Radiography equipment

Abstract

To suppress an influence of charging in a support member including a charging material.SOLUTION: A radiation imaging apparatus 100 for imaging a radiation image includes: a radiation detection portion 3 that detects radiation; a support member 4 that includes a charging material and supports the radiation detection portion 3; a conductive layer (shield layer 7) provided between the radiation detection portion 3 and the support member 4; an electronic circuit (electronic circuit mounted on circuit board 52); and electric wiring (wiring 53A) that passes a lateral surface of the support member 4 (plane shaped supporting portion 4a) and connects the radiation detection portion 3 with the electronic circuit. The conductive layer is arranged in a position facing at least a portion of the electric wiring on a surface of the support member outside a plan view region of the radiation detection portion.SELECTED DRAWING: Figure 16

Description

[Technical Field]

[0001] The present invention relates to a radiographic apparatus. [Background technology]

[0002] In recent years, portable (also called cassette type) radiography devices that can be separated from the radiography table and carried around have been developed and put into practical use. Because of their panel shape, these radiography devices are sometimes called FPDs (Flat Panel Detectors). An FPD contains a radiation detection unit that detects radiation and a support member that supports the radiation detection unit. When FPDs are used in the medical field, noise can occur due to static electricity caused by pressure from the patient during an examination, movement of the bed, or vibrations caused by moving the patient.

[0003] In this regard, Patent Document 1 describes providing a conductive layer on the surface of the radiation detection unit facing the support member in order to suppress noise caused by vibration. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-247853 Summary of the Invention [Problem to be solved by the invention]

[0005] In some cases, support members are made of bead-based foam to reduce weight. However, bead-based foam is more susceptible to static electricity than metal or resin. Furthermore, bead-based foam is prone to vibration, and the distance traveled during vibration is large, resulting in significant noise. This noise can cause unevenness in captured images. Furthermore, in imaging methods in which the FPD and the radiation irradiation device are not linked and radiation irradiation is detected using part of the FPD output signal, the noise may result in a false detection that radiation has been irradiated even when radiation has not been irradiated. Patent Document 1 does not consider the case where the material of the support member is a bead-method foam, which is easily charged, and therefore does not solve the above problem.

[0006] SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has as its object to provide a radiographic imaging apparatus that can suppress the influence of charging of a support member made of a charging material. [Means for solving the problem]

[0007] In order to solve the above problem, the radiation imaging apparatus of the invention described in claim 1 comprises: A radiographic imaging device for capturing a radiographic image, a planar radiation detection unit having a substrate and a semiconductor element formed on an imaging surface of the substrate, the radiation detection unit detecting radiation; a support member made of a charged material and supporting the radiation detection unit; a conductive layer provided between the radiation detection unit and the support member; An electronic circuit, an electrical wiring that passes through a side surface of the support member and connects the radiation detection unit and the electronic circuit; Equipped with the conductive layer is disposed on a surface of the support member outside a planar view area of ​​the radiation detection unit at a position facing at least a part of the electrical wiring, the conductive layer is provided so as to cover a side surface of the support member, The conductive layer is a radiation shielding layer connected to ground.

[0008] The invention described in claim 2 is the radiation imaging apparatus described in claim 1, The support member is made of a foam material.

[0009] The invention described in claim 3 is the radiation imaging apparatus described in claim 1 or 2, The radiation detection unit is flexible. do.

[0010] The invention described in claim 4 is the radiation imaging apparatus according to any one of claims 1 to 3, the support member has an extension portion that extends from the radiation detection unit in a direction parallel to a surface of the support member that supports the radiation detection unit, The conductive layer is disposed on the surface of the extension portion facing the radiation detection unit at a position facing the electrical wiring.

[0011] The invention described in claim 5 is the radiation imaging apparatus described in claim 4, The conductive layer is Furthermore, before The radiation detecting portion is provided on the surface of the extension portion opposite to the radiation detecting portion.

[0012] The invention described in claim 6 is the radiation imaging apparatus according to any one of claims 1 to 5, The conductive layer is a lead shielding material. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide a radiographic imaging apparatus that can suppress the influence of charging of a support member made of a charging material. [Brief explanation of the drawings]

[0014] [Figure 1A] 1 is a perspective view of a front and a part of a side of a radiation imaging apparatus according to an embodiment of the present invention; [Figure 1B] FIG. 1 is an enlarged view of area B and area C. [Figure 2] FIG. 2 is a diagram showing the radiation imaging apparatus when the cover and the cushioning material are not present, as viewed from the rear. [Figure 3] 3 is a cross-sectional view of the radiation imaging apparatus of FIG. 1A taken along line III-III. [Figure 4] FIG. 4 is a partial cross-sectional view IV of FIG. [Figure 5] FIG. 2 is a plan view illustrating an example of a photoelectric conversion unit. [Figure 6] FIG. 10 is a diagram showing an example of battery installation. [Figure 7A] FIG. 10 is a diagram showing an example of attaching a battery. [Figure 7B] FIG. 10 is a diagram showing an example of attaching a battery. [Figure 7C] FIG. 10 is a diagram showing an example of attaching a battery. [Figure 8] FIG. 8 is a detailed view of region VIII in FIG. 3 according to the first modification. [Figure 9] 3 is a cross-sectional view of the radiation imaging apparatus of FIG. 1A according to a second modification taken along the line III-III. [Figure 10] FIG. 3 is a cross-sectional view of the radiation imaging apparatus of FIG. 1A according to a third modification taken along the line III-III. [Figure 11A] FIG. 11 is a perspective view of a front and part of a side of a radiation imaging apparatus according to a fourth modified example. [Figure 11B] FIG. 11B is a cross-sectional view taken along the line BB of the radiation imaging apparatus of FIG. 11A according to a fourth modification. [Figure 12] FIG. 3 is a cross-sectional view of the radiation imaging apparatus of FIG. 1A according to a fifth modified example taken along the line III-III. [Figure 13] 13A and 13B are diagrams showing an example of fixing wiring to a support member according to Modification 6. [Figure 14] 1B is a cross-sectional view of the radiation imaging apparatus of Modification 7 taken along line III-III in FIG. 1A, showing the vicinity of an end portion of the housing. FIG. [Figure 15] 13 is a diagram showing the vicinity of a corner of a support member of Modified Example 8. FIG. [Figure 16] FIG. 30 is a cross-sectional view of the radiation imaging apparatus of Modification 9 taken along the line III-III of FIG. 1A. [Figure 17A] 1B is a cross-sectional view of the radiation imaging apparatus 100 of Modification 10 taken along line III-III in FIG. 1A, showing the vicinity of an end portion of the planar support portion. [Figure 17B] 1B is a cross-sectional view of the radiation imaging apparatus 100 of Modification 10 taken along line III-III in FIG. 1A, showing the vicinity of an end portion of the planar support portion. [Figure 18] FIG. 30 is a cross-sectional view of the radiation imaging apparatus of Modification 11 taken along the line III-III of FIG. 1A. [Figure 19A] FIG. 23 is a diagram showing an example of a retraction mechanism of Modification 11. [Figure 19B] FIG. 23 is a diagram showing an example of a retraction mechanism of Modification 11. [Figure 20A] FIG. 23 is a diagram showing an example of a retraction mechanism of Modification 11. [Figure 20B] FIG. 23 is a diagram showing an example of a retraction mechanism of Modification 11. [Figure 21] FIG. 23 is a diagram showing an example of ground connection of a radiation detection unit and a shield layer in Modification 12. [Figure 22] FIG. 23 is a diagram showing an example of a shield layer of a thirteenth modification. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to those shown in the drawings.

[0016] First, the schematic configuration of a radiation imaging apparatus 100 according to this embodiment will be described. The radiation imaging apparatus 100 is used to generate a radiation image according to received radiation.

[0017] [1. Housing] 1A is a perspective view of a front surface 110a and a part of a side surface 110c of the housing 110, on which radiation is incident. The surface of the housing 110 opposite to the front surface 110a is referred to as a back surface 110b. In FIG. 1A, the X-axis direction is parallel to the short sides of the housing 110. The Y-axis direction is parallel to the long sides of the housing 110. The Z-axis direction is the thickness direction of the housing 110. The arrows on each axis are positive (+) directions. That is, in the X-axis direction, the side where a connector 51, an antenna 56, and an operation unit 57 (described later) are provided is the negative (-) direction. In the Y-axis direction, the direction from the antenna 56 toward the connector 51 is the positive (+) direction. In the Z-axis direction, the direction from the back surface 110b toward the front surface 110a is the positive (+) direction.

[0018] FIG. 1B is an enlarged view of areas B and C shown in FIG. 1A. As shown in FIG. 1B, the housing 110 has non-textured portions 110d and 110e, and is textured in the areas other than the non-textured portions 110d and 110e. The non-textured portion 110d indicates the center of the long side of the housing 110, and the non-textured portion 110e indicates the center of the short side of the housing 110. Conventionally, the center was indicated by providing a step in the center of the long and short sides of the housing. However, when a step is provided on the housing, stress is concentrated at the step when a load is applied to the housing, causing damage or the step to accumulate dirt. Therefore, as described above, by indicating the center with the subtle difference in surface texture between the non-textured portions 110d, 110e and the other texturized portions, it is possible to prevent damage and dirt to the housing.

[0019] FIG. 2 is a diagram showing the radiation imaging apparatus 100 when viewed from the rear surface 110b (when viewed from the negative side of the Z axis) without a cover 2 (described later) and a cushioning material 6 (described later). As shown in FIGS. 1 and 2, a side surface 110c of the housing 110 is provided with a connector 51, an antenna 56, and an operation unit 57. The connector 51 supplies power from the outside via a wired connection and communicates with the outside. The antenna 56 performs wireless communication with an external device. The operation unit 57 includes switches such as a power switch and a changeover switch.

[0020] FIG. 3 is a cross-sectional view taken along line III-III of the radiation imaging apparatus 100 shown in FIG. As shown in FIG. 3, the housing 110 includes a box body 1 and a cover body 2, and is in the form of a rectangular panel. The housing 110 also houses an internal module 120 .

[0021] Furthermore, the housing 110 is made of a material that transmits radiation. For example, the material of the housing 110 is carbon fiber reinforced plastic (CFRP) containing short fibers, glass fiber reinforced plastic (GFRP), light metal or an alloy containing light metal, carbon fiber reinforced thermoplastic (CFRTP), etc. Furthermore, when the material of the housing 110 is carbon fiber reinforced (thermoplastic) resin or glass fiber reinforced resin, it may be formed using SMC (Sheet Molding Compound), which is a material containing shorter fibers than prepreg. Light metals include metals with relatively low specific gravity, such as aluminum and magnesium. This allows the housing 110 to be made lighter while maintaining its rigidity. In particular, carbon fiber reinforced resin has high radiation transmittance, so that radiation that has passed through the subject reaches the internal module 120 without attenuation along the way. This allows the image quality of the radiographic image to be higher than when the housing 110 is made of other materials.

[0022] Additionally, the housing 110 may be treated with an antibacterial coating either on the entire surface or incorporated into the material itself. Furthermore, the housing 110 may be provided with a protective member at the corners (at least one of the four corners of the front surface 11 and the four corners of the back surface 21). The material of the protective member may be metal, but since the radiation imaging apparatus 100 according to this embodiment is lightweight and receives little impact upon collision, it may be elastic (resin, rubber, elastomer, etc.). At least one of the protective members may be different from the other protective members in at least one of color and shape, so that the orientation of the radiation imaging device 100 can be easily identified based on the position of the protective member that is different in at least one of color and shape from the other protective members.

[0023] [1-1. Box body] As shown in FIG. 3, the box 1 has a front surface 11 and a side surface 12. The front surface 11 and the side surface 12 are integrally formed. The front surface portion 11 and the side surface portion 12 may be separate members.

[0024] (1-1-1.Front part) The front surface part 11 faces an imaging surface 312g (described later) of the radiation detection unit 3 and extends parallel to the imaging surface 312g. The outer surface of the front surface part 11 serves as a radiation incident surface 110a (front surface) of the radiation imaging apparatus 100 (housing 110). The front surface portion 11 is formed in the shape of a rectangular plate. Furthermore, on the radiation incident surface 110a, the range of the effective image area (area where a plurality of semiconductor elements 312b (see FIG. 5) are arranged) of the sensor panel 31 (see FIG. 4), which is a converter, is indicated by a frame (not shown).

[0025] (1-1-2. Side part) The side surface portion 12 extends from the peripheral edge of the front surface portion 11 in a direction perpendicular to the radiation incident surface 110a and in a direction toward the rear surface portion 21 (negative Z-axis direction). The outer surface of the side surface portion 12 becomes the side surface 110c of the radiation imaging apparatus 100 (housing 110).

[0026] [1-2. Lid] As shown in FIG. 3, the cover 2 has a rear surface portion 21. The cover 2 according to this embodiment has a rear surface portion 21 as a whole. The rear surface portion 21 faces the front surface portion 11 of the box body 1 with the internal module 120 interposed therebetween, and extends parallel to the front surface portion 11. The outer surface of the rear surface part 21 becomes the rear surface 110b of the radiation imaging apparatus 100 (housing 110).

[0027] The cover 2 (rear portion 21) is in contact with the side surface portion 12 of the box 1 and is attached to the side surface portion 12. As a result, the side surface portion 12 connects the front surface portion 11 and the rear surface portion 21. The lid 2 according to this embodiment is fixed to the box 1 with screws. Therefore, when repairing or maintaining the radiation imaging apparatus 100, the rear section 21 can be separated from the front section 11 and the side section 12 simply by loosening and removing the screws. In other words, a person performing maintenance on the radiation imaging apparatus 100 can easily access the internal module 120 housed within the front section 11 and the side section 12. Furthermore, a waterproof structure can be achieved by inserting a packing between the lid 2 and the box 1 and screwing or gluing them together. This prevents moisture from seeping in, preventing the foam from absorbing water and affecting the sensor panel and electrical components.

[0028] [1-3. Other] Although Figure 3 illustrates a housing 110 (box body 1) in which the side portion 12 is integrally formed with the front portion 11, the housing 110 may be one in which the side portion 12 is integral with the back portion 21, or the front portion 11, side portion 12, and back portion 21 may each be separate components. Furthermore, while Figure 3 illustrates an example of a housing 110 having a box body 1 and a lid body 2, the housing may also have a cylindrical body formed in a cylindrical shape having a front portion 11, a back portion 21, and a pair of side portions 12 connecting both ends of the front portion 11 and both ends of the back portion 21, and a lid body that closes the opening of the cylindrical body.

[0029] [2. Internal Module] The internal module 120 is fixed to the inner surface of the front part 11 . Methods for fixing the internal module 120 to the housing 110 include bonding using adhesive, adhering using adhesive tape, fitting into a recess or protrusion formed on the inner surface, engaging with an engaging portion formed on the inner surface, etc. This prevents the internal module 120 from moving when it receives an impact from a direction (X-axis direction, Y-axis direction) that is approximately perpendicular to the side surface 110c of the radiation imaging device 100, thereby preventing damage to the internal module 120.

[0030] The internal module 120 may be fixed to the inner surface of the rear portion 21 or the inner surface of the side portion 12 . In addition, the internal module 120 may be fixed to the inner surface of the front portion 11 and the inner surface of the rear portion 21, the inner surface of the front portion 11 and the inner surface of the side portion 12, and the inner surface of the side portion 12 and the inner surface of the rear portion 21, respectively. Furthermore, the internal module 120 may be fixed to the inner surface of the front portion 11, the inner surface of the side portion 12, and the inner surface of the rear portion 21, respectively.

[0031] The internal module 120 includes a radiation detection unit 3 , a support member 4 , an electric component 5 , and a cushioning material 6 .

[0032] [2-1. Radiation detection unit] As shown in FIG. 3, the radiation detection unit 3 is provided between the front surface 11 of the housing 110 and the support member 4 via an adhesive layer (not shown). FIG. 4 is a partial cross-sectional view IV of FIG. As shown in FIG. 4, the radiation detection unit 3 includes a sensor panel 31, a radiation shielding layer 32, and an electromagnetic field shielding layer 33.

[0033] (2-1-1. Sensor panel) The sensor panel 31 according to this embodiment is provided between a radiation shielding layer 32 and an electromagnetic field shielding layer 33 . The sensor panel 31 according to this embodiment also includes a wavelength conversion section 311 and a photoelectric conversion section 312.

[0034] The wavelength conversion section 311 is for converting radiation into visible light or the like. The wavelength conversion section 311 according to this embodiment is provided between the electromagnetic field shielding layer 33 and the photoelectric conversion section 312 . Moreover, the wavelength converting section 311 according to this embodiment is arranged so as to extend in parallel with the radiation incident surface 110a of the housing 110. Moreover, the wavelength converting section 311 according to this embodiment has a support layer and a phosphor layer, which are not shown.

[0035] The support layer is made of a flexible material and is formed in the shape of a film (thin plate). Examples of flexible materials include polyethylene naphthalate, polyethylene terephthalate (PET), polycarbonate, polyimide, polyamide, polyetherimide, aramid, polysulfone, polyethersulfone, fluororesin, polytetrafluoroethylene (PTFE), or composite materials made by mixing at least two or more of these. Of the above materials, polyimide, polyamide, polyetherimide, PTFE, or a composite material thereof is particularly preferred from the viewpoint of improving heat resistance. The support layer according to this embodiment is formed in a rectangular shape.

[0036] The phosphor layer is formed of a phosphor on the surface of the support layer. A phosphor is a substance that emits light when its atoms are excited by ionizing radiation such as alpha rays, gamma rays, or X-rays. In other words, phosphors convert radiation into ultraviolet light or visible light. The phosphor may be, for example, a columnar crystal of cesium iodide (CsI).

[0037] The phosphor layer according to this embodiment is formed on the entire surface of the support layer facing the photoelectric conversion section 312 . That is, the wavelength converting portion 311 is formed in a rectangular shape. Furthermore, the phosphor layer according to this embodiment has a thickness that allows it to bend (elastically deform) together with the support layer when the support layer is bent.

[0038] The wavelength converting section 311 configured in this manner is in the form of a flexible plate, and the area exposed to radiation emits light with an intensity according to the dose of the radiation received.

[0039] The photoelectric conversion section 312 is for converting light into an electrical signal. The photoelectric conversion section 312 according to this embodiment is provided between the wavelength conversion section 311 and the radiation shielding layer 32 . Moreover, the photoelectric conversion section 312 according to this embodiment is arranged so as to extend in parallel with the wavelength conversion section 311 . The photoelectric conversion section 312 is bonded to the wavelength conversion section 311 . As shown in FIG. 5, the photoelectric conversion unit 312 includes a substrate 312a, a plurality of semiconductor elements 312b, a plurality of scanning lines 312c, a plurality of signal lines 312d, a plurality of switching elements 312e, and a plurality of bias lines 312f.

[0040] The substrate 312a is formed in the form of a film (thin plate) using the flexible material described above. The substrate 312a according to this embodiment has a rectangular shape when viewed from the front, which is substantially the same as the wavelength converting section 311. The substrate 312 a according to this embodiment is made of the same material as the support layer of the wavelength converting section 311 . That is, the substrate 312a according to this embodiment is flexible, and its coefficient of thermal expansion and contraction are equal to those of the support layer. Therefore, when the photoelectric conversion section 312 thermally expands, the wavelength conversion section 311 also thermally expands, making it difficult for the laminate of the photoelectric conversion section 312 and the wavelength conversion section 311 to warp. As a result, there is no misalignment between the light-emitting position of the wavelength conversion section 311 and the opposing semiconductor element 312b, preventing degradation in the quality of radiographic images. The substrate 312a may be formed from a material that has the same coefficient of thermal expansion and contraction as the support layer but is different from the support layer.

[0041] Each of the plurality of semiconductor elements 312b generates an amount of charge according to the intensity of the light received. Furthermore, the plurality of semiconductor elements 312b are formed so as to be distributed two-dimensionally on the surface of the substrate 312a. Specifically, the semiconductor elements 312b are arranged in a matrix on the surface of the substrate 312a that is in contact with (bonded to) the wavelength converting portion 311. The semiconductor elements 312b according to this embodiment are arranged in a matrix at the center of the imaging surface 312g. Specifically, the semiconductor elements 312b are arranged in a plurality of rectangular regions (corresponding to the pixels of the radiographic image) surrounded by a plurality of scanning lines 312c (not shown) formed on the surface of the substrate 312a at equal intervals and extending parallel to one another, and a plurality of signal lines 312d (not shown) formed at equal intervals and perpendicular to the scanning lines. Each rectangular region is provided with a switch element 312e. The switch element 312e is formed of, for example, a TFT, and the gate of each switch element 312e is connected to a scanning line 312c, the source is connected to a signal line 312d, and the drain is connected to a semiconductor element 312b.

[0042] Hereinafter, the surface of the substrate 312a on which the semiconductor element 312b is formed will be referred to as an imaging surface 312g. The photoelectric conversion section 312 configured in this manner is flexible, and is disposed so that the imaging surface 312g on which the semiconductor element 312b is formed faces the wavelength conversion section 311.

[0043] Furthermore, by forming the sensor panel 31, which is composed of the wavelength conversion unit 311 and the photoelectric conversion unit 312, from a flexible material as described above, the sensor panel 31 is less likely to break even if the radiation imaging device 100 receives an impact, and the sensor panel 31 can be made lighter.

[0044] (2-1-2. Radiation shielding layer) The radiation shielding layer 32 is intended to prevent scattered radiation from reaching the circuit board 52 . The radiation shielding layer 32 according to this embodiment is provided between the sensor panel 31 (photoelectric conversion section 312) and the electromagnetic field shielding layer 33, as shown in FIG. The radiation shielding layer 32 is preferably made of metal, particularly lead, but in recent years, tungsten, molybdenum, etc. have also been used from the viewpoint of environmental protection. Furthermore, the radiation shielding layer 32 according to this embodiment fixes the sensor panel 31 with a mounting portion (not shown). The radiation shielding layer 32 may be provided between the radiation detection unit 3 and the support member 4 .

[0045] (2-1-3. Electromagnetic field shielding layer) The electromagnetic field shield layer 33 is for shielding noise. The electromagnetic field shield layer 33 is provided on at least one of the imaging surface 312g of the radiation detection unit 3 and the surface opposite to the imaging surface 312g. As shown in FIG. 4, the electromagnetic field shield layer 33 according to this embodiment is provided on both the imaging surface 312g side and the opposite surface side. The electromagnetic field shielding layer 33 on the imaging surface 312g side is attached to the inner surface of the front surface 11 by an adhesive layer not shown, and the electromagnetic field shielding layer 33 on the surface opposite the imaging surface 312g is attached to the support member 4 by an adhesive layer not shown.

[0046] The electromagnetic field shield layer 33 is a layer member that partially contains a conductive material. The electromagnetic field shielding layer 33 in this embodiment includes a thin metal film, a resin film with a metal layer formed on the surface, a film made of a transparent conductive material (such as indium tin oxide (ITO)), etc. Metals include, for example, aluminum and copper. Methods for forming the metal layer include, for example, a method of attaching a metal foil, a method of vapor-depositing a metal, and the like. For the electromagnetic field shield layer 33, a film such as Alpet (registered trademark, Panac Corporation) is suitable. At least one electromagnetic field shield layer 33 is provided on one surface.

[0047] If the electromagnetic field shield layer 33 is provided on the imaging surface 312g side, external noise entering from the front surface 11 side can be shielded. On the other hand, if the electromagnetic field shield layer 33 is provided on the side opposite to the imaging surface 312g, noise generated by the circuit board 52 can be shielded.

[0048] The electromagnetic field shielding layer 33 may be connected to, for example, the ground (GND), which keeps the potential of the electromagnetic field shielding layer 33 constant and further enhances the noise shielding effect. In this case, it is preferable to interpose a metal (for example, nickel) whose ionization tendency is small compared to that of aluminum or copper. The metal with a small difference in ionization tendency is interposed in the form of, for example, an intermediate member plated with a metal with a small difference in ionization tendency, or a conductive tape containing a metal with a small difference in ionization tendency as a conductive filler. When metals with a large difference in ionization tendency (for example, aluminum and copper) come into contact with each other, electrolytic corrosion may occur, but this method can prevent this.

[0049] [2-2. Supporting members] The support member 4 supports the radiation detection unit 3 . This "support" includes not only supporting the radiation detection unit 3 against the load received from the front surface portion 11 side, but also providing the radiation detection unit 3 on the support member 4. As shown in FIG. 3, the support member 4 is provided between the radiation detection unit 3 and the rear surface unit 21. In this way, the support member 4 distributes the load that the housing 110 receives from the outside, and therefore, bending of the radiation detection unit 3 (sensor panel 31) can be suppressed.

[0050] The support member 4 is made of a foam. By doing so, the weight of the internal module 120 including the support member 4 can be reduced compared to when it is made of metal or non-foamed resin. The foam material includes any one of polyethylene, polypropylene, polystyrene, modified polyphenylene ether, polyurethane, acrylic, and epoxy. In general, soft resins have lower rigidity than hard resins. On the other hand, it is known that the lower the expansion ratio of a soft resin foam, the higher its rigidity. Therefore, the required rigidity can be obtained by adjusting the expansion ratio when producing the foam. The expansion ratio is preferably, for example, 30 or less. In this way, the support member 4 can be made lighter while still obtaining the necessary rigidity without using a material (for example, fiber-reinforced resin or metal) that is more rigid than the foam in a portion (for example, the surface layer) of the support member 4.

[0051] It is preferable that the support member 4 has a coefficient of thermal expansion that is approximately the same as that of the sensor panel 31. The support member 4 may also be elastic. The sensor panel 31 has a higher coefficient of thermal expansion than a conventional panel equipped with a glass substrate. However, if the above-described configuration is adopted, even if the sensor panel 31 expands, the support member 4 also expands to the same extent or elastically deforms to absorb the expansion of the sensor panel 31, thereby preventing the sensor panel 31 from expanding alone and causing wrinkles in the sensor panel 31.

[0052] As shown in FIGS. 2 and 3, the support member 4 has a planar support portion 4a and a plurality of leg-like support portions 4b.

[0053] (2-2-1. Planar support part) The planar support portion 4a is arranged without any gaps along the surface opposite the imaging surface 312g of the photoelectric conversion portion 312 of the sensor panel 31 (the surface of the electromagnetic field shielding layer 33 on the side opposite the imaging surface 312g of the photoelectric conversion portion 312). The planar support member 4a has a predetermined thickness in the direction (Z-axis direction) perpendicular to the surface opposite the imaging surface 312g, and is in the form of a plate extending parallel to the surface. In this way, the support member 4 further distributes the load received by the housing 110 from the outside, thereby further suppressing deflection of the radiation detection unit 3.

[0054] One surface of the planar support portion 4a contacts the radiation detection portion 3, and the other surface contacts the circuit board 52, the battery 54, the radiation detection sensor 55, and the like. Hereinafter, one surface of the planar support portion 4a that contacts the radiation detection portion 3 will be referred to as a support surface 41a. The support surface 41a according to this embodiment is slightly larger than the sensor panel 31. In other words, the planar support portion 4a has an extending portion 4aa that extends from the radiation detection unit 3 in a direction parallel to the support surface 41a of the planar support portion 4a (a direction parallel to the plane formed by the X-axis and Y-axis). Therefore, the planar support portion 4a can support the entire sensor panel 31.

[0055] 3 illustrates a planar support portion 4a having a uniform thickness (width in the direction perpendicular to the support surface 41a (Z-axis direction)), but the planar support portion 4a may be thicker at the periphery in the direction along the support surface 41a (X-axis and Y-axis directions) than at the center. This can further increase rigidity against loads and impacts. Furthermore, the planar support portion 4a may be thicker in the center than in the peripheral edge portion.

[0056] (2-2-2. Leg support part) As shown in FIG. 3, the leg-like support portion 4b is provided so as to protrude from an opposite surface 41b, which is the surface opposite to the support surface 41a of the planar support portion 4a, toward the back surface portion 21 until it abuts against the back surface portion 21. The area surrounded by the leg-like support portions 4b constitutes a recessed portion 4c. The recess 4c accommodates a circuit board 52, a battery 54, an irradiation detection sensor 55, and the like. The width, depth and length of the recess 4c may be any size that can accommodate the circuit board 52, the battery 54, the irradiation detection sensor 55 and the like.

[0057] (2-2-3. Supporting members and others) The support member 4 is formed by integrally molding the planar support portion 4a and the leg support portion 4b from a single foam body. In this case, the recess 4c may be formed by cutting the area intended to be the recess 4c or by partial pressing, but is preferably formed by partial pressing. The portions of the support member 4 where the recesses 4c are formed are thinner (the width in the direction perpendicular to the support surface 41a (Z-axis direction) is smaller) than the other portions (the leg-like support portions 4b). However, when the recesses 4c are formed by partial pressing, the foaming ratio of the surface of the recesses 4c decreases, improving the strength. Therefore, the rigidity of the support member 4 at the recesses 4c can be made equivalent to that of the leg-like support portions 4b. The support member 4 may also be made by laminating a plurality of foam sheets.

[0058] [2-3. Electrical Components] [2-3. Electrical Components] As shown in Figures 2 and 3, the electrical component 5 includes a connector 51, a circuit board 52, wiring 53A (531A, 532A), 53B, a battery 54, an irradiation detection sensor 55, an antenna 56, an operation unit 57, a readout IC 58, etc.

[0059] The connector 51 can be connected to an external connector for supplying power from an external device via a wired connection and for communicating with an external device. The connector 51 is also connected to a circuit board 52, and outputs external power and communication signals to the circuit board 52. The antenna 56 performs wireless communication with an external device. The antenna 56 is also connected to the circuit board 52 and outputs a communication signal from the outside to the circuit board 52. The operation unit 57 is a switch such as a power switch, a changeover switch, etc. The operation unit 57 is connected to the circuit board 52 and outputs an input operation signal to the circuit board 52. The readout IC 58 converts the output signal from the radiation detection unit 3 (photoelectric conversion unit 312) into image data.

[0060] (2-3-1. Circuit board) The circuit board 52 is equipped with various electronic circuits. The circuit board 52 includes an SIF board 521, a control board 522, a GIF board 523, a board on which a wireless communication circuit is mounted, a board on which a power supply circuit is mounted, and the like. The SIF board 521 is connected to the radiation detection unit 3 via a wiring 531A, and reads out an output signal from the radiation detection unit 3 via the wiring 531A and a readout IC 58 provided thereon. The control board 522 controls each circuit to generate image data. The GIF substrate 523 is connected to the radiation detection unit 3 via a wiring 532A, and controls a gate driver IC (not shown) that drives the gate of the switch element 312e, which is provided on the wiring 532A. The wireless communication circuit is a circuit for wireless communication with other devices. The power supply circuit is a circuit for applying voltage to semiconductor elements and supplying power to the above circuits.

[0061] 3, the circuit board 52 is attached to the opposite surface 41b of the planar support portion 4a with an adhesive or adhesive tape. In this case, the terminals may be connected with wiring using, for example, conductive tape. Circuit board 52 is spaced apart from rear surface 21 of housing 110. This arrangement makes it possible to prevent the load received by housing 110 from being transmitted to circuit board 52 from the outside.

[0062] (2-3-2. Wiring) The wiring 53A is made of, for example, a flexible printed circuit board (Flexible Printed Circuits), and connects the photoelectric conversion unit 312 and the various circuit boards 52. The wiring 53A includes wiring 531A, wiring 532A, and the like. The wiring 531A connects the terminals of the signal lines (semiconductor elements 312b) of the photoelectric conversion unit 312, the readout IC 58, and the SIF board 521. The wiring 532A connects the terminals of the scanning lines (switch elements) of the photoelectric conversion unit 312, the gate driver IC, and the GIF substrate 523.

[0063] As shown in FIG. 2, the wiring 53B connects the connector 51 and the circuit board 52, for example. 3, the wiring 53B is housed in the recess 4c. The recess 4c housing the wiring 53B is the wiring groove 41c. The groove 41c is formed in the peripheral edge of the planar support portion 4a (support member 4). The portions where the recesses 4c are formed are thinner (smaller width in the direction perpendicular to the support surface 41a (Z-axis direction)) than other portions (the leg-like support portions 4b), and therefore are more likely to bend when a load is applied to the radiation imaging device 100. On the other hand, when a load is applied to a portion close to the end (side surface 110c) of the housing 110, the side surface 110c supports the load, thereby suppressing deflection. Therefore, by arranging the wiring 53B in a portion close to the end of the housing 110 (the peripheral edge of the planar support portion 4a), it is possible to suppress deflection of the grooves 41c even when a load is applied. This in turn suppresses deflection of the radiation detection unit 3, thereby reducing unevenness in the captured image.

[0064] As shown in FIG. 3, the electric component 5 also includes a GND wiring 531B and a wiring 532B for the irradiation detection sensor.

[0065] The GND wiring 531B connects the circuit board 52, to which the battery 54 is connected, to the housing 110, which is the frame ground. The GND wiring 531B is stored in a recess 4ba formed in the leg-shaped support 4b so that it is positioned farther from the radiation detection unit 3 in the thickness direction (Z-axis direction) of the radiation imaging device 100 than the other wiring (wiring 53B, wiring 532B for the irradiation detection sensor, etc.). A large current may flow through the GND wiring 531B depending on the state of the battery 54. This large current generates large noise. Therefore, by arranging the GND wiring 531B at a position far from the radiation detection unit 3 in the thickness direction of the radiographic imaging device 100, it is possible to reduce the influence of large noise on the radiation detection unit 3 and the occurrence of unevenness in images.

[0066] The irradiation detection sensor wiring 532B connects the irradiation detection sensor 55 and the circuit board 52. The irradiation detection sensor 55 outputs the detection result to the circuit board 52 via the irradiation detection sensor wiring 532B. The irradiation detection sensor wiring 532B is attached to the planar support part 4a and stored in the recess 4c so as to be disposed at a position farther from the rear surface part 21 in the thickness direction of the radiation imaging apparatus 100 than the other wiring (GND wiring 531B, etc.). Note that the wiring 53B (for example, connecting the connector 51 and the circuit board 52) shown in FIG. 3 may be provided at the same position in the thickness direction of the radiation imaging apparatus 100 as the irradiation detection sensor wiring 532B. During wireless communication by the antenna 56, an electromagnetic field may be generated from the antenna wiring connected to the antenna 56, and this electromagnetic field may be reflected by the housing 110, causing noise. If the radiation detection sensor wiring 532B is affected by the noise, there is a possibility that radiation may be erroneously detected as being irradiated even though radiation is not being irradiated. Therefore, by arranging the radiation detection sensor wiring 532B at a position far from the rear surface part 21 in the thickness direction of the radiation imaging device 100, it is possible to suppress the influence of noise generated when the electromagnetic field is reflected by the housing 110. This makes it possible to prevent erroneous detection of radiation.

[0067] As described above, the GND wiring 531B and the wiring 532B (multiple electrical wiring) for the irradiation detection sensor are arranged at different positions in the thickness direction of the radiation imaging device 100 between the planar support portion 4a (support member 4) and the rear portion 21 of the housing 110. To achieve this configuration, one of the wires may be stored in a recess 4ba formed in the leg-like support 4b, or the planar support 4a or leg-like support 4b may be made thicker. Because the support member 4 is made of a foam material, even if the support member 4 (planar support 4a or leg-like support 4b) is made thicker, the weight increase is small compared to when the support member 4 is made of metal.

[0068] (2-3-3. Battery) The battery 54 supplies power to each part of the radiation imaging apparatus 100 . In this embodiment, the battery 54 is a lithium ion capacitor, but may also be a lithium ion battery or other rechargeable battery. As shown in Figures 2 and 3, the battery 54 supports the radiation detection unit 3 with its center located closer to the center between the end (side surface 110c) and the center of the housing 110. Specifically, it is preferable to place the battery 54 near the center where the load is applied, for example, within a 10 x 12 inch (approximately 25 x 30 cm) range from the center of the back portion 21. This is because most of the load is generated in this range during portable photography. It is also more preferable to place the battery 54 in a position that includes the center of the housing 110. Furthermore, multiple batteries 54 may be provided. In this case, the above-mentioned positional condition may be satisfied for any one of the batteries 54. Alternatively, for example, even if the gaps between the multiple batteries 54 are located in the center, the above-mentioned positional condition can be said to be satisfied as long as the envelope of the outline of the multiple batteries 54 includes the center position.

[0069] 6 shows an example of how the battery 54 is attached. In FIG. 6, the top and bottom (Z-axis direction) are reversed from FIG. 6, battery 54 stores power using laminated electrodes 541, which are thin electrodes laminated in a liquid. In battery 54, laminated electrodes 541 are collectively projected to the outside as terminals 542, and the periphery of laminated electrode 541 is sealed with sealing bag 543. Terminal 542 has two terminals, a positive pole and a negative pole. Terminal 542 is fixed to circuit board 52 with screws 545 via insulating member 544, which is an insulator, and supplies power via wiring connected to circuit board 52. Note that, for simplification, only one pole is shown in FIG. 6. Sealing bag 543 is aluminum-deposited to prevent leakage of the contents. Therefore, if screws 545 for fixing to circuit board 52 come into contact with sealing bag 543, electrical continuity will occur through sealing bag 543, causing a short circuit between the positive and negative poles. Therefore, as described above, by fixing the terminal 542 with the screw 545 via the insulating member 544, the insulating member 544 can be interposed between the screw 545 and the sealing bag 543, thereby preventing a short circuit between the positive and negative poles.

[0070] 7A shows an example of attaching the battery 54. In FIG. 7, the upside down (Z-axis direction) is reversed from FIG. As shown in FIG. 7A, the battery 54 is attached to the planar support portion 4a via an adhesive material 546. The adhesive material 546 is a peelable adhesive, double-sided adhesive tape, or the like, and is configured to be removable so that the battery 54 can be replaced if it deteriorates over time. Furthermore, if the terminals 542 of the battery 54 are bent when the battery 54 is peeled off from the planar support portion 4a, there is a possibility that the laminated electrode 541 may be short-circuited. For this reason, it is more preferable that the adhesive 546 be of a type that peels off from the adhesive and the adhered object when stretched, such as the TESA 704 series. In this case, since peeling is difficult if the adhesive 546 is wide, narrow strips may be formed and arranged on the adhesive surface of the battery 54, as shown in FIG. 7B. 7C, the strip ends of adhesive material 546 can be made to protrude beyond the surface of battery 54 to serve as tabs 546a for pulling adhesive material 546, making it easier to peel off. Tabs 546a may be reinforced with a resin film or the like to prevent them from breaking when pulled. In FIG. 7C, the direction in which tabs 546a are pulled is indicated by an arrow.

[0071] 2, the battery 54 is arranged so that the terminals 542 protrude in a direction (X-axis direction) perpendicular to the side of the housing 110 on which the connector 51 is provided. When the radiographic imaging device 100 is placed in a bin or cradle of a medical cart for charging and the connector 51 is connected to the power supply unit in the bin or cradle, the radiographic imaging device 100 receives an impact in a direction perpendicular to the side of the housing 110 on which the connector 51 is provided (the X-axis direction). Therefore, as described above, by positioning the battery 54 so that the terminals 542 protrude in a direction (X-axis direction) perpendicular to the side of the housing 110 on which the connector 51 is provided, it is possible to prevent an impact from being applied perpendicular to the protruding direction of the terminals 542, thereby preventing damage to the terminals 542.

[0072] (2-3-4. Irradiation detection sensor) The irradiation detection sensor 55 detects radiation irradiated onto the front surface 110a. The irradiation detection sensor 55 is connected to the circuit board 52 and outputs the detection result to the circuit board 52. As shown in FIGS. 2 and 3, the irradiation detection sensor 55 is attached to the planar support portion 4a near the center of the housing 110, and is housed in the recess 4c.

[0073] [2-4. Cushioning material] As shown in FIG. 3, the buffer material 6 is a spacer that is attached between the circuit board 52 and the rear surface portion 21 of the housing 110. At least a portion of the cushioning material 6 is disposed at a distance from the battery 54, with its center located closer to the center between the end (side surface 110c) and the center of the housing 110. Specifically, it is preferable to dispose it near the center where the load is applied, for example, within a 10 x 12 inch range from the center of the back surface 21. It is also more preferable that at least a portion of the cushioning material 6 is disposed in a position that includes the center of the housing 110. With the above configuration, the load applied near the center of the housing 110 is supported in a dispersed manner by the battery 54 and the cushioning material 6, and therefore, the radiation detection unit 3 can be prevented from bending due to the load.

[0074] <Variation 1> Next, a first modification of the present invention will be described. In the first modification, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0075] FIG. 8 shows a detailed view of region VIII in FIG. 3 of this modified example. As shown in Figure 8, the planar support portion 4a of this modified example is provided with an attachment member 4d having a female thread, and the circuit board 52 (control board 522) is fixed to the planar support portion 4a via the attachment member 4d and a screw 4da through a hole opened in the circuit board 52 (control board 522). Furthermore, the buffer material 6 has a notch 61 in a portion facing the mounting member 4d across the circuit board 52 (control board 522). This prevents a reaction force from being generated by the mounting member 4d when a load F shown in Fig. 8 is applied to the radiation imaging apparatus 100. This reduces the reaction force acting on the radiation detection unit 3 and the occurrence of unevenness in captured images.

[0076] <Variation 2> Next, a description will be given of Modification 2 of the present invention. In Modification 2, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0077] FIG. 9 is a cross-sectional view taken along line III-III of the radiation imaging apparatus 100 shown in FIG. 1 according to this modification. As shown in FIG. 9, an internal module 120 of this modified example includes a support member 4A instead of the support member 4. The support member 4A has a planar support portion 4Aa that is thinner (shorter in width in the Z-axis direction) than the planar support portion 4a, and a leg-shaped support portion 4Ab that is thicker (longer in width in the Z-axis direction) than the leg-shaped support portion 4b.

[0078] The support member 4A is made of metal or resin. It is preferable that the support member 4A has a coefficient of thermal expansion that is approximately the same as that of the sensor panel 31. In this case, increasing the thickness of the planar support portion 4Aa increases the weight, so the height of the recess 4c cannot be reduced to match the height of the battery 54 (the width in the thickness direction (Z-axis direction) of the planar support portion 4Aa). Therefore, as shown in FIG. 9, a buffer material 6 is provided between the battery 54 and the rear surface portion 21 to fill the space in the height direction (Z-axis direction) of the recess 4c. As described above, by providing the cushioning material 6 between the battery 54 and the back portion 21, the difference in level between the battery 54 and other parts (such as the leg-like support portion 4b) can be eliminated, thereby preventing uneven pressure on the battery 54. In the above embodiment, a buffer material 6 may be provided between the battery 54 and the back surface portion 21, as shown in FIG.

[0079] <Variation 3> Next, a description will be given of Modification 3 of the present invention. In Modification 3, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0080] FIG. 10 is a cross-sectional view taken along line III-III of the radiation imaging apparatus 100 shown in FIG. 1 according to this modification. In this modification, as shown in FIG. 10, the irradiation detection sensor 55 is provided on the periphery of the housing 110 (the periphery of the planar support portion 4a). The recess 4c where the irradiation detection sensor 55 is housed is thinner than the other portions (leg-like support portions 4b), and is therefore prone to deflection when a load is applied to the radiographic imaging device 100. On the other hand, when a load is applied to a portion close to the end (side surface 110c) of the housing 110, the side surface 110c supports the load, thereby suppressing deflection. Therefore, by arranging the irradiation detection sensor 55 in a portion close to the end of the housing 110 (the peripheral edge of the planar support portion 4a), it is possible to suppress deflection of the recess 4c where the irradiation detection sensor 55 is housed, even when a load is applied. This in turn suppresses deflection of the radiation detection unit 3, thereby reducing unevenness in captured images.

[0081] <Variation 4> Next, a fourth modification of the present invention will be described. In the fourth modification, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0082] Fig. 11A is a perspective view of a front surface 110a and a portion of a side surface 110c of the radiation imaging apparatus 100 of this modified example. Fig. 11B is a cross-sectional view taken along line BB of the radiation imaging apparatus 100 of Fig. 11A. In Fig. 11B, parts other than the housing 110A and the connector 51 are omitted. As shown in FIGS. 11A and 11B, in this modification, housing 110A includes a box body 1A and a box body 2A, and is in the form of a rectangular panel. The box 1A has a front surface 11A and a side surface 12A. The front surface portion 11A and the side surface portion 12A are integrally formed, although the front surface portion 11A and the side surface portion 12A may be separate members. The box body 2A has a back surface 21A and a side surface 22A. The rear surface portion 21 and the side surface portion 22A are integrally formed, although the rear surface portion 21A and the side surface portion 22A may be separate members. The housing 110A also has an opening 110f formed by a notch 121A provided in the side surface portion 12A and a notch 221A provided in the side surface portion 22A. In the opening 110f, for example, a connector 51 is disposed.

[0083] Near the opening 110f, the height (width in the direction perpendicular to the front surface 110a (Z-axis direction)) of the side surface portion 12A and the side surface portion 22A is smaller than other portions, and therefore the strength is reduced. 11B, housing 110 is provided with reinforcing portion 110g on rear surface portion 21A near opening 110f, thereby preventing a decrease in strength near opening 110f. The reinforcing portion 110g may be provided on only one of the front surface portion 11A and the rear surface portion 21A, or may be provided on both the front surface portion 11A and the rear surface portion 21A. Furthermore, the reinforcing portion 110g may be formed integrally with the back surface portion 21A by thickening the portion of the back surface portion 21A near the opening 110f, or the back surface portion 21A and the reinforcing portion 110g may be formed as separate members.

[0084] <Variation 5> Next, a description will be given of Modification 5 of the present invention. In Modification 5, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0085] FIG. 12 is a cross-sectional view taken along line III-III of the radiation imaging apparatus 100 shown in FIG. 1 according to this modification. 12, the housing 110 has a recess 211 for accommodating the battery 54. The recess 211 is located closer to the center of the housing 110 between the end (side surface 110c) and the center. The housing 110 also includes a storage section 110h for storing the battery 54. The storage section 110h that stores the battery 54 is stored in the recess 211. With the above configuration, the battery 54 can be easily attached to and detached from the radiation imaging apparatus 100.

[0086] <Variation 6> Next, a sixth modification of the present invention will be described. In the sixth modification, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0087] 13 is a diagram showing an example of fixing the wiring 532B for the irradiation detection sensor to the support member 4 (planar support portion 4a). In FIG. 13, the top and bottom (Z-axis direction) are reversed from FIG. 13, in this modification, a groove portion 42a for electrical wiring is formed in the support member 4 (planar support portion 4a). In addition, a wiring fixing recess portion 43a is formed in the support member 4 at a fixing position of the irradiation detection sensor wiring 532B. When assembling the radiation imaging apparatus 100, the irradiation detection sensor wire 532B is placed in the groove 42a and fixed in the wire fixing recess 43a with a wire fixing member 44a (adhesive tape or the like). When wiring other than the irradiation detection sensor wiring 532B (the wiring 53B, the GND wiring 531B, etc.) is attached to the support member 4, it may be fixed in the same manner as the above configuration.

[0088] By forming the grooves 42a in the support member 4, it is possible to clearly see where the radiation detection sensor wiring 532B is to be disposed, and assembly of the radiation imaging apparatus 100 becomes easier. Furthermore, by forming the wire fixing recess 43a in the support member 4, the irradiation detection sensor wire 532B is not fixed to a wrong position, and the radiation imaging apparatus 100 can be easily assembled. Furthermore, when the support member 4 is formed using the foam bead method, the support member 4 is generally white, making it easy to see the colored wiring and components, and preventing errors in the positioning or fixing of the wiring.

[0089] <Variation 7> Next, a seventh modification of the present invention will be described. In the seventh modification, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0090] FIG. 14 is a cross-sectional view of the radiation imaging apparatus 100 of this modified example taken along the line III-III in FIG. 1A, showing the vicinity of an end portion of the housing 110. In FIG. In this modification, as shown in FIG. 14, the support member 4 includes a thick portion 4e. The thick portion 4e is provided on the planar support portion 4a near the end of the housing 110 (the end of the planar support portion 4a). The thick portion 4e may be formed integrally with the planar support portion 4a by thickening the portion near the end of the planar support portion 4a, or the planar support portion 4a and the thick portion 4e may be formed as separate members.

[0091] If the support member 4 is made of a foam material, it is susceptible to damage due to an impact FA in a direction parallel to the support surface 41a of the planar support portion 4a (a direction parallel to the plane formed by the X-axis and Y-axis) shown in Fig. 14. For example, if the impact FA is received from the direction of the side surface 110c due to a fall or the like, the radiation imaging device 100 may bend or buckle, leading to damage. Therefore, by providing the support member 4 with the thick portion 4e, it is possible to improve the strength at the end portion of the radiation imaging apparatus 100 (housing 110).

[0092] <Variation 8> Next, an eighth modification of the present invention will be described. In the eighth modification, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0093] FIG. 15 is a view showing the vicinity of a corner of the support member 4. As shown in FIG. In this modification, as shown in FIG. 15, the support member 4 has curved surfaces 4R with a predetermined radius of curvature at the corners of the support member 4 (the planar support portion 4a or the leg-like support portion 4b). The support member 4 may have a curved surface with a predetermined radius of curvature not only at the corners of the support member 4 but also at the ridges of the support member 4. Also, the support member 4 may have a chamfered surface instead of a curved surface.

[0094] When the support member 4 is made of a foam material (especially when made of a bead method foam), the ridges and corners of the support member 4 are likely to break when the radiographic imaging device 100 hits something. In particular, when handling the radiographic imaging device 100 during assembly, the support member 4 may chip, and the foam material that falls off may get into other parts inside the radiographic imaging device 100, adversely affecting imaging. Therefore, as described above, by providing curved surfaces 4R or chamfering the ridges and corners of the support member 4 to make the support member 4 less likely to chip, it is possible to prevent the support member 4 from being damaged.

[0095] <Variation 9> Next, a description will be given of Modified Example 9 of the present invention. In Modified Example 9, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0096] FIG. 16 is a cross-sectional view taken along the line III-III of the radiation imaging apparatus 100 of this modified example shown in FIG. 1A. In this modification, as shown in FIG. 16, the internal module 120 includes a shield layer 7. The shield layer 7 is intended to reduce the influence of charging on the radiation detection unit 3 caused by the support member 4. The shield layer 7 has the same shape as the support surface 41a of the planar support portion 4a, and is provided between the radiation detection unit 3 and the planar support portion 4a so as to cover the entire surface of the support surface 41a. Furthermore, the shielding layer 7 is disposed on the surface of the support member 4 (planar support portion 4a) outside the planar view region of the radiation detection unit 3, at a position facing at least a part of the wiring 53A (wiring 531A) that passes through the side surface of the planar support portion 4a and connects the circuit board 52 and the radiation detection unit 3. The part of the support member 4 (planar support portion 4a) outside the planar view region of the radiation detection unit 3 is the extension portion 4aa. The shield layer 7 is disposed at a position facing the wiring 53A (wiring 531A) on the support surface 41a (surface on the radiation detection unit 3 side) of the extension portion 4aa. The shield layer 7 is made of a metal thin film, a film on which metal is vapor-deposited, or the like.

[0097] If the support member 4 is made of a foam material (bead method foam) that is easily charged, and the support member 4 vibrates due to an external disturbance while it is charged, the radiation detection unit 3 will be affected by the charging, which will likely cause unevenness in the captured image. Furthermore, in an imaging method in which the radiation imaging device 100 and the radiation irradiation device are not linked and radiation irradiation is detected using part of the output signal of the radiation detection unit 3, noise caused by the charging effect may erroneously detect radiation irradiation even when radiation is not being irradiated. Conventionally, if the support member 4 is made of a material that is not as electrically charged as bead-method foam, the impact of charging is small even if the shield layer 7 has the same shape as the radiation detection unit 3 and there are parts that do not cover the support member 4. However, if the support member 4 is made of bead-method foam, which is easily charged, there will be parts of the support member 4 that the shield layer 7 does not cover, and these parts will be affected by charging. Therefore, by covering the entire support surface 41a with the shield layer 7 as described above, the influence of charging on the radiation detection unit 3 can be reduced compared to when the shield layer has the same shape as the radiation detection unit 3, and the occurrence of unevenness in captured images can be reduced.In addition, false detections in radiation irradiation detection can be reduced. Furthermore, since the charging of the support member 4 can affect the signals passing through the wiring 53A (wiring 531A) connecting the circuit board 52 and the radiation detection unit 3, resulting in unevenness or false detection, the effect can be suppressed by covering the entire support surface 41a of the support member 4, at least on the side where the wiring 53A (wiring 531A) exists. Furthermore, the suppression effect is greater if the charging extends to the end faces and back surface of the support member 4.

[0098] Instead of providing the internal module 120 with the shield layer 7, a lower shield layer 332 (see FIG. 21) which is an electromagnetic field shield layer 33 on the negative Z-axis direction side and is provided on the surface opposite the imaging surface 312g may have the same shape as the support surface 41a and be provided to cover the entire surface of the support surface 41a. Alternatively, the radiation shielding layer 32 described above may be used as a shielding layer to cover the entire surface of the support surface 41a. In this case, the lower shield layer 332 or the radiation shielding layer 32 is connected to ground (GND). In this case, it is not necessary to provide a separate shield layer 7, which makes it possible to reduce the weight of the radiation imaging apparatus 100 and improve assembly efficiency.

[0099] In this modification, the internal module 120 includes a heat conductive material 8 as shown in FIG. The thermally conductive material 8 is for dissipating heat from the readout IC 58 . The thermally conductive material 8 is disposed between the wiring 531A and the back surface portion 21 at a position facing the readout IC 58 with the wiring 531A interposed therebetween.

[0100] When the readout IC 58 is operated at high speed, it generates heat. If the temperature of the readout IC 58 becomes too high, the converted image data will become out of sync, resulting in unevenness in the image. This type of problem is particularly likely to occur when taking continuous shots to obtain moving images. Therefore, as described above, by thermally connecting the readout IC 58 and the rear surface portion 21 with the thermally conductive material 8, the readout IC 58 can dissipate heat and prevent the temperature from rising too high.

[0101] In this modification, as shown in FIG. 16, the internal module 120 includes a buffer material 6A. The buffer material 6A is disposed between the planar support portion 4a and the SIF substrate 521. It is preferable to use vibration-damping rubber as the buffer material 6A, which can suppress vibrations more effectively than porous (sponge-like) resin material.

[0102] 2, the wiring 531A is arranged along the side of the housing 110. The SIF board 521 has an elongated shape that follows the side of the housing 110, and is arranged along the side of the housing 110. When the support member 4 is made of a foam material, the support member 4 is prone to vibration because foam material is lightweight. When the support member 4 vibrates, the various circuit boards 52 attached to the support member 4 also vibrate. For example, because the SIF board 521 has an elongated shape, it vibrates with nodes at the attachment positions of the SIF board 521 and antinodes between the attachment positions. When the SIF board 521 vibrates, the resistance of the circuits on the board changes, which can add noise to the output signal of the radiation detection unit 3 and cause unevenness in the captured image. Therefore, by arranging the buffer material 6A between the planar support portion 4a and the SIF substrate 521 as described above, it is possible to suppress vibration of the SIF substrate 521 and prevent unevenness from occurring in the captured image. As shown in FIG. 16, in order to suppress vibration of the control board 522 and the readout IC 58, a cushioning material 6A may be placed between the planar support portion 4a and the control board 522, and between the planar support portion 4a and the readout IC 58.

[0103] As shown in FIG. 2, the GIF substrate 523 has an elongated shape that follows the side of the housing 110, and is disposed along the side of the housing 110. Like the SIF substrate 521, the GIF substrate 523 also vibrates in accordance with the vibration of the support member 4. Therefore, in order to suppress vibration of the GIF substrate 523, a buffer material 6A may be disposed between the planar support portion 4a and the GIF substrate 523. Furthermore, in order to suppress vibrations of the gate driver IC provided on the wiring 532A, a buffer material 6A may be placed between the planar support portion 4a and the gate driver IC. Note that since the gate driver IC is less affected by vibrations than the readout IC 58, the buffer material 6A in this case may be a porous (sponge-like) resin material instead of vibration-damping rubber.

[0104] <Modification 10> Next, a description will be given of Modification 10 of the present invention. In Modification 10, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0105] 17A and 17B are views showing the vicinity of the end of the planar support section 4a in a cross-sectional view taken along the line III-III of the radiation imaging apparatus 100 of this modified example shown in FIG. 1A. In this modification, as shown in FIGS. 17A and 17B, the inner module 120 includes a shield layer 7. 17A, the shield layer 7 may be provided so as to cover the entire support surface 41a and the side surfaces 41d of the planar support portion 4a (extension portion 4aa). Also, even if the planar support portion 4a has the same shape as the radiation detection unit 3 and no extension portion 4aa is present, the shield layer 7 may be provided so as to cover the entire support surface 41a and the side surfaces 41d of the planar support portion 4a. As shown in FIG. 17B, the shield layer 7 may be provided so as to cover the entire support surface 41a, the side surface 41d of the planar support portion 4a (extension portion 4aa), and at least a part of the opposite surface 41b of the extension portion 4aa. This makes it possible to further reduce the influence of charging on the radiation detection unit 3.

[0106] <Variation 11> Next, an eleventh modification of the present invention will be described. In the eleventh modification, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0107] Fig. 18 is a cross-sectional view of the radiation imaging apparatus 100 of this modified example taken along the line III-III of Fig. 1A. In Fig. 18, parts other than the housing 110 are omitted. As shown in FIG. 18, in this modification, the housing 110 includes a fastening member 110i and a waterproof member 110j. The cover 2 is attached to the box 1 by fastening members 110i via a waterproof member 110j.

[0108] When lightweight metals such as aluminum and magnesium, or carbon fiber reinforced plastic (CFRP) is used as the material for the housing 110, warping and twisting occurs in the lid 2 (rear section 21). Furthermore, when the lid 2 has a flat plate shape and a waterproof member 110j is provided between the box body 1 and the lid 2 as in the above configuration, significant warping occurs in the lid 2 (rear section 21) as shown in FIG. If warping occurs in the cover 2, the housing 110 will become uneven in the thickness direction (Z-axis direction), and there is a risk that the thickness will exceed the thickness specified by the JIS standard and it will no longer be possible to place it on the imaging table.

[0109] In order to prevent the cover 2 from warping, in this modification, the housing 110 is provided with a retraction mechanism that connects the support member 4 and the rear surface portion 21 and retracts the rear surface portion 21. 19A and 19B show an example of a retraction mechanism. 19A, the leg-like support 4b and the back surface portion 21 are fixed using a fixing material 110k. The fixing material 110k may be an adhesive or a sticky material. The fixing method shown in FIG. 19A requires low material costs and simple assembly steps. 19B, a retraction member 110l having a female thread is provided on the planar support portion 4a, and the rear portion 21 is fixed to the retraction member 110l by a screw 110m passing through a hole opened in the rear portion 21. The fixing method shown in FIG. 19B eliminates the risk of damaging the support member 4 when the cover 2 is removed from the box 1 during inspection or repair of the radiation imaging apparatus 100.

[0110] Furthermore, when warping occurs in the cover 2 as described above, there is a risk that the contact between the heat conductive material 8 and the readout IC 58 via the wiring 531A will become insufficient. In order to ensure contact between the thermally conductive material 8 and the readout IC 58, in this modification, the housing 110 is provided with a retraction mechanism shown in FIG. 20A. In the example shown in FIG. 20A, a lead-in member 110l is provided on the planar support portion 4a near the thermally conductive material 8, and the rear portion 21 is fixed to the lead-in member 110l by a screw 110m passed through a hole opened in the rear portion 21. The retraction mechanism may be provided near each of the four sides of the housing 110 to suppress warping of the entire lid body 2, but it is preferable to provide the retraction mechanism at least near the readout IC 58.

[0111] In this modification, the rear surface portion 21 includes recesses 212 and 213. The recess 212 is provided in a portion of the rear surface portion 21 facing the thermally conductive material 8 . This increases the strength of the rear surface portion 21 compared to when it is flat, and ensures reliable contact between the heat conductive material 8 and the readout IC 58 via the wiring 531A. Furthermore, since the distance between the readout IC 58 and the rear surface portion 21 in the thickness direction (Z-axis direction) of the housing 110 is shortened, the thickness of the heat conductive material 8 can be reduced, and heat dissipation efficiency can be improved. Furthermore, a user of the radiation imaging apparatus 100 can easily carry the radiation imaging apparatus 100 by gripping the recess 212. The recess 213 is provided around a hole in the rear surface portion 21 through which the screw 110m is inserted. This prevents the head of the screw 110m from protruding downward from the rear surface 21 onto the paper (negative Z-axis direction), thereby preventing problems during use such as the head of the screw 110m scratching the imaging table or getting caught on bed sheets.

[0112] Furthermore, as shown in FIG. 20B, the housing 110 may be provided with a slide portion 110n at the connection portion between the planar support portion 4a and the retraction member 110l, which enables the retraction member 110l to move in a direction parallel to the support surface 41a (a direction parallel to the plane formed by the X-axis and Y-axis). As a result, even if the position of the hole through which the screw 110m is inserted, which is opened in the back surface portion 21, is misaligned, the back surface portion 21 can be reliably fixed to the retraction member 110l by the screw 110m by moving the retraction member 110l.

[0113] <Modification 12> Next, a description will be given of Modification 12 of the present invention. In Modification 12, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0114] In this modification, as shown in FIG. 21, the internal module 120 includes a shield layer 7. FIG. 21 is a diagram showing an example of the ground connection of the radiation detecting section 3 and the shield layer 7. In FIG. As shown in FIG. 21, in this modification, the electromagnetic field shield layer 33 on the upper side of the paper (positive Z-axis direction) is referred to as upper shield layer 331, and the electromagnetic field shield layer 33 on the lower side of the paper (negative Z-axis direction) is referred to as lower shield layer 332. The upper shield layer 331 is formed from an aluminum-deposited film, and is used as a shield by being electrically connected to the ground. The upper shield layer 331 is electrically connected to the ground via a first conductive member 52A that includes a shield layer connecting portion 52e, a conductive portion 52d, and a terminal connecting portion 52c. 21, shield layer connecting portion 52e is attached so as to follow the shape of the sloped portion to the flat portion of upper shield layer 331. For this reason, a conductive tape with little elasticity, such as no substrate or a substrate made of a thin or soft material, is used for shield layer connecting portion 52e. Terminal connection portion 52c is fixed with screws 52b to ground terminal 52a of circuit board 52. For this reason, a highly elastic conductive tape made of a thick or hard material is used as terminal connection portion 52c so that it will not be damaged by the force of the screws. Conduction portion 52d connects shield layer connection portion 52e and terminal connection portion 52c. It is preferable to use a resin film on which a conductive paste is printed as conduction portion 52d, as this has sufficient strength to prevent breakage due to external vibrations or the like. The individual portions of first conductive member 52A may be formed as separate members and connected as described above, or may be formed as a single piece using thin conductive tape. In this case, it is preferable to change the hardness of each portion depending on the required function, such as leaving first conductive member 52A in a soft state as thin conductive tape, reinforcing conductive portion 52d with a resin film, and reinforcing terminal connection portion 52c with an even thicker resin or metal film. The shield layer 7 is electrically connected to the ground via the second conductive member 52f and the terminal connection portion 52c. The shield layer 7 may also function as a radiation shielding layer. As a result, there are shields above and below (in the positive and negative directions of the Z axis) the switch element 312e (such as a TFT), so the switch element 312e can be protected from external noise. Furthermore, even if peeling occurs between the lower shield layer 332 and the shield layer 7 and charging occurs, the influence of the charging can be suppressed by the lower shield layer 332. Alternatively, the influence of charging due to peeling between the shield layer 7 and the support member 4 and noise from the circuit board 52 can also be suppressed by the lower shield layer 332 and the shield layer 7. Furthermore, the above effect is enhanced by connecting the shield layer 7 to the ground.

[0115] <Variation 13> Next, a description will be given of Modification 13 of the present invention. In Modification 13, the same components as those in the above embodiment are given the same reference numerals, and the description thereof will be omitted.

[0116] In this modification, the internal module 120 includes a radiation shielding layer as the shielding layer 7, which is connected to ground and used as a shield. In this case, the shielding layer 7 is a lead shielding material, and is formed from lead foil and an adhesive material. 22, the shield layer 7 has conductive portions 7a which are protrusions for ground conduction that partially protrude from the shield layer 7. This eliminates the need for a separate conductive member, thereby reducing costs and improving the ease of assembly of the radiation imaging apparatus 100. The upper shield layer 331 and / or the lower shield layer 332 may be provided with similar protruding conductive portions.

[0117] As described above, the radiographic imaging device 100 of this embodiment is a radiographic imaging device 100 that captures radiographic images, and includes a radiation detection unit 3 that detects radiation, a support member 4 made of a charged material that supports the radiation detection unit 3, a conductive layer (shielding layer 7) and an electronic circuit (electronic circuit mounted on a circuit board 52) that are provided between the radiation detection unit 3 and the support member 4, and electrical wiring (wiring 53A) that passes along the side of the support member 4 (planar support portion 4a) and connects the radiation detection unit 3 to the electronic circuit, and the conductive layer is positioned on the surface of the support member 4 (planar support portion 4a) outside the planar view area of ​​the radiation detection unit 3 in a position facing at least a portion of the electrical wiring. Therefore, the shielding layer 7 covers the portion of the surface of the support member 4 (planar support portion 4a) outside the planar view area of ​​the radiation detection unit 3 that faces at least a part of the electrical wiring, thereby suppressing the charging effect of the support member 4 made of a charged material on the radiation detection unit 3, electrical wiring, etc.

[0118] In the radiation imaging apparatus 100 of this embodiment, the support member 4 is made of a foam material. Therefore, the weight of the radiation imaging apparatus 100 can be reduced.

[0119] In the radiation imaging apparatus 100 of this embodiment, the radiation detection unit 3 includes a flexible substrate 312a and a semiconductor element 312b formed on an imaging surface 312g of the substrate 312a. Therefore, even if the radiation imaging apparatus 100 receives an impact, the sensor panel 31 is less likely to be damaged.

[0120] Furthermore, in the radiation imaging device 100 of this embodiment, the support member 4 has an extension portion 4aa extending from the radiation detection unit 3 in a direction parallel to the surface (support surface 41a) of the support member 4 that supports the radiation detection unit 3, and the conductive layer is positioned opposite the electrical wiring on the surface (support surface 41a) of the extension portion 4aa facing the radiation detection unit 3. Therefore, the shield layer 7 covers the surface (support surface 41a) of the extension portion 4aa facing the radiation detection unit 3, thereby suppressing the charging effect of the support member 4 made of a charged material on the radiation detection unit 3, electrical wiring, etc.

[0121] In the radiographic imaging apparatus 100 of this embodiment, the conductive layer is provided on the side surface 41d of the support member 4 and / or on the surface of the extension 4aa opposite to the radiation detection unit 3. Therefore, the shielding layer 7 covers the side surface 41d of the support member 4 (planar support portion 4a) facing the radiation detection unit 3 and / or the opposite surface 41b of the extension portion 4aa, thereby further suppressing the charging effect of the support member 4 made of a charged material on the radiation detection unit 3, electrical wiring, etc.

[0122] In the radiographic imaging apparatus 100 of this embodiment, the conductive layer is a lead shielding member. Therefore, a radiation shielding layer can be provided as the shielding layer 7 .

[0123] The present invention is not limited to the above-described embodiment and modifications, and various modifications are possible. For example, although the support member 4 is described as having the planar support portion 4a and the leg-like support portion 4b integrally molded from a single foam, this is not limiting. The planar support portion 4a and the leg-like support portion 4b may be formed using foams made of different materials, or the planar support portion 4a and the leg-like support portion 4b may be molded separately and then bonded together after molding.

[0124] Furthermore, the shield layer 7 may not be provided on the side surface 41d of the planar support portion 4a, but may be provided only on a part of the support surface 41a and the opposite surface 41b.

[0125] Furthermore, the internal module 120 (radiography device 100) does not need to include the support member 4. Even in this case, the center of the battery 54 is positioned closer to the center between the end and center of the housing 110 to support the radiation detection unit 3.

[0126] In addition, the specific configurations, operation contents and procedures shown in the above embodiments can be modified as appropriate within the scope that does not deviate from the spirit of the present invention. [Explanation of symbols]

[0127] 100 Radiography equipment 110, 110A housing 110a Radiation entrance surface (front) 110b back 110c side 110d, 110e No grain part 110f opening 110g reinforcement part 110h Storage area 110i Fastening members 110j Waterproofing material 110k fixing material 110l Retraction member 110m screw 110n slide part 1, 1A box body 11, 11A Front part 121A Notch 12, 12A side part 2 Lid 21 Back part 211, 212, 213 recesses 2A box body 21A Back part 22A Side part 221A Notch 120 Internal Module 3 Radiation detection unit 31 Sensor Panel 311 Wavelength conversion unit 312 Photoelectric conversion unit 312a substrate 312b Semiconductor element 312c scan line 312d signal line 312e Switching element 312f bias wire 312g imaging surface 32 Radiation Shielding Layer 33 Electromagnetic field shielding layer 331 Upper shield layer 332 Lower shield layer 332a Continuity part 4, 4A Support member 4a, 4Aa Planar support part 4aa extension 42a Groove 43a Wiring fixing recess 44a Wiring fixing member 4b, 4Ab leg support 4ba recess 4c Recess 41c Groove 4d Mounting material 4da screws 4e Thick part 4R curved surface 41a Support surface 41b opposite side 41d Side 5. Electrical Components 51 Connector 52 Circuit Board 52A First conductive member 52a Ground terminal 52b screw 52c Terminal connection 52d Continuity part 52e Shield layer connection 52f Second conductive member 521 SIF board 522 control board 523 GIF board 53A, 531A, 532A wiring 53B Wiring 531B GND wiring 532B Irradiation detection sensor wiring 54 Battery 541 Multilayer electrode 542 terminals 543 Sealed bag 544 Insulating materials 545 screws 546 Adhesive material 55 Irradiation detection sensor 56 Antenna 57 Operation section 6, 6A buffer material 61 Notch 7 Shielding Layer 8. Thermal Conductive Materials

Claims

1. A radiographic imaging device for capturing a radiographic image, a planar radiation detection unit having a substrate and a semiconductor element formed on an imaging surface of the substrate, the radiation detection unit detecting radiation; a support member made of a charged material and supporting the radiation detection unit; a conductive layer provided between the radiation detection unit and the support member; An electronic circuit, an electrical wiring that passes through a side surface of the support member and connects the radiation detection unit and the electronic circuit; Equipped with the conductive layer is disposed at a position facing at least a part of the electrical wiring on a surface of the support member outside a planar view area of ​​the radiation detection unit, and the conductive layer is provided so as to cover a side surface of the support member; The radiation imaging apparatus, wherein the conductive layer is a radiation shielding layer connected to ground.

2. 2. The radiographic imaging apparatus according to claim 1, wherein the support member is made of a foam material.

3. The radiographic imaging apparatus according to claim 1 , wherein the radiation detection unit is flexible.

4. the support member has an extension portion that extends from the radiation detection unit in a direction parallel to a surface of the support member that supports the radiation detection unit, The radiographic imaging apparatus according to claim 1 , wherein the conductive layer is disposed on the surface of the extension portion facing the radiation detection unit, at a position facing the electrical wiring.

5. The radiographic imaging apparatus according to claim 4 , wherein the conductive layer is further provided on a surface of the extension portion opposite to the radiation detection portion.

6. The radiographic imaging apparatus according to claim 1 , wherein the conductive layer is a lead shielding material.

Images