Light source device

Abstract

A light source device (100) is provided with: a substrate (10) having a support surface (10A); a first sub-mount (20) having a first upper surface (20A) and a first mounting surface (20B) opposing the support surface (10A); one or more laser diodes (30) positioned between the substrate (10) and the first sub-mount (20) and having a p-side electrode surface (30B) and an n-side electrode surface (30A); a side wall section (15) provided on the substrate (10), having a second upper surface (15A) and an inner wall surface (15C), and defining by the inner wall surface (15C) a space (V) in which the laser diode (30) is housed; a heat dissipation member (60) provided on the first sub-mount (20); and, a metal member (50) joined to the heat dissipation member (60) and the second upper surface (15A) to seal the space (V). The height from the support surface (10A) to the first upper surface (20A) is different from the height from the support surface (10A) to the second upper surface (15A). One of the p-side electrode surface (30B) and the n-side electrode surface (30A) is directly or indirectly joined to the support surface (10A). The other of the p-side electrode surface (30B) and the n-side electrode surface (30A) is joined to the first mounting surface (20B).

Description

Technical Field

[0001] The present disclosure relates to a light source device.

Background Art

[0002] A light-emitting device having a sealing structure for sealing a space inside a package in which a laser diode is housed has been developed. Patent Document 1 discloses a light-emitting device including an upper substrate, a lower substrate facing the upper substrate, a submount supporting a laser diode, and a wavelength converter. In this light-emitting device, the laser diode is disposed between a lower substrate to which the submount is joined and the upper substrate. A space for sealing the laser diode by the wavelength converter is formed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Embodiments of the present disclosure provide a new sealing structure for hermetically sealing a space inside a package in which a laser diode is housed.

Means for Solving the Problems

[0005] In non-limiting and exemplary embodiments, the light source device of the present disclosure comprises: a substrate having a support surface; a first submount having a first mounting surface facing the support surface and a first upper surface located on the opposite side of the first mounting surface; one or more laser diodes located between the substrate and the first submount and having a p-side electrode surface and an n-side electrode surface located on the opposite side of the p-side electrode surface; a side wall portion provided on the substrate and having a second upper surface and an inner wall surface, the inner wall surface defining a space in which the laser diodes are housed; a heat dissipation member provided on the first submount; and a metal member bonded to the heat dissipation member and the second upper surface to seal the space. The height from the support surface to the first upper surface is different from the height from the support surface to the second upper surface. One of the p-side electrode surface or the n-side electrode surface is directly or indirectly bonded to the support surface, and the other of the p-side electrode surface or the n-side electrode surface is bonded to the first mounting surface. [Effects of the Invention]

[0006] According to exemplary embodiments of this disclosure, a novel sealing structure is provided for hermetically sealing a space within a package in which a laser diode is housed. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a cross-sectional view parallel to the YZ plane of a light source device according to the first embodiment of this disclosure. [Figure 2] Figure 2 is a cross-sectional view parallel to the XY plane of a light source device according to the first embodiment of this disclosure. [Figure 3] Figure 3 is a plan view of the light source device according to the first embodiment of this disclosure, viewed from above in the direction normal to the support surface of the substrate. [Figure 4] Figure 4 is a cross-sectional view parallel to the YZ plane of a light source device according to the first embodiment of this disclosure, in which an external connection electrode is provided on the support surface of a substrate. [Figure 5] Figure 5 is a cross-sectional view parallel to the YZ plane of another configuration example of the light source device according to the first embodiment of this disclosure. [Figure 6]Figure 6 is a cross-sectional view parallel to the YZ plane of yet another configuration example of the light source device according to the first embodiment of this disclosure. [Figure 7] Figure 7 is a cross-sectional view parallel to the YZ plane of a light source device equipped with a further heat dissipation member according to the first embodiment of the present disclosure. [Figure 8] Figure 8 is a cross-sectional view parallel to the XY plane of a light source device comprising a plurality of laser diodes according to the first embodiment of the present disclosure. [Figure 9] Figure 9 is a cross-sectional view parallel to the YZ plane of a modified example of the light source device according to the first embodiment of this disclosure. [Figure 10] Figure 10 is a cross-sectional view parallel to the XY plane of a modified example of the light source device according to the first embodiment of this disclosure. [Figure 11] Figure 11 is a plan view of a modified example of the light source device according to the first embodiment of this disclosure, viewed from above in the direction normal to the support surface of the substrate. [Figure 12] Figure 12 is a cross-sectional view parallel to the YZ plane of another modification of the light source device according to the first embodiment of this disclosure. [Figure 13] Figure 13 is a cross-sectional view parallel to the YZ plane of yet another modification of the light source device according to the first embodiment of this disclosure. [Figure 14] Figure 14 is a cross-sectional view parallel to the YZ plane of yet another modification of the light source device according to the first embodiment of this disclosure. [Figure 15] Figure 15 is a plan view of the retaining member as seen from above, from the direction normal to the support surface of the substrate. [Figure 16] Figure 16 is a cross-sectional view parallel to the YZ plane of yet another modification of the light source device according to the first embodiment of this disclosure. [Figure 17] Figure 17 is a plan view of the metal component as seen from above, from the direction normal to the support surface of the substrate. [Figure 18] Figure 18 is a cross-sectional view parallel to the YZ plane of yet another modification of the light source device according to the first embodiment of the present disclosure. [Figure 19] Figure 19 is a plan view of another example of a metal component, viewed from above in the direction normal to the support surface of the substrate. [Figure 20] FIG. 20 is a cross-sectional view parallel to the XY plane of the light source device according to the second embodiment of the present disclosure. [Figure 21] FIG. 21 is a plan view of the second submount in a state of supporting two laser diodes, two conductive members, and a support member in a top view seen from the normal direction of the support surface of the substrate.

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The following embodiments are examples, and the light source device according to the present disclosure is not limited to the following embodiments. For example, the numerical values, shapes, materials, steps, the order of those steps, etc. shown in the following embodiments are merely examples, and various modifications are possible as long as there is no technical contradiction. Also, the various aspects described below are merely examples, and various combinations are possible as long as there is no technical contradiction.

[0009] The dimensions, shapes, etc. of the components shown in the drawings may be exaggerated for clarity and may not reflect the actual dimensions, shapes, and size relationships between components in the light source device. Also, in order to avoid making the drawings overly complex, the illustration of some elements may be omitted.

[0010] In the following description, components having substantially the same function may be denoted by a common reference numeral, and the description may be omitted. Terms indicating a specific direction or position (e.g., "up", "down", "right", "left", and other terms including those terms) may be used. However, those terms are only used for clarity to indicate the relative direction or position in the referenced drawing. As long as the relative direction or position relationship by terms such as "up", "down", etc. in the referenced drawing is the same, the arrangement in the referenced drawing does not have to be the same in other drawings, actual products, manufacturing apparatuses, etc. outside the present disclosure.

[0011] In this specification or in the claims, polygons such as triangles and quadrilaterals are not limited to polygons in a mathematically strict sense, but also include shapes in which the corners of a polygon have been rounded, chamfered, or otherwise modified. Furthermore, shapes in which modifications have been made not only to the corners (ends of the sides) of a polygon, but also to the middle part of the sides are also referred to as polygons. In other words, any shape that retains the shape of a polygon as a base but has been partially modified is included in the definition of a "polygon."

[0012] In this specification or in the claims, when there are multiple elements identified by a certain name, and each element is to be expressed in a distinct way, an ordinal number such as "first," "second," etc. may be added to the beginning of each element. These ordinal numbers are merely labels to distinguish the objects to which they are attached. There is no special meaning in their number, order, or sequence. For example, if the term "first submount" is used in claim 1 of the claims, but the term "second submount" is not used, the invention according to claim 1 may have only one submount, and its light-emitting element may be the "second submount," not limited to the "first submount" in the specification.

[0013] (First Embodiment) An example of the configuration of the light source device 100 according to the first embodiment of this disclosure will be described with reference to Figures 1 to 3. The accompanying drawings show mutually orthogonal X, Y, and Z axes.

[0014] Figure 1 is a cross-sectional view of the light source device 100 parallel to the YZ plane. The cross-section shown in Figure 1 includes the cross-sections of the laser diode 30 and the conductive member 40. The laser beam L emitted in the Z direction from the output end face 30E of the laser diode 30 is shown by a dashed line. Figure 2 is a cross-sectional view of the light source device 100 parallel to the XY plane. The cross-section shown in Figure 2 includes the output end face 30E of the laser diode 30. Figure 3 is a plan view of the light source device 100 in a top view as seen from the direction normal to the support surface 10A of the substrate 10.

[0015] The light source device 100 according to this embodiment comprises a substrate 10, a first submount 20, a second submount 25, one or more laser diodes 30, a conductive member 40, a metal member 50, and a heat dissipation member 60. In the example shown in Figures 1 and 2, the light source device 100 comprises one laser diode 30. However, as will be described later, the light source device 100 may comprise multiple laser diodes 30. Depending on the product specifications or requirements, the light source device 100 may comprise a protective element such as a Zener diode and / or a temperature sensor for measuring the internal temperature such as a thermistor. Furthermore, the light source device 100 may comprise a photodetector such as a photodiode for monitoring the intensity of the laser light L emitted from the laser diode 30.

[0016] As illustrated in Figure 3, the shape of the light source device 100 is rectangular when viewed from above in the direction normal to the support surface 10A of the substrate 10, i.e., in the Y direction. However, the shape of the light source device is not limited to this. In Figures 1 to 3, the direction normal to the support surface 10A coincides with the Y direction. In the following description, "top view" means the top view seen from the direction normal to the support surface 10A, i.e., in the Y direction. For example, the size of the light source device 100 in the X direction is approximately 1.0 mm to 30.0 mm, and the size in the Z direction is approximately 1.0 mm to 5.0 mm. The thickness of the thickest part of the light source device 100 in the Y direction may be approximately 1.0 mm to 3.0 mm.

[0017] In this embodiment, the substrate 10 is a plate-shaped member. The substrate 10 has a support surface 10A that directly or indirectly supports the laser diode 30, and a bottom surface 10B located on the opposite side of the support surface 10A. A metal film such as gold may be formed on the support surface 10A of the substrate 10 for bonding with other members such as the side wall portion 15 and the second submount 25. The substrate 10 can be formed using ceramic, metal, silicone, resin, etc. as the main material. For example, when using ceramic, aluminum nitride, silicon nitride, aluminum oxide, silicon, silicon carbide, etc. can be used as the main material of the substrate. When using metal, copper, aluminum, iron, and composite materials such as copper molybdenum, copper-diamond composite material, copper tungsten, etc. can be used as the main material of the substrate. However, when using metal, insulation treatment is required on the support surface 10A and the bottom surface 10B in order to provide a conductor wiring layer on the substrate. Alternatively, the area directly beneath the laser diode 30 may be formed of metal, and the other areas may be formed of ceramic.

[0018] The substrate 10 has a conductive wiring layer and external connection electrodes that are electrically connected to the laser diode 30. The conductive wiring layer and external connection electrodes may be formed from metallic materials such as tungsten, molybdenum, nickel, gold, silver, platinum, titanium, copper, aluminum, and ruthenium. Conductive wiring layers are provided on the support surface 10A and the interior of the substrate 10, and external connection electrodes 11 and 12 may be provided on the bottom surface 10B of the substrate 10. The conductive wiring layer provided on the support surface 10A and the external connection electrodes 11 and 12 provided on the bottom surface 10B are electrically connected via conductive wiring layers and via holes provided inside the substrate 10.

[0019] External connection electrode 11 is electrically connected to either the p-side electrode surface or the n-side electrode surface of the laser diode 30. External connection electrode 12 is electrically connected to the other of the p-side electrode surface or the n-side electrode surface of the laser diode 30. For example, an external power supply or an external drive circuit for driving the laser diode 30 can be electrically connected to the laser diode 30 via the external connection electrodes 11 and 12. The external connection electrodes 11 and 12 do not need to be provided on the lower surface 10B as illustrated in Figure 1, but may be provided on the support surface 10A, for example.

[0020] Figure 4 is a cross-sectional view of a light source device 101 parallel to the YZ plane, in which external connection electrodes 11 and 12 are provided on the support surface 10A. The external connection electrodes 11 and / or 12 can be provided on the support surface 10A. As illustrated in Figure 4, the size of the substrate 10 in a top view may be made larger than the size of the side wall portion 15, and the external connection electrodes 11 and 12 may be provided in the area outside the side wall portion 15 of the support surface 10A.

[0021] The side wall portion 15 is provided to surround the laser diode 30 and is joined to the support surface 10A. The side wall portion 15 has a second upper surface 15A, a lower surface 15B, and an inner wall surface 15C. The inner wall surface 15C surrounds the laser diode 30 and defines the space V in which the laser diode 30 is housed. The lower surface 15B of the side wall portion 15 is joined to the support surface 10A of the substrate 10. The joining can be achieved via a joint formed from an inorganic or organic material. The joint can be formed, for example, by sintering, brazing, soldering, ultrasonic welding, resistance welding, laser welding, etc. The material of the joint can be, for example, a metal such as gold-tin or solder alloy, a metal paste such as gold paste or silver paste, or metal foil. However, when using a laser diode that emits blue or green light, it is preferable to avoid using organic materials considering the effect of dust collection by the laser light.

[0022] The side wall portion 15 is positioned on the support surface 10A to intersect the laser beam L emitted from the laser diode 30, and transmits the laser beam L. At least the portion of the side wall portion 15 that transmits the laser beam L can be formed from a material such as alkali glass, alkali-free glass, sapphire, phosphor-containing glass, or transparent ceramic material. "Alkali glass" is Na + Ka + Li + This is a silicate compound glass containing mobile ions of alkali metal elements such as [specific alkali metal elements]. Silicate compound glass in which the concentration of alkali oxides is 0.1% by mass or less is called "alkali-free glass". Examples of silicate compound glass include silicate glass, borosilicate glass, and quartz glass. The portion of the side wall 15 that does not transmit laser light L may be formed from, for example, silicon, glass, ceramic, or the same material as the substrate 10 described above.

[0023] In this embodiment, the substrate 10 and the side wall portion 15 are separate components. The components of the substrate 10 and the side wall portion 15 may be collectively referred to as the "package." The package may be formed by integrally forming the substrate 10 and the side wall portion 15.

[0024] The laser diode 30 includes a p-side electrode, an n-side electrode, and a semiconductor multilayer structure including a p-side semiconductor layer, an n-side semiconductor layer, and an active layer located between these layers. By applying a voltage to the p-side electrode and the n-side electrode and causing a current to flow inside, laser light L is emitted from the output end face 30E of the laser diode 30. In this embodiment, the laser diode 30 is an end-face output type having an output end face 30E from which laser light L is emitted. The laser diode 30 may have multiple light-emitting points.

[0025] In this embodiment, the surface of the n-side electrode is referred to as the "n-side electrode surface 30A," and the surface of the p-side electrode is referred to as the "p-side electrode surface 30B." The laser diode 30 has a p-side electrode surface 30B and an n-side electrode surface 30A located on the opposite side of the p-side electrode surface 30B.

[0026] The laser diode 30 can be, for example, a laser diode that emits blue light, a laser diode that emits green light, or a laser diode that emits red light. Alternatively, a laser diode that emits light other than visible light, such as near-infrared or ultraviolet light, may be used.

[0027] In this specification, blue light is light with an emission peak wavelength in the range of 420 nm to 494 nm. Green light is light with an emission peak wavelength in the range of 495 nm to 570 nm. Red light is light with an emission peak wavelength in the range of 605 nm to 750 nm.

[0028] Examples of laser diodes that emit blue light or green light include laser diodes containing nitride semiconductors. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. Examples of laser diodes that emit red light include those containing InAlGaP, GaInP, GaAs, and AlGaAs semiconductors.

[0029] The laser light emitted from the laser diode has a spread in both the fast and slow axis directions, forming an elliptical far-field pattern (hereinafter referred to as "FFP") in a plane parallel to the laser light's exit end face. The laser light diverges more in the fast axis direction than in the slow axis direction. The FFP is defined by the light intensity distribution of the laser light at a position away from the exit end face. In this light intensity distribution, the peak intensity value is 1 / e 2 The portion having the above intensity may be called the beam cross-section. In the example shown in Figure 1, the optical axis of the laser beam L emitted from the laser diode 30 is parallel to the Z direction. The fast axis direction and the slow axis direction are parallel to the Y direction and the X direction, respectively. Here, parallelism may include an error of ±5 degrees or less. However, the optical axis of the laser beam L does not have to be parallel to the Z direction.

[0030] As illustrated in Figure 1, the laser beam L, after being emitted from the exit end face 30E of the laser diode 30, diverges and spreads in the velocity axis direction, i.e., the Y direction. For this reason, it is preferable that the laser beam L is collimated or focused by an optical system including a lens. Such an optical system may be provided inside or outside the light source device 100.

[0031] The first submount 20 and the second submount 25 are heat dissipation members, and are typically rectangular parallelepipeds. However, the shape of each submount is not limited to this. Each submount plays a role in dissipating the heat generated from the laser diode 30. From the viewpoint of further improving heat dissipation, it is preferable that each submount be formed from a material with a higher thermal conductivity than the laser diode 30. For example, ceramic materials such as aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide; metallic materials such as copper, aluminum, silver, iron, nickel, molybdenum, tungsten, and copper-molybdenum; or diamond can be used.

[0032] The first submount 20, as shown in Figure 2, has a first mounting surface 20B facing the support surface 10A of the substrate 10, and a first upper surface 20A located on the opposite side of the first mounting surface 20B. The first submount 20 has a first wiring layer 21 on the first mounting surface 20B which is electrically connected to the laser diode 30. In the example shown in Figures 1 and 2, the n-side electrode surface 30A of the laser diode 30 is bonded to the first wiring layer 21. This causes the laser diode 30 to be in thermal contact with and electrically connected to the first submount 20. Here, the term "thermally contact" means not only that the electrode surface is indirectly in contact with the submount via a solid conductive material, but also that the electrode surface is in direct contact with the submount.

[0033] The n-side electrode surface 30A of the laser diode 30 and the first wiring layer 21 can be joined via a joining member. The joining member is, for example, a metal bump containing a metal such as gold, silver, copper, aluminum, gold-tin, or solder, or a metal paste containing a conductive metal such as gold or gold-tin. Using these, the n-side electrode surface 30A can be joined to the first wiring layer 21. Unless otherwise specified, the "joint portion" described below may be formed from the joining member described above.

[0034] The second submount 25 has a lower surface 25B that is bonded to the support surface 10A, and a second mounting surface 25A located on the opposite side of the lower surface 25B, as illustrated in Figure 2. The second mounting surface 25A faces the first mounting surface 20B of the first submount 20. The second submount 25 has a second wiring layer 26 on its second mounting surface 25A that is electrically connected to the laser diode 30. The lower surface 25B can be bonded to the support surface 10A of the substrate 10 via a joint.

[0035] A laser diode 30 is positioned on the second mounting surface 25A of the second submount 25. Via holes may be provided in the second submount 25. In the example shown in Figures 1 and 2, the laser diode 30 is bonded to the support surface 10A via the second submount 25. More specifically, the p-side electrode surface 30B of the laser diode 30 may be bonded to the second wiring layer 26 via a junction. The p-side electrode surface 30B is electrically connected to the conductor wiring layer of the substrate 10 via a via hole that electrically connects the second wiring layer 26 to the conductor wiring layer provided on the lower surface 25B of the second submount 25.

[0036] The first submount 20 and the second submount 25 are positioned to sandwich the laser diode 30. By sandwiching the laser diode 30 between the pair of submounts, the heat generated from the laser diode 30 can be efficiently dissipated to the first submount 20 and the second submount 25, respectively. This heat dissipation effect is thought to be further improved by reducing the thickness of the laser diode 30 to a few micrometers.

[0037] In the example of the light source device 100 shown in Figures 1 and 2, the size of the first submount 20 is equal to the size of the second submount 25. However, the size of the first submount 20 may be different from the size of the second submount 25. For example, in a top view, the first submount 20 The outer edge , second submount 25 surrounding It's fine to have it, or conversely, the second submount 25 The outer edge , the first submount 20 surrounding It is permissible. In the Y direction, the first submount 20 may be thicker or thinner than the second submount 25.

[0038] As described above, the n-side electrode surface 30A of the laser diode 30 is joined to the first wiring layer 21 of the first submount 20. The p-side electrode surface 30B is joined to the second wiring layer 26 of the second submount 25. However, it is also possible to reverse the orientation of the n-side electrode surface 30A and the p-side electrode surface 30B, so that the n-side electrode surface 30A is joined to the second wiring layer 26 and the p-side electrode surface 30B is joined to the first wiring layer 21.

[0039] One of the p-side electrode surface 30B or the n-side electrode surface 30A of the laser diode 30 may be bonded to the support surface 10A of the substrate 10, and the other of the p-side electrode surface 30B or the n-side electrode surface 30A may be bonded to the first mounting surface 20B of the first submount 20. Here, the bonding of one of the p-side electrode surface 30B or the n-side electrode surface 30A to the support surface 10A means that one of them is bonded to the support surface 10A directly or indirectly. In this embodiment, the p-side electrode surface 30B is indirectly bonded to the support surface 10A of the substrate 10 via the second submount 25, and the n-side electrode surface 30A is bonded to the first mounting surface 20B of the first submount 20. If the second submount 25 is not present, the p-side electrode surface 30B may be directly bonded to the support surface 10A of the substrate 10. Through this connection, the external connection electrode 11 is electrically connected to the p-side electrode surface 30B, and the external connection electrode 12 is electrically connected to the n-side electrode surface 30A via the conductive member 40.

[0040] The laser diode 30 is indirectly mounted on the support surface 10A of the substrate 10, bonded to the second submount 25. The laser diode 30 is located between the substrate 10 and the first submount 20. However, the laser diode 30 can also be directly bonded to the support surface 10A without going through the second submount 25. Therefore, the second submount 25 is not necessarily an essential component in this embodiment. However, by using the second submount 25, heat dissipation can be improved. In addition, it is possible to adjust the position of the light-emitting point of the laser diode 30 in the height direction, i.e., the Y direction, relatively easily by adjusting the thickness of the second submount 25.

[0041] The conductive member 40 is a member formed from a metal such as gold, silver, copper, or aluminum. The conductive member 40 can be molded to have the same thickness as the laser diode 30. The conductive member 40 has an upper surface facing the first mounting surface 20B of the first submount 20, and a lower surface located on the opposite side of the upper surface and joined to the second mounting surface 25A. The conductive member 40 is, for example, a rectangular parallelepiped, but is not limited to this shape as long as it has a lower surface that joins to the second mounting surface 25A.

[0042] The conductive member 40 is bonded to the first submount 20 and the second submount 25, electrically connecting the first wiring layer 21 and the second wiring layer 26. Specifically, the lower surface of the conductive member 40 is bonded to the second wiring layer 26 provided on the second mounting surface 25A. The upper surface of the conductive member 40 is bonded to the first wiring layer 21 provided on the first mounting surface 20B. The conductive member 40 can be bonded to the second wiring layer 26 and the first wiring layer 21 via the joint. As a result, the n-side electrode surface 30A of the laser diode 30 is electrically connected to the first wiring layer 21 and the second wiring layer 26. Consequently, the n-side electrode surface 30A can be electrically connected to the external connection electrode 12 provided on the lower surface 10B of the substrate 10. With this wiring example, conventional wire bonding, which involves drawing a wire such as gold from the n-side electrode surface 30A to the second wiring layer 26, becomes unnecessary, thus simplifying the wiring work and streamlining the manufacturing process. However, the n-side electrode surface 30A and the second wiring layer 26 may be electrically connected by wire bonding without using the conductive member 40.

[0043] By aligning the height of the conductive member 40 in the Y direction with the height of the laser diode 30, it becomes easier to bond the laser diode 30 and the conductive member 40, respectively, to the first submount 20 and the second submount 25, while maintaining the parallelism between the first mounting surface 20B and the second mounting surface 25A. Here, parallelism includes an error of ±5 degrees.

[0044] In this embodiment, the metal member 50 functions as a package cap that hermetically seals the space V housing the laser diode 30. An example of the metal member 50 is a metal foil. The thickness of the metal foil in this embodiment is generally 10 μm to 300 μm. Examples of base materials for the metal foil include aluminum, copper, gold, Kovar, titanium, stainless steel, tungsten, beryllium copper, titanium, nickel, silver, platinum, and nichrome. , Mo At least one of the group consisting of ribdenum and niobium, or an alloy thereof, is used.

[0045] The base material is preferably covered with a metal film formed from at least one material selected from the group consisting of, for example, gold, platinum, titanium, nickel, chromium, palladium, and ruthenium. The metal film can be formed on the surface of the base material by a film formation treatment such as sputtering or plating.

[0046] The heat dissipation member 60 illustrated in Figures 1 and 2 is a rectangular parallelepiped, similar to the first submount 20 or the second submount 25, but is not limited thereto. The heat dissipation member 60 may be formed from the same material as the submount described above. The heat dissipation member 60 is mounted on the first submount 20. In other words, the heat dissipation member 60 is located above the first submount 20. The heat dissipation member 60 has a lower surface 60B that faces the first upper surface 20A of the first submount 20.

[0047] The metal member 50 is joined to the first upper surface 20A of the first submount 20, the lower surface 60B of the heat dissipation member 60, and the second upper surface 15A of the side wall portion 15. The joining can be performed, for example, with the same materials and methods as the joining of the lower surface 15B of the side wall portion 15 and the support surface 10A of the substrate 10 described above.

[0048] The hermetically sealed structure using the metal member 50 is not limited to the examples shown in Figures 1 and 2. The metal member 50 is joined to the entire second upper surface 15A, but it may be joined to, for example, a part of the second upper surface 15A. Various hermetically sealed structures can be employed as long as hermetically sealed structures can be achieved. In this specification, hermetically sealed means that the space V is sealed to the extent that convection with the outside air is blocked. By achieving hermetically sealed structures, the members placed in space V will not deteriorate substantially.

[0049] In this embodiment, the height from the support surface 10A to the first upper surface 20A of the first submount 20 is different from the height from the support surface 10A to the second upper surface 15A of the side wall portion 15. In the example shown in Figures 1 and 2, the height from the support surface 10A to the first upper surface 20A is higher than the height from the support surface 10A to the second upper surface 15A. The height difference between the first upper surface 20A and the second upper surface 15A may depend on manufacturing variations in the thickness of each component, such as the first submount 20, the second submount 25, and the side wall portion 15. In this embodiment, the height difference is, for example, about 100 μm to 300 μm. The metal member 50 has a deformed portion 51 that occurs as a result of this height difference. The deformed portion 51 may be bent or curved.

[0050] The metal member 50 includes a first portion 50A joined to the heat dissipation member 60, a second portion 50B joined to the second upper surface 15A, and a connecting portion 50C connecting the first portion 50A and the second portion 50B. The deformable portion 51 includes a first deformable portion 51A located at the boundary between the first portion 50A and the connecting portion 50C, and a second deformable portion 51B located at the boundary between the second portion 50B and the connecting portion 50C.

[0051] As illustrated in Figures 1 and 2, at least a portion of the first part 50A may be located between the heat dissipation member 60 and the first submount 20.

[0052] Figure 5 is a cross-sectional view of the light source device 102 parallel to the YZ plane. As illustrated in Figure 5, the first portion 50A does not necessarily have to be formed between the heat dissipation member 60 and the first submount 20. In this case, the first portion 50A may be formed only in the peripheral region of the lower surface 60B of the heat dissipation member 60.

[0053] The heat dissipation member 60 is in thermal contact with the first submount 20, either via or without the first portion 50A of the metal member 50. As a result, the heat transferred from the laser diode 30 to the first submount 20 can be efficiently dissipated to the outside by the heat dissipation member 60.

[0054] Figure 6 is a cross-sectional view parallel to the YZ plane of a light source device 103 in which external connection electrodes 11 and 12 are provided on the upper surface 60A of the heat dissipation member 60. The external connection electrodes 11 and / or 12 can be provided on the upper surface 60A. In the example shown in Figure 6, the external connection electrodes 11 and 12 are provided on the upper surface 60A. Conductor wiring layers and via holes may be provided in the first submount 20 and the heat dissipation member 60, and the external connection electrodes 11 and 12 may be electrically connected to the first wiring layer 21. Alternatively, the external connection electrode 11 may be provided on the lower surface 10B of the substrate 10, and the external connection electrode 12 may be provided on the upper surface 60A of the heat dissipation member 60. In this case, the conductive member 40 may be omitted.

[0055] In the example configuration shown in Figure 1, the external connection electrodes 11 and / or 12 can be provided on the upper surface 60A of the heat dissipation member 60 instead of the lower surface 10B of the substrate 10. In this case, the metal member 50 may be drilled or otherwise processed to prevent the first portion 50A of the metal member 50 located between the first submount 20 and the heat dissipation member 60 from coming into contact with the conductor wiring layer and causing a short circuit.

[0056] Figure 7 is a cross-sectional view parallel to the YZ plane of a light source device 104 further comprising a heat dissipation member 61. As shown, the light source device 104 may further comprise a heat dissipation member 61. The heat dissipation member 61 may be positioned on the lower surface 10B of the substrate 10. The heat dissipation member 61 may be formed from the same material as the heat dissipation member 60, or from a different material. As the heat dissipation member 61, for example, a thin plate-shaped member may be used compared to the heat dissipation member 60, or a layer of metal film may be formed by sputtering or the like. By providing the heat dissipation member 61, the heat transmitted through the second submount 25 can be efficiently dissipated to the outside. As a result, a further heat dissipation effect can be obtained.

[0057] Refer to Figure 3. In Figure 3, the outline of the first upper surface 20A of the first submount 20, which is located inside the package, is shown by a dotted line to show the relative positional relationship between the first submount 20 and the heat dissipation member 60. The first deformed portion 51A and the second deformed portion 51B of the metal member 50 are shown by dashed lines, respectively.

[0058] As shown in Figure 3, in a top view, the heat dissipation member 60 The outer edge First submount 20 surround In other words, the size of the heat dissipation member 60 in the XZ plane is larger than the size of the first submount 20 in the XZ plane. Part of the heat dissipation member 60 may overlap with part or all of the second part 50B. In the example shown in Figure 3, the second part 50B is the outermost region of the metal member 50. Part of the second part 50B partially overlaps with the heat dissipation member 60. There may be a region of the second part 50B that does not overlap with the heat dissipation member 60. By thermally contacting the first submount 20 with a heat dissipation member 60 that is large enough to overlap part or all of the second part 50B, the heat dissipation performance of the light source device 100 can be further improved.

[0059] The first submount 20 has a first side surface 20S along its outer edge. The heat dissipation member 60 has a second side surface 60S along its outer edge. In a top view, the first side surface 20S is located inside the second side surface 60S. The first deformation portion 51A is located outside the first side surface 20S and inside the second side surface 60S. In this way, the first deformation portion 51A does not contact the edge (i.e., the corner of the member) where the first upper surface 20A and the first side surface 20S of the first submount 20 meet. Furthermore, the first deformation portion 51A does not contact the edge (i.e., the corner of the member) where the lower surface 60B and the second side surface 60S of the heat dissipation member 60 meet. By adjusting the position of the first deformed portion 51A of the metal member 50 so that it is located within the range described above, in other words, so that the first deformed portion 51A does not come into contact with the corner of the member, damage to the metal member 50 that may occur due to the first deformed portion 51A coming into contact with the corner of the member can be suppressed.

[0060] Thin metals such as foils can exhibit malleability (especially ductility). By using ductile metal foil for the package cap, it is possible to absorb the height difference between the first upper surface 20A and the second upper surface 15A while suppressing damage to the metal member 50 due to thermal stress. Furthermore, it is possible to suppress the delamination of the metal member 50 from at least one surface of the first upper surface 20A of the first submount 20, the second upper surface 15A of the side wall portion 15, and the lower surface 60B of the heat dissipation member 60.

[0061] In particular, when using a laser diode that emits blue or green light, it is preferable to hermetically seal the space V of the package. This is because hermetically sealing can suppress the effect of dust collection by laser light. In packages requiring hermetically sealing, double-sided bonding of the chip is sometimes required, such as bonding both sides of the laser diode to a pair of submount members. In that case, it is difficult to achieve both hermetically sealing and double-sided bonding of the chip. Specifically, it is required to hermetically seal the space V of the package while bonding both sides of the laser diode 30 so that the height of the second upper surface 15A, relative to the support surface 10A, matches the height of the first upper surface 20A. However, when double-sided bonding of the chip, for example, a load is applied to the joint. This load does not necessarily cause the joint to deform uniformly. As a result, in addition to the height difference due to manufacturing variations in the dimensions of each of the above-mentioned members, a height difference may occur between the first upper surface 20A and the second upper surface 15A due to variations in the height of the joint. Therefore, the amount of the height difference that may occur may change from one manufacturing to the next. This makes it difficult to achieve both hermetic sealing and double-sided bonding of the chip.

[0062] According to this embodiment, by using the metal member 50 having the deformable portion 51 as a cap to seal the package, the height difference between the first upper surface 20A and the second upper surface 15A can be absorbed. Therefore, precise height adjustment of each member becomes unnecessary, and double-sided bonding of the laser diode 30 becomes easier. In this way, a sealing structure is provided that can achieve both hermetic sealing and double-sided bonding of the chip.

[0063] Figure 8 is a cross-sectional view parallel to the XY plane of a light source device 105 comprising a plurality of laser diodes 30. In the example shown in Figure 8, the light source device 105 comprises two laser diodes 30. The two laser diodes 30 each have a p-side electrode surface 30B and an n-side electrode surface 30A. The p-side electrode surface 30B of each laser diode 30 is bonded to the support surface 10A via a second submount 25, and the n-side electrode surface 30A is bonded to the first mounting surface 20B of the first submount 20.

[0064] The number of laser diodes 30 in the light source device 105 is not limited to two, but may be three or more. Multiple laser diodes 30 can emit light of different colors. For example, by mounting three laser diodes that each emit RGB light in the light source device, a light source device that emits white light can be realized. Alternatively, multiple laser diodes 30 may each emit light of the same color. In this case, a light source device capable of emitting high-power laser light can be realized.

[0065] Figure 9 is a cross-sectional view of the light source device 106 parallel to the YZ plane. The cross-section shown in Figure 9 includes the cross-sections of the laser diode 30 and the conductive member 40. The laser beam L emitted in the Z direction from the output end face 30E of the laser diode 30 is shown by a dashed line. Figure 10 is a cross-sectional view of the light source device 106 parallel to the XY plane. The cross-section shown in Figure 10 includes the output end face 30E of the laser diode 30. Figure 11 is a plan view of the light source device 106 in a top view.

[0066] In the light source device 106 according to the embodiment of this disclosure, the height from the support surface 10A to the first upper surface 20A is lower than the height from the support surface 10A to the second upper surface 15A. The differences between the light source device 100 and the light source device 106 will be explained below.

[0067] In Figure 11, the outline of the first upper surface 20A of the first submount 20, which is located inside the package, is shown by a dotted line to show the relative positional relationship between the first submount 20 and the heat dissipation member 60. The first deformed portion 51A and the second deformed portion 51B of the metal member 50 are shown by dashed lines, respectively.

[0068] As illustrated in Figure 11, in a top view, the first submount 20 The outer edge The heat dissipation member 60 surround In other words, the size of the first submount 20 in the XZ plane is larger than the size of the heat dissipation member 60 in the XZ plane.

[0069] In a top view, the second side surface 60S is located inside the first side surface 20S. The first deformable portion 51A is located outside the second side surface 60S and inside the first side surface 20S. Similar to the light source device 100, the first deformable portion 51A does not contact the edge (i.e., the corner of the member) where the first upper surface 20A and the first side surface 20S of the first submount 20 meet. Furthermore, the first deformable portion 51A does not contact the edge (i.e., the corner of the member) where the lower surface 60B and the second side surface 60S of the heat dissipation member 60 meet. By adjusting the position of the first deformable portion 51A so that it is located within the above-described range, or in other words, so that it does not contact the corner of the member, damage to the metal member 50 that may occur due to the first deformable portion 51A contacting the corner of the member can be suppressed.

[0070] In this embodiment as well, by using the metal member 50 having the deformable portion 51 as a cap to seal the package, the height difference between the first upper surface 20A and the second upper surface 15A can be absorbed. Therefore, precise height adjustment of each member becomes unnecessary, and double-sided bonding of the laser diode 30 becomes easier. In this way, a sealing structure is provided that can achieve both hermetic sealing and double-sided bonding of the chip.

[0071] Figure 12 is a cross-sectional view of the light source device 107 parallel to the YZ plane. The metal member 50 does not necessarily have to be joined to the lower surface 60B of the heat dissipation member 60. The metal member 50 may not include the portion located between the first submount 20 and the heat dissipation member 60, and may be joined only to the peripheral region of the first upper surface 20A of the first submount 20, and hermetically sealed.

[0072] An example of a manufacturing method for the light source devices 100 to 107 according to this embodiment will be described. In this example of a manufacturing method, metal foil is used as the metal member 50.

[0073] (Example of manufacturing method 1) A laser diode 30 is mounted on the second submount 25 to fabricate the light source unit. The light source unit is joined to the support surface 10A of the substrate 10, and the side wall portion 15 surrounding the light source unit is joined to the support surface 10A. Separately from these steps, a cap unit for sealing the package is fabricated by joining the first submount 20 and the heat dissipation member 60 to the metal member 50. Finally, the second portion 50B of the metal member 50 included in the cap unit is joined to the second upper surface 15A of the side wall portion 15, and the package on which the light source unit and side wall portion 15 are mounted is hermetically sealed with the cap unit. In this hermetically sealed package, even if the first upper surface 20A is higher or lower than the second upper surface 15A, the metal foil can deform to absorb the height difference.

[0074] (Example of manufacturing method 2) The laser diode 30 is mounted on the second submount 25 to fabricate the light source unit. The light source unit is joined to the support surface 10A of the substrate 10, and the side wall portion 15 surrounding the light source unit is joined to the support surface 10A. The first submount 20 is joined to the laser diode 30. The second portion 50B of the metal member 50 is joined to the second upper surface 15A of the side wall portion 15, and the first portion 50A of the metal member 50 is joined to the first upper surface 20A of the first submount 20, and the package on which the light source unit and side wall portion 15 are mounted is hermetically sealed. Finally, the heat dissipation member 60 is joined to the metal member 50. In this manufacturing method as well, even if the first upper surface 20A is higher or lower than the second upper surface 15A, the difference in height can be absorbed by the deformation of the metal foil.

[0075] When joining the second portion 50B of the metal member 50 to the second upper surface 15A of the side wall portion 15, it is possible to avoid applying a load to the entire second upper surface 15A and to limit the area to which the load is applied. For example, a specific spot on the second upper surface 15A may be irradiated with laser light, and the metal member 50 may be joined to the side wall portion 15 by laser welding. This makes it easier to plastically deform the metal member (e.g., metal foil) 50, and as a result, it is possible to improve the adhesion of the metal member 50.

[0076] In the manufacturing process described above, for example, multiple light source units and side wall units 15 surrounding each of the multiple light source units are mounted on the substrate 10. Next, a first submount 20, a metal member 50, and a heat dissipation member 60 are provided. As in example 1 of the manufacturing method, a cap unit may be manufactured and individually joined to each light source unit. As in example 2 of the manufacturing method, the first submount 20 may be individually provided to each light source unit, then the metal member 50 covering the side wall unit 15 may be provided, and then the heat dissipation member 60 may be individually provided to each light source unit. Finally, multiple light source devices 100 to 107 can be manufactured by dividing the device unit by dicing or the like at the position of the side wall unit 15 between adjacent light source units. In either method, the metal member 50 and the side wall unit 15 are joined and divided in a hermetically sealed state, so the hermetically sealed state is maintained in each device after division.

[0077] Referring to Figures 13 to 19, several other structural examples of hermetic sealing using metal components to improve airtightness are described.

[0078] Figure 13 is a cross-sectional view of the light source device 108 parallel to the YZ plane. The second portion 50B of the metal member 50 in the light source device 108 is located inward from the outer edge of the second upper surface 15A of the side wall portion 15, as indicated by the arrow in the figure, and a portion of the second upper surface 15A is exposed. An adhesive member 70 is provided to cover the end of the second portion 50B of the metal member 50 on the exposed portion of the second upper surface 15A. For example, solder such as gold-tin or tin-silver-copper can be used as the material for the adhesive member 70. In this way, by using the adhesive member 70, it is possible to more reliably hermetically seal the space V of the package.

[0079] Figure 14 is a cross-sectional view of the light source device 109 parallel to the YZ plane. Figure 15 is a plan view of the retaining member 80 in a top view as seen from the normal direction of the support surface 10A of the substrate 10. For reference, the inner edge of the second upper surface 15A of the side wall portion 15 is shown by a dashed line in Figure 15. The light source device 109 includes a retaining member 80 provided on the upper surface of the second portion 50B of the metal member 50. The retaining member 80 illustrated in Figure 15 is formed continuously along the second upper surface 15A and is rectangular and annular in shape. The retaining member 80 may be formed from a material similar to the metal member 50, or from a material such as ceramic or glass. The retaining member 80 is joined to the upper surface of the second portion 50B of the metal member 50 via the joining member described above. By adopting a structure in which the second portion 50B of the metal member 50 is sandwiched between the retaining member 80 and the side wall portion 15 via the joining member, it is possible to improve airtightness.

[0080] The height from the support surface 10A to the upper surface 80A of the retaining member 80 is preferably lower than the height from the support surface 10A to the lower surface 60B of the heat dissipation member 60. This height difference prevents the retaining member 80 and the heat dissipation member 60 from coming into contact, making it possible to increase the size of the heat dissipation member 60 in the XZ plane.

[0081] Figure 16 is a cross-sectional view of the light source device 110 parallel to the YZ plane. Figure 17 is a plan view of the metal member 50-1 in a top view as seen from the normal direction of the support surface 10A of the substrate 10. The metal member 50-1 illustrated in Figure 17 differs from the metal member 50 in that it has a second portion 50B having a plurality of openings 55 formed discontinuously and parallel to the second deformed portion 51B of the metal member 50-1. The openings 55 can be formed in the second portion 50B, for example, by drilling. Note that the shape or pattern of the openings 55 shown in Figure 17 is an example, and the openings 55 may have a different shape or pattern. By forming openings in the metal member, the contact area between the second upper surface 15A of the side wall portion 15 and the adhesive member 70 is increased, and as a result, the adhesion between the adhesive member 70 and the side wall portion 15 can be improved, and the airtightness can be improved.

[0082] Figure 18 is a cross-sectional view of the light source device 111 parallel to the YZ plane. Figure 19 is a plan view of the metal member 50-2 in a top view as seen from the normal direction of the support surface 10A of the substrate 10. The metal member 50-2 illustrated in Figure 19 differs from the metal member 50 in that it has a first portion 50A in which an opening 55 is formed. Note that the shape of the opening 55 shown in Figure 19 is an example and may differ depending on the design specifications. By providing an opening 55 in the first portion 50A located in the center of the metal member 50-2, it is possible to effectively suppress twisting and wrinkling that occurs when the metal member is bent. The opening 55, illustrated in Figure 18, located between the first submount 20 and the heat dissipation member 60, may be filled with a bonding material such as gold-tin or tin-silver-copper solder. This may improve the bonding strength of the metal member. Furthermore, the metal member 50-2 may have a further number of openings in the second portion 50B, similar to the metal member 50-1 described above.

[0083] (Second Embodiment) An example of the configuration of a light source device according to the second embodiment of this disclosure will be described with reference to Figures 20 and 21.

[0084] The light source device in this embodiment comprises a plurality of laser diodes 30, a plurality of conductive members 40 corresponding to each of the plurality of laser diodes 30, and one or more support members 45. In other words, the total number of conductive members 40 and support members 45 is greater than the number of laser diodes 30.

[0085] Figure 20 is a cross-sectional view of the light source device 112 parallel to the XY plane. Figure 21 is a plan view of the second submount 25 supporting two laser diodes 30, two conductive members 40, and one support member 45, viewed from the direction normal to the support surface 10A of the substrate 10. In the example shown in Figure 20, two conductive members 40-1 and 40-2, corresponding to the two laser diodes 30-1 and 30-2, and one support member 45 are arranged between the first submount 20 and the second submount 25.

[0086] The two laser diodes 30-1 and 30-2 are arranged such that the electrode surfaces of the same polarity face either the first wiring layer 21 or the second wiring layer 26. For example, the n-side electrode surface 30A is joined to the first wiring layer 21, and the p-side electrode surface 30B is joined to the second wiring layer 26. In this case, the external connection electrode 11 is electrically connected to the n-side electrode surface 30A of laser diode 30-1 via the conductive member 40-1, the p-side electrode surface 30B of laser diode 30-1 is electrically connected to the n-side electrode surface 30A of laser diode 30-2 via the conductive member 40-2, and the p-side electrode surface 30B of laser diode 30-2 is electrically connected to the external connection electrode 12. That is, in this example, the external connection electrode 11, laser diode 30-1, laser diode 30-2, and external connection electrode 12 are connected in series in this order via the two conductive members 40-1 and 40-2.

[0087] The support member 45 is a member that does not contribute to conductivity and can be formed from, for example, metal, silicon, glass, ceramic, or the same material as the substrate 10 described above. The support member 45 can be molded to have the same thickness as the laser diode 30. In this embodiment, the support member 45 is a rectangular parallelepiped member of the same size as the conductive member 40, but is not limited to this shape. The lower surface of the support member 45 can be joined to the second wiring layer 26 of the second submount 25 via a joint, and the upper surface of the support member 45 can be joined to the first wiring layer 21 of the first submount 20 via a joint.

[0088] In the example shown in Figure 21, the conductive member 40-1, laser diode 30-1, conductive member 40-2, laser diode 30-2, and support member 45 are arranged in this order with spacing along the X direction. The outer shapes of the laser diode 30, conductive member 40, and support member 45 are each approximately rectangular in top view. The outer shape of laser diode 30-1 is formed by connecting vertices p1 to p4, and the outer shape of laser diode 30-2 is formed by connecting vertices p5 to p8. Similarly, the outer shape of conductive member 40-1 is formed by connecting vertices q1 to q4, the outer shape of conductive member 40-2 is formed by connecting vertices q5 to q8, and the outer shape of support member 45 is formed by connecting vertices q9 to q12. The longer sides of the rectangles of the laser diode 30, conductive member 40, and support member 45 are parallel to the Z direction, and the shorter sides of the rectangles are parallel to the X direction. Here, parallelism may include an error of ±5 degrees or less.

[0089] In the example shown in Figure 21, the first geometric figure formed by connecting the vertices p1 to p8 of the laser diode 30 is a rectangle, and the second geometric figure formed by connecting the vertices q1 to q12 of the conductive member 40 and the support member 45 is also a rectangle. In Figure 21, the first geometric figure is shown by a dotted line, and the second geometric figure is shown by a dashed line. The conductive member 40-1, laser diode 30-1, conductive member 40-2, laser diode 30-2, and support member 45 are arranged on the second submount 25 such that the centroid G1 of the first geometric figure and the centroid G2 of the second geometric figure coincide approximately. The centers of the outlines of the laser diodes 30-1 and 30-2 are located inside the second geometric figure, respectively.

[0090] According to this embodiment, by using the support member 45, it becomes possible to balance the load applied to the laser diode 30 and the conductive member 40 and / or the center of gravity of the cap unit when the cap unit described above is joined to the side wall portion 15. In particular, by making the center of gravity of the first geometric figure and the center of gravity of the second geometric figure substantially coincide, the stability during joining can be improved. [Industrial applicability]

[0091] The light source device of this disclosure can be suitably used as a light source in industrial fields requiring a high-power laser light source, such as for cutting, drilling, localized heat treatment, surface treatment, metal welding, and 3D printing of various materials. [Explanation of symbols]

[0092] 10: Circuit board 10A: Support surface 10B: Bottom surface 11, 12: External connection electrodes 15: Side wall section 15A: 2nd top surface 15B: Bottom surface 15C: Interior wall surface 20: First submount 20A: 1st top surface 20B: First implementation surface 20S: 1st side 21: 1st wiring layer 25: Second submount 25A: Second mounting surface 25B: Bottom surface 26: 2nd wiring layer 30: Laser Diode 30A:n side electrode surface 30B:p side electrode surface 30E: Output end face 40: Conductive material 45: Support member 50: Metal components 50A: 1st part 50B: 2nd part 50C: Connection part 51: Deformed part 51A: First deformation section 51B: Second deformation section 55 :Aperture 60: Heat dissipation component 60B: Bottom surface 60S: 2nd side 61: Heat dissipation component 70: Adhesive material 80: Retaining member 100~112: Light source device

Claims

1. A substrate having a support surface, A first submount having a first mounting surface facing the support surface and a first upper surface located on the opposite side of the first mounting surface, One or more laser diodes located between the substrate and the first submount, having a p-side electrode surface and an n-side electrode surface located opposite the p-side electrode surface, A side wall portion provided on the substrate, having a second upper surface and an inner wall surface, wherein the inner wall surface defines a space in which the laser diode is housed, A heat dissipation member provided on the first submount, The heat dissipation member and the metal member joined to the second upper surface and sealing the space, Equipped with, The height from the support surface to the first upper surface is different from the height from the support surface to the second upper surface. One of the p-side electrode surface or the n-side electrode surface is directly or indirectly bonded to the support surface, and the other of the p-side electrode surface or the n-side electrode surface is bonded to the first mounting surface. The aforementioned metal component is a metal foil. The aforementioned metal foil is The first portion joined to the heat dissipation member, The second portion joined to the second upper surface, A connecting portion that connects the first portion and the second portion, A first deformed portion located at the boundary between the first portion and the connecting portion, A second deformed portion located at the boundary between the second portion and the connecting portion, A light source device, including a light source device.

2. The light source device according to claim 1, wherein at least a portion of the first part is located between the heat dissipation member and the first submount.

3. The light source device according to claim 2, wherein the height from the support surface to the first upper surface is greater than the height from the support surface to the second upper surface.

4. The light source device according to claim 3, wherein, in a top view taken from the direction normal to the support surface, the outer edge of the heat dissipation member surrounds the first submount.

5. The light source device according to claim 4, wherein in the top view, a part of the heat dissipation member overlaps with a part or all of the second top surface.

6. The first submount has a first side surface along its outer edge, The heat dissipation member has a second side surface along its outer edge, In the above top view, the first side surface is located inside the heat dissipation member more than the second side surface. The light source device according to claim 4 or 5, wherein the first deformation portion is located outward from the first side surface and inward from the second side surface.

7. The light source device according to claim 2, wherein the height from the support surface to the first upper surface is lower than the height from the support surface to the second upper surface.

8. The light source device according to claim 7, wherein, in a top view taken from the direction normal to the support surface, the outer edge of the first submount surrounds the heat dissipation member.

9. The first submount has a first side surface along its outer edge, The heat dissipation member has a second side surface along its outer edge, In the above top view, the second side surface is located inside the first submount more than the first side surface. The light source device according to claim 8, wherein the first deformation portion is located outward from the second side surface and inward from the first side surface.

10. The metal foil has a base material and a metal film covering the base material. The base material is at least one selected from the group consisting of aluminum, copper, gold, Kovar, titanium, stainless steel, tungsten and beryllium copper, titanium, nickel, silver, platinum, nichrome, molybdenum, and niobium, or an alloy thereof. The light source device according to any one of claims 1 to 9, wherein the metal film is formed from at least one selected from the group consisting of gold, platinum, titanium, nickel, chromium, palladium, and ruthenium.

11. The second submount further comprises a lower surface joined to the support surface, and a second mounting surface located on the opposite side of the lower surface, on which the laser diode is arranged. The light source device according to any one of claims 1 to 10, wherein the laser diode is bonded to the support surface via the second submount.

12. The first submount has a first wiring layer electrically connected to the other of the p-side electrode surface or the n-side electrode surface, The light source device according to claim 11, wherein the second submount has a second wiring layer electrically connected to either the p-side electrode surface or the n-side electrode surface.

13. The light source device according to claim 12, further comprising a conductive member bonded to the first submount and the second submount, which electrically connects the first wiring layer and the second wiring layer.

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