Semiconductor device manufacturing system, server, and semiconductor device manufacturing method

Abstract

The purpose of the present invention is to provide a semiconductor manufacturing system capable of generating a recipe that can be processed by a semiconductor manufacturing device at another base even when the device specifications are different. In this semiconductor device manufacturing system, in which a manufacturing condition of a first semiconductor manufacturing device (101) at a first base (A) is transmitted to a second semiconductor manufacturing device (111) at a second base (B) and a sample is processed by the second semiconductor manufacturing device (111), when the specifications of the first semiconductor manufacturing device (101) and the specifications of the second semiconductor manufacturing device (111) are different and the manufacturing conditions of the first semiconductor manufacturing device (101) are transmitted to the second semiconductor manufacturing device (111), manufacturing conditions generated by adapting parameter items in the manufacturing conditions of the first semiconductor manufacturing device (101) to parameter items in the manufacturing conditions of the second semiconductor manufacturing device (111) are transmitted to the second semiconductor manufacturing device (111).

Description

Technical Field

[0001] The present invention relates to a semiconductor device manufacturing system, a server, and a semiconductor device manufacturing method.

Background Art

[0002] Semiconductor manufacturing apparatuses have different recipes depending on the specifications of the apparatuses. Therefore, when preparing a recipe for a semiconductor manufacturing apparatus, it is basically necessary to send materials describing the recipe and exchange information on the evaluation results and the recipe by phone or in a meeting. A recipe is composed of a plurality of steps, and parameter conversion is required depending on the apparatus specifications. Conventionally, a person has confirmed the differences in apparatus specifications from a specification document and created a processable recipe by rewriting the parameters that need to be converted due to the specification differences.

[0003] On the other hand, Patent Document 1 discloses a technique for automatically converting a recipe (parameter file) for another exposure apparatus into a recipe adapted to itself (the exposure apparatus). Specifically, the recipe is changed to a parameter configuration adapted to the transfer destination apparatus, parameters and their values are acquired from a configuration file, and based on this, the values of each parameter of the converted recipe are changed and stored in a memory.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Conventional preparation of a recipe is basically based on sending materials describing the recipe and exchanging information on the evaluation results and the recipe by phone or in a meeting as described above. Therefore, a time lag occurs from when an evaluation request is received by phone or in a meeting until the evaluation starts, and it takes time to prepare the recipe.

[0006] Furthermore, if there are differences in equipment specifications between devices, it becomes necessary to convert the recipe parameters. Since this parameter conversion is done manually, conversion errors can cause equipment trouble and failure. Recipe verification requires checking the parameter conversion items due to differences in equipment specifications at every step, which is an enormous amount of work time.

[0007] On the other hand, Patent Document 1 describes a system that converts recipes from one exposure device to another so that equivalent results are obtained when transferring them to a different exposure device. However, this system has the problem that it cannot convert recipes if the specifications and configurations of the devices are different.

[0008] In view of the above problems, the present invention aims to provide a semiconductor device manufacturing system, server, and semiconductor device manufacturing method that can generate recipes that can be processed by semiconductor manufacturing equipment at other locations, even if the equipment specifications differ. [Means for solving the problem]

[0009] To achieve the above objective, one representative semiconductor manufacturing system of the present invention is a semiconductor device manufacturing system in which the manufacturing conditions of a first semiconductor manufacturing apparatus at a first site are transferred to a second semiconductor manufacturing apparatus at a second site and a sample is processed by the second semiconductor manufacturing apparatus, wherein the specifications of the first semiconductor manufacturing apparatus and the specifications of the second semiconductor manufacturing apparatus are different and the manufacturing conditions of the first semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus, in the manufacturing conditions of the first semiconductor manufacturing apparatus First The parameter items in the manufacturing conditions of the second semiconductor manufacturing apparatus Second The manufacturing conditions generated by matching the parameter items are transferred to the second semiconductor manufacturing apparatus. Furthermore, the second parameter item differs from the first parameter item due to the difference in specifications between the first semiconductor manufacturing equipment and the second semiconductor manufacturing equipment. It is characterized by the following:

[0010] Furthermore, one semiconductor manufacturing method of the present invention is a semiconductor device manufacturing method in which the manufacturing conditions of a first semiconductor manufacturing apparatus at a first site are transferred to a second semiconductor manufacturing apparatus at a second site and a sample is processed by the second semiconductor manufacturing apparatus, and the specifications of the first semiconductor manufacturing apparatus and the specifications of the second semiconductor manufacturing apparatus are different, and the manufacturing conditions of the first semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus, First The parameter items in the manufacturing conditions of the second semiconductor manufacturing apparatus Second The manufacturing conditions generated by matching the parameter items are transferred to the second semiconductor manufacturing apparatus. Furthermore, the second parameter item differs from the first parameter item due to the difference in specifications between the first semiconductor manufacturing equipment and the second semiconductor manufacturing equipment. It is characterized by the following: [Effects of the Invention]

[0011] According to the present invention, it is possible to generate recipes that can be processed by semiconductor manufacturing equipment at other locations, even if the equipment specifications differ. Other issues, configurations, and effects will be clarified by the following embodiments. [Brief explanation of the drawing]

[0012] [Figure 1] Figure 1 is a block diagram of a computer system for carrying out an embodiment of the present disclosure. [Figure 2] Figure 2 is a system configuration diagram showing one embodiment of the semiconductor device manufacturing system of the present invention. [Figure 3] Figure 3 shows an example of the processing flow from selecting a recipe to be evaluated to transferring the evaluation results in this invention. [Figure 4] Figure 4 shows an example of the process flow for generating a recipe according to the present invention. [Modes for carrying out the invention]

[0013] A description of an embodiment for carrying out the present invention will be given.

[0014] <Computer system for implementing the embodiments> Figure 1 is a block diagram of a computer system 1 for carrying out an embodiment of the present disclosure. Mechanisms and apparatus of various embodiments disclosed herein may be applied to any suitable computing system. The main components of computer system 1 include one or more processors 2, memory 4, terminal interface 12, storage interface 14, I / O (input / output) device interface 16, and network interface 18. These components may be interconnected via a memory bus 6, an I / O bus 8, a bus interface unit 9, and an I / O bus interface unit 10.

[0015] Computer system 1 may include one or more processing units 2A and 2B collectively referred to as processor 2. Each processor 2 executes instructions stored in memory 4 and may include an onboard cache. In one embodiment, computer system 1 may have multiple processors, and in another embodiment, computer system 1 may be a system with a single processing unit. Examples of processing units include CPU (Central Processing Unit), FPGA (Field-Programmable Gate Array), GPU (Graphics Processing Unit), DSP (Digital Signal Processor), etc.

[0016] In some embodiments, memory 4 may include random-access semiconductor memory, storage devices, or storage media (either volatile or non-volatile) for storing data and programs. In some embodiments, memory 4 represents the entire virtual memory of computer system 1 and may include the virtual memory of other computer systems connected to computer system 1 via a network. While memory 4 may be considered conceptually as a single entity, in other embodiments, memory 4 may have a more complex configuration, such as a hierarchy of caches and other memory devices. For example, memory may exist as multiple levels of caches, and these caches may be divided by function. As a result, one cache may hold instructions, and other caches may hold non-instruction data used by the processor. Memory may be distributed and associated with various different processing units, as in so-called NUMA (Non-Uniform Memory Access) computer architectures.

[0017] Memory 4 may store all or part of the programs, modules, and data structures that implement the functions described in this specification. For example, memory 4 may store the latent factor identification application 50. In certain embodiments, the latent factor identification application 50 may include instructions or descriptions that execute the functions described below on processor 2, or may include instructions or descriptions that are interpreted by other instructions or descriptions. In certain embodiments, the latent factor identification application 50 may be implemented in hardware via semiconductor devices, chips, logic gates, circuits, circuit cards, and / or other physical hardware devices instead of or in addition to a processor-based system. In certain embodiments, the latent factor identification application 50 may include data other than instructions or descriptions. In certain embodiments, a camera, sensor, or other data input device (not shown) may be provided to communicate directly with the bus interface unit 9, processor 2, or other hardware of the computer system 1. In such a configuration, the need for processor 2 to access memory 4 and the latent factor identification application may be reduced.

[0018] The computer system 1 may include a bus interface unit 9 for communication between the processor 2, memory 4, display system 24, and I / O bus interface unit 10. The I / O bus interface unit 10 may be connected to an I / O bus 8 for transferring data to and from various I / O units. The I / O bus interface unit 10 may communicate via the I / O bus 8 with a plurality of I / O interface units 12, 14, 16, and 18, also known as I / O processors (IOPs) or I / O adapters (IOAs). The display system 24 may include a display controller, display memory, or both. The display controller can provide video, audio, or both data to the display device 26. The computer system 1 may also include one or more devices such as sensors configured to collect data and provide that data to the processor 2. The display memory may be dedicated memory for buffering video data. The display system 24 may be connected to a display device 26, such as a standalone display screen, television, tablet, or portable device. In one embodiment, the display device 26 may include speakers for rendering audio. Alternatively, a speaker for rendering audio may be connected to an I / O interface unit. In other embodiments, the functions provided by the display system 24 may be implemented by an integrated circuit including a processor 2. Similarly, the functions provided by the bus interface unit 9 may be implemented by an integrated circuit including a processor 2.

[0019] The I / O interface unit is equipped with the function of communicating with various storage or I / O devices. For example, the terminal interface unit 12 can be attached with user I / O devices 20 such as user output devices like video display devices and speaker TVs, and user input devices like keyboards, mice, keypads, touch pads, trackballs, buttons, light pens, or other pointing devices. The user can use the user interface to operate the user input device, thereby inputting input data and instructions to the user I / O device 20 and the computer system 1, and receiving output data from the computer system 1. The user interface may be displayed on a display device, reproduced by a speaker, or printed via a printer, for example, via the user I / O device 20.

[0020] The storage interface 14 can be attached with one or more disk drives and direct access storage devices 22 (usually magnetic disk drive storage devices, but may also be an array of disk drives configured to appear as a single disk drive or other storage devices). In certain embodiments, the storage device 22 may be implemented as any secondary storage device. The content of the memory 4 may be stored in the storage device 22 and read from the storage device 22 as needed. The network interface 18 may provide a communication path for the computer system 1 and other devices to communicate with each other. This communication path may be, for example, the network 30.

[0021] The computer system 1 shown in Figure 1 has a bus structure that provides a direct communication path between the processor 2, memory 4, bus interface 9, display system 24, and I / O bus interface unit 10. In other embodiments, the computer system 1 may include point-to-point links in a hierarchical, star, or web configuration, multiple hierarchical buses, and parallel or redundant communication paths. Furthermore, although the I / O bus interface unit 10 and I / O bus 8 are shown as a single unit, in practice, the computer system 1 may have multiple I / O bus interface units 10 or multiple I / O buses 8. Also, although multiple I / O interface units are shown to isolate the I / O bus 8 from various communication paths leading to various I / O devices, in other embodiments, some or all of the I / O devices may be directly connected to a single system I / O bus.

[0022] In one embodiment, computer system 1 may be a device that receives requests from other computer systems (clients) that do not have a direct user interface, such as a multi-user mainframe computer system, a single-user system, or a server computer. In another embodiment, computer system 1 may be a desktop computer, a portable computer, a laptop computer, a tablet computer, a pocket computer, a telephone, a smartphone, or any other suitable electronic device.

[0023] <System Configuration Diagram> Figure 2 is a system configuration diagram showing one embodiment of the semiconductor device manufacturing system of the present invention.

[0024] Figure 2 illustrates the case of having three bases: base A, base B, and base C. Here, a base is a location where a specific activity takes place, and information can be exchanged within each base via an independent network. Specific examples of bases include company offices, research laboratories, and production plants. For example, a "production base" refers to a location with production equipment and facilities where production and related activities can be carried out.

[0025] Site A is equipped with a semiconductor manufacturing line PC group 101, an internal PC 100, a gateway PC 102, a data routing PC 103, and a server 104. The gateway PC 102, data routing PC 103, and server 104 are located on an integrated platform 108 at Site A. Site A is configured to exchange information with external PCs 121 and remote monitors 106 used by other sites and teleworkers via the internet 107.

[0026] Site B is equipped with a group of semiconductor manufacturing line PCs 111, an in-site PC 110, and a server 114. Server 114 is installed on an integrated platform 118 located at Site B. Site B is configured to exchange information with other sites, external PCs 121, and remote monitors 106 via the internet 117.

[0027] Site C is equipped with an internal PC 120 and a server 124. Server 124 is installed on an integrated platform 128 located at Site C. Site C is configured to exchange information with other sites, external PCs 121, and remote monitors 106 via the internet 127.

[0028] Sites A and B are equipped with semiconductor manufacturing equipment and capable of processing samples, etc. Furthermore, sites A and B are equipped with equipment for evaluation, such as semiconductor inspection equipment, semiconductor analysis equipment, and semiconductor analytical equipment. Semiconductor manufacturing equipment may include etching equipment, as well as plasma CVD equipment, ashing equipment, surface modification equipment, etc. Sites A and B can be envisioned as semiconductor manufacturing plants, but are not limited to this. For example, they may be development lines or prototyping lines. Semiconductor inspection equipment, semiconductor analysis equipment, and semiconductor analytical equipment are used to inspect, analyze, and evaluate the evaluation targets processed by the semiconductor manufacturing equipment. Sites A, B, and C may have at least one of each. Site C, on the other hand, is an example that does not have semiconductor manufacturing equipment.

[0029] Integrated platforms 108, 118, and 128 can be applied as a common platform where gateway PCs, data routing PCs, and servers can be deployed. However, the examples shown for sites B and C do not include the deployment of gateway PCs and data routing PCs.

[0030] The semiconductor manufacturing line PC group 101 controls the semiconductor manufacturing equipment and other components that make up the manufacturing line at site A. Based on processing recipes related to process sequences and control parameters, the semiconductor manufacturing line PC group 101 controls the semiconductor manufacturing equipment at site A and acquires data indicating the results of the processing performed by the semiconductor manufacturing equipment. The acquired data is sent to the server 104 via the gateway PC 102. The semiconductor manufacturing line PC group 101 is composed of multiple computers, or it can be composed of a single computer. Similarly, the semiconductor manufacturing line PC group 101 can also control semiconductor inspection equipment, semiconductor analysis equipment, and semiconductor analytical equipment at site A.

[0031] The semiconductor manufacturing line PC group 111 controls the semiconductor manufacturing equipment and other components that make up the manufacturing line at site B. Based on processing recipes related to process sequences and control parameters, the semiconductor manufacturing line PC group 111 controls the semiconductor manufacturing equipment at site B and acquires data indicating the results of the processing performed by the semiconductor manufacturing equipment. The acquired data is sent to the server 114. The semiconductor manufacturing line PC group 111 is composed of multiple computers. It is also possible for it to be composed of a single computer. Similarly, the semiconductor manufacturing line PC group 111 can also control semiconductor inspection equipment, semiconductor analysis equipment, and semiconductor analytical equipment at site B.

[0032] Servers 104 and 114 record the equipment specifications of semiconductor manufacturing equipment belonging to their respective sites. Servers 104, 114, and 124 can also store the equipment specifications of semiconductor manufacturing equipment at other sites. They may also obtain equipment specifications from other sites. Servers 104, 114, and 124 also record recipes and equipment specifications of semiconductor manufacturing equipment belonging to their own site or other sites that have been evaluated in the past. A recipe is the conditions for processing (e.g., machining) the object to be evaluated using that semiconductor manufacturing equipment. For example, an etching machine, which is a semiconductor manufacturing device, may include processing conditions for performing etching. Furthermore, recipes may also include recipes for inspection, analysis, and analytical processing for semiconductor inspection equipment, semiconductor analysis equipment, and semiconductor analytical equipment. Equipment specifications are the specifications for operating the corresponding semiconductor manufacturing equipment, etc., and include various parameter items as described later in Figure 4. The range of each parameter is determined by the equipment specifications, and the recipe is the state in which these parameters are defined.

[0033] PC 100 at site A can access the semiconductor manufacturing line PC group 101, the integrated platform 108, and the server 104. PC 110 at site B can access the semiconductor manufacturing line PC group 111, the integrated platform 118, and the server 114. PC 120 at site C can access the integrated platform 128 and the server 124. In addition, PCs 100, 110, and 120 at each site can access the integrated platforms and servers at other sites via authentication described later. Furthermore, external PC 121 and remote monitor 106 can access the integrated platforms and servers at each site via authentication described later.

[0034] At site A, for example, a processing recipe for etching using semiconductor manufacturing equipment is entered into the semiconductor manufacturing line PC group 101 and executed. After execution, the etching equipment transmits the instruction values ​​according to the recipe to each device within the etching equipment, and the etching process is carried out. The processed recipe is saved in the semiconductor manufacturing line PC group 101.

[0035] The etched wafers are transported to a semiconductor inspection device, semiconductor analysis device, or semiconductor analytical device within site A. The measurement recipes are then entered into the semiconductor manufacturing line PC group 101, and the predetermined measurements are performed. The measurement results are stored in the semiconductor manufacturing line PC group 101.

[0036] The data routing configuration PC 103 determines whether access is permitted and defines the flow of data. The semiconductor manufacturing line PC group 101 assigns a device ID (identification information) to each semiconductor manufacturing device, stores and manages it as a device master along with the file extension of the output data stored, and sends it to the server 104 for storage as a device master. Specifically, the semiconductor manufacturing line PC group 101 assigns a device ID to each semiconductor manufacturing device, manages the file extension of the output data output from the semiconductor manufacturing device in association with each device ID, and stores it in the server 104 as a device master. Examples of file extensions include ".txt" for text data, ".gif" for image data, and ".csv" for CSV files.

[0037] When accessing the semiconductor manufacturing line PC group 101, the system refers to the device master, which includes the device ID and file extension, and collects only data that matches the device master. This program is deployed on the gateway PC 102. The data collection program built into the gateway PC 102 accesses the semiconductor manufacturing line PC group 101 and collects data according to the data flow defined above. The collected data is stored on the server 104 at the site.

[0038] Server 104 may manage data by dividing it into publicly accessible data and restricted data for external network communication. This management can be done within a database, categorized or leveled accordingly. For example, publicly accessible data may be allowed to communicate with other locations, while restricted data may be prohibited from doing so. Such regulations are defined in the data routing configuration PC 103.

[0039] Sites B and C do not have a gateway PC 102 or a data routing PC 103. Even in such sites, the data collection program of the gateway PC 102 can be used as a substitute. For example, at site B, a system could be built to collect and save data by operating a PC 110 within the site, or a system could be built to collect and save data from the semiconductor manufacturing line PC group 111 to the server 114 without user operation. Similarly, at site C, a system could be built to collect and save data from other sites by operating a PC 120 within the site. Furthermore, as a substitute for the data routing PC 103, access permissions and data flow regulations can be set by granting or denying access depending on the storage location. This makes it possible to operate a system similar to that of the gateway PC 102 or data routing PC 103 even without them.

[0040] To log in to the integrated platform 108 at site A, authentication information is registered. This registration can be done on an internal PC 100 or an external PC 121. The authentication information consists of a user ID and password, and authentication is performed upon login. The user logs in to the integrated platform 108 from the internal PC 100 or an external PC 121 using the registered authentication information. After that, the user registers the device master within the integrated platform 108. By using the integrated platform 108, data can be sent and received to other sites.

[0041] For example, when sending data from server 104 at site A to integrated platform 118 at site B, the user ID and password registered on integrated platform 108 at site A must also be registered on integrated platform 118. This prevents unauthorized access to data within the integrated platform from external networks. Alternatively, authentication on the integrated platform at another site can be configured to be limited to data transfer only, preventing access to or editing of the database. This prevents the leakage of confidential information to other sites. On the other hand, by providing a function to allow the reception of data sent from other sites, information from other sites can be shared.

[0042] For example, let's consider the case of transferring data from site B to site A. Here, the user ID and password are registered in the integrated platform 108 at site A and the integrated platform 118 at site B. First, the user selects the data to be transferred to site A from the database of the server 114 at site B. This selection can be made on an internal PC 110 or an external PC 121 at site B. Then, the internal PC 110 or external PC 121 at site B passes authentication on the integrated platform 118 via the internet 117 and accesses the server 114 at site B. The data at site B that was initially selected then passes authentication on the integrated platform 108 at site A and is transferred to and stored on the server 104.

[0043] Site C, which does not have semiconductor manufacturing equipment, cannot perform etching, but it can transfer recipes to other sites. This makes it possible to perform etching by requesting evaluation from other sites that do have semiconductor manufacturing equipment. Furthermore, when transferring recipes for semiconductor manufacturing equipment, the recipes are converted so that they can be processed by the semiconductor manufacturing equipment at the destination site before the transfer is performed.

[0044] The computer system 1 shown in Figure 1 may also be applied to the semiconductor manufacturing line PC group 101, 111, the in-site PCs 100, 110, the gateway PC 102, the data routing PC 103, and the servers 104, 114, 124 shown in Figure 2. These may also be equipped with a GUI (Graphical User Interface) for the user to input parameter values. Furthermore, the semiconductor manufacturing line PC group 101, 111 may be semiconductor manufacturing equipment (including a computer within the semiconductor manufacturing equipment).

[0045] <Processing flow> Figure 3 shows an example of the processing flow from selecting a recipe to be evaluated to transferring the evaluation results in the present invention. In Figure 3, the flow from evaluation request to transfer of evaluation results is explained using the example of transferring a recipe for semiconductor manufacturing equipment such as an etching apparatus from base C to base B.

[0046] In step S1, the user selects the recipe and the destination device. The user selects the semiconductor manufacturing equipment recipe to be evaluated and the semiconductor manufacturing equipment to which the recipe will be transferred from the database on server 124 at site C. In this case, the information for the destination semiconductor manufacturing equipment recipe for the evaluation target is not available on server 124 at site C. The user selects the semiconductor manufacturing equipment recipe on server 124 at site C that is most suitable for the manufacturing of the evaluation target. This selection is made using an internal PC 120 at site C or an external PC 121 used by teleworkers, etc. The internal PC 120 performs the selection within site C, while the external PC 121 performs the selection via the internet 127, passing through authentication on the integrated platform 128. When transferring a recipe from server 124, the user registers the device ID of the semiconductor manufacturing equipment to be used and the recipe together on server 124 at site C, which is their own site.

[0047] Next, in step S2, the differences in equipment specifications are checked. This process is performed on server 124. Specifically, the equipment specifications of the semiconductor manufacturing equipment associated with the recipe selected in step S1 are compared with the equipment specifications of the semiconductor manufacturing equipment at the transfer destination. These equipment specifications are stored on server 124 at site C. Equipment identification is performed based on the equipment ID assigned to each equipment stored on server 124 at site C. Based on the confirmed differences in equipment specifications, it is determined whether or not conversion of each parameter used in the equipment specifications is necessary. If it is determined that parameter conversion is necessary, the process proceeds to step S3. On the other hand, if it is determined that parameter conversion is not necessary, steps S3 and S4 are skipped and the process proceeds to step S5.

[0048] The device specifications define each parameter required for the recipe. Differences in device specifications in step S2 include, for example, the type of power supply, the presence or absence of hardware functions, the presence or absence of software functions, differences in parameter control range, and the presence or absence of connected gases.

[0049] In step S3, the recipe is converted and the converted recipe is saved. This process is performed on server 124. If it is determined that parameter conversion is necessary due to differences in equipment specifications, the parameters are converted based on the parameter conversion items to match the parameter items of the destination semiconductor manufacturing equipment. This generates a recipe that can be processed by the destination semiconductor manufacturing equipment. The generated recipe is saved on server 124 at site C, linked to the equipment ID of the destination semiconductor manufacturing equipment. It is saved as a new recipe, rather than overwriting any existing recipes stored on server 124.

[0050] Next, in step S4, the conversion points and consistency of the recipe are checked and notified. This process is performed by server 124. The consistency of the recipe is checked to confirm whether the converted recipe can be processed by the semiconductor manufacturing equipment at the destination. Specifically, the recipe consistency check items of the equipment specifications of the semiconductor manufacturing equipment at the destination are read and checked to see if the recipe can be processed. If the recipe consistency check determines that it can be processed, the converted parameter items are saved to server 124 at site C. At this time, the site PC 120, external PC 121, and remote monitor 106 are notified that the recipe conversion has been successfully completed. If the consistency check determines that it cannot be processed, the server 124 at site C records the parameter items that caused problems in the consistency check, the converted parameter items, and the differences in equipment specifications, and notifies the user. In this case, the notification is sent to the site PC 120 and external PC 121. In this case, the user can modify the recipe and generate a recipe that can be processed by the semiconductor manufacturing equipment at the destination by performing input operations based on the notified and recorded information via the site PC 120 or external PC 121.

[0051] Next, in step S5, the recipe is transferred to the destination server. In this process, the transfer is performed on server 124, and the saving is performed on server 114. Specifically, the recipe to be transferred is transferred to base B via the integrated platform 128 at base C and the integrated platform 118 at base B. This is done via the internet 127 and the internet 117. The transferred recipe is saved in the database held by server 114 at base B.

[0052] Next, in step S6, the evaluation results obtained from the evaluation are saved to the server. The recipe, which will serve as the evaluation request and has been transferred to the server 114 at site B, is read from the server 114 at site B to the semiconductor manufacturing line PC group 111 at site B. Then, the actual processing is carried out using the semiconductor manufacturing equipment at site B. The processed evaluation target is evaluated using at least one of the semiconductor inspection equipment, semiconductor analysis equipment, or semiconductor analyzer at site B. The calculation of the evaluation here can be done on the semiconductor manufacturing line PC group 111. The evaluation checks whether the evaluation target is approaching the target shape, the amount of material removed, the degree of processing, etc. Transport from the semiconductor manufacturing equipment to the semiconductor inspection equipment or semiconductor analysis equipment may be automated by the control of the semiconductor manufacturing line PC group 111. In this way, the data obtained from the evaluation is collected in a database on the server 114 at site B. Data collection can be performed using a system that substitutes the gateway PC as described in Figure 2. Alternatively, the data may be registered to the server 114 by operation by the user on PCs 110, 120 within the site or an external PC 121.

[0053] Next, in step S7, the evaluation results are sent to the requesting server. Specifically, the evaluation results obtained in step S6 are transferred from server 114 at site B to server 124 at site C via the internet 117 and 127. At this time, the evaluation result data passes through the integrated platform 118 at site B and the integrated platform at site C. This makes it possible to share the evaluation results with other sites.

[0054] Furthermore, it is possible to request evaluations based on the evaluation results of base B, with additional processing. By registering the recipe you want to have evaluated in the database on server 124 at base C and transferring the recipe, it is also possible to continue evaluations using other bases besides base B.

[0055] <Specific example of recipe conversion process> In steps S3 and S4 of Figure 3, the recipe is converted, and it is determined whether the converted recipe is processable. A specific example of this is explained below.

[0056] For example, if the output before conversion cannot be used due to differences in the power supply of the semiconductor manufacturing equipment, the upper limit of the power supply specified in the destination equipment specifications will be changed. If the upper limit can be changed to match the power supply of the destination equipment specifications, the consistency check will determine that the converted recipe can be processed, and a notification will be issued indicating that the recipe conversion has been successfully completed. This will enable the use of the power supply in the destination semiconductor manufacturing equipment. If it cannot be matched, the consistency check will determine that processing is impossible, and the result will be notified and recorded. In this case, the upper limit of the power supply will be a parameter item.

[0057] For example, if the destination device specifications include an increased number of stage temperature control items, resulting in a new parameter that did not originally exist, a new parameter item will be set. In this case, the temperature of the new parameter can be calculated based on a pre-prepared conversion table, and the new parameter item can be calculated on server 124. At this time, it is also expected that the stage cooling water temperature setting will be affected. In this case, the recipe value will be changed so that both the stage temperature and the cooling water temperature are within the control range. If the new parameter item can be changed to conform to the stage temperature control of the destination device specifications, the consistency check will determine that the converted recipe is processable, and a notification will be sent indicating that the recipe conversion has been successfully completed. If it is not compatible, the consistency check will determine that it is not processable, and the result will be notified and recorded.

[0058] For example, if the etching gas to be used is not available in the destination device, it will be necessary to switch to an alternative etching gas. In this case, the system will notify the user that a recipe modification is required.

[0059] <Recipe generation process> Figure 4 shows an example of the process flow for generating a recipe in the present invention. Step S3 in Figure 3 generates a recipe by transforming parameters, and here we will explain an example of parameter transformation.

[0060] When generating a recipe, if there are differences in device specifications, it is necessary to convert, add, or delete unnecessary parameters to match the parameter items of the destination device specifications. A simplified example will be explained using Figure 4.

[0061] Recipe 301 for device specification A is stored on server 331, and parameters 1 to 4 shown in recipe 301 are set. When transferring a recipe for device specification A to a device with device specification B, the difference in device specifications is checked before transferring the recipe. The difference in device specifications is determined by comparing the device specifications based on the device ID assigned to each device stored on server 331. If there is a difference in device specifications, the parameters that need to be converted are determined based on the parameter conversion table. If it is determined that parameter conversion is necessary, the recipe is converted based on the parameter conversion table so that it becomes recipe 303 that can be processed by the device with device specification B. This recipe conversion involves deleting unnecessary parameters, adding new parameters, and converting existing parameters.

[0062] After the recipe conversion, the conversion details and the modified recipe are saved to the database on server 331. Specifically, the differences in device specifications between device specification A and device specification B, as well as the parameter conversions, additions, and deletions made as part of the recipe conversion, are recorded as information on the server. The user is then notified of the converted recipe items, allowing them to confirm the parameter changes.

[0063] For example, in device specification A, it is assumed that temperature control is controlled by parameters 3 and 4. On the other hand, in device specification B, temperature control is done using only parameter 3, so parameter 4 is unnecessary and can be deleted. Also, parameter 5 does not exist in device specification A, but it does exist in device specification B. In this case, parameter 5 is added. As mentioned above, the value of the newly added parameter can be calculated from other parameters based on the conversion parameter and entered, or an initial value can be entered. In addition, the value of parameter 2 has been converted from "100" to "110". This value can be changed using a conversion formula predetermined in a parameter conversion table, etc., based on the difference in device specifications.

[0064] For example, if the temperature control range increases from three to four parameters, the fourth parameter can be set based on the data from the remaining three parameters to maintain the same temperature control. The setting method involves preparing a calculation formula in advance and generating the fourth parameter through the server 331's processing. Additionally, newly required parameters, such as parameter 5 in Figure 4, can have their initial values ​​entered. In device specification B, if the initial value is 5, then the value 5 is entered. This initial value can be pre-recorded in the parameter conversion items of the server 331. This initial value can also be entered via the server 331.

[0065] Furthermore, errors may occur due to malfunctions, such as in parameter 1 of recipe 302 after conversion to device specification B. In recipe 302, the error is recorded as "Parameter 1=4 (Error)". In such cases, the recipe needs to be modified by the user.

[0066] Examples of possible causes of errors include: 1. Failure to register conversion parameter items. 2. Failure to register information regarding the latest software or problems arising from data updates. 3. User-initiated problems due to user-specific parameter settings. For example, parameters set by the user may not be within the acceptable range. 4. Equipment-related problems, such as the etching gas not being connected.

[0067] If an error occurs, the error will be notified when the consistency of the recipe conversion is confirmed. In the example in Figure 3, this corresponds to step S4, and the notification is sent to the on-site PC 120, the external PC 121, and the remote monitor 106. The user can understand the cause of the error by checking the notified error details and conversion items. Furthermore, based on the cause of the error, the user will use the recipe editor 313 in the example in Figure 4 to perform a process to eliminate the error (inputting "0" for parameter 1). This process to eliminate the error may involve changing the problematic conversion parameter item or updating the software data. As a result, the user will use the recipe editor 313 to change the parameters so that processing according to device specification B is possible. The created recipe is saved to the server 331, linked to the device ID of the destination device specification B, and the changed items are recorded as history.

[0068] Note that server 331 in Figure 4 is shown in Figure 2 In this example, server 124 corresponds to the recipe editor 313 in Figure 4. 2 In this example, PC120 within the base station and PC121 externally would be the corresponding components.

[0069] <Effects> The above-described embodiment enables the transfer of semiconductor manufacturing recipes between different locations. Furthermore, transfer and evaluation from locations without semiconductor manufacturing equipment becomes possible. Even if the specifications of the corresponding semiconductor manufacturing equipment differ, the recipe can be accurately modified and applied. In particular, by modifying, deleting, and adding parameters to match the equipment specifications, the recipe can be effectively applied even when equipment specifications differ. This reduces the time required to transfer the recipe to semiconductor manufacturing equipment at another location and begin evaluation. Additionally, data can be sent and received via the integrated platform at each location, facilitating information sharing between locations. This reduces the manual process of converting and verifying recipes, prevents equipment problems due to errors, and shortens working time. Furthermore, requiring authentication from the integrated platform when the server within each location transmits data enhances security. Additionally, if an error occurs when modifying a recipe, the user is notified, and the user can input the changes, increasing versatility.

[0070] It should be noted that the present invention is not limited to the embodiments described above, and various modifications are included. For example, the embodiments described above are described in detail to make the present invention easier to understand, and are not necessarily limited to those having all the configurations described. Furthermore, it is possible to replace parts of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add configurations from other embodiments to the configuration of one embodiment. In addition, it is possible to add, delete, or replace parts of the configuration of each embodiment with other configurations.

[0071] For example, Figure 2 shows an example with three locations A, B, and C, but there can be multiple locations, and even more than three locations. Furthermore, it is up to decide whether or not to equip each location with a gateway PC, a data routing PC, and a group of semiconductor manufacturing line PCs.

[0072] Furthermore, while "PC" in the semiconductor manufacturing line PC group 101, 111, in-site PCs 100, 110, gateway PC 102, and data route setting PC 103 refers to a small computer such as a personal computer, it is not limited to this and can be applied to any general computer. For example, it does not have to be a PC terminal; it can be a virtual area, server, or mobile terminal. Also, various communication methods can be applied. For example, it is not limited to SMB (Server Message Block) communication, but can also be FTP (File Transfer Protocol) communication or NFS (Network File System) communication, and conversely, the remote monitor 106 can have the same effect even if it is a PC.

[0073] Furthermore, while Figure 3 illustrates the flow of recipe transfer from site C to site B, it is not limited to this. For example, the same applies to recipe transfer flows from site C to site A, from site B to site A, and from site A to site B. For instance, when transferring a recipe from site A to site B, the recipe for the semiconductor manufacturing equipment at site A can be adapted to the recipe for the semiconductor manufacturing equipment at site B before transfer.

[0074] Furthermore, while Figures 2 to 4 illustrate the equipment specifications and recipes for semiconductor manufacturing equipment, these methods can be similarly applied to evaluation equipment such as semiconductor inspection equipment, semiconductor analysis equipment, and semiconductor analytical equipment.

[0075] This specification also includes disclosures of the following aspects: (Aspect 1) In a semiconductor device manufacturing system in which the manufacturing conditions of a first semiconductor manufacturing apparatus at a first site are transferred to a second semiconductor manufacturing apparatus at a second site, and the sample is processed by the second semiconductor manufacturing apparatus, A semiconductor device manufacturing system characterized in that, when the specifications of the first semiconductor manufacturing apparatus and the specifications of the second semiconductor manufacturing apparatus are different and the manufacturing conditions of the first semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus, the manufacturing conditions generated by adapting the parameter items in the manufacturing conditions of the first semiconductor manufacturing apparatus to the parameter items in the manufacturing conditions of the second semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus.

[0076] (Aspect 2) In the semiconductor manufacturing system described in Embodiment 1, A semiconductor device manufacturing system characterized in that adapting the parameter items in the manufacturing conditions of the first semiconductor manufacturing apparatus to the parameter items in the manufacturing conditions of the second semiconductor manufacturing apparatus includes deleting, converting, or adding the parameters.

[0077] (Aspect 3) In the semiconductor manufacturing system described in Embodiment 2, A semiconductor device manufacturing system characterized in that the deletion of the aforementioned parameters is a process of deleting parameters that are not used by the second semiconductor manufacturing apparatus.

[0078] (Aspect 4) In the semiconductor manufacturing system described in Embodiment 2 or Embodiment 3, A semiconductor device manufacturing system characterized in that the conversion of the parameters is a process that converts them to satisfy the range of parameters specified by the specifications of the second semiconductor manufacturing apparatus.

[0079] (Appendix 5) In the semiconductor manufacturing system described in any of Embodiments 2 to 4, The semiconductor device manufacturing system is characterized in that the addition of the aforementioned parameters is a process of adding new parameters when new parameters are required for the second semiconductor manufacturing apparatus.

[0080] (Aspect 6) In the semiconductor manufacturing system described in Embodiment 5, A semiconductor device manufacturing system characterized in that the value of the new parameter is a value calculated from a preset initial value or other parameters.

[0081] (Aspect 7) In the semiconductor manufacturing system described in any of Embodiments 1 to 6, A semiconductor device manufacturing system characterized by having a GUI for the user to input parameter values ​​when there are parameters that cannot be matched.

[0082] (Pattern 8) In the semiconductor manufacturing system described in any of Embodiments 1 to 7, Equipped with a platform on which the application is implemented, A semiconductor device manufacturing system characterized by transferring the manufacturing conditions of the first semiconductor manufacturing equipment at the first site to the second semiconductor manufacturing equipment at the second site using the aforementioned application.

[0083] (Aspect 9) In a server that transfers the manufacturing conditions of a first semiconductor manufacturing apparatus at a first site to a second semiconductor manufacturing apparatus at a second site and processes the sample using the second semiconductor manufacturing apparatus, A server characterized in that, when the specifications of the first semiconductor manufacturing apparatus and the specifications of the second semiconductor manufacturing apparatus are different and the manufacturing conditions of the first semiconductor manufacturing apparatus are to be transferred to the second semiconductor manufacturing apparatus, the server transfers to the second semiconductor manufacturing apparatus the manufacturing conditions generated by adapting the parameter items in the manufacturing conditions of the first semiconductor manufacturing apparatus to the parameter items in the manufacturing conditions of the second semiconductor manufacturing apparatus.

[0084] (Aspect 10) A semiconductor device manufacturing method in which the manufacturing conditions of a first semiconductor manufacturing apparatus at a first site are transferred to a second semiconductor manufacturing apparatus at a second site, and a sample is processed by the second semiconductor manufacturing apparatus, A semiconductor device manufacturing method characterized in that, when the specifications of the first semiconductor manufacturing apparatus and the specifications of the second semiconductor manufacturing apparatus are different and the manufacturing conditions of the first semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus, the manufacturing conditions generated by adapting the parameter items in the manufacturing conditions of the first semiconductor manufacturing apparatus to the parameter items in the manufacturing conditions of the second semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus. [Explanation of Symbols]

[0085] 1...Computer system, 2...Processor, 2A, 2B...Processing unit, 4...Memory, 6...Memory bus, 8...I / O bus, 9...Bus interface unit, 10...I / O bus interface unit, 12...Terminal interface unit, 14...Storage interface, 16...I / O device interface, 18...Network interface, 20...User I / O device, 22...Storage device, 24...Display system, 26...Display device, 30...Network, 50...Latent factor identification application, 100...In-site PC, 101 ...Semiconductor manufacturing line PC group, 102...Gateway PC, 103...Data routing PC, 104...Server, 106...Remote monitor, 107...Internet, 108...Integrated platform, 110...On-site PC, 111...Semiconductor manufacturing line PC group, 114...Server, 117...Internet, 118...Integrated platform, 120...On-site PC, 121...External PC, 124...Server, 127...Internet, 128...Integrated platform, 301...Recipe, 302...Recipe, 303...Recipe, 313...Recipe editor, 331...Server

Claims

1. In a semiconductor device manufacturing system in which the manufacturing conditions of a first semiconductor manufacturing apparatus at a first site are transferred to a second semiconductor manufacturing apparatus at a second site, and the sample is processed by the second semiconductor manufacturing apparatus, When the specifications of the first semiconductor manufacturing apparatus and the specifications of the second semiconductor manufacturing apparatus are different, and the manufacturing conditions of the first semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus, the manufacturing conditions generated by adapting the first parameter item in the manufacturing conditions of the first semiconductor manufacturing apparatus to the second parameter item in the manufacturing conditions of the second semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus. A semiconductor device manufacturing system characterized in that the second parameter item differs from the first parameter item due to the difference between the specifications of the first semiconductor manufacturing apparatus and the specifications of the second semiconductor manufacturing apparatus.

2. In the semiconductor device manufacturing system according to claim 1, A semiconductor device manufacturing system characterized in that adapting the first parameter item to the second parameter item includes deleting, converting, or adding parameters.

3. In the semiconductor device manufacturing system according to claim 2, A semiconductor device manufacturing system characterized in that the deletion of the aforementioned parameters is a process of deleting parameters that are not used by the second semiconductor manufacturing apparatus.

4. In the semiconductor device manufacturing system according to claim 2, A semiconductor device manufacturing system characterized in that the conversion of the parameters is a process that converts them to satisfy the range of parameters defined by the specifications of the second semiconductor manufacturing apparatus.

5. In the semiconductor device manufacturing system according to claim 2, The semiconductor device manufacturing system is characterized in that the addition of the aforementioned parameters is a process of adding new parameters when new parameters are required for the second semiconductor manufacturing apparatus.

6. In the semiconductor device manufacturing system according to claim 5, A semiconductor device manufacturing system characterized in that the value of the new parameter is a value calculated from a preset initial value or other parameters.

7. In the semiconductor device manufacturing system according to claim 1, A semiconductor device manufacturing system characterized by having a GUI for the user to input parameter values ​​when there are parameters that cannot be matched.

8. In the semiconductor device manufacturing system according to claim 1, Equipped with a platform on which the application is implemented, A semiconductor device manufacturing system characterized by transferring the manufacturing conditions of the first semiconductor manufacturing apparatus at the first site to the second semiconductor manufacturing apparatus at the second site using the aforementioned application.

9. In a server that transfers the manufacturing conditions of a first semiconductor manufacturing apparatus at a first site to a second semiconductor manufacturing apparatus at a second site and processes the sample using the second semiconductor manufacturing apparatus, When the specifications of the first semiconductor manufacturing apparatus and the specifications of the second semiconductor manufacturing apparatus are different, and the manufacturing conditions of the first semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus, the manufacturing conditions generated by adapting the first parameter item in the manufacturing conditions of the first semiconductor manufacturing apparatus to the second parameter item in the manufacturing conditions of the second semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus. A server characterized in that the second parameter item differs from the first parameter item due to the difference between the specifications of the first semiconductor manufacturing equipment and the specifications of the second semiconductor manufacturing equipment.

10. A semiconductor device manufacturing method in which the manufacturing conditions of a first semiconductor manufacturing apparatus at a first site are transferred to a second semiconductor manufacturing apparatus at a second site, and a sample is processed by the second semiconductor manufacturing apparatus, When the specifications of the first semiconductor manufacturing apparatus and the specifications of the second semiconductor manufacturing apparatus are different, and the manufacturing conditions of the first semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus, the manufacturing conditions generated by adapting the first parameter item in the manufacturing conditions of the first semiconductor manufacturing apparatus to the second parameter item in the manufacturing conditions of the second semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus. A semiconductor device manufacturing method characterized in that the second parameter item differs from the first parameter item due to the difference between the specifications of the first semiconductor manufacturing apparatus and the specifications of the second semiconductor manufacturing apparatus.

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