Bending jig for EBSD measurement and EBSD measurement method

Abstract

To provide a flexure jig for EBSD measurement and EBSD measurement method that enables fixed point observation of flexure behavior of a metal plate or a laminate of metal plate and resin base material.SOLUTION: A flexure jig for EBSD measurement is a flexure jig for EBSD measurement in the flexure behavior of a metal plate or a laminate of a metal plate and a resin base material, and is configured to enable gradual measurement of 180-degree flexure behavior or W flexure behavior of the metal plate or the laminate.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a bending jig for EBSD measurement and an EBSD measurement method. [Background technology]

[0002] Conventionally, a bending test has been carried out using a metal plate or a laminate of a metal plate and a resin substrate as a sample to evaluate the adhesion between the metal plate and the resin and the state of cracks in the resin and the metal plate.

[0003] For example, known bending test methods using copper foil or copper-clad laminates as samples include the Japan Copper and Brass Association Technical Standard (JCBA) T307:2007 "Method for evaluating bending workability of copper and copper alloy thin sheet strips" and "JIS Z 2248 Bending test method."

[0004] Furthermore, Patent Document 1 discloses a bending test method using a test jig that includes a primary jig that fixes both sides of the test piece to be tested, an upper jig with loading parts that apply loads to two locations on the top surface and two locations on the bottom surface of the primary jig, and a lower jig with loading parts that apply loads to two locations on the top surface and two locations on the bottom surface of the primary jig. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2018-112499 Summary of the Invention [Problem to be solved by the invention]

[0006] In bending tests of copper foil and copper-clad laminates using conventional bending jigs, the condition of the bent part that occurs after bending the sample to the desired angle (adhesion between the copper foil and resin, crack status in the resin and copper foil) is evaluated.

[0007] However, conventional bending tests of copper foils and copper-clad laminates using bending jigs did not focus on the bending behavior of copper foils and copper-clad laminates (adhesion between the copper foil and resin, crack conditions in the resin and copper foil, and changes in the crystal orientation of the copper foil due to bending), and it was not possible to observe such bending behavior at a fixed point.

[0008] Therefore, an object of an embodiment of the present invention is to provide a bending jig for electron backscatter diffraction (EBSD) measurement and an EBSD measurement method that enable fixed-point observation of the bending behavior of a metal plate or a laminate of a metal plate and a resin substrate. [Means for solving the problem]

[0009] The above problems are solved by the present invention, which is specified as follows. (1) A bending jig for EBSD measurement of the bending behavior of a metal plate or a laminate of a metal plate and a resin substrate, The EBSD measurement bending jig is configured to be able to measure the 180-degree bending behavior or W-bending behavior of the metal plate or the laminate in stages. (2) a pair of 180-degree bending dies or a pair of W-bending dies; A base that supports the pair of 180-degree bending dies or the pair of W-bending dies and has a screw receiver; An opening and closing screw inserted into a screw socket of the base; a knob attached to the open / close screw; The bending jig for EBSD measurement according to (1) is provided with: (3) The pair of 180-degree bending dies or the pair of W-bending dies each have a screw hole into which the open-close screw is fitted, The EBSD measurement bending jig described in (2) is configured so that the pair of 180-degree bending dies or the pair of W-bending dies can be moved relative to each other and opened and closed by turning the knob and rotating the opening and closing screw inserted into the screw receiver of the base. (4) The bending jig for EBSD measurement according to any one of (1) to (3), which has a size that can be placed on the measurement stage of an SEM device. (5) The bending jig for EBSD measurement according to any one of (1) to (4), wherein the thickness of the metal plate or the metal plate in the laminate is 0.1 mm or less. (6) The bending jig for EBSD measurement according to any one of (1) to (5), wherein the metal plate or the metal plate in the laminate is a copper plate or a copper alloy plate. (7) Using a bending jig for EBSD measurement, a metal plate or a laminate of a metal plate and a resin substrate is bent 180 degrees or W-bent. An EBSD measurement method for stepwise fixed-point observation of the 180-degree bending behavior or W-bending behavior of the metal plate or the laminate. (8) The bending jig for EBSD measurement is the bending jig for EBSD measurement described in any one of (1) to (6), The EBSD measurement method according to (7), wherein the pair of 180-degree bending dies or the pair of W-bending dies are gradually narrowed by turning the knob to rotate the open / close screw inserted into the screw receptacle of the base, and the bending behavior of the metal plate or the laminate is gradually observed at a fixed point. [Effects of the Invention]

[0010] According to the embodiments of the present invention, it is possible to provide a bending jig for EBSD measurement and an EBSD measurement method that are capable of fixed-point observation of the bending behavior of a metal plate or a laminate of a metal plate and a resin substrate. [Brief explanation of the drawings]

[0011] [Figure 1] 1A to 1C are photographs showing the appearance of a W-bending jig and a 180-degree bending jig in an EBSD measurement bending jig according to an embodiment of the present invention. [Figure 2] Photographs showing the appearance of each component of a W-bending jig and a 180-degree bending jig. [Figure 3] 10 is an external observation photograph showing how a sample 20a is bent 180 degrees by a 180-degree bending jig according to an embodiment of the present invention. [Figure 4] This is an appearance observation photo showing the state of W bending of sample 20b by the W bending jig according to an embodiment of the present invention. [Figure 5] It is the SEM observation result in Example 1. [Figure 6] It is the SEM observation result and EBSD measurement result in Example 2.

Mode for Carrying Out the Invention

[0012] Next, the mode for carrying out the present invention will be described in detail with reference to the drawings. It should be understood that the present invention is not limited to the following embodiments, and design changes, improvements, etc. can be appropriately made based on the ordinary knowledge of those skilled in the art without departing from the gist of the present invention.

[0013] <Bending jig for EBSD measurement> The bending test object in the bending jig for EBSD measurement according to an embodiment of the present invention is a metal plate or a laminate of a metal plate and a resin base material. Examples of the material constituting the metal plate include copper, aluminum, iron, etc., or their alloys. The laminate is a laminate of the metal plate and a resin substrate such as a polyimide substrate. For example, when the metal plate is a copper foil or a copper alloy foil (copper plate or copper alloy plate), the laminate to be measured can be a copper-clad laminate (CCL: Copper Clad Laminate).

[0014] The thickness of the metal plate or metal plate in the laminate to be bent using the 180-degree bending jig is not particularly limited, but may be 0.2 mm or less, or 0.1 mm or less. The height (width) and length of the metal plate or metal plate in the laminate to be bent using the 180-degree bending jig are also not particularly limited, but may be 8 mm or less in height and 32 mm or less in length. The thickness of the metal plate or metal plate in the laminate to be bent using the W-bending jig is also not particularly limited, but may be 0.2 mm or less, or 0.1 mm or less. The height (width) and length of the metal plate or metal plate in the laminate to be bent using the W-bending jig are also not particularly limited, but may be 11 mm or less in height and 20 mm or less in length. The thickness, width, and length of the metal plate or metal plate in the laminate to be bent using the 180-degree bending jig and W-bending jig can be adjusted appropriately to match the size of the bending jig for EBSD measurement.

[0015] Fig. 1 shows external observation photographs of a W-bending jig and a 180-degree bending jig in an EBSD measurement bending jig according to an embodiment of the present invention. Fig. 2 shows external observation photographs of each component of the W-bending jig and the 180-degree bending jig.

[0016] (Configuration of 180 degree bending jig) The 180-degree bending jig according to the embodiment of the present invention is a bending jig for EBSD measurement of the bending behavior of a metal plate or a laminate of a metal plate and a resin base material (hereinafter also referred to as sample 20a).

[0017] The 180-degree bending jig includes a pair of 180-degree bending dies 10a, a base 12a that supports the pair of 180-degree bending dies 10a and has a screw receptacle 11a, an open / close screw 13a that is inserted into the screw receptacle 11a of the base 12a, and a knob 14a that is attached to the open / close screw 13a.

[0018] The pair of 180-degree bending dies 10a each have a screw hole 15a into which an open-close screw 13a fits, and by turning a knob 14a to rotate the open-close screw 13a inserted into a screw receiver 11a of a base 12a, the pair of 180-degree bending dies 10a can move relatively to each other to open and close (the distance between the pair of 180-degree bending dies 10a can be narrowed and widened). The pair of 180-degree bending dies 10a have smooth, flat surfaces (the surfaces that hold down the sample 20a), and as shown in Figure 3 described below, the sample 20a can be bent and inserted between the pair of 180-degree bending dies 10a, and the distance between the pair of 180-degree bending dies 10a can be narrowed further, thereby bending the sample 20a 180 degrees.

[0019] The 180-degree bending jig according to the embodiment of the present invention is configured to measure the 180-degree bending behavior of the sample 20a in a stepwise manner. More specifically, a distance (movement width) between the pair of 180-degree bending dies 10a is initially set. With the sample 20a placed between the pair of 180-degree bending dies 10a, the knob 14a is turned by a predetermined amount to rotate the open-close screw 13a inserted into the screw receptacle 11a of the base 12a, thereby gradually narrowing the distance (movement width) between the pair of 180-degree bending dies 10a. This allows the sample 20a to be bent 180 degrees in a stepwise manner. This allows for fixed-point observation of the bending behavior (e.g., adhesion between the copper foil and resin, cracking conditions in the resin and copper foil, and changes in the crystal orientation of the copper foil due to bending) of the sample 20a, such as copper foil or copper-clad laminate, at each desired bending degree.

[0020] One possible jig for bending a metal plate or laminate involves placing a pair of dies, each with a smooth, flat holding surface, with a predetermined gap between them. The metal plate or laminate to be bent is then pushed into the gap from the outside using a needle-like protrusion or similar object, thereby bending the metal plate or laminate pushed into the gap. However, with such a jig, the metal plate or laminate is bent only by pushing the metal plate or laminate into the gap between the pair of dies from one direction using the needle-like protrusion, so no bending force is applied from the side opposite the protrusion on the metal plate or laminate at the center of bending. Therefore, it is difficult to bend the metal plate or laminate to a small radius of curvature of 1.3 mm or less, and the practical limit is about 120 degrees. In contrast, the 180-degree bending jig according to an embodiment of the present invention bends a metal plate or laminate, inserts it between the opposing surfaces (the surfaces that hold down the metal plate or laminate) of a pair of 180-degree bending dies 10a, and then narrows the gap between the pair of 180-degree bending dies 10a to bend the metal plate or laminate 180 degrees. As such, the 180-degree bending jig according to an embodiment of the present invention has a structure that sandwiches the metal plate or laminate from both sides of the bending center, making it easy to bend the metal plate or laminate to a small radius of curvature of 1.3 mm or less, and making it possible to bend the metal plate or laminate substantially 180 degrees.

[0021] The bending behavior of the sample 20a bent by the 180-degree bending jig according to the embodiment of the present invention is observed by a separately provided scanning electron microscope (SEM), so the 180-degree bending jig preferably has a size that can be placed on the measurement stage of the SEM. The size can be, for example, maximum width × maximum length × maximum height = 20 mm × 30 mm × 20 mm.

[0022] The total mass of the 180-degree bending jig according to the embodiment of the present invention is not particularly limited, but is preferably 150 g or less. EBSD measurement is performed by tilting the measurement stage together with the sample, for example, by 70 degrees from the horizontal. If the total mass of the 180-degree bending jig is light, it is possible to prevent the jig from slipping off the measurement stage during EBSD measurement. The total mass of the 180-degree bending jig can be, for example, 105 g.

[0023] The shape and size of the pair of 180-degree bending dies 10a, base 12a with screw receiver 11a, open / close screw 13a, and knob 14a that make up the 180-degree bending jig are not particularly limited, and can be designed as appropriate as long as they have the above-mentioned functions. The materials used for these components are also not particularly limited, and they can be made from copper, aluminum, iron, stainless steel, or other materials that are used to make bending jigs conventionally used in bending tests of copper foils, copper-clad laminates, and the like.

[0024] (Configuration of W bending jig) The W-bending jig according to the embodiment of the present invention is a bending jig for EBSD measurement of the bending behavior of a metal plate or a laminate of a metal plate and a resin base material (hereinafter also referred to as sample 20b).

[0025] The W-bending jig comprises a pair of W-bending dies 10b, a base 12b that supports the pair of W-bending dies 10b and has a screw receptacle 11b, an open / close screw 13b inserted into the screw receptacle 11b of the base 12b, and a knob 14b attached to the open / close screw 13b.

[0026] Each of the pair of W-bending dies 10b has a threaded hole 15b that fits a corresponding one of the two screws 13b. By turning the knob 14b to rotate the screw 13b inserted into the screw receptacle 11b of the base 12b, the pair of W-bending dies 10b can be moved relative to each other to open and close (the distance between the pair of W-bending dies 10b can be narrowed and widened). The pair of W-bending dies 10b each have a concave-convex shape on their opposing surfaces (the surfaces that hold down the sample 20b). When the convex-concave shapes engage, the cross section of the contact area forms the letter W. Therefore, as shown in FIG. 4 (described later), the sample 20b can be placed between the pair of W-bending dies 10b and the distance between the pair of W-bending dies 10b can be narrowed to bend the sample 20b into a W shape.

[0027] The W-bending jig according to the embodiment of the present invention is configured to measure the W-bending behavior of the sample 20b in stages. More specifically, the pair of W-bending dies 10b is initially spaced apart (moving width). With the sample 20b placed between the pair of W-bending dies 10b, the knob 14b is turned by a predetermined amount to rotate the open-close screw 13b inserted into the screw receptacle 11b of the base 12b, thereby gradually narrowing the distance (moving width) between the pair of W-bending dies 10b. This allows the sample 20b to be W-bent in stages. This allows for fixed-point observation of the bending behavior (adhesion between the copper foil and resin, cracking conditions in the resin and copper foil, changes in the crystal orientation of the copper foil due to bending, etc.) of the sample 20b, such as copper foil or copper-clad laminate, at each desired bending degree.

[0028] As described above, when bending a metal plate or a laminated plate from only one direction using needle-like protrusions or the like, it is difficult to bend the metal plate or the laminated plate until it has a small radius of curvature of 1.3 mm or less. On the other hand, in the W-bending jig according to the embodiment of the present invention, the surfaces (the pressing surfaces of the sample 20b) of the pair of W-bending dies 10b facing each other each have irregularities, and when the irregularities of each other mesh, the cross section of the contact portion is formed so as to form the letter W of the alphabet. Therefore, it has a structure in which a metal plate or a laminated plate is sandwiched from both sides of each bending center of the W-bending. Therefore, it becomes possible to bend the metal plate or the laminated plate into a W-shape until it has a small radius of curvature of 1.3 mm or less at each bending center.

[0029] Since the bending behavior of the sample 20b bent by the W-bending jig according to the embodiment of the present invention is observed by a separately provided SEM device, the W-bending jig preferably has a size that can be installed on the measurement stage of the SEM device. The size can be, for example, maximum width × maximum length × maximum height = 20 mm × 30 mm × 20 mm.

[0030] The total mass of the W-bending jig according to the embodiment of the present invention is not particularly limited, but is preferably 150 g or less. As described above, since the EBSD measurement is performed by tilting the measurement stage, if the total mass of the W-bending jig is light, it is possible to suppress the deviation and fall from the measurement stage during the EBSD measurement. The total mass of the W-bending jig can be, for example, 117 g.

[0031] The shapes and sizes of the pair of W-bending dies 10b, the base 12b having the screw receiver 11b, the opening and closing screw 13b, and the knob 14b that constitute the W-bending jig are not particularly limited, and can be appropriately designed as long as they have the above-described functions. Also, their materials are not particularly limited, and can be formed of materials that conventionally form bending jigs used in bending tests, such as copper, aluminum, iron, stainless steel, etc., copper foil, copper-clad laminated plates, etc.

[0032] <EBSD Measurement Method> (EBSD Measurement Method Using a 180-Degree Bending Jig) FIG. 3 is an external observation photograph showing the state of 180-degree bending of sample 20a using a 180-degree bending jig according to an embodiment of the present invention. As shown in FIG. 3, first, a gap (movement width) is left between a pair of 180-degree bending dies 10a of the 180-degree bending jig, and sample 20a is placed between the pair of 180-degree bending dies 10a. Next, knob 14a of the 180-degree bending jig is turned in a predetermined direction to rotate open / close screw 13a inserted into screw receptacle 11a of base 12a. This gradually narrows the gap (movement width) between the pair of 180-degree bending dies 10a. As the pair of 180-degree bending dies 10a move relatively and close (the gap narrows), sample 20a placed between the pair of 180-degree bending dies 10a is sandwiched from both sides of the bending center and gradually bent to 180 degrees. In this way, the distance (movement width) between the pair of 180-degree bending dies 10a is narrowed stepwise, and each time, SEM observation and EBSD measurement (hereinafter simply referred to as EBSD measurement) of the sample 20a is performed.

[0033] Specifically, first, a 180-degree bending jig is fixed to the measurement stage of the SEM device using hot wax or the like. The 180-degree bending jig is left fixed to the measurement stage of the SEM device without being removed from the measurement stage until fixed-point observation of the bending behavior of the sample 20a is completed. Next, the sample 20a is placed between a pair of 180-degree bending dies 10a.

[0034] Next, the knob 14a is inserted into the open-close screw 13a, and the knob 14a is turned in a predetermined direction to rotate the open-close screw 13a. As the open-close screw 13a rotates, the distance (movement width) between the pair of 180-degree bending dies 10a narrows, and the sample 20a is bent by being pressed. After the sample 20a has been bent by being pressed, the knob 14a is removed from the open-close screw 13a. Then, in this state, the first EBSD measurement of the sample 20a is performed.

[0035] After the first EBSD measurement is completed, the knob 14a is inserted into the open-close screw 13a again, and the knob 14a is turned in the specified direction to further bend the sample 20a. After bending the sample 20a, the knob 14a is removed from the open-close screw 13a. Then, a second EBSD measurement is performed on the sample 20a. This EBSD measurement on the sample 20a is performed on the same location as the first EBSD measurement.

[0036] The above-described bending and EBSD measurement of the sample 20a are repeated while bending the sample 20a stepwise until the bending angle reaches approximately 180 degrees, and the bending behavior of the sample 20a is observed at fixed points.

[0037] The operation of turning the knob 14a of the 180-degree bending jig in a predetermined direction and rotating the opening / closing screw 13a inserted into the screw receiver 11a of the base 12a may be performed manually or automatically by a device or the like.

[0038] (EBSD measurement method using a W-bend jig) FIG. 4 is an external observation photograph showing the W-bending of sample 20b using a W-bending jig according to an embodiment of the present invention. As shown in FIG. 4, first, a gap (movement width) between a pair of W-bending dies 10b of the W-bending jig is left, and sample 20b is placed between the pair of W-bending dies 10b. Next, knob 14b of the W-bending jig is turned in a predetermined direction to rotate open-close screw 13b inserted into screw receptacle 11b of base 12b. This gradually narrows the gap (movement width) between the pair of W-bending dies 10b. As the W-bending dies 10b move relative to each other and close (the gap narrows), sample 20b placed between the pair of W-bending dies 10b is gradually pressed and bent into a W-shape along the shape of the pair of W-bending dies 10b. In this way, EBSD measurement of sample 20b is performed each time the gap (movement width) between the pair of W-bending dies 10b is gradually narrowed.

[0039] Specifically, similar to the case of the 180-degree bending jig described above, a W-bending jig is fixed to the measurement stage of the SEM apparatus with hot wax or the like, and the sample 20b is placed between a pair of W-bending dies 10b. After that, bending of the sample 20b and EBSD measurement are repeated while stepwise bending the sample 20b, and fixed-point observation of the bending behavior of the sample 20b is performed. The W-bending jig is not removed from the measurement stage of the SEM apparatus and remains fixed to the measurement stage until fixed-point observation of the bending behavior of the sample 20b is completed.

[0040] The operation of turning the knob 14b of the W-bending jig in a predetermined direction to rotate the open / close screw 13b inserted into the screw receiver 11b of the base 12b may be performed manually or automatically by a device or the like.

[0041] Conventionally, when attempting to measure bending behavior stepwise, it was necessary to bend the sample with a jig and then remove the sample from the jig each time EBSD measurement was performed. In such cases, because the EBSD measurement range is on the order of microns, it is difficult to identify the location where the previous EBSD measurement was performed, making it difficult to observe the same location. In contrast, according to the EBSD measurement method using the 180-degree bending jig or W-bending jig according to the above-described embodiment of the present invention, it is not necessary to remove the sample from the jig each time EBSD measurement is performed. Instead, sample bending and EBSD measurement can be repeated while the jig is fixed to the measurement stage of the SEM device. This makes it easy to identify the location where the previous EBSD measurement was performed.

[0042] Furthermore, when observing bending behavior, it is necessary to perform bending again with the same location as the previous bending center, but once the sample is removed from the jig, it is difficult to attach the sample to the jig in exactly the same position as the previous time. In contrast, with the EBSD measurement method using the 180-degree bending jig or W-bending jig according to the above-mentioned embodiment of the present invention, it is not necessary to remove the sample from the jig for each EBSD measurement, so it is possible to perform continuous bending with the same location as the bending center.

[0043] Furthermore, if the sample is removed from the jig after each EBSD measurement, the sample will be elastically deformed when removed from the jig, making it impossible to maintain the bent state and making it impossible to perform fixed-point observation of the sample stepwise at each predetermined bending angle. In contrast, according to the EBSD measurement method using the 180-degree bending jig or W-bending jig of the above-described embodiment of the present invention, it is not necessary to remove the sample from the jig after each EBSD measurement, and therefore the bent state can be maintained.

[0044] As described above, the EBSD measurement method using the 180-degree bending jig or W-bending jig according to the embodiment of the present invention makes it possible to perform fixed-point observation of the bending behavior (adhesion between the copper foil and resin, crack conditions in the resin and copper foil, changes in the crystal orientation of the copper foil due to bending, etc.) when bending a sample such as a copper foil or a copper-clad laminate. [Example]

[0045] Examples of the present invention are given below, but these examples are provided for a better understanding of the present invention and its advantages, and are not intended to limit the invention.

[0046] <Example 1: EBSD measurement method using a 180-degree bending jig> First, a sample of flexible copper clad laminate (FCCL) to be measured was prepared. The copper clad laminate was a laminate of a copper foil with a thickness of 12.5 μm and a polyimide substrate with a thickness of 20 μm. Next, a 180-degree bending jig having the configuration shown in Figures 1 and 2 was prepared, a pair of 180-degree bending dies of the 180-degree bending jig was spaced apart, the sample was placed between the pair of 180-degree bending dies, and fixed on the measurement stage of the SEM device with hot wax. The 180-degree bending jig was left fixed on the measurement stage of the SEM device without being removed from the measurement stage until fixed-point observation of the bending behavior of the sample was completed. Next, the sample was placed between a pair of 180-degree bending dies. Next, the knob of the 180-degree bending jig was inserted into the open-close screw, and the knob was turned in the specified direction to rotate the open-close screw. As the open-close screw rotated, the distance (travel width) between the pair of 180-degree bending dies narrowed to 0.89 mm, and the sample was bent. After bending the sample, the knob was removed from the open-close screw. Then, in this state, the first SEM observation and EBSD measurement (hereinafter simply referred to as EBSD measurement) of the sample was performed.

[0047] After the first EBSD measurement, the knob was inserted into the opening and closing screw again, and by turning the knob in the specified direction, the distance (travel width) between the pair of 180-degree bending dies was narrowed to 0.55 mm, and the sample was further bent. After bending the sample, the knob was removed from the opening and closing screw. A second EBSD measurement was then performed on the sample. This EBSD measurement was performed on the same location as the first EBSD measurement.

[0048] After the second EBSD measurement, the 180-degree bending jig was operated using the same procedure as the second time, and the sample was further bent until the distance (travel width) between the pair of 180-degree bending dies was 0.29 mm, and EBSD measurement of the sample was performed using the same procedure as the second time.

[0049] The EBSD measurements confirmed that the crystal orientation of the copper foil in the sample gradually shifted, allowing for fixed-point observation of the bending behavior of the copper-clad laminate.

[0050] The results of SEM observation are shown in Figure 5. As shown in Figure 5, in Example 1, the copper-clad laminate was sandwiched from both sides of the bending center, and therefore the copper-clad laminate could be bent to a curvature radius of 1.3 mm or less.

[0051] <Example 2: EBSD measurement method using a W-bending jig> First, a copper foil with a thickness of 100 μm was prepared as a measurement object. Next, a W-bending jig having the configuration shown in Figures 1 and 2 was prepared, a pair of W-bending dies of the W-bending jig was spaced apart, a sample was placed between the pair of W-bending dies, and fixed on the measurement stage of the SEM device with hot wax. The W-bending jig was left fixed on the measurement stage of the SEM device without being removed from the measurement stage until fixed-point observation of the bending behavior of the sample was completed. Next, the sample was placed between a pair of W-bending dies. Next, the knob of the W-bending jig was inserted into the open-close screw, and the knob was turned in the specified direction to rotate the open-close screw. As the open-close screw rotated, the distance (travel width) between the pair of W-bending dies narrowed, and the sample was bent until the bending angle of the sample was 20 degrees. After bending the sample, the knob was removed from the open-close screw. Then, in this state, the first EBSD measurement of the sample was performed.

[0052] After the first EBSD measurement, the knob was inserted into the opening and closing screw again, and the knob was turned in the specified direction to narrow the distance (travel width) between the pair of W-bending dies, further bending the sample until the bending angle of the sample reached 50 degrees. After bending the sample, the knob was removed from the opening and closing screw. A second EBSD measurement was then performed on the sample. This EBSD measurement was performed on the same location as the first EBSD measurement.

[0053] After the second EBSD measurement, the W-bending jig was operated using the same procedure as the second time, and the sample was further bent until the bending angle of the sample reached 105 degrees, and EBSD measurement of the sample was performed using the same procedure as the second time.

[0054] The results of SEM observation and EBSD measurement are shown in Figure 6. Figure 6 shows that the residual strain in the copper foil sample increases on both the inside and outside as the bending angle increases. In this way, we were able to observe the bending behavior of the copper foil at fixed points. Furthermore, the copper foil was bent until the radius of curvature R was 0.05 mm. In Example 2, because the W-bend structure sandwiched the foil from both sides of the bending center, the copper foil could be bent until the radius of curvature was 1.3 mm or less.

[0055] In Examples 1 and 2, the SEM observation and EBSD analysis were carried out using the following devices. SEM observation: Quanta FEG 650 manufactured by Japan Effi-I Co., Ltd. EBSD analysis: TSL Solutions OIM Analysis 8 [Explanation of symbols]

[0056] 10a 180 degree bending die 10b W bending die 11a, 11b screw holder 12a, 12b base 13a, 13b Opening and closing screws 14a, 14b knobs 15a, 15b screw holes 20a, 20b samples

Claims

1. A bending jig for measuring EBSD in bending behavior of a metal plate or a laminate of a metal plate and a resin substrate, The 180-degree bending behavior or W-bending behavior of the metal plate or the laminated plate is configured to be measurable in stages, a pair of 180-degree bending dies or a pair of W-bending dies; A base that supports the pair of 180-degree bending dies or the pair of W-bending dies and has a screw receiver; An opening and closing screw inserted into a screw socket of the base; a knob attached to the open / close screw; Equipped with The pair of 180-degree bending dies or the pair of W-bending dies each have a screw hole into which the open-close screw is fitted, The EBSD measurement bending jig is configured so that the pair of 180-degree bending dies or the pair of W-bending dies can be moved relative to each other to open and close by turning the knob and rotating the opening and closing screw inserted into the screw receiver of the base.

2. 2. The bending jig for EBSD measurement according to claim 1, which has a size that can be set on a measurement stage of an SEM device.

3. 2. The bending jig for EBSD measurement according to claim 1, wherein the thickness of the metal plate or the metal plate in the laminate is 0.1 mm or less.

4. 2. The bending jig for EBSD measurement according to claim 1, wherein the metal plate or the metal plate in the laminate is a copper plate or a copper alloy plate.

5. A metal plate or a laminate of a metal plate and a resin substrate is bent 180 degrees or W-bent using a bending jig for EBSD measurement. The 180-degree bending behavior or W-bending behavior of the metal plate or the laminated plate is observed at fixed points in stages, The bending jig for EBSD measurement is the bending jig for EBSD measurement according to any one of claims 1 to 4, By turning the knob and rotating the opening and closing screw inserted into the screw receiver of the base, the pair of 180-degree bending dies or the pair of W-bending dies are gradually narrowed, and the bending behavior of the metal plate or the laminate is gradually observed at fixed points.

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