Tile peeling diagnosis method and tile peeling diagnosis system

Abstract

To shorten an inspection time for tile peeling.SOLUTION: A tile peeling diagnosis method comprises: causing at least one vibration sensor to generate vibration from an excitation electric signal consisting of repeated single pulse waves and apply it to a tile (S20), and causing a plurality of vibration receiving sensors to receive vibration from the tile (S30), and convert it to a vibration receiving electric signal; calculating a voltage amplitude value for each frequency component from the vibration receiving electric signal (S60); identifying a maximum amplitude value among the voltage amplitude values for each frequency component (S70); and diagnosing peeling of the tile based on the correlation between the maximum amplitude value known in advance and the peeling of the tile, and the maximum amplitude value of each of the plurality of vibration receiving sensors (S80 to S170). Consequently, it is possible to diagnose the peeling of the tile instantaneously based on the vibration receiving electric signals obtained from the vibration receiving sensors, so that it is possible to shorten an inspection time for the peeling of the tile.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to tiles that are installed to cover exterior walls, interior walls, floors, etc. of buildings, etc., and relates to a tile peeling diagnosis method and system for diagnosing peeling of tiles that are installed using adhesive materials such as cement mortar or organic adhesive. [Background technology]

[0002] In buildings such as buildings and houses, as well as structures such as sidewalks and approachways, tiles are installed with cement mortar or organic adhesives to protect and decorate the surfaces of walls and floors. Methods for detecting peeling of existing tiles installed on the exterior and interior walls and floors of such buildings include manual tapping diagnosis and the use of an inspection device that generates vibrations. For example, conventional inspection devices that generate vibrations use two vibration sensors, one of which applies vibration to a tile and the other receives it, and the tile peeling is detected based on the vibration propagation. In this case, one of the vibration sensors generates vibrations from an electrical signal of a frequency-shifted sweep wave. Recently, a method for detecting peeling of tiles using an optical fiber sensor has also been proposed (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-17697 Summary of the Invention [Problem to be solved by the invention]

[0004] Conventional vibration-generating inspection devices detect peeling of a portion of a tile located between two vibration sensors. This requires multiple inspections of each tile, changing the position and orientation of the inspection device to match the size and shape of the tile being inspected, which is time-consuming. Furthermore, because vibrations are generated from sweep wave electrical signals, it is preferable to increase the duration of vibration generation to increase the output energy of a specific frequency per unit time, but this also increases the inspection time. Furthermore, manual tapping diagnosis methods also leave room for improvement in terms of accuracy, especially when used with organic adhesives. The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to shorten the time required to inspect for tile peeling. [Means for solving the problem]

[0005] (Aspects of the invention) The following embodiments of the present invention are examples of the configuration of the present invention, and are described in terms to facilitate understanding of the various configurations of the present invention. Each term does not limit the technical scope of the present invention, and while taking into consideration the best mode for carrying out the invention, some of the components of each term may be replaced or deleted, or other components may be added, and these may also be included in the technical scope of the present invention.

[0006] (1) A method for diagnosing peeling of an existing tile using a tile peeling detector in which at least one excitation sensor and a plurality of vibration receiving sensors are fixed to a base with a gap between them, and the at least one excitation sensor and the plurality of vibration receiving sensors are in contact with the tile while the base is arranged approximately parallel to the tile, and the at least one excitation sensor detects vibrations from an excitation electric signal consisting of a single pulse wave, a single random wave, a repetition of a single pulse wave, or a repetition of a single random wave. A tile peeling diagnosis method that generates vibrations and applies them to the tile, receives vibrations from the tile using the plurality of vibration receiving sensors and converts the vibrations into received electrical signals, calculates a voltage amplitude value for each frequency component from the received electrical signals for each of the plurality of vibration receiving sensors, identifies a maximum amplitude value among the voltage amplitude values ​​for each frequency component for each of the plurality of vibration receiving sensors, and diagnoses peeling of the tile based on a previously determined correlation between the maximum amplitude value and peeling of the tile, and the maximum amplitude value for each of the plurality of vibration receiving sensors.

[0007] The tile peeling diagnosis method described in this section utilizes a tile peeling detector to diagnose peeling of tiles attached to a building or the like. The tile peeling detector used includes at least one vibration sensor, multiple vibration receiving sensors, and a base, with the at least one vibration sensor and multiple vibration receiving sensors fixed to the base at intervals. This tile peeling detector is used by arranging the base so that the base is approximately parallel to the tile and pressing it against the tile so that the at least one vibration sensor and multiple vibration receiving sensors are in contact with the tile. In this state, vibration is applied to the tile by the at least one vibration sensor, and the vibration applied to the tile is received via the tile by the multiple vibration receiving sensors. At this time, the vibration applied by the vibration sensor is generated from a vibrating electric signal, and the vibration sensor has a function of generating vibration from the applied vibrating electric signal. The vibrating electric signal applied to the vibration sensor may be a single pulse wave, a single random wave, a repetition of a single pulse wave, or a repetition of a single random wave. Each of the vibration receiving sensors has the function of converting vibrations received from the tile into an electric vibration receiving signal.

[0008] Next, the vibrations applied by the excitation sensor propagate through the tile and are received by the receiving sensors, and converted into received electrical signals are acquired from each of the multiple receiving sensors. The voltage amplitude values ​​for each frequency component are calculated from the received electrical signals. That is, the received electrical signals, which are the measurement results from each receiving sensor, are subjected to preprocessing necessary for calculation, and then subjected to FFT analysis, for example, to extract the voltage amplitude values ​​for each frequency component of each received electrical signal. Next, the maximum amplitude value with the largest voltage value is identified from the voltage amplitude values ​​extracted for each frequency component, and this is performed on the received electrical signals of each receiving sensor. Tile peeling is then diagnosed based on the previously determined correlation between the maximum amplitude value and tile peeling, and the maximum amplitude values ​​for each of the multiple receiving sensors.

[0009] Here, the vibrations applied to the tile from the vibration sensor propagate from the tile to its attached surface in areas where the tile is still attached and not peeled off, so the vibration energy received by the vibration receiving sensor is significantly reduced. In contrast, in areas where the tile has peeled off, the vibrations applied to the tile from the vibration sensor propagate only within the tile without propagating to its attached surface, so the vibration is received with little loss by the vibration receiving sensor. Furthermore, the magnitude of the vibration energy is reflected in the received vibration signal converted from the vibration by the vibration receiving sensor, so the maximum amplitude value obtained from the received vibration signal as described above can be used as an indicator for diagnosing tile peeling.

[0010] Therefore, the tile peeling diagnosis method described in this section involves determining in advance, through testing or the like, the correlation between the maximum amplitude value obtained from the received electrical signal and tile peeling, and then diagnosing tile peeling by applying the maximum amplitude value obtained for the tile to be diagnosed to that correlation. This allows for instantaneous diagnosis of tile peeling based on the received electrical signal obtained from the vibration-receiving sensor, thereby shortening the tile peeling inspection time. Furthermore, the tile peeling diagnosis method described in this section uses a tile peeling detector that includes at least one excitation sensor and multiple vibration-receiving sensors. Therefore, the tile peeling detection between the contact point of the excitation sensor and the contact point of each of the vibration-receiving sensors is simultaneously inspected, thereby also shortening the tile peeling inspection time. Moreover, since the excitation electrical signal applied to the vibration sensor is a single pulse wave, a random wave, or a repeated combination of these, there is no need to extend the duration, as is the case when applying a sweep wave electrical signal. Furthermore, since it is possible to use vibrations caused by a single pulse wave or a random wave, the inspection time is further shortened.

[0011] (2) In the above paragraph (1), a tile peeling diagnosis method is used in which the correlation between the maximum amplitude value and the peeling of the tile is determined by the relationship between the maximum amplitude value and a score as an index showing the possibility of the tile peeling, the maximum amplitude value of each of the plurality of vibration receiving sensors is scored based on the relationship, and the peeling of the tile is diagnosed based on the score. The tile peeling diagnosis method described in this section uses the relationship between the maximum amplitude value obtained from the received electrical signal used to diagnose tile peeling and a score as an indicator of the possibility of tile peeling, as a correlation between the maximum amplitude value and tile peeling.

[0012] For this reason, for example, a correlation between the maximum amplitude value obtained from the received electrical signal and the tile adhesion area is determined by testing using multiple tiles with known but different adhesion areas (or peeled areas). Furthermore, a score is determined for each specific range of maximum amplitude values, depending on the size of the adhesion area of ​​the tile to be diagnosed as peeling, and this score is used in the relationship between the maximum amplitude value and the score. When diagnosing tile peeling, the maximum amplitude value obtained from each vibration receiving sensor for the tile to be diagnosed is applied to the relationship between the maximum amplitude value and the score, and the maximum amplitude value is scored, and tile peeling is diagnosed based on this score. This simplifies the parameters used for diagnosis, thereby realizing a method for diagnosing tile peeling using simple logic.

[0013] (3) In the above (2), the method for diagnosing tile peeling includes summing the scores obtained by scoring the maximum amplitude values ​​of each of the plurality of vibration sensors, and diagnosing peeling of the tile based on the summed scores. The tile peeling diagnosis method described in this section involves summing the scores for all vibration receiving sensors obtained by applying the maximum amplitude value from each vibration receiving sensor associated with the tile being diagnosed to the relationship between the maximum amplitude value and the score, and diagnosing tile peeling based on this total score. That is, for example, the relationship between the sum of the scores for all vibration receiving sensors and the tile adhesion area (or peeled area) is determined by testing or the like, and the total score for the tile being diagnosed is applied to this relationship to diagnose tile peeling. In this way, tile peeling is diagnosed using all the scores obtained from multiple vibration receiving sensors, and the propagation status of vibration energy that reflects the effects of adhesion or peeling at various positions on the tile is taken into account, resulting in a more appropriate diagnosis.

[0014] (4) In the above item (1), a tile peeling detector having two of the vibration sensors is used as the tile peeling detector, and a final judgment of the tile peeling is made by using both the diagnosis result of the tile peeling when vibrations generated by one of the two vibration sensors are received by the plurality of vibration receiving sensors via the tile, and the diagnosis result of the tile peeling when vibrations generated by the other of the two vibration sensors are received by the plurality of vibration receiving sensors via the tile.

[0015] The tile peeling diagnosis method described in this section diagnoses tile peeling using a tile peeling detector equipped with two excitation sensors and multiple vibration receiving sensors. Specifically, a series of procedures are performed for each of the two excitation sensors, including excitation of a tile from the excitation sensor, reception of the vibration by each of the multiple vibration receiving sensors and conversion into a received electrical signal, and diagnosis of tile peeling based on the maximum amplitude value of the voltage at a certain frequency component extracted from each received electrical signal. A final determination of tile peeling is then made using both the tile peeling diagnosis results for one excitation sensor and the other excitation sensor. This allows for a diagnosis that takes into account the propagation of vibration energy between the portion of the tile in contact with one excitation sensor and the portion in contact with each of the multiple vibration receiving sensors, and between the portion in contact with the other excitation sensor and the portion in contact with each of the multiple vibration receiving sensors, thereby improving the accuracy of tile peeling diagnosis.

[0016] (5) In the above (4), a tile peeling diagnostic method is used in which the distance between the vibration points of the two vibration sensors corresponds to the size of the trowel comb marks formed in the organic adhesive adhesive used to attach the tile. In the tile peeling diagnosis method described in this section, the distance between the excitation points of the two vibration sensors of the tile peeling detector is set to correspond to the size of the trowel comb marks formed in the adhesive when the organic adhesive patch for attaching tiles is applied to a building or the like with a trowel. In other words, the distance between the excitation points of the two vibration sensors is set so that when the tile peeling detector is pressed against the tile, the excitation point of at least one of the two vibration sensors is located on a convex part of the unevenness of the trowel comb marks formed in the adhesive when the tile is attached.

[0017] Here, when attaching tiles to a building or the like, if the adhesive is applied to the building or the like and then tapped down insufficiently after the tile is attached, there is a risk that a cavity in the adhesive will form in the area that was previously a concave portion of the trowel-like unevenness formed in the adhesive during application. Furthermore, if vibration is applied to such a cavity in the adhesive, erroneous diagnosis data may be obtained. Therefore, the tile peeling diagnosis method described in this section uses a tile peeling detector having two vibration sensors as described above, so that at least one of the vibration sensors applies vibration at a position that does not correspond to a cavity in the adhesive. As a result, vibration from at least one of the vibration sensors obtains appropriate data for diagnosing tile peeling, so that tile peeling can be diagnosed without any problems even if a cavity in the adhesive is formed behind the tile.

[0018] (6) In the above (1), a tile peeling diagnostic method is used in which the tile peeling detector is configured such that the at least one vibration sensor is fixed near the center of the base in a planar view, and the plurality of vibration receiving sensors are fixed to the base so as to surround the at least one vibration sensor. The tile peeling diagnosis method described in this section utilizes a tile peeling detector in which at least one vibration sensor for applying vibration to a tile and multiple vibration receiving sensors for receiving vibrations from the tile are arranged as follows: At least one vibration sensor is fixed near the center of the base in a plan view, and multiple vibration receiving sensors are fixed to the base so as to surround the at least one vibration sensor.

[0019] As a result, the vibrations applied to the tile from the vibration sensor are received by each of the multiple vibration receiving sensors at positions that surround the part of the tile to which the vibrations are applied. Therefore, the entire area defined by the positions of the multiple vibration receiving sensors surrounding the vibration sensor is inspected simultaneously, allowing for efficient diagnosis of tile peeling, which is expected to further reduce the time required. Furthermore, by setting the spacing between the vibration sensors and the vibration receiving sensors so that the area defined by the multiple vibration receiving sensors described above substantially covers the entire tile to be inspected, there is no need to reposition the tile peeling detector relative to the tile, and one tile can be inspected at once, resulting in more efficient diagnosis.

[0020] (7) A system for diagnosing peeling of existing tiles, comprising: a tile peeling detector, in which at least one excitation sensor applies vibrations generated from an excitation electric signal to the tile, and a plurality of vibration receiving sensors convert the vibrations received from the tile into received electric signals, the sensors being arranged at intervals; a vibration input unit that outputs the excitation electric signal consisting of a single pulse wave, a single random wave, a repetition of single pulse waves, or a repetition of single random waves to the at least one excitation sensor; and an analysis unit that receives and analyzes the received electric signals from the plurality of vibration receiving sensors, wherein the analysis unit calculates a voltage amplitude value for each frequency component from the received electric signal for each of the plurality of vibration receiving sensors, identifies a maximum amplitude value among the voltage amplitude values ​​for each of the plurality of vibration receiving sensors, and diagnoses peeling of the tile based on a previously determined correlation between the maximum amplitude value and peeling of the tile, and the maximum amplitude value for each of the plurality of vibration receiving sensors.

[0021] (8) In the above paragraph (7), the analysis unit uses the relationship between the maximum amplitude value and a score as an index showing the possibility of tile peeling as the correlation between the maximum amplitude value and the peeling of the tile, scores the maximum amplitude value of each of the multiple vibration sensors based on the relationship, and diagnoses the peeling of the tile based on the score. (9) In the above (8), the analysis unit sums up the scores obtained by scoring the maximum amplitude values ​​of each of the multiple vibration sensors, and diagnoses the peeling of the tile based on the summed scores. The tile peeling diagnostic systems described in items (7) to (9) are each used in the tile peeling diagnostic methods described in items (1) to (3) above, and thereby achieve the same effects as those of the tile peeling diagnostic methods described in items (1) to (3) above. [Effects of the Invention]

[0022] The present invention has the above-described configuration, making it possible to reduce the time required to inspect for tile peeling. [Brief explanation of the drawings]

[0023] [Figure 1] 1 is a block diagram showing an example of the configuration of a tile peeling diagnosis system according to an embodiment of the present invention; [Figure 2] FIG. 1 is a perspective view showing a schematic configuration of a tile peeling detector. [Figure 3] 1 is a flowchart showing an example of a procedure for a method for diagnosing tile peeling according to an embodiment of the present invention. [Figure 4] 10 is a table showing an example of the relationship between the maximum amplitude value of the voltage and the score as an index showing the possibility of tile peeling. [Figure 5] 10 is a table showing an example of the relationship between the total score and the adhesive application area ratio of the tile. [Figure 6] (a) shows a schematic diagram of an example of a tile used in the test, and (b) shows an example of the arrangement of sensors of a tile peeling detector relative to the tile in (a). [Figure 7] 1 is a table showing examples of various tiles with different adhesive coverage areas and adhesive application locations used in the test. [Figure 8] The figures show examples of maximum amplitude values ​​of voltage obtained by testing, where (a) is the test result for a tile with an adhesive coating area ratio of 100%, and (b) is the test result for a tile with an adhesive coating area ratio of 40%. DETAILED DESCRIPTION OF THE INVENTION

[0024] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Here, detailed descriptions of parts that are the same as or corresponding to those in the prior art will be omitted, and the same reference numerals will be used throughout the drawings to indicate the same or corresponding parts. Fig. 1 shows a schematic configuration of a tile peeling diagnostic system 10 according to an embodiment of the present invention, which diagnoses peeling of existing tiles T attached to a building or the like, and Fig. 2 shows an example of the structure of a tile peeling detector 12 used in the tile peeling diagnostic system 10. First, the structure of the tile peeling detector 12 will be described with reference to Figs. 1 and 2.

[0025] As shown in the figure, the tile peeling detector 12 includes at least one vibration sensor 14 (two vibration sensors 14A and 14B in this embodiment), a plurality of vibration receiving sensors 16 (six vibration receiving sensors 16A to 16F in this embodiment), and a base 30 to which the vibration sensor 14 and the vibration receiving sensors 16 are fixed. Each of the vibration sensors 14 is used to apply vibration to a tile T and is fixed to the base 30 by screws or the like, with most of the other components housed inside a case body 22. Although detailed explanations are omitted, the vibration sensor 14 includes a piezoelectric diaphragm, a spring, and the like in addition to the vibration transmitter 20 that can be seen in FIG. 2, and in this embodiment, the components of the two vibration sensors 14A and 14B are housed in a common case body 22 that is oval in plan view.

[0026] The case bodies 22 of the two vibration sensors 14A and 14B have two protruding holes formed in the upper part, from which protrude the triangular pyramidal tip of the vibration transmitter 20 of the vibration sensor 14A and the triangular pyramidal tip of the vibration transmitter 20 of the vibration sensor 14B. The vibration transmitter 20 of the vibration sensor 14 transmits vibrations generated by the piezoelectric diaphragm to the tile T when its tip is in contact with the tile T, and the triangular pyramidal tip serves as the excitation point. That is, when an electric vibration signal is applied to the piezoelectric diaphragm from the vibration input unit 40 (described later) when the tip of the vibration transmitter 20 is in contact with the tile T, the vibration sensor 14 generates vibrations using the piezoelectric diaphragm. The generated vibrations are then transmitted to the tile T via the vibration transmitter 20, which is physically connected to the piezoelectric diaphragm, and vibration is applied to the tile T.

[0027] On the other hand, each of the vibration receiving sensors 16 is designed to receive vibrations from the tile T, and like the vibration excitation sensor 14, has a structure in which a piezoelectric diaphragm, springs, etc. are housed inside a case body 22. Unlike the vibration excitation sensor 14, the case body 22 of the vibration receiving sensor 16 is circular in plan view, with a protrusion hole provided at the top from which the triangular pyramidal tip of the vibration transmitter 20 of the vibration receiving sensor 16 protrudes. In the vibration receiving sensor 16 configured as described above, when the tip of the vibration transmitter 20 is in contact with the tile T and the tile T vibrates, the vibration is transmitted to the vibration transmitter 20 and then to the piezoelectric diaphragm physically connected to the vibration transmitter 20. The transmitted vibration is then converted into an electrical signal by the piezoelectric diaphragm, which is then extracted as a received electrical signal by the analysis unit 50, which will be described later.

[0028] The two vibration sensors 14A and 14B and the six vibration receiving sensors 16A to 16F described above are fixed to a plate-shaped base portion 30 in a positional relationship such as that shown in Fig. 2. That is, the two vibration sensors 14A and 14B are fixed adjacent to each other in the longitudinal direction of the rectangular base portion 30 near the center of the base portion 30, which is rectangular in plan view, and the six vibration receiving sensors 16A to 16F are arranged to surround the vibration sensors 14A and 14B. More specifically, the vibration sensor 14A and the three vibration receiving sensors 16A, 16C, and 16E are arranged at approximately equal intervals in a staggered pattern, and adjacent to them, the vibration sensor 14B and the three vibration receiving sensors 16B, 16D, and 16F are also arranged at approximately equal intervals in a staggered pattern. Such an arrangement is adapted to a tile T having the size and shape shown in FIG. 6, and although not limited thereto, the size of the tile T is, for example, 95 mm x 45 mm.

[0029] As an example of a size corresponding to the above-described size of tiles T, the tile peeling detector 12 shown in Fig. 2 has a distance between the tips of the triangular pyramidal vibration transmitters 20 of the vibration receiving sensors 16A and 16B and between the tips of the triangular pyramidal vibration transmitters 20 of the vibration receiving sensors 16C and 16D of approximately 48 mm. The distance between the tips of the triangular pyramidal vibration transmitters 20 of the vibration receiving sensors 16A and 16C and between the tips of the triangular pyramidal vibration transmitters 20 of the vibration receiving sensors 16B and 16D is also approximately 29 mm. Furthermore, the distance between the tips of the triangular pyramidal vibration transmitters 20 of the vibration excitation sensors 14A and 14B, indicated by the symbol L in Fig. 2, is approximately 18 mm.

[0030] Here, the distance indicated by the symbol L above corresponds to the distance L between the excitation points of the two vibration sensors 14A and 14B, and its size, for reasons that will be described later, desirably corresponds to the size of the comb marks of a trowel formed on an adhesive patch used to attach the tile T to a building or the like. That is, the trowel here refers to a comb trowel, and when the adhesive patch is applied to a building or the like with this comb trowel, the comb trowel forms comb marks consisting of protrusions and recesses on the adhesive patch. Then, taking into account the distance between the protrusions and recesses of the comb marks and the angle of the comb marks, the distance L between the excitation points of the two vibration sensors 14A and 14B is set as follows. That is, when setting the tile peeling detector 12 on the tile T, the distance L is set so that the excitation point of at least one of the two vibration sensors 14A and 14B is located on the convex portion of the comb mark of the adhesive patch located on the back surface of the tile T in a plan view of the tile T. The adhesive agent here may be any of various types used to attach the tiles T, such as various organic adhesives.

[0031] Next, a tile peeling diagnosis system 10 according to an embodiment of the present invention will be described with reference to FIG. 1. As shown in the figure, the tile peeling diagnosis system 10 includes a vibration input unit 40 and an analysis unit 50 in addition to the above-described tile peeling detector 12. The vibration input unit 40 applies an electric vibration signal to the vibration sensor 14 to generate vibration, as described above, and in this embodiment, includes a signal generator 42 and a power amplifier 44. The signal generator 42 generates the electric vibration signal. In this embodiment, the signal generator 42 repeatedly generates a single pulse wave of, for example, a half-sine wave, and the half-sine wave has a frequency of, for example, about 14 kHz. The power amplifier 44 amplifies the electric vibration signal generated by the signal generator 42 to a voltage required for vibration by the vibration sensor 14. The electric vibration signal amplified by the power amplifier 44 is then applied to the vibration sensor 14 via wiring or the like. The destination of the vibration electrical signal from the vibration input unit 40 can be switched to either of the two vibration sensors 14A and 14B. The signal generator 42 and power amplifier 44 constituting the vibration input unit 40 may be any signal generator and power amplifier.

[0032] The analyzer 50 analyzes the received electrical signals received from each of the vibration receiving sensors 16 via wiring or the like. In this embodiment, the analyzer 50 includes a charge amplifier 52, an AD converter 54, a filter 56, an FFT analyzer 58, and a diagnostic unit 60. The charge amplifier 52 amplifies the received electrical signals received from the vibration receiving sensors 16 to a voltage required for analysis. Any multi-channel charge amplifier may be used as the charge amplifier 52. The AD converter 54 converts the received electrical signals amplified by the charge amplifier 52 from analog to digital, performing the conversion at a sampling rate and resolution required for the FFT analysis described below. For example, if the signal generator 42 generates a half-sine wave with a frequency of 14 kHz, sampling at approximately 40 kHz and a resolution of approximately 16 bits may be sufficient. The AD converter 54 performs AD conversion on each of the received electrical signals from the vibration receiving sensors 16 amplified by the charge amplifier 52. Therefore, any multi-channel AD converter having the above-described performance may be used.

[0033] The filter unit 56 is for removing frequency components unnecessary for analysis from the received electrical signal converted into a digital signal, for example, by performing high-pass filtering to remove low frequency components such as everyday vibrations below 800 Hz. The FFT analysis unit 58 performs FFT analysis on the received electrical signal that has been preprocessed between the charge amplifier 52 and the filter unit 56. In the FFT analysis, the digitized received electrical signal is decomposed into frequency components by fast Fourier transform, and the voltage amplitude value of each frequency component is extracted. The filter unit 56 and FFT analysis unit 58 are configured by any computer on which software for performing high-pass filtering and FFT analysis is installed, for example.

[0034] The diagnosis unit 60 diagnoses peeling of the inspected tile T using the analysis results from the FFT analysis unit 58. As will be described in detail later, the diagnosis unit 60 diagnoses whether the tile T is peeling or not by identifying the maximum amplitude value of the received electrical signal decomposed into frequency components, scoring the maximum amplitude value, summing the scores for the multiple vibration receiving sensors 16, and making a judgment using the total score. Such a diagnosis unit 60 may be configured, for example, by any computer on which any software is installed.

[0035] The configurations of the tile peeling diagnosis system 10 and the tile peeling detector 12 according to the embodiment of the present invention are not limited to those shown in FIGS. 1 and 2 . Some of the components shown in FIGS. 1 and 2 may be omitted, modified, or appropriately added depending on the tile T to be diagnosed and the situation. For example, the number and positional relationship of the vibration sensors 14 and the vibration receiving sensors 16 may be changed depending on the size of the tile T. For example, the tile peeling diagnosis system 10 may include only one vibration sensor 14 or three or more vibration sensors 14. The tile peeling diagnosis system 10 may also include a display device for displaying the analysis results of the analysis unit 50. The signal generator 42 may repeatedly generate a single pulse wave other than a half-sine wave. Furthermore, the excitation electrical signal generated by the signal generator 42 is not limited to a repetition of a single pulse wave, but may include only a single pulse wave, only a single random wave, or a repetition of a single random wave.

[0036] Next, with reference to the flowchart shown in Fig. 3, a specific procedure of a tile peeling diagnosis method according to an embodiment of the present invention, which uses the above-described tile peeling diagnosis system 10, will be described. For the configurations of the tile peeling diagnosis system 10 and the tile peeling detector 12, please refer to Figs. 1 and 2 as appropriate. Note that the flowchart shown in Fig. 3 shows an example for explaining the specific procedure. Therefore, the procedure of the tile peeling diagnosis method according to the embodiment of the present invention is not limited to the flowchart shown in Fig. 3, and some of the steps shown in Fig. 3 may be deleted, changed, or added as appropriate, depending on, for example, the configuration of the tile peeling diagnosis system 10 and the tiles T to be inspected.

[0037] Furthermore, when diagnosing peeling of the tile T, the tile peeling detector 12 is pressed against the tile T to be diagnosed, and the vibration transmitters 20 of all the vibration sensors 14 and all the vibration receiving sensors 16 are brought into contact with the tile T. Note that Fig. 6(b) shows an example of the arrangement of the vibration transmitters 20 of the two vibration sensors 14A, 14B and the six vibration receiving sensors 16A to 16F when the tile peeling detector 12 is pressed against the tile T, in a plan view of the tile T, i.e., when the tile peeling detector 12 shown in Fig. 2 is viewed from the back side of the base part 30.

[0038] S10 (application of excitation electric signal): The vibration input unit 40 applies an excitation electric signal generated by the signal generator 42 and amplified by the power amplifier 44 to one of the excitation sensors 14A, 14B. As described above, in this embodiment, the signal generator 42 repeatedly generates a single half-sine pulse wave with a frequency of 14 kHz. In the flow diagram of FIG. 3, steps S10 to S130, which will be described later, apply to one of the two excitation sensors 14A, 14B, and this will be described as the excitation sensor 14. S20 (Excite tile): Upon receiving the excitation electric signal applied in S10, the excitation sensor 14 of the tile peeling detector 12 generates vibrations via the piezoelectric diaphragm, which then excites the tile T. For example, in the example of FIG. 6(b), the center position of the circular imaginary line representing the vibration transmitter 20 of the excitation sensors 14A and 14B is the excitation point by the excitation sensors 14A and 14B.

[0039] S30 (receive vibration from tile): The vibrations excited by the vibration sensor 14 and propagated through the tile T are received by the six vibration-receiving sensors 16A to 16F. For example, in the example of FIG. 6(b), the center positions of the imaginary circles representing the vibration transmitters 20 of the vibration-receiving sensors 16A to 16F are the vibration-receiving points of the vibration-receiving sensors 16A to 16F. In the flow chart of FIG. 3, steps S30 to S80, which will be described later, are performed by any one of the six vibration-receiving sensors 16A to 16F, and this will be described here as the vibration-receiving sensor 16. The vibration-receiving sensor 16, which receives the vibrations from the tile T, converts the vibrations into a received electrical signal via a piezoelectric diaphragm. S40 (Acquisition of received electric signal): The analysis unit 50 acquires the received electric signal from the receiving sensor 16.

[0040] S50 (pre-processing of received electrical signal): The analysis unit 50 performs pre-processing for analyzing the received electrical signal. That is, the received electrical signal is amplified by the charge amplifier 52, and converted into a digital signal by the AD converter 54. The filter unit 56 removes unnecessary frequency components, for example, less than 800 Hz, from the digitized received electrical signal. S60 (extraction of amplitude value for each frequency): The FFT analysis unit 58 of the analysis unit 50 decomposes the digitized and filtered received electrical signal into frequency components, and extracts the amplitude value of the voltage at each frequency component.

[0041] S70 (maximum amplitude value identification): The diagnosis unit 60 of the analysis unit 50 identifies the maximum amplitude value with the largest voltage value from among the amplitude values ​​of the voltages of the frequency components extracted by the FFT analysis unit 58 in S60 above. S80 (maximum amplitude value scoring): The diagnosis unit 60 scores the maximum amplitude value identified in S70 above, using a table such as that shown in Fig. 4. That is, the table shown in Fig. 4 is a correspondence table between peak voltage values ​​(maximum voltage amplitude values) and scores; for example, if the peak voltage value is "0.110 V," the score is "0.75," and if the peak voltage value is "0.040 V," the score is "0." How to obtain the correspondence table in Fig. 4 will be described later.

[0042] S90 (determine unevaluated vibration receiving sensors): The diagnosis unit 60 determines whether or not there are any unevaluated vibration receiving sensors 16 remaining among the six vibration receiving sensors 16A to 16F. As a result, if it is determined that there are any unevaluated vibration receiving sensors 16 remaining (YES), the process returns to S30 above, and if it is determined that there are no unevaluated vibration receiving sensors 16 remaining (NO), the process proceeds to S100. That is, the above steps S30 to S80 are performed for each of the six vibration receiving sensors 16A to 16F, and then the process proceeds to S100. S100 (total score of all vibration receiving sensors): The diagnosis unit 60 sums up the scores calculated for each of the six vibration receiving sensors 16A to 16F in S80 above, and calculates a total score by adding up all the scores of the six vibration receiving sensors 16A to 16F.

[0043] S110 (Determine Total Score): The diagnostic unit 60 determines whether the total score calculated in S100 is equal to or less than a predetermined score. In the present embodiment, although not limited thereto, in the case of application with an organic adhesive, the pass mark is whether the area ratio of tiles T attached is 50% or more. To do this, for example, by referring to a correspondence table such as that shown in FIG. 5, which is obtained by testing as described below, it is determined whether the total score is 3 points or less, which indicates that the adhesive application area ratio is 50% or more. As a result, if it is determined that the total score is 3 points or less (YES), the process proceeds to S120. If it is determined that the total score is greater than 3 points (NO), the process proceeds to S130. Note that the adhesive application area ratio in FIG. 5 is the area where adhesive was applied during testing, as described below, and can be considered as the area ratio where tiles T are attached.

[0044] Regarding how to obtain the correspondence tables of Figures 4 and 5, a correspondence table like that of Figure 4 shows the relationship between the maximum amplitude value and a score as an index showing the possibility of detachment of the tile T, and is obtained together with the correspondence table of Figure 5 through tests conducted in advance. In such tests, the adhered area and detached area of ​​the tile T to the building or the like are known, and multiple tiles T are used, each with different areas and adhered and detached positions. For example, Figure 7 shows an example of a pattern of multiple tiles T using an adhesive as an adhesive for the tile T, with the adhesive application area ratio and application position being different from one another, with the adhesive application range colored.

[0045] That is, in the tiles T shown in the two rows, upper and lower, in FIG. 7, the upper row has adhesive applied to the central area of ​​the tile T in a plan view, and the lower row has adhesive applied to the left area of ​​the tile T in a plan view, with the adhesive application area ratio differing between the left and right directions in FIG. 7. Such tiles T with multiple patterns are attached to a wall or the like representing a building, and tests are performed using these tiles T in accordance with the procedures shown in S10 to S70 above. Therefore, the adhesive application area ratio and application position here can be considered to be the area ratio and position where the tile T is attached. Note that the tile T shown in FIG. 6 is equivalent to the tile T shown second from the left in the bottom row of FIG. 7, with adhesive applied to the left 40% of the tile T in a plan view.

[0046] Figure 8(a) shows the peak voltage values ​​(maximum voltage amplitude values) obtained when testing tile T, which corresponds to the tile T on the far right in the upper and lower rows of Figure 7 and has a 100% adhesive coverage. In Figure 8(a), "Adhesive A" and "Adhesive B" indicate the use of two different types of adhesive. Furthermore, "14A" and "14B" indicate the symbols of the two excitation sensors 14A and 14B that performed the excitation. Here, these excitation points are also referred to as excitation points 14A and 14B. Furthermore, "16A" through "16F" indicate the symbols of the six receiving sensors 16A through 16F that identified the peak voltage values ​​shown in the table. Here, these receiving points are also referred to as receiving points 16A through 16F. As shown in the figure, the test results for tile T, which appears to have no peeling, show that all peak voltage values ​​are below 0.050 V, regardless of the adhesive type or excitation point. Therefore, in the illustrated embodiment, if no separation occurs between the excitation point and the vibration receiving point, it can be considered that the maximum amplitude value specified as S70 above will be 0.050V or less.

[0047] On the other hand, Figure 8(b) shows the peak voltage values ​​(maximum voltage amplitude values) obtained when testing tile T in which adhesive was applied over 40% of the left side of the tile T in plan view, which corresponds to the tile T shown in Figure 6 and the second tile T from the left in the bottom row of Figure 7. In Figure 8(b), "1st tile" and "2nd tile" indicate that two tiles T with the same adhesive application area were used, and "14A," "14B," and "16A" to "16F" are the same as those in Figure 8(a), and their positions relative to the tile T during testing are shown by virtual lines in Figure 8(b).

[0048] As shown in the figure, the test results for tile T, which is considered to be 40% adhered (60% peeled), show that when excitation point 14A was applied to the first tile T, the peak voltage values ​​at receiving points 16B, 16D, and 16F were relatively low, ranging from 0.072 V to 0.025 V. This is thought to be because, as can be seen in Figure 6(b), receiving points 16B, 16D, and 16F are located within the adhesive application range. Furthermore, when excitation point 14A was applied to the first tile T, the peak voltage values ​​at receiving points 16A, 16C, and 16E were relatively high, ranging from 0.185 V to 0.148 V. This is thought to be because these receiving points are not located within the adhesive application range.

[0049] In contrast, when the first tile T is excited at excitation point 14B, the peak voltage values ​​at all of receiving points 16A-16F are relatively low, ranging from 0.062V to 0.027V. Several factors may contribute to this difference depending on the excitation point, one of which is whether the excitation point is located within the adhesive application area. Furthermore, in actual tiles T used in buildings and other structures, in addition to peeling due to aging, voids may form in the patch when the tiles are attached to buildings and other structures. Specifically, these voids may form in the concave portions of the comb lines formed in the patch by a comb trowel during attachment of the tile T. For this reason, as described above, it is desirable to set the distance L between the two excitation points 14A and 14B shown in FIG. 2 in consideration of the size of the comb lines so that at least one of the two excitation points 14A and 14B is positioned in the convex portions of the comb lines of the patch.

[0050] Furthermore, when the test results for the second tile T are checked in Figure 8(b), it can be seen that, with some exceptions, the results generally follow the same trends as the test results for the first tile. Then, for example, the above-mentioned test is performed on multiple patterns of tiles T as shown in Figure 7, and from the results, the relationship between the maximum amplitude value of the vibration receiving sensor 16 and the tile T is derived as a correlation between the maximum amplitude value and the score, which is an index showing the possibility of detachment of the tile T. Specific examples of this relationship are shown in the correspondence table of Figure 4, which shows the relationship between the peak voltage value and the score at each vibration receiving sensor 16, and the correspondence table of Figure 5, which shows the relationship between the total score for the six vibration receiving sensors 16 and the adhesive application area ratio.

[0051] S120 (healthy tendency determination): Since it was determined in S110 above that the total score is less than the predetermined score (3 points), the diagnosis unit 60 determines that the tile T to be diagnosed is in a healthy tendency when vibrated by the vibration sensor 14 mentioned in S20 above. S130 (Determination of tendency to peel): Since it was determined in S110 above that the total score is greater than the predetermined score (3 points), the diagnosis unit 60 determines that the tile T to be diagnosed is prone to peeling when vibrated by the vibration sensor 14 mentioned in S20 above.

[0052] S140 (determination of unexcited sensors): The diagnosis unit 60 determines whether or not there are any unexcited vibration sensors 14 remaining among all the vibration sensors 14, i.e., the two vibration sensors 14A and 14B in this embodiment. If it is determined that there are any unexcited vibration sensors 14 remaining (YES), the process proceeds to S150, and if it is determined that there are no unexcited vibration sensors 14 remaining (NO), the process proceeds to S160. S150 (switching of vibration sensors): The vibration sensor 14 to which the vibration electrical signal is applied in S10 and the vibration sensor 14 to which vibration is applied in S20 are switched to the vibration sensor 14 that has not yet excited vibration, out of the two vibration sensors 14A and 14B. Then, by proceeding to S10 after switching, S10 to S130 are executed again for the vibration from the vibration sensor 14 that has not yet excited vibration.

[0053] S160 (integrated judgment of all vibration sensors): The diagnosis unit 60 judges whether or not there is a result in S130 where the tile T to be diagnosed is judged to be prone to peeling among the judgments made for all vibration sensors 14. That is, in this embodiment, it is judged whether or not S130, which judges that the tile T is prone to peeling, was carried out in at least one of the steps S10 to S140 performed for the vibration from vibration sensor 14A and the steps S10 to S140 performed for the vibration from vibration sensor 14B. As a result, if the judgment results for the two vibration sensors 14A and 14B include a result judged to be prone to peeling via S130 (YES), the process proceeds to S180, and if no result judged to be prone to peeling is included (NO), the process proceeds to S170.

[0054] S170 (final determination that the tile is healthy): Since it has been determined in S160 above that the determination results for all of the vibration sensors 14 do not include a determination result that the tile T to be diagnosed is prone to peeling, the diagnosis unit 60 makes a final determination that the tile T to be diagnosed is healthy. This results in a diagnosis that the tile T to be diagnosed is healthy, and the tile peeling diagnosis method according to the embodiment of the present invention is completed. S180 (Final determination of peeled tile): Since it was determined in S160 above that the determination results for all of the vibration sensors 14 include a determination result that the tile T to be diagnosed is prone to peeling, the diagnosis unit 60 makes a final determination that the tile T to be diagnosed is a peeled tile. This results in a diagnosis that the tile T to be diagnosed is peeling, and the tile peeling diagnosis method according to the embodiment of the present invention is completed.

[0055] Here, the peak voltage values ​​shown in FIG. 8 are merely examples and will vary depending on the configuration of the tile peeling diagnosis system 10, the configuration of the tile peeling detector 12, the type of tile T, the type of adhesive, and the like. Therefore, it is preferable to perform a test to determine the peak voltage values ​​shown in FIG. 8 using the tile peeling diagnosis system 10 and tile peeling detector 12 that are actually used for peeling diagnosis, using tiles and adhesives of the same type as the tile T to be diagnosed. The peak voltage values ​​obtained from such a test can then be used to derive the correspondence tables shown in FIGS. 4 and 5. The scores shown in the correspondence tables of FIGS. 4 and 5 and the ranges of peak voltage values ​​shown in the correspondence table of FIG. 4 are also merely examples and may differ from those shown in FIGS. 4 and 5. Furthermore, in the correspondence table of FIG. 4, the higher the peak voltage value, in other words, the higher the likelihood of peeling, the higher the score. However, the magnitude relationship of the scores may be set opposite to that of FIG. 4, in which case the magnitude relationship of the total scores in the correspondence table of FIG. 5 will also be reversed.

[0056] According to the embodiment of the present invention configured as described above, the following advantageous effects can be obtained. That is, a tile peeling diagnosis method according to the embodiment of the present invention diagnoses peeling of tiles T attached to a building or the like using a tile peeling diagnosis system 10 and a tile peeling detector 12, for example, as shown in Figures 1 and 2. The tile peeling diagnosis system 10 has a vibration input unit 40 and an analysis unit 50 in addition to the tile peeling detector 12. The tile peeling detector 12 includes at least one vibration sensor 14, multiple vibration receiving sensors 16, and a base unit 30, and the at least one vibration sensor 14 and multiple vibration receiving sensors 16 are fixed to the base unit 30 at intervals from each other.

[0057] The tile peeling detector 12 is used by arranging the base 30 so that it is approximately parallel to the tile T, and pressing it against the tile T so that at least one vibration sensor 14 and multiple vibration receiving sensors 16 are in contact with the tile T. In this state, vibration is applied to the tile T by the at least one vibration sensor 14 (see S20 in FIG. 3), and the vibration applied to the tile T is received via the tile T by the multiple vibration receiving sensors 16 (see S30 in FIG. 3). At this time, the vibration applied by the vibration sensor 14 is generated from a vibration electric signal (see S10 in FIG. 3), and the vibration sensor 14 has the function of generating vibration from the applied vibration electric signal. The vibration electric signal applied to the vibration sensor 14 may be a single pulse wave, a single random wave, a repetition of a single pulse wave, or a repetition of a single random wave. Each of the vibration receiving sensors 16 has the function of converting vibrations received from the tile T into a vibration receiving electric signal.

[0058] Next, the vibrations applied by the excitation sensor 14, propagated through the tile T, and received by the vibration-receiving sensors 16 are converted into received electrical signals, which are acquired from each of the vibration-receiving sensors 16 (see S40 in FIG. 3). The amplitude value of the voltage for each frequency component is calculated from the received electrical signals. Specifically, the received electrical signals, which are the measurement results from each vibration-receiving sensor 16, are subjected to preprocessing required for calculation (see S50 in FIG. 3), and then FFT analysis or the like is performed to extract the amplitude value of the voltage for each frequency component for each received electrical signal (see S60 in FIG. 3). Next, the maximum amplitude value, which has the largest voltage value, is identified from the voltage amplitude values ​​extracted for each frequency component (see S70 in FIG. 3). This is performed on the received electrical signals of each vibration-receiving sensor 16. Then, based on the correlation between the maximum amplitude value and peeling of the tile T as previously determined, and the maximum amplitude value of each of the vibration receiving sensors 16 as described above, peeling of the tile T is diagnosed (see S80 to S180 in FIG. 3).

[0059] Here, in a portion where the tile T is attached without peeling from its attachment surface, the vibration applied to the tile T from the vibration sensor 14 propagates from the tile T to its attachment surface, and therefore the vibration energy received by the vibration receiving sensor 16 is significantly reduced. In contrast, in a portion where the tile T has peeled from its attachment surface, the vibration applied to the tile T from the vibration sensor 14 propagates only within the tile T without propagating to its attachment surface, and therefore is received with little loss by the vibration receiving sensor 16. The magnitude of the vibration energy is reflected in the received vibration signal converted from the vibration by the vibration receiving sensor 16, and therefore the maximum amplitude value obtained from the received vibration signal as described above can be an indicator for diagnosing peeling of the tile T.

[0060] Therefore, in a tile peeling diagnosis method according to an embodiment of the present invention, the correlation between the maximum amplitude value obtained from the received electrical signal (see, for example, FIG. 8 ) and peeling of the tile T is determined in advance by testing or the like, and the maximum amplitude value obtained for the tile T to be diagnosed is applied to this correlation, thereby diagnosing peeling of the tile T. This allows for instantaneous diagnosis of peeling of the tile T based on the received electrical signal obtained from the vibration-receiving sensor 16, thereby shortening the time required to inspect for peeling of the tile T. Furthermore, because the tile peeling detector 12 used has at least one excitation sensor 14 and multiple vibration-receiving sensors 16, it is possible to simultaneously inspect the area between the portion of the tile T that the excitation sensor 14 contacts and the portion that each of the vibration-receiving sensors 16 contacts, thereby also shortening the time required to inspect for peeling of the tile T. Furthermore, since the vibration electrical signal applied to the vibration sensor 14 is a single pulse wave or random wave, or a combination of these repeated, there is no need to lengthen the duration, as is the case when a sweep wave electrical signal is applied.Furthermore, since it is possible to use vibrations caused by a single pulse wave or random wave, it is possible to further shorten the inspection time.

[0061] Furthermore, the tile peeling diagnosis method according to the embodiment of the present invention uses, as the correlation between the maximum amplitude value obtained from the received electrical signal and peeling of the tile T, the relationship between the maximum amplitude value and a score as an index indicating the possibility of peeling of the tile T, as shown in FIG. 4, for example. To this end, the correlation between the maximum amplitude value obtained from the received electrical signal and the attached area of ​​the tile T is determined, for example, by a test using a plurality of tiles T (see FIG. 7) whose attached areas (or peeled areas) are known but different from one another. Furthermore, depending on the size of the attached area of ​​the tile T to be diagnosed as peeling, a score is determined for each specific range of the maximum amplitude value, for example, and this is used in the relationship between the maximum amplitude value and the score. Then, when diagnosing peeling of the tile T, the maximum amplitude value obtained from each of the vibration receiving sensors 16 for the tile T to be diagnosed is applied to the relationship between the maximum amplitude value and the score, and the maximum amplitude value is scored (see S80 in FIG. 3), and peeling of the tile T is diagnosed based on the score. This simplifies the parameters used for diagnosis, making it possible to realize a method for diagnosing peeling of tiles T using simple logic.

[0062] Furthermore, the tile peeling diagnosis method according to the embodiment of the present invention sums up the scores for all vibration receiving sensors 16 obtained by applying the maximum amplitude value from each vibration receiving sensor 16 related to the tile T to be diagnosed to the relationship between the maximum amplitude value and the score (see S100 in FIG. 3), and diagnoses peeling of the tile T based on this total score. That is, for example, as shown in FIG. 5, the relationship between the sum of the scores for all vibration receiving sensors 16 and the adhesion area (or peeled area) of the tile T is determined by testing or the like, and the total score for the tile T to be diagnosed is applied to this relationship to diagnose peeling of the tile T. In this way, peeling of the tile T can be diagnosed using all the scores obtained from the multiple vibration receiving sensors 16, and therefore, a more appropriate diagnosis can be made by taking into account the propagation status of vibration energy that reflects the effects of adhesion or peeling at various positions on the tile T.

[0063] Furthermore, a tile peeling diagnosis method according to an embodiment of the present invention diagnoses peeling of a tile T by using a tile peeling detector 12 equipped with two vibration sensors 14A, 14B and a plurality of vibration receiving sensors 16 (six vibration receiving sensors 16A to 16F) as shown in Figures 1 and 2. That is, the vibration sensor 14 vibrates the tile T, the vibration is received by each of the plurality of vibration receiving sensors 16 and converted into a received electrical signal, and a series of steps (see S10 to S130 in Figure 3) up to diagnosing peeling of the tile T based on the maximum amplitude value of the voltage in a certain frequency component extracted from each received electrical signal are executed for each of the two vibration sensors 14A, 14B.

[0064] Then, a final determination of peeling of the tile T is made by using both the diagnosis result of peeling of the tile T for one vibration sensor 14A and the diagnosis result of peeling of the tile T for the other vibration sensor 14B (see S160 to S180 in FIG. 3). This makes it possible to make a diagnosis that takes into account the propagation state of vibration energy between the portion of the tile T that is in contact with one vibration sensor 14A and the portion that is in contact with each of the multiple vibration receiving sensors 16, and between the portion that is in contact with the other vibration sensor 14B and the portion that is in contact with each of the multiple vibration receiving sensors 16, thereby improving the accuracy of the diagnosis of peeling of the tile T.

[0065] 2, the tile peeling diagnosis method may be configured so that the distance L between the vibration points of the two vibration sensors 14A and 14B of the tile peeling detector 12 corresponds to the size of the trowel comb marks formed on the adhesive when the adhesive patch for attaching the tile T is applied to a building or the like with a trowel. In other words, the distance L between the vibration points of the two vibration sensors 14A and 14B is set so that when the tile peeling detector 12 is pressed against the tile T, the vibration point of at least one of the two vibration sensors 14A and 14B is located on a convex portion of the unevenness of the trowel comb marks formed on the adhesive when the tile T is attached, in a plan view of the tile T.

[0066] Here, when attaching tiles T to a building or the like, if the adhesive patch is applied to the building or the like and then tapped insufficiently after the tile T is attached, a cavity in the patch may form in the area where the concave portion of the trowel comb pattern formed on the patch during application was originally. Furthermore, applying vibration to such a cavity in the patch may result in erroneous diagnosis data being collected. Therefore, the tile peeling diagnosis method according to an embodiment of the present invention uses a tile peeling detector 12 having two vibration sensors 14A and 14B as described above, allowing at least one of the vibration sensors 14 to vibrate at a position that does not correspond to a cavity in the patch. This allows appropriate data to be obtained for diagnosing tile T peeling by applying vibration from at least one of the vibration sensors 14, making it possible to successfully diagnose tile T peeling even in cases where a cavity in the patch is formed on the back of the tile T.

[0067] Furthermore, the tile peeling diagnosis method according to the embodiment of the present invention utilizes a tile peeling detector 12 in which two vibration sensors 14A, 14B for applying vibrations to the tile T and multiple vibration receiving sensors 16 (six vibration receiving sensors 16A to 16F) for receiving vibrations from the tile T are arranged as follows: That is, as can be seen in Fig. 2, the two vibration sensors 14A, 14B are fixed near the center of the base unit 30 in a plan view, and the six vibration receiving sensors 16A to 16F are fixed to the base unit 30 so as to surround the two vibration sensors 14A, 14B. In this way, the vibrations applied to the tile T from each of the two vibration sensors 14A, 14B can be received by each of the six vibration receiving sensors 16A to 16F at positions surrounding the portion of the tile T to which the vibrations were applied. Therefore, the entire area defined by the positions of the six vibration receiving sensors 16A to 16F surrounding the two vibration sensors 14A and 14B can be inspected simultaneously, so that peeling diagnosis of the tile T can be performed efficiently, and further time reduction can be expected.

[0068] 6(b), the spacing between the two vibration sensors 14A and 14B and the six vibration receiving sensors 16A to 16F is set so that the area defined by the six vibration receiving sensors 16A to 16F substantially covers the entire tile T to be diagnosed. This makes it possible to inspect one tile T at a time without having to change the position of the tile peeling detector 12 relative to the tile T, thereby enabling more efficient diagnosis. On the other hand, when used in the tile peeling diagnosis method according to the embodiment of the present invention as described above, the tile peeling diagnosis system 10 according to the embodiment of the present invention can achieve the same effects as those of the tile peeling diagnosis method according to the embodiment of the present invention. [Explanation of symbols]

[0069] 10: Tile peeling diagnostic system, 12: Tile peeling detector, 14 (14A, 14B): Vibration sensor, 16 (16A to 16F): Vibration receiving sensor, 30: Base unit, 40: Vibration input unit, 50: Analysis unit, T: Tile, L: Distance between vibration points

Claims

1. A method for diagnosing peeling of an existing tile by using a tile peeling detector in which at least one vibration sensor and a plurality of vibration receiving sensors are fixed to a base portion with a gap between them, and the at least one vibration sensor and the plurality of vibration receiving sensors come into contact with the tile while the base portion is disposed approximately parallel to the tile, The at least one vibration sensor generates vibrations from a vibration electric signal consisting of a single pulse wave, a single random wave, a repetition of a single pulse wave, or a repetition of a single random wave, and applies the vibrations to the tile, and the plurality of vibration receiving sensors receive vibrations from the tile and convert the vibrations into vibration receiving electric signals; For each of the plurality of vibration receiving sensors, a voltage amplitude value for each frequency component is calculated from the vibration receiving electrical signal; Identifying a maximum amplitude value among the amplitude values ​​of the voltages of the frequency components for each of the plurality of vibration receiving sensors; A tile peeling diagnosis method characterized by diagnosing tile peeling based on a correlation between the maximum amplitude value and tile peeling that is determined in advance, and the maximum amplitude value of each of the multiple vibration sensors.

2. The tile peeling diagnosis method according to claim 1, characterized in that the correlation between the maximum amplitude value and the peeling of the tile is a relationship between the maximum amplitude value and a score as an index showing the possibility of the tile peeling, the maximum amplitude value of each of the plurality of vibration receiving sensors is scored based on the relationship, and the peeling of the tile is diagnosed based on the score.

3. 3. A tile peeling diagnosis method according to claim 2, wherein the scores obtained by scoring the maximum amplitude values ​​of each of the plurality of vibration sensors are summed up, and peeling of the tile is diagnosed based on the summed score.

4. As the tile peeling detector, a tile peeling detector having two of the vibration sensors is used, 2. The tile peeling diagnosis method according to claim 1, characterized in that a final judgment of tile peeling is made using both the diagnosis result of tile peeling when vibrations generated by one of the two vibration sensors are received by the plurality of vibration receiving sensors via the tile, and the diagnosis result of tile peeling when vibrations generated by the other of the two vibration sensors are received by the plurality of vibration receiving sensors via the tile.

5. The tile peeling diagnosis method according to claim 4, characterized in that the tile peeling detector used is a tile peeling detector in which the distance between the vibration points of the two vibration sensors corresponds to the size of the trowel comb marks formed in the organic adhesive adhesive used to attach the tile.

6. The tile peeling diagnostic method according to claim 1, characterized in that the tile peeling detector is a tile peeling detector in which the at least one vibration sensor is fixed near the center of the base portion in a planar view, and the multiple vibration receiving sensors are fixed to the base portion so as to surround the at least one vibration sensor.

7. A system for diagnosing peeling of existing tiles, a tile peeling detector in which at least one vibration sensor that applies vibrations generated from an electric vibration signal to the tile and a plurality of vibration receiving sensors that convert the vibrations received from the tile into received electric vibration signals are arranged at intervals from each other; a vibration input unit that outputs the excitation electric signal, which is a single pulse wave, a single random wave, a repetition of a single pulse wave, or a repetition of a single random wave, to the at least one vibration sensor; an analysis unit that receives and analyzes the received electrical signals from the plurality of vibration receiving sensors, The analysis unit For each of the plurality of vibration receiving sensors, a voltage amplitude value for each frequency component is calculated from the vibration receiving electrical signal; Identifying a maximum amplitude value among the amplitude values ​​of the voltages of the frequency components for each of the plurality of vibration receiving sensors; A tile peeling diagnosis system characterized by diagnosing tile peeling based on a correlation between the maximum amplitude value and tile peeling that is determined in advance, and the maximum amplitude value of each of the multiple vibration sensors.

8. The tile peeling diagnosis system according to claim 7, characterized in that the analysis unit uses the relationship between the maximum amplitude value and a score as an index showing the possibility of tile peeling as the correlation between the maximum amplitude value and tile peeling, scores the maximum amplitude value of each of the plurality of vibration receiving sensors based on the relationship, and diagnoses tile peeling based on the score.

9. The tile peeling diagnosis system according to claim 8, characterized in that the analysis unit sums up the scores obtained when the maximum amplitude values ​​of each of the multiple vibration sensors are scored, and diagnoses the peeling of the tile based on the summed scores.

Images