Mounting device and mounting method

Abstract

To provide a mounting device and a mounting method with which it is possible to suppress an increase in required space and a decrease in productivity.SOLUTION: A mounting device 1 according to an embodiment comprises: a holding tool 311 that holds an electronic component 2; a holding head H that has a heating tool 312 to heat the holding tool 311; a drive mechanism 320 that moves the holding head H in a direction to approach and separate from a mounting object; an air supply unit 350 that supplies cooling air; a plurality of tanks 360 that are filled with the cooling air; a booster unit 370 that boosts the cooling air from the air supply unit 350 and fills the tanks 360 with it; a switching unit 390 that switches whether or not to supply the cooling air from one of the tanks 360 to the holding head H; and a control device 50 that controls the drive mechanism 320 so as to bring the electronic component 2 held by the holding tool 311 into contact with the mounting object, controls a heating tool 312 so as to heat the electronic component 2 via the holding tool 311, and controls the switching unit 390 so as to supply the cooling air from one of the tanks 360 to the holding head H.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a mounting apparatus and a mounting method. [Background technology]

[0002] Chip-type electronic components such as semiconductor elements are mounted on a mounting target such as a substrate and heated to melt the solder bumps for mounting. For example, a batch method is used in which a substrate on which multiple electronic components have been mounted using a mounting device is heated in a reflow furnace to mount multiple electronic components all at once.

[0003] However, in the advanced logic semiconductors used in HPC (high-performance computing) and various servers, electronic components are becoming larger and boards are becoming more multi-layered. As a result, electronic components and boards heated in a reflow furnace are more susceptible to warping due to uneven temperature distribution in the plane and height directions. Warping can damage electronic components.

[0004] To address this issue, there is a local reflow mounting device that heats and mounts electronic components individually. In this local reflow method, a tool holding the electronic components is heated by a pulse heater while the solder bumps of the electronic components are in contact with the electrodes in the mounting area of ​​the board. Once the solder bumps have melted, the tool is cooled to harden the solder. In this local reflow method, the reflow is performed while the electronic components are held in the tool, which helps prevent warping. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-329306 Summary of the Invention [Problem to be solved by the invention]

[0006] When electronic components are large, the tools used to hold them also become larger. This increases the tool's heat capacity, which means it takes longer to cool after heating and reduces productivity. For this reason, tools are cooled by spraying cooling air. Rapid cooling requires a continuous supply of cooling air at a relatively high pressure of around 0.7 MPa. However, the air available in typical factories is at a relatively low pressure of around 0.5 MPa. To address this issue, a large tank of around 20 L can be installed, and the air supplied from the factory is boosted to the required pressure using a pump or other pressure booster, before being filled into the tank and the air is then supplied from the tank. However, installing a large tank in a limited space limits the number of mounting machines that can be installed, reducing productivity.

[0007] An object of the embodiments of the present invention is to provide a mounting apparatus and a mounting method that can suppress an increase in required space and a decrease in productivity. [Means for solving the problem]

[0008] In order to achieve the above-mentioned object, the mounting apparatus of the embodiment includes a holding head having a holding tool that holds an electronic component and a heating tool that heats the holding tool, a drive mechanism that moves the holding head in a direction toward and away from a mounting target, an air supply unit that supplies cooling air, a plurality of tanks that are filled with the cooling air, a pressure increase unit that pressurizes the cooling air from the air supply unit and fills the tanks, a switching unit that switches from which tank the cooling air is supplied to the holding head, and a control device that controls the drive mechanism to bring the electronic component held by the holding tool into contact with the mounting target, controls the heating tool to heat the electronic component via the holding tool, and controls the switching unit to supply the cooling air from one of the tanks to the holding head.

[0009] The mounting method of the embodiment includes a contacting process in which a drive mechanism brings the electronic component held by the holding tool into contact with a mounting target; a heating process in which a heating tool heats the electronic component via the holding tool; and a cooling process in which a switching unit supplies cooling air, which is supplied from an air supply unit and is pressurized, from one of a plurality of tanks to a holding head having the holding tool and the heating tool. [Effects of the Invention]

[0010] The embodiment of the present invention can suppress an increase in required space and a decrease in productivity. [Brief explanation of the drawings]

[0011] [Figure 1] 1A and 1B are a front view and a block diagram showing a control device of a mounting device according to an embodiment of the present invention; [Figure 2] FIG. 1 is a plan view showing a mounting apparatus according to an embodiment. [Figure 3] FIG. 2 is a top perspective view showing the holding head of the embodiment. [Figure 4] FIG. 2 is a bottom perspective view showing the holding head of the embodiment. [Figure 5] FIG. 4 is a cross-sectional view taken along the line AA in FIG. 3. [Figure 6] FIG. 4 is a cross-sectional view taken along the arrow BB in FIG. 3. [Figure 7] FIG. 2 is a diagram showing the configuration of an air supply unit, a tank, a pressure booster unit, and a switching unit. [Figure 8] 4 is a timing chart showing the operation of each part when the embodiment is implemented. [Figure 9] 1 is a flowchart illustrating an implementation procedure according to an embodiment. [Figure 10] 10 is a graph showing a change in the rate of temperature drop of the heating tool due to switching of the pressure of the cooling air. [Figure 11] FIG. 10 is a configuration diagram showing a modified example of the mounting device of the embodiment in which one tank is provided. DETAILED DESCRIPTION OF THE INVENTION

[0012] An embodiment of the present invention (hereinafter referred to as the present embodiment) will be described in detail with reference to the drawings. Note that the drawings are schematic views, and the size, proportions, etc. of each part are exaggerated for ease of understanding. As shown in FIGS. 1 and 2, a mounting apparatus 1 of this embodiment includes a supply device 10, a pickup device 20, a mounting device 30, a substrate stage 40, and a control device 50. The mounting apparatus 1 inverts an electronic component 2 picked up by the pickup device 20 from the supply device 10, transfers it to the mounting device 30, and mounts it on a substrate 3 on the substrate stage 40.

[0013] [Electronic Components] The electronic component 2 is, for example, a rectangular thin piece component. In this embodiment, the electronic component 2 is a semiconductor chip obtained by dividing a wafer into individual pieces. One of the front and back surfaces of the semiconductor chip is a functional surface that functions as a semiconductor element and has solder bumps that serve as electrodes. The substrate 3 on which the electronic component 2 is mounted is a printed circuit board on which conductive patterns are formed in positions corresponding to the solder bumps.

[0014] [Feeding device] The supply device 10 is a device that supplies electronic components 2 to the pickup device 20. The supply device 10 moves the electronic components 2 to be picked up to a supply position P1. The supply position P1 is the position where the pickup device 20 picks up the electronic components 2 to be picked up. The supply device 10 includes a supply stage 12 that supports a sheet 11 to which the electronic components 2 are attached, and a stage movement mechanism 13 that moves the supply stage 12. The stage movement mechanism 13 can be, for example, a linear guide in which a slider moves on a rail using a ball screw mechanism driven by a servo motor.

[0015] The sheet 11 to which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown). The electronic components 2 are arranged in a matrix on the sheet 11. In this embodiment, the electronic components 2 are arranged face-up with their functional surfaces exposed upward.

[0016] The supply stage 12 is a platform that horizontally supports the wafer ring to which the sheet 11 is attached. In other words, the supply stage 12 supports the sheet 11 to which the electronic components 2 are attached via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by a stage movement mechanism 13. Since the sheet 11 is supported horizontally by the stage movement mechanism 13 together with the supply stage 12, the sheet 11 and the electronic components 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction.

[0017] 1, the horizontal direction in which the supply device 10 and the mounting device 30 are aligned is referred to as the X-axis direction, and the direction perpendicular to the X-axis is referred to as the Y-axis direction. Furthermore, the direction perpendicular to the plane of the sheet 11 is referred to as the Z-axis direction or the up-down direction. The upward direction is the direction toward the side of the plane of the sheet 11 where the electronic components 2 are placed, and the downward direction is the direction toward the side of the plane of the sheet 11 where the electronic components 2 are not placed. Furthermore, the position in the Z-axis direction is referred to as the height position.

[0018] [Pickup device] The pickup device 20 is a device that picks up the electronic components 2 from the supply device 10 and transfers the picked-up electronic components 2 to the mounting device 30. The pickup device 20 includes a pickup nozzle 21, a moving mechanism 22, a reversing mechanism 23, and a push-up mechanism 24.

[0019] (Pickup nozzle) The pick-up nozzle 21 is a mechanism that sucks and holds the electronic component 2 and releases the suction hold to release the electronic component 2. The pick-up nozzle 21 has a nozzle hole that opens to the suction surface at the tip of the pick-up nozzle 21. The nozzle hole is connected to a negative pressure generating circuit (not shown) that includes a vacuum pump or the like, and the circuit generates negative pressure to suck and hold the electronic component 2 on the suction surface of the pick-up nozzle 21. The held state of the electronic component 2 is released from the suction surface by releasing the negative pressure.

[0020] The movement mechanism 22 is a mechanism that moves the pickup nozzle 21 back and forth between the supply position P1 and the transfer position P2, and also raises and lowers the pickup nozzle 21 between the supply position P1 and the transfer position P2. The transfer position P2 is a position where the pickup device 20 transfers the electronic component 2 picked up at the supply position P1 to the holding head H, which will be described later. The supply position P1 and the transfer position P2 refer mainly to positions in the XY directions, and do not necessarily refer to positions in the Z axis direction.

[0021] (Moving mechanism) Movement mechanism 22 has an arm 22a to which pickup nozzle 21 is attached, and moves pickup nozzle 21 by moving arm 22a. Movement mechanism 22 also includes a slide mechanism 22b and an elevating mechanism 22f. Slide mechanism 22b moves arm 22a to which pickup nozzle 21 is attached, thereby reciprocating pickup nozzle 21 between supply position P1 and transfer position P2. Here, slide mechanism 22b extends parallel to the X-axis direction and includes rail 22d fixed to support frame 22c, and slider 22e that runs on rail 22d. Although not shown, slider 22e is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

[0022] Elevating mechanism 22f moves pickup nozzle 21 up and down by moving arm 22a to which pickup nozzle 21 is attached. Specifically, elevator mechanism 22f can use a linear guide in which a slider moves on a rail using a ball screw mechanism driven by a servo motor. That is, pickup nozzle 21 moves up and down along the Z-axis direction as the servo motor is driven.

[0023] (reversal mechanism) Reversing mechanism 23 is provided between pickup nozzle 21 and moving mechanism 22. In this case, reversing mechanism 23 is an actuator including a drive source such as a motor and a rotation guide such as a ball bearing, which rotates arm 22a to change the orientation of pickup nozzle 21. Changing the orientation means rotating the pickup nozzle 21 by 0° to 180° in the vertical direction.

[0024] (Push-up mechanism) The push-up mechanism 24 is provided below the sheet 11 of the supply device 10. The push-up mechanism 24 has a push-up body 24a, a backup body 24b, and a drive mechanism (not shown). The push-up body 24a is a member made up of multiple blocks. The backup body 24b is provided so that the length of the push-up body 24a is parallel to the Z-axis direction. The drive mechanism is provided on the backup body 24b and advances or retracts the blocks of the push-up body 24a from its interior. This advancement or retraction occurs in the vertical direction. The drive mechanism includes, for example, a slider that moves while being guided by a vertical rail, and an air cylinder or cam mechanism that drives the slider.

[0025] [Onboard equipment] The mounting device 30 is a device that mounts the electronic component 2 on the substrate 3. The mounting device 30 mounts the electronic component 2 received from the pickup device 20 by transporting it to a mounting position P3 and mounting it on the substrate 3. The mounting position P3 is the position where the electronic component 2 is mounted on the substrate 3. The mounting position P3 mainly refers to a position in the XY direction, and does not necessarily refer to a position in the Z axis direction. The mounting device 30 has a holding unit 310, a driving mechanism 320, a tool suction unit 330, a component suction unit 340, an air supply unit 350, a tank 360, a pressure boosting unit 370, a pressure detection unit 380, and a switching unit 390 (see FIG. 7).

[0026] (holding part) The holding unit 310 receives the electronic component 2 from the pickup nozzle 21 at the transfer position P2 and mounts the electronic component 2 on the board 3 at the mounting position P3. Specifically, as shown in FIGS. 1 to 4, the holding unit 310 has a holding head H and a bonding head 315. The holding head H has a holding tool 311 that holds the electronic component 2 and a heating tool 312 that heats the holding tool 311. In addition to the holding tool 311 and the heating tool 312, the holding head H of this embodiment also has a heat insulating material 313 and a mounting base 314. The holding head H is attached to the bonding head 315, which will be described later.

[0027] The holding tool 311 holds the electronic component 2 and is released from the electronic component 2 after mounting. As shown in FIGS. 4, 5, and 6, the holding tool 311 is a rectangular plate that is larger than the electronic component 2. As shown in FIG. 4, a plate-shaped protrusion 311a is formed on the lower surface of the holding tool 311. The lower surface of the protrusion 311a has the same size and shape as the upper surface of the electronic component 2. The lower surface of this protrusion 311a is a holding surface 311b that contacts the upper surface of the electronic component 2 and holds the electronic component 2.

[0028] A suction port 311c is provided at the center of the holding surface 311b of the holding tool 311. As shown in Fig. 5, the suction port 311c is connected to a component suction hole 311d that penetrates the holding tool 311 in the vertical direction. Furthermore, as shown in Fig. 4, a lattice-shaped groove 311e including the suction port 311c is formed in the holding surface 311b. Therefore, when negative pressure is supplied to the component suction hole 311d, the negative pressure acts on the entire groove 311e via the suction port 311c, and the top surface of the electronic component 2 is sucked and held on the holding surface 311b.

[0029] The heating tool 312 is a pulse heating tool (pulse heater) that generates resistance heat by passing an electric current through it. As shown in FIG. 4, the heating tool 312 of this embodiment is a rectangular plate. The lower surface of the heating tool 312 has the same shape and size as the upper surface of the holding tool 311. As shown in FIG. 5, the heating tool 312 is provided with a plurality of tool suction holes 312a that penetrate in the vertical direction. By applying negative pressure to the tool suction holes 312a, the upper surface of the holding tool 311 is sucked and held by the lower surface of the heating tool 312. In addition, the heating tool 312 is provided with component suction holes 312b that penetrate in the vertical direction and are connected to the component suction holes 311d of the holding tool 311.

[0030] 3 to 6, two rows of cooling grooves 312c are formed on the upper surface of the heating tool 312. Both ends of the cooling grooves 312c reach two opposite side surfaces of the heating tool 312. The heating tool 312 is provided with a temperature detection unit 312d (see FIG. 1) that detects the temperature of the heating tool 312.

[0031] As shown in FIGS. 3 and 4, the heat insulating material 313 is a rectangular parallelepiped block with thermal insulation properties. The lower surface of the heat insulating material 313 has the same shape and size as the upper surface of the heating tool 312. The upper surface of the heating tool 312 is attached to the lower surface of the heat insulating material 313. As shown in FIG. 5, the heat insulating material 313 is provided with tool suction holes 313a that extend vertically and communicate with the tool suction holes 312a of the heating tool 312. The heat insulating material 313 is also provided with component suction holes 313b that extend vertically and communicate with the component suction holes 312b of the heating tool 312. Furthermore, the heat insulating material 313 is provided with cooling holes 313c that extend vertically and communicate with the cooling grooves 312c of the heating tool 312, as shown in FIG. 6.

[0032] As shown in Figures 3 and 4, the mounting base 314 is a rectangular metal block. The lower surface of the mounting base 314 is rectangular and larger than the upper surface of the thermal insulation material 313. The upper surface of the thermal insulation material 313 is attached to the lower surface of the mounting base 314. As shown in Figure 5, tool suction holes 314a, which communicate with tool suction holes 313a of the thermal insulation material 313, are formed to penetrate the mounting base 314 in the vertical direction. In addition, component suction holes 314b, which communicate with component suction holes 313b of the thermal insulation material 313, are formed to penetrate the mounting base 314 in the vertical direction.

[0033] Furthermore, as shown in Fig. 6, the mounting base 314 is provided with cooling holes 314c that communicate with the cooling holes 313c of the heat insulating material 313. The cooling holes 314c extend from below to above, bend horizontally, and their ends reach and open on two opposing side surfaces of the mounting base 314. There are four cooling holes 314c, and as shown in Figs. 3 and 4, two openings are provided at each end on each of the two side surfaces of the mounting base 314. Each opening is fitted with a fitting 314d to which a pipe (not shown) is connected.

[0034] The tool suction holes 314a, 313a, and 312a are continuous ventilation paths for suction-holding the holding tool 311 to the heating tool 312. The component suction holes 314b, 313b, 312b, and 311d are continuous ventilation paths for suction-holding the electronic component 2 to the holding tool 311 via the suction port 311c. The cooling holes 314c and 313c and the cooling groove 312c are continuous ventilation paths for cooling the heating tool 312.

[0035] Bonding head 315 (see FIG. 1) has mounting base 314 attached to its bottom, thereby supporting holding head H. Bonding head 315 moves between transfer position P2 and mounting position P3 together with mounting base 314, heat insulating material 313, and holding tool 311. Bonding head 315 also moves downward to press-bond electronic component 2 held by holding tool 311 to substrate 3, and then moves upward to detach holding tool 311, which has released electronic component 2, from electronic component 2.

[0036] The holding head H is supported by the bonding head 315 so as to be movable up and down. The holding head H is biased downward by an elastic body such as a spring (not shown). This allows the height position of the holding tool 311 of the holding head H to be displaced relative to the bonding head 315.

[0037] (Drive mechanism) 1 and 2, the driving mechanism 320 is a mechanism that moves the holding head H back and forth between the transfer position P2 and the mounting position P3, and also moves the holding head H up and down between the transfer position P2 and the mounting position P3. The driving mechanism 320 of this embodiment moves the holding head H in a direction toward and away from the substrate 3 via the bonding head 315. Specifically, the driving mechanism 320 includes a slide mechanism 321 and an elevation mechanism 322.

[0038] The slide mechanism 321 moves the bonding head 315 back and forth between the transfer position P2 and the mounting position P3. Here, the slide mechanism 321 extends parallel to the X-axis direction and has two rails 321b fixed to a support frame 321a, and a slider 321c that runs on the rails 321b. Although not shown, the slider 321c is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

[0039] Although not shown, the slide mechanism 321 has a slide mechanism that slides the bonding head 315 in the Y-axis direction. This slide mechanism can also be configured with a rail in the Y-axis direction and a slider that runs on the rail. The slider is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

[0040] The lifting mechanism 322 moves the bonding head 315 up and down. Specifically, the lifting mechanism 322 can use a linear guide in which a slider 322c moves on a rail 322b using a ball screw mechanism driven by a servo motor 322a. That is, the bonding head 315 moves up and down along the Z-axis direction by driving the servo motor 322a.

[0041] The bonding head 315 is provided with a contact detection unit 316 (see FIG. 1) that detects contact of the electronic component 2 held by the holding tool 311 with the substrate 3. The contact detection unit 316 uses a gap sensor that detects contact of the electronic component 2 held by the holding tool 311 with the substrate 3 based on the amount of displacement in the relative height positions of the holding tool 311 and the bonding head 315. When the electronic component 2 comes into contact with the substrate 3, the displacement of the holding tool 311 stops, while the bonding head 315 continues to descend, causing a change in the distance between them. When the gap of the gap sensor, which reflects this change in distance, becomes larger than a preset threshold, contact is detected.

[0042] (Tool suction part) The tool suction unit 330 (see FIG. 1) applies negative pressure to the tool suction holes 312a of the heating tool 312, thereby suction-holding the holding tool 311 to the heating tool 312. The tool suction unit 330 has a negative pressure generating circuit (not shown) including a vacuum pump connected to the tool suction holes 314a of the mounting base 314 via piping. The negative pressure generating circuit generates negative pressure in the tool suction holes 312a via the tool suction holes 314a and 313a, thereby suction-holding the holding tool 311 to the underside of the heating tool 312. In addition, by releasing the negative pressure, the holding state of the holding tool 311 by the heating tool 312 is released. This makes it possible to replace the holding tool 311 depending on the size and type of the electronic component 2.

[0043] (Parts suction part) The component suction unit 340 (see FIG. 1) applies negative pressure to the suction port 311c of the holding tool 311, thereby suction-holding the electronic component 2 onto the holding tool 311. The component suction unit 340 has a negative pressure generation circuit (not shown) including a vacuum pump connected via piping to the component suction hole 314b of the mounting base 314. The negative pressure generation circuit generates negative pressure at the suction port 311c via the component suction holes 314b, 313b, 312b, and 311d, thereby suction-holding the electronic component 2 onto the holding surface 311b of the holding tool 311. Furthermore, by releasing the negative pressure, the electronic component 2 is released from the holding state of the holding surface 311b.

[0044] (Air supply section) 7, the air supply unit 350 cools the holding tool 311 by supplying cooling air to the holding head H. The air supply unit 350 is a pipe connected to an air supply source in the factory. The cooling air from the air supply unit 350 is relatively low-pressure air, for example, about 0.5 MPa.

[0045] (tank) The tank 360 is a tank filled with pressurized cooling air. In this embodiment, as shown in FIG. 7, two tanks 360 are installed. The capacity of each tank 360 is equal to or greater than the supply amount of cooling air required for one mounting of the electronic component 2. For example, a tank 360 with a relatively small capacity of about 10 L is used. In this embodiment, one tank is referred to as tank 360A and the other as tank 360B, and when there is no need to distinguish between the two, they are referred to as tanks 360.

[0046] (Boost section) The pressure increasing unit 370 increases the pressure of the cooling air from the air supply unit 350 and fills the tank 360. "Increasing the pressure" here means increasing the pressure higher than the pressure of the cooling air from the air supply unit 350. The pressure increasing unit 370 in this embodiment is a pressure increasing valve provided on a pipe branching from the air supply unit 350 and connected to each tank 360. Note that the pressure increasing unit 370 may be any unit that can fill the tank 360 with cooling air and increase the pressure, and may be, for example, an electric pump (compressor) driven by a motor.

[0047] (Pressure detection section) The pressure detection unit 380 detects the pressure of the tank 360. The pressure detection unit 380 is a pressure gauge provided in the pipe between the tank 360 and a switching unit 390, which will be described later.

[0048] (Switching section) The switching unit 390 switches from which tank 360 cooling air is supplied to the holding head H. The switching unit 390 can also supply cooling air from the air supply unit 350 without passing through the tank 360. In other words, the switching unit 390 can switch the supply source of cooling air between the air supply unit 350, the tank 360A, and the tank 360B. The switching unit 390 can be, for example, a three-way solenoid valve connected to the piping from the tank 360A, the piping from the tank 360B, and the piping of the air supply unit 350.

[0049] [Substrate stage] The substrate stage 40 is a platform that supports the substrate 3 on which the electronic component 2 is to be mounted. The substrate stage 40 is provided on a stage movement mechanism 41. The stage movement mechanism 41 is a movement mechanism that slides the substrate stage 40 on the XY plane and positions the intended mounting position of the electronic component 2 on the substrate 3 at a mounting position P3. The stage movement mechanism 41 can be, for example, a linear guide in which a slider moves on a rail using a ball screw mechanism driven by a servo motor.

[0050] [Control device] The control device 50 controls the start, stop, speed, operation timing, etc. of the supply device 10, pickup device 20, mounting device 30, and substrate stage 40. The control device 50 has a processor that executes programs, a memory that stores various information such as programs and operating conditions, and a drive circuit that drives each element to realize various functions of the mounting device 1. As shown in FIG. 1, the control device 50 is connected to an input device 60 through which an operator inputs instructions and information necessary for control, and a display device 70 for checking the status of the device. The input device 60 can be a switch, a touch panel, a keyboard, a mouse, etc. The display device 70 can be a liquid crystal, an organic electroluminescence (EL), etc.

[0051] The control device 50 of this embodiment has a mechanism control unit 51, a suction control unit 52, a heating control unit 53, a switching control unit 54, a filling unit 55, and a memory unit 56. The mechanism control unit 51 controls the mechanisms of the supply device 10, the pickup device 20, the mounting device 30, and the substrate stage 40. For example, in this embodiment, the mechanism control unit 51 controls the drive mechanism 320 to lower the bonding head 315 and bring the electronic component 2 held by the holding tool 311 into contact with the substrate 3. The mechanism control unit 51 also controls the drive mechanism 320 to raise the bonding head 315 and separate the holding tool 311, which has released the electronic component 2, from the electronic component 2.

[0052] The suction control unit 52 controls the tool suction unit 330 to apply negative pressure to the tool suction holes 312a of the heating tool 312, thereby holding the holding tool 311. In addition, the suction control unit 52 controls the component suction unit 340 to apply negative pressure to the suction ports 311c of the holding tool 311, thereby holding the electronic component 2.

[0053] The heating control unit 53 controls the heating tool 312 to heat the electronic component 2 via the holding tool 311. "Heating" here refers to heating to the melting temperature of the solder bumps. Therefore, heating also includes preheating to a temperature at which the solder bumps do not melt and then raising the temperature from that preheated state to the melting temperature. The switching control unit 54 controls the switching unit 390 to supply cooling air to the holding head H from either the air supply unit 350 or the tanks 360A and 360B. The filling unit 55 controls the pressure boosting unit 370 to fill the tank 360 with pressurized cooling air from the air supply unit 350.

[0054] The storage unit 56 is a storage device that includes various types of memory (such as a hard disk drive (HDD) or a solid state drive (SSD)) that are storage media, and an interface between the storage media and the outside. The storage unit 56 stores data and programs necessary for the operation of the mounting device 1. The necessary data includes, for example, a predetermined height position, a predetermined threshold value, a predetermined time, a predetermined temperature, and the like.

[0055] [Operation] The operation of mounting electronic components 2 face-down on substrate 3 using mounting apparatus 1 as described above will be described below with reference to FIGS. 1 to 7 as well as FIGS. 8 and 9. That is, pickup device 20 moves pickup nozzle 21 to supply position P1 where push-up body 24a is located, and positions the tip of pickup nozzle 21 opposite push-up body 24a. Meanwhile, supply device 10 moves supply stage 12 and positions electronic component 2 to be picked up at supply position P1. Then, pickup nozzle 21 descends and approaches electronic component 2.

[0056] Pick-up nozzle 21 descends until it comes into contact with electronic component 2, and then stops. At this time, electronic component 2 is sandwiched between pickup nozzle 21 and push-up body 24a. Then, with pickup nozzle 21 stopped, suction begins by exhausting air from the nozzle hole. In this state, push-up body 24a rises, and pickup nozzle 21 rises in sync with this, until push-up body 24a stops when it has risen a predetermined amount that allows electronic component 2 to be peeled off sheet 11. Then, as pickup nozzle 21 continues to rise, electronic component 2 is sucked in and peeled off sheet 11, and picked up.

[0057] After picking up the electronic component 2, the pickup device 20 moves the picked-up electronic component 2 to a transfer position P2 using the movement mechanism 22. At this time, the pickup device 20 inverts the pickup nozzle 21 using the inversion mechanism 23. This inverts the picked-up electronic component 2. At the transfer position P2, the holding tool 311 of the mounting device 30 is on standby and faces the electronic component 2 held by the inverted pickup nozzle 21. The bonding head 315 is lowered toward the pickup nozzle 21, and the electronic component 2 is held by the holding tool 311 through suction. After that, the pickup nozzle 21 releases the negative pressure, and the electronic component 2 is transferred to the holding tool 311. The holding tool 311 then rises away from the pickup nozzle 21 and moves to the mounting position P3.

[0058] Thereafter, lifting mechanism 322 drives bonding head 315 to lower holding tool 311, and mounts electronic component 2 by placing the mounting surface of electronic component 2 on the mounting surface of substrate 3. The procedure for this mounting operation will be described with reference to the timing chart in Fig. 8 and the flowchart in Fig. 9. In Fig. 8, the displacement in the Z-axis direction is the amount of displacement of the height position at which control device 50 controls lifting mechanism 322.

[0059] In the initial state, the bonding head 315 is at the origin position. In the initial state, the pressure in the tank 360 (360A, 360B) is filled with cooling air required for cooling in one mounting operation, and is 0.7 MPa or higher, which is higher than the 0.5 MPa pressure of the air supply unit 350. In FIG. 8, the tank 360A is indicated as tank A, and the tank 360B is indicated as tank B. The heating tool 312 is preheated to 90°C, a temperature at which the solder bumps harden without melting. Note that the horizontal axis in FIG. 8 represents time, but the Z-axis displacement, the temperature of the heating tool 312, the flow rate of the cooling air, and the pressure in the tank 360 are shown as schematic diagrams of the changes in each quantity.

[0060] First, the lifting mechanism 322 drives the bonding head 315 to lower the holding tool 311 from the origin position at high speed, and then switches to a low speed at a predetermined height (step S101). This is to prevent the occurrence of an impact pressure force that may damage the electronic component 2 held by the holding tool 311 when it comes into contact with the substrate 3, and a descent speed that does not generate such a pressure force is set. In other words, in order to shorten the mounting takt time, the predetermined height is set so that the descent time is as short as possible and the speed is switched to a low speed that is sufficiently decelerated and stable without causing an impact when it comes into contact.

[0061] Even when the electronic component 2 comes into contact with the substrate 3 and the holding tool 311 stops (timing a in FIG. 8), the bonding head 315 continues to descend until the gap detected by the contact detection unit 316, which is a gap sensor, exceeds a threshold value (NO in step S102). When contact is detected by the gap exceeding the threshold value (YES in step S102), the lifting mechanism 322 stops (step S103). In this way, the electronic component 2 held by the holding tool 311 is pressed toward the substrate 3 until contact is detected.

[0062] 8 shows that the Z-axis direction displacement of the lifting mechanism 322 continues to descend even after the timing a has passed. Also, the contact detection output of the gap sensor continues to rise (the gap widens) even after the timing a has passed. The contact detection signal indicates a signal that rises when the gap detected by the contact detection unit 316 exceeds a threshold value. This rising edge of the Z-axis direction displacement indicates that the lifting mechanism 322 has stopped, and the descent has stopped.

[0063] When the lifting mechanism 322 stops and the descent of the bonding head 315 stops, the heating tool 312 is switched to a high temperature (step S104). That is, when the contact detection signal rises, the heating temperature of the heating tool 312 is switched. The temperature to be switched is, for example, 320°C, which is the melting temperature of the solder bumps, as shown in the heating temperature setting in FIG. 8. When the solder bumps melt, the pressed-in holding tool 311 slightly lowers, and the gap detected by the contact detection unit 316 changes. Based on this change, a melt detection signal is raised to detect that melting has occurred (YES in step S105). As shown in the Z-axis displacement, the bonding head 315 rises by the amount of the descent of the holding tool 311 so that a predetermined gap is maintained between the holding tool 311 and the substrate 3 (step S106).

[0064] 8, the heating temperature is switched based on the contact detection signal, and the switching of the heating temperature of the heating tool 312 is shown as the heating temperature. The graph of the tool temperature rises accordingly, reaching 320°C, the melting temperature of the solder bumps. The graph shows the contact detection output of the gap sensor beginning to decrease as the solder melts and the holding tool 311 descends. The graph also shows the rise of the solder bump melting detection signal when the predetermined threshold is reached. The graph shows the Z-axis displacement rising based on the rising edge of the solder bump melting detection signal and stopping at a predetermined height.

[0065] When a predetermined time has elapsed since melting was detected (YES in step S107), the temperature setting of the heating tool 312 is switched to a low temperature of 90°C, and the switching unit 390 starts supplying cooling air from the air supply unit 350 to the holding head H (step S108). The pressure of this cooling air is a relatively low 0.5 MPa. In other words, before the supply of high-pressure cooling air, an initial cooling step is carried out in which low-pressure cooling air is supplied.

[0066] In Figure 8, after the time required for the holding tool 311 and the substrate 3 to form a predetermined distance has elapsed since the solder bump melting detection signal rose, the heating tool 312 switches over to a different heating mode, as shown by the graph of the heating temperature setting changing from 320°C to 90°C. The graph of the tool temperature also begins to drop. The rising of the air supply signal also indicates that the air supply unit begins to supply cooling air at the same time as the heating temperature setting is switched over. The graph of the cooling flow rate (pressure) shows that the cooling air flow rate (pressure) gradually rises to 0.5 MPa.

[0067] When the temperature detected by the temperature detection unit 312d drops to the predetermined temperature of 200°C (YES in step S109), the switching unit 390 starts supplying cooling air from one of the tanks 360A (step S110). The pressure of the cooling air at this time is a relatively high 0.7 MPa. When the temperature detected by the temperature detection unit 312d drops to the predetermined temperature of 90°C (YES in step S111), the supply of cooling air from the tank 360A is stopped (step S111). The predetermined temperature of 200°C is the temperature at which the rate of temperature decrease changes when the supply amount (flow rate) of cooling air is changed, as will be described later. With the holding tool 311 and the substrate 3 maintaining a predetermined distance, the solder bumps of the electronic component 2 melt and then harden. This allows the electronic component 2 to be mounted on the substrate 3.

[0068] 8 shows that when the tool temperature drops to 200°C, the supply signal from the air supply unit 350 falls, and the supply of cooling air from the air supply unit 350 to the holding head H is stopped. At the same time, the graph for supply from tank 360A rises, indicating that the supply of cooling air at 0.7 MPa from tank 360A to the holding head H has begun (see cooling flow rate (pressure)). Furthermore, when the tool temperature reaches 90°C, cooling is turned off, the graph for supply from tank 360A falls, the graph for cooling flow rate (pressure) becomes zero, the supply of cooling air from tank 360A is stopped, and the supply of cooling air to the holding head H is stopped.

[0069] After the mounting of the electronic component 2 is completed, the negative pressure at the suction port 311c of the holding tool 311 is released, and the bonding head 315 rises, causing the holding tool 311 to separate from the electronic component 2 and return to the origin position (step S112). At the same time, the pressure-increasing unit 370 starts increasing the pressure by supplying cooling air from the air supply unit 350 to the tank 360A, which has already been supplied with cooling air (step S113). In FIG. 8, when the cooling is turned off, the graph of Z-axis displacement rises, indicating that the lifting mechanism 322 rises. This indicates that the bonding head 315 is rising. The graph of tank 360A pressure shows the pressure of the cooling air in the tank 360A, and indicates how the pressure decreases as the supply of cooling air to the tank 360A begins. Furthermore, when the cooling is turned off, the tank 360A begins to be filled with cooling air, and the pressure increases.

[0070] Thereafter, if there is a next electronic component 2 to be mounted (YES in step S114), mounting is performed using the same procedure as above with the holding tool 311 holding the next electronic component 2. In this case, the tank 360 that supplies cooling air is tank 360B, which was not used last time. Furthermore, for tank 360A that was used last time, filling with cooling air from air supply unit 350 is completed while the electronic component 2 is being mounted. In this way, tank 360A and tank 360B are alternately used and filled with air, and mounting of electronic components 2 is repeated. If there are no more electronic components 2 to be mounted (NO in step S114), the process ends.

[0071] [effect] (1) The mounting apparatus 1 of this embodiment includes a holding head H having a holding tool 311 that holds an electronic component 2 and a heating tool 312 that heats the holding head H; a drive mechanism 320 that moves the holding head H in a direction toward and away from the mounting target; an air supply unit 350 that supplies cooling air; a plurality of tanks 360 that are filled with cooling air; a pressure increase unit 370 that pressurizes the cooling air from the air supply unit 350 and fills the tank 360; a switching unit 390 that switches from which tank 360 cooling air is supplied to the holding head H; and a control device 50 that controls the drive mechanism 320 to bring the electronic component 2 held by the holding tool 311 into contact with the mounting target, controls the heating tool 312 to heat the electronic component 2 via the holding tool 311, and controls the switching unit 390 to supply cooling air from one of the tanks 360 to the holding head H.

[0072] The mounting method of this embodiment also includes a contacting step in which the driving mechanism 320 brings the electronic component 2 held by the holding tool 311 into contact with a mounting target; a heating step in which the heating tool 312 heats the electronic component 2 via the holding tool 311; and a cooling step in which the switching unit 390 supplies cooling air to the holding head H having the holding tool 311 and the heating tool 312 from one of the multiple tanks 360 that has pressurized cooling air supplied from the air supply unit 350.

[0073] Therefore, by switching between multiple tanks 360 with increased pressure of cooling air from air supply unit 350 and supplying cooling air to cool the electronic components 2, it is possible to mount multiple electronic components 2 consecutively, thereby reducing the capacity of each tank 360 and suppressing an increase in the required space and a decrease in productivity. Furthermore, since the solder bumps are melted and hardened while the electronic components 2 are held by holding tool 311, it is possible to suppress the occurrence of warping.

[0074] (2) The control device 50 of the mounting apparatus 1 controls the pressure-increasing unit 370 to fill cooling air into tanks 360 other than the tank 360 that supplies cooling air to the holding head H. The mounting method also includes a pressure-increasing step in which the pressure-increasing unit 370 increases the pressure of cooling air and fills the tanks 360 other than the tank 360 that supplies cooling air to the holding head H. Note that if there are multiple tanks 360 other than the tank 360 that supplies cooling air to the holding head H, the cooling air may be filled into any one, multiple, or all of these tanks 360.

[0075] Therefore, while one of the tanks 360 is being cooled by cooling air, the other tanks 360 can be pressurized, so no lost time occurs and high productivity can be ensured.

[0076] (3) The control device 50 of the mounting device 1 controls the switching unit 390 to supply cooling air from the air supply unit 350 to the holding head H without passing through the tank 360 after heating by the heating tool 312 and before supplying cooling air from the tank 360 to the holding head H. The mounting method also includes an initial cooling step in which cooling air from the air supply unit 350 is supplied to the holding head H without passing through the tank 360 after the heating step and before the cooling step.

[0077] Generally, the cooling time can be shortened by increasing the amount of cooling air supplied per unit time, but the total supply amount also increases. This supply amount can be increased as the supply pressure increases. After extensive research, the inventors discovered that the amount of cooling air supplied (flow rate) has almost no effect on the rate of temperature reduction until the temperature drops to a certain level. Figure 10 shows the relationship between the temperature of the holding head H and cooling time. The vertical axis represents the temperature of the holding head H, and the horizontal axis represents time. The solid line in the figure shows the temperature change when cooling air is supplied to the holding head H at low pressure (0.5 MPa), while the dotted line shows the temperature change when cooling air is subsequently supplied to the holding head H at high pressure (0.7 MPa). From this temperature change, it can be seen that when the cooling air supply pressure is high, i.e., when the supply flow rate is high, the holding head H can be cooled from 320°C to 80°C in α seconds (as shown by the dotted line), and the same cooling can be achieved in β seconds (as shown by the solid line). In this case, β > α. In other words, FIG. 10 shows that the higher the supply pressure of cooling air, the shorter the cooling time.

[0078] However, it can be seen that the temperature of the holding head H reaches 200°C in the same amount of time whether the cooling air supply pressure is low or high (stage [1]). It can also be seen that below 200°C, cooling takes a shorter time when high pressure is used (stage [2]). Therefore, in this embodiment, low-pressure cooling air is supplied from the air supply unit 350 without going through the high-pressure tank 360 until a predetermined temperature is reached, and high-pressure cooling air is supplied from the tank 360 after the predetermined temperature is reached.

[0079] For example, as shown by the solid line in Figure 10, the cooling air pressure is low (0.5 MPa) until the temperature drops from 320°C to 200°C (stage [1]). Next, as shown by the dotted line in Figure 10, the pressure is switched from 200°C to high (0.7 MPa), and the temperature is rapidly lowered to 80°C (stage [2]). By switching in this way, the holding head H can be cooled from 320°C to 80°C in α seconds (s). If this switching were not performed and the pressure were low, it would take longer to drop to 80°C (β > α), as shown by the solid line in Figure 10.

[0080] This reduces the total amount of cooling air supplied, and by making the capacity of the tank 360 smaller, it is possible to prevent an increase in the required space. Also, by increasing the pressure of the cooling air at the stage [2] when the temperature difference between the cooling air and the heating tool 312 is small, it is possible to improve the cooling efficiency and shorten the cooling time. This prevents the equipment from becoming larger and allows for faster pressure increase cycles, improving productivity.

[0081] (4) The control device 50 of the mounting apparatus 1 controls the switching unit 390 to supply cooling air from the air supply unit 350 to the holding head H without passing through the tank 360, and then, when the temperature of the heating tool 312 reaches a predetermined temperature, causes cooling air from one of the tanks 360 to be supplied to the holding head H. This makes it possible to switch to the tank 360 at a timing when the amount of cooling air supplied reaches a temperature that affects the rate at which the temperature drops. This makes it possible to more reliably reduce the total amount of cooling air supplied, and by making the capacity of the tank 360 smaller, it is possible to prevent an increase in the required space.

[0082] (5) The control device 50 of the mounting device 1 controls the switching unit 390 to switch the tank 360 that supplies cooling air to the holding head H for each mounting of an electronic component 2. Therefore, the capacity of the tank 360 only needs to be the capacity required for cooling when mounting one electronic component 2, so the capacity of the tank 360 can be reduced and the timing of switching can be easily controlled.

[0083] [Variations] The present invention is not limited to the above-described embodiment. The following modifications can also be applied while maintaining the same basic configuration as the above-described embodiment. (1) In the above embodiment, the tank 360 is switched after each mounting of the electronic component 2. However, it may be switched when the required pressure is no longer present. This makes it easier to ensure time for filling another tank 360. For example, the control device 50 may switch the tank 360 supplying cooling air to the holding head H when the pressure detected by the pressure detection unit 380 of the tank 360 supplying cooling air falls below a predetermined threshold. This allows the tank 360 to be switched when it is determined that the required pressure (remaining amount) for cooling is no longer present, even during mounting, thereby preventing the cooling air from running out during mounting. Since multiple tanks 360 can be used in a connected manner, even if the required tank capacity changes due to a change in the type of electronic component 2, mounting can be performed with the same configuration. Furthermore, the capacity of each tank can be reduced, resulting in a smaller mounting device 1.

[0084] (2) In the above embodiment, cooling air is supplied from the tank 360 when the temperature of the heating tool 312 reaches a predetermined temperature. However, cooling air may be supplied from the tank 360 to the holding head H when a predetermined time has elapsed since the air supply unit 350 started to supply cooling air to the holding head H without using the tank 360. The predetermined time may be determined, for example, by actually measuring the time from the start of the supply of low-pressure cooling air until the temperature drops from 320°C to 200°C.

[0085] (3) The number of tanks 360 may be more than two. The switching unit 390 may be able to switch between three or more small tanks 360 to supply high-pressure cooling air.

[0086] 1 and 11, the number of tanks 360 may be one. That is, as shown in FIG. 1 and FIG. 11, the number of tanks 360 may be one, including a holding head H having a holding tool 311 for holding an electronic component 2 and a heating tool 312 for heating the holding tool 311, a driving mechanism 320 for moving the holding head H in a direction toward or away from the mounting target, an air supply unit 350 for supplying cooling air, a tank 360 filled with the cooling air, a pressure increasing unit 370 for increasing the pressure of the cooling air from the air supply unit 350 and filling the tank 360, and a pressure increasing unit 370 for increasing the pressure of the cooling air from either the air supply unit 350 or the tank 360. and a control device 50 that controls a drive mechanism 320 to bring the electronic component 2 held by the holding tool 311 into contact with a mounting target, controls a heating tool 312 to heat the electronic component 2 via the holding tool 311, and controls the switching unit 390 to supply cooling air from an air supply unit 350 to the holding head H, and then causes the cooling air to be supplied from a tank 360 to the holding head H.

[0087] The mounting method may also include a contact step in which the drive mechanism 320 brings the electronic component 2 held by the holding tool 311 into contact with a mounting target; a heating step in which the heating tool 312 heats the electronic component 2 via the holding tool 311; an initial cooling step in which the switching unit 390 supplies cooling air from the air supply unit 350 to the holding head H having the holding tool 311 and the heating tool 312; and a cooling step in which the cooling air supplied from the air supply unit 350 is pressurized and supplied to the holding head H from one of the tanks 360.

[0088] Even in this embodiment, low-pressure cooling air is supplied from the air supply unit 350 to the holding head H without going through the high-pressure tank 360 until a predetermined temperature is reached, and after the predetermined temperature is reached, high-pressure cooling air can be supplied from the tank 360 to the holding head H. For example, until the temperature drops from 320°C to 200°C (stage [1] in FIG. 10), the cooling air is supplied at low pressure (0.5 MPa), and then switched from 200°C to high pressure (0.7 MPa) to rapidly drop the temperature to 80°C (stage [2] in FIG. 10).

[0089] This reduces the total amount of cooling air supplied, and by using only one tank 360, it is possible to prevent an increase in the required space. Also, by increasing the pressure of the cooling air at the stage [2] when the temperature difference between the cooling air and the heating tool 312 is small, it is possible to improve the cooling efficiency and shorten the cooling time. Therefore, it is possible to prevent the equipment from becoming larger and to increase the pressure in a fast cycle, thereby improving productivity.

[0090] (5) In the above embodiment, the electronic components 2 are placed in the supply device 10 in a face-up state with their functional surfaces exposed upward. However, they may also be placed in a face-down state with their functional surfaces facing the sheet 11 below. As described above, the electronic components 2 may be mounted face-down on the substrate 3, or may be mounted face-up. In other words, an electronic component 2 placed face-up can be face-down bonded by flipping it over. An electronic component 2 placed face-down can also be face-down bonded by passing it through a relay device.

[0091] [Other embodiments] Although the embodiments and modifications of each part of the present invention have been described, these embodiments and modifications are presented as examples and are not intended to limit the scope of the invention. The present invention also encompasses embodiments that combine all or any of the claims. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and modifications are included within the scope and spirit of the invention, and are also included in the invention described in the claims. [Explanation of symbols]

[0092] 1 Mounting equipment 2. Electronic Components 3. Circuit Board 10 Feeding device 11 sheets 12 Supply Stage 13, 41 Stage movement mechanism 20 Pickup device 21 Pick-up nozzle 22 Moving mechanism 22a Arm 22b, 321 slide mechanism 22c, 321a Support frame 22d, 312b, 322b rails 22e, 312c, 322c slider 22f, 322 lifting mechanism 23 Reversal mechanism 24 Push-up mechanism 24a Thrust Body 24b Backup body 30 Onboard equipment 40 Substrate stage 50 Control device 51 Mechanism control unit 52 Suction control unit 53 Heating control section 54 Switching control section 55 Filling section 56 Memory section 60 Input Device 70 Display device 310 Holding part 311 Holding Tools 311a Protrusion 311b Retaining surface 311c Suction port 311d, 312b, 313b, 314b parts suction hole 311e Groove 312 Heating Tools 312a, 313a, 314a Tool suction holes 312c cooling groove 312d Temperature detection unit 313 Insulation 313c, 314c cooling hole 314 Mounting base 314d fitting 315 Bonding Head 316 Contact detection unit 320 Drive Mechanism 322a servo motor 330 Tool suction part 340 Parts suction part 350 Air supply unit 360, 360A, 360B Tanks 370 Booster 380 Pressure detection unit 390 Switching section H Retaining head

Claims

1. a holding head having a holding tool for holding an electronic component and a heating tool for heating the holding tool; a drive mechanism that moves the holding head in a direction toward and away from a mounting target; an air supply unit that supplies cooling air; a plurality of tanks filled with the cooling air; a pressure increasing unit that increases the pressure of the cooling air from the air supply unit and fills the cooling air into the tank; a switching unit that switches from which tank the cooling air is to be supplied to the holding head; a control device that controls the drive mechanism to bring the electronic component held by the holding tool into contact with the mounting target, controls the heating tool to heat the electronic component via the holding tool, and controls the switching unit to supply the cooling air from any one of the tanks to the holding head; A mounting device comprising:

2. 2. The mounting device according to claim 1, wherein the control device controls the pressure booster to fill the cooling air into the tanks other than the tank that supplies the cooling air to the holding head.

3. The mounting device described in claim 1, characterized in that the control device controls the switching unit to supply the cooling air from the air supply unit to the holding head without passing through the tank after heating by the heating tool and before the cooling air is supplied from the tank to the holding head.

4. The mounting device described in claim 3, characterized in that the control device controls the switching unit to supply the cooling air from the air supply unit to the holding head without passing through the tank, and then, when the temperature of the heating tool reaches a predetermined temperature, causes the cooling air to be supplied from the tank to the holding head.

5. The mounting device according to claim 3, characterized in that the control device controls the switching unit to supply the cooling air from the tank when a predetermined time has elapsed since the cooling air was supplied from the air supply unit to the holding head without going through the tank.

6. The mounting device according to any one of claims 1 to 5, characterized in that the control device controls the switching unit to switch the tank that supplies the cooling air to the holding head for each mounting of the electronic component.

7. a detection unit for detecting the pressure of the tank; The mounting device according to any one of claims 1 to 5, characterized in that the control device switches the tank that supplies the cooling air to the holding head when the pressure detected by the detection unit falls below a predetermined threshold value.

8. a contact step in which the drive mechanism brings the electronic component held by the holding tool into contact with the mounting target; a heating step in which a heating tool heats the electronic component through the holding tool; a cooling step in which a switching unit supplies cooling air from any one of a plurality of tanks in which the cooling air supplied from an air supply unit has been pressurized, to a holding head having the holding tool and the heating tool; 10. A method of implementation comprising:

9. 9. The mounting method according to claim 8, further comprising a pressure increasing step in which a pressure increasing unit increases the pressure of the cooling air and fills the cooling air into the tanks other than the tank that supplies the cooling air to the holding head.

10. 9. The mounting method according to claim 8, further comprising an initial cooling step of supplying the cooling air from the air supply unit to the holding head without passing through the tank after the heating step and before the cooling step.

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