Uniformization of non-uniform foil for lightweight alloy metal parts

Abstract

A method for manufacturing an object. The method includes receiving a desired alloy composition for the object; stacking a plurality of foils in a stack to form the object; applying heat to the stack at a first temperature to bond the plurality of foils to one another; and applying heat to the stack at a second temperature to homogenize the composition of the stack. The homogenized stack has the desired alloy composition. In some embodiments, the plurality of foils are patterned. In some embodiments, the plurality of foils includes foils having at least two different compositions.

Description

Technical Field

[0001] Cross - Reference to Related Applications This application is a continuation of U.S. Patent Application No. 18 / 482,866, filed on October 7, 2023, which application itself is a divisional of U.S. Patent Application No. 18 / 131,340, filed on April 5, 2023, which application itself is a partial continuation of International (PCT) Patent Application No. PCT / US2021 / 065196, filed on December 27, 2021, and this application claims the benefit of and priority to U.S. Provisional Application Nos. 63 / 131,285 and 63 / 257,091, filed on December 28, 2020 and October 18, 2021, respectively, and International (PCT) Patent Application Nos. PCT / US2021 / 030879 and PCT / US2021 / 036770, filed on May 5, 2021 and June 10, 2021, respectively (the entire disclosure content of each of these is incorporated herein by reference as if fully set forth herein).

[0002] Technical Field The embodiments described herein relate to methods and systems for manufacturing objects, and more particularly, but not limited to, methods and systems for manufacturing an object having a desired alloy composition from a laminate of foils having a composition different from the desired alloy composition.

Background Art

[0003] Background Laminated object manufacturing (LOM) techniques generally involve the steps of laminating multiple foils, each consisting of at least two alloy layers, and joining these foils together to produce a solid object. Parts assembled using conventional LOM techniques have different compositions in the foil-to-foil bonding regions and in the foil structural components, alternating throughout most of the part. Due to these compositional gradients throughout the part, the mechanical properties of LOM-assembled composites may not be equal to those predicted by the average composition of the alloys.

[0004] Therefore, improved LOM techniques are needed. [Overview of the project] [Means for solving the problem]

[0005] overview This summary is presented to introduce a simplified form of conceptual selection, which is further described in the following detailed explanations. This summary is not intended to identify or exclude any important or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0006] According to one embodiment, the embodiment relates to a method for manufacturing an object. The method includes the steps of receiving a desired alloy composition for the object; depositing a plurality of foils in a laminate to form an object; heating the laminate at a first temperature to bond the plurality of foils together; and heating the laminate at a second temperature to homogenize the composition of the laminate, the homogenized laminate having the desired alloy composition.

[0007] In some embodiments, multiple foils are patterned.

[0008] In some embodiments, the plurality of foils include foils having at least two different compositions.

[0009] In some embodiments, each foil comprises multiple layers. In some embodiments, each layer comprises an aluminum alloy, a magnesium alloy, or a titanium alloy. In some embodiments, the alloy material is aluminum, chromium, copper, lithium, magnesium, titanium, nickel, silicon, or zinc. In some embodiments, the first layer forms the core of the foil, and the second layer forms the cladding of the foil.

[0010] In some embodiments, each foil has a thickness between 25 and 1000 micrometers.

[0011] In some embodiments, the second temperature is lower than the melting point of the multiple foils.

[0012] In some embodiments, the second temperature is approximately equal to or lower than the solidus temperature of multiple foils of a desired alloy composition.

[0013] In some embodiments, the first temperature and the second temperature are the same.

[0014] In some embodiments, heating at a first temperature is performed in a first processing unit, and heating at a second temperature is performed in a second processing unit. In some embodiments, the laminate is maintained at the first temperature during transfer from the first processing unit to the second processing unit.

[0015] In some embodiments, the method further includes a step of quenching the laminate after homogenization. In some embodiments, the quenching step is performed in the same processing unit used to homogenize the laminate.

[0016] In some embodiments, the desired alloy composition is a uniform composition that is not the same as the composition of the multiple foils.

[0017] Non-limiting and non-exhaustive embodiments of the present disclosure are described with reference to the following drawings, and like reference numerals refer to like parts throughout the various drawings unless otherwise specified.

Brief Description of the Drawings

[0018] [Figure 1] FIG. 1 illustrates a cross-sectional view of a metal laminate object manufactured according to one embodiment.

[0019] [Figure 2] FIG. 2 illustrates a triangular view and an object view of the metal laminate object of FIG. 1 according to one embodiment.

[0020] [Figure 3] FIG. 3 illustrates a cross-section of an individual foil according to one embodiment.

[0021] [Figure 4A] FIGS. 4A - D illustrate foils of various configurations according to multiple embodiments. [Figure 4B] The same as above. [Figure 4C] The same as above. [Figure 4D] The same as above.

[0022] [Figure 5] FIG. 5 illustrates a concentration profile of an interface between an intermediate layer and two core layers according to one embodiment.

[0023] [Figure 6] FIG. 6 illustrates an operation profile of a homogenization process according to one embodiment.

[0024] [Figure 7] FIG. 7 illustrates a flowchart of a method for manufacturing an object according to one embodiment.

[0025] [Figure 8]Figure 8 illustrates an additive manufacturing system according to one embodiment, which includes two plates configured to bond layers in a laminate by applying at least one of heat and pressure to the laminate.

[0026] [Figure 9] Figure 9 schematically shows a method for additive manufacturing of an object by diffusion bonding according to one embodiment.

[0027] [Figure 10] Figure 10 schematically shows a method for additive manufacturing of an object by transient liquid phase (TLP) diffusion bonding according to one embodiment.

[0028] [Figure 11] Figure 11 schematically shows a method for the additive manufacturing of an object by brazing according to one embodiment. [Modes for carrying out the invention]

[0029] Detailed explanation Various embodiments are described in full below with reference to the accompanying drawings, which form part of and illustrate specific exemplary embodiments. However, the concepts of this disclosure may be implemented in numerous different forms and should not be construed as being limited to the embodiments described herein. Rather, these embodiments are presented as part of a thorough and complete disclosure to fully convey the concepts, techniques and scope of implementation to those skilled in the art. Embodiments may be implemented as methods, systems or devices. Accordingly, embodiments may take the form of hardware implementations, full software implementations, or implementations combining software and hardware aspects. Accordingly, the following detailed description should not be taken as restrictive.

[0030] Where the terms “one embodiment” or “embodiment” are used herein, it means that certain features, structures, or characteristics described in relation to those embodiments are included in at least one example of an implementation or technique provided herein. Where the phrase “in one embodiment” appears in various places herein, not all instances necessarily refer to the same embodiment.

[0031] Furthermore, the language used herein has been selected primarily for readability and instructional purposes, and may not be chosen to outline or limit the subject matter disclosed. Therefore, this disclosure is intended to illustrate, rather than limit, the scope of the concepts discussed herein.

[0032] Embodiments of the present invention include methods used to homogenize the composition of lightweight alloy laminates. These laminates may be products of a LOM process. In some embodiments, the component may include a plurality of foils joined together by a certain method, each foil comprising at least one core layer and at least one intermediate layer. In other embodiments, the component may include a plurality of foils joined together by a certain method, each foil comprising alternating foils with a uniform core layer and a uniform intermediate layer. In some embodiments, the process consists of applying heat for a predetermined processing time to promote solid diffusion of alloying elements throughout most of the component. In some embodiments, solid diffusion homogenizes the composition of alloying elements throughout most of the component in order to improve the mechanical properties of the component produced by LOM. In embodiments of the method, the amount of material added to the component is not substantial.

[0033] In some embodiments, both the composition and relative ratio of the component layers constituting the foil are selected such that a fully homogenized component has an average composition equivalent to that of a target alloy. Two or more layers of different alloys combined and homogenized using this method can produce a third alloy, determined by the composition and thickness of the component layers. In some embodiments, the target alloy has a composition and material properties similar to commercially available aluminum alloys that are commonly manufactured.

[0034] The term "foil" refers to a metal sheet used to form each layer in a laminate. The foil may include one or more sublayers, of which at least one sublayer and, optionally, several intermediate layers containing a different metal alloy from the first layer. In some embodiments, the foil has a one-dimensional thickness between 10 μm and 10 mm. In some embodiments, the foil has a one-dimensional thickness between 25 μm and 1000 μm. In further embodiments, the foil may have a one-dimensional thickness between 50 μm and 500 μm. In some embodiments, the foil may be patterned in accordance with the design of the object and its supporting structure. In some embodiments, the foil may contain at least one of Al, Sb, Ba, Be, Bi, B, Cd, Ca, C, Cr, Co, Cu, Gd, Ga, H, Fe, Pb, Li, Mg, Mn, Mo, Nd, Ni, Nb, N, O, Pd, P, K, S, Si, Ag, Na, Sr, S, Ta, Th, Sn, Ti, V, Y, Zn, Zr, or rare earth metals. In some embodiments, the foil may contain at least one of aluminum, magnesium, titanium, aluminum alloys, magnesium alloys, or titanium alloys.

[0035] The term "core" or "core layer" refers to the foil, or a portion of the foil, that constitutes the majority of the laminated structure. The composition of the alloy used in the core layer material is described with respect to the primary alloying elements.

[0036] The term "interlayer" refers to a foil or a portion of a foil that enables the joining of adjacent foils. In some embodiments, the interlayer may be applied to at least one surface of the core layer on the outside of the foil. In some embodiments, the thickness of the interlayer is less than the thickness of the core layer. The composition of the alloy used for the interlayer is described with respect to the primary alloying elements.

[0037] The term “clad layer” or “clad” refers to an intermediate layer material bonded to a core layer before the bonding and homogenization process begins. In some embodiments, a thin intermediate layer of a single composition roll bonded to a core layer is described as “clad foil.”

[0038] A “laminated structure” refers to at least two foils. In some embodiments, a single foil may include at least one support region and at least one object region. A “support” refers to a non-object component of a foil that, when joined together, forms a holder or jig that fits outside an object and can be used after subsequent processes. This holder or jig, formed as a combination of multiple support regions, may be referred to as a “support region.” A combination of object regions may be referred to as an “object region.” The process of joining may be referred to as “joining.”

[0039] The term "aluminum" refers to any material containing aluminum. For example, a material containing aluminum can refer to pure molecular aluminum, aluminum up to standard industrial grade, an alloy of aluminum with at least one other element, or any combination thereof. If an alloy contains a specific metal such as aluminum, then at least several alloy compositions must be of the same specific metal. The secondary alloying elements present are listed below.

[0040] Some embodiments described herein relate to methods for manufacturing metallic objects derived from constituent metal layers having equivalent mechanical properties. In some embodiments, these methods avoid the use of adhesives between layers and instead use high-strength metallic bonding between constituent layers to form the object. For aluminum parts, some embodiments may use bonding methods such as diffusion bonding, transient liquid-phase diffusion bonding, and / or brazing. Specific material compositions such as alloy composition, alloy structures including composites of two or more sublayers with different compositions, and process conditions such as applied temperature and pressure can result in stronger metallic bonding in shorter, more robust processes useful for manufacturing aluminum parts.

[0041] In some embodiments, the manufacturing method described herein first obtains a desired alloy composition for an object. These embodiments then apply heat to a foil laminate comprising at least one core layer and at least one intermediate layer to homogenize the composition of the laminate. The resulting product is a homogenized object having the desired alloy composition. The foil in the laminate may be selected such that, for example, one layer has an excess of one element and an adjacent layer lacks the same element, resulting in an object having desired proportions of elements. This may also apply to multiple elements forming a desired composition for the object.

[0042] Figure 1 shows a cross-sectional view of a metal laminated object 100 manufactured according to one embodiment. In some embodiments, the object 100 may be manufactured on a print bed 105. In some embodiments, the foil 110 may be deposited on the print bed 105. In some embodiments, multiple foils may be deposited directly on a first foil 110 or added later on top of the first foil 110.

[0043] Figure 2 illustrates a triangular diagram 205 and an object diagram 210 of the metal laminate of Figure 1 according to one embodiment. This object may be surrounded by support areas 215 and 220, which may be removed after the object area 225 is formed and the finishing of the metal laminate is complete, as will be described in more detail below.

[0044] Figure 3 illustrates cross-sections of individual foils 305, 315, and 325 according to one embodiment. In some embodiments, at least one foil (not shown) in the foil lamination may consist solely of a core layer 310. In some embodiments, foil 315 may include a core layer 330 and individual intermediate layers 335 on one surface. In some embodiments, the intermediate layer 335 may be located on top of the core layer 330. In some embodiments, the intermediate layer 335 may be located on the bottom of the core layer 330. In some embodiments, foil 325 may include a core layer 350 and two intermediate layers 335 on both sides of the foil.

[0045] In some embodiments, the core layer may contain aluminum. In some embodiments, the core layer may be an aluminum alloy.

[0046] In some embodiments, the intermediate layer may contain a metal or alloy having a lower melting point than the core layer. In some embodiments, the intermediate layer material may contain at least one of aluminum, copper, chromium, iron, magnesium, manganese, silicon, titanium, and zinc. In some embodiments, the metallic elements may be present in several different combinations, and each composition is selected for a specific set of properties that suit the joining method, such as liquid state properties such as surface oxidation resistance, surface oxide fracture, optimal melting temperature, and wettability on the core layer. In some embodiments, the two intermediate layers may contain different materials. In some embodiments, the two intermediate layers may be identical.

[0047] In some embodiments, the thickness of the intermediate layer may be 1 to 50% of the thickness of the core layer. In some embodiments, the thickness of the intermediate layer may be 0 to 5% of the thickness of the core layer 330. In some embodiments, for single-clad foil, the thickness of the intermediate layer may be 1 to 25% of the thickness of the core layer 330. In some embodiments, for double-clad foil, the thickness of the intermediate layer may be 2 to 50% of the thickness of the core layer.

[0048] In some embodiments, the thickness of the intermediate layer is less than the thickness of the core layer. In some embodiments, the total thickness of the foil is greater than 25 μm. In other embodiments, the total thickness of the foil is less than 1000 μm. In some embodiments, the thicknesses of the core layer and the intermediate layer, as well as the ratio of the core layer thickness to the intermediate layer thickness, vary and are optimized for a particular bonding method.

[0049] In some embodiments, the specific composition of the intermediate layer is selected such that the intermediate layer material melts at a lower temperature than the core layer. In some embodiments, the intermediate layer material is selected to minimize the melting temperature. In some embodiments, the melting temperature of the intermediate layer material may be higher than 500°C and lower than 590°C. In some embodiments, the melting temperature of the intermediate layer material may be less than 500°C. In different subsets of these embodiments, the melting temperature of the intermediate layer material may be less than 490°C. In some embodiments, the ratio of the intermediate layer material to the core layer material and their compositions are selected such that the final mechanical properties of the object are those of the final mechanical properties of a desired composition. In some embodiments, if the components of the intermediate layer constitute only a small portion of the entire foil, the desired composition may be within the tolerance of the core material composition.

[0050] In some embodiments, the composition of the foil in the laminate is selected such that, once heated, the finished product has a desired composition. For example, if the finished product should have a desired composition to match a particular alloy, each individual sheet may have excesses or deficiencies of various elements, but once heated, the finished product will have a substantially uniform composition to match the desired composition.

[0051] For example, Figure 4A illustrates a foil 400a according to one embodiment. The foil 400a includes a single core layer 402a, which is clad on one side with an intermediate layer 404a. Figure 4B illustrates a foil 400b according to another embodiment. The foil 400b includes a single core layer 402b, which is clad on both sides with an intermediate layer 404b.

[0052] Core layers 402a and 402b may contain a majority of aluminum or magnesium. Additional alloying elements may be present, but are not limited to, copper, silicon, zinc, or other materials discussed so far.

[0053] Intermediate layers 404a and 404b may contain any combination of aluminum, copper, magnesium, silicon, and zinc, or any other material discussed herein. Intermediate layers 404a and 404b may instead contain a uniform layer of any single element from the above list.

[0054] In some embodiments, the intermediate layer accounts for between 1% and 50% of the total foil thickness. In some embodiments, such as those in which the intermediate layer contains a single element, the intermediate layer may consist of a thin layer of less than 5% of the total foil thickness.

[0055] The specific composition of the core or intermediate layer can match the composition of commercially available aluminum alloys. For example, the core layer may contain 2024, 5182, 6061, or another alloy. Custom alloys that largely match the composition of commercially available alloys but have either higher or lower concentrations of one or more elements present in the intermediate layer may also be used. The intermediate layer may contain 2024, 4004, 5182, 6061, 7075, or another commercially available aluminum alloy. The intermediate layer may also contain custom alloys that match the composition of commercially available alloys but have either higher or lower concentrations of one or more elements.

[0056] The compositions of the core layer and the intermediate layer may vary from one another. For example, in some embodiments, elements present in excess in the intermediate layer may be present in the core layer at lower concentrations to achieve the desired composition after homogenization.

[0057] Alternatively, elements present in excess in the core layer may be present in the intermediate layer at lower concentrations to achieve the desired composition after homogenization. The relative thickness of the layers may also be selected so that the average composition of the alloy matches 2024, 6061, 7075, or another desired composition.

[0058] As another example, the core layer may contain a magnesium alloy with a high melting point. The intermediate layer may contain a low melting point magnesium alloy and a custom alloy with high or low concentrations of alloying elements. In some embodiments, the intermediate layer may contain elements that lower the melting point of magnesium.

[0059] In the operation, the user or system can provide the component to a heating environment such as a furnace. The furnace can heat the component, raise its temperature, and maintain the temperature of the component at a specific temperature or temperature range for a certain period of time. Specifically, the technique according to the embodiments herein may include a bonding step in which layers are heated and joined together, and a homogenization step in which the bonded layers are heated to produce a homogenized product. The homogenized product may then be quenched.

[0060] In some embodiments, the joined parts may be moved to individual furnace processing units that perform a homogenization step. The parts may be moved together with, for example, a support structure. In other embodiments, a chamber may protect the parts during movement to protect the surface from oxidation. In some embodiments, the chamber may be under vacuum, or it may be a shielded gas chamber where an inert or non-oxidizing gas is present around the parts. In some embodiments, these steps may further include a polishing step, in which case the parts may be polished, or otherwise modified before or after the homogenization process.

[0061] During the heating stage, the furnace may apply heat to the part to raise its temperature to the processing temperature. That is, heat may be applied to the part until its temperature reaches the processing temperature.

[0062] In some embodiments, the processing temperature is lower than the solidus temperature of the intermediate and core layers. For example, the furnace may be configured to set the processing temperature 5°C to 100°C lower than the solidus temperature of the intermediate layer.

[0063] In some embodiments, the component can be subjected to a heated press during the homogenization process, thereby increasing or improving heat transfer to the component. Well-controlled heat transfer allows for more even and sustained heating of the component during the processing stage, enabling fine control over the rate at which elements diffuse within the component without melting. This improves the diffusion rate and reduces the opportunity for defect formation in the component.

[0064] Figure 4C illustrates a foil or component 406 manufactured by laminating foils such as foil 400a or 400b. For example, component 406 appears to include multiple core layers 402c and multiple intermediate layers 404c.

[0065] During the homogenization process, foils such as foil 400a-c are maintained at the processing temperature for a certain period, allowing for interdiffusion of elements in the intermediate and core layers, thereby forming a nearly uniform composition in both regions. This interdiffusion process involves two simultaneous occurrences: elements present in the intermediate layer diffuse into the core layer region, and elements present in the core layer diffuse into the intermediate layer region. Since the thickness of the core layer can be at least several times thicker than the thickness of the intermediate layer, the slowest diffusing elements are components present in at least one of the core and intermediate layers that diffuse into the complementary layer.

[0066] Furthermore, elements with lower diffusion coefficients diffuse more slowly than elements with higher diffusion coefficients at the same concentration gradient, temperature, and other environmental conditions. Therefore, the slowest diffusing element is the one with the lowest diffusion coefficient. Once the slowest diffusing element is present in both the core and intermediate layers, the foil can be considered homogenized, and the peak composition of the slowest diffusing element falls within the standard tolerances for alloy composition in published standards such as the specified TEAL sheet.

[0067] Figure 4D illustrates a part 408 produced from a homogenization process according to one embodiment. As can be seen in Figure 4D, part 408 has at least a portion that is completely homogenized and uniform in composition.

[0068] Figure 5 illustrates the concentration profile 500 at the interface surrounding the intermediate layer 502 and bordering the two core layers 504, as a function of time during the homogenization process. In this example, alloying elements present in the intermediate layer 502 but not in either of the core layers 504 are present initially (i.e., before the homogenization process begins).

[0069] Series 506 represents the initial concentration of this alloying element before the homogenization process begins. As can be seen in Figure 5, the concentration of this alloying element is high in the intermediate layer 502, but zero in the core layer 504. In other words, the composition of the core layer 504 does not contain the alloying element before the homogenization process begins.

[0070] The three progressive series 508, 510, and 512 represent the concentrations of alloy elements at various points in time throughout the homogenization process. Series 508 represents the alloy element concentration at time t1, series 510 represents the alloy element concentration at time t2, series 512 represents the alloy element concentration at time t3, where t1 < t2 < t3. From t1 to t3, as the composition of the alloy elements in the intermediate layer 502 diffuses from the region previously occupied by the intermediate layer 502, it decreases. When this occurs, the composition of the alloy elements in the core layer 504 increases. Series 514 represents the concentration of alloy elements at the end of the homogenization process. As can be seen in profile 500, the concentration of alloy elements decreases in the intermediate layer 502 and increases in the core layer 504.

[0071] Figure 6 illustrates an operation profile 600 for the homogenization process as a function of time according to one embodiment. The homogenization process associated with profile 600 in Figure 6 may be similar to the process described in connection with Figure 5, for example.

[0072] The temperature 602 is initially at room temperature or ambient temperature 604 before starting the homogenization process. The temperature 602 can be heated to a temperature lower than the solidus temperature 606 of the intermediate layer. The solidus temperature 606 of the intermediate layer is lower than the solidus temperature 608 of the core layer.

[0073] The time required for the homogenization process is partly determined by the thicknesses of the core layer and the intermediate layer. For example, the time required for the homogenization process increases or decreases according to the layer thickness. Specifically, a foil with a thinner intermediate layer requires less time for homogenization.

[0074] Similarly, the speed at which the diffusing elements move increases with the increase in temperature. Therefore, the time required for the homogenization process is also a function of temperature and decreases as the processing temperature increases.

[0075] The temperature 602 may be reduced back to room temperature or ambient temperature 604 after a period of time sufficient to facilitate the homogenization process. The cooling step may include rapid cooling of the parts by means of water, oil or another fluid, using a fan, or otherwise, by blowing air to cool the parts, or by natural cooling.

[0076] Figure 7 illustrates a flow chart of a method 700 for manufacturing an object according to one embodiment. Homogeneous parts produced from two or more different component alloys may exhibit better mechanical properties than any of the constituent alloys. In some examples, the composition of the alloy selected for the component layer may have weaker mechanical properties than the final homogenized part.

[0077] For example, the core and intermediate layers may contain magnesium and silicon in proportions higher than the 2:1 stoichiometric ratio as substitutes. This ratio typically produces a weak, flexible material. However, the total proportions of magnesium and silicon are such that the homogenized part becomes a high-strength hardened 6000 series alloy with a magnesium-to-silicon ratio that satisfies the desired alloy composition. This allows the alloy to have processing conditions, such as melting temperature, that are finely tuned by the selective presence of magnesium and silicon, without the negative consequence of an excess of one of those elements in the final homogenized part.

[0078] Step 702 includes the step of receiving a desired alloy composition for the object. The desired alloy composition may be a copper-enriched aluminum alloy in the 2000 series, a silicon-enriched aluminum alloy in the 4000 series, a magnesium-enriched aluminum alloy in the 5000 series, a magnesium and silicon-enriched aluminum alloy in the 6000 series, a zinc-enriched aluminum alloy in the 7000 series, and so on.

[0079] Step 704 includes the step of depositing multiple foils in a laminate to form an object. As part of step 704, the type of foil deposited in the laminate may depend on the desired alloy composition specified in step 702.

[0080] For example, if the desired alloy composition is a 6000 series aluminum alloy, a core layer of the 6000 series alloy and an intermediate layer of the 2000 series alloy may be used. In this case, copper derived from the copper-enriched 2000 series intermediate layer diffuses into the core layer of the 6000 series alloy, resulting in a low-copper 6000 series alloy such as 6061, which is a high-strength, machinable alloy.

[0081] If the desired alloy composition is a magnesium-enriched aluminum alloy of the 5000 series, a core layer of the 1000, 3000, or 1000 series alloy and an intermediate layer of the 5000 series alloy may be used. If the desired alloy composition is a silicon-enriched aluminum alloy of the 4000 series, a core layer of the 6000 series alloy and an intermediate layer of the 4000 series alloy may be used. If the desired alloy composition is a zinc-enriched aluminum alloy of the 7000 series, at least one core layer of the 2000, 5000, 6000, or 7000 series alloy and an intermediate layer of the 7000 series alloy may be used.

[0082] In some embodiments, if the homogenization component is an aluminum alloy of the X000 series, both the intermediate layer and the core layer may be the same X000 series alloy. In other embodiments, if the homogenization component is an aluminum alloy of the X000 series, both the intermediate layer and the core layer may be a custom alloy that matches the composition of the X000 series, except that the core layer or the intermediate layer has an excess of at least one element and the complementary alloy is deficient in at least one of the same elements.

[0083] In some embodiments, the composition of individual foil layers in the laminate may be selected such that, when diffused using the process described above, the result is an object having a uniform composition that matches a desired composition, but is not the same as the composition of the constituent foils. The following table identifies several alloys and the constituent foils that can be used to realize those alloys. [Table 1] [Table 2] [Table 3] [Table 4] [Table 5] [Table 6] [Table 7] [Table 8] [Table 9] [Table 10]

[0084] Each table specifies various compositions for the core and cladding layers (i.e., intermediate layers), while the labels in the tables specify the desired alloy series. The entry numbers correspond to the weight fraction of each of the major alloying elements, with the remainder being aluminum (Al). These compositions above are merely illustrative, and other compositions may be realized by embodiments described herein.

[0085] The foil may be clad on one or both sides, and the total thickness of the foil may be between 25 μm and 1,000 μm. The thickness of the core layer is usually greater than the thickness of the intermediate layer. In some embodiments, the foil is either "all core" or "all clad" with respect to each example. In these embodiments, the foils can be alternating to produce a striped layered structure with alternating core and clad layers, identical to that which can be produced by a laminate of clad foils.

[0086] Step 706 includes the step of heating the laminate at a first temperature to bond multiple foils together. The laminate may include multiple layers of foil. Each layer may include, for example, an aluminum alloy, a magnesium alloy, or a titanium alloy. The alloy material may be aluminum, chromium, copper, lithium, magnesium, manganese, titanium, nickel, silicon, or zinc. The first temperature required to bond the foils together may depend on the material used.

[0087] Step 708 includes the step of heating the laminate at a second temperature to homogenize the composition of the laminate. As already discussed, heating the laminate (e.g., foil) can achieve a desired level of interdiffusion. In some embodiments, the second temperature is lower than the melting point of the multiple foils. In some embodiments, the second temperature may be the approximate solidus temperature of the multiple foils or the desired alloy composition. In some embodiments, the second temperature may be the same as the first temperature.

[0088] Step 710 is optional and includes a step of quenching the laminate after homogenization. This quenching step may be performed in the same processing unit as the homogenization step, or it may be performed in a separate location from the processing unit performing the homogenization step. The optional quenching step may be used depending on the desired alloy properties.

[0089] Figure 8 illustrates an additive manufacturing system 800 comprising two plates 805', 805'' (collectively, "805") configured to bond foils 810 to a laminate 815 by applying at least one of heat and pressure, according to one embodiment. In some embodiments, at least two foils 810 within the laminate 815 can be bonded using at least one bonding method.

[0090] In some embodiments, the platen 805 may be at least one of a pressure plate or a heating plate. In some embodiments, the platen 805 may be configured to apply at least one of heat or pressure to the opposite side of the laminate 815. In some embodiments, the application of at least one of heat or pressure raises the temperature of the laminate 815 to a temperature lower than the melting temperature of the core layer of the foil 810, and as a result, the first foil in the laminate 815 is bonded to the second foil by at least one of heat or pressure.

[0091] In some embodiments, the plate 805 may apply uniform pressure to the laminate 815 in order to join the object region 820. In some embodiments, the laminate 815 may include a complete enclosure of the object region 820. The complete enclosure may include at least two support regions 825, 830, so that the object region 820 is completely surrounded by the support regions 825, 830.

[0092] In some embodiments, the support regions 825, 830 are configured to conduct at least one of heat or pressure from the plate 805 through the laminate 815. Such conduction of heat or pressure facilitates the bonding of the foil 810 to form the bonded object region 820. In some embodiments, the plate 805 applies at least one of heat or pressure to the support regions 825, 830, and thereby conducts at least one of heat or pressure to the object region 820. In some embodiments, the support regions 825, 830 may have flat surfaces, so that the plate 805 can evenly apply at least one of pressure or heat across its entire surface. In some embodiments, the support region is a single support region surrounding the object region 820, and this region can be used to create a negative of the object. In some embodiments, the bonding process of the object region 820 may be carried out in an oxidizing atmosphere such as air. In some embodiments, the bonding process of the foil 810 may be enclosed in a vacuum or inert gas chamber.

[0093] In some embodiments, the system may utilize at least one of diffusion bonding, transient liquid diffusion bonding, and / or brazing. In some embodiments, the alloy composition and processing conditions are optimized for efficient diffusion bonding.

[0094] Figure 9 schematically illustrates a method 900 for additive manufacturing of an object by diffusion bonding according to one embodiment. Method 900 includes the step of heating a laminate of foils to raise the foils to a bonding temperature (step 905). In some embodiments, the bonding temperature may be below the melting temperature of the core layer of the foil and may be sufficiently high to promote diffusion and bonding between adjacent foils. In some embodiments, the bonding temperature may be below the temperature of the intermediate layer of the foil. In some embodiments, at least one plate may be heated.

[0095] In some embodiments, the foil laminate may be heated to a maximum bonding temperature and pressurized as necessary (step 915), and the bonding temperature and pressurized as necessary may be maintained until elements from adjacent core layers diffuse to each other and the foil laminate is bonded to the object region (step 930) (step 925).

[0096] In some embodiments, the method may include a sequential diffusion bonding process. In a sequential diffusion bonding process, the method may include the step of adding foil to an object or part of an object at the bonding temperature (step 920). In some embodiments, the bonding temperature may be below the melting temperature of the core layer material. Alternatively, the foil may be added to a cold foil laminate, and the laminate with the additional foil may be brought to the bonding temperature. In some embodiments, the foil is added to an already heated laminate and pressure is applied to this laminate. In some embodiments, after applying pressure, the pressure is released and another foil is added (step 920).

[0097] In some embodiments, temperature can facilitate the diffusion and bonding between elements of the core layer of the added foil and the object, thereby enabling the bonding process.

[0098] In some embodiments, the object or at least one of its components can act as a heat sink. In some embodiments, the heat sink can generate a temperature gradient across the entire object for the purpose of selectively promoting diffusion bonding in a portion of the object. In some embodiments, the diffusion process may be repeated until the object is complete.

[0099] Figure 10 schematically illustrates a method 1000 for additive manufacturing of an object by transient liquid phase (TLP) diffusion bonding according to one embodiment. In some embodiments, the alloy composition and processing conditions can be optimized for efficient bonding by transient liquid phase (TLP) diffusion bonding under an oxidizing or non-oxidizing atmosphere or under vacuum.

[0100] In some embodiments, the core material is aluminum or an aluminum alloy. In some embodiments, the core material may include at least one of aluminum, magnesium, titanium, copper, silicon, or zinc. The alloying element may include at least one of magnesium or zinc. In some embodiments, the cladding interlayer may include at least one of an aluminum-magnesium alloy, a magnesium-zinc alloy, an alloy of at least two of aluminum, copper, magnesium, silicon, or zinc, or any combination thereof. In some embodiments, at least one of the alloying elements in these interlayers can act as an oxide getter, preferentially bonding to oxygen at a greater rate than aluminum.

[0101] In some embodiments, the aluminum alloy foil may contain between 20% and 100% aluminum. In some embodiments, the aluminum alloy foil may contain at least one of the following: Sb, Ba, Be, Bi, B, Cd, Ca, C, Cr, Co, Cu, Ga, Fe, Pb, Li, Mg, Mn, Ni, O, P, K, Sc, Si, Ag, Na, Sr, Sn, Ti, V, Zn, or Zr. In some embodiments, the aluminum alloy foil may contain more than 50% Cu. In some embodiments, the aluminum alloy foil may contain more than 40% Fe. In some embodiments, the aluminum alloy foil may contain more than 40% Mg. In some embodiments, the aluminum alloy foil may contain more than 40% Ni. In some embodiments, the aluminum alloy foil may contain more than 40% Zn. In some embodiments, the aluminum alloy foil may contain more than 60% Si.

[0102] In some embodiments, the magnesium alloy foil may contain magnesium between 45% and 100%. In some embodiments, the magnesium alloy foil may contain at least one of Al, Be, Ca, Ch, Cu, Gd, Fe, Li, Mn, Nd, Ni, Si, Ag, Th, Y, Zn, Zr, or rare earth metals. In some embodiments, the magnesium alloy foil may contain more than 40% Al.

[0103] In some embodiments, the titanium alloy foil may contain between 70% and 100% titanium. In some embodiments, the titanium alloy foil may contain at least one of the following elements: Al, B, C, Cr, Cu, H, Fe, Mn, Mo, Ni, Nb, N, O, Pd, Si, S, Ta, Sn, V, Y, or Zr.

[0104] In some embodiments, the melting temperature of the intermediate layer may be at least 10°C lower than the melting temperature of the core layer. The melting temperature of the intermediate layer may be minimized to reduce energy costs and the mechanical complexity of processing. In some embodiments, the melting temperature of the intermediate layer may be less than 500°C.

[0105] In some embodiments, the total foil thickness is generally between 25 μm and 1000 μm. Each intermediate layer may be up to 50% of the core material thickness and may have a thickness between 1 μm and 50 μm. The intermediate layer material can be deposited on one or both sides of the core material to form a single foil.

[0106] In some embodiments, the method may use a diffusible element comprising at least one of Cu, Mg, Zn, or Si. In some embodiments, the intermediate layer may contain at least 0.2% Cu. In some embodiments, the diffusible element may contain at least 1% Cu. In some embodiments, the diffusible element may contain at least 2% Cu. In some embodiments, the diffusible element may contain up to 4% Cu. In some embodiments, the diffusible element may contain up to 5% Cu. In some embodiments, the diffusible element may contain up to 6% Cu. In some embodiments, the diffusible element may contain up to 6.3% Cu.

[0107] In some embodiments, the method includes a step (step 1005) of raising the foil laminate to a maximum bonding temperature, which is higher than the melting temperature of the intermediate layer but lower than the melting temperature of the core layer of the constituent foil.

[0108] In some embodiments, the method may include a step (step 1010) of compressing the foil laminate by applying pressure. In some embodiments, the pressure may be approximately 0.1 to 100 MPa.

[0109] In some embodiments, applying at least one of temperature or pressure can cause the intermediate layer to melt, increasing the diffusion rate of elements from the core layer into the intermediate layer and the diffusion rate of elements from the intermediate layer into the core layer (step 1015). In some embodiments, the applied pressure can promote the mixing of elements between the core layer and the intermediate layer of the adjacent foil.

[0110] In some embodiments, as elements in the intermediate and core layers interdiffuse, the average composition of the laminated foil changes to resemble the final average composition of the object, and the melting temperature increases in response to the compositional change. In some embodiments, new bonds are formed between the metallic components.

[0111] In some embodiments, this process may be carried out sequentially. In a sequential process, the foil may be added to the part at a bonding temperature, which is higher than the melting temperature of the interlayer material, or the new foil may be added to the cold laminate and then raised to a maximum bonding temperature. In some embodiments, the interlayer of the added foil can be melted (step 1015) and the bonding process can be continued.

[0112] In some embodiments, the intermediate layer of the previously deposited layer has already interdiffused with the core layer, and the bonding is performed in such a way that the components do not melt at the applied bonding temperature, so the previously deposited layer is not affected by this process.

[0113] Figure 11 schematically shows a method 1100 for the additive manufacturing of an object by brazing according to one embodiment. In some embodiments, brazing is used to optimize the alloy composition and processing conditions for joining.

[0114] In some embodiments, the method includes a step of depositing a first foil (step 1105). In some embodiments, the first foil may be deposited on a print bed. In some embodiments, the first foil may be deposited on a foil. In some embodiments, the method further includes a step of depositing a second foil (step 1115). In some embodiments, the foil may include at least one intermediate layer and at least one core layer.

[0115] In some embodiments, the foil may be heated up to the bonding temperature (step 1120). In some embodiments, the bonding temperature is higher than the melting temperature of the intermediate layer but lower than the melting temperature of the core layer of the foil.

[0116] In some embodiments, the foil may be maintained at this bonding temperature for a set period (step 1125). In some embodiments, maintaining the foil at the bonding temperature can cause the intermediate layer to melt, thereby increasing the diffusion rate of elements from the core layer into the intermediate layer, and correspondingly increasing the diffusion rate of elements from the intermediate layer into the core layer.

[0117] This process causes the formation of a metallic bond between adjacent stacked foils, thereby forming an object (step 1130).

[0118] In some embodiments, the brazing process may be carried out sequentially. In a sequential brazing process, foils may be added to a subassembly or object comprising several joining foils. In some embodiments, additional liquid flux may be applied to the void space between the added foil and the object.

[0119] In some embodiments, the added foil and components may be heated up to a bonding temperature, which is higher than the melting temperature of the intermediate layer of the added foil, but lower than the melting temperature of the core layer of the added foil and lower than the melting temperature of the alloy constituting the component (step 1120).

[0120] In some embodiments, the added foil and components may be maintained at this bonding temperature for a set period (step 1125), thereby melting the intermediate layer of the added foil and causing the bonding process described above to occur.

[0121] In some embodiments, the intermediate layer of the previously deposited layer has already melted and interdiffused with the core layer, and the bonding is performed in such a way that the material does not melt at the applied bonding temperature, so the previously deposited layer may not be affected by this process.

[0122] In some embodiments, the alloy compositions of the core and intermediate layers may be used in other form factors, such as core-structured powders or core-structured wires, or combinations of the two powder compositions. These can then be joined together and diffused using the process described above, resulting in an object with a uniform composition that matches a desired composition, but is not identical to the composition of the constituent inputs.

[0123] The methods, systems, and devices discussed above are examples. Various configurations may omit, replace, or add various procedures or components as appropriate. For example, in alternative configurations, the method may be performed in a different order than described, and various such steps may be added, omitted, or combined. Similarly, features described for a particular configuration may be combined for various other configurations. Different aspects and elements of configurations may be combined in similar ways. Likewise, technology advances, and therefore many of the elements are examples and do not limit the scope of this disclosure or claims.

[0124] For example, embodiments of the present disclosure are described above with reference to block diagrams and / or operational example diagrams of methods, systems, and computer program products according to embodiments of the present disclosure. The functions / operations specified in the blocks may be performed in a different order than those shown in any of the flowcharts. For example, two blocks shown consecutively may actually be executed substantially simultaneously, and depending on the functions / operations involved, the blocks may sometimes be executed in reverse order. Furthermore or alternatively, it is not necessary to perform and / or execute all of the blocks shown in any of the flowcharts. For example, if a given flowchart has five blocks containing functions / operations, only three of the five blocks may be performed and / or executed. In this example, any of the three blocks of the five may be performed and / or executed.

[0125] The statement that a value exceeds (or is greater than) a first threshold is equivalent to the statement that the value satisfies or exceeds a second threshold that is slightly greater than the first threshold, for example, the second threshold being a single value higher than the first threshold in the resolution of the relevant system. The statement that a value is less than (or within) a first threshold is equivalent to the statement that the value is less than or equal to a second threshold that is slightly less than the first threshold, for example, the second threshold being a single value lower than the first threshold in the resolution of the relevant system.

[0126] The description includes specific details to provide a complete understanding of the exemplary configurations (including their implementation). However, the configurations may be implemented without these specific details. For example, well-known circuits, processes, algorithms, structures, and techniques are shown without unnecessary details to avoid obscuring the configurations. This description merely presents exemplary configurations and does not limit the claims, applicability, or configurations. Rather, the foregoing description of the configurations provides a description that enables the implementation of the described techniques to those skilled in the art. Various modifications can be made to the function and arrangement of the elements without departing from the spirit or scope of this disclosure. The present invention provides, for example, the following items: (Item 1) The core contains the remaining amount of Al, and Si between 0.2 and 0.4 wt%, Cu between 0.15 and 0.4 wt%, Mg between 0.8 and 1.2 wt%, and Cr between 0.04 and 0.35 wt%, as well as The cladding consists of the remaining amount of Al, and Si between 1.5 and 4.5 wt%, Cu between 0.15 and 0.4 wt%, Mg between 0.4 and 1.2 wt%, and Cr between 0.04 and 0.35 wt%. Clad foil, including. (Item 2) The clad foil according to item 1, wherein the trace elements in the core and clad composition include Fe between 0 and 0.3 wt%, Mn between 0 and 0.1 wt%, Zn between 0 and 0.25 wt%, and Ti between 0 and 0.15 wt%, any other element is less than 0.05 wt%, and the sum of all other elements is less than 0.15 wt%. (Item 3) Each foil is a clad foil as described in item 1, with a thickness between 25 μm and 1000 μm. (Item 4) The clad foil according to item 1, wherein the core is a first layer of the foil and the cladding is a second layer of the foil. (Item 5) The clad foil according to item 1, wherein a first layer forms the first cladding of the foil, a second layer forms the core of the foil, and a third layer forms the second cladding of the foil. (Item 6) The clad foil according to item 1, wherein the clad is between 8% and 45% of the total thickness of the clad foil.

Claims

1. A core containing the remaining amount of Al, and Si between 0.2 and 0.4 wt%, Cu between 0.15 and 0.4 wt%, Mg between 0.8 and 1.2 wt%, and Cr between 0.04 and 0.35 wt%, as well as A cladding comprising the remaining amount of Al, and Si between 1.5 and 4.5 wt%, Cu between 0.15 and 0.4 wt%, Mg between 0.4 and 1.2 wt%, and Cr between 0.04 and 0.35 wt%. A clad foil that includes, A clad foil in which the trace elements in the core and clad composition include Fe between 0 and 0.3% by weight, Mn between 0 and 0.1% by weight, Zn between 0 and 0.25% by weight, and Ti between 0 and 0.15% by weight, with any other element being less than 0.05% by weight, and the sum of all other elements being less than 0.15% by weight.

2. The clad foil according to claim 1, wherein the clad foil has a thickness between 25 μm and 1000 μm.

3. The clad foil according to claim 1, wherein the core is a first layer of the foil, and the cladding is a second layer of the foil.

4. The clad foil according to claim 1, wherein the first layer forms the first cladding of the foil, the second layer forms the core of the foil, and the third layer forms the second cladding of the foil.

5. The clad foil according to claim 1, wherein the total thickness of the clad is between 8% and 45% of the total thickness of the clad foil.

6. A core containing the remaining amount of Al, and Si between 0.2 and 0.4 wt%, Cu between 0.15 and 0.4 wt%, Mg between 0.8 and 1.2 wt%, and Cr between 0.04 and 0.35 wt%, as well as A cladding comprising the remaining amount of Al, and Si between 1.5 and 4.5 wt%, Cu between 0.15 and 0.4 wt%, Mg between 0.4 and 1.2 wt%, and Cr between 0.04 and 0.35 wt%. A clad foil that includes, The proportions of the core and cladding are selected such that the homogenization of the core and cladding results in an aluminum alloy having 0.4 to 0.8 wt% Si, 0.15 to 0.40 wt% Cu, 0.8 to 1.2 wt% Mg, and 0.04 to 0.35 wt% Cr. A clad foil in which the trace elements in the core and clad composition include Fe between 0 and 0.3% by weight, Mn between 0 and 0.1% by weight, Zn between 0 and 0.25% by weight, and Ti between 0 and 0.15% by weight, with any other element being less than 0.05% by weight, and the sum of all other elements being less than 0.15% by weight.

7. The clad foil according to claim 6, wherein the clad foil has a thickness between 25 μm and 1000 μm.

8. The clad foil according to claim 6, wherein the core is the first layer of the foil, and the cladding is the second layer of the foil.

9. The clad foil according to claim 6, wherein the first layer forms the first cladding of the foil, the second layer forms the core of the foil, and the third layer forms the second cladding of the foil.

10. The clad foil according to claim 6, wherein the total thickness of the clad is between 8% and 45% of the total thickness of the clad foil.

11. The clad foil according to claim 6, wherein the resulting alloy is a 6061 aluminum alloy.

12. The core contains the remaining amount of Al, and Si between 0.2 and 0.4 wt%, Cu between 0.15 and 0.4 wt%, Mg between 0.8 and 1.2 wt%, Cr between 0.04 and 0.35 wt%, and Mn less than 0.1 wt%, as well as A cladding containing the remaining amount of Al, and Si between 1.5 and 4.5 wt%, Cu between 0.15 and 0.4 wt%, Mg between 0.4 and 1.2 wt%, and Cr between 0.04 and 0.35 wt%. Includes, A clad foil in which the trace elements in the core and clad composition include Fe between 0 and 0.3% by weight, Mn between 0 and 0.1% by weight, Zn between 0 and 0.25% by weight, and Ti between 0 and 0.15% by weight, with any other element being less than 0.05% by weight, and the sum of all other elements being less than 0.15% by weight.

13. The clad foil according to claim 12, wherein the clad foil has a thickness between 25 μm and 1000 μm.

14. The clad foil according to claim 12, wherein the core is a first layer of the foil, and the cladding is a second layer of the foil.

15. The clad foil according to claim 12, wherein the first layer forms the first cladding of the foil, the second layer forms the core of the foil, and the third layer forms the second cladding of the foil.

16. The clad foil according to claim 12, wherein the total thickness of the clad is between 8% and 45% of the total thickness of the clad foil.

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