in the horizontal direction due to raising and lowering of the nozzle between a component mounting height at which the component is mounted on the board and a component recognition height at which the component is recognized. [Effects of the Invention]

[0009] According to the present disclosure, misalignment of nozzles in the horizontal direction can be corrected with higher accuracy. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a top view of the interior of a floor where a component mounting system according to a first embodiment is installed. [Figure 2] FIG. 1 is a top view of a component mounting device according to a first embodiment. [Figure 3] FIG. 1 is a diagram illustrating a calibration camera of the component mounting device according to the first embodiment. [Figure 4] FIG. 1 is a block diagram showing an example of the internal configuration of a management computer according to a first embodiment; [Figure 5] FIG. 1 is a block diagram showing an example of the internal configuration of a component mounting device according to a first embodiment. [Figure 6(A)] A diagram explaining the misalignment of the nozzle tip position [Figure 6(B)] A diagram explaining the misalignment of the nozzle tip position [Figure 7] 10A and 10B are diagrams illustrating a method for imaging a nozzle at the component recognition height and the component mounting height using a calibration camera. [Figure 8] A diagram explaining an example of measuring the nozzle tip position [Figure 9] FIG. 10 is a diagram illustrating an example of generating correction data. [Figure 10] 1 is a flowchart showing an example of an operation procedure of the component mounting device according to the first embodiment. [Figure 11] 1 is a flowchart showing an example of a procedure for generating correction data for the component mounting device according to the first embodiment. [Figure 12] FIG. 10 is a diagram illustrating a calibration camera of a component mounting device according to a second embodiment. [Figure 13] 10 is a flowchart showing an example of a procedure for generating correction data for a component mounting device according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, with reference to the accompanying drawings as appropriate, detailed descriptions of each embodiment specifically disclosing a component placement apparatus, a component placement system, and a calibration method according to the present disclosure will be provided. However, unnecessary detailed descriptions may be omitted. For example, detailed descriptions of well-known matters or redundant descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter recited in the claims.

[0012] (Embodiment 1) 1 is a top view of the interior of a floor on which a component mounting system 100 according to embodiment 1 is installed. The component mounting system 100 according to embodiment 1 performs a solder printing process of printing solder on a board 3, a printing inspection process of inspecting the solder printed on the board 3 for printing defects, a component mounting process of mounting a component D on the board 3 after solder printing, a mounting inspection process of inspecting the component D mounted on the board 3, and a reflow process of reflowing the solder printed on the board 3, thereby producing a mounted board on which a component D is soldered to the board 3.

[0013] The component mounting system 100 according to the first embodiment includes at least one component mounting line L1, a communication network LN, and a management computer P1. Although Fig. 1 shows an example in which there is one component mounting line, there may be multiple component mounting lines.

[0014] The communication network LN connects the management computer P1 and each of the devices that make up the component mounting line L1 so that data communication is possible between them. While the example in Fig. 1 shows the communication network LN connected so that wired communication is possible, wireless communication is also possible. The wireless communication here refers to a communication method provided in accordance with a wireless communication standard such as wireless LAN (Local Area Network), Bluetooth (registered trademark), or Wi-Fi (registered trademark).

[0015] The control computer P1 is, for example, a PC (Personal Computer), a notebook PC, a tablet, a smartphone, etc., and is communicably connected to the component mounting line L1 via a communication network LN. The control computer P1 also has a user interface (for example, a mouse, keyboard, touch panel, touchpad, pointing device, etc.) that can accept user operations, and converts input based on the user operations into control signals.

[0016] The management computer P1 controls the overall production process of mounted boards, including the solder printing process, print inspection process, and component mounting process, which are performed by various devices that make up the component mounting line L1. For example, the management computer P1 generates production information related to the production processes that has been input or set in advance by an operator, and execution commands for executing the production processes, and sends these to the component mounting line L1 that executes these production processes.

[0017] The management computer P1 may generate correction data for each nozzle 10 used in the component mounting process performed by each of the component mounting devices M3 to M6 based on production data input or set in advance by an operator. In this case, the management computer P1 generates the correction data based on the position data for each nozzle 10 transmitted from each of the component mounting devices M3 to M6. The management computer P1 transmits the generated correction data to the corresponding component mounting device when the component mounting device starts operating (i.e., when the component mounting device is turned on) or when a nozzle 10 for which correction data has been generated is used by the component mounting device.

[0018] The production data referred to here is information used in the execution of the component mounting process by each of the component mounting devices M3 to M6, and is generated by the management computer P1 and recorded in the management storage unit 32 (see FIG. 4). The production data includes, for example, the size of the board, the position of the board recognition mark, the size of the component, the suction time of the nozzle 10, the mounting position, the board (mounting) height, information about the nozzle 10, the number of boards produced, etc. The production data is not limited to the data of the above items.

[0019] The component mounting line L1 is configured to include various devices such as a solder printing device M1, a print inspection device M2, a plurality of component mounting devices M3 to M6, a mounting inspection device M7, a reflow device M8, etc. These various devices that make up the component mounting line L1 are connected to a management computer P1 via a communication network LN so that they can communicate data with each other, and execute their respective controls based on execution commands sent from the management computer P1.

[0020] In addition, the component mounting line L1 in the component mounting system 100 of embodiment 1 is shown as an example including a solder printing device M1, a printing inspection device M2, each of multiple component mounting devices M3 to M6, a mounting inspection device M7, and a reflow device M8, but it is sufficient if it is configured to include at least one component mounting device.

[0021] The solder printer M1 executes a solder printing process in which solder is printed via a mask onto the board 3 carried in from the upstream side of the component mounting line L1 (the left side of the solder printer M1 in FIG. 2) based on solder data (e.g., solder print patterns, etc.) for the board 3 transmitted from the management computer P1. The solder printer M1 carries out the board 3 after solder printing to the print inspection device M2.

[0022] The print inspection device M2 executes a print inspection process to inspect the condition of the solder printed on the board 3 carried in from the solder printing device M1 based on solder data (e.g., solder print patterns, etc.) on the board 3 transmitted from the management computer P1. The print inspection device M2 is equipped with a camera (not shown) that captures images of the carried-in board 3, and inspects the condition of the solder (i.e., the presence or absence of solder printing defects) using the images captured by the camera. The print inspection device M2 records the results of the solder print inspection on the board 3 in its memory (not shown), and carries out boards 3 that pass the inspection to the component mounting device M3.

[0023] Each of the component mounting devices M3 to M6 performs a component mounting process of mounting one or more components D on the board 3 carried in from the print inspection device M2 based on an execution command sent from the management computer P1. Note that the component mounting line L1 is not limited to a configuration with four component mounting devices, and may have, for example, one to three component mounting devices, or five or more component mounting devices.

[0024] Each of the multiple component mounting devices M3 to M6 controls its nozzle based on production data for the board 3 sent from the management computer P1, and picks up and removes a component D from a tape feeder provided in a component supply unit attached to the component mounting device. Each of the multiple component mounting devices M3 to M6 transports the component D picked up by the nozzle to a predetermined position on the board 3 and mounts it. Each of the multiple component mounting devices M3 to M5 carries out the board 3 after components have been mounted to the next connected component mounting device. Furthermore, component mounting device M6 carries out the board 3 after components have been mounted to mounting inspection device M7.

[0025] The mounting inspection device M7 performs a mounting inspection process to inspect the condition of the components D mounted on the board 3 carried in from the component mounting device M6 (e.g., whether or not the components are mounted in the wrong position) based on the production data of the board 3 transmitted from the management computer P1. The mounting inspection device M7 is equipped with a camera (not shown) that captures images of the carried-in board 3, and inspects the condition of the mounted components using the images captured by the camera. The mounting inspection device M7 records the component mounting inspection results for the board 3 in its own memory (not shown), and transports boards 3 that pass the inspection to the reflow device M8.

[0026] Based on the reflow data for the board 3 sent from the management computer P1 (e.g., the transport speed of the conveyor that transports the board 3, the heating temperature, etc.), the reflow device M8 performs a reflow process to bond the electrode portions of the board 3 carried in from the mounting inspection device M7 to one or more mounted components. The reflow device M8 heats the board 3 carried in the device while transporting it on a belt conveyor, hardening the solder on the board 3 and bonding the electrode portions of the board 3 to one or more mounted components. The reflow device M8 carries out the board 3 after reflow to the downstream side of the component mounting line L1 (to the right of the reflow device M8 in Figure 2).

[0027] Next, the configuration of component mounting devices M3 to M6 will be described with reference to Fig. 2. Each of the component mounting devices M3 to M6 has the same configuration, and only component mounting device M3 will be described here. Fig. 2 is a top view of component mounting device M3 according to embodiment 1.

[0028] Each of the component mounting devices M3 to M6 according to the first embodiment is provided with a plurality of component supply units 4 on each side (Y direction, -Y direction) of a pair of board transport mechanisms 2 that transport boards 3, but a component supply unit may be provided on only one side. Furthermore, each of the component mounting devices M3 to M6 according to the first embodiment shows an example having a single lane configuration (i.e., a pair of board transport mechanisms 2 that can transport boards 3), but it may also have a dual lane configuration that can simultaneously mount components on each of a plurality of boards 3.

[0029] The component mounting device M3 shown in Figure 2 is composed of a base 1, a board conveying mechanism 2, each of multiple component supply units 4, Y-axis beams 6A and 6B, X-axis beams 7A and 7B, a mounting head 8, a board recognition camera 9A, a calibration camera 9B, and a component recognition camera 11.

[0030] The base 1 is provided with a board transport mechanism 2 for transporting a board 3 to a central position of the base 1. The board transport mechanism 2 transports and holds the board 3 carried in from the connected print inspection device M2 (or the connected component mounting device in the case of component mounting devices M4 to M6) to a predetermined component mounting position in the central position of the base 1. The board transport mechanism 2 also carries the board 3 after components have been mounted to the next connected component mounting device M4 (or the connected mounting inspection device M7 in the case of component mounting device M6).

[0031] Each of the multiple component supply units 4 includes multiple tape feeders 5 arranged side by side, each of which supplies components D to be mounted on the board 3. In the component mounting device M3 according to the first embodiment, an example is described in which the tape feeder 5 is a double feeder capable of mounting two carrier tapes, but it may also be a single feeder capable of mounting one carrier tape. In other words, the component mounting device M3 may be configured with a component supply unit that can mount either a single feeder or a double feeder as desired.

[0032] The component supply unit 4 is provided with each of the plurality of tape feeders 5. A tape feeder address for identifying the position of the carrier tape (component) attached to each of the plurality of tape feeders 5 is assigned and set to the component supply unit 4.

[0033] 2 shows an example in which each of the multiple component supply units 4 has the function of attaching a carrier tape containing components D to be mounted on the board 3 to a tape feeder 5, and pitch-feeding the components stored on this carrier tape to a component pick-up position by the mounting head 8. Each of the multiple component supply units 4 pitch-feeds each of the carrier tapes containing components in a predetermined tape feed direction, thereby supplying each of the components to the component pick-up position by the mounting head 8, which will be described below.

[0034] On the upper surface of the base 1, Y-axis beams 6A and 6B, each equipped with a linear drive mechanism, are arranged along the Y direction at one end in the X direction. Two X-axis beams 7A and 7B, each equipped with a linear drive mechanism, are connected to the Y-axis beams 6A and 6B, respectively, so that they can move freely in the Y and -Y directions. Each of the two X-axis beams 7A and 7B is arranged along the X direction. Each of the two X-axis beams 7A and 7B is equipped with a plate (not shown). The mounting head 8 and the board recognition camera (not shown) are attached to the X-axis beams 7A and 7B via the plate and are driven (moved) integrally with the X-axis beams 7A and 7B.

[0035] The mounting head 8 is driven (moved) integrally with a board recognition camera (not shown) by X-axis beams 7A and 7B. The mounting head 8 has multiple shafts 8A, and nozzles 10 attached to these shafts 8A suck and hold components D stored on carrier tapes attached to each of the tape feeders 5, transport them to the mounting position on the board 3, and mount them.

[0036] The multiple board recognition cameras 9A are driven (moved) integrally with the mounting head 8 by the X-axis beams 7A and 7B, and capture images of board marks (not shown) provided at predetermined positions on the board 3 from above the board 3 positioned by the board transport mechanism 2. Each of the multiple board recognition cameras 9A transmits the captured image to the control unit 41 (see FIG. 5) of the component mounting device M3. The control unit 41 of the component mounting device M3 processes the captured image of the board mark, and recognizes the transport position and posture of the board 3 transported by the board transport mechanism 2.

[0037] Each of the plurality of calibration cameras 9B, which are an example of an imaging unit, is provided between the component supply unit 4 and the board transport mechanism 2 on the base 1. Each of the plurality of calibration cameras 9B images the tip (the suction portion that suctions and holds the component D) of at least one nozzle 10 attached to the mounting head 8 from below multiple times. The plurality of calibration cameras 9B images the tip of the nozzle 10 rotated to multiple different rotation angles (e.g., 0 (zero) degree, 90 degrees, 180 degrees, 270 degrees, etc.) and transmits each of the captured images to the control unit 41 (see FIG. 5) of the component mounting device M3. The control unit 41 of the component mounting device M3 processes the captured images of the tip portion of the nozzle 10 and recognizes the tip position (coordinates) of the nozzle 10 for each rotation angle.

[0038] Each of the multiple component recognition cameras 11 is provided between the component supply unit 4 and the board transport mechanism 2 on the base 1. Each of the multiple component recognition cameras 11 captures an image of the component D held by the mounting head 8 from below at the same time that the mounting head 8, which has picked up the component D stored in the carrier tape in the component supply unit 4, moves above the component recognition camera 11. Each of the multiple component recognition cameras 11 transmits the captured image to the control unit 41 (see FIG. 5) of the component mounting device M3. The control unit 41 of the component mounting device M3 processes the captured image of the component D and recognizes the holding posture of the component D.

[0039] Next, the calibration camera 9B and the nozzle 10 will be described with reference to Fig. 3. This is a diagram illustrating the calibration camera 9B of each of the component mounting devices M3 to M6 according to embodiment 1. Fig. 3 is also a diagram of the mounting head 8 and the calibration camera 9B as seen from the direction from the board transport mechanism 2 toward the component supply unit 4.

[0040] The mounting head 8 is driven by the component mounting mechanism 12 (see Figure 5) at the timing when the nozzles 10 are calibrated (for example, when the component mounting device is started, before production begins (i.e., before the component mounting process begins), when a nozzle is mounted on the shaft 8A, when a nozzle is replaced, etc.), and moves to a position where the tip of each of the multiple nozzles 10 can be imaged by the calibration camera 9B (i.e., within the angle of view of the calibration camera 9B).

[0041] Based on a control command output from the control unit 41 (see FIG. 5), the calibration camera 9B captures images of the tips of the nozzles 10 from below (in the −Z direction) when each of the multiple nozzles 10 mounted on the mounting head 8 is positioned at a position where it can be imaged by the calibration camera 9B (i.e., within the angle of view). The calibration camera 9B outputs the captured image to the control unit 41 (see FIG. 5). The calibration camera 9B includes lenses 91 and 92, an image sensor 93, and a glass 94. Note that the lens 92 may be omitted.

[0042] The image sensor 93 is a solid-state image sensor such as a CCD (Charged-Coupled Device) or a CMOS (Complementary Metal-Oxide-Semiconductor), and converts an optical image formed on an image pickup surface 93A into an electrical signal.

[0043] Glass 94, an example of a light guide, is mounted on image sensor 93 and allows adjustment of the focal length when capturing an image of the tip of nozzle 10. Specifically, glass 94 shortens the distance (focal length) between each of lenses 91 and 92 and imaging surface 93A. This allows component mounting devices M3 to M6 to more efficiently capture images of the tip position of nozzle 10 at component recognition height H1 and the tip position of nozzle 10 at component mounting height H2 by moving nozzle 10 in the horizontal direction (X direction or Y direction). Here, the thickness of glass 94 in the Z direction is, for example, 3 mm. Note that the thickness of glass 94 is not limited to this and may differ depending on the component mounting device.

[0044] The internal configuration of the management computer P1 will be described with reference to Fig. 4. Fig. 4 is a block diagram showing an example of the internal configuration of the management computer P1 according to embodiment 1. It goes without saying that the internal configuration shown in Fig. 4 is an example and is not limited to this.

[0045] The management computer P1 is connected to the various devices that make up the component mounting line L1 so that data can be communicated between them, and controls these devices. The management computer P1 includes a management control unit 31, a management storage unit 32, an input unit 33, a display unit 34, and a communication unit 35.

[0046] The management control unit 31 is configured using, for example, a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array), and performs various processes and controls in cooperation with the management storage unit 32. Specifically, the management control unit 31 references the programs and data stored in the management storage unit 32 and executes the programs to realize the functions of each unit.

[0047] When the management computer P1 manages the correction data for each nozzle 10 generated by each of the component mounting devices M3 to M6, the management control unit 31, based on a control command requesting the transmission of correction data transmitted from each of the component mounting devices M3 to M6, references the correction data 32B stored in the management storage unit 32 and extracts the correction data corresponding to the component mounting device that transmitted the control command. The management control unit 31 outputs the extracted correction data to the communication unit 35 and transmits it to the component mounting device that transmitted the control command.

[0048] Furthermore, when the management computer P1 generates correction data for each nozzle 10, the management control unit 31 acquires captured images of each nozzle 10 or position data for each nozzle 10 transmitted from the component mounting device. The management control unit 31 generates correction data for each nozzle 10 based on the acquired captured images or position data. The management control unit 31 associates the generated correction data with information about the nozzle 10 and information about the component mounting device that transmitted the position data, and stores the associated data in the management storage unit 32. The generated correction data may be transmitted to and stored in the component mounting device that transmitted the position data. The procedure for generating correction data will be described later.

[0049] The management storage unit 32 has, for example, a RAM (Random Access Memory) as a work memory used when executing each process of the management control unit 31, and a ROM (Read Only Memory) that stores programs and data that define the operation of the management control unit 31. The RAM temporarily stores data or information generated or acquired by the management control unit 31. The ROM has written therein programs that define the operation of the management control unit 31. The management storage unit 32 stores production data 32A and correction data 32B.

[0050] The production data 32A is generated for each board 3 and is data for producing the board 3. The correction data 32B is generated for each nozzle 10 and is data for correcting (calibrating) the position of the tip of the nozzle 10, which moves up and down between the component recognition height H1 and the component mounting height H2 in the rotation direction Q of the nozzle 10 (see FIGS. 6(A) and 6(B)).

[0051] The input unit 33 is a user interface that accepts operations by an operator, and is configured using, for example, a mouse, a keyboard, a touch panel, a touch pad, a pointing device, etc. The input unit 33 outputs a signal based on the operator's operation to the management control unit 31.

[0052] The display unit 34 is configured using a display such as an LCD (Liquid Crystal Display) or an organic EL (Electroluminescence) display.

[0053] The communication unit 35 is connected to each of the component mounting devices M3 to M6 via the communication network LN so as to be able to communicate data with them. The communication unit 35 transmits execution commands for executing the production processes generated by the management control unit 31 to the corresponding component mounting devices based on production information relating to the production processes input or set in advance by the operator.

[0054] Next, the internal configuration of each of the component mounting devices M3 to M6 will be described with reference to Fig. 5. Fig. 5 is a block diagram showing an example of the internal configuration of the component mounting devices M3 to M6 according to embodiment 1. Note that since each of the multiple component mounting devices M3 to M6 has approximately the same configuration, the following description will focus on the internal configuration of the component mounting device M3.

[0055] The communication unit 40 is connected to the management computer P1 via the communication network LN so as to be able to communicate data with the management computer P1. The communication unit 40 outputs execution commands, production data, correction data, etc. transmitted from the management computer P1 to the control unit 41.

[0056] The control unit 41, which is an example of a calculation unit, is configured using, for example, a CPU or FPGA, and performs various processes and controls in cooperation with the storage unit 42. Specifically, the control unit 41 references the programs and data stored in the storage unit 42 and executes the programs to realize the functions of each unit.

[0057] The control unit 41 controls the component mounting mechanism 12, the calibration camera 9B, etc. to acquire a plurality of captured images of the tip position of the nozzle 10 at the component recognition height H1 and the component mounting height H2 at each of a plurality of different rotation angles. The control unit 41 performs image processing on each of the acquired captured images to detect the tip of the nozzle 10. By measuring the detected tip position of the nozzle 10, the control unit 41 generates position data of the tip position of the nozzle 10 at the component recognition height H1 and position data of the tip position of the nozzle 10 at the component mounting height H2.

[0058] Furthermore, the control unit 41 generates correction data for each nozzle 10 based on the generated position data for each nozzle 10 at each of the component recognition height H1 and the component mounting height H2. The generated correction data is stored in the memory unit 42 and transmitted to the management computer P1 by the communication unit 40.

[0059] Based on the generated correction data, the control unit 41 calculates a correction value for correcting the positional deviation of the tip of the nozzle 10 due to the elevation change between the component recognition height H1 and the component mounting height H2. Based on the calculated correction value, the control unit 41 drives the component mounting mechanism 12 to move the mounting head 8, thereby mounting the component D on the board 3.

[0060] In generating the correction data, the imaging height of the nozzle 10 is not limited to the component recognition height H1 and the component mounting height H2. The imaging height of the nozzle 10 may be any two different heights that allow the nozzle 10 to be raised and lowered in the Z direction and the -Z direction.

[0061] The storage unit 42 has, for example, a RAM as a work memory used when the control unit 41 executes each process, and a ROM that stores programs and data that define the operation of the control unit 41. The RAM temporarily stores data or information generated or acquired by the control unit 41. The ROM has written therein programs that define the operation of the control unit 41. For example, the storage unit 42 stores information about the nozzles 10 and correction data generated for each nozzle 10.

[0062] The component mounting mechanism 12 includes Y-axis beams 6A and 6B, X-axis beams 7A and 7B, and a mounting head 8.

[0063] Referring to Figure 6(A), we will explain the positional deviation of the tip position of the nozzle 10 when the shaft 8A is bent at a predetermined angle θ1 with respect to the rotation axis. Figure 6(A) is a diagram explaining the positional deviation of the nozzle tip position. Note that in Figure 6(A), the placement head 8 is not shown for ease of understanding. Also, in Figure 6(A), for ease of understanding, the nozzle corresponding to the component recognition height H1 is given the symbol "10A," and the nozzle corresponding to the component placement height H2 is given the symbol "10B."

[0064] The mounting head 8 includes a plurality of shafts 8A, each of which has a nozzle 10 attached to the tip located on the -Z direction side. The shafts 8A are raised and lowered in the vertical direction (Z direction, -Z direction) by a component mounting mechanism 12, and are rotated in a rotation direction Q around a rotation axis R, thereby making it possible to adjust the rotation angle of the nozzle 10 attached to the tip.

[0065] The nut 8B holds the shaft 8A so that the center of the shaft 8A is substantially aligned with the rotation axis R at a predetermined height (a height equal to or greater than the reference height H0).

[0066] When the shaft 8A is raised and lowered in the Z direction and the -Z direction by the component mounting mechanism 12, the tip position of the shaft 8A (i.e., the mounting position of the nozzle 10) shifts radially outward from the rotation axis R with the rotation axis R as the center of rotation.

[0067] For example, nozzle 10A is attached to the tip of shaft 8A, and the tip position of nozzle 10A is lowered from reference height H0 to component recognition height H1 by component mounting mechanism 12. Note that in the example shown in Figure 6(A), shaft 8A is bent by angle θ1 from rotation axis R of shaft 8A as it is raised and lowered. When lowered to component recognition height H1, the tip position of nozzle 10A is shifted by distance W1 radially outward from rotation axis R based on the bend at angle θ1 around rotation axis R.

[0068] For example, nozzle 10B is attached to the tip of shaft 8A, and the tip of nozzle 10B is lowered from component recognition height H1 to component mounting height H2 by component mounting mechanism 12. When lowered to component mounting height H2, the tip of nozzle 10B is shifted radially outward from rotation axis R by a distance W2. Note that distance W2 is greater than distance W1.

[0069] Also, referring to FIG. 6(B), a description will be given of the positional deviation of the tip position of the nozzle 10 when the shaft 8A is attached at a predetermined angle θ2 to a rotation mechanism (not shown) that rotates the shaft. FIG. 6(B) is a diagram illustrating the positional deviation of the nozzle tip position. Note that, in FIG. 6(B) as well, the placement head 8 is omitted from the illustration for ease of understanding. Also in FIG. 6(B), for ease of understanding, the nozzle corresponding to the component recognition height H1 is given the symbol "10C," and the nozzle corresponding to the component placement height H2 is given the symbol "10D."

[0070] The mounting head 8 includes a plurality of shafts 8A, each of which has a nozzle 10 attached to the tip located on the -Z direction side. The shafts 8A are raised and lowered in the vertical direction (Z direction, -Z direction) by a component mounting mechanism 12, and are rotated in a rotation direction Q around a rotation axis R, thereby making it possible to adjust the rotation angle of the nozzle 10 attached to the tip.

[0071] The nut 8B is held at a predetermined height (a height equal to or greater than the reference height H0) so that the axis passing through the center of the shaft 8A intersects with the rotation axis R.

[0072] When the shaft 8A is raised and lowered in the Z direction and the -Z direction by the component mounting mechanism 12, the tip position of the shaft 8A (i.e., the mounting position of the nozzle 10) shifts radially outward from the rotation axis R with the rotation axis R as the center of rotation.

[0073] For example, nozzle 10A is attached to the tip of shaft 8A, and the tip position of nozzle 10A is lowered from reference height H0 to component recognition height H1 by component mounting mechanism 12. Note that in the example shown in Figure 6(B), shaft 8A is attached at an angle θ2 to the rotation axis R of a rotation mechanism (not shown) for rotating the shaft when it is raised or lowered. When lowered to component recognition height H1, the tip position of nozzle 10A is shifted by a distance W3 radially outward from rotation axis R, with rotation axis R as the center.

[0074] For example, nozzle 10B is attached to the tip of shaft 8A, and the tip of nozzle 10B is lowered from component recognition height H1 to component mounting height H2 by component mounting mechanism 12. When lowered to component mounting height H2, the tip of nozzle 10B is shifted radially outward from rotation axis R by a distance W4. Note that distance W4 is greater than distance W3.

[0075] As a result, the tip positions of nozzle 10 differ between nozzle 10A at component recognition height H1 and nozzle 10B at component mounting height H2. Specifically, the tip positions of nozzle 10 are displaced in the XY plane (horizontal direction) based on the height from reference height H0, as shown in FIGS. 6(A) and 6(B). Components D placed on board 3 by such mounting head 8 are placed with a displaced position on the component mounting surface of board 3 (i.e., the surface facing nozzle 10, in the XY plane on the Z direction side). A method for acquiring position data used to generate correction data for nozzle 10 will be described below.

[0076] An example of imaging the nozzle 10 will be described with reference to Fig. 7. Fig. 7 is a diagram illustrating a method for imaging the nozzle 10 at component recognition height H1 and component mounting height H2 using the calibration camera 9B. Note that in Figs. 7 and 8, for ease of understanding, the nozzle corresponding to component recognition height H1 is given the symbol "10A" and the nozzle corresponding to component mounting height H2 is given the symbol "10B." However, as shown in Fig. 7, the height of the nozzle 10 imaged by the calibration camera 9B is the component recognition height H1.

[0077] 7 to 9 illustrate an example in which the tip of the nozzle 10 is captured by the calibration camera 9B at four rotation angles of 0 (zero)°, 90°, 180°, and 270°, but the four rotation angles are not limited to these. For example, each of the component mounting devices M3 to M6 may use an arbitrary rotation angle when the nozzle 10 mounted on the mounting head 8 is moved to an imaging position where it is imaged by the calibration camera 9B as a reference angle, and may capture images of the tip of the nozzle 10 at each of the four rotation angles by rotating the nozzle 10 by a predetermined angle (for example, 90°) from this reference angle.

[0078] Each of the component mounting devices M3 to M6 uses the calibration camera 9B to capture images of the nozzle 10 rotated through four rotation angles at each of the component recognition height H1 and the component mounting height H2. The four rotation angles of the nozzle 10 captured at the component recognition height H1 do not have to match the four rotation angles of the nozzle 10 captured at the component mounting height H2. In the examples shown in the first and second embodiments, each of the component mounting devices M3 to M6 captures images of the tip of the nozzle 10 at four rotation angles when generating correction data, but this is not limiting and images may be captured at at least three or more rotation angles.

[0079] At the timing of calibration, the control unit 41 starts the process of acquiring position data at the component recognition height H1 and the process of acquiring position data at the component mounting height H2 in order to generate correction data. Note that, although an example in which the process of acquiring position data at the component mounting height H2 is executed first will be described here, it goes without saying that the process of acquiring position data at the component recognition height H1 may also be executed first.

[0080] In the process of acquiring position data at component mounting height H2, the control unit 41 drives the component mounting mechanism 12 to move one of the nozzles 10 mounted on the mounting head 8 to be imaged within the angle of view of the calibration camera 9B. The control unit 41 drives the component mounting mechanism 12 to align the tip height of the nozzle 10 with the component recognition height H1 and position one of the nozzles 10 on the glass 94 mounted on the image sensor 93 (i.e., on the area AR2). Each of the component mounting devices M3 to M6 adjusts the focal length between the lenses 91 and 92 by moving the nozzle 10 above the glass 94 mounted on the image sensor 93, thereby enabling the tip of the nozzle 10 at component mounting height H2 to be imaged at the component recognition height H1. The area AR2 is an example of a first area.

[0081] After moving one of the nozzles 10 to be imaged onto area AR2, the control unit 41 adjusts the rotation angle of the nozzle 10 to a first rotation angle (for example, a rotation angle of 0 (zero) degrees) and starts imaging the tip of the nozzle 10 at component mounting height H2 of the nozzle 10. The control unit 41 images the tip of the nozzle 10 at the first rotation angle using the calibration camera 9B. The calibration camera 9B outputs the captured image to the control unit 41.

[0082] After capturing an image of the position of nozzle 10 rotated to the first rotation angle, control unit 41 rotates nozzle 10 to the second rotation angle. Control unit 41 then uses calibration camera 9B to capture an image of the tip of nozzle 10 rotated to the second rotation angle. Similarly, control unit 41 causes calibration camera 9B to capture images of the tip of nozzle 10 at each of the third and fourth rotation angles.

[0083] After capturing images of the nozzles 10 at each of the first to fourth rotation angles at component mounting height H2, the control unit 41 determines whether there are any nozzles 10 that have been mounted on the mounting head 8 and for which the process of acquiring position data at component mounting height H2 has not been performed (in other words, whether there are any nozzles 10 for which the process of acquiring position data at component mounting height H2 has not been performed at each of the first to fourth rotation angles). The control unit 41 selects any of the nozzles 10 for which the process of acquiring position data at component mounting height H2 has not been performed, and performs the process of acquiring position data at component mounting height H2 for the selected nozzle 10. If the control unit 41 determines that the process of acquiring position data at component mounting height H2 has been performed for all of the nozzles 10 mounted on the mounting head 8, the control unit 41 proceeds to the process of acquiring position data at component recognition height H1.

[0084] In the process of acquiring position data at component recognition height H1, the control unit 41 drives the component mounting mechanism 12 to move one of the nozzles 10 mounted on the mounting head 8 to be imaged in the horizontal direction (X direction, Y direction). Specifically, the control unit 41 drives the component mounting mechanism 12 to move the nozzle 10 so that it is positioned above and outside the glass 94 mounted on the image sensor 93 (i.e., in area AR1). Each of the component mounting devices M3 to M6 adjusts the focal length between the lenses 91 and 92 by moving the nozzle 10 above area AR1 of the image sensor 93, thereby enabling the imaging of the tip of the nozzle 10 at component recognition height H1. Note that area AR1 is an example of a second area.

[0085] After moving one of the nozzles 10 to be imaged onto area AR1, the control unit 41 adjusts the rotation angle of the nozzle 10 to a first rotation angle (for example, a rotation angle of 0 (zero) degrees) and starts imaging the tip of the nozzle 10 at the component mounting height H2 of the nozzle 10. Note that the control unit 41 may start imaging the tip of the nozzle 10 while maintaining the rotation angle at the fourth rotation angle. The control unit 41 images the tip of the nozzle 10 at the first rotation angle using the calibration camera 9B. The calibration camera 9B outputs the captured image to the control unit 41.

[0086] After capturing an image of the position of nozzle 10 rotated to the first rotation angle, control unit 41 rotates nozzle 10 to the second rotation angle. Control unit 41 then uses calibration camera 9B to capture an image of the tip of nozzle 10 rotated to the second rotation angle. Similarly, control unit 41 causes calibration camera 9B to capture images of the tip of nozzle 10 at each of the third and fourth rotation angles.

[0087] After capturing images of the nozzles 10 at each of the first to fourth rotation angles at the component recognition height H1, the control unit 41 determines whether there are any nozzles 10 that are attached to the mounting head 8 and for which the process of acquiring position data at the component recognition height H1 has not been performed (in other words, whether there are any nozzles 10 for which the process of acquiring position data at the component mounting height H2 has not been performed). The control unit 41 selects any one of the nozzles 10 for which the process of acquiring position data at the component mounting height H2 has not been performed, and performs the process of acquiring position data at the component recognition height H1 for the selected nozzle 10. If the control unit 41 determines that the process of acquiring position data at the component recognition height H1 has been performed for all of the nozzles 10 attached to the mounting head 8, the control unit 41 proceeds to the process of acquiring position data for each nozzle 10.

[0088] A method for generating correction data for the nozzle 10 will be described with reference to Figures 8 and 9. Figure 8 is a diagram illustrating an example of measuring the tip position of the nozzle 10. Figure 9 is a diagram illustrating an example of generating correction data.

[0089] The control unit 41 acquires four captured images of the tip of the nozzle 10 at four rotation angles of 0 (zero)°, 90°, 180°, and 270° at the component recognition height H1, and four captured images of the tip of the nozzle 10 at four rotation angles of 0 (zero)°, 90°, 180°, and 270° at the component mounting height H2. The control unit 41 detects the tip of the nozzle 10 from each of the acquired captured images and measures the position (coordinates) of the detected tip of the nozzle 10.

[0090] The nozzle position data PIC1 is data indicating the tip position PS11 of the nozzle 10A at the component recognition height H1 when the rotation angle is 0 (zero) degrees (first rotation angle) and the tip position PS12 of the nozzle 10B at the component mounting height H2.

[0091] The nozzle position data PIC2 is data indicating the tip position PS21 of the nozzle 10A at the component recognition height H1 when the rotation angle is 90° (second rotation angle) and the tip position PS22 of the nozzle 10B at the component mounting height H2.

[0092] The nozzle position data PIC3 is data indicating the tip position PS31 of the nozzle 10A at the component recognition height H1 when the rotation angle is 180° (third rotation angle) and the tip position PS32 of the nozzle 10B at the component mounting height H2.

[0093] The nozzle position data PIC4 is data indicating the tip position PS41 of the nozzle 10A at the component recognition height H1 when the rotation angle is 270° (fourth rotation angle) and the tip position PS42 of the nozzle 10B at the component mounting height H2.

[0094] For ease of understanding, Fig. 8 shows nozzle position data PIC1, PIC2, ​​PIC3, and PIC4, each of which is obtained by superimposing two captured images taken at each rotation angle. As shown in Fig. 8, even at the same rotation angle, the tip position (coordinates) of nozzle 10 on the XY plane differs between component recognition height H1 and component mounting height H2.

[0095] The control unit 41 generates nozzle position data PIC5 based on the tip position (coordinates) of the nozzle 10 detected from the eight captured images. The nozzle position data PIC5 shown in FIG. 9 is data plotting tip positions PS11, PS21, PS31, and PS41 of the nozzle 10 at four rotation angles captured at the component recognition height H1, and tip positions PS12, PS22, PS32, and PS42 of the nozzle 10 at four rotation angles captured at the component mounting height H2. Based on the generated nozzle position data PIC5, the control unit 41 calculates a trajectory TR1 of the tip position of the nozzle 10 at the component recognition height H1 and a trajectory TR2 of the tip position of the nozzle 10 at the component mounting height H2. The control unit 41 stores the calculated trajectory TR1 of the tip position of the nozzle 10 at the component recognition height H1 and the trajectory TR2 of the tip position of the nozzle 10 at the component mounting height H2 as correction data for the nozzle 10.

[0096] The operation procedures of each of the component mounting devices M3 to M6 will be described with reference to Fig. 10. Fig. 10 is a flowchart showing an example of the operation procedures of the component mounting devices M3 to M6 in embodiment 1. Note that each of the component mounting devices M3 to M6 executes the same operation procedures, so the operation procedures of the component mounting device M3 will be described here.

[0097] When the component mounting device M3 receives an operation start command from an operator or a control command sent from the management computer P1, the component mounting device M3 determines that it is time to perform calibration processing. The component mounting device M3 mounts the nozzles 10 on each of the multiple shafts 8A of the mounting head 8 (St10).

[0098] The component mounting device M3 acquires the position data of the nozzle 10 at each rotation angle of the component recognition height H1 and the component mounting height H2 (St11A).

[0099] The component mounting device M3 generates correction data for each nozzle 10 based on the position data of the nozzle 10 at each rotation angle of the acquired component recognition height H1 and component mounting height H2, and records (stores) the data in the memory unit 42 (St12).

[0100] After generating the correction data, the component mounting device M3 transports the board 3 to a predetermined board transport position (St13). The component mounting device M3 drives the component mounting mechanism 12 and uses the nozzle 10 to pick up the component D to be mounted on the board 3 (St14).

[0101] The component mounting device M3 drives the component mounting mechanism 12 to transport the component D sucked and held by the nozzle 10 to a predetermined component mounting position on the board 3. Here, the component mounting device M3 passes the component D over the component recognition camera 11 on the way to the predetermined component mounting position. The component mounting device M3 captures an image of the component D sucked and held by the nozzle 10 from below (in the -Z direction) using the component recognition camera 11 at the timing when the nozzle 10 mounted on the mounting head 8 passes over the component recognition camera 11. The component mounting device M3 detects the component D from the captured image and recognizes (measures) the attitude (angle) of the component D sucked and held by the nozzle 10 (St15).

[0102] The component mounting device M3 calculates the rotation angle of the nozzle 10 at the component recognition height H1 based on the measured posture (angle) of the component D and the mounting direction onto the board 3 included in the production data. The component mounting device M3 calculates a correction value (coordinate) obtained by correcting the component mounting position (coordinate) of the component D based on the correction data recorded in the memory unit 42 (specifically, the trajectory TR1 of the tip position of the nozzle 10 at the component recognition height H1 and the trajectory TR2 of the tip position of the nozzle 10 at the component mounting height H2) (St16).

[0103] Note that the trajectories TR1 and TR2 referred to here are each an example of position data. The correction data is data obtained by aligning the trajectories TR1 and TR2 with the rotation axis R of the shaft 8A. This allows the component mounting device M3 to calculate the deviation (correction value) in the horizontal direction (i.e., the XY plane, approximately the same plane as the component mounting surface of the board 3, etc.) of the tip position of the nozzle 10 between the component recognition height H1 and the component mounting height H2 at a predetermined rotation angle of the shaft 8A (i.e., the nozzle 10).

[0104] Based on the calculated correction values ​​(coordinates), the component mounting device M3 determines the movement amounts in the X and Y directions of the mounting head 8. Based on the determined movement amounts, the component mounting device M3 drives the component mounting mechanism 12 to mount the component D at a predetermined component mounting position (i.e., the coordinates indicated by the correction values) on the board 3 (St17).

[0105] Component mounting device M3 repeatedly executes the processes of steps St14 to St17 based on the production data until mounting of all components to be mounted on board 3 is completed.

[0106] Next, a procedure for generating correction data for each nozzle 10 in the first embodiment will be described with reference to Fig. 11. Fig. 11 is a flowchart showing an example of a procedure for generating correction data for the component mounting devices M3 to M6 in the first embodiment. Note that each of the component mounting devices M3 to M6 generates correction data using a similar operation procedure, so the operation procedure for the component mounting device M3 will be described here. Note that the correction data generation procedure shown in Fig. 11 may be executed by the management computer P1.

[0107] First, the component mounting device M3 performs a recognition process for the tips of each of the multiple nozzles 10 mounted on the mounting head 8 at the component mounting height H2. In the example of the generation procedure described in Fig. 11, an example will be described in which N (N: integer equal to or greater than 1) nozzles 10 are mounted on the mounting head 8.

[0108] The component mounting device M3 drives the component mounting mechanism 12 to align the tip height of the nozzles 10 with the component recognition height H1, and positions at least one nozzle 10 on the glass 94 mounted on the image sensor 93 (i.e., on the area AR2). The component mounting device M3 adjusts the rotation angle of at least one nozzle 10, which is the object to be imaged (i.e., the object to be recognized for position), to 0 (zero) degrees (an example of a first rotation angle). The component mounting device M3 uses the calibration camera 9B to capture an image of the tip of the nozzle 10 at the component mounting height H2 and a rotation angle of 0 (zero) degrees. The component mounting device M3 performs image recognition processing on the captured image to detect the tip of the nozzle 10, and measures (recognizes) the position (coordinates) of the detected tip of the nozzle 10 (St21).

[0109] The component mounting device M3 rotates the shaft 8A using the component mounting mechanism 12, and adjusts the rotation angle of the nozzle 10 to 90° (an example of a second rotation angle). The component mounting device M3 uses the calibration camera 9B to capture an image of the tip of the nozzle 10 at the component mounting height H2 and a rotation angle of 90°. The component mounting device M3 performs image recognition processing on the captured image to detect the tip of the nozzle 10, and measures (recognizes) the position (coordinates) of the detected tip of the nozzle 10 (St22).

[0110] The component mounting device M3 rotates the shaft 8A using the component mounting mechanism 12, and adjusts the rotation angle of the nozzle 10 to 180° (an example of a third rotation angle). The component mounting device M3 uses the calibration camera 9B to capture an image of the tip of the nozzle 10 at the component mounting height H2 and a rotation angle of 180°. The component mounting device M3 performs image recognition processing on the captured image to detect the tip of the nozzle 10, and measures (recognizes) the position (coordinates) of the detected tip of the nozzle 10 (St23).

[0111] The component mounting device M3 rotates the shaft 8A using the component mounting mechanism 12, and adjusts the rotation angle of the nozzle 10 to 270° (an example of a fourth rotation angle). The component mounting device M3 uses the calibration camera 9B to capture an image of the tip of the nozzle 10 at the component mounting height H2 and a rotation angle of 270°. The component mounting device M3 performs image recognition processing on the captured image to detect the tip of the nozzle 10, and measures (recognizes) the position (coordinates) of the detected tip of the nozzle 10 (St24).

[0112] The component mounting device M3 determines whether or not the tip positions of the N nozzles 10 at the component mounting height H2 have been recognized (St25).

[0113] If the component mounting device M3 determines in the processing of step St25 that it has recognized the tip positions of each of the N nozzles 10 at the component mounting height H2 (St25, YES), it drives the component mounting mechanism 12 to move each of the N nozzles 10 so that they are positioned above and outside the glass 94 mounted on the image sensor 93 (i.e., above the area AR1) (St26A).

[0114] On the other hand, if the component mounting device M3 determines in the processing of step St25 that the tip positions of the N nozzles 10 at the component mounting height H2 have not been recognized (St25, NO), it selects one of the N nozzles 10 whose tip position has not been recognized (St27). The component mounting device M3 then executes a recognition process for the tip position of the selected nozzle 10.

[0115] The component mounting device M3 moves one of the nozzles 10 to be imaged onto the area AR1, then adjusts the rotation angle of each of the N nozzles 10 to 0 (zero) degrees (an example of a first rotation angle) and images the tip of each of the N nozzles 10 at the component recognition height H1. The component mounting device M3 performs image recognition processing on the captured image to detect the tip of each of the N nozzles 10, and measures (recognizes) the tip position (coordinates) of each of the detected N nozzles 10 (St28).

[0116] The component mounting device M3 moves one of the nozzles 10 to be imaged onto the area AR1, then adjusts the rotation angle of each of the N nozzles 10 to 90° (an example of a second rotation angle), and images the tip of each of the N nozzles 10 at the component recognition height H1. The component mounting device M3 performs image recognition processing on the captured image to detect the tip of each of the N nozzles 10, and measures (recognizes) the tip position (coordinates) of each of the detected N nozzles 10 (St29).

[0117] The component mounting device M3 moves one of the nozzles 10 to be imaged onto the area AR1, then adjusts the rotation angle of each of the N nozzles 10 to 180° (an example of a third rotation angle), and images the tip of each of the N nozzles 10 at the component recognition height H1. The component mounting device M3 performs image recognition processing on the captured image to detect the tip of each of the N nozzles 10, and measures (recognizes) the tip position (coordinates) of each of the detected N nozzles 10 (St30).

[0118] The component mounting device M3 moves one of the nozzles 10 to be imaged onto the area AR1, then adjusts the rotation angle of each of the N nozzles 10 to 270° (an example of a fourth rotation angle), and images the tip of each of the N nozzles 10 at the component recognition height H1. The component mounting device M3 performs image recognition processing on the captured image to detect the tip of each of the N nozzles 10, and measures (recognizes) the tip position (coordinates) of each of the detected N nozzles 10 (St31).

[0119] The component mounting device M3 calculates a trajectory TR1 of the tip position of the nozzle 10 at the component recognition height H1 for each of the N nozzles 10 based on the position data at the component recognition height H1 (i.e., data on the tip position of the nozzle 10 at each rotation angle). Based on the position data at the component mounting height H2, the component mounting device M3 calculates a trajectory TR2 of the tip position of the nozzle 10 at the component mounting height H2. The component mounting device M3 generates correction data for each nozzle 10 based on the calculated trajectory TR1 of the tip position of the nozzle 10 at the component recognition height H1 and the trajectory TR2 of the tip position of the nozzle 10 at the component mounting height H2 (St32).

[0120] As a result, each of the component mounting devices M3 to M6 in the first embodiment can generate correction data that can correct the positional deviation of the tip of the nozzle 10 in the rotation direction of the nozzle 10. Therefore, each of the component mounting devices M3 to M6 can correct the positional deviation of the component D to be mounted on the board 3 with high precision based on the generated correction data.

[0121] The procedure for generating the correction data executed by each of the component mounting devices M3 to M6 described above is not limited to this. For example, when capturing images of the tips of the nozzles 10 at the component mounting height H2, if each of the component mounting devices M3 to M6 determines that the number and mounting positions of the nozzles 10 mounted on the mounting head 8 can be positioned within the angle of view of the calibration camera 9B and in the area AR2, it may drive the component mounting mechanism 12 so that each of the N nozzles 10 is positioned on the glass 94 mounted on the image sensor 93 (i.e., in the area AR2). In such a case, the component mounting device M3 may capture images of the tip positions of the N nozzles 10 at each rotation angle all at once, rather than capturing images of the tip positions of the nozzles 10 one by one, as shown in steps St29 to St31.

[0122] Similarly, when imaging the tips of the nozzles 10 at the component recognition height H1, if each of the component mounting devices M3 to M6 determines that the number and mounting positions of the nozzles 10 mounted on the mounting head 8 cannot be positioned within the field of view of the calibration camera 9B and in the area AR1, it may image the tip positions of the nozzles 10 one by one, rather than imaging the tip positions of each of the N nozzles 10 for each rotation angle all at once, as shown in steps St21 to St24.

[0123] Furthermore, each of the component mounting devices M3 to M6 may be configured to capture images of the tip of the nozzle 10 at the component recognition height H1 and the component mounting height H2 for each nozzle 10.

[0124] This allows each of the component mounting devices M3 to M6 to more efficiently perform the correction data generation process based on the number of nozzles that can be mounted on the mounting head 8, the nozzle mounting position, the angle of view of the calibration camera 9B, the area of ​​area AR1 or area AR2, etc.

[0125] (Embodiment 2) Each of the component mounting devices M3 to M6 in the first embodiment has a glass 94 mounted on the image sensor 93 to make the focal length adjustable, thereby enabling the tip of the nozzle 10 at the component recognition height H1 and the tip of the nozzle 10 at the component mounting height H2 to be imaged without raising or lowering the shaft 8A between the component recognition height H1 and the component mounting height H2. Each of the component mounting devices M3 to M6 in the second embodiment has an elevation mechanism 13 below the calibration camera 9C that can raise and lower the calibration camera 9C in the Z direction and the -Z direction, and by raising and lowering the calibration camera 9C, an example will be described in which the tip of the nozzle 10 at the component recognition height H1 and the tip of the nozzle 10 at the component mounting height H2 can be imaged without raising or lowering the shaft 8A between the component recognition height H1 and the component mounting height H2.

[0126] In the following description of the second embodiment, the same components as those in the component mounting system 100 according to the first embodiment and the component mounting devices M3 to M6 are given the same reference numerals and will not be described again.

[0127] The calibration camera 9C and a method for capturing an image of the tip of the nozzle 10 according to the second embodiment will be described with reference to Fig. 12. Fig. 12 is a diagram illustrating the calibration camera 9C of each of component mounting apparatuses M3 to M6 according to the second embodiment.

[0128] A plurality of calibration cameras 9C, which are an example of an imaging unit, are fixed on a lift table 14 and are raised and lowered in the Z direction and the -Z direction by a lift unit 15 that supports the lift table 14. The lift mechanism 13 shown in Fig. 5 includes the lift table 14 and the lift unit 15. The control unit 41 controls the lift unit 15 to raise and lower the calibration cameras 9C.

[0129] The control unit 41 raises and lowers the lifting unit 15 in the Z direction and the -Z direction between a height H3, where the distance between the lens 91 of the calibration camera 9C and the tip of the nozzle 10 corresponds to the component recognition height H1, and a height H4, where the distance between the lens 91 of the calibration camera 9C and the tip of the nozzle 10 corresponds to the component mounting height H2. This enables the control unit 41 to capture images of the tip of the nozzle 10 at each rotation angle at the component recognition height H1 by the calibration camera 9C, and at each rotation angle at the component mounting height H2.

[0130] Next, a procedure for generating correction data for each nozzle 10 in the second embodiment will be described with reference to Fig. 13. Fig. 13 is a flowchart showing an example of a procedure for generating correction data for component mounting devices M3 to M6 in the second embodiment. The procedure for generating correction data shown in Fig. 13 may be executed by a management computer P1.

[0131] Note that the procedure for generating correction data for each nozzle 10 in the second embodiment shown in Fig. 13 is substantially the same as the procedure for generating correction data for each nozzle 10 in the first embodiment shown in Fig. 11, and therefore a description of the same processes will be omitted. In addition, in the example of the generation procedure described in Fig. 13, an example will be described in which N (N: integer equal to or greater than 1) nozzles 10 are each mounted on the mounting head 8.

[0132] First, the component mounting device M3 drives the lifting mechanism 13 to raise and lower the calibration camera 9C to a height H4 at which the calibration camera 9C can capture images of the positions of the N nozzles 10 at the component mounting height H2.

[0133] If the component mounting device M3 determines in the processing of step St25 that it has recognized the tip positions of each of the N nozzles 10 at the component mounting height H2 (St25, YES), it drives the lifting mechanism 13 to raise and lower the calibration camera 9C to a height H3 at which it can capture an image of the positions of each of the N nozzles 10 at the component recognition height H1 (St26B).

[0134] As a result, each of the component mounting devices M3 to M6 in the second embodiment can generate correction data that can correct the deviation of the tip position of the nozzle 10 in the rotation direction of the nozzle 10. Therefore, each of the component mounting devices M3 to M6 can correct the deviation of the position of the component D to be mounted on the board 3 with high precision based on the generated correction data.

[0135] As described above, each of the component mounting devices M3 to M6 according to the first and second embodiments is a component mounting device M3 to M6 that mounts a component D on a board 3, and includes a nozzle 10 that holds the component D, a mounting head 8 that is equipped with the nozzle 10 and is capable of transporting the component D onto the board 3, calibration cameras 9B and 9C (an example of an imaging unit) that capture images of the nozzle 10 located at the first height and the second height from below, and a calibration unit that captures images of the nozzle 10 located at the first height based on the captured images captured by the calibration cameras 9B and 9C. and a control unit 41 (an example of a calculation unit) that measures a first position (e.g., tip positions PS12, PS22, PS32, and PS42 of nozzle 10B shown in FIG. 8) and a second position of the nozzle at a second height (e.g., tip positions PS11, PS21, PS31, and PS41 of nozzle 10A shown in FIG. 8), and generates, based on the measured first and second positions of nozzle 10, correction data for correcting the position of nozzle 10 in a horizontal direction substantially parallel to the mounting surface for mounting component D on board 3. Based on the correction data, control unit 41 calculates a correction value for correcting horizontal positional deviation of nozzle 10 due to elevation of nozzle 10 between component mounting height H2 at which component D is mounted on board 3 and component recognition height H1 at which component D is recognized.

[0136] The first height and the second height referred to here may be different heights and may be heights at which the shaft 8A (that is, the nozzle 10) can be raised and lowered in the Z direction and the −Z direction.

[0137] As a result, each of the component mounting devices M3 to M6 according to the first and second embodiments can calculate the horizontal deviation (correction value) of the tip position of the nozzle 10 at each of two different heights (first and second heights) at a predetermined rotation angle of the shaft 8A (i.e., the nozzle 10) (i.e., in the XY plane, approximately the same plane as the component mounting surface of the board 3, etc.). Therefore, each of the component mounting devices M3 to M6 according to the first and second embodiments can correct the horizontal movement amount of the mounting head 8 by the component mounting mechanism 12 based on the calculated correction value, thereby reducing the horizontal deviation (on the XY plane) between the component mounting position in the production data and the actual component mounting position when the shaft 8A is raised or lowered from the component recognition height H1 to the component mounting height H2. In other words, each of the component mounting devices M3 to M6 according to the first and second embodiments can further improve component mounting accuracy and, because it can calculate the correction value based on the generated correction data, can perform the component mounting process more efficiently.

[0138] As described above, the first height in the first and second embodiments is the component mounting height H2. The second height is the component recognition height H1. As a result, each of the component mounting devices M3 to M6 according to the first and second embodiments can calculate the deviation (correction value) in the horizontal direction (i.e., the XY plane, approximately the same plane as the component mounting surface of the board 3) of the tip position of the nozzle 10 at each of the component recognition height H1 and the component mounting height H2 at a predetermined rotation angle of the shaft 8A (i.e., the nozzle 10). As a result, each of the component mounting devices M3 to M6 according to the first and second embodiments can further improve the component mounting accuracy and perform the component mounting process more efficiently based on the calculated deviation (correction value).

[0139] As described above, each of the calibration cameras 9B, 9C provided in each of the component mounting devices M3 to M6 according to embodiment 1 has glass 94 (an example of a light guide) on an imaging surface 93A of an image sensor 93, and images the nozzle 10 at a first height in an area AR1 (an example of a first area) where the glass 94 is arranged, and images the nozzle 10 at a second height on the imaging surface 93A but outside the area AR1. This allows each of the component mounting devices M3 to M6 according to embodiment 1 to capture images of the tip of the nozzle 10 at two different heights (i.e., the first height and the second height), and generate position data (trajectory TR2 shown in FIG. 9) of the nozzle 10 at the component mounting height H2.

[0140] As described above, each of the component mounting devices M3 to M6 according to the second embodiment further includes an elevation mechanism 13 that can raise and lower the calibration camera 9C between the first height and the second height. This allows each of the component mounting devices M3 to M6 according to the second embodiment to capture images of the tip of the nozzle 10 at two different heights (i.e., the first height and the second height) without raising and lowering the mounting head 8, thereby enabling more efficient generation of correction data.

[0141] As described above, the nozzle 10 provided in each of the component mounting devices M3 to M6 according to the first and second embodiments is mounted on a rotatable shaft 8A and rotated around the rotation axis R of the shaft 8A at a plurality of different rotation angles (e.g., 0°, 90°, 180°, 270°, etc.). The calibration cameras 9B and 9C capture images of the nozzle 10 at a plurality of different rotation angles at each of the first and second heights. The control unit 41 measures the first and second positions of the nozzle 10 based on the captured images. As a result, each of the component mounting devices M3 to M6 according to the first and second embodiments can obtain trajectories TR1 and TR2 of the tip position of the nozzle 10 when the nozzle 10 is rotated around the rotation axis R of the shaft 8A. Therefore, even when the orientation of component D sucked and held by nozzle 10 is rotated and raised or lowered from component recognition height H1 to component mounting height H2, each of component mounting devices M3 to M6 according to embodiments 1 and 2 can calculate a correction value based on the distance between two points on trajectories TR1 and TR2 at a predetermined rotation angle for rotating component D (e.g., the positional difference between tip position PS11 and tip position PS12 shown in FIG. 9 ). In other words, each of component mounting devices M3 to M6 according to embodiments 1 and 2 can further improve component mounting accuracy and can calculate a correction value based on the generated correction data, thereby more efficiently executing component mounting processing.

[0142] Furthermore, the correction data generated by each of the component mounting devices M3 to M6 according to the first and second embodiments includes a trajectory TR1 (an example of trajectory information) of the nozzle 10 position at each of a plurality of different rotation angles at the first height, and a trajectory TR2 (an example of trajectory information) of the nozzle position at each of a plurality of different rotation angles at the second height. As a result, even when each of the component mounting devices M3 to M6 according to the first and second embodiments rotates the orientation of the component D held by the nozzle 10 and raises or lowers the component D from the component recognition height H1 to the component mounting height H2, each of the component mounting devices M3 to M6 according to the first and second embodiments can calculate a correction value based on the distance between two points on the trajectory TR1, TR2 at a predetermined rotation angle at which the component D is rotated (e.g., the positional difference between the leading edge position PS11 and the leading edge position PS12 shown in FIG. 9 ). In other words, each of the component mounting devices M3 to M6 according to the first and second embodiments can further improve component mounting accuracy and can perform component mounting processes more efficiently because it can calculate a correction value based on the generated correction data.

[0143] As described above, the calibration cameras 9B and 9C provided on each of the component mounting devices M3 to M6 according to the first and second embodiments capture an image of the tip of the nozzle 10. This allows each of the component mounting devices M3 to M6 according to the first and second embodiments to generate correction data based on the captured image of the tip of the nozzle 10, thereby enabling more accurate correction of the component mounting position on the board 3 of the component D that is sucked onto the tip of the nozzle 10.

[0144] As described above, the component mounting system 100 according to the first and second embodiments is a component mounting system 100 including component mounting devices M3 to M6 that mount components D on the board 3, and a management computer P1 (an example of a computer) that is communicably connected to the component mounting devices M3 to M6. The component mounting devices M3 to M6 are located at a first height and a second height, and capture images of the nozzles 10 that hold the components D from below (in the -Z direction), and transmit the captured images to the management computer P1. Based on the transmitted captured image, management computer P1 measures a first position of nozzle 10 at a first height (e.g., tip positions PS12, PS22, PS32, and PS42 of nozzle 10B shown in FIG. 8) and a second position of nozzle 10 at a second height (e.g., tip positions PS11, PS21, PS31, and PS41 of nozzle 10A shown in FIG. 8). Based on the measured first and second positions of nozzle 10A, management computer P1 generates correction data for correcting the position of nozzle 10 in a horizontal direction substantially parallel to the mounting surface where component D is mounted on board 3, and transmits the correction data to component mounting devices M3-M6. Based on the transmitted correction data, component mounting devices M3-M6 calculate a correction value for correcting horizontal positional deviation of nozzle 10 due to elevation of nozzle 10 between component mounting height H2 where component D is mounted on board 3 and component recognition height H1 where component D is recognized.

[0145] As a result, the component mounting systems 100 according to the first and second embodiments can calculate, based on the captured images transmitted from each of the component mounting devices M3 to M6, the horizontal (i.e., XY plane, or substantially the same plane as the component mounting surface of the board 3) deviations (correction values) of the tip positions of the nozzles 10 at two different heights (first and second heights) at a predetermined rotation angle of the shaft 8A (i.e., the nozzles 10). Therefore, the component mounting systems 100 according to the first and second embodiments can correct the horizontal movement amount of the mounting head 8 by the component mounting mechanism 12 based on the calculated correction values, thereby reducing the horizontal (XY plane) deviation between the component mounting position in the production data and the actual component mounting position when the shaft 8A is raised or lowered from the component recognition height H1 to the component mounting height H2. In other words, the component mounting systems 100 according to the first and second embodiments can further improve component mounting accuracy and, because they can calculate correction values ​​based on the generated correction data, can more efficiently perform component mounting processing.

[0146] Although various embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that those skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also fall within the technical scope of the present disclosure. Furthermore, the components of the various embodiments described above may be combined in any manner without departing from the spirit of the invention. [Industrial Applicability]

[0147] The present disclosure is useful for a component mounting apparatus, a component mounting system, and a calibration method that can correct misalignment of nozzles in the horizontal direction with higher accuracy. [Explanation of symbols]

[0148] 1 base 2. Substrate transport mechanism 3. Circuit Board 4. Parts Supply Department 5 Tape Feeder 6A, 6B Y-axis beam 7A, 7B X-axis beam 8 Placement head 8A shaft 9A PCB Recognition Camera 9B,9C Calibration Camera 10 nozzles 11 Parts Recognition Camera 12 Component mounting mechanism 13 Lifting mechanism 14 Height-adjustable table 15 Lifting section 91,92 Lens 93 Image Sensor 93A imaging surface 94 Glass 100 Component Placement System AR1,AR2 area H1 Component recognition height H2 Part mounting height M3,M4,M5,M6 parts mounting device P1 Management Computer

Claims

1. A component mounting device that mounts components on a board, a nozzle for holding the component; a mounting head including the nozzle and capable of transporting the component onto the substrate; an imaging unit that images the nozzle located at a first height and a second height different from the first height from below; a calculation unit that measures a first position of the nozzle at the first height and a second position of the nozzle at the second height based on an image captured by the imaging unit, and generates correction data for correcting the position of the nozzle in a horizontal direction substantially parallel to a mounting surface for mounting the component on the board based on the measured first position and second position of the nozzle, the imaging unit has a light guide on an imaging surface of an image sensor, and images the nozzle at the first height in a first region in which the light guide is arranged, and images the nozzle at the second height on the imaging surface and outside the first region; the calculation unit calculates, based on the correction data, a correction value for correcting a positional deviation of the nozzle in the horizontal direction due to elevation of the nozzle between a component mounting height at which the component is mounted on the board and a component recognition height at which the component is recognized. Component placement device.

2. the first height is the component mounting height, the second height is the component recognition height; 2. The component mounting device according to claim 1.

3. further comprising an elevation mechanism capable of elevating the imaging unit between the first height and the second height; 3. The component mounting device according to claim 2.

4. The nozzle is attached to a rotatable shaft and rotated around a rotation axis of the shaft at a plurality of different rotation angles; the imaging unit images the nozzle at the plurality of different rotation angles at each of the first height and the second height, the calculation unit measures the first position and the second position of the nozzle based on the captured image; 3. The component mounting device according to claim 2.

5. the correction data includes trajectory information of the position of the nozzle at each of the plurality of different rotation angles at the first height, and trajectory information of the position of the nozzle at each of the plurality of different rotation angles at the second height, 5. The component mounting apparatus according to claim 4.

6. The imaging unit images the tip of the nozzle.

5. The component mounting device according to claim 2.

7. a component mounting device that mounts components onto a board; a computer connected to the component mounting device so as to be able to communicate with the component mounting device, The component mounting device A light guide is provided on the imaging surface of the image sensor, taking an image of a first region in which the light guide is disposed and a nozzle located at a first height and holding the component from below; capturing an image of the nozzle located on the imaging surface, outside the first region, and at a second height from below, and transmitting the captured image to the computer; The computer measuring a first position of the nozzle at the first height and a second position of the nozzle at the second height based on the transmitted captured image; generating correction data for correcting the position of the nozzle in a horizontal direction substantially parallel to a mounting surface for mounting the component on the board based on the measured first position and second position of the nozzle, and transmitting the correction data to the component mounting device; The component mounting device calculating a correction value for correcting a positional deviation of the nozzle in the horizontal direction due to elevation of the nozzle between a component mounting height at which the component is mounted on the board and a component recognition height at which the component is recognized, based on the transmitted correction data; Parts mounting system.

8. the first height is the component mounting height, the second height is the component recognition height; 8. The component mounting system according to claim 7.

9. 1. A calibration method performed by a component mounting apparatus that mounts components on a board, comprising: the component mounting device has a light guide on an imaging surface of an image sensor, taking an image of a first region in which the light guide is disposed and a nozzle located at a first height and holding the component from below; taking an image of the nozzle located at a second height on the imaging surface and outside the first region from below; measuring a first position of the nozzle at the first height and a second position of the nozzle at the second height based on the captured image; generating correction data for correcting the position of the nozzle in a horizontal direction substantially parallel to a mounting surface for mounting the component on the board based on the measured first position and second position of the nozzle; calculating a correction value for correcting a positional deviation of the nozzle in the horizontal direction due to elevation of the nozzle between a component mounting height at which the component is mounted on the board and a component recognition height at which the component is recognized, based on the transmitted correction data; Calibration method.

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