PCB supports, PCB tables, and methods

Abstract

To provide a substrate support that can be cheaper to maintain and that can reduce the length of downtime required for service when wear occurs.SOLUTION: A substrate support for supporting a substrate in a lithographic apparatus includes: a first support body 21 configured to support a substrate W; a main body 22 separate from the first support body and configured to support the first support body, the main body comprising a thermal conditioner 60 configured to thermally condition the main body, the support body and / or the substrate; and an extractor body 100 surrounding the main body and the support body, where the extractor body comprises a first extraction channel 102 configured to extract fluid from near a peripheral part of the substrate.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] [Cross-reference to Related Applications] This application claims the priority of European Application No. 20158919.9 filed on February 24, 2020 and European Application No. 20163571.1 filed on March 17, 2020, the entire contents of which are incorporated herein by reference.

[0002] [Technical Field] The present invention relates to a substrate support for supporting a substrate in a lithographic apparatus, a substrate table, a method for supporting a substrate, and a device manufacturing method.

Background Art

[0003] A lithographic apparatus is an apparatus configured to apply a desired pattern onto a substrate. A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). A lithographic apparatus may project a pattern of a patterning device (e.g., a mask) (often also referred to as a “design layout” or “design”) onto a layer of radiation-sensitive material (resist) provided on a substrate (e.g., a wafer). Known lithographic apparatuses include so-called steppers in which each target portion is irradiated by exposing the entire pattern once onto the target portion, and so-called scanners in which each target portion is irradiated by simultaneously scanning the substrate parallel or non-parallel to this direction while scanning the pattern in a predetermined direction (“scan” direction) through a radiation beam.

[0004] As semiconductor manufacturing processes continue to advance, the size of circuit elements has steadily decreased over the past few decades, while the quantity of functional elements such as transistors per device has steadily increased, following a trend commonly referred to as "Moore's Law." The semiconductor industry is pursuing technologies that enable the generation of increasingly smaller features to keep pace with Moore's Law. To project patterns onto a substrate, lithography equipment may use electromagnetic radiation. The wavelength of this radiation determines the minimum size of the features that can be patterned on the substrate. Typical wavelengths currently in use are 365 nm (i-line), 248 nm, 193 nm, and 13.5 nm.

[0005] Further improvements in the resolution of smaller features may be achieved by providing an immersion fluid, such as water, with a relatively high refractive index on the substrate during exposure. The effect of the immersion fluid is that the exposure radiation in the fluid has shorter wavelengths than that in the gas, enabling imaging of smaller features. The effect of the immersion fluid also increases the effective numerical aperture (NA) of the system and increases the depth of focus. [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] The immersion fluid may be restricted to a localized area between the projection system and the substrate of the lithography apparatus by a fluid handling structure. Rapid relative movement between the substrate and the restricted immersion fluid can cause leakage of the immersion fluid from the localized area. Such leakage is undesirable and can lead to defects on the substrate. This limits the speed at which the substrate is stepped or scanned relative to the projection system. This, in turn, limits the throughput of the lithography apparatus.

[0007] During the semiconductor manufacturing process, substrates are supported on substrate supports. Over time, substrate supports wear out and need to be replaced. The objective of this invention is to provide substrate supports that can be maintained at a lower cost and reduce the length of downtime required for servicing when they wear out. [Means for solving the problem]

[0008] The present invention provides a substrate support for supporting a substrate in a lithography apparatus. The substrate support comprises a first support configured to support a substrate; a body separated from the first support and configured to support the first support, the body comprising a thermal conditioner configured to thermally adjust the body, the support, and / or the substrate; and a take-out body surrounding the body and the support, comprising a first take-out channel configured to take out fluid from near the periphery of the substrate.

[0009] According to the present invention, a substrate table comprising a substrate stage and a substrate support is also provided.

[0010] The present invention also provides a method for supporting a substrate on a substrate support in a lithography apparatus. This method comprises supporting the substrate on a first support of the substrate support; supporting the first support on a body separated from the first support; thermally conditioning the body, support and / or substrate with a thermal conditioner of the body; and extracting fluid from near the periphery of the substrate through a first extraction channel of an extraction body surrounding the body and support.

[0011] The present invention also provides a method for replacing a first support of a substrate support for supporting a substrate in a lithography apparatus. This method comprises connecting a carrier plate to a first support such that the carrier plate covers pinholes penetrating the first support in the thickness direction of the first support; extending a plurality of pins through each pinhole such that the pins support the carrier plate on their ends and the pins penetrate the body of the substrate support below the first support; and controlling the movement of the pins to lower the first support onto the body or to raise the first support from the body.

[0012] The present invention also provides a method for manufacturing a device using a lithography apparatus. This method comprises projecting a beam patterned by a patterning device onto a substrate while the substrate is supported by a substrate support, and performing a method for supporting the substrate in a lithography apparatus, or a method for replacing a first support of a substrate support for supporting the substrate in a lithography apparatus.

[0013] Further embodiments, features, and advantages of the present invention, as well as the structure and operation of various embodiments, features, and advantages of the present invention, are described in detail below with reference to the accompanying drawings. [Brief explanation of the drawing]

[0014] Hereafter, embodiments of the invention will be described for illustrative purposes only, with reference to the following accompanying schematic diagrams in which the corresponding reference numerals represent the corresponding parts. Figure 1 shows a schematic diagram of a lithography apparatus. Figures 2 and 3 show cross-sectional views of two different versions of a fluid handling system for use in a lithography projection apparatus. Figure 4 shows a section of the lithography apparatus. Figure 5 shows a substrate support according to an embodiment of the invention. Figure 6 shows a substrate support related to a comparative example. Figures 7 to 11 show different versions of the substrate support according to the invention. Figures 12 and 13 show different versions of the height adjustment mechanism for embodiments of the invention. Figure 14 is a schematic cross-sectional view of a carrier plate connected to a first support according to an embodiment of the invention. Figure 15 is a schematic cross-sectional view of the assembly shown in Figure 14, lowered onto the main body according to an embodiment of the invention. Figure 16 is a schematic cross-sectional view of the carrier plate separated from the first support shown in Figures 14 and 15. Figure 17 is a schematic cross-sectional view of a carrier plate connected to a first support according to an embodiment of the invention. Figure 18 is a schematic cross-sectional view of a carrier plate connected to a first support according to an embodiment of the invention. Figure 19 is a schematic cross-sectional view of a carrier plate connected to a first support according to an embodiment of the invention. Figure 20 is a schematic cross-sectional view of a mechanism for connecting a carrier plate to a first support according to an embodiment of the invention. Figure 21 is a schematic cross-sectional view of the process of separating the carrier plate shown in Figure 20 from the first support. Figure 22 is a schematic cross-sectional view of the carrier plate separated from the first support shown in Figure 20. Figure 23 is a schematic cross-sectional view of a mechanism for connecting a carrier plate to a first support according to an embodiment of the invention. Figure 24 is a schematic cross-sectional view of the process of separating the carrier plate shown in Figure 23 from the first support. Figure 25 is a schematic cross-sectional view of the carrier plate separated from the first support shown in Figure 23. Figure 26 is a schematic plan view of the first support according to an embodiment of the invention. Figure 27 is a schematic plan view of the first support according to an embodiment of the invention, which is being held for handling. Figure 28 is a schematic plan view of the first support according to an embodiment of the invention, which is being held for handling.

[0015] The features shown are not necessarily to scale and are not limited to the sizes and / or arrangements shown. The figures are understood to include optional features that are not essential to the invention. Further, not all features of the device are shown in each of the figures, and the figures may show only some of the relevant components in describing a particular feature.

Best Mode for Carrying Out the Invention

[0016] In this document, the terms “radiation” and “beam” are used to encompass all types of electromagnetic radiation, including ultraviolet radiation (e.g., having wavelengths of 365, 248, 193, 157, or 126 nm).

[0017] As used in this text, the terms “reticle,” “mask,” or “patterning device” may be broadly construed to represent a general patterning device that can be used to impart a patterned cross-section to an incident radiation beam corresponding to a pattern created in a target portion of a substrate. The term “light valve” may also be used in this context. Examples of such other patterning devices include programmable mirror arrays and programmable LCD arrays, in addition to classical masks (transmission or reflection, binary, phase-shift, hybrid, etc.).

[0018] Figure 1 schematically shows a lithographic apparatus. The lithographic apparatus comprises an illumination system (also referred to as an illuminator) IL configured to condition a radiation beam B (e.g., UV radiation or DUV radiation), a mask support (e.g., a mask table) MT connected to a first positioner PM configured to support a patterning device (e.g., a mask) MA and accurately position the patterning device MA in accordance with certain parameters, a substrate support (e.g., a substrate table) WT connected to a second positioner PW configured to hold a substrate (e.g., a wafer coated with resist) W and accurately position the substrate support WT in accordance with certain parameters, and a projection system (e.g., a refractive projection lens system) PS configured to project a pattern formed in the radiation beam B by the patterning device MA onto a target portion C (e.g., including one or more dies) of the substrate W.

[0019] During operation, the illumination system IL receives the radiation beam B from a radiation source SO, e.g., via a beam delivery system BD. The illumination system IL may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic and / or other types of optical components, or any combination thereof, for directing, shaping and / or controlling the radiation. The illuminator IL may be used to condition the radiation beam B such that it has a desired spatial and angular intensity distribution in the plane and in the cross-section of the patterning device MA.

[0020] As used herein, the term "projection system" PS should be broadly interpreted as encompassing various types of projection systems, including refractive, reflective, catadioptric, anamorphic, magnetic, electromagnetic and / or electrostatic optical systems, or any combination thereof, that are appropriate for the exposure radiation in use and / or for other elements, such as the use of a liquid immersion fluid or a vacuum. The use of the term "projection lens" herein may be interpreted as synonymous with the more general term "projection system" PS.

[0021] The lithography apparatus is of a type in which at least a portion of the substrate W may be covered with an immersion liquid such as water having a relatively high refractive index in order to fill the immersion space 11 between the projection system PS and the substrate W (also referred to as immersion lithography). More information on immersion technology is given in US6,952,253, which is incorporated herein by reference.

[0022] The lithography apparatus may also be of a type having two or more substrate support WTs (also called a “dual-stage” apparatus). In such a “multi-stage” apparatus, the substrate support WTs may be used in parallel, and / or, while one substrate W is being used on the other substrate support WT to expose a pattern on the other substrate W, the preparation steps for subsequent exposure of the substrate W may be performed on the substrate W located on one of the substrate support WTs.

[0023] In addition to the substrate support WT, the lithography apparatus may include a measurement stage (not shown). The measurement stage is provided to hold sensors and / or cleaning devices. The sensors may be provided to measure the characteristics of the projection system PS or the characteristics of the radiating beam B. The measurement stage may hold multiple sensors. The cleaning devices may be provided to clean parts of the lithography apparatus, such as parts of the projection system PS or parts of the system that provides the immersion fluid. The measurement stage may move under the projection system PS when the substrate support WT is separated from the projection system PS.

[0024] During operation, the radiant beam B is incident on a patterning device such as a mask MA held on a mask support MT, and a pattern is formed by the pattern (design layout) present on the patterning device MA. After passing through the mask MA, the radiant beam B passes through a projection system PS that focuses the beam onto a target portion C of the substrate W. A second positioner PW and a position measurement system IF can precisely drive the substrate support WT to position different target portions C at focusing and alignment positions along the path of the radiant beam B, for example. Similarly, a first positioner PM and other appropriate position sensors (not explicitly shown in Figure 1) may be used to precisely position the patterning device MA relative to the path of the radiant beam B. The patterning device MA and the substrate W may be aligned using mask alignment marks M1, M2 and substrate alignment marks P1, P2. The illustrated substrate alignment marks P1, P2 occupy dedicated target portions, but they may be located in the spaces between target portions. The substrate alignment marks P1 and P2, positioned between target portions C, are known as scribe line alignment marks.

[0025] To illustrate the invention, the Cartesian coordinate system is used. The Cartesian coordinate system has three axes: the x-axis, the y-axis, and the z-axis. Each of the three axes is orthogonal to the other two axes. A rotation around the x-axis is denoted as Rx rotation. A rotation around the y-axis is denoted as Ry rotation. A rotation around the z-axis is denoted as Rz rotation. The x-axis and y-axis define the horizontal plane, and the z-axis defines the vertical direction. The Cartesian coordinate system is not limiting to the invention and is used solely for illustrative purposes. Alternatively, other coordinate systems, such as the cylindrical coordinate system, may be used to illustrate the invention. For example, the orientation of the Cartesian coordinate system may be different, such that the z-axis has a component along the horizontal plane.

[0026] Immersion technology has been introduced into lithography systems to enable improved resolution of smaller features. In an immersion lithography apparatus, a liquid layer of immersion fluid with a relatively high refractive index is interposed in the immersion space 11 between the apparatus's projection system PS (through which a patterned beam is projected toward the substrate W) and the substrate W. The immersion fluid covers at least a portion of the substrate W below the final element of the projection system PS. Thus, at least a portion of the substrate W is immersed in the immersion fluid during exposure.

[0027] In commercially available immersion lithography, the immersion fluid is water. This water is typically high-purity distilled water, such as ultrapure water (UPW), commonly used in semiconductor manufacturing plants. In immersion systems, the UPW is frequently purified and may require additional processing steps before being supplied as the immersion fluid to the immersion space 11. Other liquids with high refractive indices, such as hydrocarbons (including fluorinated hydrocarbons) and / or aqueous solutions, can also be used as immersion fluids. Furthermore, other fluids besides liquids are also expected to be used in immersion lithography.

[0028] In this specification, references are made in descriptions of localized immersion in which the immersion fluid being used is confined to an immersion space 11 between the final element and the surface facing the final element. The opposing surface is the surface of the substrate W or the surface of the support stage (or substrate support WT) that is coplanar with the surface of the substrate W (in the following text, unless otherwise specified, references to the surface of the substrate W also refer to the surface of the substrate support WT, and vice versa). A fluid handling structure IH located between the projection system PS and the substrate support WT is used to confine the immersion fluid to the immersion space 11. The immersion space 11, filled with the immersion fluid, is smaller than the outermost surface of the substrate W in plan view, and the immersion space 11 remains substantially stationary relative to the projection system PS while the substrate W and substrate support WT move below.

[0029] Other immersion systems are also anticipated, such as unrestricted immersion systems (so-called "all-wet" immersion systems) and bath-type immersion systems. In an unrestricted immersion system, the immersion liquid covers more than the surface beneath the final element. The liquid outside the immersion space 11 exists as a thin liquid film. The liquid may cover the entire surface of the substrate W or the substrate W and the substrate support WT coplanar with the substrate W. In a bath-type system, the substrate W is completely immersed in the bath of immersion liquid.

[0030] A fluid handling structure IH is a structure that restricts immersion fluid to the immersion space 11 by supplying immersion fluid to the immersion space 11 and removing immersion fluid from the immersion space 11. It includes features that are part of a fluid supply system. The arrangement disclosed in PCT Patent Application Publication No. WO99 / 49504 is an early fluid handling structure comprising a pipe that supplies or collects immersion fluid from the immersion space 11 and operates in accordance with the relative movement of the stage under the projection system PS. In newer designs, the fluid handling structure extends along at least a portion of the boundary of the immersion space 11 between the final element of the projection system PS and the substrate support WT or substrate W, and partially defines the immersion space 11.

[0031] A fluid handling structure (IH) may have a choice of different functions. Each function may be derived from a corresponding feature that enables the fluid handling structure (IH) to perform that function. A fluid handling structure (IH) may be described by many different terms that represent its function, such as barrier member, seal member, fluid supply system, fluid removal system, liquid limiting structure, etc.

[0032] The fluid handling structure IH as a barrier member is a barrier against the flow of immersion fluid from the immersion space 11. As a liquid limiting structure, the structure limits the immersion fluid to the immersion space 11. The sealing feature of the fluid handling structure IH as a seal member forms a seal for limiting the immersion fluid to the immersion space 11. The sealing feature may include additional gas flow from an opening on the surface of the seal member, such as a gas knife.

[0033] In one embodiment, the fluid handling structure IH may supply immersion fluid as a fluid supply system.

[0034] In one embodiment, the fluid handling structure IH may, at least partially, restrict the immersion fluid as a fluid limiting system.

[0035] In one embodiment, the fluid handling structure IH may provide a barrier to the immersed fluid as a barrier member such as a fluid limiting structure.

[0036] In one embodiment, the fluid handling structure IH may generate or use a gas flow to assist, for example, in controlling the flow and / or position of an immersed fluid.

[0037] The gas flow may form a seal to restrict the immersed fluid, and the fluid handling structure IH may be represented as a seal member. Such a seal member may also be a fluid limiting structure.

[0038] In one embodiment, an immersion liquid is used as the immersion fluid. In this case, the fluid handling structure IH may be a liquid handling system. By reference to the above description, references to features defined in relation to fluids in these paragraphs are understood to include features defined in relation to liquids.

[0039] The lithography apparatus has a projection system PS. During exposure of a substrate W, the projection system PS projects a beam of patterned radiation onto the substrate W. To reach the substrate W, the path of the radiation beam B is from the projection system PS, through an immersion liquid restricted by a fluid handling structure IH between the projection system PS and the substrate W. The projection system PS has a lens element that contacts the immersion liquid at the end of the beam path. This lens element that contacts the immersion liquid may be referred to as the "final lens element" or "final element". The final element is at least partially surrounded by the fluid handling structure IH. The fluid handling structure IH may restrict the immersion liquid below the final element and above the opposing surface.

[0040] As shown in Figure 1, in one embodiment, the lithography apparatus includes a controller 500. The controller 500 is configured to control the substrate table WT.

[0041] Figure 2 schematically illustrates a localized liquid supply system or fluid handling system. The liquid supply system is provided with a fluid handling structure IH (or liquid limiting structure) that extends along at least a portion of the boundary of the space 11 between the final element of the projection system PS and the support table WT or substrate W. The fluid handling structure IH is substantially stationary in the XY plane relative to the projection system PS, although relative movement in the Z direction (direction of the optical axis) is possible. In this example, a seal, which may be a non-contact seal such as a gas seal (such a system having a gas seal is disclosed in EP1,420,298) or a liquid seal, is formed between the fluid handling structure IH and the surface of the substrate W.

[0042] The fluid handling structure IH restricts the immersion fluid to the space 11 between the final element of the projection system PS and the substrate W, at least partially. The space 11 is at least partially formed by the fluid handling structure IH located below and surrounding the final element of the projection system PS. The immersion fluid is supplied into the space 11 below the projection system PS and within the fluid handling structure IH through one liquid opening 13. The immersion fluid may be removed by another liquid opening 13. The immersion fluid may be supplied into the space 11 through at least two liquid openings 13. Which liquid opening 13 is used to supply the immersion fluid, and optionally which is used to remove the immersion fluid, may depend on the direction of movement of the support table WT.

[0043] The immersion fluid may be restricted to the space 11 by a non-contact seal, such as a gas seal 16, formed by gas that forms between the bottom of the fluid handling structure IH and the surface of the substrate W during use. The gas in the gas seal 16 is supplied pressurized through an inlet 15 into the gap between the fluid handling structure IH and the substrate W. The gas is withdrawn through an outlet 14. The positive pressure in the gas inlet 15, the vacuum level in the outlet 14, and the geometric arrangement of the gap are adjusted to produce a high-speed gas flow inward that restricts the immersion fluid. Such a system is disclosed in its entirety in US2004 / 0207824, which is incorporated herein by reference. In one example, the fluid handling structure IH does not have a gas seal 16.

[0044] Figure 3 is a side cross-sectional view showing a further liquid supply system or fluid handling system according to the embodiment. The arrangement illustrated in Figure 3 and described below may be applied to the lithography apparatus described above and illustrated in Figure 1. The liquid supply system is provided together with a fluid handling structure IH (or liquid limiting structure) that extends along at least a portion of the boundary of the space 11 between the final element of the projection system PS and the support table WT or substrate W.

[0045] The fluid handling structure IH restricts the immersion fluid at least partially to the space 11 between the final element of the projection system PS and the substrate W. The space 11 is at least partially formed by the fluid handling structure IH located below and surrounding the final element of the projection system PS. In an example, the fluid handling structure IH comprises a main member 53 and a porous member 33. The porous member 33 is plate-like and has multiple holes (i.e., openings or micropores). In one embodiment, the porous member 33 is a mesh plate formed by a mesh of numerous small holes 84. Such a system is disclosed in its entirety in US2010 / 0045949A1, which is incorporated herein by reference.

[0046] The main body member 53 includes a supply port 72 capable of supplying immersion liquid to the space 11 and a recovery port 73 capable of recovering immersion liquid from the space 11. The supply port 72 is connected to a liquid supply device 75 via a flow path 74. The liquid supply device 75 can supply immersion liquid to the supply port 72 through the corresponding flow path 74. The recovery port 73 can recover immersion liquid from the space 11. The recovery port 73 is connected to a liquid recovery device 80 via a flow path 79. The liquid recovery device 80 recovers the immersion liquid recovered through the recovery port 73 via the flow path 79. The porous member 33 is positioned at the recovery port 73. By performing a liquid supply operation using the supply port 72 and a liquid recovery operation using the porous member 33, a space 11 is formed with one side between the projection system PS and the fluid handling structure IH and the other side having the substrate W.

[0047] Figure 4 illustrates a portion of a lithography apparatus useful for understanding embodiments of the present invention. The arrangement illustrated in Figure 4 and described below may be applied to the lithography apparatus described and illustrated above in Figure 1. Figure 4 is a cross-section of a substrate support 20 and a substrate W. In one embodiment, the substrate support 20 comprises one or more adjustment channels 61 of a thermal conditioner 60, which is described in more detail below. A gap 5 exists between the edge of the substrate W and the edge of the substrate support 20. When the edge of the substrate W is imaged, or at other times such as when the substrate W first moves under the projection system PS (as described above), the immersion space 11, filled with liquid by a fluid handling structure IH (e.g.), passes at least partially through the gap 5 between the edge of the substrate W and the edge of the substrate support 20. Thus, liquid from the immersion space 11 can flow into the gap 5.

[0048] The substrate W is held by a first support 21 (e.g., a pimple or pry bar table) having one or more protrusions 41 (i.e., crowbars). The first support 21 is an example of an object holder. Another example of an object holder is a mask holder. The negative pressure applied between the substrate W and the substrate support 20 can ensure that the substrate W is securely held in place. However, if immersion liquid enters between the substrate W and the first support 21, it can cause difficulties, particularly when removing the substrate W.

[0049] To address the immersion liquid flowing into the gap 5, at least one drain 10, 12 is provided at the edge of the substrate W to remove the immersion liquid that has flowed into the gap 5. There may be only one drain or more than two, but in one embodiment of Figure 4, two drains 10, 12 are illustrated. In one embodiment, each of the drains 10, 12 is annular, surrounding the entire periphery of the substrate W.

[0050] The primary function of the first drain 10 (located radially outside the edge of the substrate W / first support 21) is to prevent air bubbles from entering the immersion space 11 where the liquid of the fluid handling structure IH is present. Such bubbles can adversely affect imaging of the substrate W. The first drain 10 exists to prevent gas in the gap 5 from escaping into the immersion space 11 of the fluid handling structure IH. Gas that escapes into the immersion space 11 can result in bubbles floating within the immersion space 11. If such bubbles are in the path of the projection beam, it can lead to imaging errors. The first drain 10 is configured to remove gas from the gap 5 between the edge of the substrate W and the edge of the recess in the substrate support 20 on which the substrate W is placed. The edge of the recess in the substrate support 20 may optionally be defined by a covering 101 that is separated from the first support 21 of the substrate support 20. The covering 101 may be ring-shaped in plan view or may surround the outer circumference of the substrate W. The first drain 10 extracts most of the gas and a very small amount of immersion liquid.

[0051] The second drain 12 (located radially inside the edge of the substrate W / first support 21) is provided to prevent liquid from entering below the substrate W through the gap 5 so as not to hinder the efficient release of the substrate W from the substrate table WT after imaging. By providing the second drain 12, problems that may arise from liquid entering below the substrate W are reduced or eliminated.

[0052] As shown in Figure 4, in one embodiment, the lithography apparatus includes a first take-off channel 102 which serves as a two-phase flow channel. The first take-off channel 102 is formed within a block. The first and second drains 10 and 12 are provided with their respective openings 107 and 117 and their respective take-off channels 102 and 113. The take-off channels 102 and 113 allow fluid to flow between their respective openings 107 and 117 through their respective flow channels 103 and 114.

[0053] As shown in Figure 4, the covering 101 has an upper surface. The upper surface extends circumferentially around the substrate W on the first support 21. When the lithography apparatus is in use, the fluid handling structure IH moves relative to the substrate support 20. During this relative movement, the fluid handling structure IH passes through the gap 5 between the covering 101 and the substrate W. In one embodiment, the relative movement is provided by the substrate support 20 moving below the fluid handling structure IH. In an alternative embodiment, the relative movement is provided by the fluid handling structure IH moving above the substrate support 20. In a further alternative embodiment, the relative movement is provided by both the movement of the substrate support 20 below the fluid handling structure IH and the movement of the fluid handling structure IH above the substrate support 20. In the following description, movement of the fluid handling structure IH is used to mean the relative movement of the fluid handling structure IH with respect to the substrate support 20.

[0054] Figure 5 is a schematic diagram of a substrate support 20 according to an embodiment of the invention. The substrate support 20 is for supporting a substrate W in a lithography apparatus (for example, the lithography apparatus shown in Figure 1). During the exposure process, the substrate W is supported on the substrate support 20. Between multiple exposure processes, the substrate W on the substrate support 20 may be replaced. During this time, the substrate support 20 may not support any substrate W at all.

[0055] As shown in Figure 5, in one embodiment, the substrate support 20 comprises a first support 21. The first support 21 is configured to support the substrate W. When the substrate W is supported by the substrate support 20, the substrate W is in direct contact with the first support 21. The first support 21 is part of the substrate support 20 that physically supports the underside of the substrate W. As shown in Figure 5, in one embodiment, the first support 21 comprises a plurality of crowbars 41. The ends of the crowbars 41 form a surface on which the underside of the substrate W is supported. The underside of the substrate W is in contact with the ends of the crowbars 41. The crowbars 41 are located on the upper side of the first support 21.

[0056] As shown in Figure 5, in one embodiment, there is a space 42 between the lower side of the substrate W and the upper base surface (between the multiple bars 41) of the first support 21. In one embodiment, the substrate support 20 includes a clamp configured to hold the substrate W on the first support 21. For example, as shown in Figure 5, in one embodiment, the substrate support 20 includes a clamp with a clamp channel 43. The clamp channel 43 is configured to extract gas from the space 42 between the substrate W and the first support 21. The clamp channel 43 allows fluid to flow between and the space 42. As shown in Figure 5, in one embodiment, the clamp channel 43 allows fluid to flow between and the space 42 through one or more clamp channels 44. In one embodiment, the clamp channel 43 has an annular shape surrounding the center of the substrate support 20. The clamp channel 43 extends circumferentially. In one embodiment, multiple clamp channels 44 extend vertically to connect the clamp channel 43 to the space 42.

[0057] As shown in Figure 5, in one embodiment, the substrate support 20 comprises a body 22. The body 22 is separated from the first support 21. The first support 21 can be separated from the body 22 without substantially damaging the body 22. The first support 21 may be removed from the body 22 or repositioned on the body 22. The body 22 is configured to support the first support 21.

[0058] During use, the substrate support 20 will wear out. For example, the ends of the crowbar 41 will wear out over time. Even if the crowbar 41 wears out, it is not necessary to replace the entire substrate support 20; only the first support 21 may be replaced. For example, the first support 21 may be replaced without replacing the main body 22. In one embodiment, the first support 21 is removed from the main body 22. The replaced first support 21 is placed on the main body 22. The exposure process is then continued using the replaced first support 21. Embodiments of the invention are expected to reduce the cost of maintaining the availability of the substrate support 20.

[0059] The first support 21 can be replaced more quickly compared to replacing the entire substrate support 20. Embodiments of the invention are expected to reduce the downtime of the lithography apparatus required to maintain the substrate support 20.

[0060] As shown in Figure 5, in one embodiment, the main body 22 includes a thermal conditioner 60. In one embodiment, the thermal conditioner 60 is configured to thermally adjust the main body 22. In addition or alternatively, the thermal conditioner 60 is configured to thermally adjust the first support 21. In addition or alternatively, the thermal conditioner 60 is configured to thermally adjust the substrate W. By thermally adjusting the main body 22, the first support 21 and / or the substrate W, the temperature profile can be controlled. In particular, deformation caused by thermal fluctuations can be reduced. By reducing deformation, the accuracy of the exposure process can be improved.

[0061] The method by which the thermal conditioner 60 provides thermal conditioning is not particularly limited. As just one example, in one embodiment, as shown in Figure 5, the thermal conditioner 60 comprises one or more regulating channels 61. The regulating channels 61 may penetrate the body 22. In one embodiment, the regulating channels 61 contain a fluid (e.g., gas and / or liquid).

[0062] As shown in Figure 1, in one embodiment, the lithography apparatus includes a controller 500. In one embodiment, the controller 500 is configured to control a flow or fluid through one or more adjustment channels 61. In one embodiment, the controller 500 is configured to control the flow of a fluid through the adjustment channels 61 to control the temperature profile of a target object (e.g., a body 22, a first support 21, and / or a substrate W).

[0063] As shown in Figure 5, in one embodiment, the thermal conditioner 60 includes one or more sensors 62. In one embodiment, the sensors 62 are attached to or embedded in the main body 22. In one embodiment, the sensors 62 are temperature sensors. In one embodiment, the sensors 62 may be configured to measure the temperature of the fluid flowing through the regulating channel 61. In one embodiment, multiple sensors 62 are provided at different locations along the regulating channel 61 to detect a temperature profile across the regulating channel 61.

[0064] As shown in Figure 5, in one embodiment, the thermal conditioner 60 comprises one or more heaters 63. As shown in Figure 5, in one embodiment, the heaters 63 are mounted on the underside of the body 22. However, the heaters 63 may be located on other surfaces of the body 22 or the first support 21. In addition or alternatively, sensors may be provided on the surface of the body 22 and / or the first support 21. In one embodiment, the controller 500 is configured to receive signals from the sensor 62 and subsequently to control the fluid flow through the heaters 63 and / or the regulating channel 61.

[0065] In the substrate support 20, the function of physically supporting (and clamping) the substrate W is performed by the first support 21. On the other hand, the thermal stabilization function is performed by the main body 22. The first support 21 is separated from the main body 22. The function of supporting the substrate W and the function of thermal stabilization are separated into different components. If one function is lost (or can no longer meet the required level of performance), the corresponding component can be replaced without other components being replaced. Embodiments of the invention are expected to facilitate the maintenance of the substrate support 20 so that the functions performed meet the required level.

[0066] As shown in Figure 5, in one embodiment, the substrate support 20 includes an extraction body 100. The extraction body 100 surrounds the main body 22 and the first support 21. The extraction body 100 is radially outside the main body 22 and the first support 21. As shown in Figure 5, in one embodiment, the extraction body 100 is provided as a component separate from the main body 22. However, it is not essential that the extraction body 100 is separate from the main body 22 and the first support 21. As will be described in more detail later, the extraction body 100 may be part of the same component as the main body 22. In such embodiments, the extraction body 100 cannot be replaced unless it is together with the main body 22 (and vice versa). In one embodiment, for example, as shown in Figures 7 to 10, the extraction body 100 is part of the same component as the main body 22. The extraction body 100 may be formed integrally with the main body 22. The extraction body 100 and the main body 22 are formed together as a single component. The extraction unit 100 and the main body 22 are inseparable from each other. In an alternative embodiment, the extraction unit 100 is formed integrally with the substrate stage 26.

[0067] As shown in Figure 5, in one embodiment, the extraction body 100 includes a first extraction channel 102. In one embodiment, the extraction body 100 includes the first drain 10 described above. The first extraction channel 102 is configured to extract fluid from near the periphery of the substrate W. As shown in Figure 5, in one embodiment, the first extraction channel 102 is configured to extract fluid from the radially outer periphery of the substrate W. The first extraction channel 102 is configured to remove bubbles that may occur in the immersion fluid used in the lithography apparatus. The first extraction channel 102 contributes to reducing image defects by reducing bubbles and / or, for example, by reducing the occurrence of watermarks.

[0068] As described above, the extractor 100 is configured to reduce the problem of defects. The function performed by the extractor 100 may differ from the function performed by the first support 21 and the main body 22. If one function is lost or the required level of performance can no longer be met, the corresponding component (e.g., the extractor 100, the first support 21, or the main body 22) may be replaced without other components of the substrate support 20 being replaced.

[0069] Figure 6 schematically shows a substrate support 20 according to a comparative example. In the comparative example shown in Figure 6, both the function of supporting (and clamping) the substrate W and the function of thermally adjusting the substrate W are performed by the same component. Therefore, if the tip of the crowbar 41 is worn out, the entire body 22, including both the thermal conditioner 60 and the crowbar 41 supporting the substrate W, must be replaced. For example, even if the thermal conditioner 60 is still functioning normally and does not need to be replaced, the entire body 22 will need to be replaced.

[0070] As shown in Figure 5, in one embodiment, a seal member 27 is provided to seal the gap between the substrate support 20 and the substrate stage 26 supporting the substrate support 20. In the comparative example shown in Figure 6, the seal member 27 also needs to be removed and replaced when the substrate support 20 is replaced. In contrast, in the embodiment shown in Figure 5, the take-up body 100 and the seal member 27 remain in place while the first support 21 and / or body 22 are replaced. Similarly, in embodiments where the take-up body 100 is part of the same component as the body 22, the take-up body 100 and the seal member 27 remain in place while the first support 21 is replaced. Embodiments of the invention are expected to reduce the time required to maintain the substrate support 20.

[0071] As shown in Figure 5, in one embodiment, the substrate support 20 includes a second support 23. The second support 23 is separated from the main body 22. The second support 23 is configured to support the main body 22 on the substrate stage 26. In one embodiment, the main body 22 is in physical contact with the second support 23. For example, in one embodiment, the lower side of the main body 22 is supported on the upper side of the second support 23. The second support 23 is supported on the substrate stage 26.

[0072] As shown in Figure 5, in one embodiment, the second support 23 comprises a plurality of crowbars 91. In one embodiment, the crowbars 91 of the second support 23 are longer than the crowbars 41 of the first support 21. The crowbars 91 protrude from the underside of the second support 23. These crowbars 91 extend toward the substrate stage 26 and are supported by the substrate stage 26. In one embodiment, the second support 23 is configured to reduce relative movement between the substrate support 20 and the substrate stage 26. The second support 23 is configured to reduce slippage between the substrate support 20 and the substrate stage 26. Significant acceleration occurs in the substrate stage 20 while using the lithography apparatus. If the substrate support 20 slips relative to the substrate stage 26, it can lead to undesirable overlay errors. The crowbars 91 are configured to grip the substrate stage 26 and reduce slippage of the substrate support 20 relative to the substrate stage 26.

[0073] The second support 23 can be physically separated from the main body 22 without damaging the main body 22 or the second support 23. One or the other of the main body 22 and the second support 23 can be replaced without replacing the other. For example, if the anti-slip function of the second support 23 can no longer meet the required performance level, the second support 23 can be replaced without replacing the main body 22. Embodiments of the invention are expected to reduce the cost of maintaining the substrate support 20.

[0074] In other examples, for instance, if the thermal conditioner 60 needs to be replaced, the main body 22 may be replaced. The main body 22 can be replaced without replacing (or substantially moving) the second support 23. Embodiments of the invention are expected to reduce the cost of maintaining the substrate support 20.

[0075] However, it is not essential that the substrate support 20 includes such a second support 23. For example, as shown in Figures 7 to 12, the function of reducing the slippage of the substrate support 20 relative to the substrate stage 26 may be performed by the main body 22. The crowbar 91 may be provided at the bottom of the main body 22.

[0076] As shown in Figures 5 and 7, for example, in one embodiment, the body 22 is provided with a plurality of crowbars 65 on its upper side. The crowbars 65 have ends in-plane. The crowbars 65 are configured to support the first support 21. By providing the crowbars 65 on the upper side of the body 22, the structure of the first support 21 can be kept simple. The lower side of the first support 21 may be flat and substantially featureless. The upper side of the first support is provided with crowbars 41 for supporting the substrate W. Embodiments of the invention are expected to enable the inexpensive manufacture of components for clamping the substrate W.

[0077] In addition, as shown in Figures 5 and 8 to 10, for example, in one embodiment, the first support 21 is provided with a plurality of sealing protrusions 46. The sealing protrusions 46 protrude from the upper side of the first support 21. The sealing protrusions 46 are shorter than the crowbar 41. The sealing protrusions 46 do not contact the substrate W. A small gap exists between the upper part of the sealing protrusions 46 and the lower part of the substrate W. In one embodiment, the sealing protrusions 46 extend circumferentially around the first support 21, i.e., each sealing protrusion 46 forms a ring. The sealing protrusions 46 are configured to reduce the amount of fluid passing through them.

[0078] However, it is not essential that the crowbars 65 be provided on the main body 22. For example, in an alternative embodiment shown in Figure 8, the first support 21 is provided with a plurality of crowbars 47 on its lower side. The crowbars 47 have ends in plane. The crowbars 47 are configured to contact the upper side of the main body 22. As shown in Figure 8, instead of the crowbars 65 provided on the main body 22, different sets of crowbars 47 may be provided on the lower side of the first support 21. During use, the crowbars 41, 47 may wear out before other parts of the substrate support 20 wear out. By providing both sets of crowbars 41, 47 on the first support 21, the crowbars can be replaced simply by replacing the first support 21 without replacing the main body 22. Embodiments of the invention are expected to reduce the cost of maintaining the substrate support 20.

[0079] As shown in Figure 5, in one embodiment, the take-out body 100 includes a second take-out channel 113, which is also shown in other figures. The second take-out channel 113 is part of the second drain 12. In one embodiment, the second take-out channel 113 is configured to take fluid from the radially inside of the first take-out channel 102. In one embodiment, the second take-out channel 113 is provided to prevent liquid from flowing under the substrate W. However, the provision of such a second take-out channel 113 is not essential. For example, Figure 10 shows an embodiment without a second take-out channel 113.

[0080] In one embodiment, to prevent the liquid from reaching the space 42 between the central portion W of the substrate and the first support 21, the second take-out channel 113 is configured to take the fluid from below the periphery of the substrate W. As shown in Figure 4, in one embodiment, the second take-out channel 113 is connected to the space below the periphery of the substrate W via one or more second channels 114. In one embodiment, the second take-out channel 113 extends circumferentially around the substrate support 20. In one embodiment, a plurality of second channels 114 are provided. The second channels 114 extend vertically between the second take-out channel 113 and just below the periphery of the substrate W.

[0081] As shown in Figure 5, in one embodiment, the second take-out channel 113 is isolated from the first take-out channel 102 by an open gap. The first take-out channel 102 and the second take-out channel 113 may be provided in separate units 24 and 25. The separate units 24 and 25 can be separated from each other without damaging either of them. The functions of reducing defect problems (performed by the first take-out channel 102) and preventing liquid from flowing under the substrate W (performed by the second take-out channel 113) may be performed by the separate units 24 and 25. One of the separate units 24 and 25 can be replaced without replacing the other. Embodiments of the invention are expected to reduce the cost of maintaining the substrate support 20.

[0082] As shown in Figure 7 (and also visible in Figures 5 and 8, for example), in one embodiment, the substrate support 20 comprises an inner seal 112 and an outer seal 111. The inner seal 112 is located radially inside the opening from which the second extraction channel 113 extracts fluid. The outer seal 111 is located radially outside the opening from which the second extraction channel 113 extracts fluid. The inner seal 112 and outer seal 111 protrude toward the underside of the substrate W. The inner seal 112 and outer seal 111 do not protrude so much as to come into contact with the substrate W during use together with the substrate support 20. Instead, small gaps exist between the top of the inner seal 112 and the substrate W, and between the top of the outer seal 111 and the substrate W. The inner seal 112 and outer seal 111 are configured so that liquid may be present between the seals 111 and the substrate W during use. This helps to prevent liquid from reaching the underside of the substrate W in the central part of the substrate W.

[0083] As shown in Figure 9, in one embodiment, the function of the inner seal 112 is performed by a sealing projection 46 on the upper side of the first support 21. This is an alternative to the arrangement shown in Figure 7, for example, in which the inner seal 112 is provided as a projection on the upper side of the main body 22. As shown in Figure 9, in one embodiment, an upper channel 49 is provided through the first support 21. The upper channel 49 is connected to a second channel 114 so that fluid is taken out into a second take-out channel 113 from below the periphery of the substrate W.

[0084] As shown in Figure 9, for example, in one embodiment, the body 22 is provided with a sealing projection 66. The sealing projection 66 is configured to reduce the possibility of moisture reaching the upper surface of the body 22. This reduces oxidation of the body 22.

[0085] As shown in Figure 10, in one embodiment, the substrate support 20 is not provided with a second take-off channel 113, for example, as shown in Figures 5 to 9. As shown in Figure 10, in one embodiment, an open gap or channel 115 is formed between the take-off body 100, the main body 22, and the first support 21. In one embodiment, the open gap or channel 115 allows fluid to flow to and from atmospheric pressure or a pressure source. In one embodiment, multiple channels 115 extend mainly vertically through the main body 22 (which may be part of the same components as the take-off body 100). In an alternative embodiment, the open gap extends circumferentially around the main body 22, and the take-off body 100 may be provided as a component separate from the main body 22. In one embodiment, a gas flow passes through the open gap or channel 115. The gas flow passes through a sealing projection 46 on the upper periphery of the first support 21. Providing a gas flow can reduce the possibility of liquid reaching the underside of the substrate W beyond the sealing projection 46. It is not necessary to provide a second take-off channel 113. The embodiments of the invention are expected to reduce the complexity of the substrate support 20. The embodiments of the invention are expected to facilitate the manufacturing of the substrate support 20.

[0086] As described and illustrated in Figures 5 and 7 to 10, the substrate support 20 can be modularized in various ways. As shown in Figure 11, in one embodiment, the take-up body 100 is provided together with both a first take-up channel 102 and a second take-up channel 113. The take-up body 100 is separated from both a first support 21 and a body 22. The body 22 is supported directly on the substrate stage 26 (i.e., without the second support 23). As shown in Figure 11, the inner seal 112 and outer seal 111 are provided as part of the take-up body 100. This reduces the radial dimension of the first support 21 (because the first support 21 does not require an additional sealing projection 46 to perform the function of the inner seal 112). This reduces the amount of substrate support 20 that needs to be replaced when a worn bar 41 needs to be replaced.

[0087] As shown in Figure 11, in one embodiment, the main body 22 extends below the outlet 100. The lower side of the outlet 100 is coupled to the main body 22. This facilitates control of the height of the outlet 100 relative to the first support 21. By more precisely controlling the height of the outlet 100, the reliability of the sealing function provided by the inner seal 112 and outer seal 111 is increased.

[0088] As shown in Figure 11, in one embodiment, one or more holes 119 are provided in the body 22. The holes 119 are configured to allow fluid to flow between the radial interior of the take-out body 100 and the gap between the body 22. The holes 119 may be connected to other holes extending through the substrate stage 26. The holes 119 are configured to provide atmospheric pressure or pressurized gas. By providing a gas flow passing upward through the holes 119, the possibility of liquid reaching below the central part of the substrate W is reduced. By providing a gas flow through the holes 119, the transfer of moisture to the first support 21 is reduced. By reducing the transfer of moisture to the first support 21, oxidation of the first support 21 is reduced.

[0089] In one embodiment, the hole 119 is configured to provide pressurized gas. By providing a pressurized gas flow, the lifting of the edges of the substrate W can be controlled. By controlling the lifting of the outer edge of the substrate W, wear of the outermost burl 41 of the first support 21 can be reduced. Embodiments of the invention are expected to reduce wear of the substrate support 20.

[0090] As shown in Figure 11, in one embodiment, an adhesive layer 104 is provided between the extraction body 100 and the main body 22. The adhesive layer 104 fixes the extraction body 100 to the main body 22. This facilitates control of the gap from the substrate W to the inner seal 112 and outer seal 111 of the extraction body 100.

[0091] In one embodiment, beads are dispersed in the adhesive layer 104. For example, glass beads may be dispersed in the adhesive. The size of the beads may be selected to provide the required height step between the top of the inner / outer seals 111, 112 and the top of the sealing projection 66 on the radially outer portion of the outermost surface of the body 22. In one embodiment, the beads have a diameter of, for example, 45 microns, 50 microns, or 55 microns.

[0092] As shown in Figure 11, in one embodiment, a fluid connection is maintained from the first / second take-out channels 102, 113 through the main body 22 (to which the take-out body 100 is attached) and then through the substrate stage 26. The fluid connection may also be maintained by a dogbone connector 105 and a ring 106. However, the connection between the take-out body 100 and the main body 22 for the purposes of the first / second take-out channels 102, 113 is not particularly limited.

[0093] It is not essential that the main body 22 extends below the take-up body 100. In an alternative embodiment, the lower side of the take-up body 100 is attached to the substrate stage 26. In one embodiment, the substrate table WT (comprising the substrate stage 26 and substrate support 20) includes a height adjustment mechanism 130. Alternative versions of the height adjustment mechanism 130 are shown, for example, in Figures 12 and 13. The height adjustment mechanism 130 is configured to provide finely adjustable height adjustment to obtain a suitable sealing gap between the take-up body 100 and the substrate W. The height adjustment mechanism 130 is configured to control the height of at least a portion of the take-up body 100 below the substrate W so that the take-up body 100 is configured to prevent liquid from reaching the central part of the substrate W and the first support 21.

[0094] As shown in Figure 12, in one embodiment, the height adjustment mechanism 130 includes an insert member 131. The insert member 131 is a block of material. The insert member 131 is provided between the underside of the take-out body 100 and the substrate stage 26. The insert member 131 is separated from the main body 22. The insert member 131 is a component that attaches the take-out body 100 to the substrate stage 26.

[0095] As shown in Figure 12, in one embodiment, the height adjustment mechanism 130 includes a fastener 132. For example, in one embodiment, the fastener 132 is a bolt. As shown in Figure 12, in one embodiment, the fastener 132 does not reach the substrate stage 26. The fastener 132 connects the take-up body 100 to the insert member 131.

[0096] As shown in Figure 12, in one embodiment, the take-out body 100 includes a projection 134 configured to engage with the insert member 131. As shown in Figure 12, in one embodiment, the insert member 131 is bonded to the substrate stage 26.

[0097] As shown in Figure 12, in one embodiment, the insert member 131 is configured with a notch 133 such that the insert member 131 is compressed when the fastener 132 connects the take-up body 100 to the insert member 131. The compression of the insert member 131 can be controlled to control the height of the upper part of the take-up body 100 below the substrate W. In particular, the force provided by the fastener 132 can be controlled to control the compression of the insert member 131.

[0098] Figure 12 shows the force lines 135 of the stress passing through the fastener 132 and the solid portion of the insert member 131 (i.e., between the notches 133). As shown in Figure 12, the notches 133 may be provided so that the force lines 135 pass through a relatively narrow portion of the insert member 131. If the narrow portion of the insert member 131 is relatively flexible, it becomes easier to control the compression of the insert member 131. This is useful for controlling the height of the take-up body 100 below the substrate W. In particular, the narrow portion of the insert member 131 between the notches 133 may function as a leaf spring (or other flexible portion).

[0099] The height adjustment mechanism 130 shown in Figure 12 is just one example. As another example, an alternative height adjustment mechanism 130 is shown in Figure 13. As shown in Figure 13, in one embodiment, the take-up body 100 includes a leaf spring 141. The leaf spring 141 includes a lower part 142 fixed to the rest of the take-up body 100. The leaf spring 141 further includes an upper part 143 extending between the take-up body 100 and the first support 21. In one embodiment, a plurality of such leaf springs 141 are provided circumferentially around the substrate support 20. In an alternative embodiment, a single leaf spring 141 extends circumferentially around the substrate support 20.

[0100] As shown in Figure 13, in one embodiment, a height adjustment mechanism 130 is configured to control the height of the upper part 143 below the substrate W so that the upper part 143 is configured to prevent liquid from reaching the central part of the substrate W and the first support 21. In one embodiment, a set screw 144 is provided to allow fine adjustment of the leaf spring 141. The set screw 144 can protrude a controlled distance below the take-up body 100. As the set screw 144 protrudes further from the bottom of the take-up body 100, the set screw 144 bends the leaf spring 141, lowering the height of the upper part 143 of the leaf spring 141. As shown in Figure 13, in one embodiment, the first take-up channel 102 may be connected to the second take-up channel 113 via a connecting channel 140.

[0101] The configuration in which the thermal conditioner 60 is provided on the main body 22 is not particularly limited. In one embodiment, the thermal conditioner 60 is mounted below the surface of the main body 22. For example, one or more Peltier elements and / or heaters may be provided on the underside of the main body 22 and / or the take-out body 100. In addition or alternatively, a channel 61, one or more Peltier elements and / or heaters 63 may be provided on the lower outer periphery of the main body 22. In an alternative embodiment, the thermal conditioner 60 is mounted on the upper side of the main body 22. An external channel 61 and / or one or more Peltier elements and / or heaters 63 may be mounted (e.g., bonded onto the main body 22). In one embodiment, the channel 61, heaters 63 and / or sensors 62 are provided on a substrate stage 26. At least part of the thermal conditioning function is performed by the substrate stage 26. This helps to simplify the design of the main body 22. In one embodiment, a bar 91 is provided as part of the substrate stage 26. The main body 22 does not necessarily have to have bar 91. The underside of the main body 22 may be substantially flat. In one embodiment, at least one sensor 62 is provided on each bar 91 of the substrate stage 26. The sensor 62 is configured to measure the temperature of the main body 22. The sensor 62 is located near the main body 22. In one embodiment, at least one heater 63 is provided on the surface of the substrate stage 26 facing the main body 22. In one embodiment, the heater 63 is paired with each sensor 62. The heater 63 is located near each sensor 62. In one embodiment, the heater 63 is controlled based on the output from the pair of sensors 62.

[0102] As shown in Figure 5, in one embodiment, the clamp channel 43 allows fluid to flow between the space 42 and the other space 45 between the main body 22 and the first support 21.

[0103] As shown in Figure 5, in one embodiment, the substrate support 20 is locked to the substrate stage 26 by at least one fastening bolt 29. In one embodiment, the fastening bolt 29 is configured to function as a safety lock to prevent the substrate support 20 from falling off the substrate stage 26. However, the crowbar 91 performs the function of preventing the substrate support 20 from sliding against the substrate stage 26.

[0104] As shown in Figure 5, in one embodiment, one or more pins 28 may be used to lower the substrate W onto the first support 21. The pins 28 support the substrate W by passing through each pinhole 121 in the substrate support 20 to control the height of the substrate W on the first support 21 during the loading and unloading sequence.

[0105] As shown in Figure 7, in one embodiment, the body 22 is formed by two parts joined together by a connecting line 64. For example, an adhesive material may be used.

[0106] As described above, the first support 21 can be replaced without replacing other parts of the substrate holder 20. As shown in the figure, the first support 21 has a shape that is substantially similar to that of the substrate W. In one embodiment, the lithography apparatus includes at least one handling tool configured to drive the substrate W, for example, to drive the substrate W between different parts of the lithography apparatus, and / or to drive the substrate W to and from the lithography apparatus. In one embodiment, the same handling tool may be used to control the movement of the first support 21.

[0107] Figure 14 is a schematic cross-sectional view of a carrier plate 120 coupled to a first support 21 according to an embodiment of the invention. The carrier plate 120 is configured to be coupled to the first support 21. The carrier plate 120 is configured to be detachable from the first support 21. As shown in Figure 14, in one embodiment, when the carrier plate 120 is coupled to the first support 21, the carrier plate 120 is configured to cover the pinhole 121 in the first support 21.

[0108] As described above, in one embodiment, a plurality of pins 28 can support the substrate W and be controlled to lower the substrate W onto the substrate support 20. Figure 15 shows an assembly of the carrier plate 120 and the first support 21 supported by the pins 28. The pins 28 can effectively support the first support 21 via the carrier plate 120, as the first support 21 is effectively coupled to the carrier plate 120 by providing the carrier plate 120 which covers the pinholes 121. Embodiments of the invention are expected to facilitate the replacement of the first support 21. Embodiments of the invention are expected to reduce downtime of the lithography apparatus. The provision of the carrier plate 120 is not mandatory. In alternative embodiments (described in more detail later), alternatives to the pins 28 are provided to control the movement of the first support 21.

[0109] Since the first support 21 and the carrier plate 120 are coupled to each other, the pins 28 can be controlled to lower the first support 21 onto the rest of the substrate support 20. Once the first support 21 is placed on the rest of the substrate support 20, the carrier plate 120 can be removed. Figure 16 schematically shows the carrier plate 120 being detached from and removed from the first support 21. In one embodiment, positive pressure is applied through the opening 44 to release the carrier plate 120 from the first support 21. The carrier plate 120 can be lifted from the first support 21 by the pins 28. In one embodiment, the carrier plate 120 can be driven using the same handling tool used to handle the substrate W.

[0110] As shown in Figures 14 to 16, in one embodiment, the carrier plate 120 comprises a plurality of connecting protrusions 122. The connecting protrusions 122 are configured to project from the base plate 125 of the carrier plate 120 toward the first support 21. The carrier plate 120 comprises the base plate 125 and the connecting protrusions 122. The base plate 125 is flat. In one embodiment, the base plate 125 and the connecting protrusions 122 are formed from the same material. To form the carrier plate 120, the base plate 125 is formed integrally with the connecting protrusions 122. As shown in Figure 14, in one embodiment, the connecting protrusions 122 limit the distance the base plate 125 approaches the first support 21. As shown in Figure 14, in one embodiment, the connecting protrusions 122 have a contact surface 123. The contact surface 123 is configured to contact the first support 21 directly or via an adhesive material.

[0111] By providing the connecting projection 122, the end of the crowbar 41 does not come into contact with the carrier plate 120. The carrier plate 120 is supported by the first support 21 between a plurality of crowbars 41 on the upper side of the first support 21, with the ends of the crowbars 41 on the upper side of the first support 21 isolated from the carrier plate 120. Embodiments of the invention are expected to further prevent wear of the crowbars 41.

[0112] Figure 17 is a schematic diagram of a carrier plate 120 according to an embodiment of the invention. As shown in Figure 17, in one embodiment, the surface of the carrier plate 120 facing the first support 21 is sufficiently flat, and the carrier plate 120 is supported by the upper end of the crowbar 41 of the first support 21 when the carrier plate 120 is coupled to the first support 21. As shown in Figure 17, in one embodiment, the connecting projection 122 does not limit the distance the carrier plate 120 approaches the first support 21. Instead, the end of the crowbar 41 supports the carrier plate 120. The end of the crowbar 41 contacts the base plate surface 124 directly or via an adhesive material.

[0113] As shown in Figures 14 and 15, in one embodiment, only a portion of the carrier plate 120 is in contact with the first support 21. This limits the adhesive force and facilitates the separation of the carrier plate 120 and the first support 21.

[0114] As shown in Figures 17 and 19, for example, it is not essential that the carrier plate 120 contacts the surface of the first support 21 between the multiple burrs 41. In one embodiment, the surface between the multiple burrs 41 is rough so as to limit the adhesive force. By not requiring contact with the rough surface between the multiple burrs 41, the rough surface does not adversely affect the carrier plate 120 to which it is bonded to the first support 21.

[0115] In the arrangement shown in Figure 17, the end of the crowbar 41 contacts the carrier plate 120. One reason for replacing the first support 21 is that the crowbar can wear out. If replacement of the first support 21 is necessary, the end of the crowbar 41 may be particularly smooth. The end of the crowbar 41 allows for good adhesion to the carrier plate 120, especially for removing the first support 21.

[0116] The manner in which the carrier plate 120 is bonded to the first support 21 is not particularly limited. Figure 18 schematically illustrates the use of adhesive material 126 for bonding the carrier plate 120 to the first support 21. As shown in Figure 18, in one embodiment, adhesive material 126 is provided between the first support 21 and the contact surface 123 of the connecting projection 122. In addition or alternatively, adhesive material 126 may be provided between the ends of the multiple burrs 41 and the base plate surface 124.

[0117] The adhesive material 126 is for temporarily bonding the carrier plate 120 to the first support 21 when the carrier plate 120 is bonded to the first support 21. The adhesive material 126 is not particularly limited. In one embodiment, the adhesive material (bonding material) 126 comprises an adhesive material. In an alternative embodiment, a layer of liquid (e.g., water) is provided instead of the adhesive material 126. Capillary pressure may be used to maintain the bond between the carrier plate 120 and the first support 21.

[0118] In the arrangement shown in Figure 17, the adhesive material may be applied to the recess of the base plate surface 124. By limiting the adhesive material to the recess, the possibility of the adhesive material coming into contact with other components is reduced.

[0119] As shown in Figure 19, in addition or alternatively, the carrier plate 120 is clamped to the first support 21 by pressure. In one embodiment, the carrier plate 120 includes at least one internal channel 127. The internal channel 127 is for circulating connection of a first opening 128 to at least one second opening 129. The first opening 128 and the second opening 129 are on the surface of the carrier plate 120. As shown in Figure 19, in one embodiment, when the carrier plate 120 is coupled to the first support 21, the first opening 128 is positioned so that the carrier plate 120 covers one of the pinholes 121.

[0120] The second opening 129 is located where the carrier plate 120 faces the upper side of the first support 21. In one embodiment, the first opening 128 may be connected to a negative pressure to generate a gas flow that flows from the second opening 129 through an internal channel 127 to the first opening 128 and out through the first opening 128. This can reduce the pressure in the region between the carrier plate 120 and the first support 21 when the carrier plate 120 is coupled to the first support 21. As a result of the encircling pressure being higher than the pressure between the carrier plate 120 and the first support 21, the carrier plate 120 and the first support 21 may be held together.

[0121] As shown in Figure 19, in one embodiment, a first opening 128 is located at a position corresponding to a pin 28 supporting the carrier plate 120. In one embodiment, the pin 28 has a channel for drawing fluid from an internal channel 127 through the first opening 128. The number of second openings 129 is not particularly limited. The number of internal channels 127 is not particularly limited. In one embodiment, a first opening 128 is provided for each pinhole 121.

[0122] In one embodiment, the carrier plate 120 comprises a conductive material and an insulating layer configured to electrically insulate the conductive material from the first support 21 when the carrier plate 120 is connected to the first support 21. The conductive material may have a potential difference with respect to the first support 21. Electrostatic attraction between the carrier plate 120 and the first support 21 may help to couple the carrier plate 120 to the first support 21. In one embodiment, the insulating layer is provided as a thin layer surrounding the carrier plate 120.

[0123] Figures 20 to 22 show different stages of the carrier plate 120 released from the first support 21 according to an embodiment of the invention. As shown in Figure 20, in one embodiment, the carrier plate 120 comprises at least one connecting mechanism 151. The connecting mechanism 151 is configured to mechanically lock the carrier plate 120 to the first support 21. In one embodiment, the connecting mechanism 151 locks the carrier plate 120 to the first support 21 at each pinhole 121 of the first support 21.

[0124] As shown in Figure 20, in one embodiment, the connection mechanism 151 includes a chamber 153. The chamber 153 is configured to receive each pin 28. The chamber 153 receives the contact ends of the pins 28 when the pins 28 support the carrier plate 120. In one embodiment, the connection mechanism 151 is configured to release the lock when the pressure inside the chamber 153 is sufficiently lower than the atmospheric pressure outside the chamber 153, so that the carrier plate 120 can be released from the first support 21. The carrier plate 120 can be released from the first support 21 when the lock is released.

[0125] As shown in Figure 20, in one embodiment, the connection mechanism 151 comprises at least one locking element 152. The locking element 152 penetrates the pinhole 121 and is configured to engage with the surface of the first support 21 opposite the base plate 125 of the carrier plate 120. The number of locking elements 152 is not particularly limited. In one embodiment, two, three, four, or more than four locking elements 152 are provided. The locking elements 152 may be uniformly distributed circumferentially around the pinhole 121. In one embodiment, the locking elements 152 are substantially continuous circumferentially along the inner circumferential surface of the pinhole 121. At one end, the locking element 152 is fixedly connected to the base plate 125 of the carrier plate 120. In one embodiment, the locking element 152 is integrally formed with the base plate 125 of the carrier plate 120.

[0126] In one embodiment, the chamber 153 is connected to a negative pressure to reduce the pressure inside the chamber 153. The chamber 153 is connected to a negative pressure when the carrier plate 120 is released from the first support 21. As previously stated, in one embodiment, the pin 28 is provided with a channel for drawing fluid from above the contact end of the pin 28. In one embodiment, the channel in the pin 28 is configured to draw fluid from the chamber 153 to reduce the pressure inside the chamber 153. As shown in Figure 20, in one embodiment, a plurality of pores 154 are provided for connecting the channel in the pin 28 to the chamber 153 in a flowable manner. The number and shape of the pores 154 are not particularly limited. In one embodiment, a mesh comprising the pores 154 is provided. In one embodiment, the mesh is formed integrally with the base plate 125 of the carrier plate 120. In one embodiment, the contact end of the pin 28 is not perfectly perpendicular to the longitudinal direction of the pin 28 so that the channel in the pin 28 is connected to the chamber 153 in a flowable manner when the pin 28 is supporting the carrier plate 120.

[0127] Figure 21 shows a processing step in which the pressure in the chamber 153 is reduced. As a result of the reduced pressure in the chamber 153, the locking element 152 bends inward toward the pin 28. This disengages the locking element 152 from the surface of the first support 21 opposite the base plate 125 of the carrier plate 120. Once the locking element 152 is disengaged from the first support 21, the carrier plate 120 is no longer locked to the first support 21. As shown in Figure 22, the carrier plate 120 can be released from the first support 21.

[0128] Figures 23 to 25 schematically show alternative connection mechanisms 151 according to embodiments of the invention. As shown in Figure 23, in one embodiment, the chamber 153 is defined by the housing 157. In one embodiment, a portion of the housing 157 protrudes from the surface of the carrier plate 120 opposite to the first support 21. In one embodiment, the housing 157 is formed as a separate component from the base plate 125 and later connected to the base plate 125. Embodiments of the invention are expected to facilitate the manufacture of the carrier plate 120. The design of the base plate 125 becomes simpler.

[0129] In one embodiment, the material used for the housing 157 is different from the material used for the base plate 125 of the carrier plate 120. As shown in Figure 23, in one embodiment, the locking element 152 is formed integrally with the housing 157 that defines the chamber 153.

[0130] As shown in Figure 23, in one embodiment, the carrier plate 120 includes an unlock channel 155. The unlock channel 155 defines an unlock channel through which a fluid can flow to unlock the carrier plate 120 from the first support 21. As shown in Figure 23, in one embodiment, the carrier plate 120 includes an elastic member 156 configured to connect the housing 157 to the unlock channel 155. In one embodiment, the unlock channel 155 is part of the base plate 125 of the carrier plate 120.

[0131] As shown in Figure 24, in one embodiment, a channel in the pin 28 is connected to an unlock channel in the unlock channel portion 155. This allows the pressure in the chamber 153 to be reduced. When the pressure in the chamber 153 is reduced, the housing 157 is pulled downward relative to the base plate 125 of the carrier plate 120. As shown in Figure 24, in one embodiment, the housing 157 has a portion inclined with respect to the surface of the base plate 125 such that the downward movement of the housing 157 relative to the base plate 125 bends the locking element 152. When the locking element 152 bends, the engagement between the locking element 152 and the first support 21 is released. When the engagement between the locking element 152 and the first support 21 is released, the carrier plate 120 is unlocked from the first support 21. When the pressure in the chamber 153 is reduced, the elastic member 156 may be compressed. Otherwise, as shown in Figure 23, the elastic member 156 maintains the higher position of the housing 157 relative to the base plate 125 of the carrier plate 120. As shown in Figure 25, when the carrier plate 120 is unlocked, the carrier plate 120 can be released from the first support 21.

[0132] The provision of a carrier plate 120 is not mandatory. Figure 26 is a schematic plan view of the first support 21 according to an embodiment of the invention. As shown in Figure 26, in one embodiment, the carrier plate 120 is not provided. As a result, the pins 28 are free to extend through each pinhole 121. In one embodiment, the pins 28 are not used to lower the first support 21 onto the body 22 of the substrate support 20. In one embodiment, an additional set of pins 160 is provided at a different location from the pins 28 used to lower the substrate W. The upper contour of the pins 160 is shown in Figure 26. In one embodiment, a further set of pinholes for the pins 160 is provided in the portion of the substrate support 20 lower than the first support 21. For example, such a further set of pinholes is provided in the body 22. The pins 160 pass through the further set of pinholes in the body 22 and support the lower surface of the first support 21. On the other hand, the pins 28 for supporting the substrate W pass through pinholes 121 that penetrate both the main body 22 and the first support 21.

[0133] In an alternative embodiment, pins 28 used to lower the substrate W support the first support 21 when the first support 21 is in a rotational position different from the target position on the body 22. The first support 21 is supported by pins 28 and can be lowered onto the body 22 in its rotational direction. A carrier plate 120 is not required because the pinholes 121 passing through the first support 21 do not align with pins 28. This is because the first support 21 is rotating relative to its final target position. Once the first support 21 is supported by the body 22, the first support 21 is rotated to reach the target rotational position on the body 22. When the first support 21 is at the target position on the body 22, the pinholes 121 align between the first support 21 and the body 22 so that pins 28 can pass through the pinholes 121 to support the substrate W above the first support 21. In one embodiment, a rotating tool is provided for rotating the first support 21 on the body 22. By rotating the first support 21 supported by the main body 22, it is not necessary to provide the carrier plate 120 and not to provide another set of pins 160.

[0134] Figure 27 is a schematic plan view of the first support 21 according to an embodiment of the invention. As shown in Figure 27, the first support 21 is gripped for handling. As shown in Figure 27, in one embodiment, a plurality of edge grippers 161 are provided for gripping the first support 21. The edge grippers 161 are configured to grip the outer edge of the first support 21. In one embodiment, the edge grippers 161 are configured as handling tools separate from the handling tools for handling the first support 21. By providing separate handling tools, there is no need to use the pin 28 for lowering the first support 21 and there is no need to provide the carrier plate 120.

[0135] Figure 28 is a schematic plan view of a first support 21 according to an embodiment of the invention. As shown in Figure 28, the first support 21 is gripped for handling. As shown in Figure 28, in one embodiment, an upper gripper 162 is provided for gripping the upper part of the first support 21. By providing the upper gripper 162, there is no need to provide a different set of pins 160 for handling the carrier plate 120 or the support 21. In one embodiment, the upper gripper 162 is configured as a handling tool for handling the first support 21 and a separate handling tool. The separate handling tool is separated from the pins 28 used to lower the substrate W onto the first support 21.

[0136] Features shown in the different embodiments illustrated in the figures can be combined with each other unless it is clear that they are incompatible. As just one example, the feature of providing a crowbar 47 on the underside of the first support 21 (shown in Figure 8) may be applied to the arrangements shown in Figures 5, 9, 10, or 11. In particular, the arrangement shown in Figure 9 can be modified by replacing the crowbar 65 on the upper side of the body 22 with the crowbar 47 provided on the underside of the first support 21. Other combinations of features shown in the figures are similarly possible.

Claims

1. A first support structure configured to support a substrate via a plurality of first bars, A body separated from a first support and configured to support the first support, having a plurality of second bars provided below it, supported by a substrate stage, and comprising a thermal conditioner configured to thermally adjust the body, the first support and / or the substrate, An extraction body surrounding the main body and the first support, comprising an extraction body having a first extraction channel configured to extract fluid from near the peripheral edge of the substrate, Equipped with, The second bar is longer than the first bar. A substrate support for supporting a substrate in a lithography apparatus.

2. The substrate support according to claim 1, wherein the plurality of second bars are configured to reduce relative movement between the substrate support and the substrate stage.

3. The main body is provided with a plurality of third bars on its upper side, each having an end in the plane configured to support the first support, or The first support has a plurality of fourth bars on its lower side, the ends of which are in a plane configured to contact the upper side of the main body. A substrate support according to claim 1 or 2.

4. The substrate support according to any one of claims 1 to 3, comprising a second extraction channel configured to extract fluid from the radially inner side of the first extraction channel, the second extraction channel configured to extract fluid from below the peripheral edge of the substrate, preventing the liquid from reaching the space between the central part of the substrate and the first support, and being isolated from the first extraction channel by an open gap.

5. A substrate support according to any one of claims 1 to 4, wherein an open gap or channel is formed between the take-out body, the main body, and the first support, or the take-out body is integrally formed with the main body.

6. The substrate support according to claim 5, wherein an open gap or channel allows fluid to flow to and from atmospheric pressure or a pressure source, and / or the body extends below the outlet, the lower side of the outlet is coupled to the body, and an adhesive layer is provided between the outlet and the body.

7. A substrate support according to any one of claims 1 to 6, wherein a thermal conditioner is mounted beneath the surface of the main body, and / or pinholes configured to allow each pin for lowering a substrate onto the first support to pass through are located through the first support in the thickness direction of the first support.

8. The substrate support according to claim 7, comprising a carrier plate configured to be connectable to and disconnectable from a first support, and configured to cover a pinhole when connected to the first support.

9. The first support comprises, on its upper side, a plurality of first bars having ends in a plane configured to support a substrate, The carrier plate includes connecting protrusions configured such that the carrier plate is supported by the first support between the upper first bars of the first support, while the ends of the upper first bars of the first support are isolated from the carrier plate. or The first support comprises, on its upper side, a plurality of first bars having ends in a plane configured to support a substrate, The carrier plate has a sufficiently flat surface facing the first support, and when the carrier plate is bonded to the first support, the end of the upper first bar of the first support supports the carrier plate. The substrate support according to claim 8.

10. A substrate support according to claim 8 or 9, comprising an adhesive material for temporarily adhering the carrier plate to the first support when the carrier plate is coupled to the first support, and / or the carrier plate comprising at least one internal channel for circulating connection of a first opening to at least one second opening, wherein the first opening is positioned to cover one of the pinholes when the carrier plate is coupled to the first support, and the second opening is positioned to face the upper side of the first support, and / or the carrier plate comprising a conductive material and an insulating layer configured to electrically insulate the conductive material from the first support when the carrier plate is coupled to the first support, and / or the carrier plate comprising at least one connection mechanism configured to mechanically lock the carrier plate into each pinhole of the first support.

11. The substrate support according to claim 10, wherein the connection mechanism comprises a chamber configured to receive each pin, and the connection mechanism is configured to release a lock when the pressure inside the chamber is sufficiently lower than atmospheric pressure outside the chamber and the carrier plate can be released from the first support.

12. PCB stage and A substrate support according to any one of claims 1 to 4, wherein the extraction body is provided on the substrate stage, or a substrate support according to claim 5 or 6, wherein the lower side of the extraction body is attached to the substrate stage, A circuit board table equipped with a circuit board table.

13. The substrate table according to claim 12, further comprising a height adjustment mechanism configured to control the height of at least a portion of the extraction body below the substrate, such that the extraction body is configured to prevent liquid from reaching the area between the central part of the substrate and the first support.

14. The height adjustment mechanism comprises an insert member between the lower side of the extraction body and the substrate stage, and a fastener configured to connect the extraction body to the insert member. The insert member is configured with a notch so that it is compressed when the fastener connects the extractor to the insert member in order to control the height of the extractor below the substrate. or The extraction body comprises a leaf spring having a lower part fixed to the rest of the extraction body and an upper part extending between the extraction body and the first support, The height adjustment mechanism is configured to control the height of the lower upper part of the substrate so that the upper part is configured to prevent liquid from reaching the area between the central part of the substrate and the first support. A substrate table according to claim 13.

15. A lithography apparatus comprising a substrate support according to any one of claims 1 to 11, or a substrate table according to claim 12, 13, or 14.

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