Holding member, conveying device, cutting table, cutting device, semiconductor manufacturing device, manufacturing method of holding member, and manufacturing method of semiconductor device

Abstract

To make it possible to easily remove a to-be-held object after suction is released without damaging a holding member's suction power.SOLUTION: A holding member 10 has suction holes 10a formed for sucking and holding a to-be-held object W. Multiple recesses 10c are formed on the surface of a holding area 10R for holding the to-be-held object W by the suction holes 10a. A surface other than the multiple recesses 10c in the holding area 10R is a roughened surface 10d.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a holding member, a conveying device, a cutting table, a cutting device, a semiconductor manufacturing device, a manufacturing method of a holding member, and a manufacturing method of a semiconductor device. [Background technology]

[0002] Conventionally, as shown in Patent Document 1, an adsorption member for adsorbing components has been used in cleaning equipment, film forming equipment, etc. This adsorption member adsorbs one or more components onto the same adsorption surface and includes an adsorption layer and a support. The adsorption layer is made of a porous ceramic body, and by adjusting the average pore diameter, adsorption and release of components are improved. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-183535 Summary of the Invention [Problem to be solved by the invention]

[0004] On the other hand, from the viewpoints of water resistance, ability to follow warping of the object to be held, prevention of displacement of the object to be held, etc., elastic resins (rubber materials) such as silicone-based resins and fluorine-based resins are used for the holding member (holding layer) that holds the object to be held. Also, suction holes are formed in the holding member to suck and hold the object to be held.

[0005] However, if the suction force for holding the object is increased, the object will stick to the holding member even after the suction through the suction holes is released. Furthermore, the larger the contact area between the holding member and the object due to surface tackiness or dirt on the holding member, the greater the sticking force. Furthermore, if the contact surfaces between the object and the holding member are smooth, vacuum sticking occurs. Furthermore, if the holding member becomes wet, the unevenness of the contact surfaces will fill with water, increasing the sticking force. If the object sticks to the holding member in this way, it will be impossible to remove it from the holding member, making it impossible to transport.

[0006] The present invention has been made to solve the above problems, and its main objective is to easily remove the held object after suction is released without impairing the suction force of the holding member. [Means for solving the problem]

[0007] In other words, the holding member of the present invention is a holding member formed with suction holes that suction and hold the object to be held, and is characterized in that a plurality of recesses are formed on the surface of the holding area that holds the object to be held by the suction holes, and the surface of the holding area other than the plurality of recesses is a roughened surface. [Effects of the Invention]

[0008] According to the present invention configured in this manner, the object to be held can be easily removed after the suction force of the holding member is released without losing its suction force. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic diagram illustrating a configuration of a cutting device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view schematically showing the configuration of a cutting table of the embodiment. [Figure 3]2A is a plan view schematically showing the configuration of a substrate, and FIG. 2B is a plan view schematically showing the configuration of a holding member in the embodiment. [Figure 4] FIG. 2 is a partially enlarged plan view schematically showing the configuration of the holding member of the embodiment. [Figure 5] FIG. 2 is a partially enlarged cross-sectional view schematically illustrating the configuration of a holding member of the embodiment. [Figure 6] FIG. 10 is a plan view schematically showing the configuration of a holding member according to a modified embodiment. [Figure 7] FIG. 10 is a partially enlarged plan view schematically showing the configuration of a holding member according to a modified embodiment. [Figure 8] FIG. 10 is a partially enlarged cross-sectional view schematically illustrating the configuration of a holding member according to a modified embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Next, the technology according to the present invention will be described in more detail with reference to examples, although the present invention is not limited to the following technology.

[0011] The holding member of Technology 1 according to the present invention is a holding member having suction holes formed therein that suction-hold the object to be held, wherein the suction holes form a plurality of recesses on the surface of the holding area that holds the object to be held, and the surface of the holding area other than the plurality of recesses is a roughened surface.

[0012] With this holding member, multiple recesses are formed on the surface of the holding area that holds the object to be held, thereby reducing the contact area between the holding member and the object to be held and reducing the sticking force. Furthermore, the surface of the holding area other than the multiple recesses is roughened, reducing the sticking force due to vacuum sticking, etc. Therefore, the object to be held can be easily removed after the suction force is released without impairing the suction force of the holding member.

[0013] If the suction holes and the space outside the holding area are connected by the multiple recesses formed in the holding area, the suction force of the holding member may be reduced. To solve this problem, in addition to the configuration of the holding member of Technology 2 according to the present invention, it is desirable that the multiple recesses are formed so that the suction holes and the space outside the holding area are not connected to each other when the holding object is held.

[0014] Specific embodiments of the holding member include a configuration in which a plurality of recesses are formed in a regular pattern, a configuration in which a plurality of recesses are formed in an irregular pattern, or a configuration in which a plurality of recesses are formed in an irregular shape. Here, a configuration in which a plurality of recesses are formed in a regular pattern makes it easier to process the holding member. Therefore, in addition to the configuration of the above-mentioned technology 1 or 2, the holding member of technology 3 according to the present invention preferably has the plurality of recesses in a lattice, stripe, or dot pattern in plan view.

[0015] The conveying device of Technology 4 according to the present invention comprises a holding unit that adsorbs and holds an object to be conveyed, and a moving mechanism that moves the holding unit, and the holding unit has a holding member having the configuration of any one of Technology 1 to 3 above. With this configuration, the object to be transported can be easily removed after the suction force of the holding member is released without losing its suction force, so that the object to be transported can be transported reliably to a predetermined position.

[0016] The cutting table of Technique 5 according to the present invention is a cutting table that adsorbs and holds an object to be cut, and is characterized by having a holding member having the configuration of any one of Techniques 1 to 3 above. With this configuration, the object to be cut can be easily removed after the suction force of the holding member is released without impairing the suction force, thereby preventing the object from shifting position during cutting and allowing the cut object to be easily removed after the suction force is released.

[0017] A cutting device according to Technology 6 of the present invention includes a cutting table that adsorbs and holds an object to be cut, and a cutting mechanism that cuts the object held on the cutting table, and the cutting table has a holding member having the configuration of any one of Technology 1 to 3 above. With this configuration, the object to be cut can be easily removed after the suction force of the holding member is released without impairing the suction force, thereby preventing the object from shifting position during cutting and allowing the cut object to be easily removed from the cutting table after the suction force is released.

[0018] A semiconductor manufacturing apparatus according to Technology 7 of the present invention is a semiconductor manufacturing apparatus that cuts a substrate on which a plurality of semiconductor devices are formed to manufacture individual semiconductor devices, and includes a cutting table that adsorbs and holds the substrate, a cutting mechanism that cuts the substrate held on the cutting table, and a transport mechanism that transports the individual semiconductor devices from the cutting table, wherein the cutting table or the transport mechanism has a holding member having the configuration of any one of Technology 1 to 3 above. With this configuration, the singulated semiconductor devices can be easily removed after suction is released without impairing the suction force of the holding member, so that when the cutting table has a holding member configured as any one of techniques 1 to 3, it is possible to prevent the object from shifting position during cutting, and the singulated semiconductor devices can be easily removed from the cutting table after suction is released. Furthermore, when the transport mechanism has a holding member configured as any one of techniques 1 to 3, it is possible to reliably transport the singulated semiconductor devices to a predetermined position after suction is released.

[0019] The manufacturing method of a holding member according to Technology 8 of the present invention is a method for manufacturing a holding member having the configuration of any one of Technology 1 to 3 above, and is characterized in that the roughened surface is formed by irradiating laser light onto a surface other than the plurality of recesses in the holding region. With this configuration, the surface of the holding area can be roughened to form a roughened surface, while the dirt on the surface of the holding area can be burned and removed. In particular, by roughening the surface by irradiating it with laser light after the recesses are formed, the dirt on the surface caused by the formation of the recesses can be burned and removed.

[0020] In addition to the configuration of the above-mentioned technique 8, the manufacturing method of a holding member according to technique 9 of the present invention preferably includes irradiating a surface of the holding region with laser light to form the plurality of recesses. With this configuration, not only the roughened surface but also the recesses are formed using laser light, so the manufacturing process of the holding member can be simplified.

[0021] The semiconductor device manufacturing method of Technology 10 according to the present invention is a semiconductor device manufacturing method using the semiconductor manufacturing apparatus of Technology 7 described above, characterized in that the substrate held on the cutting table is cut by the cutting mechanism, and the individual semiconductor devices are carried out by the transport mechanism.

[0022] <One embodiment of the present invention> DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a cutting device according to the present invention will be described below with reference to the drawings. In addition, in all of the drawings shown below, for the sake of clarity, some parts are omitted or exaggerated as appropriate, and the same components are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0023] <Overall configuration of cutting device 100> The cutting apparatus 100 of this embodiment cuts a substrate W, which is an object to be cut, into a plurality of cut pieces P.

[0024] Here, examples of the substrate W include a flip-chip substrate or a sealed substrate. A flip-chip substrate is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are flip-chip connected. A sealed substrate is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are connected, and which is resin-molded to seal at least the electronic elements. Examples of substrates that constitute the sealed substrate include lead frames and printed wiring boards, and other substrates that may also be used, such as semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, ceramic substrates, glass substrates, and resin substrates. Furthermore, the substrates that constitute the sealed substrate may or may not be wired.

[0025] 1, the cutting apparatus 100 includes, as its components, a supply module 100A that supplies a substrate W, a cutting module 100B that cuts the substrate W, and an inspection module 100C that inspects the cut products P that have been cut and separated. Each component is detachable and replaceable with respect to the other components. Note that when the substrate W is a substrate on which a plurality of semiconductor devices are formed, the cutting apparatus 100 can be said to be a semiconductor manufacturing apparatus that manufactures the separated semiconductor devices.

[0026] The operation of the cutting device 100 including the modules 100A to 100C described below is controlled by a control unit CTL provided in the supply module 100A. This control unit CTL may be provided in modules 100B and 100C other than the supply module 100A. Furthermore, the control unit CTL may be divided into multiple units and provided in at least two of the supply module 100A, the cutting module 100B, and the inspection module 100C.

[0027] The supply module 100A receives the substrates W to be cut from the outside and accommodates the substrates W. The supply module 100A is provided with a substrate accommodation section 2 that accommodates the substrates W. The substrates W are transported from the supply module 100A to the cutting module 100B by a transport mechanism (loader) 3. The loader 3 transports the substrates W to the cutting module 100B using guide rails 31. The cutting apparatus 100 of this embodiment is provided with three substrate accommodation sections 2, but the number of substrate accommodation sections 2 is not particularly limited.

[0028] The cutting module 100B cuts the substrate W into a plurality of cut products P. The cutting module 100B has a cutting table 4 that adsorbs and holds the substrate W, which is the object to be cut, and a cutting mechanism 5 that cuts the substrate W held on the cutting table 4.

[0029] The cutting mechanism 5 is configured by attaching a rotary blade 52 to a spindle 51. The cutting table 4 and the cutting mechanism 5 are moved relative to each other, whereby the substrate W is cut by the rotary blade 52 and singulated into cut pieces P. Here, a cutting fluid supply unit 50 supplies cutting water, which is a processing fluid, to the rotary blade 52 and the substrate W to suppress frictional heat generated when cutting the substrate W. Thereafter, the singulated cut pieces P are transported from the cutting module 100B to the inspection module 100C by a transport mechanism (unloader) 6. The unloader 6 has a holder 61 that individually adsorbs and holds a plurality of cut pieces P, which are transport objects, and a moving mechanism 62 that moves the holder 61. The cutting device 100 of this embodiment has two cutting mechanisms 5, but may have only one cutting mechanism 5.

[0030] The inspection module 100C inspects the cut products P that have been singulated by the cutting module 100B by capturing images of them. The inspection module 100C includes an inspection table 7 that suctions and holds a plurality of cut products P, which are the objects to be inspected, and an inspection camera 8 that captures images of the plurality of cut products P held on the inspection table 7. The inspection module 100C then distinguishes the singulated cut products P into good products and defective products based on the images obtained by the inspection camera 8. A transport mechanism (not shown) then transports and stores the good products in a tray 9a for good products and the defective products in a tray 9b for defective products (see FIG. 1).

[0031] <Configuration of the holding member 10 that holds the substrate W or multiple cut pieces P by suction> 2 to 5, in this embodiment, a holding member 10 that sucks and holds the substrate W or a plurality of cut products P is provided on at least one of the cutting table 4, the holding part 61 of the unloader 6, and the inspection table 7. The holding member 10 is made of an elastic resin (rubber material) such as a silicone-based resin or a fluorine-based resin.

[0032] 2 to 5 show a configuration in which the cutting table 4 has a holding member 10, and the holding member 10 is formed with a blade avoidance groove 10M for avoiding the rotary blade 52 during cutting.

[0033] Here, as shown in FIG. 3(a), the substrate W has product portions Wx that are used as products after cutting, and non-product portions Wy that are not used as products after cutting. The product portions Wx are cut into individual cut products P. In this embodiment, a plurality of product portions Wx are arranged in the center, for example, in a vertical and horizontal matrix pattern (for example, a rectangular shape overall), and non-product portions Wy are arranged on the periphery of the plurality of product portions Wx. The arrangement of the product portions Wx and non-product portions Wy is not limited to the above. For example, the non-product portions Wy may be arranged other than on the periphery of the substrate W.

[0034] For this reason, as shown in Figure 3(b), the blade groove 10M is formed in a grid pattern corresponding to the product portion Wx and non-product portion Wy, and the rectangular area surrounded by the blade groove 10M becomes the holding area 10R that holds each product portion Wx of the substrate W.

[0035] In addition, when the holding section 61 of the unloader 6, which adsorbs and holds the plurality of cut products P that have been singulated, has a holding member 10, a holding area 10R is formed corresponding to each of the plurality of cut products P. In addition, when the inspection table 7, which adsorbs and holds the plurality of cut products P that have been singulated, has a holding member 10, a holding area 10R is formed corresponding to each of the plurality of cut products P.

[0036] The holding member 10 is formed with suction holes 10a that suction-hold the substrate W or multiple cut pieces P. In this embodiment, in order to increase the suction force of the suction holes 10a, the opening size of the suction-side opening of the suction holes 10a is enlarged to form pocket portions 10b. The suction holes 10a and the pocket portions 10b are formed inside each holding region 10R in a plan view. Note that, although the pocket portions 10b in FIGS. 2 to 5 are rectangular in a plan view, the shape of the pocket portions 10b in a plan view is not limited to this. Note that the suction holes 10a of the holding member 10 communicate with a suction flow path 40a formed in a holding main body 40 (the table main body in FIG. 2) to which the holding member 10 is attached.

[0037] 4 and 5, the holding member 10 has a plurality of recesses 10c formed on the surface of a holding region 10R that holds the substrate W or a plurality of cut pieces P by means of suction holes 10a. The plurality of recesses 10c serves to reduce the contact area between the surface of the holding region 10R and the substrate W. By forming the plurality of recesses 10c, the contact area is reduced to, for example, 50% to 60% of the contact area when the recesses 10c are not formed, which is 100%.

[0038] Furthermore, the recesses 10c are formed so that the suction holes 10a and the outer space of the holding region 10R do not communicate with each other when the substrate W or the cut pieces P is held therein. Specifically, the recesses 10c are arranged in a grid, stripe, or dot pattern in a plan view. FIG. 4 shows an example in which the recesses 10c are arranged in a dot pattern. Here, the width and depth of each recess 10c are preferably small enough to prevent foreign matter from being trapped in the recess 10c, and are also desirably sized to be unaffected by wear caused by cutting the substrate W (producing the cut pieces P) and cleaning. Specifically, the width and depth of each recess 10c may be, for example, several tens to several hundreds of μm.

[0039] Furthermore, as shown in Figures 4 and 5, the surface of the holding member 10 other than the multiple recesses 10c in the holding region 10R is a roughened surface 10d. This roughened surface 10d improves peeling against vacuum adhesion. In this embodiment, the roughened surface 10d is formed by irradiating the surface other than the multiple recesses 10c in the holding region 10R with laser light. Furthermore, the roughened surface 10d has irregularities that are smaller than the width and depth of the recesses 10c, and is, for example, striped with a pitch of several tens of micrometers.

[0040] <Method of manufacturing the holding member 10> Next, an example of a method for manufacturing the holding member 10 of this embodiment will be described. First, the holding member 10 having the suction holes 10a and the pocket portions 10b formed therein is prepared. In the case of the holding member 10 used for the cutting table 4, a blade avoidance groove 10M for avoiding the rotary blade 52 is formed.

[0041] Then, a laser beam is irradiated onto the surface of the holding region 10R of the holding member 10 to form a plurality of recesses 10c. Here, in consideration of processability, the laser beam can be irradiated to form a plurality of recesses 10c without distinguishing between the suction holes 10a and the pocket portions 10b (or the blade protection grooves 10M, if any).

[0042] After forming the plurality of recesses 10c, a laser beam is irradiated onto the surface other than the plurality of recesses 10c in the holding region 10R of the holding member 10 to form a roughened surface 10d. Here, taking into consideration processability, the surface of the holding region 10R can also be roughened by irradiating with laser beam without distinguishing between the plurality of recesses 10c, the suction holes 10a, and the pocket portions 10b (or the blade protection grooves 10M, if any).

[0043] Since the roughened surface 10d is formed by irradiating with laser light in this manner, it is possible to burn and remove dirt on the surface of the holding region 10R. In particular, by irradiating with laser light to roughen the surface after the recesses 10c are formed, it is possible to burn and remove dirt on the surface caused by the formation of the recesses 10c. In this way, the holding member 10 having the plurality of recesses 10c and the roughened surface 10d formed therein is manufactured.

[0044] <Effects of this embodiment> According to the cutting device 100 of this embodiment, a plurality of recesses 10c are formed on the surface of the holding region 10R that holds the substrate W or the cut product P, thereby reducing the contact area between the holding member 10 and the substrate W and reducing the sticking force, making it possible to easily remove the substrate W or the cut product P after suction is released. Furthermore, the surface of the holding region 10R other than the plurality of recesses 10c is roughened as the surface 10d, reducing the sticking force due to vacuum sticking or the like, making it possible to easily remove the substrate W or the cut product P after suction is released. Therefore, the substrate W or the cut product P can be easily removed after suction is released without impairing the suction force of the holding member 10.

[0045] <Other Modified Embodiments> The present invention is not limited to the above-described embodiment.

[0046] For example, in the above embodiment, the holding member 10 is used on at least one of the cutting table 4, the unloader 6, or the inspection table 7 of the cutting device 100, but if there is another suction mechanism that suction-holds the substrate W or the cut product P, the holding member 10 of the above embodiment may be used for that suction mechanism.

[0047] Furthermore, the holding member 10 of the above embodiment can also be applied to semiconductor manufacturing equipment other than the cutting device 100, for example, a resin molding device such as compression molding or transfer molding, or an inspection device that inspects objects to be inspected such as semiconductor devices.

[0048] In addition, the recess 10c may be formed by, for example, machining such as cutting, chemical treatment using a chemical solution, or mold transfer molding, in addition to the method of irradiating laser light.

[0049] Furthermore, the roughened surface 10d may be formed by machining such as cutting, blasting, or mold transfer molding, in addition to the method of irradiating with laser light.

[0050] Furthermore, in the above embodiment, the holding member 10 has the pocket portion 10b, but the holding member 10 may have a configuration without the pocket portion 10b.

[0051] Furthermore, when the holding member 10 is used for the cutting table 4, as shown in FIGS. 6 to 8, a plurality of second recesses 10e may be formed on the surface of the contact region 10S of the holding member 10, which contacts the non-product portion Wy resulting from cutting the substrate W. The plurality of second recesses 10e reduces the contact area between the surface of the contact region 10S and the non-product portion Wy. By forming the plurality of second recesses 10e, the contact area is reduced to, for example, 20% to 30% of the contact area when the second recesses 10e are not formed, which is 100%. Note that the recesses 10c and roughened surface 10d of the above embodiment are not shown in FIGS. 6 to 8.

[0052] Furthermore, the multiple second recesses 10e communicate with the outside of the contact region 10S when the non-product portion Wy is in contact with the contact region 10S. Here, "communicating with the outside of the contact region 10S" includes the second recesses 10e extending outside the non-product portion Wy in a plan view and opening onto the surface of the holding member 10, or the second recesses 10e being covered by the non-product portion Wy in a plan view but opening onto the side surface 101 of the holding member 10 or the inner surface 102 of the blade groove 10M as shown in FIG. 8. Furthermore, both ends of the second recesses 10e may communicate with the outside of the contact region 10S in a plan view, or one end of the second recesses 10e may communicate with the outside of the contact region 10S. In addition, when one end of the second recess 10e is configured to communicate with the outside of the contact area 10S, it is desirable that one end on the side to which the machining liquid is supplied be configured to communicate with the outside of the contact area 10S.

[0053] Specifically, the plurality of second recesses 10e are arranged in a grid, stripe, or dot pattern in a plan view. FIGS. 7 and 8 show an example in which the plurality of second recesses 10e are arranged in a grid pattern. The width and depth of each second recess 10e are preferably small enough to prevent foreign matter from being trapped in the second recess 10e and to be sized to be unaffected by wear caused by cutting the substrate W (producing the cut product P) and cleaning. Specifically, the width and depth of each second recess 10e may be, for example, several tens to several hundreds of micrometers. The pitch of the plurality of second recesses 10e may be, for example, several tens of micrometers. The plurality of second recesses 10e may be formed by irradiating with laser light, by machining such as cutting, by chemical treatment using a chemical solution, or by mold transfer molding.

[0054] In this way, since multiple second recesses 10e are formed on the surface of the contact region 10S that contacts the non-product portion Wy, the contact area between the holding member 10 and the non-product portion Wy is reduced, reducing the sticking force and making it easier to remove the non-product portion Wy. Furthermore, since the multiple second recesses 10e are connected to the outside of the contact region 10S, the processing liquid can easily flow between the holding member 10 and the non-product portion Wy, making it easier to remove the non-product portion Wy. Therefore, it is possible to prevent the non-product portion Wy resulting from cutting the substrate W from sticking to the holding member 10. Furthermore, it is possible to reduce the amount of processing liquid supplied, thereby saving processing liquid.

[0055] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0056] 100 Cutting equipment (semiconductor manufacturing equipment) W: Substrate (object to be held, transported, or cut) P... Cutting products (semiconductor device) 4. Cutting table 5...Cutting mechanism 6. Unloader (transport device) 61...Holding part 62...Moving mechanism 10. Retaining member 10a...Adsorption hole 10R...Holding area 10c Recess 10d...Roughened surface

Claims

1. A holding member having a suction hole formed therein for suction-holding an object to be held, a pocket portion having an opening size larger than that of the suction hole is formed at an opening on the suction side of the suction hole, a plurality of recesses are formed on a surface of a holding area where the suction holes and the pockets hold the object to be held; A holding member in which the surface other than the plurality of recesses in the holding region is a roughened surface having irregularities smaller than the width and depth of the recesses.

2. The holding member according to claim 1 , wherein the plurality of recesses are formed so that the suction holes and an outer space of the holding area do not communicate with each other when the holding object is held by the recesses.

3. The holding member according to claim 1 , wherein the plurality of recesses are arranged in a grid, stripe, or dot pattern in a plan view.

4. a holding unit that adsorbs and holds the object to be conveyed; a moving mechanism that moves the holding unit, A conveying device, wherein the holding section comprises the holding member according to claim 1 .

5. A cutting table that adsorbs and holds an object to be cut, A cutting table comprising the holding member according to any one of claims 1 to 3.

6. a cutting table that adsorbs and holds the workpiece; a cutting mechanism that cuts the object held on the cutting table, A cutting device, wherein the cutting table comprises a holding member according to any one of claims 1 to 3.

7. A semiconductor manufacturing apparatus for manufacturing individual semiconductor devices by cutting a substrate on which a plurality of semiconductor devices are formed, a cutting table that holds the substrate by suction; a cutting mechanism that cuts the substrate held on the cutting table; a transport mechanism for transporting the individual semiconductor devices from the cutting table, A semiconductor manufacturing apparatus, wherein the cutting table or the transport mechanism comprises the holding member according to claim 1 .

8. A method for manufacturing the holding member according to any one of claims 1 to 3, comprising: A method for manufacturing a holding member, comprising: irradiating a surface of the holding region other than the plurality of recesses with laser light to form the roughened surface.

9. The method for manufacturing a holding member according to claim 8 , wherein the plurality of recesses are formed by irradiating a surface of the holding region with laser light.

10. A method for manufacturing a semiconductor device using the semiconductor manufacturing apparatus according to claim 7, cutting the substrate held on the cutting table with the cutting mechanism; The semiconductor device manufacturing method further comprises carrying out the individual semiconductor devices by the transport mechanism.

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