Component mounting system, component mounting device, and component mounting method

Abstract

To provide a component mounting system capable of properly feeding back misalignment information of components mounted on a board, a component mounting device, and a component mounting method.SOLUTION: The component mounting system performs the steps below; acquiring first misalignment information of a component mounted on a first model board (ST2); calculating a second correction value that is a correction value when mounting a component onto the board based on the first misalignment information independent of the board type (ST4); when switching from the first product type board to the second product type board (Yes in ST5), mounting a component onto a second type board using a second correction value (ST6); acquiring second misalignment information of the component mounted on the second type board (ST7); calculating a third correction value when mounting a component onto a second type board based on the second misalignment information (ST8); and mounting the component onto the second type board using the third correction value when the third correction value is calculated (ST9).SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a component mounting system, a component mounting apparatus, and a component mounting method for mounting components on a board. [Background technology]

[0002] In a component mounting system that mounts components on a board to produce a mounted board, an inspection device acquires positional deviation information of the components mounted on the board, and the acquired positional deviation information is used as feedback for correcting the mounting position when the component mounting device mounts the components on a subsequent board (see, for example, Patent Document 1). The component mounting system described in Patent Document 1 discloses that until positional deviation information is detected by an inspection device installed downstream of the component mounting device, fluctuations caused by thermal deformation over time of the component mounting device are used to correct the mounting position, and once positional deviation information is acquired by the inspection device, the acquired positional deviation information is added to the fluctuations caused by thermal deformation to correct the mounting position. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-58604 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional technologies including Patent Document 1, component mounting lines connecting multiple component mounting devices have the following problem: Namely, when switching the type of mounted board to be produced on a component mounting line in which five component mounting devices, each capable of storing three boards, are connected, the new board cannot be fed into the first component mounting device until the board before the switch has finished running on the component mounting line. As a result, the production time of 10 or more boards must be wasted before production can be resumed, resulting in a problem of reduced production efficiency.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a component mounting system, a component mounting apparatus, and a component mounting method that are capable of appropriately feeding back information about positional deviations of components mounted on a board. [Means for solving the problem]

[0006] A component mounting system of the present invention includes a positional deviation information acquisition unit that acquires positional deviation information of a component mounted on a board, a first correction value calculation unit that calculates a first correction value when mounting the component on the board based on the positional deviation information, a second correction value calculation unit that calculates a second correction value that is a correction value when mounting the component on the board based on the positional deviation information and that does not depend on the type of board, and a component mounting unit that mounts the component on the board, the first correction value calculation unit calculates the first correction value based on the positional deviation information of the first type substrate; The second correction value calculation unit The aforementioned calculating the second correction value based on the positional deviation information of boards on which components have been mounted up to now, the board including at least the first type board; the component mounting unit mounts components on the first-type board using the first correction value; When the first type board is switched to the second type board, the component mounting unit initially mounts components onto the second type board using the second correction value.

[0007] The component mounting device of the present invention comprises: a first correction value calculation unit that calculates a first correction value when mounting a component on a first type board based on positional deviation information of the component mounted on the first type board; and a second correction value calculation unit that calculates a second correction value that is independent of the type of board based on the positional deviation information of boards on which components have been previously mounted, the second correction value including at least the first type board; a component mounting section that mounts components on the board; ,of Prepared, the above Parts mounting section teeth, Mounting components on the first type board using the first correction value; When we first switched from the first type board to the second type board, The aforementioned The second correction value is used to mount the components on the second type board. dress up do.

[0008] The component mounting method of the present invention is place Obtain the misalignment information, Based on the positional deviation information of the component mounted on the first type board, a first correction value is calculated when the component is mounted on the first type board, and a correction value is calculated for all boards on which components have been mounted, including at least the first type board. before Inscription calculating a second correction value, which is a correction value for mounting the component on the board based on the misplacement information and is independent of the type of board; Mounting components on the first type board using the first correction value; The first type substrate is switched to the second type substrate. At first, Then, the second correction value is used to mount components on the second type substrate. dress up do. [Effects of the Invention]

[0009] According to the present invention, it is possible to appropriately feed back information about positional deviations of components mounted on a board. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram illustrating the configuration of a component mounting system according to an embodiment of the present invention. [Figure 2] FIG. 1 is a plan view showing a configuration of a main part of a component mounting apparatus according to an embodiment of the present invention; [Figure 3] FIG. 1 is a diagram illustrating the configuration of a mounting head and a component supply unit of a component mounting device according to an embodiment of the present invention; [Figure 4] FIG. 1 is a block diagram showing the configuration of a control system of a component mounting system according to an embodiment of the present invention. [Figure 5] FIG. 10 is an explanatory diagram of the amount of component mounting position deviation acquired by the inspection device according to the embodiment of the present invention. [Figure 6] 1A and 1B are explanatory diagrams illustrating the effect of nozzle rotation on the amount of component mounting position deviation in a component mounting apparatus according to an embodiment of the present invention. [Figure 7] 1 is a flow diagram of a component mounting method according to an embodiment of the present invention; [Figure 8] (a) (b) (c) (d) (e) are explanatory diagrams of a component mounting process in a component mounting system according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0011] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the component mounting system, management computer, component mounting device, and inspection device. Corresponding elements in all drawings will be denoted by the same reference numerals, and redundant description will be omitted. In FIG. 1 and in some sections described below, two axes perpendicular to each other in a horizontal plane are shown: the X-axis (left-right direction in FIG. 1) in the substrate transport direction; and the Y-axis (up-down direction in FIG. 1) perpendicular to the substrate transport direction. In FIG. 3 and in some sections described below, the Z-axis (up-down direction in FIG. 3) is shown as the height direction perpendicular to the horizontal plane. In FIG. 3 and in some sections described below, the θ-direction is shown, which is the direction of rotation around the Z-axis.

[0012] First, the configuration of component mounting system 1 will be described with reference to Figure 1. Component mounting system 1 has the function of manufacturing a mounted board by mounting components on a board. Component mounting system 1 has four component mounting devices M1 to M4 and an inspection device M5 arranged in series from upstream (left side of the page) to downstream (right side of the page) in the board transport direction. Each device is connected to a management computer 3 via a communication network 2. Each device also transmits and receives data to and from each other via the communication network 2. Note that the number of component mounting devices M1 to M4 provided in component mounting system 1 is not limited to four, and may be one, two, three, five or more.

[0013] In FIG. 1, component mounting devices M1 to M4 and inspection device M5 each include board transport units 4 and 5. Board transport units 4 and 5 transport board B from upstream devices to downstream devices. Component mounting device M1 receives board B from upstream production equipment, such as a printing device that prints solder paste on electrodes formed on board B (arrow a). Component mounting device M1 performs component mounting work by using a mounting head to pick up components D from a component supply unit and mount them at the mounting positions on the received board B, and then transports board B to downstream component mounting device M2. Similarly, component mounting devices M2 to M4 each perform component mounting work by attaching components D to the mounting positions on board B transported from the upstream device.

[0014] Inspection device M5 uses inspection camera 6 to inspect the mounting state of components D on board B on which components D have been mounted by component mounting devices M1 to M4, obtains information such as positional deviation of components D from their normal positions, and judges the quality of the mounted board. After inspection, board B is transported to a downstream device such as a reflow device that heats board B to melt the solder paste (arrow b). Management computer 3 has the function of overall control of component mounting system 1, which includes component mounting devices M1 to M4 and inspection device M5.

[0015] Next, the configuration of component mounting devices M1 to M4 will be described with reference to Figure 2. A board transport unit 4 is installed along the X axis in the center of a base 7. The board transport unit 4 transports a board B carried out from an upstream device, and positions and holds it at a mounting operation position by a mounting head, which will be described below. The board transport unit 4 also carries out the board B, on which component mounting operation (component mounting operation) has been completed, to a downstream device.

[0016] The substrate transport unit 4 includes a fixed rail 4a fixed to a base 7 and a movable rail 4b that is movable along the Y-axis. The substrate transport unit 4 includes a rail movement unit 8 that moves the movable rail 4b in the width direction (Y-axis direction) of the substrate B being transported. The rail movement unit 8 includes a feed screw 8a, a nut 8b that engages with the feed screw 8a arranged on the movable rail 4b, and a rail movement motor 8c that rotates the feed screw 8a. By operating the rail movement motor 8c to rotate the feed screw 8a, the movable rail 4b moves along the Y-axis (arrow a). This allows the distance between the fixed rail 4a and the movable rail 4b to be changed to match the width of the substrate B being transported by the substrate transport unit 4.

[0017] 2, a component supply unit 9 is installed on each side (front and back direction of the Y axis) of the board transport unit 4. In the component supply unit 9, multiple tape feeders 10 are arranged in parallel along the X axis. The tape feeders 10 feed a component tape, which has pockets for storing components D, at a pitch rate in a direction (tape feed direction) from the outside of the component supply unit 9 toward the board transport unit 4, thereby supplying components D to the component supply position where the mounting head picks up the components.

[0018] Y-axis tables 11 equipped with linear drive mechanisms are arranged at both ends of the X-axis on the top surface of base 7. A beam 12 similarly equipped with a linear mechanism is connected between the two Y-axis tables 11 so as to be freely movable along the Y-axis. A mounting head 13 is attached to beam 12 via plate 12a so as to be freely movable along the X-axis. Mounting head 13 has a nozzle 13b attached to its lower end for suctioning and holding component D, and is equipped with multiple (eight in this case) suction units 13a that can raise and lower the attached nozzle 13b (see FIG. 3).

[0019] 2, Y-axis table 11 and beam 12 constitute a head movement mechanism that moves mounting head 13 horizontally (in the X-axis and Y-axis directions). The head movement mechanism and mounting head 13 also constitute component mounting unit 14, which performs component mounting work by picking up components D from the component supply positions of tape feeder 10 attached to component supply unit 9 and mounting them at the mounting positions on board B held by board transport unit 4. During the component mounting work, mounting head 13 moves above component supply unit 9, picks up predetermined components D with each nozzle, moves above board B, and repeats a series of mounting turns to mount the components D held by each nozzle at their respective mounting positions.

[0020] A head camera 15 is attached to the plate 12a on which the mounting head 13 is attached. As the mounting head 13 moves, the head camera 15 moves above the board B positioned at the mounting work position of the board transport unit 4, and captures images of the board marks (not shown) provided on the board B and the mounting position of the board B.

[0021] 2, a component recognition camera 16 is installed between the component supply unit 9 and the board transport unit 4. When the mounting head 13, which has taken out a component D from the component supply unit 9, is positioned above the component recognition camera 16, the component recognition camera 16 captures an image of the component D held by the nozzle from below. When the mounting head 13 mounts the component D on the board B, the mounting position is corrected taking into account the recognition results of the board B by the head camera 15 and the recognition results of the component by the component recognition camera 16.

[0022] A touch panel 17 operated by the worker is installed in front of the component mounting devices M1 to M4 at a position where the worker works. Touch panel 17 displays various information on its display, and the worker inputs data and operates component mounting devices M1 to M4 using operation buttons and the like displayed on the display.

[0023] Next, the configuration of the mounting head 13 will be described with reference to Figure 3. The mounting head 13 is equipped with a plurality of suction units 13a. Each suction unit 13a is equipped with a drive mechanism (not shown). By driving the drive mechanism, a shaft 13c having a nozzle 13b attached to its lower end moves up and down (arrow b). By driving the drive mechanism, the shaft 13c rotates, and the nozzle 13b rotates in the θ direction around the nozzle axis AN as the rotation axis (arrow c). In this way, the mounting head 13 provided in the component mounting unit 14 is equipped with a nozzle 13b that holds and rotates a component D to mount the component D on the board B at a predetermined rotation angle.

[0024] Next, the configuration of the control system of component mounting system 1 will be described with reference to FIG. 4. Among the functions possessed by component mounting system 1, the following will be described, focusing on the function of appropriately feeding back to component mounting devices M1-M4 information about mounting position deviations of components D mounted on board B when changing the production model of the mounted board to be manufactured. Management computer 3, component mounting devices M1-M4, and inspection device M5 are interconnected via communication network 2. Each of component mounting devices M1-M4 includes a mounting control device 20, a board transport unit 4, a rail movement unit 8, a tape feeder 10, a component mounting unit 14, a head camera 15, a component recognition camera 16, and a touch panel 17. Mounting control device 20 includes a mounting memory unit 21, a board change processing unit 22, an acquisition unit 23, a first correction value calculation unit 24, a second correction value calculation unit 25, a mounting control unit 26, and a mounting communication unit 27.

[0025] Mounting communication unit 27 transmits and receives data to and from inspection device M5 and management computer 3 via communication network 2. Mounting memory unit 21 is a storage device that stores mounting data 21a, positional deviation information 21b, first correction value information 21c, second correction value information 21d, etc. Mounting data 21a includes information such as the production model name (board name) of the mounted board, the size of board B, the type (component name) of component D to be mounted on board B, the mounting position (XY coordinates), the mounting direction (θ direction), the installation position of tape feeder 10 that supplies component D, and the installation position of the nozzle.

[0026] 4, board change processing unit 22 executes board change processing for changing the production model of board B on which component mounting work is performed by component mounting devices M1 to M4, based on a command from management computer 3 or based on an operator's operation on touch panel 17. Specifically, board change processing unit 22 stores mounting data 21a for changed board B transmitted from management computer 3 in mounting storage unit 21. Then, board change processing unit 22 controls rail movement unit 8 based on the changed width of board B (length in the Y-axis direction) included in mounting data 21a, and moves the position of movable rail 4b so that board transport unit 4 can transport changed board B.

[0027] 4, acquisition unit 23 acquires misalignment information (mounting position misalignment amounts ΔX, ΔY, Δθ) of component D mounted on board B, which is calculated by inspection device M5 by capturing an image of component D mounted on board B, and stores the information in mounting storage unit 21 as misalignment information 21b. First correction value calculation unit 24 calculates a first correction value to be used when component mounting devices M1 to M4 mount component D on board B, based on the mounting position misalignment amounts ΔX, ΔY, Δθ of component D included in misalignment information 21b. That is, first correction value calculation unit 24 calculates the first correction value based on misalignment information 21b of board B (first type board) currently being manufactured. First correction value calculation unit 24 stores the calculated first correction value in mounting storage unit 21 as first correction value information 21c.

[0028] Based on the mounting position deviation amounts ΔX, ΔY, and Δθ of the component D included in the position deviation information 21b, the second correction value calculation unit 25 calculates a second correction value that is used by the component mounting devices M1 to M4 when mounting the component D on the board B, and that does not depend on the type of board B (production model) or the type of component D. That is, the second correction value calculation unit 25 calculates the second correction value based on the position deviation information 21b of the boards B manufactured so far, including at least the board B currently being manufactured (first type board). The second correction value calculation unit 25 stores the calculated second correction value in the mounting storage unit 21 as second correction value information 21d. Examples of the second correction value will be described later.

[0029] 4, mounting control unit 26 (control unit) controls board transport unit 4, tape feeder 10, component mounting unit 14, head camera 15, and component recognition camera 16 based on the mounting position and mounting direction included in mounting data 21a, the first correction value included in first correction value information 21c, the second correction value included in second correction value information 21d, etc., to mount component D on board B. That is, component mounting unit 14 corrects the position of mounting head 13 based on the position of board B imaged by head camera 15, suction position deviation information, and the first correction value included in first correction value information 21c or the second correction value included in second correction value information 21d, to mount component D on board B.

[0030] More specifically, when the production model of the mounted boards to be manufactured is switched from the first type board to the second type board, the mounting control unit 26 initially mounts the component D on the second type board using the second correction value that is independent of the type of board B or the type of component D. Then, when the mounting control unit 26 calculates the first correction value for mounting the component D on the second type board based on the positional deviation information 21b of the component D mounted on the second type board, the mounting control unit 26 controls the component mounting unit 14 to mount the component D on the second type board using the first correction value.

[0031] This allows for appropriate feedback of positional deviation information 21b of component D mounted on board B without stopping the component mounting work by component mounting devices M1 to M4, even while switching the production model of the mounting board manufactured in component mounting system 1.

[0032] 4, inspection device M5 includes an inspection control device 30, a board transport unit 5, an inspection camera 6, and an inspection camera moving mechanism 31. Inspection control device 30 includes an inspection memory unit 32, an inspection control unit 33, a recognition processing unit 34, and an inspection communication unit 35. Inspection communication unit 35 transmits and receives data to and from component mounting devices M1 to M4 and management computer 3 via communication network 2. Inspection memory unit 32 is a storage device that stores inspection data 32a and the like. Inspection data 32a includes the production model name of the mounted board (board name), the size of board B, the type of component mounted on board B (component name), mounting position (XY coordinates), mounting direction (θ direction), defect determination value, and the like.

[0033] The inspection control unit 33 controls the board transport unit 5 to transport the mounted board B carried out from the upstream component mounting device M4 to the inspection work position, position it, and hold it there, and then carry out the board B downstream after the inspection work has been completed. Furthermore, the inspection control unit 33 controls the inspection camera moving mechanism 31 based on the inspection data 32a to move the inspection camera 6 sequentially above the mounting position of the board B held at the inspection work position, and causes the inspection camera 6 to capture images of the components D mounted on the board B.

[0034] In FIG. 4, the recognition processing unit 34 recognizes and processes the image captured by the inspection camera 6 to calculate the mounting position deviation amounts ΔX, ΔY, and Δθ (see FIG. 5) of the component D mounted on the board B from the correct mounting position Q. Furthermore, if the calculated mounting position deviation amounts ΔX, ΔY, and Δθ exceed the defect determination values ​​included in the inspection data 32a, the recognition processing unit 34 determines that the component D is defective (the board B is a defective board). Furthermore, the recognition processing unit 34 transmits the position deviation information (mounting position deviation amounts ΔX, ΔY, and Δθ) of the component D mounted on the board B to the component mounting devices M1 to M4. The acquisition units 23 of the component mounting devices M1 to M4 store the received position deviation information 21b in the mounting storage unit 21. In this way, the inspection device M5 is a position deviation information acquisition unit that acquires the position deviation information 21b of the component D mounted on the board B.

[0035] 5, an example of a method for calculating the mounting position deviation amounts ΔX, ΔY, and Δθ of component D mounted on board B from its normal mounting position Q, performed by the recognition processing unit 34, will be described. The inspection control unit 33 causes the inspection camera 6 to capture an image of component D mounted on board B at a position where the center of the image capture coincides with the normal mounting position Q of component D. The recognition processing unit 34 detects the component center C of the mounted component D by performing recognition processing on the captured image. The recognition processing unit 34 then calculates the position deviation amount ΔX in the X-axis direction and the position deviation amount ΔY in the Y-axis direction from the difference between the component center C (ΔX, ΔY) and the mounting position Q (0,0). Furthermore, the recognition processing unit 34 calculates the tilt of component D in the θ direction as the position deviation amount Δθ.

[0036] 4, the management processing device 40 of the management computer 3 includes a management storage unit 41, a production change processing unit 42, an input unit 43, a display unit 44, and a management communication unit 45. The input unit 43 is an input device such as a keyboard, touch panel, or mouse, and is used when inputting operation commands and data. The display unit 44 is a display device such as a liquid crystal panel, and displays various types of information such as various screens, including an operation screen for operation by the input unit 43. The management communication unit 45 is a communication interface, and transmits and receives signals and data to and from the component mounting devices M1 to M4 and the inspection device M5 via the communication network 2.

[0037] The management storage unit 41 is a storage device that stores production data 41a and the like. The production data 41a includes information such as the production model name of the mounted board (board name), the size of the board B, the type (component name) of the component D to be mounted on the board B, the size of the component D, the mounting position (XY coordinates), the mounting direction (θ direction), the component mounting devices M1 to M4 (component mounting units 14) that mount the components D, the attachment position of the tape feeder 10 that supplies the components D, information that identifies the mounting head 13, and the attachment position of the nozzle. In other words, the production data 41a includes mounting data 21a to be used by the component mounting devices M1 to M4 for each production model of the mounted board manufactured in the component mounting system 1.

[0038] 4, the production change processing unit 42 executes production change processing to change the production model of the mounted boards manufactured in the component mounting system 1. Specifically, when the mounted boards manufactured in the component mounting system 1 are changed from first-type boards to second-type boards, the production change processing unit 42 transmits mounting data 21a for the second-type board and a command for changeover to the component mounting devices M1 to M4 that have completed component mounting work on the last board BA55 of the first-type board (see FIG. 8). When the component mounting devices M1 to M4 that received the command complete the board change processing, the component mounting devices M1 to M4 receive the first board BB1 of the second-type boards from upstream devices and execute the component mounting work.

[0039] Next, referring to FIG. 6, a correction value calculated for each rotation angle of the nozzle 13b will be described as an example of the second correction value that is independent of the type of board B or the type of component D. As shown by the two-dot chain line in FIG. 6(a), the nozzle 13b is attached to the suction unit 13a with the nozzle axis AN aligned vertically (in the Z-axis direction). However, depending on how the nozzle 13b is attached or on distortion of the shaft 13c or the nozzle 13b, the nozzle axis AN may be tilted from the vertical. The tilt of this nozzle axis AN differs for each suction unit 13a or each nozzle 13b, but is independent of the production model of the mounted board or the type of component D.

[0040] When a mounting operation is performed using nozzle 13b with nozzle axis AN tilted, component center C is shifted from the correct mounting position Q, and component D is mounted on board B. Furthermore, as shown in FIG. 6(b), when nozzle 13b is rotated, component center C of component D moves according to the rotation angle and is mounted on board B. As a result, as shown in the example of FIG. 6(b), the mounting position deviation amounts ΔX, ΔY, and Δθ differ for each rotation angle of 0°, 90°, 180°, and 270°.

[0041] Immediately after the mounting board manufactured in the component mounting system 1 is changed from the first type board to the second type board, the misalignment information 21b for the second type board is not acquired. Therefore, the first correction value based on the misalignment information 21b for the second type board is not calculated immediately after the change. Therefore, by using the correction value (second correction value) for each rotation angle of the nozzle 13b calculated based on the misalignment information 21b for the first type board immediately after the change, it is possible to perform component mounting work on the second type board by appropriately feeding back the misalignment information 21b, without stopping the component mounting work by the component mounting devices M1 to M4.

[0042] Next, following the flow of FIG. 7 and with reference to FIG. 8, a component mounting method will be described using the component mounting system 1 as an example, in which, when the production model of the mounted board to be manufactured is changed from a first type board to a second type board, the positional deviation information 21b is appropriately fed back to continue the component mounting work.

[0043] 7, it is assumed that a considerable number of boards have been manufactured in component mounting system 1 since the mounted boards to be manufactured were changed to first-type boards, and that component mounting devices M1 to M4 are performing regular component mounting work on the first-type boards. That is, component mounting units 14 of component mounting devices M1 to M4 are mounting components D on boards BA52 to BA53 using the first correction value included in first correction value information 21c (ST1: first component mounting step) (see FIG. 8(a)).

[0044] Furthermore, in the inspection device M5, positional deviation information 21b (first positional deviation information) of the component D mounted on the first type board BA51 is acquired from the imaging results of the inspection camera 6 (ST2: first positional deviation information acquisition step) (see FIG. 8(a)). The acquired first type board positional deviation information 21b (first positional deviation information) is transmitted to the component mounting devices M1 to M4. Thereafter, the first correction value calculation units 24 of the component mounting devices M1 to M4 calculate a first correction value when mounting the component D on the first type board based on the acquired first type board positional deviation information 21b (first positional deviation information) (ST3: first correction value calculation step). The calculated first correction value is stored in the mounting storage unit 21 as first correction value information 21c.

[0045] 7, the second correction value calculation unit 25 of each of the component mounting devices M1 to M4 calculates a second correction value that is independent of the type of board based on the acquired positional deviation information 21b (first positional deviation information) of the first type board (ST4: second correction value calculation step). The calculated second correction value is stored in the mounting storage unit 21 as second correction value information 21d.

[0046] While the board on which component mounting operations are performed by component mounting devices M1 to M4 is the first type board (No in ST5), the first component mounting step (ST1), the first correction value calculation step (ST3), and the second correction value calculation step (ST4) are repeatedly performed by component mounting devices M1 to M4, and the first positional deviation information acquisition step (ST2) is repeatedly performed by inspection device M5. When the board on which component mounting operations are performed is changed from the first type board to the second type board (Yes in ST5), the component mounting devices M1 to M4 perform a board change process.

[0047] In Fig. 8(a), component mounting apparatus M1 is performing component mounting work using the first correction value on board BA55, the last of the first-type boards. When board BA55 is ejected from component mounting apparatus M1, board change processing is executed in component mounting apparatus M1 to switch the target of component mounting work to the second-type board in accordance with instructions from management computer 3. In Fig. 8(b), when the board change processing in component mounting apparatus M1 is completed, board BB1, the first of the second-type boards, is transported to component mounting apparatus M1, and component mounting work is executed using the second correction value. Meanwhile, component mounting apparatus M2 is performing component mounting work using the first correction value on board BA55 of the first-type board.

[0048] In FIG. 8(c), when the component mounting operation using the first correction value for the last board BA55 is completed in component mounting devices M2 to M4, a board change process is executed in sequence to switch the target of the component mounting operation to the second type board.

[0049] 7, when the target of the component mounting operation in component mounting devices M1 to M4 is switched from the first type board to the second type board (Yes in ST5), component mounting units 14 of component mounting devices M1 to M4 mount components D on boards BB1 to BB5 of the second type board using the second correction value included in second correction value information 21d (ST6: second component mounting step) (see FIGS. 8(b) to 8(d)). Next, when the first board BB1 of the second type board is transported to inspection device M5, positional deviation information 21b (second positional deviation information) of component D mounted on board BB1 of the second type board is acquired (ST7: second positional deviation information acquisition step) (see FIG. 8(d)).

[0050] The acquired second-type substrate positional deviation information 21b (second positional deviation information) is transmitted to the component mounting devices M1 to M4. Then, the first correction value calculation units 24 of the component mounting devices M1 to M4 calculate the first correction value (third correction value) when mounting the component D on the second-type substrate BB6 based on the acquired second-type substrate positional deviation information 21b (second positional deviation information) (ST8: third correction value calculation step). The calculated first correction value (third correction value) is stored in the mounting storage unit 21 as first correction value information 21c.

[0051] 8(d), the first substrate BB1 ​​of the second-type substrates is transported to the inspection device M5, and positional deviation information 21b (second positional deviation information) is acquired. The acquired positional deviation information 21b (second positional deviation information) of the substrate BB1 ​​is transmitted to the component mounting devices M1 to M4, and the first correction value (third correction value) is calculated by the first correction value calculation unit 24 of the component mounting devices M1 to M4.

[0052] 7, once the first correction value (third correction value) is calculated (ST8), the component mounting units 14 of the component mounting devices M1 to M4 mount components D on the second-type boards BB3 to BB6 using the first correction value (third correction value) included in the first correction value information 21c (ST9: third component mounting step). That is, the third component mounting step (ST9) using the first correction value (third correction value) is executed for board BB6 by component mounting device M1, board BB5 by component mounting device M2, board BB4 by component mounting device M3, and board BB3 by component mounting device M4 (see FIG. 8(e)).

[0053] In this way, the inspection device M5 (positional deviation information acquisition unit) acquires the positional deviation information 21b of the second type board (ST7), and the first correction value calculation unit 24 calculates the first correction value (third correction value) based on the positional deviation information 21b of the second type board (ST8), and the component mounting unit 14 mounts the component D on the second type board using the first correction value (third correction value) of the second type board (ST9).

[0054] Thereafter, the inspection device M5 acquires misalignment information 21b (second misalignment information) of the component D mounted on the second-type board BB2 (ST10). That is, a second misalignment information acquisition step (ST7) is executed. Next, the first correction value calculation unit 24 of each of the component mounting devices M1 to M4 calculates a first correction value (third correction value) based on the acquired misalignment information 21b (second misalignment information). That is, a third correction value calculation step (ST8) is executed. Furthermore, the second correction value calculation unit 25 of each of the component mounting devices M1 to M4 calculates a second correction value (fourth correction value) that is independent of the type of board based on the acquired misalignment information 21b (second misalignment information) (ST12: fourth correction value calculation step).

[0055] 7, until component mounting work on all second-type boards is completed (No in ST13), component mounting devices M1 to M4 repeatedly execute the third component mounting step (ST9), the third correction value calculation step (ST11 (ST8)), and the fourth correction value calculation step (ST12), and inspection device M5 repeatedly executes the second positional deviation information acquisition step (ST10 (ST7)). This allows positional deviation information 21b of components D mounted on boards BB1 to BB6 to be appropriately fed back to component mounting devices M1 to M4.

[0056] As described above, the component mounting system 1 of this embodiment includes a positional deviation information acquisition unit (inspection device M5) that acquires positional deviation information 21b of components D mounted on boards BB1 to BB6, a first correction value calculation unit 24 that calculates a first correction value (third correction value) when mounting components D on boards BB1 to BB6 based on the positional deviation information 21b, a second correction value calculation unit 25 that calculates a second correction value (fourth correction value) that is a correction value when mounting components D on boards BB1 to BB6 based on the positional deviation information 21b and is independent of the type of board, and a component mounting unit 14 that mounts components D on boards BA51 to BA55 and boards BB1 to BB6.

[0057] Second correction value calculation unit 25 calculates the second correction value based on misalignment information 21b of boards BA51 to BA55, which include at least the first type board, on which components D have been mounted up to now, and when the first type board is switched to the second type board, component mounting unit 14 uses the second correction value to mount components D on boards BB1 to BB5 of the second type board. This allows misalignment information 21b of components D mounted on boards BB1 to BB6 to be appropriately fed back to component mounting devices M1 to M4. [Industrial Applicability]

[0058] The component mounting system, component mounting device, and component mounting method of the present invention have the effect of being able to appropriately feed back positional deviation information of components mounted on a board, and are useful in fields where components are mounted on boards. [Explanation of symbols]

[0059] 1. Component mounting system 13b Nozzle 14 Component mounting section B, BA51~BA55, BB1~BB6 boards D parts M1~M4 component mounting equipment M5 Inspection device (position deviation information acquisition unit)

Claims

1. a positional deviation information acquisition unit that acquires positional deviation information of components mounted on a board; a first correction value calculation unit that calculates a first correction value when mounting the component on the board based on the positional deviation information; a second correction value calculation unit that calculates a second correction value, which is a correction value when mounting a component on a board based on the positional deviation information, and which does not depend on the type of board; a component mounting unit that mounts components on the board, the first correction value calculation unit calculates the first correction value based on the positional deviation information of the first type substrate; the second correction value calculation unit calculates the second correction value based on the positional deviation information of boards on which components have been mounted up to now, the board including at least the first type board; the component mounting unit mounts components on the first-type board using the first correction value; when the first type substrate is switched to the second type substrate, the component mounting unit mounts components onto the second type substrate using the second correction value; Component mounting system.

2. the misalignment information acquisition unit acquires the misalignment information of the second-type substrate, When the first correction value calculation unit calculates the first correction value based on the positional deviation information of the second type substrate, the component mounting unit mounts components on the second-type substrate using the first correction value for the second-type substrate; The component mounting system according to claim 1 .

3. the component mounting unit includes a nozzle that holds a component and rotates it to mount the component on a board at a predetermined rotation angle; the second correction value is a correction value for each rotation angle of the nozzle; The component mounting system according to claim 1 or 2.

4. The second correction value is independent of the type of component and board. The component mounting system according to any one of claims 1 to 3.

5. A first correction value calculation unit that calculates a first correction value when mounting a component on a first type substrate based on positional deviation information of the component mounted on the first type substrate; a second correction value calculation unit that calculates a second correction value that is independent of the type of board based on the positional deviation information of boards on which components have been mounted, the second correction value including at least the first type board; a component mounting unit that mounts components on the board, The component mounting unit includes: Mounting components on the first type board using the first correction value; initially, when the first type substrate is switched to the second type substrate, components are mounted on the second type substrate using the second correction value; Component mounting equipment.

6. Acquire positional deviation information of components mounted on the first type board; calculating a first correction value for mounting the component on the first type substrate based on the positional deviation information of the component mounted on the first type substrate; calculating a second correction value, which is a correction value for mounting components on a substrate based on the positional deviation information of substrates on which components have been mounted up to now, including at least the first type substrate, and which does not depend on the type of substrate; Mounting components on the first type board using the first correction value; initially, when the first type substrate is switched to the second type substrate, components are mounted on the second type substrate using the second correction value; Component mounting method.

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