Method for manufacturing bound solids

Abstract

To provide a method for producing a cohesive solid that is capable of easily bonding a metal solid to a solid.SOLUTION: This method for producing a cohesive solid comprises: disposing a metal powder on a solid; covering at least a portion of the periphery of the metal powder with a high-melting-point material having a melting point higher than the melting point of the metal powder; and heating the metal powder, in which at least a portion of the periphery thereof is covered by a high-melting-point material, by irradiation with microwaves, thereby sintering or melt-solidifying the metal powder in order to form a metal solid on the solid.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This invention relates to a method for producing a bound solid. [Background technology]

[0002] Traditionally, solid metal parts used in daily necessities, home appliances, and machine tools have been manufactured by processing ingots or metal billets. The process of processing ingots and metal billets involves various steps and is complex. Furthermore, the process of processing ingots and metal billets may involve multiple processing companies. As a result, the process of processing ingots and metal billets may include transportation by logistics. Consequently, the process of processing ingots and metal billets is costly. Moreover, if one step in the process of processing ingots and metal billets is delayed, all downstream steps may be delayed. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2012-158790 [Patent Document 2] Japanese Patent Publication No. 2017-145151 [Patent Document 3] Japanese Patent Publication No. 2009-035776 [Patent Document 4] Japanese Patent Publication No. 2013-216943 [Patent Document 5] Japanese Patent Publication No. 2017-145151 [Overview of the project] [Problems that the invention aims to solve]

[0004] One objective of the present invention is to provide a method for manufacturing a metallic solid that can be easily produced. Another objective of the present invention is to provide a method for manufacturing a bonded solid that can be easily bonded to a solid, and a method for manufacturing a bonded solid that can be easily connected to other solids. [Means for solving the problem]

[0005] According to an aspect of the present invention, a method for producing a solid metal is provided, which includes covering at least a portion of the metal powder with a high-melting-point material that has a melting point higher than the melting point of the metal powder, and heating the metal powder, which is covered at least a portion of the surrounding area with the high-melting-point material, by irradiating it with microwaves, thereby sintering or melting and solidifying the metal powder.

[0006] In the above-described method for producing a solid metal, the steps of covering at least a portion of the metal powder with a high-melting-point material and sintering or melting and solidifying the metal powder may be repeated.

[0007] In the above-described method for manufacturing a metallic solid, a stacked metallic solid may be formed.

[0008] In the above-described method for producing a solid metal, the high-melting-point material may include an insulating material that absorbs microwaves to a lower degree than the metal powder.

[0009] In the above-described method for producing a solid metal, the high-melting-point material may include an absorbing material that absorbs microwaves at a temperature range at least partially lower than the temperature range in which the metal powder absorbs microwaves.

[0010] In the above-described method for producing a solid metal, the high-melting-point material may include a heat insulating material that absorbs microwaves to a lower degree than the metal powder, and a heat absorbing material that absorbs microwaves at a temperature range at least partially lower than the temperature range in which the metal powder absorbs microwaves.

[0011] In the above-described method for producing a solid metal, the high-melting-point material may contain 1% to 70% by mass of an absorbent material.

[0012] In the above-described method for producing a solid metal, the heat insulating material may contain an oxide.

[0013] In the method for producing the above metal solid, the heat insulating material may contain at least one selected from the group consisting of aluminum oxide, silicon oxide, magnesium oxide, zirconium oxide, and titanium oxide.

[0014] In the method for producing the above metal solid, the absorption material may contain a carbon material.

[0015] In the method for producing the above metal solid, the absorption material may contain at least one selected from the group consisting of carbon, graphite, silicon carbide, carbon resin, and metal carbide.

[0016] In the method for producing the above metal solid, the metal powder may contain a metal.

[0017] In the method for producing the above metal solid, the metal powder may contain at least one selected from the group consisting of iron, nickel, copper, gold, silver, aluminum, and cobalt.

[0018] In the method for producing the above metal solid, the metal powder may contain a metal compound.

[0019] In the method for producing the above metal solid, the metal powder may contain at least one compound selected from the group consisting of iron, nickel, copper, gold, silver, aluminum, and cobalt.

[0020] In the method for producing the above metal solid, the metal powder may further contain an alloy component.

[0021] In the method for producing the above metal solid, the alloy component may contain at least one selected from the group consisting of silicon, manganese, chromium, nickel, carbon, boron, copper, aluminum, titanium, niobium, vanadium, zinc, and sulfur.

[0022] In the method for producing the above metal solid, the average particle diameter of the metal powder may be 200 μm or less.

[0023] In the above-described method for producing a solid metal, the metal powder may contain a metal oxide, and the metal powder may be reduced when irradiated with microwaves.

[0024] In the above-described method for producing a solid metal, the metal powder may contain a metal oxide, and the metal powder may be sintered when microwaves are irradiated onto it.

[0025] In the above-described method for producing a solid metal, a high-melting-point material may form the mold or container.

[0026] In the above-described method for producing a solid metal, the metal powder may be in the form of a compacted powder.

[0027] The above method for producing a solid metal may further include applying pressure to the metal powder before irradiating it with microwaves.

[0028] In the above-described method for manufacturing a solid metal, the pressure may be between 0.1 MPa and 2000 MPa.

[0029] The above method for producing a solid metal may further include applying pressure to the metal powder while irradiating it with microwaves.

[0030] In the above-described method for manufacturing a solid metal, the pressure may be between 0.1 MPa and 2000 MPa.

[0031] The above method for producing a solid metal may further include applying pressure to the metal powder after irradiating it with microwaves.

[0032] In the above-described method for manufacturing a solid metal, the pressure may be between 0.1 MPa and 2000 MPa.

[0033] In the above-described method for producing a solid metal, the irradiation of the metal powder with microwaves may be carried out under an inert gas atmosphere.

[0034] In the above-described method for producing a solid metal, the irradiation of the metal powder with microwaves may be carried out under a reducing atmosphere.

[0035] In the above-described method for producing a solid metal, the metal powder may further include a reduction of the metal oxide before irradiating the metal powder with microwaves.

[0036] In the above-described method for producing a solid metal, covering at least a portion of the metal powder with a high-melting-point material whose melting point is higher than that of the metal powder may include forming a layer of the high-melting-point material, forming a recess in the layer of the high-melting-point material, and filling the recess with metal powder.

[0037] In the above-described method for producing a solid metal, forming a recess in the layer of the high-melting-point material may include hardening a portion of the layer of the high-melting-point material and removing the unhardened portion of the layer of the high-melting-point material.

[0038] In the above-described method for producing a solid metal, hardening a portion of the layer of the high-melting-point material may include including a hardenable material in a portion of the layer of the high-melting-point material.

[0039] In the above-described method for producing a solid metal, a curable material may be impregnated into a portion of the layer of the high-melting-point material.

[0040] In the above-described method for manufacturing a solid metal, a portion of the layer of the high-melting-point material may be hardened by light irradiation.

[0041] Furthermore, according to an aspect of the present invention, there is a metal solid manufacturing apparatus comprising: a stage for arranging metal powder and a high-melting-point material having a melting point higher than the melting point of the metal powder, covering at least a portion of the metal powder; and a microwave irradiation unit for heating the metal powder, which is covered at least a portion of the metal powder with the high-melting-point material, by irradiating it with microwaves, and for sintering or melting and solidifying the metal powder.

[0042] The above-described metal solid manufacturing apparatus may further include a high-melting-point material placement section for placing high-melting-point materials on a stage.

[0043] In the above-described apparatus for manufacturing solid metals, the high-melting-point material placement section may apply the high-melting-point material onto the stage.

[0044] In the above-described apparatus for manufacturing solid metals, the high-melting-point material placement section may stack layers of high-melting-point material on a stage.

[0045] The above-described apparatus for manufacturing solid metals may further include a curable material addition section for adding a curable material to at least a portion of the high-melting-point material.

[0046] The above-described apparatus for manufacturing a solid metal may further include a curing apparatus for curing at least a portion of the high-melting-point material.

[0047] The above-described metal solid manufacturing apparatus may further include an uncured material removal unit for removing uncured high-melting-point material.

[0048] The above-described metal solid manufacturing apparatus may further include a metal powder placement section for placing metal powder on a stage.

[0049] In the above-described apparatus for manufacturing solid metals, the metal powder placement section may coat the metal powder onto the stage.

[0050] In the above-described apparatus for manufacturing solid metals, the metal powder placement section may place the metal powder in the recess of the high-melting-point material.

[0051] The above-described metal solid manufacturing apparatus may further include a pressurizing unit for applying pressure to the metal powder placed on the stage.

[0052] In the above-described apparatus for manufacturing solid metals, the pressurizing unit may apply pressure to the metal powder before the microwave irradiation unit irradiates the metal powder with microwaves.

[0053] In the above-described apparatus for manufacturing solid metals, the pressurizing unit may apply pressure to the metal powder while the microwave irradiation unit is irradiating the metal powder with microwaves.

[0054] In the above-described apparatus for manufacturing solid metals, the pressurizing unit may apply pressure to the metal powder after the microwave irradiation unit has irradiated the metal powder with microwaves.

[0055] The above-described metal solid manufacturing apparatus may further include an inert gas supply unit for supplying an inert gas to the metal powder.

[0056] The above-described metal solid manufacturing apparatus may further include a reducing gas supply unit for supplying a reducing gas to the metal powder.

[0057] The above-described metal solid manufacturing apparatus further comprises a high-melting-point material placement section for placing a high-melting-point material on a stage, and a metal powder placement section for placing metal powder on a stage, wherein (1) the high-melting-point material placement section and the metal powder placement section place metal powder surrounded by the high-melting-point material on the stage, and (2) a microwave irradiation section sintersects or melts and solidifies the metal powder. The metal solid manufacturing apparatus may repeat the combination of (1) and (2).

[0058] In the above-described apparatus for manufacturing solid metals, the metal powder may contain a metal oxide, and the apparatus may further include a reduction device that reduces the metal oxide before the microwave irradiation unit irradiates the metal powder with microwaves.

[0059] According to an aspect of the present invention, a method for producing a bonded solid is provided, which includes: arranging metal powder on a solid; covering at least a portion of the metal powder with a high-melting-point material that has a melting point higher than the melting point of the metal powder; and irradiating the metal powder, which is covered at least a portion of the surrounding area with the high-melting-point material, with microwaves to heat the metal powder, thereby sintering or melting and solidifying the metal powder to form a metal solid on the solid.

[0060] The above-described method for producing a bonded solid may further include: placing metal powder on a metal solid; covering at least a portion of the metal powder on the metal solid with a high-melting-point material; and irradiating the metal powder on the metal solid, which is covered at least a portion of the surrounding area with the high-melting-point material, with microwaves to heat the metal powder, thereby sintering or melting and solidifying the metal powder to form an additional metal solid on the metal solid.

[0061] In the above-described method for producing a bonded solid, stacked metal solids may be formed.

[0062] In the above-described method for producing a bonded solid, the high-melting-point material may include an insulating material that absorbs microwaves to a lower degree than the metal powder.

[0063] In the above-described method for producing a bonded solid, the high-melting-point material may include an absorbing material that absorbs microwaves at a temperature range at least partially lower than the temperature range in which the metal powder absorbs microwaves.

[0064] In the above-described method for producing a bonded solid, the high-melting-point material may include a heat insulating material that absorbs microwaves to a lower degree than the metal powder, and a heat-absorbing material that absorbs microwaves at a temperature range at least partially lower than the temperature range in which the metal powder absorbs microwaves.

[0065] In the above-described method for producing a bonded solid, the high-melting-point material may contain 1% to 70% by mass of an absorbent material.

[0066] In the above-described method for producing a bonded solid, the heat insulating material may contain an oxide.

[0067] In the above-described method for producing a bonded solid, the thermal insulation material may include at least one selected from the group consisting of aluminum oxide, silicon oxide, magnesium oxide, zirconium oxide, and titanium oxide.

[0068] The absorbent material may also contain carbon material.

[0069] In the above-described method for producing a bonded solid, the absorbent material may include at least one selected from the group consisting of carbon, graphite, silicon carbide, carbon resin, and metal carbides.

[0070] In the above-described method for producing a bonded solid, the metal powder may contain metal.

[0071] In the above-described method for producing a bonded solid, the metal powder may contain at least one selected from the group consisting of iron, nickel, copper, gold, silver, aluminum, and cobalt.

[0072] In the above-described method for producing a bonded solid, the metal powder may contain a metal compound.

[0073] In the above-described method for producing a bonded solid, the metal powder may contain at least one compound selected from the group consisting of iron, nickel, copper, gold, silver, aluminum, and cobalt.

[0074] In the above-described method for producing a bonded solid, the metal powder may further contain alloying components.

[0075] In the above-described method for producing a bonded solid, the alloy component may include at least one selected from the group consisting of silicon, manganese, chromium, nickel, carbon, boron, copper, aluminum, titanium, niobium, vanadium, zinc, and sulfur.

[0076] In the above-described method for producing the bonded solid, the average particle size of the metal powder may be 200 μm or less.

[0077] In the above-described method for producing a bonded solid, the metal powder may contain a metal oxide, and the metal powder may be reduced when irradiated with microwaves.

[0078] In the above-described method for producing a bonded solid, the metal powder may contain a metal oxide, and the metal powder may be sintered when microwaves are irradiated onto it.

[0079] In the above-described method for producing a bonded solid, a high-melting-point material may form the mold or container.

[0080] In the above-described method for producing a bound solid, the metal powder may be in the form of a compacted powder.

[0081] The above method for producing a bonded solid may further include applying pressure to the metal powder before irradiating the metal powder with microwaves.

[0082] In the above-described method for producing a bonded solid, the pressure may be between 0.1 MPa and 2000 MPa.

[0083] The above method for producing a bonded solid may further include applying pressure to the metal powder while irradiating it with microwaves.

[0084] In the above-described method for producing a bonded solid, the pressure may be between 0.1 MPa and 2000 MPa.

[0085] The above method for producing a bonded solid may further include applying pressure to the metal powder after irradiating it with microwaves.

[0086] In the above-described method for producing a bonded solid, the pressure may be between 0.1 MPa and 2000 MPa.

[0087] In the above-described method for producing a bonded solid, the irradiation of the metal powder with microwaves may be carried out under an inert gas atmosphere.

[0088] In the above-described method for producing a bonded solid, the irradiation of the metal powder with microwaves may be carried out under a reducing atmosphere.

[0089] In the above-described method for producing a bonded solid, the metal powder may further include a metal oxide, and the metal oxide may be reduced before the metal powder is irradiated with microwaves.

[0090] In the above-described method for producing a bonded solid, covering at least a portion of the metal powder with a high-melting-point material whose melting point is higher than that of the metal powder may include forming a layer of the high-melting-point material, forming a recess in the layer of the high-melting-point material, and placing the solid and the metal powder in the recess.

[0091] In the above-described method for producing a bonded solid, forming a recess in the layer of high-melting-point material may include hardening a portion of the layer of high-melting-point material and removing the unhardened portion of the layer of high-melting-point material.

[0092] In the above-described method for producing a bonded solid, curing a portion of the layer of high-melting-point material may include including a curable material in a portion of the layer of high-melting-point material.

[0093] In the above-described method for producing a bonded solid, a curable material may be impregnated into a portion of the layer of the high-melting-point material.

[0094] In the above-described method for producing a bonded solid, a portion of the layer of the high-melting-point material may be cured by light irradiation.

[0095] According to an aspect of the present invention, a method for manufacturing a bonded solid is provided, which includes: placing a bonding metal between a first solid and a second solid; covering at least a portion of the area surrounding the bonding metal with a high-melting-point material that has a melting point higher than the melting point of the bonding metal; and irradiating the bonding metal, which is covered at least a portion of the area with the high-melting-point material, with microwaves to heat the bonding metal, thereby sintering or melting and solidifying the bonding metal to bond the first solid and the second solid.

[0096] In the above-described method for producing a bonded solid, the bonding metal may be in powder form.

[0097] In the above-described method for producing a bonded solid, the bonding metal may be a solid.

[0098] In the above-described method for producing a bonded solid, the bonding metal may be a liquid.

[0099] In the above-described method for producing a bonded solid, the high-melting-point material may include an insulating material that absorbs microwaves to a lower degree than the bonding metal.

[0100] In the above-described method for producing a bonded solid, the high-melting-point material may include an absorbing material that absorbs microwaves at a temperature range at least partially lower than the temperature range in which the bonding metal absorbs microwaves.

[0101] In the above-described method for producing a bonded solid, the high-melting-point material may include a heat insulating material that absorbs microwaves to a lower degree than the bonding metal, and a heat-absorbing material that absorbs microwaves at a temperature range at least partially lower than the temperature range in which the bonding metal absorbs microwaves.

[0102] In the above-described method for producing a bonded solid, the high-melting-point material may contain 1% to 70% by mass of an absorbent material.

[0103] In the above-described method for producing a bonded solid, the heat insulating material may contain an oxide.

[0104] In the above-described method for producing a bonded solid, the thermal insulation material may include at least one selected from the group consisting of aluminum oxide, silicon oxide, magnesium oxide, zirconium oxide, and titanium oxide.

[0105] In the above-described method for producing a bonded solid, the absorbent material may include a carbon material.

[0106] In the above-described method for producing a bonded solid, the absorbent material may include at least one selected from the group consisting of carbon, graphite, silicon carbide, carbon resin, and metal carbides.

[0107] In the above-described method for producing a bonded solid, the bonding metal may contain a metal.

[0108] In the above-described method for producing a bonded solid, the bonding metal may include at least one selected from the group consisting of iron, nickel, copper, gold, silver, aluminum, and cobalt.

[0109] In the above-described method for producing a bonded solid, the bonding metal may include a metal compound.

[0110] In the above-described method for producing a bonded solid, the bonding metal may include at least one compound selected from the group consisting of iron, nickel, copper, gold, silver, aluminum, and cobalt.

[0111] In the above-described method for producing a bonded solid, the bonding metal may further contain alloy components.

[0112] In the above-described method for producing a bonded solid, the alloy component may include at least one selected from the group consisting of silicon, manganese, chromium, nickel, carbon, boron, copper, aluminum, titanium, niobium, vanadium, zinc, and sulfur.

[0113] In the above-described method for producing a bound solid, the binding metal may be in powder form, and the average particle size of the binding metal may be 200 μm or less.

[0114] In the above-described method for producing a bonded solid, the bonding metal may contain a metal oxide, and the bonding metal may be reduced when irradiated with microwaves.

[0115] In the above-described method for producing a bonded solid, the bonding metal may contain a metal oxide, and the bonding metal may be sintered when microwaves are irradiated onto it.

[0116] In the above-described method for producing a bonded solid, a high-melting-point material may form the mold or container.

[0117] In the above-described method for producing a bonded solid, the bonding metal may be in the form of a compacted powder.

[0118] The above method for producing a bonded solid may further include applying pressure to the bonding metal before irradiating the bonding metal with microwaves.

[0119] In the above-described method for producing a bonded solid, the pressure may be between 0.1 MPa and 2000 MPa.

[0120] The above method for producing a bonded solid may further include applying pressure to the metal powder while irradiating it with microwaves.

[0121] In the above-described method for producing a bonded solid, the pressure may be between 0.1 MPa and 2000 MPa.

[0122] The above method for producing a bonded solid may further include applying pressure to the bonding metal after irradiating it with microwaves.

[0123] In the above-described method for producing a bonded solid, the pressure may be between 0.1 MPa and 2000 MPa.

[0124] In the above-described method for producing a bonded solid, the irradiation of the bonding metal with microwaves may be carried out under an inert gas atmosphere.

[0125] In the above-described method for producing a bonded solid, the irradiation of the bonding metal with microwaves may be carried out under a reducing atmosphere.

[0126] In the above-described method for producing a bonded solid, the bonding metal may further include a metal oxide, and the method may further include reducing the metal oxide before irradiating the bonding metal with microwaves.

[0127] In the above-described method for producing a bonded solid, covering at least a portion of the area surrounding the bonding metal with a high-melting-point material whose melting point is higher than that of the bonding metal may include forming a layer of the high-melting-point material, forming a recess in the layer of the high-melting-point material, and placing the first and second solids and the bonding metal into the recess.

[0128] In the above-described method for producing a bonded solid, forming a recess in the layer of high-melting-point material may include hardening a portion of the layer of high-melting-point material and removing the unhardened portion of the layer of high-melting-point material.

[0129] In the above-described method for producing a bonded solid, curing a portion of the layer of high-melting-point material may include including a curable material in a portion of the layer of high-melting-point material.

[0130] In the above-described method for producing a bonded solid, a curable material may be impregnated into a portion of the layer of the high-melting-point material.

[0131] In the above-described method for producing a bonded solid, a portion of the layer of the high-melting-point material may be cured by light irradiation. [Effects of the Invention]

[0132] According to the present invention, it is possible to provide a method for manufacturing a metal solid that can be easily produced. Furthermore, according to the present invention, it is possible to provide a method for manufacturing a bonded solid that can be easily bonded to a solid, and a method for manufacturing a bonded solid that can be easily connected to other solids. [Brief explanation of the drawing]

[0133] [Figure 1] Figure 1 is a schematic perspective view of a metal solid manufacturing apparatus according to the first embodiment. [Figure 2] Figure 2 is a schematic process diagram of the method for manufacturing a metal solid according to the first embodiment. [Figure 3] Figure 3 is a schematic process diagram of the method for manufacturing a solid metal according to the first embodiment. [Figure 4] Figure 4 is a schematic process diagram of the method for manufacturing a metal solid according to the first embodiment. [Figure 5] Figure 5 is a schematic process diagram of the method for manufacturing a solid metal according to the first embodiment. [Figure 6] Figure 6 is a schematic process diagram of the method for manufacturing a solid metal according to the first embodiment. [Figure 7] Figure 7 is a schematic process diagram of the method for manufacturing a metal solid according to the first embodiment. [Figure 8] Figure 8 is a schematic perspective view of a metal solid manufacturing apparatus according to the first embodiment. [Figure 9] Figure 9 is a schematic perspective view of a metal solid manufacturing apparatus according to the first embodiment. [Figure 10] Figure 10 is a schematic perspective view of a metal solid manufacturing apparatus according to the first embodiment. [Figure 11] Figure 11 is a photograph of the metallic solid obtained in Example 1. [Figure 12] Figure 12 is a photograph of the metallic solid obtained in Example 2. [Figure 13] Figure 13 is a photograph of the metallic solid obtained in Example 3. [Figure 14] Figure 14 is a photograph of the metallic solid obtained in Example 4. [Figure 15] Figure 15 is a photograph of the solid coated with the metal film obtained in Example 5. [Figure 16] Figure 16 is a photograph of the solid coated with the metal film obtained in Example 6. [Figure 17] Figure 17 is a photograph of the solid coated with the metal film obtained in Example 7. [Figure 18] Figure 18 is a photograph of the bonded solid obtained in Example 8. [Figure 19] Figure 19 is a photograph of the bonded solid obtained in Example 10. [Modes for carrying out the invention]

[0134] Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, identical or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic. Therefore, specific dimensions and other details should be determined by referring to the following description. It should also be noted that there are parts in the drawings where the relationships and ratios of dimensions differ from one another.

[0135] (First Embodiment) The method for producing a solid metal according to the first embodiment includes covering at least a portion of the metal powder with a high-melting-point material that has a higher melting point than the metal powder, and heating the metal powder, which is covered at least a portion of the metal powder with the high-melting-point material, by irradiating it with microwaves to sinter or melt and solidify the metal powder. The microwaves are, for example, electromagnetic waves with a frequency of 300 MHz or more and 30 GHz or less. It is preferable that the metal powder and the high-melting-point material are in close contact in the portion of the metal powder covered with the high-melting-point material.

[0136] The material of the metal powder may contain elemental metals or metal compounds such as alloys. Examples of metals include iron (Fe), nickel (Ni), copper (Cu), gold (Au), silver (Ag), aluminum (Al), and cobalt (Co). The sintering temperature of iron (Fe) is, for example, 1200°C. The melting point of iron (Fe) is 1538°C. The sintering temperature of nickel (Ni) is, for example, 1200°C. The melting point of nickel (Ni) is 1495°C. The sintering temperature of copper (Cu) is, for example, 800°C. The melting point of copper (Cu) is 1085°C. The sintering temperature of gold (Au) is, for example, 800°C. The melting point of gold (Au) is 1064°C. The sintering temperature of silver (Ag) is, for example, 750°C. The melting point of silver (Ag) is 962°C. The sintering temperature of aluminum (Al) is, for example, 500°C. The melting point of aluminum (Al) is 660°C. The sintering temperature of cobalt (Co) is, for example, 1100°C. The melting point of cobalt (Co) is 1455°C.

[0137] The material of the metal powder may contain one type of metal or multiple types of metals. Examples of metal compounds include, but are not limited to, alloys composed of multiple metal elements, alloys composed of metal and nonmetal elements, metal oxides, metal hydroxides, metal chlorides, metal carbides, metal borides, and metal sulfides. The metal powder may contain, for example, silicon (Si), manganese (Mn), chromium (Cr), nickel (Ni), carbon (C), boron (B), copper (Cu), aluminum (Al), titanium (Ti), niobium (Nb), vanadium (V), zinc (Zn), and sulfur (S) as alloying components. The material of the metal powder preferably has superior microwave absorption characteristics compared to the surrounding high-melting-point material. This makes the metal powder more easily heated by microwaves than the surrounding high-melting-point material.

[0138] The average particle size of the metal powder is, for example, 200 μm or less, 190 μm or less, or 180 μm or less. The average particle size of the metal powder is measured, for example, by laser diffraction-scattering, using the median diameter D in the cumulative particle size distribution on a volume basis. 50 This refers to the particle size distribution of the metal powder, D 10 / D 50 >0.5 and D 50 / D 90 The value is >0.5. When the average particle size of the metal powder is 200 μm or less, the metal powder tends to absorb microwaves easily.

[0139] The high-melting-point material may contain an insulating material that has higher microwave permeability than the metal powder and absorbs microwaves to a lower degree than the metal powder. The insulating material has a higher melting point than the metal powder. Because the insulating material absorbs microwaves to a low degree, it generates less heat even when irradiated with microwaves, thus exhibiting an insulating effect. Furthermore, because the insulating material has a higher melting point than the metal powder, its shape remains stable even when irradiated with microwaves. Therefore, the high-melting-point material containing the insulating material can maintain its shape even while the metal powder irradiated with microwaves is sintering or melting.

[0140] The insulating material may contain metal oxides or metalloid oxides. Examples of metal and metalloid oxides include, but are not limited to, aluminum oxide (Al2O3), silicon oxide (SiO2), magnesium oxide (MgO), zirconium oxide (ZrO2), and titanium oxide (TiO2). For example, the melting point of aluminum oxide (Al2O3) is 2072°C. The melting point of silicon oxide (SiO2) is 1710°C. The melting point of magnesium oxide (MgO) is 2852°C. The insulating material may also be a compound of these.

[0141] High-melting-point materials may include an absorbing material that absorbs microwaves at a temperature range that is at least partially lower than the temperature range in which the metal powder absorbs microwaves. The absorbing material has a higher melting point than the metal powder. At least partially of the temperature range in which the absorbing material absorbs microwaves is lower than the temperature range in which the metal powder absorbs microwaves. The temperature range in which the metal powder absorbs microwaves is, for example, 300°C to 1200°C, 450°C to 1100°C, or 600°C to 800°C. The temperature range in which the absorbing material absorbs microwaves is, for example, 100°C to 1000°C, 250°C to 900°C, or 400°C to 600°C.

[0142] Preferably, at least a portion of the temperature range in which the absorbing material absorbs microwaves overlaps with the temperature range in which the metal powder absorbs microwaves. Since the absorbing material absorbs microwaves at a temperature range that is at least partially lower than the temperature range in which the metal powder absorbs microwaves, it generates heat faster than the metal powder. Therefore, the absorbing material can heat the metal powder before it reaches the temperature range in which the metal powder absorbs microwaves. Consequently, when a high-melting-point material contains an absorbing material, the temperature of the metal powder reaches the microwave-absorbing temperature range more quickly, and the heating time of the metal powder can be shortened. In addition, since the absorbing material absorbs microwaves at a temperature range that is at least partially lower than the temperature range in which the metal powder absorbs microwaves, it is possible to suppress the high-melting-point material from being heated more than necessary. Therefore, even while the metal powder irradiated with microwaves is sintering or melting, the shape of the high-melting-point material containing the absorbing material can remain stable.

[0143] The absorbing material includes, for example, a carbon material. Examples of carbon materials include, but are not limited to, carbon black, amorphous carbon, graphite, silicon carbide, carbon resin, and metal carbides. The absorbing material may also be a compound of these materials. It is preferable that the absorbing material does not contain volatile components. By not containing volatile components, it is possible to avoid the absorption of microwaves by volatile components.

[0144] High-melting-point materials may contain reducing materials that reduce metal powders. The reducing material has a melting point higher than that of the metal powder. Examples of reducing materials include carbon and silicon carbide. Carbon materials used as absorbents can also function as reducing materials.

[0145] High-melting-point materials may consist solely of insulating materials, solely of absorbing materials, solely of reducing materials, or a combination of these. Furthermore, insulating materials, absorbing materials, and reducing materials may have overlapping properties and functions. For example, carbon materials can function as both absorbing and reducing materials.

[0146] When a high-melting-point material contains both an insulating material and an absorbent material, the mass ratio of the insulating material to the absorbent material is preferably 1:1, or the mass ratio of the insulating material is greater than the mass ratio of the absorbent material. For example, the mass ratio of the absorbent material in a high-melting-point material is 1% by mass or more, 2% by mass or more, or 5% by mass or more, and is 70% by mass or less, 50% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, or 10% by mass or less. By setting the mass ratio of the absorbent material in a high-melting-point material to 50% by mass or less, it becomes possible to ensure microwave transmission in the high-melting-point material and to appropriately control the rate of sintering or melting and solidification of the metal powder.

[0147] When the metal powder irradiated with microwaves is a compacted powder, the high-melting-point material may be a solid powder or the like, and may have fluidity. After forming the metal powder into a compacted powder of a desired three-dimensional shape, at least a portion of the compacted powder is covered with the high-melting-point material, and then the compacted powder covered with the high-melting-point material is irradiated with microwaves, causing the compacted powder to sinter and a metal solid of the desired shape to be produced by metallurgy. Alternatively, the compacted powder covered with the high-melting-point material is irradiated with microwaves, and then cooled, causing the compacted powder to melt and solidify, and a metal solid of the desired shape to be produced. The compacted powder may be completely covered with the high-melting-point material. The thickness, volume, etc., of the high-melting-point material covering the compacted powder can be appropriately set based on the microwave transmittance.

[0148] When forming metal powder into compacts, the metal powder may be subjected to pressures such as 0.1 MPa or higher, 1 MPa or higher, 100 MPa or higher, or 200 MPa or higher, and 2000 MPa or lower, 1900 MPa or lower, or 1800 MPa or lower. Pressurization tends to make the resulting metal solid more dense. Pressurization methods include uniaxial molding, cold isostatic pressing (CIP) molding, hot isostatic pressing (HIP) molding, and roller pressing.

[0149] If the metal powder irradiated with microwaves is fluid, the high-melting-point material may form a solid such as a mold or container. For example, the entire metal powder irradiated with microwaves may be a powder, or a portion of the metal powder may be a compact. The metal powder is placed in a recess of a mold or container made of the high-melting-point material that corresponds to a desired three-dimensional shape, at least a portion of the metal powder is covered with the mold or container made of the high-melting-point material, and then the metal powder covered with the mold or container made of the high-melting-point material is irradiated with microwaves, causing the metal powder to sinter and a metal solid of the desired shape to be produced. In this disclosure, the recess includes a through hole. Alternatively, the metal powder covered with the high-melting-point material is irradiated with microwaves, and then cooled, causing the compact to melt and solidify, and a metal solid of the desired shape to be produced. The metal powder may be completely covered with a mold or container made of the high-melting-point material. The thickness, volume, etc., of the mold or container made of the high-melting-point material covering the compact can be appropriately set based on the microwave transmittance. The metal powder, which is placed in a mold or container made of a high-melting-point material, may have its composition varied depending on its position. For example, the type of metal making up the metal powder or the alloying components of the metal powder may be changed depending on its position.

[0150] After placing metal powder into a mold or container made of a high melting point material, and before irradiating with microwaves, the metal powder may be subjected to pressures such as 0.1 MPa or higher, 1 MPa or higher, 100 MPa or higher, or 200 MPa or higher, and 2000 MPa or lower, 1900 MPa or lower, or 1800 MPa or lower. Pressurization tends to make the resulting solid metal denser. Pressurization methods include uniaxial molding, cold isostatic pressing (CIP) molding, hot isostatic pressing (HIP) molding, and roller pressing.

[0151] When solidifying a high-melting-point material into a mold or container, a curable material such as a photocurable resin may be dispersed in the high-melting-point material, and the mixture of the high-melting-point material and the photocurable resin may be cured by irradiating it with light. If the photocurable resin is an ultraviolet-curable resin, ultraviolet light is irradiated onto the mixture of the high-melting-point material and the photocurable resin. The irradiation time is, for example, 1 hour or more, 2 hours or more, or 3 hours or more. The mass ratio of the photocurable resin in the mixture of the high-melting-point material and the photocurable resin is, for example, 1% or more, 2% or more, or 3% or more, and 10% or less, 9% or less, or 8% or less. By setting the mass ratio of the photocurable resin in the mixture of the high-melting-point material and the photocurable resin to 1% or more and 10% or less, it may be possible to ensure hardness and microwave transmittance. The curable material may also be thermosetting. In this case, the mixture of the high-melting-point material and the thermosetting material may be heated to cure the mixture.

[0152] If both the metal powder to be irradiated with microwaves and the high-melting-point material are in powder form, the metal powder and the high-melting-point material may be layered, and then the layered metal powder and high-melting-point material may be irradiated with microwaves. After layering the metal powder and high-melting-point material, before irradiating with microwaves, a pressure of, for example, 0.1 MPa or more, 1 MPa or more, 100 MPa or more, or 200 MPa or more, and 2000 MPa or less, 1900 MPa or less, or 1800 MPa or less may be applied to the layered metal powder and high-melting-point material. Pressurization tends to make the manufactured metal solid more dense. Examples of pressurization methods include uniaxial molding, cold isostatic pressing (CIP) molding, hot isostatic pressing (HIP) molding, and roller pressing.

[0153] Pressure may be applied to the metal powder while it is being irradiated with microwaves. The applied pressure may be, for example, 0.1 MPa or more, 1 MPa or more, 100 MPa or more, or 200 MPa or more, and 2000 MPa or less, 1900 MPa or less, or 1800 MPa or less.

[0154] After sintering or melting and solidifying the metal powder, pressure may be applied to the resulting metal solid. In this case, it is preferable to apply pressure while the metal solid is still hot and before it has cooled to ambient temperature, and while its temperature is higher than the ambient temperature. The applied pressure can be, for example, 0.1 MPa, 1 MPa or more, 100 MPa or more, or 200 MPa or more, and 2000 MPa or less, 1900 MPa or less, or 1800 MPa or less. Pressurization tends to make the manufactured metal solid denser. Pressurization methods include uniaxial molding, cold isostatic pressing (CIP) molding, hot isostatic pressing (HIP) molding, and roller pressing.

[0155] When a metal powder contains a metal oxide, the metal oxide is reduced by irradiating the metal powder, which is covered with a high-melting-point material containing a reducing agent, with microwaves. Heating the metal powder to a temperature above the sintering temperature and near the melting point makes it easier to obtain a dense sintered body. Therefore, the metal powder may be heated with microwaves to 1400°C or above, or even 1500°C or above. When melting and solidifying the metal powder, the metal powder should be heated above its melting point. It should be noted that the oxide powder of the metal may be reduced beforehand before irradiating the metal powder with microwaves. For example, the metal oxide powder can be reduced by mixing the metal oxide powder with carbon powder and heating the mixture. The reduced metal powder can then be separated from the carbon powder, for example, by a magnet.

[0156] The heating of metal powder may be carried out under an inert gas atmosphere. Examples of inert gases include argon (Ar) and helium (He). Alternatively, the heating of metal powder may be carried out under a neutral gas atmosphere. Examples of neutral gases include nitrogen (N2), dry hydrogen (H2), and ammonia (NH3). Furthermore, the heating of metal powder may be carried out under a reducing atmosphere. Examples of reducing gases that provide a reducing atmosphere include hydrogen (H2), carbon monoxide (CO), and hydrocarbon gases (CH4, C3H8, C4H8). 10Examples include the above. When a high-melting-point material forms a mold or container, an inert gas, neutral gas, or reducing gas may be supplied to the inside of the mold or container made of the high-melting-point material.

[0157] A layered metal solid may be formed by repeatedly covering at least a portion of the metal powder with a high-melting-point material and sintering or melting and solidifying the metal powder. The metal solid obtained by the above method may also be polished. Alternatively, the metal solid obtained by the above method may be used as a core, for example, with metal powder placed around it, and then the high-melting-point material placed around the metal powder, and the process of irradiating with microwaves may be repeated. This makes it possible to scale up the metal solid. Furthermore, the composition of the metal powder and the high-melting-point material may be changed each time microwaves are irradiated. For example, the alloying component of the metal powder may be changed each time microwaves are irradiated.

[0158] As shown in Figure 1, the metal solid manufacturing apparatus according to the first embodiment includes a stage 10 on which metal powder and a high-melting-point material with a melting point higher than the melting point of the metal powder are placed, covering at least a portion of the metal powder, and a microwave irradiation unit 20 for heating the metal powder by irradiating the metal powder, which is covered at least a portion of the high-melting-point material, with microwaves to sinter or melt and solidify the metal powder. The metal solid manufacturing apparatus according to the first embodiment can, for example, carry out the metal solid manufacturing method according to the first embodiment described above.

[0159] Stage 10 is not particularly limited as long as it can accommodate the metal powder and the high-melting-point material. Stage 10 may be movable in three axes perpendicular to each other. For example, Stage 10 may be movable in the direction of gravity and in the horizontal direction.

[0160] The metal solid manufacturing apparatus according to the first embodiment may further include a high-melting-point material placement section 31 for placing a high-melting-point material on a stage 10. The high-melting-point material placement section 31 may coat the high-melting-point material onto the stage 10. The high-melting-point material placement section 31 may form a layer of high-melting-point material on the stage 10. The high-melting-point material placement section 31 may be movable in three axes perpendicular to each other. For example, the high-melting-point material placement section 31 may be movable in the direction of gravity and in the horizontal direction. For example, as shown in Figures 2(a) to 2(c), the high-melting-point material placement section 31 may move along the stage 10 and coat the high-melting-point material in powder form onto the stage 10, forming a layer 101 of high-melting-point material on the stage 10.

[0161] As shown in Figure 1, the metal solid manufacturing apparatus according to the first embodiment may further include a curable material addition section 32 for adding a curable material to at least a portion of the high-melting-point material. The curable material addition section 32 adds the curable material to the portion of the high-melting-point material to be hardened, and does not add the curable material to the portion of the high-melting-point material that is not to be hardened. The curable material is, for example, a liquid, and the curable material addition section 32 may impregnate the portion of the high-melting-point material to be hardened with the curable material. The curable material addition section 32 may be movable in three axes perpendicular to each other. For example, the curable material addition section 32 may be movable in the direction of gravity and in the horizontal direction. For example, as shown in Figures 3(a) and 3(b), the curable material addition unit 32 may move over the layer 101 of the high-melting-point material on the stage 10, applying the curable material to the layer 101 of the high-melting-point material in a patterned manner, without adding the curable material to the non-curable portion 102 of the layer 101 of the high-melting-point material, and adding the curable material to the curable portion of the layer 101 of the high-melting-point material. The curable material addition unit 32 may, for example, be equipped with an inkjet nozzle and add the curable material to the high-melting-point material using a binder jetting method.

[0162] The high-melting-point material placement section 31 and the curable material addition section 32 may be integrated into a single unit.

[0163] As shown in Figure 1, the metal solid manufacturing apparatus according to the first embodiment may further include a curing apparatus 40 for curing at least a portion of the high-melting-point material. If the high-melting-point material includes a photocurable material, the curing apparatus 40 is a light source. If the high-melting-point material includes a thermosetting material, the curing apparatus 40 is a heat source. The curing apparatus 40 may be movable in three axes perpendicular to each other. For example, the curing apparatus 40 may be movable in the direction of gravity and in the horizontal direction. As shown in Figure 3(c), the curing apparatus 40 irradiates the layer 101 of the high-melting-point material with the energy required for curing the curable material, thereby curing at least a portion of the layer 101 of the high-melting-point material. The curing apparatus 40 may irradiate the entire surface of the layer 101 of the high-melting-point material with energy at once, or it may irradiate the layer 101 of the high-melting-point material while scanning it.

[0164] As shown in Figure 1, the metal solid manufacturing apparatus according to the first embodiment may further include an uncured material removal unit 50 for removing uncured high-melting-point material. For example, as shown in Figures 4(a) and 4(b), the uncured material removal unit 50 may apply air pressure to the uncured powder portion 102 of the high-melting-point material layer 101 to remove the uncured powder portion 102 from the high-melting-point material layer 101, thereby forming a recess 103 in the high-melting-point material layer 101.

[0165] As shown in Figure 1, the metal solid manufacturing apparatus according to the first embodiment may further include a metal powder placement unit 33 for placing metal powder on a stage 10. A recoater can be used as the metal powder placement unit 33. The metal powder placement unit 33 may coat the metal powder onto the stage 10. The metal powder placement unit 33 may be movable in three axes perpendicular to each other. For example, the metal powder placement unit 33 may be movable in the direction of gravity and in the horizontal direction. For example, as shown in Figures 5(a) and 5(b), the metal powder placement unit 33 may place metal powder 200 in the recesses 103 of the high-melting-point material layer 101 on the stage 10. Metal powder placed on the surface of the portion of the high-melting-point material layer 101 on the stage 10 where the recesses 103 are not formed may be removed with a roller, brush, or the like.

[0166] The high-melting-point material placement section 31 and the metal powder placement section 33 may be integrated. The curable material addition section 32 and the metal powder placement section 33 may be integrated. The high-melting-point material placement section 31, the curable material addition section 32, and the metal powder placement section 33 may be integrated.

[0167] As shown in Figure 1, the metal solid manufacturing apparatus according to the first embodiment may further include a pressurizing unit 60 that applies pressure to the metal powder placed on the stage 10. As shown in Figure 5(c), the pressurizing unit 60 applies pressure to the metal powder 200 before it is irradiated with microwaves. Examples of pressurizing methods include uniaxial molding, cold isostatic pressing (CIP) molding, hot isostatic pressing (HIP) molding, and roller pressurizing. In the case of roller pressurizing, the pressurizing tip of the pressurizing unit 60 may be a roller type, and a pressurizing method may be selected in which the stage 10 is slid while the roller is pressed against the stage 10.

[0168] For example, as shown in Figure 6, the microwave irradiation unit 20 irradiates microwaves onto the metal powder 200 placed in the recess 103 of the high-melting-point material layer 101 on the stage 10. The microwave irradiation unit 20 may irradiate the entire surface of the metal powder 200 with microwaves at once, or it may irradiate the metal powder 200 while scanning it. The metal solid manufacturing apparatus according to the first embodiment may further include an inert gas supply unit that supplies an inert gas to the metal powder. The inert gas supply unit supplies an inert gas around the metal powder 200 while the metal powder 200 is irradiated with microwaves at least. The metal solid manufacturing apparatus according to the first embodiment may further include a reducing gas supply unit that supplies a reducing gas to the metal powder. The reducing gas supply unit supplies a reducing gas around the metal powder 200 while the metal powder 200 is irradiated with microwaves at least. The metal solid manufacturing apparatus according to the first embodiment may further include a neutral gas supply unit that supplies a reducing gas to the metal powder. The neutral gas supply unit supplies neutral gas around the metal powder 200 while the metal powder 200 is irradiated with microwaves at least. The inert gas supply unit and the reducing gas supply unit may be integrated. The inert gas supply unit and the neutral gas supply unit may be integrated. The reducing gas supply unit and the neutral gas supply unit may be integrated.

[0169] As shown in Figure 1, the metal solid manufacturing apparatus according to the first embodiment may include a thermometer 71 for measuring the temperature of the metal powder placed on the stage 10. A radiation thermometer can be used as the thermometer 71. The radiation thermometer measures the temperature of the metal powder based on the emissivity of the metal powder material. The thermometer 71 may also measure the temperature of high-melting-point materials. The microwaves irradiated by the microwave irradiation unit 20 may be controlled based on the temperature of the metal powder measured by the thermometer 71. The metal solid manufacturing apparatus according to the first embodiment may also include a microwave detector 72 for detecting the microwaves irradiated by the microwave irradiation unit 20. The microwaves irradiated by the microwave irradiation unit 20 may be controlled based on the characteristics of the microwaves detected by the microwave detector 72.

[0170] The pressurizing section 60 shown in Figure 1 may apply pressure to the metal powder 200 after it has been irradiated with microwaves. Examples of pressurizing methods include uniaxial molding, cold isostatic pressing (CIP) molding, hot isostatic pressing (HIP) molding, and roller pressurizing. In the case of roller pressurizing, the pressurizing tip of the pressurizing section 60 may be a roller type, and a pressurizing method may be selected in which the stage 10 is slid while the roller is pressed against the stage 10.

[0171] The metal powder 200, placed in the recess 103 of the high-melting-point material layer 101 on the stage 10 shown in Figure 6 and irradiated with microwaves, is then cooled, sintered, or melted and solidified to become a solid metal. Note that the metal powder 200 near the edge of the recess 103 in the high-melting-point material layer 101 tends to heat up more easily. Therefore, the mass ratio of the absorbing material contained in the high-melting-point material may be lower near the edge of the recess 103 than in other areas.

[0172] The stage 10 and microwave irradiation unit 20 of the metal solid manufacturing apparatus according to the first embodiment may be housed in a casing.

[0173] The apparatus for manufacturing a metal solid according to the first embodiment may repeatedly form a layer of high-melting-point material 101 surrounding a metal powder on top of a layer of high-melting-point material 101 surrounding a sintered or melted-solidified metal solid and the metal solid, and then sinter or melt-solidify the metal powder. This makes it possible to manufacture a thick metal solid by stacking metal solids even if the thickness of the metal solid formed by a single microwave irradiation is thin. By changing the shape of the recesses formed in the high-melting-point material layer 101 each time a layer of high-melting-point material 101 surrounding the metal powder is formed, it is possible to manufacture a metal solid with a complex three-dimensional shape.

[0174] Specifically, as shown in Figure 7, a first layer of high-melting-point material 101A is formed on the stage 10, and metal powder 200A is placed in the recesses of the high-melting-point material layer 101A. Next, microwaves are irradiated onto the metal powder 200A to convert it into the first layer of solid metal 201A. Next, a second layer of high-melting-point material 101B is formed on top of the first layer of high-melting-point material 101A, and metal powder 200B is placed in the recesses of the high-melting-point material layer 101B. Here, the first layer of solid metal 201A is exposed from the recesses of the high-melting-point material layer 101B, and the metal powder 200B is in contact with the surface of the first layer of solid metal 201A. Next, microwaves are irradiated onto the metal powder 200B to convert it into the second layer of solid metal 201B. In this process, the second layer of metal solid 201B adheres to the first layer of metal solid 201A. The same process is repeated thereafter to build up layers of metal solids.

[0175] (Second Embodiment) A method for producing a bonded solid according to the second embodiment includes: placing metal powder on a solid; covering at least a portion of the metal powder with a high-melting-point material that has a melting point higher than the melting point of the metal powder; and irradiating the metal powder, which is covered at least a portion of the surrounding area with the high-melting-point material, with microwaves to heat the metal powder, thereby sintering or melting and solidifying the metal powder to form a metal solid on the solid.

[0176] The solid material is not particularly limited, but a material with a melting point higher than that of the metal powder is preferred. An example of a solid material is a metal with a melting point higher than that of the metal powder. The shape of the solid is not particularly limited. Examples of solid shapes include flat plates, rectangular parallelepipeds, and cylinders. For example, the solid may have a flat surface or a curved surface.

[0177] The metal powder and high-melting-point material may be the same as in the first embodiment. The arrangement method of the metal powder and high-melting-point material may be the same as in the first embodiment. The relative arrangement of the metal powder and high-melting-point material may be the same as in the first embodiment. In addition, the microwave irradiation conditions may be the same as in the first embodiment.

[0178] The method for arranging metal powder on a solid is not particularly limited. Metal powder may be arranged on the solid using a recoater. Metal powder may be arranged on at least some of the surfaces of a solid. Metal powder may be arranged to cover the entire solid. The thickness of the layer of metal powder arranged on the solid is appropriately set according to the thickness of the resulting metal solid. For example, the thickness of the layer of metal powder arranged on the solid is constant. A recess may be created in a layer of high-melting-point material placed on a stage, a solid may be placed in the recess of the high-melting-point material layer, and then the metal powder may be arranged on the solid. Alternatively, after arranging the metal powder on the solid, high-melting-point material may be placed at least around the metal powder.

[0179] Pressure may be applied to the metal powder on a solid surface before irradiating it with microwaves. The pressurization method may be the same as in the first embodiment. Pressure may also be applied to the metal powder after it has been irradiated with microwaves.

[0180] A metallic solid is formed on a solid by sintering or melting and solidifying metal powder on a solid. This results in the metallic solid being bonded to the solid. The formed metallic solid may be in the form of a film. A metallic solid may also be formed on a solid for the purpose of coating the solid.

[0181] The process of forming a metal solid on a solid surface may be repeated. The metal solid may be in the form of a film, and a multilayer film may be formed on the solid surface.

[0182] The method for manufacturing a bonded solid according to the second embodiment may be carried out using the metal solid manufacturing apparatus described in the first embodiment.

[0183] (Third embodiment) A method for manufacturing a bonded solid according to the third embodiment includes: placing a bonding metal between a first solid and a second solid; covering at least a portion of the area surrounding the bonding metal with a high-melting-point material that has a melting point higher than the melting point of the bonding metal; and irradiating the bonding metal, which is covered at least a portion of the area with the high-melting-point material, with microwaves to heat the bonding metal, thereby sintering or melting and solidifying the bonding metal to bond the first solid and the second solid.

[0184] The materials of the first and second solids are not particularly limited, but materials with a melting point higher than that of the metal powder are preferred. Examples of the materials of the first and second solids include metals with a melting point higher than that of the metal powder. The shapes of the first and second solids are not particularly limited. The first and second solids may have surfaces that can come into contact with each other. The first solid may have a shape that can be fitted with the second solid. The first solid may have a shape that can be inserted into the second solid.

[0185] The bonding metal may be a powder, a solid, or a liquid. If the bonding metal is a solid, it may have a shape that allows it to be inserted between the bonding surfaces of a first solid and a second solid. If the bonding metal is a liquid, the liquid may be viscous. The bonding metal, whether powder or solid, may be heated to a liquid state.

[0186] The material of the bonding metal may be the same as the metal powder described in the first embodiment. The high-melting-point material may be the same as in the first embodiment. The bonding metal is placed between the bonding surface of the first solid and the bonding surface of the second solid, and the high-melting-point material is placed at least around the bonding metal. The method of placing the high-melting-point material may be the same as in the first embodiment. The relative arrangement of the bonding metal and the high-melting-point material may be the same as the relative arrangement of the metal powder and the high-melting-point material in the first embodiment. A first solid or a second solid may be placed between the bonding metal and the high-melting-point material. The microwave irradiation conditions may be the same as in the first embodiment.

[0187] The method for placing the bonding metal between the first and second solids is not particularly limited. If the bonding metal is a powder or liquid, the bonding metal may be injected between the bonding surfaces of the first solid and the second solid. If the bonding metal is a solid, the bonding metal may be inserted between the bonding surfaces of the first solid and the second solid. Alternatively, regardless of whether the bonding metal is a powder, liquid, or solid, the bonding metal may be placed on the bonding surface of the first solid, and then the bonding surface of the second solid may be brought into contact with the bonding metal.

[0188] A recess may be provided in the layer of high-melting-point material placed on the stage, a first solid may be placed in the recess of the high-melting-point material layer, and a binding metal and a second solid may be sequentially placed on the first solid. Alternatively, a binding metal may be placed between the first solid and the second solid, and then the high-melting-point material may be placed at least around the binding metal.

[0189] Pressure may be applied to the bonding metal placed between the first and second solids before irradiating with microwaves. For example, pressure may be applied to at least one of the first and second solids to apply pressure to the bonding metal. Pressure may also be applied to the bonding metal after it has been irradiated with microwaves.

[0190] The first and second solids are bonded together by sintering or melting and solidifying a bonding metal between them.

[0191] The method for manufacturing a bonded solid according to the third embodiment may be carried out using the metal solid manufacturing apparatus described in the first embodiment.

[0192] Although the present invention has been described above by embodiments, the descriptions and drawings that constitute part of this disclosure should not be understood as limiting the invention. Various alternative embodiments, examples, and operational techniques should become apparent to those skilled in the art from this disclosure. For example, the pressurizing unit 60 shown in Figure 1 may apply pressure to the entire surface of the metal powder 200 that is placed thereon. Alternatively, as shown in Figure 8, the pressurizing unit 60 having a contact area smaller than the surface area of ​​the metal powder 200 that is placed thereon may continuously apply pressure to the metal powder 200 while moving. Examples of pressurizing methods include uniaxial molding, cold isostatic pressing (CIP) molding, hot isostatic pressing (HIP) molding, and roller pressurizing. In the case of roller pressurizing, as shown in Figure 9, the pressurizing unit 60 is equipped with rollers, and a pressurizing method may be selected in which the rollers are moved on the stage 10 while the rollers are pressed against the stage 10, or the stage 10 is slid. Furthermore, for example, as shown in Figure 10, the metal solid manufacturing apparatus according to the embodiment may include a reduction device 80 that reduces the metal powder before the metal powder is irradiated with microwaves. The reduction device 80 is, for example, a heating device that heats the metal powder to reduce it. It should be understood that the present invention encompasses various embodiments not described herein. [Examples]

[0193] (Example 1) A layer of high-melting-point material was formed. The high-melting-point material consisted of 93% by mass of aluminum oxide (Al2O3) powder and 7% by mass of carbon (C) powder. The portion of the high-melting-point material layer where depressions were to be created was covered with a circular aluminum plate, and a curable material was sprayed onto the surface of the high-melting-point material layer, allowing the curable material to penetrate the portion of the high-melting-point material layer not covered by the aluminum plate. The curable material contained 50% by mass of UV-curable resin (Standard Photopolymer Resin, manufactured by AMZLAB GmbH) and 50% by mass of ethanol. Subsequently, the high-melting-point material layer was irradiated with UV light to cure the curable resin that had penetrated the high-melting-point material layer. The high-melting-point material that was covered by the aluminum plate and not cured was removed with an air shower. As a result, cylindrical depressions were formed in the high-melting-point material layer. The diameter of the bottom of the cylindrical depressions was 7.0 mm, and the depth was 4.0 mm.

[0194] A recess in a layer of high-melting-point material was filled with metal powder (average particle size 45 μm). The metal powder consisted of 100% iron (Fe). A press was used to apply a pressure of 250 MPa to the metal powder and the high-melting-point material surrounding it. Under an air atmosphere, the high-melting-point material and metal powder were irradiated with 700 W microwaves for 180 seconds, heating the metal powder to 1350 °C (estimated value). Figure 11 shows a photograph of the metal solid obtained by sintering the metal powder. The obtained metal solid was cylindrical, with a base diameter of 7.0 mm and a height of 4.0 mm. The density of the obtained metal solid was 4.5 g / cm³. 2 The relative density (= density / true density) was 58%.

[0195] (Example 2) A first layer of high-melting-point material was formed. The high-melting-point material consisted of 93% by mass of aluminum oxide (Al2O3) powder and 7% by mass of carbon (C) powder. The portion of the surface of the first layer of high-melting-point material where the depressions were to be formed was covered with a circular aluminum plate, and a curable material was sprayed onto the surface of the first layer of high-melting-point material, allowing the curable material to penetrate the portion of the first layer of high-melting-point material not covered by the aluminum plate. The curable material contained 50% by mass of UV-curable resin (Standard Photopolymer Resin, manufactured by AMZLAB GmbH) and 50% by mass of ethanol. Subsequently, the first layer of high-melting-point material was irradiated with UV light to cure the curable resin that had penetrated the first layer of high-melting-point material. The high-melting-point material that was covered by the aluminum plate and not cured was removed with an air shower. As a result, cylindrical depressions were formed in the first layer of high-melting-point material. The diameter of the bottom of the cylindrical depressions was 7.0 mm, and the depth was 4.2 mm.

[0196] Metal powder was filled into a recess in the first layer of the high-melting-point material. The metal powder consisted of 100% iron (Fe). Using a press, a pressure of 250 MPa was applied to the metal powder and the high-melting-point material surrounding it. In an air atmosphere, the high-melting-point material and metal powder were irradiated with 700 W microwaves for 180 seconds, heating the metal powder to 1350°C (estimated value) to obtain a cylindrical metal solid.

[0197] A second layer of high-melting-point material was formed on top of a first layer of high-melting-point material. The high-melting-point material consisted of 93% by mass of aluminum oxide (Al2O3) and 7% by mass of carbon (C). A circular aluminum plate was placed over the portion of the metal solid surrounded by the first layer of high-melting-point material where a recess was to be formed on the surface of the second layer of high-melting-point material. A curable material was sprayed onto the surface of the second layer of high-melting-point material, allowing the curable material to penetrate the portion of the second layer of high-melting-point material not covered by the aluminum plate. The curable material contained 50% by mass of UV-curable resin (Standard Photopolymer Resin, manufactured by AMZLAB GmbH) and 50% by mass of ethanol. Subsequently, UV light was irradiated onto the second layer of high-melting-point material to cure the curable resin that had penetrated it. The high-melting-point material that was covered by the aluminum plate and not cured was removed by an air shower. As a result, a cylindrical recess was formed in the second layer of high-melting-point material. The cylindrical recess had a base diameter of 7.0 mm and a depth of 2.4 mm. The upper surface of the metal solid, surrounded by the first layer of the high-melting-point material, was exposed through the recess, which was located in the second layer of the high-melting-point material.

[0198] Metal powder was filled into a recess in the second layer of the high-melting-point material. The metal powder consisted of 100% iron (Fe). Using a press, a pressure of 250 MPa was applied to the metal powder and the high-melting-point material surrounding it. In an air atmosphere, the high-melting-point material and the metal powder were irradiated with 700 W microwaves for 180 seconds, heating the metal powder to 1350°C (estimated value) to obtain a cylindrical metal solid. At this time, the metal solid surrounded by the first layer of the high-melting-point material and the metal solid surrounded by the second layer of the high-melting-point material bonded together.

[0199] Figure 12 shows a photograph of the metal solid obtained by sintering metal powder. The obtained metal solid was cylindrical, with a base diameter of 7.0 mm and a height of 6.6 mm. The density of the obtained metal solid was 4.1 g / cm³. 2 The relative density was 52%.

[0200] (Example 3) A layer of high melting point material was formed. The high melting point material consisted of 93% by mass of aluminum oxide (Al2O3) powder and 7% by mass of carbon (C) powder. The portion where recesses could be provided on the surface of the high melting point material layer was covered with a triangular aluminum plate, a curable material was sprayed onto the surface of the high melting point material layer, and the curable material was allowed to penetrate into the portion of the high melting point material layer not covered by the aluminum plate. The curable material contained 50% by mass of a UV curable resin (Standard Photopolymer Resin manufactured by AMZLAB GmbH) and 50% by mass of ethanol. Thereafter, the high melting point material layer was irradiated with UV light to cure the curable resin that had penetrated into the high melting point material layer. The high melting point material that was covered with the aluminum plate and not cured was removed by an air shower. As a result, triangular prism-shaped recesses were formed in the high melting point material layer. The length of the base of the bottom surface of the triangular prism-shaped recess was 8.0 mm and the depth was 1.4 mm.

[0201] The recesses provided in the high melting point material layer were filled with metal powder. The metal powder consisted of 100% iron (Fe). Using a press machine, a pressure of 250 MPa was applied to the metal powder and the high melting point material surrounding the metal powder. In an air atmosphere, the high melting point material and the metal powder were irradiated with 500 W of microwaves for 70 seconds to heat the metal powder to 1250 °C (estimated value). A photograph of the metal solid obtained by sintering the metal powder is shown in Fig. 13. The obtained metal solid was triangular prism-shaped, the length of the base of the bottom surface was 8.0 mm, and the height was 1.4 mm. The density of the obtained metal solid was 4.5 g / cm 2 and the relative density was 58%.

[0202] (Example 4) A layer of high-melting-point material was formed. The high-melting-point material consisted of 93% by mass of aluminum oxide (Al2O3) powder and 7% by mass of carbon (C) powder. The portion of the high-melting-point material layer where depressions were to be created was covered with a rectangular aluminum plate, and a curable material was sprayed onto the surface of the high-melting-point material layer, allowing the curable material to penetrate the portion of the high-melting-point material layer not covered by the aluminum plate. The curable material contained 50% by mass of UV-curable resin (Standard Photopolymer Resin, manufactured by AMZLAB GmbH) and 50% by mass of ethanol. Subsequently, the high-melting-point material layer was irradiated with UV light to cure the curable resin that had penetrated the high-melting-point material layer. The high-melting-point material that was covered by the aluminum plate and not cured was removed with an air shower. As a result, rectangular prism-shaped depressions were formed in the high-melting-point material layer. The length of one side of the bottom surface of the rectangular prism-shaped depression was 7.2 mm, and the depth was 1.9 mm.

[0203] Metal powder was filled into a recess in a layer of high-melting-point material. The metal powder consisted of 100% iron (Fe). A press was used to apply a pressure of 250 MPa to the metal powder and the high-melting-point material surrounding it. Under an air atmosphere, the high-melting-point material and metal powder were irradiated with 500 W microwaves for 70 seconds, heating the metal powder to 1250°C (estimated value). Figure 14 shows a photograph of the metal solid obtained by sintering the metal powder. The obtained metal solid was rectangular prism-shaped, with a base side length of 7.2 mm and a height of 1.9 mm. The density of the obtained metal solid was 4.5 g / cm³. 2 The relative density was 58%.

[0204] (Example 5) A cylindrical solid made of 99.8% copper (Cu) was prepared. The solid had a diameter of 7 mm and a height of 10 mm. A compact made by applying a pressure of 250 MPa to 99.8% copper (Cu) powder was placed on top of the solid. The compact was cylindrical in shape, with a diameter of 10 mm and a height of 2 mm. The compact was positioned so that its center coincided with the center of the solid.

[0205] A layer of high-melting-point material was formed around the solid and compacted material. The high-melting-point material consisted of 93% by mass of aluminum oxide (Al2O3) powder and 7% by mass of carbon (C) powder. A curable material was sprayed onto the surface of the high-melting-point material layer, causing the curable material to penetrate the high-melting-point material. The curable material contained 50% by mass of UV-curable resin (Standard Photopolymer Resin, manufactured by AMZLAB GmbH) and 50% by mass of ethanol. Subsequently, the high-melting-point material layer was irradiated with UV light to cure the curable resin that had penetrated the high-melting-point material layer.

[0206] While applying a pressure of 20 MPa to the solid and the compacted material, the compacted material, which was covered with a high-melting-point material, was irradiated with 700 W microwaves for 85 seconds, heating the compacted material to 800°C (estimated value). Figure 15 shows a photograph of the solid material after the compacted material has sintered and is coated with a copper metal film (metallic solid). The solid and the metal film were strongly bonded.

[0207] (Example 6) A cylindrical solid made of tool steel (SKD61) was prepared. The solid had a diameter of 10 mm and a height of 4 mm. A compacted powder, manufactured by applying a pressure of 1750 MPa to powdered tool steel (SKD61), was placed on top of the solid. The compacted powder was cylindrical in shape, with a diameter of 10 mm and a height of 4 mm. The compacted powder was positioned so that its center coincided with the center of the solid.

[0208] Similar to Example 5, a layer of high-melting-point material was formed around the solid and compacted material.

[0209] While applying a pressure of 20 MPa to the solid and the compacted material, the compacted material, which was covered with a high-melting-point material, was irradiated with 400 W microwaves for 1500 seconds, heating the compacted material to 1200°C (estimated value). Figure 16 shows a photograph of the solid material after the compacted material has sintered and is coated with a metal film (metallic solid) of tool steel. The solid and the metal film were strongly bonded.

[0210] (Example 7) A cylindrical solid made of carbon steel (S45C) was prepared. The solid had a diameter of 10 mm and a height of 10 mm. A compact made by applying a pressure of 250 MPa to aluminum alloy (A6061) powder was placed on top of the solid. The compact was cylindrical in shape, with a diameter of 10 mm and a height of 4 mm. The compact was positioned so that its center coincided with the center of the solid.

[0211] Similar to Example 5, a layer of high-melting-point material was formed around the solid and compacted material.

[0212] While applying a pressure of 20 MPa to the solid and the compacted material, the compacted material, which was covered with a high-melting-point material, was irradiated with 200 W microwaves for 1500 seconds, heating the compacted material to 400°C (estimated value). Figure 17 shows a photograph of the solid material after the compacted material has sintered and is coated with a metal film (metallic solid) of aluminum alloy. The solid and the metal film were strongly bonded.

[0213] (Example 8) A first cylindrical solid made of 99.8% copper (Cu) was prepared. The first solid had a diameter of 10 mm and a height of 10 mm. A compact made by applying a pressure of 250 MPa to 99.8% copper (Cu) powder was placed on top of the first solid as a binding metal. The compact was cylindrical in shape, with a diameter of 10 mm and a height of 3 mm. The compact was positioned so that its center coincided with the center of the first solid. A second cylindrical solid made of 99.8% copper (Cu) was placed on top of the compact. The second solid had a diameter of 10 mm and a height of 6 mm. The second solid was positioned so that its center coincided with the center of the compact.

[0214] Similar to Example 5, layers of high-melting-point material were formed around the first solid, the compacted powder, and the second solid.

[0215] A compacted powder covered with a high-melting-point material was irradiated with 700W microwaves for 135 seconds, heating the compacted powder to an estimated temperature of 800°C. Figure 18 shows a photograph of the bonded solid formed when the compacted powder sintered and the first and second solids bonded together. The first and second solids were strongly bonded.

[0216] (Example 9) A first cylindrical solid made of tool steel (SKD61) was prepared. The first solid had a diameter of 10 mm and a height of 10 mm. A compacted material, manufactured by applying a pressure of 1750 MPa to powdered tool steel (SKD61), was placed on top of the first solid as a binding metal. The compacted material was cylindrical in shape, with a diameter of 10 mm and a height of 3 mm. The compacted material was positioned so that its center coincided with the center of the first solid. A second cylindrical solid made of tool steel (SKD61) was placed on top of the compacted material. The second solid had a diameter of 10 mm and a height of 6 mm. The second solid was positioned so that its center coincided with the center of the compacted material.

[0217] Similar to Example 5, layers of high-melting-point material were formed around the first solid, the compacted powder, and the second solid.

[0218] Without applying pressure, a compacted powder covered with a high-melting-point material was irradiated with 400W microwaves for 2000 seconds, heating the compacted powder to an estimated 1200°C. The first solid and the second solid were strongly bonded together.

[0219] (Example 10) A first cylindrical solid made of tool steel (SKD61) was prepared. The diameter of the first solid was 10 mm and the height was 4 mm. A solid of tool steel (SKD61) was placed on top of the first solid as a bonding metal. The bonding metal was cylindrical in shape, with a diameter of 10 mm and a height of 4 mm. The bonding metal was positioned so that the center of the first solid and the center of the bonding metal coincided. A second cylindrical solid made of tool steel (SKD61) was placed on top of the bonding metal. The diameter of the second solid was 10 mm and the height was 4 mm. The second solid was positioned so that the center of the bonding metal and the center of the second solid coincided.

[0220] Similar to Example 5, layers of high-melting-point material were formed around the first solid, the binder metal, and the second solid.

[0221] While applying a pressure of 20 MPa to the first solid, the bonding metal, and the second solid, the bonding metal, which is covered with a high-melting-point material, was irradiated with 400 W microwaves for 2000 seconds, heating the bonding metal to 1200°C (estimated value). Figure 19 shows a photograph of the bonded solid formed when the bonding metal melted and solidified, and the first and second solids were bonded together. The first and second solids were strongly bonded. [Explanation of symbols]

[0222] 10...Stage, 20...Microwave irradiation section, 31...High melting point material placement section, 32...Curable material addition section, 33...Metal powder placement section, 40...Curing device, 50...Uncured material removal section, 60...Pressurization section, 101...Layer, 102...Part, 103...Concave, 200...Metal powder

Claims

1. Placing a metallic material on a solid, Covering at least a portion of the surrounding area of ​​the placed metal material with a high-melting-point material whose melting point is higher than that of the metal material, The process involves irradiating the metal material, which is covered with the high-melting-point material at least a portion of its surroundings, with microwaves to heat the metal material, sintering or melting and solidifying the metal material, and forming a metal solid bonded to the solid on the solid, Includes, The aforementioned high melting point material, A thermal insulation material that absorbs microwaves to a lower degree than the aforementioned metal material, comprising an oxide, An absorbing material that absorbs microwaves at a temperature range at least partially lower than the temperature range in which the metal material absorbs microwaves, comprising an absorbing material containing a carbon material, A mixture containing A method for producing a bound solid.

2. Placing the metal material on the metal solid, The high-melting-point material covers at least a portion of the surrounding metal material placed on the metal solid, The process involves irradiating the metal material on the metal solid, where at least a portion of the surrounding area is covered with the high-melting-point material, with microwaves to heat the metal material, sintering or melting and solidifying the metal material, and forming an additional metal solid on the metal solid. A method for producing a bound solid according to claim 1, further comprising:

3. A method for producing a bonded solid according to claim 2, wherein the stacked metal solids are formed.

4. A method for producing a bonded solid according to any one of claims 1 to 3, wherein the high melting point material comprises 1% by mass to 70% by mass of the absorbent material.

5. A method for producing a bonded solid according to any one of claims 1 to 4, wherein the thermal insulation material comprises at least one selected from the group consisting of aluminum oxide, silicon oxide, magnesium oxide, zirconium oxide, and titanium oxide.

6. A method for producing a bound solid according to any one of claims 1 to 5, wherein the absorbent material comprises at least one selected from the group consisting of carbon, graphite, silicon carbide, carbon resin, and metal carbides.

7. A method for producing a bonded solid according to any one of claims 1 to 6, wherein the metal material includes a metal.

8. A method for producing a bonded solid according to any one of claims 1 to 7, wherein the metal material comprises at least one selected from the group consisting of iron, nickel, copper, gold, silver, aluminum, and cobalt.

9. A method for producing a bonded solid according to any one of claims 1 to 8, wherein the metal material includes a metal compound.

10. A method for producing a bonded solid according to any one of claims 1 to 9, wherein the metal material comprises at least one compound selected from the group consisting of iron, nickel, copper, gold, silver, aluminum, and cobalt.

11. A method for producing a bonded solid according to any one of claims 7 to 10, wherein the metal material further comprises an alloy component.

12. The method for producing a bonded solid according to claim 11, wherein the alloy component comprises at least one selected from the group consisting of silicon, manganese, chromium, nickel, carbon, boron, copper, aluminum, titanium, niobium, vanadium, zinc, and sulfur.

13. A method for producing a bound solid according to any one of claims 1 to 12, wherein the metal material is a metal powder and the average particle size of the metal powder is 200 μm or less.

14. A method for producing a bonded solid according to any one of claims 1 to 13, wherein the metal material contains a metal oxide, and the metal material is reduced by irradiating the metal material with microwaves.

15. A method for manufacturing a bonded solid according to any one of claims 1 to 14, wherein the metal material contains a metal oxide, and the metal material is sintered by irradiating it with microwaves.

16. A method for producing a bound solid according to any one of claims 1 to 15, wherein the high melting point material forms a mold or container.

17. A method for producing a bound solid according to any one of claims 1 to 16, wherein the metal material is in the form of a compacted powder.

18. A method for producing a bonded solid according to any one of claims 1 to 17, further comprising applying pressure to the metal material before irradiating the metal material with microwaves.

19. The method for producing a bonded solid according to claim 18, wherein the pressure is from 0.1 MPa to 2000 MPa.

20. A method for producing a bonded solid according to any one of claims 1 to 19, further comprising applying pressure to the metal material while irradiating the metal material with microwaves.

21. The method for producing a bonded solid according to claim 20, wherein the pressure is from 0.1 MPa to 2000 MPa.

22. A method for producing a bonded solid according to any one of claims 1 to 21, further comprising irradiating the metal material with microwaves and then applying pressure to the metal material.

23. The method for producing a bonded solid according to claim 22, wherein the pressure is from 0.1 MPa to 2000 MPa.

24. A method for producing a bonded solid according to any one of claims 1 to 23, wherein the irradiation of the metal material with microwaves is performed in an inert gas atmosphere.

25. A method for producing a bonded solid according to any one of claims 1 to 24, wherein the irradiation of the metal material with microwaves is performed in a reducing atmosphere.

26. A method for producing a bonded solid according to any one of claims 1 to 25, wherein the metal material includes a metal oxide, and further comprises reducing the metal oxide before irradiating the metal material with microwaves.

27. Covering at least a portion of the surrounding area of ​​the arranged metal material with a high-melting-point material whose melting point is higher than that of the metal material is, Forming a layer of the aforementioned high melting point material, Forming recesses in the layer of the high melting point material, The solid and the metal material are placed in the recess, A method for producing a bound solid according to any one of claims 1 to 26, including the method described above.

28. Forming the recess in the layer of the high melting point material is A portion of the layer of the aforementioned high-melting-point material is hardened, Removing the uncured portion of the high-melting-point material layer, A method for producing a bound solid according to claim 27, including the method described in claim 27.

29. A method for producing a bonded solid according to claim 28, wherein curing a portion of the layer of the high-melting-point material includes including a curable material in the portion of the layer of the high-melting-point material.

30. A method for producing a bonded solid according to claim 29, wherein a curable material is impregnated into a portion of the layer of the high melting point material.

31. A method for producing a bonded solid according to any one of claims 28 to 30, wherein a portion of the layer of the high-melting-point material is cured by light irradiation.

32. The method involves placing a bonding metal between the first solid and the second solid, The arrangement of the bonding metal is covered with a high-melting-point material whose melting point is higher than that of the bonding metal, The bonding metal, in which at least a portion of its periphery is covered with the high-melting-point material, is heated by irradiating it with microwaves, and the bonding metal is sintered or melted and solidified to bond the first solid and the second solid. Includes, The aforementioned high melting point material, A thermal insulation material that absorbs microwaves to a lower degree than the bonding metal, comprising an oxide, An absorbing material that absorbs microwaves at a temperature range at least partially lower than the temperature range in which the bonding metal absorbs microwaves, comprising an absorbing material containing a carbon material, A mixture containing A method for producing a bound solid.

33. The method for producing a bonded solid according to claim 32, wherein the bonding metal is in powder form.

34. The method for producing a bonded solid according to claim 32, wherein the bonding metal is solid.

35. The method for producing a bonded solid according to claim 32, wherein the bonding metal is a liquid.

36. A method for producing a bonded solid according to any one of claims 32 to 35, wherein the high melting point material comprises 1% by mass to 70% by mass of the absorbent material.

37. A method for producing a bonded solid according to any one of claims 32 to 36, wherein the thermal insulation material comprises at least one selected from the group consisting of aluminum oxide, silicon oxide, magnesium oxide, zirconium oxide, and titanium oxide.

38. A method for producing a bound solid according to any one of claims 32 to 37, wherein the absorbent material comprises at least one selected from the group consisting of carbon, graphite, silicon carbide, carbon resin, and metal carbides.

39. A method for producing a bonded solid according to any one of claims 32 to 38, wherein the bonding metal includes a metal.

40. A method for producing a bonded solid according to any one of claims 32 to 39, wherein the bonding metal includes at least one selected from the group consisting of iron, nickel, copper, gold, silver, aluminum, and cobalt.

41. A method for producing a bonded solid according to any one of claims 32 to 40, wherein the bonding metal includes a metal compound.

42. A method for producing a bonded solid according to any one of claims 32 to 41, wherein the bonding metal comprises at least one compound selected from the group consisting of iron, nickel, copper, gold, silver, aluminum, and cobalt.

43. A method for producing a bonded solid according to any one of claims 39 to 42, wherein the bonding metal further comprises an alloy component.

44. The method for producing a bonded solid according to claim 43, wherein the alloy component comprises at least one selected from the group consisting of silicon, manganese, chromium, nickel, carbon, boron, copper, aluminum, titanium, niobium, vanadium, zinc, and sulfur.

45. A method for producing a bound solid according to any one of claims 32 to 44, wherein the binding metal is a powder and the average particle size of the binding metal is 200 μm or less.

46. A method for producing a bonded solid according to any one of claims 32 to 45, wherein the bonding metal includes a metal oxide, and the bonding metal is reduced when microwaves are irradiated onto the bonding metal.

47. A method for manufacturing a bonded solid according to any one of claims 32 to 46, wherein the bonding metal contains a metal oxide, and the bonding metal is sintered by irradiating the bonding metal with microwaves.

48. A method for producing a bonded solid according to any one of claims 32 to 47, wherein the high melting point material forms a mold or container.

49. The method for producing a bound solid according to claim 33 or 34, wherein the binding metal is in the form of a compacted powder.

50. A method for producing a bonded solid according to any one of claims 32 to 49, further comprising applying pressure to the bonded metal before irradiating the bonded metal with microwaves.

51. The method for producing a bonded solid according to claim 50, wherein the pressure is from 0.1 MPa to 2000 MPa.

52. A method for producing a bonded solid according to any one of claims 32 to 51, further comprising applying pressure to the bonded metal while irradiating the bonded metal with microwaves.

53. The method for producing a bonded solid according to claim 52, wherein the pressure is from 0.1 MPa to 2000 MPa.

54. A method for producing a bonded solid according to any one of claims 32 to 53, further comprising irradiating the bonded metal with microwaves and then applying pressure to the bonded metal.

55. The method for producing a bonded solid according to claim 54, wherein the pressure is from 0.1 MPa to 2000 MPa.

56. A method for producing a bonded solid according to any one of claims 32 to 55, wherein the bonding metal is irradiated with microwaves in an inert gas atmosphere.

57. Claim 32, wherein the irradiation of the bonding metal with microwaves is performed under a reducing atmosphere. A method for producing a bound solid according to any one of items 56 to 56.

58. A method for producing a bonded solid according to any one of claims 32 to 57, wherein the bonding metal includes a metal oxide, and further comprises reducing the metal oxide before irradiating the bonding metal with microwaves.

59. Covering at least a portion of the surrounding area of ​​the arranged bonding metal with a high-melting-point material whose melting point is higher than that of the bonding metal, Forming a layer of the aforementioned high melting point material, Forming recesses in the layer of the high melting point material, The first and second solids and the bonding metal are placed in the recess, A method for producing a bound solid according to any one of claims 32 to 58, including the method described above.

60. Forming the recess in the layer of the high melting point material is A portion of the layer of the aforementioned high-melting-point material is hardened, Removing the uncured portion of the high-melting-point material layer, A method for producing a bound solid according to claim 59, including the method described in claim 59.

61. A method for producing a bonded solid according to claim 60, wherein curing a portion of the layer of the high-melting-point material includes including a curable material in the portion of the layer of the high-melting-point material.

62. A method for producing a bonded solid according to claim 61, wherein a curable material is impregnated into a portion of the layer of the high melting point material.

63. A method for producing a bonded solid according to any one of claims 60 to 62, wherein a portion of the layer of the high-melting-point material is cured by light irradiation.

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