Photosensitive resin support structure and method for manufacturing same

Abstract

To provide a photosensitive resin support structure that has air dischargeability capable of suppressing air from stagnating, and also has sealability high enough to cause no ink permeation at a support end part so as to suppress a risk that a plate peels off from a plate cylinder in spite of long-period use.SOLUTION: A method of manufacturing a photosensitive resin support structure that includes a laminating process of laminating a support c, an adhesive layer d and a support b in this order to form a laminate, and a pressure bonding process of performing pressure bonding of the laminate. In the pressure bonding process, a rate of variation in turbidity of the press-bonded part of the laminate ((the turbidity of the laminate before the pressure bonding-the turbidity of the laminate after the pressure bonding) / the turbidity of the laminate before the pressure bonding×100) is 2.0% or larger, and the adhesive layer d has a recessed part open on a second surface on the opposite side from a first surface contacting the support b, the recessed part being 10 μm or larger deep.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a photosensitive resin supporting structure and a method for producing the same. [Background technology]

[0002] Most production processes for relief plates using photosensitive resins include an exposure step in which a photosensitive resin composition layer molded to a certain plate thickness is irradiated with actinic rays to harden only the photosensitive resin composition layer that will become the relief portion of the printing plate through a photopolymerization reaction, followed by a development step in which the unhardened photosensitive resin composition outside the relief portion is dissolved and removed with a specified cleaning solution (developer) or swelled and dispersed to mechanically remove it, thereby revealing only the hardened portion as a relief on the plate surface.

[0003] Relief plates using the above-mentioned photosensitive resins are widely used for flexographic printing and pattern making. A support is used to fix the photocured product of the photosensitive resin composition to form the relief. In any of the above applications, the resulting relief plate is used by attaching the back surface of the support to an object according to the application using a removable adhesive. Here, the support also plays a role in ensuring the ease of handling, mechanical strength, and dimensional accuracy of the relief plate. As such a support, for example, Patent Document 1 discloses a support structure having a pressure-sensitive adhesive layer pre-formed on the surface of the support opposite to the surface that comes into contact with the photosensitive resin. Another method for attaching a relief plate to an object is to attach the back surface of the support to the object with double-sided tape.

[0004] Patent Document 1 discloses a support structure in which an adhesive layer (a pressure-sensitive adhesive layer in the present invention) and a protective film are provided on a support. The support structure described in Patent Document 1 is characterized by having an air passage on the surface opposite to the surface in contact with the support, which is in communication with the adhesive layer when the protective film is peeled off.

[0005] However, when the photosensitive resin support structure disclosed in Patent Document 1 is used in applications in which a high-definition relief is formed on a support by exposure means from the back of the support (for example, the method for making a molded plate disclosed in Patent Document 2, the method for forming a registration mark when attaching a flexographic printing plate to a desired position disclosed in Patent Document 3, and the application of forming printing plate information on a support disclosed in Patent Document 4), the curing properties of the photosensitive resin composition differ between the air passage portions of the adhesive layer or pressure-sensitive adhesive layer and other portions, and therefore the desired relief shape may not be obtained.

[0006] Patent Document 5 discloses a photosensitive isomeric resin support structure that equalizes the curing properties of a photosensitive resin composition by reducing the difference in ultraviolet transmittance between the air passage portion of the adhesive layer and other portions. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Patent No. 3094647 [Patent Document 2] Japanese Patent Application Laid-Open No. 2004-317978 [Patent Document 3] Japanese Patent Application Publication No. 61-32058 [Patent Document 4] Japanese Patent Application Laid-Open No. 2000-181051 [Patent Document 5] Japanese Patent Application Laid-Open No. 2007-139911 Summary of the Invention [Problem to be solved by the invention]

[0008] However, when the photosensitive resin support structure disclosed in Patent Document 5 is cleaned with a cleaning liquid while attached to a plate cylinder, the cleaning liquid penetrates into the air passage portion of the adhesive layer, resulting in insufficient sealing and the risk of the photosensitive resin support structure peeling off from the plate cylinder, leaving room for improvement.

[0009] Therefore, in order to prevent the penetration of the cleaning liquid, there is a need for a photosensitive resin support structure that has adhesive properties, has an air passage portion to suppress the occurrence of air pockets, has sufficient sealing properties, and suppresses the plate from peeling off from the plate cylinder.

[0010] Therefore, the present invention aims to provide a photosensitive resin support structure that has air-releasing properties that can suppress the occurrence of air pockets, and also has sufficient sealing properties to prevent ink penetration into the edge of the support, in order to reduce the risk of the plate peeling off from the plate cylinder even after long-term use. [Means for solving the problem]

[0011] As a result of intensive research into solving the above problems, the inventors discovered that the above problems can be solved by using a photosensitive resin support structure with a specific configuration, and thus completed the present invention. That is, the present invention is as follows.

[0012] [1] a lamination step of laminating a support (c), a pressure-sensitive adhesive layer (d), and a support (b) in this order to form a laminate; a compression bonding step of compressing the laminate, In the pressure-bonding step, the rate of change in turbidity of the pressure-bonded portion of the laminate ((turbidity of the laminate before pressure-bonding - turbidity of the laminate after pressure-bonding) / turbidity of the laminate before pressure-bonding × 100) is set to 2.0% or more, A method for producing a photosensitive resin support structure, wherein the pressure-sensitive adhesive layer d has an open recess on a second surface opposite to the first surface in contact with the support b, and the depth of the recess is 10 μm or more. [2] The method for producing a photosensitive resin supporting structure according to [1], wherein the pressure-sensitive adhesive layer d is present on the entire surface of the support b on the support c side. [3] The method for producing a photosensitive resin supporting structure according to [1] or [2], wherein the pressure-sensitive adhesive layer d includes a support e. [4] The method for producing a photosensitive resin supporting structure according to any one of [1] to [3], further comprising a photosensitive resin layer forming step between the laminating step and the pressure-bonding step, in which a photosensitive resin layer a is laminated on the surface of the support b of the laminate opposite to the surface in contact with the pressure-sensitive adhesive layer d. [5] [1] to [4], the method for producing a photosensitive resin support structure according to any one of [1] to [4], wherein in the pressure-bonding step, pressure is applied in the direction of the support c from the surface of the support b opposite to the surface in contact with the pressure-sensitive adhesive layer d. [6] The method for producing a photosensitive resin supporting structure according to any one of [1] to [5], wherein in the pressure-bonding step, a range of at least 2 mm in width is pressure-bonded from the end of the pressure-sensitive adhesive layer d toward the center of the surface. [7] The method for producing a photosensitive resin supporting structure according to any one of [1] to [5], wherein in the pressure-bonding step, a range of at least 10 mm in width is pressure-bonded from the end of the pressure-sensitive adhesive layer d toward the center of the surface. [8] The pressure during the compression step is 300 g / cm 2 More than 5000g / cm 2 A method for producing a photosensitive resin supporting structure according to any one of [1] to [7], wherein the method comprises: [9] A method for producing a photosensitive resin relief plate, comprising: a production step of producing a photosensitive resin structure by the production method according to any one of [1] to [8]; an exposure step of arranging the photosensitive resin support structure produced in the production step and a negative film and irradiating the negative film with actinic rays from the back side thereof; and a development step of removing the photosensitive resin composition in an area not irradiated with the actinic rays in the exposure step.

[10] a laminate in which a support c, a pressure-sensitive adhesive layer d, and a support b are laminated in this order, the laminate has a pressure-bonded portion in a part thereof, and the turbidity of the pressure-bonded portion of the laminate is 30% or less; The difference in turbidity between the crimped portion and the un-crimped portion ((turbidity of the laminate in the un-crimped portion - turbidity of the laminate in the crimped portion) / turbidity of the laminate in the un-crimped portion × 100) is 2.0% or more, The pressure-sensitive resin supporting structure, wherein the pressure-sensitive adhesive layer (d) has an open recess on a second surface opposite to the first surface in contact with the support (b), and the depth of the recess is 10 μm or more.

[11] The photosensitive resin support structure according to

[10] , wherein the pressure-sensitive adhesive layer d is present on the entire surface of the support b on the support c side.

[12] The photosensitive resin support structure according to

[10] or

[11] , wherein the pressure-sensitive adhesive layer d includes a support e. [Effects of the Invention]

[0013] According to the present invention, for example, in a case where a photosensitive resin support structure having an adhesive function is configured to have an air passage portion, it is possible to provide a photosensitive resin support structure that achieves sufficient air escape properties that suppress the occurrence of air pockets, and also achieves sealing properties that completely prevent ink penetration. [Brief explanation of the drawings]

[0014] [Figure 1] 1 shows a schematic cross-sectional view of an example of a structure forming a photosensitive resin support structure. [Figure 2] FIG. 2 is a schematic cross-sectional view showing an example of a state in which a pressure-sensitive adhesive layer in a photosensitive resin support structure comes into contact with an adherend. [Figure 3] 1A and 1B are schematic cross-sectional views of a structure forming a photosensitive resin supporting structure before and after contact with an adherend, respectively. [Figure 4] 1 shows a schematic cross-sectional view of an example of a photosensitive resin supporting structure of the present invention. [Figure 5] 1 shows a schematic top view of an example of a photosensitive resin support structure of the present invention. [Figure 6] FIG. 1 shows a schematic diagram of an apparatus for evaluating the sealing property of a photosensitive resin support structure. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, an embodiment of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail. It should be noted that the following embodiment is an example for explaining the present invention, and is not intended to limit the present invention to the following content. The present invention can be implemented in various modifications within the scope of its gist. In the drawings, the same elements are given the same reference numerals, and duplicate explanations will be omitted. Furthermore, positional relationships such as up, down, left, and right are based on the positional relationships shown in the drawings unless otherwise specified. Furthermore, the dimensional ratios of the drawings are not limited to those shown in the drawings.

[0016] [Method for producing photosensitive resin support structure] The method for producing a photosensitive resin supporting structure of this embodiment includes the steps of: a lamination step of laminating a support (c), a pressure-sensitive adhesive layer (d), and a support (b) in this order to form a laminate; a compression bonding step of compressing the laminate, In the pressure-bonding step, the rate of change in turbidity of the pressure-bonded portion of the laminate ((turbidity of the laminate before pressure-bonding - turbidity of the laminate after pressure-bonding) / turbidity of the laminate before pressure-bonding × 100) is set to 2.0% or more, The pressure-sensitive adhesive layer d has an open recess on a second surface opposite to the first surface in contact with the support b, and the depth of the recess is 10 μm or more. The photosensitive resin support structure obtained by such a manufacturing method, for example, when the photosensitive resin support structure having adhesive function is configured to have an air passage portion, can achieve sufficient air escape properties that suppress the occurrence of air pockets, and can also achieve sealing properties that completely prevent ink penetration.

[0017] The thickness of the support b is preferably 10 μm or more and 500 μm or less, and more preferably 50 μm or more and 250 μm or less. The thickness of the support c is preferably 10 μm or more and 500 μm or less, and more preferably 50 μm or more and 250 μm or less. The thickness of the pressure-sensitive adhesive layer d is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 100 μm or less.

[0018] The areas of the support b and the adhesive layer d are preferably equal, and the area of ​​the support c is preferably larger than the areas of the support b and the adhesive layer d.

[0019] In the bonding step, the rate of change in turbidity of the bonded portion of the laminate is preferably 2.0% to 5.0%, more preferably 2.0% to 4.0%, even more preferably 2.0% to 3.5%, and particularly preferably 2.1% to 3.2%. If the rate of change in turbidity of the bonded portion of the laminate is within the above range in the bonding step, the resulting photosensitive resin support structure tends to maintain excellent sealing properties for a longer period of time due to improved adhesion between the support c and the pressure-sensitive adhesive layer d. In the pressing step, the method for controlling the rate of change in turbidity of the pressed portion of the laminate to the above-mentioned specific range is not particularly limited, but examples thereof include a method of adjusting the pressing force using a roller or the like. In this embodiment, the rate of change in turbidity of the pressed portion of the laminate can be measured by the method described in the examples below.

[0020] In the pressure-sensitive adhesive layer d, the depth of the recesses is preferably 10 μm to 40 μm, more preferably 10 μm to 35 μm, and even more preferably 10 μm to 30 μm. When the depth of the recesses in the pressure-sensitive adhesive layer d is within the above range, the photosensitive resin support structure tends to have less air trapping and better sealing properties. The method for controlling the depth of the recesses in the pressure-sensitive adhesive layer d to the specific range described above is not particularly limited, but may include, for example, a method in which the recesses and protrusions on the liner are processed to a predetermined size in advance. In this embodiment, the depth of the recess can be measured by the method described in the examples below.

[0021] The pressure-sensitive adhesive layer d is preferably present on the entire surface of the support b facing the support c. When the pressure-sensitive adhesive layer d is present on the entire surface of the support b facing the support c in this manner, the photosensitive resin support structure tends to have excellent sealing properties.

[0022] The pressure-sensitive adhesive layer d may include a support e. Specifically, for example, the pressure-sensitive adhesive layer d may be a pressure-sensitive adhesive layer (for example, a double-sided tape) including a support e between two pressure-sensitive adhesive layers d1 and d2.

[0023] It is preferable that the method further includes, between the lamination step and the pressure-bonding step, a photosensitive resin layer formation step of laminating a photosensitive resin layer a on the surface of the support b of the laminate opposite to the surface in contact with the pressure-sensitive adhesive layer d. Therefore, the photosensitive resin support structure of this embodiment also includes a case where it includes a photosensitive resin layer a. Fig. 4 shows a schematic cross-sectional view of an example of a photosensitive resin support structure of this embodiment, and Fig. 5 shows a schematic top view of an example of a photosensitive resin support structure of this embodiment. As shown in Fig. 4, the photosensitive resin support structure of this embodiment preferably has a laminate in which, from bottom to top, a support c, a pressure-sensitive adhesive layer d, and a support b are laminated, and further has a photosensitive resin layer a on the surface of support b opposite to the surface in contact with the pressure-sensitive adhesive layer d.

[0024] In the pressure-bonding step, it is preferable to apply pressure from the surface of the support b opposite to the surface in contact with the pressure-sensitive adhesive layer d toward the support c. By applying pressure in this manner, when working on a workbench or the like, for example, the photosensitive resin a as shown in Fig. 4 does not come into contact with the workbench, which tends to reduce the risk of scratches, stains, and the like.

[0025] In the pressure-bonding step, the pressure-bonded portion of the laminate preferably has a width of at least 2 mm from the edge of the pressure-sensitive adhesive layer d toward the center of the surface, and more preferably a width of at least 10 mm. Here, the edge refers to, for example, the peripheral portion f of the support b when the surface area of ​​the support b is smaller than that of the support c and the pressure-sensitive adhesive layer d is present over the entire surface in contact with the support b, as in the photosensitive resin support structure shown in Figure 5.

[0026] The pressure during the compression step is 500 g / cm 2 More than 5000g / cm 2 It is preferable that the density is 800 g / cm or less. 2 More than 2000g / cm 2 More preferably, it is:

[0027] The temperature during the compression bonding step is preferably 0°C or higher and 50°C or lower, more preferably 10°C or higher and 40°C or lower, and even more preferably 20°C or higher and 30°C or lower.

[0028] The specific method of pressure bonding in the pressure bonding step is not particularly limited, but examples thereof include a method of applying a load to the laminate with a roller, a finger, a nail, or a spatula.

[0029] [Photosensitive resin support structure] The photosensitive resin support structure of the present embodiment includes a laminate in which a support c, a pressure-sensitive adhesive layer d, and a support b are laminated in this order, the laminate has a pressure-bonded portion in a part thereof, and the pressure-bonded portion of the laminate has a turbidity of 30% or less, The difference in turbidity between the crimped portion and the un-crimped portion ((turbidity of the laminate in the un-crimped portion - turbidity of the laminate in the crimped portion) / turbidity of the laminate in the un-crimped portion × 100) is 2.0% or more, The pressure-sensitive adhesive layer d has an open recess on a second surface opposite to the first surface in contact with the support b, and the depth of the recess is 10 μm or more. The photosensitive resin support structure of this embodiment has such characteristics, and therefore has, for example, sufficient air release properties that suppress the occurrence of air pockets, and also has sealing properties that completely prevent ink penetration. In the photosensitive resin support structure of this embodiment, the turbidity of the laminate in the unbonded portion refers to the maximum value of the turbidity of the laminate, and the turbidity of the laminate in the bonded portion refers to the minimum value of the turbidity of the laminate.

[0030] In this embodiment, the turbidity of the laminate can be measured by the method described in the examples below.

[0031] In the laminate, the difference in turbidity between the bonded portion and the unbonded portion ((turbidity of the laminate in the unbonded portion - turbidity of the laminate in the bonded portion) / turbidity of the laminate in the unbonded portion x 100) is preferably 2.0% or more and 5.0% or less, more preferably 2.0% or more and 4.0% or less, even more preferably 2.0% or more and 3.5% or less, and particularly preferably 2.1% or more and 3.2% or less.

[0032] The pressure-sensitive adhesive layer d is preferably present on the entire surface of the support b facing the support c. When the pressure-sensitive adhesive layer d is present on the entire surface of the support b facing the support c in this manner, the photosensitive resin support structure tends to have excellent sealing properties.

[0033] The pressure-sensitive adhesive layer d may include a support e. Specifically, for example, the pressure-sensitive adhesive layer d may be a pressure-sensitive adhesive layer (for example, a double-sided tape) including a support e between two pressure-sensitive adhesive layers d1 and d2.

[0034] The photosensitive resin support structure of this embodiment is formed, for example, as shown in the schematic cross-sectional view of Figure 1, using a structure 1 that forms a photosensitive resin support structure having a support 2 (corresponding to support b) and an adhesive layer 3 (corresponding to adhesive layer d) on the support 2. As shown in FIG. 1, the pressure-sensitive adhesive layer 3 preferably has a recess 3h that opens onto a second surface 3b opposite to a first surface 3a that contacts the support 2. As shown in Figure 1, a liner 4 having convex portions (which is temporarily placed before laminating the support c) may be laminated on the second surface 3b of the adhesive layer 3, and it is preferable that the concave portions 3h of the adhesive layer 3 are formed by the convex portions of the liner 4. By using the structure 1 having the above configuration, it is possible to form a photosensitive resin support structure that can obtain sufficient air release properties by suppressing the occurrence of air pockets and also achieve sufficient sealing properties. As shown in FIG. 1, an adhesive layer 5 may be provided on the surface of the support 2 opposite to the surface in contact with the pressure-sensitive adhesive layer 3 .

[0035] The photosensitive resin supporting structure of this embodiment may include a photosensitive resin layer a on the surface of the support b of the laminate opposite to the surface in contact with the pressure-sensitive adhesive layer d. The photosensitive resin that can be used in the photosensitive resin support structure of this embodiment is preferably a known photosensitive resin that undergoes a radical reaction upon irradiation with actinic rays, resulting in polymerization and hardening. Examples of such photosensitive resins include, but are not limited to, liquid photosensitive resins obtained by mixing an ethylenically unsaturated compound and a photopolymerization initiator with a prepolymer made of unsaturated polyester, unsaturated polyurethane, or the like, and solid photosensitive resins obtained by adding an ethylenically unsaturated compound and a photopolymerization initiator to a polymer binder selected from styrene-butadiene copolymer rubber, styrene-isoprene copolymer rubber, methyl methacrylate resin, partially saponified polyvinyl acetate, water-soluble polyamide, unsaturated polyurethane, and a hydrophilic copolymer synthesized by emulsion polymerization.

[0036] The photosensitivity characteristics of the photosensitive resin can be adjusted by selecting a material from known photoinitiators (Yashiro Keiichi, "Photocuring Technology Data Book," Technonet Co., Ltd., 2000, pp. 122-133) depending on the type of actinic ray used in the exposure process, and the effective wavelength range of the actinic ray refers to the central wavelength range within the wavelength distribution of the irradiation light from the exposure light source. In order for the photosensitive resin support structure of this embodiment to fully exhibit its effects in, for example, a flexographic printing plate or a molded plate, it preferably has the light transmission characteristics described below for exposure light sources used in the manufacture of these relief plates, such as high-pressure mercury lamps, ultra-high-pressure mercury lamps, ultraviolet fluorescent lamps, carbon arc lamps, and xenon lamps; that is, it preferably has light transmission characteristics for actinic rays having a central wavelength range of 300 to 400 nm.

[0037] (Support b) The support b used in the photosensitive resin support structure of this embodiment preferably has a function of reinforcing the relief plate finally obtained after laminating and curing the photosensitive resin layer a thereon and maintaining it in a predetermined shape. Such a support b can be appropriately selected from those commonly used as supports depending on the purpose. The material of the support b is not particularly limited, but in order for the photosensitive resin support structure of this embodiment to form an image by exposure from the support b side, it is preferable that the support b has a predetermined transmittance to actinic rays with a wavelength of 350 nm, as described below. The support b that can be preferably applied is a plastic film or sheet whose material itself has a relatively good thickness accuracy, such as a polyester film, a polypropylene film, or a polyvinyl chloride film. When the support b is a plastic film, the thickness of the support is preferably in the range of 10 μm to 500 μm, but from the viewpoint of obtaining sufficient strength to support the relief plate and from the viewpoint of economy, the thickness is more preferably 50 μm to 250 μm. As a plastic film of such a thickness, a polyester film is preferred.

[0038] (adhesive layer) An adhesive layer may be provided on the surface of the support (b) opposite to the surface in contact with the pressure-sensitive adhesive layer (d), on which the photosensitive resin layer (a) is laminated, in order to enhance adhesion to the photosensitive resin layer (a). This adhesive layer is preferably formed by applying an adhesive material to the support b, or by modifying the surface of the support b by corona treatment or the like. The adhesive material is not particularly limited, and for example, a material known as an adhesive for supports for photosensitive resin plates can be used. For example, an adhesive material can be appropriately selected from those described in Japanese Patent Publication Nos. 48-6563 and 49-43561, taking into consideration the chemical properties of the photosensitive resin. A dye or an ultraviolet absorber may be added to this adhesive layer for the purpose of preventing halation and adjusting the ultraviolet transmission wavelength range. The thickness of the adhesive layer is preferably within the range of 0.1 to 10 μm.

[0039] (adhesive layer d) The adhesive layer d used in the photosensitive resin support structure of this embodiment is preferably used to attach a plate having a relief of the cured product of the photosensitive resin layer a laminated on the support b to the surface of an adherend (corresponding to the support c) that varies depending on the application. The adhesive layer d is disposed on the surface of the support b opposite to the surface on which the photosensitive resin layer a is formed. The adherend (corresponding to support c) is not particularly limited, but examples thereof include a carrier sheet when a printing plate having a relief of a cured product of a photosensitive resin composition layer laminated on support b is used in a printing process. A specific example of such a configuration is one in which, as shown in FIG. 2, a plate is formed from the cured product of the photosensitive resin layer, and the recess-forming surface of the photosensitive resin support of this embodiment having an adhesive layer 3 on a support 2 is in contact with the plate cylinder via a specified carrier sheet. The adhesive constituting the adhesive layer d is not limited to the following, but examples thereof include known adhesives such as acrylic adhesives, rubber adhesives, silicone adhesives, urethane adhesives, polyester adhesives, and vinyl acetate adhesives ("Encyclopedia of Adhesion and Adhesion," edited by Yamaguchi Shozaburo, Asakura Shoten, 1986, pp. 118-169), from which an appropriate adhesive is selected in consideration of transparency to actinic rays, adhesive strength and peel strength to the support b or liner, solvent resistance to the developer, and the like. Among these, adhesives that can be suitably used for the photosensitive resin support structure of this embodiment are preferably removable pressure-sensitive adhesives that do not permanently adhere, so as to enable correction of the attachment position of the printing plate or replacement due to design changes, and acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, and silicone-based pressure-sensitive adhesives are preferred.

[0040] <recess> In order to prevent air pockets from forming between the surface of the adhesive layer d and the surface of the adherend when the relief plate is attached to the surface of the adherend, the adhesive layer d has recesses on its second surface opposite to the first surface that contacts the support b, which serve as communicating air passages that are open when the liner is peeled off. The recesses are preferably formed continuously from one end to the other end of the pressure-sensitive adhesive layer d, which can effectively prevent air pockets from forming between the surface of the adherend. The cross-sectional shape of the air passage formed by the recesses is not particularly limited, and examples thereof include rectangular, wedge, semicircular, etc. The depth of the recesses is 10 μm or more and may be shallower than the thickness of the adhesive layer d. In a structure having air passages formed by recesses, it is preferable that the passages are interconnected, but there are no particular limitations on the planar pattern of the air passages, and they may be formed, for example, in a striped, lattice, mesh or curved shape. Furthermore, the pressure-sensitive adhesive layer d itself may be an interconnected porous body, a laminate of fibrous pressure-sensitive adhesives, or a combination of these, thereby achieving the desired breathability. A thin film layer may be provided in the pressure-sensitive adhesive layer d for the purpose of reinforcement.

[0041] <Method for forming pressure-sensitive adhesive layer d> In the photosensitive resin support structure of this embodiment, the method for forming the adhesive layer d having recesses that are open, communicating air passages is not particularly limited, but examples thereof include the following method. For example, a method can be mentioned in which a predetermined pattern is formed on a liner forming roll that will become the pattern of the air passage, the liner is patterned with the forming roll, an adhesive is applied to the liner, it is dried, and a support b is attached to form an adhesive layer d. When the adhesive is applied, the adhesive may be in a state of being dissolved or dispersed in a volatile solvent, or may be in a molten state. Other methods for forming the adhesive layer d include, but are not limited to, a method in which the adhesive is extracted from a nozzle in a periodic pattern relative to the flow direction of the support roll, a method in which the adhesive is projected in a dotted pattern from a nozzle, a method in which the adhesive is first applied to the entire surface of the support and then scraped off with a fingernail having the desired cross-sectional shape and pitch, a method in which the adhesive surface is impressed with a roll having the desired relief shape and pattern, a method in which the adhesive is foamed and porous using a foaming agent and then coated on the support, and a method in which the adhesive is extruded into a fibrous form and then laminated on the support 2. The above-mentioned methods may be used alone or in combination of two or more.

[0042] In order to manufacture the photosensitive resin support structure of this embodiment as a long sheet with excellent productivity, it is preferable to form continuous recesses, which are air passages for the pressure-sensitive adhesive layer, in the support sheet by any of the methods described above. An example of a structure forming the photosensitive resin support structure of this embodiment is a structure in which a pressure-sensitive adhesive layer d is laminated on a support b, and a liner is further laminated on the pressure-sensitive adhesive layer d. When such structures are stacked and stored, there is a risk of the uneven shape of the pressure-sensitive adhesive layer d being transferred, the pressure-sensitive adhesive overflowing from the edge of the structure due to cold flow, and blockage of the air passage. Therefore, in the photosensitive resin support structure of this embodiment, it is preferable to appropriately select the thickness of the pressure-sensitive adhesive layer d and the opening width and depth of the recesses that serve as air passages, depending on the adhesive strength and flexibility of the pressure-sensitive adhesive used, so as to maintain sufficient strength and prevent the above-mentioned phenomena.

[0043] (liner) In the structure forming the photosensitive resin support structure of this embodiment, a liner having convex portions may be laminated on the second surface of the pressure-sensitive adhesive layer d, and it is preferable that the concave portions of the pressure-sensitive adhesive layer d are formed by the convex portions. A liner is laminated to the adhesive layer d to protect it during handling and during the plate making and plate mounting process. The liner should be resistant to the aqueous, alcoholic, or hydrocarbon-based developers used in the platemaking process. Examples of such liners include, but are not limited to, transparent plastic films made from polyester, polypropylene, polyethylene, propylene-ethylene copolymer, soft polyvinyl chloride, polyamide, and acrylic resin. The thickness of the liner is preferably 5 μm to 200 μm.

[0044] The surface of the liner opposite to the surface in contact with the pressure-sensitive adhesive layer d is preferably uniformly roughened to facilitate vacuuming during plate making. Excessive roughening is not necessary; for example, a 10-point average roughness (Rz) of about 0.1 μm according to the JIS standard is sufficient. The roughening method is not particularly limited, but examples include sandblasting and chemical etching. Other examples include the resin mat method, which roughens the surface when forming films and sheets used as protective films.

[0045] The adhesive strength of the adhesive layer d is adjusted as needed, but the adhesive strength to the support b (for example, the adhesive strength on the first surface 3a in FIG. 1) is preferably 100 g / 25 mm or more, more preferably 200 g / 25 mm or more, in terms of the adhesive strength (180-degree adhesive strength) when a 25 mm wide test piece is left at 20°C for one week to stabilize the adhesive strength and then peeled in a 180-degree direction at a rate of 300 mm / min. If the 180-degree adhesive strength is 200 g / 25 mm or more, peeling tends to be suppressed in practice even in thick plates with a relief thickness of 3 mm or more. The adhesive strength of the adhesive layer d to the receiving surface to which the relief plate is to be attached (for example, the adhesive strength on the second surface 3b in FIG. 1) is preferably equal to or less than the adhesive strength to the support b, because if the adhesive strength to the support b is weaker, there is a risk that the adhesive layer d will peel off from the support b and be transferred to the receiving surface when the attached relief plate is to be removed. When the support b and the receiving surface are made of the same material, it is preferable to provide a known anchor coat layer on the surface of the support b in advance, or to corona-treat the support coated with an adhesive to increase the adhesive strength, in order to set the adhesive strength between the adhesive layer d and the support b higher than the adhesive strength between the adhesive layer d and the receiving surface.

[0046] The adhesive strength between the adhesive layer d and the liner is preferably adjusted to be smaller than the adhesive strength with the support b described above in order to enable peeling of the liner. From the viewpoint of preventing peeling of the liner during handling or the plate-making process and facilitating peeling of the liner, the 180-degree adhesive strength is preferably adjusted to 1 to 200 g / 25 mm, more preferably 5 to 100 g / 25 mm, and even more preferably 10 to 50 g / 25 mm. When the support b and the liner are made of the same material, it is effective to provide a release agent layer on the surface of the liner that comes into contact with the adhesive layer d in order to set the adhesive strength between the adhesive layer d and the liner lower than the adhesive strength between the adhesive layer d and the support b. As the release agent, known release agents that are commonly used in adhesive tapes, for example, silicone-based release agents and fluororesins, can be used.

[0047] [Method for manufacturing a photosensitive resin relief plate] The photosensitive resin supporting structure of this embodiment is preferably used in the production of a photosensitive resin relief plate, which includes an exposure step of irradiating a photosensitive resin composition layer with actinic rays. A method for producing a photosensitive resin relief plate using the photosensitive resin support structure of this embodiment will be described. The method for producing a photosensitive resin relief plate preferably includes an exposure step, a development step, and then, if necessary, a post-exposure step and a drying step. The exposure step more preferably includes a step of arranging a negative film and the photosensitive resin support structure of this embodiment (including a photosensitive resin layer) and irradiating the negative film with actinic rays from the back side, and it is even more preferable that the actinic rays irradiated have a central wavelength in the range of 300 to 400 nm.

[0048] Other actions in the exposure step are not limited in any way, and for example, measures may be taken to reduce scattered light of the actinic rays used in the exposure step and increase parallelism, or a step may be included in which a protective film is adhered to the surface of the photosensitive resin layer a opposite to the surface that contacts the support b, and actinic rays having a central wavelength in the range of 300 to 400 nm are irradiated through a negative film of an image different from the negative film on the support side.

[0049] After the exposure step, a development step is preferably carried out to remove the photosensitive resin composition in the area not irradiated with actinic rays, and the development method is not particularly limited as long as it is a method that can remove the uncured photosensitive resin composition. For example, there can be mentioned a method using a liquid (developer) that can dissolve, disperse, and swell the photosensitive resin composition, a method of removing the uncured photosensitive resin composition with high-pressure water or compressed air in an environment where the uncured photosensitive resin composition has fluidity, a method of wiping with a nonwoven fabric, etc.

[0050] When conventional photosensitive resin support structures are applied to a liquid development process, the developer tends to seep into the recesses in the pressure-sensitive adhesive layer, which serve as air passages, during the development process. In this case, when the liner is peeled off to attach the plate, the developer that has seeped in may emit an unpleasant odor, creating an unhygienic environment, or may act on the pressure-sensitive adhesive layer, causing fluctuations in performance, or causing the photosensitive resin support structure to peel off from the adherend. On the other hand, in the photosensitive resin support structure of this embodiment, the turbidity of the laminate is 30% or less, and the pressure-sensitive adhesive layer d has an open recess on the second surface opposite to the first surface in contact with the support b, and the depth of the recess is 10 μm or more, thereby realizing sufficient air release properties that suppress the occurrence of air pockets, and also achieving sufficient sealing properties. [Example]

[0051] Hereinafter, the present embodiment will be described in more detail with reference to specific examples and comparative examples, but the present embodiment is not limited to the following examples and comparative examples.

[0052] [Examples 1 to 12], [Comparative Examples 1 to 16] A structure for forming a photosensitive resin support structure as shown in FIG. 3(A) was prepared as follows. First, a rectangular liner 4 made of polyethylene terephthalate (PET) was embossed to form a grid-like uneven portion of a predetermined height on the surface of the liner 4. Next, an adhesive was applied onto the liner 4 and dried to form an adhesive layer 3 with a thickness of 57 μm. The size and shape of the adhesive layer 3 were a rectangle measuring 50 mm × 150 mm. The height of the convex portions on the surface of the liner 4 that contacts the adhesive layer 3 was adjusted appropriately to control the depth of the concave portions in the adhesive layer 3 as shown in Table 1. However, in Comparative Examples 1 to 4, an adhesive layer 3 without concave portions was formed by using a liner 4 that did not have concave and convex portions formed thereon. Furthermore, a 188 μm-thick support 2 was attached to the surface of the pressure-sensitive adhesive layer 3 opposite to the liner 4 side to form a laminate. Here, the pressure-sensitive adhesive layer 3 was present over the entire surface of the support 2 facing the liner 4. A photosensitive resin layer a was laminated on the surface of the support 2 of the obtained laminate opposite to the surface in contact with the pressure-sensitive adhesive layer 3 . Next, as shown in Figure 3(B), the liner 4 was peeled off from the structure 1 forming a 50 mm x 150 mm photosensitive resin support structure, exposing the adhesive layer 3, which was then attached to a predetermined substrate 10 (PET film: corresponding to support c). Specifically, first, the peripheral portion of the surface where the liner 4 was peeled off from the structure 1 forming the photosensitive resin support structure was attached to the adherend 10, and then the central portion of the surface where the liner 4 was peeled off from the structure 1 forming the photosensitive resin support structure was attached to the adherend 10 to obtain a laminate. Next, the surface of the support 2 opposite to the surface in contact with the pressure-sensitive adhesive layer 3 was pressed toward the adherend 10 with a roller at a pressure shown in Table 1. The portion of the laminate to be pressed was a 5 mm wide range from the end of the pressure-sensitive adhesive layer 3 toward the center of the surface, and the rate of change in turbidity of the pressed portion of the laminate ((turbidity of laminate before pressing - turbidity of laminate after pressing) / turbidity of laminate before pressing × 100) was adjusted to be as shown in Table 1. The roller speed during pressing was 5 cm / sec. However, in Comparative Examples 1, 5, 9 to 12 and 14, pressing was not performed. As described above, photosensitive resin supporting structures having a pressure-sensitive adhesive layer with a recess depth of 0 to 30 μm were produced, and measurements were carried out by the following method.

[0053] (Measurement of the depth of the recesses in the adhesive layer) The liner 4 was peeled off from the structure 1 forming the photosensitive resin support structure, and the depth H of the recesses 3h in the exposed adhesive layer 3 was measured using a shape analysis laser microscope (VK-X1000, manufactured by Keyence Corporation). The analysis was performed using a vk analysis application. In the measurement, three arbitrary points were selected at least 5 cm inward from the edge of the pressure-sensitive adhesive layer 3, and the average value of these measurements was calculated as the measured value of the recess depth. In Fig. 3(A), (1) corresponds to the total thickness of the support 2, the pressure-sensitive adhesive layer 3, and the liner 4. In Fig. 3(A), (2) corresponds to the thickness including the height of the irregularities of the liner 4.

[0054] [Evaluation of characteristics] The properties of the photosensitive resin supports of the above Examples and Comparative Examples were evaluated as follows, and the evaluation results are shown in Table 1.

[0055] (Sealing properties) A hole was punched with a punch near one short side (the side where ink would not penetrate) of the photosensitive resin support (a 50 mm x 150 mm rectangle) of the above-mentioned Examples and Comparative Examples, and a dotted line was drawn with a magic marker along the boundary between the bonded portion (5 mm wide) and the unbonded portion of the other short side (the side where ink would penetrate) to prepare a measurement sample. As shown in Figure 6, a measurement sample 13 with a rod 12 inserted through a hole 11 was placed in a beaker 14. As shown in Figure 6, the measurement sample 13 was placed so that the boundary 15 of the bonded portion (5 mm wide) was visible, and the portion of the other short side up to 3 mm from the end was immersed in liquid 16. The immersion time was 10 minutes. The liquid 16 was a plate cleaner (IC-01 manufactured by Sakata Inx), and was colored with black ink to visualize the state of penetration. After immersion, the measurement sample 13 was left to stand in a thermostatic bath at 25°C for 3 hours. The measurement points were from the entry point of the plate cleaner along the recess to the point where the entry of the plate cleaner stopped. If no entry of the plate cleaner (ink) was confirmed, it was rated as "OK", and if even a small amount of entry of the plate cleaner (ink) was confirmed, it was rated as "X".

[0056] (Air release) As shown in FIG. 3(B), the liner 4 was peeled off from the structure 1 forming a 50 mm×150 mm photosensitive resin support structure, exposing the pressure-sensitive adhesive layer 3, which was then attached to a predetermined adherend 10. Specifically, first, the peripheral portion of the surface where the liner 4 was peeled off from the structure 1 forming the photosensitive resin support structure was attached to the adherend 10, and then the central portion of the surface where the liner 4 was peeled off from the structure 1 forming the photosensitive resin support structure was attached to the adherend 10. Whether or not the air trapped at the boundary between the adhesive layer 3 of the photosensitive resin support structure and the adherend 10 escapes when the central portion of the surface obtained by peeling the liner 4 from the structure 1 forming the photosensitive resin support structure is attached to the adherend 10 was evaluated by measuring the thickness of the area where the air had accumulated. If the thickness of the area where the air is trapped is 50 μm or more higher than the surrounding area, it is marked as ×. If it was less than 50 μm, it was evaluated as ◯.

[0057] (Measurement of turbidity change rate) The turbidity of the laminated portion of the photosensitive resin support in the examples and comparative examples and the turbidity of the laminate before compression were measured using a HAZE METER NDH5000 (Nippon Denshoku Kogyo Co., Ltd.), and the rate of change in turbidity before and after compression of the laminate ((turbidity of laminate before compression - turbidity of laminate after compression) / turbidity of laminate before compression x 100) was calculated.

[0058] (Measurement of turbidity of laminate) The turbidity of the pressed portion of the laminate in the photosensitive resin support of each of the Examples and Comparative Examples was measured using a HAZE METER NDH5000 (Nippon Denshoku Kogyo Co., Ltd.) However, since no pressing was performed in Comparative Examples 1, 5, 9 to 12, and 14, the turbidity of the unpressurized portion of the laminate was measured and is shown in Table 1.

[0059] [Table 1] [Industrial Applicability]

[0060] The photosensitive resin support structure of the present invention has industrial applicability in fields where the convenience of a support structure with adhesive function is required and where the photosensitive resin support structure has an air passage portion, the occurrence of air pockets is suppressed and sufficient sealing properties are required, such as the fields of flexographic printing plate manufacturing and molded plate manufacturing. [Explanation of symbols]

[0061] 1. Photosensitive resin support structure forming structure 2 Support 3. Adhesive layer 3a First Side 3b Second Side 3h recess 4 Liner 5 Adhesive layer 10 Adherent a Photosensitive resin layer a b Support b c Support c d Adhesive layer d e Photosensitive resin support structure f end

Claims

1. a lamination step of laminating the support (c), the pressure-sensitive adhesive layer (d), and the support (b) in this order to form a laminate; a compression bonding step of compressing the laminate, In the pressure-bonding step, the change rate of turbidity of the pressure-bonded portion of the laminate ((turbidity of the laminate before pressure-bonding - turbidity of the laminate after pressure-bonding) / turbidity of the laminate before pressure-bonding × 100) is set to 2.0% or more, the pressure-sensitive adhesive layer (d) has an open recess on a second surface opposite to a first surface in contact with the support (b), the recess having a depth of 10 μm or more; A method for manufacturing a photosensitive resin support structure, wherein in the pressure-bonding step, pressure is applied in the direction of the support c from the surface of the support b opposite to the surface in contact with the pressure-sensitive adhesive layer d.

2. A lamination step of laminating a support c, an adhesive layer d, and a support b in this order to form a laminate; a compression bonding step of compressing the laminate, In the pressure-bonding step, the change rate of turbidity of the pressure-bonded portion of the laminate ((turbidity of the laminate before pressure-bonding - turbidity of the laminate after pressure-bonding) / turbidity of the laminate before pressure-bonding × 100) is set to 2.0% or more, the pressure-sensitive adhesive layer (d) has an open recess on a second surface opposite to a first surface in contact with the support (b), the recess having a depth of 10 μm or more; The method for manufacturing a photosensitive resin support structure further includes, between the lamination step and the pressure-bonding step, a photosensitive resin layer formation step of laminating a photosensitive resin layer a on the surface of the support b of the laminate opposite to the surface that contacts the pressure-sensitive adhesive layer d.

3. A lamination step of laminating a support c, an adhesive layer d, and a support b in this order to form a laminate; a compression bonding step of compressing the laminate, In the pressure-bonding step, the change rate of turbidity of the pressure-bonded portion of the laminate ((turbidity of the laminate before pressure-bonding - turbidity of the laminate after pressure-bonding) / turbidity of the laminate before pressure-bonding × 100) is set to 2.0% or more, the pressure-sensitive adhesive layer (d) has an open recess on a second surface opposite to a first surface in contact with the support (b), the recess having a depth of 10 μm or more; In the pressure-bonding step, a range of at least 2 mm in width is pressure-bonded from the end of the pressure-sensitive adhesive layer d toward the center of the surface.

4. A lamination step of laminating a support c, an adhesive layer d, and a support b in this order to form a laminate; a compression bonding step of compressing the laminate, In the pressure-bonding step, the change rate of turbidity of the pressure-bonded portion of the laminate ((turbidity of the laminate before pressure-bonding - turbidity of the laminate after pressure-bonding) / turbidity of the laminate before pressure-bonding × 100) is set to 2.0% or more, the pressure-sensitive adhesive layer (d) has an open recess on a second surface opposite to a first surface in contact with the support (b), the recess having a depth of 10 μm or more; In the pressure-bonding step, a range of at least 10 mm in width is pressure-bonded from the end of the pressure-sensitive adhesive layer d toward the center of the surface.

5. A lamination step of laminating a support c, an adhesive layer d, and a support b in this order to form a laminate; a compression bonding step of compressing the laminate, In the pressure-bonding step, the change rate of turbidity of the pressure-bonded portion of the laminate ((turbidity of the laminate before pressure-bonding - turbidity of the laminate after pressure-bonding) / turbidity of the laminate before pressure-bonding × 100) is set to 2.0% or more, the pressure-sensitive adhesive layer (d) has an open recess on a second surface opposite to a first surface in contact with the support (b), the recess having a depth of 10 μm or more; The method for producing a photosensitive resin support structure, wherein the pressure-sensitive adhesive layer (d) includes a support (e).

6. The method for producing a photosensitive resin support structure according to any one of claims 1 to 5, wherein the pressure-sensitive adhesive layer d is present on the entire surface of the support b on the support c side.

7. The pressure during the compression step is 300 g / cm 2 More than 5000g / cm 2 The method for producing a photosensitive resin supporting structure according to any one of claims 1 to 6, wherein:

8. A manufacturing process for producing a photosensitive resin structure by a method for producing a photosensitive resin support structure, comprising: a lamination step of laminating a support c, an adhesive layer d, and a support b in this order to form a laminate; and a lamination step of laminating the laminate, wherein in the lamination step, the rate of change in turbidity of the laminated portion ((turbidity of laminate before lamination - turbidity of laminate after lamination) / turbidity of laminate before lamination x 100) is 2.0% or more, and the adhesive layer d has a recess that opens on a second surface opposite to a first surface that contacts the support b, and the depth of the recess is 10 μm or more; an exposure step of disposing the photosensitive resin support structure produced in the production step and a negative film and irradiating the negative film with actinic rays from the back side thereof; a development step of removing the photosensitive resin composition in the region not irradiated with the actinic ray in the exposure step.

9. a laminate in which a support (c), a pressure-sensitive adhesive layer (d), and a support (b) are laminated in this order, the laminate has a pressure-bonded portion in a part thereof, and the pressure-bonded portion of the laminate has a turbidity of 30% or less; The difference in turbidity between the crimped portion and the un-crimped portion ((turbidity of the laminate in the un-crimped portion - turbidity of the laminate in the crimped portion) / turbidity of the laminate in the un-crimped portion x 100) is 2.0% or more, the pressure-sensitive adhesive layer (d) has an open recess on a second surface opposite to a first surface in contact with the support (b), the recess having a depth of 10 μm or more; The photosensitive resin support structure, wherein the pressure-sensitive adhesive layer (d) includes a support (e).

10. The photosensitive resin support structure according to claim 9 , wherein the pressure-sensitive adhesive layer d is present on the entire surface of the support b on the support c side.

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