Cleaning brush, substrate processing device, and substrate processing method

Abstract

To provide a technique for enhancing the removal efficiency of particles with a cleaning brush.SOLUTION: A cleaning brush cleans a chucking surface of a chuck. The cleaning brush includes a brush base linearly extending radially to an outside in a radial direction from a rotation center line of the chuck, and a plurality of contact portions which protrudes from the brush base and contacts the suction surface. When viewed in a direction orthogonal to the suction surface, a plurality of rows each including the plurality of contact portions arranged at intervals in a first direction, is provided at intervals in a second direction intersecting the first direction. The second direction is a longitudinal direction of the brush base. In each of the rows, at least two contact portions are of different types.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a cleaning brush, a substrate processing apparatus, and a substrate processing method. [Background technology]

[0002] The cleaning brush described in Patent Document 1 is provided on a machine tool for cleaning a surface on which a workpiece is placed. The cleaning brush includes a brush base and multiple brush rows. The brush base rotates about an axis that is substantially perpendicular to the surface to be cleaned. The multiple brush rows are arranged on the surface of the brush base that faces the surface to be cleaned. Each brush row is arranged along an inclined line that starts midway along a radial line extending from the axis and is inclined relative to the radial line. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-59881 Summary of the Invention [Problem to be solved by the invention]

[0004] One aspect of the present disclosure provides a technique for improving the efficiency of particle removal by a cleaning brush. [Means for solving the problem]

[0005] A cleaning brush according to one aspect of the present disclosure cleans the suction surface of a chuck. The cleaning brush includes a brush base extending linearly radially outward from the rotation centerline of the chuck, and a plurality of contact portions protruding from the brush base and contacting the suction surface. When viewed from a direction perpendicular to the suction surface, a plurality of rows of the contact portions spaced apart in a first direction are provided spaced apart in a second direction intersecting the first direction. The second direction is the longitudinal direction of the brush base. In each row, at least two of the contact portions are of different types. [Effects of the Invention]

[0006] According to one aspect of the present disclosure, the efficiency of particle removal by a cleaning brush can be improved. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view showing a substrate processing apparatus according to an embodiment. [Figure 2] FIG. 2 is a side view showing an example of a chuck and a tool driving unit. [Figure 3] FIG. 3 is a plan view showing a cleaning brush according to one embodiment. [Figure 4] FIG. 4 is an enlarged plan view of a part of FIG. [Figure 5] FIG. 5 is a plan view showing an example of the flow of the cleaning liquid near the cleaning brush of FIG. [Figure 6] FIG. 6 is a side view showing an example of a type of contact portion. [Figure 7] FIG. 7 is a plan view showing an example of a swinging portion. [Figure 8] FIG. 8 is a plan view showing an example of the swing range of the brush base. [Figure 9] FIG. 9 is a plan view showing an example of the flow of the cleaning liquid near the cleaning brush of FIG. [Figure 10] FIG. 10 is a plan view showing an example of a plurality of contact portions arranged on an imaginary circle. [Figure 11] FIG. 11 is a plan view showing a modified example of the swing range of the brush base. [Figure 12] FIG. 12 is a cross-sectional view showing a cleaning brush according to a modified example. [Figure 13] FIG. 13 is a cross-sectional view showing an example of movement of the pin in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that the same or corresponding components in each drawing are denoted by the same reference numerals, and descriptions thereof may be omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to one another. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is vertical. The U-axis direction, the V-axis direction, and the Z-axis direction are perpendicular to one another. The U-axis direction and the V-axis direction are horizontal directions, the U-axis direction is the longitudinal direction of the brush base 51, and the V-axis direction is the width direction of the brush base 51.

[0009] A substrate processing apparatus 1 according to one embodiment will be described with reference to Fig. 1. In this embodiment, the substrate processing apparatus 1 is a grinding apparatus that grinds a substrate W, but it may also be a polishing apparatus, cutting apparatus, trimming apparatus, or the like. The substrate processing apparatus 1 may be any apparatus that processes a substrate W that is attracted to the attracting surface of a chuck 20. The substrate W includes a semiconductor substrate or a glass substrate. The semiconductor substrate is a silicon wafer or a compound semiconductor wafer.

[0010] The substrate processing apparatus 1 includes, for example, a turntable 10, four chucks 20, and three drive units 30. The turntable 10 holds the four chucks 20 around a rotation center line R1, and rotates about the rotation center line R1 to rotate the four chucks 20. When viewed from above, the rotation direction of the turntable 10 may be switched between a clockwise direction and a counterclockwise direction.

[0011] The four chucks 20 are arranged at equal intervals around the rotation center line R1 of the turntable 10. Each chuck 20 rotates together with the turntable 10 and moves, for example, to a first load / unload position A0, a first grinding position A1, a second grinding position A2, a third grinding position A3, and the first load / unload position A0 in this order. The first load / unload position A0 serves as a load position where the transfer device 2 transfers the substrate W to the chuck 20 and also as a unload position where the transfer device 2 receives the substrate W from the chuck 20. Note that in this embodiment, the load position and the unload position are the same position, but they may be different positions. The first grinding position A1 is a position where primary grinding of the substrate W is performed. The second grinding position A2 is a position where secondary grinding of the substrate W is performed. The third grinding position A3 is a position where tertiary grinding of the substrate W is performed.

[0012] The first loading / unloading position A0, the first grinding position A1, the second grinding position A2, and the third grinding position A3 are arranged counterclockwise around the rotation center line R1 of the turntable 10, but the technology of the present disclosure is not limited to this. For example, a second loading / unloading position may be arranged instead of the third grinding position A3. Similar to the first loading / unloading position A0, the second loading / unloading position serves as both a loading position where the transfer device 2 transfers the substrate W to the chuck 20 and a unloading position where the transfer device 2 receives the substrate W from the chuck 20. In this case, for example, two substrates W are loaded into the first loading / unloading position A0 and the second loading / unloading position, subsequently ground at the first grinding position A1 and the second grinding position A2, and subsequently unloaded at the first loading / unloading position A0 and the second loading / unloading position.

[0013] Next, an example of the chuck 20 and the drive unit 30 will be described with reference to Fig. 2. The chuck 20 has a suction surface 21 that suctions the substrate W. The suction surface 21 suctions the substrate W from below. While the suction surface 21 is a horizontal plane in Fig. 2, it may also be a conical surface that is symmetrical about the rotation center line R2 of the chuck 20. In the latter case, the rotation center line R2 is inclined with respect to the Z-axis direction, and the thickness distribution of the substrate W after grinding can be adjusted by adjusting the angle of inclination.

[0014] The chuck 20 has, for example, a porous body 22 on its suction surface 21. The porous body 22 is embedded in a recess in the upper surface of a base 23. When the gas inside the porous body 22 is sucked and the air pressure inside the porous body 22 becomes a negative pressure lower than atmospheric pressure, the substrate W is sucked onto the porous body 22. On the other hand, when the suction of the gas is stopped and the air pressure inside the porous body 22 is returned to atmospheric pressure, the suction of the substrate W is released.

[0015] The chucks 20 are attached to the rotary table 10 so as to be rotatable about a rotation center line R2. A chuck motor 25 is provided for each chuck 20 to rotate the chuck 20. The rotational driving force of the chuck motor 25 may be transmitted to the chuck 20 via a rotation transmission mechanism such as a timing belt or gears.

[0016] The driving unit 30 drives the grinding tool D. The driving unit 30 rotates and raises and lowers the grinding tool D. The grinding tool D grinds the substrate W that is adsorbed to the chuck 20. Note that the tool for processing the substrate W is not limited to the grinding tool D, and may be, for example, a polishing tool, a cutting tool, or a trimming tool.

[0017] The driving unit 30 includes a movable unit 31 to which a grinding tool D is attached. The grinding tool D is pressed against the substrate W to grind the substrate W. The grinding tool D includes, for example, a disk-shaped grinding wheel D1 and a plurality of grinding stones D2 arranged in a ring shape on the lower surface of the grinding wheel D1. The grinding stones D2 may be fixed to the entire lower surface of the grinding wheel D1.

[0018] The movable part 31 has a flange 32 on which the grinding tool D is attached, a spindle shaft 33 on whose lower end the flange 32 is provided, and a spindle motor 34 that rotates the spindle shaft 33. The flange 32 is arranged horizontally, and the grinding tool D is attached to its lower surface. The spindle shaft 33 is arranged vertically. The spindle motor 34 rotates the spindle shaft 33, thereby rotating the grinding tool D attached to the flange 32. The rotation center line R3 of the grinding tool D is the rotation center line of the spindle shaft 33.

[0019] The drive unit 30 further has an elevator unit 35 that raises and lowers the movable unit 31. The elevator unit 35 has, for example, a vertical Z-axis guide 36, a Z-axis slider 37 that moves along the Z-axis guide 36, and a Z-axis motor 38 that moves the Z-axis slider 37. The movable unit 31 is fixed to the Z-axis slider 37, and the movable unit 31 and grinding tool D rise and fall together with the Z-axis slider 37. The elevator unit 35 further has a position detector 39 that detects the position of the grinding tool D. The position detector 39 detects, for example, the rotation of the Z-axis motor 38 to detect the position of the grinding tool D.

[0020] The lifting unit 35 lowers the grinding tool D from the standby position. The grinding tool D rotates while descending, and comes into contact with the upper surface of the rotating substrate W, grinding the entire upper surface of the substrate W. When the thickness of the substrate W reaches a set value, the lifting unit 35 stops the lowering of the grinding tool D. Thereafter, the lifting unit 35 raises the grinding tool D to the standby position.

[0021] The substrate processing apparatus 1 processes a plurality of substrates W in sequence. When a particle gets caught between the chucking surface 21 of the chuck 20 and the substrate W, the substrate W is locally deformed. When the substrate W is ground in this state, a localized concave defect called a dimple is formed on the surface of the substrate W. Particles that cause dimples include, for example, transferred material transferred from the substrate W, processing debris generated during processing of the substrate W, or fragments generated by damage to the porous body 22.

[0022] Therefore, as shown in FIG. 1, the substrate processing apparatus 1 includes a cleaning brush 50. The cleaning brush 50 cleans the suction surface 21 of the rotating chuck 20 and removes particles adhering to the suction surface 21. The cleaning brush 50 cleans the suction surface 21 after removing one substrate W from the suction surface 21 and before adsorbing another substrate W to the suction surface 21. The cleaning brush 50 is provided, for example, at the first load / unload position A0. When the second load / unload position is provided instead of the third grinding position A3, the cleaning brush 50 may be provided at both the first load / unload position A0 and the second load / unload position.

[0023] The substrate processing apparatus 1 also includes a nozzle 80 that supplies cleaning liquid to the suction surface 21 of the chuck 20. The nozzle 80 is provided, for example, at the first load / unload position A0. When a second load / unload position is provided instead of the third grinding position A3, the nozzle 80 may be provided at both the first load / unload position A0 and the second load / unload position. The nozzle 80 supplies cleaning liquid to the suction surface 21 of the rotating chuck 20, for example. The cleaning liquid is supplied to the rotation center line R2 of the suction surface 21 or its vicinity, and spreads across the entire radial direction of the suction surface 21 by centrifugal force. For example, DIW (deionized water) is used as the cleaning liquid. The nozzle 80 may be a two-fluid nozzle that mixes and discharges cleaning liquid and gas.

[0024] The substrate processing apparatus 1 includes a control unit 90. The control unit 90 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs that control various processes executed in the substrate processing apparatus 1. The control unit 90 controls the operation of the substrate processing apparatus 1 by having the CPU 91 execute the programs stored in the storage medium 92.

[0025] Next, a cleaning brush 50 according to one embodiment will be described with reference to FIGS. 3 to 5. Note that FIG. 3 only shows the outline of the brush base 51 to illustrate the arrangement of the contact portions 52. The cleaning brush 50 includes the brush base 51 and a plurality of contact portions 52. The brush base 51 extends linearly radially outward from the rotation center line R2 of the chuck 20. The brush base 51 has a length, for example, approximately the same as the radius of the suction surface 21 of the chuck 20, and extends above the periphery of the suction surface 21 of the chuck 20. The brush base 51 may be fixed during cleaning of the chuck 20, or may be oscillated as described below.

[0026] Each contact portion 52 protrudes from the underside of the brush base 51 and comes into contact with the adsorption surface 21. Each contact portion 52 scrapes off or peels off particles adhering to the adsorption surface 21. Each contact portion 52 is, for example, a bristle bundle formed by bundling multiple bristles. The bristle bundle is implanted in a hole provided in the underside of the brush base 51.

[0027] In this embodiment, each contact portion 52 is a bristle bundle, but may also be a sponge or a pin. Each contact portion 52 may be any material that can remove particles adhering to the suction surface 21 of the chuck 20 without damaging the suction surface 21. Each contact portion 52 is preferably made of resin so as not to damage the suction surface 21 of the chuck 20.

[0028] As shown in Fig. 3, when viewed from a direction perpendicular to the suction surface 21 (Z-axis direction), a plurality of rows 53 each consisting of a plurality of contact portions 52 arranged at intervals in a first direction are provided at intervals in a second direction intersecting the first direction. The second direction is the longitudinal direction (U-axis direction) of the brush base 51. In Fig. 3, the longitudinal direction of the brush base 51 coincides with the radial direction of the chuck 20. The number of rows 53 provided at intervals in the second direction is not particularly limited.

[0029] The first direction is the extension direction of the rows 53. The first direction is, for example, a direction that obliquely intersects with the second direction. For example, the first direction is a direction that inclines from the radially inner side to the radially outer side of the chuck 20 as it moves from the upstream side in the rotation direction of the chuck 20 to the downstream side in the rotation direction. In other words, the first direction is a direction that inclines radially outward with respect to the rotation center line R2 of the chuck 20 as it moves from the upstream side in the rotation direction of the chuck 20 to the downstream side in the rotation direction. Note that the first direction may be a direction that inclines in the opposite direction, or may be a direction that intersects with the second direction perpendicularly.

[0030] When viewed from the Z-axis direction, a plurality of rows 54 each consisting of a plurality of contact portions 52 arranged at intervals in the second direction (U-axis direction) are provided in a fourth direction perpendicular to the second direction. The fourth direction is the width direction (V-axis direction) of the brush base 51. The number of rows 54 is not limited to three, and may be two, four or more.

[0031] 5, the cleaning liquid L is supplied upstream of the cleaning brush 50 in the rotation direction of the chuck 20. The cleaning liquid L rotates together with the chuck 20 and reaches the cleaning brush 50. The cleaning brush 50 has a discharge path 55 between two adjacent rows 53 for discharging the cleaning liquid L.

[0032] The discharge path 55 extends in a first direction. If the first direction is a direction that inclines from the radially inner side to the radially outer side of the chuck 20 as it moves from the upstream side in the rotation direction of the chuck 20 to the downstream side in the rotation direction, the cleaning liquid containing particles discharged from the cleaning brush 50 flows from the radially inner side to the radially outer side of the chuck 20 and is discharged outside the suction surface 21 in a short time. Therefore, the time that the cleaning liquid containing particles discharged from the cleaning brush 50 remains on the suction surface 21 can be shortened. In addition, the area where the cleaning liquid containing particles discharged from the cleaning brush 50 remains on the suction surface 21 can be narrowed.

[0033] Each row 53 includes n contact portions 52 lined up in the first direction. n is a natural number of 2 or more, and preferably a natural number of 3 or more. n is preferably a natural number of 7 or less. In each row 53, the mth (m is a natural number of 1 or more and n or less) contact portion 52 from the upstream side of the rotation direction of the chuck 20 to the downstream side of the rotation direction is referred to as the mth contact portion 52-m.

[0034] 4, when viewed from the Z-axis direction, if a direction perpendicular to the first direction is defined as a third direction, a distance G1 in the third direction between two adjacent rows 53 is larger than a distance G2 in the first direction between two adjacent contact portions (e.g., first contact portion 52-1 and second contact portion 52-2) in each row 53. The distance G1 is the width of the discharge path 55. If the distance G1 is larger than the distance G2, the width of the discharge path 55 is wide, and the cleaning liquid L can easily pass through the discharge path 55.

[0035] In each row 53, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 are arranged at equal intervals in the first direction. This reduces uneven discharge of the cleaning liquid L. Note that in each row 53, the interval in the first direction between the first contact portion 52-1 and the second contact portion 52-2 may be different from the interval in the first direction between the second contact portion 52-2 and the third contact portion 52-3. The interval G1 in the third direction between two adjacent rows 53 only needs to be greater than the maximum value of the interval G2 in the first direction between two adjacent contact portions 52 in each row 53.

[0036] The multiple rows 53 are arranged at equal intervals in the U-axis direction. This reduces uneven discharge of the cleaning liquid L. The multiple rows 53 may also be arranged at unequal intervals in the U-axis direction. In this case, the distance G1 between two adjacent rows 53 in the third direction, i.e., the width of the discharge path 55, varies depending on the combination of rows 53. The width of the discharge path 55 only needs to be larger than the maximum value of the distance G2 in the first direction between two adjacent contact portions in each of the two rows 53 that sandwich the discharge path 55.

[0037] When viewed from the V-axis direction, in two adjacent rows 53, the first contact portion 52-1 of one row 53 and the second contact portion 52-2 of the other row 53 do not overlap in the U-axis direction even in the closest combination, but are separated in the U-axis direction. Compared to when they overlap in the U-axis direction, the gap G1 between the two adjacent rows 53 can be made larger, and the width of the discharge channel 55 can be made wider. This makes it easier for the cleaning liquid L to pass through the discharge channel 55. The second contact portion in this embodiment corresponds to the (n-1)th contact portion recited in the claims.

[0038] When viewed from the V-axis direction, two adjacent rows 53 overlap in the U-axis direction, with the first contact portion 52-1 of one row 53 overlapping the third contact portion 52-3 of another row in the U-axis direction. There is no gap between the two adjacent rows 53 in the U-axis direction. When viewed from the V-axis direction, multiple contact portions 52 are present continuously in the U-axis direction, with no gaps between the multiple contact portions 52. This reduces the risk of incomplete cleaning. The third contact portion in this embodiment corresponds to the nth contact portion described in the claims.

[0039] When viewed in the Z-axis direction, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 have the same dimensions and the same outer shape. For example, when viewed in the Z-axis direction, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 have circular outer shapes with the same diameter. Although not shown, when viewed in the Z-axis direction, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 may have different dimensions or different outer shapes.

[0040] Next, an example of the type of contact portion 52 will be described with reference to Fig. 6. Note that in Fig. 6, gaps are illustrated between the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 to clarify the boundaries between them, but the gaps do not have to be there. When viewed from the U-axis direction, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 overlap, and there do not have to be any gaps.

[0041] In each row 53, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 are of different types. As described above, particles of various sizes and materials adhere to the suction surface 21 of the chuck 20. In addition, the suction surface 21 of the chuck 20 has many protrusions and recesses (suction holes), and the adhesion strength of particles differs between the protrusions and the recesses. By using multiple types of contact portions 52, particles of various sizes, materials, and adhesion strengths can be efficiently removed.

[0042] Note that multiple types of particles can be efficiently removed if at least two of the contact portions 52 in each row 53 are of different types. For example, when the first contact portion 52-1 and the second contact portion 52-2 are of different types, the second contact portion 52-2 and the third contact portion 52-3 may be of the same type. Also, when the second contact portion 52-2 and the third contact portion 52-3 are of different types, the first contact portion 52-1 and the second contact portion 52-2 may be of the same type.

[0043] In each row 53, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 have bristles with different wire diameters, for example. The smaller the wire diameter of the bristles, the more flexible the bristles are, and the easier it is to scrape out fine particles that have entered recesses in the adsorption surface 21. Furthermore, the larger the wire diameter of the bristles, the more rigid the bristles are, and the easier it is to peel off particles that have adhered to the adsorption surface 21. When the wire diameters of the bristles are different, the bristles may be made of the same material.

[0044] The bristles may be made of different materials. The first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 may have bristles made of different materials. The lower the bristles' hardness, the more flexible the bristles are, and the easier it is to scrape out fine particles that have entered recesses in the adsorption surface 21. The higher the bristles' hardness, the more rigid the bristles are, and the easier it is to peel off particles that have adhered to the adsorption surface 21. The hardness of the bristles is determined by the bristles' material. When the bristles are made of resin, the hardness of the resin is expressed, for example, by Shore hardness. When the bristles are made of different materials, the bristles may have the same diameter. The bristles may be made of different materials and have different diameters.

[0045] In each row 53, the contact portion 52 on the upstream side of the rotation direction of the chuck 20 has bristles with a larger wire diameter than the contact portion 52 on the downstream side of the rotation direction. For example, the first contact portion 52-1 has bristles with a larger wire diameter than the second contact portion 52-2. The second contact portion 52-2 has bristles with a larger wire diameter than the third contact portion 52-3. The wire diameter of the bristles of the contact portions 52 decreases from the upstream side to the downstream side of the rotation direction of the chuck 20. After the highly rigid bristles peel off the adhered particles, fine particles that have entered the recesses can be scraped out, improving particle removal efficiency.

[0046] As described above, the bristles may be made of different materials. The contact portion 52 on the upstream side in the rotation direction of the chuck 20 has bristles made of a harder material than the contact portion 52 on the downstream side in the rotation direction. For example, the first contact portion 52-1 has bristles made of a harder material than the second contact portion 52-2. The second contact portion 52-2 has bristles made of a harder material than the third contact portion 52-3. The hardness of the bristles of the contact portion 52 decreases from the upstream side to the downstream side in the rotation direction of the chuck 20. After peeling off the adhered particles with the highly rigid bristles, fine particles that have entered the recesses can be scraped out, improving the particle removal efficiency.

[0047] As described above, each contact portion 52 is not limited to a bristle bundle, but may be a sponge or a pin. When each contact portion 52 is a sponge or a pin, if the diameters of the sponges or pins are different or if the materials of the sponges or pins are different, multiple types of particles can be efficiently removed.

[0048] In each row 54, all of the contact portions 52 may be of the same type, but at least two of the contact portions 52 may be of different types. For example, all of the first contact portions 52-1 may be of the same type, but at least two of the first contact portions 52-1 may be of different types. However, it is preferable that the types of contact portions 52 and the number of each type be the same between one column 53 and another column 53.

[0049] Next, an example of the swinging unit 60 will be described with reference to Fig. 7. The cleaning brush 50 includes a swinging unit 60 that swings the brush base 51. The swinging unit 60 swings the brush base 51, for example, around a swing center line R4 that is perpendicular to the suction surface 21 of the chuck 20. The swing center line R4 of the brush base 51 is provided outside the suction surface 21 of the chuck 20, for example.

[0050] The swinging unit 60 includes, for example, a first drive source 61, a pivot shaft 62, and a connecting bar 63. The first drive source 61 rotates the pivot shaft 62. The first drive source 61 is, for example, an electric motor. Although a pneumatic actuator may be used as the first drive source 61, using an electric motor allows for precise control of the rotation speed and range. The pivot shaft 62 is disposed vertically. The connecting bar 63 extends linearly from the lower end of the pivot shaft 62 radially outward from the pivot shaft 62. The brush base 51 is connected to the tip of the connecting bar 63 so as to be able to move up and down freely.

[0051] The brush base 51 is provided below the connecting bar 63. The brush base 51 is pressed against the suction surface 21 of the chuck 20 by, for example, the elastic restoring force of a spring 64. The spring 64 is provided between the brush base 51 and the connecting bar 63. The type of spring 64 is not particularly limited. The spring 64 may be a coil spring, a leaf spring, a disc spring, a bar spring, a ring spring, or the like. The brush base 51 may be pressed against the suction surface 21 of the chuck 20 by its own weight. A weight may be provided on the brush base 51. The pressing pressure can be adjusted by the weight of the weight.

[0052] The swinging unit 60 may include a second drive source 65. The second drive source 65 raises and lowers the first drive source 61, thereby raising and lowering the brush base 51. The second drive source 65 is, for example, an electric motor. The electric motor is used in combination with a ball screw. A pneumatic actuator may be used as the second drive source 65, but using an electric motor can reduce impact.

[0053] Next, an example of the swing range of the brush base 51 will be described with reference to FIGS. 8 and 9. During cleaning of the chuck 20, the brush base 51 is repeatedly rotated, for example, between a first cleaning position indicated by a two-dot chain line in FIG. 8 and a second cleaning position indicated by a solid line in FIG. 8. When the brush base 51 is located at the second cleaning position, the longitudinal direction (U-axis direction) of the brush base 51 is inclined with respect to the radial direction of the chuck 20, as shown in FIG. 8. Note that while the brush base 51 is returning from the second cleaning position to the first cleaning position, the brush base 51 may be raised so that the contact portion 52 does not come into contact with the suction surface 21. The contact portion 52 may come into contact with the suction surface 21 only while the brush base 51 is moving from the first cleaning position to the second cleaning position. The swing of the brush base 51 is performed under the control of the control unit 90.

[0054] The first cleaning position is a position where the tip of the brush base 51 coincides with the rotation center line R2 of the chuck 20, but it may be a position where it does not coincide. In the latter case, the brush base 51 may pass a position where the tip of the brush base 51 coincides with the rotation center line R2 of the chuck 20 during oscillation. When the tip of the brush base 51 coincides with the rotation center line R2 of the chuck 20, the longitudinal direction of the brush base 51 coincides with the radial direction of the chuck 20.

[0055] 9, even when the brush base 51 is located at the second cleaning position, the first direction, which is the extension direction of the discharge passage 55, is inclined radially outward from the chuck 20 as it approaches the downstream side in the rotation direction of the chuck 20. The same is true when the brush base 51 is located at the first cleaning position (see FIG. 5).

[0056] While the brush base 51 is oscillated between the first cleaning position and the second cleaning position, the first direction, which is the extension direction of the discharge path 55, is always inclined radially outward from the chuck 20 as it moves downstream in the rotation direction of the chuck 20. This allows the cleaning liquid containing particles discharged from the cleaning brush 50 to always flow from the radially inner side to the radially outer side of the chuck 20 and be discharged outside the suction surface 21 in a short time. Therefore, the time that the cleaning liquid containing particles discharged from the cleaning brush 50 remains on the suction surface 21 can be shortened. In addition, the area where the cleaning liquid containing particles discharged from the cleaning brush 50 remains on the suction surface 21 can be narrowed.

[0057] As shown in Fig. 8, while the cleaning brush 50 cleans the suction surface 21 of the chuck 20, the chuck 20 is rotated and the brush base 51 is swiveled. The first contact portion 52-1A of the second row 53 from the rotation center line R4 of the brush base 51 moves in the radial direction of the chuck 20 from dashed line L1 to dashed line L2. The movement distance MD is equal to or greater than the interval G3 (MD = G3 in Fig. 8). The interval G3 is the interval between two adjacent rows 53 in the second direction (the longitudinal direction of the brush base), for example, the interval between the first contact portions in the second direction.

[0058] The oscillating unit 60 oscillates the brush base 51 so that the movement distance MD of each contact portion 52 in the radial direction of the chuck 20 is equal to or greater than the interval G3. The same location on the suction surface 21 can be cleaned by multiple contact portions 52, improving the uniformity of cleaning. This is particularly effective when at least two of the contact portions 52 in each row 53 are different types.

[0059] As described above, the swinging part 60 swings the brush base 51 around the swing center line R4 that is perpendicular to the suction surface 21 of the chuck 20. This allows the distance between the brush base 51 and the suction surface 21 to be maintained constant while the brush base 51 swings, and allows the contact part 52 to be pressed against the suction surface 21 with a constant pressure.

[0060] While the cleaning brush 50 cleans the suction surface 21 of the chuck 20, the chuck 20 is rotated and the brush base 51 is turned. The farther the contact position between the chuck 20 and the contact portion 52 is from the rotation center line R2 of the chuck 20, the faster the peripheral speed of the chuck 20. The farther the contact position between the chuck 20 and the contact portion 52 is from the rotation center line R4 of the brush base 51, the faster the peripheral speed of the brush base 51.

[0061] At the contact position between the chuck 20 and the contact portion 52, the greater the relative speed difference between the chuck 20 and the brush base 51, the greater the impact force when particles adhering to the chuck 20 collide with the contact portion 52. Therefore, in order to make the impact force uniform over the entire radial direction of the suction surface 21, the rotation center line R4 of the brush base 51 is provided outside the suction surface 21 of the chuck 20. In this case, the farther the contact position between the chuck 20 and the contact portion 52 is from the rotation center line R2 of the chuck 20, the faster the peripheral speed of the chuck 20 becomes, but the slower the peripheral speed of the brush base 51 becomes.

[0062] 10, a plurality of contact portions 52 may be provided on an imaginary circle 56 whose center is the rotation center line R4 of the brush base 51 and which passes through the rotation center line R2 of the chuck 20. When the brush base 51 rotates, the plurality of contact portions 52 pass through the center of the suction surface 21. The center of the suction surface 21 can be cleaned by the plurality of contact portions 52, thereby improving the uniformity of cleaning.

[0063] At least two of the contact portions 52 arranged on the imaginary circle 56 may be of different types. By using multiple types of contact portions 52, multiple types of particles can be efficiently removed from the center of the adsorption surface 21. The at least two of the contact portions 52 arranged on the imaginary circle 56 may be made of different materials or have bristles with different wire diameters.

[0064] Next, a modified example of the swing range of the brush base 51 will be described with reference to Fig. 11. During cleaning of the chuck 20, the brush base 51 may be repeatedly moved linearly between, for example, a first cleaning position indicated by a two-dot chain line in Fig. 11 and a second cleaning position indicated by a solid line in Fig. 11.

[0065] The brush base 51 is moved linearly in the longitudinal direction (U-axis direction) of the brush base 51. During this movement, the longitudinal direction of the brush base 51 coincides with the radial direction of the chuck 20. The brush base 51 is oscillated so that the movement distance MD of each contact portion 52 in the radial direction of the chuck 20 is equal to or greater than the interval G3 between two adjacent rows 53 in the second direction (the longitudinal direction of the brush base).

[0066] Next, a modified example of the cleaning brush 50 will be described with reference to Figures 12 and 13. Differences from Figure 6 will be mainly described below. The cleaning brush 50 includes, for example, a brush base 51, a first contact portion 52-1, a second contact portion 52-2, and a third contact portion 52-3. The first contact portion 52-1 includes a pin 521. The second contact portion 52-2 includes a bristle bundle 523. The third contact portion 52-3 includes a bristle bundle 524.

[0067] 12 and 13, PL is the length of the portion of the pin 521 that protrudes from the brush base 51 (hereinafter referred to as the protrusion length of the pin 521). The pin 521 protrudes downward from the lower surface of the brush base 51. The longitudinal direction of the pin 521 is, for example, the Z-axis direction. A portion of the pin 521 is housed inside the brush base 51, and the remainder protrudes outside the brush base 51.

[0068] The brush base 51 movably holds the pins 521 so that the protruding length PL of the pins 521 can be freely changed. The pins 521 can be freely moved, for example, in the longitudinal direction of the pins 521. Even if the pins 521 wear and the overall length L0 of the pins 521 becomes shorter, the pins 521 can continue to be used by adjusting the protruding length PL of the pins 521 to a desired length.

[0069] The brush base 51 has, for example, a first hole 511 and a second hole 512 having a diameter larger than that of the first hole 511. A pin 521 is movably inserted through the first hole 511. One end (for example, the lower end) of the pin 521 protrudes outside the brush base 51. Meanwhile, the other end (for example, the upper end) of the pin 521 is housed inside the brush base 51. A stopper 522 is provided at the upper end of the pin 521. The stopper 522 is movably disposed in the second hole 512.

[0070] The stopper 522 is, for example, disk-shaped. The stopper 522 has a diameter smaller than that of the second hole 512 and larger than that of the first hole 511. The stopper 522 abuts against the step surface between the second hole 512 and the first hole 511 as shown in FIG. 12 , thereby preventing the pin 521 from coming off the brush base 51. The stopper 522 may be provided in the form of a flange midway along the pin 521.

[0071] The brush stand 51 may have a base 513, a lid 514, and a connector 515. A first hole 511 and a second hole 512 are formed through the base 513. The lid 514 closes the second hole 512 from the side opposite the first hole 511. The connector 515 detachably connects the base 513 and the lid 514. The connector 515 is not particularly limited, but may be, for example, a bolt. By detachably connecting the base 513 and the lid 514, the pin 521 can be replaced. Only the pin 521 can be replaced, eliminating the need to replace the entire cleaning brush 50.

[0072] The pins 521 are formed of a material softer than the suction surface 21 of the chuck 20 so as not to scratch the suction surface 21 of the chuck 20. This is because scratching the suction surface 21 of the chuck 20 would result in greater unevenness in the thickness of the substrate W after grinding. The chuck 20 has, for example, a porous body 22 on its suction surface 21. When the porous body 22 is made of ceramic such as aluminum oxide, the pins 521 are made of resin such as PEEK (Poly Ether Ether Ketone).

[0073] As described above, pin 521 is made of a relatively soft material and is therefore susceptible to wear. Therefore, it is important to be able to adjust the protrusion length PL of pin 521. This is because even if pin 521 wears and the overall length L0 of pin 521 becomes shorter, adjusting the protrusion length PL of pin 521 allows pin 521 to continue to be used.

[0074] The pin 521 has a larger diameter and greater rigidity than the individual bristles that make up the bristle bundles 523 and 524. Unlike the bristle bundles 523 and 524, the pin 521 can crush particles P that have become stuck in recesses on the chucking surface 21 of the chuck 20, for example, and can flatten the particles P.

[0075] 13, the pins 521 are preferably arranged on the most upstream side in the rotation direction of the chuck in each row 53. The pins 521 come into contact with the particles P before the bristle bundles 523, 524 do, and crush the particles P. Therefore, wear on the bristle bundles 523, 524 can be suppressed.

[0076] New dust particles may be generated when the pins 521 crush the particles P. The bristle bundles 523, 524 may be disposed downstream of the pins 521 in the rotation direction of the chuck 20 so that the newly generated dust particles can be immediately swept away by the bristle bundles 523, 524. This allows the newly generated dust particles to be removed efficiently.

[0077] The cleaning brush 50 may have an elastic body, such as a spring 57. The spring 57 urges the pin 521 in a direction that protrudes outward from the brush base 51 by its elastic restoring force. The spring 57 is, for example, a coil spring, and is disposed in a compressed state between the stopper 522 and the lid 514. The spring 57 may be a leaf spring or the like, and is not limited to a coil spring.

[0078] The cleaning brush 50 has the spring 57, so that the protruding length PL of the pin 521 can be automatically adjusted to a desired length. The pin 521 hits the suction surface 21 of the chuck 20 before the bristle bundles 523 and 524. Then, the pin 521 moves in the direction of entering the inside of the brush base 51 against the elastic restoring force of the spring 57 until it reaches the same height as the bristle bundles 523 and 524.

[0079] The bristle bundles 523, 524 are fixed to the brush base 51. The pin 521 moves between a position where the tip (e.g., the lower end) of the pin 521 protrudes further than the tips (e.g., the lower end) of the bristle bundles 523, 524 (see FIG. 12) and a position where the tip of the pin 521 is at the same height as the tips of the bristle bundles 523, 524 (see FIG. 13). Both the pin 521 and the bristle bundles 523, 524 can be brought into contact with the suction surface 21 of the chuck 20.

[0080] The cleaning brush, substrate processing device, and substrate processing method according to the present disclosure have been described above, but the present disclosure is not limited to the above-described embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure. [Explanation of symbols]

[0081] 20. Chuck 21 Adsorption surface 50 cleaning brushes 51 Brush stand 52 Contact part 53 columns W substrate

Claims

1. A cleaning brush for cleaning the suction surface of a chuck, a brush base extending linearly radially outward from a rotation center line of the chuck; and a plurality of contact portions protruding from the brush base and contacting the suction surface, When viewed from a direction perpendicular to the adsorption surface, a plurality of rows of the contact portions arranged at intervals in a first direction are provided at intervals in a second direction intersecting the first direction, and the second direction is a longitudinal direction of the brush base, A cleaning brush, wherein at least two of the contact portions in each row are of different types.

2. The cleaning brush according to claim 1 , wherein in each row, at least two of the contact portions have bristles made of different materials or having bristles with different wire diameters.

3. 3. The cleaning brush according to claim 2, wherein in each row, the contact portion on the upstream side in the rotation direction of the chuck is made of a harder material or has bristles with a larger wire diameter than the contact portion on the downstream side in the rotation direction of the chuck.

4. 2. The cleaning brush according to claim 1, wherein the first direction is a direction that intersects the second direction obliquely and is a direction that inclines from the radially inner side to the radially outer side of the chuck as it moves from the upstream side of the rotation direction of the chuck to the downstream side of the rotation direction.

5. When viewed from a direction orthogonal to the adsorption surface, a direction perpendicular to the first direction is defined as a third direction. The cleaning brush according to claim 4 , wherein the distance between two adjacent rows in the third direction is greater than the distance between two adjacent contact portions in each row in the first direction.

6. The cleaning brush according to claim 4 , wherein the plurality of rows are arranged at equal intervals in the second direction.

7. The cleaning brush according to claim 4 , wherein in each row, three or more of the contact portions are arranged at equal intervals in the first direction.

8. Each of the rows includes n (n is a natural number equal to or greater than 3) contact portions arranged in the first direction, In each row, the contact portion located at the mth position (m is a natural number of 1 to n) from the upstream side of the rotation direction of the chuck to the downstream side of the rotation direction is defined as the mth contact portion, The cleaning brush according to claim 4, wherein in two adjacent rows, the first contact portion of one row and the (n-1)th contact portion of another row do not overlap in the second direction.

9. Each of the rows includes n (n is a natural number equal to or greater than 3) contact portions arranged in the first direction, In each row, the contact portion located at the mth position (m is a natural number of 1 to n) from the upstream side of the rotation direction of the chuck to the downstream side of the rotation direction is defined as the mth contact portion, The cleaning brush according to claim 4 , wherein two adjacent rows overlap in the second direction, and a first contact portion of one row overlaps an nth contact portion of another row in the second direction.

10. The cleaning brush according to claim 1 , wherein the contact portion includes a tuft of bristles, a sponge, or a pin.

11. the contact portion includes a pin; 2. The cleaning brush according to claim 1, wherein the brush base movably holds the pins so that the length of the portions of the pins that protrude from the brush base can be freely changed.

12. The cleaning brush according to claim 11 , wherein the pins are arranged in each row at the most upstream side in the rotation direction of the chuck.

13. The cleaning brush according to claim 11, further comprising an elastic body that biases the pin in a direction in which the pin protrudes outward from the brush base.

14. the contact portion includes a tuft of bristles fixed to the brush base; The cleaning brush according to claim 11, wherein the pin moves between a position where the tip of the pin protrudes beyond the tip of the bristle bundle and a position where the tip of the pin is flush with the tip of the bristle bundle.

15. A cleaning brush according to any one of claims 1 to 14; The chuck; a nozzle for supplying a cleaning liquid to the suction surface of the chuck; a drive unit that drives a tool that processes the substrate that is sucked onto the suction surface of the chuck; A substrate processing device comprising:

16. sequentially processing a plurality of the substrates using the substrate processing apparatus according to claim 15; After removing one of the substrates from the suction surface, cleaning the suction surface with the cleaning brush before suctioning another of the substrates onto the suction surface; A substrate processing method comprising:

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