Laser processing method and device for mechanical seal end face waviness

Abstract

This application relates to the technical field of mechanical seals, and particularly to a laser processing method and apparatus for mechanical seal end face undulations. Here, the method includes steps of determining the number of circumferential rotations based on a circumferential periodic structure, dividing a plurality of stepped regions by a taper angle in the radial direction, drawing a processing layer corresponding to each stepped region, introducing the processing layer corresponding to the first stepped region, attaching a test piece, aligning, focusing, and setting technical parameters, completing the first stepped processing within a single periodic structure, rotating by the number of circumferential rotations, and sequentially introducing the remaining stepped regions until all stepped processing within the entire period is completed. The embodiments of this application can perform rotational splicing based on the circumferential periodic structure and sequentially process each stepped region, realizing high-efficiency operations. At the same time, by ensuring the stable quality of the laser processing of the end face undulations, it reduces the operation difficulty of the mechanical seal, improves the accuracy and qualification rate of the processing results, and becomes more practical.

Description

[Technical Field]

[0001] This application is based on and claims priority from a Chinese patent application with application number 202310180289.9 and filing date February 15, 2023, the entire contents of which are hereby incorporated by reference into this application.

[0002] The present application relates to the technical field of mechanical seals, and more particularly to a method and apparatus for laser processing of undulations on the end face of a mechanical seal. [Background technology]

[0003] The undulating end face mechanical seal is a non-contact mechanical seal that utilizes the structural characteristics of the end face to generate fluid dynamic and static pressure effects, forming a single micron-level fluid film between the end faces of the rotating ring and fixed ring to achieve non-contact operation, and is widely used in industries such as nuclear power and chemical industries.

[0004] In related technologies, the processing defect of end surface waviness directly affects the formation of fluid film in the seal gap and reduces the stability of the seal. On the other hand, laser processing technology has advantages such as high processing efficiency, great flexibility in surface micro-texturing processing, and quality controllability, and can be used for precision processing of surface texturing.

[0005] However, in the related art, the processed dynamic pressure groove shape does not have continuity in the circumferential direction, and the change in processing depth is uniform, making it difficult to use for processing complex waviness texturing. In addition, the technical process of end face waviness is restricted by external conditions, resulting in a complicated processing process, a low success rate, failure to meet high-precision processing requirements, and insufficient processing accuracy, which needs to be resolved. Summary of the Invention [Problem to be solved by the invention]

[0006] The present application provides a method and apparatus for laser processing the end face waviness of a mechanical seal, which solves the problems that in related technologies, the processed dynamic pressure groove shape does not have continuity in the circumferential direction, the processing depth changes only in a single manner, and it is difficult to use it to process complex waviness texturing, and the technical process of end face waviness is restricted by external conditions, which makes the processing process complicated, results in a low pass rate, cannot meet high-precision processing requirements, and results in insufficient processing accuracy.

[0007] A first embodiment of the present application provides a laser processing method for the waviness of a mechanical seal end face, including the steps of: determining the number of circumferential rotations based on the circumferential periodic structure; dividing a plurality of staircase areas by determining the processing depth of one time according to the maximum height difference formed by the taper angle in the radial direction; drawing a processing layer corresponding to each staircase area of ​​the plurality of staircase areas; introducing a processing layer corresponding to a first staircase area of ​​the plurality of staircase areas, mounting a test piece, aligning and focusing, and setting technical parameters to start processing using a laser device; after completing the first staircase processing within the single periodic structure, rotating the circumferential rotations the number of times, completing the first staircase processing within the entire period, and sequentially introducing the remaining staircase areas until all staircase processing within the entire period is completed.

[0008] Optionally, in one embodiment of the present application, the processing layer includes laser processing routes to form circumferentially arranged undulations.

[0009] Optionally, in one embodiment of the present application, the number of rotations in the circumferential direction is in the interval [0, 50].

[0010] Optionally, in one embodiment of the present application, the value of the single processing depth ranges from 0 to 50 μm, and the value of the number of step regions ranges from 1 to 100.

[0011] Optionally, in one embodiment of the present application, the step of drawing a processing layer corresponding to each stair area of ​​the plurality of stair areas includes a step of determining the contour of the corresponding processing layer according to an end face geometric structure corresponding to each stair area.

[0012] The second embodiment of the present application provides a laser processing device for mechanical seal end face waviness, which includes an acquisition module used to determine the number of circumferential rotations based on the circumferential periodic structure; and a division module used to determine the processing depth of one rotation according to the maximum height difference formed by the taper angle in the radial direction, thereby dividing multiple step regions. The present invention includes a drawing module used to draw a processing layer corresponding to each staircase area of ​​the plurality of staircase areas; an introduction module used to introduce a processing layer corresponding to a first staircase area of ​​the plurality of staircase areas, attach a test piece, align, focus, and set technical parameters to start processing using a laser device; and a processing module used to complete the first staircase processing within a single periodic structure, rotate through the circumferential processing number, and then complete the first staircase processing within the entire period, and sequentially introduce the remaining staircase areas until all staircase processing within the entire period is completed.

[0013] Optionally, in one embodiment of the present application, the processing layer includes laser processing routes to form circumferentially arranged undulations.

[0014] Optionally, in one embodiment of the present application, the number of rotations in the circumferential direction is in the interval [0, 50].

[0015] Optionally, in one embodiment of the present application, the value of the single processing depth ranges from 0 to 50 μm, and the value of the number of step regions ranges from 1 to 100.

[0016] Optionally, in one embodiment of the present application, the drawing module includes a determining unit used for determining the contour of the corresponding processing layer according to an end face geometric structure corresponding to each of the staircase regions.

[0017] A third embodiment of the present application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable by the processor, wherein the processor executes the program to realize the laser processing method for mechanical seal end face waviness described in the above embodiment.

[0018] A fourth embodiment of the present application provides a computer-readable storage medium, which stores a computer program, and when the program is executed by a processor, realizes the above-mentioned method for laser processing the end face waviness of a mechanical seal.

[0019] In the embodiment of the present application, the number of circumferential rotations is determined based on the circumferential periodic structure, and the machining depth of one pass is determined according to the maximum height difference formed by the radial taper angle. A plurality of staircase regions are divided, a machining layer corresponding to each staircase region of the plurality of staircase regions is drawn, a machining layer corresponding to the first staircase region of the plurality of staircase regions is introduced, a test piece is mounted, aligned, focused, and technical parameters are set, and then the laser device is used to start machining. After completing the first staircase within the single periodic structure, the laser device rotates a certain number of circumferential rotations, and then completes the first staircase within the entire period. The remaining staircase regions are introduced sequentially until all staircases within the entire period are completed. This achieves high-efficiency work while ensuring stable quality in laser processing of end face waviness. This reduces the difficulty of operating the mechanical seal, improves the precision and pass rate of the processing results, and is more practical. As a result, the dynamic pressure groove shape machined in the related art does not have continuity in the circumferential direction, and the change in machining depth is uniform, making it difficult to use for machining complex wavy texturing. In addition, the technical process for end face waviness is restricted by external conditions, which solves problems such as the complicated machining process, low pass rate, inability to meet high-precision machining requirements, and insufficient machining accuracy.

[0020] Additional aspects and advantages of the present application will be set forth in part in the description that follows, and in part will be obvious from the description, or may be learned by practice of the present application. [Brief explanation of the drawings]

[0021] The above and / or additional aspects and advantages of the present application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the drawings, in which: [Figure 1] 1 is a flowchart of a method for laser processing an end face undulation of a mechanical seal provided by an embodiment of the present application. [Figure 2] 1 is a schematic diagram of a laser processing process for forming waviness on an end face of a mechanical seal according to an embodiment of the present application; FIG. [Figure 3] FIG. 2 is a schematic diagram of the waviness of the end face of a mechanical seal according to an embodiment of the present application. [Figure 4] 1 is a schematic diagram of a division of a staircase area according to an embodiment of the present application; [Figure 5] 1 is a schematic diagram of a processing layer of an embodiment of the present application; [Figure 6] FIG. 10 is a schematic diagram of an actual machining form of a tapered angle region in the radial direction in one embodiment of the present application. [Figure 7] 1 is a structural schematic diagram of a laser processing device for removing waviness from an end face of a mechanical seal according to an embodiment of the present application. [Figure 8] 1 is a structural schematic diagram of an electronic device according to an embodiment of the present application; DETAILED DESCRIPTION OF THE INVENTION

[0022] The following describes in detail the embodiments of the present application, and examples of the described embodiments are shown in the drawings, where the same or similar designations throughout refer to the same or similar elements, or elements having the same or similar functions. The embodiments described below with reference to the drawings are illustrative and are intended to be used to explain the present application, and should not be understood as limiting the present application.

[0023] The present application provides a laser processing method and apparatus for machining the waviness of mechanical seal end faces according to the embodiments, with reference to the drawings. In the related art described in the background art above, the processed dynamic pressure groove shape does not have continuity in the circumferential direction, and the change in processing depth is single, making it difficult to process complex waviness texturing. Furthermore, the technical process of waviness end faces is constrained by external conditions, resulting in complicated processing, low pass rates, inability to meet high-precision processing requirements, and insufficient processing accuracy. In response to these problems, the present application provides a laser processing method for machining the waviness of mechanical seal end faces, which determines the number of circumferential rotations according to the circumferential periodic structure, and determines the processing depth of each rotation according to the maximum height difference formed by the taper angle in the radial direction, thereby dividing multiple step regions into multiple step regions.

[0003] By drawing a machining layer corresponding to each staircase region in the region, introducing a machining layer corresponding to the first staircase region of the multiple staircase regions, mounting a test piece, aligning, focusing, and setting technical parameters, the laser device is used to start machining. After completing the first staircase region in a single periodic structure, the laser is rotated a certain number of times in the circumferential direction, completing the first staircase region in the entire period, and then sequentially introducing the remaining staircase regions until all staircase regions in the entire period are completed. This achieves high work efficiency while ensuring stable quality in laser processing of edge waviness, reduces the difficulty of operating the mechanical seal, improves the accuracy and pass rate of the processing results, and is more practical. As a result, this solves the problems that the processed dynamic groove shape in the related art is not continuous in the circumferential direction and the change in processing depth is uniform, making it difficult to process complex waviness texturing, and the edge waviness technical process is restricted by external conditions, resulting in complicated processing, low pass rate, inability to meet high-precision processing requirements, and insufficient processing accuracy.

[0024] Specifically, FIG. 1 is a schematic diagram of the process of the laser processing method for the waviness of the end face of a mechanical seal provided in the embodiment of the present application.

[0025] As shown in FIG. 1, the laser processing method for the waviness of the end face of the mechanical seal includes the following steps.

[0026] In step S101, the number of rotations in the circumferential direction is determined based on the periodic structure in the circumferential direction.

[0027] In addition, the circumferential periodic structure in the embodiments of the present application can be formed by repeating a number of identical structures along the circumferential direction, and the circumferential periodic structure of the wavy end face can be formed by repeating a number of identical wavy end faces along the circumferential direction. The periodicity can be analyzed according to the structural characteristics of the wavy end face of the mechanical seal, and the number of circumferential rotations can be determined accordingly. For example, when the end face is formed by repeating nine identical wavy portions, the number of rotations can be determined to be eight.

[0028] The embodiments of the present application can determine the number of rotations in the circumferential direction based on the circumferential periodic structure, and perform a quantitative analysis of the end face waviness to provide a basis for determining the number of rotations required for each step in the following steps.

[0029] Optionally, in one embodiment of the present application, the number of rotations in the circumferential direction is in the interval [0, 50].

[0030] In addition, the limited range of the number of circumferential rotations in the examples of the present application is 0 to 50 times. By specifying the maximum and minimum number of circumferential rotations, the laser processing operation can avoid redundancy in the execution operation and ensure the processing efficiency of the mechanical seal.

[0031] In step S102, the depth of one machining operation is determined based on the maximum height difference formed by the taper angle in the radial direction, thereby dividing the step regions into a plurality of step regions.

[0032] In the embodiment of the present application, the maximum height difference can be determined by the taper angle area in the radial direction of the object to be machined, and the single machining depth of the object can be obtained, and the number of divided steps can be obtained, and the position of each step area can be confirmed. The step area can also be a step, which is a numerical value of the single machining depth, with a slight height set instead of the taper angle according to the cross-sectional geometric parameters of the taper angle in the radial direction.

[0033] In actual implementation, the cross-sectional shape of the tapered angle region in the radial direction of the machined object may be a single cone, a double cone, multiple cones, steps, various curves, etc., and the end face contour shape of the tapered angle region in the radial direction may be an arc, a sine curve, a straight line, etc.

[0034] In the embodiment of the present application, the machining depth for one step is determined according to the maximum height difference formed by the radial taper angle, so that multiple step regions can be divided, which provides the necessary data basis for realizing the multi-level machining of mechanical seals in the following steps, and improves the precision level of the laser machining process.

[0035] Optionally, in one embodiment of the present application, the range of values ​​for the single processing depth is 0-50 μm, and the range of values ​​for the number of step regions is 1-100.

[0036] In actual implementation, when the embodiments of the present application divide the step regions into laser processed waviness on the end face of the mechanical seal, the range of values ​​for the single processing depth of each step region can be set to 0 to 50 μm, and the range of values ​​for the number of divided step regions according to the single processing depth can be set to 1 to 100. By limiting the range of values ​​for the single processing depth and the number of step regions, the operating conditions of the laser processing process can be further improved and the processing efficiency of the mechanical seal can be further ensured.

[0037] In step S103, a processing layer corresponding to each of the plurality of staircase regions is drawn.

[0038] In addition, in the embodiment of the present application, for the divided staircase areas of the above steps, drawing can be performed on each staircase area separately, and processing layers corresponding to each staircase area can be obtained. For example, AutoCAD software can be used to draw each staircase area, and corresponding processing layers can be obtained and saved separately.

[0039] The embodiments of the present application depict processing layers corresponding to each of the multiple staircase regions, thereby obtaining the processing basis of each separate staircase region and providing processing plans for each staircase region, which further improves the feasibility of the laser processing process of the mechanical seal.

[0040] Optionally, in one embodiment of the present application, the processing layer includes laser processing routes to form circumferentially arranged undulations.

[0041] In some embodiments, the spacing between the laser processing routes can be set to 0 to 1 mm. In one embodiment of the present application, the processing layer includes laser processing routes to form circumferentially arranged undulations, which provide information on the required processing layer for the rotary processing of the single-periodic structure in the following steps.

[0042] Optionally, in one embodiment of the present application, the step of drawing a processing layer corresponding to each stair area of ​​the plurality of stair areas includes a step of determining the contour of the corresponding processing layer according to an end face geometric structure corresponding to each stair area.

[0043] In addition, the contour of the processing layer in the embodiments of the present application can be obtained by the end face geometric structure of each corresponding staircase area obtained in the above steps, and the information of the processing layer can be further obtained by embodying the end face shape of the staircase area of ​​the step.

[0044] In step S104, a processing layer corresponding to a first staircase region of the plurality of staircase regions is introduced, and a test piece is attached, aligned, focused, and technological parameters are set, and processing is started using a laser device.

[0045] In some embodiments, the ranges of values ​​of the technical parameters can be set as follows: laser speed 0-4000 m / s, frequency 0-120 kHz, and power 0-100%, and the laser device is used for processing. The attached test piece can be the object of laser processing of the mechanical seal end face waviness. The material of the test piece is not limited, and can be, for example, cemented carbide, tungsten carbide, silicon nitride, stainless steel, etc.

[0046] The embodiment of the present application introduces a processing layer corresponding to the first step region of multiple step regions, and by mounting a test piece, aligning, focusing, and setting technical parameters, processing can be started using a laser device. By executing the operation preparation program for the first step region of laser processing of the mechanical seal end face waviness, an operating environment is provided to complete the first step processing of the single-periodic structure in the following steps, making the operation easier and more efficient.

[0047] In step S105, after completing the first staircase machining in the single periodic structure, rotate the number of circumferential rotations, and then complete the first staircase machining in the entire period, and then introduce the remaining staircase areas sequentially until all staircase machining in the entire period is completed.

[0048] In addition, the first staircase processing in the single periodic structure of the embodiment of the present application can be an operation performed by laser processing a single identical undulation portion of the first staircase region, and then, by performing rotation processing for the number of rotations in the circumferential direction of the first staircase region obtained in the above step, to obtain the first staircase processing result within the entire period, and similarly, performing laser processing operations on the processing layers that sequentially introduce the remaining staircase regions, and polishing the processed surface before processing the staircase region of the next layer and after all processing is completed, to obtain the staircase processing result for the entire period corresponding to each staircase region, that is, to obtain the final laser processing state of the mechanical seal end face waviness.

[0049] In the embodiment of the present application, after completing the first step machining within a single periodic structure, the first step machining within the entire period is completed after rotating a certain number of times in the circumferential direction, and the remaining step areas can be introduced sequentially until all step machining within the entire period is completed, thereby realizing high-efficiency work and at the same time ensuring stable quality of laser processing of end face waviness and improving the accuracy of laser processing of mechanical seal end face waviness.

[0050] Below, the work content of the embodiment of the present application will be described in detail as a specific example in combination with Figures 2 to 6. Figure 2 is a schematic diagram of the laser processing process for the waviness of the end face of a mechanical seal in one embodiment of the present application.

[0051] First, the periodicity of the object to be processed is analyzed based on the structural characteristics of the waviness of the mechanical seal end face, and the corresponding number of rotations M in the circumferential direction is determined. Figure 3 is a schematic diagram of the waviness of the mechanical seal end face in one embodiment of the present application, and by knowing that the end face is composed of a flat dam region (1) and a tapered angle region (2) in the radial direction, with the boundary between the two being an arc (3) where they meet, and that the end face is repeatedly composed of nine identical wavinesses a to i, the number of rotations M can be determined to be 8. The formula for the height H of the tapered angle region is: H(r,θ)=(rR linjie (θ))·tan(β), Here, H is the height of the taper angle region, r is the radial coordinate, θ is the circumferential coordinate, β is the taper angle of the taper angle region in the radial direction, and R linjie (θ) is the radius of the boundary line between the flat dam region and the tapered angle region in the radial direction, and the structure is periodic along the circumferential direction.

[0052] Then, a single machining depth h is determined, and N staircase regions are divided. As shown in Figure 4, which is a schematic diagram of the division of the staircase region in one embodiment of the present application, the maximum height difference H of the tapered angle region in the radial direction is set to 13 μm, and the single machining depth h is set to 1.3 μm, so that N=10 staircase regions can be divided, and the staircase regions are arranged in the order of 1 to 10 from highest to lowest.

[0053] Then, a machining layer is drawn and the first staircase machining layer is introduced, and a test piece is mounted, aligned, focused, and technical parameters are set. According to the location of each staircase area, a corresponding machining layer is drawn in AutoCAD, and a laser machining route is drawn using a default alignment. As shown in Figure 5, which is a schematic diagram of a machining layer in one embodiment of the present application, the drawn machining layer is saved in DXF format, and the machining layer corresponding to the first staircase is imported into the Hanz laser machine software. The test piece is mounted on the machining table, and the horizontal and vertical coordinates of the table's X and Y axes are adjusted to (112.249, -30), and the plane height coordinate is set to 262 for focus. The test piece used is cemented carbide, and the technical parameters are set as follows: laser speed 2000 m / s, frequency 60 kHz, power 65%, and automatic rotation angle of the machining table 40 degrees. The laser machine is then started to process.

[0054] Finally, the first staircase processing is completed by rotating M times, and the second to N processing layers are sequentially introduced and repeatedly processed to obtain the final result. The first staircase area within the single waviness is processed, and the first staircase area within the entire cycle is processed by rotating 8 times, and the second to ten processing layers are sequentially introduced and repeatedly processed until completion.

[0055] 6 is a schematic diagram of the actual processing shape of the radial taper angle region in one embodiment of the present application. Using surface topography, the shape measurement was performed from the inner diameter to the outer diameter at the widest point of the cone surface, and it was found that the taper angle of the radial taper angle region was about 1400 μrad, which corresponds to an ideal cone surface.

[0056] The laser processing method for the waviness of mechanical seal end faces presented in the embodiments of this application determines the number of circumferential rotations based on the circumferential periodic structure, and determines the processing depth of one pass according to the maximum height difference formed by the radial taper angle. This divides multiple staircase regions, draws processing layers corresponding to each staircase region of the multiple staircase regions, introduces a processing layer corresponding to the first staircase region of the multiple staircase regions, mounts a test piece, aligns it, adjusts the focus, and sets technical parameters. Then, using a laser device to start processing, after completing the first staircase processing within a single periodic structure, rotates a certain number of circumferential rotations, completes the first staircase processing within the entire period, and sequentially introduces the remaining staircase regions until all staircase processing within the entire period is completed. This achieves high-efficiency work while ensuring stable quality in the laser processing of waviness end faces, thereby reducing the difficulty of mechanical seal operation, improving the precision and pass rate of the processing results, and making it more practical. As a result, the dynamic pressure groove shape machined in the related art does not have continuity in the circumferential direction, and the change in machining depth is uniform, making it difficult to use for machining complex wavy texturing. In addition, the technical process for end face waviness is restricted by external conditions, which solves problems such as the complicated machining process, low pass rate, inability to meet high-precision machining requirements, and insufficient machining accuracy.

[0057] Next, a laser processing device for removing waviness from an end face of a mechanical seal according to an embodiment of the present application will be described with reference to the drawings.

[0058] FIG. 7 is a block schematic diagram of a laser processing device for removing waviness from an end face of a mechanical seal according to an embodiment of the present application.

[0059] As shown in FIG. 7, the laser processing device 10 for processing the waviness of an end face of a mechanical seal includes an acquisition module 100, a division module 200, a drawing module 300, an introduction module 400 and a processing module 500.

[0060] Here, the acquisition module 100 is used to determine the number of rotations in the circumferential direction based on the circumferential periodic structure.

[0061] The division module 200 is used to divide a plurality of step regions by determining the machining depth at one time according to the maximum height difference formed by the taper angle in the radial direction.

[0062] The drawing module 300 is used to draw a processing layer corresponding to each stair region of the plurality of stair regions.

[0063] The introduction module 400 is used to introduce a processing layer corresponding to a first staircase area of ​​the plurality of staircase areas, mount a test piece, align, focus, and set technical parameters, and then start processing using a laser device.

[0064] After the processing module 500 completes the first step processing within a single periodic structure, it rotates a number of times in the circumferential direction, and then completes the first step processing within the entire period, and is used to sequentially introduce the remaining step areas until all step processing within the entire period is completed.

[0065] Optionally, in one embodiment of the present application, the processing layer includes laser processing routes to form circumferentially arranged undulations.

[0066] Optionally, in one embodiment of the present application, the number of rotations in the circumferential direction is in the interval [0, 50].

[0067] Optionally, in one embodiment of the present application, the range of values ​​for the single processing depth is 0-50 μm, and the range of values ​​for the number of step regions is 1-100.

[0068] Optionally, in one embodiment of the present application, the drawing module 300 includes a determination unit.

[0069] Here, the determining unit is used to determine the contour of the processing layer according to the edge geometric structure corresponding to each step region.

[0070] The explanations and interpretations of the embodiment of the laser processing method for removing undulations from the end face of a mechanical seal described above also apply to the laser processing device for removing undulations from the end face of a mechanical seal of the embodiment, and will be omitted here.

[0071] The laser processing device for mechanical seal end waviness provided in the embodiments of this application determines the number of circumferential rotations based on the circumferential periodic structure, and determines the processing depth for one run according to the maximum height difference formed by the radial taper angle. This divides multiple staircase regions, draws processing layers corresponding to each staircase region in the multiple staircase regions, introduces a processing layer corresponding to the first staircase region of the multiple staircase regions, mounts a test piece, aligns, focuses, and sets technical parameters. Then, using the laser device to start processing, after completing the first staircase within a single periodic structure, rotates a certain number of circumferential rotations, completes the first staircase within the entire period, and sequentially introduces the remaining staircase regions until all staircases within the entire period are completed. This achieves high-efficiency work while ensuring stable quality in laser processing of end waviness, reduces the difficulty of mechanical seal operation, improves the precision and pass rate of processing results, and is more practical. As a result, the dynamic pressure groove shape machined in the related art does not have continuity in the circumferential direction, and the change in machining depth is uniform, making it difficult to use for machining complex wavy texturing. In addition, the technical process for end face waviness is restricted by external conditions, which solves problems such as the complicated machining process, low pass rate, inability to meet high-precision machining requirements, and insufficient machining accuracy.

[0072] 8 is a structural schematic diagram of an electronic device provided in an embodiment of the present application, the electronic device comprising: It may include a memory 801 , a processor 802 and a computer program stored in the memory 801 and executable by the processor 802 . When the processor 802 executes the program, the laser processing method for the undulations on the end face of the mechanical seal provided in the above embodiment is realized. Furthermore, electronic devices a communication interface 803 used for communication between the memory 801 and the processor 802; It further includes a memory 801 used to store computer programs executable by the processor 802. The memory 801 may include a high-speed RAM memory and may further include a non-volatile memory, for example at least one magnetic storage.

[0073] When the memory 801, processor 802, and communication interface 803 are implemented independently, the communication interface 803, memory 801, and processor 802 are connected to each other by a bus to complete communication between them. The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus. The bus may be divided into an address bus, a data bus, a control bus, and the like. For ease of illustration, only one bold line is shown in FIG. 8, but this does not represent only one bus or one type of bus.

[0074] Optionally, in a specific implementation, when the memory 801, the processor 802 and the communication interface 803 are integrated into a single chip, the memory 801, the processor 802 and the communication interface 803 can complete communication between each other through an internal interface.

[0075] The processor 802 may be a Central Processing Unit (CPU), or an Application Specific Integrated Circuit (ASIC), or one or more integrated circuits arranged to implement embodiments of the present application.

[0076] This embodiment further provides a computer-readable storage medium for storing a computer program, which, when executed by a processor, realizes the above-mentioned method for laser processing an end face undulation of a mechanical seal.

[0077] In the description herein, reference to the reference terms "one embodiment," "some embodiments," "example," "specific example," or "some examples" means that the specific feature, structure, material, or characteristic described in the relevant embodiment or example is included in at least one embodiment or example of the present application. The exemplary use of the above terms in the description herein does not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, if not mutually inconsistent, a person skilled in the art may combine different embodiments or examples and features of different embodiments or examples described herein.

[0078] Additionally, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or to specify the number of technical features being indicated. Thus, a feature qualified as "first" or "second" may indicate or imply the inclusion of at least one of that feature. In the description herein, unless otherwise clearly and specifically limited, "N" means at least two, e.g., two, three, etc.

[0079] Any process or method illustrated in a flowchart or otherwise herein can be understood to represent including modules, segments, or portions of executable code that implement instructions used to implement one or more customized logic functions or processes, and the scope of the preferred implementation of the present application includes other implementations, where functions are performed in the order shown or discussed herein, and in essentially simultaneous or reverse order depending on the function involved, as would be understood by one skilled in the art of the embodiments of the present application.

[0080] The logic and / or steps depicted in flowcharts or otherwise described herein may be viewed, for example, as an executable sequential listing of instructions for implementing logical functions, and may be tangibly embodied in any computer-readable medium for use with an instruction-executing system, apparatus, or device (including, for example, a computer-based system, a processor-based system, or a system that retrieves and executes instructions from other instruction-executing systems, apparatus, or devices), or for use in conjunction with such instruction-executing systems, apparatus, or devices. For purposes of this specification, a "computer-readable medium" may include any program capable of containing, storing, communicating, propagating, or transmitting an instruction-executing system, apparatus, or device, or an apparatus for use in conjunction with such an instruction-executing system, apparatus, or device. More specific examples (non-exhaustive list) of computer-readable media include electrical connections having one or N wires (electronic devices), portable computer disk enclosures (magnetic devices), random access memory (RAM), read-only memory (ROM), programmable-erasable read-only memory (EPROM or flash memory), fiber optic devices, and portable CD-ROMs (CD-ROMs). It may also be a computer readable medium, such as paper or other suitable medium onto which the program may be printed, since the program may be obtained in electronic form, for example by optically scanning the paper or other medium and editing, interpreting or otherwise processing as needed in an appropriate manner, and then stored in computer memory.

[0081] It should be noted that each part of the present application may be implemented in hardware, software, firmware, or a combination thereof. In the above-described implementation, the N steps or methods may be implemented in software or firmware stored in a memory and executed by an appropriate instruction execution system. For example, when implemented in hardware, as with other implementations, the N steps or methods may be implemented in any one or combination of discrete logic circuits having logic circuits for implementing logic functions on data signals, application specific integrated circuits having appropriate combinational logic circuits, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc., as are known in the art.

[0082] Those skilled in the art can understand that all or part of the steps of the methods of the above embodiments can be realized by instructing relevant hardware using a program, which can be stored in a computer-readable storage medium, and when the program is executed, it will include one or a combination of the steps of the method embodiments.

[0083] Furthermore, each functional unit in each embodiment of the present application may be integrated into one processing module, each unit may exist physically independently, or two or more units may be integrated into one module. The integrated module may be realized in the form of hardware or in the form of a software functional module. The integrated module may be realized in the form of a software functional module and stored in a computer-readable storage medium when sold or used as an independent product.

[0084] The above-mentioned storage medium may be a read-only memory, a magnetic disk, or a disk. It should be noted that the above has already shown and described the embodiments of the present application, and the above embodiments are merely illustrative and should not be construed as limitations on the present application. Those skilled in the art may make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A laser processing method for waviness on an end face of a mechanical seal, comprising: determining the number of rotations in the circumferential direction based on the periodic structure in the circumferential direction; Dividing the plurality of step regions by determining a single machining depth according to a maximum height difference formed by a taper angle in a radial direction; drawing a processing layer corresponding to each staircase region of the plurality of staircase regions; introducing a processing layer corresponding to a first staircase region of the plurality of staircase regions, and starting processing using a laser device by mounting, aligning, focusing, and setting technological parameters on a test piece; a step of completing the first staircase machining within the single periodic structure, rotating the number of times in the circumferential direction, and then completing the first staircase machining within the entire period, and sequentially introducing the remaining staircase regions until all staircase machining within the entire period is completed.

2. The method of claim 1 , wherein the processing layer includes laser processing routes to form circumferentially arranged undulations.

3. The method according to claim 1, wherein the number of revolutions in the circumferential direction is in the interval [0, 50].

4. 2. The method according to claim 1, wherein the processing depth for one time is in the range of 0 to 50 μm, and the number of step regions is in the range of 1 to 100.

5. The step of drawing a processing layer corresponding to each of the plurality of staircase regions includes:

2. The method of claim 1, further comprising the step of defining a contour of the corresponding processing layer according to an end face geometry corresponding to each of the staircase regions.

6. A laser processing device for mechanical seal end surface waviness, an acquisition module used for determining the number of rotations in the circumferential direction according to the circumferential periodic structure; A division module is used to divide a plurality of step regions by determining a single machining depth according to the maximum height difference formed by the taper angle in the radial direction; a drawing module used to draw a processing layer corresponding to each staircase region of the plurality of staircase regions; an introduction module, which is used for introducing a processing layer corresponding to a first staircase region of the plurality of staircase regions, and starting processing using a laser device by mounting a test piece, aligning, focusing, and setting technical parameters; a processing module used to complete the first staircase processing within the entire period after rotating the number of times in the circumferential direction after completing the first staircase processing within the single periodic structure, and to sequentially introduce the remaining staircase areas until all staircase processing within the entire period is completed.

7. The apparatus of claim 6, wherein the processing layer includes laser processing routes to form circumferentially arranged undulations.

8. The apparatus according to claim 6, characterized in that the number of revolutions in the circumferential direction is in the interval [0, 50].

9. 7. The apparatus according to claim 6, wherein the range of values ​​of the single processing depth is 0 to 50 μm, and the range of values ​​of the number of step regions is 1 to 100.

10. The drawing module: The apparatus according to claim 6 , further comprising: a determining unit used for determining the contour of the corresponding processing layer according to the end face geometric structure corresponding to each of the step regions.

11. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable by the processor, wherein the processor executes the program to realize the method for laser processing a mechanical seal end face waviness according to any one of claims 1 to 5.

12. A computer-readable storage medium having a computer program stored therein, the computer-readable storage medium being characterized in that the program, when executed by a processor, realizes the method for laser processing of waviness on an end face of a mechanical seal according to any one of claims 1 to 5.

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