Epoxy resins, curable resin compositions, cured products, and phenolic resins

Abstract

The present invention provides an epoxy resin with excellent high fluidity and heat resistance, a curable resin composition, and a phenolic resin which is an epoxy resin precursor.　The phenolic resin is obtained by reacting a compound represented by formula (a) and a compound represented by formula (b). (In formula (a), the plurality of Rs are each present independently, and each represent a 1-5C hydrocarbon group. The total of the carbon numbers of the plurality of Rs is 2-8. k is an integer 1-3.)

Description

Technical Field

[0001] The present invention relates to an epoxy resin having a specific structure, a curable resin composition, a cured product, and a phenolic resin, and is suitably used for electrical and electronic components such as semiconductor encapsulation materials, printed wiring boards, build-up multilayer boards, and optical waveguide devices, lightweight and high-strength materials such as carbon fiber reinforced plastics and glass fiber reinforced plastics, and 3D printing applications.

Background Art

[0002] Epoxy resins are excellent in electrical properties (dielectric constant, dielectric loss tangent, insulation), mechanical properties, adhesiveness, thermal properties (heat resistance, etc.), etc., and are widely used in fields such as electrical and electronic fields such as cast products, laminates, and IC encapsulation materials, structural materials, adhesives, and paints.

[0003] In recent years, in the electrical and electronic fields, further improvement of various properties such as flame retardancy, moisture resistance, adhesion, dielectric properties, etc. of resin compositions, improvement of purity, reduction of viscosity for high filling of fillers (inorganic or organic fillers), and improvement of reactivity for shortening the molding cycle are required (Patent Document 1). In addition, as structural materials, materials that are lightweight and have excellent mechanical properties are required in aerospace materials, leisure and sports equipment applications, etc. Especially in the semiconductor encapsulation field and substrates (the substrate itself or its peripheral materials), following the transition of the semiconductor, it has become more complicated with thinning, stacking, systemization, and three-dimensionalization, and required characteristics such as very high heat resistance and high fluidity are required. In particular, with the expansion of plastic packages to in-vehicle applications, the requirement for heat resistance improvement has become even more severe. Specifically, due to the increase in the driving temperature of semiconductors, very high heat resistance has come to be required. In particular, with the recent movement towards the transition to high wide-gap semiconductors, it has also become necessary to cope with driving temperatures of 175°C and even 200°C or higher (Non-Patent Documents 1 and 2).

[0004] In the field of semiconductor encapsulants, there is a growing demand for further improvements in various properties, including higher purity of resin compositions, moisture resistance, adhesion, dielectric properties, lower viscosity for high-density filling of fillers (inorganic or organic fillers), and improved reactivity to shorten molding cycles. Furthermore, the shape of semiconductor packages has become increasingly complex with the evolution of thin-layer, stacked, system-based, and three-dimensional designs. As wire wiring becomes narrower and finer, poor fluidity of the resin composition can induce wire sweeping. Moreover, this puts stress on the wire connections, leading to adverse effects.

[0005] Furthermore, in flip-chip type packaging, the mold-underfill method, which involves sealing the chip in one go without using underfill, is attracting attention as a low-cost manufacturing method. In this method, the resin needs to pass through a very narrow gap between the chip and the package substrate, so miniaturization of the filler is important. Also, in sealing resins used in redistribution layers such as wafer-level packages, and interlayer insulating films used in build-up layers, the layer thickness needs to be thin, and the filling of fine fillers is necessary to reduce the coefficient of thermal expansion. On the other hand, miniaturization of the filler increases the surface area, which increases the viscosity of the system and can cause voids to form, so there is a need to lower the viscosity of the resin composition. [Prior art documents] [Non-patent literature]

[0006] [Non-Patent Document 1] STRJ Report 2008, Semiconductor Roadmap Expert Committee, FY2008 Report, Chapter 8, pp. 1-1, [online], March 2009, JEITA (Japan Electronics and Information Technology Industries Association), Semiconductor Technology Roadmap Expert Committee, [Retrieved May 30, 2012].<http: / / strj-jeita.elisasp.net / strj / nenjihоukоku-2008.cfm> [Non-Patent Document 2] Takakura, Nobuyuki et al., Matsushita Electric Works Technical Report, Automotive Device Technology, High-Temperature Operation for Automotive Applications C, No. 74, Japan, May 31, 2001, pp. 35-40. [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2015-147854 [Patent Document 2] Japanese Patent Publication No. 2008-195751 [Patent Document 3] Japanese Patent Publication No. 2010-018669 [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] One method for reducing the viscosity of epoxy resin compositions is to add a low-viscosity epoxy resin. Patent document 2 describes an epoxy resin composition to which a low-molecular-weight bisphenol F type epoxy resin has been added. However, low-viscosity epoxy resins often have poor heat resistance, making it difficult to satisfy the need for high heat resistance.

[0009] Another method involves reducing the viscosity of the epoxy resin itself. Specifically, this involves reducing the molecular weight of the epoxy resin, and Patent Document 3 describes the study of a low molecular weight cresol novolac type epoxy resin. However, while reducing the molecular weight of the epoxy resin and narrowing the molecular weight distribution improves fluidity, it tends to decrease heat resistance, and Patent Document 3 is no exception.

[0010] Against this backdrop, there is a need for the development of materials that can ensure high fluidity without significantly compromising heat resistance.

[0011] This invention has been made in view of the above circumstances, and aims to provide an epoxy resin, a curable resin composition, and a phenolic resin that is a precursor of epoxy resin, all of which are excellent in terms of high fluidity and heat resistance. [Means for solving the problem]

[0012] That is, the present invention relates to the following [1] to [8]. In the present application, “(numerical value 1) to (numerical value 2)” indicates that the upper and lower limit values are included. [1] A phenolic resin obtained by reacting a compound represented by the following formula (a) with a compound represented by the following formula (b).

[0013]

Chemical formula

[0014] (In formula (a), a plurality of R's exist independently and each represents a hydrocarbon group having 1 to 5 carbon atoms. The total number of carbon atoms of a plurality of R's is 2 to 8. k is an integer of 1 to 3.) [2] The phenolic resin according to the above [1], wherein the content of the compound represented by the following formula (c) determined by differential refractive index detector detection in gel permeation chromatography is 75 to 95 area %.

[0015]

Chemical formula

[0016] (In formula (c), a plurality of R's exist independently and each represents a hydrocarbon group having 1 to 5 carbon atoms. In each benzene ring substituted with R, the total number of carbon atoms of a plurality of R's is 2 to 8. k is an integer of 1 to 3.) [3] An epoxy resin obtained by reacting the phenolic resin according to the above [1] or [2] with epihalohydrin. [4] A curable resin composition containing the epoxy resin according to the above [3]. [5] Furthermore, the curable resin composition according to the above [4], which contains a curing agent and / or a curing accelerator. [6] Furthermore, the curable resin composition according to the preceding paragraph [4], which contains at least one or more selected from a curing accelerator, a polymerization initiator, an epoxy resin, an active ester compound, a phenolic resin, a polyphenylene ether compound, an amine resin, a compound having an ethylenically unsaturated bond, an isocyanate resin, a polyamide resin, a maleimide compound, a cyanate ester resin, a polyimide resin, polybutadiene and its modified products, polystyrene and its modified products, polyethylene and its modified products, and a benzoxazine compound. [7] A cured product obtained by curing the curable resin composition according to any one of the preceding paragraphs [4] to [6]. [8] An epoxy resin represented by the following formula (d-1).

[0017] [Chemical formula]

[0018] (In the formula (d-1), a plurality of R's exist independently and each represents a hydrocarbon group having 1 to 5 carbon atoms. In each benzene ring substituted with R, the total number of carbon atoms of a plurality of R's is 2 to 8. k is an integer of 1 to 3. n is the average value of the repeating number and is 1 to 20.) [Advantages of the Invention]

[0019] According to the present invention, an epoxy resin, a curable resin composition, and a cured product thereof that are excellent in high fluidity and heat resistance can be provided. [Brief Description of the Drawings]

[0020] [Figure 1] Shows the GPC chart of Synthesis Example 1. [Figure 2] Shows the GPC chart of Synthesis Example 2. [Modes for Carrying Out the Invention]

[0021] The embodiments of the present invention (hereinafter also referred to as "this embodiment") will be described in more detail below.

[0022] The phenolic resin of this embodiment is obtained by reacting a compound represented by the following formula (a) with a compound represented by the following formula (b).

[0023] [ka]

[0024] In formula (a) above, each of the multiple R groups exists independently and represents a hydrocarbon group having 1 to 5 carbon atoms, preferably a hydrocarbon group having 1 to 4 carbon atoms. If the number of carbon atoms is 6 or more, the heat resistance will be impaired and there is a risk of a decrease in the elastic modulus of the cured product, which is undesirable from the viewpoint of causing warping of the substrate when applied to a substrate material. If a hydrocarbon group is not introduced, the cured product will be more susceptible to water absorption, which may cause swelling during solder reflow. The total number of carbon atoms of each independently existing R group is 2 to 8, preferably 2 to 6, and more preferably 2 to 5. If the total number of carbon atoms of R is 1, the effect of reducing water absorption may not be sufficiently obtained, and if the total is 9 or more, there is a risk of increased viscosity due to an increase in molecular weight and a decrease in heat resistance. From the viewpoint of achieving both high fluidity and heat resistance, it is preferable that the total number of carbon atoms of R is 2 to 8. k represents an integer from 1 to 3, preferably 2 to 3. For example, if k=2 and all R groups are methyl groups, the total number of carbon atoms of R is 2.

[0025] As for compounds represented by formula (a) above, it is preferable that they have alkyl groups at the 2nd and 5th positions (or 3rd and 6th positions) relative to the phenolic hydroxyl group. By introducing hydrocarbon groups at these substitution positions, it is possible to obtain phenolic resins with a narrow molecular weight distribution and epoxy resins derived therefrom. Compounds having alkyl groups at the 2nd and 5th positions (or 3rd and 6th positions) relative to the phenolic hydroxyl group are not particularly limited, but preferred compounds include, for example, 3-methyl-6-t-butylphenol, thymol, carvacrol, and 2,5-dimethylphenol.

[0026] The compound represented by formula (b) above has a hydroxyl group at the ortho position of the aldehyde group, which, after being converted into a phenol resin or epoxy resin, causes steric hindrance, resulting in a high modulus of elasticity and low water absorption of the cured product.

[0027] The reaction between the compound represented by formula (a) and the compound represented by formula (b) may be synthesized using any known method, for example, a reaction in a solvent in the presence of an acid catalyst.

[0028] The compound of formula (a) above is preferably charged in an amount of 1.1 to 8 times the molar ratio to the compound of formula (b) above, more preferably 1.25 to 6 times the molar ratio, and even more preferably 1.5 to 4 times the molar ratio. If the amount is less than 1.1 times the molar ratio, washing with water becomes difficult due to the high molecular weight, and the fluidity of the resin may decrease significantly. If the amount exceeds 8 times the molar ratio, the yield produced in one batch decreases significantly, and it is also undesirable from the standpoint of increasing waste. In the reaction, hydrochloric acid, phosphoric acid, sulfuric acid, formic acid, p-toluenesulfonic acid, methanesulfonic acid, as well as Lewis acids such as aluminum chloride and zinc chloride, solid acids such as activated clay, acid clay, white carbon, zeolite, silica alumina, and acid ion exchange resins can be used as acid catalysts. These may be used alone or in combination of two or more. The amount of catalyst used is 0.01 to 25% by mass, preferably 0.1 to 15% by mass, relative to the total mass of the reaction substrates, phenols (compounds of formula (a) above) and salicylaldehyde (compounds of formula (b) above). Using too much catalyst may make stirring during the synthesis reaction difficult and is undesirable as it increases unnecessary waste. Examples of solvents that can be used include non-water-soluble solvents such as aromatic solvents like toluene and xylene, aliphatic solvents like cyclohexane and n-hexane, ethers like diethyl ether and diisopropyl ether, ester solvents like ethyl acetate and butyl acetate, ketone solvents like methyl isobutyl ketone and cyclopentanone, as well as alcohol solvents like methanol, ethanol, and isopropanol. However, the solvents are not limited to these, and two or more may be used in combination. In addition to the non-water-soluble solvents, aprotic polar solvents may also be used in combination. Examples include dimethyl sulfone, dimethyl sulfoxide, dimethylformamide, dimethylacetamide, 1,3-dimethyl-2-imidazolidinone, and N-methylpyrrolidone, and two or more may be used in combination. The reaction temperature is preferably 20 to 180°C, more preferably 40 to 160°C, and even more preferably 50 to 130°C. If the reaction temperature is too high, the methine structure of the trisphenolmethane structure may decompose, and if the reaction temperature is too low, the reaction may not proceed sufficiently.After the reaction is complete, the acidic catalyst may be neutralized with an alkaline aqueous solution, the solvent may be recovered, and the target phenol resin may be obtained together with the neutralized salt. Alternatively, an insoluble organic solvent may be added to the oil layer, and the wastewater may be washed repeatedly until it becomes neutral, after which the solvent may be removed under heated reduced pressure to obtain the target phenol resin. When activated clay or ion exchange resin is used, after the reaction is complete, the reaction solution is filtered to remove the catalyst, the solvent is recovered, and the target phenol resin is obtained. The amount of monomer remaining in the compound represented by formula (a) above is preferably 0.01 to 10% by mass, more preferably 0.05 to 7.5% by mass, and even more preferably 0.1 to 5% by mass. This monomer amount affects the amount of low molecular weight remaining in the epoxy resin, and this amount affects the heat resistance, etc.

[0029] The phenol resin obtained by reacting the compound represented by formula (a) above with the compound represented by formula (b) above contains 75 to 95 area percent of the compound represented by formula (c) below, as detected by a differential refractometer in gel permeation chromatography analysis. If the content of the compound represented by formula (c) below is less than 75 area percent, the phenol resin of this embodiment, the epoxy resin made therefrom, and the curable resin composition containing them may not have sufficient fluidity. If it exceeds 95 area percent, the phenol resin of this embodiment, the epoxy resin made therefrom, and the curable resin composition containing them may not have sufficient heat resistance, and may also have high crystallinity and reduced solvent solubility.

[0030] [ka]

[0031] In formula (c) above, each of the multiple R atoms exists independently and represents a hydrocarbon group having 1 to 5 carbon atoms. In each benzene ring substituted with R, the sum of the carbon atoms of the multiple R atoms is between 2 and 8. k is an integer between 1 and 3. The preferred values ​​for R and k are the same as those in formula (a) above.

[0032] The number-average molecular weight (Mn) of the phenol resin obtained by reacting the compound represented by formula (a) above with the compound represented by formula (b) above is preferably 300 to 1500, more preferably 325 to 1000, and even more preferably 350 to 800. If the number-average molecular weight is less than 300, the heat resistance may decrease due to residual raw materials, etc. If the number-average molecular weight exceeds 1500, the fluidity may decrease due to the increased molecular weight.

[0033] The weight-average molecular weight (Mw) of the phenol resin obtained by reacting the compound represented by formula (a) above with the compound represented by formula (b) above is preferably 300 to 1500, more preferably 325 to 1000, and even more preferably 350 to 800. If the weight-average molecular weight is less than 300, the heat resistance may decrease due to residual raw materials, etc. If the weight-average molecular weight is greater than 1500, the fluidity may decrease due to the increased molecular weight.

[0034] The hydroxyl group equivalent of the phenol resin obtained by reacting the compound represented by formula (a) with the compound represented by formula (b) is preferably 100 to 200 g / eq., more preferably 110 to 180 g / eq., and even more preferably 120 to 160 g / eq. The above hydroxyl group equivalent may be calculated from the area % obtained by gel permeation chromatography (GPC) analysis, or it may be measured by titration. When measuring by titration, for example, the sample is acetylated in a pyridine solution with acetic anhydride, the remaining acid anhydride is decomposed with water after acetylation is complete, and the amount of free acetic acid is measured by titrating with a 0.5 N KOH ethanol solution using a potentiometric titrator, and the hydroxyl group equivalent can be determined from the result.

[0035] The content of the polymer component of the compound represented by formula (c) above is preferably 1 to 25 area%, and more preferably 3 to 15 area%, as determined by gel permeation chromatography analysis (detection by differential refractometer). If it exceeds 25 area%, fluidity may decrease, and if it falls below 3 area%, solvent solubility and heat resistance may decrease.

[0036] A typical structure of the phenol resin obtained by reacting the compound represented by formula (a) above with the compound represented by formula (b) above can be represented as shown in formula (c-1) below.

[0037] [ka]

[0038] In formula (c-1) above, each of the multiple R groups exists independently and represents a hydrocarbon group having 1 to 5 carbon atoms. In each benzene ring substituted with R, the sum of the carbon atoms of the multiple R groups is 2 to 8. k is an integer from 1 to 3. Preferred values ​​for R and k are the same as in formula (a) above. n is the average value of the number of repeats, and is 1 to 20, preferably 1 to 10, and more preferably 1 to 5. If n is less than 1, there is a risk of high monomer residue and reduced heat resistance. If n is greater than 20, there is a risk of insufficient fluidity. n can be determined by GPC analysis, and may be calculated from the area % of each peak or from the number-average molecular weight (Mn).

[0039] The epoxy resin of this embodiment will be described below. The epoxy resin of this embodiment can be obtained by reacting a phenol resin, which is obtained by reacting a compound represented by formula (a) with a compound represented by formula (b), with an epihalohydrin. For example, it can be obtained by adding or ring-closing the phenol resin of this embodiment with the epihalohydrin in the presence of a solvent and a catalyst. The amount of epihalohydrin used is usually 1.0 to 20.0 moles, preferably 1.5 to 10.0 moles, per mole of phenolic hydroxyl groups of the phenol resin.

[0040] Examples of alkali metal hydroxides that can be used in the epoxidation reaction include sodium hydroxide and potassium hydroxide. The alkali metal hydroxide may be used in solid form or as an aqueous solution. When using an aqueous solution, the aqueous solution of the alkali metal hydroxide may be continuously added to the reaction system, and water and epihalohydrin may be continuously distilled off under reduced pressure or normal pressure, followed by liquid-liquid separation to remove the water and continuously returning the epihalohydrin to the reaction system. The amount of alkali metal hydroxide used is usually 0.9 to 2.5 moles per mole of phenolic hydroxyl groups of the phenolic resin, preferably 0.95 to 1.5 moles. If the amount of alkali metal hydroxide used is too small, the reaction will not proceed sufficiently. On the other hand, excessive use of alkali metal hydroxide exceeding 2.5 moles per mole of phenolic hydroxyl groups of the phenolic resin will result in the generation of unnecessary waste by-products.

[0041] To accelerate the above reaction, quaternary ammonium salts such as tetramethylammonium chloride, tetramethylammonium bromide, and trimethylbenzylammonium chloride may be added as catalysts. The amount of quaternary ammonium salt used is usually 0.1 to 15 g, preferably 0.2 to 10 g, per mole of phenolic hydroxyl groups in the phenolic resin. If the amount used is too small, a sufficient reaction-accelerating effect will not be obtained, and if the amount used is too large, the amount of quaternary ammonium salt remaining in the epoxy resin will increase, which may cause deterioration of electrical reliability.

[0042] During the epoxidation reaction, it is preferable to add alcohols such as methanol, ethanol, and isopropyl alcohol, or aprotic polar solvents such as dimethyl sulfone, dimethyl sulfoxide, tetrahydrofuran, and dioxane to facilitate the reaction. When alcohols are used, the amount used is usually 2 to 50% by mass, preferably 4 to 20% by mass, relative to the amount of epihalohydrin. When aprotic polar solvents are used, the amount used is usually 5 to 100% by mass, preferably 10 to 80% by mass, relative to the amount of epihalohydrin. The reaction temperature is usually 30 to 90°C, preferably 35 to 80°C. The reaction time is usually 0.5 to 100 hours, preferably 1 to 30 hours.

[0043] After the reaction is complete, the reactants are washed with water, or heated under reduced pressure without washing, to remove epihalohydrins, solvents, etc. Furthermore, to obtain an epoxy resin with fewer hydrolyzable halogens, the recovered epoxy resin can be dissolved in a solvent such as toluene or methyl isobutyl ketone, and an aqueous solution of alkali metal hydroxide such as sodium hydroxide or potassium hydroxide can be added to carry out the reaction and ensure ring closure. In this case, the amount of alkali metal hydroxide used is usually 0.01 to 0.3 moles, preferably 0.05 to 0.2 moles, per mole of phenolic hydroxyl groups of the phenol resin used for glycidylation. The reaction temperature is usually 50 to 120°C, and the reaction time is usually 0.5 to 24 hours. After the reaction is complete, the generated salt is removed by filtration, washing with water, etc., and the solvent is further removed by distillation under reduced pressure, thereby obtaining the epoxy resin of this embodiment.

[0044] The softening point of the epoxy resin in this embodiment is preferably 40 to 150°C, more preferably 45 to 125°C, and even more preferably 50 to 100°C. If the softening point is higher than 150°C, solvent tends to remain when the resin is removed, and voids are likely to form during curing. There are also significant production challenges, such as a tendency to foam during solvent removal. On the other hand, if the softening point is below 40°C, it negatively affects heat resistance and thermal decomposition properties. Furthermore, the epoxy equivalent is preferably 150 to 300 g / eq., more preferably 160 to 275 g / eq., and even more preferably 170 to 250 g / eq. If the epoxy equivalent is less than 150 g / eq., there is a possibility of residual epichlorohydrin and a large amount of impurity epoxidized products remaining, which may lead to deterioration of properties. If it exceeds 300 g / eq., a decrease in heat resistance becomes a problem. The ICI viscosity of the epoxy resin in this embodiment at 150°C is preferably 0.01 to 0.5 Pa·s, more preferably 0.01 to 0.4 Pa·s, and even more preferably 0.01 to 0.3 Pa·s. If the ICI viscosity at 150°C exceeds 0.5 Pa·s, it is difficult to obtain sufficient fluidity. In this embodiment, fluidity is improved by controlling the gel time during curing by utilizing the steric hindrance of the alkyl group derived from the compound of formula (a) and the orientation of the hydroxyl group derived from the compound of formula (b) (having a hydroxyl group at the ortho position of the aldehyde). If the gel time during curing is too fast, the resin will not flow properly during molding.

[0045] The epoxy resin of this embodiment contains 75 to 95 area percent of the compound represented by the following formula (d) as detected by a differential refractometer in gel permeation chromatography analysis. If the content of the compound represented by the following formula (d) is less than 75 area percent, the epoxy resin of this embodiment and the curable resin composition containing them may not be able to obtain sufficient fluidity. If it exceeds 95 area percent, the epoxy resin of this embodiment and the curable resin composition containing them may not be able to obtain sufficient heat resistance, and the crystallinity may be high, resulting in reduced solvent solubility.

[0046] [ka]

[0047] In formula (d) above, each of the multiple R atoms exists independently and represents a hydrocarbon group with 1 to 5 carbon atoms. In each benzene ring substituted with R, the sum of the carbon atoms of the multiple R atoms is between 2 and 8. k is an integer between 1 and 3. The preferred values ​​for R and k are the same as those in formula (a) above.

[0048] The typical structure of the epoxy resin in this embodiment can be represented by the following formula (d-1). [ka]

[0049] In formula (d-1) above, each of the multiple R groups exists independently and represents a hydrocarbon group with 1 to 5 carbon atoms. In each benzene ring substituted with R, the sum of the carbon atoms of the multiple R groups is between 2 and 8. k is an integer between 1 and 3. n is the average value of the number of repeats and is between 1 and 20. The preferred values ​​for R, k, and n are the same as in formula (c-1) above.

[0050] The curable resin composition of this embodiment will be described below. The epoxy resin used in the curable resin composition of this embodiment may be used alone, or it may be used in combination with other epoxy resins. When used in combination, the proportion of the epoxy resin of this embodiment in the total epoxy resin is preferably 10 to 98% by mass, more preferably 30 to 95% by mass, and even more preferably 60 to 95% by mass. By adding 10% or more of the epoxy resin of this embodiment, high fluidity and high heat resistance can be achieved.

[0051] Specific examples of other epoxy resins that can be used in combination with the epoxy resin of this embodiment include bisphenols (bisphenol A, bisphenol F, bisphenol S, biphenol, bisphenol AD, etc.) or phenols (phenol, alkyl-substituted phenol, aromatic-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, alkyl-substituted dihydroxybenzene, dihydroxynaphthalene, etc.) and various aldehydes (formaldehyde, acetaldehyde, alkylaldehyde, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzaldehyde, naphthaldehyde, glutaraldehyde, phthalaldehyde, etc.). Polycondensates of phenols (such as rotonaldehyde and cinnamaldehyde); polymers of the phenols and various diene compounds (such as dicyclopentadiene, terpenes, vinylcyclohexene, norbornadiene, vinylnorbornene, tetrahydroindene, divinylbenzene, divinylbiphenyl, diisopropenylbiphenyl, butadiene, isoprene, etc.); polycondensates of the phenols and ketones (such as acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, etc.); polycondensates of the phenols and aromatic dimethanols (such as benzenedimethanol and biphenyldimethanol, etc.); polycondensates of the phenols and aromatic dichloromethyls (α,Polycondensates of α'-dichloroxylene (e.g., bischloromethylbiphenyl); polycondensates of the phenols and aromatic bisalkoxymethyl compounds (e.g., bismethoxymethylbenzene, bismethoxymethylbiphenyl, bisphenoxymethylbiphenyl); glycidyl ether epoxy resins, alicyclic epoxy resins, glycidylamine epoxy resins, glycidyl ester epoxy resins, etc. obtained by glycidly obtaining polycondensates of the bisphenols and various aldehydes or alcohols, etc., are examples, but the invention is not limited to these as long as it is a commonly used epoxy resin. Specific examples include "RE310S", "RE410S" (both manufactured by Nippon Kayaku Co., Ltd., bisphenol A type epoxy resin), "RE303S", "RE304S", "RE403S", "RE404S" (all manufactured by Nippon Kayaku Co., Ltd., bisphenol F type epoxy resin), "HP4032", "HP4032D", "HP4032SS" (all manufactured by DIC Corporation, naphthalene type epoxy resin), "jER(registered trademark)828US", "jER828EL", "825", "828EL" (all manufactured by Mitsubishi Chemical Corporation, bisphenol A type epoxy resin), "jER807", "jER1750" (both manufactured by Mitsubishi Chemical Corporation, bisphenol F type epoxy resin), and "jER152 (Mitsubishi Chemical Corporation, phenol novolac type epoxy resin), "jER630", "jER630LSD" (both manufactured by Mitsubishi Chemical Corporation, glycidylamine type epoxy resin), "ZX1059" (Nippon Steel & Sumitomo Metal Chemical Co., Ltd., mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin), "EX-721" (Nagase ChemteX Corporation, glycidyl ester type epoxy resin), "Celoxide (registered trademark) 2021P" (Daicel Corporation, alicyclic epoxy resin with ester skeleton), "PB-3600" (Daicel Corporation, epoxy resin with butadiene structure), "ZX1658", "ZX1658GS" (both manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., liquid 1,4-Glycidylcyclohexane type epoxy resin), "HP4032H" (manufactured by DIC, naphthalene type epoxy resin), "HP-4700", "HP-4710" (both manufactured by DIC, naphthalene type tetrafunctional epoxy resin), "N-690" (manufactured by DIC, cresol novolac type epoxy resin), "N-695" (manufactured by DIC, cresol novolac type epoxy resin), "HP-7200", "HP-7200HH", "HP-7200H" (both manufactured by DIC, dicyclopentadiene type epoxy resin), "EXA-7311 "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP-6000" (all manufactured by DIC Corporation, naphthylene ether type epoxy resin), "EPPN-502H" (manufactured by Nippon Kayaku Co., Ltd., trisphenol type epoxy resin), "NC-7000L", "NC-7300" (both manufactured by Nippon Kayaku Co., Ltd., naphthol-cresol novolac type epoxy resin), "NC-3000H", "NC-3000", "NC-3000L", "NC-3100" (all manufactured by Nippon Kayaku Co., Ltd., biphenyl aralkyl (Type epoxy resin), "XD-1000-2L", "XD-1000-L", "XD-1000-H" (all manufactured by Nippon Kayaku Co., Ltd., dicyclopentadiene type epoxy resin), "ESN475V" (manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., naphthol type epoxy resin), "ESN485" (manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., naphthol novolac type epoxy resin), "YX-4000H", "YX-4000", "YL6121" (all manufactured by Mitsubishi Chemical Corporation, biphenyl type epoxy resin), "YX-4000HK" (manufactured by Mitsubishi Chemical Corporation, bixylenol type epoxy resin) Examples include (a type of epoxy resin), "YX-8800" (manufactured by Mitsubishi Chemical Corporation, anthracene-type epoxy resin), "PG-100", "CG-500" (manufactured by Osaka Gas Chemical Co., Ltd., fluorene-based epoxy resin), "YL-7760" (manufactured by Mitsubishi Chemical Corporation, bisphenol AF-type epoxy resin), "YL-7800" (manufactured by Mitsubishi Chemical Corporation, fluorene-type epoxy resin), "jER1010" (manufactured by Mitsubishi Chemical Corporation, solid bisphenol A-type epoxy resin), and "jER1031S" (manufactured by Mitsubishi Chemical Corporation, tetraphenylethane-type epoxy resin). These may be used individually or in combination of two or more types.

[0052] Examples of curing agents that can be used in the curable resin composition of this embodiment include amine-based curing agents, acid anhydride-based curing agents, amide-based curing agents, phenol-based curing agents, and active ester compounds described later. Specific examples of curing agents that can be used include, for example, o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylsulfone, 3,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, 2,2'-diaminodiphenylsulfone, diethyltoluenediamine, dimethylthiotoluenediamine, diaminodiphenylmethane, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, and 3,3'-diethyl-4,4'-diaminodiphenyl Nylmethane, 4,4'-diamino-3,3'-diethyl-5,5'-dimethyldiphenylmethane, 4,4'-diamino-3,3',5,5'-tetramethyldiphenylmethane, 4,4'-diamino-3,3',5,5'-tetraethyldiphenylmethane, 4,4'-diamino-3,3',5,5'-tetraisopropyldiphenylmethane, 3,3'-diisopropyl-4,4'-diaminodiphenylmethane, 3,3'-di-t-butyl-4,4'-diaminodiphenylmethane, 3,3'-diisopropyl Ropyru-5,5'-dimethyl-4,4'-diaminodiphenylmethane, 3,3'-di-t-butyl-5,5'-dimethyl-4,4'-diaminodiphenylmethane, 3,3'-diisopropyl-5,5'-diethyl-4,4'-diaminodiphenylmethane, 3,3'-di-t-butyl-5,5'-diethyl-4,4'-diaminodiphenylmethane, 3,3'-di-t-butyl-5,5'-diisopropyl-4,4'-diaminodiphenylmethane, 3,3',5,5'-tetra-t-butyl-4,4' -Diaminodiphenylmethane, 4,4'-methylenebis(N-methylaniline), bis(aminophenyl)fluorene, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 2,2'-bis[4-(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, 1,3'-bis(4-aminophenoxy)benzene, 1,4'-bis(4-aminophenoxy)benzene, 1,4'-bis(4-aminophenoxy)biphenyl,Examples of aromatic amine compounds include, but are not limited to, 4,4'-(1,3-phenylenediisopropylidene)bisaniline, naphthalenediamine, benzidine, dimethylbenzidine, aromatic amine compounds described in Synthesis Examples 1 and 2 of International Publication No. 2017 / 170551, 1,3-bis(aminomethyl)cyclohexane, isophoronediamine, 4,4'-methylenebis(cyclohexylamine), norbornanediamine, ethylenediamine, propanediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, dimeramine, metaxylylenediamine, triethylenetetramine, and other aliphatic amines. They can be suitably used depending on the properties to be imparted to the composition. It is preferable to use aromatic amines to ensure pot life, and it is preferable to use aliphatic amines when immediate curing is desired. By using amine compounds containing a bifunctional component as the main component as a curing agent, a highly linear network can be constructed during the curing reaction, resulting in particularly excellent toughness. Other examples include amide compounds such as dicyandiamide and polyamide resins synthesized from linolenic acid dimers and ethylenediamine; acid anhydride compounds such as phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride, and methylhexahydrophthalic anhydride; bisphenols (bisphenol A, bisphenol F, bisphenol S, biphenol, bisphenol AD, etc.) or phenols (phenol, alkyl-substituted phenol Polycondensates of phenols (such as formaldehyde, acetaldehyde, alkylaldehyde, benzaldehyde, alkyl-substituted naphthol, dihydroxybenzene, alkyl-substituted dihydroxybenzene, dihydroxynaphthalene, etc.) and various aldehydes (such as formaldehyde, acetaldehyde, alkylaldehyde, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzaldehyde, naphthaldehyde, glutaraldehyde, phthalaldehyde, crotonaldehyde, cinnamaldehyde, furfural, etc.), or polycondensates of the phenols and various diene compounds (dicyclopentadiene, terpenes, etc.)Phenolic compounds such as polymers of vinylcyclohexene, norbornadiene, vinylnorbornene, tetrahydroindene, divinylbenzene, divinylbiphenyl, diisopropenylbiphenyl, butadiene, isoprene, etc., or polycondensates of the phenols and ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, fluorenone, etc.), or polycondensates of the phenols and aromatic dimethanols (benzenedimethanol, biphenyldimethanol, etc.), or polycondensates of the phenols and aromatic dichloromethyls (α,α'-dichloroxylene, bischloromethylbiphenyl, etc.), or polycondensates of the phenols and aromatic bisalkoxymethyls (bismethoxymethylbenzene, bismethoxymethylbiphenyl, bisphenoxymethylbiphenyl, etc.), or polycondensates of the bisphenols and various aldehydes, and modified versions thereof; examples include, but are not limited to, imidazoles, trifluoroborane-amine complexes, guanidine derivatives, etc.

[0053] [Activated ester compounds] The above-mentioned active ester compounds refer to compounds that contain at least one ester bond in their structure, and on both sides of the ester bond, an aliphatic chain, an aliphatic ring, or an aromatic ring is bonded. Examples of active ester compounds include compounds having two or more highly reactive ester groups in one molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds. These are obtained by a condensation reaction between at least one compound of a carboxylic acid compound, an acid chloride, or a thiocarboxylic acid compound and at least one compound of a hydroxy compound or a thiol compound. In particular, from the viewpoint of improving heat resistance, it is preferable that they be obtained from a carboxylic acid compound or an acid chloride and a hydroxy compound, and phenol compounds or naphthol compounds are preferred as the hydroxy compound. Active ester compounds may be used alone or in combination of two or more.

[0054] Examples of the carboxylic acid compounds mentioned above include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.

[0055] Examples of the above-mentioned acid chlorides include acetyl chloride, acrylate chloride, methacrylate chloride, malonyl chloride, succinate dichloride, diglycolyl chloride, glutarate dichloride, suberic acid dichloride, sebacate dichloride, adipic acid dichloride, dodecanediol dichloride, azera oil chloride, 2,5-franzicarbonyl dichloride, phthaloyl chloride, isophthaloyl chloride, terephthaloyl chloride, trimesic acid chloride, bis(4-chlorocarbonylphenyl) ether, 4,4'-diphenyldicarbonyl chloride, and 4,4'-azodibenzoyl dichloride.

[0056] Examples of the above-mentioned phenol compounds and naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, phenol novolac, and phenol resins described later. Here, "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by the condensation of two molecules of phenol with one molecule of dicyclopentadiene.

[0057] Preferred examples of active ester compounds include active ester compounds containing a dicyclopentadiene-type diphenol structure, active ester compounds containing a naphthalene structure, active ester compounds containing an acetylated phenol novolac, active ester compounds containing a benzoylated phenol novolac, the compounds described in Example 2 of International Publication No. 2020 / 095829, and the compounds disclosed in International Publication No. 2020 / 059625. Among these, active ester compounds containing a naphthalene structure and active ester compounds containing a dicyclopentadiene-type diphenol structure are more preferred. The dicyclopentadiene-type diphenol structure represents a divalent structural unit consisting of phenylene-dicyclopentylene-phenylene.

[0058] Commercially available active ester compounds include, for example, "EXB9451," "EXB9460," "EXB9460S," "HPC-8000-65T," "HPC-8000H-65TM," "EXB-8000L-65TM," and "EXB-8150-65T" (manufactured by DIC Corporation) as active ester compounds containing a dicyclopentadiene-type diphenol structure; "EXB9416-70BK" (manufactured by DIC Corporation) as an active ester compound containing a naphthalene structure; "DC808" (manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing an acetylated phenol novolac; "YLH1026," "YLH1030," and "YLH1048" (manufactured by Mitsubishi Chemical Corporation) as active ester compounds containing a benzoylated phenol novolac; "EXB-9050L-62M" (manufactured by DIC Corporation) as a phosphorus atom-containing active ester curing agent; and "Unifiner" as an active ester compound containing a bisphenol A structure. Examples include "W-575".

[0059] In the curable resin composition of this embodiment, the amount of curing agent used is preferably 0.5 to 1.5 equivalents, and particularly preferably 0.6 to 1.2 equivalents, per equivalent of epoxy groups in the epoxy resin. Good cured properties can be obtained by using 0.5 to 1.5 equivalents.

[0060] When performing a curing reaction using the above curing agent, a curing accelerator may be used in combination. Examples of usable curing accelerators include imidazoles such as 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, and 2-ethyl-4-methylimidazole; tertiary amines such as 2-(dimethylaminomethyl)phenol, triethylenediamine, triethanolamine, and 1,8-diazabicyclo(5,4,0)undecene-7; organophosphines such as triphenylphosphine, diphenylphosphine, and tributylphosphine; metal compounds such as tin octylate; tetraphenylphosphonium-tetraphenylborate and tetraphenylphosphonium-ethyltriphenylborate; tetraphenylboron salts such as 2-ethyl-4-methylimidazole-tetraphenylborate and N-methylmorpholine-tetraphenylborate; and carboxylic acid compounds such as benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, naphthoic acid, and salicylic acid. From the viewpoint of promoting the curing reaction between amine compounds and epoxy resins, carboxylic acid compounds such as salicylic acid are preferred. The curing accelerator is used as needed in an amount of 0.01 to 15 parts by mass per 100 parts by mass of epoxy resin.

[0061] Furthermore, inorganic fillers may be added to the curable resin composition of this embodiment as needed. Examples of inorganic fillers include, but are not limited to, powders such as crystalline silica, fused silica, hollow silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, aluminum hydroxide, magnesium hydroxide, zircon, calcium silicate, calcium carbonate, silicon carbide, silicon nitride, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, zirconium tungstate phosphate, clay, zirconia, fossilite, steatite, spinel, titania, talc, mica powder, zinc oxide, hydrotalcite, boehmite, carbon black, or beads made by shaping these into spheres. These may be used individually or in combination of two or more types. The amount of these inorganic fillers used varies depending on the application, but for example, when used as a encapsulant for semiconductors, it is preferable to use them in a proportion of 20% by mass or more in the curable resin composition, more preferably 30% by mass or more, and even more preferably 70-95% by mass in order to improve the coefficient of linear expansion with the lead frame.

[0062] The curable resin composition of this embodiment may contain a release agent to improve mold release during molding. Any conventionally known release agent can be used, but examples include ester waxes such as carnauba wax and montane wax, fatty acids such as stearic acid and palmitic acid and their metal salts, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. These may be used individually or in combination of two or more. The amount of these release agents added is preferably 0.5 to 3% by mass relative to the total organic components. Too little will result in poor mold release, while too much will result in poor adhesion to the lead frame and the like.

[0063] The curable resin composition of this embodiment may contain a coupling agent to enhance the adhesion between the inorganic filler and the resin component. Any conventionally known coupling agent can be used, but examples include various alkoxysilane compounds such as vinyl alkoxysilane, epoxy alkoxysilane, styryl alkoxysilane, methacryloxyalkoxysilane, acryloxyalkoxysilane, amino alkoxysilane, mercaptoalkoxysilane, and isocyanate alkoxysilane, as well as alkoxytitanium compounds and aluminum chelates. These may be used individually or in combination of two or more. The coupling agent may be added by first treating the surface of the inorganic filler with the coupling agent and then kneading it with the resin, or by mixing the coupling agent with the resin and then kneading the inorganic filler.

[0064] Furthermore, known additives may be added to the curable resin composition of this embodiment as needed. Specific examples of additives that can be used include polybutadiene and its modified products, modified acrylonitrile copolymers, polyphenylene ether, polystyrene, polyethylene, polyimide, fluororesin, maleimide compounds, cyanate ester compounds, silicone gels, silicone oils, and colorants such as carbon black, phthalocyanine blue, and phthalocyanine green.

[0065] The curable resin composition of this embodiment may contain, in addition to the components described above, the components exemplified below. For example, these include carboxylic acid compounds, maleimide compounds, cyanate compounds, isocyanate compounds, polyphenylene ether compounds, compounds having ethylenically unsaturated bonds, polyamide compounds, polyimide compounds, allyl compounds, polybutadiene and its modified counterparts, polystyrene and its modified counterparts, polyethylene and its modified counterparts, benzoxazine compounds, flame retardants, polymerization initiators, etc. These may be used individually or in combination. Among these compounds, it is preferable to include polyphenylene ether compounds, compounds having ethylenically unsaturated bonds, cyanate ester resins, polybutadiene and its modified counterparts, polystyrene and its modified counterparts, benzoxazine compounds, flame retardants, polymerization initiators, etc., in order to balance heat resistance, adhesion, and dielectric properties. By including these compounds, the brittleness of the cured product can be improved and adhesion to metal can be enhanced, and cracks in the package can be suppressed during reliability tests such as solder reflow and thermal cycling. The total amount of the above compounds used is preferably 10 times or less by mass, more preferably 5 times or less by mass, and most preferably 3 times or less by mass, relative to the compound of this embodiment, unless otherwise specified. Furthermore, the preferred lower limit is 0.1 times or more by mass, more preferably 0.25 times or more by mass, and even more preferably 0.5 times or more by mass. Within this range, the effects of each added compound can be added while utilizing the heat-resistant effect of the compound of this embodiment. Examples of these components can be used as shown below.

[0066] [Carboxylic acid compounds] Examples of the carboxylic acid compounds mentioned above include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, oxalic acid, malonic acid, succicic acid, glutaric acid, adipic acid, suberic acid, azelaic acid, sebacic acid, undecanediic acid, dodecanediic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid, 5-hydroxyisophthalic acid, 2-chloroterephthalic acid, 2-methylterephthalic acid, 5-methylisophthalic acid, 5-sodium sulfoisophthalic acid, hexahydroterephthalic acid, hexahydroisophthalic acid, cyclohexanedicarboxylic acid, biphenyldicarboxylic acid, naphthalenedicarboxylic acid, benzophenonedicarboxylic acid, francicarboxylic acid, 4,4'-dicarboxydiphenyl ether, and 4,4'-dicarboxydiphenyl sulfide. A commercially available product is G4-142MHR (manufactured by Nippon Kayaku Co., Ltd.).

[0067] [Maleimide compounds] Examples of the above maleimide compounds include phenylmaleimide, 4,4'-diphenylmethanebismaleimide, polyphenylmethanemaleimide, m-phenylenebismaleimide, 2,2'-bis[4-(4-maleimidophenoxy)phenyl]propane, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethanebismaleimide, 4-methyl-1,3-phenylenebismaleimide, 4,4'-diphenyletherbismaleimide, 4,4'-diphenylsulfonebismaleimide, 1,3-bis(3-maleimidophenoxy)benzene, 1,3-bis(4-maleimidophenoxy)benzene, and Zyloc-type maleimide compounds (anilix). Maleimide (manufactured by Mitsui Chemicals Fine Co., Ltd.), biphenylaralkyl type maleimide compound (solidified by solvent distillation under reduced pressure of a resin solution containing the maleimide compound (M2) described in Example 4 of Japanese Patent Publication No. 2009-001783), bisaminocumylbenzene type maleimide (maleimide compound described in International Publication No. 2020 / 054601), maleimide compound having an indan structure described in Japanese Patent No. 6629692 or International Publication No. 2020 / 217679, polymaleimide derived from aromatic vinyl compounds and anilines described in Japanese Patent Publication No. 2023-007239, MATERIAL STAGE Vol. 18, No. 12 2019 "~Continued Epoxy Resin CAS Number Story~ Curing Agent CAS Number Memo No. 31 Bismaleimide (1)" and MATERIAL STAGE Vol. 19, No. 2 2019 Examples include maleimide compounds described in "~Continued Story of Epoxy Resin CAS Numbers~ Memo on CAS Numbers of Hardeners, Part 32: Bismaleimide (2)". Commercially available examples include MIR-3000-70MT (biphenyl aralkyl type maleimide compound, manufactured by Nippon Kayaku Co., Ltd.) and MIZ-001 (manufactured by Nippon Kayaku Co., Ltd.).

[0068] [Cyanate compounds] Cyanate compounds are obtained by reacting phenol compounds with cyanide halides. Specific examples include dicyanatebenzene, tricyanatebenzene, dicyanatenaphthalene, dicyanatebiphenyl, 2,2'-bis(4-cyanatephenyl)propane, bis(4-cyanatephenyl)methane, bis(3,5-dimethyl-4-cyanatephenyl)methane, 2,2'-bis(3,5-dimethyl-4-cyanatephenyl)propane, 2,2'-bis(4-cyanatephenyl)ethane, 2,2'-bis(4-cyanatephenyl)hexafluoropropane, bis(4-cyanatephenyl)sulfone, bis(4-cyanatephenyl)thioether, phenol novolac cyanate, and compounds obtained by converting the hydroxyl groups of phenol-dicyclopentadiene copolymers to cyanate groups. A commercially available example is CYTESTER TA (manufactured by Mitsubishi Gas Chemical Co., Ltd., a bisphenol A type cyanate resin). These can be used individually or in combination. Furthermore, the cyanate compound whose synthesis method is described in Japanese Patent Publication No. 2005-264154 is particularly preferred as a cyanate compound because it has excellent low hygroscopicity, flame retardancy, and dielectric properties. The cyanate compound may also contain catalysts such as zinc naphthenate, cobalt naphthenate, copper naphthenate, lead naphthenate, zinc octoate, tin octoate, lead acetylacetonate, or dibutyltin maleate to trimerize the cyanate group as needed and form a sym-triazine ring.

[0069] It is preferable to use 0.0001 to 0.10 parts by mass, preferably 0.00015 to 0.0015 parts by mass, of the catalyst per 100 parts by mass of the cyanate compound and the curable resin composition.

[0070] [Isocyanate compounds] An isocyanate compound is a compound that has two or more isocyanate groups in its molecule. Examples of isocyanate compounds include, but are not limited to, aromatic diisocyanates such as p-phenylenediisocyanate, m-phenylenediisocyanate, p-xylenediisocyanate, m-xylenediisocyanate, 2,4-tollylenediisocyanate, 2,6-tollylenediisocyanate, 4,4'-diphenylmethanediisocyanate, and naphthalenediisocyanate; aliphatic or alicyclic diisocyanates such as isophorone diisocyanate, hexamethylenediisocyanate, 4,4'-dicyclohexylmethanediisocyanate, hydrogenated xylenediisocyanate, norbornene diisocyanate, and lysine diisocyanate; biuret derivatives of one or more isocyanate monomers; or polyisocyanates such as isocyanates obtained by trimerizing the above diisocyanate compounds; and polyisocyanates obtained by urethane reaction between the above isocyanate compounds and polyol compounds. Furthermore, these can be used individually or in combination.

[0071] [Polyphenylene ether compounds] From the viewpoint of heat resistance and electrical properties, the polyphenylene ether compound is preferably a polyphenylene ether compound having an ethylenically unsaturated bond, and more preferably a polyphenylene ether compound having an acrylic group, a methacrylic group, or a styrene structure. Commercially available products include SA-9000 (manufactured by SABIC, a polyphenylene ether compound having a methacrylic group), OPE-2St 1200, and OPE-2st 2200 (both manufactured by Mitsubishi Gas Chemical Company, polyphenylene ether compounds having a styrene structure). The number-average molecular weight (Mn) of the polyphenylene ether compound is preferably 500 to 5000, more preferably 2000 to 5000, and even more preferably 2000 to 4000. If the number-average molecular weight is less than 500, the heat resistance of the cured product tends not to be sufficient. If the number-average molecular weight is greater than 5000, the melt viscosity increases, and sufficient fluidity cannot be obtained, which tends to lead to molding defects. Furthermore, the reactivity decreases, requiring a long time for the curing reaction, increasing the amount of unreacted material that is not incorporated into the curing system, lowering the glass transition temperature of the cured product, and tending to reduce the heat resistance of the cured product. If the number-average molecular weight of the polyphenylene ether compound is between 500 and 5000, it is possible to achieve excellent heat resistance and moldability while maintaining excellent dielectric properties. Specifically, the number-average molecular weight can be measured using methods such as gel permeation chromatography.

[0072] Polyphenylene ether compounds may be obtained by polymerization reactions, or by redistributing high molecular weight polyphenylene ether compounds with a number average molecular weight of approximately 10,000 to 30,000. Alternatively, these may be used as raw materials and reacted with compounds having ethylenically unsaturated bonds, such as methacrylate chloride, acrylate chloride, and chloromethylstyrene, to impart radical polymerizability. Polyphenylene ether compounds obtained by redistribution reactions can be obtained, for example, by heating a high molecular weight polyphenylene ether compound in a solvent such as toluene in the presence of a phenolic compound and a radical initiator to induce a redistribution reaction. Polyphenylene ether compounds obtained by such redistribution reactions are preferable because they maintain even higher heat resistance due to having hydroxyl groups derived from phenolic compounds that contribute to curing at both ends of the molecular chain, and because functional groups can be introduced to both ends of the molecular chain even after modification with compounds having ethylenically unsaturated bonds. Furthermore, polyphenylene ether compounds obtained by polymerization reactions are preferable because they exhibit excellent fluidity.

[0073] The molecular weight of polyphenylene ether compounds can be adjusted by adjusting polymerization conditions, etc., in the case of polyphenylene ether compounds obtained by polymerization reactions. In the case of polyphenylene ether compounds obtained by redistribution reactions, the molecular weight of the resulting polyphenylene ether compound can be adjusted by adjusting the conditions of the redistribution reaction, etc. More specifically, this can be done by adjusting the amount of phenolic compound used in the redistribution reaction. That is, the higher the amount of phenolic compound used, the lower the molecular weight of the resulting polyphenylene ether compound. In this case, poly(2,6-dimethyl-1,4-phenylene ether) can be used as the high molecular weight polyphenylene ether compound that undergoes the redistribution reaction. Furthermore, the phenolic compound used in the redistribution reaction is not particularly limited, but polyfunctional phenolic compounds having two or more phenolic hydroxyl groups in the molecule, such as bisphenol A, phenol novolac, and cresol novolac, are preferably used. These may be used individually or in combination of two or more.

[0074] The content of the polyphenylene ether compound is not particularly limited, but is preferably 5 to 1000 parts by mass, and more preferably 10 to 750 parts by mass, per 100 parts by mass of the curable resin composition. When the content of the polyphenylene ether compound is within the above range, it is preferable not only to obtain a cured product that is excellent in heat resistance and the like, but also in that the excellent dielectric properties of the polyphenylene ether compound are fully exhibited.

[0075] [Compounds containing ethylenically unsaturated bonds] A compound containing an ethylenically unsaturated bond is a compound that has one or more ethylenically unsaturated bonds in its molecule that can be polymerized by heat or light, regardless of whether a polymerization initiator is used or not. Examples of compounds containing ethylenically unsaturated bonds include acenaphthylene, indene, styrene, divinylbenzene, reaction products of the phenolic resin and halogenated compounds containing ethylenically unsaturated bonds (chloromethylstyrene, allyl chloride, methallyl chloride, acrylate chloride, methacrylate chloride, etc.), reaction products of ethylenically unsaturated phenols (2-allylphenol, 2-propenylphenol, 4-allylphenol, 4-propenylphenol, eugenol, isoeugenol, etc.) and halogenated compounds (1,4-bis(chloromethyl)benzene, 4,4'-bis(chloromethyl)biphenyl, 4,4'-difluorobenzophenone, 4,4'-dichlorobenzophenone, 4,4'-dibromobenzophenone, cyanuryl chloride, etc.), reaction products of epoxy resins or alcohols and (meth)acrylic acids (acrylic acid, methacrylic acid, etc.), and acid-modified products thereof. Specific examples include, but are not limited to, BVPE (bisvinylphenylethane), compounds having a vinylbenzene structure as described in WO2021 / 100658, and KAYARAD R-684. Furthermore, these can be used individually or in combination.

[0076] [Polyamide resin] Examples of polyamide resins include reaction products of one or more of diamines, diisocyanates, or oxazolines with dicarboxylic acids, reaction products of diamines and acid chlorides, and ring-opening polymers of lactam compounds. These can be used individually or in combination. Specific examples of each of the above ingredients are given below, but this list is not exhaustive. <Diamine> Ethylenediamine, trimethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, heptamethylenediamine, octamethylenediamine, nonamethylenediamine, decanediamine, undecanediamine, dodecanediamine, tridecanediamine, tetradecanediamine, pentadecanediamine, hexadecanediamine, heptadecanediamine, octadecanediamine, nonadecanediamine, eicosanediamine, 2-methyl-1,5-diaminopentane, 2-methyl 1,8-diaminooctane, dimeramine, cyclohexanediamine, bis-(4-aminocyclohexyl)methane, bis(3-methyl-4-aminocyclohexyl)methane, xylylenediamine, norbornanediamine, isophoronediamine, bisaminomethyltricyclodecane, phenylenediamine, diethyltoluenediamine, naphthalenediamine, diaminodiphenylmethane, bis(4-amino-3,5-dimethylphenyl)methane, bis(4-amino-3,5-diethylphenyl)methane 4,4'-methylenebis-o-toluidine, 4,4'-methylenebis-o-ethylaniline, 4,4'-methylenebis-2-ethyl-6-methylaniline, 4,4'-methylenebis-2,6-diisopropylaniline, 4,4-ethylenedianiline, diaminodiphenylsulfone, diaminodiphenyl ether, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 4,4-bis(4-aminophenoxy)biphenyl, 2,2-bis[4-(4-amino [phenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 2,2-bis(4-aminophenyl)hexafluoropropane, 4,4'-(1,3-phenylenediisopropylidene)bisaniline, 4,4'-(1,4-phenylenediisopropylidene)bisaniline, 9,9-bis(4-aminophenyl)fluorene, 2,7-diaminofluorene, aminobenzylamine, diaminobenzophenone, etc. <Diisocyanate> Benzene diisocyanate, toluene diisocyanate, 1,3-bis(isocyanatomethyl)benzene, 1,3-bis(isocyanatomethyl)cyclohexane, bis(4-isocyanatophenyl)methane, isophorone diisocyanate, 1,3-bis(2-isocyanato-2-propyl)benzene, 2,2-bis(4-isocyanatophenyl)hexafluoropropane, dicyclohexylmethane-4,4'-diisocyanate, etc. <Dicarboxylic acid> Oxalic acid, malonic acid, succicic acid, glutaric acid, adipic acid, suberic acid, azelaic acid, sebacic acid, undecanediic acid, dodecanediic acid, terephthalic acid, isophthalic acid, 5-hydroxyisophthalic acid, 2-chloroterephthalic acid, 2-methylterephthalic acid, 5-methylisophthalic acid, 5-sodium sulfoisophthalic acid, hexahydroterephthalic acid, hexahydroisophthalic acid, cyclohexanedicarboxylic acid, biphenyldicarboxylic acid, naphthalenedicarboxylic acid, benzophenonedicarboxylic acid, francicarboxylic acid, 4,4'-dicarboxydiphenyl ether, 4,4'-dicarboxydiphenyl sulfide, etc. <Acid chlorides> Acetyl chloride, acrylate chloride, methacrylate chloride, malonyl chloride, succinate dichloride, diglycolyl chloride, glutarate dichloride, suberate dichloride, sebacate dichloride, adipic acid dichloride, dodecanediol dichloride, azera oil chloride, 2,5-franzicarbonyl dichloride, phthaloyl chloride, isophthaloyl chloride, terephthaloyl chloride, trimesinate chloride, bis(4-chlorocarbonylphenyl) ether, 4,4'-diphenyldicarbonyl chloride, 4,4'-azodibenzoyl dichloride, etc. <Lactam> ε-caprolactam, ω-undecanlactam, ω-laurolactam, etc.

[0077] [Polyimide resin] Examples of polyimide resins include, but are not limited to, the reaction products of the diamine and the tetracarboxylic dianhydride exemplified below. Furthermore, these may be used individually or in combination. A specific example is the polyimide compound obtained by the method described in WO2023013224A1. <Tetracarboxylic acid dianhydride> 4,4'-(hexafluoroisopropylidene)diphthalic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methylcyclohexene-1,2-dicarboxylic acid anhydride, pyromellitic dianhydride, 1,2,3,4-benzenetetracarboxylic acid dianhydride, 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride, 2,2',3,3'-benzophenonetetracarboxylic acid dianhydride, 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, 3,3',4,4'-diphenylsulfonetetracarboxylic acid dianhydride, 2,2',3 ,3'-biphenyltetracarboxylic acid dianhydride, methylene-4,4'-diphthalic acid dianhydride, 1,1-ethylidene-4,4'-diphthalic acid dianhydride, 2,2'-propyridene-4,4'-diphthalic acid dianhydride, 1,2-ethylene-4,4'-diphthalic acid dianhydride, 1,3-trimethylene-4,4'-diphthalic acid dianhydride, 1,4-tetramethylene-4,4'-diphthalic acid dianhydride, 1,5-pentamethylene-4,4'-diphthalic acid dianhydride, 4,4'-oxydiphthalic acid dianhydride, thio-4,4'-diphthalic acid dianhydride, sulfonyl-4,4'-diphthalic acid Acidic dianhydrides, 1,3-bis(3,4-dicarboxyphenyl)benzene dianhydride, 1,3-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,3-bis[2-(3,4-dicarboxyphenyl)-2-propyl]benzene dianhydride, 1,4-bis[2-(3,4-dicarboxyphenyl)-2-propyl]benzene dianhydride, bis[3-(3,4-dicarboxyphenoxy)phenyl]methane dianhydride, bis[4-(3,4-dicarboxyphenoxy)phenyl]meth Dianhydride, 2,2-bis[3-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, bis(3,4-dicarboxyphenoxy)dimethylsilane dianhydride, 1,3-bis(3,4-dicarboxyphenyl)-1,1,3,3-tetramethyldisiloxane dianhydride, 2,3,6,7-naphthalenetetracarboxylic acid dianhydride, 1,4,5,8-naphthalenetetracarboxylic acid dianhydride, 1,2,5,6-naphthalenetetracarboxylic acid dianhydride, 3,4,9,10-Perylenetetracarboxylic dianhydride, 2,3,6,7-Anthracenetetracarboxylic dianhydride, 1,2,7,8-Phenanthrenetetracarboxylic dianhydride, Ethylenetetracarboxylic dianhydride, 1,2,3,4-Butanetetracarboxylic dianhydride, 1,2,3,4-Cyclobutanetetracarboxylic dianhydride, Cyclopentanetetracarboxylic dianhydride, Cyclohexane-1,2,3,4-Tetocarboxylic dianhydride, Cyclohexane-1,2,4,5-Tetocarboxylic dianhydride Dianhydride of 3,3',4,4'-bicyclohexyltetracarboxylic acid dianhydride, carbonyl-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, methylene-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, 1,2-ethylene-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, 1,1-ethylidene-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, 2,2-propyridene- 4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, oxy-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, thio-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, sulfonyl-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, bicyclo[2,2,2]octo-7-ene-2,3,5,6-tetracarboxylic acid dianhydride, rel-[1S,5R,6R]-3-oxabicyclo[3,2 ,1] Octane-2,4-dione-6-spiro-3'-(tetrahydrofuran-2',5'-dione), 4-(2,5-dioxotetrahydrofuran-3-yl)-1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic acid anhydride, ethylene glycol-bis-(3,4-dicarboxylic acid anhydride phenyl) ether, 4,4'-biphenylbis(trimellitic acid monoester anhydride), 9,9'-bis(3,4-dicarboxyphenyl)fluorene dianhydride, etc.

[0078] [Allyl compounds] Examples of the allyl compounds mentioned above include monoallyl isocyanurate, diallyl isocyanurate, and triallyl isocyanurate. Specific examples include "TAIC" (manufactured by Mitsubishi Chemical Corporation), "MA-DGIC," and "DA-MGIC" (both manufactured by Shikoku Chemicals Corporation).

[0079] [Polybutadiene and its modified forms] Polybutadiene and its modified products are compounds that contain polybutadiene or a structure derived from polybutadiene within their molecule. The structure derived from polybutadiene may have some or all of its unsaturated bonds converted to single bonds by hydrogenation. Examples of polybutadiene and its modified products include, but are not limited to, polybutadiene, hydroxyl-terminated polybutadiene, terminally (meth)acrylated polybutadiene, carboxylic acid-terminated polybutadiene, amine-terminated polybutadiene, and styrene-butadiene rubber. These may be used individually or in combination. Of these, polybutadiene or styrene-butadiene rubber is preferred from the viewpoint of dielectric properties. Examples of styrene-butadiene rubber (SBR) include RICON-100, RICON-181, RICON-184 (all manufactured by Clay Valley Corporation), and 1,2-SBS (manufactured by Nippon Soda Co., Ltd.), while examples of polybutadiene include B-1000, B-2000, and B-3000 (all manufactured by Nippon Soda Co., Ltd.). The weight-average molecular weight of polybutadiene and styrene-butadiene rubber is preferably 500 to 10000, more preferably 750 to 7500, and even more preferably 1000 to 5000. Below the lower limit of the above range, the volatilization rate is high, making it difficult to adjust the solid content during prepreg preparation, and above the upper limit of the above range, compatibility with other curable resins deteriorates. Generally, in the case of compounds containing heteroatoms such as oxygen and nitrogen, such as bismaleimide and polymaleimide, it is difficult to ensure compatibility with low-polarity compounds such as compounds composed mainly of hydrocarbons or compounds composed only of hydrocarbons, due to their polarity. On the other hand, the compound of this embodiment does not have a framework design that actively incorporates heteroatoms such as oxygen and nitrogen, and therefore exhibits excellent compatibility with materials that have low polarity and low dielectric properties, as well as compounds composed only of hydrocarbons.

[0080] [Polystyrene and its modified forms] Polystyrene and its modified products are compounds that have polystyrene or a structure derived from polystyrene within their molecule. Examples of polystyrene and its modified products include polystyrene, styrene-2-isopropenyl-2-oxazoline copolymer (Epocross RPS-1005, RP-61, both manufactured by Nippon Shokubai Co., Ltd.), SEP (styrene-ethylene-propylene copolymer: Septon® 1020, manufactured by Kuraray Co., Ltd.), SEPS (styrene-ethylene-propylene-styrene copolymer: Septon 2002, Septon 2004F, Septon 2005, Septon 2006, Septon 2063, Septon 2104, all manufactured by Kuraray Co., Ltd.), and SEEPS (styrene-ethylene / ethylene-propylene-styrene block copolymer: Septon 4003, Septon 4044, Septon 4055, Septon 4077, Septon 4099). (All manufactured by Kuraray Co., Ltd.), SEBS (styrene-ethylene-butylene-styrene block copolymer: Septon 8004, Septon 8006, Septon 8007L, all manufactured by Kuraray Co., Ltd.), SEEPS-OH (compound having hydroxyl groups at the ends of styrene-ethylene / ethylene-propylene-styrene block copolymer: Septon HG252, manufactured by Kuraray Co., Ltd.), SIS (styrene-isoprene-styrene block copolymer: Septon 5125, Septon 5127, all manufactured by Kuraray Co., Ltd.), Hydrogenated SIS (hydrogenated styrene-isoprene-styrene block copolymer: Hybrar® 7125F, Hybrar 7311F) Examples include, but are not limited to, polystyrene-isobutylene-styrene block copolymers (all manufactured by Kuraray Co., Ltd.), SIBS (styrene-isobutylene-styrene block copolymer: SIBSTAR® 073T, SIBSTAR 102T, SIBSTAR 103T (all manufactured by Kaneka Corporation), Septon V9827 (manufactured by Kuraray Co., Ltd.)), etc. Furthermore, these may be used individually or in combination. Polystyrene and its modified products are preferable to have those without unsaturated bonds, as they have higher heat resistance and are less susceptible to oxidative degradation. In addition, there is no particular limit to the weight-average molecular weight of polystyrene and its modified products as long as it is 10,000 or more, but if it is too large, the compatibility with polyphenylene ether compounds, as well as low molecular weight components with a weight-average molecular weight of about 50 to 1,000 and oligomer components with a weight-average molecular weight of about 1,000 to 5,000 deteriorates, making it difficult to ensure mixing and solvent stability, so it is preferable that it be around 10,000 to 300,000.

[0081] [Polyethylene and its modified forms] Polyethylene and its modified products refer to polyethylene or compounds having a polyethylene-derived structure within their molecules. Examples of polyethylene and its modified products include, but are not limited to, ethylene-propylene copolymers, ethylene-styrene copolymers, ethylene-propylene-ethylidene norbornene copolymers (Mitsui Chemicals EBT: K-8370EM, K-9330M, etc.), ethylene-propylene-vinyl norbornene copolymers (Mitsui Chemicals VNB-EPT: PX-006M, PX-008M, PX-009M, etc.), ethylene-vinyl alcohol copolymers, and ethylene-vinyl acetate copolymers. From the viewpoint of improving heat resistance, it is preferable to use ethylene-propylene-ethylidene norbornene copolymers or ethylene-propylene-vinyl norbornene copolymers that contain a crosslinkable structure. Furthermore, these may be used individually or in combination of multiple types. While there are no particular restrictions on the weight-average molecular weight of polyethylene and its modified products as long as it is 10,000 or more, if it is too high, the compatibility with polyphenylene ether compounds, as well as low molecular weight components with a weight-average molecular weight of about 50 to 1,000 and oligomer components with a weight-average molecular weight of about 1,000 to 5,000 deteriorates, making it difficult to ensure mixing and solvent stability. Therefore, it is preferable that the molecular weight be around 10,000 to 300,000.

[0082] [Benzoxazine compounds] As the benzoxazine compound, any compound obtained by reacting a compound having a phenolic hydroxyl group, a compound having an amino group, or a compound having an aldehyde group may be used. The compound having a phenolic hydroxyl group is not particularly limited, but for example, the aforementioned phenolic resins, phenols (which may have substituents such as alkenyl groups or alkyl groups), and bisphenols can be used. The compound having an amino group is not particularly limited, but for example, the aforementioned amine resins, diamines, and anilines (which may have substituents such as alkenyl groups or alkyl groups) can be used. As the aldehyde compound, for example, the aforementioned aldehydes can be used, but formaldehyde is preferred. Commercially available benzoxazine compounds may be used, including benzoxazine Pd, Fa, ALP-d (all manufactured by Shikoku Chemicals Co., Ltd.), JBZ-BA100N, JBZ-FA100N, JBZ-DP100N, JBZ-OP100N, JBZ-OP100D, JBZ-OP100I (all manufactured by JFE Chemical Corporation), and BTBz (manufactured by Nippon Materials Technology Co., Ltd.).

[0083] [Flame retardant] The curable resin composition of this embodiment may contain a flame retardant. Examples of flame retardants include halogen-based flame retardants, inorganic flame retardants (antimony compounds, metal hydroxides, nitrogen compounds, boron compounds, etc.), and phosphorus-based flame retardants, but phosphorus-based flame retardants are preferred from the viewpoint of achieving halogen-free flame retardancy.

[0084] The phosphorus-based flame retardants mentioned above may be reactive or additive types. Specific examples include phosphorus esters such as trimethyl phosphate, triethyl phosphate, tricresyl phosphate, trixyllenyl phosphate, cresyl diphenyl phosphate, cresyl-2,6-dixyllenyl phosphate, 1,3-phenylenebis(dixyllenyl phosphate), 1,4-phenylenebis(dixyllenyl phosphate), and 4,4'-biphenyl(dixyllenyl phosphate); phosphanes such as 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 10(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide; phosphorus-containing epoxy compounds obtained by reacting epoxy resin with the active hydrogen of the aforementioned phosphanes; and red phosphorus, but are not limited to these. Furthermore, these may be used individually or in combination of multiple types. Among the above example substances, phosphate esters, phosphans, or phosphorus-containing epoxy compounds are preferred, and 1,3-phenylenebis(dixyllenyl phosphate), 1,4-phenylenebis(dixyllenyl phosphate), 4,4'-biphenyl(dixyllenyl phosphate), or phosphorus-containing epoxy compounds are particularly preferred.

[0085] The flame retardant content is preferably in the range of 0.1 to 0.6 parts by mass per 100 parts by mass of the curable resin composition. If the content is less than 0.1 parts by mass, the flame retardancy may be insufficient, and if it is more than 0.6 parts by mass, it may adversely affect the hygroscopicity and dielectric properties of the cured product.

[0086] [Polymerization initiator] The curable resin composition of this embodiment can also have its curability improved by adding a polymerization initiator. A polymerization initiator is a compound capable of polymerizing olefin functional groups such as ethylenically unsaturated bonds, and examples include olefin metathesis polymerization initiators, anionic polymerization initiators, cationic polymerization initiators, and radical polymerization initiators. Among these, it is preferable to use a radical polymerization initiator that has both curability and appropriate stability. A radical polymerization initiator is a compound that generates radicals upon irradiation with ultraviolet or visible light or heating, thereby initiating a chain polymerization reaction. Examples of radical polymerization initiators that can be used include organic peroxides, azo compounds, and benzopinacols, and it is preferable to use organic peroxides because they have less influence on curing temperature control, outgassing suppression, and the electrical properties of decomposition products.

[0087] Examples of the above organic peroxides include ketone peroxides such as methyl ethyl ketone peroxide and acetylacetone peroxide, diacyl peroxides such as benzoyl peroxide, dialkyl peroxides such as dicumyl peroxide (DCP) and 1,3-bis-(t-butylperoxyisopropyl)benzene, peroxyketals such as t-butyl peroxybenzoate and 1,1-di-t-butylperoxycyclohexane, α-cumyl peroxyneodecanoate, t-butyl peroxyneodecanoate, t-butyl peroxypivalate, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, and t-amyl peroxy-2-ethylhexanoate. Examples include alkyl peresters such as noates, t-butyl peroxy-2-ethylhexanoate, t-amyl peroxy-3,5,5-trimethylhexanoate, t-butyl peroxy-3,5,5-trimethylhexanoate, and t-amyl peroxybenzoate; peroxycarbonates such as di-2-ethylhexyl peroxydicarbonate, bis(4-t-butylcyclohexyl) peroxydicarbonate, t-butyl peroxyisopropyl carbonate, and 1,6-bis(t-butyl peroxycarbonyloxy)hexane; t-butyl hydroperoxide, cumene hydroperoxide, t-butyl peroxyoctoate, and lauroyl peroxide. Specific examples include Irgacure OXE-04 and Irgacure 290 (both manufactured by BASF), but are not limited to these. Furthermore, these can be used individually or in combination. Among the above organic peroxides, ketone peroxides, diacyl peroxides, hydroperoxides, dialkyl peroxides, peroxyketals, alkyl peresters, and peroxycarbonates are preferred, with dialkyl peroxides being more preferred.

[0088] Examples of the above-mentioned azo compounds include, but are not limited to, azobisisobutyronitrile, 4,4'-azobis(4-cyanovaleric acid), and 2,2'-azobis(2,4-dimethylvaleronitrile). Furthermore, these compounds may be used individually or in combination.

[0089] The amount of polymerization initiator added is preferably 0.01 to 5 parts by mass, and particularly preferably 0.01 to 3 parts by mass, per 100 parts by mass of the curable resin composition. If the amount of polymerization initiator used is less than 0.01 parts by mass, the molecular weight may not elongate sufficiently during the polymerization reaction, and if it is more than 5 parts by mass, dielectric properties such as dielectric constant and dielectric loss tangent may be impaired.

[0090] [Polymerization inhibitor] The curable resin composition of this embodiment may contain a polymerization inhibitor. Including a polymerization inhibitor improves storage stability and allows control of the reaction initiation temperature. Controlling the reaction initiation temperature makes it easier to ensure fluidity, prevents impregnation of glass cloth and the like, and facilitates B-stage processes such as prepreg formation. If the polymerization reaction proceeds too far during prepreg formation, problems such as difficulty in lamination during the lamination process are likely to occur.

[0091] The polymerization inhibitor may be added during the synthesis of the compound of this embodiment or after the synthesis. The amount of polymerization inhibitor used is 0.008 to 1 part by weight, preferably 0.01 to 0.5 parts by weight, per 100 parts by weight of the compound of this embodiment.

[0092] Examples of polymerization inhibitors include phenol-based, sulfur-based, phosphorus-based, hindered amine-based, nitroso-based, and nitroxyl radical-based agents. Furthermore, polymerization inhibitors may be used individually or in combination of multiple types. Of these, phenol-based, hindered amine-based, nitroso-based, and nitroxyl radical-based agents are preferred in this embodiment.

[0093] Examples of the above phenolic polymerization inhibitors include 2,6-di-t-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-t-butyl-p-ethylphenol, stearyl-β-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, isooctyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-triazine, and 2,4-bis[(octylthio)methyl]-o-c Monophenols such as resols, 2,2'-methylenebis(4-methyl-6-t-butylphenol), 2,2'-methylenebis(4-ethyl-6-t-butylphenol), 4,4'-thiobis(3-methyl-6-t-butylphenol), 4,4'-butylidenebis(3-methyl-6-t-butylphenol), triethylene glycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], 1,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate] [T], N,N'-Hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamamide), 2,2-thio-diethylenebis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 3,5-di-t-butyl-4-hydroxybenzylphosphonate-diethyl ester, 3,9-bis[1,1-dimethyl-2-{β-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy}ethyl]2,4,8,10-tetraoxaspiro[5,5]undecane, bis(3,5-di-t- Bisphenols such as calcium ethyl hydroxybenzylsulfonate, 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane, 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, tetrakis-[methylene-3-(3',5'-di-t-butyl-4'-hydroxyphenyl)propionate]methane, bis[3,3'-bis-(4'-hydroxy-3'-t-butylphenyl)butyric acid]glycol ester, tris-(3,Examples include, but are not limited to, high molecular weight phenols such as 5-di-t-butyl-4-hydroxybenzyl)-isocyanurate, 1,3,5-tris(3',5'-di-t-butyl-4'-hydroxybenzyl)-s-triazine-2,4,6-(1H,3H,5H)trione, and tocopherol.

[0094] Examples of sulfur-based polymerization inhibitors include, but are not limited to, dilauryl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, and distearyl-3,3'-thiodipropionate.

[0095] Examples of the phosphorus polymerization inhibitors mentioned above include triphenyl phosphite, diphenylisodecyl phosphite, phenyldiisodecyl phosphite, tris(nonylphenyl) phosphite, diisodecylpentaerythritol phosphite, tris(2,4-di-t-butylphenyl) phosphite, cyclic neopentanetetraylbis(octadecyl) phosphite, cyclic neopentanetetraylbis(2,4-di-t-butylphenyl) phosphite, cyclic neopentanetetraylbis(2,4-di-t-butyl-4-methylphenyl) phosphite, and bis[2- Examples include, but are not limited to, phosphites such as t-butyl-6-methyl-4-{2-(octadecyloxycarbonyl)ethyl}phenyl]hydrogen phosphite, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(3,5-di-t-butyl-4-hydroxybenzyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, and 10-decyloxy-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide.

[0096] Examples of the above hindered amine polymerization inhibitors include Adekastab (registered trademark) LA-40MP, Adekastab LA-40Si, Adekastab LA-402AF, Adekastab LA-87, Adekastab LA-82, Adekastab LA-81, Adekastab LA-77Y, Adekastab LA-77G, Adekastab LA-72, Adekastab LA-68, Adekastab LA-63P, Adekastab LA-57, Adekastab LA-52 (all from ADE Inc.) Examples include, but are not limited to, products such as KA, Chimassorb® 2020FDL, Chimassorb 944FDL, Chimassorb 944LD, Tinuvin® 622SF, Tinuvin PA144, Tinuvin 765, Tinuvin 770DF, Tinuvin XT55FB, Tinuvin 111FDL, Tinuvin 783FDL, and Tinuvin 791FB (all manufactured by BASF).

[0097] Examples of the nitroso polymerization inhibitors mentioned above include, but are not limited to, p-nitrosophenol, N-nitrosodiphenylamine, and ammonium salts of N-nitrosophenylhydroxyamine (cuperone). Of these, ammonium salts of N-nitrosophenylhydroxyamine (cuperone) are preferred.

[0098] Examples of the above-mentioned nitroxyl radical polymerization inhibitors include, but are not limited to, di-tert-butylnitroxide, 2,2,6,6-tetramethylpiperidine-1-oxyl, 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-oxo-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-amino-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-methoxy-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-acetoxy-2,2,6,6-tetramethylpiperidine-1-oxyl, and 4-benzoyloxy-2,2,6,6-tetramethylpiperidine-1-oxyl.

[0099] [Light stabilizer] The curable resin composition of this embodiment may also contain a light stabilizer. Suitable light stabilizers include hindered amine light stabilizers (HALS). Examples of HALS include the reaction product of dibutylamine·1,3,5-triazine·N,N'-bis(2,2,6,6-tetramethyl-4-piperidyl)-1,6-hexamethylenediamine and N-(2,2,6,6-tetramethyl-4-piperidyl)butylamine, dimethyl-1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine polycondensate, poly[{6-(1,1,3,3-tetramethylbutyl)amino-1,3,5-triazine-2,4-diyl}{(2,2,6,6-tetramethyl-4-piperidyl)imino}hexamethylene{(2,2,6,6-tetramethyl-4-piperidyl Examples include, but are not limited to, bis(1,2,2,6,6-pentamethyl-4-piperidyl)[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate, bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis(1-octyroxy-2,2,6,6-tetramethyl-4-piperidyl) sebacate, 2-(3,5-di-t-butyl-4-hydroxybenzyl)-2-n-butylmalonate bis(1,2,2,6,6-pentamethyl-4-piperidyl). Furthermore, these may be used individually or in combination.

[0100] The amount of light stabilizer is preferably in the range of 0.001 to 0.1 parts by mass per 100 parts by mass of the curable resin composition. If the amount is less than 0.001 parts by mass, it may be insufficient to exhibit the light stabilization effect, and if it is more than 0.1 parts by mass, it may adversely affect the hygroscopicity and dielectric properties of the cured product.

[0101] The curable resin composition of this embodiment is obtained by uniformly mixing the above components. The curable resin composition of this embodiment can be easily cured in the same manner as conventionally known methods. For example, the curable resin composition of this embodiment can be obtained by thoroughly mixing epoxy resin, a curing agent, and optionally a curing accelerator, inorganic filler, mold release agent, silane coupling agent, and additives until uniform using an extruder, kneader, roll, etc. as needed. This mixture can then be molded by a molten casting method, transfer molding method, injection molding method, compression molding method, etc., and a cured product can be obtained by further heating at 80 to 200°C for 2 to 10 hours.

[0102] Furthermore, the curable resin composition of this embodiment may contain a solvent as needed. The curable resin composition (epoxy resin varnish) containing a solvent can be impregnated into a fibrous material (substrate) such as glass fiber, carbon fiber, polyester fiber, polyamide fiber, alumina fiber, or paper, and the resulting prepreg is heat-dried to obtain a cured product of the curable resin composition of this embodiment by hot-press molding. The solvent content of this curable resin composition is typically 10 to 70% by mass, preferably about 15 to 70% by mass. Examples of solvents include γ-butyrolactones; amide solvents such as N-methylpyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, and N,N-dimethylimidazolidinone; sulfones such as tetramethylene sulfone; ether solvents such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, and propylene glycol monobutyl ether, preferably mono or di-lower (C1-C3) alkyl ethers of lower (C1-C3) alkylene glycols; ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, preferably di-lower (C1-C3) alkyl ketones in which the two alkyl groups may be the same or different; and aromatic solvents such as toluene and xylene. These may be used individually or as a mixture of two or more solvents.

[0103] Furthermore, a sheet-like adhesive can be obtained by applying the epoxy resin varnish onto a release film, removing the solvent under heating, and performing B-stage processing. This sheet-like adhesive can be used as an interlayer insulating layer in multilayer substrates and the like.

[0104] The cured product obtained in this embodiment can be used for various applications. Specifically, it can be used in general applications where thermosetting resins such as epoxy resins are used, such as adhesives, paints, coatings, molding materials (including sheets, films, FRP, etc.), insulating materials (including printed circuit boards, wire coatings, etc.), sealants, and as an additive to other resins.

[0105] Adhesives include those for civil engineering, construction, automotive, general office, and medical applications, as well as adhesives for electronic materials. Among these, adhesives for electronic materials include interlayer adhesives for multilayer substrates such as build-up substrates, die bonding agents, semiconductor adhesives such as underfills, underfills for BGA reinforcement, and adhesives for mounting such as anisotropic conductive films (ACF) and anisotropic conductive pastes (ACP).

[0106] Examples of encapsulants include potting, dipping, and transfer molding encapsulation for capacitors, transistors, diodes, light-emitting diodes, ICs, and LSIs; potting encapsulation for COB, COF, and TAB of ICs and LSIs; underfill for flip chips; and encapsulation during mounting of IC packages such as QFP, BGA, and CSP (including reinforcing underfill). [Examples]

[0107] Next, the present invention will be described in more detail with reference to examples. Hereinafter, unless otherwise specified, parts refer to parts by mass. However, the present invention is not limited to these examples.

[0108] The various analytical methods used in the examples are described below. • GPC (Gel Permeation Chromatography) Analysis Equipment: DGU-20A, LC-20AD, SIL-20A, RID-20A, SPD-M40, CTО-20A, CBM-20A Columns: SHODEX GPC KF-601 (2 pieces), KF-602, KF-602.5, KF-603 Flow rate: 1.5ml / min. Column temperature: 40℃ Solvent used: THF (tetrahydrofuran) Detector: RI (Differential Refraction Detector) • ICI viscosity (150°C): Measured according to the method compliant with JIS K-7117-2. • Softening point: Measured using a METTER TOLEDO FP90 softening point meter. • Epoxy equivalent: Measured according to the method in accordance with JIS K-7236.

[0109] [Example 1] In a flask equipped with a thermometer, condenser, and stirrer, 311.6 parts of 3-methyl-6-t-butylphenol, 0.4 parts of 4-methyl-2-t-butylphenol, 122 parts of salicylaldehyde, 217 parts of methanol, and 5 parts of methanesulfonic acid were added under nitrogen purging. The mixture was heated to 60°C and reacted for 13 hours. After cooling to room temperature, 4.4 parts of 48% sodium hydroxide aqueous solution were added to neutralize the mixture. The solvent was recovered under reduced pressure at 60°C to obtain a phenolic resin (P1) represented by the following formula (c-2) as a yellow powder. The GPC chart is shown in Figure 1 (number-average molecular weight Mn was 581, and weight-average molecular weight Mw was 601). The hydroxyl group equivalent calculated from the area % of the GPC was 144 g / eq. (Yield was 417 parts, containing 7 g of salt). The total peak area derived from the raw materials 3-methyl-6-t-butylphenol and 4-methyl-2-t-butylphenol was 0.5 area%, the peak area derived from the component where n=1 is represented by the following formula (c-2) was 91.6 area%, and the peak area derived from compounds with a higher molecular weight than n=1 of the compound represented by the following formula (c-2) was 7.9 area.

[0110] [ka]

[0111] [Example 2] In a flask equipped with a thermometer, condenser, and stirrer, 407 parts of the phenolic resin (P1) obtained in Example 1 were added under nitrogen purging. 1305 parts of epichlorohydrin, 386 parts of dimethyl sulfoxide, and 23 parts of water were added, and the internal temperature was raised to 45°C. 114 parts of sodium hydroxide were added in installments over 3 hours, and the mixture was reacted at 45°C for 1.5 hours and at 70°C for 0.5 hours. Under reduced pressure, the solvent and excess epichlorohydrin were removed by distillation, and 1280 parts of methyl isobutyl ketone were added. The organic layer was washed with 670 parts of water, and then 25.3 parts of 30 wt% sodium hydroxide aqueous solution, 26.9 parts of methanol, and 25 parts of water were added. The mixture was reacted at 75°C for 1 hour. The organic layer was washed with water until the wastewater was neutral, and the solvent in the resulting solution was removed under reduced pressure to obtain 525 parts of epoxy resin (E1) represented by the following formula (d-2) as a yellow solid. The epoxy equivalent was 216 g / eq., the ICI viscosity at 150°C was 0.04 Pa·s, and the softening point was 72.4°C. The GPC chart of the obtained epoxy resin (E1) is shown in Figure 2 (number-average molecular weight Mn was 593, and weight-average molecular weight Mw was 644). The total peak area derived from the reaction product of 3-methyl-6-t-butylphenol and epihalohydrin, and the reaction product of 4-methyl-2-t-butylphenol and epihalohydrin was 0.3 area%, the peak area derived from the component n=1 of the compound represented by the following formula (d-2) was 86.0 area%, and the peak area derived from a compound with a higher molecular weight than the compound represented by the following formula (d-2) was 13.7 area.

[0112] [ka]

[0113] [Example 3 and Comparative Example 1] The epoxy resin (E1) obtained in Example 2 and the epoxy resin represented by the following formula (e) (FAE-2500, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 216 g / eq., softening point 86°C, ICI viscosity at 150°C 0.29 Pa·s), phenol novolac resin (manufactured by Meiwa Kasei Co., Ltd., PN(H-1), softening point 85°C, hydroxyl group equivalent 104 g / eq.) as a curing agent, and triphenylphosphine (hereinafter also referred to as TPP) as a curing accelerator were used and blended in the proportions (parts by weight) shown in Table 1. The mixture was uniformly mixed and kneaded using a mixing roll, and after demolding, it was cured at 160°C for 2 hours and 180°C for 6 hours to obtain test pieces for evaluation.

[0114] [ka]

[0115] [Geltime] The time it took for the mixture to gel was measured on a hot plate heated to 175°C. [Heat resistance / Glass transition temperature (Tg)] The temperature at which tanδ is at its maximum value was measured using a dynamic viscoelasticity tester. Dynamic viscoelasticity measuring instrument: TA-instruments DMA-2980 Heating rate: 2°C / min [5% weight loss temperature] Using a TG / DTA6200 (manufactured by Hitachi High-Tech Science Corporation), measurements were taken from 30°C to 300°C with a nitrogen gas flow rate of 200 mL / min and a heating rate of 10°C / min. [Flexural modulus] Measurements were taken in accordance with JIS K-6911 at 30°C. [Water absorption rate] After measuring the initial mass of a disc-shaped test specimen measuring 5 cm in diameter and 4 mm in thickness, the specimen was immersed in 100°C water and held for 24 hours. The mass was then measured, and the water absorption rate was calculated using the following formula. Water absorption rate (%) = (Mass after 24 hours - Initial mass) / Mass after 24 hours

[0116] [Table 1]

[0117] The phenolic resin P1 and epoxy resin E1 of the present invention were confirmed to have low ICI viscosity and high fluidity. Furthermore, Example 3, which is a curable resin composition of the present invention, was confirmed to have excellent fluidity in terms of a long gel time and the ability to maintain low viscosity for a long time after melting. In addition, its cured product had a glass transition temperature of 200°C or higher, indicating good heat resistance, and was also confirmed to have excellent elastic modulus and low water absorption.

[0118] The epoxy resin of the present invention is suitably used in electrical and electronic components such as semiconductor encapsulants, printed circuit boards, build-up laminates, and optical waveguide devices.

Claims

1. An epoxy resin obtained by reacting a phenol resin with an epihalohydrin, The phenol resin is obtained by reacting a compound represented by the following formula (a) with a compound represented by the following formula (b), The phenolic resin has a content of 75 to 95 area percent of the compound represented by the following formula (c), as determined by differential refractive index detection in gel permeation chromatography. Epoxy resin. 【Chemistry 1】 (In formula (a), each of the multiple R groups exists independently and represents a hydrocarbon group with 1 to 5 carbon atoms. The sum of the carbon atoms of the multiple R groups is between 2 and 8. k is an integer between 1 and 4.) 【Chemistry 2】 (In formula (c), each of the multiple R groups exists independently and represents a hydrocarbon group having 1 to 5 carbon atoms. In each benzene ring substituted with R, the sum of the carbon atoms of the multiple R groups is between 2 and 8. k is an integer between 1 and 3.)

2. A curable resin composition containing the epoxy resin described in claim 1.

3. Furthermore, the curable resin composition according to claim 2, further comprising a curing agent and / or a curing accelerator.

4. The curable resin composition according to claim 2, further comprising at least one selected from a curing accelerator, polymerization initiator, epoxy resin, active ester compound, phenol resin, polyphenylene ether compound, amine resin, compound having an ethylenically unsaturated bond, isocyanate resin, polyamide resin, maleimide compound, cyanate ester resin, polyimide resin, polybutadiene and modified thereof, polystyrene and modified thereof, polyethylene and modified thereof, and benzoxazine compound.

5. A cured product obtained by curing the curable resin composition described in claim 2.

6. An epoxy resin having a compound content of 75 to 95 area percent, as determined by differential refractometer detection in gel permeation chromatography, represented by the following formula (d-1). 【Transformation 3】 (In formula (d-1), each of the multiple R groups exists independently and represents a hydrocarbon group with 1 to 5 carbon atoms. In each benzene ring substituted with R, the sum of the carbon atoms of the multiple R groups is between 2 and 8. k is an integer between 1 and 3. n is the average number of repeats, between 1 and 20.)

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