Processing method and charged particle beam apparatus

JP7833571B2Active Publication Date: 2026-03-19HITACHI HIGH TECH CORP
View PDF 6 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-01-31
Publication Date
2026-03-19

AI Technical Summary

Technical Problem

Existing FIB systems require expert judgment for selecting appropriate processing based on sample observations, and setting parameters for each sample is cumbersome.

Method used

A charged particle beam apparatus that automatically identifies defects in sample layers using a trained model and performs processing based on defect type or shape, eliminating the need for human judgment and simplifying the setup process.

Benefits of technology

Enables automatic processing of sample cross-sections based on the sample's state, reducing the need for expert intervention and simplifying the workflow.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007833571000001
    Figure 0007833571000001
  • Figure 0007833571000002
    Figure 0007833571000002
  • Figure 0007833571000003
    Figure 0007833571000003
Patent Text Reader

Abstract

This charged particle beam device processes a sample in which a plurality of layers including a specific layer are stacked. The charged particle beam device comprises: a focused ion beam column; a charged particle beam column; and a processor. The charged particle beam device performs a process for exposing the specific layer. After it is determined that the specific layer is exposed, the processor determines whether there is a defect on the basis of reference data regarding the specific layer and an observed image. When it is determined that there is a defect, the processor uses a trained model to identify the type of the defect on the basis of the observed image of the sample. The charged particle beam device performs a different process depending on whether the defect is present and / or depending on the identified type of defect.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Defect inspection analysis system, defect inspection analysis method and management computer used for the method

    JP2008066633A

  • Cross section processing observation method, cross section processing observation apparatus

    JP2015050126A

  • Charged particle beam irradiation device and control method

    JP2021051878A

  • Methods of cross-section imaging of an inspection volume in a wafer

    US20220392793A1

  • SEM type defect observation device and defect image acquiring method

    WO2011114403A1