Liquid dispensing head and liquid dispensing device

Abstract

To achieve size optimization of a compliance board.SOLUTION: A liquid discharge head has: a nozzle; a pressure chamber; a supply channel which is positioned on one side in a first direction with respect to the pressure chamber, and supplies a liquid into the pressure chamber; a discharge channel which is positioned on the other side in the first direction with respect to the pressure chamber, and discharges the liquid from the pressure chamber; a supply side compliance board which absorbs vibration of the liquid in the supply channel; and a discharge side compliance board which absorbs vibration of the liquid in the discharge channel. A length of the discharge compliance board along the first direction is shorter than a length of the supply side compliance board along the first direction.SELECTED DRAWING: Figure 2

Description

Technical Field

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[0001] The present invention relates to a liquid ejection head and a liquid ejection device.

Background Art

[0002] The liquid ejection head described in Patent Document 1 below includes a nozzle that ejects a liquid, a pressure chamber that communicates with the nozzle, a supply flow path that supplies the liquid to the pressure chamber, and a discharge flow path that discharges the liquid discharged from the pressure chamber. The liquid that has not been ejected from the nozzle is discharged from the pressure chamber and flows through the discharge flow path. The liquid ejection head includes a supply-side compliance substrate for absorbing the vibration of the liquid in the supply flow path and a discharge-side compliance substrate for absorbing the vibration of the liquid in the discharge flow path.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the liquid ejection head according to the prior art, the supply-side compliance substrate and the discharge-side compliance substrate have the same size. Since the flow rate of the liquid flowing through the supply flow path and the flow rate of the liquid flowing through the discharge flow path are different, there is room for consideration regarding the size of the supply-side compliance substrate and the discharge-side compliance substrate.

Means for Solving the Problems

[0005] The liquid discharge head of the present invention comprises a nozzle for discharging liquid, a pressure chamber for applying pressure to the liquid, a supply channel located on one side of the pressure chamber in a first direction for supplying liquid to the pressure chamber, a discharge channel located on the other side of the pressure chamber in the first direction for discharging liquid from the pressure chamber, a supply-side compliance substrate provided facing the supply channel for absorbing vibrations of the liquid in the supply channel, and a discharge-side compliance substrate provided facing the discharge channel for absorbing vibrations of the liquid in the discharge channel, wherein the length of the discharge-side compliance substrate along the first direction is shorter than the length of the supply-side compliance substrate along the first direction.

[0006] The liquid discharge head of the present invention comprises a nozzle for discharging liquid, a pressure chamber for applying pressure to the liquid, a supply channel located on one side of the pressure chamber in a first direction for supplying liquid to the nozzle, a discharge channel located on the other side of the pressure chamber in a first direction for discharging liquid from the nozzle, a supply-side compliance substrate provided facing the supply channel for absorbing vibrations of the liquid in the supply channel, and a discharge-side compliance substrate provided facing the discharge channel for absorbing vibrations of the liquid in the discharge channel, wherein the length of the discharge-side compliance substrate along the first direction is longer than the length of the supply-side compliance substrate along the first direction.

[0007] The liquid dispensing device of the present invention comprises the above-mentioned liquid dispensing head and a control unit that controls the dispensing operation of dispensing liquid from the liquid dispensing head. [Brief explanation of the drawing]

[0008] [Figure 1] This is an exploded perspective view showing the liquid dispensing head according to Example 1. [Figure 2] This is a cross-sectional view showing the liquid dispensing head, specifically the cross-section along the line II-II in Figure 1. [Figure 3] This is a plan view showing a part of the communication plate according to Example 1. [Figure 4] This is a plan view showing a part of the pressure chamber substrate according to Example 1. [Figure 5]This is a plan view showing the diaphragm, piezoelectric element, and a portion of the pressure absorption section. [Figure 6] This is a cross-sectional view showing a cross-section along the line VI-VI in Figure 5, and it shows the vibration absorption section on the supply side. [Figure 7] This is a cross-sectional view showing a part of the diaphragm, piezoelectric element, and vibration absorbing section according to Example 1. [Figure 8] This is a cross-sectional view showing a cross-section along the line VIII-VIII in Figure 5, and it shows the vibration absorption section on the discharge side. [Figure 9] This is a plan view showing the length and width of the opening of the damper chamber formed below the compliance substrate. [Figure 10] This is a cross-sectional view showing the thickness of the compliance substrate. [Figure 11] This is a cross-sectional view showing the liquid dispensing head according to Example 2. [Figure 12] This is a plan view showing a part of the connecting plate according to Example 2. [Figure 13] This is a plan view showing a part of the pressure chamber substrate according to Example 2. [Figure 14] This is a cross-sectional view showing the liquid dispensing head according to Example 3. [Figure 15] This is a cross-sectional view showing a part of the vibration absorption section on the supply side according to Example 3. [Figure 16] This is a cross-sectional view showing a part of the vibration absorption section on the discharge side according to Example 3. [Figure 17] This is a plan view showing a part of the connecting plate according to Example 5. [Figure 18] This is a plan view showing a part of the pressure chamber substrate according to Example 5. [Figure 19] This is a cross-sectional view showing the liquid dispensing head according to Example 8. [Figure 20] This is a schematic diagram showing a liquid dispensing device according to an example. [Figure 21] This is a block diagram of a liquid dispensing device according to an example.

[0009] Hereinafter, embodiments for implementing the present invention will be described with reference to the drawings. However, in each figure, the dimensions and scales of each part are appropriately different from the actual ones. Further, the embodiments described below are preferred specific examples of the present invention, and thus are subject to various technically preferable limitations. However, the scope of the present invention is not limited to these embodiments unless otherwise specifically stated to limit the present invention in the following description.

[0010] In the following description, there may be cases where three mutually intersecting directions are described as the X-axis direction, the Y-axis direction, and the Z-axis direction. The X-axis direction includes the X1 direction and the X2 direction which are opposite to each other. The X-axis direction is an example of the first direction. The Y-axis direction includes the Y1 direction and the Y2 direction which are opposite to each other. The Y-axis direction is an example of the second direction. The Z-axis direction includes the Z1 direction and the Z2 direction which are opposite to each other. The Z1 direction is an example of the third direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are orthogonal. The Z-axis direction is usually a direction along the vertical direction, but the Z-axis direction may not be a direction along the vertical direction.

[0011] <Example 1> Referring to FIGS. 1 to 8, the liquid ejection head 10 according to Example 1 will be described. FIG. 1 is an exploded perspective view showing the liquid ejection head 10 according to Example 1. FIG. 2 is a cross-sectional view showing the liquid ejection head 10, and is a view showing a cross-section along the line II-II in FIG. 1. FIG. 3 is a partial plan view showing a part of the communication plate 24. FIG. 4 is a partial plan view showing a part of the pressure chamber substrate 25 according to Example 1. FIG. 5 is a plan view showing a part of the diaphragm, the piezoelectric element, and the vibration absorption part according to Example 1. The liquid ejection head 10 employs a circulation method for circulating the liquid that has flowed through the common liquid chambers RA and RB and the pressure chambers CA and CB described later.

[0012] In addition, in this specification, the terms "supply side" and "discharge side" may be used. The "supply side" refers to the upstream side of the pressure chamber C with respect to the liquid flow path. Also, something related to the upstream side of the pressure chamber C may be referred to as the "supply side". For example, as will be described later, there may be a description of a "compliance substrate on the supply side". The "discharge side" refers to the downstream side of the pressure chamber C with respect to the liquid flow path. Note that the nozzle N described later is not included in the "discharge side". Also, something related to the downstream side of the pressure chamber C may be referred to as the "discharge side". For example, as will be described later, there may be a description of a "compliance substrate on the discharge side".

[0013] The liquid ejection head 10 includes a nozzle substrate 21, a communication plate 24, a pressure chamber substrate 25, a diaphragm 26, a sealing plate 27, and a piezoelectric element 50. The liquid ejection head 10 also includes a case 28 and a COF 60. COF is an abbreviation for Chip on Film. The liquid ejection head 10 has compliance substrates 23A and 23B and damper chambers DA and DB. In this embodiment, the liquid ejection head 10 that ejects ink, which is an example of a liquid, will be described. The liquid is not limited to ink, and the liquid ejection head 10 can eject other liquids.

[0014] The thickness directions of the nozzle substrate 21, the communication plate 24, the pressure chamber substrate 25, the diaphragm 26, the sealing plate 27, and the case 28 follow the Z-axis direction. The nozzle substrate 21 is disposed at the bottom of the liquid ejection head 10. The communication plate 24 is disposed in the Z2 direction of the nozzle substrate 21. The pressure chamber substrate 25 is disposed in the Z2 direction of the communication plate 24. In other words, the communication plate 24 is provided between the pressure chamber substrate 25 and the nozzle substrate 21. The diaphragm 26 and the compliance substrates 23A and 23B are formed in the Z2 direction of the pressure chamber substrate 25.

[0015] A sealing plate 27 is positioned in the Z2 direction of the diaphragm 26 and compliance substrates 23A and 23B. The sealing plate 27 includes a portion that is outside the compliance substrates 23A and 23B in the X-axis direction. The outer portion of the sealing plate 27 in the X-axis direction is located in the Z2 direction of the pressure chamber substrate 25. The sealing plate 27 covers the diaphragm 26, compliance substrates 23A and 23, the plurality of piezoelectric elements 50, and the pressure chamber substrate 25. The case 28 is positioned on the sealing plate 27. The piezoelectric elements 50 are provided corresponding to the pressure chamber CA.

[0016] Next, the ink flow path 40 will be described. The liquid ejection head 10 has an ink flow path 40 formed therein. The flow path 40 includes a supply port 42A, an outlet port 42B, common liquid chambers RA, RB, damper chambers DA, DB, pressure chamber C, connecting flow paths 47A to 47C, and a nozzle N.

[0017] The flow path 40 has a supply flow path 41A and a discharge flow path 41B. The supply flow path 41A is a flow path upstream of the pressure chamber C and is a flow path within the communication plate 24 and the pressure chamber substrate 25. The supply flow path 41A includes flow path 45A, the communication flow path 46A, and the damper chamber DA. The discharge flow path 41B is a flow path downstream of the pressure chamber C and is a flow path within the communication plate 24 and the pressure chamber substrate 25. The discharge flow path 41B includes the communication flow path 47C, the communication flow path 47B, the damper chamber DB, flow path 46B, and flow path 45B. Note that the supply flow path 41A does not include the flow path 44A within the sealing plate 27 and the flow path 43A within the case 28. The discharge flow path 41B does not include the flow path 44B within the sealing plate 27 and the flow path 43B within the case 28.

[0018] The common liquid chamber RA is provided in common for multiple pressure chambers C. The common liquid chamber RA is continuous in the Y-axis direction. The common liquid chamber RA includes a flow path 43A provided in the case 28, a flow path 44A provided in the sealing plate 27, a flow path 45A provided in the pressure chamber substrate 25, and a flow path 46A provided in the communication plate 24. These flow paths 43A, 44A, 45A, and 46A are continuous in the Z-axis direction. Flow paths 45A and 46A are examples of common supply flow paths. Of the common liquid chamber RA, flow paths 43A and 44A are not included in the common supply flow path.

[0019] Multiple connecting passages 47A are provided for each of the multiple pressure chambers C. The multiple connecting passages 47A are located downstream of the common liquid chamber RA. The connecting passages 47A are connected to passage 46A.

[0020] Multiple damper chambers DA are provided for each of the multiple pressure chambers C. Each of the multiple damper chambers DA is provided between the multiple communication passages 47A and the multiple pressure chambers C. The damper chambers DA are located in the Z2 direction of the communication passages 47A. The damper chambers DA communicate downstream of the communication passages 47A. The damper chambers DA are located in the X1 direction of the pressure chamber C. The damper chambers DA communicate upstream of the pressure chamber C. The communication passages 47A and damper chambers DA are an example of "individual supply passages". The damper chambers DA are damper chambers on the supply side.

[0021] Multiple pressure chambers C are connected to multiple nozzles N. The nozzles N are located in the Z1 direction of the pressure chambers C.

[0022] Multiple communication channels 47C are provided for each of the multiple pressure chambers C. The multiple communication channels 47C communicate downstream of the pressure chambers C. The downstream end of the pressure chamber C, which is the end in the X2 direction, and the upstream end of the communication channel 47C, which is the end in the X1 direction, overlap when viewed in the Z-axis direction.

[0023] Each of the multiple connecting channels 47C is provided. Connecting channel 47B is located downstream of connecting channel 47C.

[0024] Multiple damper chambers DB are provided for each of the multiple pressure chambers C. The damper chambers DB are located in the Z2 direction of the communication passage 47B. Each of the multiple damper chambers DB communicates with each of the multiple communication passages 47B. The damper chambers DB communicate with the pressure chambers C via the communication passages 47B and 47C. The communication passages 47B and 47C and the damper chambers DB are an example of "individual discharge passages". The damper chambers DB are the damper chambers on the discharge side.

[0025] The common liquid chamber RB is provided in common for multiple pressure chambers C. The common liquid chamber RB is in common communication with multiple communication channels 47B. The common liquid chamber RB is in communication with the pressure chambers C via communication channels 47B and 47C. The common liquid chamber RB is located downstream of the communication channels 47B.

[0026] The common liquid chamber RB is continuous in the Y-axis direction. The common liquid chamber RB includes a flow path 43B provided in the case 28, a flow path 44B provided in the sealing plate 27, a flow path 45B provided in the pressure chamber substrate 25, and a flow path 46B provided in the communication plate 24. These flow paths 43B, 44B, 45B, and 46B are continuous in the Z-axis direction. Flow paths 45B and 46B are examples of common discharge flow paths. Of the common liquid chamber RB, flow paths 43B and 44B are not included in the common discharge flow path.

[0027] As described above, the liquid ejection head 10 employs a circulation system in which the ink that has flowed through the pressure chamber C is circulated. As shown in Figure 20, a circulation mechanism 8 for circulating the ink is connected to the liquid ejection head 10. A liquid container 2 is connected to the circulation mechanism 8. The circulation mechanism 8 includes a supply channel 81 for supplying ink to the liquid ejection head 10, a recovery channel 82 for recovering the ink discharged from the liquid ejection head 10, and a pump 83 for transferring the ink. The supply channel 81 and the recovery channel 82 may be, for example, channels inside a tube. The supply channel 81 and the recovery channel 82 include channels formed by openings, grooves, recesses, etc.

[0028] The ink in the liquid container 2 is transferred by the pump 83, flows through the supply channel 81, passes through the supply port 42A shown in Figure 2, and flows into the common liquid chamber RA. The ink in the common liquid chamber RA is supplied to the pressure chamber C through the communication channel 47A and the damper chamber DA. A portion of the ink in the pressure chamber C is discharged from the nozzle N.

[0029] Ink that is not ejected from nozzle N flows through communication channels 47C and 47B and into the common liquid chamber RB. A portion of the ink that flows through communication channel 47C flows into damper chamber DB. The ink in the common liquid chamber RB flows into the recovery channel 82 through outlet 42B and is recovered into liquid container 2. Ink is circulated in this manner in the liquid ejection head 10.

[0030] Next, the structure of the liquid discharge head 10 will be described. Multiple nozzles N are formed on the nozzle substrate 21 shown in Figures 1 and 2. The multiple nozzles N constitute a nozzle row N1. The nozzle row N1 includes multiple nozzles N arranged in the Y-axis direction. The nozzles N are through holes that penetrate the nozzle substrate 21 in the Z-axis direction.

[0031] As shown in Figures 2 and 3, the communication plate 24 has a flow path 46A, a communication flow path 47A, a communication flow path 47C, a communication flow path 47B, which are part of the common liquid chamber RA, and a flow path 46B, which are part of the common liquid chamber RB. In other words, the communication plate 24 is provided with a supply flow path and a part of the discharge flow path. The communication plate 24 has through holes, grooves, or recesses formed therein. These through holes, grooves, or recesses form parts of the common liquid chambers RA and RB, and communication flow paths 47A, 47B, and 47C.

[0032] Furthermore, parts of multiple nozzles N are formed on the communication plate 24. As shown in Figure 2, the nozzles N penetrate the communication plate 24 and the nozzle substrate 21 in the Z-axis direction. The portion of the nozzles N closer to the pressure chamber C is formed on the communication plate 24.

[0033] As shown in Figures 2 and 4, the pressure chamber substrate 25 has a flow path 45A which is part of the common liquid chamber RA, multiple damper chambers DA, multiple pressure chambers C, multiple damper chambers DB, and a flow path 45B which is part of the common liquid chamber RA. In Figure 4, multiple nozzles N are shown by dashed lines. The pressure chamber substrate 25 can be manufactured from, for example, a silicon single crystal substrate. The pressure chamber substrate 25 may also be manufactured from other materials.

[0034] As shown in Figure 4, the multiple damper chambers DA extend in the X-axis direction. The damper chambers DA and the common liquid chamber RA are spaced apart from each other in the X-axis direction. The damper chambers DA and the pressure chamber C are formed as a common space continuous in the X-axis direction. The damper chambers DA penetrate the pressure chamber substrate 25 in the Z-axis direction. The damper chambers DA have a predetermined volume. The multiple damper chambers DA are arranged at predetermined intervals in the Y-axis direction. A relay channel may be formed between the damper chambers DA and the pressure chamber C.

[0035] The pressure chamber C extends in the X-axis direction. The pressure chamber C penetrates the pressure chamber substrate 25 in the Z-axis direction. The pressure chamber C has a predetermined volume. Multiple pressure chambers C are arranged at predetermined intervals in the Y-axis direction. Multiple pressure chambers C are located in the same position as multiple damper chambers DA in the Y-axis direction. Multiple pressure chambers C constitute a pressure chamber row CL arranged in the Y-axis direction. The pressure chamber row CL contains multiple pressure chambers C. In Figure 4, the imaginary lines L1 and L2 indicating the boundaries of the pressure chamber C are shown as dashed lines. Imaginary line L1 indicates the end of the pressure chamber C in the X1 direction. Imaginary line L2 indicates the end of the pressure chamber C in the X2 direction.

[0036] Multiple damper chambers DB extend in the X-axis direction. The damper chambers DB and the pressure chamber C are spaced apart in the X-axis direction. A communication channel 47C is formed between the damper chambers DB and the pressure chamber C, as shown in Figure 2. The damper chambers DB and the common liquid chamber RB are spaced apart from each other in the X-axis direction. Viewed in the Z-axis direction, the damper chambers DB are formed to overlap the communication channel 47B. The damper chambers DB penetrate the pressure chamber substrate 25 in the Z-axis direction. The damper chambers DB and the communication channel 47B communicate in the Z-axis direction. The damper chambers DB have a predetermined volume. Multiple damper chambers DB are arranged at predetermined intervals in the Y-axis direction.

[0037] As shown in Figure 4, the width W1 of the supply-side damper chamber DA along the X-axis is different from the length W2 of the discharge-side damper chamber DB along the X-axis. The length W1 of the supply-side damper chamber DA along the X-axis is greater than the length W2 of the discharge-side damper chamber DB along the X-axis. The width of damper chamber DA along the Y-axis is the same as the width of damper chamber DB along the Y-axis.

[0038] Figure 6 is a cross-sectional view showing a cross-section along the line VI-VI in Figure 5. Figure 7 is an enlarged cross-sectional view showing a portion of the diaphragm 26, piezoelectric element 50, and COM wiring 54. As shown in Figures 6 and 7, the diaphragm 26 is positioned on the upper surface of the pressure chamber substrate 25. The diaphragm 26 covers the opening of the pressure chamber substrate 25. The portion of the diaphragm 26 that covers the opening of the pressure chamber substrate 25 constitutes the upper wall surface of the pressure chamber C.

[0039] The diaphragm 26 includes an elastic layer 26a and an insulating layer 26b. The elastic layer 26a is made of, for example, silicon dioxide (SiO2). The insulating layer 26b is made of, for example, zirconium dioxide (ZrO2). The elastic layer 26a is formed on the pressure chamber substrate 25, and the insulating layer 26b is formed on the elastic layer 26a.

[0040] As shown in Figures 5 to 7, multiple piezoelectric elements 50 are formed on the diaphragm 26. The piezoelectric elements 50 are positioned to overlap the pressure chambers C when viewed in the Z-axis direction. Each of the multiple piezoelectric elements 50 is provided for a separate pressure chamber C.

[0041] The diaphragm 26 is driven by a piezoelectric element 50 and vibrates in the Z-axis direction. The diaphragm 26 forming the upper wall surface of the pressure chamber C is driven by a piezoelectric element 50 on the pressure chamber C. The total thickness of the diaphragm 26 is, for example, 2 μm or less. The total thickness of the diaphragm 26 may be 15 μm or less, 40 μm or less, or 100 μm or less. For example, if the total thickness of the diaphragm 26 is 15 μm or less, it may include a resin layer. The diaphragm 26 may be made of metal. Examples of metals include stainless steel and nickel. If the diaphragm 26 is made of metal, the plate thickness of the diaphragm 26 may be 15 μm or more and 100 μm or less.

[0042] The piezoelectric element 50 shown in Figures 6 and 7 has individual electrodes 51, a common electrode 52, and a piezoelectric layer 53. The individual electrodes 51, the piezoelectric layer 53, and the common electrode 52 are stacked in this order on the diaphragm 26. The piezoelectric layer 53 is sandwiched between the individual electrodes 51 and the common electrode 52. The individual electrodes 51 are elongated in length along the X-axis direction. Multiple individual electrodes 51 are arranged with spacing between them in the Y-axis direction. Multiple individual electrodes 51 are arranged for each of the multiple pressure chambers C. When viewed in the Z-axis direction, each individual electrode 51 is positioned to overlap the multiple pressure chambers C. The common electrode 52 is strip-shaped and extends in the Y-axis direction. The common electrode 52 is continuous so as to cover the multiple individual electrodes 51.

[0043] Each individual electrode 51 includes a base layer and an electrode layer. The base layer includes, for example, titanium (Ti). The electrode layer includes, for example, a low-resistance conductive material such as platinum (Pt) or iridium (Ir). The electrode layer may be formed from oxides such as strontium ruthenate (SrRuO3) and lanthanum nickelate (LaNiO3). The piezoelectric layers 53A and 53B are formed from known piezoelectric materials such as, for example, lead zirconate titanate (Pb(Zr,Ti)O3) or ceramics.

[0044] The common electrode 52 includes a base layer and an electrode layer. The base layer includes, for example, titanium. The electrode layer includes, for example, a low-resistance conductive material such as platinum or iridium. The electrode layer may be formed of oxides such as strontium ruthenate and lanthanum nickelate. The region of the piezoelectric layer 53 between the individual electrodes 51 and the common electrode 52 becomes the driving region. A driving region is formed on each of the multiple pressure chambers C.

[0045] A predetermined reference voltage is applied to the common electrode 52. The reference voltage is a constant voltage, and is set to a voltage higher than, for example, the ground voltage. A holding signal with a constant voltage is applied to the common electrode 52. A drive signal with a fluctuating voltage is applied to the individual electrodes 51. A voltage equivalent to the difference between the reference voltage applied to the common electrode 52 and the drive signal supplied to the individual electrodes 51 is applied to the piezoelectric layer 53. The drive signal corresponds to the amount of liquid discharged from the nozzle N.

[0046] When a voltage is applied between the individual electrodes 51 and the common electrode 52, the piezoelectric layer 53 deforms, and the piezoelectric element 50 generates energy that causes the diaphragm 26 to bend and deform.

[0047] The energy generated by the piezoelectric element 50 causes the diaphragm 26 to vibrate, which changes the pressure of the liquid in the pressure chamber C, and the liquid in the pressure chamber C is discharged from the nozzle N.

[0048] As shown in Figures 1 and 2, the COF 60 comprises a flexible printed circuit board 61 and a drive circuit 62. The flexible printed circuit board 61 is a flexible printed circuit board. The flexible printed circuit board 61 is, for example, an FPC. The flexible printed circuit board 61 may also be, for example, an FFC. FPC is an abbreviation for Flexible Printed Circuit. FFC is an abbreviation for Flexible Flat Cable.

[0049] As shown in Figure 2, the flexible wiring board 61 is electrically connected to the individual electrodes 51 of the piezoelectric element 50 via COM wiring 54, which will be described later. COM wiring 54 is illustrated in Figures 2, 5, and 7.

[0050] Furthermore, the flexible wiring board 61 is electrically connected to the common electrode 52 of the piezoelectric element 50 via VBS wiring 55A and 55B, which will be described later. The flexible wiring board 61 is electrically connected to a circuit board (not shown). The circuit board includes a drive signal generation circuit 32 shown in Figure 21.

[0051] The drive circuit 62 is mounted on the flexible wiring board 61. The drive circuit 62 includes a switching element for driving the piezoelectric element 50. The drive circuit 62 is electrically connected to the control unit 30 shown in Figure 21 via the flexible wiring board 61 and the circuit board. The drive circuit 62 receives a drive signal Com output from the drive signal generation circuit 32. The switching element of the drive circuit 62 switches whether or not to supply the drive signal Com generated by the drive signal generation circuit 32 to the piezoelectric element 50. The drive circuit 62 supplies a drive voltage or current to the piezoelectric element 50 to vibrate the diaphragm 26.

[0052] As shown in Figures 5 and 7, the liquid discharge head 10 is equipped with COM wiring 54. Multiple COM wirings 54 are connected to multiple individual electrodes 51. The multiple COM wirings 54 extend in the X-axis direction and are drawn into the opening 27a of the sealing plate 27. The opening 27a is shown in Figures 1 and 2. Note that the COM wiring 54 is not shown in Figure 1. The opening 27a penetrates the sealing plate 27 in the Z-axis direction. It is electrically connected to the COF 60 at a position corresponding to the opening 27a when viewed in the Z-axis direction. The COM wiring 54 is formed of a conductive material with lower resistance than the individual electrodes 51. For example, the COM wiring 54 is a conductive pattern with a structure in which a gold (Au) conductive film is laminated on the surface of a conductive film formed of nichrome (NiCr).

[0053] As shown in Figure 7, the COM wiring 54 has an electrode layer 54a, a first adhesion layer 54b, and a first wiring layer 54c. The electrode layer 54a covers the end face of the piezoelectric layer 53 in the X2 direction. The end face in the X2 direction forms a plane that intersects with the X-axis direction. The first adhesion layer 54b covers the electrode layer 54a and the individual electrodes 51. The first adhesion layer 54b is in close contact with the electrode layer 54a and the individual electrodes 51. The first wiring layer 54c covers the first adhesion layer 54b. The first wiring layer 54c is electrically connected to the individual electrodes 51 via the first adhesion layer 54b.

[0054] The liquid discharge head 10 includes VBS wiring 55 that is electrically connected to the COF 60 and the common electrode 52. The VBS wiring 55 is positioned on the common electrode 52 and extends in the Y-axis direction. The VBS wiring is strip-shaped when viewed in the Z-axis direction and is formed to cover the common electrode 52. The VBS wiring 55 is electrically connected to the COF 60 at the Y-axis end of the liquid discharge head 10.

[0055] Next, the vibration absorbing sections 70A and 70B will be described with reference to Figures 2, 5, 6, and 8. The liquid discharge head 10 includes a vibration absorbing section 70A on the supply side and a vibration absorbing section 70B on the discharge side. As shown in Figures 2, 5, and 6, the vibration absorbing section 70A on the supply side is provided for the damper chamber DA on the supply side. As shown in Figures 2, 5, and 8, the vibration absorbing section 70B on the discharge side is provided for the damper chamber DB on the discharge side.

[0056] As shown in Figure 6, the vibration absorbing section 70A comprises a compliance substrate 23A and a piezoelectric element 71A. The compliance substrate 23A is located in the X1 direction of the diaphragm 26. The compliance substrate 23A is positioned on the upper surface of the pressure chamber substrate 25. The compliance substrate 23A covers the portion of the opening of the pressure chamber substrate 25 that corresponds to the damper chamber DA. The compliance substrate 23A constitutes the upper wall surface of the damper chamber DA. When viewed in the Z-axis direction, the compliance substrate 23A is positioned in a location corresponding to the sealing space S2 formed in the sealing plate 27.

[0057] The compliance substrate 23A includes a flexible film. The compliance substrate 23A includes an elastic layer 23a and an insulating layer 23b. The elastic layer 23a is made of, for example, silicon dioxide (SiO2). The insulating layer 23b is made of, for example, zirconium dioxide (ZrO2). The elastic layer 23a is formed on the pressure chamber substrate 25, and the insulating layer 23b is formed on the elastic layer 23a. The elastic layer 23a is formed continuously with the elastic layer 26a of the diaphragm 26 that covers the pressure chamber C. The insulating layer 23b is formed continuously with the insulating layer 26b of the diaphragm 26.

[0058] Multiple compliance substrates 23A are provided for each of the multiple damper chambers DA arranged in the Y-axis direction. The compliance substrates 23A are deformable in response to the pressure of the ink. The compliance substrates 23A deform in response to the pressure of the ink and can absorb pressure fluctuations of the ink in the damper chambers DA. The multiple compliance substrates 23A deform individually in accordance with the multiple damper chambers DA.

[0059] As shown in Figures 5 and 6, multiple piezoelectric elements 71A are formed on the compliance substrate 23A. The piezoelectric elements 71A are positioned to overlap the damper chambers DA when viewed in the Z-axis direction. Each of the multiple piezoelectric elements 71A is provided for each of the damper chambers DA.

[0060] The piezoelectric element 71A has individual electrode layers 71a, a common electrode layer 71b, and a piezoelectric layer 71c. The individual electrode layers 71a, the common electrode layer 71b, and the piezoelectric layer 71c are stacked in this order on the compliance substrate 23A. The piezoelectric layer 71c is sandwiched between the individual electrode layers 71a and the common electrode layer 71b. The individual electrode layers 71a are elongated in shape along the X-axis. Multiple individual electrode layers 71a are arranged with spacing between them in the Y-axis direction. Multiple individual electrode layers 71a are arranged for each of the multiple damper chambers DA. When viewed in the Z-axis direction, each individual electrode layer 71a is positioned to overlap the multiple damper chambers DA. The common electrode layer 71b is strip-shaped and extends in the Y-axis direction. The common electrode layer 71b is continuous so as to cover the multiple individual electrode layers 71a.

[0061] The structure and material of the individual electrode layer 71a are the same as those of the individual electrodes 51 of the piezoelectric element 50. The structure and material of the common electrode layer 71b are the same as those of the common electrode 52 of the piezoelectric element 50. The structure and material of the piezoelectric body layer 71c are the same as those of the piezoelectric body layer 53 of the piezoelectric element 50. The piezoelectric element 71A can be formed in the same way as the piezoelectric element 50.

[0062] As shown in Figures 2 and 5, the compliance substrate 23B is located in the X2 direction of the diaphragm 26. In the X-axis direction, the compliance substrate 23B is located on the opposite side of the diaphragm 26 from the compliance substrate 23A. As shown in Figure 8, the compliance substrate 23B is positioned on the upper surface of the pressure chamber substrate 25. The compliance substrate 23B covers the portion of the opening in the pressure chamber substrate 25 that corresponds to the damper chamber DB. The compliance substrate 23B constitutes the upper wall surface of the damper chamber DB. When viewed in the Z-axis direction, the compliance substrate 23B is positioned in a location corresponding to the sealing space S3 formed in the sealing plate 27.

[0063] The compliance substrate 23B includes a flexible film. The compliance substrate 23B includes an elastic layer 23c and an insulating layer 23d. The elastic layer 23c is made of, for example, silicon dioxide (SiO2). The insulating layer 23d is made of, for example, zirconium dioxide (ZrO2). The elastic layer 23c is formed on the pressure chamber substrate 25, and the insulating layer 23d is formed on the elastic layer 23c. The elastic layer 23c is formed continuously with the elastic layer 26a of the diaphragm 26. The insulating layer 23d is formed continuously with the insulating layer 26b of the diaphragm 26.

[0064] Multiple compliance substrates 23B are provided for each of the multiple damper chambers DB arranged in the Y-axis direction. The compliance substrates 23B are deformable in response to the pressure of the ink. The compliance substrates 23B deform in response to the pressure of the ink and can absorb pressure fluctuations of the ink in the damper chambers DB. The multiple compliance substrates 23B deform individually in accordance with the multiple damper chambers DB.

[0065] As shown in Figures 5 and 8, multiple piezoelectric elements 71B are formed on the compliance substrate 23B. The piezoelectric elements 71B are positioned to overlap the damper chambers DB when viewed in the Z-axis direction. Each of the multiple piezoelectric elements 71B is provided for each of the damper chambers DB.

[0066] The piezoelectric element 71B has individual electrode layers 71d, a common electrode layer 71e, and a piezoelectric layer 71f. The individual electrode layers 71d, the common electrode layer 71e, and the piezoelectric layer 71f are stacked in this order on the compliance substrate 23B. The piezoelectric layer 71f is sandwiched between the individual electrode layers 71e and the common electrode layer 71e. The individual electrode layers 71d are elongated in shape along the X-axis. Multiple individual electrode layers 71d are arranged with spacing between them in the Y-axis direction. Multiple individual electrode layers 71d are arranged for each of the multiple damper chambers DB. When viewed in the Z-axis direction, each individual electrode layer 71d is positioned to overlap the multiple damper chambers DB. The common electrode layer 71e is strip-shaped and extends in the Y-axis direction. The common electrode layer 71e is continuous so as to cover the multiple individual electrode layers 71d.

[0067] The structure and material of the individual electrode layer 71d are the same as those of the individual electrodes 51 of the piezoelectric element 50. The structure and material of the common electrode layer 71e are the same as those of the common electrode 52 of the piezoelectric element 50. The structure and material of the piezoelectric body layer 71f are the same as those of the piezoelectric body layer 53 of the piezoelectric element 50. The piezoelectric element 71B can be formed in the same way as the piezoelectric element 50 and the piezoelectric element 71A.

[0068] The sealing plate 27 has a rectangular shape when viewed in the Z-axis direction. The sealing plate 27 protects the multiple piezoelectric elements 50, 71A, and 71B, and reinforces the mechanical strength of the pressure chamber substrate 25, the diaphragm 26, and the compliance substrates 23A and 23B. The sealing plate 27 is bonded to the diaphragm 26, for example, by adhesive. The sealing plate 27 is fixed to the pressure chamber substrate 25 via the diaphragm 26 and the compliance substrates 23A and 23B.

[0069] The sealing plate 27 has sealing spaces S1 to S3 formed therein. A recess is formed on the lower surface of the sealing plate 27. The space created by this recess is the sealing space S1 to S3. The sealing spaces S1 to S3 are each formed to be continuous in the Y-axis direction. When viewed in the Z-axis direction, sealing space S1 is formed to overlap with a plurality of pressure chambers C. The sealing space S1 accommodates a plurality of piezoelectric elements 50. When viewed in the Z-axis direction, sealing space S2 is formed to overlap with a plurality of damper chambers DA. The sealing space S2 accommodates a plurality of piezoelectric elements 71A. When viewed in the Z-axis direction, sealing space S3 is formed to overlap with a plurality of damper chambers DB. The sealing space S3 accommodates a plurality of piezoelectric elements 71B.

[0070] The sealing plate 27 has a flow path 44A included in the common liquid chamber RA and a flow path 44B included in the common liquid chamber RB. The flow paths 44A and 44B are formed to penetrate the sealing plate 27 in the Z-axis direction. Flow path 44A is located in the X1 direction of the sealing space S2. Flow path 44B is located in the X2 direction of the sealing space S3.

[0071] Case 28 is located in the Z2 direction of the sealing plate 27. Case 28 has a supply port 42A, an outlet port 42B, and flow paths 43A and 43B. Flow path 43A is included in the common liquid chamber RA. Flow path 43A is formed to overlap with flow path 44A of the sealing plate 27 when viewed in the Z-axis direction. The supply port 42A communicates with flow path 43A. Flow path 43B is included in the common liquid chamber RB. Flow path 43B is formed to overlap with flow path 44B of the sealing plate 27 when viewed in the Z-axis direction. The outlet port 42B communicates with flow path 43B.

[0072] Next, referring to Figure 2, the compliance substrates 77A and 77B provided in the common liquid chambers RA and RB will be described. As shown in Figure 2, the liquid discharge head 10 is equipped with compliance substrates 77A and 77B. The compliance substrates 77A and 77B are different from the compliance substrates 23A and 23B provided in the damper chambers DA and DB. In Figure 2, the compliance substrates 77A and 77B are not exposed to the outside of the liquid discharge head 10, but the compliance substrates 77A and 77B may also be exposed to the outside of the liquid discharge head 10.

[0073] The compliance substrate 77A is provided corresponding to the flow path 43A of the common liquid chamber RA. The compliance substrate 77A is located in the X1 direction of the flow path 43A. The compliance substrate 77A is positioned to cover the opening that forms the flow path 43A. The thickness direction of the compliance substrate 77A is along the X-axis direction. The compliance substrate 77A extends in the Y-axis direction. The compliance substrate 77A is fixed to the case 28.

[0074] The compliance substrate 77B is provided corresponding to the flow path 43B of the common liquid chamber RB. The compliance substrate 77B is located in the X2 direction of the flow path 43B. The compliance substrate 77B is positioned to cover the opening that forms the flow path 43B. The thickness direction of the compliance substrate 77B is along the X-axis direction. The compliance substrate 77B extends in the Y-axis direction. The compliance substrate 77B is fixed to the case 28.

[0075] Compliance substrates 77A and 77B may have the same configuration as compliance substrates 23A and 23B, for example. Compliance substrates 77A and 77B include an elastic layer and an insulating layer. The elastic layer is made of, for example, silicon dioxide (SiO2). The insulating layer is made of, for example, zirconium dioxide (ZrO2).

[0076] The compliance substrate 77A is deformable in response to the pressure of the ink in the flow path 43A of the common liquid chamber RA. The compliance substrate 77A deforms in response to the pressure of the ink and can absorb pressure fluctuations of the ink in the flow path 43A of the common liquid chamber RA.

[0077] The compliance substrate 77B is deformable in response to the pressure of the ink in the flow path 43B of the common liquid chamber RB. The compliance substrate 77B deforms in response to the pressure of the ink and can absorb pressure fluctuations of the ink in the flow path 43B of the common liquid chamber RB.

[0078] In the liquid ejection head 10 according to Example 1, the length LX1 in the X-axis direction of the supply-side compliance substrate 23A is longer than the length LX2 in the X-axis direction of the discharge-side compliance substrate 23B. In the liquid ejection head 10, ink is ejected from the nozzle N, so the flow rate of the liquid flowing through the discharge channel 41B is less than the flow rate of the liquid flowing through the supply channel 41A. The discharge channel 41B requires relatively less compliance capability because it is less affected by crosstalk and other factors compared to the supply channel 41A. Crosstalk, as used here, is a phenomenon in which vibrations caused by the flow of liquid through one individual channel (a channel consisting of an individual supply channel and an individual discharge channel) affect the liquid flowing through other individual channels adjacent to that one individual channel, reducing the ejection characteristics of the liquid in the other individual channels. As described above, since the flow rate of the discharge channel 41B is less than that of the supply channel 41A, the discharge-side compliance substrate 23B does not require as much length in the X-axis direction as the supply-side compliance substrate 23A. In the liquid discharge head 10, the length of the liquid discharge head 10 in the X-axis direction can be shortened by shortening the length LX1 of the supply-side compliance substrate 23A to the length LX2 of the discharge-side compliance substrate 23B. This makes it possible to miniaturize the liquid discharge head 10.

[0079] In the liquid discharge head 10 of Example 1, the compliance capacity on the supply side can be ensured by increasing the size of the compliance substrate 23A on the supply side, and the length of the liquid discharge head 10 in the Y-axis direction can be shortened by decreasing the size of the compliance substrate 23B on the discharge side, thereby saving space. The liquid discharge head 10 can achieve both ensuring compliance capacity and saving space.

[0080] In the liquid discharge head 10, the length LX6 of the discharge channel 41B is longer than the length LX5 of the supply channel 41A. However, the liquid discharge head 10 is not limited to having a discharge channel 41B with a length LX6 longer than the supply channel 41A with a length LX5. If the length LX6 of the discharge channel 41B is longer than the length LX5 of the supply channel 41A, and the cross-sectional area is the same, then the inertance of the discharge channel 41B is greater than the inertance of the supply channel 41A. As a result, the crosstalk effect is more easily attenuated in the discharge channel 41B than in the supply channel 41A. Even disregarding the fact that the flow rate of the discharge channel 41B is lower than that of the supply channel 41A, considering that the discharge channel 41B has a greater inertance than the supply channel 41A, it can be seen that the length of the compliance substrate 23B on the discharge side may be smaller in the X-axis direction than the compliance substrate 23A on the supply side.

[0081] Furthermore, in the liquid ejection head 10, since the piezoelectric element 71A is provided on the compliance substrate 23A, the piezoelectric element 71A can be deformed in accordance with the deformation of the compliance substrate 23A, thereby absorbing vibrations of the ink in the damper chamber DA. In addition, by providing the piezoelectric element 71A on the compliance substrate 23A, the compliance substrate 23A can be reinforced. The same applies to the piezoelectric element 71B.

[0082] Furthermore, in the liquid discharge head 10, the diaphragm 26 and compliance substrates 23A and 23B are integrated, and the configuration of the piezoelectric elements 71A and 71B on the compliance substrates 23A and 23B is the same as the configuration of the piezoelectric element 50 on the diaphragm 26, so the piezoelectric elements 71A and 71B can be easily manufactured.

[0083] In the liquid discharge head 10, the compliance amount CR from the discharge-side compliance substrate 23B is smaller than the compliance amount CS from the supply-side compliance substrate 23A. The compliance amounts CS and CR will be described later. As in Example 1, when the material, width along the Y-axis, and thickness along the Z-axis of the compliance substrates 23A and 23B are the same, the compliance amounts CS and CR are proportional to the length of the compliance substrates 23A and 23B in the X-axis direction. In the liquid discharge head 10, the compliance amount CR from the discharge side can be reduced compared to the compliance amount CS from the supply side.

[0084] <Compliance level> Next, the compliance amounts CS and CR in the liquid discharge head 10 will be described. Figure 9 is a plan view showing the length l and width w of the opening of the damper chamber DA formed below the compliance substrate 23A. Figure 10 is a cross-sectional view showing the thickness t of the compliance substrate 23A.

[0085] Compliance amount CS is the compliance amount in the supply channel 41A. Compliance amount CR is the compliance amount in the discharge channel 41B. Compliance amounts CS and CR satisfy the following equation (1): The supply-side compliance amount CS is greater than the discharge-side compliance amount CR. The supply-side compliance amount CS is an example of the supply-side compliance capacity. The discharge-side compliance amount CR is an example of the discharge-side compliance capacity. CS>CR…(1)

[0086] The ink flow rates QS and QR flowing through the liquid ejection head 10 satisfy the following equation (2): The supply ink flow rate QS is greater than the discharge ink flow rate QR. The supply flow rate QS is the flow rate of ink flowing through the supply channel 41A. The discharge flow rate QR is the flow rate of ink flowing through the discharge channel 41B. QS>QR…(2)

[0087] When the compliance amount CS on the supply side and the compliance amount CR on the discharge side are not distinguished, it is written as compliance amount C. Similarly, when compliance substrates 23A and 23B are not distinguished, it is written as compliance substrate 23. The compliance amount C can be expressed using the following formula (3).

number

[0088] In equation (3), "ν" is the Poisson's ratio of the compliance substrate 23. "ν" is a physical property of the material constituting the compliance substrate. "E" is Young's modulus. "E" is a physical property of the material constituting the compliance substrate.

[0089] "w" is the width of the opening covered by the compliance substrate. "w" is the width of the damper chambers DA and DB along the Y-axis. "l" is the length of the opening covered by the compliance substrate. "t" is the thickness of the compliance substrate.

[0090] <Case 1> For example, if the inertance MS of the supply channel 41A is smaller than the inertance MR of the discharge channel 41B, pressure fluctuations in the ink in the pressure chamber C are more easily transmitted to the ink in the supply channel 41A than to the ink in the discharge channel 41B. In this case, the compliance amounts CS and CR are set to satisfy equation (4). The compliance amount CS on the supply side is larger than the compliance amount CR on the discharge side. In Example 1, the inertance MS of the supply channel 41A is smaller than the inertance MR of the discharge channel 41B. CS>CR…(4)

[0091] <Case 2> For example, if the inertance MS of the supply channel 41A is greater than the inertance MR of the discharge channel 41B, pressure fluctuations in the ink in the pressure chamber C are more easily transmitted to the ink in the discharge channel 41B than to the ink in the supply channel 41A. In this case, the compliance amounts CS and CR are set to satisfy equation (5). The compliance amount CS on the supply side is greater than the compliance amount CR on the discharge side. In Example 8, which will be described later, the inertance MS of the supply channel 41A is greater than the inertance MR of the discharge channel 41B. CS <CR…(5)

[0092] <Example 2> Next, the liquid discharge head 10B according to Example 2 will be described. Figure 11 is a cross-sectional view showing the liquid discharge head 10B according to Example 2. Figure 12 is a plan view showing a part of the communication plate 24B. Figure 13 is a plan view showing a part of the pressure chamber substrate 25B. The differences between the liquid discharge head 10B according to Example 2 and the liquid discharge head 10 according to Example 1 shown in Figure 2 are that the communication plate 24B is replaced with a communication plate 24B, the pressure chamber substrate 25B is replaced with a pressure chamber substrate 25B, and the vibration absorbing parts 70C and 70D are replaced with vibration absorbing parts 70C and 70D. Note that in the description of Example 2, explanations similar to those for Example 1 may be omitted.

[0093] As shown in Figure 11, the liquid discharge head 10B comprises a nozzle substrate 21, a communication plate 24B, a pressure chamber substrate 25B, a diaphragm 26, compliance substrates 23C, 23D, a sealing plate 27, a case 28, and a COF 60. The liquid discharge head 10 also comprises vibration absorbing sections 70C, 70D. The supply-side vibration absorbing section 70C has a compliance substrate 23C and a piezoelectric element 71C. The discharge-side vibration absorbing section 70D has a compliance substrate 23D and a piezoelectric element 71D.

[0094] The liquid discharge head 10B has an ink flow path 40B. The ink flow path 40B has a supply flow path 41C and a discharge flow path 41D. The supply flow path 41C includes a flow path 45A, a flow path 46A, a connecting flow path 47D, and a damper chamber DC. The supply flow path 41C includes a common supply flow path provided in common for a plurality of pressure chambers C. The common supply flow path includes a flow path 45A, a flow path 46A, a connecting flow path 47D, and a damper chamber DC.

[0095] The discharge channel 41D includes a connecting channel 47C, a connecting channel 47E, a damper chamber DD, a channel 46B, and 45B. The discharge channel 41D includes individual discharge channels provided for each of the multiple pressure chambers C. Each individual discharge channel includes multiple connecting channels 47C. The discharge channel 41D includes a common discharge channel provided for all of the multiple pressure chambers C. The common discharge channel includes a channel 45B, a channel 46B, a connecting channel 47C, a connecting channel 47E, and a damper chamber DD.

[0096] As shown in Figure 12, the communication plate 24B has a flow path 46A which is part of the common liquid chamber RA, a communication flow path 47D, multiple communication flow paths 47C, a communication flow path 47E, and a flow path 46B which is part of the common liquid chamber RB. The communication plate 24 has through holes, grooves, or recesses formed therein. These through holes, grooves, or recesses form parts of the common liquid chambers RA and RB, and communication flow paths 47D, 47C, and 47E.

[0097] As shown in Figure 13, the pressure chamber substrate 25B has a flow path 45A which is part of the common liquid chamber RA, a damper chamber DC, multiple pressure chambers C, a damper chamber DD, and a flow path 45B which is part of the common liquid chamber RA. In Figure 13, multiple nozzles N are shown by dashed lines.

[0098] The supply-side damper chamber DC is provided in common for multiple pressure chambers C. The damper chamber DC extends in the Y-axis direction. The damper chamber DC communicates with multiple pressure chambers C. The discharge-side damper chamber DD is provided in common for multiple pressure chambers C. The damper chamber DD extends in the Y-axis direction. The damper chamber DC communicates with multiple pressure chambers C via multiple communication passages 47C.

[0099] The length LX3 of the supply-side damper chamber DC along the X-axis is different from the length LX4 of the discharge-side damper chamber DB along the X-axis. The length LX3 of the supply-side damper chamber DA along the X-axis is longer than the length LX4 of the discharge-side damper chamber DB along the X-axis. The width of damper chamber DA along the Y-axis is the same as the width of damper chamber DB along the Y-axis.

[0100] In the liquid discharge head 10B according to Example 2, a common supply-side compliance substrate 23C is provided for multiple pressure chambers C. In the liquid discharge head 10B, a common discharge-side compliance substrate 23D is provided for multiple pressure chambers C. The liquid discharge head 10B may also be configured to include such compliance substrates 23C and 23D.

[0101] <Example 3> Next, the liquid discharge head 10C according to Example 3 will be described. Figure 14 is a cross-sectional view showing the liquid discharge head 10C according to Example 3. Figure 15 is a cross-sectional view showing a part of the vibration absorption section 70E on the supply side according to Example 3. Figure 16 is a cross-sectional view showing a part of the vibration absorption section 70E on the discharge side according to Example 3. The difference between the liquid discharge head 10C according to Example 3 and the liquid discharge head 10 according to Example 1, as shown in Figure 2, is that it is equipped with a vibration absorption section 70E instead of a vibration absorption section 70A, and a vibration absorption section 70F instead of a vibration absorption section 70B. Note that in the description of Example 3, explanations similar to those for Examples 1 and 2 may be omitted.

[0102] As shown in Figure 15, the supply-side vibration absorbing section 70E comprises a compliance substrate 23E and a gold thin film 71E. The compliance substrate 23E includes a flexible film. The compliance substrate 23E includes an elastic layer 23e and an insulating layer 23f. The elastic layer 23e is made of, for example, silicon dioxide (SiO2). The insulating layer 23f is made of, for example, zirconium dioxide (ZrO2). The elastic layer 23e is formed on the pressure chamber substrate 25, and the insulating layer 23f is formed on the elastic layer 23e. The elastic layer 23e is formed continuously with the elastic layer 26a of the diaphragm 26 covering the pressure chamber C. The insulating layer 23f is formed continuously with the insulating layer 26b of the diaphragm 26.

[0103] Multiple compliance substrates 23E are provided for each of the multiple damper chambers DA arranged in the Y-axis direction. The compliance substrates 23E are deformable in response to the pressure of the ink. The compliance substrates 23E deform in response to the pressure of the ink and can absorb pressure fluctuations of the ink in the damper chambers DA. The multiple compliance substrates 23E deform individually in accordance with the multiple damper chambers DA.

[0104] The gold thin film 71E is deposited on the compliance substrate 23E. The gold thin film 71E has a predetermined length in the X-axis direction. The length of the gold thin film 71E in the X-axis direction is shorter than the length of the damper chamber DA in the X-axis direction. The gold thin film 71E has a predetermined length in the Y-axis direction. The gold thin film 71E is formed to cover a plurality of compliance substrates 23E arranged in the Y-axis direction. The gold thin film 71E may be provided for each of the plurality of compliance substrates 23E. The gold thin film 71E is made of gold. The thickness of the gold thin film 71E should be somewhat thick to reinforce the strength of the compliance substrate 23E, but somewhat thin to efficiently absorb pressure fluctuations of the ink in the damper chamber DA. Experiments have shown that a thickness of 0.7 to 1.3 μm was suitable for obtaining the above two effects. The vibration absorbing section 70E may be provided with a metal thin film made of a metal other than gold, such as tin, copper, or aluminum, instead of the gold thin film 71E.

[0105] As shown in Figure 16, the vibration absorption section 70F on the discharge side comprises a compliance substrate 23F and a gold thin film 71F. The compliance substrate 23F includes a flexible film. The compliance substrate 23F includes an elastic layer 23g and an insulating layer 23h. The elastic layer 23g is made of, for example, silicon dioxide (SiO2). The insulating layer 23h is made of, for example, zirconium dioxide (ZrO2). The elastic layer 23g is formed on the pressure chamber substrate 25, and the insulating layer 23h is formed on the elastic layer 23g. The elastic layer 23g is formed continuously with the elastic layer 26a of the diaphragm 26 that covers the pressure chamber C. The insulating layer 23h is formed continuously with the insulating layer 26b of the diaphragm 26.

[0106] Multiple compliance substrates 23F are provided for each of the multiple damper chambers DB arranged in the Y-axis direction. The compliance substrates 23F are deformable in response to the pressure of the ink. The compliance substrates 23F deform in response to the pressure of the ink and can absorb pressure fluctuations of the ink in the damper chambers DB. The multiple compliance substrates 23F deform individually in accordance with the multiple damper chambers DB.

[0107] The gold thin film 71F is deposited on the compliance substrate 23F. The gold thin film 71F has a predetermined length in the X-axis direction. The length of the gold thin film 71F in the X-axis direction is shorter than the length of the damper chamber DB in the X-axis direction. The gold thin film 71F has a predetermined length in the Y-axis direction. The gold thin film 71F is formed to cover a plurality of compliance substrates 23F arranged in the Y-axis direction. The gold thin film 71F may be provided for each of the plurality of compliance substrates 23F. The gold thin film 71F is made of gold. The thickness of the gold thin film 71F should be somewhat thick to reinforce the strength of the compliance substrate 23F, but somewhat thin to efficiently absorb pressure fluctuations of the ink in the damper chamber DB. Experiments have shown that a thickness of 0.7 to 1.3 μm was suitable for obtaining the above two effects. The vibration absorbing section 70F may be provided with a metal thin film made of a metal other than gold, such as tin, copper, or aluminum, instead of the gold thin film 71F.

[0108] Thus, the liquid discharge head 10C may also include a thin gold film 71E formed on the compliance substrate 23E. The liquid discharge head 10C may also include a thin gold film 71F formed on the compliance substrate 23F. In the liquid discharge head 10C, since the thin gold films 71E and 71F are formed on the compliance substrates 23E and 23F, the strength of the compliance substrates 23E and 23F can be reinforced. This improves the reliability of the compliance substrates 23E and 23F.

[0109] Furthermore, the ease with which the compliance substrates 23E and 23F can be deformed can be changed by varying the thickness of the gold thin films 71E and 71F. Also, the vibration absorption efficiency of the vibration absorption sections 70E and 70F can be changed by varying the thickness of the gold thin films 71E and 71F. Additionally, the ease with which the compliance substrates 23E and 23F can be deformed can be changed by varying the material of the metal thin film on the compliance substrates 23E and 23F.

[0110] <Example 4> Next, the liquid discharge head 10 according to Example 4 will be described. The illustration of the liquid discharge head 10 according to Example 4 is omitted. The cross-sectional view of the liquid discharge head 10 according to Example 4 is almost the same as the cross-sectional view of the liquid discharge head 10C of Example 3 shown in Figures 14 to 16. The difference between the liquid discharge head 10 according to Example 4 and the liquid discharge head 10C of Example 3 shown in Figure 14 is that the damper chambers DA and DB are replaced with damper chambers DC and DD, and the communication passages 47A and 47B are replaced with communication passages 47D and 47E. The damper chambers DC and DD and the communication passages 47D and 47E are the same as the damper chambers DC and DD and the communication passages 47D and 47E of Example 2 shown in Figure 11.

[0111] In the liquid discharge head 10 according to Example 4, a thin gold film 71E is formed on a compliance substrate 23C that covers the damper chamber DC, which is a common supply channel. In the liquid discharge head 10 according to Example 4, a thin gold film 71F is formed on a compliance substrate 23D that covers the damper chamber DD, which is a common discharge channel. The thin gold films 71E and 71F can be formed in the same manner as the thin gold films 71E and 71F of Example 3 described above.

[0112] <Example 5> Next, the liquid discharge head 10E according to Example 5 will be described. The illustration of the liquid discharge head 10E according to Example 5 is omitted. The cross-sectional view of the liquid discharge head 10E according to Example 5 is almost the same as the cross-sectional view of the liquid discharge head 10 of Example 1 shown in Figure 2. The differences between the liquid discharge head 10E according to Example 5 and the liquid discharge head 10 of Example 1 shown in Figure 2 are that the damper chamber DA is replaced with a damper chamber DC, the communication passage 47A is replaced with a communication passage 47D, and the vibration absorption section 70A is replaced with a vibration absorption section 70C. The damper chamber DC, communication passage 47D, and vibration absorption section 70C are the same as the damper chamber DC, communication passage 47D, and vibration absorption section 70C of Example 2 shown in Figure 11.

[0113] Figure 17 is a plan view showing a part of the communication plate 24E of the liquid discharge head 10E according to Example 5. The liquid discharge head 10E is equipped with a communication plate 24E in place of the communication plate 24 of Example 1. The communication plate 24E has a communication channel 47D included in the common supply channel and a communication channel 47B included in the individual discharge channels formed thereon.

[0114] Figure 18 is a plan view showing a part of the pressure chamber substrate 25E of the liquid discharge head 10E according to Example 5. The liquid discharge head 10E is equipped with a pressure chamber substrate 25E in place of the pressure chamber substrate 25 of Example 1. The pressure chamber substrate 25E has a damper chamber DC included in the common supply channel and a damper chamber DB included in the individual discharge channel formed therein.

[0115] Thus, in the liquid discharge head 10E, the supply-side damper chamber DC is provided in common for multiple pressure chambers C, and the discharge-side damper chamber DB is provided individually for each of the multiple pressure chambers C. In the liquid discharge head 10E, a common compliance substrate 23C is provided for each of the multiple pressure chambers C. In the liquid discharge head 10E, a compliance substrate 23B is provided for each of the multiple pressure chambers C. In the liquid discharge head 10E, an individual compliance substrate 23B is provided for each of the multiple pressure chambers C.

[0116] <Example 6> Next, the liquid discharge head 10 according to Example 6 will be described. The illustration of the liquid discharge head 10 according to Example 6 is omitted. The cross-sectional view of the liquid discharge head 10 according to Example 6 is almost the same as the cross-sectional view of the liquid discharge head 10C of Example 3 shown in Figure 14. The difference between the liquid discharge head 10 according to Example 6 and the liquid discharge head 10C of Example 3 shown in Figure 14 is that the damper chamber DA is replaced with a damper chamber DC, and the communication passage 47A is replaced with a communication passage 47D. The damper chamber DC, communication passage 47D, and vibration absorbing section 70C are the same as the damper chamber DC, communication passage 47D, and vibration absorbing section 70C of Example 2 shown in Figure 11.

[0117] The communication plate in Example 6 is the same as the communication plate 24E in Example 5 shown in Figure 17. The pressure chamber substrate in Example 6 is the same as the pressure chamber substrate 25E in Example 5 shown in Figure 18.

[0118] The liquid discharge head 10 of Example 6 includes a vibration absorption section 70E on the supply side and a vibration absorption section 70F on the discharge side. The cross-sectional view of the vibration absorption section 70E on the supply side is substantially the same as the vibration absorption section 70E shown in Figure 15. In Example 6, a compliance substrate 23E is provided for the damper chamber DC, which is a common supply flow path. The vibration absorption section 70E on the supply side includes a compliance substrate 23E provided for the common damper chamber DC and a gold thin film 71 provided on this compliance substrate 23E.

[0119] The cross-sectional view of the vibration absorption section 70F on the supply side is the same as the vibration absorption section 70F shown in Figure 16. In Embodiment 6, a compliance substrate 23F is provided for the damper chamber DB, which is an individual discharge channel. The vibration absorption section 70F on the discharge side comprises a plurality of compliance substrates 23E, each provided for a plurality of damper chambers DC, and a gold thin film 71 provided on these compliance substrates 23E.

[0120] In the liquid discharge head 10 of Example 6, gold thin films 71E and 71F are provided on compliance substrates 23E and 23F.

[0121] <Example 7> Next, the liquid discharge head 10 according to Example 7 will be described. The illustration of the liquid discharge head 10 according to Example 7 is omitted. The cross-sectional view of the liquid discharge head 10 according to Example 7 is almost the same as the cross-sectional view of the liquid discharge head 10B of Example 2 shown in Figure 11. The difference between the liquid discharge head 10 according to Example 7 and the liquid discharge head 10B of Example 2 shown in Figure 11 is that the vibration absorbing section 70E is provided instead of the vibration absorbing section 70C. In Example 7, the vibration absorbing section 70E on the supply side has a gold thin film 71E, and the vibration absorbing section 70D on the discharge side has a piezoelectric element 71D.

[0122] In Example 7, the structure provided on the supply-side compliance substrate 23C and the structure provided on the discharge-side compliance substrate 23D are different. By changing the structures on the compliance substrates 23C and 23D in this way, it is possible to create a difference in vibration absorption capacity between the supply side and the discharge side.

[0123] For example, as a modification of Example 7, a piezoelectric element 71A may be provided on the supply-side compliance substrate 23C, and a gold thin film 71F may be provided on the discharge-side compliance substrate 23D. In addition, in the liquid discharge head 10 according to other embodiments, the structure on the compliance substrate may be different on the supply side and the discharge side.

[0124] <Example 8> Next, the liquid dispensing head 10H according to Example 8 will be described. Figure 19 is a cross-sectional view showing the liquid dispensing head 10H according to Example 8. The difference between the liquid dispensing head 10H according to Example 8 shown in Figure 19 and the liquid dispensing head 10 of Example 1 shown in Figure 2 is that the direction of liquid flow is different. In the liquid dispensing head 10H of Example 8, the direction of liquid flow is the opposite of the direction of liquid flow in the liquid dispensing head 10 of Example 1. In Figure 19, the direction of liquid flow is indicated by an arrow. In Figure 19, almost the same reference numerals as in Figure 1 are used, but the direction of liquid flow is the opposite of that in Figure 1. Note that in the description of the liquid dispensing head 10H according to Example 8, the same explanation as for the liquid dispensing heads 10 according to Examples 1 to 7 above may be omitted.

[0125] The liquid discharge head 10H has a flow path 40H through which ink flows. The flow path 40H includes a supply port 42C, an outlet port 42D, common liquid chambers RA and RB, damper chambers DA and DB, a pressure chamber C, connecting flow paths 47A to 47C, and a nozzle N.

[0126] The flow path 40H includes a supply flow path 41E and a discharge flow path 41F. The supply flow path 41E is a flow path upstream of the pressure chamber C and is a flow path within the communication plate 24 and the pressure chamber substrate 25. The supply flow path 41E includes flow path 45B, flow path 46B, communication flow path 47B, damper chamber DB, and communication flow path 47C. The discharge flow path 41F is a flow path downstream of the pressure chamber C and is a flow path within the communication plate 24 and the pressure chamber substrate 25. The discharge flow path 41F includes the damper chamber DA, communication flow path 47A, flow path 46A, and flow path 45A.

[0127] The liquid discharge head 10H includes a damper chamber DB on the supply side and a damper chamber DA on the discharge side. The liquid discharge head 10H also includes a vibration absorption section 70B on the supply side and a vibration absorption section 70A on the discharge side. In this case, the compliance substrate 23B is the compliance substrate on the supply side, and the compliance substrate 23A is the compliance substrate on the discharge side.

[0128] In Example 8, the length LX12 of the discharge-side compliance substrate 23A along the X-axis direction is longer than the length LX11 of the supply-side compliance substrate 23B along the X-axis direction.

[0129] Thus, the length LX12 of the discharge-side compliance substrate 23A along the X-axis direction may be longer than the length LX11 of the supply-side compliance substrate 23B along the X-axis direction.

[0130] In Example 8, the compliance capacity of the discharge-side compliance substrate 23A is greater than that of the supply-side compliance substrate 23B. The compliance substrates 23A and 23B are made of the same material and have the same thickness. Since the length LX12 of compliance substrate 23A along the X-axis is longer than the length LX11 of compliance substrate 23B along the X-axis, the compliance capacity of compliance substrate 23A is greater than that of compliance substrate 23B.

[0131] In Example 8, the inertance of the discharge channel 41F is greater than the inertance of the supply channel 41E. In Example 8, the compliance capabilities of the compliance substrates 23A and 23B are set according to the size of the inertance.

[0132] <Liquid discharge device> Next, a liquid dispensing device 1 equipped with a liquid dispensing head 10 will be described with reference to Figures 18 and 19. Figure 18 is a schematic diagram showing a liquid dispensing device 1 equipped with a liquid dispensing head 10. The liquid dispensing device 1 is equipped with the liquid dispensing head 10 according to the above-described embodiment 1. Figure 18 is a block diagram of the liquid dispensing device 1. Note that the liquid dispensing device 1 is not limited to a configuration equipped with the liquid dispensing head 10 according to embodiment 1. The liquid dispensing device 1 may be equipped with liquid dispensing heads 10B to 10G according to embodiments 2 to 7 instead of the liquid dispensing head 10 according to embodiment 1.

[0133] Liquid ejection device 1 is an inkjet printing device that ejects ink, an example of a "liquid," as droplets onto a medium PA. Liquid ejection device 1 is a serial-type printing device. Medium PA is typically printing paper. However, medium PA is not limited to printing paper and may be any material to be printed on, such as resin film or fabric.

[0134] The liquid dispensing device 1 comprises a liquid dispensing head 10 for dispensing ink, a liquid container 2 for storing ink, a carriage 3 on which the liquid dispensing head 10 is mounted, a carriage transport mechanism 4 for transporting the carriage 3, a medium transport mechanism 5 for transporting the medium PA, and a control unit 30. The control unit 30 is a control unit that controls the dispensing of the liquid.

[0135] Specific embodiments of the liquid container 2 include, for example, a cartridge detachable from the liquid dispensing device 1, a bag-shaped ink pack made of a flexible film, and an ink tank that can be refilled with ink. The type of ink stored in the liquid container 2 is arbitrary. The liquid dispensing device 1 may be equipped with multiple liquid containers 2 corresponding to, for example, four colors of ink. The four colors of ink may be, for example, cyan, magenta, yellow, and black. The liquid containers 2 may also be mounted on the carriage 3.

[0136] The liquid ejection device 1 includes a circulation mechanism 8 for circulating ink. The circulation mechanism 8 includes a supply channel 81 for supplying ink to the liquid ejection head 10, a recovery channel 82 for recovering the ink discharged from the liquid ejection head 10, and a pump 83 for transferring the ink.

[0137] The carriage transport mechanism 4 has a transport belt 4a and a motor for transporting the carriage 3. The medium transport mechanism 5 has transport rollers 5a and a motor for transporting the medium PA. The carriage transport mechanism 4 and the medium transport mechanism 5 are controlled by the control unit 30. The liquid dispensing device 1 transports the carriage 3 by the carriage transport mechanism 4 while the medium PA is transported by the medium transport mechanism 5, and prints by dispensing ink droplets onto the medium PA.

[0138] The liquid dispensing device 1 includes a linear encoder 6, as shown in Figure 19. It is positioned to detect the position of the carriage 3. The linear encoder 6 acquires information regarding the position of the carriage 3. As the carriage 3 moves, the linear encoder 6 outputs an encoder signal to the control unit 30.

[0139] The control unit 30 includes one or more CPUs 31. The control unit 30 may also include an FPGA instead of, or in addition to, the CPUs 31. The control unit 30 includes a storage unit 35. The storage unit 35 includes, for example, a ROM 36 and a RAM 37. The storage unit 35 may also include an EEPROM or a PROM. The storage unit 35 can store print data Img supplied from the host computer. The storage unit 35 stores the control program for the liquid dispensing device 1.

[0140] CPU is an abbreviation for Central Processing Unit. FPGA is an abbreviation for field-programmable gate array. RAM is an abbreviation for Random Access Memory. ROM is an abbreviation for Read Only Memory. EEPROM is an abbreviation for Electrically Erasable Programmable Read-Only Memory. PROM is an abbreviation for Programmable ROM.

[0141] The control unit 30 generates signals to control the operation of each part of the liquid dispensing device 1. The control unit 30 can generate a print signal SI and a waveform specification signal dCom. The print signal SI is a digital signal that specifies the type of operation of the liquid dispensing head 20. The print signal SI can specify whether or not to supply a drive signal Com to the piezoelectric element 50. The waveform specification signal dCom is a digital signal that defines the waveform of the drive signal Com. The drive signal Com is an analog signal for driving the piezoelectric element 50.

[0142] The liquid dispensing device 1 includes a drive signal generation circuit 32. The drive signal generation circuit 32 is electrically connected to the control unit 30. The drive signal generation circuit 32 includes a DA conversion circuit. The drive signal generation circuit 32 generates a drive signal Com having a waveform defined by a waveform specification signal dCom. When the control unit 30 receives an encoder signal from the linear encoder 6, it outputs a timing signal PTS to the drive signal generation circuit 32. The timing signal PTS defines the generation timing of the drive signal Com. The drive signal generation circuit 32 outputs the drive signal Com each time it receives the timing signal PTS.

[0143] The drive circuit 62 is electrically connected to the control unit 30 and the drive signal generation circuit 32. Based on the print signal SI, the drive circuit 62 switches whether or not to supply the drive signal Com to the piezoelectric element 50. Based on the print signal SI, latch signal LAT, and change signal CH supplied from the control unit 30, the drive circuit 62 can select the piezoelectric element 50 to which the drive signal Com is supplied. The latch signal LAT defines the latch timing of the print data Img. The change signal CH defines the selection timing of the drive pulse included in the drive signal Com.

[0144] The control unit 30 controls the ink ejection operation by the liquid ejection head 20. As described above, the control unit 30 drives the piezoelectric element 50 to fluctuate the ink pressure in the pressure chamber C and eject ink from the nozzle N. The control unit 30 controls the ejection operation when performing a printing operation.

[0145] The above-described liquid discharge head 10 can be applied to such a liquid discharge device 1. In a liquid discharge device 1 equipped with the liquid discharge head 10, the length LX1 in the X-axis direction of the supply-side compliance substrate 23A is longer than the length LX2 in the X-axis direction of the discharge-side compliance substrate 23B. By making the length LX2 of the discharge-side compliance substrate 23B shorter than the length LX1 of the supply-side compliance substrate 23A, the liquid discharge head 10 can be miniaturized.

[0146] The embodiments described above merely represent typical forms of the present invention, and the present invention is not limited to the embodiments described above. Various modifications and additions are possible without departing from the spirit of the present invention.

[0147] <Example 1> In the liquid discharge head 10 according to Embodiment 1 described above, the compliance substrates 23A and 23B are provided at the same position as the diaphragm 26 in the Z-axis direction. However, the compliance substrates 23A and 23B may be provided at different positions from the diaphragm 26 in the Z-axis direction. For example, the supply-side compliance substrate 23A may be provided in the Z1 direction of the communication channel 47A. The discharge-side compliance substrate 23B may be provided in the Z1 direction of the communication channel 47B. The compliance substrates 23A and 23B may be provided on the nozzle substrate 21.

[0148] <Modification 2> In the liquid discharge head 10 according to the above embodiment 1, compliance substrates 77A and 77B are provided in the common liquid chambers RA and RB. However, the liquid discharge head 10 may also be configured without compliance substrates 77A and 77B. Furthermore, the amount of compliance provided by the compliance substrate 77A on the supply side and the amount of compliance provided by the compliance substrate 77B on the discharge side may be different. In addition, the compliance substrates 77A and 77B may be of different sizes.

[0149] <Variation 3> In the liquid discharge head 10 according to the above embodiment 1, the COF 60 is positioned between the piezoelectric element 50 and the discharge-side compliance substrate 23B in the X-axis direction, but the positioning of the COF 60 is not limited to this. For example, the COF 60 may be positioned between the piezoelectric element 50 and the supply-side compliance substrate 23A in the X-axis direction.

[0150] <Modification 4> In the liquid discharge head 10 according to the above embodiment 1, the nozzle N is positioned to overlap with the pressure chamber C when viewed in the Z-axis direction, but the nozzle N may be positioned to not overlap with the pressure chamber C. Furthermore, the liquid discharge head 10 may be configured such that multiple pressure chambers C are connected to a single nozzle N.

[0151] <Modification 5> In the liquid discharge head 10 according to Embodiment 1 described above, the vibration absorbing section 70A is configured to include individual electrode layers 71a, a common electrode layer 71b, and a piezoelectric layer 71c provided on the compliance substrate 23A. However, the vibration absorbing section 70A is not limited to having individual electrode layers 71a, a common electrode layer 71b, and a piezoelectric layer 71c. For example, the vibration absorbing section 70A may have a piezoelectric layer 71c and a common electrode layer 71b, but no individual electrode layer 71a. Other components may be arranged on the compliance substrate 23A. If the components laminated on the compliance substrate 23A have the same configuration as the piezoelectric element 50 on the diaphragm 26, the piezoelectric element 50 can be laminated, and at the same time, the individual electrode layers 71a, a common electrode layer 71b, and a piezoelectric layer 71c can be laminated on the compliance substrate 23A. Therefore, the piezoelectric element 71A can be easily manufactured on the compliance substrate 23A. The same applies to the piezoelectric element 71B on the compliance substrate 77B.

[0152] <Variation 6> The rigidity of the supply-side compliance substrate 23A may be lower than that of the discharge-side compliance substrate 23B. For example, the rigidity can be changed by changing the film thickness, material, length in the X-axis direction, length in the Y-axis direction, etc., of the compliance substrates 23A and 23B. Alternatively, the rigidity of the compliance substrates 23A and 23B can be changed by changing the configuration of the laminate on the compliance substrates 23A and 23B. The laminate on the compliance substrates 23A and 23B may include, for example, the piezoelectric elements 71A and 71B and the gold thin film 71E.

[0153] In the embodiments described above, a serial-type liquid dispensing device 1 is illustrated in which a carriage 3 equipped with a liquid dispensing head 10 is reciprocated in the width direction of the medium PA. However, the present invention may also be applied to a line-type liquid dispensing device equipped with a line head in which the liquid dispensing heads 10 are arranged in a predetermined direction.

[0154] The liquid dispensing device 1 illustrated in the above-described embodiment can be used in various devices such as facsimile machines and photocopiers, in addition to equipment dedicated to printing. However, the applications of the liquid dispensing device of the present invention are not limited to printing. For example, a liquid dispensing device that dispenses a colorant solution can be used as a manufacturing device for forming color filters for display devices such as liquid crystal display panels. A liquid dispensing device that dispenses a conductive material solution can be used as a manufacturing device for forming wiring and electrodes on a wiring board. Furthermore, a liquid dispensing device that dispenses a solution of organic matter related to living organisms can be used, for example, as a manufacturing device for producing biochips. [Explanation of symbols]

[0155] 1...Liquid discharge device, 10, 10B, 10C, 10E, 10H...Liquid discharge head, 21...Nozzle substrate, 23A...Compliance substrate (supply side compliance substrate), 23B...Compliance substrate (discharge side compliance substrate), 24...Communication plate, 25...Pressure chamber substrate, 30...Control unit, 41A...Supply channel, 41B...Discharge channel, 50...Piezoelectric element, 77A...Compliance substrate (second supply side compliance substrate), 77B...Compliance substrate (second discharge side compliance substrate), 61...Flexible wiring board (wiring board), C...Pressure chamber, CL...Pressure chamber row, LX1...Length of supply side compliance substrate, LX2...Length of discharge side compliance substrate, N...Nozzle, X...X-axis direction (first direction), X1...X1 direction (one side of the first direction), X2...X2 direction (the other side of the first direction), Y...Y-axis direction (second direction), Z...Z-axis direction (third direction).

Claims

1. A nozzle for dispensing liquid, A pressure chamber for applying pressure to a liquid, A supply channel located on one side in the first direction from the pressure chamber, which supplies liquid to the pressure chamber, A discharge channel located on the other side in the first direction from the pressure chamber, for discharging liquid from the pressure chamber, A supply-side compliance substrate is provided facing the supply channel and for absorbing vibrations of the liquid in the supply channel, A discharge-side compliance substrate is provided facing the discharge channel and for absorbing vibrations of the liquid in the discharge channel, It has, The length of the discharge-side compliance substrate along the first direction is shorter than the length of the supply-side compliance substrate along the first direction. The length of the discharge channel along the first direction is longer than the length of the supply channel along the first direction. A liquid dispensing head characterized by the following features.

2. A nozzle for dispensing liquid, A pressure chamber for applying pressure to a liquid, A supply channel located on one side in the first direction from the pressure chamber, which supplies liquid to the pressure chamber, A discharge channel located on the other side in the first direction from the pressure chamber, for discharging liquid from the pressure chamber, A supply-side compliance substrate is provided facing the supply channel and for absorbing vibrations of the liquid in the supply channel, A discharge-side compliance substrate is provided facing the discharge channel and for absorbing vibrations of the liquid in the discharge channel, A pressure chamber row in which a plurality of the aforementioned pressure chambers are arranged in a predetermined direction, It has, The length of the discharge-side compliance substrate along the first direction is shorter than the length of the supply-side compliance substrate along the first direction. The supply-side compliance substrate is provided in common for the plurality of pressure chambers, The exhaust-side compliance substrate is provided individually for each of the multiple pressure chambers. A liquid dispensing head characterized by the following features.

3. The liquid discharge head according to claim 1 or 2, characterized in that the compliance capacity of the discharge-side compliance substrate is smaller than the compliance capacity of the supply-side compliance substrate.

4. The liquid discharge head according to any one of claims 1 to 3, characterized in that the rigidity of the supply-side compliance substrate is lower than that of the discharge-side compliance substrate.

5. The liquid discharge head according to any one of claims 1 to 4, characterized in that the inertance of the discharge channel is greater than the inertance of the supply channel.

6. Upstream of the aforementioned supply channel, a second supply-side compliance substrate, different from the supply-side compliance substrate, is further provided. The liquid discharge head according to any one of claims 1 to 5, further characterized in that a second discharge-side compliance substrate, different from the discharge-side compliance substrate, is provided downstream of the discharge channel.

7. The liquid discharge head according to claim 6, characterized in that the second supply-side compliance substrate and the second discharge-side compliance substrate are provided along a second direction intersecting the first direction.

8. The liquid discharge head according to claim 7, characterized in that the length of the second supply-side compliance substrate along the second direction is equal to the length of the second discharge-side compliance substrate along the second direction.

9. The liquid discharge head according to any one of claims 1 to 8, characterized in that, in the first direction, the supply-side compliance substrate and the discharge-side compliance substrate are arranged spaced apart from each other.

10. The liquid discharge head according to claim 9, characterized in that the pressure chamber is located between the supply-side compliance substrate and the discharge-side compliance substrate in the first direction.

11. A piezoelectric element provided in the pressure chamber, which causes pressure fluctuations in the liquid inside the pressure chamber, The system comprises a wiring board electrically connected to the piezoelectric element, The liquid discharge head according to claim 10, characterized in that the wiring board is located between the discharge-side compliance board and the pressure chamber in the first direction when viewed in a third direction along the thickness direction of the discharge-side compliance board.

12. A nozzle for dispensing liquid, A pressure chamber for applying pressure to a liquid, A supply channel located on one side in the first direction from the pressure chamber, which supplies liquid to the nozzle, A discharge channel located on the other side in the first direction from the pressure chamber, for discharging liquid from the nozzle, A supply-side compliance substrate is provided facing the supply channel and for absorbing vibrations of the liquid in the supply channel, A discharge-side compliance substrate is provided facing the discharge channel and for absorbing vibrations of the liquid in the discharge channel, It has, The length of the discharge-side compliance substrate along the first direction is longer than the length of the supply-side compliance substrate along the first direction. The length of the discharge channel along the first direction is shorter than the length of the supply channel along the first direction. A liquid dispensing head characterized by the following features.

13. The liquid discharge head according to claim 12, characterized in that the compliance capability of the discharge-side compliance substrate is greater than the compliance capability of the supply-side compliance substrate.

14. The liquid discharge head according to claim 12 or 13, characterized in that the inertance of the discharge channel is smaller than the inertance of the supply channel.

15. A pressure chamber substrate provided with the aforementioned pressure chamber, A nozzle substrate on which the nozzle is provided, The supply channel and a portion of the discharge channel are provided, and a communication plate is provided between the pressure chamber substrate and the nozzle substrate, The supply channel is the channel upstream of the pressure chamber among the channels provided in the communication plate and the pressure chamber substrate, The liquid discharge head according to any one of claims 1 to 14, characterized in that the discharge channel is a channel downstream of the pressure chamber among the channels provided in the communication plate and the pressure chamber substrate.

16. A liquid dispensing head according to any one of claims 1 to 15, A liquid dispensing device characterized by having a control unit that controls the dispensing operation of dispensing liquid from the liquid dispensing head.

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