Wiring Formation Method

Abstract

This wiring forming method for forming wiring by stacking a plurality of layers of a metal-containing liquid, which contains metal fine particles, includes: a first ejecting step for ejecting the metal-containing liquid in a first array pattern comprising an array, extending in a predetermined direction, of a plurality of rows of ink dots; and a second ejecting step for ejecting the metal-containing liquid onto the metal-containing liquid ejected in the first ejecting step, in a position that is offset, in the predetermined direction, from an ejection position of the metal-containing liquid in the first ejecting step by a distance corresponding to a gap less than a pitch of the ink dots, in an array pattern obtained by removing from the first array pattern one row of ink dots positioned at an edge thereof in the predetermined direction.

Description

[Technical Field]

[0001] The present invention relates to a wiring forming method for forming wiring using a metal-containing liquid containing metal fine particles. [Background technology]

[0002] The following Patent Document describes a technique for forming wiring using a metal-containing liquid containing metal fine particles. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-084566 Summary of the Invention [Problem to be solved by the invention]

[0004] When wiring is formed using a metal-containing liquid containing metal fine particles, the metal-containing liquid is laminated to form the wiring. Therefore, an object of the present specification is to appropriately form wiring by laminating the metal-containing liquid. [Means for solving the problem]

[0005] In order to solve the above-mentioned problems, the present specification provides a method for manufacturing a metal-containing liquid, the method comprising: a first ejection step of ejecting a metal-containing liquid containing metal fine particles in a first array pattern consisting of an array of ink dots in a plurality of rows extending in a predetermined direction; and a method for removing one row of ink dots located at an end of the first array pattern in the predetermined direction from the metal-containing liquid ejected in the first ejection step. Second a second ejection step of ejecting the metal-containing liquid in an array pattern at a position shifted in the predetermined direction by a distance corresponding to an interval narrower than the pitch of ink dots from the ejection position of the metal-containing liquid in the first ejection step, odd number The second discharge step is a discharge step of the second layer. even numberThis is the layer discharge process, where the metal-containing liquid is discharged at different discharge positions for odd-numbered and even-numbered layers, and wiring is formed by stacking multiple layers of metal-containing liquid. The metal-containing liquid is discharged onto odd-numbered layers of the plurality of layers in the first arrangement pattern, and onto even-numbered layers of the plurality of layers in the second arrangement pattern. A wiring formation method is disclosed.

[0006] [Effects of the Invention]

[0007] In the present disclosure, metal-containing liquid is ejected in a first array pattern consisting of an array of ink dots in multiple rows extending in a predetermined direction. Then, metal-containing liquid is ejected onto the metal-containing liquid in an array pattern obtained by removing one row of ink dots located at the end of the first array pattern in the predetermined direction from the first array pattern, at a position shifted in the predetermined direction from the ejection position of the first array pattern by a distance corresponding to an interval narrower than the pitch of the ink dots. Furthermore, as the array pattern of the metal ink in the Nth layer, a first array pattern consisting of an array of ink dots in multiple rows extending in the predetermined direction is calculated. Then, as the array pattern of the metal ink in the (N+1)th layer, an array pattern obtained by removing one row of ink dots located at the end of the first array pattern in the predetermined direction and removing one row of ink dots located at the end in a direction intersecting the predetermined direction from the first array pattern is calculated, at a position shifted in the predetermined direction from the ejection position of the first array pattern by a distance corresponding to an interval narrower than the pitch of the ink dots. This allows the metal-containing liquid to be stacked to form wiring appropriately. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing a circuit forming device. [Figure 2] FIG. 2 is a block diagram showing a control device. [Figure 3] FIG. 2 is a cross-sectional view showing a circuit in a state where a resin laminate is formed. [Figure 4] FIG. 2 is a cross-sectional view showing a circuit in a state where wiring is formed on a resin laminate. [Figure 5] FIG. 2 is a diagram showing a nozzle surface of an inkjet head. [Figure 6] FIG. 10 is a diagram showing an arrangement pattern. [Figure 7] FIG. 10 is a diagram showing an arrangement pattern. [Figure 8] 1A and 1B are diagrams showing arrangement patterns and wiring of odd-numbered and even-numbered layers; [Figure 9] FIG. 1 is a diagram showing conventional wiring. [Figure 10] FIG. 10 is a diagram showing an arrangement pattern of odd-numbered layers. [Figure 11] FIG. 10 is a diagram showing an arrangement pattern of even-numbered layers. [Figure 12] 12 is a diagram showing wiring formed by the arrangement pattern of FIG. 10 and the arrangement pattern of FIG. 11. FIG. [Figure 13] FIG. 10 is a diagram showing an arrangement pattern of odd-numbered layers. [Figure 14] FIG. 10 is a diagram showing an arrangement pattern of even-numbered layers. DETAILED DESCRIPTION OF THE INVENTION

[0009] FIG. 1 shows a circuit forming apparatus 10. The circuit forming apparatus 10 includes a conveying device 20, a first modeling unit 22, a second modeling unit 24, and a control device (see FIG. 2) 28. The conveying device 20, the first modeling unit 22, and the second modeling unit 24 are arranged on a base 29 of the circuit forming apparatus 10. The base 29 is generally rectangular, and in the following description, the longitudinal direction of the base 29 will be referred to as the X-axis direction, the lateral direction of the base 29 as the Y-axis direction, and the direction perpendicular to both the X-axis direction and the Y-axis direction as the Z-axis direction. The Z-axis direction is the same as the vertical direction.

[0010] The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on a base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. The X-axis slide mechanism 30 also includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by the drive of the electromagnetic motor 38. The Y-axis slide mechanism 32 also includes a Y-axis slide rail 50 and a table 52. The Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. The table 52 is held by the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and table 52 moves to any position in the Y-axis direction by driving electromagnetic motor 56. As a result, table 52 moves to any position on base 29 by driving X-axis slide mechanism 30 and Y-axis slide mechanism 32.

[0011] Table 52 has a base 60, a holding device 62, and an elevating device (see FIG. 2) 64. Base 60 is formed in a flat plate shape, and a pallet 70 (see FIG. 3) is placed on the upper surface. Holding devices 62 are provided on both sides of base 60 in the X-axis direction. Both edges of pallet 70 in the X-axis direction placed on base 60 are clamped by holding devices 62, thereby fixedly holding pallet 70. Elevating device 64 is disposed below base 60 and raises and lowers base 60.

[0012] The first modeling unit 22 is a unit that models the wiring of a circuit board and includes a first printing unit 72 and a baking unit 74. The first printing unit 72 includes an inkjet head 76 (see FIG. 2) that ejects metal ink in a linear pattern. The metal ink is made by dispersing nanometer-sized metal particles, such as silver particles, in a solvent. The surfaces of the metal particles are coated with a dispersant to prevent aggregation in the solvent. The inkjet head 76 ejects the metal ink from multiple nozzles using, for example, a piezoelectric method using piezoelectric elements.

[0013] The baking unit 74 has an infrared irradiation device 78 (see FIG. 2). The infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays, and the metal ink irradiated with infrared rays is baked to form wiring. Note that baking of metal ink is a phenomenon in which, by applying energy, the solvent is vaporized and the protective film on the metal particles, i.e., the dispersant, is decomposed, and the metal particles come into contact or fuse together, thereby increasing the conductivity. Then, by baking the metal ink, metal wiring is formed.

[0014] The second modeling unit 24 is a unit that models the resin layer of the circuit board, and has a second printing unit 84 and a curing unit 86. The second printing unit 84 has an inkjet head (see FIG. 2) 88 that ejects ultraviolet curable resin. The ultraviolet curable resin is a resin that hardens when irradiated with ultraviolet light. The inkjet head 88 may be, for example, a piezo type that uses a piezoelectric element, or a thermal type that heats the resin to generate bubbles and ejects the resin from multiple nozzles.

[0015] The curing unit 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curing resin discharged by the inkjet head 88, for example, by leveling the surface of the ultraviolet curing resin and scraping off excess resin with a roller or blade, thereby making the thickness of the ultraviolet curing resin uniform. The irradiation device 92 is equipped with a mercury lamp or LED as a light source and irradiates the discharged ultraviolet curing resin with ultraviolet light. This hardens the discharged ultraviolet curing resin, forming a resin layer.

[0016] 2, the control device 28 includes a controller 110 and a plurality of drive circuits 112. The plurality of drive circuits 112 are connected to the electromagnetic motors 38, 56, the holding device 62, the lifting device 64, the inkjet head 76, the infrared irradiation device 78, the inkjet head 88, the flattening device 90, and the irradiation device 92. The controller 110 includes a CPU, ROM, RAM, etc., and is mainly a computer, and is connected to the plurality of drive circuits 112. As a result, the operations of the transport device 20, the first modeling unit 22, and the second modeling unit 24 are controlled by the controller 110.

[0017] In the circuit forming device 10, with the above-described configuration, a resin laminate is formed on a pallet 70 placed on the base 60 of the table 52, and wiring is formed on the upper surface of the resin laminate, thereby forming a circuit board.

[0018] Specifically, when the pallet 70 is set on the base 60 of the table 52, the table 52 moves to below the second modeling unit 24. Then, in the second modeling unit 24, a resin laminate 122 is formed on the pallet 70, as shown in Fig. 3. The resin laminate 122 is formed by repeatedly discharging an ultraviolet curable resin from the inkjet head 88 and irradiating the discharged ultraviolet curable resin with ultraviolet rays by the irradiation device 92.

[0019] More specifically, in the second printing unit 84 of the second modeling unit 24, the inkjet head 88 dispenses a thin film of ultraviolet curable resin onto the upper surface of the pallet 70. Then, after the ultraviolet curable resin has been dispensed in a thin film, the ultraviolet curable resin is flattened by a flattening device 90 in the curing unit 86 so that the film thickness of the ultraviolet curable resin is uniform. Then, the irradiation device 92 irradiates the thin film of ultraviolet curable resin with ultraviolet rays. As a result, a thin film resin layer 124 is formed on the pallet 70.

[0020] Next, the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the thin film resin layer 124. The thin film of ultraviolet curable resin is then flattened by the flattening device 90, and the irradiation device 92 irradiates the ejected thin film of ultraviolet curable resin with ultraviolet light, thereby laminating thin film resin layers 124 on thin film resin layers 124. In this manner, the ejection of ultraviolet curable resin onto the thin film resin layer 124 and the irradiation with ultraviolet light are repeated, and a plurality of resin layers 124 are laminated, thereby forming the resin laminate 122.

[0021] Next, after the resin laminate 122 is formed, the table 52 moves below the first modeling unit 22. Then, in the first printing section 72 of the first modeling unit 22, the inkjet head 76 ejects the metal ink 130 in a line shape according to the circuit pattern onto the upper surface of the resin laminate 122, as shown in FIG. 4 . Next, in the baking section 74 of the first modeling unit 22, the infrared irradiation device 78 irradiates the metal ink 130 ejected according to the circuit pattern with infrared rays. As a result, the metal ink 130 is baked, and wiring 132 is formed on the upper surface of the resin laminate 122.

[0022] In this way, the resin laminate 122 is formed on the pallet 70 in the second modeling unit 24, and the wiring 132 is formed on the resin laminate 122 in the first modeling unit 22, thereby forming the circuit board 136. The wiring 132 formed on the resin laminate 122 is formed by layering the metal ink 130. More specifically, a first layer of metal ink 130 is ejected onto the upper surface of the resin laminate 122, and the first layer of metal ink 130 is irradiated with infrared rays. As a result, the first layer of metal ink 130 is baked, and a first layer of metal thin film is formed. Next, a second layer of metal ink 130 is ejected onto the first layer of metal thin film, and the second layer of metal ink 130 is irradiated with infrared rays. As a result, the second layer of metal ink 130 is baked, and a second layer of metal thin film is formed. In this way, the ejection of the metal ink 130 and the irradiation of infrared rays are repeated, and thereby metal thin films are layered, and wiring 132 of a predetermined thickness is formed.

[0023] However, when the inkjet head 76 ejects the metal ink from multiple nozzle holes, there is a risk that misalignment of the metal ink dots (hereinafter referred to as "ink dots") ejected from the multiple nozzle holes may result in disconnected wiring. Specifically, as shown in FIG. 5 , multiple nozzle holes 152 are formed in a nozzle surface 150 of the inkjet head 76. The nozzle surface 150 is generally rectangular, and is disposed on the inkjet head 76 with its longitudinal direction facing the X direction. The multiple nozzle holes 152 are formed in the nozzle surface 150 and arranged in two rows extending in the X direction. In other words, the longitudinal direction of the multiple nozzle holes 152 is the longitudinal direction of the nozzle surface 150, which is the X direction. The multiple nozzle holes 152 arranged in the X direction are formed at an equal pitch. In other words, the multiple nozzle holes 152 arranged in the X direction are formed so that the intervals between adjacent nozzle holes 152 are the same. When the inkjet head 76 ejects the metal ink, the inkjet head 76 moves in the Y direction, so that the metal ink is ejected in an array pattern consisting of an array of ink dots in multiple rows.

[0024] Specifically, as shown in FIG. 6, for example, the metal ink is ejected in an array pattern consisting of an array of ink dots 160 in multiple rows extending in the X direction. The array pattern is designed to create overlapping regions of the ink dots 160 (hatched in FIG. 5). When the array pattern is designed, the ejection pitch of the metal ink in the Y direction is calculated based on the diameter of the ink dots 160, i.e., the diameter of the impact diameter of the metal ink. The metal ink is then ejected at the calculated ejection pitch, resulting in an array pattern with overlapping regions of the ink dots 160. The array pattern is the array pattern of one layer of metal ink, and multiple layers of metal ink ejected in this array pattern are stacked to form wiring. The ejection position of the metal ink in each of the multiple layers is the same. In other words, the metal ink is ejected at a predetermined position according to the array pattern. The metal ink is then irradiated with infrared light to form a first layer of metal thin film. Next, metal ink is ejected onto the first metal thin film layer in accordance with an array pattern at the same positions as the ejection positions of the first metal ink, and infrared light is irradiated to form a second metal thin film. In this way, by repeating the ejection of metal ink at the same positions according to the array pattern and the irradiation of infrared light, metal thin films are stacked and wiring is formed.

[0025] However, positional deviations of the ink dots 160 may occur due to tolerances in the positional accuracy of the multiple nozzle holes formed in the nozzle surface 150 of the inkjet head 76. Furthermore, when a large printing area is divided and printed using one inkjet head or multiple inkjet heads, positional deviations of the ink dots 160 may occur at the joints between the divided prints. In such cases, if the positional deviations of the ink dots 160 are greater than the overlapping areas of the ink dots 160, there is a risk of forming broken wiring. Specifically, even when metal ink is ejected according to an array pattern, gaps 166 without overlapping areas (hatched lines) of the ink dots 160 are formed due to positional deviations of the ink dots 160, as shown in FIG. 7 . Therefore, when the ejected metal ink is irradiated with infrared rays, a discontinuous metal thin film with gaps 166 is formed. As described above, even if metal ink is repeatedly ejected at the same position according to the array pattern and irradiated with infrared rays, gaps 166 remain, resulting in broken wiring.

[0026] In consideration of this, wiring is formed by differentiating the ejection positions of the metal ink for odd-numbered layers from the ejection positions of the metal ink for even-numbered layers. Specifically, for example, when forming a first layer of metal thin film, metal ink is ejected at a predetermined position according to an array pattern, resulting in the metal ink being ejected in an array pattern consisting of an array of multiple rows of ink dots 160a, as shown in FIG. 8. Then, infrared rays are irradiated onto the metal ink, forming a first layer of metal thin film 168a. Note that gaps 166a are generated in the first layer of metal thin film 168a. Furthermore, when forming a second layer of metal thin film, metal ink is ejected according to the array pattern at a position shifted by 0.5 pixels in the X direction from the ejection position of the metal ink for the first layer. As a result, as shown in FIG. 8, metal ink is ejected in an array pattern consisting of an array of multiple rows of ink dots 160b. Then, infrared rays are irradiated onto the metal ink, forming a second layer of metal thin film 168b.

[0027] A gap 166b also occurs in the second-layer metal thin film 168b. Thus, when the first-layer metal thin film 168a and the second-layer metal thin film 168b are described individually, gaps 166a and 166b occur between the metal thin films 168a and 168b, as shown in FIG. 8. In reality, however, the second-layer metal thin film 168b is stacked on top of the first-layer metal thin film 168a, resulting in a wiring 170 without any gaps, as shown in FIG. 8. One pixel is the pitch at which the multiple nozzle holes 152 extending in the X direction are formed. In other words, one pixel is the distance between the centers of two adjacent nozzle holes 152 of the multiple nozzle holes 152 extending in the X direction, and is the distance between the centers of two adjacent ink dots of the multiple ink dots 160 extending in the X direction. Furthermore, in the above explanation, the wiring 170 is formed by stacking two layers of metal thin films 168a, b, but for example, if wiring is formed by stacking seven layers of metal thin films, the metal inks for the first, third, fifth, and seventh layers are ejected at predetermined positions according to an array pattern, and the metal inks for the second, fourth, and sixth layers are ejected at positions shifted 0.5 pixels in the X direction from the predetermined positions according to the array pattern. In this way, by ejecting the metal inks for the odd-numbered layers at predetermined positions according to an array pattern, and the metal inks for the even-numbered layers at positions shifted 0.5 pixels in the X direction from the predetermined positions according to the array pattern, wiring without gaps can be formed.

[0028] However, when metallic ink is ejected onto the odd-numbered metal thin films in accordance with an array pattern at a predetermined position, and metallic ink is ejected onto the even-numbered metal thin films in accordance with an array pattern at a position shifted 0.5 pixels in the X direction from the predetermined position, the width of the wiring may increase depending on the direction in which the wiring extends. Specifically, even if metallic ink is ejected onto the even-numbered metal thin films in accordance with an array pattern at a position shifted 0.5 pixels in the X direction from the ejection position of the metallic ink on the odd-numbered layers, as shown in Figure 9, the length of the wiring 170a extending in the X direction increases by a distance equivalent to 0.5 pixels, but the width (= W1) does not increase. On the other hand, when metallic ink is ejected onto the even-numbered metal thin films in accordance with an array pattern at a position shifted 0.5 pixels in the X direction from the ejection position of the metallic ink on the odd-numbered layers, the length of the wiring 170b extending in the Y direction remains unchanged, but the width (= W2) increases by a distance equivalent to 0.5 pixels. In this way, the width dimension (=W2) of the wiring 170b extending in the Y direction is larger than the width dimension (=W1) of the wiring 170a extending in the X direction by a distance equivalent to 0.5 pixels.

[0029] As described above, if the width of the wiring increases depending on the direction in which the wiring extends, the increased width of the wiring may cause a short circuit. Furthermore, forming a wiring with a width of W2 when the wiring width is W1 in the circuit design is undesirable because it results in wiring not being formed as designed. In consideration of this, the array pattern for the even-numbered layers, in which the metal ink is ejected at a position shifted by 0.5 pixels in the X direction from the ejection position of the metal ink for the odd-numbered layers, is an array pattern obtained by removing a row of ink dots 160 located at the end in the X direction from the array pattern for the odd-numbered layers. Specifically, for example, the array pattern 180a for the odd-numbered layers is shown in FIG. 10 . Then, a row of ink dots 160c (shown by the dotted line in FIG. 10 ) located at the end in the X direction is removed from the array pattern 180a for the odd-numbered layers. As a result, the array pattern 180b for the even-numbered layers, as shown in FIG. 11 , is an array pattern obtained by removing a row of ink dots 160c located at the end in the X direction from the array pattern 180a for the odd-numbered layers. Then, by ejecting the metal ink in odd-numbered layers at predetermined positions according to array pattern 180a (FIG. 10) and the metal ink in even-numbered layers at positions shifted 0.5 pixels in the X direction from the predetermined positions according to array pattern 180b (FIG. 11), it is possible to form wires of the same width regardless of the direction in which the wires extend. In other words, as shown in FIG. 12, the width (= W1) of wire 170b extending in the Y direction can be made the same as the width (= W1) of wire 170a extending in the X direction.

[0030] However, by making the array pattern 180b for the even-numbered layer an array pattern in which one row of ink dots 160c located at the end in the X direction is removed from the array pattern 180a for the odd-numbered layer, the width of the wiring can be made the same, but the electrical quality of the wiring changes depending on the direction in which the wiring extends. Specifically, when the array pattern 180b for the even-numbered layer is an array pattern in which one row of ink dots 160c located at the end in the X direction is removed from the array pattern 180a for the odd-numbered layer, one row of ink dots 160c in the width direction (X direction) is removed from the wiring 170b extending in the Y direction. On the other hand, one row of ink dots 160c in the length direction (X direction) is removed from the wiring 170a extending in the X direction. In other words, the ink dots 160c in the width direction (Y direction) are not removed from the wiring 170a extending in the X direction. For this reason, the cross-sectional area in the width direction of the wiring 170b extending in the Y direction is smaller than the cross-sectional area of ​​the wiring 170a extending in the X direction. In this way, if the cross-sectional area in the width direction of the wiring 170b extending in the Y direction differs from the cross-sectional area of ​​the wiring 170a extending in the X direction, the resistance value and the like will differ depending on the direction in which the wiring extends, and the electrical quality of the wiring will change.

[0031] In consideration of this, the array pattern for the even-numbered layer is an array pattern obtained by removing not only the row of ink dots 160c located at the end in the X direction from the array pattern 180a for the odd-numbered layer, but also the row of ink dots located at the end in the X direction. Specifically, as shown in Fig. 13, the row of ink dots 160c located at the end in the X direction from the array pattern 180a for the odd-numbered layer is removed, and also the row of ink dots 160d located at the end in the Y direction (shown by the dashed-dotted line in Fig. 10). As a result, as shown in Fig. 14, the array pattern 180c for the even-numbered layer is an array pattern obtained by removing not only the row of ink dots 160c located at the end in the X direction from the array pattern 180a for the odd-numbered layer, but also the row of ink dots 160d located at the end in the Y direction. Then, by ejecting the metal ink for odd-numbered layers at predetermined positions according to array pattern 180a (FIG. 13), and ejecting the metal ink for even-numbered layers at positions shifted 0.5 pixels in the X direction from the predetermined positions according to array pattern 180c (FIG. 14), it is possible to make the cross-sectional area of ​​the wiring in the width direction the same regardless of the direction in which the wiring extends. This makes it possible to make the electrical quality of wiring 170b extending in the Y direction the same as the electrical quality of wiring 170a extending in the X direction. In other words, it is possible to form wiring with the same electrical quality regardless of the direction in which the wiring extends.

[0032] As shown in FIG. 2, the controller 110 of the control device 28 includes a first calculation unit 200, a second calculation unit 202, a first ejection unit 204, and a second ejection unit 206. The first calculation unit 200 is a functional unit that allows the controller 110 to calculate an odd-layer array pattern 180a consisting of multiple rows of ink dots. The second calculation unit 202 is a functional unit that removes one column of ink dots 160c and one row of ink dots 160d from the odd-layer array pattern 180a and calculates an array pattern shifted 0.5 pixels in the X direction from the ejection position of the metal ink for the odd layer as the even-layer array pattern 180c. The first ejection unit 204 is a functional unit that ejects metal ink according to the odd-layer array pattern 180a. The second ejection unit 206 is a functional unit for ejecting metal ink on top of the metal ink ejected in the odd-numbered layer, at a position shifted 0.5 pixels in the X direction from the ejection position of the metal ink in the odd-numbered layer, according to the arrangement pattern 180c of the even-numbered layer.

[0033] In the above embodiment, the control device 28 is an example of an information processing device. The nozzle hole 152 is an example of a nozzle hole. The first calculation unit 200 is an example of a first calculation unit. The second calculation unit 202 is an example of a second calculation unit. Furthermore, the process performed by the first discharge unit 204 is an example of a first discharge process. The process performed by the second discharge unit 206 is an example of a second discharge process.

[0034] The present invention is not limited to the above-described embodiment and can be embodied in various forms incorporating various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above-described embodiment, the metallic ink for the even-numbered layers is ejected at a position shifted by 0.5 pixels in the X direction from the ejection position of the metallic ink for the odd-numbered layers according to array pattern 180c, which is obtained by removing one column of ink dots 160c and one row of ink dots 160d from array pattern 180a for the odd-numbered layers. On the other hand, the metallic ink for the even-numbered layers may be ejected at a position shifted by 0.5 pixels in the X direction from the ejection position of the metallic ink for the odd-numbered layers according to array pattern 180b, which is obtained by removing one column of ink dots 160c from array pattern 180a for the odd-numbered layers. In such a case, although the electrical quality of the wiring varies depending on the direction in which the wiring extends, wiring of the same width can be formed regardless of the direction in which the wiring extends.

[0035] In the above embodiment, the metallic ink is ejected in accordance with the even-layer arrangement pattern 180c to a position shifted by 0.5 pixels in the X direction from the metallic ink ejection position of the odd-layer metal, but the amount of shift need only be narrower than 1 pixel. Therefore, it is sufficient that the metallic ink is ejected in accordance with the even-layer arrangement pattern 180c to a position shifted in the X direction by a distance greater than 0 pixels and narrower than 1 pixel from the metallic ink ejection position of the odd-layer metal.

[0036] In the above embodiment, the controller 110 of the control device 28 calculates the array pattern and controls the operation of the first modeling unit 22 so that the metal ink is ejected according to the calculated array pattern. On the other hand, the array pattern may be calculated in an information processing device different from the control device 28. Then, the array pattern calculated in the information processing device may be input to the control device 28, and the control device 28 may control the operation of the first modeling unit 22 so that the metal ink is ejected according to the input array pattern. In other words, the information processing device may include the first calculation unit 200 and the second calculation unit 202, and the controller 110 of the control device 28 may include the first ejection unit 204 and the second ejection unit 206.

[0037] In the above embodiment, a metal ink for forming wiring is used as the metal-containing liquid, but various metal-containing liquids containing metal particles can be used. Specifically, for example, a conductive paste in which micrometer-sized metal particles are dispersed in a solvent can be used as the metal-containing liquid. [Explanation of symbols]

[0038] 28: Control device (information processing device) 152: Nozzle hole 200: First calculation unit 202: Second calculation unit 204: First discharge unit (first discharge process) 206: Second discharge unit (second discharge process)

Claims

1. a first ejection step of ejecting a metal-containing liquid containing metal fine particles in a first array pattern consisting of an array of ink dots in a plurality of rows extending in a predetermined direction; a second ejection step of ejecting the metal-containing liquid onto the metal-containing liquid ejected in the first ejection step, in a second arrangement pattern obtained by removing one row of ink dots located at an end in the predetermined direction from the first arrangement pattern, at a position shifted in the predetermined direction by a distance corresponding to an interval narrower than the pitch of the ink dots from the ejection position of the metal-containing liquid in the first ejection step; Including, the first discharge step is a discharge step for an odd-numbered layer, the second discharge step is a discharge step for an even-numbered layer, The metal-containing liquid is discharged at different discharge positions for odd-numbered layers and even-numbered layers, and wiring is formed by stacking multiple layers of the metal-containing liquid. The wiring forming method, wherein the metal-containing liquid is discharged onto odd-numbered layers of the plurality of layers in the first arrangement pattern, and onto even-numbered layers of the plurality of layers in the second arrangement pattern.

2. The second discharge step includes:

2. The wiring formation method according to claim 1, wherein the metal-containing liquid is ejected onto the metal-containing liquid ejected in the first ejection process in an arrangement pattern obtained by removing not only the one column of ink dots from the first arrangement pattern but also one row of ink dots located at the end in a direction intersecting the specified direction.

3. 3. The wiring forming method according to claim 1, wherein the predetermined direction is a longitudinal direction in which a plurality of nozzle holes for discharging the metal-containing liquid are arranged.

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