Wafer processing device and semiconductor chip manufacturing method

Abstract

A wafer processing apparatus (100) according to the present invention is provided with: a wafer container unit (202) in which a wafer structure (W) is contained; a dicing unit (1) which dices a wafer (W1) of the wafer structure supplied from the wafer container unit; and wafer conveyance units (203, 204) which convey the wafer structure between the wafer container unit and the dicing unit. The wafer conveyance units comprise a reverse mechanism (204d) which reverses the posture of the wafer structure.

Description

[Technical Field]

[0001] The present invention relates to a wafer processing apparatus. and How semiconductor chips are manufactured By law In particular, a wafer processing apparatus for processing a wafer on which a plurality of semiconductor chips are formed. and How semiconductor chips are manufactured By law Regarding. [Background technology]

[0002] 2. Description of the Related Art Conventionally, wafer processing apparatuses for processing wafers on which a plurality of semiconductor chips are formed are known. Such wafer processing apparatuses are disclosed, for example, in Japanese Patent No. 6904368.

[0003] The above-mentioned Japanese Patent Publication No. 6904368 discloses a wafer processing apparatus for processing a wafer on which a plurality of integrated circuit chips are formed. This wafer processing apparatus performs dicing on the wafer. Specifically, after the wafer is turned over, dicing is performed on the back side of the wafer. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6904368 Summary of the Invention [Problem to be solved by the invention]

[0005] Although not explicitly stated in the above-mentioned Japanese Patent No. 6904368, it is believed that the wafer processing apparatus described in the above-mentioned Japanese Patent No. 6904368 is provided with an inversion mechanism for inverting the wafer. However, if an inversion mechanism is provided separately and independently, there is a problem in that the structure becomes complicated.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a wafer processing apparatus that can invert a wafer structure using an inversion mechanism while suppressing the complexity of the structure. and How semiconductor chips are manufactured The law The purpose is to provide. [Means for solving the problem]

[0007] In order to achieve the above object, a wafer processing apparatus according to a first aspect of the present invention includes a wafer storage unit that stores a wafer structure including a wafer on which a plurality of semiconductor chips are formed and a sheet member to which the wafer is attached, a dicing unit that performs dicing on the wafer of the wafer structure supplied from the wafer storage unit to divide it into individual semiconductor chips, and a wafer transport unit that transports the wafer structure between the wafer storage unit and the dicing unit, and the wafer transport unit includes an inversion mechanism that inverts the attitude of the wafer structure. The wafer transport unit includes a conveyor unit that removes the wafer structure from the wafer storage unit and transports the removed wafer structure, and the reversing mechanism is provided as a part of the conveyor unit. .

[0008] In the wafer processing apparatus according to the first aspect of the present invention, as described above, the wafer transport unit is configured to include an inversion mechanism that inverts the posture of the wafer structure. This allows the inversion mechanism to be provided by effectively utilizing the wafer transport unit, eliminating the need to provide a separate, independent inversion mechanism. As a result, the structure can be prevented from becoming complicated. Furthermore, the wafer structure can be inverted by the inversion mechanism. As a result, the wafer structure can be inverted by the inversion mechanism while preventing the structure from becoming complicated.

[0009] In the wafer processing apparatus according to the first aspect, ,cormorantThe wafer transport unit includes a conveyor unit that removes the wafer structure from the wafer storage unit and transports the removed wafer structure, and the inversion mechanism is provided as part of the conveyor unit. This configuration effectively utilizes the conveyor unit that removes the wafer structure from the wafer storage unit to provide the inversion mechanism as part of the conveyor unit, thereby reducing the complexity of the structure compared to when the inversion mechanism is provided separately and independently. Furthermore, since the orientation of the wafer structure can be inverted while being transported by the conveyor unit, no loss of wafer structure transport occurs (the transport path does not become longer). As a result, even when the orientation of the wafer structure is inverted, an increase in cycle time can be suppressed.

[0010] In this case, the conveyor preferably has a rail portion that supports the wafer structure removed from the wafer storage portion from below, and the reversing mechanism is provided as part of the rail portion. With this configuration, the rail portion of the conveyor can be effectively used to provide the reversing mechanism as part of the conveyor, making it easy to prevent the structure from becoming complicated.

[0011] In the above-described configuration in which the inversion mechanism is provided as part of the rail portion, preferably, a pair of rail portions are provided at a predetermined interval, the inversion mechanism is provided as part of one of the pair of rail portions, and the other of the pair of rail portions is configured to retract when the inversion mechanism inverts the position of the wafer structure. With this configuration, since the inversion mechanism is provided as part of one of the pair of rail portions, the structure can be made less complex than when the inversion mechanism is provided as part of both of the pair of rail portions. Furthermore, since the other of the pair of rail portions retracts when the inversion mechanism inverts the position of the wafer structure, interference between the other of the pair of rail portions and the wafer structure can be avoided, and the position of the wafer structure can be easily inverted by the inversion mechanism. As a result, the position of the wafer structure can be easily inverted by the inversion mechanism while preventing the structure from becoming complicated.

[0012] In this case, preferably, the other of the pair of rail portions is configured to rotate about a rotation axis extending along the direction in which the rail portions extend, thereby moving between an initial position in which the wafer structure is supported from below and a retracted position spaced apart from the wafer structure. With this configuration, the other of the pair of rail portions can be retracted from the initial position to the retracted position with a simple configuration that simply rotates the other of the pair of rail portions. Here, when the other of the pair of rail portions is retracted from the initial position to the retracted position, a portion of the wafer structure that is no longer supported from below by the other of the pair of rail portions may bend slightly downward. In response to this, by rotating the other of the pair of rail portions to return the other of the pair of rail portions from the retracted position to the initial position, even if the portion of the wafer structure that is no longer supported from below by the other of the pair of rail portions is bent slightly downward, the retracted portion of the wafer structure can be easily returned to the initial position while lifting up the bent portion.

[0013] In the configuration in which the inversion mechanism is provided as part of the rail portion, preferably the inversion mechanism is provided as part of the rail portion, has a holding portion that holds the wafer structure, and is configured to invert the attitude of the wafer structure by rotating the holding portion while the wafer structure is held by the holding portion. With this configuration, the holding portion can be provided by effectively utilizing the rail portion that supports the wafer structure from below, thereby preventing the structure from becoming complicated and allowing the wafer structure to be easily held by the holding portion.

[0014] In the configuration in which the inversion mechanism is provided as part of one of the pair of rails, preferably, the wafer storage section accommodates a wafer structure having a ring-shaped member surrounding the wafer, and the inversion mechanism is provided as part of one of the pair of rails and has a clamping section that clamps the end of the ring-shaped member of the wafer structure in the vertical direction, and is configured to invert the orientation of the wafer structure by rotating the clamping section while the end of the ring-shaped member of the wafer structure is clamped by the clamping section. This configuration allows the clamping section to be provided by effectively utilizing one of the pair of rails that support the wafer structure from below, thereby preventing the structure from becoming complicated. Furthermore, by clamping the end of the ring-shaped member of the wafer structure by the clamping section, the wafer structure can be reliably held, allowing the orientation of the wafer structure to be stably inverted.

[0015] In the configuration in which the inversion mechanism is provided as part of the conveyor, it is preferable that the inversion mechanism be able to switch between a setting in which the orientation of the wafer structure is inverted and a setting in which the orientation of the wafer structure is not inverted based on information regarding the laser processing of the wafer. With this configuration, it is possible to switch between laser processing from the circuit side of the wafer and laser processing from the side opposite to the circuit side of the wafer depending on the wafer to be processed. As a result, the degree of freedom in processing the wafer can be improved.

[0016] A method for manufacturing semiconductor chips according to a second aspect of the present invention includes a step of dicing, by a dicing unit, a wafer of a wafer structure supplied from a wafer accommodation unit that accommodates a wafer structure including a wafer on which a plurality of semiconductor chips are formed and a sheet member to which the wafer is attached, to divide the wafer into individual semiconductor chips, and a step of transporting the wafer structure between the wafer accommodation unit and the dicing unit by a wafer transport unit, the wafer transport unit including an inversion mechanism that inverts the attitude of the wafer structure. The wafer transport unit includes a conveyor unit that removes the wafer structure from the wafer storage unit and transports the removed wafer structure, and the reversing mechanism is provided as a part of the conveyor unit. .

[0017] In the semiconductor chip manufacturing method according to the second aspect of the present invention, as described above, the wafer transport unit is configured to include an inversion mechanism that inverts the orientation of the wafer structure. This allows the inversion mechanism to be provided by effectively utilizing the wafer transport unit, eliminating the need for a separate, independent inversion mechanism. As a result, the structure can be prevented from becoming complicated. Furthermore, the wafer structure can be inverted by the inversion mechanism. As a result, a semiconductor chip manufacturing method can be provided that allows the wafer structure to be inverted by the inversion mechanism while preventing the structure from becoming complicated. [Effects of the Invention]

[0018] According to the present invention, as described above, the wafer structure can be inverted by the inversion mechanism while preventing the structure from becoming complicated. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a plan view showing a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a first reference example. [Figure 2] 1 is a plan view showing a wafer ring structure processed in a semiconductor wafer processing apparatus according to a first reference example. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4] FIG. 10 is a plan view of a dicing device disposed adjacent to an expanding device according to a first reference example. [Figure 5] 10 is a side view of a dicing device arranged adjacent to an expanding device according to a first reference example, as viewed from the Y2 direction side. FIG. [Figure 6] FIG. 1 is a plan view of an expanding device according to a first reference example. [Figure 7] FIG. 10 is a side view of the expanding device according to the first reference example, as viewed from the Y2 direction side. [Figure 8] FIG. 10 is a side view of the expanding device according to the first reference example, as viewed from the X1 direction side. [Figure 9]FIG. 1 is a block diagram showing a control configuration of a semiconductor wafer processing apparatus according to a first reference example. [Figure 10] 10 is a flowchart of the first half of a semiconductor chip manufacturing process by the semiconductor wafer processing apparatus according to the first reference example. [Figure 11] 10 is a flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the first reference example. [Figure 12] FIG. 10 is a view for explaining wafer reversal according to the first reference example. [Figure 13] FIG. 10 is a plan view showing a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a second reference example. [Figure 14] 10 is a side view of a semiconductor wafer processing apparatus provided with a dicing device and an expanding device according to a second reference example, as viewed from the Y2 direction. FIG. [Figure 15] 10 is a side view of a semiconductor wafer processing apparatus provided with a dicing device and an expanding device according to a second reference example, as viewed from the X1 direction. FIG. [Figure 16] FIG. 10 is a block diagram showing a control configuration of a semiconductor wafer processing apparatus according to a second reference example. [Figure 17] 10 is a flowchart of the first half of a semiconductor chip manufacturing process by a semiconductor wafer processing apparatus according to a second reference example. [Figure 18] 10 is a flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the second reference example. [Figure 19] FIG. 10 is a plan view showing a semiconductor wafer processing apparatus according to a third reference example. [Figure 20] FIG. 11 is a plan view showing a wafer structure to be processed in a semiconductor wafer processing apparatus according to a third reference example. [Figure 21] FIG. 21 is a cross-sectional view taken along line XXI-XXI in FIG. 20. [Figure 22] FIG. 11 is a side view of the cassette unit and temporary placement unit according to the third reference example, as viewed from the Y2 direction side. [Figure 23] FIG. 10 is a diagram (1) for explaining wafer reversal according to the third reference example. [Figure 24] FIG. 10 is a diagram (2) for explaining wafer reversal according to the third reference example. [Figure 25] 10A and 10B are diagrams for explaining imaging of a wafer according to a third reference example. [Figure 26] FIG. 10 is a plan view showing a semiconductor wafer processing apparatus according to a fourth reference example. [Figure 27] FIG. 11 is a side view of an expanding device according to a fourth reference example, as viewed from the Y2 direction side. [Figure 28] FIG. 10 is a view for explaining wafer reversal according to a fourth reference example. [Figure 29] FIG. 11 is a plan view showing a semiconductor wafer processing apparatus according to a modified example of the fourth reference example. [Figure 30] FIG. 13 is a view for explaining wafer reversal according to a modified example of the fourth reference example. [Figure 31] 1 is a plan view showing a semiconductor wafer processing apparatus according to an embodiment; [Figure 32] FIG. 2 is a plan view showing a reversing mechanism and a rail portion according to the embodiment. [Figure 33] FIG. 1 is a diagram (1) for explaining wafer reversal according to an embodiment. [Figure 34] FIG. 10 is a diagram (2) for explaining wafer reversal according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0020] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0021] [1st Reference example ] Referring to Figures 1 to 12 , th 1 Reference example The configuration of the semiconductor wafer processing apparatus 100 will be described. 。

[0022] (Semiconductor wafer processing equipment) As shown in Fig. 1, the semiconductor wafer processing apparatus 100 is an apparatus for processing a wafer W1 mounted on a wafer ring structure W. The semiconductor wafer processing apparatus 100 is configured to form a modified layer on the wafer W1 and to divide the wafer W1 along the modified layer to form a plurality of semiconductor chips Ch (see Fig. 8). The wafer ring structure W is an example of a "wafer structure" in the claims.

[0023] 2 and 3, the wafer ring structure W will be described. The wafer ring structure W includes a wafer W1, a sheet member W2, and a ring-shaped member W3.

[0024] The wafer W1 is a circular thin plate made of crystals of a semiconductor material that is the material for semiconductor integrated circuits. A modified layer is formed inside the wafer W1 along the dividing line by processing in the semiconductor wafer processing device 100. In other words, the wafer W1 is processed so that it can be divided along the dividing line. The sheet member W2 is an elastic adhesive tape. An adhesive layer is provided on the upper surface W21 of the sheet member W2. The wafer W1 is attached to the adhesive layer of the sheet member W2. The ring-shaped member W3 is a metal frame that is ring-shaped in a plan view. The ring-shaped member W3 is attached to the adhesive layer of the sheet member W2 while surrounding the wafer W1. The wafer W1 also has a circuit layer W11. The first Reference example In this example, the wafer W1 is placed on the sheet member W2 so that the circuit layer W11 is placed on the side opposite to the sheet member W2.

[0025] The semiconductor wafer processing apparatus 100 is equipped with a dicing apparatus 1 and an expanding apparatus 2. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 2 are aligned is the X direction, the X1 direction is the expanding apparatus 2 side of the X direction, and the X2 direction is the dicing apparatus 1 side of the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction. 。

[0026] (dicing equipment) As shown in FIGS. 1, 4, and 5, the dicing apparatus 1 is configured to perform dicing on a wafer W1, which is supplied from a cassette unit 202 (described later) and on which a plurality of semiconductor chips Ch are formed, to divide the wafer W1 into a plurality of semiconductor chips Ch. The dicing apparatus 1 is configured to form a modified layer by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along dividing lines (streets). The modified layer refers to cracks, voids, and the like formed inside the wafer W1 by the laser. The method of forming a modified layer on the wafer W1 in this manner is called dicing.

[0027] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0028] The base 11 is a base on which the chuck table 12 is placed. The base 11 has a rectangular shape in a plan view.

[0029] <Chuck table section> The chuck table 12 includes a suction unit 12a, a clamp unit 12b, a rotation mechanism 12c, and a table movement mechanism 12d. The suction unit 12a is configured to suction the wafer ring structure W onto its upper surface on the Z1 side. The suction unit 12a is a table provided with suction holes and suction lines for suctioning the lower surface of the ring-shaped member W3 of the wafer ring structure W on the Z2 side. The suction unit 12a is supported by the table movement mechanism 12d via the rotation mechanism 12c. The clamp unit 12b is provided at the upper end of the suction unit 12a. The clamp unit 12b is configured to hold the wafer ring structure W held by the suction unit 12a. The clamp unit 12b holds the ring-shaped member W3 of the wafer ring structure W held by the suction unit 12a from the Z1 side. In this manner, the wafer ring structure W is gripped by the suction unit 12a and the clamp unit 12b.

[0030] The rotation mechanism 12c is configured to rotate the suction unit 12a in the circumferential direction around a rotation center axis C extending parallel to the Z direction. The rotation mechanism 12c is attached to the upper end of the table movement mechanism 12d. The table movement mechanism 12d is configured to move the wafer ring structure W in the X direction and the Y direction. The table movement mechanism 12d has an X-direction movement mechanism 121 and a Y-direction movement mechanism 122. The X-direction movement mechanism 121 is configured to move the rotation mechanism 12c in the X1 direction or the X2 direction. The X-direction movement mechanism 121 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Y-direction movement mechanism 122 is configured to move the rotation mechanism 12c in the Y1 direction or the Y2 direction. The Y-direction movement mechanism 122 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0031] <Laser section> The laser unit 13 is configured to irradiate a wafer W1 of the wafer ring structure W held by the chuck table 12 with laser light. The laser unit 13 is disposed on the Z1 side of the chuck table 12. The laser unit 13 includes a laser irradiation unit 13a, a mounting member 13b, and a Z-direction movement mechanism 13c. The laser irradiation unit 13a is configured to irradiate a pulsed laser light. The mounting member 13b is a frame to which the laser unit 13 and the imaging unit 14 are attached. The Z-direction movement mechanism 13c is configured to move the laser unit 13 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 13c includes, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. Note that the laser irradiation unit 13a may be a laser irradiation unit that oscillates a continuous-wave laser light as the laser light, other than a pulsed laser light, as long as it can form a modified layer through multiphoton absorption.

[0032] <Imaging unit> The imaging unit 14 is configured to capture an image of the wafer W1 of the wafer ring structure W held by the chuck table 12. The imaging unit 14 is disposed on the Z1 direction side of the chuck table 12. The imaging unit 14 has a high-resolution camera 14a, a wide-angle camera 14b, a Z-direction movement mechanism 14c, and a Z-direction movement mechanism 14d.

[0033] The high-resolution camera 14a and the wide-angle camera 14b are near-infrared imaging cameras. The high-resolution camera 14a has a narrower viewing angle than the wide-angle camera 14b. The high-resolution camera 14a has higher resolution than the wide-angle camera 14b. The wide-angle camera 14b has a wider viewing angle than the high-resolution camera 14a. The wide-angle camera 14b has lower resolution than the high-resolution camera 14a. The high-resolution camera 14a is arranged on the X1 direction side of the laser irradiation unit 13a. The wide-angle camera 14b is arranged on the X2 direction side of the laser irradiation unit 13a. In this way, the high-resolution camera 14a, the laser irradiation unit 13a, and the wide-angle camera 14b are arranged adjacent to each other in this order from the X1 direction side to the X2 direction side.

[0034] The Z-direction movement mechanism 14c is configured to move the high-resolution camera 14a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 14d is configured to move the wide-angle camera 14b in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14d has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0035] (Expanding device) As shown in FIGS. 1, 6, and 7, the expanding device 2 is configured to divide the wafer W1 to form a plurality of semiconductor chips Ch (see FIG. 8). The expanding device 2 is also configured to form sufficient gaps between the plurality of semiconductor chips Ch. Here, a modified layer is formed on the wafer W1 by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets) in the dicing device 1. In the expanding device 2, the wafer W1 is divided along the modified layer that was previously formed in the dicing device 1, thereby forming a plurality of semiconductor chips Ch.

[0036] Therefore, in the expanding device 2, the wafer W1 is divided along the modified layer by expanding the sheet member W2. In addition, in the expanding device 2, the sheet member W2 is expanded, and thus the gaps between the plurality of semiconductor chips Ch formed by division are widened.

[0037] The expanding device 2 includes an expanding main body section 200, a base 201, a cassette section 202, a lift-up hand section 203, and a suction hand section 204. The expanding main body section 200 is configured to perform expansion on a sheet member W2 to which a wafer W1 (having a modified layer formed thereon) that has been diced by the dicing device 1 is attached. The expanding main body section 200 includes a base 205, a cold air supply section 206, a cooling unit 207, an expanding section 208, a base 209, an expansion maintaining member 210, a heat shrink section 211, an ultraviolet ray irradiation section 212, a squeegee section 213, and a clamp section 214. 。

[0038] <base> The base 201 is a base on which the cassette unit 202 and the lift-up hand unit 203 are installed. The base 201 has a rectangular shape in a plan view.

[0039] <Cassette section> The cassette unit 202 is configured to be able to accommodate a plurality of wafer ring structures W. Reference example In the figure, the wafer ring structure W is accommodated in the cassette unit 202 so that the sheet member W2 is on the upper side, the wafer W1 is on the lower side, and the circuit layer W11 is on the lower side. The cassette unit 202 includes a wafer cassette 202a, a Z-direction movement mechanism 202b, and a pair of mounting units 202c.

[0040] A plurality of (three) wafer cassettes 202a are arranged in the Z direction. Each wafer cassette 202a has a storage space capable of storing a plurality of (five) wafer ring structures W. The wafer ring structures W are manually supplied and placed in the wafer cassette 202a. The wafer cassette 202a may store one to four wafer ring structures W, or may store six or more wafer ring structures W. One, two, or four or more wafer cassettes 202a may be arranged in the Z direction.

[0041] The Z-direction movement mechanism 202b is configured to move the wafer cassette 202a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 202b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 202b also has a mounting table 202d that supports the wafer cassette 202a from below. Multiple mounting tables 202d (three in total) are arranged to match the positions of the multiple wafer cassettes 202a.

[0042] A plurality (five) of pairs of mounting portions 202c are arranged inside the wafer cassette 202a. The ring-shaped member W3 of the wafer ring structure W is placed on the pair of mounting portions 202c from the Z1 direction side. One of the pair of mounting portions 202c protrudes in the X2 direction from the inner surface of the wafer cassette 202a on the X1 direction side. The other of the pair of mounting portions 202c protrudes in the X1 direction from the inner surface of the wafer cassette 202a on the X2 direction side.

[0043] <Lift-up hand part> The lift-up hand section 203 is configured to be able to take out the wafer ring structure W from the cassette section 202. The lift-up hand section 203 is also configured to be able to store the wafer ring structure W in the cassette section 202.

[0044] Specifically, the lift-up hand unit 203 includes a Y-direction movement mechanism 203a and a lift-up hand 203b. The Y-direction movement mechanism 203a has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The lift-up hand 203b is configured to support the ring-shaped member W3 of the wafer ring structure W from the Z2 direction side.

[0045] <Suction hand section> The suction hand portion 204 is configured to suck the ring-shaped member W3 of the wafer ring structure W from the Z1 direction side.

[0046] Specifically, the suction hand unit 204 includes an X-direction movement mechanism 204a, a Z-direction movement mechanism 204b, and a suction hand 204c. The X-direction movement mechanism 204a is configured to move the suction hand 204c in the X direction. The Z-direction movement mechanism 204b is configured to move the suction hand 204c in the Z direction. The X-direction movement mechanism 204a and the Z-direction movement mechanism 204b each have a drive unit including, for example, a linear conveyor module or a ball screw and a motor with an encoder. The suction hand 204c is configured to suck and support the ring-shaped member W3 of the wafer ring structure W from the Z1 direction. Here, the suction hand 204c supports the ring-shaped member W3 of the wafer ring structure W by generating a negative pressure. The suction hand 204c is provided with suction holes and the like to suck and support the wafer ring structure W by negative pressure. The lift-up hand unit 203 and the suction hand unit 204 constitute a wafer transport unit, which is configured to transport the wafer ring structure W between the cassette unit 202, the dicing device 1, and the expander main body unit 200. Reference example , the wafer transfer section includes a lift-up hand section 203 that removes the wafer ring structure W from the cassette section 202, and a suction hand section 204 that transfers the removed wafer ring structure W.

[0047] <base> 7 and 8, the base 205 is a base on which the expanding section 208, the cooling unit 207, the ultraviolet irradiation section 212, and the squeegee section 213 are mounted. The base 205 has a rectangular shape in a plan view. In FIG. 8, the clamp section 214, which is positioned in the Z1 direction of the cooling unit 207, is indicated by a dotted line.

[0048] <Cold air supply section> The cold air supply unit 206 is configured to cool the sheet member W2 when expanding the sheet member W2. The cold air supply unit 206 is configured to supply cold air to the sheet member W2 from the Z1 direction side when expanding the sheet member W2 by the expanding unit 208.

[0049] Specifically, the cold air supply unit 206 has a supply unit main body 206a, a cold air supply port 206b, and a movement mechanism 206c. The cold air supply port 206b is configured to allow cold air supplied from the cold air supply device to flow out. The cold air supply port 206b is provided at the end of the supply unit main body 206a on the Z2 direction side. The cold air supply port 206b is located in the center of the end of the supply unit main body 206a on the Z2 direction side. The movement mechanism 206c has, for example, a linear conveyor module or a motor with a ball screw and an encoder.

[0050] The cold air supply device is a device for generating cold air. The cold air supply device supplies air cooled by, for example, a heat pump. Such a cold air supply device is installed on base 205. Cold air supply unit 206 and the cold air supply device are connected by a hose (not shown).

[0051] <Cooling unit> The cooling unit 207 is configured to cool the sheet member W2 from the Z2 direction side.

[0052] Specifically, the cooling unit 207 includes a cooling member 207a having a cooling body 271 and a Peltier element 272, and a Z-direction movement mechanism 207b. The cooling body 271 is made of a material with a large heat capacity and high thermal conductivity. The cooling body 271 is made of a metal such as aluminum. The Peltier element 272 is configured to cool the cooling body 271. Note that the cooling body 271 is not limited to aluminum, and may be made of another material with a large heat capacity and high thermal conductivity. The Z-direction movement mechanism 207b is a cylinder.

[0053] The cooling unit 207 is configured to be movable in the Z1 direction or the Z2 direction by a Z-direction movement mechanism 207b, which allows the cooling unit 207 to move to a position where it contacts the sheet member W2 and a position away from the sheet member W2.

[0054] <Expanding section> The expanding section 208 is configured to expand the sheet member W2 of the wafer ring structure W, thereby dividing the wafer W1 along the dividing lines.

[0055] Specifically, the expanding section 208 has an expanding ring 281. The expanding ring 281 is configured to support the sheet member W2 from the Z2 direction side, thereby expanding (expanding) the sheet member W2. The expanding ring 281 has a ring shape in a plan view. The structure of the expanding ring 281 will be described in detail later.

[0056] <base> The base 209 is a base material on which the cold air supply unit 206, the expansion and retention member 210 and the heat shrink unit 211 are mounted.

[0057] <Expansion maintenance member> As shown in FIGS. 7 and 8, the expansion maintaining member 210 is configured to press the sheet member W2 from the Z1 direction side so that the sheet member W2 near the wafer W1 does not shrink due to heating by the heating ring 211a.

[0058] Specifically, the expansion-retaining member 210 includes a pressure ring portion 210a, a lid portion 210b, and an intake portion 210c. The pressure ring portion 210a has a ring shape in a plan view. The lid portion 210b is attached to the pressure ring portion 210a so as to close the opening of the pressure ring portion 210a. The intake portion 210c is an intake ring having a ring shape in a plan view. Multiple intake ports are formed on the underside of the intake portion 210c on the Z2 direction side. The pressure ring portion 210a is configured to move in the Z direction by a Z-direction movement mechanism 210d. That is, the Z-direction movement mechanism 210d is configured to move the pressure ring portion 210a to a position where it presses the sheet member W2 and to a position away from the sheet member W2. The Z-direction movement mechanism 210d includes, for example, a linear conveyor module or a drive unit including a ball screw and a motor with an encoder.

[0059] <Heat shrink section> The heat shrink section 211 is configured to shrink the sheet member W2 expanded by the expanding section 208 by heating while maintaining the gaps between the plurality of semiconductor chips Ch.

[0060] The heat shrink unit 211 has a heating ring 211a and a Z-direction movement mechanism 211b. The heating ring 211a has a ring shape in a plan view. The heating ring 211a also has a sheathed heater that heats the sheet member W2. The Z-direction movement mechanism 211b is configured to move the heating ring 211a in the Z direction. The Z-direction movement mechanism 211b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0061] <Ultraviolet irradiation section> The ultraviolet irradiating unit 212 is configured to irradiate the sheet member W2 with ultraviolet rays in order to reduce the adhesive strength of the adhesive layer of the sheet member W2. Specifically, the ultraviolet irradiating unit 212 has an ultraviolet illuminator. The ultraviolet irradiating unit 212 is disposed at the end of the squeegee unit 213 on the Z1 direction side of a pressing unit 213a (described later). The ultraviolet irradiating unit 212 is configured to irradiate the sheet member W2 with ultraviolet rays while moving together with the squeegee unit 213.

[0062] <Squeegee Section> The squeegee unit 213 is configured to expand the sheet member W2 and then locally press the wafer W1 from the Z2 direction side to further divide the wafer W1 along the modified layer. Specifically, the squeegee unit 213 has a pressing unit 213a, a Z-direction moving mechanism 213b, an X-direction moving mechanism 213c, and a rotating mechanism 213d.

[0063] The pressing unit 213a is configured to press the wafer W1 from the Z2 direction side via the sheet member W2 while moving using the rotation mechanism 213d and the X-direction movement mechanism 213c, thereby generating bending stress in the wafer W1 and dividing the wafer W1 along the modified layer. When the pressing unit 213a is raised to an elevated position in the Z1 direction by the Z-direction movement mechanism 213b, the wafer W1 is pressed via the sheet member W2. When the pressing unit 213a is lowered to a lower position in the Z2 direction by the Z-direction movement mechanism 213b, the pressing unit 213a no longer presses the wafer W1. The pressing unit 213a is a squeegee.

[0064] The pressing unit 213a is attached to the Z1-direction end of the Z-direction movement mechanism 213b. The Z-direction movement mechanism 213b is configured to move the pressing unit 213a linearly in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 213b is, for example, a cylinder. The Z-direction movement mechanism 213b is attached to the Z1-direction end of the X-direction movement mechanism 213c.

[0065] The X-direction movement mechanism 213c is attached to the end of the rotation mechanism 213d on the Z1 direction side. The X-direction movement mechanism 213c is configured to move the pressing unit 213a linearly in one direction. The X-direction movement mechanism 213c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0066] In the squeegee unit 213, the pressing unit 213a is raised to a raised position by the Z-direction movement mechanism 213b. In the squeegee unit 213, the pressing unit 213a locally presses the wafer W1 from the Z2 direction side via the sheet member W2, while the X-direction movement mechanism 213c moves the pressing unit 213a in the Y direction, thereby dividing the wafer W1. In the squeegee unit 213, the Z-direction movement mechanism 213b lowers the pressing unit 213a to a lowered position. In the squeegee unit 213, after the movement of the pressing unit 213a in the Y direction has finished, the rotation mechanism 213d rotates the pressing unit 213a by 90 degrees.

[0067] In the squeegee unit 213, the pressing unit 213a is raised to an elevated position by the Z-direction movement mechanism 213b. In the squeegee unit 213, after the pressing unit 213a rotates 90 degrees, the pressing unit 213a locally presses the wafer W1 from the Z2 direction side via the sheet member W2, while the pressing unit 213a is moved in the X direction by the X-direction movement mechanism 213c, thereby dividing the wafer W1.

[0068] <Clamp section> The clamp unit 214 is configured to grip the ring-shaped member W3 of the wafer ring structure W. Specifically, the clamp unit 214 has a gripping unit 214a, a Z-direction movement mechanism 214b, and a Y-direction movement mechanism 214c. The gripping unit 214a supports the ring-shaped member W3 from the Z2 direction side and presses the ring-shaped member W3 from the Z1 direction side. In this manner, the ring-shaped member W3 is gripped by the gripping unit 214a. The gripping unit 214a is attached to the Z-direction movement mechanism 214b.

[0069] The Z-direction movement mechanism 214b is configured to move the clamp unit 214 in the Z direction. Specifically, the Z-direction movement mechanism 214b is configured to move the gripper 214a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 214b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 214b is attached to the Y-direction movement mechanism 214c. The Y-direction movement mechanism 214c is configured to move the Z-direction movement mechanism 214b in the Y1 direction or the Y2 direction. The Y-direction movement mechanism 214c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0070] (Control configuration of semiconductor wafer processing equipment) As shown in FIG. 9, the semiconductor wafer processing apparatus 100 includes a first control unit 101, a second control unit 102, a third control unit 103, a fourth control unit 104, a fifth control unit 105, a sixth control unit 106, a seventh control unit 107, an eighth control unit 108, an expansion control calculation unit 109, a handling control calculation unit 110, and a dicing control calculation unit 111.

[0071] The first control unit 101 is configured to control the squeegee unit 213. The first control unit 101 includes a central processing unit (CPU) and a storage unit having a read-only memory (ROM) and a random access memory (RAM). The first control unit 101 may include a hard disk drive (HDD) as the storage unit, in which stored information is retained even after the voltage is cut off. The HDD may be shared by the first control unit 101, the second control unit 102, the third control unit 103, the fourth control unit 104, the fifth control unit 105, the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108.

[0072] The second control unit 102 is configured to control the cool air supply unit 206 and the cooling unit 207. The second control unit 102 includes a CPU and a storage unit having a ROM, RAM, etc. The third control unit 103 is configured to control the heat shrink unit 211 and the ultraviolet ray irradiation unit 212. The third control unit 103 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the second control unit 102 and the third control unit 103 may include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0073] The fourth control unit 104 is configured to control the cassette unit 202 and the lift-up hand unit 203. The fourth control unit 104 includes a CPU and a storage unit having a ROM, RAM, etc. The fifth control unit 105 is configured to control the suction hand unit 204. The fifth control unit 105 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the fourth control unit 104 and the fifth control unit 105 may include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0074] The sixth control unit 106 is configured to control the chuck table unit 12. The sixth control unit 106 includes a CPU and a storage unit having a ROM, RAM, etc. The seventh control unit 107 is configured to control the laser unit 13. The seventh control unit 107 includes a CPU and a storage unit having a ROM, RAM, etc. The eighth control unit 108 is configured to control the imaging unit 14. The eighth control unit 108 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108 may each include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0075] The expansion control calculation unit 109 is configured to perform calculations related to the expansion process of the sheet member W2 based on the processing results of the first control unit 101, the second control unit 102, and the third control unit 103. The expansion control calculation unit 109 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0076] The handling control calculation unit 110 is configured to perform calculations related to the movement process of the wafer ring structure W based on the processing results of the fourth control unit 104 and the fifth control unit 105. The handling control calculation unit 110 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0077] The dicing control calculation unit 111 is configured to perform calculations related to the dicing process of the wafer W1 based on the processing results of the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108. The dicing control calculation unit 111 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0078] The storage unit 112 stores programs for operating the dicing device 1 and the expanding device 2. The storage unit 112 includes a ROM, a RAM, an HDD, and the like.

[0079] (Semiconductor chip manufacturing process) The overall operation of the semiconductor wafer processing apparatus 100 will be described below with reference to FIGS.

[0080] In step S1, the wafer ring structure W is removed from the cassette unit 202. That is, after the wafer ring structure W accommodated in the cassette unit 202 is supported by the lift-up hand 203b, the lift-up hand 203b is moved in the Y1 direction by the Y-direction movement mechanism 203a, thereby removing the wafer ring structure W from the cassette unit 202. In step S2, the wafer ring structure W is transferred to the chuck table unit 12 of the dicing apparatus 1 by the suction hand 204c. That is, the wafer ring structure W removed from the cassette unit 202 is moved in the X2 direction by the X-direction movement mechanism 204a while being sucked by the suction hand 204c. Then, the wafer ring structure W moved in the X2 direction is transferred from the suction hand 204c to the chuck table unit 12, and then gripped by the chuck table unit 12.

[0081] In step S3, a modified layer is formed on the wafer W1 by the laser unit 13. In step S4, the wafer ring structure W having the wafer W1 on which the modified layer has been formed is transferred to the clamp unit 214 by the suction hand 204c. In step S5, the sheet member W2 is cooled by the cold air supply unit 206 and the cooling unit 207. That is, the wafer ring structure W held by the clamp unit 214 is moved (lowered) in the Z2 direction by the Z-direction movement mechanism 214b so as to contact the cooling unit 207, and cold air is supplied from the Z1 direction by the cold air supply unit 206, thereby cooling the sheet member W2.

[0082] In step S6, the wafer ring structure W is moved to the expanding unit 208 by the clamping unit 214. That is, the wafer ring structure W, from which the sheet member W2 has been cooled, is moved in the Y1 direction by the Y-direction moving mechanism 214c while being held by the clamping unit 214. In step S7, the sheet member W2 is expanded by the expanding unit 208. That is, the wafer ring structure W is moved in the Z2 direction by the Z-direction moving mechanism 214b while being held by the clamping unit 214. Then, the sheet member W2 comes into contact with the expanding ring 281 and is expanded by being pulled by the expanding ring 281. As a result, the wafer W1 is divided along the dividing lines (modified layers).

[0083] In step S8, the sheet member W2 in the expanded state is pressed from the Z1 direction side by the expansion maintaining member 210. That is, the pressing ring portion 210a is moved (lowered) in the Z2 direction by the Z direction moving mechanism 210d until it abuts against the sheet member W2. Then, the process proceeds from point A in FIG. 10 via point A in FIG. 11 to step S9.

[0084] 11, in step S9, after the sheet member W2 is pressed by the expansion maintaining member 210, ultraviolet rays are irradiated onto the sheet member W2 by the ultraviolet irradiating unit 212 while the wafer W1 is pressed by the squeegee unit 213. As a result, the wafer W1 is further divided by the squeegee unit 213. In addition, the adhesive strength of the sheet member W2 is reduced by the ultraviolet rays irradiated from the ultraviolet irradiating unit 212.

[0085] In step S10, the sheet material W2 is heated and shrunk by the heat shrink unit 211, while the clamp unit 214 is raised. At this time, the intake unit 210c sucks in air near the heated sheet material W2. In step S11, the wafer ring structure W is transferred from the clamp unit 214 to the suction hand 204c. That is, the wafer ring structure W is moved in the Y2 direction by the Y-direction movement mechanism 214c while being held by the clamp unit 214. Then, at a position on the Z1 direction side of the cooling unit 207, the wafer ring structure W is released from the clamp unit 214 and then sucked by the suction hand 204c.

[0086] In step S12, the wafer ring structure W is transferred to the lift-up hand 203b by the suction hand 204c. In step S13, the wafer ring structure W is accommodated in the cassette unit 202. That is, the wafer ring structure W supported by the lift-up hand 203b is moved in the Y1 direction by the Y-direction movement mechanism 203a, and the wafer ring structure W is accommodated in the cassette unit 202. This completes the processing performed on one wafer ring structure W. Then, the process returns to step S1 from point B in FIG. 11 via point B in FIG. 10.

[0087] (reversal mechanism) Here, the first Reference example 1, 6 and 8, the suction hand unit 204 includes a reversing mechanism 204d that reverses the posture of the wafer ring structure W.

[0088] Furthermore, the method for manufacturing semiconductor chips Ch using this semiconductor wafer processing apparatus 100 includes a step of dicing the wafer W1 of the wafer ring structure W supplied from a cassette unit 202 that stores the wafer ring structure W, the wafer W1 including a wafer W1 on which a plurality of semiconductor chips Ch are formed and a sheet member W2 to which the wafer W1 is attached, using a dicing apparatus 1 to divide the wafer W1 into individual semiconductor chips Ch, and a step of transporting the wafer ring structure W between the cassette unit 202 and the dicing apparatus 1 using a lift-up hand unit 203 and a suction hand unit 204, wherein the suction hand unit 204 includes an inversion mechanism 204d that inverts the posture of the wafer ring structure W.

[0089] Furthermore, the semiconductor chips Ch manufactured by this semiconductor wafer processing apparatus 100 are manufactured by the semiconductor wafer processing apparatus 100, which includes a cassette unit 202 that stores a wafer ring structure W including a wafer W1 on which a plurality of semiconductor chips Ch are formed and a sheet member W2 to which the wafer W1 is attached, a dicing apparatus 1 that performs dicing on the wafer W1 of the wafer ring structure W supplied from the cassette unit 202 to divide it into individual semiconductor chips Ch, and a lift-up hand unit 203 and a suction hand unit 204 that transport the wafer ring structure W between the cassette unit 202 and the dicing apparatus 1, and the suction hand unit 204 is manufactured by the semiconductor wafer processing apparatus 100 that includes an inversion mechanism 204d that inverts the posture of the wafer ring structure W.

[0090] Also, the first Reference example In the first embodiment, the reversing mechanism 204d is provided in the suction hand unit 204. Reference example In the inversion mechanism 204d, the inversion mechanism 204d is configured to invert the orientation of the wafer ring structure W by rotating the suction hand 204c of the suction hand section 204, which has sucked the wafer ring structure W, about a rotation axis Ax extending in the horizontal direction (Y direction). The inversion mechanism 204d has a motor and a rotation shaft portion rotated by the motor. The rotation shaft portion of the inversion mechanism 204d is connected to the suction hand 204c so as to be able to rotate the suction hand 204c about the rotation axis Ax.

[0091] Also, the first Reference example In the example shown in FIG. 1, the suction hand unit 204 is configured to supply the wafer ring structure W to the dicing device 1 without inverting the wafer ring structure W using the inversion mechanism 204d, and then invert the wafer ring structure W using the inversion mechanism 204d and supply it to the expanding main body unit 200. Specifically, the suction hand unit 204 is configured to supply the wafer ring structure W, in which the sheet member W2 is arranged on the upper side and the wafer W1 is arranged on the lower side, to the dicing device 1, and then invert the wafer ring structure W using the inversion mechanism 204d, thereby supplying the wafer ring structure W, in which the sheet member W2 is arranged on the lower side and the wafer W1 is arranged on the upper side, to the expanding main body unit 200.

[0092] Also, the first Reference example In the suction hand unit 204, the reversing mechanism 204d is configured to reverse the wafer ring structure W and deliver it to the cold air supply unit 206. Specifically, the suction hand unit 204 is configured to reverse the wafer ring structure W using the reversing mechanism 204d, and deliver the wafer ring structure W, with the sheet member W2 on the lower side and the wafer W1 on the upper side, to the cold air supply unit 206. The cold air supply unit 206 is configured to generate negative pressure to suck the wafer ring structure W and receive the wafer ring structure W from the suction hand unit 204. The cold air supply unit 206 is provided with suction holes and the like to suck the wafer ring structure W by negative pressure.

[0093] The inversion of the wafer ring structure W will be described with reference to Fig. 12. The operation of the dicing device 1 is controlled by a dicing control calculation unit 111. The operations of the lift-up hand unit 203 and the suction hand unit 204 are controlled by a handling control calculation unit 110. The operation of the expand main body unit 200 is controlled by an expand control calculation unit 109.

[0094] First, the wafer ring structure W in which the sheet member W2 is placed on the upper side and the wafer W1 is placed on the lower side (hereinafter referred to as the wafer ring structure W in the first state) is removed from the cassette unit 202 by the lift-up hand unit 203. Then, as shown in FIG. 12, the wafer ring structure W in the first state is transferred from the lift-up hand unit 203 to the suction hand unit 204. Then, the wafer ring structure W in the first state is supplied to the dicing apparatus 1 by the suction hand unit 204. In the dicing apparatus 1, the wafer ring structure W in the first state is received by the chuck table unit 12.

[0095] Then, the laser unit 13 irradiates the wafer ring structure W in the first state with laser light, thereby forming a modified layer. At this time, the laser unit 13 irradiates the wafer W1 with laser light from the opposite side of the circuit layer W11 via the sheet member W2. Here, when the laser light is irradiated from the circuit layer W11 side where the streets are formed, if the street width is narrow, the width of the laser light may not fit within the street width. However, by irradiating the wafer W1 with laser light from the laser unit 13 from the opposite side of the circuit layer W11 via the sheet member W2, it is possible to prevent the width of the laser light from not fitting within the street width. In this way, the wafer W1 is supplied to the dicing apparatus 1 in an attitude suitable for dicing.

[0096] After dicing, the wafer ring structure W in the first state is transferred from the chuck table 12 to the suction hand unit 204. During transfer from the dicing apparatus 1 to the expander main body 200, the wafer ring structure W in the first state is reversed by the reversing mechanism 204d. The wafer ring structure W in which the sheet member W2 is disposed on the lower side and the wafer W1 is disposed on the upper side (hereinafter referred to as the wafer ring structure W in the second state) is supplied to the expander main body 200 by the suction hand unit 204. In the expander main body 200, the wafer ring structure W in the second state is transferred from the suction hand unit 204 to the cold air supply unit 206. At this time, the upper surface of the ring-shaped member W3 of the wafer ring structure W in the second state is sucked by the cold air supply unit 206. The wafer ring structure W in the second state is then transferred from the cold air supply unit 206 to the clamp unit 214.

[0097] Then, the wafer ring structure W in the second state is cooled by the cold air supply section 206 and the cooling unit 207, expanded by the expanding section 208, irradiated with ultraviolet light by the ultraviolet irradiating section 212, squeegee breaking by the squeegee section 213, and heat shrunk by the heat shrinking section 211. During expansion by the expanding section 208, the wafer ring structure W in the second state, in which the sheet member W2 is placed on the lower side and the wafer W1 is placed on the upper side, is expanded. In this way, the wafer W1 is supplied to the expanding main body section 200 in a position suitable for expansion.

[0098] Then, after performing expansion and the like, the wafer ring structure W in the second state is transferred from the clamp unit 214 to the cold air supply unit 206. Then, the wafer ring structure W in the second state is transferred from the cold air supply unit 206 to the suction hand unit 204. Then, during transfer from the suction hand unit 204 to the lift-up hand unit 203, the wafer ring structure W in the second state is reversed by the reversing mechanism 204d. Then, the wafer ring structure W in the first state, in which the sheet member W2 is placed on the upper side and the wafer W1 is placed on the lower side, is transferred from the suction hand unit 204 to the lift-up hand unit 203. Then, the wafer ring structure W in the first state is stored in the cassette unit 202 by the lift-up hand unit 203.

[0099] The semiconductor wafer processing apparatus 100 is also capable of processing a wafer ring structure W that is not inverted. When the wafer ring structure W is not inverted, the wafer ring structure W is stored in the cassette unit 202 so that the sheet member W2 is on the bottom, the wafer W1 is on the top, and the circuit layer W11 is on the top. In this case, the wafer ring structure W is supplied to the dicing apparatus 1 by the suction hand unit 204 without being inverted. Furthermore, the wafer ring structure W is supplied to the expander main body unit 200 by the suction hand unit 204 without being inverted.

[0100] (1st Reference example effect) No. 1 Reference example Then, the following effects can be obtained:

[0101] No. 1 Reference exampleIn the present embodiment, as described above, the suction hand unit 204 is configured to include an inversion mechanism 204d that inverts the orientation of the wafer ring structure W. This allows the inversion mechanism 204d to be provided by effectively utilizing the suction hand unit 204, eliminating the need to provide a separate, independent inversion mechanism 204d. As a result, the structure can be prevented from becoming complicated. Furthermore, the wafer ring structure W can be inverted by the inversion mechanism 204d. As a result, the wafer ring structure W can be inverted by the inversion mechanism 204d while preventing the structure from becoming complicated.

[0102] Also, the first Reference example As described above, the reversing mechanism 204d is configured to rotate the suction hand 204c of the suction hand section 204, which has sucked the wafer ring structure W, about the rotation axis Ax extending in the horizontal direction, thereby reversing the orientation of the wafer ring structure W. This allows the wafer W1 to be reliably held by suction, so that the wafer W1 can be stably reversed and transported.

[0103] Also, the first Reference exampleAs described above, the semiconductor wafer processing apparatus 100 further includes an expanding main body section 200 that expands the sheet member W2 to which the wafer W1 diced by the dicing apparatus 1 is attached, and the lift-up hand section 203 and the suction hand section 204 are configured to transport the wafer ring structure W between the dicing apparatus 1 and the expanding main body section 200. The cassette section 202 contains a wafer ring structure W having a ring-shaped member W3 surrounding the wafer W1. The suction hand section 204 is configured to supply the wafer ring structure W to the dicing apparatus 1 without inverting it using the inversion mechanism 204d, and then invert the wafer ring structure W using the inversion mechanism 204d and supply it to the expanding main body section 200. Here, in the case of a wafer ring structure W provided with a ring-shaped member W3, the wafer W1 is supplied in a posture suitable for dicing, but if the posture of the wafer W1 suitable for dicing is opposite to the posture of the wafer W1 suitable for expanding, the posture of the wafer W1 suitable for dicing will not match the posture of the wafer W1 suitable for expanding. Therefore, with the above configuration, even in the case of a wafer ring structure W provided with a ring-shaped member W3 in which the posture of the wafer W1 suitable for dicing does not match the posture of the wafer W1 suitable for expanding, the wafer ring structure W can be reversed by the reversing mechanism 204d, allowing dicing and expanding to be performed appropriately.

[0104] Also, the first Reference example As described above, the expander main body 200 includes the cold air supply unit 206 that cools the sheet member W2 when expanding the sheet member W2, and the suction hand unit 204 is configured to invert the wafer ring structure W using the inverting mechanism 204d and transfer it to the cold air supply unit 206. This allows the cold air supply unit 206 to be effectively used to transfer the wafer W1, eliminating the need to provide a wafer W1 receiving unit independent of the cold air supply unit 206. As a result, the structure can be made less complex than when a wafer W1 receiving unit is provided independent of the cold air supply unit 206.

[0105] Also, the first Reference example As described above, the wafer transfer section includes the lift-up hand section 203 that removes the wafer ring structure W from the cassette section 202 and the suction hand section 204 that transports the removed wafer ring structure W, and the reversing mechanism 204d is provided in the suction hand section 204. As a result, since the lift-up hand section 203 and the suction hand section 204 are provided separately, the wafer ring structure W can be easily removed from the cassette section 202 and transported. Furthermore, by providing the reversing mechanism 204d in the suction hand section 204, the wafer ring structure W can be easily reversed by the reversing mechanism 204d.

[0106] [2nd Reference example ] Referring to FIGS. 13 to 18, Reference example The configuration of the semiconductor wafer processing apparatus 300 will be described. Reference example So, the first Reference example Unlike the first embodiment, the squeegee part 3213 is disposed on the outside of the expand ring 3281. Reference example So, the first Reference example Detailed explanations of the same configurations will be omitted. 。

[0107] (Semiconductor wafer processing equipment) As shown in FIGS. 13 and 14, the semiconductor wafer processing apparatus 300 is an apparatus for processing a wafer W1 provided on a wafer ring structure W.

[0108] The semiconductor wafer processing apparatus 300 is equipped with a dicing apparatus 1 and an expanding apparatus 302. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 302 are lined up is the X direction, the X1 direction is the expanding apparatus 302 side of the X direction, and the X2 direction is the dicing apparatus 1 side of the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction.

[0109] (dicing equipment) The dicing device 1 is configured to form a modified layer by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets).

[0110] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0111] (Expanding device) As shown in FIGS. 14 and 15, the expanding apparatus 302 is configured to divide the wafer W1 into a plurality of semiconductor chips Ch.

[0112] The expanding device 302 includes an expanding main body 302a, a base 201, a cassette unit 202, a lift-up hand unit 203, and a suction hand unit 204. The expanding main body 302a is configured to expand a sheet member W2 to which a wafer W1 (having a modified layer formed thereon) that has been diced by the dicing device 1 is attached. The expanding main body 302a includes a base 205, a cold air supply unit 206, a cooling unit 207, an expanding unit 3208, a base 209, an expansion maintaining member 210, a heat shrink unit 211, an ultraviolet ray irradiation unit 212, a squeegee unit 3213, and a clamp unit 214. 。

[0113] <Expanding section> The expanding section 3208 is configured to expand the sheet member W2 of the wafer ring structure W, thereby dividing the wafer W1 along the dividing line.

[0114] Specifically, the expanding section 3208 has an expanding ring 3281 and a Z-direction moving mechanism 3282 .

[0115] The expand ring 3281 is configured to support the sheet member W2 from the Z2 direction side, thereby expanding (expanding) the sheet member W2. The expand ring 3281 has a ring shape in a plan view. The Z-direction movement mechanism 3282 is configured to move the expand ring 3281 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 3282 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 3282 is attached to the base 205.

[0116] <Squeegee Section> The squeegee unit 3213 is configured to expand the sheet member W2 and then press the wafer W1 from the Z2 direction to further divide the wafer W1 along the modified layer. Specifically, the squeegee unit 3213 has a pressing unit 3213a, an X-direction moving mechanism 3213b, a Z-direction moving mechanism 3213c, and a rotating mechanism 3213d.

[0117] The pressing unit 3213a is configured to move in the Z1 direction by the Z-direction moving mechanism 3213c, and then move by the rotating mechanism 3213d and the X-direction moving mechanism 3213b while pressing the wafer W1 from the Z2 direction via the sheet member W2, thereby generating bending stress in the wafer W1 and dividing the wafer W1 along the modified layer. The pressing unit 3213a is a squeegee. The pressing unit 3213a is attached to the Z1 direction end of the rotating mechanism 3213d. The Z-direction moving mechanism 3213c is configured to move the rotating mechanism 3213d in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 3213c has, for example, a cylinder. The Z-direction moving mechanism 3213c is attached to the Z1 direction end of the X-direction moving mechanism 3213b. The X-direction moving mechanism 3213b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The X-direction movement mechanism 3213b is attached to the end of the base 205 on the Z1 direction side.

[0118] In the squeegee unit 3213, after being moved in the Z1 direction by the Z-direction moving mechanism 3213c, the pressing unit 3213a presses the wafer W1 from the Z2 direction side via the sheet member W2, while the X-direction moving mechanism 3213b moves the pressing unit 3213a in the Y direction, thereby dividing the wafer W1. In addition, in the squeegee unit 3213, after the pressing unit 3213a has finished moving in the Y direction, the rotating mechanism 3213d rotates the pressing unit 3213a by 90 degrees. In addition, in the squeegee unit 3213, after being rotated 90 degrees, the X-direction moving mechanism 3213b moves the pressing unit 3213a in the X direction while the pressing unit 3213a presses the wafer W1 from the Z2 direction side via the sheet member W2, thereby dividing the wafer W1.

[0119] Although detailed description is omitted, the suction hand unit 204 includes a reversing mechanism 204d for reversing the posture of the wafer ring structure W. The reversing of the wafer ring structure W by the reversing mechanism 204d is performed in the same manner as in the first embodiment. Reference example is the same as:

[0120] (Control configuration of semiconductor wafer processing equipment) 16, semiconductor wafer processing apparatus 300 includes first control unit 101, second control unit 102, third control unit 103, fourth control unit 3104, fifth control unit 3105, sixth control unit 3106, seventh control unit 3107, eighth control unit 3108, ninth control unit 3109, expansion control calculation unit 3110, handling control calculation unit 3111, dicing control calculation unit 3112, and memory unit 3113. Note that first control unit 101, second control unit 102, third control unit 103, fifth control unit 3105, sixth control unit 3106, seventh control unit 3107, eighth control unit 3108, ninth control unit 3109, expansion control calculation unit 3110, handling control calculation unit 3111, dicing control calculation unit 3112, and memory unit 3113 are respectively included in the first control unit 101, second control unit 102, third control unit 103, fifth control unit 3105, sixth control unit 3106, seventh control unit 3107, eighth control unit 3108, ninth control unit 3109, expansion control calculation unit 3110, handling control calculation unit 3111, dicing control calculation unit 3112, and memory unit 3113. Reference example The first control unit 101, the second control unit 102, the third control unit 103, the fourth control unit 104, the fifth control unit 105, the sixth control unit 106, the seventh control unit 107, the eighth control unit 108, the expansion control calculation unit 109, the handling control calculation unit 110, the dicing control calculation unit 111, and the memory unit 112 have the same configuration as those of the first control unit 101, the second control unit 102, the third control unit 103, the fourth control unit 104, the fifth control unit 105, the sixth control unit 106, the seventh control unit 107, the eighth control unit 108, the expansion control calculation unit 109, the handling control calculation unit 110, the dicing control calculation unit 111, and the memory unit 112, and therefore their explanation will be omitted.

[0121] The fourth control unit 3104 is configured to control the expanding unit 3208. The fourth control unit 3104 includes a CPU and a storage unit having a ROM, a RAM, etc. The fourth control unit 3104 may include, as the storage unit, an HDD or the like that retains stored information even after the voltage is cut off.

[0122] (Semiconductor chip manufacturing process) The overall operation of the semiconductor wafer processing apparatus 300 will now be described with reference to FIGS.

[0123] Steps S1 to S6, step S8, and step S11 are the first steps, respectively. Reference example Since these steps are the same as steps S1 to S6, S8, and S11 in the semiconductor chip manufacturing process described above, their explanations will be omitted.

[0124] In step S307, the sheet member W2 is expanded by the expanding unit 3208. That is, the expanding ring 3281 is moved in the Z1 direction by the Z-direction moving mechanism 3282. The wafer ring structure W is moved in the Z2 direction by the Z-direction moving mechanism 214b while being held by the clamping unit 214. Then, the sheet member W2 comes into contact with the expanding ring 3281 and is pulled by the expanding ring 3281, thereby expanding. As a result, the wafer W1 is divided along the division lines (modified layers).

[0125] 18, in step S309, the heat shrink unit 211 heats and shrinks the sheet member W2, and the ultraviolet irradiation unit 212 irradiates ultraviolet light onto the sheet member W2 while the clamp unit 214 rises. At this time, the air intake unit 210c sucks in air near the heated sheet member W2. In step S310, the clamp unit 214 moves the wafer ring structure W to the squeegee unit 3213. That is, the wafer ring structure W, while held by the clamp unit 214, is moved in the Y2 direction by the Y-direction movement mechanism 214c.

[0126] In step S311, after the wafer ring structure W is moved to the squeegee portion 3213, the wafer W1 is pressed by the squeegee portion 3213. As a result, the wafer W1 is further divided by the squeegee portion 3213. Reference example The other configurations are the same as those in the first embodiment. Reference example The configuration is the same as that of

[0127] (2nd Reference example effect) No. 2 Reference example Then, the following effects can be obtained:

[0128] No. 2 Reference example As described above, the suction hand unit 204 is configured to include a reversing mechanism 204d that reverses the posture of the wafer ring structure W. Reference exampleSimilarly, the wafer ring structure W can be inverted by the inversion mechanism 204d while preventing the structure from becoming complicated. Reference example Other effects of the above are as follows: Reference example The effect is similar to that of

[0129] [Third Reference example ] 19 to 25, the third Reference example The configuration of the semiconductor wafer processing apparatus 400 will be described. Reference example Now, the above 1st and 2nd Reference example Unlike the above, dicing is performed on a wafer structure Wa that does not have a ring-shaped member. Reference example So, the first or second Reference example Detailed explanations of the same configurations will be omitted. 。

[0130] (Semiconductor wafer processing equipment) As shown in FIG. 19, a semiconductor wafer processing apparatus 400 is an apparatus for processing a wafer W1 provided in a wafer structure Wa.

[0131] Here, the wafer structure Wa will be described with reference to Figures 20 and 21. The wafer structure Wa has a wafer W1 and a sheet member W2a, but does not have a ring-shaped member. The sheet member W2a is a member that is formed by bonding the first and second Reference example The sheet member W2a is an adhesive tape for back grinding made of a hard material that does not have elasticity compared to the sheet member W2 for expansion. An adhesive layer is provided on the upper surface of the sheet member W2a. The wafer W1 is attached to the adhesive layer of the sheet member W2a. Reference example In this example, the wafer W1 is placed on the sheet member W2a so that the circuit layer W11 is placed on the sheet member W2a side.

[0132] 19, the semiconductor wafer processing apparatus 400 includes a dicing apparatus 1 and a wafer supply apparatus 403. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the wafer supply apparatus 403 are aligned is the X direction, the X direction is the wafer supply apparatus 403 side of the X direction, and the X2 direction is the dicing apparatus 1 side of the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction.

[0133] (dicing equipment) The dicing device 1 is configured to form a modified layer by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets).

[0134] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0135] (Wafer supply device) As shown in FIGS. 19 and 21, the wafer supply device 403 is configured to supply a wafer W1 (wafer structure Wa).

[0136] The wafer supply device 403 includes a base 201, a cassette unit 202, a lift-up hand unit 503, suction hand units 504 and 505, a temporary placement unit 506, and an imaging unit 507. 。

[0137] <base> The base 201 is a base on which the cassette unit 202 and the lift-up hand unit 503 are installed.

[0138] <Cassette section> The cassette unit 202 is configured to be able to accommodate a plurality of wafer structures Wa. Reference exampleIn the example shown, the wafer structure Wa is accommodated in the cassette unit 202 so that the sheet member W2 is on the upper side, the wafer W1 is on the lower side, and the circuit layer W11 is on the upper side. The wafer structure Wa is accommodated in the cassette unit 202 so that it bends downward. The cassette unit 202 includes a wafer cassette 202a, a Z-direction movement mechanism 202b, and a pair of mounting units 202c.

[0139] <Lift-up hand part> The lift-up hand portion 503 is configured to be able to take out the wafer structure Wa from the cassette portion 202. The lift-up hand portion 503 is also configured to be able to store the wafer structure Wa in the cassette portion 202.

[0140] Specifically, the lift-up hand section 503 includes a Y-direction movement mechanism 503a and a lift-up hand 503b. The Y-direction movement mechanism 503a has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The lift-up hand 503b is configured to generate negative pressure to suck and support the wafer W1 of the wafer structure Wa from the Z2 direction side. The lift-up hand 503b is provided with suction holes and the like to suck the wafer structure Wa by negative pressure. The lift-up hand 503b is I-shaped extending in the Y direction in a plan view.

[0141] <Suction hand section> The suction hand portion 505 is configured to suck the sheet member W2a of the wafer structure Wa from the Z1 direction side.

[0142] Specifically, the suction hand section 505 includes a Z-direction movement mechanism 505a and a suction hand 505b. The Z-direction movement mechanism 505a is configured to move the suction hand 505b in the Z direction. The Z-direction movement mechanism 505a has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The suction hand 505b is configured to generate negative pressure to suck and support the sheet member W2a of the wafer structure Wa from the Z1 direction side. The suction hand 505b is provided with suction holes and the like to suck the wafer structure Wa by negative pressure. The suction hand 505b is circular in plan view.

[0143] The suction hand portion 504 is configured to suck the wafer structure Wa.

[0144] Specifically, the suction hand unit 504 includes an X-direction movement mechanism 504a, a Z-direction movement mechanism 504b, a suction hand 504c, and an inversion mechanism 504d. The X-direction movement mechanism 504a is configured to move the suction hand 504c in the X direction. The Z-direction movement mechanism 504b is configured to move the suction hand 504c in the Z direction. The X-direction movement mechanism 504a and the Z-direction movement mechanism 504b each have a drive unit including, for example, a linear conveyor module or a ball screw and a motor with an encoder. The suction hand 504c is configured to suck and support the wafer structure Wa by generating negative pressure. The suction hand 504c is provided with suction holes or the like for sucking the wafer structure Wa by negative pressure. The suction hand 504c is circular in plan view with a diameter equal to or greater than the wafer structure Wa and is configured to be able to suck and hold substantially the entire wafer structure Wa.

[0145] The lift-up hand unit 503 and the suction hand units 504 and 505 constitute a wafer transfer unit, which is configured to transfer the wafer structure Wa between the cassette unit 202 and the dicing device 1. Reference example, the wafer transfer section includes a lift-up hand section 503 that takes out the wafer structure Wa from the cassette section 202, and suction hand sections 504 and 505 that transfer the taken-out wafer structure Wa.

[0146] Here, the third Reference example In the third embodiment, the suction hand unit 504 includes a reversing mechanism 504d for reversing the posture of the wafer structure Wa. Reference example In the third embodiment, the reversing mechanism 504d is provided in the suction hand unit 504. Reference example In the inversion mechanism 504d, the suction hand 504c of the suction hand section 504, which has sucked the wafer structure Wa, is rotated about a rotation axis Ax extending in the horizontal direction (Y direction), thereby inverting the orientation of the wafer structure Wa. The inversion mechanism 504d has a motor and a rotation shaft portion rotated by the motor. The rotation shaft portion of the inversion mechanism 504d is connected to the suction hand 504c so as to be able to rotate the suction hand 504c about the rotation axis Ax.

[0147] Also, the third Reference example In the third embodiment, the suction hand unit 504 is configured to invert the wafer structure Wa using the inversion mechanism 504d and supply the wafer structure Wa to the dicing apparatus 1. Specifically, the suction hand unit 504 is configured to invert the wafer structure Wa, in which the sheet member W2 is arranged on the upper side and the wafer W1 is arranged on the lower side, using the inversion mechanism 504d, and supply the wafer structure Wa, in which the sheet member W2 is arranged on the lower side and the wafer W1 is arranged on the upper side, to the dicing apparatus 1. Reference example In the suction hand unit 504, the reversing mechanism 504d is configured to reverse the wafer structure Wa and place the wafer structure Wa on the temporary placement unit 506 before supplying it to the dicing apparatus 1.

[0148] <Temporary storage area> The temporary placing unit 506 is a table for temporarily placing the wafer structure Wa before it is supplied to the dicing apparatus 1. The temporary placing unit 506 is provided between the cassette unit 202 and the dicing apparatus 1. The wafer structure Wa that is to be next diced (on which a modified layer is to be formed) is placed on the temporary placing unit 506. The temporary placing unit 506 also has an adsorption surface 506a on its upper surface. The adsorption surface 506a is configured to adsorb and support the wafer structure Wa by generating negative pressure. The adsorption surface 506a is provided with suction holes or the like for adsorbing the wafer structure Wa by negative pressure. The adsorption surface 506a is circular in shape with a diameter equal to or greater than the wafer structure Wa in a plan view, and is configured to be able to adsorb substantially the entire wafer structure Wa.

[0149] <Imaging unit> The imaging unit 507 is a camera that images the wafer W1 of the wafer structure Wa placed in the temporary placement unit 506. Based on the imaging results of the wafer W1 of the wafer structure Wa by the imaging unit 507, it is possible to obtain the misalignment of the wafer W1 in the X and Y directions and the rotational misalignment within the XY plane. Furthermore, after the wafer structure Wa is transferred to the chuck table 12, it is possible to correct the position of the wafer W1 of the wafer structure Wa on the chuck table 12 based on the misalignment of the wafer W1 in the X and Y directions and the rotational misalignment within the XY plane.

[0150] (Flip of wafer structure) 23 and 24, the inversion of the wafer structure Wa will be described.

[0151] First, the lift-up hand 503b of the lift-up hand section 503 is moved in the Y1 direction by the Y-direction movement mechanism 503a and moved into the cassette section 202. Then, the lift-up hand 503b suction-holds the wafer structure Wa in the cassette section 202 from the Z2 direction side. Then, while the lift-up hand 503b suction-holds the wafer structure Wa from the Z2 direction side, it is moved in the Y2 direction by the Y-direction movement mechanism 503a and moved out of the cassette section 202. Then, the wafer structure Wa, in which the sheet member W2a is arranged on the upper side and the wafer W1 is arranged on the lower side (hereinafter referred to as the wafer structure Wa in the first state), is removed from the cassette section 202 by the lift-up hand section 503. Then, as shown in FIG. 23, the suction hand 505b of the suction hand section 505 is moved in the Z2 direction by the Z-direction movement mechanism 505a. Then, the wafer structure Wa in the first state is sucked and supported by the suction hand portion 505, and the suction from the lift-up hand portion 503 is released, so that the wafer structure Wa is transferred from the lift-up hand portion 503 to the suction hand portion 505. Then, the suction hand 505b of the suction hand portion 505 is moved in the Z1 direction by the Z-direction movement mechanism 505a.

[0152] Then, the suction hand 504c of the suction hand section 504 is moved in the X1 direction by the X-direction movement mechanism 504a to a position below the suction hand 505b of the suction hand section 505. At this time, the suction surface of the suction hand 504c of the suction hand section 504 faces the Z1 direction (towards the suction hand 505b). Then, the suction hand 505b of the suction hand section 505 is moved in the Z2 direction by the Z-direction movement mechanism 505a. The wafer structure Wa in the first state is then sucked and supported by the suction hand section 504, and is transferred from the suction hand section 505 to the suction hand section 504 by releasing the suction from the suction hand section 505.

[0153] 24, the wafer structure Wa in the first state is inverted by the inverting mechanism 504d during transport to the dicing apparatus 1. Then, the wafer structure Wa in which the sheet member W2a is placed on the lower side and the wafer W1 is placed on the upper side (hereinafter referred to as the wafer structure Wa in the second state) is supplied to the dicing apparatus 1 by the suction hand unit 504. Specifically, before being supplied to the dicing apparatus 1, the wafer structure Wa in the second state is placed on the suction surface 506a of the temporary placement unit 506 by the suction hand unit 504.

[0154] At this time, the suction hand 504c of the suction hand section 504 is moved in the X2 direction by the X-direction movement mechanism 504a to a position above the suction surface 506a of the temporary holder 506. Then, the suction hand 504c of the suction hand section 504 is moved in the Z2 direction by the Z-direction movement mechanism 504b. Then, the wafer structure Wa in the second state is sucked and supported by the temporary holder 506, and is transferred from the suction hand section 504 to the temporary holder 506 by releasing the suction from the suction hand section 504. Note that in the dicing apparatus 1, dicing (formation of a modified layer) is performed on the wafer structure Wa that was supplied to the dicing apparatus 1 before the wafer structure Wa placed on the temporary holder 506.

[0155] 25, while the wafer W1 of the wafer structure Wa is placed on the temporary placement section 506, the wafer W1 in the second state is imaged by the imaging section 507. Then, based on the imaging results of the wafer W1 by the imaging section 507, the misalignment of the wafer W1 in the X and Y directions and the rotational misalignment within the XY plane are acquired.

[0156] Then, when dicing (formation of a modified layer) for the previous wafer structure Wa is completed, the diced wafer structure Wa is transported from the dicing apparatus 1 to the cassette unit 202. The procedure for transporting the wafer structure Wa from the dicing apparatus 1 to the cassette unit 202 is generally the opposite procedure to the procedure for transporting it from the cassette unit 202 to the dicing apparatus 1.

[0157] That is, the wafer structure Wa in the second state is transferred from the chuck table 12 of the dicing apparatus 1 to the suction hand unit 504. At this time, the suction surface of the suction hand 504c of the suction hand unit 504 faces the Z2 direction (the chuck table 12 side). Then, the suction hand unit 504 is moved in the X1 direction by the X-direction movement mechanism 504a to a position below the suction hand unit 505. During this movement, the wafer structure Wa in the second state is inverted by the inversion mechanism 504d. Then, the wafer structure Wa in the first state, in which the sheet member W2a is placed on the upper side and the wafer W1 is placed on the lower side, is transferred from the suction hand unit 504 to the lift-up hand unit 503 via the suction hand unit 505. Then, the lift-up hand 503b of the lift-up hand unit 503 is moved in the Y1 direction by the Y-direction movement mechanism 503a and moved into the cassette unit 202. Then, the wafer structure Wa in the first state is transferred from the lift-up hand part 503 to the cassette part 202 and accommodated in the cassette part 202.

[0158] Furthermore, after the wafer structure Wa in the first state is transferred from the suction hand section 504 to the suction hand section 505, the suction hand 504c of the suction hand section 504, which is in an empty state and not holding the wafer structure Wa by suction, is moved in the X2 direction by the X-direction movement mechanism 504a to a position above the wafer structure Wa placed on the temporary holder 506. At this time, the suction surface of the suction hand 504c of the suction hand section 504 faces the Z2 direction (toward the temporary holder 506). Then, the suction hand 504c of the suction hand section 504 is moved in the Z2 direction by the Z-direction movement mechanism 504b. Then, the wafer structure Wa in the second state is suctioned and supported by the suction hand section 504, and is transferred from the temporary holder 506 to the suction hand section 504 by releasing suction from the temporary holder 506.

[0159] Then, the suction hand 504c of the suction hand portion 504 is moved in the Z1 direction by the Z-direction movement mechanism 504b, and is moved in the X2 direction by the X-direction movement mechanism 504a, to a position above the chuck table portion 12. Then, the suction hand 504c of the suction hand portion 504 is moved in the Z2 direction by the Z-direction movement mechanism 504b. The wafer structure Wa in the second state is supported by the chuck table portion 12, and is transferred from the suction hand portion 504 to the chuck table portion 12 as suction from the suction hand portion 504 is released.

[0160] Then, the modified layer is formed by irradiating the wafer structure Wa in the second state with laser light from the laser unit 13. At this time, the laser light from the laser unit 13 is irradiated onto the wafer W1 from the side opposite to the circuit layer W11. Reference example Similarly, it is possible to prevent the width of the laser beam from exceeding the width of the street. In this way, the wafer W1 is supplied to the dicing device 1 in a posture suitable for dicing. Reference example The other configurations are the same as those in the first embodiment. Reference example The configuration is the same as that of

[0161] (3rd Reference example effect) Third Reference example Then, the following effects can be obtained:

[0162] Third Reference example In the first embodiment, as described above, the suction hand unit 504 is configured to include a reversing mechanism 504d for reversing the posture of the wafer structure Wa. Reference example Similarly, the wafer structure Wa can be inverted by the inverting mechanism 504d while preventing the structure from becoming complicated.

[0163] Also, the third Reference exampleAs described above, the cassette unit 202 accommodates a wafer structure Wa that does not have a ring-shaped member surrounding the wafer W1, and the wafer W1 transport unit is configured to invert the wafer structure Wa using the inversion mechanism 504d and supply the wafer structure Wa to the dicing apparatus 1. In the case of a wafer structure Wa that does not have a ring-shaped member, the wafer W1 may not be supplied in an orientation suitable for dicing. Therefore, with the above configuration, even in the case of a wafer structure Wa that does not have a ring-shaped member and in which the wafer W1 is not supplied in an orientation suitable for dicing, the wafer structure Wa can be inverted using the inversion mechanism 504d to place the wafer W1 in an orientation suitable for dicing, allowing dicing to be performed appropriately.

[0164] Also, the third Reference example As described above, the semiconductor wafer processing apparatus 400 is provided between the cassette unit 202 and the dicing apparatus 1 and includes a temporary placement unit 506 on which the wafer structure Wa can be placed, and the suction hand unit 504 is configured to invert the wafer structure Wa using the inversion mechanism 504d and place the wafer structure Wa on the temporary placement unit 506 before supplying it to the dicing apparatus 1. This allows the next wafer W1 to be prepared in an inverted state in the temporary placement unit 506, so that the next wafer W1 can be quickly supplied to the dicing apparatus 1. Reference example Other effects of the above are as follows: Reference example The effect is similar to that of

[0165] [4th Reference example ] Referring to FIGS. 26 and 27, Reference example The configuration of the semiconductor wafer processing apparatus 600 will be described. Reference example So, the above items 1 to 3 Reference example Unlike the above, the lift-up hand part 703 is provided with a reversing mechanism 703d. Reference example So, the above 1, 2 or 3 Reference example Detailed explanations of the same configurations will be omitted. 。

[0166] (Semiconductor wafer processing equipment) As shown in FIGS. 26 and 27, the semiconductor wafer processing apparatus 600 is an apparatus for processing a wafer W1 provided on a wafer ring structure W.

[0167] The semiconductor wafer processing device 600 is equipped with a dicing device 601 and a wafer supply device 603. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing device 601 and wafer supply device 603 are aligned is the X direction, the wafer supply device 603 side of the X direction is the X2 direction, and the dicing device 601 side of the X direction is the X1 direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction. 。

[0168] (dicing equipment) The dicing device 601 is configured to form a modified layer by irradiating the wafer W1 along the dividing lines (streets) with a laser having a wavelength that is transparent to the wafer W1.

[0169] Specifically, the dicing device 601 includes a base 11 , a chuck table unit 12 , a laser unit 13 , an imaging unit 14 , and a lift-up hand unit 703 .

[0170] (Wafer supply device) The wafer supply device 603 is configured to supply a wafer W1 (wafer ring structure W).

[0171] The wafer supply device 603 includes a cassette unit 202. The cassette unit 202 is configured to be able to accommodate a plurality of wafer ring structures W. Reference example In the figure, the wafer ring structure W is accommodated in the cassette unit 202 so that the sheet member W2 is on the bottom side, the wafer W1 is on the top side, and the circuit layer W11 is on the top side. The cassette unit 202 includes a wafer cassette 202a, a Z-direction movement mechanism 202b, and a pair of mounting units 202c.

[0172] <Lift-up hand part> The lift-up hand unit 703 is configured to be able to take out the wafer ring structure W from the cassette unit 202 and transport the taken-out wafer ring structure W. The lift-up hand unit 703 is also configured to be able to store the wafer ring structure W in the cassette unit 202. The lift-up hand unit 703 is configured to transport the wafer ring structure W between the cassette unit 202 and the dicing device 601.

[0173] Specifically, the lift-up hand unit 703 includes an X-direction movement mechanism 703a, a Z-direction movement mechanism 703b, and a lift-up hand 703c. The X-direction movement mechanism 703a is configured to move the lift-up hand 703c in the X direction. The Z-direction movement mechanism 703b is configured to move the lift-up hand 703c in the Z direction. The X-direction movement mechanism 703a and the Z-direction movement mechanism 703b each have a drive unit including, for example, a linear conveyor module or a ball screw and a motor with an encoder. The lift-up hand 703c is configured to generate negative pressure to adsorb and support the ring-shaped member W3 of the wafer ring structure W from the Z2 direction side. The lift-up hand 703c is provided with suction holes or the like to adsorb the wafer ring structure W by negative pressure.

[0174] Here, the fourth Reference example In the fourth embodiment, the lift-up hand unit 703 includes a reversing mechanism 703d for reversing the posture of the wafer ring structure W. Reference example In the fourth embodiment, the reversing mechanism 703d is provided in the lift-up hand part 703. Reference exampleIn the inversion mechanism 703d, the lift-up hand 703c of the lift-up hand section 703, which has adsorbed the wafer ring structure W, is rotated about a rotation axis Ax extending in the horizontal direction (Y direction), thereby inverting the orientation of the wafer ring structure W. The inversion mechanism 703d has a motor and a rotation shaft rotated by the motor. The rotation shaft of the inversion mechanism 703d is connected to the lift-up hand 703c so as to be able to rotate the lift-up hand 703c about the rotation axis Ax. Furthermore, the lift-up hand 703c is configured to be rotated about the rotation axis Ax by the inversion mechanism 703d so as to move from one side to the other with respect to the rotation axis Ax.

[0175] Also, the 4th Reference example In the example shown in FIG. 6, the lift-up hand unit 703 is configured to invert the wafer ring structure W using the inverting mechanism 703d and supply the wafer ring structure W to the dicing device 601. Specifically, the lift-up hand unit 703 is configured to supply the wafer ring structure W, in which the sheet member W2 is arranged on the lower side and the wafer W1 is arranged on the upper side, to the dicing device 601 by inverting the wafer ring structure W, in which the sheet member W2 is arranged on the upper side and the wafer W1 is arranged on the lower side, using the inverting mechanism 703d.

[0176] (Flip of wafer structure) Referring to FIG. 28, the inversion of the wafer ring structure W will be described.

[0177] 28, first, the lift-up hand 703c of the lift-up hand section 703 is moved in the X2 direction by the X-direction movement mechanism 703a and moved into the cassette section 202. Then, the lift-up hand 703c suction-supports the wafer ring structure W in the cassette section 202 from the Z2 direction side. Then, while the lift-up hand 703c suction-supports the wafer ring structure W from the Z2 direction side, it is moved in the X1 direction by the X-direction movement mechanism 703a and moved out of the cassette section 202. Then, the wafer ring structure W with the sheet member W2 on the lower side and the wafer W1 on the wafer side (hereinafter referred to as the wafer ring structure W in the first state) is removed from the cassette section 202 by the lift-up hand section 703.

[0178] Then, during transfer to the chuck table 12, the wafer ring structure W in the first state is inverted by the inverting mechanism 703d. Then, the wafer ring structure W in which the sheet member W2 is arranged on the upper side and the wafer W1 is arranged on the lower side (hereinafter referred to as the wafer ring structure W in the second state) is supplied to the chuck table 12 by the lift-up hand unit 703. Specifically, the lift-up hand 703c of the lift-up hand unit 703 and the chuck table 12 are moved in the X direction, and the lift-up hand 703c is moved to a position above the chuck table 12. Then, the lift-up hand 703c is moved in the Z2 direction by the Z-direction moving mechanism 703b. Then, the wafer ring structure W in the second state is delivered from the lift-up hand unit 703 to the chuck table 12.

[0179] Then, the modified layer is formed by irradiating the wafer ring structure W in the second state with laser light from the laser unit 13. At this time, the laser light from the laser unit 13 is irradiated onto the wafer W1 from the opposite side of the circuit layer W11 via the sheet member W2. Reference example Similarly, it is possible to prevent the width of the laser beam from exceeding the width of the street. In this way, the wafer W1 is supplied to the dicing device 601 in a posture suitable for dicing.

[0180] Then, when dicing (formation of a modified layer) of the wafer structure Wa is completed, the diced wafer ring structure W is transferred from the chuck table 12 to the cassette 202. The procedure for transferring the wafer ring structure W from the chuck table 12 to the cassette 202 is generally the opposite of the procedure for transferring it from the cassette 202 to the chuck table 12.

[0181] That is, the wafer structure Wa in the second state is transferred from the chuck table 12 to the lift-up hand unit 703. Then, the lift-up hand 703c of the lift-up hand unit 703 is moved in the X2 direction by the X-direction movement mechanism 703a. During this movement, the wafer ring structure W in the second state is inverted by the inversion mechanism 703d. Then, the wafer ring structure W assumes the first state in which the sheet member W2a is on the lower side and the wafer W1 is on the upper side. Then, the lift-up hand 703c of the lift-up hand unit 703 is moved in the Y1 direction by the X-direction movement mechanism 703a and moved into the cassette unit 202. Then, the wafer structure Wa in the first state is transferred from the lift-up hand unit 703 to the cassette unit 202 and stored in the cassette unit 202.

[0182] The semiconductor wafer processing apparatus 600 can also process a wafer ring structure W that is not inverted. When the wafer ring structure W is not inverted, the lift-up hand 703c sucks and supports the wafer ring structure W in the cassette unit 202 from the Z1 direction side. Then, the wafer ring structure W is supplied to the chuck table unit 12 by the lift-up hand unit 703 without being inverted. Reference example The other configurations are the same as those in the first embodiment. Reference example The configuration is the same as that of

[0183] (4th Reference example effect) Fourth Reference example Then, the following effects can be obtained:

[0184] Fourth Reference example As described above, the lift-up hand unit 703 is configured to include a reversing mechanism 703d that reverses the posture of the wafer ring structure W. Reference example Similarly, the wafer ring structure W can be inverted by the inversion mechanism 703d while preventing the structure from becoming complicated.

[0185] Also, the 4th Reference example As described above, the cassette unit 202 accommodates a wafer ring structure W having a ring-shaped member W3 surrounding the wafer W1, and the lift-up hand unit 703 is configured to invert the wafer ring structure W using the inversion mechanism 703d and supply the wafer ring structure W to the dicing device 601. In the case of a wafer ring structure W having a ring-shaped member W3, the wafer W1 may not be supplied in an orientation suitable for dicing. Therefore, with the above configuration, even in the case of a wafer ring structure W having a ring-shaped member W3 in which the wafer W1 is not supplied in an orientation suitable for dicing, the wafer ring structure W can be inverted using the inversion mechanism 703d to place the wafer W1 in an orientation suitable for dicing, thereby enabling appropriate dicing.

[0186] Also, the 4th Reference example As described above, in the fourth embodiment, the wafer transfer section includes the lift-up hand section 703 that removes the wafer ring structure W from the cassette section 202 and transfers the removed wafer ring structure W, and the reversing mechanism 703d is provided in the lift-up hand section 703. This allows the wafer ring structure W to be easily removed from the cassette section 202 and transferred using the lift-up hand section 703. Reference example Other effects of the above are as follows: Reference example The effect is similar to that of

[0187] (4th Reference example (variation of 29 and 30, the fourth Reference exampleIn this modification, the lift-up hand 703c is rotated around the rotation axis Ax extending in the Y direction by the reversing mechanism 703d. Reference example 1. In contrast to the above, an example will be described in which the lift-up hand 703c is rotated around a rotation axis Ax extending in the X direction by an inversion mechanism 703d.

[0188] As shown in Figures 29 and 30, Reference example In this modified example, the inversion mechanism 703d is configured to rotate the lift-up hand 703c of the lift-up hand section 703, which has adsorbed the wafer ring structure W, about a rotation axis Ax extending in the horizontal direction (X direction), thereby inverting the orientation of the wafer ring structure W. The inversion mechanism 703d has a motor and a rotation shaft portion rotated by the motor. The rotation shaft portion of the inversion mechanism 703d is connected to the lift-up hand 703c so that the lift-up hand 703c can be rotated about the rotation axis Ax. Furthermore, the lift-up hand 703c is configured to be rotated in place about the rotation axis Ax by the inversion mechanism 703d.

[0189] Fourth Reference example The inversion of the wafer ring structure W in the modified example is the same as that in the fourth embodiment. Reference example Since this is the same as the above, detailed description will be omitted, but the wafer ring structure W in the first state is taken out from the cassette unit 202 by the lift-up hand unit 703. Then, during the transfer to the chuck table unit 12, the wafer ring structure W in the first state is inverted by the inversion mechanism 703d. Then, the wafer ring structure W in the second state is supplied to the chuck table unit 12 by the lift-up hand unit 703. The subsequent operations are the same as those in the fourth step described above. Reference example The same as the fourth Reference example Other configurations of the modified example are the same as those of the fourth modified example. Reference example The configuration is the same as that of

[0190] [fruit Form] Referring to Figures 31 to 34 ,fruit The configuration of a semiconductor wafer processing apparatus 800 according to the embodiment will be described. .fruit In this embodiment, the first to fourth Reference example Unlike the conveyor 803a, a reversing mechanism 803c is provided on the conveyor 803a. ,fruit In this embodiment, the first, second, third or fourth Reference example Detailed description of the same configuration will be omitted. Also, semiconductor wafer processing apparatus 800 is an example of the "wafer processing apparatus" in the claims.

[0191] (Semiconductor wafer processing equipment) As shown in FIG. 31, a semiconductor wafer processing apparatus 800 is an apparatus for processing a wafer W1 provided on a wafer ring structure W.

[0192] Semiconductor wafer processing apparatus 800 includes a dicing unit 801, a cassette unit 202, and a wafer transport unit 803. The vertical direction is defined as the Z direction, with the upward direction defined as the Z1 direction and the downward direction defined as the Z2 direction. The horizontal direction perpendicular to the Z direction is defined as the X direction, with one side of the X direction defined as the X1 direction and the other side defined as the X2 direction. The horizontal direction perpendicular to the X direction is defined as the Y direction, with one side of the Y direction defined as the Y1 direction and the other side defined as the Y2 direction.

[0193] (Dicing section) The dicing unit 801 is configured to form a modified layer by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets). Specifically, the dicing unit 801 includes a chuck table 12, a laser unit 13, and an imaging unit 14.

[0194] (Cassette section) The cassette unit 202 is configured to accommodate a plurality of wafer ring structures W, each of which has a ring-shaped member W3 surrounding the wafer W1. .fruit In this embodiment, the wafer ring structure W is accommodated in the cassette unit 202 so that the sheet member W2 is on the lower side, the wafer W1 is on the upper side, and the circuit layer W11 is on the upper side. The cassette unit 202 includes a wafer cassette 202a, a Z-direction movement mechanism 202b, and a pair of mounting units 202c.

[0195] (Wafer transport section) The wafer transfer unit 803 is configured to transfer the wafer ring structure W between the cassette unit 202 and the dicing unit 801. Specifically, the wafer transfer unit 803 includes a conveyor unit 803a that removes the wafer ring structure W from the cassette unit 202 and transfers the removed wafer ring structure W, and a suction hand unit 803b that transfers the wafer ring structure W transferred by the conveyor unit 803a onto the chuck table unit 12 of the dicing unit 801.

[0196] The conveyor section 803a has rail sections 831 and 832 that support the wafer ring structure W removed from the cassette section 202 from below, a clamp hand section 833 that removes the wafer ring structure W from the cassette section 202 and transports it along the rail sections 831 and 832, and a Y-direction movement mechanism 834 that moves the clamp hand section 833 in the Y direction.

[0197] The rail portions 831 and 832 are arranged side by side in this order from the Y2 direction side toward the Y1 direction side. The rail portion 831 is arranged near the cassette unit 202. The rail portion 832 is arranged near the rail portion 831. The rail portions 831 and 832 are arranged to extend in the Y direction. The rail portions 831 and 832 are provided as a pair with a predetermined gap in the X direction. The pair of rail portions 832 is provided with a rail drive mechanism 832a for changing the gap between the pair of rail portions 832 in the X direction. The rail drive mechanism 832a moves the pair of rail portions 832 away from each other in the X direction, thereby widening the gap between the pair of rail portions 832 in the X direction. The rail drive mechanism 832a moves the pair of rail portions 832 toward each other in the X direction, thereby narrowing the gap between the pair of rail portions 832 in the X direction. The rail drive mechanism 832a includes, for example, a cylinder (such as an air cylinder) provided on each of the pair of rail portions 832.

[0198] The clamp hand unit 833 is configured to clamp and transport the wafer ring structure W. The clamp hand unit 833 is configured to transport the wafer ring structure W between three positions: a storage position for the wafer ring structure W in the cassette unit 202; an inversion position where the orientation of the wafer ring structure W is inverted by an inversion mechanism 803c (described later); and a transfer position where the wafer ring structure W is handed over to the suction hand unit 803b. The clamp hand unit 833 is formed in a hook shape. The clamp hand unit 833 has a clamp unit 833a at its tip for clamping the wafer ring structure W. The clamp unit 833a is configured to clamp the end of the ring-shaped member W3 of the wafer ring structure W on the Y1 direction side in the vertical direction.

[0199] The Y-direction movement mechanism 834 is configured to move the clamp hand unit 833 in the Y1 direction or the Y2 direction. The clamp hand unit 833 is configured to transport the wafer ring structure W by being moved by the Y-direction movement mechanism 834. The Y-direction movement mechanism 834 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0200] The suction hand section 803b has a suction hand 841 that suctions the wafer ring structure W, and a Z-direction movement mechanism 842 that moves the suction hand 841 in the Z direction. The suction hand 841 is configured to suck and support the wafer ring structure W by generating negative pressure. The suction hand 841 is provided with suction holes and the like for sucking the wafer ring structure W. The Z-direction movement mechanism 842 is configured to move the suction hand 841 in the Z direction. The Z-direction movement mechanism 842 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0201] where ,fruitIn this embodiment, the wafer transfer unit 803 includes an inversion mechanism 803c. Specifically, as shown in Figures 31 and 32, the inversion mechanism 803c is provided as part of the conveyor unit 803a. More specifically, the inversion mechanism 803c is provided as part of the rail unit 831. Furthermore, the inversion mechanism 803c is provided as part of one of the pair of rail units 831.

[0202] The inversion mechanism 803c has a holding unit 851 that holds the wafer ring structure W, a clamp drive mechanism 852 that drives the holding unit 851 in the vertical direction (Z direction), and a rotation drive mechanism 853 that rotates the holding unit 851. The holding unit 851 is an example of the "clamp unit" in the claims.

[0203] The holding portion 851 is provided as a part of one of the pair of rail portions 831. The inversion mechanism 803c is configured to invert the orientation of the wafer ring structure W by rotating the holding portion 851 around a rotation axis Ax1 extending in the horizontal direction (X direction) while the holding portion 851 holds the wafer ring structure W. Specifically, the holding portion 851 is configured to clamp the end of the ring-shaped member W3 of the wafer ring structure W on the X1 direction side in the vertical direction (Z direction). The inversion mechanism 803c is configured to invert the orientation of the wafer ring structure W by rotating the holding portion 851 around the rotation axis Ax1 while the holding portion 851 clamps the end of the ring-shaped member W3 of the wafer ring structure W on the X1 direction side.

[0204] The holding unit 851 has a first clamp member 851a which is a movable member and a second clamp member 851b which is a fixed member. The first clamp member 851a and the second clamp member 851b are arranged to face each other in the vertical direction (Z direction). A clamp drive mechanism 852 is connected to the first clamp member 851a. The holding unit 851 is configured to clamp the wafer ring structure W between the first clamp member 851a and the second clamp member 851b by the clamp drive mechanism 852 driving the first clamp member 851a in the vertical direction. The clamp drive mechanism 852 includes a cylinder 852a such as an air cylinder as a drive source.

[0205] The rotation drive mechanism 853 has an attachment member 853a and a motor 853b as a drive source for rotating the attachment member 853a. A clamp drive mechanism 852 and a second clamp member 851b are connected to the attachment member 853a. Furthermore, a first clamp member 851a is connected to the attachment member 853a via the clamp drive mechanism 852. The rotation drive mechanism 853 is configured to rotate the clamp drive mechanism 852, the first clamp member 851a, and the second clamp member 851b by rotating the attachment member 853a using the motor 853b. This allows the first clamp member 851a and the second clamp member 851b to rotate while the wafer ring structure W is clamped between them, thereby reversing the orientation of the wafer ring structure W. The motor 853b may be connected to the attachment member 853a via a belt pulley mechanism or the like.

[0206] Also ,fruit32 and 33, in this embodiment, the other of the pair of rail portions 831 is configured to retract when the orientation of the wafer ring structure W is reversed by the reversing mechanism 803c. Specifically, the other of the pair of rail portions 831 is configured to rotate about a rotation axis Ax2 extending along the direction in which the rail portions 831 extend (the Y direction), thereby moving between an initial position where the wafer ring structure W is supported from below and a retracted position spaced apart from the wafer ring structure W. A retraction drive mechanism 861 that rotationally drives the pair of rail portions 831 is provided on the other of the pair of rail portions 831. The retraction drive mechanism 861 includes a rotary actuator 861a as a drive source.

[0207] 34, when the stroke of the cylinder 852a is S, the rotation center Ce (rotation axis Ax1) of the inversion of the wafer ring structure W is located at a height position S / 2 above the support surface (upper surface) of the rail portion 831. As a result, when the wafer ring structure W is inverted and the piston rod of the cylinder 852a is pulled back, it is possible to make the support surface (upper surface) of the first clamp member 851a approximately coincident in height with the support surface (upper surface) of the rail portion 831. Note that the stroke amount S is equal to the distance between the first clamp member 851a and the second clamp member 851b, but because there is a thickness t of the ring-shaped member W3, the piston rod of the cylinder 852a does not reach the stroke end, and the actual stroke movement distance is St.

[0208] The reversing mechanism 803c is configured so that the support surface of the holder 851, which supports the ring-shaped member W3 of the wafer ring structure W from below, is at approximately the same height as the support surface (upper surface) of the rail portion 831, both before and after the reversal of the wafer ring structure W. This allows the wafer ring structure W to be transported smoothly both before and after the reversal of the wafer ring structure W.

[0209] Specifically, before the wafer ring structure W is inverted, the support surface (upper surface) of the second clamp member 851b, which supports the ring-shaped member W3 of the wafer ring structure W from below, is at approximately the same height as the support surface (upper surface) of the rail portion 831. Furthermore, after the wafer ring structure W is inverted and the piston rod of the cylinder 852a is pulled back, the support surface (upper surface) of the first clamp member 851a, which supports the ring-shaped member W3 of the wafer ring structure W from below, is at approximately the same height as the support surface (upper surface) of the rail portion 831.

[0210] Also ,fruit In this embodiment, the semiconductor wafer processing apparatus 800 can switch between a setting in which the inversion mechanism 803c inverts the orientation of the wafer ring structure W and a setting in which the inversion mechanism 803c does not invert the orientation of the wafer ring structure W, based on information regarding laser processing of the wafer W1. The information regarding laser processing of the wafer W1 includes setting information regarding whether to perform laser processing from the circuit side of the wafer W1 (the side where the circuit layer W11 is present) or from the side opposite the circuit side of the wafer W1 (the side where the circuit layer W11 is not present) via the sheet member W2. The information regarding laser processing of the wafer W1 is set by a user and pre-stored in a memory unit of the semiconductor wafer processing apparatus 800. Note that when laser processing is performed from the circuit side of the wafer W1, the setting is such that the inversion mechanism 803c does not invert the orientation of the wafer ring structure W. Note that when laser processing is performed from the side opposite the circuit side of the wafer W1 via the sheet member W2, the setting is such that the inversion mechanism 803c inverts the orientation of the wafer ring structure W.

[0211] (Operation of semiconductor wafer processing equipment) Referring to Figures 31 to 34 ,fruit The operation of the semiconductor wafer processing apparatus 800 according to this embodiment will be described.

[0212] 31, first, the Z-direction movement mechanism 202b moves the wafer cassette 202a in the vertical direction, thereby positioning the wafer ring structure W to be processed at a height where it can be removed by the clamp hand unit 833. Then, the Y-direction movement mechanism 834 moves the clamp hand unit 833 to the storage position, and the clamp hand unit 833 clamps the wafer ring structure W. Then, when the setting is such that the orientation of the wafer ring structure W is to be inverted by the inversion mechanism 803c, the clamp hand unit 833 moves the wafer ring structure W on the rail unit 831 and transports it from the storage position to the inversion position.

[0213] 32 and 33, the holder 851 holds the end of the ring-shaped member W3 of the wafer ring structure W on the X1 direction side, and the retraction drive mechanism 861 retracts the other of the pair of rail portions 831. That is, the cylinder 852a moves the first clamp member 851a toward the second clamp member 851b, thereby clamping the end of the ring-shaped member W3 of the wafer ring structure W on the X1 direction side between the first clamp member 851a and the second clamp member 851b. Furthermore, the rotary actuator 861a rotates the other of the pair of rail portions 831 so as to move it away from the wafer ring structure W, thereby moving the other of the pair of rail portions 831 from the initial position to the retracted position. At the retracted position, the other of the pair of rail portions 831 does not interfere with the inversion of the wafer ring structure W. Furthermore, when the wafer ring structure W is to be inverted, the clamp hand portion 833 releases its hold on the wafer ring structure W, and the Y-direction movement mechanism 834 moves the clamp hand portion 833 to a position where it does not interfere with the inversion of the wafer ring structure W.

[0214] 33 and 34, the holding unit 851 is rotated 180 degrees by the rotation drive mechanism 853. That is, the mounting member 853a is rotated 180 degrees by the motor 853b, which rotates the clamp drive mechanism 852, the first clamp member 851a, and the second clamp member 851b 180 degrees. As a result, the wafer ring structure W held between the first clamp member 851a and the second clamp member 851b is inverted. Then, the other of the pair of rail members 831 is returned from the retracted position to the initial position, and the holding of the wafer ring structure W by the holding unit 851 is released. Furthermore, the Y-direction movement mechanism 834 moves the clamp hand unit 833 to a position where it can hold the wafer ring structure W, and the clamp hand unit 833 holds the wafer ring structure W.

[0215] 31, the wafer ring structure W is moved on the rails 831 and 832 by the clamp hand unit 833 and transported to the delivery position. Note that if the setting is such that the orientation of the wafer ring structure W is not reversed by the reversing mechanism 803c, the wafer ring structure W is transported by the clamp hand unit 833 from the accommodation position to the delivery position without passing through the reversing position.

[0216] Then, at the transfer position, the wafer ring structure W is transferred from the clamp hand unit 833 to the suction hand unit 803b. That is, the suction hand 841 is lowered by the Z-direction movement mechanism 842, and the ring-shaped member W3 of the wafer ring structure W is sucked by the suction hand 841. The suction hand 841 is then raised by the Z-direction movement mechanism 842, and the wafer ring structure W sucked by the suction hand 841 is retracted from the rail unit 832. The rail drive mechanism 832a then widens the gap in the X direction between the pair of rail units 832. This makes it possible to transfer the wafer ring structure W to the chuck table unit 12, which has been moved below the suction hand 841 and the rail units 832 by the X-direction movement mechanism 121 and the Y-direction movement mechanism 122.

[0217] The wafer ring structure W is then transferred from the suction hand 841 to the chuck table 12. That is, the Z-direction movement mechanism 842 lowers the suction hand 841 to a position below the rails 832, and the wafer ring structure W is placed on the suction portion 12a. Then, the suction hand 841 releases the ring-shaped member W3 of the wafer ring structure W from suction, and the wafer ring structure W is sucked by the suction portion 12a. The Z-direction movement mechanism 842 then raises the suction hand 841, and the suction hand 841 is retracted from the chuck table 12.

[0218] Then, the wafer ring structure W is moved by the chuck table unit 12 to a position where the laser unit 13 can irradiate the wafer W1 with laser light. Then, laser processing is performed on the wafer W1 of the wafer ring structure W. Details of the laser processing are described in the first section above. Reference example Since this is similar to the above, detailed description will be omitted. Note that, when the inversion mechanism 803c is set to invert the orientation of the wafer ring structure W, laser processing is performed via the sheet member W2 from the side opposite the circuit side of the wafer W1. This type of laser processing is effective when it is difficult to laser process the wafer W1 from the circuit side of the wafer W1 due to the narrow width of the streets of the wafer W1. Also, when the inversion mechanism 803c is set not to invert the orientation of the wafer ring structure W, laser processing is performed from the circuit side of the wafer W1. In this case, since there is no need to invert the orientation of the wafer ring structure W using the inversion mechanism 803c, it is possible to shorten the cycle time compared to when the orientation of the wafer ring structure W is inverted using the inversion mechanism 803c.

[0219] (fruit Effect of the embodiment fruit In this embodiment, the following effects can be obtained.

[0220] fruit In this embodiment, as described above, the wafer transfer unit 803 is configured to include an inversion mechanism 803c that inverts the posture of the wafer ring structure W. Reference example Similarly, the wafer ring structure W can be inverted by the inversion mechanism 803c while preventing the structure from becoming complicated.

[0221] Also ,fruit In this embodiment, as described above, the wafer transfer unit 803 includes a conveyor unit 803a that removes the wafer ring structure W from the cassette unit 202 and transports the removed wafer ring structure W, and the reversing mechanism 803c is provided as part of the conveyor unit 803a. This allows the conveyor unit 803a that removes the wafer ring structure W from the cassette unit 202 to be effectively utilized to provide the reversing mechanism 803c as part of the conveyor unit 803a, thereby reducing the complexity of the structure compared to when the reversing mechanism 803c is provided separately and independently. Furthermore, since the orientation of the wafer ring structure W can be reversed while being transported by the conveyor unit 803a, no loss of wafer ring structure W is transported (the transport path does not become longer). As a result, an increase in cycle time can be reduced even when the orientation of the wafer ring structure W is reversed.

[0222] Also ,fruit In this embodiment, as described above, the conveyor unit 803a has the rail unit 831 that supports from below the wafer ring structure W removed from the cassette unit 202, and the reversing mechanism 803c is provided as part of the rail unit 831 of the conveyor unit 803a. This makes it possible to provide the reversing mechanism 803c as part of the conveyor unit 803a by effectively utilizing the rail unit 831, and therefore makes it possible to easily prevent the structure from becoming complicated.

[0223] Also ,fruitIn this embodiment, as described above, a pair of rail portions 831 are provided with a predetermined gap between them, and the reversing mechanism 803c is provided as part of one of the pair of rail portions 831, with the other of the pair of rail portions 831 being retracted when the reversing mechanism 803c reverses the orientation of the wafer ring structure W. Thus, by providing the reversing mechanism 803c as part of one of the pair of rail portions 831, it is possible to prevent the structure from becoming more complex than when the reversing mechanism 803c is provided as part of both of the pair of rail portions 831. Furthermore, by retracting the other of the pair of rail portions 831 when the reversing mechanism 803c reverses the orientation of the wafer ring structure W, it is possible to prevent the other of the pair of rail portions 831 from interfering with the wafer ring structure W, and therefore the orientation of the wafer ring structure W can be easily reversed by the reversing mechanism 803c. As a result, it is possible to easily reverse the orientation of the wafer ring structure W by the reversing mechanism 803c while preventing the structure from becoming more complex.

[0224] Also ,fruitIn this embodiment, as described above, the other of the pair of rail portions 831 is configured to rotate about the rotation axis Ax2 extending along the direction in which the rail portions 831 extend, thereby moving between an initial position in which the wafer ring structure W is supported from below and a retracted position spaced apart from the wafer ring structure W. This allows the other of the pair of rail portions 831 to be retracted from the initial position to the retracted position with a simple configuration in which the other of the pair of rail portions 831 is rotated. Here, when the other of the pair of rail portions 831 is retracted from the initial position to the retracted position, the portion of the wafer ring structure W that is no longer supported from below by the other of the pair of rail portions 831 may bend slightly downward. In contrast to this, by rotating the other of the pair of rail portions 831 and returning the other of the pair of rail portions 831 from the retracted position to the initial position, even if the portion of the wafer ring structure W that is no longer supported from below by the other of the pair of rail portions 831 is slightly bent downward, the bent portion of the wafer ring structure W can be lifted up and the other of the pair of rail portions 831 can be easily returned to the initial position.

[0225] Also ,fruit In this embodiment, as described above, the reversing mechanism 803c is provided as part of the rail portion 831, has a holding portion 851 that holds the wafer ring structure W, and is configured to rotate the holding portion 851 while the wafer ring structure W is held by the holding portion 851, thereby reversing the orientation of the wafer ring structure W. This allows the holding portion 851 to be provided by effectively utilizing the rail portion 831 that supports the wafer ring structure W from below, thereby preventing the structure from becoming complicated and allowing the wafer ring structure W to be easily held by the holding portion 851.

[0226] Also ,fruitIn this embodiment, as described above, the cassette unit 202 accommodates a wafer ring structure W having a ring-shaped member W3 surrounding the wafer. The inversion mechanism 803c includes a holding unit 851 that is provided as part of one of a pair of rail units 831 and that clamps the end of the ring-shaped member W3 of the wafer ring structure W in the vertical direction. The inversion mechanism 803c is configured to invert the orientation of the wafer ring structure W by rotating the holding unit 851 while the end of the ring-shaped member W3 of the wafer ring structure W is clamped by the holding unit 851. This allows the holding unit 851 to be provided by effectively utilizing one of the pair of rail units 831 that support the wafer ring structure W from below, thereby preventing the structure from becoming complicated. Furthermore, by clamping the end of the ring-shaped member W3 of the wafer ring structure W by the holding unit 851, the wafer ring structure W can be reliably held, thereby enabling the orientation of the wafer ring structure W to be stably inverted.

[0227] Also ,fruit In this embodiment, as described above, it is possible to switch between a setting in which the attitude of the wafer ring structure W is inverted by the inversion mechanism 803c and a setting in which the attitude of the wafer ring structure W is not inverted by the inversion mechanism 803c based on information regarding laser processing of the wafer W1. This makes it possible to switch between laser processing from the circuit surface side of the wafer W1 and laser processing from the surface side opposite to the circuit surface of the wafer W1 depending on the wafer W1 to be processed. As a result, it is possible to improve the degree of freedom in processing the wafer W1. ,fruit Other effects of the embodiment are as follows: Reference example The effect is similar to that of

[0228] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not by the description of the above embodiments, and includes all modifications (variations) within the meaning and scope of the claims.

[0229] aboveNotes 1 to 4 Reference example In the above, an example has been shown in which the wafer transport unit includes a suction hand that suction-holds the wafer structure and the reversing mechanism reverses the suction hand that has suction-held the wafer structure, but the present invention is not limited to this. In the present invention, the wafer transport unit may include a support unit other than the suction unit that supports the wafer structure, and the reversing mechanism may reverse the support unit that supports the wafer structure.

[0230] Also, the above third Reference example Although the semiconductor wafer processing apparatus has been described as having a temporary storage section, the present invention is not limited to this. In the present invention, even in the case of a wafer structure that does not have a ring-shaped member, the wafer processing apparatus does not need to have a temporary storage section. In this case, the wafer structure can be inverted by the inversion mechanism and directly supplied to the dicing section.

[0231] Also, the above third Reference example Although an example has been shown in which the semiconductor wafer processing device is provided with an imaging unit that captures images of the wafers of the wafer structure placed on the temporary storage section, the present invention is not limited to this. In the present invention, even when the semiconductor wafer processing device is provided with a temporary storage section, the semiconductor wafer processing device does not necessarily have to be provided with an imaging unit that captures images of the wafers of the wafer structure placed on the temporary storage section.

[0232] In addition, the above 1st and 2nd Reference example Although an example in which the semiconductor wafer processing device is equipped with an ultraviolet irradiation unit and a squeegee unit has been described above, the present invention is not limited to this. In the present invention, even if the semiconductor wafer processing device is equipped with an expanding unit, the semiconductor wafer processing device does not necessarily have to be equipped with an ultraviolet irradiation unit and a squeegee unit.

[0233] In addition, the above 1st and 2nd Reference example In the above, an example has been shown in which the wafer transport unit inverts the wafer structure using the inversion mechanism and delivers it to the cold air supply unit, but the present invention is not limited to this. In the present invention, the wafer transport unit may invert the wafer structure using the inversion mechanism and deliver it to a receiving unit other than the cold air supply unit.

[0234] In addition, the above 1st and 2nd Reference example For the sake of convenience, the control process has been described using a flow-driven flowchart in which the process is performed in order according to the processing flow, but the present invention is not limited to this. In the present invention, the control process may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the control process may be performed completely event-driven, or may be performed by combining event-driven and flow-driven processing.

[0235] Also, above Memorial In the embodiment, an example in which the reversing mechanism is provided as part of one of the pair of rail portions has been shown, but the present invention is not limited to this. In the present invention, the reversing mechanism may be provided as part of both of the pair of rail portions. In other words, the holding portion of the reversing mechanism may be provided as part of both of the pair of rail portions.

[0236] Also, above Memorial In the embodiment, an example has been shown in which the holding portion of the inversion mechanism is a clamping portion that clamps the wafer structure, but the present invention is not limited to this. In the present invention, the holding portion of the inversion mechanism may be a suction portion that suctions the wafer structure.

[0237] Also, above Memorial In the embodiment, an example has been shown in which the other of the pair of rail portions moves between the initial position and the retracted position by rotating, but the present invention is not limited to this. In the present invention, the other of the pair of rail portions may move between the initial position and the retracted position by sliding. [Explanation of symbols]

[0238] 8 00 Semiconductor wafer processing equipment (wafer processing equipment) 202 Cassette section (wafer storage section) 8 03c Reversal mechanism 801 Dicing Department 803 Wafer transport unit 803a Conveyor section 831 Rail part 852 Holding part (clamp part) Ch semiconductor chip W Wafer ring structure (wafer structure) W1 wafer W 2 Sheet material W3 Ring-shaped member

Claims

1. a wafer accommodating section for accommodating a wafer structure including a wafer on which a plurality of semiconductor chips are formed and a sheet member to which the wafer is attached; a dicing unit that performs dicing on the wafer of the wafer structure supplied from the wafer accommodation unit to divide it into individual semiconductor chips; a wafer transport unit that transports the wafer structure between the wafer accommodation unit and the dicing unit, the wafer transport unit includes an inversion mechanism that inverts the attitude of the wafer structure, the wafer transport unit includes a conveyor unit that removes the wafer structure from the wafer accommodation unit and transports the removed wafer structure, The wafer processing apparatus, wherein the reversing mechanism is provided as a part of the conveyor unit.

2. the conveyor unit has a rail unit that supports the wafer structure removed from the wafer accommodation unit from below, The wafer processing device according to claim 1 , wherein the reversing mechanism is provided as a part of the rail portion.

3. The rail portion is provided as a pair at a predetermined interval, the reversing mechanism is provided as a part of one of the pair of rail portions, 3. The wafer processing device according to claim 2, wherein the other of the pair of rail portions is configured to retract when the attitude of the wafer structure is reversed by the reversing mechanism.

4. 4. The wafer processing device according to claim 3, wherein the other of the pair of rail portions is configured to move between an initial position in which the wafer structure is supported from below and a retracted position spaced apart from the wafer structure by rotating about a rotation axis extending along the direction in which the rail portions extend.

5. 3. The wafer processing apparatus according to claim 2, wherein the inversion mechanism is provided as part of the rail portion, has a holding portion that holds the wafer structure, and is configured to invert the attitude of the wafer structure by rotating the holding portion while the wafer structure is held by the holding portion.

6. the wafer accommodating section accommodates the wafer structure provided with a ring-shaped member surrounding the wafer; 4. The wafer processing apparatus according to claim 3, wherein the inversion mechanism is provided as part of one of the pair of rail portions, has a clamp portion that clamps the end of the ring-shaped member of the wafer structure in the vertical direction, and is configured to invert the posture of the wafer structure by rotating the clamp portion while the end of the ring-shaped member of the wafer structure is clamped by the clamp portion.

7. 2. The wafer processing device according to claim 1, wherein the wafer processing device is switchable between a setting in which the inversion mechanism inverts the attitude of the wafer structure and a setting in which the inversion mechanism does not invert the attitude of the wafer structure based on information regarding laser processing of the wafer.

8. a step of dicing the wafer of the wafer structure, which is supplied from a wafer accommodation unit that accommodates a wafer structure including a wafer on which a plurality of semiconductor chips are formed and a sheet member to which the wafer is attached, by a dicing unit to divide the wafer into individual semiconductor chips; and transporting the wafer structure between the wafer accommodation unit and the dicing unit by a wafer transport unit, the wafer transport unit includes an inversion mechanism that inverts the attitude of the wafer structure, the wafer transport unit includes a conveyor unit that removes the wafer structure from the wafer accommodation unit and transports the removed wafer structure, A method for manufacturing semiconductor chips, wherein the inversion mechanism is provided as part of the conveyor unit.

Images