Processing system and imaging device

Abstract

To provide an imaging apparatus capable of imaging the state of a wafer stored in a cassette.SOLUTION: An imaging apparatus 1 includes a placing table 10 for placing a first cassette 50, a transfer arm 20 for carrying in / out a wafer 200 to / from the first cassette 50 installed in the placing table 10, an imaging unit 30 for imaging the wafer 200 carried out from the first cassette 50 by the transport arm 20, and a memory 41 for recording the imaged image.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an imaging device that images a wafer and records the state of the wafer. Processing system and

Background Art

[0002] It is known to unload a wafer housed in a cassette from the cassette and process it with an arbitrary processing device (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003] <000**********>

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a conventional processing device, when there are scratches or foreign substances attached to the wafer after processing the wafer, it is difficult to identify whether the cause is in the processing device or whether there were already scratches or foreign substances present in the state of being housed in the cassette, and there is a problem that it is difficult to investigate the cause of the scratches and foreign substances.

[0005] The present invention has been made in view of such problems, and an object thereof is to provide an imaging device that can image the state of a wafer housed in a cassette. Processing system and

Means for Solving the Problems

[0006] In order to solve the above-described problems and achieve the object, the present invention Processing system includes a mounting table on which a first cassette is mounted, a transfer arm for unloading and loading a wafer with respect to the first cassette installed on the mounting table, an imaging unit for imaging the wafer unloaded from the first cassette, and a memory for recording the imaged image. A control unit that detects scratches, foreign matter, or cracks on a wafer based on an image of the wafer recorded by the memory, ​​​ A transport unit includes an imaging device, a second cassette for containing wafers imaged by the imaging unit, and a lifting unit for moving the second cassette between the inside of the imaging device and a vehicle body containing the second cassette; a transfer area formed above where the transport unit containing the second cassette is positioned; an opening formed in the transfer area through which the second cassette passes; and a landing area where the second cassette, having descended into the inside of the imaging device, lands; the wafers discharged from the first cassette and imaged by the imaging unit of the imaging device are transferred to the second cassette which has landed on the landing area after imaging; the second cassette is then housed in the vehicle body by the lifting unit of the transport unit and transported by the transport unit to any processing device, the processing device being a cutting device, grinding device, laser processing device, plasma irradiation device, protective member attachment device, ultraviolet irradiation device, or cleaning device. is characterized by the fact.

[0007] The transport unit transports the second cassette containing wafers processed by any processing device to the transfer area, the lifting unit lowers the second cassette from the transport unit to the landing area, the imaging unit images the wafers discharged from the second cassette that have landed on the landing area, and the wafers imaged by the imaging unit are placed in the first cassette. It may also be.

[0008] The processing system of the present invention includes a transport unit comprising: a second cassette for housing wafers; a lifting unit for moving the second cassette between the inside of an imaging device and a vehicle body housing the second cassette; a transfer area formed above where the transport unit housing the second cassette is positioned; an opening formed in the transfer area through which the second cassette passes; a landing section where the second cassette, having descended into the inside of the imaging device, lands; a transport arm for unloading and loading wafers into and out of the second cassette that has landed on the landing section; an imaging unit for imaging the wafer unloaded from the second cassette; and a memory for recording the captured image. The imaging device comprises an imaging device equipped with a control unit that detects scratches, foreign matter adhesion, or cracks on a wafer based on an image of the wafer recorded in the memory, and a mounting table on which a first cassette is placed, wherein the wafer is contained in the second cassette and transported from any processing device to the transfer area by the transport unit, the wafer is unloaded from the second cassette and imaged by the imaging unit of the imaging device, and after imaging is placed in the first cassette on the mounting table and transferred, and the processing device is a cutting device, grinding device, laser processing device, plasma irradiation device, protective member attachment device, ultraviolet irradiation device, or cleaning device.

[0009] This invention The imaging device A mounting platform on which a first cassette is placed, a transport arm that unloads a wafer from the first cassette placed on the mounting platform, and an image capture of the wafer unloaded from the first cassette and before processing. imaging unit and, imaging A memory that records the processed image, and the pre-processed image recorded in the memory. wafer A control unit that detects scratches, foreign matter, or cracks on the wafer before processing based on the image, and a cassette having a different external shape from the first cassette a second cassette for doing The landing area on which it will be placed, is provided with The first cassette is ejected and the image is captured by the imaging unit. wafer The landing area was placed on the landing surface. accommodated in the second cassette <schema: It is characterized by the process of transferring and then moving. The imaging device of the present invention includes a landing section on which a second cassette is placed, and a landing section that is installed on the second cassette. a transfer arm for taking out the wafer, and an imaging unit for imaging the wafer taken out from the second 2 cassette, and a memory for recording the imaged image And after processing is provided with A control unit that detects scratches, foreign matter, or cracks on the processed wafer based on an image of the processed wafer recorded in the memory, and a mounting table on which a first cassette having a different external shape from the second cassette is placed. is provided with The method is characterized by transferring wafers that have been removed from the second cassette and imaged by the imaging unit into the first cassette placed on the mounting table.

[0010] The transport arm The first cassette The unprocessed wafer, which has been unloaded, is imaged by the imaging unit, and after imaging, the transport arm is placed on the landing section to which the wafer is transported to the processing unit that processes the wafer. the second cassette Before processing accommodates the wafer Transfer It may also be. The processed wafer, which has been transported from the processing unit that processes the wafer and discharged from the second cassette, may be imaged by an imaging unit, and after imaging, the transport arm may transfer the processed wafer to the first cassette.

[0011] With the transport arm holding the wafer the imaging unit so wafer of imaging death It may also be.

[0012] Applicable imaging unit It has at least a camera, which is the first cassette placed on the mounting base. wafer It is positioned to capture images of an area adjacent to the opening through which the item is loaded or unloaded. It may also be. The camera may have an imaging field of view that covers the entire surface of the front or back surface of the wafer, and may capture the entire surface of the front or back surface of the wafer in a single image, and record the captured image in the memory.

Advantages of the Invention

[0013] The present invention can image the state of the wafer accommodated in the cassette.

Brief Description of the Drawings

[0014] [Figure 1] FIG. 1 is a perspective view showing a configuration example of a processing apparatus including an imaging apparatus according to Embodiment 1. [Figure 2] FIG. 2 is a cross-sectional view showing a processing apparatus including the imaging apparatus of FIG. 1. [Figure 3] FIG. 3 is a cross-sectional view showing another state of the processing apparatus including the imaging apparatus of FIG. 1. [Figure 4] FIG. 4 is a cross-sectional view showing a transport arm of the imaging apparatus of FIG. 1. [Figure 5] FIG. 5 is a diagram showing an example of an image captured by an imaging unit of the imaging apparatus of FIG. 1. [Figure 6] FIG. 6 is a perspective view showing a configuration example of a part of a processing system including an imaging apparatus according to Embodiment 2. [Figure 7] FIG. 7 is a perspective view showing a configuration example of another part of a processing system including an imaging apparatus according to Embodiment 2. [Figure 8] FIG. 8 is a cross-sectional view showing a transfer apparatus including the imaging apparatus of FIG. 6. [Figure 9] FIG. 9 is a cross-sectional view showing another state of the transfer apparatus including the imaging apparatus of FIG. 6. [Figure 10] FIG. 10 is a perspective view showing a configuration example of a transport unit of the processing system of FIG. 6. [Figure 11] FIG. 11 is a perspective view showing a configuration example of a transport unit of the processing system of FIG. 6. [Figure 12] FIG. 12 is a top view showing a configuration example of a lifting unit of the transport unit of FIG. 10. [Figure 13] FIG. 13 is a cross-sectional view showing the lifting unit of FIG. 12. [Figure 14] FIG. 14 is an enlarged top view showing a part of the lifting unit of FIG. 12 enlarged. [Figure 15] FIG. 15 is an enlarged cross-sectional view showing a part of the lifting unit of FIG. 13 enlarged. DETAILED DESCRIPTION OF THE INVENTION

[0015] Embodiments for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by those skilled in the art, and those that are substantially the same. In addition, the components described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the components can be made without departing from the spirit of the present invention.

[0016] [Embodiment 1] An imaging device 1 according to Embodiment 1 of the present invention will be described based on the drawings. Figure 1 is a perspective view showing an example configuration of a processing device 100 including the imaging device 1 according to Embodiment 1. Figure 2 is a cross-sectional view showing the processing device 100 including the imaging device 1 of Figure 1. Figure 3 is a cross-sectional view showing another state of the processing device 100 including the imaging device 1 of Figure 1. As shown in Figures 1, 2, and 3, the imaging device 1 comprises a mounting table 10, a transport arm 20, an imaging unit 30, and a control unit 40. In Embodiment 1, the imaging device 1 is incorporated into the processing device 100. As shown in Figures 1, 2, and 3, the processing device 100 includes a processing unit 101 in addition to the components of the imaging device 1. Note that the processing device 100 may not include the processing unit 101 and may only include the components of the imaging device 1.

[0017] This section describes the wafer 200, which is the imaging target and transport target of the imaging device 1 according to Embodiment 1, and also the processing target of the processing device 100. As shown in Figure 1, the wafer 200 is a disc-shaped semiconductor wafer or optical device wafer made of silicon, sapphire, silicon carbide (SiC), gallium arsenide, glass, etc. On the flat surface 201 of the wafer 200, chip-shaped devices are formed in regions demarcated by a plurality of intersecting (orthogonal in Embodiment 1) division lines. However, the present invention is not limited to the wafer 200, and devices may not be formed on the wafer 200. In Embodiment 1, the wafer 200 has an adhesive tape 205, such as an expanded sheet, attached to its back surface 202, and an annular frame 206 attached to the outer edge of the adhesive tape 205. However, the present invention is not limited to this, and the adhesive tape 205 may be attached to the front surface 201 and the annular frame 206 may be attached, or the annular frame 206 may not be attached, or the adhesive tape 205 may not be attached at all.

[0018] Furthermore, the objects to be imaged and transported by the imaging device 1, and the objects to be processed by the processing device 100, are not limited to wafers 200, but may also be rectangular package substrates having multiple resin-sealed devices, ceramic plates, glass plates, etc. In addition, the objects to be imaged and transported by the imaging device 1 may also be consumables used for processing wafers 200, such as cutting blades, grinding wheels, and adhesive tapes, or consumables used for maintenance of the processing unit 101 of the processing device 100, such as dresser boards and silicone sharpening pieces.

[0019] The processing apparatus 100 is provided with an outer cover 102 that covers the top of the transport arm 20, the imaging unit 30, and the processing unit 101. The mounting table 10 is provided on the outside of the outer cover 102 of the processing apparatus 100, adjacent to a predetermined side of the outer cover 102. The transport arm 20, the imaging unit 30, and the processing unit 101 are provided inside the outer cover 102. The mounting table 10 is separated from the transport arm 20, the imaging unit 30, and the processing unit 101 by the outer cover 102 in the Y-axis direction parallel to the horizontal direction as shown in Figures 1, 2, and 3.

[0020] The mounting table 10 is a mounting table on which a first cassette 50, which is a container for housing multiple or one wafer 200, is placed. In Embodiment 1, the first cassette 50 houses multiple wafers 200. The first cassette 50 is mounted with an opening 51 for loading and unloading wafers 200 facing the side of an outer cover 102 adjacent to the mounting table 10. The outer cover 102 has an opening 103 on the side adjacent to the mounting table 10. The processing device 100 loads and unloads wafers 200 through the openings 51 and 103 between the first cassette 50 mounted on the mounting table 10 and the space inside the outer cover 102, along the Y-axis direction in which the outer cover 102 separates the mounting table 10. The opening 103 is opened and closed by an opening / closing door 104.

[0021] As shown in Figures 2 and 3, the transport arm 20 includes a holding part 21, a rotating mechanism 22, a holding base 23, a first moving unit 24, and a second moving unit 25. In Embodiment 1, the holding part 21 holds the wafer 200 from the back surface 202 side. The holding part 21 can be switched between a state in which it holds the wafer 200 and a state in which it does not hold the wafer 200 and is released. In Embodiment 1, the holding part 21 is, for example, a holding pad that suction-holds the back surface 202 side of the wafer 200. The holding part 21 is not limited to this in the present invention, and the wafer 200 may be held by gripping the annular frame 206 attached to the wafer 200 with a clip or the like.

[0022] The rotating mechanism 22 is, for example, a rotary cylinder, with a holding part 21 attached to the tip of a rotating shaft along the Y-axis direction. By rotating the rotating shaft, the holding part 21 is rotated around its axis along the Y-axis direction. The rotating mechanism 22 rotates the wafer 200 between a state where the surface 201 of the wafer 200 held by the holding part 21, as shown in Figure 2, faces the imaging unit 30, and a state where the back surface 202 of the wafer 200 held by the holding part 21, as shown in Figure 3, faces the imaging unit 30, by rotating the holding part 21, which holds the wafer 200, by 180° around its axis along the Y-axis direction.

[0023] The holding base 23 holds the fixed end of the rotating mechanism 22, thereby allowing the holding portion 21 to rotate around its axis along the Y-axis via the rotating mechanism 22. The holding base 23 is supported by the first moving unit 24 so as to be movable along the Y-axis, and together with the first moving unit 24, is supported by the second moving unit 25 so as to be movable along the Z-axis parallel to the vertical.

[0024] Figure 4 is a cross-sectional view showing the transport arm 20 of the imaging device 1 in Figure 1. As shown in Figure 4, the first moving unit 24 comprises a pair of guide rails 24-1, a motor 24-2, an endless drive belt 24-3 such as a chain or belt, a fastener 24-4, and a pulley 24-5. The pair of guide rails 24-1 extend in the Y-axis direction and are formed parallel to each other, supporting the holder 23 so that it can move along the Y-axis direction. The motor 24-2 and pulley 24-5 are provided at both ends between the pair of guide rails 24-1, respectively, and the drive belt 24-3 is wound around them. The motor 24-2 rotates the wound drive belt 24-3 by rotational driving. The fastener 24-4 fixes the holder 23 to the drive belt 24-3. The pulley 24-5 rotatably supports the drive belt 24-3 at the end opposite to the motor 24-2. The first moving unit 24 rotates the drive belt 24-3 by rotating the motor 24-2, and moves the holding base 23, which is fixed to the drive belt 24-3 with fasteners 24-4, along a pair of guide rails 24-1 in the Y-axis direction. As the first moving unit 24 moves the holding base 23 along the Y-axis direction in this way, the holding part 21 supported by the holding base 23 also moves along the Y-axis direction.

[0025] As shown in Figure 4, the second moving unit 25 comprises a pair of guide rails 25-1, a motor 25-2, an endless drive belt 25-3 such as a chain or belt, a fastener 25-4, and a pulley 25-5. The pair of guide rails 25-1 extend in the Z-axis direction and are formed parallel to each other, supporting the first moving unit 24 so that it can move along the Z-axis direction. The motor 25-2 and pulley 25-5 are provided at both ends between the pair of guide rails 25-1, respectively, and the drive belt 25-3 is wound around them. The motor 25-2 rotates the wound drive belt 25-3 by rotational driving. The fastener 25-4 fixes the first moving unit 24 to the drive belt 25-3. The pulley 25-5 rotatably supports the drive belt 25-3 at the end opposite to the motor 25-2. The second moving unit 25 rotates the drive belt 25-3 by rotating the motor 25-2, and moves the first moving unit 24, which is fixed to the drive belt 25-3 with fasteners 25-4, along a pair of guide rails 25-1 in the Z-axis direction. As the second moving unit 25 moves the first moving unit 24 along the Z-axis direction in this way, the holding base 23, which is supported on the first moving unit 24 so as to be movable in the Y-axis direction, moves along the Z-axis direction, thereby moving the holding part 21 supported on the holding base 23 along the Z-axis direction.

[0026] The transport arm 20 moves the holding section 21 that holds the wafer 200 along the Y-axis and Z-axis directions using the first moving unit 24 and the second moving unit 25, respectively, to load and unload the wafer 200 to and from the first cassette 50 placed on the mounting table 10, and transports the wafer 200 between the first cassette 50, the support section 34 within the field of view of the camera 31 of the imaging unit 30, and the processing unit 101.

[0027] The transport arm 20 moves the holding portion 21 that holds the wafer 200 onto the panel illumination 32, which is within the field of view of the camera 31 of the imaging unit 30, using the first moving unit 24 and the second moving unit 25. The rotation mechanism 22 then orients the surface 201 of the wafer 200 opposite to the side held by the holding portion 21 downwards towards the camera 31, so that the surface 201 of the wafer 200 can be imaged by the camera 31 of the imaging unit 30, as shown in Figure 2. When imaging the surface 201, the transport arm 20 may either continue to hold the back surface 202 of the wafer 200 with the holding portion 21, or it may leave the back surface 202 of the wafer 200 on the support portion 34 without holding it with the holding portion 21. Furthermore, the transport arm 20 moves the holding portion 21 that holds the wafer 200 onto the panel illumination 32, which is within the field of view of the camera 31 of the imaging unit 30, using the first moving unit 24 and the second moving unit 25. Then, using the rotation mechanism 22, the back surface 202 of the wafer 200 held by the holding portion 21 is turned downwards towards the camera 31, and the wafer 200 is placed on the support portion 34. The transport arm 20 is then moved away from between the panel illumination 32 and the wafer 200, thereby enabling the camera 31 of the imaging unit 30 to image the back surface 202 of the wafer 200, as shown in Figure 3.

[0028] As shown in Figures 1, 2, and 3, the imaging unit 30 includes a camera 31, a panel light 32, and a plurality of support parts 34. In Embodiment 1, the camera 31 is installed below the area adjacent to the opening 103 through which the wafer 200 is loaded and unloaded, with its imaging direction oriented vertically upward. Therefore, it is possible to image the wafer 200 immediately after it has been unloaded from the first cassette 50 through the opening 103 by the transport arm 20, and the wafer 200 immediately before it is loaded into the first cassette 50 through the opening 103 by the transport arm 20.

[0029] Camera 31 is equipped with an image sensor that images the front surface 201 or back surface 202 of the wafer 200. The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. Camera 31 can image the front surface 201 or back surface 202 of the wafer 200 positioned within the imaging field by passing through the panel illumination 32 and the adhesive tape 205. Camera 31 images the front surface 201 or back surface 202 of the wafer 200 to acquire an image 300 (see Figure 5) of the wafer 200, outputs it to the control unit 40, and records it in the memory 41. In Embodiment 1, Camera 31 has an imaging field that covers the entire surface 201 or back surface 202 of the wafer 200, and can acquire an image 300 that captures the entire surface 201 or back surface 202 of the wafer 200 in a single imaging. The camera 31 is not limited to this in the present invention, and may acquire an image 300 of the entire surface 201 or back surface 202 of the wafer 200 by dividing it into multiple images acquired by multiple imaging attempts.

[0030] The panel illumination 32 is installed above the camera 31, in the same direction as the camera's shooting direction, with its illumination direction facing the same direction as the camera 31's shooting direction. The panel illumination 32 is disc-shaped and larger than the camera 31's field of view, and illuminates the front surface 201 or back surface 202 of the wafer 200 imaged by the camera 31. The panel illumination 32 is not limited to disc shape; it can be rectangular or any other shape as long as it can illuminate the wafer 200. For example, the panel illumination 32 has a light source such as a large number of LED (Light Emitting Diode) elements on its outer circumference, and by covering it with a diffuser plate, it can illuminate the entire wafer 200, and is made of a material that can be transmitted when the camera 31 takes an image. In this invention, the illumination of the imaging unit 30 is not limited to surface-emitting illumination such as the panel illumination 32, but may also be coaxial incident illumination installed coaxially with the image sensor, ring illumination, bar-shaped illumination, etc., and multiple types may be combined depending on the wafer 200 to be imaged.

[0031] Multiple support parts 34 are erected on the outer periphery of the panel lighting 32. The multiple support parts 34 are provided at equal intervals in the circumferential direction on the outer periphery of the upper surface of the panel lighting 32, and support the outer periphery of the wafer 200 that is transported and placed by the transport arm 20 from below. In Embodiment 1, the multiple support parts 34 support the annular frame 206 mounted on the wafer 200 from below. The heights of the multiple support parts 34 are uniform, and are such that when the wafer 200 is placed on the support parts 34, the holding part 21 and the rotation mechanism 22 of the transport arm 20 can pass horizontally between the panel lighting 32 and the wafer 200. In the example shown in Figures 1, 2 and 3, four support parts 34 are provided, but the present invention is not limited to this, and any three or more capable of supporting the wafer 200 are sufficient. Alternatively, the support portion 34 may have a structure in which a plate-like object larger than the wafer 200 and an opening formed in the center of the plate-like object that is slightly smaller than the shape of the wafer 200, and the edge of the opening supports the outer circumference of the wafer 200.

[0032] Figure 5 shows an example of an image 300 captured by the imaging unit 30 of the imaging device 1 shown in Figure 1. As shown in Figure 5, the entire surface 201 of the wafer 200 is captured in this example of image 300. In addition, a portion of the adhesive tape 205 and the annular frame 206 on the outer periphery of the wafer 200 are captured in this example of image 300. Furthermore, scratches 211 and attached foreign matter 212 are captured on the surface 201 of the wafer 200. Thus, if scratches 211 or foreign matter 212 are attached to the surface 201 of the wafer 200, the imaging unit 30 can acquire an image 300 capturing scratches 211 and foreign matter 212 on the surface 201 of the wafer 200. In addition to scratches 211 and foreign matter 212, the imaging unit 30 can also capture cracks that have occurred in the wafer 200.

[0033] The processing unit 101 processes the wafer 200. In Embodiment 1, the processing unit 101 may include, for example, a cutting unit equipped with a spindle on which a cutting blade is rotatably mounted and which cuts the wafer 200 with the cutting blade; a grinding unit equipped with a spindle on which a grinding wheel on which a grinding wheel is arranged is rotatably mounted and which grinds the wafer 200 with the grinding wheel; a laser beam irradiation unit equipped with a laser beam irradiator that irradiates the wafer 200 with a laser beam and which performs laser processing or inspection of the wafer 200 with a laser beam; a plasma processing unit that irradiates the wafer 200 with plasma for processing; an attachment unit equipped with an ultraviolet irradiator that irradiates the wafer 200 with ultraviolet light and which performs ultraviolet irradiation of the wafer 200; a cleaning unit equipped with a nozzle that supplies cleaning liquid or cleaning gas to the wafer 200 and which cleans the wafer 200; or an inspection unit that inspects the wafer 200.

[0034] The control unit 40 controls the operation of each component of the imaging device 1 to cause the imaging device 1 to unload and load the wafer 200 and to image the wafer 200. The control unit 40 includes a memory 41 that records images 300 of the front surface 201 or back surface 202 of the wafer 200 captured by the camera 31. In Embodiment 1, the control unit 40 further controls the operation of each component of the processing unit 101 to cause the processing unit 101 to perform processing operations on the wafer 200, but the present invention is not limited to this, and the control unit of the imaging device 1 and the control unit of the processing unit 101 may be provided separately.

[0035] Furthermore, the memory 41 stores an image of the wafer 200 that is free from scratches 211, foreign matter 212, cracks, etc., as a reference image to be used when inspecting for scratches 211, foreign matter 212, cracks, etc. The control unit 40 performs image processing such as pattern matching between the reference image stored in the memory 41 and the image 300 captured by the camera 31, and detects the parts that are detected as differences between the two as scratches 211, foreign matter 212, cracks, etc. captured in the image 300.

[0036] In Embodiment 1, the control unit 40 includes a computer system. The computer system included in the control unit 40 is a computer having an arithmetic processing unit with a microprocessor such as a CPU (Central Processing Unit), a storage device with memory such as ROM (Read Only Memory) or RAM (Random Access Memory), and an input / output interface device. The arithmetic processing unit of the control unit 40 performs arithmetic processing according to the computer program stored in the storage device of the control unit 40 and outputs control signals for controlling the imaging device 1 and the processing unit 101 to each component of the imaging device 1 and the processing unit 101 via the input / output interface device of the control unit 40. The function of memory 41 is realized by the storage device of the computer system of the control unit 40.

[0037] An example of the operation process of the processing unit 100 incorporating the imaging device 1 of Embodiment 1 will be described. Under the control of the control unit 40, the imaging device 1 and processing unit 100 operate as follows: After the opening door 104 opens the opening 103, the transport arm 20 transports the unprocessed wafer 200 from the first cassette 50 placed on the mounting table 10 through the opening 103, with the surface 201 facing the camera 31, the imaging unit 30 images the surface 201 of the wafer 200, and the memory 41 records the image 300 of the surface 201 of the unprocessed wafer 200 captured by the imaging unit 30. The transport arm 20 then holds the wafer 200 again and places it on the multiple support units 34 with the back surface 202 facing the camera 31, the imaging unit 30 images the back surface 202 of the wafer 200, and the memory 41 records the image 300 of the back surface 202 of the unprocessed wafer 200 captured by the imaging unit 30.

[0038] Then, the imaging device 1 and the processing device 100 use a transport arm 20 to transport the wafer 200, which has been imaged by the imaging unit 30, to the processing unit 101. The processing device 100 uses the processing unit 101 to process the wafer 200 that has been transported to the processing unit 101 after image capture. After processing by the processing unit 101, the transport arm 20 transports the processed wafer 200 from the processing unit 101 to above the imaging unit 30, and the imaging unit 30 images the front surface 201 and back surface 202 of the processed wafer 200 in the same manner as before processing. The memory 41 records the images 300 of the front surface 201 and back surface 202 of the processed wafer 200 that were imaged by the imaging unit 30, and the transport arm 20 loads the processed and imaged wafer 200 into the first cassette 50 placed on the mounting table 10. In this manner, the wafer 200, which has been imaged by the imaging unit 30 and processed by the processing unit 101, is returned to the first cassette 50 by the transport arm 20.

[0039] Subsequently, the control unit 40 of the imaging device 1 performs image processing such as pattern matching between the images 300 of the front surface 201 and back surface 202 of the wafer 200 before and after processing, which are recorded in the memory 41 and captured by the imaging unit 30, and a reference image stored in the memory 41. The control unit 40 then detects the differences between the two as scratches 211, foreign matter 212, cracks, etc., that are captured in the image 300. The operator of the imaging device 1 retrieves the detection results of scratches 211, foreign matter 212, cracks, etc. detected by the control unit 40, and recognizes that scratches 211, foreign matter 212, cracks, etc. detected in both the pre-processing and post-processing images 300 are highly likely to have already existed in the wafer 200 in the state of being contained in the first cassette 50, and scratches 211, foreign matter 212, cracks, etc. detected only in the post-processing image 300 and not in the pre-processing image 300 of the wafer 200 are highly likely to have been caused by processing by the processing unit 101.

[0040] The imaging device 1 according to Embodiment 1, having the configuration described above, captures an image 300 of the wafer 200 immediately after it has been unloaded from the first cassette 50 placed on the mounting table 10 by the transport arm 20, and before processing by the processing unit 101 (processing device 100), using the imaging unit 30. This provides the effect of being able to capture the state of the wafer 200 as it is contained in the first cassette 50.

[0041] Furthermore, the imaging device 1 according to Embodiment 1 returns the wafer 200, which has been imaged by the imaging unit 30, to the first cassette 50 placed on the mounting table 10 by the transport arm 20. Therefore, if processing is performed between the time the wafer 200 is removed from the first cassette 50 and the time it is brought back in, the imaging device 1 according to Embodiment 1 can capture images 300 of the wafer 200 before and after processing, and has the effect of making it possible to compare the state of the wafer 200 before and after processing. As a result, the imaging device 1 according to Embodiment 1 has the effect of making it possible for the operator to easily determine whether scratches 211, foreign matter 212, cracks, etc. occur on the wafer 200, whether they were already present when it was stored in the first cassette 50 or whether the cause lies in the processing unit 101 (processing device 100), thereby facilitating the investigation of the cause of scratches 211, foreign matter 212, cracks, etc.

[0042] Furthermore, the imaging device 1 according to Embodiment 1 may also be installed as an imaging device independent of any processing device equipped with a processing unit 101, without having a processing unit 101. In that case, the imaging device 1 removes the wafer 200 from the first cassette 50, images it with the imaging unit 30, and then returns the wafer 200 to the first cassette 50. The wafer 200 imaged by the imaging device 1 is then processed by any processing device, but the image recorded by the imaging device 1 allows the operator to check the condition of the wafer 200 before processing by the processing device. As a result, the imaging device 1 according to Embodiment 1 has the effect of allowing the operator to easily investigate whether or not scratches 211, foreign matter 212, cracks, etc. have occurred on the wafer 200 before processing it with the processing device.

[0043] [Embodiment 2] An imaging device 1-2 according to Embodiment 2 of the present invention will be described based on the drawings. Figure 6 is a perspective view showing a partial configuration example of a processing system 100-2 including the imaging device 1-2 according to Embodiment 2. Figure 7 is a perspective view showing another partial configuration example of the processing system 100-2 including the imaging device 1-2 according to Embodiment 2. Figure 8 is a cross-sectional view showing a transfer device 110 including the imaging device 1-2 of Figure 6. Figure 9 is a cross-sectional view showing another state of the transfer device 110 including the imaging device 1-2 of Figure 6. Figure 10 is a perspective view showing a configuration example of the transport unit 130 of the processing system 100-2 of Figure 6. Figure 11 is a perspective view showing a configuration example of the transport unit 130 of the processing system 100-2 of Figure 6. Figure 12 is a top view showing a configuration example of the lifting unit 134 of the transport unit 130 of Figure 10. Figure 13 is a cross-sectional view showing the lifting unit 134 of Figure 12. Figure 14 is an enlarged top view showing a part of the lifting unit 134 of Figure 12. Figure 15 is an enlarged cross-sectional view of a portion of the lifting unit 134 in Figure 13. Figure 15 is an enlarged cross-sectional view of XV in Figure 13. Figures 6 to 15 use the same reference numerals as in Embodiment 1, and their descriptions are omitted.

[0044] The imaging device 1-2 according to Embodiment 2 is incorporated into the transfer device 110 of the processing system 100-2 shown in Figures 6 and 7. As shown in Figures 6 and 7, the processing system 100-2 comprises at least one transfer device 110, a transport passage 120, a transport unit 130, a control unit 140, and one or more processing devices 150. In Embodiment 2, the processing system 100-2 includes multiple transport units 130 (two in the example shown in Figures 6 and 7), but the present invention is not limited to this, and may include one, or of course, three or more. Note that, as appropriate, some components are omitted from the drawings, or some components are shown simply by their outlines, etc.

[0045] As shown in Figures 6, 8, and 9, the imaging device 1-2 according to Embodiment 2 includes, in addition to the same mounting base 10, transport arm 20, imaging unit 30, and control unit 40 as the imaging device 1 according to Embodiment 1, a housing 111, an opening 111-2 formed in the ceiling 111-1 of the housing 111, a landing section 112 disposed inside the housing 111, a second cassette 133 for housing wafers 200, a lifting unit 134 for moving the second cassette 133 up and down, a transfer area 124 where a transport unit 130 housing the second cassette 133 is positioned, and an opening 125 formed in the transfer area 124. The housing 111, opening 111-2, and landing section 112 are components of the transfer device 110. The second cassette 133 and lifting unit 134 are components of the transport unit 130. The transfer area 124 and the opening 125 are included in the components of the transport passage 120. In this invention, the interior of the imaging device 1-2 refers to the interior of the housing 111 of the transfer device 110.

[0046] The processing system 100-2, for example, transfers the wafers 200 contained in the first cassette 50 to the second cassette 133 using the transfer device 110, transports the second cassette 133 to each processing device 150 using the transport unit 130, processes the transported wafers 200 in each processing device 150 and returns them to the second cassette 133, transports the second cassette 133 containing the processed wafers 200 to the transfer device 110 using the transport unit 130, and transfers the processed wafers 200 from the second cassette 133 to the first cassette 50 using the transfer device 110. The imaging device 1-2, incorporated into the transfer device 110 of the processing system 100-2, images the front surface 201 and back surface 202 of the wafer 200 being transferred between the first cassette 50 and the second cassette 133 inside the transfer device 110, i.e., inside the housing 111.

[0047] As shown in Figures 6 and 8, the transfer device 110 includes, in addition to the mounting table 10, transport arm 20, imaging unit 30, and control unit 40 similar to those of the imaging device 1 and processing device 100 according to Embodiment 1, a housing 111, an opening 111-2, a landing section 112, a receiver 117, and a transmitter 118. The housing 111 covers the transport arm 20 and imaging unit 30 from above, similar to the outer cover 102 of Embodiment 1. The mounting table 10 is provided on the outside of the housing 111, adjacent to a predetermined side of the housing 111. The transport arm 20 and imaging unit 30 are provided on the inside of the housing 111. The mounting table 10 is separated from the transport arm 20 and imaging unit 30 by the housing 111 in the Y-axis direction parallel to the horizontal direction in Figures 6, 8, and 9.

[0048] In Embodiment 2, the first cassette 50 is placed on the mounting table 10 with an opening 51 for loading and unloading wafers 200 facing the side of the housing 111 adjacent to the mounting table 10. The housing 111 has an opening 111-3 on the side adjacent to the mounting table 10. The transfer device 110 loads and unloads wafers 200 between the first cassette 50 placed on the mounting table 10 and the space inside the housing 111 through openings 51 and 111-3, along the Y-axis direction in which the housing 111 separates the mounting table 10. Opening 111-3 is opened and closed by an opening / closing door 114.

[0049] Furthermore, as shown in Figures 6, 8, and 9, the housing 111 has an opening 111-2 formed in the ceiling 111-1 above the housing 111, which is sized and shaped to allow the second cassette 133, which is transported by the transport unit 130 and contains the wafer 200, to pass through. The landing section 112 is located inside the housing 111, at a position higher than the opening 111-3 and directly below the opening 111-2. The landing section 112 receives the second cassette 133, which has been lowered by the lifting unit 134 that moves the second cassette 133 up and down, passing through the opening 125 formed in the transfer area 124 of the transport passage 120 and the opening 111-2 of the housing 111. The landing section 112 supports the landed second cassette 133 upwards on its upper surface.

[0050] In Embodiment 2, the transport arm 20 loads and unloads wafers 200 into and out of the first cassette 50 placed on the mounting table 10, and also loads and unloads wafers 200 into and out of the second cassette 133 that has landed on the landing section 112. The transport arm 20 transports wafers 200 between the first cassette 50 placed on the mounting table 10, the support section 34 within the field of view of the camera 31 of the imaging unit 30, and the second cassette 133 that has landed on the landing section 112. The transport arm 20 transfers wafers 200 from the first cassette 50 to the second cassette 133 by unloading wafers 200 from the first cassette 50 placed on the mounting table 10 and loading wafers 200 into the second cassette 133 that has landed on the landing section 112. Furthermore, the transport arm 20 transfers the wafer 200 from the second cassette 133 to the first cassette 50 by unloading the wafer 200 from the second cassette 133, which has landed on the landing section 112, and loading the wafer 200 into the first cassette 50, which is placed on the mounting table 10.

[0051] In Embodiment 2, similar to Embodiment 1, the transport arm 20 faces downwards toward the camera 31, thereby enabling the camera 31 to image the surface 201 of the wafer 200, as shown in Figure 8. The back surface 202 is then faced downwards toward the camera 31, and the wafer 200 is placed on the support 34. The transport arm 20 is then retracted from between the panel illumination 32 and the wafer 200, thereby enabling the camera 31 to image the back surface 202 of the wafer 200, as shown in Figure 9.

[0052] The receiver 117 is connected to the control unit 140 of the processing system 100-2 so as to be able to communicate with information, receives information transmitted from the control unit 140, and outputs the received information to the control unit 40. In Embodiment 2, the receiver 117 is connected to the control unit 140 so as to be able to communicate with information wirelessly, but the present invention is not limited to this, and may be connected to the control unit 140 so as to be able to communicate with information via a wire. The information that the receiver 117 receives from the control unit 140 is, in Embodiment 2, for example, command information for operations related to the transfer process of the transfer device 110 and the imaging process of the imaging device 1-2, and request information prompting the transmission of the transfer processing status of the transfer device 110 and the imaging processing status of the imaging device 1-2, including the status of the wafer 200 inside the transfer device 110 (inside the imaging device 1-2).

[0053] The transmitter 118 is connected to the control unit 140 so as to be able to communicate information, and transmits information output from the control unit 40 to the control unit 140. In Embodiment 2, the transmitter 118 is connected to the control unit 140 so as to be able to communicate information wirelessly, but the present invention is not limited to this, and may be connected to the control unit 140 so as to be able to communicate information via a wire. In Embodiment 2, the information that the transmitter 118 transmits to the control unit 140 is, for example, the transfer processing status of the transfer device 110 and the imaging processing status of the imaging device 1-2.

[0054] In Embodiment 2, the control unit 40 controls the operation of each component of the transfer device 110 to cause the transfer device 110 to perform the operations of loading, loading, and transferring the wafer 200, and also controls the operation of each component of the imaging device 1-2 to cause the imaging device 1-2 to perform the operation of imaging the wafer 200 during loading, loading, and transfer. The control unit 40 acquires information received by the receiver 117 from the control unit 140 and outputs information to the transmitter 118 to send to the control unit 140. The control unit 40 causes the imaging device 1-2 and the transfer device 110 to perform operations according to the command information received by the receiver 117 from the control unit 140. The control unit 40 causes the imaging device 1-2 and the transfer device 110 to send information about the imaging processing status of the imaging device 1-2 and the transfer processing status of the transfer device 110 from the transmitter 118 to the control unit 140 according to the request information received by the receiver 117 from the control unit 140. Even if the control unit 40 has not received request information from the control unit 140, it can also voluntarily cause the transmitter 118 to send information about the imaging processing status of the imaging device 1-2 and the transfer processing status of the transfer device 110 to the control unit 140.

[0055] As shown in Figures 6 and 7, the transport passage 120 comprises a passage section 121, a waiting section 122, a guide section 123, and transfer areas 124 and 126. The passage section 121 is arranged across the housing 111 of the transfer device 110 and the housings 151 of one or more processing units 150. The waiting section 122 is arranged above the housing 111 of the transfer device 110 and adjacent to the passage section 121, with one waiting section for each processing unit 150 located above its housing 151 and adjacent to the passage section 121.

[0056] The guide sections 123 are positioned at both ends in the width direction of the passage section 121, the waiting section 122, and the transfer areas 124 and 126. The guide sections 123 are formed to be higher than the wheels 132 of the transport unit 130, thereby preventing the transport unit 130 from going over the guide sections 123 and falling out of the passage section 121, the waiting section 122, and the transfer areas 124 and 126.

[0057] As shown in Figure 6, the transfer area 124 is located beyond the waiting section 122, which is arranged on the transfer device 110. In the transfer area 124, an opening 125 is formed directly above the opening 111-2 formed in the ceiling 111-1 of the housing 111. This opening is of a size and shape that prevents the vehicle body 131 of the transport unit 130 from passing through, while allowing the second cassette 133 transported by the transport unit 130 to pass through.

[0058] The transfer area 126 is located beyond the standby unit 122, which is positioned on the processing unit 150. In the transfer area 126, an opening 127 is formed directly above the opening 151-2 formed in the ceiling 151-1 of the housing 151. This opening is of a size and shape that prevents the vehicle body 131 of the transport unit 130 from passing through, while allowing the second cassette 133 transported by the transport unit 130 to pass through.

[0059] As shown in Figures 10 and 11, the transport unit 130 comprises a body 131, wheels 132, a second cassette 133, a lifting unit 134, a receiver 135, a transmitter 136, and a control unit 137. In Embodiment 2, the transport unit 130 is an Automated Guided Vehicle (AGV). The body 131 is rectangular in shape and has a recess that is open to the bottom and capable of accommodating the second cassette 133.

[0060] Multiple wheels 132 (two in the example shown in Figures 10 and 11) are mounted on each of two pairs of parallel sides of the vehicle body 131, and are rotatable independently of each other around an axis perpendicular to the pair of sides. The outer surfaces of the wheels 132 contact the passage section 121, waiting section 122, or transfer areas 124, 126 of the transport passage 120. Each wheel 132 is connected to a motor or the like (not shown), and rotational motion around the axis is applied by the motor or the like, causing it to travel on the passage section 121, waiting section 122, or transfer areas 124, 126 of the transport passage 120. In Embodiment 2, for example, Mecanum wheels are used, in which multiple inclined barrel-shaped (cylindrical) rotating bodies are attached to the outer surface.

[0061] The second cassette 133 is rectangular in shape and accommodates multiple wafers 200 or one wafer (one wafer in the example shown in Figures 10 and 11). The second cassette 133 has openings 133-1 formed on a pair of parallel sides, which are of a size and shape that allows the wafer 200 to pass through. The wafer 200 is removed from the second cassette 133 through the openings 133-1 and then placed back into the second cassette 133 through the openings 133-1. In this way, the second cassette 133 accommodates the wafer 200 by covering all sides, including the top and bottom, except for the openings 133-1 through which the wafer is loaded and unloaded. However, the present invention is not limited to this, and for example, a tray that accommodates a single wafer 200 placed with the top open may also be used.

[0062] The lifting unit 134 is installed from inside the vehicle body 131 to the second cassette 133 and is connected to the second cassette 133, and moves the second cassette 133 up and down. When the transport unit 130 is positioned in the transfer area 124, the lifting unit 134 moves up and down through the opening 125 of the transport passage 120 and the opening 111-2 of the housing 111, between its position in the recess of the vehicle body 131 and its position when it lands on the landing section 112 located inside the housing 111 of the transfer device 110 (see Figures 6, 8 and 11). When the transport unit 130 is positioned in the transfer area 126, the lifting unit 134 moves up and down through the opening 127 of the transport passage 120 and the opening 151-2 of the housing 151, between its position in the recess of the vehicle body 131 and its position on the landing section 152 located inside the housing 151 of the processing device 150 (see Figure 7).

[0063] As shown in Figures 12 to 15, the lifting unit 134 comprises a rotating shaft 161, two rollers 162-1 and 162-2, a reel 163, a first belt 164, a second belt 165, a fixing member 166, a motor 167, a pulley 168, and a drive belt 169. The rotating shaft 161 and the two rollers 162-1 and 162-2 are both located inside the vehicle body 131 in an area above the recess of the vehicle body 131. As shown in Figures 12 and 13, the rotating shaft 161 and the two rollers 162-1 and 162-2 are arranged parallel to each other in terms of their rotation axis directions. The rotating shaft 161 is located between the two rollers 162-1 and 162-2.

[0064] As shown in Figure 12, multiple cylindrical reels 163 are fixed to the rotating shaft 161. In the example shown in Figure 12, a pair (2) of reels 163 are fixed to both ends of the rotating shaft 161. As shown in Figure 12, one first belt 164 and one second belt 165 are fixed to each reel 163, and as shown in Figure 13, they are wound in the same direction.

[0065] Rollers 162-1 and 162-2 are both supported so as to be easily rotatable according to an externally applied force. Roller 162-1 supports the first belt 164 wound around the reel 163 on its outer surface. In the example shown in Figure 12, two first belts 164 are supported, one at each end of roller 162-1. Roller 162-2 supports the second belt 165 wound around the reel 163 on its outer surface. In the example shown in Figure 12, two second belts 165 are supported, one at each end of roller 162-2.

[0066] The first belt 164 has one end wound around the reel 163, with one portion above the position supported by the roller 162-1 held generally horizontally, the other portion hanging down below the position supported by the roller 162-1, and the other end fixed to a predetermined position on the upper surface of the second cassette 133. The second belt 165 has one end wound around the reel 163, with one portion above the position supported by the roller 162-2 held generally horizontally, the other portion hanging down below the position supported by the roller 162-2, and the other end fixed to a predetermined position on the upper surface of the second cassette 133 (see Figures 8 and 11, etc.).

[0067] As shown in Figure 15, a groove (recess) 163-1 is formed in a part of the outer circumference of the reel 163, along the rotation axis 161. The inner surface of the groove 163-1 is formed in a curved shape. Both ends of the groove 163-1 reach both ends of the reel 163 in the direction of the rotation axis. The first belt 164 and the second belt 165 are both positioned in the same direction with one end overlapping this groove 163-1.

[0068] As shown in Figure 15, the fixing member 166 is cylindrical and has a curved outer surface that corresponds to the shape of the inner surface of the groove 163-1. With one end of each of the first belt 164 and the second belt 165 overlapping and positioned in the same direction in the groove 163-1, the fixing member 166 is fitted into the groove 163-1 by pushing one end of these belts toward the inner surface of the groove 163-1. One fixing member 166 is fitted into each groove 163-1, i.e., one fixing member 166 is fitted into each reel 163. In this way, the fixing member 166, with its outer surface, clamps one end of each of the first belt 164 and the second belt 165 between itself and the inner surface of the groove 163-1, thereby fixing them to the reel 163.

[0069] As shown in Figure 14, a pair of protrusions (protrusions) 166-1 are provided on the outer circumference of the reel 163 so as to sandwich the individual first belts 164 and second belts 165 fixed to the reel 163 in the width direction. The pair of protrusions 166-1 function as guides to prevent misalignment of the individual first belts 164 and second belts 165 in the width direction. By rotating the reel 163 configured in this way, the individual first belts 164 and second belts 165 can be wound up or fed out.

[0070] In Embodiment 2, the motor 167 is positioned between the rotating shaft 161 and the roller 162-1. A pulley 168 is provided on the rotating shaft 167-1 of the motor 167. An endless drive belt 169, such as a belt or chain, is stretched between the pulley 168 and the rotating shaft 161. By driving the motor 167 to rotate the rotating shaft 167-1, rotational motion can be applied to the rotating shaft 161 via the pulley 168 and the drive belt 169.

[0071] The lifting unit 134 lowers the second cassette 133, to which the other ends of the two pairs of first belts 164 and second belts 165 are fixed to the upper surface, by rotating the rotating shaft 161 in a clockwise direction when the motor 167 rotates the rotating shaft 167-1 in a clockwise direction in Figure 13, thereby feeding out the two pairs of first belts 164 and second belts 165 from the reel 163 via rollers 162-1 and 162-2. On the other hand, the lifting unit 134 raises the second cassette 133, to which the other ends of the two pairs of first belts 164 and second belts 165 are fixed to the upper surface, by rotating the rotating shaft 161 in a counterclockwise direction when the motor 167 rotates the rotating shaft 167-1 in a counterclockwise direction in Figure 13, thereby winding up the two pairs of first belts 164 and second belts 165 on the reel 163.

[0072] The receiver 135 is connected to the control unit 140 for information communication, receives information transmitted from the control unit 140, and outputs the received information to the control unit 137. In Embodiment 2, the receiver 135 is connected to the control unit 140 wirelessly for information communication, but the present invention is not limited to this, and may be connected to the control unit 140 via a wired connection for information communication. In Embodiment 2, the information that the receiver 135 receives from the control unit 140 includes, for example, command information for operations related to the movement of the transport unit 130 and the raising and lowering of the second cassette 133, and request information prompting the transmission of the status of the transport unit 130, including the position of the transport unit 130 and the position of the second cassette 133.

[0073] The transmitter 136 is connected to the control unit 140 for information communication and transmits information output from the control unit 137 to the control unit 140. In Embodiment 2, the transmitter 136 is connected to the control unit 140 wirelessly for information communication, but the present invention is not limited to this, and the transmitter 136 may be connected to the control unit 140 via a wired connection for information communication. In Embodiment 2, the information that the transmitter 136 transmits to the control unit 140 is, for example, the status of the transport unit 130.

[0074] The control unit 137 controls the operation of each component of the transport unit 130 to cause the transport unit 130 to perform operations related to the movement of the transport unit 130 and the raising and lowering of the second cassette 133. The control unit 137 controls the movement of the transport unit 130 by controlling motors (not shown) connected to the wheels 132 and the angle of the wheels 132. The control unit 137 controls the raising and lowering movement of the second cassette 133 by controlling the motor 167 of the lifting unit 134. The control unit 137 acquires information received by the receiver 135 from the control unit 140 and outputs information to the transmitter 136 to send to the control unit 140. The control unit 137 causes the transport unit 130 to perform operations according to the command information received by the receiver 135 from the control unit 140. The control unit 137 causes the transmitter 136 to send information about the status of the transport unit 130 to the control unit 140 according to the request information received by the receiver 135 from the control unit 140. Even if the control unit 137 has not received request information from the control unit 140, it can also voluntarily cause the transmitter 136 to send information about the status of the transport unit 130 to the control unit 140.

[0075] In Embodiment 2, the control unit 137 includes a computer system similar to the control unit 40 in Embodiment 1. The arithmetic processing unit of the control unit 137 performs calculations according to a computer program stored in the storage device of the control unit 137 and outputs control signals for controlling the transport unit 130 to each component of the transport unit 130 via the input / output interface device of the control unit 137.

[0076] As shown in Figure 7, the processing unit 150 comprises a housing 151, a landing section 152, a transport section 153, a processing unit 154 that processes wafers 200 similarly to the processing unit 101, a receiver 157, a transmitter 158, and a control unit 159. The housing 151 covers the upper parts of each component of the processing unit 150, excluding the housing 151 itself. The housing 151 has an opening 151-2 formed in the ceiling 151-1 above it, which is sized and shaped to allow the second cassette 133 to pass through. The landing section 152 is located inside the housing 151, directly below the opening 151-2. The second cassette 133, which has descended through the opening 127 formed in the transfer area 126 of the transport passage 120 and the opening 151-2 of the housing 151, lands on the landing section 152 via the lifting unit 134. The landing section 152 supports the second cassette 133 that has landed on it, with its upper surface facing upward. The transport section 153 holds the wafer 200, similar to the holding section 21. The transport section 153 loads and unloads the wafer 200 to and from the second cassette 133 that has landed on the landing section 152, and transports the wafer 200 between the second cassette 133 that has landed on the landing section 152 and the processing unit 154.

[0077] The receiver 157 is connected to the control unit 140 so as to be able to communicate with it, receives information transmitted from the control unit 140, and outputs the received information to the control unit 159. In Embodiment 2, the receiver 157 is connected to the control unit 140 so as to be able to communicate with it wirelessly, but the present invention is not limited to this, and the receiver 157 may be connected to the control unit 140 so as to be able to communicate with it via a wired connection. In Embodiment 2, the information that the receiver 157 receives from the control unit 140 is, for example, command information for operations related to the processing of the processing device 150, and request information prompting the transmission of the processing status of the processing device 150, including the status of the wafer 200 inside the processing device 150.

[0078] The transmitter 158 is connected to the control unit 140 for information communication and transmits information output from the control unit 159 to the control unit 140. In Embodiment 2, the transmitter 158 is connected to the control unit 140 wirelessly for information communication, but the present invention is not limited to this, and may be connected to the control unit 140 via a wired connection for information communication. In Embodiment 2, the information that the transmitter 158 transmits to the control unit 140 is, for example, the processing status of the processing device 150.

[0079] In Embodiment 2, the control unit 159 controls the operation of each component of the processing unit 150 to cause the processing unit 150 to perform processing operations on the wafer 200. The control unit 159 acquires information received by the receiver 157 from the control unit 140 and outputs information to be sent to the control unit 140 to the transmitter 158. The control unit 159 causes the processing unit 150 to perform operations according to the command information received by the receiver 157 from the control unit 140. The control unit 159 causes the transmitter 158 to send information about the processing status of the processing unit 150 to the control unit 140 in response to the request information received by the receiver 157 from the control unit 140. The control unit 159 can also spontaneously send information about the processing status of the processing unit 150 to the control unit 140 from the transmitter 158 even if it has not received request information from the control unit 140.

[0080] In Embodiment 2, the control unit 159 includes a computer system similar to that of the control units 40 and 137. The arithmetic processing unit of the control unit 159 performs arithmetic processing according to the computer program stored in the storage device of the control unit 159 and outputs control signals for controlling the processing unit 150 to each component of the processing unit 150 via the input / output interface device of the control unit 159.

[0081] The control unit 140 is connected to the receiver 117 and transmitter 118 of the transfer device 110, the receiver 135 and transmitter 136 of the transport unit 130, and the receiver 157 and transmitter 158 of each processing unit 150 so as to be able to communicate with each other. By transmitting command information to the receivers 117, 135, and 157, the control unit 140 can remotely control and operate the transfer device 110, the transport unit 130, and each processing unit 150 via the control units 40, 137, and 159. In addition, the control unit 140 can receive and understand the status of the transfer device 110, the transport unit 130, and each processing unit 150 from the transmitters 118, 136, and 158. In this way, the control unit 140 can comprehensively control and operate the transfer device 110, the transport unit 130, and each processing unit 150, which are components of the processing system 100-2.

[0082] In Embodiment 2, the control unit 140 includes a computer system similar to that of the control units 40, 137, and 159. The arithmetic processing unit of the control unit 140 performs arithmetic processing according to a computer program stored in the storage device of the control unit 140 and outputs control signals for controlling the processing system 100-2 to each component of the processing system 100-2 via the input / output interface device of the control unit 140.

[0083] An example of the operation process of a processing system 100-2, which includes a transfer device 110 incorporating an imaging device 1-2 according to Embodiment 2, will be described. Under the control of the control unit 40, the imaging device 1-2 and the transfer device 110, after the opening door 114 opens the opening 111-3, the transport arm 20 unloads the wafer 200 from the first cassette 50 placed on the mounting table 10 through the opening 111-3, and the imaging unit 30 images the front surface 201 and back surface 202 of the processed wafer 200, respectively, in the same manner as in Embodiment 1. The memory 41 records the images 300 of the front surface 201 and back surface 202 of the wafer 200 immediately after being unloaded from the first cassette 50 (before processing) as captured by the imaging unit 30, and the transport arm 20 transports and loads the wafer 200 after imaging by the imaging unit 30 into the second cassette 133 which is landed on the landing section 112, and stores it in the second cassette 133. In this manner, in the imaging device 1-2 and the transfer device 110, the wafer 200 is unloaded from the first cassette 50 placed on the mounting table 10 and, after imaging by the imaging unit 30, is placed in the second cassette 133 which lands on the landing section 112.

[0084] After the wafer 200, captured by the imaging unit 30, is placed in the second cassette 133, the transport unit 130, under the control of the control unit 137, uses the lifting unit 134 to move the second cassette 133 upward from the landing section 112 in the imaging device 1-2 (transfer device 110) through the openings 111-2 and 125, and places it in the recess of the transport unit 130's body 131, which is positioned in the transfer area 124. In this way, the second cassette 133 is placed in the transport unit 130 by the lifting unit 134. Then, the transport unit 130 rotates its wheels 132 to travel along the transport passage 120, transporting the second cassette 133 housed in a recess in the vehicle body 131 from the transfer area 124 to the transfer area 126 on any processing device 150 and positioning it thereafter, the lifting unit 134 moves the second cassette 133 downward from the recess in the vehicle body 131 of the transport unit 130 through the opening 127 and lands it on the landing area 152 inside the processing device 150.

[0085] After the second cassette 133 containing the wafer 200 after imaging by the imaging unit 30 is landed on the landing unit 152, any processing unit 150, under the control of the control unit 159, has the transport unit 153 unload the wafer 200 from the second cassette 133 that has landed on the landing unit 152 and transport it to the processing unit 154, where the processing unit 154 processes the wafer 200, and the transport unit 153 transports the processed wafer 200 and loads it into the second cassette 133 that has landed on the landing unit 152.

[0086] After the wafer 200 processed by the processing device 150 is placed in the second cassette 133, the transport unit 130 uses a lifting unit 134 to move the second cassette 133 upward from the landing section 152 inside the processing device 150 through the opening 127, placing it in the recess of the transport unit 130's body 131, which is positioned in the transfer area 126. The transport unit 130 then rotates its wheels 132 to travel along the transport path 120, transporting the second cassette 133, which is placed in the recess of the body 131, from the transfer area 126 to the transfer area 124, and then the lifting unit 134 moves the second cassette 133 downward from the recess of the transport unit 130's body 131 through the openings 111-2 and 125, placing it on the landing section 112 inside the imaging device 1-2 (transfer device 110).

[0087] The imaging device 1-2 and the transfer device 110 land the second cassette 133 containing the wafer 200 processed by the processing device 150 on the landing section 112. Then, the transport arm 20 unloads the wafer 200 processed by the processing device 150 from the second cassette 133 that has landed on the landing section 112. The imaging unit 30 then images the front surface 201 and back surface 202 of the processed wafer 200, respectively, in the same manner as described above. The memory 41 records the images 300 of the front surface 201 and back surface 202 of the processed wafer 200 captured by the imaging unit 30. The wafer 200 processed by the processing device 150 and imaged by the imaging unit 30 is then transported and loaded by the transport arm 20 through the opening 111-3 into the first cassette 50 placed on the mounting table 10, where it is stored. In this way, in the imaging device 1-2 and the transfer device 110, the wafer 200 processed by any processing device 150 is transferred from the second cassette 133, which has landed on the landing section 112, to the first cassette 50, which has been placed on the mounting table 10, after imaging by the imaging unit 30.

[0088] Subsequently, the control unit 40 of the imaging device 1-2 detects scratches 211, foreign matter 212, cracks, etc., captured in the image 300 in the same manner as in Embodiment 1. The operator of the imaging device 1-2 retrieves the detection results of scratches 211, foreign matter 212, cracks, etc., by the control unit 40 and recognizes that scratches 211, foreign matter 212, cracks, etc., captured in both the image 300 before and after transfer, transport, and processing are highly likely to have already existed in the wafer 200 in the state of being contained in the first cassette 50, and that scratches 211, foreign matter 212, cracks, etc., captured only in the image 300 of the wafer 200 after transfer, transport, and processing are highly likely to have been caused by transfer by the transfer device 110, transport by the transport unit 130, or processing by the processing device 150.

[0089] The processing system 100-2 transports and processes the wafer 200 across two or more processing units 150. Between each transport, the wafer 200 is transported to the imaging unit 30 and transferred to the imaging unit 30. Subsequently, the control unit 40 of the imaging unit 1-2 may detect scratches 211, foreign matter 212, cracks, etc., captured in these images 300. Based on the detection results of scratches 211, foreign matter 212, cracks, etc., by the control unit 40, the operator of the imaging unit 1-2 can recognize which processing unit 150 was responsible for the occurrence of the scratches 211, foreign matter 212, cracks, etc.

[0090] The imaging device 1-2 according to Embodiment 2, having the configuration described above, captures an image 300 of the wafer 200 immediately after it has been unloaded by the transport arm 20 from the first cassette 50 placed on the mounting table 10 and before it is transferred to the second cassette 133, using the imaging unit 30. This provides the effect of being able to capture the state of the wafer 200 as it is contained in the first cassette 50. In addition, the imaging device 1-2 according to Embodiment 2 may have either the first cassette 50 or the second cassette 133, which contain and transfer the wafer 200, be a tray that contains only one wafer 200, and the same effect is achieved even when the wafer 200 is transferred to a tray.

[0091] Furthermore, the imaging device 1-2 according to Embodiment 2 further includes a housing 111, an opening 111-2, a landing section 112, a lifting unit 134, a transfer area 124, and an opening 125, so that the wafer 200 can be transported by the transport unit 130 through the transport passage 120 to and from multiple processing devices 150. Even in such a case, the imaging device 1-2 according to Embodiment 2 captures an image 300 of the wafer 200 by the imaging unit 30 immediately after it is unloaded by the transport arm 20 from the first cassette 50 placed on the mounting table 10, before it is transferred to the second cassette 133, before it is transported by the transport unit 130, and before it is processed by any processing device 150. This provides the effect of being able to capture the state of the wafer 200 as it is contained in the first cassette 50.

[0092] Furthermore, the imaging device 1-2 according to Embodiment 2 stores the wafer 200 processed by any processing device 150 in a second cassette 133, transports it through the transport passage 120 via the opening 125 of the transfer area 124 to the landing area 112 by the transport unit 130, and captures an image 300 of the wafer 200 by the imaging unit 30 just before it is loaded into the first cassette 50 placed on the mounting table 10, after it has been transferred to the second cassette 133, transported by the transport unit 130, and processed by any processing device 150. Therefore, the imaging device 1-2 according to Embodiment 2 can capture images 300 of the wafer 200 before and after transfer, transport, and processing, and has the effect of making it possible to compare the state of the wafer 200 before and after these processes. As a result, the imaging device 1-2 according to Embodiment 2 has the effect of enabling the operator to easily identify whether scratches 211, foreign matter 212, cracks, etc., that occurred on the wafer 200 were already present when it was housed in the first cassette 50, or whether the cause lies in the transfer device 110, transport unit 130, and processing device 150, thereby facilitating the investigation of the cause of scratches 211 and foreign matter 212.

[0093] Furthermore, if the imaging devices 1,1-2 according to Embodiments 1 and 2 are used, for example, after the attachment step of attaching protective tape to the wafer 200 and before being transported to a grinding device equipped with a grinding unit and performing the grinding step, the control unit 40 has a determination unit that checks and determines whether there is any trapped debris of the protective tape before grinding by the grinding device, based on the image captured by the imaging unit 30. The determination unit compares the image with a reference image stored in the memory 41 and determines that there is an abnormality if there is trapped debris of the protective tape before grinding by the grinding device. In addition, if the determination unit determines that there is an abnormality, the control unit 40 may perform actions such as notifying the operator or not transporting the wafer 200 to the next process. Furthermore, the imaging devices 1,1-2 according to Embodiments 1 and 2 may, after forming a division starting point along the planned division line on the wafer 200 with a laser beam irradiation device equipped with a laser beam irradiation unit, and before expanding the expanded sheet to which the wafer 200 is attached to divide the wafer 200 along the division starting point, capture an image of the wafer 200 with the imaging unit 30 and perform image judgment to determine whether the division starting point has been formed correctly. Thus, the imaging devices 1,1-2 according to Embodiments 1 and 2 may be used at any timing in a process including multiple steps, and may have a determination unit that inspects and determines whether the preceding process has been carried out correctly based on the image captured by the imaging unit 30, and may be used to maintain the quality of the wafer 200 being processed in a process including multiple steps.

[0094] It should be noted that the present invention is not limited to the embodiments described above. That is, it can be implemented with various modifications without departing from the core principles of the present invention. [Explanation of Symbols]

[0095] 1,1-2 Imaging device 10 Mounting platform 20 Transport Arms 22 Rotation mechanism 30 imaging units 41 memory 50 First Cassette 112 Landing section 124 Transfer area 125 Aperture 130 Conveyor Unit 133 Second Cassette 150 Processing Units 200 wafers 201 Surface 202 Back side 300 images

Claims

1. An imaging device comprising: a mounting platform on which a first cassette is placed; a transport arm installed on the mounting platform for loading and unloading wafers into and out of the first cassette; an imaging unit for imaging the wafer unloaded from the first cassette; a memory for recording the captured image; and a control unit for detecting scratches, foreign matter, or cracks on the wafer based on the wafer image recorded by the memory. A transport unit including a second cassette for housing wafers imaged by the imaging unit, and a lifting unit for moving the second cassette between the inside of the imaging device and the vehicle body housing the second cassette, A transfer area is formed above, in which a transport unit for housing the second cassette is positioned, An opening is formed in the transfer area through which the second cassette passes, The imaging device includes a landing section into which the second cassette, which has descended, lands, The wafer, which is unloaded from the first cassette and imaged by the imaging unit of the imaging device, is transferred to the second cassette, which is then placed on the landing area after imaging. The second cassette is then placed in the vehicle body by the lifting unit of the transport unit and transported to any processing device by the transport unit. The processing apparatus is a cutting apparatus, a grinding apparatus, a laser processing apparatus, a plasma irradiation apparatus, a protective member attachment apparatus, an ultraviolet irradiation apparatus, or a cleaning apparatus. Processing system.

2. The transport unit transports the second cassette containing the wafer processed by any processing device to the transfer area. The lifting unit lowers the second cassette from the transport unit to the landing section. The imaging unit images the wafer ejected from the second cassette that has landed on the landing area. The wafer imaged by the imaging unit is stored in the first cassette. The processing system according to claim 1.

3. A transport unit including a second cassette for housing wafers, and a lifting unit for moving the second cassette between the inside of the imaging device and the vehicle body housing the second cassette, A transfer area is formed above, in which a transport unit for housing the second cassette is positioned, An opening is formed in the transfer area through which the second cassette passes, The imaging device includes a landing section where the second cassette, which has descended, lands, An imaging device comprising: a transport arm for unloading and loading wafers into a second cassette that has landed on the landing area; an imaging unit for imaging wafers unloaded from the second cassette; a memory for recording the captured images; and a control unit for detecting scratches, foreign matter, or cracks on the wafer based on the wafer images recorded by the memory. It comprises a mounting platform on which a first cassette is placed, The wafer is housed in the second cassette and transported from any processing unit to the transfer area by the transport unit. The wafer, which is removed from the second cassette and imaged by the imaging unit of the imaging device, is transferred to the first cassette placed on the mounting table after imaging. The processing apparatus is a cutting apparatus, a grinding apparatus, a laser processing apparatus, a plasma irradiation apparatus, a protective member attachment apparatus, an ultraviolet irradiation apparatus, or a cleaning apparatus. Processing system.

4. A mounting platform for placing the first cassette, A transport arm for unloading wafers from the first cassette installed on the mounting platform, An imaging unit for imaging a wafer that has been discharged from the first cassette and is not yet processed, A memory for recording captured images, A control unit that detects scratches, foreign matter, or cracks on the wafer before processing based on an image of the wafer before processing recorded in the memory, It comprises a landing section on which a second cassette having a different external shape from the first cassette is placed, An imaging apparatus characterized by transferring a wafer, which has been unloaded from the first cassette and imaged by the imaging unit, to the second cassette placed on the landing section.

5. A landing section on which a second cassette is placed, A transport arm for unloading wafers from the second cassette installed at the landing area, An imaging unit for imaging the wafer that has been discharged from the second cassette and processed, A memory for recording captured images, A control unit that detects scratches, foreign matter, or cracks on the processed wafer based on the image of the processed wafer recorded in the memory, It comprises a mounting base on which a first cassette having a different external shape from the second cassette is placed, An imaging apparatus characterized by transferring wafers, which are unloaded from the second cassette and imaged by the imaging unit, to the first cassette placed on the mounting stage.

6. The imaging apparatus according to claim 4, characterized in that the transport arm images the unprocessed wafer discharged from the first cassette with the imaging unit, and after imaging, the transport arm places the unprocessed wafer into the second cassette placed on the landing section which is transported to the processing unit that processes the wafer.

7. The imaging apparatus according to claim 5, characterized in that an imaging unit images a processed wafer that has been transported from a processing unit that processes wafers and discharged from a second cassette, and after imaging, the transport arm transfers the processed wafer to the first cassette.

8. The imaging apparatus according to claim 4 or claim 5, characterized in that the imaging unit images the wafer while the transport arm is holding the wafer.

9. The imaging unit has at least a camera, The camera is positioned to capture an area adjacent to the opening through which the wafer of the first cassette, which is placed on the mounting table, is loaded or unloaded. The imaging device according to claim 4 or claim 5, characterized by the event.

10. The camera has an imaging field of view that covers the entire surface or back surface of the wafer, The entire surface of the wafer, either the front or back surface, is imaged in a single scan, and the captured image is recorded in the memory. The imaging device according to claim 9, characterized by the fact that

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