electronic machines

Abstract

To suppress the change of a flange back by a heat at a photographing while cancelling variation in an individual flange back.SOLUTION: An electronic apparatus includes: an imaging element unit containing an imaging element; a first support member that supports the imaging element unit; and an adjustment member that is provided between the imaging element unit and the first support member, and adjusts so that a flange back becomes a constant. The imaging element unit includes: an imaging element; a second support member that supports the imaging element; a third support member that is supported by the first support member; a shaft part that is fitted into a hole part of the second support member, and supports the second support member to the third support member; a bimetal member that is arranged between a tip end surface of the shaft part on the side where it is fitted into the hole part and a bottom surface of the hole part; and energization means of energizing the second support member to the third support member to a direction vertical to an imaging surface. The bimetal member suppresses the change of the flange back due to a temperature change by being deformed in accordance with a temperature.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an electronic device including an image pickup device, and more particularly to an electronic device including a position adjustment mechanism for the image pickup device.

Background Art

[0002] In recent years, with the increase in the number of pixels of the image pickup device used, high precision is required for the flange back distance and tilt. Here, the flange back is the distance from the mount surface of the image pickup device main body to the image pickup device where the lens barrel is mounted. During video shooting, due to the heat generated by the image pickup device, the housing of the image pickup device expands thermally or the unit including the image pickup device is deformed, so that the flange back changes.

[0003] For example, Patent Document 1 discloses an imaging device including means for storing the relationship between the temperature information around the image pickup device and the flange back of the imaging device. According to the imaging device of Patent Document 1, it is possible to adjust the flange back according to an arbitrary usage environment assumed by the user. On the other hand, Patent Document 2 discloses that a bimetal member is installed between a lens holding member and an image pickup device holding member in an image reading device that converts characters and graphic information on a document surface into an electric signal as image information. According to the image reading device of Patent Document 2, the change in the distance between the lens and the image pickup device due to the temperature change of the device is suppressed by utilizing the thermal deformation of the bimetal member.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the prior art disclosed in Patent Document 1 cannot suppress the change in flange back due to heat during imaging. Furthermore, in the prior art disclosed in Patent Document 2, a bimetallic member is installed between the lens holder and the image sensor holder, so it is necessary to adjust the height of the bimetallic member in the optical axis direction when initially adjusting the distance between the lens and the image sensor. Since the amount of thermal deformation of the bimetallic member varies depending on its shape and dimensions, there is a concern that the amount of correction will vary in individual imaging devices.

[0006] This invention was made in view of the above-mentioned problems, and aims to eliminate individual variations in flange back while suppressing changes in flange back due to heat during imaging. [Means for solving the problem]

[0007] To achieve the above objective, the electronic device of the present invention comprises: an image sensor unit including an image sensor; a first support member supporting the image sensor unit; an adjustment member provided between the image sensor unit and the first support member, which adjusts the imaging surface of the image sensor and the reference surface of the first support member to be parallel at a predetermined first distance; the image sensor unit comprises: the image sensor; a second support member supporting the image sensor; a third support member supported by the first support member; a shaft portion slidably fitted into a hole provided in the second support member in a direction perpendicular to the imaging surface and pivotally supporting the second support member with respect to the third support member; a temperature-deformable member disposed between the tip surface of the shaft portion fitted into the hole and the bottom surface of the hole, which deforms according to temperature; and a biasing means for biasing the second support member to the third support member in a direction perpendicular to the imaging surface; the temperature-deformable member suppresses the change in the first distance due to temperature changes by deforming according to temperature. Furthermore, the shaft portion has a contact portion that abuts against the second support member and limits the distance between the tip surface of the shaft portion and the bottom surface of the hole portion so that it does not become shorter than at least a predetermined second distance. do. [Effects of the Invention]

[0008] According to the present invention, it is possible to eliminate individual variations in flange back while suppressing changes in flange back due to heat during imaging. [Brief explanation of the drawing]

[0009] [Figure 1] A perspective view showing the external appearance of an imaging device according to an embodiment of the present invention. [Figure 2] An exploded perspective view showing the main parts of the imaging device according to the first embodiment. [Figure 3] An exploded perspective view of the image sensor unit according to the first embodiment, viewed from a different direction. [Figure 4] A perspective view and a cross-sectional view showing an example of the shape of a bimetallic member according to the first embodiment. [Figure 5] (a) is a front view of the base plate according to the first embodiment, and (b) is a rear view of the movable unit according to the first embodiment. [Figure 6A] A cross-sectional view of the fitting portion between the base plate and the movable frame according to the first embodiment. [Figure 6B] Another cross-sectional view of the joint portion between the base plate and the movable frame according to the first embodiment. [Figure 7] A schematic diagram showing a modified example of the bimetallic member according to the first embodiment, depending on the temperature. [Figure 8A] An exploded perspective view of the image sensor unit according to the second embodiment. [Figure 8B] An exploded perspective view of the image sensor unit according to the second embodiment, viewed from a different direction. [Figure 9] A cross-sectional view of the fitting portion between the base plate and the movable frame according to the second embodiment. [Figure 10] A cross-sectional view showing the load relationship of the connecting member according to the second embodiment, and a projection view showing the contact point between the bimetallic member and the connecting member, and the movable region of the sphere projected onto a plane perpendicular to the optical axis. [Figure 11] A cross-sectional view of the fitting portion between the base plate and the movable frame according to the third embodiment. [Modes for carrying out the invention]

[0010] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0011] Hereinafter, preferred embodiments of the present invention will be described in detail based on the accompanying drawings. In each embodiment, an example of an imaging device to which the holding structure of the imaging element according to the present invention is applied is shown.

[0012] <First Embodiment> FIG. 1 is a perspective view of an imaging device 10 (electronic device). Regarding the direction of the imaging device 10 , covered The subject side is defined as the front side, and the vertical direction, the front-rear direction, and the left-right direction are defined when viewed from a user facing the back of the imaging device 10. Therefore, FIG. 1(a) is a perspective view when the imaging device 10 is viewed from the front side, and FIG. 1(b) is a perspective view when the imaging device 10 is viewed from the back side. Note that in this embodiment, as an application example, a lens-exchangeable camera in which a lens device can be attached to a camera body is shown, but the present invention is applicable to various electronic devices having an imaging element.

[0013] The imaging device 10 includes an exterior portion 10b, and the exterior portion 10b is composed of a plurality of members. The imaging device 10 includes a mount 10a on the front side, and an interchangeable lens (lens device) not shown can be attached to the mount 10a. The axis passing through the center of the mount 10a substantially coincides with the optical axis P of the imaging optical system of the interchangeable lens, that is, the photographing optical axis.

[0014] FIG. 2 is an exploded perspective view of the main part of the imaging device 10 as seen from the rear side (the photographer's side). In FIG. 2, the illustration of the exterior part 10b and the like is omitted. Also, in the figures after FIG. 2, the parts necessary for the explanation of the present invention are illustrated, and the unnecessary parts are omitted. The imaging device 10 includes a control board 100, an imaging element unit 200, a shutter unit 300, and a base member 400. The base member 400 holds the mount 10a, the imaging element unit 200, and the shutter unit 300.

[0015] The imaging element unit 200 is configured to be able to adjust the distance between the imaging surface of the imaging element 230 shown in FIG. 3 described later and the mount 10a (hereinafter referred to as "flange back"), and the inclination of the imaging surface with respect to the base member 400. For example, the imaging element unit 200 is supported by the base member 400 by three screws 600a, 600b, 600c and three adjustment washers 500a, 500b, 500c (adjustment members). An operator performs an operation of adjusting the thickness of the adjustment washers 500a, 500b, 500c. Thereby, the flange back and the inclination of the imaging surface can be adjusted. When this adjustment operation is completed, the screws 600a, 600b, 600c are adhesively fixed to the fixing unit of the imaging element unit 200 in order to prevent their loosening. In the case of a camera that is not an interchangeable-lens camera, the flange back is the distance between the imaging surface of the imaging element 230 and a reference surface parallel to the imaging surface in the base member 400.

[0016] The control board 100 and the base member 400 are fixed to the exterior part 10b. A control IC 101 and a connector 102 used for controlling the imaging signal are mounted on the control board 100. Also, various electronic components (not shown), such as chip resistors, ceramic capacitors, inductors, and transistors, are mounted on the control board 100.

[0017] Next, the image sensor unit 200 will be described using Figure 3. Figure 3(a) is an exploded perspective view of the image sensor unit 200 as seen from the rear, and Figure 3(b) is an exploded perspective view of the image sensor unit 200 as seen from the front. The image sensor unit 200 has a movable unit 200a and a fixed unit 200b. The movable unit 200a is a movable member including the image sensor 230, and the fixed unit 200b is a support member fixed to the base member 400. The movable unit 200a is pivotally supported relative to the fixed unit 200b so that it can be displaced in the optical axis direction (the direction perpendicular to the imaging plane of the image sensor 230). Bimetallic members 261, 262, and 263 are arranged between the movable unit 200a and the fixed unit 200b, and define the position of the movable unit 200a in the optical axis direction (the position of the plane parallel to the imaging plane of the image sensor 230). Furthermore, the movable unit 200a is magnetically biased toward the fixed unit 200b in the optical axis direction by a magnetic attraction plate 224 (biasing member) located on the movable unit 200a and a magnetic member 254 (biasing member) located on the fixed unit 200b.

[0018] The main components of the fixed unit 200b are the base plate 250 and the magnetic member 254. 200a The main components are a movable frame 220, a magnetic attraction plate 224, and an image sensor substrate 232. An image sensor 230 is mounted on the image sensor substrate 232. The image sensor 230 is a CMOS (complementary metal-oxide-semiconductor) image sensor or a CCD (charge-coupled device) image sensor, etc., which converts the optical image of the subject into an electrical signal and outputs it. The image sensor substrate 232 on which the image sensor 230 is mounted is bonded and fixed to the movable frame 220. In the movable frame 220, an optical low-pass filter 231, which is an optical element to prevent the occurrence of color moiré and the like, is positioned in front of the image sensor 230.

[0019] When the image sensor 230 generates heat due to prolonged video recording, the base member 400 expands due to thermal expansion, potentially causing an increase in the flange back distance. Therefore, bimetallic members 261, 262, and 263, as shown in Figure 4(a), are provided between the movable unit 200a and the fixed unit 200b. By utilizing the thermal deformation of the bimetallic members 261, 262, and 263 to displace the optical axis position of the movable unit 200a in a direction that counteracts the change in flange back distance, the change in flange back distance due to the heat generated by the image sensor 230 can be suppressed. Since the amount of thermal deformation of the bimetallic members 261, 262, and 263 varies depending on their shape and dimensions, it is desirable to use bimetallic members of the same shape and dimensions for each imaging device. Although Figure 4(a) shows a bowl-shaped bimetallic member, examples of other bimetallic member shapes will be explained later. Furthermore, while described here as bimetallic members, any temperature-deformable member that deforms according to temperature may be used, even if it is not a bimetallic member.

[0020] Next, the configuration of the bimetallic member will be described in detail with reference to Figures 5, 6A, and 6B. Figure 5(a) is a front view of the base plate 250 (viewed from the mount 10a side), and Figure 5(b) is a rear view of the movable unit 200a. Figure 6A(a) is a cross-sectional view AA of the mating portion between the base plate 250 and the movable frame 220 of the image sensor unit 200 shown in Figure 5, and Figure 6A(b) is an enlarged view of area B in Figure 6A(a).

[0021] The movable frame 220 has holes 221, 222, and 223 that engage with shafts 251, 252, and 253 attached to the base plate 250, and is pivotally supported so as to be slidable in the optical axis direction. The bimetallic members 261, 262, and 263 are positioned between the shafts 251, 252, and 253 and the holes 221, 222, and 223, and the position of the movable frame 220 in the optical axis direction is defined by the bimetallic members 261, 262, and 263. Below, only the configuration of the engagement portion by the shafts 251, holes 221, and bimetallic member 261 will be described, but the configuration of the engagement portion by the shafts 252, 253, holes 222, 223, and bimetallic members 262, 263 is similar.

[0022] One end 261a of the bimetallic member 261 abuts against the bottom surface 221a of the hole 221 of the movable frame 220, and the other end 261b is on the shaft portion 251 of the base plate 250. destination It contacts the end face 251a. Furthermore, the outer peripheral portion 261c of the bimetallic member 261 is fitted so as to use the inner wall surface 221b of the hole 221 of the movable frame 220 as a guide. In addition, the bimetallic member 261 has a hole 261d centered on the center of gravity, and the hole 261d engages with a shaft portion 221c provided on the bottom surface 221a inside the hole 221 of the movable frame 220.

[0023] Alternatively, instead of the shaft portion 221c provided in the hole portion 221, a shaft portion 251b may be provided on the tip surface 251a of the shaft portion 251, as shown in Figure 6B(a), and fitted with the hole portion 261d of the bimetallic member 261.

[0024] By providing a guide or fitting configuration in this way, the optical axis of the bimetallic member 261 P This makes it possible to restrict misalignment in the in-plane direction perpendicular to the optical axis. As a result, even if the image sensor unit 200 is subjected to an impact such as a fall, misalignment of the contact between the bimetallic member 261 and the movable frame 220 can be prevented, and positional misalignment of the image sensor 230 in the optical axis direction can be suppressed.

[0025] The shaft portion 251 attached to the base plate 250 has a contact portion 251c having a thickness that contacts the bottom surface portion 222 of the movable frame 220 when the distance in the optical axis direction from the movable frame 220 is reduced by a certain value D. The value D is determined considering the machining tolerances of the shaft portion 251, the bimetallic member 261, and the movable frame 220, as well as the amount of deformation of the bimetallic member 261 due to the heat generated by the image sensor 230. When the image sensor unit 200 is subjected to an impact, such as by dropping, the bimetallic member 261 may deform excessively, and plastic deformation may occur, potentially changing the position of the image sensor 230 in the optical axis direction. Therefore, by providing the contact portion 251c, deformation of the bimetallic member 261 due to impact can be prevented, and the occurrence of the above-mentioned position change can be prevented. Furthermore, the location of the contact portion 251c is not limited to the shaft portion 251, but may also be provided on the base plate 250.

[0026] Figure 7 is a schematic diagram showing how the flange back change is suppressed by the aforementioned mating configuration. Figures 7(a) to (c) show cross-sectional views of the bimetallic member 261 when the temperature around the bimetallic member 261 is at room temperature, high temperature, and low temperature, respectively. Figures 7(b) and (c) also show the shape of the bimetallic member 261 at room temperature with a dashed line. As shown in Figure 7(b), at high temperatures, the bimetallic member 261 deforms in a direction that increases its height in the optical axis direction, and the movable frame 220 moves in a direction that shortens the flange back (towards the mount 10b). On the other hand, at low temperatures, the bimetallic member 261 deforms in a direction that decreases its height in the optical axis direction, and the movable frame 220 moves in a direction that lengthens the flange back (away from the mount 10b).

[0027] In other words, when the image sensor 230 generates heat, the shape of the bimetallic member 261 changes, causing the optical axis position of the movable frame 220 to move in a direction that shortens the flange back. At this time, the base member 400 expands in the optical axis direction due to thermal expansion, and the image sensor unit 200 moves in a direction that lengthens the flange back. Therefore, it becomes possible to correct the change in flange back caused by the heat generation of the image sensor 230.

[0028] Conversely, during imaging in cold environments such as cold regions, the shape of the bimetallic member 261 changes, causing the optical axis position of the movable frame 220 to move in a direction that extends the flange back. At this time, the base member 400 shortens in the optical axis direction, and the image sensor unit 200 moves in a direction that shortens the flange back. Therefore, it becomes possible to correct for changes in the flange back due to temperature decrease.

[0029] Next, examples of the shape of the bimetallic member 261 will be described. Figure 4(a) shows a bimetallic member 261 with a circular outer shape, and Figure 4(b) shows a bimetallic member 261 with a rectangular outer shape, where the part near the center is raised from the ends. Figures 4(a) and (b) show examples of shapes with height in the direction of the optical axis, but it may also be a flat plate without height.

[0030] On the other hand, in the case of the shapes shown in Figures 4(a) and (b), the ends 261b and 261c that come into contact with the shaft portion 251 and the hole portion 221, respectively, are edges. Therefore, during the deformation process, there is a risk that friction with the mating member will become excessive and hinder deformation. In light of the above concerns, the shapes shown in Figures 4(c) and (d) may also be used.

[0031] Figure 4(c) shows a shape having a curved portion 261e that contacts the tip surface 251a of the shaft portion 251, and a curved portion 261f that fits into the inner wall surface 221b of the movable frame 220. Figure 4(d) is a cross-sectional view taken along line X-X' in Figure 4(c). As shown in Figure 4(c), by making the contact portion 261e of the base plate 250 with the tip surface 251a of the shaft portion 251 a curved surface, friction with the mating member can be reduced during the deformation process. Therefore, even when a biasing force in the optical axis direction is applied by the magnetic attraction plate 224 and the magnetic member 254, a configuration is achieved that does not hinder the deformation of the bimetal member 261.

[0032] Furthermore, as shown in Figure 6B(b), multiple bimetallic members 261 (multiple temperature-deformable components) may be arranged. In this case, it is desirable that each bimetallic member 261 is stacked in an alternating pattern. By stacking them in an alternating pattern, an improvement in the overall springiness of the bimetallic members and an increase in the amount of temperature deformation can be expected. In other words, it becomes possible to improve the correction effect of flange back changes while preventing deformation of the bimetallic members due to impact from drops.

[0033] Furthermore, the stacked bimetallic members do not have to be the same shape. For example, of the two stacked bimetallic members, one bimetallic member that contacts the bottom surface 221a of the movable frame 220 may be a flat plate shape with no height in the optical axis direction, while the other bimetallic member that contacts the tip surface 251a of the shaft portion 251 may have a shape that has height in the optical axis direction. By making the bimetallic member closest to the heat source image sensor 230 a flat plate shape, the contact area can be increased and heat transfer can be improved.

[0034] Furthermore, as shown in Figure 6A(b), thermal grease may be filled into the space 221e (the space where the bimetallic member 261 is located) formed by the hole 221 of the movable frame 220 and the tip surface 251a of the shaft portion 251. This improves the heat transfer of heat generated by the image sensor 230 to the bimetallic member 261. As a result, the amount of deformation of the bimetallic member 261 in response to the heat generated by the image sensor 230 increases, and an improvement in the correction effect for changes in the flange back can be expected.

[0035] When applying the prior art disclosed in Patent Document 2, the only member that can adjust the flange back is the bimetallic member, so it is necessary to adjust the height of the bimetallic member in the optical axis direction during the initial flange back adjustment. On the other hand, in this embodiment, in addition to the bimetallic member, another flange back adjustment member (adjustment washers 500a, 500b, 500c) is provided, so the bimetallic member 261 during the initial adjustment of the flange back when assembling the imaging device 10 、Height adjustment of 262 and 263 becomes unnecessary. Therefore, it is possible to keep the flange back of each imaging device constant. Furthermore, according to this embodiment, since the bimetallic members 261, 262, and 263 can be installed near the image sensor, which is a heat source, the flange back correction effect can be obtained efficiently.

[0036] As described above, this embodiment makes it possible to eliminate individual variations in flange back during assembly while effectively suppressing changes in flange back due to heat during shooting.

[0037] <Second Embodiment> Next, a second embodiment of the present invention will be described. In the second embodiment, a case is described in which the image sensor unit 200 is equipped with an image blur correction mechanism that can be displaced in any direction in a plane perpendicular to the optical axis. Note that the components other than the image sensor unit 200 can be the same as those described in the first embodiment with reference to Figures 1 and 2, so their description is omitted here. First, the image sensor unit 200 in the second embodiment will be described with reference to Figures 8A and 8B. Note that components similar to those described in the first embodiment with reference to Figure 3 will be given the same reference numerals, and their descriptions will be omitted as appropriate.

[0038] Figure 8A is an exploded perspective view of the image sensor unit 200 as seen from the rear, and Figure 8B is an exploded perspective view of the image sensor unit 200 as seen from the front. The image sensor unit 200 has a movable unit 200a and a fixed unit 200b. The movable unit 200a is a movable member including the image sensor 230, and the fixed unit 200b is a support member fixed to the base member 400. The movable unit 200a is magnetically biased toward the fixed unit 200b in the optical axis direction by a magnetic attraction plate 224 located on the movable unit 200a and a magnetic member 254 located on the fixed unit 200b. The movable unit 200a is supported by the fixed unit 200b in a state that it can be displaced in any direction in a plane perpendicular to the optical axis P relative to the fixed unit 200b. By moving the movable unit 200a in a direction perpendicular to the optical axis P, optical image blur correction operation is realized.

[0039] The main components of the fixed unit 200b in the second embodiment are the front yoke 210, the base plate 250, the rear yokes 212a and 212b, and the magnetic member 254. The main components of the movable unit 200a in the second embodiment are the movable frame 220, the magnetic attraction plate 224, the image sensor substrate 232, and the flexible substrate 240. The flexible substrate 240 and the flexible substrate 290 connect the movable unit 200a to the control board 100. Both the flexible substrate 290 and the flexible substrate 240 are flexible printed circuit boards with flexibility.

[0040] The movable frame 220 has three openings 225a, 225b, and 225c. The flexible substrate 240 is equipped with three coils 241a, 241b, and 241c. The flexible substrate 240 is assembled to the movable frame 220 from the front and fixed with adhesive, and the coils 241a, 241b, and 241c are housed inside the openings 225a, 225b, and 225c, respectively.

[0041] The movable frame 220 includes bimetallic members 261, 262, 263 and connecting members 271, 272, 273. The movable frame 220 and the base plate 250 clamp the spheres 215a, 215b, and 215c via the bimetallic members 261, 262, 263 and connecting members 271, 272, 273. This allows the spheres 215a, 215b, and 215c to be supported so that they can roll. The position of the movable frame 220 in the optical axis direction is defined by the bimetallic members 261-263. When the temperature around the bimetallic members 261-263 changes, the bimetallic members 261-263 deform so that their height in the optical axis direction changes, as explained with reference to Figure 7. This deformation is used to realize a configuration that cancels out the flange back change due to the heat generated by the image sensor 230. The detailed configuration around the bimetallic members 261-263 will be described later.

[0042] As shown in Figures 8A and 8B, the front yoke 210 has support columns 211a, 211b, and 211c erected toward the base plate 250. One end of each support column 211a, 211b, and 211c is press-fitted into the base plate 250, and the front yoke 210 and the base plate 250 are joined by sandwiching the movable frame 220 between them.

[0043] The base plate 250 has openings 255a, 255b, and 255c formed at different positions when viewed from the direction of the optical axis P. Magnets 256a, 256b, and 256c are incorporated into the openings 255a, 255b, and 255c, respectively. When viewed from the direction of the optical axis P, the magnets 256a, 256b, and 256c are formed in approximately the same position and shape as the corresponding coils 241a, 241b, and 241c. Furthermore, the magnets 256a, 256b, and 256c are positioned so that their centers approximately coincide with the coils 241a, 241b, and 241c mounted on the corresponding flexible substrate 240. Hall elements are mounted inside the windings of each coil 241a, 241b, and 241c.

[0044] In this way, a magnetic field is formed by the magnets 256a, 256b, and 256c installed on the base plate 250, and the coils 241a, 241b, and 241c are placed in the magnetic field environment. The control unit controls the current in these coils to generate a Lorentz force in each coil, and using the Lorentz force as thrust, the movable frame 220 can be displaced in any direction in a plane perpendicular to the optical axis P. Hall elements are also mounted inside the coils 241a, 241b, and 241c, respectively, to detect changes in magnetic force due to the relative movement of the movable frame 220. Based on the detection signals from each Hall element, the relative displacement of the movable unit 200a with respect to the fixed unit 200b, that is, the displacement in any direction in a plane perpendicular to the optical axis P, can be detected.

[0045] The image blur directions in the imaging device 10 are the pitch direction, the yaw direction, and the roll direction. The pitch direction and the yaw direction are two directions around axes that are perpendicular to the optical axis P of the imaging optical system and are mutually orthogonal, while the roll direction is around an axis parallel to the optical axis P. When correcting image blur in the pitch direction, which is rotation around the left-right axis, the movable unit 200a moves translationally in the vertical direction. When correcting image blur in the yaw direction, which is rotation around the vertical axis, the movable unit 200a moves translationally in the left-right direction. When correcting image blur in the roll direction, which is rotation around the front-back axis, the movable unit 200a rotates around an axis parallel to the front-back axis.

[0046] Next, referring to Figure 9, the configuration of the interlocking portion made up of bimetallic members 261, 262, 263 and connecting members 271, 272, 273 will be described. In the following description, only the configuration of the interlocking portion made up of bimetallic member 261 and connecting member 271 will be explained, but the configuration of the interlocking portion made up of bimetallic members 262, 263 and connecting members 272, 273 is similar.

[0047] Figure 9 is a cross-sectional view of the fitting portion between the base plate 250 and the movable frame 220 of the image sensor unit 200. The connecting member 271 has a horizontal surface 271a that contacts the sphere 215a and is capable of rolling. The connecting member 271 also has an outer peripheral surface 271b that fits with the inner wall surface 221b of the hole 221 of the movable frame 220.

[0048] Next, the configuration of the restricting unit that limits the range in which the sphere 215a can roll will be described. A conventional image blur correction mechanism is known in which the restricting unit is provided on the movable frame 220. However, in this embodiment... In However, if the restricting portion is provided on the movable frame 220, the fitting length between the outer surface 271b of the connecting member 271 and the inner wall surface 221b of the movable frame 220 cannot be sufficiently secured. As a result, when the movable frame 220 moves in the in-plane direction perpendicular to the optical axis, the connecting member 271 tends to tilt with respect to the in-plane direction, raising concerns that the controllability during image blur correction may be impaired.

[0049] Alternatively, if the height of the connecting member 271 in the optical axis direction is increased to secure the fitting length, the height of the movable unit 200a in the optical axis direction will increase, which may lead to an increase in the size of the image sensor unit 200.

[0050] Therefore, in this embodiment, the connecting member 271 has a shape that includes an inner wall surface 271c that restricts the range in which the sphere 215a can roll. By providing the restricting portion to the connecting member 271, the fitting length between the connecting member 271 and the movable frame 220 can be secured, and the inclination of the connecting member 271 with respect to the in-plane direction can be suppressed.

[0051] On the other hand, the bimetallic member 261 is positioned between the connecting member 271 and the movable frame 220, defining the position of the movable frame 220 in the optical axis direction. One end 261a of the bimetallic member 261 abuts against the bottom surface 221a of the hole 221 of the movable frame 220, and the other end 261b abuts against the front surface 271d of the connecting member 271. Furthermore, the outer peripheral portion 261c of the bimetallic member 261 is fitted so as to use the inner wall surface 221b of the movable frame 220 as a guide. Therefore, during image stabilization, the bimetallic member 261 and connectionMember 271, integrated with the movable frame 220, is displaceable in the in-plane direction. Furthermore, the shape of the bimetallic member changes in response to temperature changes in the image sensor unit 200, and the position of the movable unit 200a in the optical axis direction is adjusted accordingly. In other words, it becomes possible to cancel out the change in flange back due to the heat generated by the image sensor 230.

[0052] Next, the detailed configuration of the connecting member 271 and the bimetallic member 261 will be described. The connecting member 271 has a contact portion 271f (the first contact portion described in claim 10) that contacts the bottom surface portion 222 of the movable frame 220 when the distance in the optical axis direction from the movable frame 220 is reduced by a certain value D. The value D is determined considering the processing tolerances of the connecting member 271, the bimetallic member 261, and the movable frame 220, as well as the amount of deformation of the bimetallic member 261 due to the heat generated by the image sensor 230. When the image sensor unit 200 is subjected to an impact such as a fall, the bimetallic member 261 may deform excessively, and plastic deformation may occur, potentially changing the position of the image sensor 230 in the optical axis direction. By providing the contact portion 271f, deformation of the bimetallic member 261 due to impact can be prevented, thereby preventing the occurrence of the above concern. Furthermore, the location of the contact portion 271f is not limited to the connecting member 271, but may also be provided on the base plate 250.

[0053] The bimetallic member 261 has a hole 261d centered on the center of gravity, and the hole 261d fits with a shaft portion 221c provided on the bottom surface 221a within the hole 221 of the movable frame 220.

[0054] Alternatively, as shown in Figure 9(b), the shaft portion 271g provided on the tip surface 271d of the connecting member 271 may be configured to fit with the hole portion 261d of the bimetallic member 261. By providing such a fitting configuration, it is possible to restrict the in-plane displacement of the bimetallic material 261. Therefore, even if the image sensor unit 200 is subjected to an impact such as a fall, it is possible to prevent misalignment of the contact point between the bimetallic member 261 and the movable frame 220, and to suppress positional displacement of the image sensor 230 in the optical axis direction.

[0055] Next, the shape of the bimetallic member 261 will be described. The shape of the bimetallic member 261 may be the same as the shape shown in Figure 6A in the first embodiment. Alternatively, as shown in Figure 6B(b), multiple bimetallic members 261 may be arranged. However, it is desirable that the contact point C between the end portion 261b of the bimetallic member 261 and the tip surface 271d of the connecting member 271 satisfies the following conditions on the projection plane in the direction of the optical axis.

[0056] Condition 1: The contact point C is located outside the movable range S1 of the sphere 215a. Condition 2: The region S2 formed by connecting the contact points C encloses the movable region S1 of the sphere 215a.

[0057] Figure 10(a) is a cross-sectional view showing the load relationship on the connecting member 271. The circles indicated by the dashed lines in the figure show the state in which the sphere 215a is in contact with the inner wall surface 271c of the connecting member 271. d Figure 10(a) and ( d This indicates the case where the shape and arrangement of the bimetallic member 261 satisfy both conditions 1 and 2 described above.

[0058] On the other hand, Figure 10 ( b ) and ( e ) shows the case where neither condition 1 nor condition 2 is met. Also, Figure 10( c (f) and (f) show cases where condition 1 is met but condition 2 is not. Figure 10 b ) and ( e In the case of the shape and arrangement of the bimetallic member 261 shown in Figure 10, the connecting member 271 receives a moment in a direction that causes it to tilt relative to the movable frame 220. Therefore, there is a concern that the controllability during image blur correction will be impaired. cIn the case of the bimetallic member 261 shape and arrangement shown in (f) and (a), when the sphere 215a moves outside the region S2 connecting the contact points C, the connecting member 271 receives a moment in a direction that causes it to tilt with respect to the movable frame 220. Therefore, by configuring the contact point C between the end portion 261b of the bimetallic member 261 and the front end surface 271d of the connecting member 271 to satisfy the above two conditions, it is possible to suppress the tilt of the connecting member 271 and prevent loss of controllability during image blur correction.

[0059] In the configuration shown in Figure 9(b), the contact point C in condition 1 is the contact point between the end portion 261b of the bimetallic member 261 and the bottom surface 221a of the hole 221 of the movable frame 220.

[0060] Furthermore, in the space 221e (the space where the bimetallic member 261 is placed) formed by the hole 221 of the movable frame 220 and the tip surface 271d of the connecting member 271 shown in Figure 9, thermal grease is applied. of It may also be filled. This improves the heat transfer of heat generated by the image sensor 230 to the bimetallic member 261. Therefore, the amount of deformation of the bimetallic member 261 in response to the heat generated by the image sensor 230 increases, and an improvement in the correction effect of flange back change can be expected.

[0061] As described above, according to the second embodiment, in addition to the same effects as the first embodiment, it is possible to displace the movable unit in a plane perpendicular to the optical axis without impairing the effect of correcting the flange back change.

[0062] <Third Embodiment> Next, a third embodiment of the present invention will be described. In the third embodiment, an example in which a rail shape is added to the connecting member 271 will be described. Note that the same reference numerals will be used for configurations similar to those in the first and second embodiments, and their descriptions will be omitted as appropriate.

[0063] Figure 11(a) is a cross-sectional view of the joint between the base plate 250 and the movable frame 220 of the image sensor unit 200, and Figure 11(b) is a cross-sectional view of the E-E' section of Figure 11(a). A rail portion 271h (protrusion) extends in the optical axis direction from the outer peripheral surface 271b of the connecting member 271. On the other hand, a recess 221d is provided on the inner wall surface 221b of the movable frame 220, which extends in the optical axis direction and into which the rail portion 271h is inserted. It is desirable that the rail portion 271h and the recess 221d be provided in at least three locations to suppress the tilt of the connecting member 271 relative to the movable frame 220. With this configuration, it is possible to provide an imaging device that suppresses flange back changes due to heat generation of the image sensor without impairing controllability during image blur correction.

[0064] In the example shown in Figure 11, the outer circumferential surface 271b of the connecting member 271 has a convex-shaped rail portion 271h, and the inner wall surface 221b of the movable frame 220 has a recess that fits into the rail portion 271h. 221d Although the present invention has been described in the case where such a feature is provided, the present invention is not limited thereto. For example, a convex-shaped rail portion may be provided on the inner wall surface 221b of the movable frame 220, and a recess for insertion into the rail portion may be provided on the outer circumferential surface 271b of the connecting member 271.

[0065] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0066] 10: Imaging device, 200: Image sensor unit, 215a~215c: Sphere, 220: Movable frame, 224: Magnetic attraction plate, 250: Base plate, 251~253: Shaft, 254: Magnetic member, 261~263: Bimetallic member, 271~273: Connecting member, 400: Base member, 500a~500c: Adjustment washer

Claims

1. Image sensor unit including image sensor, A first support member that supports the image sensor unit, The device includes an adjustment member provided between the image sensor unit and the first support member, which adjusts the imaging surface of the image sensor and the reference surface of the first support member to be parallel at a predetermined first distance, The aforementioned image sensor unit is The aforementioned imaging sensor, A second support member that supports the image sensor, A third support member supported by the first support member, A shaft portion is fitted into a hole provided in the second support member so as to be slidable in a direction perpendicular to the imaging surface, and pivotally supports the second support member with respect to the third support member, A temperature-deformable member is positioned between the tip surface of the shaft portion fitted into the hole and the bottom surface of the hole, and deforms according to temperature. The device includes a biasing means for biasing the second support member to the third support member in a direction perpendicular to the imaging surface, The temperature-deformable member deforms in accordance with temperature, thereby suppressing the change in the first distance due to temperature changes. The electronic device is characterized in that the shaft portion has a contact portion that abuts against the second support member to limit the distance between the tip surface of the shaft portion and the bottom surface of the hole portion so that it does not become shorter than at least a predetermined second distance.

2. The electronic device according to claim 1, characterized in that the shaft portion has a portion that fits into the hole and a portion that fits into a hole provided in the third support member to fix the third support member.

3. Image sensor unit including image sensor, A first support member that supports the image sensor unit, The device includes an adjustment member provided between the image sensor unit and the first support member, which adjusts the imaging surface of the image sensor and the reference surface of the first support member to be parallel at a predetermined first distance, The aforementioned image sensor unit is The aforementioned imaging sensor, A second support member that supports the image sensor, A third support member supported by the first support member, A sphere and, A connecting member that is slidably fitted into a hole provided in the second support member in a direction perpendicular to the imaging surface, and has a recess for rotatably sandwiching the sphere between itself and the third support member, A temperature-deformable member is positioned between the tip surface of the connecting member fitted into the hole and the bottom surface of the hole, and deforms according to temperature. The device includes a biasing means for biasing the second support member to the third support member in a direction perpendicular to the imaging surface, The electronic device is characterized in that the temperature-deformable member deforms in accordance with temperature, thereby suppressing the change in the first distance due to temperature changes.

4. The electronic device according to claim 3, characterized in that, when viewed from a direction perpendicular to the imaging surface, the portion of the end of the temperature-deformable member that abuts the tip surface is outside the movable region of the sphere, and the region connecting the portions of the end of the temperature-deformable member that abut the tip surface encloses the movable region of the sphere.

5. The electronic device according to claim 3, characterized in that the connecting member has a plurality of protrusions on its outer circumferential surface that extend in a direction perpendicular to the imaging surface, and the hole has a plurality of recesses into which each of the plurality of protrusions is inserted.

6. The electronic device according to claim 3, characterized in that the hole portion has a plurality of protrusions extending in a direction perpendicular to the imaging surface, and the connecting member has a plurality of recesses on its outer circumferential surface that are respectively inserted into the plurality of protrusions.

7. The electronic device according to any one of claims 3 to 6, characterized in that the connecting member has a contact portion that abuts against the second support member and limits the distance between the tip surface of the connecting member and the bottom surface of the hole so that the distance between them does not become shorter than at least a predetermined second distance.

8. The electronic device according to any one of claims 3 to 7, characterized in that the second support member and the third support member are provided with displacement means for displacing the second support member in a plane parallel to the imaging surface.

9. The temperature-deformable member has a hole centered on the center of gravity, The hole has a protrusion on its bottom surface that engages with the hole. The electronic device according to any one of claims 1 to 8.

10. The temperature-deformable member has a hole centered on the center of gravity, The shaft portion has a protrusion on its tip surface that engages with the hole. The electronic device according to claim 1 or 2.

11. The temperature-deformable member has a hole centered on the center of gravity, The connecting member has a protrusion on its tip surface that engages with the hole. The electronic device according to any one of claims 3 to 8.

12. The electronic device according to any one of claims 1 to 11, characterized in that the temperature-deformable member has a shape in which the portion near the center is raised from the end.

13. The electronic device according to any one of claims 1 to 12, characterized in that the temperature-deformable member has a curved shape at its end.

14. The electronic device according to any one of claims 1 to 11, characterized in that the temperature-deformable member has a flat plate shape.

15. The electronic device according to any one of claims 1 to 14, characterized in that the temperature-deformable member is formed by combining a plurality of temperature-deformable components.

16. The electronic device according to any one of claims 1 to 15, characterized in that the temperature-deformable member is made of a bimetal.

17. The adjusting member is a washer, The electronic device according to any one of claims 1 to 16, characterized in that the image sensor unit is attached to the first support member via a washer using screws.

18. The electronic device according to any one of claims 1 to 17, characterized in that the space in which the temperature-deformable member is located is filled with thermal grease.

Images