Package positioning marking method

Abstract

To provide a package positioning marking method of aligning a die bonding apparatus with a die mounting area of a substrate.SOLUTION: A method includes steps of synchronously moving a die bonding apparatus, a reflecting mirror, and a calibration sheet below a first image capture unit until the first image capture unit clearly captures an image of a mark on the calibration sheet with the reflecting mirror to obtain a first template, synchronously moving the die bonding apparatus, the reflecting mirror, and the calibration sheet until the first image capture unit clearly captures the image of the mark on a die mounting area of the substrate, obtaining a position of the die mounting area, moving the substrate below the capture unit, synchronously moving the die bonding apparatus, the reflector, and the calibration sheet to predetermined positions based on the first template and the position of the die mounting area to align the die bonding apparatus with the die mounting area.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a package alignment marking method. [Background technology]

[0002] Integrated circuits are fabricated on semiconductor wafers through multiple processes in batches, and the wafers are then divided into multiple dies. A die is a small, unpackaged integrated circuit body made of semiconductor material. The dies are then neatly attached to a carrier device, which is then carried by a support frame. A die bonding machine then transfers the dies sequentially to a substrate for subsequent processing.

[0003] Since the die bonding device misaligns when adsorbing the die, conventional technology has proposed a package alignment marking method including the steps of: an image capture unit capturing an image of the die bonding device and the die; a processing unit calculating the relative position between the die bonding device and the die based on the image of the die bonding device and the die; and the processing unit moving the die bonding device based on the relative position between the die bonding device and the die, thereby allowing the die bonding device to place the die on the die placement area of ​​the substrate.

[0004] However, when the die bonding apparatus places the die on the die placement area of ​​the substrate, slight misalignment still occurs, making it impossible to place the die on the die placement area of ​​the substrate with high precision.

[0005] To solve the above-mentioned problems, the prior art includes the steps of: two first image capture units respectively capture images of two second image capture units, and the second image capture units respectively capture images of the first image capture units; and a control unit obtains relative positions of the first image capture units and the second image capture units based on the images; the die bonding device adsorbs the die, and the calibration sheet is attached to the die bonding device by a fixing part, and the die bonding device, the fixing part and the calibration sheet are moved synchronously below the first image capturing unit and above the second image capturing unit until the first image capturing units respectively directly and clearly capture the images of the two marks on the calibration sheet, and the second image capturing units respectively directly and clearly capture the images of the die bonding device and the die, so as to obtain a first template and a second template; the first image capture units respectively directly and clearly capturing images of the marks on the proof sheet, wherein the images of the marks on the proof sheet are located at first focal lengths of the first image capture units; moving the substrate under the die bonding machine and aligning two marks outside the die mounting area of ​​the substrate with those marks on the calibration sheet; lowering and moving the first image capturing units until the first image capturing units directly and clearly capture images of the marks outside the die mounting area of ​​the substrate, so as to acquire positions of the die mounting area of ​​the substrate, wherein the marks outside the die mounting area of ​​the substrate are located on second focal lengths of the first image capturing units, and the first focal lengths are equal to the second focal lengths; the control unit moves the die bonding apparatus, the fixing part, and the calibration sheet to predetermined positions synchronously based on the positions of the first template and the die mounting area of ​​the substrate, and the relative positions of the first image capturing unit and the second image capturing unit, to align the die bonding apparatus with the die mounting area of ​​the substrate; the control unit adjusts a horizontal position of the die bonding apparatus based on the positions of the second template and the die mounting area of ​​the substrate, and the relative positions of the first image capturing unit and the second image capturing unit, until the die is aligned with the die mounting area of ​​the substrate; A package alignment marking method has been proposed, which includes the steps of: a die bonding apparatus placing a die on a die placement area of ​​a substrate;

[0006] However, when these first image capture units capture images of these marks on the proof sheet at the first focal length, the images are very blurred, so unless these first image capture units are moved down until the first focal length is equal to the second focal length, these first image capture units cannot clearly capture images of these marks on the proof sheet.

[0007] Note that these marks outside the die mounting area of ​​the substrate must be offset from these marks on the calibration sheet, otherwise they will be blocked by the die bonding device and the calibration sheet. However, if these marks outside the die mounting area of ​​the substrate are far away from the die mounting area, the positions of the marks outside the die mounting area of ​​the substrate that are acquired will not be accurate, and the die bonding device will not be able to be aligned with the die mounting area of ​​the substrate. Summary of the Invention [Problem to be solved by the invention]

[0008] SUMMARY OF THE INVENTION A primary object of the present invention is to provide a package alignment marking method that can align a die bonding apparatus with a die mounting area of ​​a substrate without moving a first image capturing unit.

[0009] Another object of the present invention is to provide a package alignment marking method that can obtain highly accurate positional information of the die mounting area of ​​a substrate. [Means for solving the problem]

[0010] In order to achieve the above object, the present invention provides: (a) synchronously moving a die bonding apparatus, the at least one reflecting mirror, and the at least one calibration sheet under the at least one first image capturing unit so as to obtain a first template, until the at least one first image capturing unit clearly captures an image of at least one mark on the at least one calibration sheet indirectly through reflection of the at least one reflecting mirror, wherein the at least one mark on the at least one calibration sheet is located at a first focal length of the at least one first image capturing unit;

[0011] (b) synchronously moving the die bonding apparatus, the at least one reflecting mirror, and the at least one calibration sheet away from the at least one first image capturing unit, and moving the substrate under the at least one first image capturing unit, until the at least one first image capturing unit clearly captures an image of at least one mark on the die mounting area of ​​the substrate directly, so as to obtain the position of the die mounting area of ​​the substrate, wherein the at least one mark on the die mounting area of ​​the substrate is located at a second focal length of the at least one first image capturing unit, and the first focal length is equal to the second focal length;

[0012] (c) a control unit synchronously moves the die bonding device, the at least one reflecting mirror, and the at least one calibration sheet to predetermined positions based on the positions of the first template and the die mounting area of ​​the substrate, so as to align the die bonding device with the die mounting area of ​​the substrate.

[0013] In some embodiments, step (a) further includes: the die bonding apparatus adsorbing the at least one die, and synchronously moving the die bonding apparatus, the at least one reflecting mirror, and the at least one calibration sheet above the at least one second image capturing unit until the at least one second image capturing unit directly and clearly captures an image of the die bonding apparatus and the die, so as to obtain a second template; After step (c), (d) the control unit adjusts a horizontal position of the die bonding apparatus based on positions of the second template and the die mounting area of ​​the substrate until the die is aligned with the die mounting area of ​​the substrate;

[0014] (e) placing the die on the die-mounting area of ​​the substrate by the die-bonding device.

[0015] In some embodiments, before step (a), the method further includes the steps of: (f) the at least one first image capture unit captures an image of the at least one second image capture unit, and the at least one second image capture unit captures an image of the at least one first image capture unit, and the control unit obtains a relative position of the at least one first image capture unit and the at least one second image capture unit based on these images; Step (c) further includes the step of: the control unit synchronously moving the die bonding apparatus, the at least one reflecting mirror, and the at least one calibration sheet to the predetermined positions based on the relative positions of the first template, the die mounting area of ​​the substrate, and the at least one first image capturing unit and the at least one second image capturing unit; Step (d) further includes the control unit adjusting the horizontal position of the die bonding apparatus based on the relative positions of the second template, the die mounting area of ​​the substrate, and the at least one first image capturing unit and the at least one second image capturing unit.

[0016] In some embodiments, the number of the at least one first image capturing unit is plural, the number of the at least one second image capturing unit is plural, the number of the at least one reflecting mirror is plural and the directions of the reflecting surfaces are opposite, and the number of the at least one calibration sheet is plural and each is located on one side of the reflecting surface of the reflecting mirror.

[0017] In some embodiments, the number of the at least one first image capturing unit is one, the number of the at least one second image capturing unit is one, the number of the at least one reflecting mirror is one, and the at least one calibration sheet is located on the side of the reflective surface of the reflecting mirror. [Effects of the Invention]

[0018] According to the method of the present invention, a first template is first obtained by the first image capture unit, the die bonding device, the reflecting mirror, and the calibration sheet, and the position of the die mounting area of ​​the substrate is also obtained by the first image capture unit. The first focal length can be equal to the second focal length, so that even if the first image capture unit is kept stationary, the technical effect that the die bonding device, the reflecting mirror, and the calibration sheet can be moved to a predetermined position synchronously can be achieved.

[0019] Furthermore, according to the method of the present invention, even when the die bonding device, the reflecting mirror, and the calibration sheet are separated from the first image capturing unit, the first image capturing unit can directly and clearly capture the image of the mark on the die mounting area of ​​the substrate, so the position of the die mounting area of ​​the substrate can be acquired with very high accuracy. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a flowchart of a method according to the present invention. [Figure 2] FIG. 2 is a schematic diagram of step S10 of a first embodiment of the method according to the present invention. [Figure 3] FIG. 2 is a schematic diagram showing the connection relationship of all parts of the present invention. [Figure 4] FIG. 2 is a schematic diagram of step S20 of the first embodiment of the method according to the present invention. [Figure 5] FIG. 2 is a schematic diagram of step S30 of a first embodiment of the method according to the present invention. [Figure 6] FIG. 2 is a schematic diagram of step S40 of the first embodiment of the method according to the present invention. [Figure 7] FIG. 2 is a schematic diagram of step S50 of a first embodiment of the method according to the present invention. [Figure 8] FIG. 2 is a schematic diagram of step S60 of the first embodiment of the method according to the present invention. [Figure 9] FIG. 4 is a schematic diagram of step S10 of a second embodiment of the method according to the present invention. [Figure 10]FIG. 4 is a schematic diagram of step S20 of a second embodiment of the method according to the present invention. [Figure 11] FIG. 4 is a schematic diagram of step S30 of a second embodiment of the method according to the present invention. [Figure 12] FIG. 4 is a schematic diagram of step S40 of a second embodiment of the method according to the present invention. [Figure 13] FIG. 4 is a schematic diagram of step S50 of a second embodiment of the method according to the present invention. [Figure 14] FIG. 4 is a schematic diagram of step S60 of a second embodiment of the method according to the present invention. [Figure 15] FIG. 4 is a schematic diagram of step S10 of a third embodiment of the method according to the present invention. [Figure 16] FIG. 4 is a schematic diagram of step S20 of a third embodiment of the method according to the present invention. [Figure 17] FIG. 4 is a schematic diagram of step S30 of a third embodiment of the method according to the present invention. [Figure 18] FIG. 4 is a schematic diagram of step S40 of a third embodiment of the method according to the present invention. [Figure 19] FIG. 4 is a schematic diagram of step S50 of a third embodiment of the method according to the present invention. [Figure 20] FIG. 4 is a schematic diagram of step S60 of a third embodiment of the method according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will now be described in more detail in conjunction with the drawings and reference numerals so that those skilled in the art can practice the present invention after reading this specification.

[0022] FIG. 1 is a flowchart of the method according to the present invention. FIG. 2 is a schematic diagram of step S10 of the first embodiment of the method according to the present invention. FIG. 3 is a schematic diagram of the connection relationship of all parts of the present invention. FIG. 4 is a schematic diagram of step S20 of the first embodiment of the method according to the present invention. FIG. 5 is a schematic diagram of step S30 of the first embodiment of the method according to the present invention. FIG. 6 is a schematic diagram of step S40 of the first embodiment of the method according to the present invention. FIG. 7 is a schematic diagram of step S50 of the first embodiment of the method according to the present invention. FIG. 8 is a schematic diagram of step S60 of the first embodiment of the method according to the present invention. The present invention provides a package alignment marking method including steps S10 to S60, which will be described below.

[0023] In step S10, as shown in Figures 1, 2 and 3, the two first image capturing units 10 respectively capture images of the two second image capturing units 20, and the second image capturing units 20 respectively capture images of the first image capturing units 10, and the control unit 30 obtains the relative positions of the first image capturing units 10 and the second image capturing units 20 based on the multiple images.

[0024] In step S20, as shown in FIGS. 1 and 4, the first image capturing units 10 indirectly and clearly capture images of the two marks 71 on the two calibration sheets 70 respectively through reflection from the two reflecting mirrors 60 in opposite directions, so as to obtain the first template and the second template, and the die bonding device 40 adsorbs a single die 50, and synchronously moves the die bonding device 40, the reflecting mirrors 60, and the calibration sheets 70 on one side of the reflecting surfaces of the reflecting mirrors 60 below the first image capturing units 10 and above the second image capturing units 20 until the second image capturing units 20 directly and clearly capture images of the die bonding device 40 and the die 50 respectively, and at this time, the marks 71 on the calibration sheets 70 are located at the first focal length F1 of the first image capturing units 10.

[0025] In step S30, as shown in FIGS. 1 and 5, the die bonding apparatus 40, the reflectors 60, and the calibration sheets 70 are synchronously moved away from the first image capturing units 10, and the substrate 80 is moved below the first image capturing units 10, until the first image capturing units 10 directly and clearly capture images of the two marks 82 on the die placing area 81 of the substrate 80, so as to obtain the position of the die placing area 81 of the substrate 80, and at this time, the marks 82 on the die placing area 81 of the substrate 80 are located at a second focal length F2 of the first image capturing units 10, and the first focal length F1 is equal to the second focal length F2.

[0026] In step S40, as shown in FIGS. 1, 3 and 6, the control unit 30 aligns the die bonding device 40 with the die placing area 81 of the substrate 80 by synchronously moving the die bonding device 40, the reflecting mirrors 60 and the calibration sheets 70 to predetermined positions based on the positions of the first template, the die placing area 81 of the substrate 80, and the relative positions of the first image capturing unit 10 and the second image capturing unit 20.

[0027] In step S50, as shown in Figures 1, 3 and 7, the control unit 30 adjusts the horizontal position of the die bonding apparatus 40 based on the positions of the second template, the die mounting area 81 of the substrate 80, and the relative positions of these first image capturing units 10 and these second image capturing units 20 until the die 50 is aligned with the die mounting area 81 of the substrate 80.

[0028] In step S60, as shown in FIGS. 1 and 8, the die 50 is placed on the die placement area 81 of the substrate 80 by the die bonding device 40.

[0029] In some embodiments, the number of these first image capturing units 10, these second image capturing units 20, these reflectors 60 and these calibration sheets 70 may be two or more, each calibration sheet 70 may have multiple marks 71, and the die bonding device 40 may adsorb multiple dies 50.

[0030] Fig. 9 is a schematic diagram of step S10 of the second embodiment of the method according to the present invention. Fig. 10 is a schematic diagram of step S20 of the second embodiment of the method according to the present invention. Fig. 11 is a schematic diagram of step S30 of the second embodiment of the method according to the present invention. Fig. 12 is a schematic diagram of step S40 of the second embodiment of the method according to the present invention. Fig. 13 is a schematic diagram of step S50 of the second embodiment of the method according to the present invention.

[0031] 14 is a schematic diagram of step S60 of a second embodiment of the method according to the present invention. As shown in FIGS. 9 to 14, the second embodiment differs from the first embodiment in that there is one first image capture unit 10A, one second image capture unit 20A, one reflector 60A with its reflective surface facing left, the calibration sheets 70 are located on one side of the reflective surface of the reflector 60A and are vertically arranged, and the die bonding device 40 adsorbs multiple dies 50. In some embodiments, the calibration sheets 70 may be horizontally or randomly arranged, and each calibration sheet 70 has multiple marks 71.

[0032] FIG. 15 is a schematic diagram of step S10 of a third embodiment of a method according to the present invention. FIG. 16 is a schematic diagram of step S20 of a third embodiment of a method according to the present invention. FIG. 17 is a schematic diagram of step S30 of a third embodiment of a method according to the present invention. FIG. 18 is a schematic diagram of step S40 of a third embodiment of a method according to the present invention. FIG. 19 is a schematic diagram of step S50 of a third embodiment of a method according to the present invention. FIG. 20 is a schematic diagram of step S60 of a third embodiment of a method according to the present invention. As shown in FIGS. 15 to 20, the difference between the third embodiment and the second embodiment is that the reflective surface of the reflecting mirror 60B faces right, and the calibration sheets 70 are located on one side of the reflective surface of the reflecting mirror 60B. In some embodiments, the calibration sheets 70 may be arranged horizontally or randomly, and each calibration sheet 70 has a plurality of marks 71.

[0033] As described above, according to the method of the present invention, the first template is first obtained by the first image capture unit 10, 10A, the die bonding device 40, the reflecting mirror 60, 60A, and the calibration sheet 70, and the position of the die mounting area 81 of the substrate 80 is also obtained by the first image capture unit 10, 10A. Since the first focal length F1 can be equal to the second focal length F2, even if the first image capture unit 10, 10A is kept stationary, the die bonding device 40, the reflecting mirror 60, 60A, and the calibration sheet 70 can be moved to predetermined positions synchronously.

[0034] In addition, in the method of the present invention, even when the die bonding device 40, the reflecting mirrors 60, 60A, and the calibration sheet 70 are separated from the first image capturing unit 10, 10A, the first image capturing unit 10, 10A can directly and clearly capture the image of the mark 82 on the die mounting area 81 of the substrate 80, so the position of the die mounting area 81 of the substrate 80 obtained by the method of the present invention is very accurate.

[0035] In addition, according to the method of the present invention, the second template can be first obtained by the second image capture unit 20, 20A, and the position of the die mounting area 81 of the substrate 80 can be obtained by the first image capture unit 10, 10A, so that the horizontal position of the die bonding device 40 can be adjusted to ensure that the die 50 is aligned with the die mounting area 81 of the substrate 80.

[0036] In addition, according to the method of the present invention, the relative positions of the first image capturing unit 10, 10A and the second image capturing unit 20, 20A are first obtained, and then the accuracy of synchronously moving the die bonding device 40, the reflecting mirrors 60, 60A, and the calibration sheet 70 to predetermined positions and the accuracy of adjusting the horizontal position of the die bonding device 40 can be improved based on the relative positions of the first image capturing unit 10, 10A and the second image capturing unit 20, 20A.

[0037] The above is only to explain the preferred embodiments of the present invention, and is not intended to limit the present invention in any way. Any modifications or variations of the present invention made under the same inventive concept are also included in the intended scope of protection of the present invention. [Explanation of symbols]

[0038] 10, 10A First image capture unit 20, 20A Second image capture unit 30 Control Unit 40 Die bonding equipment 50 Die 60, 60A reflector 70 Proofreading Sheets 71, 82 marks 80 boards 81 Die placement area F1 first focal length F2 first focal length S10~S60 steps

Claims

1. 1. A package alignment marking method, comprising: (a) synchronously moving a die bonding apparatus, the at least one reflecting mirror, and the at least one calibration sheet under the at least one first image capturing unit until the at least one first image capturing unit clearly captures an image of at least one mark on the at least one calibration sheet indirectly by one reflection of the at least one reflecting mirror, so as to obtain a first template, wherein the at least one mark on the at least one calibration sheet is located at a first focal length of the at least one first image capturing unit; (b) synchronously moving the die bonding apparatus, the at least one reflecting mirror, and the at least one calibration sheet away from the at least one first image capturing unit, and moving the substrate under the at least one first image capturing unit, until the at least one first image capturing unit directly and clearly captures an image of at least one mark on the die mounting area of ​​the substrate, so as to obtain the position of the die mounting area of ​​the substrate, wherein the at least one mark on the die mounting area of ​​the substrate is located at a second focal length of the at least one first image capturing unit, and the first focal length is equal to the second focal length; (c) a control unit synchronously moves the die bonding apparatus, the at least one reflecting mirror, and the at least one calibration sheet to predetermined positions based on positions of the first template and the die mounting area of ​​the substrate, so as to align the die bonding apparatus with the die mounting area of ​​the substrate; Before step (a), (f) the at least one first image capture unit captures an image of the at least one second image capture unit, the at least one second image capture unit captures an image of the at least one first image capture unit, and the control unit acquires a relative position of the at least one first image capture unit and the at least one second image capture unit based on these images. Package positioning marking method.

2. Step (a) further includes the steps of: the die bonding device adsorbs the at least one die, and the die bonding device, the at least one reflecting mirror, and the at least one calibration sheet are moved synchronously above the at least one second image capturing unit until the at least one second image capturing unit directly and clearly captures an image of the die bonding device and the die, so as to obtain a second template; After step (c), (d) the control unit adjusts a horizontal position of the die bonding apparatus based on positions of the second template and the die mounting area of ​​the substrate until the die is aligned with the die mounting area of ​​the substrate; (e) placing the die on the die placement area of ​​the substrate by the die bonding apparatus; 2. The package alignment marking method of claim 1.

3. Step (c) further includes a step in which the control unit synchronously moves the die bonding device, the at least one reflecting mirror, and the at least one calibration sheet to the predetermined positions based on the first template, the position of the die mounting area of ​​the substrate, and the relative positions of the at least one first image capturing unit and the at least one second image capturing unit; and step (d) further includes the control unit adjusting a horizontal position of the die bonding apparatus based on the relative positions of the second template, the die mounting area of ​​the substrate, and the at least one first image capturing unit and the at least one second image capturing unit.

3. The package alignment marking method according to claim 2.

4. the number of the at least one first image capturing unit is plural; the number of the at least one second image capturing unit is plural; The number of the at least one reflecting mirror is plural, and the directions of the reflecting surfaces are opposite to each other; The at least one calibration sheet is plural in number, and each calibration sheet is located on one side of the reflecting surface of the reflector.

4. The package positioning marking method according to claim 2 or 3.

5. the number of the at least one first image capturing unit is one; the number of the at least one second image capturing unit is one; the number of the at least one reflecting mirror is one, the at least one calibration sheet is located on the side of the reflecting surface of the reflector; 4. The package positioning marking method according to claim 2 or 3.

Images