Film forming apparatus and film forming method

Abstract

To provide a technology that can address increase in size of a substrate.SOLUTION: A film deposition apparatus includes a movable body moving inside the film deposition apparatus and including a battery. The battery is charged in a first position inside the film deposition apparatus and supplies power in a second position inside the film deposition apparatus.SELECTED DRAWING: Figure 26

Description

[Technical Field]

[0001] The present invention relates to a film forming apparatus and a film forming method. [Background technology]

[0002] As manufacturing equipment for organic EL displays and the like, there is known an apparatus that transports a substrate to a deposition chamber and deposits a film on the substrate. Patent Document 1 describes a scanning deposition type deposition apparatus that moves and releases deposition material. In Patent Document 1, an atmospheric arm with a power cable running through it is used because a power cable or the like is connected to the evaporation source. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-026931 Summary of the Invention [Problem to be solved by the invention]

[0004] As substrates become larger, the deposition source must also move a greater distance. However, the air arm limits the range of movement, making it difficult to adapt the deposition equipment to accommodate large substrates.

[0005] The present invention provides a technique that can accommodate larger substrates. [Means for solving the problem]

[0006] According to the present invention, there is provided a film forming apparatus, a deposition source that emits a film forming material in a deposition direction; Battery included , moving the evaporation source move and means for The battery The vapor deposition source is moved in a first direction intersecting the vapor deposition direction on a first line, and is also moved to a second line adjacent to the first line in a second direction intersecting the vapor deposition direction and the first direction, and further, power is supplied to the moving means to move the vapor deposition source in the first direction on the second line. Along with Power is supplied by a charging unit disposed on a path along which the moving means moves between a first film formation position where a film is formed by the evaporation source on a substrate held by a first substrate holding unit that holds a substrate on the first line and a second film formation position where a film is formed by the evaporation source on a substrate held by a second substrate holding unit that holds a substrate on the second line. A film forming apparatus characterized by the above features is provided. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a technique that can accommodate larger substrates. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a layout diagram of a film forming system according to an embodiment of the present invention. [Figure 2] 1A and 1B are a plan view and a side view of a transport unit. [Figure 3] FIG. 3 is a perspective view of a hand of the transport unit of FIGS. 2A and 2B. [Figure 4] (A) and (B) are explanatory diagrams of the bending of the substrate and the function of the support member. [Figure 5] FIG. [Figure 6] FIG. 6 is a cross-sectional view of the transport unit of FIG. 5. [Figure 7] 10A and 10B are explanatory diagrams of the substrate transfer operation. [Figure 8] 10A and 10B are explanatory diagrams of the substrate transfer operation. [Figure 9] 10A and 10B are explanatory diagrams of the substrate transfer operation. [Figure 10] 10A and 10B are explanatory diagrams of the substrate transfer operation. [Figure 11] (A) to (F) are diagrams illustrating the movement of the evaporation source. [Figure 12] 10A and 10B are explanatory diagrams of the mask transport operation to the mask table. [Figure 13] 10A and 10B are explanatory diagrams of the mask transport operation to the mask table. [Figure 14] 10A and 10B are explanatory diagrams of the substrate transport operation and alignment operation. [Figure 15] 1A and 1B are explanatory diagrams of a film forming operation on a substrate. [Figure 16] 1A to 1C are explanatory diagrams showing an example of the operation of the entire film forming apparatus. [Figure 17] 1A to 1C are explanatory diagrams showing an example of the operation of the entire film forming apparatus. [Figure 18] 1A to 1C are explanatory diagrams showing an example of the operation of the entire film forming apparatus. [Figure 19] 1A to 1C are explanatory diagrams showing an example of the operation of the entire film forming apparatus. [Figure 20] 1A to 1D are explanatory diagrams showing an example of the operation of the entire film forming apparatus. [Figure 21] 10(A) to 10(C) are explanatory diagrams of another deposition source and its moving unit. [Figure 22] (A) and (B) are explanatory diagrams of the alignment unit. [Figure 23] 10(A) to 10(C) are explanatory diagrams of other configuration examples of a film forming apparatus. [Figure 24] FIG. 10 is an explanatory diagram of another example of the configuration of the holding unit. [Figure 25] (A) is an overall view of an organic EL display device, and (B) is a diagram showing the cross-sectional structure of one pixel. [Figure 26] (A) is a side view showing the movement of the evaporation source, and (B) is a top view showing the movement of the evaporation source. [Figure 27] (A) and (B) are explanatory diagrams of the evaporation source moving unit. [Figure 28] (A) is an explanatory diagram showing the movement of the evaporation source, and (B) is an explanatory diagram of the evaporation source movement unit. [Figure 29] FIG. [Figure 30] 10A and 10B are explanatory diagrams showing the movement of the holding unit. [Figure 31] (A) and (B) are explanatory diagrams of the film formation unit. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0010] First Embodiment (System Overview) 1 is a layout diagram of a film forming system 1. In each diagram, arrow Z indicates the vertical direction (direction of gravity), arrows X and Y indicate horizontal directions that are orthogonal to each other, and arrow θ indicates the direction of rotation around the Z axis.

[0011] The film formation system 1 has a configuration in which an intermediate transfer device 101, a film formation device 1, and an intermediate transfer device 102 are arranged in the X direction, and substrates W are transferred and processed in this order. The intermediate transfer device 101 is located upstream in the transfer direction of the substrate W, and the intermediate transfer device 102 is located downstream in the transfer direction of the substrate W. In the example shown in the figure, the film formation system 1 includes one film formation device 1, but another film formation device 1 can be provided upstream of the intermediate transfer device 101 or downstream of the intermediate transfer device 102. The control device 103 includes a processor such as a CPU, a storage device such as a semiconductor memory or a hard disk, and an input / output interface, and controls the film formation system 1.

[0012] The intermediate transfer devices 101 and 102 are equipped with a transfer robot 110. The transfer robot 110 is a double-arm robot in which two sets of arms 110b and hands 110c are supported on a base 110a. The two sets of arms 110b and hands 110c rotate in the θ direction on the base 110a and are also extendable. A stocker 104 in which masks M are stored is provided adjacent to the intermediate transfer devices 101 and 102. The transfer robot 110 transfers masks M in addition to transferring substrates W. The hand 110c is fork-shaped, and the substrates M and masks M are placed on the hand 110c for transfer.

[0013] The film formation apparatus 1 is an apparatus that performs a film formation process on a substrate W carried in from an intermediate transfer device 101 and carries the substrate out to an intermediate transfer device 102. The film formation apparatus 1 includes a delivery chamber 2 that delivers and receives the substrate W, and a plurality of film formation chambers 3 that are arranged adjacent to the delivery chamber 2. In this embodiment, two film formation chambers 3 are provided, one on each side of the delivery chamber 2 in the Y direction. The delivery chamber 2 and the film formation chamber 3 are surrounded by walls 20 and 30, respectively, and can be kept airtight.

[0014] In the film formation chamber, a deposition material is formed on the substrate W. A mask M can be used to form a thin film of the deposition material in a predetermined pattern on the substrate W. The material of the substrate W can be selected appropriately from glass, resin, metal, etc., and typically, a substrate having a resin layer such as polyimide formed on glass is used. In this embodiment, the substrate W is rectangular. The deposition material is an organic material or an inorganic material (metal, metal oxide, etc.). The film formation apparatus 1 is applicable to manufacturing apparatuses for manufacturing electronic devices such as display devices (such as flat panel displays), thin-film solar cells, and organic photoelectric conversion elements (organic thin-film imaging elements), as well as optical components, and is particularly applicable to manufacturing apparatuses for manufacturing organic EL panels.

[0015] (Delivery room) The delivery chamber 2 not only delivers the substrates W and masks M between the intermediate transfer devices 101 and 102 and the film formation device 1, but also distributes the substrates W and masks M to the film formation chambers 3. Therefore, the delivery chamber 2 can also be called a sorting chamber.

[0016] (Multi-directional transport unit) The delivery chamber 2 is provided with a transport unit 4 that transports a substrate W and a mask M. The transport unit 4 receives the substrate W or the mask M from the intermediate transport device 101 and delivers it to the holding units 6A to 6D. The transport unit 4 also transports the substrate W or the mask M received from the holding units 6A to 6D to the intermediate transport device 102. FIGS. 2(A) and 2(B) are a plan view and a side view of the transport unit 4.

[0017] The transport unit 4 of this embodiment is a horizontal, articulated robot capable of moving a substrate W or the like in multiple directions on the XY plane, and includes a cylindrical base 40, an arm 41 supported on the base 40, and a hand 44 supported by the arm 41. The base 40 has a drive shaft 40a, and rotation of the drive shaft 40a in the θ direction causes the arm 41 to rotate about the Z1 axis, and vertical movement of the drive shaft 40a causes the arm 41 to rise and fall. The arm 41 includes arm members 42 and 43. One end of the arm 42 is connected to the drive shaft 40a, and the other end is connected to one end of the arm member 43. The arm member 43 is connected to the arm member 42 so as to be rotatable about the Z2 axis. The hand 44 is connected to the other end of the arm member 43 so as to be rotatable about the Z3 axis.

[0018] In addition to Figures 2(A) and 2(B), reference will be made to Figure 3. Figure 3 is a perspective view of a hand 44. The hand 44 comprises a plate-shaped hand body 45 and a plurality of support members 46 to 48 that are erected on the hand body 45 and support the substrate W. The support members 46 to 48 are broadly divided into support member 46 located in the center of the hand body 45 and support members 47 and 48 located in the peripheral portions. The substrate W is placed on the plurality of support members 46 to 48. When the substrate W is supported by the hand 44, support member 46 is located in the center of the substrate W, and support members 47 and 48 are located in the peripheral portions of the substrate W.

[0019] The support member 46 includes a pin 46a and an elastic member 46b provided at the tip of the pin 46a. The support member 47 includes a pin 47a, a mounting portion 47b provided at the tip of the pin 47a, and an elastic member 47c provided on the upper surface of the mounting portion 47b and located at the tip of the support member 47. The support member 48 includes a plurality of pins 48a, mounting portions 48b provided at the tips of the plurality of pins 48a, and a plurality of elastic members 48c provided on the upper surface of the mounting portion 48b and located at the tip of the support member 48.

[0020] Supporting the substrate W with these support members 46-48 allows the substrate W to be supported with a small area, and prevents scratches and the like from occurring on the surface of the substrate W. Furthermore, the elastic members 46b, 47c, and 48c are portions that come into contact with the substrate W and are made of, for example, resin. The contact of the elastic members 46b, 47c, and 48c with the substrate W more reliably prevents scratches and the like from occurring on the surface of the substrate W.

[0021] As shown in Fig. 2(B), the relationship between the height H1 of the support member 46 from the hand body 45 and the height H2 of the support members 47 and 48 is H1>H2. This makes it possible to prevent the central portion of the substrate W from sagging. Figs. 4(A) and 4(B) are explanatory diagrams illustrating the state in which the holding unit 6A receives the substrate W from the hand 44.

[0022] As will be described later, in this embodiment, the holding units 6A to 6D hold the substrate W by electrostatic force. When the holding units 6A to 6D receive the substrate W, if the flatness of the substrate W is low, the suction force decreases. Furthermore, the accuracy of film formation during film formation also decreases. FIG. 4(A) shows, as a comparative example, a case in which the hand 44 does not include the support member 46 and the substrate W is supported by the support member 47 (and support member 48). With a large substrate W, the center portion thereof bends and sags due to its own weight. If the holding unit 6A suctions the substrate W in this state, a gap may form between the center portion of the substrate W and the lower surface (holding surface) of the holding unit 6A, resulting in a decrease in the suction force.

[0023] 4(B), the relationship between the height H1 of the support member 46 and the height H2 of the support members 47 and 48 is H1>H2, so that the center of the substrate W is supported by the support member 46, and the center of the substrate W is slightly raised. Even for large substrates W, the center is prevented from bending and sagging due to its own weight, and rather, the center of the substrate W comes into contact with the holding unit 6A before the peripheral edge. As a result, suction spreads from the center of the substrate W to the peripheral edge, and the entire substrate W is held by the holding unit 6A without any gaps.

[0024] (Sliding transport unit) 1, the film formation apparatus 1 includes two transport units 5A and 5B arranged from the delivery chamber 2 to the two film formation chambers 3. The transport unit 5A includes holding units 6A and 6C and a moving unit 7A that moves these units independently in parallel in the Y direction. The transport unit 5B has the same structure as the transport unit 5A and includes holding units 6B and 6D and a moving unit 7B that moves these units independently in parallel in the Y direction.

[0025] Fig. 5 shows the portions of the transport units 5A and 5B arranged in the delivery chamber 2, and Fig. 6 shows a cross-sectional view of the transport unit 5A (moving unit 7A and holding unit 6A). The transport units 5A and 5B are units that move holding units 6A to 6D independently in a horizontal position in the Y direction at a position higher than the transport unit 4, and are arranged side by side in the X direction. Note that Fig. 6 shows the structure of the transport unit 5A (moving unit 7A and holding unit 6A) as a representative, but the holding units 6A to 6D have the same structure, and the moving units 7A and 7B also have the same structure.

[0026] The moving units 7A and 7B of this embodiment are mechanisms that move the holding units 6A to 6D by magnetic force, and in particular, mechanisms that levitate and move by magnetic force. Each of the moving units 7A and 7B includes a pair of guide members 70 that define the movement trajectory of the holding units 6A to 6D in the Y direction. Each guide member 70 has a C-shaped cross section and is a rail member that extends in the Y direction. The pair of guide members 70 are spaced apart from each other in the X direction.

[0027] Each guide member 70 includes a large number of pairs of magnetic elements 71 spaced apart in the Z direction. The large number of pairs of magnetic elements 71 are arranged at equal pitches in the Y direction. At least one of the pair of magnetic elements 71 is an electromagnet, and the other is an electromagnet or a permanent magnet.

[0028] The holding units 6A to 6D are carriers for transporting substrates W and masks M. Each of the holding units 6A to 6D includes a main body member 60 that is rectangular in plan view. Each end of the main body member 60 in the X direction is inserted into a corresponding guide member 70. A permanent magnet 61 with a yoke (not shown) is fixed to the upper and lower surfaces of each end of the main body member 60 in the X direction. A plurality of upper and lower permanent magnets 61 are provided on the main body member 60 in the Y direction. The permanent magnets 61 face magnetic elements 71 of the guide member 70. A levitation force can be generated in the holding units 6A to 6D by the repulsive force between the permanent magnets 61 and the magnetic elements 71. By sequentially switching the magnetic elements 71 that generate magnetic force among the many magnetic elements (electromagnets) 71 provided in the Y direction, a moving force in the Y direction can be generated in the holding units 6A to 6D by the attractive force between the permanent magnets 61 and the magnetic elements 71.

[0029] In this embodiment, the moving units 7A and 7B are magnetic levitation transport mechanisms, but they may be other transport mechanisms capable of moving the holding units 6A to 6D, such as a roller transport mechanism, a belt transport mechanism, or a rack-and-pinion mechanism.

[0030] A scale 72 extending in the Y direction is disposed on the guide member 70, and a sensor 64 that reads the scale 72 is provided on the main body member 60. The position of each of the holding units 6A to 6D in the Y direction can be identified based on the detection result of the sensor 64.

[0031] Each of the holding units 6A to 6D includes a holder 62 that holds the substrate W. In this embodiment, the holder 62 is an electrostatic chuck that attracts the substrate W by electrostatic force, and the holder 62 includes a plurality of electrodes 62a arranged on the lower surfaces of the holding units 6A to 6D. Each of the holding units 6A to 6D also includes a holder 63 that holds the mask M. The holder 63 is, for example, a magnetic chuck that attracts the mask M by magnetic force, and is located outside the holder 62 in the X direction. The holder 63 may also be a clamping mechanism that mechanically clamps the mask M.

[0032] (Board receiving operation) The holding units 6A to 6D receive the substrates W and masks M transferred from the transport unit 4 at predetermined positions within the delivery chamber 2. Figure 5 shows the holding units 6A to 6D positioned at the respective receiving positions PA to PD. The receiving positions PA to PD are arranged in a matrix (2 x 2) on the XY plane and are set inside the delivery chamber 2, outside the film formation chamber 3. The presence of four different receiving positions PA to PD also allows these receiving positions PA to PD to be used as buffers for holding substrates W in the event of a system failure downstream.

[0033] 7(A) to 8(B) show an example of the receiving operation of the holding unit 6B of the substrate W from the transport unit 4 at the receiving position PB. FIG. 7(A) shows the state in which the transport unit 4 receives the substrate W from the intermediate transport device 101. The substrate W is placed on the hand 44. In other words, the substrate W is supported by the hand 44 from its underside. The holding unit 6B is moved to the receiving position PB by the moving unit 7B. FIG. 7(B) shows the state in which the hand 44 has moved below the holding unit 6B by the operation of the arm portion 41 of the transport unit 4. In the state of FIG. 7(B), the hand 44 has rotated 90 degrees in the θ direction from the state of FIG. 7(A). As a result, the substrate W changes from a position in which its longitudinal direction faces the X direction (FIG. 7(A)) to a position in which it faces the Y direction (FIG. 7(B)).

[0034] 7(B), the holding unit 6B is aligned with the substrate W. An alignment camera 21 is provided in the delivery chamber 2. The relative positions of the holding unit 6B and the substrate W are identified from the image captured by the camera 21, and the position of the substrate W in the X, Y, and θ directions is adjusted by the transport unit 4.

[0035] 8(A) shows a state in which the arm portion 41 of the transport unit 4 has been raised and the substrate W has come into contact with the holder 62 of the holding unit 6B. The substrate W is held by the holder 62 by the electrostatic force of the holder 62. In this manner, in this embodiment, the substrate W is transferred from the transport unit 4 to the holding unit 6B from bottom to top. FIG. 8(B) shows a state in which the arm portion 41 of the transport unit 4 has been lowered and the holding unit 6B has completed receiving the substrate W.

[0036] The same applies to the transfer of the substrate W between the transport unit 4 and the other holding units 6A, 6C, and 6D. As an example, FIGS. 9(A) to 10(B) show an example of the receiving operation of the holding unit 6A to receive the substrate W from the transport unit 4 at the receiving position PA. FIG. 9(A) shows a state in which the transport unit 4 receives the substrate W from the intermediate transport device 101. The substrate W is supported from its underside by the hand 44. The holding unit 6A is moved to the receiving position PA by the moving unit 7A. FIG. 9(B) shows a state in which the hand 44 has moved below the holding unit 6B by the operation of the arm portion 41 of the transport unit 4. In the state of FIG. 9(B), the hand 44 has rotated 90 degrees in the θ direction from the state of FIG. 9(A). As a result, the substrate W changes from a position in which its longitudinal direction faces the X direction (FIG. 9(A)) to a position in which it faces the Y direction (FIG. 9(B)).

[0037] 9(B), the holding unit 6A is aligned with the substrate W. The relative positions of the holding unit 6A and the substrate W are identified from an image captured by the camera 21 provided in the delivery chamber 2, and the position of the substrate W in the X direction, Y direction, and θ direction is adjusted by the transport unit 4.

[0038] Fig. 10(A) shows a state in which the arm portion 41 of the transport unit 4 is raised and the substrate W is brought into contact with the holder 62 of the holding unit 6A. The substrate W is held by the holder 62 by the electrostatic force of the holder 62. Fig. 10(B) shows a state in which the arm portion 41 of the transport unit 4 is lowered and the holding unit 6A has completed receiving the substrate W.

[0039] The above has been described regarding the receiving operation of the substrate W, but the same applies to the receiving operation of the mask M.

[0040] (Film forming chamber) In the film formation chamber 3, a film is formed on a substrate W using a mask M. As shown in FIG. 1, two mask stages 31 are arranged in each of the two film formation chambers 3. A total of four mask stages 31 define deposition positions JA to JD where deposition processes are performed. The two film formation chambers 3 have the same structure. Each film formation chamber 3 is provided with a deposition source 8 and a moving unit 9 that moves the deposition source 8. The structures and operations of the deposition source 8 and the moving unit 9 will be described with reference to FIGS. 11(A) to 11(F).

[0041] The deposition source 8 includes a crucible that contains the raw material of the deposition substance, a heater that heats the crucible, and the like, and heats the raw material to release the vapor of the deposition substance upward from the opening 8a. The movement unit 9 includes an actuator 90, a pair of movable rails 94, and a pair of fixed rails 95. The actuator 90 includes a drive source 93, an arm member 91, and an arm member 92. One end of the arm member 91 is connected to the drive source 93 and is rotated by the drive source 93. The other end of the arm member 91 is rotatably connected to one end of the arm member 92, and the other end of the arm member 92 is rotatably connected to the bottom of the deposition source 8.

[0042] The pair of movable rails 94 guides the movement of the vapor deposition source 8 in the Y direction. Each movable rail 94 extends in the Y direction, and the pair of movable rails 94 are spaced apart from each other in the X direction. The pair of fixed rails 95 guides the movement of the pair of movable rails 94 in the X direction. Each fixed rail 95 is fixed so as to be immovable, and extends in the Y direction. The pair of fixed rails 95 are spaced apart from each other in the Y direction.

[0043] By driving the actuator 90, the deposition source 8 slides in the Y direction below the deposition position JA (below the mask table 31), then slides from the deposition position JA side to the deposition position JB side, and further slides in the Y direction below the deposition position JB (below the mask table 31). Specifically, when the arm members 91 and 92 are rotated by driving the actuator 90 from the position shown in FIG. 11(A), the deposition source 8 passes below the deposition position JA in the Y direction guided by the pair of movable rails 94 as shown in FIG. 11(B). When the arm members 91 and 92 are rotated in the opposite direction by driving the actuator 90 from this state, the deposition source 8 passes below the deposition position JA in the Y direction as shown in FIG. 11(C) and returns to the position shown in FIG. 11(A).

[0044] When the arm members 91 and 92 are further rotated by driving the actuator 90, the vapor deposition source 8 and the pair of movable rails 94 move in the X direction toward the vapor deposition position JB, guided by the pair of fixed rails 95. When the arm members 91 and 92 are further rotated from the position shown in Figure 11(D) by driving the actuator 90, the vapor deposition source 8 passes below the vapor deposition position JB in the Y direction, guided by the pair of movable rails 94, as shown in Figure 11(E). When the arm members 91 and 92 are rotated in the opposite direction by driving the actuator 90 from this state, the vapor deposition source 8 passes below the vapor deposition position JB in the Y direction, as shown in Figure 11(F), and returns to the position shown in Figure 11(D).

[0045] In this manner, in this embodiment, by moving one vapor deposition source 8, the vapor deposition source 8 can be shared by two vapor deposition positions, ie, the vapor deposition position JA and the vapor deposition position JB.

[0046] Next, the operation of placing the mask M on the mask stage 31, the operation of aligning the mask M with the substrate W, and the subsequent film formation operation will be described with reference to FIGS. 12(A) to 15(B).

[0047] First, the operation of mounting the mask M on the mask stage 31 will be described. Figures 12(A) to 13(B) show the operation of mounting the mask M on the mask stage 31 at the deposition position JA. From the state shown in Figure 12(A), the holding unit 6A holding the mask M is moved onto the mask stage 31 by the moving unit 7A. When the mask M reaches a predetermined position on the mask stage 31 as shown in Figure 13(A), the magnetic force of the magnetic element 71 of the moving unit 7A is adjusted to reduce the levitation amount of the holding unit 6A, and the holding of the mask M by the holding unit 6A is released, as shown in Figure 13(B). This causes the mask M to be mounted on the mask stage 31.

[0048] Next, the alignment operation and film formation operation will be described. FIG. 14(A) shows a state in which the holding unit 6A holding the substrate W is being moved by the moving unit 7A to the deposition position JA. When the substrate W reaches above the mask M, the substrate W and the mask M are aligned in the XY plane. In the alignment, as shown in FIG. 14(B), the camera 32 captures images of the alignment marks on the substrate W and the mask M, respectively, and calculates the amount of misalignment between the substrate W and the mask M from the captured images. The position of the substrate W is then adjusted to reduce the calculated amount of misalignment. In this embodiment, the position of the substrate W is adjusted by adjusting the magnetic force of the magnetic elements 71 of the moving unit 7A. By adjusting the magnetic forces of the magnetic elements 71 spaced apart in the X and Y directions, the position of the holding unit 6A can be displaced in the X, Y, and θ directions, thereby displacing the position of the substrate W held by the holding unit 6A in the X, Y, and θ directions. For example, by strengthening the magnetic force of the magnetic element 71 provided on one of the pair of guide members 70, the holding unit 6A and the substrate W can be displaced toward one of the guide members 70 by the attraction of the magnetic force (or toward the other guide member 70 by the repulsion of the magnetic force).

[0049] The imaging by the camera 32 and the alignment of the substrate W and the mask M by adjusting the magnetic force of the magnetic element 71 may be repeated until the amount of misalignment between them falls within an allowable range. Once the alignment is complete, as shown in FIG. 15(A), the magnetic force of the magnetic element 71 of the moving unit 7A is adjusted to lower the levitation amount of the holding unit 6A, and the substrate W is placed on the mask M. The holding of the substrate W by the holding unit 6A is not released. Next, the film formation operation is performed. As shown in FIG. 15(B), the evaporation source 8 is moved and the evaporation material is released from the evaporation source 8 onto the substrate W. A film of the evaporation material that has passed through the mask M is formed on the substrate W. During film formation, the substrate W remains held by the holding unit 6A.

[0050] (Example of film formation device operation) 16(A) to 20(D), an example of the operation of the film formation apparatus 1 to continuously form films on a plurality of substrates W will be described. First, the mask M is transported to the mask stage 31 at each of the deposition positions JA to JD. FIG. 16(A) shows the state in which the first mask M has been transported from the intermediate transport device 101. The transport unit 4 receives the mask M on the hand 44, and as shown in FIG. 16(B), passes the mask M to the holding unit 6A at the receiving position PA. The holding unit 6A holds the mask M from above.

[0051] As shown in FIG. 16(C), the second mask M is transported from the intermediate transport device 101. At the same time, the holding unit 6A is moved parallel to the deposition position JA by the moving unit 7A. The transport unit 4 receives the second mask M on the hand 44, and as shown in FIG. 17(A), hands over the mask M to the holding unit 6C at the receiving position PC. The holding unit 6C holds the mask M from above. At the same time, the first mask M is placed on the mask stage 31 at the deposition position JA, and the holding unit 6A returns to the receiving position PA.

[0052] As shown in FIG. 17(B), the third mask M is transported from the intermediate transport device 101. At the same time, the holding unit 6C is moved parallel to the deposition position JC by the moving unit 7A. The transport unit 4 receives the third mask M on the hand 44 and hands over the mask M to the holding unit 6B at the receiving position PB. By repeating the above procedure, the masks M are placed at the deposition positions JA to JD, as shown in FIG. 17(C).

[0053] Next, a series of operations for forming a film on a substrate W will be described. Fig. 18(A) shows the state in which the first substrate W has been transported from the intermediate transport device 101. The transport unit 4 receives the substrate W on the hand 44, and as shown in Fig. 18(B), hands the substrate W over to the holding unit 6A at the receiving position PA. The holding unit 6A holds the substrate W from above.

[0054] As shown in FIG. 18(C), a second substrate W is transported from the intermediate transport device 101. In parallel, the holding unit 6A that has received the substrate W is moved parallel to the deposition position JA by the moving unit 7A. At the deposition position JA, the substrate W and the mask M are aligned. The transport unit 4 receives the second substrate W on the hand 44, and as shown in FIG. 19(A), hands the substrate W over to the holding unit 6C at the receiving position PC. The holding unit 6C holds the substrate W from above. In parallel, a film formation operation is performed on the first substrate W by the deposition source 8 at the deposition position JA.

[0055] As shown in FIG. 19(B), the third substrate W is transported from the intermediate transport device 101. Concurrently, the holding unit 6C, which has received the second substrate W, is moved parallel to the deposition position JC by the moving unit 7A. At the deposition position JC, the substrate W and the mask M are aligned. The transport unit 4 receives the third substrate W on the hand 44 and, as shown in FIG. 19(C), hands the substrate W to the holding unit 6B at the receiving position PB. The holding unit 6B holds the substrate W from above. Concurrently, the deposition source 8, which has completed film formation at the deposition position JA, is moved toward the deposition position JB. Furthermore, a film formation operation is performed on the second substrate W by the deposition source 8 at the deposition position JC.

[0056] As shown in Figure 20(A), the fourth substrate W is transported from the intermediate transport device 101. At the same time, the holding unit 6B, which has received the third substrate W, is moved parallel to the deposition position JB by the moving unit 7B. At the deposition position JB, the substrate W is aligned with the mask M. Furthermore, the holding unit 6A, which holds the first substrate W on which film formation has been completed, is moved to the receiving position PA by the moving unit 7A.

[0057] The transport unit 4 receives the fourth substrate W on the hand 44 and, as shown in Figure 20(B), hands the substrate W to the holding unit 6D at the receiving position PD. The holding unit 6D holds the substrate W from above. Concurrently, the evaporation source 8, which has completed film formation at the evaporation position JC, is moved toward the evaporation position JD, and the holding unit 6C, which holds the second substrate W that has completed film formation, is moved to the receiving position PC by the moving unit 7A. Furthermore, a film formation operation is performed on the third substrate W by the evaporation source 8 at the evaporation position JB.

[0058] When the holding unit 6A holding the first substrate W on which film formation has been completed returns to the moving unit 7A, the transport unit 4 receives the first substrate W from the holding unit 6A at the receiving position PA, as shown in Figure 20(C). In parallel, the holding unit 6D which has received the fourth substrate W is moved parallel to the deposition position JD by the moving unit 7B. The transport unit 4 transports the first substrate W on which film formation has been completed to the intermediate transport device 102, as shown in Figure 20(D). By repeating the above procedure, film formation is performed sequentially on a large number of substrates W.

[0059] According to the above-described film formation apparatus 1, the substrate W or mask M is transported from the intermediate transport device 101 to each of the deposition positions JA to JD by using the transport unit 4 in combination with the transport unit 5A or 5B. Compared to transport using a single transport mechanism, the substrate W can be transported over a longer distance while shortening the transport distance of each transport unit. When transporting a large substrate W, it is possible to prevent each transport unit from becoming larger due to increased rigidity while realizing a long transport distance. Therefore, it is possible to provide a film formation apparatus 1 that can accommodate larger substrates W.

[0060] Furthermore, different mechanisms are employed for the transport unit 4 and the transport units 5A and 5B. That is, by configuring the transport unit 4 as an articulated robot, it is possible to improve the degree of freedom in the position of the transport destination of the substrate W and the degree of freedom in the attitude (orientation) of the substrate W. Furthermore, by configuring the transport units 5A and 5B as a mechanism for moving the substrate W in parallel, it is possible to accommodate long transport distances.

[0061] The transfer of the substrate W from the transport unit 4 to the transport units 5A and 5B is performed by the holding part 62, which is an electrostatic chuck, so the substrate W can be transferred by attaching it from the transport unit 4 to the holding part 62. Compared to the method of replacing the substrate W, there is no need to place the substrate W, and the transfer time can be shortened, thereby improving productivity.

[0062] When the substrate W and mask M are transported from the delivery chamber 2 to the film formation chamber 3, their orientations are changed by 90 degrees by the transport unit 4 so that the longitudinal directions of the substrate W and mask M are oriented in the Y direction. This contributes to reducing the width of the film formation apparatus 1 in the X direction. Of course, a configuration in which the orientations of the substrate W and mask M are not changed can also be adopted. In this case, it contributes to reducing the width of the film formation apparatus 1 in the Y direction.

[0063] Second Embodiment In the first embodiment, the deposition source 8 is configured to be movable in both the X and Y directions, but it may be configured to be movable only in the X direction. Figures 21(A) to 21(C) show an example of this, illustrating the configuration at deposition positions JA and JB. A similar configuration can also be adopted at deposition positions JC and JD.

[0064] The deposition source 8', which replaces the deposition source 8, has a shape that is elongated in the Y direction, and the openings 8a' that release the deposition material have a length that corresponds to the length of the deposition positions JA and JB in the Y direction. The moving unit 9', which replaces the moving unit 9, has a pair of fixed rails 96. Each fixed rail 96 extends in the X direction, and the pair of fixed rails 96 are spaced apart from each other in the Y direction. The moving unit 9' has an actuator (not shown) that corresponds to the actuator 90.

[0065] As shown in Fig. 21(A), the deposition source 8' has a standby position between deposition positions JA and JB, and when forming a film on the substrate W at deposition position JA, it traverses deposition position JA in the X direction as shown in Fig. 21(B). When forming a film on the substrate W at deposition position JB, it traverses deposition position JB in the X direction as shown in Fig. 21(C). According to this embodiment, the mechanism of the moving unit 9' can be made relatively simple.

[0066] Third Embodiment In the first embodiment, the alignment between the substrate W and the mask M at the deposition positions JA to JD is performed by adjusting the magnetic force of the magnetic element 71, but a dedicated alignment device may also be provided. Figures 22(A) and 22(B) show an example. An alignment device 10 is disposed at each of the deposition positions JA to JD, and the illustrated example shows the alignment device 10 disposed at deposition position JA.

[0067] The alignment device 10 is an apparatus that receives the substrate W from the holding unit 6A, aligns the substrate W with the mask M, and overlays the substrate W on the mask M. The alignment device 10 has an arm member 11 with claws that hold the substrate W. The substrate W held by the holding unit 6A is released from the holding and placed on the arm member 11. The arm member 11 can be displaced in the X, Y, and θ directions by a drive unit 12, thereby adjusting the position of the substrate W placed on the arm member 11 in the X, Y, and θ directions. The drive unit 12 can be raised and lowered by a lifting unit 13.

[0068] The alignment device 10 also includes a plate unit 14 and an elevating unit 15 that raises and lowers the plate unit 14. The plate unit 14 is a plate for bringing the substrate W and the mask M into close contact with each other, and includes, for example, a magnet that attracts the iron mask M, and a cooler that cools the substrate W.

[0069] 22(A), during alignment, the camera 32 captures images of the alignment marks affixed to the substrate W and the mask M, respectively, and calculates the amount of misalignment between the substrate W and the mask M from the captured images. Then, the position of the substrate W is adjusted to reduce the calculated amount of misalignment. The position of the substrate W is adjusted by displacing the arm member 11 on which the substrate W is placed, with the drive unit 12, while the substrate W and the mask M are spaced apart from each other vertically.

[0070] The imaging by the camera 32 and the alignment of the substrate W and the mask M by adjusting the magnetic force of the magnetic element 71 may be repeated until the amount of misalignment between them falls within an allowable range. Once the alignment is complete, as shown in FIG. 22(B), the holding unit 6A retreats from the deposition position JA, and then the lifting unit 13 lowers the substrate W onto the mask M together with the drive unit 12 and the arm member 12 to overlap them, and further the lifting unit 15 lowers the plate unit 14 onto the substrate W to bring the substrate W and the mask M into close contact. In this state, film formation on the substrate W is performed.

[0071] When film formation is completed, the plate unit 14 is raised by the lifting unit 15. After the holding unit 6A is moved to the deposition position JA again, the lifting unit 13 raises the substrate W together with the drive unit 12 and the arm member 12, and the substrate W is transferred to the holding unit 6A.

[0072] <Fourth embodiment> It is also possible to transport the substrate W and mask M to the film formation chamber 3 using only the transport unit 4, without using the transport units 5A and 5B. Figures 23(A) to 23(D) show an example of this. In the illustrated example, corresponding holding units 6A and 6C are disposed at the deposition positions JA and JC. The holding units 6A and 6C are fixedly disposed and do not move. Each deposition position JA and JC is configured such that, from bottom to top, deposition sources 8, 8, mask tables 31, 31, and holding units 6A and 6C are disposed. The deposition source 8 may be fixed, but in this embodiment, it is movable as in the other embodiments. The mask M is placed in advance on the mask table 31.

[0073] As shown in FIG. 23(A), when the substrate W is transported from the intermediate transport device 101, the transport unit 4 receives the substrate W on the hand 44, and as shown in FIGS. 24(B) and 24(C), delivers the substrate W to the holding unit 6A at the deposition position JA. The deposition position JA also serves as the receiving position PA. The holding unit 6A holds the substrate W from above. The transfer of the substrate W is performed by the holding part 62, which is an electrostatic chuck. Therefore, the substrate W can be transferred by simply attaching it from the transport unit 4 to the holding part 62. Compared to the method of replacing the substrate W, there is no need to place the substrate W, and the transfer time can be shortened. This improves productivity. The alignment of the mask M and the substrate W can be performed by adjusting the position and orientation of the substrate W using the transport unit 4.

[0074] 23(D), the evaporation source 8 is moved in the Y direction to perform film formation on the substrate W held by the holding unit 6A. The film formation operation at the evaporation position JC is similar, and the substrate W can be transported and film formed in parallel at the evaporation positions JA and JC. After film formation is completed, the transport unit 4 receives the substrate W from the holding unit 6A or 6C and transports it to the intermediate transport device 102.

[0075] Fifth Embodiment In the first embodiment, the holder 62 that holds the substrate W is configured as an electrostatic chuck, but other suction methods may be used. Fig. 24 shows an example of such a method, illustrating the underside of the holder 62. A plurality of suction pads 65 are provided on the underside of the holder 62. The suction pads 65 are, for example, adhesive members that hold the substrate W by adhesive force. Alternatively, the suction pads 65 are vacuum pads.

[0076] Sixth Embodiment Next, an example of a method for manufacturing an electronic device will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device will be illustrated as an example of the electronic device.

[0077] First, the organic EL display device to be manufactured will be described. Fig. 25(A) is an overall view of an organic EL display device 50, and Fig. 25(B) is a diagram showing the cross-sectional structure of one pixel.

[0078] 25(A), a plurality of pixels 52, each including a plurality of light-emitting elements, are arranged in a matrix in a display region 51 of an organic EL display device 50. As will be described in detail later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

[0079] The term "pixel" as used herein refers to the smallest unit capable of displaying a desired color in the display region 51. In the case of a color organic EL display device, a pixel 52 is configured by a combination of multiple sub-pixels, each of which is a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B, each of which emits light differently from one another. The pixel 52 is often configured by a combination of three types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but is not limited to this. The pixel 52 may include at least one type of sub-pixel, preferably two or more types of sub-pixels, and more preferably three or more types of sub-pixels. The sub-pixels that make up the pixel 52 may be a combination of four types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element, for example.

[0080] Figure 25(B) is a partial cross-sectional schematic diagram taken along line AB in Figure 25(A). A pixel 52 has, on a substrate 53, multiple sub-pixels each composed of an organic EL element including a first electrode (anode) 54, a hole transport layer 55, any one of a red layer 56R, a green layer 56G, and a blue layer 56B, an electron transport layer 57, and a second electrode (cathode) 58. Of these, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively.

[0081] 25B , the hole transport layer 55 may be formed as a common layer across the plurality of sub-pixel regions, and the red layer 56R, the green layer 56G, and the blue layer 56B may be formed separately for each sub-pixel region on the hole transport layer 55. The electron transport layer 57 and the second electrode 58 may be formed separately for each sub-pixel region on the hole transport layer 55. The electron transport layer 57 and the second electrode 58 may be formed as a common layer across the plurality of sub-pixel regions on the hole transport layer 55.

[0082] In order to prevent short circuits between adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 60 is provided to protect the organic EL element from moisture and oxygen.

[0083] 25(B), the hole transport layer 55 and the electron transport layer 57 are shown as a single layer, but they may be formed of multiple layers including a hole blocking layer and an electron blocking layer depending on the structure of the organic EL display element. Furthermore, a hole injection layer having an energy band structure that can smoothly inject holes from the first electrode 54 to the hole transport layer 55 may be formed between the first electrode 54 and the hole transport layer 55. Similarly, an electron injection layer may be formed between the second electrode 58 and the electron transport layer 57.

[0084] Each of the red layer 56R, green layer 56G, and blue layer 56B may be formed of a single light-emitting layer or may be formed by laminating multiple layers. For example, the red layer 56R may be formed of two layers, with the upper layer being a red light-emitting layer and the lower layer being a hole-transporting layer or an electron-blocking layer. Alternatively, the lower layer may be a red light-emitting layer and the upper layer being an electron-transporting layer or a hole-blocking layer. By providing a layer below or above the light-emitting layer in this manner, the light-emitting position in the light-emitting layer can be adjusted, and the optical path length can be adjusted, thereby improving the color purity of the light-emitting element.

[0085] Although the example of the red layer 56R is shown here, a similar structure may be adopted for the green layer 56G or the blue layer 56B. The number of layers may be two or more. Furthermore, layers of different materials may be stacked, such as a light-emitting layer and an electron-blocking layer, or layers of the same material may be stacked, such as two or more light-emitting layers.

[0086] Next, an example of a method for manufacturing an organic EL display device will be specifically described. Here, it is assumed that the red layer 56R is made up of two layers, a lower layer 56R1 and an upper layer 56R2, and the green layer 56G and the blue layer 56B are made up of a single light-emitting layer.

[0087] First, a substrate 53 is prepared on which a circuit (not shown) for driving the organic EL display device and a first electrode 54 are formed. The material of the substrate 53 is not particularly limited, and it can be made of glass, plastic, metal, etc. In this embodiment, a substrate in which a polyimide film is laminated on a glass substrate is used as the substrate 53.

[0088] A resin layer such as acrylic or polyimide is coated by bar coating or spin coating on the substrate 53 on which the first electrode 54 is formed, and the resin layer is patterned by lithography so as to form an opening in the area where the first electrode 54 is formed, thereby forming an insulating layer 59. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0089] The substrate 53 with the patterned insulating layer 59 is carried into a first film-forming chamber, and a hole transport layer 55 is formed as a common layer on the first electrodes 54 in the display area. The hole transport layer 55 is formed using a mask in which openings are formed for each display area 51, which will ultimately become the panel portion of each organic EL display device.

[0090] Next, the substrate 53 on which the hole transport layer 55 has been formed is carried into a second film formation chamber. The substrate 53 and a mask are aligned, and the substrate is placed on the mask. A red layer 56R is then formed on the hole transport layer 55 in the portion of the substrate 53 where the red-emitting elements are to be disposed (the region where the red subpixels are to be formed). The mask used in the second film formation chamber is a high-resolution mask with openings formed only in the regions that will become the red subpixels among the regions on the substrate 53 that will become the subpixels of the organic EL display device. As a result, the red layer 56R including the red light-emitting layer is formed only in the regions that will become the red subpixels among the regions on the substrate 53 that will become the red subpixels. In other words, the red layer 56R is selectively formed in the regions that will become the red subpixels, but not in the regions that will become the blue or green subpixels among the regions on the substrate 53 that will become the subpixels.

[0091] Similar to the formation of the red layer 56R, the green layer 56G is formed in the third film formation chamber, and then the blue layer 56B is formed in the fourth film formation chamber. After the formation of the red layer 56R, green layer 56G, and blue layer 56B is completed, the electron transport layer 57 is formed over the entire display area 51 in the fifth film formation chamber. The electron transport layer 57 is formed as a layer common to the three color layers 56R, 56G, and 56B.

[0092] The substrate on which the layers up to the electron transport layer 57 have been formed is moved to a sixth film-forming chamber, where the second electrode 58 is formed. In this embodiment, each layer is formed by vacuum deposition in the first to sixth film-forming chambers. However, the present invention is not limited to this, and for example, the second electrode 58 in the sixth film-forming chamber may be formed by sputtering. Thereafter, the substrate on which the layers up to the second electrode 68 have been formed is moved to a sealing device, where the protective layer 60 is formed by plasma CVD (sealing step), thereby completing the organic EL display device 50. Note that although the protective layer 60 is formed by the CVD method here, the method is not limited thereto, and it may also be formed by the ALD method or the inkjet method.

[0093] Here, the films are formed in the first to sixth film formation chambers using masks having openings corresponding to the patterns of the respective layers to be formed. When forming the films, the relative positions of the substrate 53 and the masks are adjusted (aligned), and then the substrate 53 is placed on the mask and film formation is performed.

[0094] Seventh Embodiment In the first embodiment, the deposition source 8 is moved in at least one of the X direction and the Y direction by the moving unit 9 to form a film, but the deposition source 8 may be arranged as a moving unit, and the deposition source 8 may be moved below the substrate to form a film. Figures 26(A) and 26(B) and 27(A) and 27(B) show an example.

[0095] The moving unit 9'' moves along fixed rails 95. The moving unit 9'' is an example of a moving body according to this embodiment, which includes a battery (a battery 2704, which will be described later with reference to FIG. 27(A)) for moving between moving positions MA and MB. A charging unit 261 for charging the battery of the moving unit 9'' is also disposed in the film formation chamber 3. The moving position MA is a position where the moving unit 9'' is charged, and the moving position MB, indicated by the dotted line, is the turning back position where the moving unit 9'' is furthest from the moving position MA.

[0096] In the example of FIG. 26(A), the charging unit 261 is shown as being directly connected to the moving unit 9'', but charging may also be performed by wireless power supply or the like. Also, a charging terminal may be arranged on the fixed rail 95, and the charging unit 261 may be charged via the charging terminal. Also, the position at which the charging unit 261 is arranged is not limited to the position shown in FIG. 26(A), and it may be arranged at a position close to the loading / unloading opening for the substrate W. Also, multiple charging units 261 may be arranged on one moving unit 9'' to charge them simultaneously or at different times.

[0097] Next, with reference to Figures 27(A) and 27(B), the structure of the moving unit 9" will be described. The moving unit 9" is a moving mechanism for moving the vapor deposition unit 8 in the Y direction. The moving unit 9" includes two first guide rails 95A (first rail members) extending in a first direction, which is the Y direction, and first guide blocks 2703 (first movable members) installed on each of the first guide rails 95A and movable in the first direction. The first guide block 2703 supports an atmospheric box 2701 that supports the vapor deposition source 8. The first guide block 2703 receives a driving force from the first servo motor 2705 in the atmospheric box 2701 through a connection between a first pinion 2702 connected to the end of a rotation shaft of the first servo motor 2705 and a first rack 95B fixed to a base plate 2752, and moves in the Y direction on the first guide rails 95A. The first pinion 2702 and the first rack 95B correspond to the first driving force conversion mechanism of this embodiment, but the driving force conversion mechanism is not limited to this and may include other driving force conversion mechanisms that can convert the rotational driving force of a motor, which is a driving source, into linear driving force. For example, other driving force conversion mechanisms such as a ball screw may also be included. The battery 2704 supplies power to the first servo motor 2705 and receives power from the charging unit 261.

[0098] A lubricating material such as fluorine-containing grease is applied between the first guide rail 95A and the first guide block 2706, and between the first pinion 2702 connected to the end of the rotating shaft of the first servo motor 2705 and the first rack 95B fixed to the base plate 2752, in order to reduce frictional resistance.

[0099] The film formation system 1 according to this embodiment includes a first moving mechanism cover member installed adjacent to the moving unit 9'' so as to cover at least the lubrication portion (the portion to which the lubrication member is attached) of the moving unit 9'' that moves the deposition source 8 in the Y direction, in order to block a path of scattering of the lubrication member toward the substrate W. Specifically, as shown in FIG. 27(b), the film formation system 1 includes, as the first moving mechanism cover member, first cover members 2753 fixed to the first guide block 2703 and extending a predetermined length in the first direction from the front and rear ends of the first guide block 2703 in the first direction so as to cover at least a portion of the upper surface of the first guide rail 95A.

[0100] The first cover member 2753 is formed to surround the first guide rail 95A on three sides (i.e., the top surface and both side surfaces when viewed from the first direction) as shown in Figure 27(b) in order to more reliably block the path of scattering of the lubricating material from between the first guide rail 95A and the first guide block 20 toward the object to be deposited.

[0101] 27(a), the length of the first cover member 2753 in the first direction can be determined taking into consideration the degree to which the scattering path toward the substrate W is blocked and the degree of interference with other components of the film formation chamber 3. That is, the longer the length of the first cover member 2753 in the first direction, the more reliably the scattering path toward the substrate W can be blocked, but there is a possibility that the first cover member 2753 may hit, for example, the wall surface of the film formation chamber 3 at both ends of its movement in the first direction, so the length in the first direction can be determined taking into consideration the balance of these factors.

[0102] As shown in FIG. 27(B), the film formation system 1 may include, as the first movement mechanism cover member, a second cover member 2751 for blocking a scattering path of a lubricant applied between the first pinion 2702 and the first rack 95B (a lubricated portion of the first driving force conversion mechanism) in addition to the first cover member 2753. The second cover member 2751 is formed to cover at least the lubricated portion between the first pinion 2702 and the first rack 95B, as shown in FIG. 27(b). In order to more reliably block a scattering path of the lubricant, the second cover member 2751 is formed to cover not only at least a portion of the upper surface of the first pinion 2702 but also at least a portion of the outer side of the coupling portion between the first pinion 2702 and the first rack 95B (the side opposite the deposition source 8 from the first rack 95B when viewed from the first direction). Therefore, the second cover member 2751 extends vertically (third direction) from the outside of the first rack 95B, and its upper end has a shape that is bent toward the upper side of the first pinion 2702 (in a second direction that intersects with the first direction).

[0103] 27(A) and 27(B), the battery 2704 is described as supplying power to the first servo motor 2705. In one example, the battery 2704 may supply power to the deposition source 8 at the film formation positions JA and JB.

[0104] Eighth Embodiment In the seventh embodiment, the deposition source 8 is provided for each deposition position. However, a single deposition source may be used to perform film formation at a plurality of deposition positions.

[0105] An example of the moving unit 9'' will be described with reference to FIGS. 28(A) and 28(B). In the example of FIGS. 26(A) and 26(B), the moving unit 9'' supporting the vapor deposition source 8 is provided for each line and moves the vapor deposition source 8 in the Y direction. The moving unit 9'' shown in FIGS. 28(A) and 28(B) is movable in a second direction, which is the X direction, and moves the vapor deposition source 8 in multiple lines.

[0106] FIG. 28(A) is a top view of the deposition source 8. As shown in FIG. 28(A), the moving unit 9'' can perform a first movement of moving the deposition source 8 in the Y direction along the movable rail 94 and a second movement of moving the deposition source 8 and the movable rail 94 in the X direction along the fixed rail 95. Although the charging unit 261 is illustrated in FIG. 28(A) as being disposed on one of the lines, it may be disposed on multiple lines. The charging unit 261 may also be disposed between the two lines, for example, on a path along which the moving unit 9'' moves between multiple deposition positions. This allows easy access to the deposition positions JA and JB while the moving unit 9'' is charging, facilitating maintenance such as substrate alignment and mask or substrate replacement.

[0107] 27(B) shows the structures of the deposition source 8 and the moving unit 9″. Similar to the moving unit 9″ shown in FIG. 27(B), the moving unit 9″ shown in FIG. 28(B) includes a first pinion 2802 connected to the end of a rotation shaft of a first servo motor 2805 in an atmospheric box 2801. The first pinion 2802 is driven by the first servo motor 2805 to move along the movable rail 94, and has an engaging portion that engages with the moving unit 9″ so that the relative position of the moving unit 9″ and the movable rail 94 in the X direction does not change. The first servo motor 2805 receives power from a battery 2804 in the atmospheric box. The first pinion 2802 is driven by the first servo motor 2805, so that the moving box 9″ can move in the Y direction along the movable rail 94. The moving unit 9″ shown in FIG. 28(B) also includes a roller 2808 driven by a second servo motor 2806 that receives power from the battery 2804. The roller 2808 is supported by a rotation shaft 2807 that can adjust the position of the roller 2808 in the Z direction. When the roller 2808 is in contact with the base plate 2752, the second servo motor 2806 drives the roller 2808, thereby allowing the moving unit 9'' and the deposition source 8 supported thereby, as well as the movable rail 94 that engages with the engaging structure of the first pinion 2802, to move in the X direction.

[0108] On the other hand, when the moving unit 9'' is supported by the rotation axis 2807 so as not to come into contact with the base plate 2752, the moving unit 9'' does not move in the X direction, but is enabled to move along the movable rail 94 by the first pinion 2802 driven by the first servo motor 2805.

[0109] This allows one film formation source 8 to be moved between a plurality of lanes for forming films on substrates W in the film formation chamber 3 as shown in FIG. 28(A).

[0110] Ninth Embodiment The holding units 6A to 6D (collectively referred to as holding units 6), which are carriers (substrate carriers) for the substrate W, may be equipped with a battery, and the holding units 6 may be transported or the substrates or masks may be held using power supplied from the battery. Fig. 29 shows an example of a holding unit 6 equipped with a battery. The holding unit 6 shown in Fig. 29 is an example of a mobile body according to this embodiment equipped with a battery 2901 and a charging interface 2902.

[0111] The battery 2901 supplies power to the holder 62 (substrate holder), which is an electrostatic chuck, or the mask holder 63, which is an electromagnet. In one example, the permanent magnet 61 of the first embodiment may be configured as an electromagnet, and power to the electromagnet may be supplied from the battery 2901. In this case, a voltage control unit (not shown) may be provided that changes the voltage supplied from the battery 2901, like a linear motor, so that the holding unit 6 moves depending on whether the voltage is positive or negative.

[0112] Next, an example of movement of the holding unit 6 equipped with a battery will be described with reference to Fig. 30(A) and Fig. 30(B). In Fig. 30(A) and Fig. 30(B), the holding unit 6 is assumed to move by power supply from a battery 2901.

[0113] 30(A) is a diagram showing a state in which the holding unit 6 is moving from the receiving position PA to the deposition position JA for the substrate W. As described above, in FIG. 30(A), the holding unit 6 moves from the receiving position PA to the deposition position JA using power supplied from the battery 2901. Next, when the holding unit 6 moves to the charging unit 3001 provided at the deposition position JA, the charging unit 3001 charges the battery 2901 via the charging interface 2902. Charging from the charging unit 3001 may be performed in parallel with the deposition process. Note that, although FIG. 30(B) illustrates power supply from the charging unit 3001 via the charging interface 2902 connected to the charging unit 3001, charging of the battery 2901 may also be performed by contactless power supply, such as wireless power supply.

[0114] When the deposition process is completed, the holding unit 6 transports the substrate W from the deposition position JA to the receiving position PA. In one example, a charging unit 3001 for the battery 2901 may also be provided at the receiving position PA, or the charging unit 3001 may be provided only at the receiving position PA and not at the deposition position JA.

[0115] Tenth Embodiment In the first to eighth embodiments, the deposition source 8 moved by the moving unit 9" has been described as including a crucible that contains raw materials for the deposition substance, a heater that heats the crucible, and the like, and discharging the vapor of the deposition substance upward from the opening 8a. However, any other film formation unit may be used as long as it can discharge a film formation material. For example, the moving unit 9" may hold and move a film formation unit that performs a film formation process by sputtering and includes a cathode that applies a high voltage to the film formation material to generate a glow discharge and expel particles of the film formation material to form a thin film on the substrate W. In the ninth embodiment, a moving unit that holds and moves a film formation unit that performs a film formation process by sputtering will be described. Note that the same reference numerals are used for components similar to those in the first to eighth embodiments, and descriptions thereof will be omitted.

[0116] FIG. 31(A) shows a moving unit 9'' that holds and transports a film forming unit 8' for sputtering. The moving unit 9'' is similar to the moving unit 9'' described with reference to FIG. 27, and therefore a description thereof will be omitted.

[0117] The film forming unit 8' includes a target unit 3101 and a target control unit 3102. The target unit 3101 is supported by the target control unit 3102, which is fixed on a base plate 3100 disposed on the moving unit 9''. As shown in FIG. 31(B), the target unit 3101 includes a cylindrical target 3111, a cathode 3112 serving as an electrode disposed on the inner periphery of the target, and a magnet unit 3113 disposed inside the target. The target unit 3101 is rotatably supported by the target control unit 3102, and the magnet unit 3113 is supported in a fixed state. Note that although the magnet unit 3113 is not rotatable here, this is not a limitation, and the magnet unit 3113 may also rotate or swing.

[0118] 31(A), the battery 2704 may supply power to the target control unit 3102. That is, the battery 2704 provided in the moving unit 9'' may be used for moving the moving unit 9'' and for the film formation process of the film formation unit 8'. In another example, a battery may also be provided in the film formation unit 8' and charged by the charging unit 261 in FIG. 26. In this case, the battery provided in the film formation unit 8' is used for the film formation process, and the battery 2704 provided in the moving unit 9'' is used for the moving unit 9''.

[0119] <Other embodiments> The present invention can also be realized by supplying a program that realizes one or more functions of the above-described embodiments to a system or device via a network or a storage medium, and having one or more processors in the computer of the system or device read and execute the program. It can also be realized by a circuit (e.g., ASIC) that realizes one or more functions.

[0120] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0121] 1 film forming apparatus, 3 film forming chamber, 4 transport unit, 5A and 5B transport units, 6A to 6D holding units, 7A and 7B moving units, 8: evaporation source, 8': film forming unit, 9: moving unit

Claims

1. A film forming apparatus, a deposition source that emits a film forming material in a deposition direction; a moving means for moving the deposition source, the moving means including a battery; Equipped with The battery a supply of power to the moving means for moving the vapor deposition source in a first direction intersecting the vapor deposition direction along a first line, and moving the vapor deposition source in a second direction intersecting the vapor deposition direction and the first direction to a second line adjacent to the first line, and further moving the vapor deposition source in the first direction along the second line; Power is supplied by a charging unit disposed on a path along which the moving means moves between a first film formation position where a film is formed by the evaporation source on a substrate held by a first substrate holding unit that holds a substrate on the first line and a second film formation position where a film is formed by the evaporation source on a substrate held by a second substrate holding unit that holds a substrate on the second line. A film forming apparatus characterized by:

2. The film forming apparatus according to claim 1 , wherein a plurality of the charging units are arranged in the film forming apparatus.

3. 3. The film deposition apparatus according to claim 1, wherein at least one of the first substrate holding unit and the second substrate holding unit includes an electrostatic chuck that holds the substrate by electrostatic force.

4. A deposition source that emits a film-forming material; a moving unit that includes a battery, and that moves the evaporation source in a first direction intersecting an evaporation direction along a first line, moves the evaporation source in a second direction intersecting the evaporation direction and the first direction to a second line adjacent to the first line, and further moves the evaporation source in the first direction along the second line, a power supplying step of supplying power to the battery by a charging unit disposed on a path along which the moving means moves between a first film formation position where a film is formed by the evaporation source on a substrate held by a first substrate holding unit that holds a substrate on the first line and a second film formation position where a film is formed by the evaporation source on a substrate held by a second substrate holding unit that holds a substrate on the second line; a supply step of supplying power from the battery to the transportation means; a film forming step of forming a film on a substrate; A film forming method comprising the steps of:

5. A method for manufacturing an electronic device, comprising manufacturing an electronic device using the film formation method described in claim 4.

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