Ceramic Electronic Components

Abstract

To provide a ceramic electronic component.SOLUTION: There is provided a ceramic electronic component including: a chip component with an approximately rectangular parallelepiped shape, in which a terminal electrode is formed on a pair of approximately rectangular chip end surfaces having a pair of chip first sides and a pair of chip second sides; and a metal terminal part provided corresponding to each chip end surface. The metal terminal part includes: an electrode facing part facing the chip end surface; a mating arm part to grip the chip component from both end sides of the chip first side; and a mounting part. The chip component is arranged such that the chip second side is along a horizontal direction. In the electrode facing part, a second through hole having a peripheral part to which a lower arm part is connected is formed corresponding to the chip component. The terminal electrode and the electrode facing part are joined by a connection member located at a place different from that of the second through hole. A joint portion formed of the lower arm part, the second through hole, and the connection member is aligned in a height direction from the mounting part in the order of the lower arm part, the second through hole, and the joint portion.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a ceramic electronic component with metal terminals, which has a chip component and a metal terminal attached to the chip component. [Background technology]

[0002] As ceramic electronic components such as ceramic capacitors, in addition to ordinary chip components that are directly surface-mounted on a substrate, etc., chip components with metal terminals attached have been proposed. Ceramic electronic components with metal terminals attached have been reported to have the effect of mitigating the deformation stress that the chip component receives from the substrate after mounting and protecting the chip component from impacts, etc., and are used in fields where durability, reliability, etc. are required.

[0003] It has also been reported that metal terminals have the effect of preventing vibrations generated by chip components from being transmitted to the mounting board, and in order to enhance this effect, it has been proposed to provide a connecting portion between the mounting portion and the connection portion (electrode opposing portion) of the metal terminal. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-95490 Summary of the Invention [Problem to be solved by the invention]

[0005] However, conventional metal terminals that have a connecting portion between the mounting portion and the connection portion (electrode opposing portion) have the problem that the mounting area (projected area from the Z-axis direction) of the ceramic electronic component is somewhat larger than the projected area of ​​the chip component.

[0006] The present invention has been made in view of the above circumstances, and aims to provide a ceramic electronic component that prevents vibrations generated in a chip component from being transmitted to a mounting substrate via metal terminals, protects the chip component from deformation stress and impacts received from the substrate after mounting, and prevents an increase in the mounting area. [Means for solving the problem]

[0007] In order to achieve the above object, a ceramic electronic component according to the present invention comprises: a plurality of chip components each having a substantially rectangular shape, with terminal electrodes formed on a pair of chip end faces having a pair of chip first sides and a pair of chip second sides shorter than the chip first sides, and each having a substantially rectangular shape consisting of the pair of chip end faces and four chip side faces connecting the pair of chip end faces; and a pair of metal terminal portions provided corresponding to the pair of chip end faces; The pair of metal terminal portions each include: an electrode facing portion having a substantially rectangular flat plate shape and including a pair of terminal first sides substantially parallel to the chip first sides and terminal second sides substantially parallel to the chip second sides, the electrode facing portion facing the chip end surface; a plurality of pairs of fitting arms extending from the electrode facing portions to the chip side surfaces and configured to sandwich and hold the chip component from both ends of the first chip edge; The mounting portion is connected to one of the second terminal sides in the electrode opposing portion, extends from the one of the second terminal sides toward the chip component, and has at least a portion that is approximately perpendicular to the electrode opposing portion.

[0008] The height direction of the metal terminal portion in the ceramic electronic component according to the present invention is the same as the direction of the first chip side, which is the long side of the chip end face, so the projected area in the height direction of the ceramic electronic component is small. Furthermore, because the mounting portion is connected to the second terminal side of the electrode-opposing portion, the ceramic electronic component according to the present invention has a smaller projected area in the height direction than conventional technologies in which the mounting portion is connected to the first terminal side via a connecting portion, thereby further reducing the mounting area.

[0009] Furthermore, because the height direction of the metal terminal portion of the ceramic electronic component according to the present invention is aligned with the long side of the chip end face, even when multiple chip components are arranged parallel to the mounting surface rather than stacked vertically, an increase in the mounting area is suppressed. When multiple chip components are arranged parallel to the mounting surface, the mounting height of such a ceramic electronic component remains constant regardless of the number of chip components, making it suitable for mounting on a mounting board used in devices with strict low-profile requirements. Furthermore, in a ceramic electronic component in which multiple chip components are arranged parallel to the mounting surface, only one chip component is held between the pair of mating arms along the mating direction, resulting in high joint reliability between the chip component and the metal terminal portion and high reliability against impact and vibration. Furthermore, a metal terminal in which a pair of mating arms hold only one chip component along the mating direction can reliably hold the chip component even if the first side of the chip component is long.

[0010] Furthermore, in the ceramic electronic component of the present invention, the fitting arms clamp the chip component from both ends of the first side, which is the long side of the chip end face, so that the metal terminals effectively relieve stress, suppressing the transmission of vibration from the chip component to the mounting board and preventing acoustic noise.

[0011] Furthermore, for example, the chip component is a multilayer capacitor in which internal electrode layers and dielectric layers are laminated, The stacking direction of the chip component may be approximately parallel to the second side of the chip.

[0012] In such ceramic electronic components, the internal electrode layers are arranged perpendicular to the mounting surface, which allows for a lower ESL compared to components in which the internal electrode layers are arranged parallel to the mounting surface. Furthermore, the first edge of the chip held by the mating arm is perpendicular to the stacking direction, resulting in small dimensional variations. Therefore, by holding a portion of the chip component with minimal dimensional variations, the metal terminal can hold the chip component more securely.

[0013] Furthermore, for example, a first through hole may be formed in a portion of the electrode facing portion facing the chip end surface.

[0014] Ceramic electronic components having such first through holes are easy to manufacture because, for example, after assembling the metal terminal portion and the chip component, solder, conductive adhesive, or the like that electrically and mechanically connects the chip component and the metal terminal portion can be applied. Furthermore, the condition of the bonding material that electrically and mechanically connects the chip component and the metal terminal can be visually confirmed from outside the ceramic electronic component, which reduces the occurrence of manufacturing defects.

[0015] Furthermore, for example, the electrode facing portion may be formed with a plurality of protrusions that protrude toward the chip end surface and come into contact with the chip end surface.

[0016] The formation of protrusions on the electrode facing portions reduces the area of ​​direct contact between the electrode facing portions and the chip end faces, preventing the problem of vibrations from the chip component being transmitted to the mounting substrate and suppressing squealing in the ceramic electronic component. Furthermore, the protrusions on the electrode facing portions form gaps between the electrode facing portions and the chip end faces. Therefore, by adjusting the gaps formed between the electrode facing portions and the chip end faces using the protrusions, the state of the bonding material that electrically and mechanically connects the chip component and the metal terminals can be controlled, and the bonding state between the chip component and the metal terminals can be suitably controlled.

[0017] Furthermore, for example, the electrode opposing portion may be formed with a second through hole having a periphery to which a lower arm portion, which is one of the pairs of mating arm portions, is connected.

[0018] The metal terminal portion having such a second through hole has a shape that allows the periphery of the lower arm portion that supports the chip component to easily deform elastically, and therefore can effectively relieve stress generated in the ceramic electronic component and absorb vibrations. Therefore, a ceramic electronic component having such a metal terminal portion can effectively prevent acoustic noise and has good bonding reliability with the mounting board during mounting.

[0019] Furthermore, for example, an upper arm portion that is another one of the plurality of pairs of fitting arm portions may be connected to a second side of the other terminal in the electrode opposing portion, The chip component may be sandwiched between the upper arm portion and the lower arm portion from both ends of the first side of the terminal.

[0020] A metal terminal portion in which the mounting portion is connected to one second side of the terminal and the upper arm portion is connected to the other second side of the chip can be shortened in height (terminal first side direction), and ceramic electronic components having such metal terminal portions are advantageous in terms of reducing their height. Because such metal terminal portions have a configuration in which the lower arm portion is not connected to the second side of the terminal, the upper and lower arm portions and the mounting portion can be formed in positions that overlap with each other in the terminal second side direction. Therefore, such ceramic electronic components are advantageous in terms of miniaturization.

[0021] Furthermore, for example, the electrode opposing portion has a plate main body portion facing the chip end surface and a terminal connection portion located below the plate main body portion and connecting the plate main body portion and the mounting portion, the second through hole is formed such that a peripheral portion of the second through hole straddles the plate main body portion and the terminal connection portion, The lower arm portion may extend from the terminal connection portion.

[0022] By extending the lower arm portion from the terminal connection portion 36, the transmission path between the terminal electrode of the chip capacitor and the mounting board is shorter than when these are connected to the plate main body portion.

[0023] Furthermore, for example, the electrode opposing portion may be formed with a first through hole and a second through hole having a peripheral portion to which a lower arm portion that is one of the pairs of fitting arm portions is connected and positioned closer to the mounting portion than the first through hole, The second through hole may have an opening width in a width direction parallel to the second side of the terminal that is wider than that of the first through hole.

[0024] Although the widths of the first and second through holes are not particularly limited, increasing the width of the second through hole can effectively enhance the stress relaxation effect of the metal terminal portion and the acoustic noise prevention effect. Also, making the opening width of the first through hole narrower than that of the second through hole can prevent the bonding strength between the chip component and the electrode opposing portion, which is caused by a bonding material or the like, from becoming excessively strong, thereby enabling such a ceramic electronic component to suppress acoustic noise. [Brief explanation of the drawings]

[0025] [Figure 1] FIG. 1 is a schematic perspective view showing a ceramic electronic component according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a front view of the ceramic electronic component shown in FIG. [Figure 3] FIG. 3 is a left side view of the ceramic electronic component shown in FIG. [Figure 4] FIG. 4 is a top view of the ceramic electronic component shown in FIG. [Figure 5] FIG. 5 is a bottom view of the ceramic electronic component shown in FIG. [Figure 6] FIG. 6 is a schematic cross-sectional view of the ceramic electronic component shown in FIG. [Figure 7]FIG. 7 is a schematic perspective view showing a ceramic electronic component according to a second embodiment of the present invention. [Figure 8] FIG. 8 is a front view of the ceramic electronic component shown in FIG. [Figure 9] FIG. 9 is a left side view of the ceramic electronic component shown in FIG. [Figure 10] FIG. 10 is a top view of the ceramic electronic component shown in FIG. [Figure 11] FIG. 11 is a bottom view of the ceramic electronic component shown in FIG. [Figure 12] FIG. 12 is a left side view of a ceramic electronic component according to a first modified example. [Figure 13] FIG. 13 is a left side view of a ceramic electronic component according to a second modified example. [Figure 14] FIG. 14 is a perspective view of a ceramic capacitor according to a comparative example. [Figure 15] FIG. 15 is a graph showing the measurement results of the impedance and resistance component of the ceramic capacitors according to the example and comparative example. DETAILED DESCRIPTION OF THE INVENTION

[0026] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0027] First embodiment 1 is a schematic perspective view showing a ceramic capacitor 10 according to a first embodiment of the present invention. The ceramic capacitor 10 has a chip capacitor 20 as a chip component and a pair of metal terminal portions 30, 40. The ceramic capacitor 10 according to the first embodiment has two chip capacitors 20, but the number of chip capacitors 20 included in the ceramic capacitor 10 is not particularly limited as long as it is plural.

[0028] 1 to 11 , the description of each embodiment will be given taking as an example a ceramic capacitor in which metal terminal portions 30, 40 are attached to chip capacitor 20, but the ceramic electronic component of the present invention is not limited to this and may be a chip component other than a capacitor in which metal terminal portions 30, 40 are attached. Furthermore, in the description of each embodiment, as shown in FIGS. 1 to 11 , the direction connecting first side surface 20c and second side surface 20d of chip capacitor 20 (direction parallel to chip second side 20h) is defined as the X-axis direction, the direction connecting first end surface 20a and second end surface 20b (direction parallel to chip third side 20j) is defined as the Y-axis direction, and the direction connecting third side surface 20e and fourth side surface 20f (direction parallel to chip first side 20g) is defined as the Z-axis direction.

[0029] The chip capacitor 20 has a substantially rectangular parallelepiped shape, and the two chip capacitors 20 have substantially the same shape and size. As shown in Fig. 2, the chip capacitor 20 has a pair of chip end faces facing each other, which are composed of a first end face 20a and a second end face 20b. As shown in Figs. 1, 2, and 4, the first end face 20a and the second end face 20b are substantially rectangular, and of the four sides that make up the rectangle of the first end face 20a and the second end face 20b, a pair of longer sides are chip first sides 20g (see Fig. 2), and a pair of shorter sides are chip second sides 20h (see Fig. 3).

[0030] The chip capacitor 20 is arranged so that the first end face 20a and the second end face 20b are perpendicular to the mounting surface, in other words, so that the third chip side 20j of the chip capacitor 20 connecting the first end face 20a and the second end face 20b is parallel to the mounting surface of the ceramic capacitor 10. The mounting surface of the ceramic capacitor 10 is the surface to which the ceramic capacitor 10 is attached by solder or the like so that mounting portions 38, 48 of the metal terminal portions 30, 40, which will be described later, face each other, and is a surface parallel to the XY plane shown in FIG.

[0031] Comparing the length L1 of the chip first side 20g shown in Fig. 2 with the length L2 of the chip second side 20h shown in Fig. 4, the chip second side 20h is shorter than the chip first side 20g (L1>L2). The ratio of the lengths of the chip first side 20g and the chip second side 20h is not particularly limited, but for example, L2 / L1 is about 0.3 to 0.7.

[0032] As shown in Fig. 2, the chip capacitor 20 is arranged so that the first chip side 20g is perpendicular to the mounting surface, and as shown in Fig. 4, the second chip side 20h is parallel to the mounting surface. Therefore, of the four chip side surfaces, first to fourth side surfaces 20c to 20f, which connect the first end surface 20a and the second end surface 20b, the first side surface 20c and the second side surface 20d, which have larger areas, are arranged perpendicular to the mounting surface, and the third side surface 20e and the fourth side surface 20f, which have smaller areas than the first side surface 20c and the second side surface 20d, are arranged parallel to the mounting surface. The third side surface 20e is an upper side surface facing away from the lower mounting portions 38, 48, and the fourth side surface 20f is a lower side surface facing the mounting portions 38, 48.

[0033] 1, 2, and 4, the first terminal electrode 22 of the chip capacitor 20 is formed so as to extend from the first end face 20a around parts of the first to fourth side faces 20c to 20f. Therefore, the first terminal electrode 22 has a portion disposed on the first end face 20a and a portion disposed on the first to fourth side faces 20c to 20f.

[0034] The second terminal electrode 24 of the chip capacitor 20 is formed so as to wrap around from the second end face 20b to other parts of the side faces 20c to 20f (parts different from the part around which the first terminal electrode 22 wraps). Therefore, the second terminal electrode 24 has a part that is arranged on the second end face 20b and a part that is arranged on the first to fourth side faces 20c to 20f (see FIGS. 1, 2, and 4). Furthermore, on the first to fourth side faces 20c to 20f, the first terminal electrode 22 and the second terminal electrode 24 are formed at a predetermined distance from each other.

[0035] 6, which schematically shows the internal structure of the chip capacitor 20, the chip capacitor 20 is a multilayer capacitor in which internal electrode layers 26 and dielectric layers 28 are laminated. Some of the internal electrode layers 26 are connected to the first terminal electrode 22, and others are connected to the second terminal electrode 24, and the internal electrode layers 26 connected to the first terminal electrode 22 and the internal electrode layers 26 connected to the second terminal electrode 24 are laminated alternately with the dielectric layer 28 sandwiched between them.

[0036] As shown in Fig. 6, the stacking direction in the chip capacitor 20 is parallel to the second chip side 20h shown in Fig. 4. Therefore, the internal electrode layers 26 shown in Fig. 6 are disposed perpendicular to the mounting surface.

[0037] The material of the dielectric layers 28 in the chip capacitor 20 is not particularly limited, and may be, for example, a dielectric material such as calcium titanate, strontium titanate, barium titanate, or a mixture thereof. The thickness of each dielectric layer 28 is not particularly limited, but is generally several μm to several hundred μm. In this embodiment, the thickness is preferably 1.0 to 5.0 μm. Furthermore, the dielectric layers 28 preferably contain barium titanate as a main component, which can increase the capacitance of the capacitor.

[0038] The conductive material contained in the internal electrode layers 26 is not particularly limited, but if the material constituting the dielectric layers 28 is resistant to reduction, a relatively inexpensive base metal can be used. The base metal is preferably Ni or a Ni alloy. The Ni alloy is preferably an alloy of Ni with one or more elements selected from Mn, Cr, Co, and Al, and the Ni content in the alloy is preferably 95% by weight or more. Note that the Ni or Ni alloy may contain trace elements such as P at approximately 0.1% by weight or less. The internal electrode layers 26 may also be formed using a commercially available electrode paste. The thickness of the internal electrode layers 26 may be determined appropriately depending on the application, etc.

[0039] The material of the first and second terminal electrodes 22, 24 is not particularly limited, and typically copper, copper alloy, nickel, nickel alloy, etc. are used, but silver, silver-palladium alloy, etc. can also be used. The thickness of the first and second terminal electrodes 22, 24 is also not particularly limited, but is typically about 10 to 50 μm. The surfaces of the first and second terminal electrodes 22, 24 may be coated with at least one metal selected from Ni, Cu, Sn, etc.

[0040] The shape and size of the chip capacitor 20 may be determined appropriately depending on the purpose and application. The chip capacitor 20 has, for example, a length (L3) of 1.0 to 6.5 mm, preferably 3.2 to 5.9 mm, a width (L1) of 0.5 to 5.5 mm, preferably 1.6 to 5.2 mm, and a thickness (L2) of 0.3 to 3.2 mm, preferably 0.8 to 2.9 mm. When multiple chip capacitors 20 are used, they may have different sizes and shapes.

[0041] The pair of metal terminal portions 30, 40 of the ceramic capacitor 10 are provided corresponding to the first and second end faces 20a, 20b, which are a pair of chip end faces. That is, the first metal terminal portion 30, which is one of the pair of metal terminal portions 30, 40, is provided corresponding to the first terminal electrode 22, which is one of the pair of terminal electrodes 22, 24, and the second metal terminal portion 40, which is the other of the pair of metal terminal portions 30, 40, is provided corresponding to the second terminal electrode 24, which is the other of the pair of terminal electrodes 22, 24.

[0042] The first metal terminal portion 30 has an electrode facing portion 36 facing the first terminal electrode 22, multiple pairs of mating arm portions 31a, 31b, 33a, 33b that hold the chip capacitor 20 in the Z-axis direction from both ends of the chip first edge 20g, and a mounting portion 38 that extends from the electrode facing portion 36 toward the chip capacitor 20, at least a portion of which is approximately perpendicular to the electrode facing portion 36.

[0043] As shown in Figure 2, the electrode opposing portion 36 is in the shape of a roughly rectangular plate having a pair of terminal first sides 36g that are roughly parallel to the chip first side 20g that is perpendicular to the mounting surface, and a pair of terminal second sides 36ha, 36hb that are roughly parallel to the chip second side 20h that is parallel to the mounting surface, as shown in Figure 3.

[0044] As shown in Figure 3 and Figure 13 relating to the first variant, the length of the terminal second sides 36ha, 36hb that are parallel to the mounting surface may be equal to, slightly shorter than, or slightly longer than the length obtained by multiplying the length L2 of the chip second side 20h that is arranged parallel to the terminal second sides 36ha, 36hb a number of times corresponding to the number of chip capacitors 20 included in the ceramic capacitor 10, 200.

[0045] 12 shows a ceramic capacitor 200 according to a first modification, which includes two chip capacitors, and the length of the terminal second sides 36ha and 36hb parallel to the mounting surface is shorter than twice the length L2 of the chip second side 20h arranged parallel to the terminal second sides 36ha and 36hb. The ceramic capacitor 200 is similar to the ceramic capacitor 10 shown in FIGS. 1 to 7, except that the length of the chip second side in the chip capacitor is longer than the length of the chip second side 20h of the chip capacitor 20 according to the embodiment.

[0046] 3, the ceramic capacitor 10 includes two chip capacitors, and the length of the terminal second sides 36ha, 36hb parallel to the mounting surface is slightly longer than twice the length L2 of the chip second side 20h arranged parallel to the terminal second sides 36ha, 36hb. As shown in FIGS. 3 and 12, the dimensions of the chip capacitors that can be combined with the metal terminals 30, 40 are not limited to one type, and the metal terminals 30, 40 can be used to configure ceramic capacitors corresponding to multiple types of chip capacitors with different lengths of the chip second side.

[0047] The electrode facing portion 36 is electrically and mechanically connected to the first terminal electrode 22 formed on the opposing first end surface 20a. For example, the electrode facing portion 36 and the first terminal electrode 22 can be connected by interposing a conductive connecting member such as solder or a conductive adhesive in the gap between them as shown in Fig. 4. Note that if the electrical connection between the first metal terminal portion 30 and the first terminal electrode 22 is achieved by the contact portions between the first terminal electrode 22 and mating arm portions 31a, 31b, 33a, and 33b (described later), a non-conductive adhesive such as epoxy resin or phenol resin may be used as the connecting member connecting the electrode facing portion 36 and the first terminal electrode 22.

[0048] Furthermore, first through holes 36b are formed in the portion of the electrode opposing portion 36 facing the first end face 20a. Two first through holes 36b are formed to correspond to each chip capacitor 20 included in the ceramic capacitor 10, but the shape and number of the first through holes 36b are not limited to this.

[0049] A connecting member is provided in the first through-hole 36b, connecting the electrode opposing portion 36 and the first terminal electrode 22. The connecting member is preferably made of a conductive material such as solder or a conductive adhesive, and a connecting member made of solder, for example, can form a solder bridge between the periphery of the first through-hole 36b and the first terminal electrode 22, thereby firmly joining the electrode opposing portion 36 and the first terminal electrode 22.

[0050] Furthermore, the electrode opposing portion 36 is formed with a plurality of protrusions 36a that protrude toward and come into contact with the first end face 20a of the chip capacitor 20. The protrusions 36a reduce the contact area between the electrode opposing portion 36 and the first terminal electrode 22, thereby preventing vibrations generated in the chip capacitor 20 from being transmitted to the mounting board via the first metal terminal portion 30, and making noise in the ceramic capacitor 10.

[0051] Furthermore, by forming the protrusions 36a around the first through-holes 36b, it is possible to adjust the area where a connecting member such as solder is formed, and such ceramic capacitor 10 can prevent acoustic noise while adjusting the bonding strength between the electrode opposing portion 36 and the first terminal electrode 22 within an appropriate range. Note that, although four protrusions 36a are formed around one first through-hole 36b in the ceramic capacitor 10, the number and arrangement of the protrusions 36a are not limited to this.

[0052] A second through hole 36c having a peripheral edge to which the lower arm portion 31b or the lower arm portion 33b, which is one of the pairs of mating arm portions 31a, 31b, 33a, 33b, is connected, is formed in the electrode opposing portion 36. The second through hole 36c is located closer to the mounting portion 38 than the first through hole 36b, and unlike the first through hole 36b, no connecting member such as solder is provided.

[0053] The first metal terminal portion 30 having such a second through hole 36c formed therein has a shape that allows the periphery of the lower arm portions 31b, 33b that support the chip capacitor 20 to easily deform elastically, and therefore can effectively relieve stress generated in the ceramic capacitor 10 and absorb vibrations of the chip capacitor 20. Therefore, the ceramic capacitor 10 having such a first metal terminal portion 30 can suitably prevent acoustic noise and also has good bonding reliability with the mounting board during mounting.

[0054] Although the shape of the second through hole 36c is not particularly limited, it is preferable that the opening width of the second through hole 36c in the width direction parallel to the terminal second sides 36ha and 36hb (X-axis direction) is wider than that of the first through hole 36b. By widening the opening width of the second through hole 36c, the stress relaxation effect and acoustic noise prevention effect of the first metal terminal portion 30 can be effectively enhanced. Furthermore, by narrowing the opening width of the first through hole 36b compared to the second through hole 36c, it is possible to prevent the bonding material from spreading too much, thereby preventing an excessive increase in the bonding strength between the chip capacitor 20 and the electrode opposing portion 36. Therefore, such a ceramic capacitor 10 can suppress acoustic noise.

[0055] In the electrode facing portion 36, the second through hole 36c to which the lower arm portion 31b is connected is formed at a predetermined height distance from the lower terminal second side 36hb to which the mounting portion 38 is connected, and a slit 36d is formed between the second through hole 36c and the terminal second side 36hb. In the electrode facing portion 36, the slit 36d is formed between the connection position (the lower edge of the periphery of the second through hole 36c) of the lower arm portion 31b located near the mounting portion 38 to the electrode facing portion 36 and the lower terminal second side 36hb to which the mounting portion 36 is connected. The slit 36d extends in a direction parallel to the terminal second sides 36ha and 36hb. The slit 36d prevents solder used when mounting the ceramic capacitor 10 on a mounting board from creeping up the electrode facing portion 36 and thus prevents the formation of a solder bridge connecting to the lower arm portions 31b and 33b or the first terminal electrode 22. Therefore, the ceramic capacitor 10 having such slits 36d formed therein has the effect of suppressing acoustic noise.

[0056] 1 and 2, the mating arm portions 31a, 31b, 33a, and 33b of the first metal terminal portion 30 extend from the electrode facing portion 36 to the third side surface 20e or the fourth side surface 20f, which are chip side surfaces of the chip capacitor 20. The lower arm portion 31b (or the lower arm portion 33b), which is one of the mating arm portions 31a, 31b, 33a, and 33b, is connected to the peripheral edge of the second through-hole 36c formed in the electrode facing portion 36. The upper arm portion 31a (or the upper arm portion 33a), which is the other of the mating arm portions 31a, 31b, 33a, and 33b, is connected to the upper terminal second side 36ha (on the positive Z-axis direction) of the electrode facing portion 36.

[0057] 1, the electrode opposing portion 36 has a plate main body portion 36j that faces the first end surface 20a of the chip capacitor 20 and is positioned at a height overlapping the first end surface 20a, and a terminal connection portion 36k that is positioned below the plate main body portion 36j and connects the plate main body portion 36j to the mounting portion 38. The second through-hole 36c is formed such that its peripheral portion straddles the plate main body portion 36j and the terminal connection portion 36k, and the lower arm portions 31b, 33b extend from the terminal connection portion 36k. That is, the base ends of the lower arm portions 31b, 33b are connected to the lower side of the substantially rectangular peripheral portion of the second through-hole 36c, and the lower arm portions 31b, 33b extend from their base ends while bending upward (in the positive direction of the Z-axis) and inward (in the negative direction of the Y-axis) to contact the fourth side surface 20f of the chip capacitor 20 and support the chip capacitor 20 from below (see FIG. 2). Therefore, the lower end (lower chip second side 20h) of the first side surface 20a of the chip capacitor 20 is located above the lower side of the periphery of the second through hole 26c, which is the base end of the lower arm portions 31b, 33b. When the chip capacitor is viewed from the positive direction of the Y axis, as shown in Fig. 3, the lower end (lower chip second side 20h) of the first side surface 20a of the chip capacitor 20 can be seen from the side of the ceramic capacitor 10 through the second through hole 36c.

[0058] As shown in FIG. 1 , the upper arm portion 31a and the lower arm portion 31b form a pair to hold one chip capacitor 20, and the upper arm portion 33a and the lower arm portion 33b form a pair to hold another chip capacitor 20. In the first metal terminal portion 30, the pair of mating arms 31a, 31b (or mating arms 33a, 33b) holds one chip capacitor 20 rather than multiple chip capacitors 20, so each chip capacitor 20 can be securely held. Furthermore, the pair of mating arms 31a, 31b hold the chip capacitor 20 from both ends of the long chip first side 20g of the first end surface 20a, rather than the short chip second side 20h. This increases the distance between the upper arm portions 31a, 33a and the lower arm portions 31b, 33b, making it easier to absorb vibrations of the chip capacitor 20, thereby effectively preventing acoustic noise in the ceramic capacitor 10.

[0059] The pair of upper arm portion 31a and lower arm portion 31b that hold chip capacitor 20 may have asymmetric shapes and may have different widthwise lengths (lengths in the X-axis direction). Furthermore, by extending lower arm portions 31b and 31b from terminal connection portion 36, the transmission path between first terminal electrode 22 of chip capacitor 20 and the mounting board is shorter than when these are connected to plate main body portion 36j.

[0060] The mounting portion 38 is connected to the lower (Z-axis negative side) terminal second side 36hb of the electrode opposing portion 36. The mounting portion 38 extends from the lower terminal second side 36hb toward the chip capacitor 20 (Y-axis negative side) and bends approximately perpendicular to the electrode opposing portion 36. Note that the upper surface of the mounting portion 38, which is the surface of the mounting portion 38 facing the chip capacitor 20, preferably has lower wettability to solder than the lower surface of the mounting portion 38, from the viewpoint of preventing excessive spread of solder used when mounting the chip capacitor 20 to the board.

[0061] 1 and 2, the ceramic capacitor 10 is mounted on a mounting surface such as a mounting board with the mounting portion 38 facing downward, and therefore the length in the Z-axis direction of the ceramic capacitor 10 when mounted is the height. In the ceramic capacitor 10, the mounting portion 38 is connected to one terminal second side 36hb of the electrode opposing portion 36, and the upper arm portions 31a, 33a are connected to the other terminal second side 36ha, so there is no wasted length in the Z-axis direction, which is advantageous for reducing the height.

[0062] Furthermore, because the mounting portion 38 is connected to one of the terminal second sides 36hb of the electrode opposing portion 36, the projected area from the Z-axis direction is smaller than in the conventional technology in which the mounting portion 38 is connected to the terminal first side 36g of the electrode opposing portion 36, and it is possible to reduce the mounting area. Furthermore, as shown in Figures 1 and 5, among the first to fourth side surfaces 20c, 20d, 20e, and 20f of the chip capacitor 20, the third side surface 20e and the fourth side surface 20f, which have smaller areas, are arranged parallel to the mounting surface, so that the mounting area can be reduced even in a configuration in which the chip capacitors 20 are not arranged stacked in the height direction.

[0063] As shown in Figures 1 and 2, the second metal terminal portion 40 has an electrode facing portion 46 facing the second terminal electrode 24, multiple pairs of mating arm portions 41a, 41b, 43a that hold the chip capacitor 20 in the Z-axis direction from both ends of the chip first side 20g, and a mounting portion 48 that extends from the electrode facing portion 46 toward the chip capacitor 20, at least a portion of which is approximately perpendicular to the electrode facing portion 46.

[0064] Similar to the electrode opposing portion 36 of the first metal terminal portion 30, the electrode opposing portion 46 of the second metal terminal portion 40 has a pair of terminal first sides 46g substantially parallel to the chip first side 20g and a terminal second side 46ha substantially parallel to the chip second side 20h, and the electrode opposing portion 46 is formed with a protrusion 46a, a first through hole, a second through hole, and a slit 46d. As shown in FIG. 1 , the second metal terminal portion 40 is disposed symmetrically with respect to the first metal terminal portion 30, and its arrangement with respect to the chip capacitor 20 is different from that of the first metal terminal portion 30. However, since the second metal terminal portion 40 has a similar shape to the first metal terminal portion 30 except for its arrangement, detailed description will be omitted.

[0065] The material of the first metal terminal portion 30 and the second metal terminal portion 40 is not particularly limited as long as it is a metallic material having electrical conductivity, and examples thereof include iron, nickel, copper, silver, etc. In particular, using phosphor bronze as the material of the first and second metal terminal portions 30, 40 is preferable from the viewpoint of suppressing the resistivity of the first and second metal terminal portions 30, 40 and reducing the ESR of the ceramic capacitor 10.

[0066] A method for manufacturing the ceramic capacitor 10 will be described below.

[0067] Manufacturing method of multilayer ceramic chip capacitor 20 The multilayer ceramic chip capacitor 20 is manufactured by first stacking green sheets (which will become dielectric layers 28 after firing) on ​​which electrode patterns that will become internal electrode layers 26 after firing are formed to form a laminate, and then pressing and firing the resulting laminate to obtain a capacitor element. The first terminal electrode 22 and second terminal electrode 24 are then formed on the capacitor element by baking terminal electrode paint and plating, etc., to obtain the chip capacitor 20. The green sheet paint and internal electrode layer paint that are the raw materials for the laminate, the raw materials for the terminal electrodes, and the firing conditions for the laminate and electrodes are not particularly limited and can be determined with reference to known manufacturing methods. In this embodiment, a ceramic green sheet primarily composed of barium titanate is used as the dielectric material. The terminal electrodes are formed by immersing in Cu paste and baking, forming a baking layer. Further, Ni plating and Sn plating processes are performed to form a Cu baking layer / Ni plating layer / Sn plating layer.

[0068] Manufacturing method of metal terminal parts 30, 40 In manufacturing the first metal terminal portion 30, first, a flat metal plate is prepared. The material of the metal plate is not particularly limited as long as it is a conductive metal material, and examples thereof include iron, nickel, copper, silver, etc., and alloys containing these. Next, the metal plate is machined to obtain an intermediate member having the shapes of the fitting arm portions 31a to 33b, the electrode opposing portion 36, the mounting portion 38, etc.

[0069] Next, a metal coating is formed by plating on the surface of the intermediate member formed by machining, thereby obtaining the first metal terminal portion 30. Materials used for plating are not particularly limited, but examples include Ni, Sn, and Cu. Furthermore, during the plating process, a resist treatment can be applied to the upper surface of the mounting portion 38 to prevent the plating from adhering to the upper surface of the mounting portion 38. This creates a difference in wettability with respect to solder between the upper and lower surfaces of the mounting portion 38. The same difference can also be created by plating the entire intermediate member to form a metal coating, and then removing only the metal coating formed on the upper surface of the mounting portion 38 by laser stripping or the like.

[0070] In manufacturing the first metal terminal portion 30, a plurality of first metal terminal portions 30 may be formed in a state of being connected to one another from a continuous strip-shaped metal plate material. The plurality of first metal terminal portions 30 connected to one another are cut into individual pieces before or after being connected to the chip capacitor 20. The manufacturing method of the second metal terminal 40 is the same as that of the first metal terminal 30 .

[0071] Assembly of ceramic capacitor 10 Two chip capacitors 20 obtained as described above are prepared and arranged and held so that the second side surface 20d and the first side surface 20c are in contact, as shown in FIG. 1. Then, the first metal terminal portion 30 and the second metal terminal portion 40 are attached to the first terminal electrode 22 and the second terminal electrode 24, respectively. Furthermore, a connecting material such as solder is applied to the first through-holes 36b of the first and second metal terminal portions 30, 40, and the solder is interposed between the electrode opposing portions 36, 46 and the first terminal electrode 22 and the second terminal electrode 24. This electrically and mechanically connects the first and second metal terminal portions 30, 40 to the first terminal electrode 22 and the second terminal electrode 24 of the chip capacitor 20, thereby obtaining the ceramic capacitor 10.

[0072] Note that the connecting material such as solder may be applied in advance to the electrode opposing portions 36, 46 of the metal terminal portions 30, 40 that face the first and second terminal electrodes 22, 24 before attaching the first and second metal terminal portions 30, 40 to the chip capacitor 20, and then remelted after assembly. Note that, if necessary, the first and second terminal electrodes 22, 24 and the mating arm portions 31a-33b, 41a-43a engaged therewith may be welded by melting the metal plating formed on the surface of either or both of them.

[0073] The ceramic capacitor 10 obtained in this manner has a height direction that is the same as the direction of the chip first side 20g, which is the long side of the chip capacitor 20, and the mounting portions 38, 48 are formed by bending downward from the terminal second side 36hb of the chip capacitor 20, so that the projection area of ​​the ceramic capacitor 10 in the height direction is small (see FIGS. 4 and 5). Therefore, the mounting area of ​​such a ceramic capacitor 10 can be made small.

[0074] Furthermore, in a ceramic capacitor 10 configured such that multiple chip capacitors 20 are arranged in a direction parallel to the mounting surface, for example, only one chip capacitor 20 is held between a pair of mating arm portions 31a, 31b along the mating direction (Z-axis direction), resulting in high bonding reliability between the chip capacitor 20 and the metal terminal portions 30, 40 and high reliability against impact and vibration.

[0075] Furthermore, by arranging multiple chip capacitors 20 in a direction parallel to the mounting surface and by aligning the stacking direction of the chip capacitors 20 parallel to the mounting surface, the transmission path of the ceramic capacitor 10 is shortened, thereby achieving a low ESL for the ceramic capacitor 10. Furthermore, because the direction in which the chip capacitor 20 is held is perpendicular to the stacking direction of the chip capacitors 20, the first and second metal terminals 30, 40 can hold the chip capacitor 20 without any problems even if the number of stacked layers of the held chip capacitor 20 changes and the length L2 of the second chip edge 20h of the chip capacitor 20 changes. Thus, the first and second metal terminals 30, 40 of the ceramic capacitor 10 can hold chip capacitors 20 with various numbers of stacked layers, allowing for flexible response to design changes.

[0076] In addition, the upper arm portions 31a, 33a and the lower arm portions 31b, 33b of the ceramic capacitor 10 sandwich and hold the chip capacitor 20 from both ends of the first chip edge 20g, which is the long side of the first end face 20a of the chip capacitor 20. This allows the first and second metal terminal portions 30, 40 to effectively relieve stress, suppressing the transmission of vibration from the chip capacitor 20 to the mounting board and preventing acoustic noise. In particular, because the lower arm portions 31b, 33b are connected to the periphery of the second through hole 36c, the lower arm portions 31b, 33b that support the chip capacitor 20 and the electrode facing portions 36, 46 that support the lower arm portions 31b, 33b are shaped to be easily elastically deformed. Therefore, the first and second metal terminal portions 30, 40 can effectively relieve stress generated in the ceramic capacitor 10 and absorb vibration.

[0077] Furthermore, since the lower arm portions 31b and 33b are connected to the periphery of the second through hole 36c, the lower arm portions 31b and 33b can be positioned to overlap the mounting portion 38 when viewed from the direction perpendicular to the mounting surface (Z-axis direction) in the ceramic capacitor 10 (see FIG. 5). Therefore, the mounting portion 38 of the ceramic capacitor 10 can be made wider, which is advantageous from the viewpoint of miniaturization.

[0078] Furthermore, in a ceramic capacitor 10 having a first through hole 36b formed in the electrode opposing portion 36, a connecting material such as solder can be applied to the first through hole 36b to form a solder bridge between the periphery of the first through hole 36b and the first terminal electrode 22, thereby reliably connecting the first and second metal terminal portions 30, 40 and the chip capacitor 20. Furthermore, the formation of the first through hole 36b makes it easy to interpose a connecting material such as solder between the first and second terminal electrodes 22, 24 and the electrode opposing portion 36, 46, even after the chip capacitor 20 and the first and second metal terminal portions 30, 40 are assembled. Furthermore, the formation of such a first through hole 36b allows the bonding state between the first and second metal terminal portions 30, 40 and the chip capacitor 20 to be easily visually confirmed from the outside, thereby reducing quality variation and improving the yield rate.

[0079] Second embodiment Fig. 7 is a schematic perspective view of a ceramic capacitor 100 according to a second embodiment of the present invention, and Figs. 8, 9, 10, and 11 are a front view, a left side view, a top view, and a bottom view, respectively, of the ceramic capacitor 100. As shown in Fig. 7, the ceramic capacitor 100 is similar to the ceramic capacitor 10 according to the first embodiment, except that it has three chip capacitors 20 and the number of first through holes 36b included in the first metal terminal portion 130 and the second metal terminal portion 140 is different. Therefore, in describing the ceramic capacitor 100, the same parts as those in the ceramic capacitor 10 are denoted by the same reference numerals as those in the ceramic capacitor 10, and description thereof will be omitted.

[0080] As shown in Fig. 7, the chip capacitor 20 included in the ceramic capacitor 100 is the same as the chip capacitor 20 included in the ceramic capacitor 10 shown in Fig. 1. The three chip capacitors 20 included in the ceramic capacitor 100 are arranged so that the chip first sides 20g are perpendicular to the mounting surface, as shown in Fig. 8, and the chip second sides 20h are parallel to the mounting surface, as shown in Fig. 10. The three chip capacitors 20 included in the ceramic capacitor 100 are arranged parallel to the mounting surface so that the first terminal electrodes 22 of adjacent chip capacitors 20 contact each other and the second terminal electrodes 24 of adjacent chip capacitors 20 contact each other.

[0081] The first metal terminal portion 130 included in the ceramic capacitor 100 has an electrode facing portion 136 facing the first terminal electrode 22, three pairs of fitting arms 31a, 31b, 33a, 33b, 35a, 35b that grip the chip capacitor 20, and a mounting portion 138 that bends perpendicularly from a terminal second side 136hb of the electrode facing portion 136 toward the chip capacitor 20. The electrode facing portion 136 is in the shape of a substantially rectangular plate, and has a pair of terminal first sides 136g that are substantially parallel to the chip first side 20g, and a pair of terminal second sides 136ha, 136hb that are substantially parallel to the chip second side 20h.

[0082] 9, the first metal terminal portion 130 has protrusions 36a, first through holes 36b, second through holes 36c, and slits 36d formed therein, similar to the first metal terminal portion 30 shown in FIG. 3. However, the first metal terminal portion 130 has three first through holes 36b, three second through holes 36c, and three slits 36d formed therein, with one first through hole 36b, one second through hole 36c, and one slit 36d corresponding to one chip capacitor 20. Furthermore, the first metal terminal portion 130 has a total of twelve protrusions 36a formed therein, with four protrusions 36a corresponding to one chip capacitor 20.

[0083] 10, in the first metal terminal portion 130, the upper arm portion 31a and the lower arm portion 31b hold one chip capacitor 20, the upper arm portion 33a and the lower arm portion 33b hold another chip capacitor 20, and the upper arm portion 35a and the lower arm portion 35b hold another chip capacitor 20 different from the above two. The upper arm portions 31a, 33a, and 35a are connected to the upper (Z-axis positive direction) terminal second side 136ha of the electrode opposing portion 36, and the lower arm portions 31b, 33b, and 35b are connected to the peripheral edge of the second through-hole 36c.

[0084] 8 and 11, the mounting portion 138 of the first metal terminal portion 130 is connected to the lower (Z-axis negative direction) terminal second side 136hb of the electrode opposing portion 136. The mounting portion 138 extends from the lower terminal second side 136hb toward the chip capacitor 20 (Y-axis negative direction), and is bent approximately perpendicular to the electrode opposing portion 136.

[0085] The second metal terminal portion 140 has an electrode facing portion 146 facing the second terminal electrode 24, multiple pairs of mating arm portions 141a, 143a, 145a that hold the chip capacitor 20 in the Z-axis direction from both ends of the chip first side 20g, and a mounting portion 148 that extends from the electrode facing portion 146 toward the chip capacitor 20, at least a portion of which is approximately perpendicular to the electrode facing portion 146.

[0086] Similar to the electrode opposing portion 36 of the first metal terminal portion 130, the electrode opposing portion 146 of the second metal terminal portion 140 has a pair of terminal first sides 146g substantially parallel to the chip first side 20g and a terminal second side 140ha substantially parallel to the chip second side 20h, and the electrode opposing portion 146 is formed with a protrusion 46a, a first through hole, a second through hole, and a slit. As shown in FIG. 7, the second metal terminal portion 140 is disposed symmetrically with respect to the first metal terminal portion 130, and its arrangement with respect to the chip capacitor 20 is different from that of the first metal terminal portion 130. However, since the second metal terminal portion 140 has a similar shape to the first metal terminal portion 130 except for its arrangement, detailed description will be omitted.

[0087] The ceramic capacitor 100 according to the second embodiment also achieves the same effects as the ceramic capacitor 10 according to the first embodiment. In the ceramic capacitor 100, the number of upper arm portions 31a-33a, lower arm portions 31b-33b, first through holes 36b, second through holes 36c, and slits 36d included in the first metal terminal portion 130 is the same as the number of chip capacitors 20 included in the ceramic capacitor 100, but the number of mating arm portions and the like included in the ceramic capacitor 100 is not limited to this. For example, the first metal terminal portion 130 may be formed with twice the number of first through holes 36b as the chip capacitors 20, or may be formed with one long continuous slit 36d.

[0088] Other embodiments As described above, the present invention has been described using the embodiments, but it goes without saying that the present invention is not limited to the above-described embodiments and includes many other variations. For example, the first metal terminal portion 30 shown in Fig. 1 has the protrusion 36a, the first through hole 36b, the second through hole 36c, and the slit 36d all formed therein, but the first metal terminal portion is not limited to this, and variations in which one or more of these portions are not formed are also included in the first metal terminal portion according to the present invention.

[0089] 1 to 11 do not show the connecting members that connect the first metal terminal portions 30, 130 or the second metal terminal portions 40, 140 to the chip capacitor 20, but the shape, size and type of the connecting members, such as solder, are adjusted appropriately depending on the size of the ceramic capacitors 10, 100 and the intended use of the ceramic capacitors 10, 100, etc.

[0090] FIG. 13 is a left side view showing a ceramic capacitor 300 according to a second modification. The ceramic capacitor 300 according to the second modification is similar to the ceramic capacitor 10 according to the first embodiment, except for the shape of the slits 336d formed in the first and second metal terminal portions 330. As shown in FIG. 13, the first and second metal terminal portions 330 each have a single slit 336d that is continuous in the X-axis direction and formed below the two second through-holes 36c. As such, the shape and number of the slits 336d are not limited as long as they are formed between the lower end of the portion of the chip capacitor 20 facing the first end face 20a (the lower chip second side 20h) and the terminal second side 36hb (i.e., the terminal connection portion 36k).

[0091] The present invention will be described in detail below with reference to examples, but is not limited to these examples.

[0092] The impedance Z and resistance component Rs were measured for the ceramic capacitor according to the example. The ceramic capacitor according to the example has the same shape as the ceramic capacitor 100 shown in FIG. 1. The impedance Z and resistance component Rs were measured with the mounting portion of the ceramic capacitor soldered to a mounting board. The size of the ceramic capacitor according to the example and the measurement conditions for the example are as follows: Example <Overall size of ceramic capacitor> 5.0×6.0×6.4mm <Chip components> Size: (L3 x L1 x L2) 5.7 x 5.0 x 2.5 mm Capacitance: 15μF <Metal terminal> Material: 3-layer clad material Cu-NiFe-Cu Electrode facing part 36 size: (Z axis direction (terminal first side 36g) x X axis direction (terminal second side 36ha) x plate thickness) 6.3 x 5.0 x 0.1 mm Arm 33a size: (X direction x Y direction) 0.9 x 0.9 mm Mounting area size: (Y direction) 1.2 mm <Measurement conditions> Frequency: 100Hz to 10MHz Temperature: 25℃

[0093] Comparative Example The impedance Z and resistance component Rs of the ceramic capacitor according to the comparative example were measured in the same manner as in the example. As shown in FIG. 14, the ceramic capacitor 500 according to the comparative example uses L-shaped metal terminals 501 and 502. The chip capacitor 20 included in the ceramic capacitor 500 is similar to the chip capacitor 20 included in the ceramic capacitor according to the example. However, in the ceramic capacitor 500, the chip capacitor 20 is arranged so that a first chip side 20g, which is the long side of the rectangle constituting the chip end face, is horizontal to the mounting surface, and two chip capacitors 20 are arranged overlapping each other in a direction perpendicular to the mounting surface (Z-axis direction). The chip capacitors 20 are fixed to electrode opposing portions 510 of the metal terminals 501 and 502 with solder. <Overall size of ceramic capacitor> 5.0×6.0×6.5mm <Chip components> Same as in the example <Metal terminal> Material: 3-layer clad material Cu-NiFe-Cu Electrode facing area size: (Z-axis direction x X-axis direction x plate thickness) 6.3 x 5.0 x 0.1 mm Without arms Mounting area size: (Y direction) 1.6 mm

[0094] FIG. 15 shows a graph of the impedance Z and resistance component Rs measured using the ceramic capacitors according to the example and the comparative example. In the graph shown in FIG. 15, the vertical axis represents the impedance Z and the resistance component Rs, and the horizontal axis represents the frequency. The impedance Z measured using the ceramic capacitor according to the example has one extreme value (minimum value) at the resonance point, whereas the impedance Z measured using the ceramic capacitor according to the comparative example shows multiple other extreme values ​​in a range higher than the resonance point. In a range higher than the resonance point where the influence of ESL appears in the impedance Z, the ceramic capacitor according to the example has a smaller impedance Z value than the ceramic capacitor according to the comparative example, and it can be seen that the ceramic capacitor according to the example has a lower ESL than the comparative example. [Explanation of symbols]

[0095] 10, 100... ceramic capacitors 20...Chip capacitor 20a...first end surface 20b…Second end surface 20c…1st side 20d…Second side 20e…Third side 20f…4th side 20g...first side of chip 20h: Second side of chip 20j...Third side of chip 22...First terminal electrode 24…Second terminal electrode 26...Internal electrode layer 28...Dielectric layer 30, 130, 40, 140...Metal terminal part 31a, 33a, 35a, 41a, 43a, 45a...Upper arm portion (mating arm portion) 31b, 33b, 35b...lower arm portion (mating arm portion) 36, 136, 46, 146...electrode opposing part 36a, 46a...Protrusion 36b...1st through hole 36c…Second through hole 36d, 46d...Slit 36g...First side of terminal 36ha, 36hb...Second side of terminal 38, 138, 48, 148... Mounting section

Claims

1. a plurality of chip components each having a substantially rectangular shape, with terminal electrodes formed on a pair of chip end faces having a pair of chip first sides and a pair of chip second sides shorter than the chip first sides, and each having a substantially rectangular parallelepiped shape consisting of the pair of chip end faces and four chip side faces connecting the pair of chip end faces; and a pair of metal terminal portions provided corresponding to the pair of chip end faces; The pair of metal terminal portions each include: an electrode facing portion having a substantially rectangular flat plate shape and including a pair of terminal first sides substantially parallel to the chip first sides and a pair of terminal second sides substantially parallel to the chip second sides, the electrode facing portion facing the chip end surface; a fitting arm portion extending from the electrode facing portion to a side surface of the chip and configured to sandwich and hold the chip component from both ends of the first side of the chip; a mounting portion connected to one of the second terminal sides of the electrode opposing portion, extending from the one of the second terminal sides toward the chip component, and at least a portion of which is substantially perpendicular to the electrode opposing portion; the plurality of chip components are arranged such that the chip second sides are aligned in a horizontal direction, a second through hole having a peripheral edge connected to a lower arm portion that is one of the fitting arm portions and supports the chip component from below, is formed in the electrode facing portion in correspondence with the chip component; In the chip component, the terminal electrodes on the pair of chip end faces and the electrode facing portions of the pair of metal terminal portions are joined by connecting members located at positions different from the second through holes, a first through hole is formed in a portion of the electrode facing portion facing the chip end surface, In the chip component, the lower arm portion, the second through hole, and the joining point of the connecting member are arranged side by side in a height direction perpendicular to the horizontal direction from the mounting portion in the order of the lower arm portion, the second through hole, and the joining point, The second through hole has an opening width in a width direction parallel to the second side of the terminal that is wider than that of the first through hole.

2. a slit extending in a direction parallel to the second side of the terminal is formed between the second through hole and the second side of the terminal in correspondence with the chip component; 2. The ceramic electronic component according to claim 1, wherein in the chip component, the slit, the lower arm portion, and the second through hole are arranged in a line in a height direction perpendicular to the horizontal direction from the mounting portion in the following order: slit, lower arm portion, second through hole.

3. a plurality of chip components each having a substantially rectangular shape, with terminal electrodes formed on a pair of chip end faces having a pair of chip first sides and a pair of chip second sides shorter than the chip first sides, and each having a substantially rectangular parallelepiped shape consisting of the pair of chip end faces and four chip side faces connecting the pair of chip end faces; and a pair of metal terminal portions provided corresponding to the pair of chip end faces; The pair of metal terminal portions each include: an electrode facing portion having a substantially rectangular flat plate shape and including a pair of terminal first sides substantially parallel to the chip first sides and a pair of terminal second sides substantially parallel to the chip second sides, the electrode facing portion facing the chip end surface; a fitting arm portion extending from the electrode facing portion to a side surface of the chip and configured to sandwich and hold the chip component from both ends of the first side of the chip; a mounting portion connected to one of the second terminal sides of the electrode opposing portion, extending from the one of the second terminal sides toward the chip component, and at least a portion of which is substantially perpendicular to the electrode opposing portion; the plurality of chip components are arranged such that the chip second sides are aligned in a horizontal direction, a second through hole having a peripheral edge connected to a lower arm portion that is one of the fitting arm portions and supports the chip component from below, is formed in the electrode facing portion in correspondence with the chip component; a slit extending in a direction parallel to the second side of the terminal is formed between the second through hole and the second side of the terminal in correspondence with the chip component; In the chip component, the slit, the lower arm portion, and the second through hole are arranged side by side in a height direction perpendicular to the horizontal direction from the mounting portion in the order of the slit, the lower arm portion, and the second through hole, the chip component is a multilayer capacitor in which internal electrode layers and dielectric layers are laminated, The stacking direction of the chip component is approximately parallel to the second chip side.

4. a plurality of chip components each having a substantially rectangular shape, with terminal electrodes formed on a pair of chip end faces having a pair of chip first sides and a pair of chip second sides shorter than the chip first sides, and each having a substantially rectangular parallelepiped shape consisting of the pair of chip end faces and four chip side faces connecting the pair of chip end faces; and a pair of metal terminal portions provided corresponding to the pair of chip end faces; The pair of metal terminal portions each include: an electrode facing portion having a substantially rectangular flat plate shape and including a pair of terminal first sides substantially parallel to the chip first sides and a pair of terminal second sides substantially parallel to the chip second sides, the electrode facing portion facing the chip end surface; a fitting arm portion extending from the electrode facing portion to a side surface of the chip and configured to sandwich and hold the chip component from both ends of the first side of the chip; a mounting portion connected to one of the second terminal sides of the electrode opposing portion, extending from the one of the second terminal sides toward the chip component, and at least a portion of which is substantially perpendicular to the electrode opposing portion; the plurality of chip components are arranged such that the chip second sides are aligned in a horizontal direction, a second through hole having a peripheral edge connected to a lower arm portion that is one of the fitting arm portions and supports the chip component from below, is formed in the electrode facing portion in correspondence with the chip component; a slit extending in a direction parallel to the second side of the terminal is formed between the second through hole and the second side of the terminal in correspondence with the chip component; the chip component is a multilayer capacitor in which internal electrode layers and dielectric layers are laminated, The ceramic electronic component is characterized in that the stacking direction of the chip component is approximately parallel to the second side of the chip.

5. a plurality of chip components each having a substantially rectangular shape, with terminal electrodes formed on a pair of chip end faces having a pair of chip first sides and a pair of chip second sides shorter than the chip first sides, and each having a substantially rectangular parallelepiped shape consisting of the pair of chip end faces and four chip side faces connecting the pair of chip end faces; and a pair of metal terminal portions provided corresponding to the pair of chip end faces; The pair of metal terminal portions each include: an electrode facing portion having a substantially rectangular flat plate shape and including a pair of terminal first sides substantially parallel to the chip first sides and a pair of terminal second sides substantially parallel to the chip second sides, the electrode facing portion facing the chip end surface; a plurality of pairs of fitting arms extending from the electrode facing portions to the chip side surfaces and configured to sandwich and hold the chip component from both ends of the first chip edge; a mounting portion connected to one of the second terminal sides of the electrode opposing portion, extending from the one of the second terminal sides toward the chip component, and at least a portion of which is substantially perpendicular to the electrode opposing portion; the plurality of chip components are arranged such that the chip second sides are aligned along a horizontal direction, a second through hole having a peripheral edge connected to a lower arm portion that is one of the fitting arm portions and supports the chip component from below, is formed in the electrode facing portion in correspondence with the chip component; a connecting member is provided on a portion of the electrode opposing portion facing the chip end face, connecting the electrode opposing portion and a portion of the terminal electrode that is disposed on the chip end face; and a plurality of first through holes are formed corresponding to each of the chip components, through which a bonding state between the metal terminal portion and each of the portions of the terminal electrodes of the plurality of chip components that is disposed on the chip end face can be visually confirmed from the outside; the connecting member is interposed between a peripheral edge of the first through hole and the terminal electrode, The ceramic electronic component is characterized in that the second through hole has an opening width in a width direction parallel to the second side of the terminal that is wider than that of the first through hole.

6. each of the plurality of chip components is a multilayer capacitor in which an internal electrode layer and a dielectric layer are laminated; 6. The ceramic electronic component according to claim 1, wherein the stacking direction of each of the plurality of chip components is approximately parallel to the second chip side.

7. 6. The ceramic electronic component according to claim 5, wherein the electrode facing portion is formed with a plurality of protrusions that protrude toward the chip end face and come into contact with the chip end face.

8. The ceramic electronic component according to claim 7 , wherein the plurality of protrusions are formed around the first through hole.

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