Photonics-electronics convergence module

Abstract

The object is to provide a photonics-electronics integrated module with improved information processing performance. [Solution] Provided is an optoelectronic fusion module comprising a common substrate, an integrated circuit chip section, and an optical engine section, wherein the integrated circuit chip section and the optical engine section are mounted on the common substrate, and an electrical wiring section is formed on the common substrate, and the electrical wiring section electrically connects the integrated circuit chip section and the optical engine section, the optical engine section has an optical receiving section and an optical transmitting section, and the optical engine section is optically connected to a multicore fiber, the optical receiving section generates a received electrical signal from a received optical signal, and the optical transmitting section generates a transmitted optical signal from a transmitted electrical signal, and the multicore fiber is configured with multiple cores surrounded by a cladding, and is optically connected to at least one of the optical receiving section and the optical transmitting section.

Description

[Technical Field]

[0001] The present invention relates to an optoelectronic hybrid module. [Background technology]

[0002] In recent years, the amount of information processed at data centers has been increasing due to the rapid increase in communication traffic between large-scale data centers and the rapid development of AI (artificial intelligence). Against this background, there is a demand for improving the information processing performance of optical communication systems within data centers. Here, a technology has been proposed that uses equipment equipped with, for example, an SFP (Small Form-factor Pluggable) optical transceiver module (hereinafter simply referred to as a module) for converting optical signals and electrical signals in data centers (see, for example, Patent Document 1). Such an SFP module is attached to, for example, the front panel of a network device, and optical communication is realized by connecting a single-core optical fiber to this module. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-198172 Summary of the Invention [Problem to be solved by the invention]

[0004] The use of a single-core optical fiber limits communication capacity, and in addition, with SFP modules, the electrical wiring length from the integrated circuit (e.g., switch ASIC) to the module becomes longer, which raises concerns about delays (reduced processing speed) and signal degradation. Thus, conventional optical signal / electrical signal conversion modules face the issue of being unable to handle the increasing volume of information being processed in data centers.

[0005] An object of the present invention is to provide a photonics-electronics hybrid module with improved information processing performance. [Means for solving the problem]

[0006] According to the present invention, there is provided an optoelectronic fusion module comprising a common substrate, an integrated circuit chip section, and an optical engine section, wherein the integrated circuit chip section and the optical engine section are mounted on the common substrate, and an electrical wiring section is formed on the common substrate, and the electrical wiring section electrically connects the integrated circuit chip section and the optical engine section, the optical engine section has an optical receiving section and an optical transmitting section, and the optical engine section is optically connected to a multicore fiber, the optical receiving section generates a received electrical signal from a received optical signal, and the optical transmitting section generates a transmitted optical signal from a transmitted electrical signal, and the multicore fiber is configured with multiple cores surrounded by a cladding, and is optically connected to at least one of the optical receiving section and the optical transmitting section.

[0007] In the present invention, the integrated circuit chip section and the optical engine section are mounted on a common substrate, which makes it easier to reduce the wiring length of the electrical wiring section that electrically connects the integrated circuit chip section and the optical engine section, and furthermore, the optical engine section is configured to be optically connected to the multi-core fiber, which improves information processing performance. [Brief explanation of the drawings]

[0008] [Figure 1] Fig. 1A is a perspective view of an optoelectronic module 100 according to an embodiment. Fig. 1B is an enlarged view of a region B shown in Fig. 1A, and is an explanatory diagram schematically illustrating the configuration of a multi-core fiber 4 as an optical fiber. [Figure 2] FIG. 2 is a top view of the photonics-electronic module 100 shown in FIG. 1A. [Figure 3] Fig. 3A is a schematic vertical cross-sectional view of the photonics-electrical hybrid module 100 shown in Fig. 2. Fig. 3B is an enlarged view of region B shown in Fig. 3A. [Figure 4]Fig. 4A is a perspective view for explaining the configuration of the optical engine unit 2 and the multi-core fiber 4 connected to the optical engine unit 2. Fig. 4B is a side view of the configuration shown in Fig. 4A. In Fig. 4B, cores 4q inside the multi-core fiber 4 are schematically shown by dashed lines. [Figure 5] FIG. 5 is a schematic diagram for explaining the configuration of the optical engine unit 2. As shown in FIG. [Figure 6] FIG. 6A schematically shows a state in which a resist p1 for forming a photonic wire portion has been formed. FIG. 6B schematically shows a state in which a laser (femtosecond laser) is irradiated onto the resist p1 to cause a photocurable material in the resist p1 to react and form a photonic wire portion 2a. FIG. 6C schematically shows a state in which the photonic wire portion 2a has been formed in the resist p1. FIG. 6D schematically shows a state in which the resist p1 shown in FIG. 6C has been peeled off. FIG. 6E schematically shows a state in which a cladding portion 2b has been formed around the photonic wire portion 2a. [Figure 7] FIG. 7 is a top view showing a modified example of the arrangement of the light engine unit 2. In FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Various features shown in the following embodiments can be combined with each other. Furthermore, each feature can be an invention independently.

[0010] 1. Description of the configuration of the embodiment 1A to 2, the overall configuration of an optoelectronic module 100 according to this embodiment will be described. The optoelectronic module 100 includes an integrated circuit chip unit 1, an optical engine unit 2, a common substrate 3, a multi-core fiber 4, a main substrate 5, and a cover unit 6 (the cover unit 6 is schematically shown by a dashed line in FIG. 1A). The optical engine unit 2 is optically connected to the multi-core fiber 4.

[0011] The photonics-electronics module 100 can be applied to, but is not limited to, high-speed optical interconnects in data centers (such as hyperscale data centers and edge data centers), etc. The photonics-electronics module 100 is also suitable for applications requiring high-speed, large-capacity communications (such as AI computing clusters, connections to 5G / 6G base stations, and connections to quantum computers).

[0012] 1-1. Integrated circuit chip section 1 The integrated circuit chip unit 1 is a component that performs central signal processing in the photonics-electronics hybrid module 100. The integrated circuit chip unit 1 can be configured, for example, from a switch ASIC (Application Specific Integrated Circuit), a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a DSP (Digital Signal Processor), or a combination thereof, but is not limited to these.

[0013] 2, the integrated circuit chip portion 1 has a rectangular shape with four sides 1a when viewed from above. The integrated circuit chip portion 1 is provided with a plurality of electrode pads, for example, on the lower part of the sides 1a, and electrical connection with the common substrate 3 (electrical connection with the electrical wiring portion w described below) is realized via these electrode pads.

[0014] 1-2. Light engine part 2 The optical engine unit 2 has a function of converting an optical signal into an electrical signal, and a function of converting an electrical signal into an optical signal. Specifically, the optical engine unit 2 has a function of converting an optical signal input from an optical fiber (multi-core fiber 4) into an electrical signal and supplying it to the integrated circuit chip unit 1, and a function of converting an electrical signal input from the integrated circuit chip unit 1 into an optical signal and outputting it to the optical fiber (multi-core fiber 4). In the embodiment, the optical engine unit 2 is disposed adjacent to the integrated circuit chip unit 1. Also, in the embodiment, the photonics-electronic module 100 includes a plurality of optical engine units 2.

[0015] The optical engine unit 2 may have various signal processing functions (e.g., signal amplification function, signal waveform shaping function, modulation / demodulation function, etc.) and various optical functions (e.g., wavelength division multiplexing function, optical switching function, optical amplification function, optical attenuation function, etc.).

[0016] As shown in FIGS. 4A to 5, the optical engine unit 2 has a photonic wire unit 2a, a cladding unit 2b, an optical waveguide 2c, an optical coupling unit 2cp, a tip unit 2d, and a base unit 2e.

[0017] 1-2-1. Arrangement of the optical engine unit 2 First, the arrangement of the plurality of optical engine units 2 relative to the integrated circuit chip unit 1 will be described. As shown in Fig. 2, the multiple optical engine units 2 are arranged side by side on the side 1a of the integrated circuit chip unit 1. In addition, as shown in Fig. 2, the multiple optical engine units 2 are arranged radially with the integrated circuit chip unit 1 as the center. In the example of the embodiment, four optical engine units 2 are arranged along the side 1a, but this is not limited thereto, and the number may be one to three, or five or more. In the example of the embodiment, four optical engine units 2 are arranged evenly along each side 1a, but the number of optical engine units 2 arranged may vary from one side 1a to another (for example, two optical engine units 2 along one side 1a and four optical engine units 2 along another side 1a). Furthermore, some of the sides 1a may have no optical engine units 2 arranged along them. In other words, in the embodiment, multiple optical engine units 2 are arranged radially around the integrated circuit chip unit 1, but this is not limited thereto, and the arrangement positions may be biased.

[0018] 2, the distance wd is the distance wd between a pair of adjacent optical engine units 2. The pair of adjacent optical engine units 2 referred to here is selected from among the optical engine units 2 on each side 1a of the integrated circuit chip unit 1. In other words, it refers to a pair of adjacent optical engine units 2 on the same side 1a, and does not mean optical engine units 2 selected one from each of the different sides 1a. Specifically, the distance wd (mm) may be, for example, 0, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.5, 3.0, 3.5, 4.0, 4.5, or 5.0 mm, and may be within the range of the two values ​​exemplified here. For example, the distance wd is 0 mm or more and 5.0 mm or less. Preferably, the distance wd is 0 mm or more and 0.5 mm or less. Note that the multiple optical engine units 2 on each side 1a may be unitized and configured as a single optical engine unit. When the multiple optical engine units 2 are unitized, the distance wd is 0 mm.

[0019] As described above, by setting the distance wd to 0.5 mm or less, it becomes possible to arrange many optical engine units 2 at high density in the limited peripheral region of the integrated circuit chip unit 1. This leads to making maximum use of the extremely fine optical path structure using the photonic wire units 2a. That is, in the embodiment, a complex optical path structure using, for example, multiple lenses is not adopted, but an optical path structure using the photonic wire units 2a is adopted, which makes it possible to achieve high density structurally and arrange multiple optical engine units 2 at high density. Furthermore, because the optical engine units 2 can be arranged at high density, variation in the electrical wiring length (the length of the electrical wiring unit w, described below) between the integrated circuit chip unit 1 and each optical engine unit 2 is reduced, and this is expected to have the effect of ensuring stability in information processing.

[0020] 1-2-2. Photonic wire section 2a 4A and 4B, the photonic wire portion 2a is a fine optical waveguide structure that three-dimensionally connects the optical waveguide 2c and each core 4q of the multicore fiber 4. The photonic wire portion 2a can be formed as a thin optical waveguide having a diameter of, for example, about several μm to several tens of μm. The diameter of the photonic wire portion 2a is not limited to this, but may be determined depending on whether an optical signal can be propagated appropriately. 4A and 4B, the diameter of the photonic wire portion 2a does not need to be constant along the extending direction of the photonic wire portion 2a and may vary. For example, the photonic wire portion 2a may have a tapered shape that is thin on the optical coupling portion 2cp side and thick on the core 4q (see FIG. 4B) side of the multicore fiber 4, or may have a structure in which the diameter changes in the middle portion.

[0021] As shown in FIG. 4B, the multiple photonic wire portions 2a extend toward the corresponding cores 4q (in the embodiment, the cores 4q correspond to the receiving core 4q1, the transmitting core 4q2, and the external laser core 4q3 shown in FIG. 1B), and each photonic wire portion 2a forms an optical path independent of the others. Specifically, each photonic wire portion 2a extends from the optical coupling portion 2cp to the tip tp of the core 4q. Furthermore, each photonic wire portion 2a optically connects the optical coupling portion 2cp and the core 4q (the tip of the core 4q).

[0022] Here, the photonic wire portion 2a preferably has the same or similar refractive index to the core 4q of the multicore fiber 4 and the optical waveguide 2c to achieve smooth propagation of an optical signal. For example, the refractive index of the photonic wire portion 2a is n1, the refractive index of the core 4q is n2, and the refractive index of the optical waveguide 2c is n3. In this case, the refractive index n1 is preferably within the range of 0.9×n2 or more and 1.1×n2 or less. Furthermore, the refractive index n1 is preferably within the range of 0.9×n3 or more and 1.1×n3 or less.

[0023] The photonic wire portion 2a is formed by three-dimensionally shaping a material containing a photocurable resin composition using a laser. The method for forming the photonic wire portion 2a and the materials used to form it will be briefly explained in "2. Explanation of the process for forming the photonic wire portion 2a" below.

[0024] In one example of the embodiment, the entire photonic wire portion 2a is separated from the common substrate 3. With this configuration, a space is formed between the photonic wire portion 2a and the common substrate 3, and direct transmission of thermal effects and mechanical stress from the common substrate 3 to the photonic wire portion 2a is suppressed. Note that, although the example of the embodiment is described as the entire photonic wire portion 2a being separated from the common substrate 3, this is not limiting, and a part of the photonic wire portion 2a may be disposed close to the common substrate 3 so as to be along the common substrate 3, or may be in physical contact with the common substrate 3.

[0025] In one embodiment, the photonic wire portion 2a is curved so as to form a convex shape in a direction away from the common substrate 3. This curved shape forms a smooth optical path from the optical coupling portion 2cp to the tip 4a of the multicore fiber 4, thereby suppressing optical propagation loss. The curved shape also provides the photonic wire portion 2a with appropriate flexibility, and is expected to have the effect of improving resistance to thermal expansion and external stress. The shape of the photonic wire portion 2a is not limited to the curved shape described above, and does not have to be convex.

[0026] 1-2-3. Cladding part 2b The cladding portion 2b has, for example, a function of confining light propagating through the photonic wire portion 2a (total reflection function), a function of mechanically protecting the photonic wire portion 2a, and a function of blocking the environment of the photonic wire portion 2a (for example, moisture-proofing and dust-proofing). The cladding portion 2b is provided to cover the photonic wire portion 2a. In other words, the cladding portion 2b is an optical coating layer formed to surround the outer circumferential surface of the photonic wire portion 2a. In one example of the embodiment, the cladding portion 2b is provided over the entire length of the photonic wire portion 2a. Note that the cladding portion 2b may be provided to surround a partial section of the photonic wire portion 2a, and the remaining portion may be surrounded by a configuration other than the cladding portion 2b.

[0027] The refractive index of the cladding portion 2b is smaller than the refractive index of the photonic wire portion 2a, which satisfies the condition for total reflection and efficiently confines the optical signal within the photonic wire portion 2a.

[0028] The constituent material of the cladding portion 2b is not limited, and it can be made of, for example, fluorine-doped silica glass, pure silica glass, a fluorine-based polymer, a silicon-based polymer, a UV-curable acrylate resin, etc. Although the cladding portion 2b is shown in Figures 4A and 4B as a substantially rectangular parallelepiped region surrounding the periphery of the photonic wire portion 2a, its shape is not limited to this.

[0029] 1-2-4. Optical waveguide 2c and optical coupling part 2cp The optical coupling portion 2cp is a portion optically connected to the optical waveguide 2c. Specifically, the optical coupling portion 2cp is a connection portion between the photonic wire portion 2a and the optical waveguide 2c. The optical coupling portion 2cp can employ various configurations, such as a grating coupler (diffraction grating optical coupling portion), an edge coupler, or a taper coupler. For example, when a grating coupler is employed, the optical path can be converted to the vertical direction.

[0030] 5, the optical waveguide 2c optically connects the various components of the optical engine unit 2. For example, the optical waveguide 2c through which the received optical signal sg1 passes extends from the optical coupling unit 2cp to the optical receiving unit 2f. The optical waveguide 2c through which the transmitted optical signal sg2 passes extends from the optical coupling unit 2cp to the optical transmitting unit 2g. Furthermore, the optical waveguide 2c through which the external laser light lz passes also extends from another optical coupling unit 2cp to the optical transmitting unit 2g.

[0031] The optical waveguide 2c can be configured to have a linear shape, a curved shape, or a combination thereof. The optical waveguide 2c may include an optical functional element such as an optical branching device, an optical multiplexer, an optical switch, or a wavelength filter.

[0032] The optical waveguide 2c can be made of a semiconductor-based waveguide, a glass-based waveguide, or a polymer-based waveguide. An example of a semiconductor waveguide is a silicon wire waveguide formed by silicon photonics technology. Examples of glass-based waveguides include glass waveguides made of various glass materials. Polymer-based waveguides include polymer waveguides made of organic materials. These optical waveguides 2c may be formed integrally with the chip portion 2d, or may be formed on a substrate separate from the chip portion 2d. The optical waveguides 2c may be configured as single-mode waveguides or multi-mode waveguides.

[0033] 1-2-5. Tip part 2d 4A to 5 can be configured as a chip formed by silicon photonics, and has an optical receiving unit 2f and an optical transmitting unit 2g. That is, the optical receiving unit 2f and the optical transmitting unit 2g are integrated into a common silicon photonics chip (chip unit 2d). Furthermore, the chip unit 2d is provided with the above-mentioned optical waveguide 2c.

[0034] The optical receiving unit 2f is configured to generate a received electrical signal (see received electrical signal st1 in FIG. 3B) from a received optical signal (see received optical signal sg1 in FIGS. 1B and 5). Specifically, the optical receiving unit 2f can be configured with a photodiode (PD). As the photodiode, various configurations can be adopted, such as a germanium (Ge) photodiode, a silicon-germanium (SiGe) photodiode, or an InGaAs photodiode. The optical receiving unit 2f may also include a receiving circuit such as an amplifier.

[0035] The optical transmitting unit 2g is configured to generate a transmission optical signal (see the transmission optical signal sg2 in FIGS. 1B and 5) from a transmission electrical signal (see the transmission electrical signal st2 in FIG. 3). The optical transmitting unit 2g can be configured, for example, by an optical modulator that modulates the external laser light lz supplied from the external laser core 4q3 based on the transmission electrical signal st2 from the integrated circuit chip unit 1. The optical transmitting unit 2g may include a transmission circuit such as a driver circuit or a temperature compensation circuit.

[0036] 1-2-6. Base part 2e The base portion 2e is a member that functions as a base supporting the chip portion 2d. The base portion 2e shown in FIGS. 4A and 4B is located on a common substrate 3 (not shown in FIGS. 4A and 4B), and the chip portion 2d is mounted on its upper surface. The base portion 2e can be formed of, for example, a substrate, and may be provided with a heat sink. That is, the base portion 2e may have the function of efficiently dissipating heat generated in the chip portion 2d in addition to the function of mechanically supporting the chip portion 2d. The base portion 2e also functions to adjust the height between the chip portion 2d and the common substrate 3, allowing the photonic wire portion 2a to extend toward the multi-core fiber 4 at an appropriate angle. Furthermore, the base portion 2e may be electrically connected to an electrical wiring portion w (see FIG. 3B), which will be described later, or may have a hole formed therein through which an electrically conductive portion connected to the electrical wiring portion w passes to the chip portion 2d, or both may be combined.

[0037] 1-3. Common board 3 As shown in FIGS. 3A and 3B, an integrated circuit chip unit 1 and an optical engine unit 2 are mounted on a common substrate 3. Also, as shown in FIG. 3B, an electrical wiring unit w is formed on the common substrate 3. This electrical wiring unit w electrically connects the integrated circuit chip unit 1 and the optical engine unit 2. The material of the common substrate 3 is not particularly limited, and may be, for example, a printed circuit board (PCB), an organic substrate, a ceramic substrate, or other material. The electrical wiring unit w is formed inside (inner layer) or on the surface of the common substrate 3. The integrated circuit chip unit 1 and the optical engine unit 2 are electrically connected by the electrical wiring unit w. Because the integrated circuit chip unit 1 and the optical engine unit 2 are mounted together on the common substrate 3, the length of the electrical wiring (the length of the electrical wiring unit w) between the integrated circuit chip unit 1 and the optical engine unit 2 is reduced.

[0038] 1-4. Multicore fiber 4 1B, the multi-core fiber 4 is an optical fiber configured such that multiple cores 4q are surrounded by a cladding 4s. The multiple cores 4q include a receiving core 4q1, a transmitting core 4q2, and an external laser core 4q3.

[0039] The receiving core 4q1 is optically connected to the optical receiving unit 2f of the optical engine unit 2. That is, the receiving core 4q1 transmits a received optical signal sg1 from the outside and guides it to the optical receiving unit 2f via the photonic wire unit 2a. The transmitting core 4q2 is a core independent of the receiving core 4q1, and is optically connected to the optical transmitting unit 2g of the optical engine unit 2. The transmitting core 4q2 receives the transmission optical signal sg2 generated in the optical transmitting unit 2g via the photonic wire unit 2a and transmits it to the outside.

[0040] The external laser core 4q3 is a core for supplying laser light (hereinafter also referred to as external laser light lz) for generating the transmission optical signal sg2 to the optical transmitting unit 2g of the optical engine unit 2. The external laser core 4q3 is optically connected to the laser light generating unit. Note that the laser light generating unit is arranged independently of the optical engine unit 2. The laser light generating unit can be configured, for example, by a wavelength-tunable laser generating source installed outside the photonics-electrical module 100. In the embodiment, by adopting such an external laser method, heat generation in the optical engine unit 2 is suppressed, the optical engine unit 2 can be made smaller, and high-density packaging of the components of the photonics-electrical module 100 can be achieved.

[0041] The tip portion 4a of the multi-core fiber 4 forms an inclined surface. Specifically, the inclined surface of the tip portion 4a is formed so as to be inclined with respect to the axial direction of the multi-core fiber 4. Then, each tip tp of each core 4q is arranged on the inclined surface of the tip portion 4a. Specifically, the angle of the end face of the tip portion 4a of the multicore fiber 4 is, for example, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, or 90 degrees with respect to the axial direction of the multicore fiber 4, and may be within the range of the two values ​​exemplified here. In the embodiment, as an example, the end face of the tip portion 4a of the multicore fiber 4 is an inclined surface at an angle of 45 degrees with respect to the axial direction of the multicore fiber 4. Note that when the end face of the tip portion 4a is inclined at an angle of 90 degrees, it is not an inclined surface but a vertical surface.

[0042] The inclined surface of the tip 4a of the multi-core fiber 4 is arranged so as not to face the common substrate 3. In one example of the embodiment, the inclined surface of the tip 4a of the multi-core fiber 4 faces upward (the opposite side from the common substrate 3 when viewed from the multi-core fiber 4). This arrangement facilitates the formation of the photonic wire portion 2a by the laser writing method as shown in FIG. 6B . That is, since the inclined surface faces upward, the multi-core fiber 4 itself does not become an obstacle when irradiating with laser light from above, and the connection portion between the tip tp of each core 4q and the photonic wire portion 2a can be precisely formed. Furthermore, since a working space is secured when forming the photonic wire portion 2a and the degree of freedom in the laser irradiation angle is increased, it can be expected that it will be easier to form photonic wire portions 2a with complex three-dimensional shapes. Furthermore, visibility during modeling is improved, which also contributes to improved alignment accuracy.

[0043] Furthermore, there are optical advantages to having the tip portion 4a as an inclined surface. If the end face of the tip portion 4a were a vertical surface (90 degrees relative to the axial direction of the multicore fiber 4), there would be a higher possibility that light reflected at the interface between the core 4q and the photonic wire portion 2a would return in the direction opposite to the traveling direction (for example, a direction 180 degrees opposite to the traveling direction). In contrast, by making the surface inclined, the light reflected at the interface is reflected at an angle different from the direction opposite to the traveling direction, which prevents the reflected light from attenuating the light propagating in the traveling direction within the core 4q, contributing to improved light utilization efficiency.

[0044] Here, it has been described that the inclined surface of the tip 4a of the multi-core fiber 4 faces upward, but this is not limited to this, and it may face, for example, sideways (horizontally), diagonally upward, or diagonally downward.

[0045] 1-5. Main board 5 The common board 3 is mounted on the main board 5. The main board 5 is a board larger than the common board 3. In addition to the common board 3, additional components (for example, a power supply circuit, a control circuit, a cooling mechanism such as a heat sink, an optical connector section, etc.) can also be mounted on the main board 5. 1A and other figures show the multi-core fiber 4 extending outside the photonics-electrical module 100, but the present invention is not limited to this. An optical connector unit (not shown) may be provided as an accessory component on a device in which the photonics-electrical module 100 is mounted, or on a main board 5 of the photonics-electrical module 100. The optical connector unit may be configured to optically connect the multi-core fiber 4 and an external multi-core fiber (not shown). The external multi-core fiber is to be connected to, for example, a network device, a module, an optical fiber, or the like external to the photonics-electrical module 100.

[0046] 1-6. Cover part 6 1A, the cover unit 6 is a member provided so as to cover, for example, at least a part of or the entire common substrate 3, the integrated circuit chip unit 1, and the optical engine unit 2. The cover unit 6 can be made of, for example, a metal cover, a resin cover, or a composite material thereof. In the embodiment, the photonics-electrical hybrid module 100 is described as including the cover portion 6, but whether or not the cover portion 6 is included is optional.

[0047] The cover 6 has the function of protecting the internal optical and electronic components from external mechanical shocks, dust, moisture, etc. The cover 6 may also have an electromagnetic shielding function, which suppresses the radiation of electromagnetic noise generated from the photonics-electrical module 100 and the intrusion of electromagnetic noise from the outside.

[0048] The cover part 6 may be provided with an opening (for example, an opening) for passing the multi-core fiber 4 through, or a ventilation hole for heat dissipation. Furthermore, the cover part 6 may be provided with a heat sink to promote heat dissipation.

[0049] 2. Explanation of the process for forming the photonic wire portion 2a The steps of forming the photonic wire portion 2a will be briefly described with reference to FIGS. 6A to 6E. The photonic wire portion 2a is formed by laser direct writing using two-photon absorption. First, as shown in FIG. 6A, a resist p1 is formed in the region where the photonic wire portion 2a is to be formed. This region includes the tip portion 4a of the multi-core fiber 4. The resist p1 contains a photocurable compound and a photopolymerization initiator.

[0050] Next, as shown in FIG. 6B, a femtosecond laser is irradiated onto the resist p1. The laser light is focused via an objective lens p2, and a polymerization reaction of the photocurable material occurs at the focal position (focusing point) due to two-photon absorption. Then, by scanning the laser light three-dimensionally, an optical path (photonic wire portion 2a) from the optical coupling portion 2cp to the tip tp of each core 4q of the multi-core fiber 4 can be drawn, as shown in FIG. 6C. Note that the scanning of the laser light can be achieved by moving the object to be modeled (resist p1) itself or by moving the objective lens p2.

[0051] Thereafter, as shown in Fig. 6D, the uncured resist p1 is removed with a developer to expose the photonic wire portion 2a. Finally, as shown in Fig. 6E, a clad material is applied around the photonic wire portion 2a to form the clad portion 2b. This allows the photonic wire portion 2a surrounded by the clad portion 2b to be formed.

[0052] 3. Operation explanation 5, in a receiving operation, a received optical signal sg1 transmitted from outside propagates through the receiving core 4q1 of the multi-core fiber 4, passes through the photonic wire unit 2a and the optical waveguide 2c, and reaches the optical receiving unit 2f of the optical engine unit 2. As shown in FIGS. 3B and 5, the optical receiving unit 2f converts the received optical signal sg1 into a received electrical signal st1, and this received electrical signal st1 is transmitted to the integrated circuit chip unit 1 through the electrical wiring unit w.

[0053] As shown in FIGS. 3B and 5, in a transmission operation, a transmission electrical signal st2 output from the integrated circuit chip unit 1 is transmitted to the optical transmitting unit 2g of the optical engine unit 2 through the electrical wiring unit w. Meanwhile, an external laser light lz supplied from the laser light generating unit (see FIG. 1B) is supplied to the optical transmitting unit 2g through the external laser core 4q3 of the multi-core fiber 4. The optical transmitting unit 2g modulates this external laser light lz based on the transmission electrical signal st2 to generate a transmission optical signal sg2. The generated transmission optical signal sg2 is transmitted to the transmitting core 4q2 via the optical waveguide 2c and the photonic wire unit 2a.

[0054] 4. Description of the Functions and Effects of the Embodiments In the photonics-electronics module 100 of this embodiment, the integrated circuit chip unit 1 and the optical engine unit 2 are mounted on a common substrate 3, so the wiring length of the electrical wiring unit w between them can be significantly shortened. This suppresses signal delay and signal degradation, which have been problems in conventional SFP-type modules, and improves information processing performance. Furthermore, because the optical engine unit 2 is optically connected to the multicore fiber 4, a higher communication capacity can be achieved compared to a single-core fiber, further improving information processing performance.

[0055] By employing the photonic wire unit 2a, the photonic-electronic module 100 according to the embodiment can significantly reduce the volume of the optical system compared to an optical transmission structure using, for example, a lens, and enables high-density packaging of the optical engine unit 2. In addition, by employing an external laser system, heat generation in the optical engine unit 2 is suppressed, improving temperature stability and reliability.

[0056] 5. Other embodiments The following forms may be adopted: 7, multiple optical engine units 2 may be arranged in a completely radial pattern around the integrated circuit chip unit 1. In this arrangement, the optical engine units 2 are arranged at equal intervals (equal angular intervals) on a circumference centered on the integrated circuit chip unit 1, and the multi-core fibers 4 connected to each optical engine unit 2 extend radially. Even with this arrangement, the electrical wiring lengths from the integrated circuit chip unit 1 to each optical engine unit 2 can be made uniform.

[0057] It is particularly preferable to employ a photonic wire portion for the optical system connected to the multi-core fiber 4, but the present invention is not limited to this. For example, although the embodiment has been described with a configuration in which the optical receiving unit 2f is optically connected to the core 4q of the multi-core fiber 4 via the photonic wire unit 2a, the present invention is not limited to this. Instead of the photonic wire unit 2a, another optical system such as a lens may be used to focus the light emitted from the core 4q onto the optical receiving unit 2f. Furthermore, for the optical path in the optical transmitting unit 2g, another optical system may be used instead of the photonic wire unit 2a. Note that the other optical system may be, for example, a lens, a prism, a mirror, or a combination thereof, and for example, MEMS may be adopted.

[0058] Various embodiments are exemplified below, and the embodiments shown below can be combined with each other. [Appendix 1] a common substrate, an integrated circuit chip portion, and an optical engine portion; the integrated circuit chip unit and the optical engine unit are mounted on the common substrate, and an electrical wiring unit is formed on the common substrate; the electrical wiring section electrically connects the integrated circuit chip section and the optical engine section; the optical engine unit has an optical receiving unit and an optical transmitting unit, and the optical engine unit is optically connected to a multi-core fiber; the optical receiving unit generates a received electrical signal from a received optical signal; the optical transmitter generates a transmission optical signal from a transmission electrical signal; The multicore fiber is configured with a plurality of cores surrounded by a cladding, and is optically connected to at least one of the optical receiving unit and the optical transmitting unit. [Appendix 2] 10. The photonics-electronics hybrid module according to claim 1, the plurality of cores includes a receiving core and a transmitting core, the receiving core is optically connected to the optical receiving portion of the optical engine portion; a transmitting core that is independent of the receiving core and is optically connected to the optical transmitting unit of the optical engine unit; [Appendix 3] The photonics-electronics hybrid module according to Supplementary Note 1 or Supplementary Note 2, the plurality of cores further comprising an outer laser core; the external laser core is a core for supplying laser light for generating the transmission optical signal to the optical transmitting unit of the optical engine unit, and the external laser core is optically connected to a laser light generating unit, The photonics-electronics integrated module, wherein the laser light generating unit is disposed independently of the optical engine unit. [Appendix 4] The photonics-electronics hybrid module according to any one of Supplementary Note 1 to Supplementary Note 3, Further comprising a photonic wire portion, the optical engine unit has an optical coupling unit and an optical waveguide, the optical coupling portion is optically connected to the optical waveguide, the optical waveguide extends from the optical coupling unit to the optical transmitting unit or the optical receiving unit, an optical-electronics hybrid module, wherein the photonic wire portion extends from the optical coupling portion to a tip of the core, and the photonic wire portion optically connects the optical coupling portion and the core; [Appendix 5] 5. The photonics-electronics hybrid module according to claim 4, a tip end of the multi-core fiber forms an inclined surface, an inclined surface formed to be inclined with respect to the axial direction of the multicore fiber, and each of the tips of each of the cores being disposed on the inclined surface; [Appendix 6] 6. The photonics-electronics hybrid module according to claim 5, an optoelectronic hybrid module, wherein the inclined surface of the multicore fiber is arranged so as not to face the common substrate; [Appendix 7] The photonics-electronics hybrid module according to any one of Supplementary Note 4 to Supplementary Note 6, A photonic-electronic integrated module, wherein a part or the whole of the photonic wire portion is separated from the common substrate. [Appendix 8] The photonics-electronics hybrid module according to any one of Supplementary Note 4 to Supplementary Note 7, Further comprising a clad portion, The cladding portion is provided to cover the photonic wire portion, and the refractive index of the cladding portion is smaller than the refractive index of the photonic wire portion. [Appendix 9] The photonics-electronics hybrid module according to any one of Supplementary Note 4 to Supplementary Note 8, The photonic wire portion is curved so as to form a convex shape in a direction away from the common substrate. [Appendix 10] The photonics-electronics hybrid module according to any one of Supplementary Note 1 to Supplementary Note 9, a plurality of the optical engine units; the integrated circuit chip portion has a rectangular shape having four sides when viewed in a plan view, The optical engine units are arranged side by side on the side of the integrated circuit chip unit. [Appendix 11] The photonics-electronics hybrid module according to any one of Supplementary Note 1 to Supplementary Note 10, a plurality of the optical engine units; The optical engine units are arranged radially relative to the integrated circuit chip unit. [Appendix 12] The photonics-electronics hybrid module according to claim 10 or 11, The optical-electronic hybrid module, wherein the distance between a pair of adjacent optical engine units is 0.5 mm or less. [Appendix 13] The photonics-electronics hybrid module according to any one of Supplementary Note 1 to Supplementary Note 12, Further comprising a main board and an optical connector section, the common board is mounted on the main board, The optical connector unit is configured to optically connect the multicore fiber and an external multicore fiber. [Appendix 14] The photonics-electronics hybrid module according to any one of Supplementary Note 1 to Supplementary Note 13, An optoelectronic convergence module, wherein the optical receiving unit and the optical transmitting unit in the optical engine unit are integrated on a common silicon photonics chip. [Explanation of symbols]

[0059] 100: Photonics-electronics convergence module 1: Integrated circuit chip section 1a: Edge 2: Optical engine section 2a: Photonic wire part 2b: Cladding part 2c: Optical waveguide 2cp: Optical coupling part 2d: Tip part 2e: Base part 2f: Optical receiving section 2g: Optical transmitter 3: Common board w: Electrical wiring section 4: Multi-core fiber 4a:Tip 4q: Core 4q1: Receiving core 4q2: Transmitting core 4q3: External laser core tp: tip 4s: Clad 5: Main board 6: Cover part p1: Resist p2: Objective lens sg1: Received optical signal sg2: Transmitted optical signal st1: Received electrical signal st2: Transmitted electrical signal

Claims

1. The optical communication device includes a common substrate, an integrated circuit chip portion, an optical engine portion, and a photonic wire portion, the integrated circuit chip unit and the optical engine unit are mounted on the common substrate, and an electrical wiring unit is formed on the common substrate; the electrical wiring section electrically connects the integrated circuit chip section and the optical engine section; the optical engine unit has an optical receiving unit, an optical transmitting unit, an optical coupling unit, and an optical waveguide, and the optical engine unit is optically connected to a multi-core fiber by the photonic wire unit; the optical receiving unit generates a received electrical signal from a received optical signal; the optical transmitter generates a transmission optical signal from a transmission electrical signal; the optical coupling portion is optically connected to the optical waveguide, the optical waveguide extends from the optical coupling unit to the optical transmitting unit or the optical receiving unit, the multi-core fiber is configured such that a plurality of cores are surrounded by a cladding, and is optically connected to at least one of the optical receiving unit and the optical transmitting unit; a tip end of the multi-core fiber is provided in the optical engine unit, an optical-electronics hybrid module, wherein the photonic wire portion extends from the optical coupling portion to a tip of the core, and the photonic wire portion optically connects the optical coupling portion and the core;

2. The photonics-electronics hybrid module according to claim 1, the plurality of cores includes a receiving core and a transmitting core, the receiving core is optically connected to the optical receiving portion of the optical engine portion; a transmitting core that is independent of the receiving core and is optically connected to the optical transmitting unit of the optical engine unit;

3. The photonics-electronics hybrid module according to claim 2, the plurality of cores further comprising an outer laser core; the external laser core is a core for supplying laser light for generating the transmission optical signal to the optical transmitting unit of the optical engine unit, and the external laser core is optically connected to a laser light generating unit, The photonics-electronics integrated module, wherein the laser light generating unit is disposed independently of the optical engine unit.

4. The photonics-electronics hybrid module according to any one of claims 1 to 3, the tip end of the multi-core fiber forms an inclined surface, an inclined surface formed to be inclined with respect to the axial direction of the multicore fiber, and each of the tips of each of the cores being disposed on the inclined surface;

5. The photonics-electronics hybrid module according to claim 4, an optoelectronic hybrid module, wherein the inclined surface of the multicore fiber is arranged so as not to face the common substrate;

6. The photonics-electronics hybrid module according to any one of claims 1 to 3, A photonic-electronic integrated module, wherein a part or the whole of the photonic wire portion is separated from the common substrate.

7. The photonics-electronics hybrid module according to any one of claims 1 to 3, Further comprising a clad portion, The cladding portion is provided to cover the photonic wire portion, and the refractive index of the cladding portion is smaller than the refractive index of the photonic wire portion.

8. The photonics-electronics hybrid module according to any one of claims 1 to 3, The photonic wire portion is curved so as to form a convex shape in a direction away from the common substrate.

9. The photonics-electronics hybrid module according to any one of claims 1 to 3, a plurality of the optical engine units; the integrated circuit chip portion has a rectangular shape having four sides when viewed from above, The optical engine units are arranged side by side on the side of the integrated circuit chip unit.

10. The photonics-electronics hybrid module according to any one of claims 1 to 3, a plurality of the optical engine units; The optical engine units are arranged radially relative to the integrated circuit chip unit.

11. The photonics-electronics hybrid module according to claim 9, The photonics-electronics hybrid module, wherein the distance between a pair of adjacent optical engine units is 0.5 mm or less.

12. The photonics-electronics hybrid module according to any one of claims 1 to 3, Further comprising a main board and an optical connector section, the common board is mounted on the main board, The optical connector unit is configured to optically connect the multicore fiber and an external multicore fiber.

13. The photonics-electronics hybrid module according to any one of claims 1 to 3, An optoelectronic convergence module, wherein the optical receiving unit and the optical transmitting unit in the optical engine unit are integrated on a common silicon photonics chip.

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