Cooling devices for electronic equipment

Abstract

To provide a cooling device for electronic apparatuses with which it is possible to downsize a cooling fan without reducing a discharge amount of a cooling air.SOLUTION: A first air blower unit has a first discharge surface that creates an air flow between the fins of a heat sink by rotation-induced air blow and discharges air toward the heat sink. A second air blower unit has a second discharge surface that creates an air flow between the fins by rotation-induced air blow and discharges air toward the heat sink and that is installed adjacent to the first air blower unit. A duct covers the heat sink and the first and second air blower units and has a suction port on an upstream side and an exhaust port on a downstream side in the direction of air blow by the first and second air blower units. A partition member is disposed between the first and second air blower units and the heat sink, and has a bottom plate that is in contact with a base unit and through which the heat of the base unit propagates, and a bulk head that is disposed upright to the bottom plate and divides a space above the bottom plate from between the first and second discharge surfaces to one of the fins.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] Embodiments of the present invention relate to a cooling device for an electronic device.

Background Art

[0002] Conventionally, electronic devices such as PCs (Personal Computers) include components that become hot, such as CPUs (Central Processing Units). Generally, a heat sink is attached to such components for heat dissipation. Then, heat dissipation is performed by the air sucked in by a fan installed on the upstream side flowing through the heat sink and being exhausted to the downstream side of the heat sink. (For example, Patent Document 1)

[0003] Recently, there has been a great demand for miniaturization of electronic devices, and miniaturization of cooling fans that blow air to heat sinks has been required. However, when the cooling fan is miniaturized, the discharge amount of the cooling air decreases, so the cooling performance of the heat sink deteriorates, which is not preferable.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The problem to be solved by the present invention is to provide a cooling device for an electronic device capable of realizing miniaturization of a cooling fan without reducing the discharge amount of cooling air.

Means for Solving the Problems

[0005] The cooling device for electronic equipment according to this embodiment comprises a heat sink with a plurality of fins arranged in the thickness direction on a base portion to which heat from electronic components is conducted, a first air blower and a second air blower, a duct, and a partition member. The first air blower creates an airflow between the fins by rotating airflow and has a first discharge surface that discharges the air toward the heat sink. The second air blower creates an airflow between the fins by rotating airflow and has a second discharge surface that discharges the air toward the heat sink, and is installed adjacent to the first air blower. The duct covers the heat sink, the first air blower and the second air blower, and has an intake port on the upstream side and an exhaust port on the downstream side in the direction of airflow by the first air blower and the second air blower. The partition member is positioned between the first air blower and the second air blower and the heat sink, and is in contact with the base portion to which heat from the base portion is conducted. metal A base plate and a device erected on the base plate that divides the space above the base plate from between the first discharge surface and the second discharge surface to either of the fins. metal It has a partition wall. Furthermore, the bottom plate and the base portion are in contact at their end faces, and these end faces are opposing slopes, with a heat-conducting material in between them. [Brief explanation of the drawing]

[0006] [Figure 1] Figure 1 is a perspective view showing an example of the external appearance of a cooling device according to the first embodiment. [Figure 2] Figure 2 is a schematic perspective view showing an example of the structure of an electronic device to which a cooling device is attached. [Figure 3] Figure 3 is a perspective view showing an example of a ventilation hole provided in an electronic device. [Figure 4] Figure 4 is a perspective view showing an example of a duct shape. [Figure 5] Figure 5 illustrates the shape of the partition member. [Figure 6] Figure 6 is an example of the shape of a partition member. [Figure 7] Figure 7 illustrates the shape of the partition member. [Figure 8] Figure 8 is a plan view showing an example of the arrangement of fans within a duct. [Figure 9] Figure 9 is a front view showing an example of the arrangement of fans within a duct. [Figure 10] Figure 10 is a longitudinal cross-sectional side view showing an example of the arrangement of fans within a duct. [Figure 11] Figure 11 is a plan view showing the arrangement of the fans in the second embodiment. [Figure 12] Figure 12 is a plan view showing the arrangement of the fans in the third embodiment. [Figure 13] Figure 13 is a plan view showing another example of the positional relationship between the fan and the bulkhead and side wall. [Figure 14] Figure 14 is a plan view showing another example of the positional relationship between the fan and the bulkhead and side wall. [Modes for carrying out the invention]

[0007] (First embodiment) Embodiments will be described with reference to the drawings. Figure 1 is a perspective view showing an example of the external appearance of the cooling device 200 of the first embodiment. Figure 2 is a perspective view schematically showing an example of the structure of the electronic device 100 to which the cooling device 200 is attached. For the sake of explanation, a three-dimensional coordinate system is also shown in the drawings. In the three-dimensional coordinate system, the width direction (left-right direction) of the cooling device 200 and the electronic device 100 is the X-axis direction, the depth direction (front-back direction) is the Y-axis direction, and the height direction (up-down direction) is the Z-axis direction. The positive direction of the Y-axis is the direction from the back side to the front side of the electronic device 100, and the positive direction of the Y-axis is defined as "forward". The positive direction of the Z-axis is the direction from bottom to top.

[0008] First, as shown in Figure 1, the cooling device 200 comprises a duct 1, a heat sink 2, and fans 3 and 4. The duct 1 has a roughly box-like shape and covers the heat sink 2 and the fans 3 and 4 that blow air onto the heat sink 2. An intake port 11 is provided on the upstream side of the airflow direction of the fans 3 and 4, and an exhaust port 12 is provided on the downstream side. The duct 1 causes the fans 3 and 4 to draw in air from the intake port 11 and discharge it from the exhaust port 12. The direction of airflow from the fans 3 and 4 is directed in the negative direction (rearward) of the Y-axis by the duct 1.

[0009] Hereafter, when simply referred to as "upstream," it means the upstream side (windward) based on the direction of airflow within duct 1 (negative direction of the Y-axis). Similarly, when simply referred to as "downstream," it means the downstream side (leeward) based on the direction of airflow within duct 1.

[0010] The heatsink 2 is generally made of a metal material with high thermal conductivity, such as aluminum or copper, and is attached to a heat-generating electronic component (heat source). This heat source is, for example, a CPU (Central Processing Unit). The heat generated by the CPU is conducted to the heatsink 2, and the heat from the heatsink 2 is dissipated into the surrounding air. This prevents malfunctions caused by CPU overheating.

[0011] The heatsink 2 comprises a base portion 21 and a plurality of fins 22. The base portion 21 receives heat conduction from the electronic components. The fins 22 are arranged vertically on the base portion 21 in a row in the thickness direction. The plurality of fins 22 are adjacent to each other with a predetermined distance between them. The base portion 21 is in contact with the CPU and receives heat conduction from the CPU. The fins 22 dissipate the heat conducted from the base portion 21, which is continuous with them, into the air (heat dissipation). Heat dissipation is promoted as air flowing through the duct 1 passes between the fins 22 of the heatsink 2.

[0012] The heat sink 2 is fixed on frames 81 and 82 that form layers at a predetermined interval by a winding spring 84 and a screw 85. A motherboard 101 (see FIG. 2) is sandwiched between the frame 81 and the frame 82.

[0013] The fan 3 is an example of the first air blowing unit in the present disclosure. The fan 4 is an example of the second air blowing unit in the present disclosure. The fan 3 includes a first discharge surface that discharges the air sucked from the outside toward the heat sink 2. The fan 4 includes a second discharge surface that discharges the air sucked from the outside toward the heat sink 2.

[0014] The fan 3 and the fan 4 in the present embodiment are of the same size, and are symmetrically arranged with respect to a plane (a plane parallel to the YZ plane) parallel to the fins 22 with an included angle of 90 degrees or more through the central position in the width direction of the heat sink 2 along the X axis.

[0015] The fans 3 and 4 are axial fans, and a propeller having one or more blades around the rotation axis is rotationally driven by, for example, a conduction motor to continuously send air. The air blowing by the fans 3 and 4 creates an air flow between the fins 22. The air sent by the fans 3 and 4 carries the heat dissipated by the fins 22 and the base portion 21 to the downstream side, promoting heat dissipation. Thus, the fans 3 and 4 cool the heat sink 2.

[0016] In the present embodiment, the intake port 11, the fan 3 or the fan 4, the heat sink 2, and the exhaust port 12 are arranged in this order from the upstream side to the downstream side of the air flow direction in the duct 1. The air sucked in by the fans 3 and 4 from the intake port 11 flows mainly around the fins 22 of the heat sink 2, takes away the heat of the fins 22, and is discharged from the exhaust port 12.

[0017] The duct 1 efficiently utilizes the air blown by the fan 3 to enhance the heat dissipation effect of the heat sink 2. Specifically, the duct 1 surrounds the heat sink 2 and demarcates the area through which the air sent by the fan 3 for cooling the heat sink 2 flows. The gas within the duct 1 is exchanged with the gas sucked in from the intake port 11 due to the rotation of the fan 3 and is pushed out from the exhaust port 12. As a result, the gas around the heat sink 2 is quickly replaced.

[0018] To fully exhibit the effect of the cooling device 200 as described above, it is desirable that there are no components (obstacles) obstructing the exhaust downstream of the exhaust port 12. However, depending on the size of the electronic device 100 equipped with the cooling device 200 and the arrangement of the internal components, etc., an obstacle may be placed downstream of the exhaust port 12.

[0019] As shown in FIG. 2, the electronic device 100 includes a motherboard 101, a CPU 102, a memory 103, a SSD (Solid State Drive) 104, a riser card 105, an I / O board 106, and a housing 110. The housing 110 houses the above-mentioned respective components (motherboard 101, CPU 102, memory 103, SSD 104, riser card 105, I / O board 106).

[0020] The motherboard 101 is an example of a substrate on which an electronic component (CPU 102 in this embodiment) that is cooled by the heat sink 2 is mounted. Also, since the memory 103 and the SSD 104 generate heat according to their operations, they can be heat sources. The heat generated by these heat sources is also dissipated by the flow of the gas within the housing 110 created by the air blown by the fans 3 and 4.

[0021] The I / O board 106 is connected to the motherboard 101 via a slot provided in the riser card 105. Since the I / O board 106 is arranged in parallel with the motherboard 101 by being connected to the slot provided in the riser card 105, it is possible to suppress the height dimension of the housing 110.

[0022] However, with the arrangement described above, if the I / O board 106 is located downstream of the exhaust port 12, the I / O board 106 becomes an obstacle that obstructs the exhaust. In this embodiment, the exhaust from the duct 1 is configured to avoid the I / O board 106.

[0023] Figure 3 is a perspective view showing an example of ventilation holes 161-167 provided in the electronic device 100. Note that this perspective view shows the electronic device 100 as seen from the rear.

[0024] Duct 1 is housed inside the housing 110 of the electronic device 100. The housing 110 is provided with ventilation holes 161, 162, and 163 for taking in air drawn into the duct 1, and ventilation holes 164, 165, and 167 for exhausting the air that has passed through duct 1.

[0025] Ventilation holes 161, 162, and 163 are provided in the front cover 111, which forms the front of the housing 110. Ventilation hole 164 is provided in the rear cover 112, which forms the back of the housing 110. Ventilation holes 165 and 167 are provided in the I / O panel 113, which forms part of the back of the housing 110. The I / O panel 113 is equipped with connection terminals for various peripheral devices to the electronic device 100.

[0026] In the electronic device 100 of this embodiment, the I / O board 106 is positioned behind the CPU 102. Therefore, the exhaust port 12 of the duct 1 is divided into an upper exhaust port 121 that opens upward and a lower exhaust port 122 that opens downward, so that the exhaust avoids the I / O board 106 (see Figure 1). Specifically, the exhaust port 12 is divided into the upper exhaust port 121 and the lower exhaust port 122 by a branching wall 13.

[0027] Figure 4 is a perspective view showing an example of the shape of duct 1. Duct 1 has an opening on the side where fans 3 and 4 are attached and on the side of the exhaust port 12.

[0028] Duct 1 comprises a top plate 10 and side walls 15-18. The top plate 10 constitutes the upper part of duct 1 in the Z-axis direction and faces the tip of the fins 22. Side walls 17 and 18 face both sides of the heatsink 2. Side walls 15 and 16 connect side walls 17 and 18 to the sides of fans 3 and 4 and enclose the space between fans 3 and 4 and the heatsink 2.

[0029] As described above, the duct 1 allows the air blown out by fans 3 and 4 to reach the heatsink 2 without leaking from the duct 1. The side walls 15 and 16 are examples of the first wall portion in this disclosure.

[0030] A branch wall 13 is provided on the downstream side (negative Y-axis side) of duct 1. The branch wall 13 comprises an upper wall portion 131 and a lower wall portion 132. A portion of the air that passes between the fins 22 of the heat sink 2 flows along the upper wall portion 131 and is discharged from the upper exhaust port 121. The remaining air that passes between the fins 22 of the heat sink 2 flows along the lower wall portion 132 and is discharged from the lower exhaust port 122.

[0031] Figures 5, 6, and 7 illustrate the shapes of the partition members 5, 501, and 502. The cooling device 200 includes one of the partition members 5, 501, and 502 shown in Figures 5, 6, and 7. The partition members 5, 501, and 502 are provided on the upstream side (positive Y-axis side) of the heat sink 2 within the duct 1. It is preferable that the partition members 5, 501, and 502 are made of a metal material with high thermal conductivity, such as aluminum or copper.

[0032] The partition member 5 shown in Figure 5 has a partition wall 50 and a bottom plate 59. The rear end surface 591 of the bottom plate 59 is an upwardly inclined slope. In contrast, the front end surface of the base portion 21 of the heat sink 2 is a downwardly inclined slope and is substantially parallel to the upwardly inclined rear end surface 591. These two slopes (the rear end surface 591 and the front end surface of the base portion 21) are arranged to be in contact with each other. As a result, heat from the heat sink 2 is conducted to the partition member 5. It is more preferable that the two slopes are in contact with a thermal conductive material (thermal interface material: TIM) in between. Examples of thermal conductive materials include thermal conductive grease.

[0033] The partition wall 50 is a wall aligned with the Z-axis direction, installed vertically between the position between fan 3 and fan 4 and the center position in the width direction (X-axis direction) of the heatsink 2. The partition wall 50 separates the air supplied by fan 3 and the air supplied by fan 4, preventing the two flows from interfering with each other. The partition wall 50 guides the air supplied by fan 3 and fan 4 to the heatsink 2 without mixing them. Note that the partition wall 50 is an example of the second wall portion in this disclosure.

[0034] The partition member 501 shown in Figure 6 has, in addition to the configuration of the partition member 5, further separation walls 51 and 52. The separation walls 51 and 52 are provided approximately parallel to the partition wall 50.

[0035] The separation wall 51 is a wall that runs between the side wall 15 and the partition wall 50, from the central part of the fan 3 to the fins 22 of the heatsink 2. Note that the separation wall 51 is an example of a first separation wall in this disclosure.

[0036] The separation wall 52 is a wall that runs between the side wall 16 and the partition wall 50, from the central part of the fan 4 to the fins 22 of the heatsink 2. Note that the separation wall 52 is an example of a second separation wall in this disclosure.

[0037] Here, the partition members 5 and 501 described above can be manufactured, for example, by extruding a metal material in the Y-axis direction and processing the end faces.

[0038] The partition member 502 shown in Figure 7 is equipped with separation walls 51 and 52, similar to Figure 6, but these are not parallel to the partition wall 50 and are positioned opposite each other such that the distance between them narrows as you move downstream in the direction of airflow within the duct 1 (negative direction of the Y-axis). The angle (close angle) between the partition wall 50 and the separation wall 51 or 52 is acute. Because the separation walls 51 and 52 are not parallel to the partition wall 50, this partition member 502 is not suitable for extrusion processing, but it can be easily formed using processing methods such as hemming bend (crease bend, crush bend). If a portion corresponding to the rear end surface 591 described above is to be provided on this partition member 502, for example, one method is to bend the rear edge of the bottom plate 59 to form a sloped surface parallel to the end surface of the base portion 21.

[0039] Figure 8 is a plan view showing an example of the arrangement of fans 3 and 4 within duct 1. Figure 9 is a front view showing an example of the arrangement of fans 3 and 4 within duct 1. Figure 10 is a longitudinal side view showing an example of the arrangement of fans 3 and 4 within duct 1. Note that Figure 10 is a cross-sectional view taken along the CC line shown in Figure 8. In addition, the partition member 502 shown in Figure 7 is used in the examples shown in these figures.

[0040] As shown in Figures 8 and 9, fan 3 has multiple blades that rotate around a rotation axis 31. Fan 3 draws in air from the intake port 11 and discharges it from a first discharge surface 32. The first discharge surface 32 is a circular area with a diameter D. Similarly, fan 4 has multiple blades that rotate around a rotation axis 41. Fan 4 draws in air from the intake port 11 and discharges it from a second discharge surface 42. The second discharge surface 42 is a circular area with a diameter D.

[0041] Fans 3 and 4 are the same size. The size of fans 3 and 4 is set such that the sum of the diameters D of the first discharge surface 32 and the diameter D of the second discharge surface 42, 2D, is greater than the width W of the heatsink 2.

[0042] Furthermore, the first discharge surface 32 from which fan 3 discharges air and the second discharge surface 42 from which fan 4 discharges air are arranged symmetrically on the upstream side of the heatsink 2, with a virtual plane 25 passing through the center of the heatsink 2 in the width direction and parallel to the fins 22.

[0043] More specifically, in Figure 8, the angle θ between the first discharge surface 32 and the virtual plane 25 is equal to the angle θ between the second discharge surface 42 and the virtual plane 25, and the angle between the first discharge surface 32 and the second discharge surface 42 (2θ) is set to be 90° or greater. That is, the angle θ is set to be 45° or greater.

[0044] Furthermore, the casings of fan 3 and fan 4 are adjacent to each other without any gaps. Therefore, the casings of fan 3, fan 4, side walls 15 and 16, and top plate 10 (see Figure 4) surround the space upstream of the heatsink 2. As a result, the air supplied by fans 3 and 4 reaches the heatsink 2 without leaking outside the duct 1.

[0045] Furthermore, the cooling device 200 includes a partition wall 50 between the point where the housings of fan 3 and fan 4 meet and the center of the heat sink 2 in the width direction, which guides the air discharged from the first discharge surface 32 and the second discharge surface 42 to the heat sink 2 without mixing. The partition wall 50 is, for example, a rib that is erected in the positive Z-axis direction.

[0046] In this way, by installing the partition wall 50, the air discharged from the first discharge surface 32 and the air discharged from the second discharge surface 42 do not come into contact with each other and therefore do not affect one another. As a result, the air drawn in by fan 3 and the air drawn in by fan 4 are each guided in a direction along the fins 22 of the heatsink 2.

[0047] Furthermore, a separation wall 51 is installed inside the duct 1, passing through a position between the first discharge surfaces 32 and a position between the side wall 15 on the fan 3 side and the partition wall 50, and reaching the fins 22 of the heat sink 2. The separation wall 51 is formed to be thinner than the partition wall 50. The separation wall 51 is, for example, a rib that is erected in the positive Z-axis direction.

[0048] The separation wall 51 forms two independent channels 61 and 62 between the first discharge surface 32 and the heat sink 2. Channel 61 is a space partitioned vertically (Z-axis direction) by the top plate 10 and the motherboard 101, and horizontally (X-axis direction) by the side wall 15 and the separation wall 51. Channel 62 is a space partitioned vertically (Z-axis direction) by the top plate 10 and the motherboard 101, and horizontally (X-axis direction) by the separation wall 51 and the partition wall 50.

[0049] Furthermore, a separation wall 52 is installed inside the duct 1, passing through a position between the second discharge surfaces 42 and a position between the side wall 16 on the fan 4 side and the partition wall 50, and reaching the fins 22 of the heat sink 2. The separation wall 52 is formed to be thinner than the partition wall 50. The separation wall 52 is, for example, a rib that is erected in the positive Z-axis direction.

[0050] The separation wall 52 forms independent flow paths 63 and 64 between the second discharge surface 42 and the heat sink 2. Flow path 63 is a space partitioned vertically (Z-axis direction) by the top plate 10 and the motherboard 101, and horizontally (X-axis direction) by the side wall 16 and the separation wall 52. Flow path 64 is a space partitioned vertically (Z-axis direction) by the top plate 10 and the motherboard 101, and horizontally (X-axis direction) by the separation wall 52 and the partition wall 50.

[0051] The side walls 15 and 16 of duct 1 are arranged so that the distance between them gradually narrows from the air intake 11 to the heat sink 2. As a result, the air supplied by fan 3 is directed towards the center in the width direction along side wall 15, and the air supplied by fan 4 is directed towards the center in the width direction along side wall 16.

[0052] If we assume that there are no partition walls 50 or separation walls 51 and 52, the air supplied by fan 3 and the air supplied by fan 4 will collide in the center in the width direction, causing turbulence in both flows. In this case, the flow velocity may weaken, which is undesirable.

[0053] However, in this embodiment, the partition wall 50 prevents the air supplied by fan 3 from mixing with the air supplied by fan 4, thereby improving the stability of the airflow within the duct 1.

[0054] In this example, the separation wall 51 is positioned between the center of the first discharge surface 32 and the center of the side wall 15 of the heat sink 2 and the partition wall 50. As a result, approximately the same amount of air flows through the flow path 61 and the flow path 62. Similarly, since the separation wall 52 is formed between the center of the second discharge surface 42 and the center of the side wall 16 of the heat sink 2 and the partition wall 50, approximately the same amount of air flows through the flow path 63 and the flow path 64. Therefore, a uniform amount of air is delivered to the fins 22 of the heat sink 2 without any bias depending on the location. As a result, uniform cooling performance can be obtained regardless of the location of the fins 22.

[0055] As shown in Figure 10, the air that passes between the fins 22 of the heatsink 2 reaches the branching wall 13. The branching wall 13 has an upper wall portion 131 and a lower wall portion 132. The upper wall portion 131 and the lower wall portion 132 are connected by an edge along the X-axis on the upstream side in the airflow direction. The upper wall portion 131 and the lower wall portion 132 are also inclined with respect to the airflow direction such that the distance between them increases as you move downstream in the airflow direction. The upper wall portion 131 guides the air that has passed between the fins 22 of the heatsink 2 diagonally upward and discharges it from the upper exhaust port 121. The lower wall portion 132 guides the air that has passed between the fins 22 of the heatsink 2 diagonally downward and discharges it from the lower exhaust port 122. In this way, the branching wall 13 guides the exhaust to avoid a certain area downstream of itself and branches the exhaust. Therefore, even if peripheral devices such as the I / O board 106 (see Figure 3) are located downstream of the branch wall 13, the cooling performance of the heatsink 2 will not be hindered.

[0056] (Other embodiments) Next, other embodiments will be described. The following embodiments are modifications of the above embodiments, so the same reference numerals are used for the same parts as in the above embodiments and their descriptions are omitted, while the parts that differ from the above embodiments will be described. Figure 11 is a plan view showing the arrangement of fans 3 and 4 in the second embodiment. Figure 12 is a plan view showing the arrangement of fans 3 and 4 in the third embodiment.

[0057] Figure 11 shows an example in which fans 3 and 4 are installed with an angle θ = 90° between them and the partition wall 50. That is, the angle between fans 3 and 4 (2θ) is set to 180°, and fans 3 and 4 are installed side by side. Note that in this example, the partition walls 51 and 52 are not parallel to each other, but are positioned facing each other at an angle, as shown in the partition member 502 partition wall 51 and 52 in Figure 7.

[0058] In this arrangement, the air discharged by fans 3 and 4 is guided to the fins 22 of the heatsink 2 through a flow path partitioned by side walls 15 and 16, partition wall 50, separation wall 51 and separation wall 52. Therefore, the stability of the airflow is maintained, and high cooling performance can be maintained.

[0059] Figure 12 shows an example where fans 3 and 4 are both installed at an angle θ = 45° between them and the partition wall 50. That is, the angle between fans 3 and 4 (2θ) is 90°. In this example, the partition walls 51 and 52 are parallel to each other, as shown in the partition member 501 partition walls 51 and 52 in Figure 6.

[0060] In this arrangement, the air discharged by fans 3 and 4 is guided to the fins 22 of the heatsink 2 through a flow path partitioned by side walls 15 and 16, partition wall 50, separation wall 51 and separation wall 52. Therefore, the stability of the airflow is maintained, and high cooling performance can be maintained.

[0061] Furthermore, if the angle θ is made even smaller than in this example, that is, if the angle between fan 3 and fan 4 (2θ) is made smaller than 90°, the angle between the direction of airflow discharged by fans 3 and 4 and the partition wall 50 or separation walls 51 and 52 will increase. This will increase the resistance to the air changing its flow direction along the partition wall 50 or separation walls 51 and 52, making the airflow more turbulent. In this case, the point where the first discharge surface 32 and the second discharge surface 42 contact each other will be farther from the heat sink 2, which is undesirable. Therefore, it is desirable that the angle between fan 3 and fan 4 (2θ) be 90° or greater.

[0062] Furthermore, the various embodiments described above do not preclude the installation of fans 3 and 4 with an angle θ exceeding 90°. That is, the angle between fans 3 and 4 (2θ) may be set to be greater than 180° (for example, up to about 200°). In this case, the partition wall 50 provided between the point where the housings of fan 3 and fan 4 meet and the center of the heat sink 2 in the width direction does not have to be flat; for example, both sides of the partition wall 50 may be curved surfaces that protrude towards the flow path.

[0063] Furthermore, although the partition members 501 and 502 were described in the various embodiments above as having two separation walls 51 and 52 flanking the partition wall 50, in practice, there may be three or more separation walls. By adjusting the position, angle, and number of separation walls, the direction and amount of air flowing from the fans 3 and 4 to the heat sink 2 can be adjusted. For example, if a heat source (CPU, etc.) is in contact with the center of the base portion 21, it is preferable to adjust the position, angle, and number of separation walls so that a large amount of air is blown onto the fins 22 in the center in the width direction, or so that the airflow velocity at that location is increased. Also, if heat sources are in contact with multiple locations on the base portion 21, it is preferable to adjust the position, angle, and number of separation walls so that a large amount of air is blown onto the fins 22 standing at those locations, or so that the airflow velocity at those locations is increased.

[0064] Furthermore, other embodiments will be described. Figures 13 and 14 are plan views (viewed from above in the negative Z-axis direction) showing other examples of the positional relationship between fans 3 and 4 and partition walls 50 and side walls 15 and 16. Figures 13 and 14 show examples where the arrangement of fans 3 and 4 is not symmetrical with respect to the heatsink 2. As shown in these figures, fans 3 and 4 do not need to be arranged symmetrically.

[0065] Fans 3 and 4 draw in air from the intake port 11 to blow onto the heatsink 2, creating an airflow in the area facing the intake port 11. This airflow carries away and removes heat generated by components located near the intake port 11. In other words, the airflow created by fans 3 and 4 promotes heat dissipation not only from heat sources in contact with the base portion 21 of the heatsink 2, but also from components near the intake port 11.

[0066] As described above, according to each embodiment, multiple fans 3 and 4 can supply air to a single heatsink 2. Therefore, even if a large-diameter fan cannot be used due to the height of the housing 110 of the electronic device 100, by employing multiple fans 3 and 4 that work together to supply an airflow equivalent to that of a large-diameter fan, it is possible to miniaturize the cooling fan (reduce its height dimension) without reducing the amount of cooling air discharged.

[0067] Furthermore, by gradually narrowing the cross-sectional area of ​​the airflow channels 61-64 from fans 3 and 4 to heat sink 2 from upstream to downstream, the airflow velocity can be increased.

[0068] Furthermore, by providing the partition wall 50, interference between the airflow from fan 3 and the airflow from fan 4 can be avoided, enabling efficient cooling.

[0069] Furthermore, by providing separation walls 51 and 52, and by setting the orientation of the separation walls 51 and 52, the direction, flow rate, and flow velocity of the air blown onto the heatsink 2 by fans 3 and 4 can be adjusted. This adjustment allows a uniform amount of air to be delivered to the fins 22 of the heatsink 2 regardless of their location, thereby achieving uniform cooling performance regardless of the location of the fins 22. Conversely, by adjusting the flow rate or flow rate of the air flowing around the fins 22 that generate a lot of heat, the cooling performance of the heatsink 2 can be improved.

[0070] Although the fans 3 and 4 in each of the embodiments described above are the same size, the sizes of the multiple fans 3 and 4 do not necessarily have to be the same in practice, and they may have different outputs (obtainable wind speed and airflow).

[0071] As described above, the cooling device 200 of the embodiment comprises a heat sink 2, a fan (first air blower) 3, a fan (second air blower) 4, a duct 1, and partition members 5, 501, 502. The heat sink 2 has a base portion 21 to which heat from electronic components such as the CPU 102 is conducted, with a plurality of fins 22 arranged in the thickness direction. The fan 3 creates airflow between the fins 22 by rotating and blowing air, and has a first discharge surface 32 that discharges air toward the heat sink 2. The fan 4 also creates airflow between the fins 22 by rotating and blowing air. The duct 1 has a second discharge surface 42 that discharges air toward the heat sink 2 and is installed adjacent to the fan 3. The duct 1 covers the heat sink 2, fan 3 and fan 4, and has an intake port 11 on the upstream side and an exhaust port 12 on the downstream side in the direction of airflow by fans 3 and 4. The partition members 5, 501 and 502 are positioned between fans 3 and fan 4 and the heat sink 2 and have a bottom plate 59 that is in contact with the base portion 21 and through which heat from the base portion is conducted, and a partition wall 50 that is erected on the bottom plate 59 and divides the space above the bottom plate 59 from between the first discharge surface 32 and the second discharge surface 42 to either of the fins 22.

[0072] With this structure, the cooling device 200 can use multiple fans 3 and 4 to blow air onto the heat sink 2, and the airflow from each fan can be directed towards the heat sink 2 without interfering with each other. As a result, when cooling the heat sink 2 with two fans 3 and 4, the sum of the diameters of the discharge surfaces of which is greater than the width of the heat sink 2, energy loss can be minimized and cooling can be performed efficiently. Furthermore, heat from the heat sink 2 is conducted to the partition members 5,501 and 502 through contact between the base portion 21 and the bottom plate 59. The partition wall 50 receives airflow from the fans 3 and 4, so it effectively dissipates the heat transferred from the bottom plate 59. In this way, the partition members 5,501 and 502 function as auxiliary heat sinks.

[0073] Furthermore, in the cooling device 200 of the embodiment, the bottom plate 59 and the base portion 21 are in contact with each other at their end faces, and the end faces are opposing slopes.

[0074] This makes it easier to conduct heat from the base section 21 to the bottom plate 59.

[0075] Furthermore, in the cooling device 200 of the embodiment, the partition members 501 and 502 further have one or more pairs of separation walls 51 and 52. The separation walls 51 and 52 further divide the space separated by the partition wall 50, dividing the space from the central part of the fans 3 and 4 to either of the fins 22.

[0076] By providing the separation walls 51 and 52, the cooling device 200 can adjust how much air is blown to which area of ​​the heat sink 2. Also, since the separation walls 51 and 52 receive airflow from the fans 3 and 4, they effectively dissipate the heat transferred from the bottom plate 59. This enhances the function of the partition members 501 and 502 as auxiliary heat sinks.

[0077] Furthermore, in the cooling device 200 of the embodiment, the separation walls 51 and 52 are installed at a position or angle where the airflow rate or velocity of the air flowing between the fins 22, which are erected at the positions where electronic components such as the CPU 102 are in contact with the base portion 21, is greater than the airflow rate or velocity of the air around the other fins 22, thereby separating the space from the fans 3 and 4 to the heat sink 2.

[0078] This makes it possible to improve the cooling performance of the cooling device 200.

[0079] Furthermore, in the cooling device 200 of the embodiment, the partition members 5,501, and 502 may be formed continuously by processing a plate-shaped metal material by hemming bending.

[0080] This broadens the options for manufacturing methods for partition members 5,501,502 and increases the degree of freedom in the installation position and angle of the partition wall 50 and separation walls 51,52.

[0081] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, modifications, and combinations are possible without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of Symbols]

[0082] 100...Electronic equipment, 101...Motherboard, 102...CPU, 103...Memory 104...SSD, 105...Riser card, 106...I / O board, 110...casing, 111...front cover, 112...rear cover 113...I / O panel, 161~167...Ventilation holes, 200...Cooling device, 1...Duct, 10...Top plate, 11...Air intake, 12... Exhaust port, 121... Upper exhaust port, 122... Lower exhaust port, 13...branch wall, 131...upper wall section, 132...lower wall section, 15-18... Side wall (first wall section), 2...heatsink, 21...base, 22...fins, 25...virtual plane 3...Fan (first air blower), 31...Rotating shaft, 32...First discharge surface, 4...Fan (second air blower), 41...Rotating shaft, 42...Second discharge surface, 5,501,502...partition members, 50... Partition wall (second wall section), 51...Separation wall (first separation wall), 52...Separation wall (second separation wall), 59...bottom plate, 591...rear end surface, 61-64...flow channels, 81...frame, 82...frame, 84...string spring, D...Diameter, W...Width, θ...Angle. [Prior art documents] [Patent Documents]

[0083] [Patent Document 1] Japanese Patent Publication No. 2003-283171

Claims

1. A heat sink with multiple fins arranged in the thickness direction on the base where heat from electronic components is conducted, A first air blower unit that creates an airflow between the fins by blowing air through rotation and has a first discharge surface that discharges the air toward the heat sink, A second air blower is installed adjacent to the first air blower, and it has a second discharge surface that discharges the air toward the heat sink, and it creates an airflow between the fins by blowing air through rotation, A duct covering the heat sink, the first air blower and the second air blower, having an intake port on the upstream side and an exhaust port on the downstream side in the direction of airflow by the first air blower and the second air blower, A partition member having a metal bottom plate positioned between the first and second air blowers and the heat sink, in contact with the base portion and through which heat from the base portion is conducted, and a metal partition wall erected on the bottom plate, dividing the space above the bottom plate from between the first and second discharge surfaces to either of the fins, Equipped with, The bottom plate and the base portion are in contact at their end faces, the end faces are opposing slopes, and a heat-conducting material is in contact between the slopes in a cooling device for electronic equipment.

2. The partition member further divides the space separated by the partition wall, and further comprises one or more separating walls that divide the space from the central part of the first air blower and the second air blower to either of the fins. The separation wall is installed at a position corresponding to the angle formed by the first discharge surface and the second discharge surface. Cooling device for electronic equipment according to claim 1.

3. The separation wall is positioned or angled such that the airflow rate or velocity between the fins, which are erected at the base portion where the electronic components are in contact, is greater than the airflow rate or velocity around the other fins, thereby separating the space from the first and second air blowers to the heat sink. Cooling device for electronic equipment according to claim 2.

4. The partition member is formed by processing a plate-shaped metal material by hemming and bending, so that each part is continuously formed. A cooling device for electronic equipment according to any one of claims 1 to 3.

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