Method for manufacturing a conductive material having a larger specific surface area and its structure

Abstract

To provide a method for manufacturing a conductive material having a larger specific surface area.SOLUTION: A method includes the steps of forming a block layer on an outer surface of a support precursor (e.g., conductive nanofiber) to produce a mixed precursor, rolling the mixed precursor to crack a portion of the outer surface of the block layer to form a plurality of crack gaps, exposing a portion of the outer surface of the support precursor through the plurality of crack gaps, and adding a conductive material to the mixed precursor such that the conductive material comes into contact with and is electrically connected to the support precursor through the plurality of crack gaps, manufacturing a conductive material with a larger specific surface area.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] A large surface area material is a material with an extremely large specific surface area, and the development of its industry is advancing rapidly. The advantage of this type of material lies in the large ratio of surface area to volume, and it is widely used in many fields.

[0002] The industrial applications of large surface area materials include many fields such as catalysts, adsorbents, and energy storage.

[0003] Large surface area materials often function as efficient catalysts. Due to their large surface area, a more active surface can be obtained, thereby improving the reaction rate and efficiency. Such materials have important applications in the fields of chemical synthesis, environmental protection, such as automotive exhaust gas purification, chemical reaction catalysts, and energy conversion in fuel cells.

[0004] Large surface area materials can have a large number of fine pores and often exhibit excellent performance in adsorption and separation processes. Therefore, large surface area materials are widely used in fields such as gas-liquid separation, water treatment, and waste treatment. For example, activated carbon is a common large surface area adsorbent and is used to remove organic substances and heavy metal ions from water.

[0005] Large surface area materials play an important role in the field of energy storage. For example, porous materials with a large surface area may be used in electrode materials of supercapacitors and lithium-ion batteries to increase the charge transfer rate and capacitance. Among them, supercapacitor technology has attracted attention.

[0006] Capacitors vary in appearance and structure depending on their type, and many commonly used capacitors are commercially available. Most capacitors have a structure in which the surfaces of at least two metal plates or metal conductors are separated by a layer of insulation. Conductors can be metal foil, film, sintered metal beads, or electrolytes. Non-conductive insulating materials can improve the energy storage capacity of a capacitor. Common insulating materials include glass, ceramic, plastic film, paper, mica, and metal oxides. Capacitors play an important role in many electronic circuits and energy storage applications.

[0007] Capacitors are widely used in electronic circuits. In energy storage applications, they can be used as a substitute for batteries in some areas. When high power output is required, capacitors are more suitable than batteries.

[0008] Overall, capacitors are essential electronic and power energy storage components that store electrical energy and regulate circuit characteristics. From electronic devices to power systems, various types of capacitors play crucial roles in diverse applications, all of which are indispensable to capacitor use. With the continuous advancement of science and technology, capacitors continue to play a vital role in driving progress and innovation in the field of electronics.

[0009] High dielectric constant ferroelectric materials in the temperature range of 25-200°C include barium titanate, lead magnesium niobate, and lead zirconate titanate. However, the development of lead-containing materials is limited because they are highly volatile at high temperatures, readily react with electrodes, and are inherently toxic. Therefore, barium titanate ceramics are currently one of the most widely used dielectric materials in electronic ceramic capacitors.

[0010] With industrial development, there is a growing need for more efficient materials with larger surface areas in the fields of catalysts, adsorbents, and energy storage. In particular, in the energy storage sector, the high-value-added power storage market and the power electronics equipment market are gradually becoming smaller and more high-performance. Dielectric materials are being developed with a focus on high energy storage density, high charge / discharge efficiency, easy processing and molding, and stable performance. Therefore, industry needs methods for preparing conductive materials with larger specific surface areas in order to manufacture conductive materials with high specific surface areas for applications in the aforementioned fields of catalysts, adsorbents, and energy storage.

[0011] To solve the above problems of the prior art, the present invention provides a method and structure for manufacturing a conductive material having a larger specific surface area, the method comprising the steps of forming a block layer on the outer surface of a support precursor, rolling to create cracks in a portion of the outer surface of the block layer in order to expose a portion of the outer surface of the support precursor, and adding an electrically connected conductive material to a portion of the support precursor in order to manufacture a conductive material having a larger specific surface area. [Overview of the project] The problem of trying to solve the problem

[0012] The object of the present invention is to provide a method for producing a conductor material having a larger specific surface area, comprising the steps of: forming a block layer on the outer surface of a support precursor; rolling a portion of the outer surface of the block layer to create cracks and expose a portion of the outer surface of the support precursor; and adding a conductor material to a mixed precursor so as to be electrically connected to a portion of the support precursor to produce a conductor material having a larger specific surface area.

[0013] To achieve the above objectives and effects, the present invention provides a method for manufacturing a conductive material having a larger specific surface area, comprising the steps of: forming a block layer on the outer surface of a support precursor to produce a mixed precursor; rolling the mixed precursor to create cracks in a portion of the outer surface of the block layer to form a plurality of crack gaps, thereby exposing a portion of the outer surface of the support precursor through the plurality of crack gaps; and adding a conductive material to the mixed precursor so that the conductive material contacts the support precursor through the plurality of crack gaps and is electrically connected, thereby manufacturing a conductive material having a larger specific surface area. By using this method, a conductive material having a larger specific surface area can be manufactured.

[0014] To achieve the above objectives and effects, the present invention provides a structure for a conductive material having a larger specific surface area, comprising a substrate and a first large specific surface area conductive slurry layer. The first large specific surface area conductive slurry layer comprises a first support precursor, a first block layer, and a plurality of first particles. The first block layer covers the first support precursor. The first block layer includes a plurality of first crack gaps. The plurality of first particles are arranged corresponding to the plurality of first crack gaps. By using this structure, a conductive material having a larger specific surface area can be provided.

[0015] According to one embodiment of the present invention, in order to produce a mixed precursor, in the step of forming a block layer on the outer surface of a support precursor, the support precursor is added to a titanium tetrachloride solution in order to produce a mixed precursor and form a block layer on the outer surface of the support precursor.

[0016] According to one embodiment of the present invention, in order to produce a mixed precursor, in the step of forming a block layer on the outer surface of a support precursor, the mixed precursor is added to a barium acetate solution, and the barium acetate in the barium acetate solution reacts with the titanium oxide in the block layer to form barium titanate.

[0017] According to one embodiment of the present invention, in the step of adding a conductive material to a mixed precursor such that the conductive material contacts and electrically connects with a support precursor through a plurality of crack gaps, the conductive material comprises a polyvinyl butyral solution, a conductive gel, and barium titanate particles. During rolling, the block layer is cracked to form a plurality of crack gaps. The conductive gel and the barium titanate particles come into contact and are electrically connected to the support precursor through the plurality of crack gaps, thereby producing a conductive material with a larger specific surface area.

[0018] According to one embodiment of the present invention, after the step of adding a conductive material to a mixed precursor to produce a conductive material having a larger specific surface area such that the conductive material contacts and electrically connects with a support precursor through a plurality of crack gaps, the method further includes the steps of coating the upper and lower surfaces of a substrate with the conductive material having a larger specific surface area and heating to a sintering temperature, and forming a capacitor.

[0019] According to one embodiment of the present invention, the support precursor comprises carbon nanotubes (CNTs) or nanometer metal fibers.

[0020] According to one embodiment of the present invention, the polyvinyl butyral solution comprises polyvinyl butyral (PVB), toluene (C7H8), and ethanol (CH3CH2OH) as an adhesive or solvent.

[0021] According to one embodiment of the present invention, in order to produce a mixed precursor, in the step of forming a block layer on the outer surface of a support precursor, one of the following methods, or a combination thereof, is employed to form the block layer on the outer surface of the support precursor: hydrothermal synthesis, electroless plating, electroplating, and physical vapor deposition (PVD), chemical vapor deposition (CVD).

[0022] According to one embodiment of the present invention, the sintering temperature is 1000°C to 1350°C.

[0023] According to an embodiment of the present invention, the structure further includes a second high specific surface area conductive slurry layer disposed below the substrate. The second high specific surface area conductive slurry layer includes a second support precursor, a second block layer, and a plurality of second particles. The second block layer covers the second support precursor. The second block layer includes a plurality of second crack gaps. The plurality of second particles are disposed corresponding to the plurality of second crack gaps.

[0024] The first support precursor includes carbon nanotubes (CNT) or nanometer metal fibers.

[0025] According to an embodiment of the present invention, the first block layer and the second block layer are barium titanate.

[0026] According to an embodiment of the present invention, the plurality of first particles and the plurality of second particles are metal particles.

Brief Description of the Drawings

[0027] [Figure 1] It is a flowchart of material manufacturing according to an embodiment of the present invention. [Figure 2A] It is a schematic diagram of a material structure according to an embodiment of the present invention. [Figure 2B] It is a schematic diagram of a material structure according to an embodiment of the present invention. [Figure 2C] It is a schematic diagram of a material structure according to an embodiment of the present invention. [Figure 2D] It is a schematic diagram of a material structure according to an embodiment of the present invention. [Figure 3] It is a flowchart of the manufacture of a capacitor material according to an embodiment of the present invention. [Figure 4] It is a flowchart of an application according to an embodiment of the present invention. [Figure 5] It is a schematic diagram of a capacitor structure according to an embodiment of the present invention.

Modes for Carrying Out the Invention

[0028] In order to further understand and recognize the structure, features, and effectiveness of the present invention, the present invention will be described in detail below along with embodiments.

[0029] To solve the problems of the prior art described above, the present invention provides a method and structure for manufacturing a conductive material having a larger specific surface area, the method comprising the steps of forming a block layer on the outer surface of a support precursor, rolling the block layer to create cracks in a portion of the outer surface of the support precursor to form a crack gap to expose a portion of the outer surface of the support precursor, and adding a conductive material to the portion of the support precursor for electrical connection in order to manufacture a conductive material having a larger specific surface area. This will satisfy the need for materials with a large specific surface area in industrial applications.

[0030] Please refer to Figure 1, which is a flowchart of material manufacturing according to an embodiment of the present invention. As shown in Figure 1, this embodiment provides a method for manufacturing a conductive material having a larger specific surface area, and includes the following steps.

[0031] Step S02: To produce a mixed precursor, a block layer is formed on the outer surface of the support precursor.

[0032] Step S04: The mixed precursor is rolled to create cracks in a portion of the outer surface of the block layer in order to form multiple crack gaps, and a portion of the outer surface of the support precursor is exposed through the multiple crack gaps.

[0033] Step S06: The conductive material is added to the mixed precursor so that the conductive material contacts the support precursor through multiple crack gaps and is electrically connected, thereby producing a conductive material with a larger specific surface area.

[0034] Please refer to Figure 1 again. Figures 2A to 2D are schematic diagrams of the material structure according to embodiments of the present invention. As shown in Figures 2A to 2B, in step S02 of this embodiment, a block layer 14 is formed on the outer surface of the support precursor 12. That is, the block layer 14 covers the outer surface of the support precursor 12 in order to produce the mixed precursor 16. The block layer 14 can prevent the fibers in the support precursor 12 from becoming entangled, crushed, or bonded together, thereby reducing the surface area of ​​the support precursor 12.

[0035] According to one embodiment, the support precursor 12 includes carbon nanotubes (CNTs) or nanometer metal fibers. The metal of the nanometer metal fibers may be copper, silver, or nickel. However, the present invention is not limited to this embodiment.

[0036] According to one embodiment, to form a block layer 14 on the outer surface of the support precursor 12, one of the following methods may be employed: hydrothermal synthesis, electroless plating, electroplating, physical vapor deposition (PVD), chemical vapor deposition (CVD), or a combination of any of the above methods. However, the present invention is not limited to this embodiment.

[0037] Please refer again to Figures 1 and 2A to 2D. As shown in the figures, in step S04 of this embodiment, after forming the mixed precursor 16 using the previous steps, the mixed precursor 16 is rolled in order to apply force to it. As a result, the mixed precursor 16 and the support precursor 12 within the block layer 14 are bent and deformed, cracks appear on the outer surface of the block layer 14, and multiple crack gaps 142 are created on a part of the outer surface of the block layer 14, resulting in a portion of the outer surface of the support precursor 12 being exposed in the multiple crack gaps 142.

[0038] According to this embodiment, by deforming and restoring the block layer 14, multiple crack gaps 142 are formed and exposed.

[0039] Please refer again to Figures 1 and 2A to 2D. As shown in the figures, in step S06 of this embodiment, a conductive material 18 is added to the mixed precursor 16 so that the conductive material 18 comes into contact with the support precursor 12 through a plurality of crack gaps 142 and is electrically connected. Since the conductive material 18 is electrically connected to the support precursor 12 within the block layer 14, a conductive material with a larger specific surface area can be produced by increasing the surface area of ​​the support precursor 12 that is in contact with the outside.

[0040] According to this embodiment, the conductive material 18 is a metallic conductive gel. The conductive material 18 is further interconnected, and the fibers of the support precursor 12 are interconnected, thereby giving the conductive material a larger specific surface area.

[0041] The method for manufacturing a conductive material having a larger specific surface area according to this embodiment can produce conductive materials with a large specific surface area and is applicable to various industries such as catalytic materials and supercapacitors.

[0042] Please refer to Figure 3, which shows a manufacturing flowchart of a capacitor material according to an embodiment of the present invention. As shown in the figure, this embodiment is based on the previously described embodiment. This embodiment is used in a method for manufacturing a capacitor material, which includes the following steps.

[0043] Step S11: The support precursor is added to the titanium tetrachloride solution and heated at the first temperature for one hour to form a block layer on the outer surface of the support precursor and produce a mixed precursor.

[0044] Step S13: Wash and dry the mixed precursor.

[0045] Step S15: The mixed precursor is added to the barium acetate solution and heated at the second temperature for two hours, causing the barium acetate in the barium acetate solution to react with the titanium oxide in the block layer to form barium titanate.

[0046] Step S17: Wash and dry the mixed precursor.

[0047] Step S19: Barium titanate particles, conductive gel, and mixed precursor are added to a polyvinyl butyral solution, rolled and mixed to crack the block layer and create multiple crack gaps, and the conductive gel and barium titanate particles are filled into the multiple crack gaps. The barium titanate particles come into contact with the support precursor through the multiple crack gaps, are electrically connected, and a conductive material with a larger specific surface area is produced.

[0048] Please refer to Figure 3 again. As shown in the figure, in step S11 of this embodiment, after adding a support precursor to the titanium tetrachloride solution, the support precursor and the titanium tetrachloride solution are mixed and heated at a first temperature. After heating for a first hour, the titanium tetrachloride solution reacts with oxygen, and titanium oxide is formed on the outer surface of the support precursor, thereby forming a block layer and producing a mixed precursor.

[0049] According to this embodiment, carbon nanotubes (CNTs) are used as the support precursor. The support precursor contains multiple carbon nanotubes. Multiple carbon nanotubes, an acidic solution, and titanium tetrachloride are uniformly mixed and heated to form a first mixture. The acidic solution softens the carbon nanotubes and increases their surface activity, thereby allowing titanium to adhere to the surface of the carbon nanotubes.

[0050] According to this embodiment, the support precursor may be nanometer metal fibers formed by a plurality of nanometer metal filaments made of nanometer metals such as copper, silver, or nickel. The plurality of nanometer metal fibers, an acidic solution, and titanium tetrachloride are uniformly mixed and heated to form the first mixture. The acidic solution enhances the surface activity of the nanometer metals, allowing titanium to adhere to the surface of the nanometer metal fibers.

[0051] According to one embodiment, the support precursor may be first washed with an acidic solution to remove impurities from the outer surface of the support precursor. The acidic solution may be, but is not limited to, nitric acid. Different acidic solutions may be used depending on the material of the support precursor.

[0052] According to this embodiment, titanium tetrachloride (TiCl4) is used to produce intermediates for titanium oxide and its compounds.

[0053] According to this embodiment, the first temperature and first time vary depending on the material properties of the support precursor and the titanium tetrachloride solution. For example, in the embodiment using carbon nanotubes and titanium tetrachloride, the first temperature is 80°C to 100°C, and the first time is 0.5 to 10 hours. For example, a mixture of the support precursor and the titanium tetrachloride solution is heated at 90°C for 0.5 to 10 hours.

[0054] According to one embodiment, in order to achieve uniform mixing, the mixture of the acidic solution, the support precursor, and titanium tetrachloride may be vibrated in an ultrasonic vibrator for 1 to 2 hours.

[0055] Please refer to Figure 3 again. As shown in the figure, in step S13 of this embodiment, the mixed precursor is further washed with deionized water and ethanol to a neutral pH. For example, hydrochloric acid produced during the reaction to produce titanium dioxide from titanium tetrachloride is removed. After that, the mixed precursor is dried using an oven.

[0056] In the above embodiments of carbon nanotubes and titanium tetrachloride, the mixed precursor is a precursor of titanium oxide-carbon nanotubes (TiO2-CNT).

[0057] According to this embodiment, the mixed precursor is dried at 50°C to 70°C.

[0058] Please refer to Figure 3 again. As shown in the figure, in step S15 of this embodiment, the mixed precursor is added to the barium acetate solution and heated at a second temperature for two hours, so that the barium acetate in the barium acetate solution reacts with the titanium oxide in the block layer to form barium titanate.

[0059] According to this embodiment, the second temperature and second time vary depending on the material properties of the barium acetate solution and the mixed precursor. For example, in the embodiment of barium acetate solution and mixed precursor, the second temperature is 150°C to 170°C and the second time is 0.5 to 10 hours. For example, the mixture of barium acetate solution and mixed precursor may be heated at 160°C for 0.5 to 10 hours to ensure a complete reaction between the mixed precursor and the barium acetate solution.

[0060] According to one embodiment, in order to achieve uniform mixing, the mixture of barium acetate solution and the mixed precursor may be vibrated in an ultrasonic vibrator for 1 to 2 hours.

[0061] According to one embodiment, the mixed precursor may be further washed with deionized water and ethanol to achieve a neutral pH.

[0062] Please refer to Figure 3 again. As shown in the figure, in step S17 of this embodiment, the mixed precursor is dried using an oven.

[0063] In the above embodiment of the barium acetate solution and mixed precursor, a barium titanate-carbon nanotube (BaTiO3-CNT) precursor is produced by the reaction of the barium acetate solution and the mixed precursor.

[0064] According to this embodiment, the mixed precursor is dried at 50°C to 70°C.

[0065] Please refer to Figure 3 again. As shown in the figure, in step S19 of this embodiment, the conductive material comprises a polyvinyl butyral solution, a conductive gel, and barium titanate particles. The barium titanate particles, conductive gel, and mixed precursor are added to the polyvinyl butyral solution. The mixture is rolled and mixed to slightly crack the block layer, forming multiple crack gaps. The conductive gel particles fill the multiple crack gaps in the block layer of the mixed precursor, as shown in Figure 2D. This causes the conductive fibers (carbon nanotubes in this embodiment) to contact the outer surface of the support precursor through the multiple crack gaps, and are electrically connected, producing a conductive material with a larger specific surface area.

[0066] According to this embodiment, the polyvinyl butyral solution contains polyvinyl butyral (PVB), toluene (C7H8), and ethanol (CH3CH2OH). C7H8 and CH3CH2OH form a solution in a volume ratio of 3:2. PVB is added to this solution to obtain the polyvinyl butyral solution.

[0067] Please refer to Figure 4, which shows a flowchart of an application according to one embodiment of the present invention. As shown in the figure, after the steps of adding a conductive material to a mixed precursor and rolling and mixing the conductive material to contact the support precursor with multiple crack gaps to electrically connect it in order to produce a conductive material having a larger specific surface area, the method further includes the following steps.

[0068] Step S22: A conductive material with a larger specific surface area is coated onto the substrate and heated to the sintering temperature.

[0069] Step S24: Form a capacitor.

[0070] Please refer to Figure 4 again. As shown in the figure, in step S22 of this embodiment, a conductive material having a larger specific surface area is coated onto the substrate 10.

[0071] Please refer to Figure 4 again. As shown in the figure, in step S24 of this embodiment, a conductive material having a larger specific surface area is coated under the substrate 10. After heating to the sintering temperature, a capacitor is formed.

[0072] Refer to Figure 5, which shows a schematic diagram of a capacitor structure according to one embodiment of the present invention. As shown in the figure, this embodiment discloses an application to the manufacture of a capacitor. According to this embodiment, the mixed precursor is tested using a viscometer. Once the appropriate viscosity is reached, the mixed precursor is rolled and mixed to slightly break the outer block layer of the support precursor in order to form multiple crack gaps.

[0073] According to one embodiment, a triple roll mill is used to roll and mix the capacitor slurry. ) will be adopted.

[0074] Please refer to Figure 5 again. As shown in the figure, according to this embodiment, capacitor slurry is coated on the upper and lower surfaces of the substrate 10. The capacitor slurry is applied to the upper surface of the substrate 10 to form a first large specific surface area conductive slurry layer 20. The capacitor slurry is applied to the bottom surface of the substrate 10 to form a second large specific surface area conductive slurry layer 30. The substrate 10, the first large specific surface area conductive slurry layer 20, and the second large specific surface area conductive slurry layer 30 form a capacitor precursor. After sintering at a high temperature, a capacitor product is manufactured.

[0075] According to this embodiment, the substrate 10 is a barium titanate or metal oxide ceramic substrate, for example, a substrate containing barium or other dielectric material, and is used for bonding with a large specific surface area conductive slurry.

[0076] According to this embodiment, the first large specific surface area conductive slurry layer 20 includes a plurality of first support precursors 22, a first block layer 23, and a plurality of first particles 24. According to one embodiment, the plurality of first support precursors 22 are carbon nanotubes (CNTs). The plurality of first support precursors 22 cover the first block layer 23, for example, barium titanate (BaTiO3). The plurality of first particles 24 are metal particles of the conductive slurry. However, the present invention is not limited to this embodiment.

[0077] According to this embodiment, the second large specific surface area conductive slurry layer 30 includes a plurality of second support precursors 32, a second block layer 33, and a plurality of second particles 34. According to one embodiment, the plurality of second support precursors 32 are carbon nanotubes (CNTs). The plurality of second support precursors 32 cover the second block layer 33, for example, barium titanate (BaTiO3). The plurality of second particles 34 are metal particles of the conductive slurry. However, the present invention is not limited to this embodiment.

[0078] Please refer to Figure 5 again. As shown in the figure, according to this embodiment, the intermediate product is heated to a third temperature, which is the sintering temperature of the second mixture and the substrate 10.

[0079] In the above embodiment of barium titanate-carbon nanotubes (BaTiO3-CNT), the third temperature is 1000°C to 1350°C. The intermediate product is first heated at 240°C to 260°C for 2 to 2.5 hours. Then, it is further heated at 1000°C to 1350°C for 2 to 2.5 hours.

[0080] The object of the present invention is to provide a method for manufacturing a conductor material having a larger specific surface area and a structure thereof, comprising the steps of forming a block layer on the outer surface of a support precursor, rolling a portion of the outer surface of the block layer to create cracks in order to expose a portion of the outer surface of the support precursor, and adding a conductor material that is electrically connected to a portion of the support precursor in order to manufacture a conductor material having a larger specific surface area.

[0081] Therefore, the present invention, by its novelty, non-obviousness, and usefulness, complies with legal requirements. However, the foregoing description is merely an embodiment of the present invention and is not intended to define or limit the scope of the invention. Equivalent changes or modifications made in accordance with the form, structure, features, or spirit described in the claims of the present invention are included in the appended claims of the present invention.

Claims

1. A method for manufacturing a conductive material applied to a capacitor, To generate a mixed precursor, the steps include forming a block layer on the outer surface of the support precursor, The steps include rolling the mixed precursor to create cracks in a portion of the outer surface of the block layer in order to form multiple crack gaps, thereby exposing a portion of the outer surface of the support precursor through the multiple crack gaps, The process includes the step of adding a conductive material to a mixed precursor and manufacturing the conductive material such that a conductive gel of the conductive material contacts and electrically connects with a support precursor through multiple crack gaps, A method for producing a support, characterized in that the support precursor contains conductive fibers and the block layer contains a metal oxide.

2. The manufacturing method according to claim 1, characterized in that, in the step of forming a block layer on the outer surface of a support precursor in order to produce the mixed precursor, the support precursor is added to a titanium tetrachloride solution in order to produce the mixed precursor and form a block layer on the outer surface of the support precursor.

3. In order to produce the mixed precursor, in the step of forming a block layer on the outer surface of the support precursor, The manufacturing method according to claim 2, characterized in that the mixed precursor is added to a barium acetate solution, and the barium acetate in the barium acetate solution reacts with the titanium oxide in the block layer to form the metal oxide.

4. In the step of manufacturing the conductor material by adding the conductor material to a mixed precursor such that the conductor material contacts and electrically connects with the support precursor through a plurality of crack gaps, The conductive material comprises a polyvinyl butyral solution, the conductive gel, and metal oxide particles, and during rolling, cracks are introduced into the block layer to form a plurality of crack gaps. The manufacturing method according to claim 3, characterized in that the conductive gel and the metal oxide particles contact the support precursor through the plurality of crack gaps and are electrically connected to produce the conductive material.

5. After the step of adding the conductor material to the mixed precursor and manufacturing the conductor material, the following steps are taken: The steps include coating the upper and lower surfaces of the substrate with the aforementioned conductive material and heating it to the sintering temperature, The manufacturing method according to claim 1, comprising the step of forming a capacitor.

6. The manufacturing method according to claim 1 or 4, wherein the conductive fiber is a carbon nanotube (CNT) or a nanometer metal fiber.

7. The manufacturing method according to claim 4, characterized in that the metal oxide particles are barium titanate particles.

8. The polyvinyl butyral solution contains polyvinyl butyral (PVB) and toluene (C) as an adhesive or solvent. ７ H ８ ) and ethanol (CH ３ CH ２ The manufacturing method according to claim 4, comprising OH.

9. In the step of forming a block layer on the outer surface of a support precursor in order to produce a mixed precursor, The manufacturing method according to claim 1, wherein a hydrothermal synthesis method, an electroless plating method, an electroplating method, and any of the following methods, such as physical vapor deposition (PVD) or chemical vapor deposition (CVD), are employed to form the block layer on the outer surface of the support precursor.

10. The manufacturing method according to claim 5, wherein the sintering temperature is 1000°C to 1350°C.

11. A structure of a conductive material applied to a capacitor, The above structure includes a substrate and a first large specific surface area conductive slurry layer disposed on the substrate. The first large specific surface area conductive slurry layer comprises a first support precursor, a first block layer, and a plurality of first metal particles. The first block layer covers the first support precursor, the first block layer includes a plurality of first crack gaps, and the plurality of first metal particles are arranged corresponding to the plurality of first crack gaps. The structure of a conductive material is characterized in that the first support precursor contains conductive fibers, and the first block layer contains a metal oxide.

12. Furthermore, it includes a second large specific surface area conductive slurry layer disposed below the substrate, The second large specific surface area conductive slurry layer comprises a second support precursor, a second block layer, and a plurality of second particles. The structure of the conductive material according to claim 11, characterized in that the second block layer covers the second support precursor, the second block layer includes a plurality of second crack gaps, and the plurality of second particles are arranged corresponding to the plurality of second crack gaps.

13. The structure of the conductive material according to claim 11 or 12, characterized in that the first support precursor comprises carbon nanotubes (CNTs) or nanometer metal fibers.

14. The structure of the conductive material according to claim 12, characterized in that the second block layer is a metal oxide.

15. The structure of the conductive material according to claim 12, characterized in that the plurality of second particles are metal particles.

16. The structure of the conductive material according to claim 11 or 14, characterized in that the metal oxide is barium titanate.

17. The structure of the conductive material according to claim 12, characterized in that the second support precursor includes carbon nanotubes (CNTs) or nanometer metal fibers.

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