Feed-through wiring solution for solar cell modules

The solar cell module design with laminated substrates and conductor pads addresses the inefficiencies of manual wiring by enabling a flat, densely packed array with reduced costs and improved performance.

JP7834438B2Active Publication Date: 2026-03-24THE BOEING CO
View PDF 18 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-08-10
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

Existing solar cell module wiring solutions require manual labor for routing and create non-uniform surfaces, limiting efficient packing and increasing manufacturing costs.

Method used

A solar cell module design using a laminated substrate with conductor pads and vias to connect pads through the substrate, eliminating the need for manual wiring and gaps, allowing for a flat surface and efficient packing.

Benefits of technology

Enables a more densely packed solar cell array with reduced manufacturing costs and improved efficiency by eliminating manual labor and gaps, providing a uniform front surface for better integration and performance.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007834438000001
    Figure 0007834438000001
  • Figure 0007834438000002
    Figure 0007834438000002
  • Figure 0007834438000003
    Figure 0007834438000003
Patent Text Reader

Abstract

To enable tighter packing of solar array modules and simplifies an array level assembly, while also providing a uniform front-side height.SOLUTION: The present disclosure provides a solar cell module, comprising (a) a laminate substrate having a first surface and a second surface opposite the first surface, (b) a solar cell positioned on the first surface of the laminate substrate, (c) a first conductor pad positioned on the first surface of the laminate substrate adjacent to the solar cell, (d) a second conductor pad positioned on the second surface of the laminate substrate, (e) one or more vias positioned through the laminate substrate to electrically connect the first conductor pad to the second conductor pad, and (f) one or more interconnects extending from the solar cell and electrically coupling the solar cell to the first conductor pad.SELECTED DRAWING: None
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001]

[0001] This disclosure relates generally to solar cell modules, and more specifically to through-wiring solutions for solar cell arrays including a plurality of solar cell modules.

Background Art

[0002]

[0002] Solar arrays are generally composed of a plurality of solar cell modules connected together to generate electricity. In order to carry the electricity to other devices, wiring must be completed across the entire solar cell module. Existing methods for extracting current from individual solar cell modules and sending them to the power bus for the solar cell array involve flexible tabs extending from the edges of each solar cell module or wiring welded or soldered to traces on the front side of each solar cell module. Therefore, obtaining power from the front side to the back side of a solar cell module usually involves either allocating sufficient space between solar cell modules to allow the wiring or flexible tabs to be wound around the back side of the assembly, or including through-holes in the assembly to pass the wiring from the front to the back of the solar cell module.

[0003]

[0003] Both of these options require manual labor to perform routing with a sufficient radius to avoid the joints opening due to the stress of circulating heat. These wiring solutions also create a non-uniform front surface at the edges of the solar cell modules, making them less than ideal for certain desired applications. Therefore, a solar module design that allows for a more rigid packing of adjacent solar array modules, simplifies the array-level assembly, and at the same time provides a uniform front surface height may be desirable.

Summary of the Invention

[0004]

[0004] In one embodiment, the present disclosure provides a solar cell module. The solar cell module includes (a) a laminated substrate having a first surface and a second surface facing the first surface; (b) a solar cell positioned on the first surface of the laminated substrate; (c) a first conductor pad positioned on the first surface of the laminated substrate adjacent to the solar cell; (d) a second conductor pad positioned on the second surface of the laminated substrate; (e) one or more vias positioned through the laminated substrate to electrically connect the first conductor pad to the second conductor pad; and (f) one or more interconnectors extending from the solar cell and electrically connecting the solar cell to the first conductor pad.

[0005]

[0005] In another aspect, the present disclosure provides a solar cell array. The solar cell array comprises a plurality of solar cell modules (a), each of which comprises a panel (b) connected to the laminate of each of the plurality of solar cell modules, each comprising (i) a laminate substrate having a first surface and a second surface facing the first surface, (ii) a solar cell positioned on the first surface of the laminate substrate, (iii) a first conductor pad positioned on the first surface of the laminate substrate adjacent to the solar cell, (iv) a second conductor pad positioned on the second surface of the laminate substrate, (v) one or more vias positioned through the laminate substrate to electrically connect the first conductor pad to the second conductor pad, and (vi) one or more interconnectors extending from the solar cell and electrically connecting the solar cell to the first conductor pad, wherein adjacent solar cell modules of the plurality of solar cell modules are in contact with each other without any gaps between them.

[0006]

[0006] In yet another embodiment, a method for manufacturing a solar cell module is described. This method includes (a) positioning a solar cell on a first surface of a laminated substrate, (b) positioning a first conductor pad on a first surface of a laminated substrate adjacent to the solar cell, (c) positioning a second conductor pad on a second surface of a laminated substrate, (d) forming one or more vias through the laminated substrate to electrically connect the first conductor pad to the second conductor pad, and (e) electrically connecting one or more interconnection portions extending from the solar cell to the first conductor pad.

[0007]

[0007] The features, functions, and advantages described above may be realized individually in various embodiments or incorporated into yet another embodiment, and further details of such yet another embodiment can be understood by referring to the following description and drawings.

[0008]

[0008] Novel features that may be considered characteristics of exemplary embodiments are specified in the appended claims. However, the embodiments and preferred modes of use, their further purposes and descriptions will be best understood by reading the following detailed description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings. [Brief explanation of the drawing]

[0009] [Figure 1A]

[0009] This is a side cross-sectional view of a solar cell module according to an exemplary implementation. [Figure 1B]

[0010] This is a side cross-sectional view of another solar cell module relating to an exemplary implementation. [Figure 2A]

[0011] This is a top view of a solar cell array, illustrating an exemplary implementation. [Figure 2B]

[0012] This is a side cross-sectional view of the solar cell array shown in Figure 2A, which is an exemplary implementation. [Figure 3]

[0013] An example implementation of a solar cell array is shown in the form of a functional block diagram. [Figure 4]

[0014] This is a flowchart illustrating an exemplary implementation and method. [Modes for carrying out the invention]

[0010]

[0015] The embodiments disclosed hereafter will be described more comprehensively with reference to the accompanying drawings, but the accompanying drawings show only some, not all, of the embodiments disclosed. In practice, several different embodiments may be provided, and these should not be interpreted as being limited to the embodiments specified herein. Rather, these embodiments are described in order to make this disclosure comprehensive and complete, and to fully convey the scope of this disclosure to those skilled in the art.

[0011]

[0016] In the following description, numerous specific details are provided to offer a comprehensive understanding of the disclosed concepts; however, these concepts can be practiced without some or all of these details. In other instances, details of known apparatus and / or processes are omitted to avoid unnecessarily complicating the disclosure. Some concepts will be described in conjunction with specific embodiments; however, it should be understood that these embodiments are not intended to be limiting.

[0012]

[0017] In Figure 4, blocks represent operations and / or parts thereof, and the lines connecting the various blocks do not suggest any particular order or dependency of operations or parts thereof. It will be understood that not all dependencies between the various disclosed processes are necessarily represented. Figure 4 and the accompanying disclosures illustrating the operations of one or more methods specified herein should not necessarily be interpreted as determining the sequence in which the operations should be performed. Rather, even if one exemplary order is shown, it should be understood that the sequence of operations may be modified where appropriate. Thus, certain operations may be performed in different orders or simultaneously. Furthermore, those skilled in the art will recognize that it is not necessary to perform all the operations described.

[0013]

[0018] Unless otherwise indicated, terms such as “first,” “second,” etc., are used solely as symbols in this specification and are not intended to impose any sequential, positional, or hierarchical requirements on the items they represent. Furthermore, a reference to, for example, item “second,” does not require or exclude the existence of items numbered, for example, “first” or a smaller number, and / or items numbered, for example, “third” or a larger number.

[0014]

[0019] In this specification, the term "one example" means that one or more features, structures, or properties described in relation to that example are included in at least one implementation. The expression "one example," which appears frequently in this specification, may or may not refer to the same example.

[0015]

[0020] In this specification, a system, apparatus, device, structure, article, element, component, or hardware "configured to" perform a particular function does not mean that it is actually capable of performing that particular function without any modification, and is merely capable of performing that particular function after further modification. In other words, a system, apparatus, structure, article, element, component, or hardware "configured to" perform a particular function is specifically selected, produced, implemented, used, programmed, and / or designed for the purpose of performing that particular function. In this specification, the expression "configured to" means that there are characteristics of the system, apparatus, structure, article, element, component, or hardware that enable the system, apparatus, structure, article, element, component, or hardware to perform a particular function without further modification. In this disclosure, any system, apparatus, structure, article, element, component, or hardware described as “configured / set up to” perform a particular function may additionally or alternatively be described as “adapted to” and / or “operative to” perform that function.

[0016]

[0021] In this specification, with respect to measurement, "substantially flat" means a surface that does not have any features protruding from it.

[0017]

[0022] Unless otherwise noted, the elements depicted in the drawings are not necessarily drawn to the correct scale.

[0018]

[0023] Exemplary and non-exclusive embodiments of the subject matter of this disclosure, which may or may not be claimed, are provided below.

[0019]

[0024] The present disclosure provides a solar cell module, a solar cell array including a plurality of solar cell modules, and methods of manufacturing them. In particular, the present disclosure provides a low-profile, high-packing density, reduced manufacturing cost solution for collecting power from modular solar cells or flexible array assemblies. Replacing a conventional Kapton® polyimide film substrate with a thin laminate including front-side landing pads and back-side wiring routes with one or more vias instead of feed-through locations results in eliminating the need to allocate any of the gaps, tabs, or front-side height clearances for coiled wiring for conventional feed-through wiring routing. The solar cell module designs described herein may also result in a reduction of manufacturing cost and difficulty due to any redundancy of either conventional approach. Further, the designs described herein enable a tighter packing of adjacent solar array modules and can simplify array-level assembly, along with providing a uniform front-side surface height. The ability to maintain a flat front-side surface while eliminating both the gap and labor required to wrap flexible tabs or wiring to the back side provides a competitive advantage at the solar cell array level in terms of cost, packing density, and reliability.

[0020]

[0025] These improvements and others are described in more detail below. The implementations described below are for purposes of illustration. The implementations described below, as well as other implementations, may provide other improvements.

[0021]

[0026] With respect to the drawings, Figure 1A is a side cross-sectional view of a solar cell module 100 according to an embodiment. As shown in Figure 1A, the solar cell module 100 includes a laminated substrate 102 having a first surface 104 and a second surface 106 facing the first surface 104. The thickness of the laminated substrate 102 is from about 3 mm to about 5 mm. In one embodiment, the laminated substrate 102 includes a fiberglass printed circuit board insulating material. The laminated substrate 102 includes an insulating material that can withstand the rigidity of space. At the proposed thickness of 3 mm to 5 mm, the laminated substrate 102 is still moderately flexible, allowing for integration into a flexible modular array solution or integration as the top layer in a rigid modular array. In one embodiment, the laminated substrate 102 is flexible. This configuration is used when the solar cell module 100 described herein is used in a flexible modular array solution. In another embodiment, the laminated substrate 102 is rigid. Such a configuration is used when the solar cell module 100 described herein is used in a rigid modular array. Therefore, the solar cell module 100 described herein can be used in a wide variety of solar cell arrays.

[0022]

[0027] The solar cell module 100 further includes a solar cell 108 positioned on a first surface 104 of a laminated substrate 102. The solar cell 108 can be of various sizes and shapes and comprises any structure for absorbing light from a light source and generating an electrical output accordingly. In one embodiment, the solar cell 108 includes a single solar cell. In another embodiment, the solar cell 108 includes a plurality of solar cells connected in series on the first surface 104 of the laminated substrate 102, and the solar cell 108 is one of the plurality of solar cells.

[0023]

[0028] The solar cell module 100 further includes a first conductor pad 110 positioned on a first surface 104 of a laminated substrate 102 adjacent to a solar cell 108, and a second conductor pad 112 positioned on a second surface 106 of the laminated substrate 102. In one embodiment, the first conductor pad 110 and the second conductor pad 112 each include a conductive material. In one particular embodiment, the first conductor pad 110 and the second conductor pad 112 each include a copper material. In such an embodiment, the copper material includes cladding or patterning on the first conductor pad 110 and the second conductor pad 112. In one embodiment, the second conductor pad 112 includes a landing pad for connecting the solar cell module 100 to a rear harness or a substrate insert. In another embodiment, the second conductor pad 112 includes a trace pattern behind the laminated substrate 102 and exchanges wiring for a portion of a harness. In yet another embodiment, the second conductor pad 112 is patterned with output wiring 113 to carry the power obtained by the solar cell 108 to other devices.

[0024]

[0029] As further shown in FIG. 1A, the solar cell module 100 further includes one or more vias 114 positioned through the laminated substrate 102 to electrically connect the first conductor pad 110 to the second conductor pad 112. In one embodiment, each of the one or more vias 114 is plated with a metal material, thereby including a through-hole 116 that includes an inner surface 118 for electrically connecting the first conductor pad 110 to the second conductor pad 112. In one particular embodiment, the metal material includes copper, although other conductive materials are possible.

[0025]

[0030] The solar cell module 100 further includes one or more interconnectors 120 extending from the solar cell 108 and electrically connecting the solar cell 108 to the first conductor pad 110. The one or more interconnectors 120 include metal foil or other conductive material. In one embodiment, the one or more interconnectors 120 include end tabs welded, soldered, or electrically joined to the first conductor pad 110. In another embodiment, the one or more interconnectors 120 are welded, soldered, or directly electrically joined to the first conductor pad 110 without end tabs. In any case, the one or more interconnectors 120 electrically connect the solar cell 108 to the first conductor pad 110.

[0026]

[0031] In one embodiment, as shown in Figure 1A, the solar cell module 100 further includes a cover glass 122 positioned on the upper surface of the solar cell 108. In such an embodiment, the solar cell module 100 further includes a glass adhesive 124 positioned between the cover glass 122 and the solar cell 108. In another embodiment, a circuit adhesive 126 is positioned between the solar cell 108 and the laminated substrate 102. In one embodiment, the circuit adhesive 126 includes a pressure-sensitive adhesive tape. As shown in Figure 1A, the upper surface of the cover glass 122 and the upper surface of the first conductor pad 110 define the upper surface 128 of the solar cell module 100. As shown in Figure 1A, the upper surface 128 of the solar cell module is substantially flat. Therefore, the solar cell module 100 does not have any features that protrude from the upper surface 128 of the solar cell module 100 that are higher than the surface of the solar cell 108 itself. In the embodiment shown in Figure 1A, the cover glass 122 covers the solar cell 108, but does not cover the first conductor pad 110.

[0027]

[0032] Figure 1B is a side cross-sectional view of another configuration of the solar cell module 100 relating to an exemplary implementation. The advantage of the configurations of the solar cell module 100 shown in Figures 1A and 1B is that there are no wires with a diameter that would normally protrude above the top surface of the solar cell 108. This is not the case in conventional solar cell configurations. Therefore, as shown in Figure 1B, the solar cell module 100 provides a sufficiently flat front surface and is suitable for applications where it is desirable to bond a single large cover glass 122 to the entire solar cell module 100, thereby covering both the solar cell 108 and the first conductor pad 110. Furthermore, as will be described in more detail later, such a configuration allows the single cover glass 122 to extend between adjacent solar cell modules 100 in a solar cell array.

[0028]

[0033] Figure 2A is a top view of a solar cell array 130 according to an embodiment. As shown in Figure 2A, the solar cell array 130 includes a plurality of solar cell modules 100, each of which includes the features of the solar cell module 100 described with respect to Figures 1A and 1B. The solar cell array 130 further includes panels 132 connected to each of the laminated substrates 102 of the plurality of solar cell modules 100. The panels 132 provide not only a surface for fixing the plurality of solar cell modules 100, but also a power bus that receives power from a second conductive pad 112. Adjacent solar cell modules of the plurality of solar cell modules 100 are in contact with each other without any gaps between them. Such a configuration provides a more densely packed modular solar cell array 130, which increases the efficiency of the solar cell array 130, improves power density, and enhances overall performance.

[0029]

[0034] Figure 2B is a side cross-sectional view of the solar cell array 130 of Figure 2A according to an embodiment. As shown in Figure 2B, adjacent solar cell modules of the multiple solar cell modules 100 are in contact with each other without any gaps between them. The upper surfaces of the solar cells 108 and the first conductor pad 110 define the upper surfaces 128 of each solar cell module 100, together forming the upper surface 140 of the solar cell array 130. As shown in Figure 2B, the upper surface 140 of the solar cell array 130 is substantially flat. Therefore, the upper surface 140 of the solar cell array 130 does not have any features that protrude from the top surface, being higher than the surface of the solar cells 108 themselves. In one embodiment, as shown in Figure 2B, a single cover glass 122 is provided over the multiple solar cell modules 100 of the solar cell array 130. In another embodiment, separate cover glasses 122 cover each individual solar cell module 100. In yet another embodiment, the cover glass 122 covers two or more solar cell modules 100 of the solar cell array 130. Each of these configurations is possible because the top surface 140 of the solar cell array 130 is substantially flat.

[0030]

[0035] The above configuration, with a substantially flat top surface of the solar cell module 100 and a corresponding substantially flat top surface of the solar cell array 130, offers a wide range of advantages over solar cell modules with protruding features. Firstly, the flat surface of the solar cell module allows such modules to be compatible with both folded and rolled array housings, so they can be fitted into a smaller housing space inside the launch vehicle without the need to ensure static or dynamic clearance for protruding components, which typically complicates conventional flat panel array designs. Furthermore, the protruding components of conventional configurations reduce the unit housing space (W / m²). 3) limits power per unit capacity. Therefore, the flat surface of the solar cell module 100 described herein provides the benefit of a more efficient solar cell system. Furthermore, the flat surface of the solar cell module 100 described herein enables compatibility with applications where it is desirable to have a single cover glass 122 added to the entire module, as shown in Figure 1B, for reasons of manufacturability / cost savings or mission-environment survivability.

[0031]

[0036] Figure 3 shows a solar cell array 130 in the form of a functional block diagram. As shown in Figure 3, the solar cell array 130 includes a panel 132 having one or more solar cell modules 100 positioned on the panel. In one embodiment, the panel 132 is rigid. In another embodiment, the panel 132 is flexible (e.g., mesh backing). One or more solar cell modules 100 are connected in series linearly, for example, from top to bottom of each row of solar cell modules 100. In one embodiment, each row of solar cell modules 100 is terminated with a metal strip at the top and / or bottom of the row, and multiple rows are connected together with wires at the top and / or bottom of each row. Alternatively, the solar cell modules 100 are connected in series linearly, for example, from left to right of each row of solar cell modules 100. In such an embodiment, each row of solar cell modules 100 is terminated with a metal strip at the left and / or right side of the row, and multiple rows are connected together with wires at the left and / or right side of each row. Each of the solar cell modules 100 absorbs light 134 from the light source 136 and generates an electrical output 138 accordingly.

[0032]

[0037] As described above, conventional methods for extracting power from individual solar cell modules involve flexible tabs extending from the edges of each solar cell module, or wiring welded or soldered to traces on the front of each solar cell module. Therefore, supplying power from the front to the back of a solar cell module typically involves allocating sufficient space between solar cell modules to allow wiring to be wound around flexible tabs, or including feed-through holes in the assembly to allow wiring to pass from the front to the back of the solar cell module.

[0033]

[0038] Both of these options require manual labor to route the wiring around flexible tabs or through feed-through holes. This manual labor step is time-consuming and therefore costly. The solar cell module 100 and the corresponding solar cell array 130 described herein eliminate the need for manual winding or feeding of wiring and instead use a combination of interconnects 120, a first conductor pad 110, vias 114, and a second conductor pad 112 to transfer power from the solar cells 108 on the front of the solar cell module 100 to the output wiring 113 on the rear of the solar cell module 100. Each of these components can be manufactured and assembled autonomously, thereby reducing the cost and increasing the precision of the solar cell module 100.

[0034]

[0039] Furthermore, in conventional flexible tab wiring solutions, the presence of flexible tabs creates a gap (typically about 0.25 inches) between adjacent solar cell modules. As described above, the solar cell modules 100 and corresponding solar cell arrays 130 described herein eliminate this gap between adjacent solar cell modules 100. Such a configuration provides a more densely packed modular solar cell array 130, which increases the efficiency of the solar cell array 130, improves power density, and enhances overall performance.

[0035]

[0040] Furthermore, in conventional feed-through wiring solutions, the front of the solar cell module includes a raised area corresponding to the area where the wiring passes from the front to the back of the solar cell module. Therefore, conventional feed-through wiring solutions create an uneven surface at the edges of the solar cell module, which, as mentioned above, is undesirable for certain desired applications.

[0036]

[0041] Figure 4 is a block diagram of one embodiment of method 200 for fabricating a solar cell module 100. Method 200 shown in Figure 4 presents one embodiment of a method that may be used, for example, in any of the embodiments of the solar cell module 100 described above with respect to Figures 1A to 3. Method 200 includes one or more operations, functions, or actions, as shown in one or more of blocks 202 to 210. The blocks are shown in order, but these blocks may be executed in parallel and / or in an order different from the order described herein. Furthermore, the various blocks can be combined to reduce the number of blocks, divided to add blocks, and / or removed based on the desired implementation.

[0037]

[0042] Initially, in block 202, the method 200 includes positioning the solar cell 108 on a first surface 104 of the laminated substrate 102. In one embodiment, a circuit adhesive 126 is positioned between the solar cell 108 and the laminated substrate 102 to fix the solar cell 108 to the laminated substrate 102. In one embodiment, the circuit adhesive 126 includes a pressure-sensitive adhesive tape. In block 204, the method 200 includes positioning a first conductive pad 110 on a first surface 104 of the laminated substrate 102 adjacent to the solar cell 108. In block 206, the method 200 includes positioning a second conductive pad 112 on a second surface 106 of the laminated substrate 102. The first conductive pad 110 and the second conductive pad 112 each include a conductive material. In one particular embodiment, the first conductive pad 110 and the second conductive pad 112 each include a copper material. In such embodiments, the copper material includes cladding or patterning on a first conductor pad 110 and a second conductor pad 112. In one embodiment, such cladding or patterning is generated autonomously without the need for manual intervention. In one embodiment, the second conductor pad 112 includes a landing pad for connecting the solar cell module 100 to a rear harness or substrate insert. In another embodiment, the second conductor pad 112 has a trace pattern at the rear of the laminated substrate 102 to replace wiring for a portion of the harness. In yet another embodiment, the second conductor pad 112 is patterned with output wiring 113 to transport the power generated by the solar cell 108 to other devices.

[0038]

[0043] In block 208, the method 200 includes forming one or more vias 114 through the laminated substrate 102 to electrically connect a first conductor pad 110 to a second conductor pad 112. Each of the one or more vias 114 includes a through-hole 116, which is plated with a metallic material and thereby includes an inner surface 118 for electrically connecting the first conductor pad 110 to the second conductor pad 112. In one particular embodiment, the metallic material includes copper, but other conductive materials are also possible. In block 210, the method 200 includes electrically connecting one or more interconnectors 120 extending from the solar cell 108 to the first conductor pad 110. One or more interconnectors 120 include metallic foil or other conductive material. In one embodiment, one or more interconnectors 120 include end tabs welded, soldered, or electrically bonded to the first conductor pad 110. In another embodiment, one or more interconnections 120 are welded, soldered, or directly conductively joined to the first conductor pad 110 without end tabs.

[0039]

[0044] In one embodiment, the method 200 further includes positioning the cover glass 122 on the upper surface of the solar cell 108. In such embodiment, the method 200 further includes positioning a glass adhesive 124 between the cover glass 122 and the solar cell 108, thereby fixing the cover glass 122 to the solar cell 108. Furthermore, in such embodiment, the upper surface of the solar cell 108 and the upper surface of the first conductor pad 110 define the upper surface 128 of the solar cell module 100, and the upper surface 128 of the solar cell module 100 is substantially flat.

[0040]

[0045] As described above, conventional wiring solutions require manual labor to route the wiring around flexible tabs or through feed-through holes, thereby enabling power to flow from the front to the back of the solar cell module. This manual labor step is time-consuming and therefore costly. The solar cell module 100 and the corresponding manufacturing method described herein eliminate the need for manual winding or feeding of wiring and instead use a combination of interconnects 120, a first conductor pad 110, vias 114, and a second conductor pad 112 to transfer power from the solar cells 108 on the front of the solar cell module 100 to the output wiring 113 on the back of the solar cell module 100. Each of these components can be manufactured and assembled autonomously, thereby reducing the cost and increasing the precision of the solar cell module 100.

[0041]

[0046] Furthermore, this disclosure includes embodiments relating to the following clauses.

[0042] Clause 1. Solar cell module, A laminated substrate having a first surface and a second surface facing the first surface, A solar cell positioned on the first surface of the laminated substrate, A first conductive pad positioned on the first surface of the laminated substrate adjacent to the solar cell, A second conductive pad positioned on the second surface of the laminated substrate, One or more vias positioned through the laminated substrate are used to electrically connect the first conductor pad to the second conductor pad. One or more interconnection parts extending from the solar cell and electrically connecting the solar cell to the first conductor pad A solar cell module equipped with the following features.

[0043] Clause 2. The solar cell module according to Clause 1, further comprising a cover glass positioned on the upper surface of the solar cell.

[0044] Clause 3. A glass adhesive positioned between the cover glass and the solar cell, A circuit adhesive positioned between the solar cell and the laminated substrate. Solar cell modules as described in Clause 2, further including the solar cell modules described in Clause 2.

[0045] Clause 4. A solar cell module according to any one of Clauses 1 to 3, wherein the upper surface of the solar cell and the upper surface of the first conductor pad define the upper surface of the solar cell module, and the upper surface of the solar cell module is substantially flat.

[0046] Clause 5. A solar cell module according to any one of Clauses 1 to 4, wherein the thickness of the laminated substrate is approximately 3 mm to approximately 5 mm.

[0047] Clause 6. A solar cell module according to any one of Clauses 1 to 5, wherein the laminated substrate includes a fiberglass printed circuit board insulating material.

[0048] Clause 7. A solar cell module according to any one of Clauses 1 to 6, wherein the first conductor pad and the second conductor pad include a copper material.

[0049] Clause 8. The solar cell module according to Clause 7, wherein the copper material includes cladding or patterning on the first conductor pad and the second conductor pad.

[0050] Clause 9. A solar cell module according to any one of Clauses 1 to 8, further comprising a plurality of solar cells connected in series on the first surface of the laminated substrate, wherein the solar cell is one of the plurality of solar cells.

[0051] Clause 10. The solar cell module according to any one of Clauses 1 to 9, wherein one or more interconnections are welded, soldered, or electrically directly bonded to the first conductor pad.

[0052] Clause 11. The solar cell module according to any one of Clauses 1 to 10, wherein the one or more interconnections include end tabs welded, soldered, or electrically bonded to the first conductor pad.

[0053] Clause 12. The solar cell module according to any one of Clauses 1 to 11, wherein each of the one or more vias includes a through-hole with an inner surface plated with a metallic material, thereby electrically connecting the first conductor pad to the second conductor pad.

[0054] Clause 13. A solar cell module according to any one of Clauses 1 to 12, wherein the laminated substrate is flexible.

[0055] Clause 14. A solar cell module according to any one of Clauses 1 to 13, wherein the laminated substrate is rigid.

[0056] Clause 15. A solar cell array, It includes multiple solar cell modules, and each of the multiple solar cell modules is A laminated substrate having a first surface and a second surface facing the first surface, A solar cell positioned on the first surface of the laminated substrate, A first conductive pad positioned on the first surface of the laminated substrate adjacent to the solar cell, A second conductive pad positioned on the second surface of the laminated substrate, One or more vias positioned through the laminated substrate are used to electrically connect the first conductor pad to the second conductor pad. One or more interconnection parts extending from the solar cell and electrically connecting the solar cell to the first conductor pad Includes, A solar cell array comprising panels connected to the laminated substrate of each of the plurality of solar cell modules, wherein adjacent solar cell modules of the plurality of solar cell modules are in contact with each other without any gaps between them.

[0057] Clause 16. The solar cell array according to Clause 15, wherein each of the plurality of solar cell modules includes a cover glass positioned on the upper surface of the solar cell.

[0058] Clause 17. The solar cell array according to Clause 15 or 16, wherein the upper surface of the solar cell and the upper surface of the first conductor pad define the upper surface of the solar cell array, and the upper surface of the solar cell array is substantially flat.

[0059] Article 18. A method for manufacturing a solar cell module, Positioning the solar cell on the first surface of the laminated substrate, The first conductor pad is positioned on the first surface of the laminated substrate adjacent to the solar cell, Positioning a second conductor pad on the second surface of the laminated substrate, To electrically connect the first conductor pad to the second conductor pad, one or more vias are formed through the laminated substrate, One or more interconnection parts extending from the solar cell are electrically connected to the first conductor pad. Methods that include...

[0060] Clause 19. The method according to Clause 18, further comprising positioning a cover glass on the upper surface of the solar cell.

[0061] Clause 20. The method according to Clause 18 or 19, wherein the upper surface of the solar cell and the upper surface of the first conductor pad define the upper surface of the solar cell module, and the upper surface of the solar cell module is substantially flat.

[0062]

[0047] It should be understood that the configurations described herein are for illustrative purposes only. Therefore, those skilled in the art will understand that other configurations and other elements (e.g., machines, interfaces, functions, sequences, and groups of functions) may be used instead, depending on the desired result, and that some elements may be omitted entirely. Furthermore, many of the elements described are functional entities that can be implemented as separate or isolated components or in combination with other components in any suitable combination and location, or can be combined with other structural elements described as independent structures.

[0063]

[0048] The descriptions of various advantageous configurations are presented for illustrative and explanatory purposes only and are not intended to be exhaustive or to limit the examples to the forms disclosed. A number of modifications and variations will be obvious to those skilled in the art. Furthermore, various advantageous embodiments may offer different advantages compared to other advantageous embodiments. One or more selected embodiments have been chosen and described to best illustrate the principles and practical applications of those embodiments and to enable other those skilled in the art to understand various modifications suitable for specific applications envisioned together with the disclosure of various embodiments.

Claims

1. A solar cell module (100), A laminated substrate (102) having a first surface (104) and a second surface (106) facing the first surface (104), A solar cell (108) positioned on the first surface (104) of the laminated substrate (102), A first conductive pad (110) is positioned on the first surface (104) of the laminated substrate (102) adjacent to the solar cell (108), A second conductive pad (112) positioned on the second surface (106) of the laminated substrate (102), To electrically connect the first conductor pad (110) to the second conductor pad (112), one or more vias (114) are positioned through the laminated substrate (102), One or more interconnection parts (120) extending from the solar cell (108) and electrically connecting the solar cell (108) to the first conductor pad (110), The cover glass (122) positioned on the upper surface of the solar cell (108) and Equipped with, The upper surface of the cover glass (122) and the upper surface of the first conductor pad (110) constitute the upper surface (128) of the solar cell module (100), and the upper surface of the cover glass (122) is flat.

2. A glass adhesive (124) positioned between the cover glass (122) and the solar cell (108), A circuit adhesive (126) positioned between the solar cell (108) and the laminated substrate (102) and The solar cell module (100) according to claim 1, further comprising:

3. The solar cell module (100) according to claim 1 or 2, wherein the thickness of the laminated substrate (102) is 3 mm to 5 mm.

4. The solar cell module (100) according to any one of claims 1 to 3, wherein the laminated substrate (102) includes a fiberglass printed circuit board insulating material.

5. The solar cell module (100) according to any one of claims 1 to 4, wherein the first conductor pad (110) and the second conductor pad (112) include a copper material.

6. The solar cell module (100) according to claim 5, wherein the copper material includes cladding or patterning on the first conductor pad (110) and the second conductor pad (112).

7. The solar cell module (100) according to any one of claims 1 to 6, further comprising a plurality of solar cells connected in series on the first surface (104) of the laminated substrate (102), wherein the solar cell (108) is one of the plurality of solar cells.

8. The solar cell module (100) according to any one of claims 1 to 7, wherein one or more interconnection parts (120) are welded, soldered, or electrically directly bonded to the first conductor pad (110).

9. The solar cell module (100) according to any one of claims 1 to 8, wherein one or more interconnecting portions (120) include end tabs welded, soldered, or electrically joined to the first conductor pad (110).

10. The solar cell module (100) according to any one of claims 1 to 9, wherein each of the one or more vias (114) is plated with a metallic material to provide a through-hole (116) including an inner surface (118) for electrically connecting the first conductor pad (110) to the second conductor pad (112).

11. The solar cell module (100) according to any one of claims 1 to 10, wherein the laminated substrate (102) is flexible or rigid.

12. A solar cell array (130), It includes a plurality of solar cell modules (100), and each of the plurality of solar cell modules (100) is A laminated substrate (102) having a first surface (104) and a second surface (106) facing the first surface (104), A solar cell (108) positioned on the first surface (104) of the laminated substrate (102), A first conductive pad (110) is positioned on the first surface (104) of the laminated substrate (102) adjacent to the solar cell (108), A second conductive pad (112) positioned on the second surface (106) of the laminated substrate (102), To electrically connect the first conductor pad (110) to the second conductor pad (112), one or more vias (114) are positioned through the laminated substrate (102), One or more interconnection parts (120) extending from the solar cell (108) and electrically connecting the solar cell (108) to the first conductor pad (110) Includes, A solar cell array (130) comprising panels (132) connected to the laminated substrate (102) of each of the plurality of solar cell modules (100), wherein adjacent solar cell modules (100) are in contact with each other without any gaps between them.

13. The solar cell array (130) according to claim 12, wherein each of the plurality of solar cell modules (100) includes a cover glass (122) positioned on the upper surface of the solar cell (108), the upper surface of the cover glass (122) and the upper surface of the first conductor pad (110) constitute the upper surface (128) of the solar cell array (130), and the upper surface of the cover glass (122) is flat.

14. The solar cell array (130) according to claim 12 or 13, wherein each of the first conductor pads (110) and second conductor pads (112) of the plurality of solar cell modules (100) comprises a copper material that is cladding or patterning on the first conductor pads (110) and second conductor pads (112).

15. A method (200) for manufacturing a solar cell module (100), Positioning the solar cell (108) on the first surface (104) of the laminated substrate (102) (202), Positioning the first conductor pad (110) on the first surface (104) of the laminated substrate (102) adjacent to the solar cell (108) (204), Positioning the second conductor pad (112) on the second surface (106) of the laminated substrate (102) (206), To electrically connect the first conductor pad (110) to the second conductor pad (112), one or more vias (114) are formed through the laminated substrate (102) (208), One or more interconnection parts (120) extending from the solar cell (108) are electrically connected (210) to the first conductor pad (110), The cover glass (122) is positioned on the upper surface of the solar cell (108) and Includes, Method (200), wherein the upper surface of the cover glass (122) and the upper surface of the first conductor pad (110) constitute the upper surface (128) of the solar cell module (100), and the upper surface of the cover glass (122) is flat.

Citation Information

Patent Citations

  • Integrated backboard and back-contact photovoltaic module

    CN203277425U

  • Solar array

    JP1987042469A

  • Solar cell board

    JP1996298334A

  • Solar cell and solar cell panel using the same

    JP1998242491A

  • Solar cell module

    JP1999112008A