Manufacturing equipment for organic light-emitting display devices

Abstract

The organic light emitting display device manufacturing apparatus includes a first deposition chamber, a second deposition chamber, and a third deposition chamber. The first deposition chamber includes a first evaporation source that dispenses a third light emitting material for forming a third organic light emitting element through a first nozzle arranged to face a spaced region between adjacent stripe patterns on a substrate having a plurality of stripe patterns. The second deposition chamber includes a second evaporation source that dispenses a first light emitting material for forming the first organic light emitting element through a second nozzle arranged to face a first region of the stripe patterns. The third deposition chamber includes a third evaporation source that dispenses a second light emitting material for forming a second organic light emitting element through a third nozzle arranged to face a second region of the stripe patterns. The second nozzle and the third nozzle are inclined in opposite directions to each other with respect to the moving direction of the substrate.

Description

Technical Field

[0001] Embodiments of the present invention relate to a manufacturing apparatus for an organic light-emitting display device.

Background Art

[0002] Recently, flat panel displays having excellent characteristics such as thinning, weight reduction, and low power consumption have been widely developed and applied in various fields.

[0003] Among flat panel displays, an organic light-emitting display device is a display device that injects charges into an organic light-emitting layer formed between a second electrode that is an electron injection electrode and a first electrode that is a hole injection electrode, forms pairs of electrons and holes, and emits light while disappearing.

[0004] An FMM (Fine Metal Mask) is used as a deposition pattern mask to form an organic light-emitting layer constituting an organic light-emitting element by deposition for each sub-pixel.

[0005] However, in the manufacture of high-definition (e.g., 500 PPI or more) display devices or large-area (e.g., 8th generation or more) display devices, it is quite difficult to form a light-emitting layer for each sub-pixel using an FMM. Further, when using an FMM, there is a limit to further increasing the high definition.

[0006] Also, when using an FMM, there are problems of a decrease in yield and an increase in manufacturing cost.

[0007] Furthermore, when using an FMM, it is difficult to optimize the deposition, and there is a problem of a decrease in product life. [[ID=No. 34]]

Summary of the Invention

Problems to be Solved by the Invention

[0008] The present invention aims to provide a manufacturing apparatus for an organic light-emitting display device that can effectively form a light-emitting layer without using a deposition pattern mask such as an FMM. [Means for solving the problem]

[0009] According to one aspect of the embodiment of the present application, the manufacturing apparatus for an organic light-emitting device includes: a first evaporation chamber including a first evaporation source for discharging a third light-emitting material for forming a third organic light-emitting device through a first nozzle positioned opposite to a separation region between adjacent stripe patterns on a substrate having a plurality of stripe patterns; a second evaporation chamber including a second evaporation source for discharging a first light-emitting material for forming the first organic light-emitting device through a second nozzle positioned opposite to a first region of the stripe pattern; and a third evaporation chamber including a third evaporation source for discharging a second light-emitting material for forming the second organic light-emitting device through a third nozzle positioned opposite to a second region of the stripe pattern, wherein the second and third nozzles are inclined in opposite directions with respect to the direction of movement of the substrate.

[0010] The substrate includes a plurality of pixels, each of which includes a first subpixel, a second subpixel, and a third subpixel, the first subpixel, the second subpixel, and the third subpixel are arranged alternately along the first direction and elongated along the second direction, the inclination angles of the first and second regions of the stripe pattern are 60 to 95 degrees, and the substrate can move in the first direction during deposition in the first, second, and third deposition chambers, respectively.

[0011] The first deposition chamber can discharge the third light-emitting material toward the separation region to form a third organic light-emitting layer common to each of the first subpixel, second subpixel, and third subpixel.

[0012] The first region has at least one first surface, and the second deposition chamber can eject the first light-emitting material toward the at least one first surface to form a first organic light-emitting layer on the first subpixel.

[0013] The second region has at least one second surface, and the third deposition chamber can eject the second light-emitting material toward the at least one second surface to form a second organic light-emitting layer on the second subpixel.

[0014] During the deposition process in the first deposition chamber, the substrate can move in the first or second direction, and during the deposition process in the second and third deposition chambers, the substrate can move in the first direction.

[0015] The manufacturing apparatus for an organic light-emitting display device may include a rotating chamber between the first and second deposition chambers for rotating the substrate by 90 degrees.

[0016] The manufacturing apparatus for the organic light-emitting display device includes an input chamber at the front end of the first deposition chamber, and the input chamber may have a function that allows substrates to be fed in one direction and two directions perpendicular to each other.

[0017] The first light-emitting material may be a red light-emitting material, the second light-emitting material may be a green light-emitting material, and the third light-emitting material may be a blue light-emitting material.

[0018] The first light-emitting material may be a green light-emitting material, the second light-emitting material may be a red light-emitting material, and the third light-emitting material may be a blue light-emitting material. [Effects of the Invention]

[0019] In the embodiments of this application, two subpixels constituting a pixel (a first subpixel and a second subpixel) are located on corresponding first regions (first inclined surfaces) and second regions (second inclined surfaces) of the stripe pattern, and another subpixel (a third subpixel) can be located on a separation region between adjacent stripe patterns. In such cases, first to third organic light-emitting layers corresponding to the first to third subpixels are deposited. At this time, the first to third organic light-emitting layers are deposited on the first to third subpixels using a self-alignment method.

[0020] This makes it possible to form subpixels in a side-by-side structure for high-definition or large-area display devices that are difficult to manufacture using FMM (Full-Mounted Microwave) technology, thereby improving the performance of the display device, including power consumption, brightness, and lifespan.

[0021] Furthermore, the side-by-side structure can now be realized using an in-line deposition method, reducing investment costs and improving productivity (for example, by more than three times).

[0022] Furthermore, it becomes possible to form the light-emitting layer without using FMM, improving yield and reducing manufacturing costs.

[0023] Furthermore, it becomes possible to form an organic light-emitting layer without using FMM, and product life is extended through optimization of the deposition process.

[0024] Furthermore, pixels will have a three-dimensional structure instead of a planar structure, increasing the light-emitting area and improving their lifespan (for example, by approximately four times or more).

[0025] Furthermore, due to the three-dimensional structure of the stripe pattern, an organic light-emitting device that emits at least two or more different color lights is arranged on at least two or more sub-pixels, and thus, compared with the existing planar structure, a higher definition is ensured, and it can be adopted for XR (extended reality) related devices such as AR (augmented reality), VR (virtual reality), and MR (mixed reality).

Brief Description of Drawings

[0026] [Figure 1] FIG. 1 is a diagram schematically showing an organic light-emitting display device according to a first embodiment. [Figure 2] FIG. 2 is a diagram schematically showing a stacked structure of different organic light-emitting devices according to a first embodiment. [Figure 3] FIG. 3 is a cross-sectional view schematically showing a stripe pattern and a light-emitting layer according to a first embodiment. [Figure 4] FIG. 4 is a diagram schematically showing a deposition method of a blue light-emitting layer according to a first embodiment. [Figure 5] FIG. 5 is a diagram schematically showing a deposition method of a red light-emitting layer according to a first embodiment. [Figure 6] FIG. 6 is a diagram schematically showing a deposition method of a green light-emitting layer according to a first embodiment. [Figure 7] FIG. 7 is a diagram schematically showing another example of a deposition method of a blue light-emitting layer according to a first embodiment. [Figure 8] FIG. 8(A) is a diagram schematically showing a design structure of a stripe pattern and a design structure of a deposition apparatus according to a first embodiment, and FIG. 8(B) is a diagram showing a partial enlargement of the substrate in FIG. 8(A). [Figure 9] FIG. 9 is a diagram showing an example of the structure of an organic light-emitting display device according to a first embodiment. [Figure 10] FIGS. 10 is a diagram showing a light-emitting path when the organic light-emitting display device in FIG. 9 is an upper light-emitting type. [Figure 11]Figure 11 is a diagram illustrating the light emission path when the organic light-emitting display device shown in Figure 9 uses an upper light emission method. [Figure 12] Figure 12 is a diagram illustrating the light emission path when the organic light-emitting display device shown in Figure 9 uses a bottom-emitting method. [Figure 13] Figures 13(a), 13(b), and 13(c) illustrate various examples of the stripe pattern shapes of the first embodiment. [Figure 14] Figure 14 illustrates various examples of the stripe pattern shapes in the first embodiment. [Figure 15] Figure 15 illustrates various examples of the stripe pattern shapes in the first embodiment. [Figure 16] Figure 16 illustrates various examples of the stripe pattern shapes in the first embodiment. [Figure 17] Figure 17 illustrates various examples of the stripe pattern shapes in the first embodiment. [Figure 18] Figure 18 is a diagram illustrating the stacked structure of different organic light-emitting elements according to the first embodiment. [Figure 19] Figure 19 is a schematic diagram illustrating an in-line deposition apparatus for forming the stacked organic light-emitting element shown in Figure 18. [Figure 20] Figure 20 is a diagram illustrating the stacked structure of different organic light-emitting elements according to the second embodiment. [Figure 21] Figure 21 is a diagram illustrating the stacked structure of different organic light-emitting elements according to the third embodiment. [Figure 22] Figure 22 is a schematic diagram illustrating an organic light-emitting display device according to the second embodiment. [Figure 23] Figure 23 illustrates an example of a method for forming the protective pattern shown in Figure 22. [Figure 24] Figure 24 is a schematic diagram illustrating an organic light-emitting display device according to the third embodiment. [Figure 25] Figure 25 is a schematic diagram illustrating the pixel structure of a typical display device. [Figure 26]Figure 26 is a schematic diagram illustrating the pixel structure of the display device of the embodiment. [Figure 27] Figure 27 is a schematic diagram illustrating the pixel design model of the display device in the embodiment shown in Figure 26. [Modes for carrying out the invention]

[0027] The embodiments will be described in detail below with reference to the drawings. In the following description, unless otherwise specified, the display device may refer to an organic light-emitting display device. Row direction and row line may represent the X-axis direction as the first direction, and column direction and column line may represent the Y-axis direction as the second direction perpendicular to the first direction. In the following description, row direction, row line, first direction, X-axis direction, etc. may be used interchangeably. Similarly, column direction, column line, second direction, Y-axis direction, etc. may be used interchangeably.

[0028] Alternatively, the first direction may refer to the Y-axis direction, and the second direction may refer to the X-axis direction. In the following description, multiple subpixels SPr, SPg, and SPb can be adjacent to or separated from each other. Pixels P that make up multiple subpixels SPr, SPg, and SPb can be adjacent to or separated from other adjacent pixels P. When multiple subpixels SPr, SPg, and SPb separate, or when adjacent pixels P separate, a black matrix, bank, barrier pattern, color delimiter pattern, etc., are placed on the separated region formed by that separation.

[0029] Some components omitted from the following description may be publicly known, but it is self-evident that these omitted components also fall within the technical concept of the embodiments. Furthermore, for the sake of explanatory convenience, the components illustrated in the drawings relating to the various embodiments do not necessarily correspond in structure, shape, thickness, width, area, size, volume, etc., to the corresponding components in the actual mass-produced products.

[0030] Figure 1 is a schematic diagram illustrating an organic light-emitting device according to the first embodiment, and Figure 2 is a schematic diagram illustrating the stacked structure of each organic light-emitting element according to the first embodiment.

[0031] Referring to Figure 1, the organic light-emitting display device 10 according to the embodiment may include a substrate 100 in which a plurality of pixels P are arranged in a matrix configuration along the column direction (or first direction) and the row direction (or second direction) in the display area. Here, the row direction may represent the X-axis direction, and the column direction may represent the Y-axis direction.

[0032] The organic light-emitting display device 10 according to the embodiment may be a top-emission type display device that emits light upwards from the substrate 100 to display an image. The organic light-emitting display device 10 according to the embodiment may also be a bottom-emission type display device that emits light downwards from the substrate 100 to display an image.

[0033] Multiple pixels P may contain at least three subpixels of different colors, but may be arranged in the order of red subpixel SPr, green subpixel SPg, and blue subpixel SPb along the first direction (X-axis direction), but is not limited to this. For example, the red subpixel SPr may be referred to as the first subpixel, the green subpixel SPg as the second subpixel, and the blue subpixel SPb as the third subpixel. Although not shown in the figures, they may be arranged in the order of green subpixel SPg, red subpixel SPr, and blue subpixel SPb along the first direction (X-axis direction). Although not shown in the figures, they may be arranged in the order of red subpixel SPr, blue subpixel SPb, and green subpixel SPg along the first direction (X-axis direction).

[0034] On the other hand, in this embodiment, each subpixel SPr, SPg, and SPb may be arranged in a stripe pattern. Subpixels SPr, SPg, and SPb of the same color may be placed on the same column line, while subpixels SPr, SPg, and SPb of different colors may be arranged alternately on a column line basis. That is, subpixels SPr, SPg, and SPb of the same color may be arranged in a stripe pattern that is elongated along the second direction (Y-axis direction). For example, red subpixels SPr may be arranged in a stripe pattern that is elongated along the second direction. For example, green subpixels SPg may be arranged adjacent to red subpixels SPr in the first direction and in a stripe pattern that is elongated along the second direction. For example, blue subpixels SPb may be arranged adjacent to green subpixels SPg in the first direction and in a stripe pattern that is elongated along the second direction.

[0035] In this case, the red subpixel SPr, green subpixel SPg, and blue subpixel SPb, which are arranged adjacent to each other in the direction of the row line, can constitute a pixel P, which is the unit of color display.

[0036] Thus, in this embodiment, subpixels SPr, SPg, and SPb of different colors are arranged in a side-by-side structure along the row direction.

[0037] Each subpixel, SPr, SPg, and SPb, is equipped with an organic light-emitting element that emits the corresponding color.

[0038] As shown in Figure 2, a red organic light-emitting element is placed on the red subpixel SPr, a green organic light-emitting element is placed on the green subpixel SPg, and a blue organic light-emitting element is placed on the blue subpixel SPb. For example, the red organic light-emitting element may be referred to as the first organic light-emitting element, the green organic light-emitting element as the second organic light-emitting element, and the blue organic light-emitting element as the third organic light-emitting element, but this is not limited to these terms.

[0039] The red organic light-emitting element, the green organic light-emitting element, and the blue organic light-emitting element can each include a first electrode E1 which is a lower electrode, a second electrode E2 which is an upper electrode, and organic light-emitting layers R-EML, G-EML, and B-EML which are interposed between the first electrode E1 and the second electrode E2, respectively. That is, the red organic light-emitting element includes a red organic light-emitting layer R-EML which generates red light, the green organic light-emitting element includes a green organic light-emitting layer G-EML which generates green light, and the blue organic light-emitting element includes a blue organic light-emitting layer B-EML which generates blue light. For example, the red organic light-emitting layer R-EML may be referred to as the first organic light-emitting layer, the green organic light-emitting layer G-EML as the second organic light-emitting layer, and the blue organic light-emitting layer B-EML as the third organic light-emitting layer.

[0040] Here, the first electrode E1 is either an anode or a cathode electrode, and the second electrode E2 may be the other of the anode and cathode electrodes. In this embodiment, we take the case where the first electrode E1 is an anode electrode and the second electrode E2 is a cathode electrode as an example.

[0041] Furthermore, the red organic light-emitting element, the green organic light-emitting element, and the blue organic light-emitting element may each include a hole transport structure between the first electrode E1 and the organic light-emitting layers R-EML, G-EML, and B-EML, and an electron transport structure between the organic light-emitting layers R-EML, G-EML, and B-EML and the second electrode E2. The hole transport structure and the electron transport structure may each include multiple organic layers. Alternatively, the hole transport structure and the electron transport structure may each include multiple organic layers and at least one inorganic layer. For example, the hole transport structure may be referred to as the first transport structure, and the electron transport structure may be referred to as the second transport structure, and vice versa.

[0042] The hole transport structure may include a hole injection layer (HIL) and / or a hole transport layer (HTL), but may also include more organic layers. The hole injection layer (HIL) and / or the hole transport layer (HTL) can supply holes to the organic light-emitting layers (R-EML, G-EML, B-EML). The electron transport structure has the function of injecting electrons, and the hole transport layer (HTL) may include an electron injection layer (EIL) and / or an electron transport layer (ETL), but may also include more organic layers. The electron injection layer (EIL) and / or the electron transport layer (ETL) can supply electrons to the organic light-emitting layers (R-EML, G-EML, B-EML). The laminated structure of the organic light-emitting layers shown in Figure 2 is just one example; various deformations are possible, and such diverse deformation-possible laminated structures will be described later.

[0043] Multiple organic materials contained in the hole transport structure and / or electron transport structure may be arranged in common with each of the red subpixel SPr, green subpixel SPg, and blue subpixel SPb. Thus, the hole transport structure and / or electron transport structure can be referred to as a common layer. That is, the hole transport structure can be referred to as the first common layer, and the electron transport structure as the second common layer, and vice versa. According to the embodiment, even if the common layer is arranged in common with each of the red subpixel SPr, green subpixel SPg, and blue subpixel SPb, the common layers of each of the red subpixel SPr, green subpixel SPg, and blue subpixel SPb can have different thicknesses. This is made possible by a stripe pattern STP having at least two or more regions in which the red subpixel SPr and green subpixel SPg are defined, and by multiple evaporation sources that evaporate the red light-emitting material, green light-emitting material, and blue light-emitting material in different directions relative to the substrate 100. Although not shown in the illustration, multiple organic molecules contained within the hole transport structure and / or electron transport structure may also be arranged separately from each other in the subpixel SPr, the green subpixel SPg, and the blue subpixel SPb, respectively.

[0044] On the other hand, in the embodiment, the blue organic light-emitting layer B-EML is placed not only on the blue subpixel SPb but also on the red subpixel SPr and the green subpixel SPr. That is, the blue organic light-emitting layer B-EML may be placed in common on the red subpixel SPr, the green subpixel SPr and the blue subpixel SPb. In such a case, the red organic light-emitting layer R-EML and the green organic light-emitting layer G-EML are placed on top of the blue organic light-emitting layer B-EML. In this case, holes from the hole transport structure are supplied to the red organic light-emitting layer R-EML and the green organic light-emitting layer G-EML via the blue organic light-emitting layer B-EML. Furthermore, electrons from the electron transport structure are supplied to the red organic light-emitting layer R-EML and the green organic light-emitting layer G-EML. As a result, light is generated in the red organic light-emitting layer R-EML and the green organic light-emitting layer G-EML as the light-emitting material is excited by the energy from the bonding of holes and electrons, and then returns to the ground state.

[0045] On the other hand, a capping layer (CPL) can be positioned on top of the second electrode E2.

[0046] On the other hand, in this embodiment, at least two or more inclined surfaces SS1 and SS2 of the stripe pattern STP are provided with a separation interval between adjacent stripe pattern STPs. Furthermore, an evaporation source is positioned opposite the inclined surfaces SS1 and SS2 and the separation interval to evaporate the luminescent material. Thus, the luminescent material evaporated by the evaporation source is directly deposited onto at least two or more inclined surfaces SS1 and SS2 and the separation interval. As a result, a red organic light-emitting element is formed as a red subpixel SPr on the first inclined surface SS1, a green organic light-emitting element is formed as a green subpixel SPg on the second inclined surface SS2, and a blue organic light-emitting element is formed as a blue subpixel SPb on the separation interval. This significantly reduces costs and dramatically simplifies the manufacturing process by eliminating the need for FMMs or drastically reducing the number of FMMs used.

[0047] This will be explained in more detail with reference to Figure 3. Figure 3 is a schematic cross-sectional view illustrating the stripe pattern and light-emitting layer according to the first embodiment. In Figure 3, for the sake of explanation, only the stripe pattern and light-emitting layer are shown, and other components are omitted.

[0048] Referring to Figures 1 to 3, multiple stripe patterns STPs extending in the column direction are formed on the substrate 100 of the organic light-emitting display device 10.

[0049] In this case, along the row direction, the stripe pattern STP is repeatedly arranged for each pixel P, that is, it is arranged periodically on a pixel-P basis.

[0050] Such a stripe pattern STP is formed in correspondence with column line regions where two adjacent subpixels SP, for example, a red subpixel SPr and a green subpixel SPg, are formed. That is, the red subpixel SPr and the green subpixel SPg can be located in the corresponding first and second regions of the stripe pattern STP, respectively. Each of the subpixels SPr and green subpixel SPg can be located along the length of the stripe pattern STP. In the separation region between two adjacent stripe pattern STPs, i.e., the third region, a blue subpixel SPb can be located. The blue subpixel SPb can be located along the length of the stripe pattern STP.

[0051] The stripe pattern STP is formed in a tapered shape, narrowing in width towards the top of the substrate 100 (i.e., away from the substrate 100), and the sides on both sides in the width direction may consist of inclined surfaces. In this embodiment, for the sake of explanation, the inclined surface located on the left side of the drawing is referred to as the first inclined surface SS1, and the inclined surface located on the right side is referred to as the second inclined surface SS2. For example, the first inclined surface SS1 may be referred to as the first region, and the second inclined surface SS2 may be referred to as the second region, but this is not limited to this.

[0052] As will be explained later, the stripe pattern STP is formed such that its width is constant along the upper direction of the substrate 100. That is, the stripe pattern STP may have a first inclined surface SS1 and a second inclined surface SS2, which are perpendicular to the plane (or ground), respectively.

[0053] On the other hand, the stripe pattern STP is configured to have an upper surface (or apex surface) TM connecting the upper ends of the first inclined surface SS1 and the second inclined surface SS2. This upper surface TM may be configured in a substantially flat planar form, but is not limited to this, and may also have a curved form.

[0054] The red subpixel SPr and green subpixel SPg of pixel P can be positioned corresponding to the first and second inclined surfaces SS1 and SS2, respectively. The blue subpixel SPb can be positioned corresponding to the separation region between adjacent stripe patterns STP.

[0055] On the other hand, in the organic light-emitting device 10 of this embodiment, the blue light-emitting layer B-EML is formed not only on the corresponding blue subpixel SPb but also on the red subpixel SPr and the green subpixel SPg. That is, the blue light-emitting layer B-EML is formed commonly on the entire area of ​​the substrate 100, i.e., on all subpixels SP, i.e., on the red subpixel SPr, the green subpixel SPg and the blue subpixel SPb. Such a structure is called a blue common structure.

[0056] In such a blue common structure, the blue light-emitting layer B-EML can cover the stripe pattern STP and also cover the separation region of the substrate 100 between adjacent stripe patterns STP.

[0057] In this blue common structure, the blue light-emitting layer B-EML located within the blue subpixel SPb will function to generate blue light. The blue light-emitting layers B-EML located within the red subpixel SPr and the green subpixel SPg, i.e., the blue light-emitting layers B-EML located on the first and second inclined surfaces SS1 and SS2, can function as charge transport layers (e.g., hole transport layers).

[0058] Thus, in this embodiment, there is no need to use a separate deposition pattern mask such as FMM during deposition for the blue light-emitting layer B-EML.

[0059] The red light-emitting layer R-EML is deposited on the corresponding first inclined surface SS1, and the green light-emitting layer G-EML is deposited on the corresponding second inclined surface SS2. More specifically, the red light-emitting layer R-EML is deposited on the portion of the blue light-emitting layer B-EML located on the corresponding first inclined surface SS1, and the green light-emitting layer G-EML is deposited on the portion of the blue light-emitting layer B-EML located on the corresponding second inclined surface SS2.

[0060] In contrast, this embodiment is provided with a slanted stripe pattern STP. Due to the shadow effect of the stripe pattern STP, the red light-emitting material is selectively deposited on the corresponding first slanted surface SS1 to form a red light-emitting layer R-EML in a patterned form, and the green light-emitting material is selectively deposited on the corresponding second slanted surface SS2 to form a green light-emitting layer G-EML in a patterned form.

[0061] In this way, by utilizing the stripe pattern STP, the red emissive layer (R-EML) and the green emissive layer (G-EML) are formed in a patterned form in the desired region using a self-aligning (or self-matching) deposition method.

[0062] This eliminates the need to use a separate deposition pattern mask, such as FMM, during deposition for the red emissive layer (R-EML) and the green emissive layer (G-EML).

[0063] The deposition methods for the red, green, and blue light-emitting layers according to the first embodiment will be described below with reference to Figures 4 to 6.

[0064] In Figures 4 to 6, for the sake of explanation, an example is shown in which a substrate 100 on which a stripe pattern STP is formed is moved to the right in the drawing while the light-emitting material is deposited.

[0065] The substrate 100 is positioned so that the stripe pattern STP faces downwards, and evaporation sources 410-430 can be located below the substrate 100, separated from it by a certain distance, to evaporate the light-emitting material deposited on the substrate 100.

[0066] Referring to Figure 4 regarding the deposition of the blue light-emitting layer B-EML, within the deposition chamber for the blue light-emitting layer B-EML, the substrate 100 on which the stripe pattern STP is formed moves in the row direction (or X direction) perpendicular to the column direction (or Y direction) in which the stripe pattern STP extends, and the blue light-emitting material is deposited on the substrate 100 while the substrate 100 is moving.

[0067] In contrast, a first nozzle 415 for discharging the evaporated light-emitting material is located on the upper surface of the first evaporation source 410 of the blue light-emitting material, and this first nozzle 415 extends in the direction normal to the plane of the substrate 100 (or the Z direction), that is, in a direction perpendicular to the plane of the substrate 100.

[0068] On the other hand, a first angle limiting plate 416 is provided to limit the deposition angle and / or deposition range, but the first angle limiting plate 416 is provided above the first nozzle 415 and defines an opening 417 having a width wider than the first nozzle 415 (or first evaporation source 410). In contrast, for example, the first angle limiting plate 416 can be arranged on both sides of the first nozzle 415 in a vertical direction, and the upper end of the first angle limiting plate 416 can be positioned higher than the first nozzle 415. In order to improve the material utilization efficiency of the light-emitting material, the deposition apparatus can be configured in a way that reduces the distance between the substrate 100 and the first nozzle 415 and increases the distance from the first nozzle 415 to the first angle limiting plate 416 (i.e., offset value).

[0069] The distance between the substrate 100 and the first nozzle 415 is fixed, and the blue light-emitting material is ejected from the top of the first evaporation source 410 with its hemispherical size adjusted according to the offset value of the first angle limiting plate 416, and the blue light-emitting material is continuously deposited over the entire surface of the substrate 100 according to the appropriate offset value. Here, the red and green subpixels SPr and SPg are located corresponding to the inclined surface of the stripe pattern STP, and the blue subpixel SPb is located corresponding to the plane of the substrate 100. As a result, the subpixels of different colors can have different thicknesses in the blue light-emitting layer B-EML.

[0070] On the other hand, while the blue light-emitting layer (B-EML) is formed with the same thickness for subpixels of the same color, for example, a blue light-emitting layer of the same thickness is formed for red subpixels (SPr), green subpixels (SPg), and blue subpixels (SPb).

[0071] Referring to Figure 5 regarding the deposition of the red light-emitting layer R-EML, the substrate 100 on which the blue light-emitting layer B-EML is formed moves in the row direction within the deposition chamber for the red light-emitting layer R-EML, and the red light-emitting material is deposited on the substrate 100 while the substrate 100 is moving.

[0072] In contrast, a second nozzle 425 for discharging evaporated light-emitting material is located on the upper surface of the second evaporation source 420 for the red light-emitting material, and this second nozzle 425 extends in a direction inclined with respect to the direction perpendicular to the plane of the substrate 100. That is, the second nozzle 425 is configured to be inclined so as to view the first inclined surface SS1 of the stripe pattern STP, which corresponds to the deposition surface of the red light-emitting material. At this time, the deposition angle can be set to one optimized for the pre-deposited substrate structure with respect to the second angle limiting plate 426 so as not to deposit the red light-emitting layer R-EML in the region between adjacent stripe pattern STP (or the blue subpixel SPb). Here, the second angle limiting plate 426 is positioned above the second evaporation source 420 so as to block it. For example, the second angle limiting plate 426 may include a horizontal portion 426a that covers the second evaporation source 420 and an extended vertical portion 426b that is positioned in the opposite direction to the inclination direction of the second nozzle 425 (i.e., to the right in the drawing) (i.e., to the left in the drawing) and bent from the horizontal portion 426a in the following direction.

[0073] Thus, the second nozzle 425 is configured to tilt forward in order to view the first inclined surface SS1, which is a rearward inclined surface, with respect to the substrate movement direction.

[0074] In this case, when viewing the substrate 100 from the second nozzle 425, the separation region between the second inclined surface SS2 and the stripe pattern STP corresponds to the shadow region, and the first inclined surface SS1 corresponds to the visible region.

[0075] This allows the red light-emitting material to be ejected from the second nozzle 425 and incident substantially perpendicularly onto the first inclined surface SS1.

[0076] Therefore, the red light-emitting material is substantially deposited on the first inclined surface SS1, and a red light-emitting layer R-EML is formed on the red subpixel SPr.

[0077] Referring to Figure 6 regarding the deposition of the green light-emitting layer G-EML, the substrate 100 on which the red light-emitting layer R-EML is formed moves in the row direction within the deposition chamber for the green light-emitting layer G-EML, and the green light-emitting material is deposited on the substrate 100 while the substrate 100 is moving.

[0078] In contrast, a third nozzle 435 for discharging the evaporated light-emitting material is located on the upper surface of the third evaporation source 430 of the green light-emitting material, and this third nozzle 435 extends in a direction inclined with respect to the direction perpendicular to the plane of the substrate 100. That is, the third nozzle 435 is configured to be inclined so as to view the second inclined surface SS2 of the stripe pattern STP, which corresponds to the deposition surface of the green light-emitting material.

[0079] Here, the third angle limiting plate 436 is positioned above the third evaporation source 430 so as to obstruct it. For example, the third angle limiting plate 436 may include a horizontal portion 436a that covers the third evaporation source 430 and an extended vertical portion 436b that is positioned in the opposite direction to the inclination direction of the third nozzle 435 (i.e., the left direction in the drawing) (i.e., the right direction in the drawing) and bent from the horizontal portion 436a in the following direction.

[0080] Thus, the third nozzle 435 is configured to tilt backward in order to view the second inclined surface SS2, which is a forward inclined surface, with respect to the substrate movement direction. In other words, the third nozzle 435 is configured to tilt in the opposite direction to the second nozzle 425.

[0081] In this case, when viewing the substrate 100 from the third nozzle 435, the separation region between the first inclined surface SS1 and the stripe pattern STP corresponds to the shadow region, and the second inclined surface SS2 corresponds to the visible region.

[0082] This allows the green light-emitting material to be ejected from the third nozzle 435 and incident substantially perpendicularly onto the second inclined surface SS2.

[0083] Therefore, the green light-emitting material is substantially deposited on the second inclined surface SS2, and the green light-emitting layer G-EML is formed on the green subpixel SPg.

[0084] On the other hand, although the above example describes the case where a red light-emitting layer (R-EML) is formed first, followed by a green light-emitting layer (G-EML), the deposition process may be carried out in the reverse order.

[0085] On the other hand, regarding the formation of the blue light-emitting layer (B-EML), the thickness of the blue light-emitting layer (B-EML) formed on the red and green subpixels SPr and SPg is made thinner than the thickness of the blue light-emitting layer (B-EML) formed on the blue subpixel SPb. Furthermore, by minimizing the influence on the thickness of the blue light-emitting layer (B-EML) due to deposition shadows caused by the first inclined surface SS1 and the second inclined surface SS2 of the red and green subpixels SPr and SPg, it is possible to ensure that the thickness of the blue light-emitting layer (B-EML) of the blue subpixel SPb remains constant within the substrate.

[0086] In this regard, please refer to Figure 7, where a fourth angle limiting plate 418 is placed between the first evaporation source 410 of the blue light-emitting material and the substrate 100, defining an opening 417 of a certain width. For example, the opening 417 can have a width wider than the first evaporation source 410 (or first nozzle 415).

[0087] In this case, the upper end of the fourth angle limiting plate 418 is positioned higher than that of the first angle limiting plate 416 mentioned above, resulting in a narrower deposition angle compared to when using the first angle limiting plate 416.

[0088] Using such a fourth angle limiting plate 418 narrows the incident angle of the blue light-emitting material on the substrate 100 to a near-perpendicular position.

[0089] This reduces the thickness of the blue emissive layer (B-EML) deposited on the first and second inclined surfaces SS1 and SS2 of the red and green subpixels SPr and SPg. For example, the thickness of the blue emissive layer (B-EML) of the red and green subpixels SPr and SPg can be approximately 80% or less of the thickness of the blue emissive layer (B-EML) of the blue subpixel SPb.

[0090] By reducing the thickness of the blue light-emitting layer (B-EML) in this way, the influence of the blue dopant on the organic light-emitting elements of the red and green subpixels (SPr and SPg) can be minimized, thereby improving color perception and device efficiency.

[0091] The first evaporation source 410 can be applied not only to the blue light-emitting layer (B-EML) but also to all common layers (e.g., hole injection layer (HIL), hole transport layer (HTL), electron injection layer (EIL), electron transport layer (ETL), capping layer (CPL), etc.). In this case, the thickness of the common layer deposited for each subpixel (SP) can be optimized by designing an appropriate offset value for the angle limiting plate relative to the common layer. Therefore, if differentiation of the common layer for each subpixel is required depending on the product, such as to improve optical properties, various combinations of evaporation source and angle limiting plate structures are possible.

[0092] On the other hand, to improve or adjust the uniformity of the common layer thickness, methods can be used to optimize the structure of the evaporation source as shown in Figures 4 and 7, or to change the movement of the substrate in the deposition apparatus in a different manner.

[0093] In this regard, for example, when depositing a common layer including a blue light-emitting layer B-EML, the movement direction of the substrate 100 can be set to the column direction (second direction) where the stripe pattern STP is extended, and when depositing a red light-emitting layer R-EML and a green light-emitting layer G-EML, the movement direction of the substrate 100 can be set to the row direction perpendicular to the column direction. In this case, the influence of the shadow effect by the stripe pattern STP on the deposition uniformity of the common layer can be minimized, and the design freedom for the angle limiting plate of the evaporation source can be increased, thereby improving material utilization efficiency. In this case, a chamber for substrate rotation may be added to the deposition apparatus.

[0094] Referring to Figure 8, the design structure of the stripe pattern STP and the design structure of the deposition apparatus will be explained in more detail. For the sake of explanation, Figure 8 uses the deposition of the green light-emitting layer G-EML as an example, and the blue light-emitting layer B-EML and the first electrode E1 formed below it are not shown. Figure 8(B) shows an enlarged view of a part of the substrate in Figure 8(A).

[0095] In the deposition of luminescent material onto an inclined surface, the main factors for designing the stripe pattern STP are set to height H, first width W1, and second width W2. Height H may be the height of the stripe pattern STP. First width W1 may be the width projected perpendicularly to the first inclined surface SS1 of the stripe pattern STP. Second width W2 may be the width of the separation region between adjacent stripe patterns STP.

[0096] The deposition angle θe (or maximum deposition angle) required to deposit the green light-emitting material onto the second inclined surface SS2 due to the shadow effect can be expressed by the following equation 1.

[0097] Formula 1: tanθe = H / (W1 + W2)

[0098] In this regard, when the plane of the substrate 100 is used as a reference, a virtual line can be drawn connecting the lower end of the effective light-emitting region of the green subpixel SPg to one end of the upper surface TM of the stripe pattern STP located in front of it, and this virtual line can be said to substantially correspond to the deposition angle θe in equation 1.

[0099] On the other hand, the configuration of the deposition apparatus for inclined surface deposition as described above is arranged to satisfy the deposition angle θe.

[0100] In contrast, within the green light-emitting layer deposition chamber, a third angle limiting plate 436 is placed between the third evaporation source 430 of the green light-emitting material and the substrate 100.

[0101] This third angle limiting plate 436 has a width substantially wider than the third evaporation source 430 and is configured to completely block the third evaporation source 430.

[0102] On the other hand, the third nozzle 435 of the third evaporation source 430 is configured to tilt backward so that it can view the second inclined surface SS2.

[0103] At this time, the third evaporation source 430 and the third angle limiting plate 436 are arranged such that the virtual line connecting the third nozzle 435 and the rear end of the third angle limiting plate 436 (i.e., one end in the deposition direction) becomes the deposition angle θe, and this can be expressed by the following equation 2.

[0104] Formula 2: tanθe = TS / Loffset.

[0105] Here, TS is the vertical distance between the substrate 100 and the third evaporation source 430 (more specifically, the third nozzle 435), and Loffset is the shortest horizontal distance from the third evaporation source 430 to a point on the substrate 100 where the light-emitting material can be deposited.

[0106] It is preferable to design the stripe pattern STP and deposition apparatus so that equations 1 and 2 described above are satisfied.

[0107] The structure of the organic light-emitting display device of this embodiment will be described in more detail with reference to Figure 9.

[0108] Referring to Figure 9, in the organic light-emitting display device 10 of this embodiment, a drive circuit DC is formed on the substrate 100 for each subpixel SP that drives it. The drive circuit DC may include a plurality of transistors, including a drive transistor, and at least one capacitor, etc.

[0109] A planarization layer 110 made of an insulating material is formed on the drive circuit DC. A contact hole 111 is formed in this planarization layer 110 to expose one electrode of the drive circuit DC. Here, the one electrode of the drive circuit DC may be the drain electrode of any one transistor included in the drive circuit DC.

[0110] On the planarization layer 110, an auxiliary electrode (or connecting electrode) E11 is formed, patterned for each subpixel SP. The auxiliary electrode E11 can be considered as one electrode layer constituting the first electrode E1, and this auxiliary electrode E11 can contact one electrode of the drive circuit DC through the contact hole 111 of the corresponding subpixel SP. The auxiliary electrode E11 and the first electrode E1 may, but are not limited to, contain different metals. The auxiliary electrode E11 and / or the first electrode E1 may be a single layer or may contain multiple metal layers.

[0111] In contrast to this, the first auxiliary electrode E11 may be referred to as the first anode electrode, and the first electrode E1 may be referred to as the second anode electrode, and the first electrode may be composed of the first anode electrode and the second anode electrode.

[0112] A stripe pattern STP is formed on the auxiliary electrode E11 of the red subpixel SPr and the green subpixel SPg.

[0113] The stripe pattern STP can be positioned to correspond to the regions where the red subpixel SPr and green subpixel SPg are formed.

[0114] In this case, one end of the auxiliary electrode E11 of the red subpixel SPr is located outside the first inclined surface SS1 of the stripe pattern STP and can be exposed without being covered by the stripe pattern STP.

[0115] The other end of the auxiliary electrode E11 of the green subpixel SPg is located outside the second inclined surface SS2 of the stripe pattern STP and can be exposed without being covered by the stripe pattern STP.

[0116] On the other hand, the auxiliary electrode E11 of the blue subpixel SPb is located between adjacent stripe patterns STP and can be exposed without being covered by the stripe patterns STP.

[0117] Stripe pattern STP can be made of an organic insulating material and can be formed by printing or photolithography. Polyimide-based or acrylic resins can be used as the organic insulating material, but are not limited to these.

[0118] After forming the stripe pattern STP, a first electrode E1 is formed, patterned for each subpixel SP. The first electrode E1 contacts an auxiliary electrode E11 located below it and is connected to the drive circuit DC.

[0119] In this regard, the first electrode E1 of the red subpixel SPr is formed along the first inclined surface SS1 of the stripe pattern STP, and its lower end can contact one end of the auxiliary electrode E11.

[0120] The first electrode E1 of the green subpixel SPg is formed along the second inclined surface SS2 of the stripe pattern STP, and its lower end can contact the other end of the auxiliary electrode E11.

[0121] On the other hand, the first electrode E1 of the blue subpixel SPb is located between adjacent stripe patterns STP and can make overall contact with the auxiliary electrode E11 below it.

[0122] After forming the first electrode E1, a common layer consisting of a hole injection layer (HIL) and a hole transport layer (HTL) can be formed on the substrate 100 in that order, and another common layer, the blue light-emitting layer (B-EML), can be deposited on top of the hole transport layer (HTL).

[0123] The blue light-emitting layer B-EML is formed in common on all subpixels SPr, SPg, and SPb, specifically on the first inclined surface SS1 and the second inclined surface SS2 of the stripe pattern STP, and in the separation region between adjacent stripe patterns STP.

[0124] After forming the blue light-emitting layer B-EML, the red light-emitting layer R-EML is deposited on the blue light-emitting layer B-EML located on the corresponding first inclined surface SS1, and the green light-emitting layer G-EML is deposited on the blue light-emitting layer B-EML located on the corresponding second inclined surface SS2.

[0125] After forming the red light-emitting layer (R-EML) and the green light-emitting layer (G-EML), an electron transport layer (ETL) and an electron injection layer (EIL) are formed as common layers on the upper part of the substrate 100, allowing the second electrode E2 to be formed on the substrate 100. The second electrode E2 is formed commonly across the entire substrate 100.

[0126] As described above, a red organic light-emitting element is placed on the first inclined surface SS1 of the stripe pattern STP, a green organic light-emitting element is placed on the second inclined surface SS2 of the stripe pattern STP, and a blue organic light-emitting element is placed on the separation region between adjacent stripe patterns STP. The first inclined surface SS1 and the second inclined surface SS2 may have inclined surfaces that are inclined with respect to the separation region. In this case, the first inclination angle of the first inclined surface SS1 and the second inclination angle of the second inclined surface SS2 may be the same or different.

[0127] Therefore, the light emission direction differs for each of the red, green, and blue organic light-emitting elements. For example, red light is emitted from the top surface of the red organic light-emitting element towards the 10 o'clock position. For example, green light is emitted from the top surface of the green organic light-emitting element towards the 2 o'clock position. For example, blue light is emitted from the top surface of the blue organic light-emitting element towards the 12 o'clock position.

[0128] On the other hand, when the organic light-emitting display device 10 configured as described above is an upper light-emitting type, the lower electrode, including the auxiliary electrode E11 and the first electrode E1, has reflective properties, and the upper electrode, the second electrode E2, can have transmission or semi-transmission properties. In this regard, for example, the auxiliary electrode E11 can be made of ITO, Ti, or Mo, and the first electrode E1 can be made of ITO / (Ag or Ag alloy) / ITO to have high reflectivity. On the other hand, the second electrode E2 can be made of ITO or Mg-Ag. Figure 10 can be used to show the light path in this case, but Figure 10 shows the light emission path of the red subpixel SPr as an example.

[0129] As another example, the auxiliary electrode E11 can consist of a single-layer structure of Ag, Ag alloy, or Al, or a multilayer structure containing Ag or Ag alloy (e.g., ITO / (Ag or Ag alloy) / ITO, ITO / (Ag or Ag alloy) / Ti, or ITO / (Ag or Ag alloy) / Mo) to have high reflectivity characteristics. Furthermore, the first electrode E1 can be a single layer of ITO, and the second electrode E2 can consist of ITO or Mg-Ag. Figure 11 can be used to illustrate the optical path in this case, illustrating the light emission path of the red subpixel SPr as an example.

[0130] When the organic light-emitting display device 10 configured as described above is a bottom-emitting type, the auxiliary electrode E11 and the first electrode E1 constituting the bottom electrode can both have transmission properties, and the second electrode E2 can have reflection properties. In this regard, for example, the second electrode E2 can be made of Al. Figure 12 can be used to show the light path in this case, but Figure 12 shows the light emission path of the red subpixel SPr as an example.

[0131] On the other hand, the stripe pattern STP of this embodiment can have a variety of shapes, which can be seen in Figures 13 to 17.

[0132] As shown in Figures 13(a) to 13(c), the stripe pattern STP can have at least two or more surfaces.

[0133] As an example, a stripe pattern STP can have a symmetrical polygonal shape (Figure 13(a)). Stripe patterns STP having such a symmetrical polygonal shape have already been described. For example, a stripe pattern STP can have a first inclined surface SS1, a second inclined surface SS2, and a top surface TM. In such a case, the first inclined surface SS1 and the second inclined surface SS2 can be symmetrical with respect to a vertical line. For example, the interior angle of the first inclined surface SS1 with respect to the plane (or ground) and the interior angle of the second inclined surface SS2 with respect to the plane may be the same. Here, the interior angle can be called the inclination angle. In this case, the interior angle may be acute. The lengths of the first inclined surface SS1 and the second inclined surface SS2 may be greater than the length of the top surface TM. The areas of the first inclined surface SS1 and the second inclined surface SS2 may be greater than the area of ​​the top surface TM.

[0134] On the other hand, a red light-emitting layer R-EML is placed on the first inclined surface SS1, and a green light-emitting layer G-EML is placed on the second inclined surface SS2. As the area of ​​the red light-emitting layer R-EML and the green light-emitting layer G-EML increases, the amount of light increases, so the area of ​​the top surface TM can be minimal or zero, and the areas of the first inclined surface SS1 and the second inclined surface SS2 can be maximum. Here, the area of ​​the top surface TM is controlled by using a patterning method that matches the resolution of the product, so that the height and inclination angle of the stripe pattern STP are the same or similar on each subpixel SPr, SPg, and SPb of each of the multiple pixels P on the substrate 100. For example, when patterning using a photolithography method, process control is not possible unless the area is above a certain level.

[0135] As another example, the stripe pattern STP can have an asymmetrical polygonal shape (Figure 13(b)).

[0136] For example, the stripe pattern STP may have a first inclined surface SS1, a second inclined surface SS2, and a top surface TM. In such a case, the first inclined surface SS1 and the second inclined surface SS2 may be asymmetrical with respect to a vertical line. For example, the interior angle of the first inclined surface SS1 with respect to the plane and the interior angle of the second inclined surface SS2 with respect to the plane may be different. Here, the interior angle can be called the inclination angle. In this case, the interior angle may be acute. The lengths of the first inclined surface SS1 and the second inclined surface SS2 may be greater than the length of the top surface TM. The length of the first inclined surface SS1 may be greater than the length of the second inclined surface SS2. The area of ​​the first inclined surface SS1 may be greater than the area of ​​the second inclined surface SS2. Although not shown, the length of the second inclined surface SS2 may be greater than the length of the first inclined surface SS1. The area of ​​the second inclined surface SS2 may be greater than the area of ​​the first inclined surface SS1.

[0137] On the other hand, a red light-emitting layer R-EML is placed on the first inclined surface SS1, and a green light-emitting layer G-EML is placed on the second inclined surface SS2.

[0138] Since the red light-emitting layer (R-EML), green light-emitting layer (G-EML), and blue light-emitting layer (B-EML) have different lifespans, it is preferable to design the areas of each subpixel to be different. Accordingly, according to the embodiment, the interior angles (60 to 95 degrees) and the width of the bottom surface (W2 in Figure 8(B)) of the first inclined surface SS1 and the second inclined surface SS2 are optimized as design variables. That is, since the lifespan of the product is determined by the subpixel with the shortest lifespan, the overall lifespan of the product can be improved by optimizing the area ratio between the R, G, and B subpixels SPr, SPg, and SPb. If the product lifespan is sufficiently satisfied, the brightness of the product can be improved. Also, if there is a design margin in brightness, power consumption is reduced. Furthermore, in order to increase productivity and yield, a sufficient process margin must be ensured. The design margin is optimized in terms of the inclination angle, the distance between anodes, etc., so that a sufficient process margin is ensured.

[0139] However, according to the embodiment, the area of ​​the inclined surface on which a relatively low-brightness light-emitting layer is placed is made larger, and the area of ​​the inclined surface on which a relatively high-brightness light-emitting layer is placed is made smaller. For example, when the brightness of the red light-emitting layer R-EML is low, as shown in Figure 13(b), the area of ​​the first inclined surface SS1 is made larger than the area of ​​the second inclined surface SS2, and the competitiveness of the product in terms of brightness, power consumption, etc. can be ensured by optimizing the lifetime between pixels. Conversely, when the brightness of the green light-emitting layer G-EML is low, although not shown, the competitiveness of the product in terms of brightness, power consumption, etc. can be ensured by optimizing the lifetime between pixels by making the area of ​​the second inclined surface SS2 larger than the area of ​​the first inclined surface SS1.

[0140] In this way, by making the inclined surfaces SS1 and SS2 on both sides different, it is possible to compensate for the difference in efficiency and lifetime between the red organic light-emitting element and the green organic light-emitting element.

[0141] As yet another example, the stripe pattern STP can have a rectangular shape (Figure 13(c)).

[0142] For example, a stripe pattern STP may have a first inclined surface SS1, a second inclined surface SS2, and a top surface TM. In such a case, the first inclined surface SS1 and / or the second inclined surface SS2 may be perpendicular to the horizontal line. That is, the first inclined surface SS1 may be perpendicular to the horizontal line. The second inclined surface SS2 may be perpendicular to the horizontal line. For example, the interior angle of the first inclined surface SS1 with respect to the plane and the interior angle of the second inclined surface SS2 with respect to the plane may be the same or different. The interior angle of the first inclined surface SS1 with respect to the plane and the interior angle of the second inclined surface SS2 with respect to the plane may both be perpendicular. The interior angle of the first inclined surface SS1 with respect to the plane may be perpendicular, and the interior angle of the second inclined surface SS2 with respect to the plane may be less than 90 degrees. The interior angle of the second inclined surface SS2 with respect to the plane may be perpendicular, and the interior angle with respect to the first inclined surface SS1 may be less than 90 degrees.

[0143] The lengths of the first inclined surface SS1 and the second inclined surface SS2 may be the same as or different from the length of the top surface TM. The lengths of the first inclined surface SS1 and the second inclined surface SS2 may be the same as or greater than the length of the top surface TM. The areas of the first inclined surface SS1, the second inclined surface SS2, and the top surface TM may be the same as or different from the area of ​​the first inclined surface SS1 and the second inclined surface SS2. The lengths of the first inclined surface SS1 and the second inclined surface SS2 may be the same as or greater than the area of ​​the top surface TM.

[0144] In Figure 13(c), the stripe pattern STP may have a first inclined surface SS1 and / or a second inclined surface SS2 perpendicular to the ground. The stripe pattern STP may also have a top surface. Although not shown, the interior angles of the first inclined surface SS1 and / or the second inclined surface SS2 relative to the ground may be obtuse angles, i.e., angles of 90 degrees or more. When the interior angles of the first inclined surface SS1 and / or the second inclined surface SS2 relative to the ground are obtuse angles, the stripe pattern STP may have an inverse tapered shape.

[0145] In the embodiment, the interior angles of the first inclined surface SS1 and / or the second inclined surface SS2 of the stripe pattern STP can be between 60 and 95 degrees, but are not limited to this range.

[0146] A red light-emitting layer R-EML is placed on the first inclined surface SS1, and a green light-emitting layer G-EML is placed on the second inclined surface SS2. In this case, the narrower the gap between the red light-emitting layer R-EML and the green light-emitting layer G-EML, the more advantageous it is for miniaturization and high PPI (Passive Per Intake) on the side surface. Therefore, it is preferable to minimize the length and area of ​​the top surface TM.

[0147] Referring to Figure 14, the stripe pattern STP is configured to have an outwardly bulging inclined surface as a curved surface.

[0148] Referring to Figure 15, the stripe pattern STP is configured to have an inclined surface that is recessed inward as a curved surface.

[0149] Referring to Figure 16, the stripe pattern STP is configured to have an inclined surface with a curved shape, which includes protruding and recessed portions.

[0150] Referring to Figure 17, the stripe pattern STP can have a polygonal shape. The stripe pattern STP can have a first inclined surface SS1, a second inclined surface SS2, and a top surface TM. In the drawing, the first inclined surface SS1 and the second inclined surface SS2 are shown to be symmetrical with respect to a vertical line, but they may be asymmetrical.

[0151] For example, the first inclined surface SS1 may have a plurality of first sub-inclined surfaces 311, 312. The interior angles between the plurality of first sub-inclined surfaces 311, 312 may be the same or different from each other. For example, the second inclined surface SS2 may have a plurality of second sub-inclined surfaces 321, 322.

[0152] The interior angles between the multiple second sub-inclined surfaces 321 and 322 may be the same or different. For example, a red light-emitting layer R-EML is placed on multiple first sub-inclined surfaces 311 and 312. For example, a green light-emitting layer G-EML is placed on multiple second sub-inclined surfaces 321 and 322. In such a case, red light is emitted in different directions by the red light-emitting layer R-EML placed on multiple first sub-inclined surfaces 311 and 312 having different interior angles. Similarly, green light is emitted in different directions by the green light-emitting layer G-EML placed on multiple second sub-inclined surfaces 321 and 322 having different interior angles. This results in emission at a larger radiation angle than the red light R-EML and green light G-EML, displaying high-brightness and high-definition images. For example, it has the advantage of more effectively realizing high-definition display devices of 2000 PPI or more.

[0153] As described above, the stripe pattern STP of this embodiment is based on a tapered shape in which the width gradually decreases towards the top, and the shape of its inclined surface can be varied in many ways.

[0154] The organic light-emitting element of the organic light-emitting device in this embodiment can be manufactured using an in-line deposition apparatus, which will be described in more detail below. In contrast, the embodiment can also be adopted as a cluster system if the structure and design of each chamber are changed to be similar to or identical to that of the in-line system. That is, if each chamber is modified so that the transport direction of the substrate 100 and the movement direction of the evaporation source are similar for a specific organic light-emitting layer, such as the red organic light-emitting layer R-EML or the red organic light-emitting layer G-EML, the in-line deposition apparatus can be similarly applied to the cluster system. Figure 18 is a diagram illustrating the stacked structure of each organic light-emitting element according to the first embodiment, and Figure 19 is a schematic diagram illustrating an in-line deposition apparatus for forming the stacked organic light-emitting element of the stacked structure of Figure 18.

[0155] In the organic light-emitting element structures shown in Figures 1 and 18, the red, green, and blue subpixels SPr, SPg, and SPb each have a blue light-emitting layer B-EML, a hole injection layer and / or hole transport layers HIL and HTL below the blue light-emitting layer B-EML, and an electron transport layer ETL and / or electron injection layer EIL above the blue light-emitting layer B-EML, respectively, and a capping layer CPL is commonly formed on the second electrode E2. The arrangement order of the hole injection layer HIL and the hole transport layer HTL can also be changed. The arrangement order of the electron transport layer ETL and the electron injection layer EIL can also be changed. As mentioned above, the hole injection layer and / or hole transport layers HIL and HTL are included in the hole transport structure, the electron transport layer ETL and the electron injection layer EIL are included in the electron transport structure, and the hole transport structure and the electron transport structure may each contain more organic layers.

[0156] On the other hand, in the red subpixel SPr, a red emissive layer R-EML is formed on top of the blue emissive layer B-EML, and in the green subpixel SPg, a green emissive layer G-EML is formed on top of the blue emissive layer B-EML.

[0157] To realize such a layered structure, an in-line deposition apparatus as shown in Figure 19 can be used. In this in-line deposition apparatus, for example, the first to seventh deposition chambers CH1 to CH7 are sequentially arranged along the direction in which the substrate 100 moves, as multiple deposition chambers for depositing multiple layered films constituting the organic light-emitting element. The in-line deposition apparatus may further include a first rotating chamber CHr1 and a second rotating chamber CHr2 for rotating the substrate.

[0158] On the other hand, although not specifically shown in the diagram, at least one of the first to seventh deposition chambers CH1 to CH7 and the first and second rotation chambers CHr1 and CHr2 may have a chamber with a function different from deposition or rotation located at its front and / or rear end. Also, the direction of the stripe pattern STP changes depending on the arrangement (Layout) of the panel and multiple organic light-emitting elements within the substrate 100. Therefore, the design allows for the substrate 100 to be loaded in two or more directions at the substrate loading stage.

[0159] In the first deposition chamber CH1, the hole injection layer and / or hole transport layer HIL, HTL are deposited uniformly on the substrate 100 on which the stripe pattern STP and the first electrode E1 are formed. At this time, in order to deposit the hole injection layer and / or hole transport layer HIL, HTL on the substrate 100 with a uniform thickness, a plurality of first evaporation sources 410, each having a first nozzle 415, are arranged in the first deposition chamber CH1.

[0160] As another example, in order to create a difference in the thickness of the first inclined surface SS1 and / or the second inclined surface SS2, a first evaporation source 410 having a first nozzle 415 perpendicular to the horizontal plane, a second evaporation source 420 having a second nozzle 425 inclined forward, and a third evaporation source 430 having a third nozzle 435 inclined backward are arranged in an appropriate combination.

[0161] On the other hand, in the first deposition chamber CH1, an evaporation source for depositing the hole injection layer (HIL) is located on the substrate loading side, and an evaporation source for depositing the hole transport layer (HTL) is located on the substrate unloading side.

[0162] In the second deposition chamber CH2, the blue light-emitting layer B-EML is deposited uniformly on the substrate 100. At this time, the second deposition chamber CH2 is equipped with multiple first evaporation sources 410, each having a vertical first nozzle 415. This ensures that the blue light-emitting layer B-EML is continuously formed with approximately uniform thickness across the blue, red, and green subpixels SPb, SPr, and SPg. Furthermore, in both the first deposition chamber CH1 and the second deposition chamber CH2, the substrate 100 is moved in the same direction as the third deposition chamber CH3 and the fourth deposition chamber CH4, in the direction perpendicular to the direction (X-axis direction) of the extended stripe pattern STP (Y-axis direction). In this case, the common layer, the hole transport layer HTL, and the blue organic light-emitting layer B-EML are deposited with different thicknesses for the red subpixel SPr, green subpixel SPg, and blue subpixel SPb. This ensures a deposition technology with increased flexibility for improving the performance of the red organic light-emitting element, the green organic light-emitting element, and the blue organic light-emitting element. This results in the realization of a new device with improved performance. In such cases, the first rotating chamber CHr1 becomes unnecessary and can be omitted.

[0163] The substrate 100, on which the blue light-emitting layer B-EML has been formed in the second deposition chamber CH2, can be placed in the first rotating chamber CHr1 and rotated.

[0164] In this regard, as mentioned above, for example, in the first and second deposition chambers CH1 and CH2, the substrate 100 is moved parallel to the direction in which the stripe pattern STP is extended during the deposition process. Before the subsequent deposition processes of the green and red light-emitting layers G-EML and R-EML, the substrate 100 can be rotated by 90 degrees, and a first rotation chamber CHr1 is provided for this substrate rotation process.

[0165] The substrate 100, rotated 90 degrees by the first rotation chamber CHr1, is placed into the third deposition chamber CH3, and the deposition process is carried out while the substrate 100 is moved parallel to the row direction perpendicular to the stripe pattern STP. In this process, the green light-emitting layer G-EML is deposited on the green subpixels SPg on the substrate 100 in the third deposition chamber CH3. At this time, the third deposition chamber CH3 is equipped with a plurality of third evaporation sources 430, each having a third nozzle 435 tilted backward.

[0166] In the fourth deposition chamber CH4, a red light-emitting layer R-EML is deposited onto the red subpixel SPr on the substrate 100. At this time, the fourth deposition chamber CH4 is equipped with a plurality of second evaporation sources 420, each having a second nozzle 425 tilted forward.

[0167] The substrate 100, on which the red light-emitting layer R-EML has been formed in the fourth deposition chamber CH4, can be placed in the second rotating chamber CHr2 and rotated.

[0168] In this regard, for example, in the third and fourth deposition chambers CH3 and CH4, the deposition process is carried out while the substrate 100 is moved along the row direction, and a process of rotating the substrate 100 by 90 degrees can be performed before the subsequent deposition process, and a second rotation chamber CHr2 is provided for this substrate rotation process.

[0169] The substrate 100, rotated by 90 degrees in the second rotating chamber CHr2, is placed in the fifth deposition chamber CH5, and the deposition process is carried out while the substrate 100 is moved parallel to the direction in which the stripe pattern STP is extended.

[0170] In this regard, in the fifth deposition chamber CH5, the electron transport layer ETL is deposited on the substrate 100 in a common manner. At this time, the fifth deposition chamber CH5 is equipped with a plurality of first evaporation sources 410, each having a first nozzle 415. As another example, a first evaporation source 410 with a first nozzle 415, a second evaporation source 420 with a second nozzle 425, and a third evaporation source 430 with a third nozzle 435 are arranged together.

[0171] In the sixth deposition chamber CH6, the electron injection layer EIL and the second electrode E2 are commonly deposited on the substrate 100. At this time, the sixth deposition chamber CH6 uses evaporation sources M1 for the inorganic material (or metal) for the electron injection layer and M2 and M3 for the inorganic material (or metal) for the second electrode to commonly deposit the electron injection layer EIL and the second electrode E2 on the substrate 100.

[0172] In the seventh deposition chamber CH7, a capping layer CPL is deposited on the substrate 100 in a common manner. At this time, the seventh deposition chamber CH7 is equipped with a plurality of first evaporation sources 410, each having a first nozzle 415. As another example, a first evaporation source 410 with a first nozzle 415, a second evaporation source 420 with a second nozzle 425, and a third evaporation source 430 with a third nozzle 435 are arranged together.

[0173] Figure 20 is a diagram illustrating the stacked structure of different organic light-emitting elements according to the second embodiment.

[0174] In the organic light-emitting element structures shown in Figures 1, 3, and 20, a p-hole transport layer p-HTL and a hole transport layer HTL are commonly deposited on a substrate 100 on which a stripe pattern STP and a first electrode E1 are formed. The p-hole transport layer p-HTL may be a hole injection layer doped with a p-type dopant. Unless otherwise specified, the p-hole transport layer p-HTL described below may refer to a hole injection layer.

[0175] The red hole transport layer (R-HTL) and the green hole transport layer (G-HTL) are individually deposited on the red subpixel (SPr) and the green subpixel (SPg), respectively.

[0176] An electron blocking layer (EBL) is commonly deposited on the substrate 100. The electron blocking layer (EBL) may be an inorganic semiconductor layer, but is not limited to this.

[0177] A blue light-emitting layer (B-EML) is commonly deposited onto the substrate 100.

[0178] The green emissive layer (G-EML) and the red emissive layer (R-EML) are individually deposited onto the green subpixel (SPg) and the red subpixel (SPr), respectively.

[0179] A hole blocking layer (HBL) is commonly deposited on the substrate 100.

[0180] The electron transport layer (ETL) is commonly deposited onto the substrate 100.

[0181] The second electrode E2 is deposited on the substrate 100 in a common manner.

[0182] A capping layer (CPL) is commonly deposited onto the substrate 100.

[0183] Although the above explanation is based on a chronological order of processes, the processes may be performed simultaneously or the order of the processes may be changed chronologically.

[0184] To form the organic light-emitting layered structure shown in Figure 21, an in-line deposition apparatus similar to the in-line deposition apparatus shown in Figure 19 can be used.

[0185] Figure 21 is a diagram illustrating the stacked structure of different organic light-emitting elements according to the third embodiment.

[0186] The stacked structures of each organic light-emitting element shown in Figures 1, 3, and 21 are so-called 2-stack structures, in which two light-emitting layers of the corresponding color are stacked on each subpixel SP.

[0187] In contrast, a p-hole transport layer p-HTL and a hole transport layer HTL1 are deposited on a substrate 100 on which a stripe pattern STP and a first electrode E1 are formed. The p-hole transport layer p-HTL may be a hole injection layer doped with a p-type dopant.

[0188] A hole control layer HCL1 is commonly deposited on the substrate 100.

[0189] A blue light-emitting layer (B-EML) is commonly deposited onto the substrate 100.

[0190] The green emissive layer (G-EML) and the red emissive layer (R-EML) are individually deposited onto the green subpixel (SPg) and the red subpixel (SPr), respectively.

[0191] The electron transport layer ETL1 is commonly deposited on the substrate 100.

[0192] An n-charge generation layer (n-CGL) is commonly deposited on the substrate 100.

[0193] A p-charge generation layer (p-CGL) is commonly deposited on the substrate 100.

[0194] Other hole transport layers (HTL2) are commonly deposited on the substrate 100.

[0195] Other hole control layers, HCL2, are commonly deposited on the substrate 100.

[0196] A blue light-emitting layer (B-EML) is commonly deposited onto the substrate 100.

[0197] The green emissive layer (G-EML) and the red emissive layer (R-EML) are individually deposited onto the green subpixel (SPg) and the red subpixel (SPr), respectively.

[0198] Other electron transport layers (ETL2) are commonly deposited on the substrate 100.

[0199] The second electrode E2 is deposited on the substrate 100 in a common manner.

[0200] A capping layer (CPL) is commonly deposited onto the substrate 100.

[0201] The first electrode E1 is positioned separately for the red subpixel SPr, the green subpixel SPg, and the blue subpixel SPb. The second electrode E2 may be positioned in common for the red subpixel SPr, the green subpixel SPg, and the blue subpixel SPb. For example, the first electrode E1 may be the anode electrode and the second electrode E2 may be the cathode electrode.

[0202] The two-stack structure may also be a structure in which at least two or more organic light-emitting layers R-EML, G-EML, and B-EML that emit the same color light are arranged above and below the n-charge generation layer n-CGL and the p-charge generation layer p-CGL. Multiple organic layers are arranged above and below the n-charge generation layer n-CGL and the p-charge generation layer p-CGL, respectively.

[0203] Although the above description is based on a process in chronological order, the processes may be performed simultaneously or the order of the processes may be changed in time. To form the organic light-emitting layered structure of Figure 21, an in-line deposition apparatus similar to the in-line deposition apparatus of Figure 19 can be used.

[0204] Figure 22 is a schematic diagram illustrating an organic light-emitting device according to the second embodiment. For the sake of explanation, Figure 22 mainly shows the stripe pattern and the light-emitting layer, and other components are omitted.

[0205] Referring to Figure 22, in the organic light-emitting display device 10 of this embodiment, a protective pattern 130 is formed that covers the corner of the first electrode E1, compared to the organic light-emitting display device of the first embodiment described above.

[0206] In this regard, the formation of the first electrode E1 creates a step, and in particular, if the first electrode E1 is made of, for example, ITO / Ag / ITO and has a reflective function, the step becomes larger due to its thickness.

[0207] Such a step can create an overcurrent, which can lead to an electrical short circuit between the first electrode E1 and the second electrode E2.

[0208] To improve this, protective patterns 130 can be formed at each corner of the first electrode E1 to cover it. These protective patterns 130 reduce the step, thereby eliminating the electrical short circuit between the first electrode E1 and the second electrode E2.

[0209] Figure 23 can be referenced for a method of forming the protective pattern 130.

[0210] Referring to Figure 23, a first electrode E1 is formed on each subpixel by a photolithography process, and then the photoresist pattern 140, which is an etching mask for forming the first electrode E1, is ashed.

[0211] As a result, the corners of the first electrode E1 of each subpixel SP are not covered by the photoresist pattern 140 and remain exposed, but for example, a corner of approximately 1 μm or more can be exposed.

[0212] Subsequently, the substrate 100 is immersed in the electrolyte, and a voltage is applied to the first electrode E1 via the subpixel SP drive circuit DC. As a result, an organic or inorganic insulating material is electrodeposited onto the exposed corners of the first electrode E1, forming a protective pattern 130.

[0213] After the protective pattern 130 is formed, the photoresist pattern 140 can be removed, and then an organic light-emitting layer can be formed.

[0214] Figure 24 is a schematic diagram illustrating an organic light-emitting device according to the third embodiment. For the sake of explanation, Figure 24 mainly shows the stripe pattern and the light-emitting layer, and other components are omitted.

[0215] Referring to Figure 24, in the organic light-emitting display device 10 of this embodiment, compared with the organic light-emitting display device of the first embodiment described above, a single protective film 120 can be formed on the drive circuit DC, in which the planarization layer 125 and the stripe pattern STP are integrated.

[0216] In contrast, for example, an organic insulating material can be deposited onto a substrate 100 on which a drive circuit DC is formed, and a photolithography process can be performed to form a protective film 120 composed of a stripe pattern STP and a planarization layer 125.

[0217] The stripe pattern STP is configured similarly to the stripe patterns of the first and second embodiments, but is formed in correspondence with the red subpixel SPr and the green subpixel SPg.

[0218] Between adjacent stripe patterns STP, a planarization layer 125 is formed that connects the adjacent stripe patterns STP. This planarization layer 125 can be positioned substantially corresponding to the blue subpixel SPb.

[0219] On the other hand, the protective film 120 has contact holes 121 that expose one electrode of the drive circuit DC of each subpixel SP.

[0220] In this regard, for example, a contact hole 121 is formed at the boundary between the first inclined surface SS1 of the stripe pattern STP and the adjacent planarization layer 125, exposing the drive circuit DC of the red subpixel SPr.

[0221] A contact hole 121 is formed at the boundary between the second inclined surface SS2 of the stripe pattern STP and the adjacent planarization layer 125, exposing the drive circuit DC of the green subpixel SPg.

[0222] Furthermore, a contact hole 121 is formed in the planarization layer 125 to expose the drive circuit DC for the blue subpixel SPb.

[0223] On the protective film 120 as described above, a first electrode E1 is formed for each subpixel SP. The first electrode E1 of each subpixel SP is connected to the corresponding drive circuit DC via the corresponding contact hole 121.

[0224] Such a first electrode E1 is configured similarly to the first electrode E1 of the first and second embodiments.

[0225] On the other hand, although not specifically shown in the diagram, the protective pattern of the second embodiment can be applied to the organic light-emitting display device 10 of the third embodiment. In this case, after forming the first electrode E1, a protective pattern can be formed to cover its corners.

[0226] Table 1 shows the product, design values ​​of the stripe pattern, and predicted product performance for an organic light-emitting display device with a stripe pattern according to the embodiment. Table 2 shows the comparison results of a phone display device product with a display device of related technology and a display device with a stripe pattern according to the embodiment. Figure 25 is a schematic diagram illustrating the pixel structure of a general display device, and Figure 26 is a schematic diagram illustrating the pixel structure of the display device of the embodiment (see Table 2). Figure 27 illustrates the pixel design model of the display device of the embodiment in Figure 26. Meanwhile, Figures 25 and 26 The unit of the numbers is μm. The red, green, and blue subpixels shown as anode electrodes in Figure 27 may be the first electrodes located substantially in the effective light-emitting region, assuming they are not covered by the protective pattern.

[0227] [Table 1]

[0228] [Table 2]

[0229] Referring to Table 1, across various products (AR / VR, Phone, iPad, TV), the height of the stripe pattern is approximately 40% to 44% of the pixel size, and the deposition angle margin decreases as the PPI decreases. In the examples, the pixel area utilization is dramatically increased by arranging subpixels in at least two regions of the stripe pattern to construct the pixels three-dimensionally. Each of the two regions has at least one surface, which may be an inclined surface tilted relative to the ground.

[0230] By using a self-alignment method for deposition without using a deposition pattern mask like FMM, the spacing between subpixels and between pixels can be reduced, resulting in an aperture ratio that is approximately three times higher than related technologies.

[0231] Furthermore, the lifespan of the display device is increased by approximately 4.8 times compared to related technologies; for this, please refer to Equation 3.

[0232] Formula 3: Lifetime ratio = (Aperture ratio) n (n=1.4).

[0233] On the other hand, in the pixel aperture ratio calculation of the related technology, the width of the bank located between subpixels was assumed to be 20 μm, and a pentile structure (i.e., R, G, B, G arrangement) was assumed only when the PPI was 530, while the calculation for the remaining PPIs was performed assuming a complete R, G, B arrangement structure.

[0234] On the other hand, in order to more accurately confirm the improvements of the display device in the embodiment, the pixel structure of the display device of the related technology of the 530 PPI mobile phone shown in Figures 25 and 26, respectively, and the pixel structure of the embodiment are referenced. Based on the design dimensions in Figure 26, the aperture ratio, maximum deposition angle, deposition angle margin, etc., of the pixel structure of the display device in the embodiment (for example, the pixel structure of the third embodiment) can be predicted as shown in Figure 27.

[0235] Comparing the display device of the related technology with that of the embodiment, it can be seen that the aperture ratio is approximately 3.1 times higher and the lifespan is approximately 4.8 times longer than that of the display device of the related technology. In the related technology, differences are made in the area of ​​subpixels to compensate for the difference in lifespan between colors, and a pentile structure is applied to overcome the resolution limit. On the other hand, in the embodiment, a sufficient design margin for lifespan can be secured, so it can be confirmed that a new form of organic light-emitting display device can be provided.

[0236] Image quality performance and yield are optimized by adjusting variables such as the height of the stripe pattern, its top margin, and the upper and lower margins of the first electrode (i.e., the upper and lower margins on the plane).

[0237] The revolutionary increase in element lifespan also makes it possible to increase the brightness of the display device, thereby improving the fundamental performance of the display device.

[0238] Furthermore, in the manufacturing of ultra-small organic light-emitting display devices such as OLEDoS (OLED on Silicon), where side-by-side arrangement is currently impossible, or in large-area deposition equipment where deposition is possible without using FMM, this could usher in a new era of display devices.

[0239] Furthermore, since large-area organic light-emitting display devices for outdoor use require improved brightness and longer lifespan, organic light-emitting display devices will likely be able to capture the market currently occupied by micro-LEDs.

[0240] Furthermore, applying the structure of the example to products using the side-by-side structure of related technologies will not only lead to performance innovation but also cost innovation through increased productivity, which will expand its application to laptops, monitors, automobiles, and other products.

[0241] As described above, in the display device of the embodiment, two subpixels constituting pixels are located on the stripe pattern, and an organic light-emitting layer is deposited to generate color light for another subpixel constituting a pixel located in the separation region between adjacent stripe patterns. Organic light-emitting layers that generate color light for two subpixels can be individually deposited on both inclined surfaces of the stripe pattern using a self-alignment method.

[0242] This makes it possible to form subpixels in a side-by-side structure for high-definition or large-area display devices that are difficult to manufacture using FMM, thereby improving the performance of the display device, such as power consumption, brightness, and lifespan.

[0243] The side-by-side structure can now be implemented using an inline method, reducing investment costs and improving productivity (for example, by more than three times).

[0244] Furthermore, it becomes possible to form the light-emitting layer without using FMM, improving yield and reducing manufacturing costs.

[0245] Furthermore, pixels will have a three-dimensional structure instead of a planar structure, increasing the light-emitting area and improving their lifespan (for example, by approximately four times or more).

[0246] On the other hand, the above-described embodiment described the case in which an in-line deposition apparatus is applied to an organic light-emitting display device in which a stripe pattern is formed. However, the in-line deposition apparatus can also be applied to organic light-emitting display devices with structures different from those having a stripe pattern.

[0247] The embodiments described above, as examples of the present invention, can be freely modified within the scope of the spirit of the invention. Therefore, the present invention includes the appended claims and modifications of the present invention within an equivalent scope.

Claims

1. A first evaporation chamber includes a first evaporation source that ejects a third light-emitting material for forming a third organic light-emitting element through a first nozzle positioned opposite to the separation region between adjacent stripe patterns on a substrate having multiple stripe patterns, A second evaporation chamber includes a second evaporation source that discharges a first light-emitting material for forming a first organic light-emitting element through a second nozzle positioned opposite to the first region of the stripe pattern, The third deposition chamber includes a third evaporation source that discharges a second light-emitting material for forming a second organic light-emitting element through a third nozzle positioned opposite the second region of the stripe pattern, The second nozzle and the third nozzle are inclined in opposite directions to the direction of movement of the substrate. The first deposition angle θe1 ​​for depositing the first light-emitting material and the second light-emitting material in the first and second regions of the stripe pattern, respectively, is expressed by equation 1. Formula 1: tanθe1 = H / (W1 + W2) H is the height of the stripe pattern, W1 is the width projected perpendicularly to the first region of the stripe pattern, and W2 is the width of the separation region. The second deposition angle θe2 for depositing the first and second light-emitting materials from the second and third evaporation sources toward the first and second regions of the stripe pattern, respectively, is expressed by equation 2. Formula 2: tanθe² = TS / Loffset TS is the vertical distance between the substrate and the second and third evaporation sources. Loffset is the shortest horizontal distance from the second evaporation source and the third evaporation source to a location on a substrate where the first light-emitting material and the second light-emitting material can be deposited, and is a manufacturing apparatus for an organic light-emitting device.

2. The substrate includes a plurality of pixels, Each of the aforementioned plurality of pixels includes a first subpixel, a second subpixel, and a third subpixel. The first subpixel, second subpixel, and third subpixel are arranged alternately along the first direction and elongated along the second direction. The inclination angles of the first and second regions of the stripe pattern are 60 degrees to 95 degrees. The apparatus for manufacturing an organic light-emitting display device according to claim 1, wherein the substrate moves in the first direction during deposition in the first deposition chamber, the second deposition chamber, and the third deposition chamber, respectively.

3. The apparatus for manufacturing an organic light-emitting display device according to claim 2, wherein the first deposition chamber discharges the third light-emitting material toward the separation region to form a third organic light-emitting layer common to each of the first subpixel, the second subpixel, and the third subpixel.

4. The first region has at least one first surface, The apparatus for manufacturing an organic light-emitting display device according to claim 3, wherein the second deposition chamber discharges the first light-emitting material toward at least one first surface to form a first organic light-emitting layer on the first subpixel.

5. The second region has at least one second surface, The apparatus for manufacturing an organic light-emitting display device according to claim 3, wherein the third deposition chamber discharges the second light-emitting material toward at least one second surface to form a second organic light-emitting layer on the second subpixel.

6. During the deposition process in the first deposition chamber, the substrate moves in a first direction or a second direction. The apparatus for manufacturing an organic light-emitting display device according to claim 1, wherein the substrate moves in the first direction during the deposition process in the second deposition chamber and the third deposition chamber.

7. The apparatus for manufacturing an organic light-emitting display device according to claim 1, further comprising a rotating chamber for rotating the substrate by 90 degrees between the first deposition chamber and the second deposition chamber.

8. The apparatus for manufacturing an organic light-emitting display device according to claim 1, further comprising an input chamber at the front end of the first deposition chamber, which allows substrates to be input in multiple directions, one and two directions perpendicular to each other.

9. The first light-emitting material is a red light-emitting material, The second light-emitting substance is a green light-emitting substance, The organic light-emitting display device manufacturing apparatus according to any one of claims 1 to 8, wherein the third light-emitting material is a blue light-emitting material.

10. The first light-emitting material is a green light-emitting material, The aforementioned second light-emitting material is a red light-emitting material, The organic light-emitting display device manufacturing apparatus according to any one of claims 1 to 8, wherein the third light-emitting material is a blue light-emitting material.

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