Substrate manufacturing method and light-emitting device manufacturing method

Abstract

To provide a manufacturing method for a substrate in which a resin member is disposed on a side surface of a base body, and a manufacturing method for a light-emitting device.SOLUTION: A manufacturing method for a substrate includes the steps of: preparing a substrate intermediate body including a plurality of base bodies 11 each having an upper surface and an outer side surface 11A continuing from the upper surface, and a support member 13 for supporting the base body so that the outer side surfaces of the plurality of base bodies are disposed apart from each other; preparing a plate-shaped member 30 with an opening part; disposing the plate-shaped member on the support member so that at least a part of an inner side surface 30S for defining the opening part of the plate-shaped member and at least a part of the outer side surfaces of the base bodies face each other through a gap; covering the outer side surface of the base body by supplying a resin member to the gap; and forming a covering layer covering the outer side surface of the base body by curing the resin member.SELECTED DRAWING: Figure 3B

Description

[Technical Field]

[0001] The present disclosure relates to a method for manufacturing a substrate and a method for manufacturing a light-emitting device. [Background technology]

[0002] A method is known in which the top and side surfaces of a molded package are colored black by screen printing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-093185 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of an embodiment of the present disclosure is to provide a method for applying a resin member to a side surface of a substrate. [Means for solving the problem]

[0005] The present disclosure includes the following configurations. a step of preparing a substrate intermediate including a plurality of substrates each having an upper surface and an outer surface continuous with the upper surface, and a support member that supports the substrates such that the outer surfaces of the plurality of substrates are spaced apart from one another; providing a plate-like member having an opening; a step of placing the plate-shaped member on the support member so that at least a part of an inner surface of the plate-shaped member that defines the opening and at least a part of an outer surface of the base body face each other via a gap; a step of supplying a resin material into the gap to cover the outer surface of the base; a step of forming a coating layer that covers the outer surface of the base by curing the resin member; A method for manufacturing a substrate comprising: [Effects of the Invention]

[0006] According to an embodiment of the present disclosure, a method for disposing a resin member on a side surface of a base can be provided. [Brief explanation of the drawings]

[0007] [Figure 1A] 1A and 1B are a schematic top view and a schematic side view of a substrate obtained by a substrate manufacturing method according to an embodiment. [Figure 1B] 1B is a schematic top view showing an enlarged view of a portion including the base body in FIG. 1A. FIG. [Figure 1C] FIG. 1B is a schematic side view showing an enlarged view of a portion including the base body in FIG. 1A. [Figure 1D] FIG. 2 is a schematic cross-sectional view showing a cross section taken along line ID-ID in FIG. 1B. [Figure 2A] 1A and 1B are a schematic top view and a schematic side view showing a substrate intermediate body according to an embodiment. [Figure 2B] FIG. 2B is a schematic enlarged top view of a portion including the base body in FIG. 2A. [Figure 2C] FIG. 2C is a schematic top view showing the support member in FIG. 2B. [Figure 2D] FIG. 2B is a schematic side view showing an enlarged view of a portion including the base body in FIG. 2A. [Figure 3A] 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate according to an embodiment. [Figure 3B] 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate according to an embodiment. [Figure 3C] 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate according to an embodiment. [Figure 4A] 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate according to an embodiment. [Figure 4B] 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate according to an embodiment. [Figure 4C] 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate according to an embodiment. [Figure 4D] 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate according to an embodiment. [Figure 4E] 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate according to an embodiment. [Figure 5A] 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate according to an embodiment. [Figure 5B] 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate according to an embodiment. [Figure 5C] 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate according to an embodiment. [Figure 6] 1 is a schematic cross-sectional view showing an enlarged portion of a substrate obtained by a substrate manufacturing method according to an embodiment. [Figure 7A] 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate according to an embodiment. [Figure 7B] 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate according to an embodiment. [Figure 8A] 1A and 1B are a schematic top view and a schematic side view obtained by a substrate manufacturing method according to an embodiment. [Figure 8B] FIG. 8B is a schematic top view showing an enlarged portion including the base body in FIG. 8A. [Figure 8C] FIG. 8B is a schematic side view showing an enlarged view of a portion including the base body in FIG. 8A. [Figure 8D] 1A and 1B are a schematic top view and a schematic side view showing a substrate intermediate body according to an embodiment. [Figure 9A] 1 is a schematic top view of a light emitting device obtained by a manufacturing method of a light emitting device according to an embodiment. [Figure 9B] 1 is a schematic side view of a light emitting device obtained by a method for manufacturing a light emitting device according to an embodiment. [Figure 9C] 9B is a schematic cross-sectional view showing a cross section taken along line IXC-IXC in FIG. 9A. [Figure 10] 1 is a schematic top view of a light emitting device obtained by a manufacturing method of a light emitting device according to an embodiment. [Figure 11A] 1A and 1B are a schematic top view and a side view showing a light emitting device obtained by a manufacturing method for a light emitting device according to an embodiment. [Figure 11B] 11B is a schematic cross-sectional view showing a cross section taken along line XIB-XIB in FIG. 11A. [Figure 12A] 1A and 1B are a schematic top view and a side view showing a light emitting device obtained by a manufacturing method for a light emitting device according to an embodiment. [Figure 12B] FIG. 12B is a schematic cross-sectional view showing a cross section taken along line XIIB-XIIB in FIG. 12A. [Figure 12C] FIG. 12B is a schematic cross-sectional view showing a cross section taken along line XIIC-XIIC in FIG. 12A. DETAILED DESCRIPTION OF THE INVENTION

[0008] Embodiments of the present invention will be described in detail with reference to the drawings. The following embodiments are merely examples, and the methods for manufacturing a substrate and a light-emitting device according to the embodiments of the present invention are not limited to the following embodiments. For example, the numerical values, shapes, materials, processes, and the order of the processes shown in the following embodiments are merely examples, and various modifications are possible as long as no technical contradictions occur. Various combinations of the embodiments described below are possible as long as no technical contradictions occur.

[0009] The dimensions, shapes, etc. of components shown in the drawings may be exaggerated for clarity and may not reflect the actual dimensions, shapes, or the relationship between the components. In addition, to avoid overly complicated drawings, schematic diagrams may be used in which some elements are omitted, or end views showing only the cut surface may be used as cross-sectional views.

[0010] (Embodiment 1) The substrate obtained by the method for manufacturing a substrate according to this embodiment includes a plurality of substrates and a support member that supports the substrates so that the outer surfaces of the substrates are spaced apart from one another. Each substrate has an upper surface and a side surface, and a coating layer is disposed on the side surface.

[0011] The base is a member that can become part of the package that constitutes the light emitting device. In other words, the substrate obtained in this embodiment is a member that can be used in the manufacturing method of the light emitting device described below.

[0012] The following method can be used to manufacture such a substrate. One is a method of using a member that constitutes part of the package of the light emitting device as the support member (substrate manufacturing method 1). Another is a method of using a member that does not constitute the package of the light emitting device as the support member (substrate manufacturing method 2).

[0013] In either case, the method for manufacturing the substrate comprises the following steps. (1-1) A step of preparing a substrate intermediate including a base and a support member that supports the base (1-2) A step of preparing a plate-shaped member having an opening (1-3) A step of placing the plate-like member on the support member so that the base is placed in the opening of the plate-like member. (1-4) A step of supplying a resin material into the gap between the side surface of the base and the plate-like member to cover the outer surface of the base. (1-5) A step of forming a coating layer that covers the side surface of the base by hardening the resin member

[0014] <Substrate manufacturing method 1> FIG. 1A is a top view and two side views showing a substrate 10 obtained by the substrate manufacturing method according to this embodiment. FIG. 1B is a top view of an enlarged portion of the substrate 10 shown in FIG. 1A, including one base 11. FIG. 1C is a side view of an enlarged portion of the substrate 10 shown in FIG. 1A, including one base 11. FIG. 1D is a cross-sectional view taken along line ID-ID in FIG. 1B. FIG. 2A is a top view and two side views showing a substrate intermediate 10A used in the substrate manufacturing method according to this embodiment. FIG. 2B is a top view of an enlarged portion of the substrate intermediate 10A shown in FIG. 2A, including one base 11. FIG. 2C is a top view showing the support member S1 (conductive member 13) embedded in the base 11 in the base intermediate 10A shown in FIG. 2B. FIG. 2D is a side view of an enlarged portion of the substrate intermediate 10A shown in FIG. 2A, including one base 11.

[0015] The substrate 10 includes a base 11, a coating layer 12 disposed on the base 11, and a support member S1. The substrate 10 includes one support member S1 and a plurality of bases 11. In the example shown in FIG. 1A, a total of 56 bases 11 (7 x 8) are supported by one support member S1, and the bases 11 are disposed at equal intervals in both the vertical and horizontal directions. A coating layer 12 is disposed on the outer surface 11A of each of the bases 11. In the example shown in FIG. 1A, etc., the coating layer 12 is also disposed on the upper surface 11C of the base 11. The number of bases 11, the interval at which the bases 11 are disposed, and the like can be selected arbitrarily. The interval at which the bases 11 are disposed can be, for example, 1 mm to 5 mm.

[0016] The support member S1 is a conductive member or a composite member containing a conductive member. When the support member S1 is made of only a conductive member, for example, a lead frame can be used. Furthermore, a composite member containing a conductive member can be a rigid or flexible substrate having an insulating base material and a conductive wiring layer.

[0017] The shape of the support member S1 in a top view can be, for example, a square or a rectangle. The size of the support member S1 is, for example, a short side length of 15 mm to 250 mm, a long side length of 15 mm to 250 mm, and a thickness of 50 μm to 1000 μm. Examples of conductive materials that can be used to form the support member S1 include metal materials such as Fe, Cu, Ni, Al, Ag, Au, and alloys containing one of these. The support member S1 can also have a plating layer on the surface of the above metal material. The plating layer can be, for example, Au, Ag, Cu, Pt, Ni, or an alloy containing one of these, and can be a single layer or multiple layers of these. When the support member S1 is a rigid substrate, examples of the base material include ceramics such as aluminum nitride and aluminum oxide, glass epoxy substrates (FR-4), glass composite substrates (SEM3), bismaleimide triazine resin (BT resin), and paper epoxy. When the support member S1 is a flexible substrate, it has a film-like insulator (resin) and a conductor wiring layer made of, for example, copper. Examples of resin materials that make up the insulator include phenolic resin, epoxy resin, polyimide resin, BT resin, polyphthalamide (PPA), and polyethylene terephthalate (PET).

[0018] The substrate 10 shown in FIG. 1A includes a lead frame, which is a conductive member 13, as a support member S1.

[0019] As shown in FIG. 2C, the conductive member (lead frame) 13 used as the support member S1 includes an inner lead 13A disposed inside the outer surface 11A and at least a portion of which is embedded in the base 11, and an outer lead 13B disposed protruding outward from the outer surface 11A of the base 11. The inner lead 13A and the outer lead 13B constitute a part of the package that constitutes the light emitting device. A suspension lead 13C is disposed on a different outer surface 11A from the outer lead 13B and is slightly embedded in the outer surface 11A of the base 11. Furthermore, the conductive member 13 includes a frame portion 13D that connects the outer lead 13B and the suspension lead 13C. The suspension lead 13C supports the base 11 after the frame portion 13D and the outer lead 13B are cut. The substrate 10 shown in FIG. 1A shows a state in which the outer lead 13B and the frame portion 13D are continuous. However, the substrate 10 may be a substrate in a state where the outer leads 13B and the frame portion 13D are cut off, or a substrate in a state where the outer leads 13B are bent after the outer leads 13B and the frame portion 13D are cut off. Also, the substrate does not have to include the suspension leads 13C.

[0020] The base 11 is an insulating molded body that constitutes a package for holding a light-emitting element in a light-emitting device obtained using the substrate 10. The base 11 has an upper surface 11C and an outer surface 11A that is continuous with the upper surface 11C. A portion of the support member S1 is embedded in the base 11. In other words, the upper surface, side surfaces, and lower surface of the support member S1 are partially covered by the base 11. The support member S1 protrudes from the outer surface 11A of the base 11.

[0021] The outer peripheral shape of the upper surface 11C of the base 11 is, for example, rectangular, square, circular, etc. The size of the base 11 in top view is, for example, 0.5 mm to 5 mm on a side. The base 11 has a recess R that opens on the upper surface 11C. In other words, the upper surface 11C of the base 11 is a frame-shaped portion located around the recess R. The recess R is a space defined by an inner side surface 11B and a bottom surface R1, and in a light-emitting device, it is a space for arranging, for example, a light-emitting element. The inner side surface 11B that defines the recess R is made up of the base 11, and the bottom surface R1 that defines the recess R is made up of the base 11 and a part of the support member S1 (conductive member 13). The opening shape of the recess R is, for example, rectangular, square, or circular.

[0022] 1A, the support member S1 is located near the center of the outer surface 11A in the height direction of the base 11. The thickness of the base 11 located above the support member S1 is thicker than the thickness of the base 11 located below the support member S1. The height of the base 11 located above the support member S1 is, for example, 0.2 mm to 1.6 mm, and the height of the base 11 located below the support member S1 is, for example, 0.1 mm to 0.6 mm. However, this is not limiting, and the lower surface of the support member S1 may be located at a position that is flush with the lower surface of the base 11.

[0023] The outer surface 11A of the base 11 is inclined so that the width on the side closer to the support member S1 is large and the width on the side closer to the upper surface 11C or the lower surface is small.

[0024] The material of the base 11 may be, for example, a thermoplastic resin such as PA (polyamide), PPA (polyphthalamide), PPS (polyphenylene sulfide), or liquid crystal polymer, or a thermosetting resin such as epoxy resin, silicone resin, modified epoxy resin, urethane resin, or phenol resin.

[0025] Of the base 11, the outer surface 11A or the upper surface 11C on which the coating layer 12 is disposed can be composed of only the molded body 22, as shown in Fig. 1D. Alternatively, of the base 11, the outer surface 11A or the upper surface 11C on which the coating layer 12 is disposed may include the molded body 22 and a light-shielding layer 18 disposed on the upper surface thereof, as shown in Fig. 10.

[0026] The covering layer 12 is disposed on the outer surface 11A of the base 11 and is a member having a desired function. For example, the covering layer 12 can be a covering layer 12 that adjusts optical properties. Specifically, by using a substrate having a light-absorbing layer containing a light-absorbing substance as the covering layer 12, it is possible to obtain a light-emitting device for a display that can, for example, absorb external light and improve the contrast ratio. Furthermore, by using a substrate having a light-reflecting layer containing a light-reflecting substance as the covering layer 12, it is possible to obtain a light-emitting device that can improve the light reflectivity of the base 11.

[0027] Furthermore, the covering layer 12 can have a function of adjusting water resistance or light resistance, etc. For example, water resistance can be improved by providing a water-resistant layer that is less permeable to moisture. Furthermore, by using a substrate having a gas barrier layer with high gas barrier properties that reduces the passage of water vapor or corrosive gases (sulfur compound-containing gases such as SOx and H2S) as the covering layer 12, a light-emitting device can be obtained that improves the gas barrier properties of the base 11. Examples of water-resistant layers or gas barrier layers include epoxy resins and phenyl silicone resins.

[0028] By using a substrate having a highly light-resistant light-resistant layer as the covering layer 12, it is possible to obtain a light-emitting device capable of improving the light resistance of the base 11. Examples of materials for the light-resistant layer include dimethyl silicone resin. The above-mentioned light-absorbing substances are also materials that can improve the light resistance of the base by absorbing light.

[0029] By providing the coating layer 12 with a gas-reactive layer that reacts with, for example, sulfur gas, it is possible to obtain a light-emitting device that can improve the gas deterioration resistance of the base 11. Examples of materials for the gas-reactive particles contained in the gas-reactive layer include oxides, hydroxides, or carbonates of at least one element selected from potassium, calcium, sodium, magnesium, manganese, zinc, iron, copper, nickel, silver, zirconium, cobalt, chromium, lead, and barium, as well as compounds thereof. Specific examples include resin layers containing particles of basic carbonates such as basic zinc carbonate (ZnCO3·Zn(OH)2).

[0030] The layer having these functions may be used as a single layer or may be laminated, and one layer may have multiple functions.

[0031] Furthermore, by providing such a gas barrier layer or gas reactive layer as coating layer 12, when a lead frame containing silver is used as a support member, a substrate can be obtained that can reduce deterioration of the lead frame due to sulfur gas, etc. Similarly, when base 11 is a resin package with leads containing silver or a ceramic package with wiring containing silver, a light emitting device can be obtained that can reduce deterioration of the leads or wiring due to sulfur gas.

[0032] The coating layer 12 is disposed on the outer surface 11A of the base 11. For example, the coating layer 12 can be disposed on the outer surface 11A so that the outer surface 11A is at the outer peripheral edge of the upper surface 11C of the base 11, i.e., the upper end of the outer surface 11A. However, the upper end of the coating layer 12 may be spaced apart from the upper end of the outer surface 11A. The lower end of the coating layer 12 can be disposed at a position spaced apart from the support member S1. Alternatively, the lower end of the coating layer 12 can be disposed so as to reach the support member S1. For example, by disposing a gas barrier layer, a gas-reactive layer, or the like over the entire outer surface 11A of the base 11, these layers can more effectively perform their functions.

[0033] For example, when the base 11 is used as a package for a light-emitting device for a display as shown in FIG. 9A , the lightness of the coating layer 12 is preferably lower than that of the base 11. For example, the lightness of the coating layer 12 is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1, on the Munsell color system. Specifically, the coating layer 12 is preferably made of a dark-colored resin material such as black. When a light-emitting device having such a coating layer 12 is mounted on a wiring board to form a light-emitting module, the periphery of the light-emitting device is covered with a waterproof resin. In this case, it is preferable to adjust the amount of the resin member 12A so that the side of the light-emitting device (the outer surface 11A of the base 11) exposed from the waterproof resin is covered with the coating layer 12. For example, the outer surface 11A of the base 11, which has a height of 0.8 mm, can be covered with the coating layer 12 in a range of 0.1 mm or more from the upper end of the outer surface 11A downward, in a portion located above the support member S1. Furthermore, the covering layer 12 can be arranged so that its lower end covers a position 0.1 mm away from the support member S1.

[0034] The lower end of the coating layer 12 may be linear and parallel to the upper or lower end of the outer surface 11A, or may be partially or entirely curved. As shown in Fig. 1C, it is preferable that one coating layer 12 is disposed so as to cover the outer surface 11A of the base 11 from the left end to the right end in side view. However, the coating layer 12 may be disposed in two or more parts in side view.

[0035] When the outer peripheral shape of the upper surface 11C of the base 11 is rectangular and the base 11 has four outer surfaces 11A, the coating layer 12 is preferably disposed on all four outer surfaces 11A. However, it is acceptable for some outer surfaces 11A not to have the coating layer 12 disposed thereon. Furthermore, when the coating layer 12 is disposed on multiple outer surfaces 11A, the areas covering the outer surfaces 11A may be the same for each outer surface 11A, or may be partially or entirely different.

[0036] The coating layer 12 can be disposed not only on the outer surface 11A of the base 11 but also on the upper surface 11C of the base 11, which is continuous with the outer surface 11A. The coating layer 12 disposed on the upper surface 11C of the base 11 may be disposed up to a position that reaches the recess R, or may be disposed at a position away from the recess R.

[0037] The thickness of the coating layer 12 can be, for example, 0.5 μm to 100 μm. In particular, the thickness of the coating layer 12 is preferably 1 μm to 30 μm. This can prevent cracks in the coating layer 12 caused by expansion and contraction of the base 11 due to heating or cooling during the process of forming the light-emitting device. The coating layer 12 can have the same thickness on one outer surface 11A of the base 11, for example. Alternatively, the edge of the coating layer 12, or if the coating layer 12 covers the edge of the base 11, the edge of the base 11 may have a portion with a smaller thickness than other portions. In the example shown in FIG. 1D, the coating layer 12 covers the upper end of the outer surface 11A of the base 11 in a cross-sectional view, and the thickness of this portion is thinner than that of portions away from the upper end. In other words, the thickness of the coating layer 12 is greater at positions away from the upper end. As a result, for example, by providing a light-emitting device for a display with a black coating layer 12, the thickness of the coating layer 12 located closer to the light-emitting element can be increased, thereby further improving the contrast ratio. Also, by varying the thickness of the coating layer 12 in this way, the surface of the coating layer 12 becomes curved. This makes it easier to diffuse and reflect external light, making the black coating layer 12 appear even blacker.

[0038] When the coating layer 12 continuously covers the upper surface 11C and the outer surface 11A of the base 11, the coating layer 12 is thinner at the edge between the upper surface 11C and the outer surface 11A of the base 11, i.e., at the corner of the base 11 in a cross-sectional view as shown in FIG. 1D , than at other portions. For example, if the base 11 is white and the coating layer 12 is black, it may be difficult to recognize the boundary between the coating layer 12 disposed on the upper surface 11C and the coating layer 12 disposed on the outer surface 11A during an inspection process, etc. In such a case, if the coating layer 12 is thin at the boundary between the upper surface 11C and the outer surface 11A, the white base 11 covered by the black coating layer 12 can be seen through. This makes it easier to visually recognize the outline of the base 11 through the coating layer 12.

[0039] Furthermore, the lower end of the coating layer 12 is located near the center of the outer surface 11A of the base 11, and the film thickness there is thinner than in the portion away from the lower end. This makes the coating layer 12 more stretchable at the end, thereby reducing the stress applied to the end due to contraction of the coating layer 12. Reducing the stress makes it less likely for the coating layer 12 to peel off from the end. Furthermore, the coating layer 12 disposed on the upper surface 11C of the base 11 is also thinner at the end of the upper surface 11C of the base 11 than in other portions. This makes it less likely for the coating layer 12 to peel off even at the end of the upper surface 11C.

[0040] Examples of materials for the coating layer 12 include thermosetting resins such as epoxy resin, modified epoxy resin, phenol resin, melamine resin, (meth)acrylate resin, urethane resin, silicone resin, and modified silicone resin.

[0041] The coating layer 12 may contain various additives such as a light-absorbing substance and a light-reflecting substance in the resin material described above. The light-absorbing substance contained in the coating layer 12 is preferably a dark-colored substance such as black or gray, and specific examples thereof include carbon black and titanium black. The light-reflecting substance contained in the coating layer 12 is preferably a white-colored substance, and specific examples thereof include barium titanate, titanium oxide, aluminum oxide, and silicon oxide.

[0042] Each step in the method for manufacturing the substrate as described above will be described in detail below.

[0043] (1-1) A step of preparing a substrate intermediate including a base and a support member that supports the base First, a substrate intermediate 10A as shown in FIG. 2A is prepared. The substrate intermediate 10A is the substrate 10 without the coating layer 12. That is, the substrate intermediate 10A includes a plurality of bases 11 and a support member S1 that integrally supports the bases 11. The substrate intermediate 10A can be prepared by purchasing a substrate in which the bases 11 are supported by the support member S1 in advance. Alternatively, the substrate intermediate 10A can be prepared by preparing only the support member S1 and then placing the bases 11 on the support member S1. For example, a lead frame 13 obtained by processing a metal plate into a desired shape can be prepared as the support member S1, and the lead frame 13 can be set in a mold and subjected to injection molding or the like to prepare a substrate intermediate 10A in which a molded body 22 mainly composed of resin is supported on the lead frame 13 as the base 11.

[0044] (1-2) A step of preparing a plate-shaped member having an opening Next, a plate-shaped member with an opening is prepared. The plate-shaped member is flat and has an upper surface, a lower surface, and an opening that penetrates from the upper surface to the lower surface. The upper and lower surfaces of the plate-shaped member are preferably parallel to each other. The upper and lower surfaces of the plate-shaped member can be smooth or rough. Similarly, the inner surface of the opening of the plate-shaped member can also be smooth or rough. The upper, lower, and inner surfaces may have the same surface condition or different surface conditions. Roughening the upper, lower, and inner surfaces of the plate-shaped member can reduce poor chemical wettability due to capillary action. In other words, it can make the resin member 12A more easily wetted and spreadable. Furthermore, smoothing the upper, lower, and inner surfaces of the plate-shaped member can make the capillary action less likely to occur. For example, even if the material of the plate-shaped member has low wettability (a material that repels resin materials), roughening the surface can make the resin member more easily wetted and spreadable due to capillary action. On the other hand, when the plate-like member is made of a material with low wettability, the inherent wettability of the plate-like member can be maintained by making the upper, lower and inner surfaces smooth.

[0045] For example, the wettability of the inner surface of the opening of the plate-shaped member 30 can be made higher than the wettability of the upper surface of the plate-shaped member 30. This makes it possible to make it easier for the resin member 12A supplied from above the gap G between the outer surface 11A of the base 11 and the inner surface of the opening of the plate-shaped member to spread into the gap G. Also, the wettability of the inner surface of the opening of the plate-shaped member 30 can be made lower than that of the lower surface of the plate-shaped member 30. This makes it possible to reduce the flow of excess resin member 12A below the outer surface 11A of the base 11. Details of the shape of the plate-shaped member will be described later.

[0046] The plate-shaped member may be made of, for example, metal, ceramic, or resin. The plate-shaped member may have a plating layer or coating layer on each of its upper, lower, and inner surfaces. The plating layer may be made of, for example, Au, Ag, Cu, Pt, Ni, or an alloy containing one of these, and may be a single layer or multiple layers. The coating layer may be made of, for example, fluorine, silicone, or glass.

[0047] (1-3) A step of placing the plate-like member on the support member so that the base is placed in the opening of the plate-like member. Next, as shown in Figures 3A to 3C, the plate-shaped member 30 is placed on the support member S1. Figure 3B shows the state in which the plate-shaped member 30 is placed at a position above and away from the support member S1. Then, by lowering the plate-shaped member 30, the plate-shaped member 30 is placed on the support member S1 as shown in Figure 3C. Note that the plate-shaped member 30 is shown in an end view showing only the cross section taken along line IIIB-IIIB.

[0048] The plate-shaped member 30 is disposed on the support member S1, and the base 11 is disposed within the opening 30A of the plate-shaped member 30. Specifically, the plate-shaped member 30 is disposed so that at least a portion of the inner surface 30S defining the opening 30A of the plate-shaped member 30 faces at least a portion of the outer surface 11A of the base 11 across a gap G. The plate-shaped member 30 may be disposed in contact with the support member S1. Preferably, the upper surface 30U of the plate-shaped member 30 is at the same height as the upper surface 11C of the base 11. This makes it easier to dispose the resin member 12A on the upper end of the outer surface 11A of the base 11. If the resin member 12A is also disposed on the upper surface 11C of the base 11, the upper surface 30U of the plate-shaped member 30 may be disposed at a position higher than the upper surface 11C of the base 11. Furthermore, when the resin member 12A is disposed at a position away from the upper end of the outer surface 11A of the base 11, the upper surface 30U of the plate-like member 30 may be disposed at a position lower in height than the upper surface 11C of the base 11.

[0049] The shape of the opening 30A of the plate-like member 30 is preferably similar to the outer circumferential shape of the upper surface 11C of the base 11. For example, as shown in Fig. 3A, when the outer circumferential shape of the upper surface 11C of the base 11 is rectangular, the shape of the opening 30A of the plate-like member 30 is also preferably rectangular.

[0050] When the shape of the opening 30A of the plate-like member 30 and the outer peripheral shape of the upper surface 11C of the base 11 are similar in shape, it is preferable that the opening 30A be sized so that the width of the gap G is constant over the entire periphery of the opening 30A. In other words, it is preferable that the center of the opening 30A of the plate-like member 30 and the center of the base 11 coincide with each other in a top view. This makes it easier to make the thickness of the coating layer 12 the same on the four outer surfaces 11A of the base 11.

[0051] The distance between the inner surface 30S of the plate-shaped member 30 and the outer surface 11A of the base 11, i.e., the length of the gap G, can be, for example, 0.5 μm to 100 μm. For example, if the distance between one outer surface 11A of the base 11 and the inner surface 30S of the plate-shaped member 30 arranged opposite that outer surface 11A is not constant, the length of the gap G is the length of the gap G at the portion where the distance is shortest. For example, in the example shown in FIG. 3C , the outer surface 11A of the base 11 is inclined with respect to the upper surface 11C and is not parallel to the inner surface 30S of the plate-shaped member 30. In such a case, the length of the gap G refers to the length of the gap G at the closest portion of these opposing surfaces. As shown in FIGS. 3B and 3C , when the inner surface 30S of the plate-shaped member 30 includes a first inner surface 30S1 and a second inner surface 30S2 located outside the first inner surface 30S1, the distance between the lower end of the first inner surface 30S1 and the outer surface 11A of the base 11 facing the lower end is the shortest, and refers to the length of the gap G at that portion. The portion located inside the second inner surface 30S2 is referred to as the convex portion 30T. When such a convex portion 30T is included, the lower surface 30D includes a first lower surface 30D1 and a second lower surface 30D2 located below the first lower surface 30D1. In the example shown in FIG. 3B and other figures, the upper surface of the convex portion 30T coincides with the upper surface 30U of the plate-shaped member 30. In other words, the convex portion 30T is located on the upper side of the plate-shaped member 30. However, the shape may be inverted, i.e., the lower surface of the convex portion 30T may coincide with the lower surface of the plate-shaped member 30. Alternatively, the protrusion 30T may have a shape including an upper surface located below the upper surface 30U of the plate-shaped member 30 and a lower surface located above the lower surface 30D of the plate-shaped member 30.

[0052] The inner side surface 30S of the opening 30A of the plate-shaped member 30 can be a surface that is perpendicular to the upper surface 30U or the lower surface 30D of the plate-shaped member 30 or a surface that is inclined.

[0053] As shown in FIG. 3B , the inner surface 30S of the opening 30A of the plate-shaped member 30 may include a protrusion 30T protruding inward from the opening 30A. That is, the inner surface 30S of the opening 30A includes a first inner surface 30S1 located on the upper surface 30U side and a second inner surface 30S2 located on the lower surface 30D side and outward from the first inner surface 30S1. In other words, the first inner surface 30S1 is located more inward than the second inner surface 30S2 and is the inner surface of the protrusion 30T. A first lower surface 30D1 is located between the first inner surface 30S1 and the second inner surface 30S2. The upper surface of the protrusion 30T coincides with the upper surface 30U of the plate-shaped member 30, and the first lower surface 30D1, which is the lower surface of the protrusion 30T, is located away from the second lower surface 30D2, which is the lower surface of the plate-shaped member 30. This allows the first lower surface 30D1 of the protruding portion 30T of the plate-shaped member 30 and the upper surface of the support member S1 to be spaced apart from each other.

[0054] When the plate-shaped member 30 has a protrusion 30T on a portion of the inner surface 30S of the opening 30A, the gap between the first inner surface 30S1, which is the inner surface of the protrusion 30T, and the outer surface 11A of the base 11 corresponds to the gap G described above. The resin member 12A contacts both the first inner surface 30S1 and the outer surface 11A of the base 11 and is held by these two opposing surfaces. In other words, by not placing the resin member 12A on the second inner surface 30S2, it is possible to make it difficult for the support member S1 to come into contact with the resin member 12A. In this way, the length of the first inner surface 30S1 can adjust the range of wetting and spreading. It is preferable that the distance between the second inner surface 30S2 and the first inner surface 30S1, i.e., the length of the first lower surface 30D1, is set to a distance that prevents the resin member 12A from being placed on the second inner surface 30S2 when it spreads.

[0055] When the plate-shaped member 30 has a first inner surface 30S1 and a second inner surface 30S2, it is preferable that the thickness of the plate-shaped member 30, i.e., the distance between the upper surface 30U and the lower surface 30D, be approximately equal to the height of the base 11 located above the upper surface of the support member S1 on the substrate 10. However, when an adjustment member (such as a spacer) for adjusting the distance between the plate-shaped member 30 and the support member S1 is disposed between them, the thickness of the plate-shaped member 30 only needs to be equivalent to the vertical width (height) of the resin member (coating layer) to be disposed on the outer surface 11A of the base 11. When the inner surface 30S of the opening 30A of the plate-shaped member 30 does not have the first inner surface 30S1 and the second inner surface 30S2, it is preferable that the thickness of the plate-shaped member 30, i.e., the distance between the upper surface 30U and the lower surface 30D, be smaller than the height of the base 11 located above the upper surface of the support member S1 on the substrate 10, and it is also preferable to use a spacer or the like. Also, the plate-like member 30 may be provided with legs that correspond to spacers.

[0056] 3B, when the inner surface 30S of the opening 30A of the plate-shaped member 30 includes a first inner surface 30S1 and a second inner surface 30S2, the length of the first inner surface 30S1 can be, for example, 0.1 mm or more. Since the upper limit of the length of the first inner surface 30S1 varies depending on the thickness of the plate-shaped member 30 (the distance between the top and bottom surfaces), the second inner surface 30S2 can be adjusted to be 0.1 mm or more. The length of the first inner surface 30S1 determines the area where the resin member 12A is disposed in a process described below.

[0057] (1-4) A process of supplying a resin material into the gap to cover the outer surface of the base Next, a resin member 12A is supplied into the gap G between the outer surface 11A of the base 11 and the inner surface 30S of the opening 30A of the plate-like member 30 to cover the outer surface of the base. The resin member 12A is in a liquid or sol state at this stage. Examples of methods for supplying the resin member 12A include supplying it using a jet dispenser or a potting dispenser, or supplying it through an opening in a mask. The resin member 12A is then supplied from above the upper surface 30U of the plate-like member 30. The viscosity of the resin member 12A is preferably, for example, approximately 10 Pa·s / 0.5 rpm or less, or 1 Pa·s / 50 rpm or less at 25°C.

[0058] The resin member 12A can be supplied only to the gap G. Furthermore, as shown in FIGS. 4A and 4B , the resin member 12A can be supplied so as to straddle the upper surface 11C of the base 11 and the upper surface 30U of the plate-shaped member 30. This allows the supplied resin member 12A to flow so as to contact both the inner surface 30S of the opening 30A of the plate-shaped member 30 and the outer surface 11A of the base 11, thereby disposing the resin member 12A in the gap G. In plan view, the resin member 12A can be disposed in all or part of the gap G located outside each of the outer surfaces 11A of the base 11. For example, as shown in FIG. 4A , if the outer periphery of the upper surface 11C of the base 11 has a rectangular shape in plan view, the resin member 12A can be supplied to the outer surface 11A at each of the four corners and in the vicinity thereof, with a space therebetween. Even when resin material 12A is supplied to multiple locations in a single continuous gap G, adjusting the width of the gap G to the above-described width allows interfacial tension to cause resin material 12A to flow laterally (toward adjacent corners). As a result, as shown in FIG. 4C , resin material 12A can be disposed not only on the outer surface 11A where resin material 12A is supplied, but also on the outer surface 11A sandwiched between the supplied resin material 12A. Note that when resin material 12A flows laterally within gap G, resin material 12A may also flow on the upper surface 30U of plate-like member 30 or the upper surface 11C of base 11. By allowing resin material 12A supplied at separate locations to flow laterally in this manner, continuous resin material 12A can be formed as shown in FIG. 4C . However, the flowing resin material 12A may not be continuous but may be spaced apart from each other.

[0059] The amount of resin material 12A supplied can be adjusted according to the size of the outer surface 11A of the base 11 and the size (area) of the desired coating layer 12 on the outer surface 11A. When supplying the resin material 12A to multiple locations, for example, when using an air dispenser or a jet dispenser, multiple nozzles connected to one syringe can be used to supply the resin material 12A simultaneously. Alternatively, multiple syringes, each connected to a nozzle, can be used to supply the resin material 12A simultaneously or at different times. Alternatively, a jet dispenser having one nozzle connected to one syringe can be used to supply the resin material 12A to multiple different locations by moving the nozzle. Alternatively, the resin material 12A can be supplied multiple times at the same position. In this case, the resin material 12A may be cured to form a coating layer 12 in a process described below, and then another resin material 12A may be placed on the coating layer 12. Alternatively, a new resin material 12A may be placed so as not to overlap the coating layer 12 in whole or in part.

[0060] 4C , when the inner surface 30S of the opening 30A of the plate-shaped member 30 has a first inner surface 30S1, which is the inner surface of the protrusion 30T, the length of the first inner surface 30S1 is shorter than the length of the outer surface 11A of the base 11. In this case, the resin member 12A that protrudes below the first inner surface 30S1 has a portion that extends downward from the outer surface 11A of the base 11 and a portion that extends to a first lower surface 30D1, which is the lower surface of the protrusion 30T. This is because surface tension (interfacial tension) acts on the flowable resin member 12A, which reduces the resin member 12A from flowing downward and contacting the support member S1. In other words, by locating the first lower surface 30D1, which is continuous with the first inner surface 30S1, away from the support member S1 so as to form a space for excess resin member 12A to escape, the resin member 12A can be more easily positioned in a desired area. As described above, it is difficult to control the arrangement area of ​​the resin member 12A by using the space between the plate-like member 30 and the outer surface 11A of the base 11 using molding methods such as injection molding and compression molding. Similarly, with methods such as screen printing that do not provide a plate-like member facing the outer surface 11A of the base 11, even if it is possible to arrange the resin member 12A on the outer surface 11A of the base 11, it is difficult to control the area in which the resin member 12A extends, in particular the position of the lower end of the resin member 12A arranged on the outer surface 11A of the base 11.

[0061] 4B illustrates an opening 30A having a first inner surface 30S1 and a second inner surface 30S2. However, this is not limiting. When the thickness of the entire plate-shaped member 30 corresponds to the first inner surface 30S1, that is, when the entire plate-shaped member 30 is thin, the position of the lower end of the resin member 12A can be controlled as described above even without the second inner surface 30S2. In this case, it is preferable that the upper surface 30U of the plate-shaped member 30 and the upper surface 11C of the base 11 are arranged so as to be substantially horizontal.

[0062] 4E, the plate-shaped member 30 may have a side groove 30S3 on the inner surface 30S (first inner surface 30S1). The side groove 30S3 is disposed away from the upper surface 30U and the lower surface 30D (first lower surface 30D1). The resin member 12A can be caused to flow within the side groove 30S3.

[0063] (1-5) A step of forming a coating layer that covers the side surface of the base by hardening the resin member Next, the resin member 12A is cured. Specifically, the resin member 12A is cured by heating. This forms the coating layer 12. The heating temperature can be, for example, 60° C. to 200° C. The heating time can be, for example, 5 minutes to 480 minutes.

[0064] Before the resin member 12A is cured, the plate-shaped member 30 is moved and positioned away from the support member S1, as shown in FIG. 4D. After the plate-shaped member 30 is moved, the resin member 12A positioned on the outer surface 11A of the base 11 is subjected to surface tension (interfacial tension). As a result, the lateral thickness W of the resin member 12A on the outer surface 11A of the base 11 is thicker near the center than at the upper and lower ends. Furthermore, if fine particles such as carbon black are contained in the resin member 12A, the concentration of the fine particles at the edges is lower. As shown in FIG. 4D, a portion of the resin member 12A is attached to the inner surface 30S (30S1) of the opening of the plate-shaped member 30. In some cases, the resin member 12A also attaches to the lower surface 30D (30D1) of the plate-shaped member 30. However, if the surface of the plate-shaped member 30 has low wettability with respect to the resin member, the resin member 12A may not adhere to the plate-shaped member 30. It is also possible to harden the resin member 12A without moving the plate-like member 30. For example, if the adhesion between the resin member 12A and the outer surface 11A of the base 11 is stronger than the adhesion between the resin member 12A and the plate-like member 30, the hardened coating layer 12 can be peeled off from the plate-like member 30 and the coating layer 12 can be placed on the outer surface 11A of the base 11.

[0065] By the above steps, the substrate 10 shown in FIG. 1A etc. can be obtained.

[0066] A case where a modified plate-like member that can be used in the above steps is used will be described.

[0067] A plate-shaped member 31 according to a modified example is shown in FIGS. 5A and 5B. FIG. 5B is a cross-sectional view taken along line VB-VB in FIG. 5A. In the plate-shaped member 31, the shape of the opening 30A in a top view is partially different from the outer peripheral shape of the upper surface 11C of the base 11. Specifically, in the case of a base 11 whose outer peripheral shape of the upper surface 11C is rectangular, the upper surface 30U of the plate-shaped member 31 has a recessed portion 30P that is continuous with the opening 30A. The recessed portion 30P is continuous with a portion of the inner surface 30S that faces the four outer surfaces 11A of the base 11, and is disposed at a position facing each of the four corners of the base 11. The top view shape of the recessed portion 30P can be a semicircular shape as shown in FIG. 5A, or a rectangular, triangular, or other shape. Furthermore, as shown in FIG. 5B, the recessed portion 30P can have an inclined surface that slopes downward from the upper surface 30U in a cross-sectional view.

[0068] In this way, by providing recessed portion 30P that is continuous with inner surface 30S of opening 30A and recessed from upper surface 30U, resin member 12A can be supplied to recessed portion 30P, as shown in FIG. 5C. This allows resin member 12A to be placed in gap G that is continuous with recessed portion 30P. In other words, resin member 12A can be supplied to gap G without being supplied onto upper surface 11C of base 11. This makes it difficult to place resin member 12A on upper surface 30U of base 11, as shown in FIG. 6.

[0069] In the example shown in FIG. 5A , four recesses 30P are arranged corresponding to the four outer surfaces 11A of the base 11, and each recess 30P is arranged near a corner of the top surface 11C of the base 11. The position or shape of the recesses 30P is not limited to this. For example, the recesses 30P may be arranged away from the corners of the outer surface 11A of the base 11. Two or more recesses 30P may be arranged on one outer surface 11A. Furthermore, recesses 30P may not be arranged on all parts of the outer surface 11A of the base 11. The top view shape of the recesses 30P may be semicircular, rectangular, polygonal such as triangular, semi-elliptical, or a combination thereof. For example, if resin member 12A is supplied in a size of about 0.5 mm and spreads to about 1 mm, the width of recess 30P in top view (the distance from the boundary between the recess and the portion other than the recess to the farthest point) can be set to 0.5 mm to 1 mm. In this case, resin member 12A can be supplied into recess 30P, but not onto upper surface 11C of base 11.

[0070] 5B, the cross-sectional shape of the recessed portion 30P can be a surface parallel to the upper surface 30U, or a concave or convex curved surface. The depth of the recessed portion 30P (the distance from the upper surface 30U to the farthest point) can be, for example, 0.1 mm from the upper surface 30U of the plate-like member 30 when the upper surface 30U of the plate-like member 30 is at the same height as the upper surface 11C of the base 11.

[0071] A plate-shaped member 32 according to yet another modification is shown in FIGS. 7A and 7B. FIG. 7B is a cross-sectional view taken along line VIIB-VIIB in FIG. 7A. In the plate-shaped member 32, the shape of the opening 30A in a top view is partially different from the outer peripheral shape of the upper surface 11C of the base 11. Specifically, for the base 11 whose outer peripheral shape of the upper surface 11C is rectangular, the inner surface 30S of the opening 30A of the plate-shaped member 32 has an eave portion 30F that overlaps the upper surface 11C of the base 11. The eave portion 30F is disposed above a portion of the upper surface 11C of the base 11 that includes four sides, with a gap between them. In the portions corresponding to the four corners of the base 11, the upper surface 11C of the base 11 is not covered by the eave portion 30F, and the inner surface 30S of the opening 30A is located outside the outer surface 11A. The eaves portion 30F is disposed so as not to overlap the recessed portion R of the base body 11. The distance (gap) between the lower surface of the eaves portion 30F and the upper surface 11C of the base body 11 is, for example, 0 mm to 0.025 mm.

[0072] When such a plate-like member 32 is used, the resin member 12A is disposed so as to straddle the upper surface 11C of the base 11 that is not covered by the eaves portion 30F and the upper surface of the plate-like member 32 disposed outside of the upper surface 11C. This allows the resin member 12A disposed in the gap G between the inner surface 30S of the opening 30A of the plate-like member 30 and the outer surface 11A of the base 11 to spread laterally due to interfacial tension, and also allows the resin member 12A to spread in the gap between the lower surface of the eaves portion 30F of the plate-like member 32 and the upper surface 11C of the base 11 due to interfacial tension. If the distance between the lower surface of the eaves portion 30F and the upper surface 11C of the base 11 is 0 mm, i.e., if they are in contact, a new gap will be formed between the lower surface of the eaves portion 30F and the upper surface 11C of the base 11 when the plate-like member 30 is moved upward before the resin member 12A hardens. The resin member 12A then flows into this newly formed gap. This allows resin member 12A to be placed on upper surface 11C of base 11. Furthermore, when resin member 12A is cured with the lower surface of eaves portion 30F and upper surface 11C of base 11 in contact with each other, resin member 12A is unlikely to be placed on upper surface 11C of base 11 that was covered with eaves portion 30F.

[0073] <Substrate manufacturing method 2> Fig. 8A is a top view and two side views, viewed vertically and horizontally, showing a substrate 20 obtained by the substrate manufacturing method according to this embodiment. Fig. 8B is an enlarged top view of a portion of the substrate 20 shown in Fig. 1A, including one base 21. Fig. 8C is a cross-sectional view taken along line VIIIC-VIIIC in Fig. 8B. Fig. 8D shows a substrate intermediate 20A used in the substrate manufacturing method according to this embodiment.

[0074] Similar to manufacturing method 1, substrate 20 obtained in substrate manufacturing method 2 includes base 21, covering layer 12 disposed on outer surface 21A of base 21, and support member S2. In substrate 20 according to this embodiment, adhesive sheet member 23 is used as support member S2, and base 21 is disposed on the upper surface of support member S2. By removing base 21 from support member S2, light emitting device package P1 including base 21 and covering layer 12 can be obtained. In other words, in substrate manufacturing method 1, a portion of support member S1 becomes a component that constitutes a portion of the light emitting device, whereas in substrate manufacturing method 2, support member S2 is a component that is not included in the light emitting device.

[0075] In this embodiment, the sheet member 23 serving as the support member S2 may be conductive, insulating, or a combination thereof. The sheet member 23 has a shape, for example, rectangular or circular, when viewed from above. Regarding the size of the sheet member 23, if it is rectangular, the short side length is 41 mm to 100 mm, the long side length is 100 mm to 200 mm, and the thickness is 0.035 mm to 0.2 mm. Furthermore, if it is circular, the diameter is 100 mm to 300 mm, and the thickness is 0.035 mm to 0.2 mm. For example, if the sheet member 23 is conductive, the same materials as those listed in the substrate manufacturing method 1 may be used. If it is insulating, resin materials such as phenolic resin, epoxy resin, polyimide resin, polyethylene terephthalate, polycarbonate, polyethylene naphthalate, silicone resin, polyphthalamide, and liquid crystal polymer may be used. The sheet member 23 may itself be adhesive, or may be a non-adhesive member with an adhesive applied to its surface, such as a support member S2 having a metal frame and a UV sheet held by the frame, as shown in Fig. 8A. The UV sheet is a resin sheet with an adhesive on its surface, and its adhesiveness decreases when irradiated with UV light.

[0076] In this embodiment, the base 21 is a member for holding a light-emitting element in a light-emitting device, which will be described later. Materials for the base 21 include the resin materials listed in the substrate manufacturing method 1, as well as ceramic materials such as aluminum oxide and aluminum nitride, and metal materials such as aluminum and copper. In this embodiment, the base 21 is a package P1 including a resin molded body 22 and a conductive member 23. The package P1 is supported by a support member S2 in the state where a coating layer 12 is provided on the outer surface of the molded body 22, i.e., the outer surface 21A of the base 21. Examples of the base 21 include a resin package in which leads are embedded in a resin base, or a ceramic package with wiring. The base 21 is supported by the support member S2 so that the lower surface of the base 21 faces the upper surface of the support member S2.

[0077] The covering layer 12 can be made of the same materials as those exemplified in the substrate manufacturing method 1.

[0078] Such a substrate 20 can be manufactured using the same steps as in substrate manufacturing method 1. In this embodiment, as shown in Fig. 8D, in a substrate intermediate body 20A, the base body 21 (package P1) is entirely disposed on the upper surface of a support member S2.

[0079] (Embodiment 2) The light emitting device obtained by the manufacturing method of the light emitting device according to the present embodiment includes a package and a light emitting element held in the package. The package includes a base, a covering layer disposed on the outer surface of the base, and a conductive member.

[0080] The following method can be used to manufacture such a light emitting device. One method includes a step of preparing a substrate intermediate used in embodiment 1, arranging a light emitting element on the substrate of the substrate intermediate to form a light emitting device intermediate, and then arranging a coating layer on the base of the substrate (light emitting device manufacturing method 1). Another method includes a step of preparing a substrate according to embodiment 1, i.e., a substrate provided with a coating layer, and placing a light emitting element on the base of the substrate (light emitting device manufacturing method 2).

[0081] 9A and 9B are a top view and a side view showing a light emitting device 100 obtained by the manufacturing method of a light emitting device according to this embodiment. FIG. 9C is a cross-sectional view taken along line IXC-IXC in FIG. 9A. The light emitting device 100 includes a package P1 and a light emitting element 14. The package P1 includes a base 11 and a covering layer 12 disposed on an outer surface 11A of the base 11. The base 11 includes a molded body 22 and a conductive member 13. The light emitting device 100 may further include a wire 15 that joins the light emitting element 14 and the conductive member 13, a light-transmitting member 17 that seals the light emitting element 14, etc.

[0082] A known semiconductor light emitting element can be used as the light emitting element 14. In this embodiment, a light emitting diode is used as the light emitting element. For example, a light emitting element that emits blue light (peak wavelength 430 nm to 490 nm) or green light (peak wavelength 495 nm to 565 nm) may be a nitride semiconductor (In x Al y Ga 1-x-y N, 0≦X, 0≦Y, X+Y≦1) can be used. As a light-emitting element that emits red light (peak wavelength 610 nm to 700 nm), in addition to the nitride-based semiconductor elements described above, GaAlAs, AlInGaP, etc. can be used. The shape of the light-emitting element in plan view can be quadrangular, such as square or rectangle, or polygonal, such as triangle or hexagon. In the example shown in FIG. 9A etc., the light-emitting device 100 includes three light-emitting elements 14: a blue light-emitting element, a green light-emitting element, and a red light-emitting element. For example, in the case of a light-emitting device 100 applicable to a display, full-color display can be achieved by including three light-emitting elements: a blue light-emitting element, a green light-emitting element, and a red light-emitting element.

[0083] The light emitting device 100 also includes a bonding member that bonds the light emitting element 14 and the conductive member 13. The bonding member may be insulating or conductive. Examples of insulating bonding members include resin materials such as silicone and epoxy. Examples of conductive bonding members include bumps containing metals such as gold, silver, and copper, conductive paste, and eutectic solder such as Au-Sn.

[0084] The wire 15 is a member that electrically connects the conductive member 13 and the light emitting element 14. Examples of materials for the wire 15 include gold, silver, aluminum, and alloys thereof.

[0085] The light-transmitting member 17 is a member that protects the light-emitting element 14 and the like, and is disposed in the recess R. Examples of resin materials used for the light-transmitting member 17 include thermosetting resins such as epoxy resin, modified epoxy resin, silicone resin, and modified silicone resin. The light-transmitting member 17 may also contain a diffusing material such as barium titanate, titanium oxide, aluminum oxide, or silicon oxide. Furthermore, the light-transmitting member 17 may also contain a pigment or a dye.

[0086] 10 includes a molded body 22 and a light-shielding layer 18 as a base 11. In the example shown in FIG. 10, the covering layer 12 covers the outer surface 11A and the upper surface 11C of the base 11, including the light-shielding layer 18. However, the light-shielding layer 18 may be exposed from the covering layer 12.

[0087] Examples of the light-shielding layer 18 include a resin material containing carbon black or titanium black as a light-absorbing substance. The light-shielding layer 18 may be made of the same material as the covering layer 12, or a different material. The light-shielding layer 18 preferably covers the entire upper surface of the molded body 22. The upper surface of the light-shielding layer 18 may be flat or uneven. When the light-emitting device is used as a display, the upper surface of the light-shielding layer 18 is preferably uneven. When the light-shielding layer 18 with an uneven upper surface is exposed from the covering layer 12, it can scatter external light and reduce shine. When the light-shielding layer 18 with an uneven upper surface is covered with the covering layer 12 so as to cover the unevenness, it can improve adhesion between the light-shielding layer 18 and the covering layer 12. In particular, when the light-emitting device is used in a harsh environment, such as when used as an outdoor display, having the covering layer 12 arranged with good adhesion can reduce problems such as peeling of the covering layer 12.

[0088] The thickness of the light-shielding layer 18 can be, for example, 1 μm to 25 μm. When the coating layer 12 is a light-shielding coating layer 12 containing carbon black or the like as a light-absorbing material, by covering the upper surface of the light-shielding layer 18 with the coating layer 12, gaps in the light-shielding layer 18 that have cracked due to thermal shrinkage of the base 11 or curing shrinkage of the light-shielding layer 18 itself can be filled. The light-shielding layer 18 can be formed by printing, stamping, injection molding, compression molding, or the like.

[0089] <Light-emitting device manufacturing method 1> The manufacturing method 1 for the light emitting device includes the following steps. (2-1) A step of preparing a substrate intermediate including a base and a support member that supports the base (2-2) Step of arranging the light emitting element on the base (2-3) Step of preparing a plate-shaped member having an opening (2-4) A step of placing the plate-like member on the support member so that the base is placed in the opening of the plate-like member. (2-5) A step of placing a resin member in the gap between the side surface of the base and the plate-like member (2-6) A process of forming a coating layer that covers the side surface of the base by hardening the resin member

[0090] In the above steps, except for step (2-2), the steps are the same as those in embodiment 1. That is, step (2-1) is the same as step (1-1) in embodiment 1, step (2-3) is the same as step (1-2), step (2-4) is the same as step (1-3), step (2-5) is the same as step (1-4), and step (2-6) is the same as step (1-5), so their explanations will be omitted. Step (2-2) will be described in detail below.

[0091] (2-2) Step of arranging the light emitting element on the base The light emitting element 14 is placed in the recess R of each base 11 of the substrate intermediate 10A shown in FIG. 2A. For example, a bonding member such as a resin is placed on the bottom surface R1 that defines the recess R, and the light emitting element 14 is placed on top of that. The light emitting element 14 can be placed at a desired position on the bottom surface R1 that defines the recess R by, for example, using a collet to suction and hold the light emitting element 14.

[0092] This step may also include a step of arranging members such as the wires 15 and the light-transmitting member 17.

[0093] The wires 15 can be arranged using a wire bonder or the like. The light-transmitting member 17 can be formed by placing a liquid resin material in the recess R by potting, spraying, or the like, and then heating it at a temperature of 60°C or higher and 200°C or lower to harden it.

[0094] In addition to the light emitting element 14, a protective element such as a Zener diode may be disposed as needed. A light reflective member such as a white resin may be disposed around the light emitting element 14 by potting, printing, or other methods. If the conductive member 13 is made of a material containing silver, a protective film such as titanium oxide or aluminum oxide may be disposed by sputtering, vapor deposition, atomic layer deposition (ALD), or other methods for the purpose of reducing sulfurization of silver.

[0095] Finally, after the step of forming the covering layer 12 in (2-6), the lead frame 13, which is the support member S1, is cut at a desired position, or a part of the lead frame 13 (hanging lead 13C) that was embedded in the base 11 is removed from the base 11, thereby obtaining the individual light emitting devices 100 as shown in Fig. 9A. In this embodiment, the support member S1 is the lead frame 13, and before removing the base 11 from the lead frame 13, a step of bending the part that will become the outer lead 13B of the light emitting device 100 into a desired shape may be provided.

[0096] 8D, when a sheet member is used as the support member S2, a step of removing the light emitting device 300 held by the support member (sheet member) S2 is provided, thereby obtaining the light emitting device 300 shown in FIGS. 11A and 11B.

[0097] 12A and 12B, the light-emitting device 400 has a structure in which the base 40 does not have a recess, and the base 40 includes a molded body 22 and a wiring substrate 28. The molded body 22 and the light-emitting element 24 are in contact with each other. Since it is virtually impossible to obtain a substrate intermediate for the light-emitting device 400 having such a structure, the light-emitting device 400 can be obtained by forming a light-emitting device intermediate without a coating layer and then providing the coating layer. Furthermore, the light-emitting device 400 has four outer surfaces 40A, of which two outer surfaces 40A are provided with a coating layer 12, and the other two outer surfaces 40A are not provided with a coating layer 12. By providing the coating layer 12 only on the desired outer surfaces 40A, for example, it is possible to prevent light emitted from the light-emitting element 24 from leaking to the outside through the outer surfaces 40A on which the coating layer 12 is provided.

[0098] <Light-emitting device manufacturing method 2> The manufacturing method 2 of the light emitting device includes the following steps. (3-1) A step of preparing a substrate including a base, a coating layer disposed on a side surface of the base, and a support member that supports the base. (3-2) Step of arranging the light emitting element on the base

[0099] In the above steps, step (3-1) is the same as step (1-1) in embodiment 1, and step (3-2) is the same as step (2-2) in method 1 for manufacturing a light-emitting device, so a description thereof will be omitted.

[0100] For example, aspects of the present invention are as follows.

[0101] (Appendix 1) a step of preparing a substrate intermediate including a plurality of substrates each having an upper surface and an outer surface continuous with the upper surface, and a support member that supports the substrates such that the outer surfaces of the plurality of substrates are spaced apart from one another; providing a plate-like member having an opening; a step of placing the plate-shaped member on the support member so that at least a part of an inner surface of the plate-shaped member that defines the opening and at least a part of an outer surface of the base body face each other via a gap; a step of supplying a resin material into the gap to cover the outer surface of the base; a step of forming a coating layer that covers the outer surface of the base by curing the resin member; A method for manufacturing a substrate comprising:

[0102] (Appendix 2) The method for manufacturing a substrate described in Appendix 1, wherein the inner surface of the plate-shaped member has a first inner surface and a second inner surface located outside the first inner surface, and the resin member is arranged in the gap between the first inner surface and the outer surfaces of the multiple bases.

[0103] (Appendix 3) the plate-like member has a recessed portion on an upper surface thereof that is continuous with the opening, 3. The method for manufacturing a substrate according to claim 1, wherein in the step of placing the resin member, the resin member is placed in the gap via the recessed portion.

[0104] (Appendix 4) 4. The method for producing a substrate according to any one of claims 1 to 3, wherein the coating layer has a lower brightness than the base.

[0105] (Appendix 5) 6. The method for manufacturing a substrate according to any one of claims 1 to 5, wherein the support member is a lead frame, and the base is a molded body containing a resin as a main component.

[0106] (Appendix 6) 6. The method for manufacturing a substrate according to any one of Appendix 5, wherein the base includes the molded body and a light-shielding layer disposed on an upper surface of the molded body.

[0107] (Appendix 7) 7. The method for manufacturing a substrate according to claim 6, wherein in the step of arranging the resin member, the resin member is arranged so as to cover the light-shielding layer.

[0108] (Appendix 8) preparing a plurality of light emitting device intermediates, each of which includes a plurality of bases each having an upper surface and an outer surface continuous with the upper surface, a light emitting element held on the base, and a support member that supports the light emitting device intermediates such that the outer surfaces of the plurality of bases are spaced apart from each other; providing a plate-like member having an opening; a step of placing the plate-shaped member on the support member so that at least a part of an inner surface of the plate-shaped member that defines the opening and at least a part of an outer surface of the base body face each other via a gap; a step of supplying a resin member into the gap to cover the outer surface of the base; a step of hardening the resin member to form a coating layer that covers the outer surface of the base; A method for manufacturing a light emitting device comprising:

[0109] (Appendix 9) 9. The method for manufacturing a light-emitting device according to claim 8, wherein the light-emitting element includes a blue light-emitting element, a green light-emitting element, and a red light-emitting element. [Explanation of symbols]

[0110] 10, 20...board 10A, 20A...Substrate intermediate 100, 200, 300, 400...light-emitting device 100A, 200A...Light emitting device intermediate 11, 21, 40...Base (11A, 21A, 40A...Outer surface, 11B...Inner surface, 11C...Top surface) 12…Covering layer 12A...Resin material 13, 23... Conductive member (lead frame) (13A... inner lead, 13B... outer lead, 13C... suspension lead, 13D... frame portion) 14, 24...Light emitting element 15...Wire 17, 27...Translucent member 18...Light blocking layer 22...Molded body 25...Protection element 28...Wiring board R...recess (R1...bottom) P1, P2...Package S1, S2...Support members 30, 31, 32... Plate-shaped members 30A...Opening of plate-shaped member 30U: Upper surface of plate-shaped member 30D...Bottom surface of plate-shaped member 30D1...First lower surface of plate-shaped member (lower surface of convex portion) 30D2...second lower surface of plate-like member 30S...Inner surface of plate-shaped member 30S1...First inner surface of the opening of the plate-shaped member (inner surface of the convex portion) 30S2...Second inner surface of the opening of the plate-shaped member 30S3...Side groove of opening of plate-shaped member 30T...Protruding part of plate-shaped member 30P...Recessed portion on the top surface of the plate-shaped member 30F: Eaves of plate-shaped components G...gap

Claims

1. preparing a substrate intermediate including a plurality of substrates each having an upper surface and an outer surface continuous with the upper surface, and a support member that supports the plurality of substrates such that the outer surfaces of the plurality of substrates are spaced apart from one another; providing a plate-like member having an opening; a step of placing the plate-shaped member on the support member so that at least a part of an inner surface of the plate-shaped member that defines the opening and at least a part of an outer surface of the base body face each other via a gap; a step of supplying a resin material into the gap to cover the outer surfaces of the plurality of bases; a step of forming a coating layer that covers outer surfaces of the plurality of bases by curing the resin member; A method for manufacturing a substrate comprising:

2. 2. The method for manufacturing a substrate according to claim 1, wherein the inner surface of the plate-like member has a first inner surface and a second inner surface located outside the first inner surface, and the resin member is arranged in a gap between the first inner surface and the outer surfaces of the plurality of bases.

3. the plate-like member has a recessed portion on an upper surface thereof that is continuous with the opening, The method for manufacturing a substrate according to claim 1 , wherein in the step of arranging the resin member, the resin member is arranged in the gap via the recessed portion.

4. The method for manufacturing a substrate according to claim 1 or 2, wherein the coating layer has a lower brightness than the base.

5. 3. The method for manufacturing a substrate according to claim 1, wherein the support member is a lead frame, and the base is a molded body whose main component is resin.

6. The method for manufacturing a substrate according to claim 5 , wherein the base includes the molded body and a light-shielding layer disposed on an upper surface of the molded body.

7. The method for manufacturing a substrate according to claim 6 , wherein in the step of arranging the resin member, the resin member is arranged so as to cover the light-shielding layer.

8. preparing a plurality of light emitting device intermediates, each of which includes a plurality of bases each having an upper surface and an outer surface continuous with the upper surface, a light emitting element held on the base, and a support member that supports the light emitting device intermediates such that the outer surfaces of the plurality of bases are spaced apart from each other; providing a plate-like member having an opening; a step of placing the plate-shaped member on the support member so that at least a part of an inner surface of the plate-shaped member that defines the opening and at least a part of an outer surface of the base body face each other via a gap; a step of supplying a resin member into the gap to cover the outer surface of the base; a step of hardening the resin member to form a coating layer that covers the outer surface of the base; A method for manufacturing a light emitting device comprising:

9. The method for manufacturing a light emitting device according to claim 8 , wherein the light emitting elements include a blue light emitting element, a green light emitting element, and a red light emitting element.

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