Wafer processing method

Abstract

To provide a processing method capable of repairing damages due to a formation of a processing groove.SOLUTION: A first edge surface part 120 and a second edge surface part 121 of a first processing groove 114 and a second processing groove 115 of a wafer 100 are fused by irradiation with a laser beam 401. Therefore, a front surface of each of the first edge surface part 120 and the second edge surface part 121 can be flattened, and damages on the first edge surface part 120 and the second edge surface part 121 can be repaired. As a result, a transverse intensity of a chip 116 formed by dividing the wafer 100 can be improved.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a method for processing a wafer by forming a processing groove in the wafer.

Background Art

[0002] There is a technique for forming a processing groove in a wafer (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, when a processing groove is formed in a wafer, damage such as cracks and chips may occur in the wafer. An object of the present invention is to provide a processing method capable of repairing at least a part of the damage caused by the formation of the processing groove.

Means for Solving the Problems

[0005] A method for processing a wafer according to the present invention (this processing method) is a method for processing a wafer in which a plurality of planned division lines are formed along the planned division lines, a processing groove forming step of forming a processing groove along the planned division line, and an energy supply step of supplying energy to at least one of the bottom, side surface, and edge surface of the processing groove to melt and repair at least a part of the damage caused by the processing groove forming step. The groove forming step is characterized by forming grooves that divide the wafer into a plurality of chips, and the energy supply step further comprises a side exposure step in which the chip to be supplied with energy is pushed up relative to the other chips to expose the side surface of the chip to be supplied with energy, and the energy is supplied to the side surface exposed in the side exposure step. In this processing method, a functional layer may be laminated on the wafer, and the processing groove formation step may include forming a pair of pre-processing grooves to a depth that removes at least the functional layer, and forming the processing groove between the pair of pre-processing grooves. In this processing method, the energy supply step may be a step of irradiating with a laser beam. Furthermore, the wavelength of the laser beam may be a wavelength that is absorbed by the wafer. Furthermore, the wavelength of the laser beam may be in the range of 500 to 1000 nm. Furthermore, the wafer may have a functional layer laminated on it, and in the energy supply step, energy may be supplied to the portion of the functional layer at least one of the groove bottom, side surface, and edge surface of the processed groove to repair at least a portion of the damage caused to the portion of the functional layer. [Effects of the Invention]

[0006] In this processing method, after the groove formation step, an energy supply step is performed to supply energy to at least one of the groove bottom, side surface, and edge surface of the groove, causing this area (laser-irradiated area) to melt and recrystallize. By melting, the laser-irradiated area can be flattened, and cracks and chips caused by the formation of the groove can be bonded, thereby reducing damage to the laser-irradiated area. In other words, at least a portion of the damage can be repaired. As a result, the flexural strength of the chip formed by the splitting of the wafer can be increased. [Brief explanation of the drawing]

[0007] [Figure 1] This is a perspective view showing a workset including wafers. [Figure 2] This is a block diagram showing the configuration of the processing system. [Figure 3] This is a perspective view showing the configuration of the first cutting apparatus. [Figure 4] This is a perspective view showing the configuration of a laser processing device. [Figure 5] Figure 5(a) is an explanatory diagram showing an example of the groove formation step, and Figure 5(b) is an explanatory diagram showing an example of the energy supply step. [Figure 6] Figure 6(a) is an explanatory diagram showing another example of the machining groove formation step, and Figures 6(b) and (c) are explanatory diagrams showing other examples of the energy supply step. [Figure 7] Figure 7(a) is an explanatory diagram showing yet another example of the machining groove formation step, and Figure 7(b) is an explanatory diagram showing yet another example of the energy supply step. [Figure 8] This is a block diagram showing other configurations of the processing system. [Figure 9] Figure 9(a) is an explanatory diagram showing the functional layer removal process, Figure 9(b) is an explanatory diagram showing yet another example of the processing groove formation step, Figure 9(c) is an explanatory diagram showing yet another example of the energy supply step, and Figure 9(d) is an explanatory diagram showing an example of the splitting step. [Figure 10] This is an explanatory diagram showing another example of a holding part in a laser processing device. [Figure 11] This is an explanatory diagram showing the push-up member. [Figure 12] This is an explanatory diagram showing another example of the energy supply step. [Figure 13] This is an explanatory diagram showing another example of the energy supply step. [Figure 14] This figure shows a table illustrating the relationship between the wavelength of the laser beam emitted from the oscillator and the results of the melting steps performed using each laser beam. [Modes for carrying out the invention]

[0008] In this embodiment, as the workpiece, a wafer 100 as shown in FIG. 1 is used. The wafer 100 has a circular shape, and on its surface, a plurality of first planned division lines 103 extending in a first direction and a plurality of second planned division lines 104 extending in a second direction orthogonal to the first direction are formed. For example, devices (not shown) may be formed in each region partitioned by these first planned division lines 103 and second planned division lines 104.

[0009] In this embodiment, as shown in FIG. 1, the wafer 100 is handled in the state of a work set 110. The work set 110 is formed by integrating an annular frame 111 having an opening 112 capable of accommodating the wafer 100 and the wafer 100 positioned in the opening 112 of the annular frame 111 with a dicing tape 113. In this embodiment, the wafer 100 is processed in the processing system 1 shown in FIG. 2 in the state of such a work set 110.

[0010] The processing system 1 shown in FIG. 2 is a system for processing the wafer 100, and includes a first cutting device 2 for cutting the wafer 100, a laser processing device 4 for laser-processing the wafer 100, a transfer device 5 for transferring the wafer 100 between these devices, and a control unit 7 for controlling these devices.

[0011] First, the configuration of the first cutting device 2 will be described. As shown in FIG. 3, the first cutting device 2 includes a base 10, and on this base 10, a processing feed mechanism 14 is disposed. The processing feed mechanism 14 moves a holding unit 20 including a holding table 21 relative to a first cutting blade 46 of a cutting mechanism 45 along a processing feed direction (X-axis direction) parallel to the holding surface 22 of the holding table 21.

[0012] The processing feed mechanism 14 includes a pair of guide rails 模15 extending in the X-axis direction, an X-axis table 16 placed on the guide rails 15, a ball screw 17 extending parallel to the guide rails 15, and a motor 18 for rotating the ball screw 17.

[0013] A pair of guide rails 15 are arranged on the upper surface of the base 10 in parallel with the X-axis direction. The X-axis table 16 is installed on the pair of guide rails 15 so as to be slidable along these guide rails 15. A holding part 20 is placed on the X-axis table 16.

[0014] The ball screw 17 is screwed into a nut part (not shown) provided on the X-axis table 16. The motor 18 is connected to one end of the ball screw 17 and rotationally drives the ball screw 17. When the ball screw 17 is rotationally driven, the X-axis table 16 and the holding part 20 move along the guide rails 15 in the X-axis direction which is the machining feed direction.

[0015] The holding part 20 includes a holding table 21 for holding the wafer 100 (see FIG. 1) of the work set 110, a cover plate 24 arranged around the holding table 21, and two clamp parts 25 provided around the holding table 21. Further, the holding part 20 has a θ table 23 that supports the holding table 21 and rotates it in the XY plane below the cover plate 24.

[0016] The holding table 21 is a member for holding the wafer 100 shown in FIG. 1 and is formed in a disc shape. The holding table 21 has a holding surface 22 made of a porous material. The holding surface 22 can communicate with a suction source (not shown). The holding table 21 sucks and holds the wafer 100 in the work set 110 by this holding surface 22.

[0017] The two clamp parts 25 provided around the holding table 21 sandwich and fix the annular frame 111 around the wafer 100 held by the holding table 21.

[0018] On the rear side (-X direction side) of the base 10, a gantry column 11 is erected so as to straddle the machining feed mechanism 14. On the front surface (+X direction side surface) of the gantry column 11, a cutting mechanism moving mechanism 13 for moving the cutting mechanism 45 is provided.

[0019] The cutting mechanism movement mechanism 13 indexes and feeds the cutting mechanism 45 in the Y-axis direction and in the Z-axis direction. The cutting mechanism movement mechanism 13 includes an indexing feed mechanism 30 that moves the cutting mechanism 45 in the indexing feed direction (Y-axis direction), and a cutting feed mechanism 40 that moves the cutting mechanism 45 in the in-cut feed direction (Z-axis direction).

[0020] The indexing feed mechanism 30 is located on the front of the gantry column 11. The indexing feed mechanism 30 adjusts the position of the cutting mechanism 45 in the Y-axis direction by reciprocating the cutting feed mechanism 40 and the cutting mechanism 45 along the Y-axis direction.

[0021] The indexing feed mechanism 30 includes a pair of guide rails 31 extending in the Y-axis direction, a Y-axis table 34 mounted on the guide rails 31, a ball screw 32 extending parallel to the guide rails 31, and a motor 33 for rotating the ball screw 32.

[0022] A pair of guide rails 31 are positioned parallel to the Y-axis direction on the front of the gantry column 11. The Y-axis table 34 is mounted on the pair of guide rails 31 and is slidable along these guide rails 31. A cutting feed mechanism 40 and a cutting mechanism 45 are mounted on the Y-axis table 34.

[0023] The ball screw 32 is screwed into a nut portion (not shown) provided on the Y-axis table 34. The motor 33 is connected to one end of the ball screw 32 and rotates the ball screw 32. As the ball screw 32 rotates, the Y-axis table 34, the depth-of-cut feed mechanism 40, and the cutting mechanism 45 move along the guide rail 31 in the Y-axis direction, which is the indexing feed direction.

[0024] The cutting feed mechanism 40 reciprocates the cutting mechanism 45 along the Z-axis direction (vertical direction). The Z-axis direction is perpendicular to the X-axis and Y-axis directions, as well as perpendicular to the holding surface 22 of the holding table 21.

[0025] The cutting feed mechanism 40 includes a pair of guide rails 41 extending in the Z-axis direction, a support member 42 mounted on the guide rails 41, a ball screw 43 extending parallel to the guide rails 41, and a motor 44 for rotating the ball screw 43.

[0026] A pair of guide rails 41 are arranged on the Y-axis table 34 parallel to the Z-axis direction. A support member 42, equipped with an imaging mechanism 48, is slidably mounted on the pair of guide rails 41 along these guide rails 41. A cutting mechanism 45 is attached to the lower end of the support member 42.

[0027] The ball screw 43 is screwed into a nut portion (not shown) provided on the back side of the support member 42. The motor 44 is connected to one end of the ball screw 43 and rotates the ball screw 43. As the ball screw 43 rotates, the support member 42 and the cutting mechanism 45 move along the guide rail 41 in the Z-axis direction, which is the cutting feed direction.

[0028] The cutting mechanism 45 cuts the wafer 100 held on the holding table 21 and rotatably supports a first cutting blade 46 for cutting the wafer 100.

[0029] The cutting mechanism 45 includes, in addition to the first cutting blade 46, a spindle on which the first cutting blade 46 is mounted and rotated, a housing that rotatably supports the spindle, and a motor that rotates the spindle (all not shown). In the cutting mechanism 45, cutting is performed on the wafer 100 by the first cutting blade 46 which rotates at high speed together with the spindle by the motor.

[0030] Next, the configuration of the laser processing apparatus 4 will be described. As shown in Figure 4, the laser processing apparatus 4 comprises a rectangular parallelepiped base 51 and a vertical wall portion 52 erected at one end of the base 51.

[0031] The upper surface of the base 51 is equipped with a holding section 55 having a holding table 56, a Y-axis movement mechanism 60 for moving the holding table 56 in the Y-axis direction, which is the indexing feed direction, and an X-axis movement mechanism 70 for moving the holding table 56 in the X-axis direction, which is the machining feed direction. The holding table 56 is equipped with a holding surface 57 for holding the wafer 100.

[0032] The Y-axis movement mechanism 60 moves the holding table 56 in the Y-axis direction parallel to the holding surface 57 relative to the laser beam irradiation mechanism 80. The Y-axis movement mechanism 60 includes a pair of guide rails 63 extending in the Y-axis direction, a Y-axis table 64 mounted on the guide rails 63, a ball screw 65 extending parallel to the guide rails 63, and a drive motor 66 for rotating the ball screw 65.

[0033] A pair of guide rails 63 are positioned on the upper surface of the base 51, parallel to the Y-axis direction. The Y-axis table 64 is mounted on the pair of guide rails 63 so as to be slidable along these guide rails 63. The X-axis movement mechanism 70 and the holding unit 55 are mounted on the Y-axis table 64.

[0034] The ball screw 65 is screwed into a nut portion (not shown) provided on the Y-axis table 64. The drive motor 66 is connected to one end of the ball screw 65 and rotates the ball screw 65. As the ball screw 65 rotates, the Y-axis table 64, the X-axis movement mechanism 70, and the holding portion 55 move in the Y-axis direction along the guide rail 63.

[0035] The X-axis movement mechanism 70 moves the holding table 56 in the X-axis direction parallel to the holding surface 57 relative to the laser beam irradiation mechanism 80. The X-axis movement mechanism 70 includes a pair of guide rails 71 extending in the X-axis direction, an X-axis table 72 mounted on the guide rails 71, a ball screw 73 extending parallel to the guide rails 71, and a drive motor 75 for rotating the ball screw 73.

[0036] A pair of guide rails 71 are positioned parallel to the X-axis direction on the upper surface of the Y-axis table 64. The X-axis table 72 is mounted on the pair of guide rails 71 so as to be slidable along these guide rails 71. A holding unit 55 is placed on the X-axis table 72.

[0037] The ball screw 73 is screwed into a nut portion (not shown) provided on the X-axis table 72. The drive motor 75 is connected to one end of the ball screw 73 and rotates the ball screw 73. As the ball screw 73 rotates, the X-axis table 72 and the holding portion 55 move along the guide rail 71 in the machining feed direction (X-axis direction).

[0038] The holding section 55 is used to hold the wafer 100. In this embodiment, the wafer 100 is held in the holding section 55 as a workset 110 as shown in Figure 1.

[0039] The holding unit 55 includes a holding table 56 for holding the wafer 100, four clamping units 58 provided around the holding table 56, and a θ table 59 that supports the holding table 56 and rotates it in the XY plane.

[0040] The holding table 56 is a component for holding the wafer 100 and is formed in a disc shape. The holding table 56 has a holding surface 57 made of porous material. This holding surface 57 can communicate with a suction source (not shown). The holding table 56 uses this holding surface 57 to suction and hold the wafer 100 in the workset 110.

[0041] The four clamping portions 58 provided around the holding table 56 clamp and fix the annular frame 111 surrounding the wafer 100 held by the holding table 56 from all four sides.

[0042] A laser beam irradiation mechanism 80 is provided on the front surface of the vertical wall portion 52 of the laser processing apparatus 4.

[0043] The laser beam irradiation mechanism 80 irradiates a laser beam onto the wafer 100 held on the holding table 56. The laser beam irradiation mechanism 80 includes a processing head (concentrator) 81 for irradiating the wafer 100 with a laser beam, a camera 82 for imaging the wafer 100, an arm portion 83 for supporting the processing head 81 and the camera 82, and a Z-axis movement mechanism 85 for moving the arm portion 83 in the Z-axis direction.

[0044] The Z-axis movement mechanism 85 includes a pair of guide rails 86 extending in the Z-axis direction, a Z-axis table 89 mounted on the guide rails 86, a ball screw 87 extending parallel to the guide rails 86, and a drive motor 88 for rotating the ball screw 87.

[0045] A pair of guide rails 86 are positioned parallel to the Z-axis direction on the front of the vertical wall 52. The Z-axis table 89 is mounted on the pair of guide rails 86 so as to be slidable along these guide rails 86. An arm portion 83 is attached to the Z-axis table 89.

[0046] The ball screw 87 is screwed into a nut portion (not shown) provided on the Z-axis table 89. The drive motor 88 is connected to one end of the ball screw 87 and rotates the ball screw 87. As the ball screw 87 rotates, the Z-axis table 89 and the arm portion 83 move in the Z-axis direction along the guide rail 86.

[0047] The arm portion 83 is mounted on the Z-axis table 89 so as to protrude in the -Y direction. The machining head 81 is supported at the tip of the arm portion 83 so as to face the holding table 56 of the holding portion 55.

[0048] An optical system (not shown) for a laser beam irradiation mechanism 80, including a laser beam oscillator and a focusing lens, is arranged inside the arm portion 83 and the processing head 81. The laser beam irradiation mechanism 80 is configured to irradiate the laser beam generated using these optical systems from the lower end of the processing head 81 toward the wafer 100 held in the holding table 56. In this embodiment, the wavelength of the laser beam irradiated from the laser beam irradiation mechanism 80 is an absorbent wavelength for the wafer 100, which is the workpiece.

[0049] The transport device 5 shown in Figure 2 can hold a workset 110 including wafers 100 by, for example, a holding member (not shown) such as a robot hand. The transport device 5 can, for example, load and unload the workset 110 into and out of a storage unit (not shown), and transport the workset 110 between the first cutting device 2 and the laser processing device 4. Alternatively, the operator may transport the workset 110 without using the transport device 5.

[0050] The control unit 7 includes a CPU that performs calculations according to a control program, and a storage medium such as memory. The control unit 7 controls each component of the processing system 1 to process the wafer 100.

[0051] The following describes a method for processing a wafer 100 in the processing system 1, which is controlled by the control unit 7. The processing method according to this embodiment is a method for processing a wafer 100, which has a plurality of division lines 103 and 104 formed on it, along these division lines 103 and 104.

[0052] [Processing groove formation step] First, the groove formation step will be described. In this step, a first cutting device 2 is used to form grooves in the wafer 100 along the first division line 103 and the second division line 104 shown in Figure 1. The groove formation step includes the following holding and cutting steps.

[0053] [Holding process] In this process, the wafer 100 of the workset 110 shown in Figure 1 is placed on the holding table 21 of the holding unit 20 in the first cutting apparatus 2 shown in Figure 3, via the dicing tape 113, by the transport device 5 or an operator. Furthermore, the annular frame 111 of the workset 110 is supported by the clamping unit 25 of the holding unit 20. In this state, the control unit 7 connects the holding surface 22 of the holding table 21 to a suction source (not shown), thereby holding the wafer 100 by suction using the holding surface 22. In this way, the workset 110, including the wafer 100, is held by the holding unit 20.

[0054] [Cutting process] In this process, the wafer 100 is cut along a plurality of first division lines 103 and second division lines 104 (see Figure 1) formed in a first direction.

[0055] Specifically, first, the control unit 7 controls the θ table 23 of the holding unit 20 shown in Figure 3 to rotate the holding table 21 so that the first planned division line 103 of the wafer 100 held on the holding surface 22 of the holding table 21 is parallel to the X axis. Then, the control unit 7 controls the processing feed mechanism 14 to position the holding unit 20 at a predetermined cutting start position below the cutting mechanism 45.

[0056] Furthermore, the control unit 7 controls the indexing feed mechanism 30 to align the position of the first cutting blade 46 in the Y-axis direction with one of the first planned division lines 103 on the wafer 100.

[0057] Subsequently, the control unit 7 controls the cutting feed mechanism 40 while rotating the first cutting blade 46 at high speed, lowering the first cutting blade 46 of the cutting mechanism 45 to a predetermined cutting height that cuts (full cuts) the wafer 100 which is held by suction on the holding surface 22.

[0058] In this state, the control unit 7 controls the processing feed mechanism 14 to move the holding unit 20 that holds the workpiece set 110 in the X-axis direction. As a result, the rotating first cutting blade 46 cuts the wafer 100 along one of the first planned division lines 103. As a result, a first processing groove 114, which is a processing groove (cutting groove) along the first planned division line 103, is formed on the wafer 100, as shown in Figure 5(a). In this case, the first processing groove 114 is formed to a depth that cuts through the wafer 100 and reaches the dicing tape 113.

[0059] Subsequently, the control unit 7 controls the cutting feed mechanism 40 to move the first cutting blade 46 away from the wafer 100 and position it above it. Furthermore, the control unit 7 controls the processing feed mechanism 14 to return the holding unit 20 to the cutting start position. Then, the control unit 7 controls the indexing feed mechanism 30 to align the position of the first cutting blade 46 in the Y-axis direction with another first division line 103 that will be cut next on the wafer 100, and cuts the wafer 100 along this first division line 103. In this way, the control unit 7 cuts the wafer 100 along all of the first planned division lines 103 on the wafer 100.

[0060] Next, the control unit 7 controls the θ table 23 of the holding unit 20 shown in Figure 3 to rotate the holding table 21 so that the second division line 104 of the wafer 100 held on the holding surface 22 of the holding table 21 is parallel to the X-axis direction.

[0061] Subsequently, the control unit 7 controls the processing feed mechanism 14, indexing feed mechanism 30, cutting feed mechanism 40, and cutting mechanism 45, similar to the cutting along the first division line 103, to form a second processing groove 115 along all of the second division lines 104 in the wafer 100 using the first cutting blade 46, as shown in Figure 5(a). This second processing groove 115 also has the same depth as the first processing groove 114.

[0062] As a result, the wafer 100 is divided into multiple chips 116 by the first processing groove 114 and the second processing groove 115.

[0063] Furthermore, after the cutting process, the workpiece set 110 is transported to the laser processing device 4 by the transport device 5 or by an operator.

[0064] [Energy supply step] Next, the energy supply step will be described. In this step, energy is supplied, for example, locally (partially) to at least one of the groove bottoms, sides, and edges of the first groove 114 and the second groove 115 formed in the groove formation step to melt them and repair at least a portion of the damage caused by the groove formation step. This damage (damage layer) is a processed altered portion (processed altered layer) that includes, for example, cracks, scratches, and chips that occur during groove formation.

[0065] In this embodiment, during the energy supply step, a laser beam is irradiated onto the edges of the first processing groove 114 and the second processing groove 115 using the laser processing apparatus 4. The energy supply step includes the following holding step and laser beam irradiation step. The edges of the first processing groove 114 and the second processing groove 115 are the peripheral portions (ends of the tip 116) of the openings of the first processing groove 114 and the second processing groove 115 on the surface of the wafer 100 shown in Figure 5(a), and include the first edge surface portion 120 and the second edge surface portion 121 extending along the processing grooves 114 and 115. The edges of the processing grooves 114 and 115 can also be described, for example, as the upper surfaces next to the processing grooves 114 and 115.

[0066] [Holding process] In this process, the wafer 100 of the workset 110 shown in Figure 1 is placed on the holding table 56 of the holding unit 55 in the laser processing apparatus 4 shown in Figure 4, via the dicing tape 113, by the transport device 5 or by an operator. Furthermore, the annular frame 111 of the workset 110 is supported by the clamping unit 58 of the holding unit 55. In this state, the control unit 7 connects the holding surface 57 of the holding table 56 to a suction source (not shown), thereby holding the wafer 100 by suction using the holding surface 57. In this way, the workset 110, including the wafer 100, is held by the holding unit 55.

[0067] [Laser beam irradiation process] In this process, a laser beam is irradiated onto the edges of the first processing groove 114 and the second processing groove 115. Specifically, first, the control unit 7 controls the θ table 59 of the holding unit 55 shown in Figure 4 to rotate the holding table 56 so that the first processing groove 114 of the wafer 100 held on the holding surface 57 of the holding table 56 is parallel to the X-axis direction. Then, the control unit 7 controls the X-axis movement mechanism 70 to position the holding unit 55 at a predetermined irradiation start position below the processing head 81 of the laser beam irradiation mechanism 80.

[0068] Furthermore, the control unit 7 controls the Y-axis movement mechanism 60 to position the first edge surface 120 (see Figure 5(a)) of one of the first processing grooves 114 in the wafer 100 below the processing head 81. The control unit 7 also controls the Z-axis movement mechanism 85 of the laser beam irradiation mechanism 80 to appropriately adjust the height of the processing head 81.

[0069] In this state, the control unit 7 controls the optical system of the laser beam irradiation mechanism 80 to generate a laser beam and irradiates the laser beam downward from the processing head 81, while also controlling the X-axis movement mechanism 70 to move the holding unit 55 that holds the workpiece set 110 in the X-axis direction. As a result, as shown in Figure 5(b), the laser beam 401 output from the processing head 81 is irradiated along the first edge surface 120 of one of the first processing grooves 114.

[0070] Subsequently, the control unit 7 stops the irradiation of the laser beam 401 and controls the X-axis movement mechanism 70 to return the holding unit 55 to the irradiation start position. Then, the control unit 7 controls the Y-axis movement mechanism 60 to position the second edge surface 121 of the first machining groove 114 below the machining head 81 and irradiates the laser beam 401 along this second edge surface 121.

[0071] In this manner, the control unit 7 irradiates the first edge surface 120 and the second edge surface 121 of all first processing grooves 114 on the wafer 100 with a laser beam 401.

[0072] Next, the control unit 7 controls the θ table 59 of the holding unit 55 shown in Figure 4 to rotate the holding table 21 so that the second processing groove 115 of the wafer 100 held on the holding surface 57 of the holding table 56 is parallel to the X-axis direction.

[0073] Subsequently, the control unit 7 controls the Y-axis movement mechanism 60, the X-axis movement mechanism 70, and the laser beam irradiation mechanism 80, similar to the laser irradiation along the first processing groove 114, to irradiate the laser beam 401 along the first edge surface 120 and the second edge surface 121 of all the second processing grooves 115.

[0074] As described above, in this embodiment, after the groove formation step, an energy supply step is performed to supply energy by irradiating the first edge surface 120 and the second edge surface 121 of the first groove 114 and the second groove 115 of the wafer 100 with a laser beam 401. As a result, the first edge surface 120 and the second edge surface 121 are melted by the laser beam 401.

[0075] Furthermore, in this embodiment, since a laser beam 401 with a wavelength that is absorbed by the wafer 100 is used, not only the surface of the first edge portion 120 and the second edge portion 121, but also the portion from the surface to a predetermined thickness (the portion near the surface) is melted. Then, the melted regions of the first edge portion 120 and the second edge portion 121 are cooled and solidified after laser irradiation.

[0076] Through this melting and cooling process, in this embodiment, crystal growth can be achieved in the molten regions of the first edge surface portion 120 and the second edge surface portion 121, which are the laser irradiation areas (laser irradiation portions), to form seed crystals, which can then be recrystallized. Therefore, the surfaces of the first edge surface portion 120 and the second edge surface portion 121 can be flattened. Furthermore, cracks and chips that occur on and near the surface of the first edge surface portion 120 and the second edge surface portion 121 during the formation of the first and second processing grooves 114 and the second processing groove 115 can be bonded together. As a result, damage to the first edge surface portion 120 and the second edge surface portion 121 can be reduced. In other words, at least a portion of the damage can be repaired (or removed). As a result, the flexural strength of the chip 116 formed by dividing the wafer 100 can be increased.

[0077] Furthermore, in the energy supply step, a laser beam is locally (partially) irradiated onto the bottom, side, or edge of the first processing groove 114 and the second processing groove 115 to repair damage caused by the processing groove formation step. This suppresses adverse effects of the laser beam on devices even when devices are formed on the surface of the wafer 100. In addition, by irradiating with a laser beam locally, the time required for the energy supply step can be shortened, thereby improving productivity.

[0078] Furthermore, there is a technique called laser cleaning, in which, after the grooves have been formed, machining debris adhering to the grooves is scraped off by irradiating them with a laser beam. In this method, a UV wavelength laser beam is irradiated onto the grooves, causing the machining debris adhering to the surface of the grooves to absorb the laser beam and ablate, thereby removing the debris. In other words, laser cleaning is performed to remove the machining debris adhering to the surface by sublimation.

[0079] On the other hand, in this embodiment, the laser beam 401 not only flattens the surface of the laser-irradiated portion of the wafer 100, such as the first edge surface 120 and the second edge surface 121, but also repairs damage by bonding cracks and the like that formed inside (the portion near the surface). Therefore, it is preferable that the laser beam 401 is not absorbed too much by the surface of the laser-irradiated portion. For this reason, in this embodiment, it is preferable to use a laser beam 401 with a wavelength longer than the wavelength irradiated in laser cleaning, for example, a wavelength in the range of 500 to 1000 nm, to melt the surface of the laser-irradiated portion and the portion from the surface to a predetermined thickness (the portion near the surface). The portion near the surface is, for example, a portion with a thickness of 0.5 μm to 1.5 μm, or 0.5 μm to 4 μm, from the surface.

[0080] In the above-described embodiment, the control unit 7 sets the height of the first cutting blade 46 of the cutting mechanism 45 to a height that cuts (full cut) the wafer 100 during the cutting process in the groove formation step. This cuts the wafer 100 and forms a first processing groove 114 and a second processing groove 115 to a depth that reaches the dicing tape 113, thereby dividing the wafer 100 into multiple chips 116. In this regard, during the cutting process in the groove formation step, the wafer 100 may be half-cut by setting the height of the first cutting blade 46 of the cutting mechanism 45 to a height that cuts the wafer 100. In this case, as shown in Figure 6(a), the first processing groove 114 and the second processing groove 115 are formed to a depth that does not reach the dicing tape 113.

[0081] In this case, it is preferable to irradiate not only the first edge surface portion 120 and the second edge surface portion 121 of the first processed groove 114 and the second processed groove 115 with the laser beam 401, but also the groove bottom 122. In other words, in this case, as shown in Figure 6(b), the control unit 7 irradiates the laser beam 401 output from the processing head 81 along the groove bottom 122 of the first processing groove 114 (second processing groove 115) during the laser beam irradiation process in the energy supply step. Subsequently, as shown in Figure 6(c), the control unit 7 irradiates the laser beam 401 along the first edge surface portion 120 and the second edge surface portion 121 of the first processing groove 114 (second processing groove 115). With this configuration, it is possible to reduce damage not only to the first edge surface portion 120 and the second edge surface portion 121 but also to the groove bottom 122.

[0082] Furthermore, it is preferable that the control unit 7 adjusts the position of the laser beam 401 in the Y-axis direction as appropriate, for example, using the Y-axis movement mechanism 60, so that the laser beam 401 irradiates the entire surface of the groove bottom 122. Furthermore, it may be difficult to irradiate the corners of the groove bottom 122 with the laser beam 401 from above using the processing head 81. In such cases, the processing head 81 may be tilted, or the direction of the laser beam 401 output from the processing head 81 may be changed using a mirror (not shown) to irradiate the corners of the groove bottom 122 with the laser beam 401 from an oblique angle. Such a mirror may be placed, for example, inside the processing head 81 in the laser beam irradiation mechanism 80.

[0083] Furthermore, a functional layer 105 may be laminated on the surface (device surface) of the wafer 100, as shown in Figure 7(a). The functional layer 105 has a configuration in which, for example, a low-k film (low dielectric film), devices, and wiring layers are stacked. In this configuration, in the groove formation step, it is preferable to remove the functional layer 105 and half-cut the wafer 100 to form a first groove 114 and a second groove 115 that do not reach the dicing tape 113, and in the energy supply step, as shown in Figure 7(b), irradiate the groove bottom 122 with a laser beam 401.

[0084] Furthermore, if a functional layer 105 is provided on the wafer 100, in the energy supply step, energy may be supplied to the portion of the functional layer 105 at least one of the groove bottoms, sides, and edges of the first processing groove 114 and the second processing groove 115 to repair at least a portion of the damage that has occurred in this portion. That is, in the example shown in Figure 7(b), the first edge portion 120 and the second edge portion 121 of the first processing groove 114 and the second processing groove 115, which consist of the functional layer 105, may be irradiated with a laser beam 401 to melt the functional layer 105 and remove the damage.

[0085] In some cases, the functional layer 105 may be thicker than the substrate layer (base material layer) of the wafer 100. For example, the substrate layer may be about 10 μm thick, while the functional layer may be 20-30 μm thick. When the functional layer 105 is this thick, damage to the functional layer 105 affects the flexural strength of the chip when the wafer 100 is formed into a chip.

[0086] Therefore, when the functional layer 105 is thick, it is particularly effective to repair part of the damage by irradiating at least one of the edges, sides, and bottoms of the first and second processed grooves 114 and 115 formed in the functional layer 105 with a laser beam 401 to melt and solidify the irradiated portion. Thus, if a functional layer 105 is provided on the wafer 100, the portion of the functional layer 105 and / or the portion of the substrate layer at least one of the groove bottoms, sides, and edges of the processed grooves 114 and 115 may be irradiated with a laser beam 401 to melt and repair a portion of the damage.

[0087] The case where the groove bottom 122 of the processed grooves 114 and 115 consists of the functional layer 105 is, for example, when the processed grooves 114 and 115 consist only of the functional layer 105 (when the processed grooves 114 and 115 do not reach the substrate layer). Such processed grooves 114 and 115 are formed, for example, when it is not desirable to irradiate the substrate layer with a laser beam. Furthermore, when irradiating the functional layer 105 with a laser beam, it is preferable to limit the output of the laser beam 401 to the extent that the surface layer of the irradiated surface of the laser beam 401 melts, so that the heat of the laser beam 401 does not cause new damage to the functional layer 105.

[0088] Furthermore, if a functional layer 105 is laminated on the surface of the wafer 100, the following processing method may be performed on the wafer 100. In this case, as shown in Figure 8, the processing system 1 further includes a second cutting device 3 in addition to the first cutting device 2, laser processing device 4, transport device 5, and control unit 7 shown in Figure 2. This second cutting device 3 has a second cutting blade 47 that is thinner than the first cutting blade 46 of the first cutting device 2, in the configuration of the first cutting device 2 shown in Figure 3.

[0089] In this processing method, in the groove formation step, before performing cutting using the first cutting device 2, the control unit 7, as shown in Figure 9(a), uses the laser processing device 4 to irradiate both sides of the first planned division line 103 and the second planned division line 104 on the wafer 100 with a laser beam 401 from the processing head 81. This removes the functional layer 105 on both sides of the first planned division line 103 and the second planned division line 104, forming a pair of pre-processing grooves 117 (functional layer removal step in groove formation step). The depth of these pre-processing grooves 117 is at least the depth to which the functional layer 105 is removed. Also, the distance between the pair of pre-processing grooves 117 is greater than the width of the first processing groove 114 and the second processing groove 115 that are formed later.

[0090] Subsequently, the workset 110, including the wafer 100, is transported to the first cutting device 2. Then, the control unit 7 uses the first cutting blade 46 of the first cutting device 2 to cut between the pair of pre-cutting grooves 117. As a result, as shown in Figure 9(b), a first cutting groove 114 along the first planned division line 103 and a second cutting groove 115 along the second planned division line 104 are formed on the wafer 100 between the pair of pre-cutting grooves 117 (cutting step of cutting groove formation step). In this case, the first cutting groove 114 and the second cutting groove 115 are formed to a depth that does not reach the dicing tape 113.

[0091] Subsequently, the workset 110, including the wafer 100, is transported to the laser processing apparatus 4. Then, as shown in Figure 9(c), the control unit 7 uses the processing head 81 of the laser processing apparatus 4 to irradiate the groove bottoms 122 of the first processing groove 114 and the second processing groove 115 with a laser beam 401 to repair damage to the groove bottoms 122 (energy supply step). In the energy supply step, the laser beam 401 may also be irradiated with at least one of the groove bottoms, edges, and sides of the pair of pre-processing grooves 117 to repair damage to the groove bottoms, edges, and edges (periphery of the opening) of the pre-processing grooves 117 caused by the functional layer removal step of the processing groove formation step.

[0092] Next, the workset 110, including the wafer 100, is transported to the second cutting device 3. Then, the control unit 7 uses the second cutting blade 47 of the second cutting device 3 to cut (full cut) the groove bottoms 122 of the first processing groove 114 and the second processing groove 115, as shown in Figure 9(d), so that dividing grooves 118 with a depth reaching the dicing tape 113 are formed. As a result, the wafer 100 is divided into multiple chips 116 (dividing step).

[0093] In this processing method, as shown in Figure 9(b), during the cutting step of the groove formation step, the first cutting blade 46 of the first cutting device 2 cuts between the pre-processing grooves 117 from which the functional layer 105 has been removed. Therefore, it is possible to prevent the functional layer 105 from being peeled off from the surface of the wafer 100 on both sides of the first processing groove 114 and the second processing groove 115 by the first cutting blade 46.

[0094] Furthermore, before fully cutting the groove bottoms 122 of the first and second processing grooves 114 and 115, the groove bottoms 122 are irradiated with a laser beam 401 to repair any damage to the groove bottoms 122. This increases the bending strength of the chip 116 formed by the full cut.

[0095] Furthermore, when implementing the machining method shown in Figures 9(a) to (d), instead of using two first cutting devices 2 and second cutting devices 3 as shown in Figure 8, a so-called dual dicer first cutting device 2 having two cutting blades, a relatively thick first cutting blade 46 and a relatively thin second cutting blade 47, may be used. The first cutting device 2 may then perform both the formation of the first machining groove 114 and the second machining groove 115 by the first cutting blade 46 shown in Figure 9(b), and the formation of the divided groove 118 by the second cutting blade 47 shown in Figure 9(d).

[0096] Alternatively, the processing system 1 may perform the processing method shown in Figures 9(a) to (d) using a single processing device that has both the dual dicing function described above and the laser processing function similar to that of the laser processing device 4.

[0097] Furthermore, in the embodiments described above, the processing system 1 includes a first cutting device 2 for forming a first processing groove 114 and a second processing groove 115 in the wafer 100, as shown in Figure 2 or Figure 8. In this regard, the processing system 1 may also include a separate laser processing device for groove formation, distinct from the laser processing device 4, for forming the first processing groove 114 and the second processing groove 115, instead of the first cutting device 2.

[0098] A laser processing apparatus for groove formation has a configuration similar to, for example, the laser processing apparatus 4 shown in Figure 4. However, the wavelength and output of the laser beam used to form the first processing groove 114 and the second processing groove 115 are different from those of the laser beam used to repair damage to the wafer 100. For this reason, the laser processing apparatus for groove formation is configured to irradiate laser beams suitable for forming the first processing groove 114 and the second processing groove 115.

[0099] Alternatively, in processing system 1, the laser processing apparatus 4 may be equipped with two types of laser beam oscillators and configured to switch between irradiating a laser beam suitable for forming the first processing groove 114 and the second processing groove 115 and a laser beam suitable for repairing damage to the wafer 100. In this case, processing system 1 can perform the processing groove formation step and the energy supply step described above with a single laser processing apparatus 4.

[0100] Furthermore, in the embodiment described above, during the energy supply step, the laser beam 401 is irradiated onto the edges (first edge surface portion 120, second edge surface portion 121) and / or the groove bottom 122 of the first processing groove 114 and the second processing groove 115. In this regard, the laser beam 401 may also be irradiated onto the sides of the first processing groove 114 and the second processing groove 115.

[0101] In this case, for example, the holding section 55 of the laser processing apparatus 4 shown in Figure 4 has a holding mechanism 90 instead of a holding table 56, as shown in Figure 10.

[0102] The holding mechanism 90 includes clamping portions 58 around the holding base 91 that clamp and fix the annular frame 111 surrounding the wafer 100. The holding mechanism 90 also includes a ball screw type moving mechanism 93 fixed on the holding base 91, and a push-up member 92 supported by the moving mechanism 93.

[0103] The moving mechanism 93 is capable of moving the push-up member 92 along the Y-axis direction and also in the vertical direction, as shown by the arrow 501 in Figures 10 and 11. As shown in Figure 11, the push-up member 92 is a substantially plate-shaped member that is longer than the diameter of the wafer 100 and extends in the diametrical direction of the wafer 100 so as to contact the wafer 100 via the dicing tape 113. The width of the portion of the push-up member 92 that contacts the wafer 100 is about the same as the width of the chip 116 obtained by dividing the wafer 100 with the first processing groove 114 and the second processing groove 115.

[0104] In this configuration, during the groove formation step, as shown in Figure 5(a), a first groove 114 and a second groove 115 are formed to divide the wafer 100 into a plurality of chips 116.

[0105] Then, in the energy supply step, the annular frame 111 of the workpiece set 110 is supported by the clamp portion 58 of the holding portion 55 in the laser processing apparatus 4 shown in Figure 10 (holding step).

[0106] Then, as shown in Figure 10, the control unit 7 adjusts the Y-axis movement mechanism 60 (see Figure 4) and the θ table 59 so that the laser beam 401 output from the processing head 81 irradiates a row of chips 116 along a first processing groove 114 extending in the X-axis direction. Furthermore, the control unit 7 adjusts the tilt of the processing head 81 so that the laser beam 401 output from the processing head 81 irradiates the surface of the wafer 100 at an oblique angle. Alternatively, instead of adjusting the tilt of the processing head 81, the laser beam 401 may be tilted by a mirror (not shown) placed inside the processing head 81.

[0107] In this state, the control unit 7 controls the holding mechanism 90 to position the push-up member 92 below the row of chips 116 (the chips 116 to be supplied with energy) that are irradiated with the laser beam 401, and the push-up member 92 pushes these chips 116 up relative to the other chips 116. As a result, the control unit 7 exposes the first side surface 123, which is one of the two side surfaces of the chip 116 irradiated with the laser beam 401 that are parallel to the X-axis direction, so that it faces the processing head 81, as shown in Figure 12 (side surface exposure step). The side surface of the chip 116 corresponds to the side surfaces of the first machining groove 114 and the second machining groove 115.

[0108] In this state, the control unit 7 irradiates the processing head 81 with a laser beam 401 and moves the holding unit 55 in the X-axis direction using the X-axis movement mechanism 70 (see Figure 4). As a result, the laser beam 401 from the processing head 81 is sequentially irradiated onto the exposed first side surface 123 of the row of chips 116 that have been pushed up, supplying energy. It is preferable that the control unit 7 adjusts the inclination of the laser beam 401 as appropriate so that the entire surface of the first side surface 123 is irradiated with the laser beam 401.

[0109] Subsequently, the control unit 7 changes the row of chips 116 irradiated with the laser beam 401 using the Y-axis movement mechanism 60 (see Figure 4), and controls the movement mechanism 93 to push up these chips 116 with the push-up member 92, irradiating their first side surfaces 123 with the laser beam 401. In this way, the control unit 7 irradiates the first side surfaces 123 of all chips 116 on the wafer 100 with the laser beam 401.

[0110] Next, the control unit 7 rotates the workset 110, including the wafer 100, by 180 degrees using the θ table 59 (see Figure 10), and irradiates the second side surface 124 of the chip 116, which is opposite the first side surface 123, with the laser beam 401, as shown in Figure 13.

[0111] In this way, the control unit 7 rotates the workset 110 using the θ table 59 and irradiates all four sides of the chips 116 on the wafer 100 with the laser beam 401. This melts all sides of the chips 116, repairing at least part of the damage.

[0112] Furthermore, as described above, the laser beam irradiation mechanism 80 outputs a laser beam with a wavelength that is absorbed by the wafer 100. For example, if the wafer 100 is a silicon wafer, the wavelength of the laser beam output from the laser beam irradiation mechanism 80 is in the range of 500 to 1000 nm, which is the wavelength that is absorbed by silicon.

[0113] Figure 14 is a table showing the relationship between the wavelength of the laser beam output from the laser beam irradiation mechanism 80 and the results (processing results) of the energy supply steps performed using each laser beam. As shown in this table, when the wavelength was in the range of 500 to 1000 nm, it was possible to successfully melt the laser-irradiated portion of the silicon wafer 100.

[0114] On the other hand, when the wavelength was 355 nm or less, it was difficult to sufficiently melt the laser-irradiated area of ​​wafer 100, which is a silicon wafer. Also, when the wavelength was 1064 nm, the laser beam passed through wafer 100, making it difficult to properly melt the laser-irradiated area.

[0115] In this embodiment, the material of the wafer 100 as the workpiece is preferably a liquid-phase grown material such as Si, Ge, and GaAs. Liquid-phase grown materials are easily melted by laser irradiation. Therefore, damage to the wafer 100 can be effectively repaired by laser irradiation.

[0116] In the energy supply step, energy should be supplied to at least a portion of the first processing groove 114 and the second processing groove 115 so as not to adversely affect the device formed on the wafer 100, thereby repairing at least a portion of the damage that occurs during the formation of the first processing groove 114 and the second processing groove 115. Therefore, energy can be supplied in any form in the energy supply step. For example, instead of irradiating with a laser beam, damage may be repaired by irradiating with plasma or an ion beam. [Explanation of Symbols]

[0117] 1: Machining system, 2: First cutting device, 3: Second cutting device, 4: Laser processing device, 5: Conveying device, 7: Control unit, 10: Base, 11: Gantry column, 13: Cutting mechanism moving mechanism, 14: Machining feed mechanism, 15: Guide rail, 16: X-axis table, 17: Ball screw, 18: Motor, 20: Holding part, 21: Holding table, 22: Holding surface, 23: θ table, 24: cover plate, 25: clamping section, 30: indexing feed mechanism, 31: Guide rail, 32: Ball screw, 33: Motor, 34: Y-axis table, 40: Cutting feed mechanism, 41: Guide rail, 42: Support member, 43: Ball screw, 44: Motor, 45: Cutting mechanism, 46: First cutting blade, 47: Second cutting blade, 48: Imaging mechanism, 51: Base, 52: Vertical wall section, 55: Holding section, 56: Holding table, 57: Holding surface, 58: Clamping part, 59: θ table, 60: Y-axis movement mechanism, 63: Guide rail, 64: Y-axis table, 65: Ball screw, 66: Drive motor, 70: X-axis movement mechanism, 71: Guide rail, 72: X-axis table, 73: Ball screw, 75: Drive motor, 80: Laser beam irradiation mechanism, 81: Processing head, 82: Camera, 83: Arm section, 85: Z-axis movement mechanism, 86: Guide rail, 87: Ball screw, 88: Drive motor, 89: Z-axis table, 90: Holding mechanism, 91: Holding base, 92: Push-up member, 93: Moving mechanism, 100: Wafer, 103: Planned line for the first division, 104: Planned line for the second division, 105: Functional layer, 110: Workset, 111: Ring frame, 112: Opening, 113: Dicing tape, 114: First machining groove, 115: Second machining groove, 116: Chip, 117: Pre-machining groove, 118: Divided groove, 120: First edge surface, 121: Second edge surface, 122: Groove bottom, 123: First side surface, 401: Laser beam

Claims

1. A wafer processing method for processing a wafer on which multiple division lines are formed along the division lines, A machining groove forming step in which a machining groove is formed along the planned division line, An energy supply step to supply energy to melt at least one portion of the groove bottom, side surface, and edge surface of the processed groove, thereby repairing at least a portion of the damage caused by the groove forming step, Equipped with, In the groove formation step, grooves are formed to divide the wafer into multiple chips. The energy supply step further comprises a side exposure step which pushes the chip to be supplied with energy relatively higher than other chips, exposing the side of the chip to be supplied with energy, and supplies the energy to the side exposed in the side exposure step. Characterized by, Wafer processing methods.

2. The wafer has functional layers stacked on top of it. The machining groove forming step includes forming a pair of pre-machining grooves to a depth at least that removes the functional layer, and forming the machining groove between the pair of pre-machining grooves. Characterized by, The wafer processing method according to claim 1.

3. The energy supply step is characterized by being a step of irradiating with a laser beam. The wafer processing method according to claim 1.

4. The wavelength of the laser beam is characterized by being a wavelength that is absorbed by the wafer. The wafer processing method according to claim 3.

5. The wavelength of the laser beam is characterized by being in the range of 500 to 1000 nm. The wafer processing method according to claim 3.

6. The wafer has functional layers stacked on top of it. The energy supply step is, This includes supplying energy to the portion of the functional layer in at least one of the groove bottom, side surface, and edge surface of the processed groove, and repairing at least a portion of the damage caused to the portion of the functional layer. It is characterized by the following: The wafer processing method according to claim 1.

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