Semiconductor equipment

Abstract

To provide a semiconductor device.SOLUTION: A semiconductor device includes a plurality of semiconductor unit elements. The semiconductor unit element is disposed between a first insulating layer and a second insulating layer, which are disposed apart from each other in a normal line direction of a substrate. The semiconductor unit element includes a selection element layer and a phase change material layer that are disposed while extending in a direction parallel to the substrate. The phase change material layer has a superlattice similar structure. The phase change material layer is disposed along a recess part formed by the first insulating layer, the second insulating layer, and the selection element layer.SELECTED DRAWING: Figure 3C

Description

[Technical Field]

[0001] The present invention relates to a semiconductor element including a selective element layer and a variable resistor layer, and a semiconductor device including the same. [Background technology]

[0002] The trend toward miniaturization and lightness of electronic products is increasing the demand for highly integrated semiconductor elements. To address this, various forms of semiconductor elements have been proposed; one example is a semiconductor element that includes a variable resistance layer and a selective element layer. [Overview of the project] [Problems that the invention aims to solve]

[0003] The problem that this invention aims to solve is to provide a semiconductor device that can be driven with low power and has a high degree of integration. [Means for solving the problem]

[0004] A semiconductor device according to one embodiment is The substrate includes a first insulating layer and a second insulating layer arranged spaced apart from each other in the direction normal to the substrate, and a semiconductor unit element arranged between the first insulating layer and the second insulating layer, wherein the semiconductor unit element may also include a selective element layer and a phase change material layer arranged side by side in a direction parallel to the substrate.

[0005] The selected element layer is also arranged to cover a portion of the surface of the first insulating layer and the second insulating layer, while forming a recess.

[0006] The phase change material layer is arranged along the recess and covers the first insulating layer, the selection element layer, and the second insulating layer, such that the length of the surface adjacent to the first insulating layer is the same as or longer than the length of the surface adjacent to the selection element layer.

[0007] The phase change material layer is Ge x Te 1-xThe first chalcogen layer containing (0.3≦x≦0.7), and Sb y Te 1-y The first chalcogen layer and the second chalcogen layer may be arranged alternately one or more times in a direction parallel to the substrate.

[0008] The phase-change material layer is also arranged such that the length of the surface adjacent to the first insulating layer is more than 1.0 times and 5.0 times or less compared to the length of the surface adjacent to the selected element layer.

[0009] The selected element layer may include a pn junction and may also include MIEC (mixed ion-electron conductors) or a Mott transition device.

[0010] The selective element layer may contain a material having ovonic threshold switching characteristics. The selective element layer may contain a first element including germanium (Ge) and / or tin (Sn), a second element including arsenic (As), antimony (Sb) and / or bismuth (Bi), and a third element including sulfur (S), selenium (Se) and / or tellurium (Te).

[0011] The selective element layer and the phase-change material layer can be electrically connected. The semiconductor device may further include a first electrode electrically connected to a selection element layer and a second electrode electrically connected to a phase change material layer. The first electrode and / or the second electrode also serve as a common electrode that electrically connects a plurality of semiconductor unit elements. [Effects of the Invention]

[0012] According to the present invention, a semiconductor device including a plurality of semiconductor unit elements can be provided. Further, according to the present invention, a semiconductor device including a phase change material layer having a superlattice-like structure can be provided. Such a semiconductor device can be driven with low power, can implement an improved integration degree, and can contribute to miniaturization of an electronic device.

Brief Description of the Drawings

[0013] [Figure 1] It is an equivalent circuit diagram of a semiconductor device including a plurality of semiconductor unit elements. [Figure 2] It is a perspective view of a semiconductor device according to an embodiment. [Figure 3A] It is a plan view of a semiconductor device according to an embodiment. [Figure 3B] It is a cross-sectional view taken along the line I-I' of FIG. 3A. [Figure 3C] It is a schematic diagram showing an enlarged SA region of FIG. 3B. [Figure 4] It is a cross-sectional view of a semiconductor device according to an embodiment. [Figure 5] It is a graph schematically showing a voltage-current curve of a substance having ovonic threshold switching characteristics. [Figure 6A] It is a cross-sectional view showing a part of the manufacturing process of a semiconductor device according to an embodiment. [Figure 6B] It is a cross-sectional view showing a part of the manufacturing process of a semiconductor device according to an embodiment. [Figure 6C] It is a cross-sectional view showing a part of the manufacturing process of a semiconductor device according to an embodiment. [Figure 6D] [[ID=e38]]It is a cross-sectional view showing a part of the manufacturing process of a semiconductor device according to an embodiment. [Figure 6E] It is a cross-sectional view showing a part of the manufacturing process of a semiconductor device according to an embodiment. [Figure 6F] It is a cross-sectional view showing a part of the manufacturing process of a semiconductor device according to an embodiment. [Figure 6G] It is a cross-sectional view showing a part of the manufacturing process of a semiconductor device according to an embodiment. [Figure 7A]This is a cross-sectional view showing a part of the manufacturing process of a semiconductor device according to one embodiment. [Figure 7B] This is a cross-sectional view showing a part of the manufacturing process of a semiconductor device according to one embodiment. [Figure 7C] This is a cross-sectional view showing a part of the manufacturing process of a semiconductor device according to one embodiment. [Figure 7D] This is a cross-sectional view showing a part of the manufacturing process of a semiconductor device according to one embodiment. [Figure 7E] This is a cross-sectional view showing a part of the manufacturing process of a semiconductor device according to one embodiment. [Modes for carrying out the invention]

[0014] The terms used herein are for illustrative purposes only regarding specific embodiments and are not intended to limit the technical ideas. Where “top” or “above” is written, it may include not only things that are in contact and immediately above, below, to the sides, but also things that are not in contact and are in the above, below, to the sides, etc.

[0015] A singular expression includes plural expressions unless the context clearly indicates otherwise. Terms such as “includes” or “has,” unless otherwise specifically stated, indicate the presence of a feature, number, stage, operation, component, part, ingredient, material, or combination thereof described in the specification, and should not be understood to preemptively exclude the possibility of the presence or addition of one or more other features, numbers, stages, operations, components, parts, ingredients, materials, or combination thereof.

[0016] Terms such as "first," "second," and "third" may be used to describe various components, but they are used solely to distinguish one component from others and do not limit the order or type of the components. Furthermore, terms such as "unit," "means," "module," and "...part" refer to comprehensive components that process a particular function or operation, and these can be embodied by hardware or software, or by a combination of hardware and software.

[0017] The embodiment will be described in detail below with reference to the attached drawings. In the following drawings, the same reference numerals refer to the same components, and the size of each component (width, thickness, etc. of layers, areas, etc.) is exaggerated in the drawings for clarity and convenience of explanation. On the other hand, the embodiments described below are merely illustrative, and various modifications are possible from such embodiments.

[0018] In one aspect, the semiconductor device may also be a three-dimensional structure in which two spaced-apart electrode lines have a cross point, and may include a semiconductor unit element comprising a variable resistance layer and a selection element layer electrically connected to each other at the cross point. Such a semiconductor element and / or semiconductor device is also a memory element.

[0019] Figure 1 is an equivalent circuit diagram of a semiconductor device containing multiple semiconductor unit elements. Referring to Figure 1, the semiconductor device 101 may include multiple first electrode lines WL1, WL2 extending parallel to each other in a first direction (X direction). The semiconductor device 101 may also include second electrode lines BL1, BL2, BL3, BL4 that are separated from the first electrode lines WL1, WL2 in a third direction (Z direction) and extend parallel to each other in a second direction (Y direction). Semiconductor unit elements MC are also arranged between the first electrode lines WL1, WL2 and the second electrode lines BL1, BL2, BL3, BL4. Specifically, the semiconductor unit elements MC are electrically connected to the first electrode lines WL1, WL2 and the second electrode lines BL1, BL2, BL3, BL4, and are also arranged at the intersections between these lines. Furthermore, the semiconductor unit elements MC may include a phase change material layer ME and a selective element layer SW that are electrically connected to each other. For example, the phase change material layer ME and the selective element layer SW may be arranged in series along the third direction (Z direction), with the selective element layer SW electrically connected to one of the first electrode lines WL1, WL2 and the second electrode lines BL1, BL2, BL3, BL4, and the phase change material layer ME also electrically connected to the other electrode lines.

[0020] To briefly explain the driving method of the semiconductor device 101, a voltage is applied to the phase change material layer ME of the semiconductor device MC via the first electrode lines WL1, WL2 and the second electrode lines BL1, BL2, BL3, BL4, causing a current to flow. Specifically, by selecting the first electrode lines WL1, WL2 and the second electrode lines BL1, BL2, BL3, BL4, any semiconductor device MC can be addressed, and a predetermined signal can be applied between the first electrode lines WL1, WL2 and the second electrode lines BL1, BL2, BL3, BL4 to program the semiconductor device MC. Furthermore, by measuring the current value via the second electrode lines BL1, BL2, BL3, BL4, information based on the resistance value of the phase change material layer ME of the semiconductor device MC, i.e., programmed information, can be read.

[0021] The selection element layer SW can control the flow of current to the semiconductor unit element MC electrically connected to the selection element layer SW, and can perform the role of selecting (addressing) the semiconductor unit element MC.

[0022] The phase-change material layer ME can serve the role of storing information. Specifically, the resistance of the phase-change material layer ME can vary depending on the applied voltage. The semiconductor unit element MC can store and erase digital information such as "0" or "1" based on the resistance change of the phase-change material layer ME. For example, the semiconductor unit element MC can write data to the phase-change material layer ME, with the high-resistance state being "0" and the low-resistance state being "1". Here, writing from the high-resistance state "0" to the low-resistance state "1" can be called a "set operation", and writing from the low-resistance state "1" to the high-resistance state "0" can be called a "reset operation".

[0023] The phase-change material layer ME may contain a substance whose phase can be reversibly changed depending on the temperature. In other words, the phase-change material layer ME may contain a substance whose phase state can be reversibly changed by Joule heating that occurs when an external electrical pulse is applied, and whose resistance can be changed by such a phase change.

[0024] The phase-change material layer ME may contain a chalcogen compound having a superlattice-like structure. Existing phase-change material layers include GST (Ge-Sb-Te) alloys, which undergo a phase change between crystalline and amorphous states depending on the heating time (applied heat), while simultaneously changing electrical resistance. However, chalcogen compounds having a superlattice-like structure offer even greater advantages over GST (Ge-Sb-Te) alloys for low-power and / or high-speed operation of semiconductor devices. Specifically, when a first chalcogen layer containing Ge-Te and a second chalcogen layer containing Sb-Te are alternately stacked to form a superlattice-like structure, a phase change occurs at the interface between the two chalcogen layers, where the elemental bonding of Ge differs, resulting in changes to the electrical resistance, such as an inverted Petrov phase or a Kooi phase (Adv. Mater. Interfaces 2014, 1, 1300027). Such chalcogenous materials can undergo phase changes at even lower energies than GST (Ge-Sb-Te) alloys, and the time required for the phase change is also even shorter.

[0025] Furthermore, in the case of a semiconductor device in which multiple semiconductor unit elements (MCs) are arranged spaced apart on the XY plane, as shown in Figure 1, the required area increases with the number of semiconductor unit elements, making it difficult to keep up with the trend towards miniaturization due to the limitations of the minimum linewidth (minimum feature size).

[0026] To address these problems, one embodiment provides a semiconductor device in which the phase change material layer ME contains a chalcogen compound having a superlattice-like structure, enabling low power / high-speed operation, and in which multiple semiconductor unit elements MC are spaced apart along the Z-axis, thereby improving integration density.

[0027] Figure 2 is a perspective view of a semiconductor device according to one embodiment. Referring to Figure 2, in the semiconductor device 20, a selection element layer 130 and a phase change material layer 110 are arranged side by side in the XY plane to form a semiconductor unit element, and multiple such semiconductor unit elements are arranged separated by a first insulating layer 200 in a direction perpendicular to the substrate 100 (Z direction).

[0028] Figure 3A is a plan view of a semiconductor device according to one embodiment, Figure 3B is a cross-sectional view taken in the direction of line I-I' in Figure 3A, and Figure 3C is a schematic diagram showing an enlarged view of the SA region in Figure 3B. Referring to Figures 3A and 3B, in the semiconductor device 20, the semiconductor unit elements MC1a, MC1b, and MC2a are spaced apart from each other in the Z direction with a first insulating layer 200 in between (semiconductor unit elements MC1a, MC2a), and in the XY plane, they are spaced apart from each other with a second insulating layer 210 in between (semiconductor unit elements MC1a, MC1b). Furthermore, each semiconductor unit element MC1a, MC1b, and MC2a may include a selection element layer 130 and a phase change material layer 110 arranged in a direction parallel to the substrate (X direction).

[0029] Furthermore, referring to Figure 3C, the phase change material layer 110 may include a first chalcogen layer 110a containing Ge-Te and a second chalcogen layer 110b containing Sb-Te. Both the first chalcogen layer 110a and the second chalcogen layer 110b may have a superlattice-like structure. Specifically, the first chalcogen layer 110a and the second chalcogen layer 110b may be arranged alternately one or more times in a direction parallel to the substrate 100 (X direction). For example, the phase change material layer 110 may include (A m B 1-m ) nIt can also be expressed as follows. A is the first chalcogen layer, B is the second chalcogen layer, 0 < m < 1, and n is the number of repetition cycles of the first chalcogen layer and the second chalcogen layer. The number of repetition cycles n of the first chalcogen layer 110a and the second chalcogen layer 110b is 1.5 or more, 2 or more, 2.5 or more, 3 or more, or 200 or less, 150 or less, 130 or less, 100 or less, 95 or less, or 90 or less.

[0030] The first chalcogen layer 110a is Ge x Te 1-x It may contain a compound represented by (0.3 ≤ x ≤ 0.7). The second chalcogen layer 110b is Sb y Te 1-y It may contain a compound represented by (0.2 ≤ y ≤ 0.8). Further, the first chalcogen layer 110a and / or the second chalcogen layer 110b may each independently further contain one or more dopant substances selected from the group consisting of C, N, In, Zn, Sc, and Sn.

[0031] The phase change material layer 110 may have a thickness of 30 nm or more, 35 nm or more, 40 nm or more, 100 nm or less, 95 nm or less, 90 nm or less, 85 nm or less, or 80 nm or less in the direction (X direction) parallel to the substrate 100. Further, the first chalcogen layer 110a and the second chalcogen layer 110b may each independently have a thickness of 1 nm or more, 2 nm or more, 3 nm or more, 5 nm or more, 20 nm or less, 15 nm or less, or 10 nm or less.

[0032] On the other hand, the first chalcogen layer 110a and / or the second chalcogen layer 110b may have an electron transfer path (electron carrier path) inside each layer. Thereby, the semiconductor unit elements MC1a and MC2a arranged adjacent to each other in the vertical direction (Z direction) share the first chalcogen layer 110a and / or the second chalcogen layer 110b, and cross-talk may occur between the semiconductor unit elements MC1a and MC2a.

[0033] In one embodiment, the semiconductor device can minimize or prevent electron transfer in the phase change material layer 110 between adjacent semiconductor unit elements MC1a and MC2a.

[0034] According to one embodiment, referring to Figure 3C, the selection element layer 130 is arranged between the two first insulating layers 200 such that it covers a portion of the surface of the two first insulating layers 200 and forms a recess R, and the phase change material layer 110 is also arranged along such a recess so as to cover the two first insulating layers 200 and the selection element layer 130. The length d2 of the surface of the phase change material layer 110 adjacent to the first insulating layer 200 is the same as or greater than the length d1 of the surface of the phase change material layer 110 adjacent to the selection element layer 130, thereby minimizing crosstalk between adjacent semiconductor unit elements MC1a and MC2a. For example, the length d2 of the surface of the phase change material layer 110 adjacent to the first insulating layer 200 is more than 1.0 times, 1.5 times or more, 2.0 times or more, 5.0 times or less, 4.5 times or less, or 4.0 times or less compared to the length d1 of the surface adjacent to the selection element layer.

[0035] In semiconductor devices according to other embodiments, the first chalcogen layer and the second chalcogen layer may be electrically insulated by the first insulating layer 200. Figure 4 illustrates a semiconductor device according to another embodiment. Referring to Figure 4, the semiconductor device 30 includes a first semiconductor element MC1a, which includes a first selective element layer 1301 and a first phase change material layer 1101 that are extended in a direction parallel to the substrate 100 and arranged side by side, and a second semiconductor element MC2a, which includes a second selective element layer 1302 and a second phase change material layer 1102 that are extended in a direction parallel to the substrate 100 and arranged side by side. The first semiconductor element MC1a and the second semiconductor element MC2a are arranged separated from each other in the direction normal to the substrate 100, with the first insulating layer 200 in between. The first phase-change material layer 1101 and the second phase-change material layer 1102 may each include first chalcogen layers 1101a, 1102a and second chalcogen layers 1101b, 1102b, which are extended and arranged in a direction parallel to the substrate 100. The first phase-change material layer 1101 and the second phase-change material layer 1102 are physically separated from each other and electrically insulated by the first insulating layer 200, thereby preventing electron transfer between semiconductor unit elements MC1a and MC2a. The thickness of the first insulating layer 200 may be 5 nm or more, 10 nm or more, 15 nm or more, 50 nm or less, 45 nm or less, 40 nm or less, 35 nm or less, or 30 nm or less.

[0036] Referring again to Figure 3C, the selective element layer 130 may include a material whose resistance can change depending on the magnitude of the voltage applied across its terminals. For example, the selective element layer 130 may include a pn junction and may include MIEC (mixed ion-electron conductors) or a Mott transition device. According to one embodiment, the selective element layer 130 is also a diode. Specifically, the diode is also a junction structure (not shown) in which materials having different conductivity types are arranged side by side, extending in a direction parallel to the substrate. For example, the diode has N-type and P-type conductivity types, with one of the N-type and P-type conductivity types arranged adjacent to the first electrode CL1, and the other arranged adjacent to the phase change material layer 110 and / or the second electrode CL2. The selective element layer 130 is also a silicon diode with P-Si and N-Si junctions. Alternatively, the selective element layer 130 is P-NiO x and N-TiO x The two are joined together, or P-CuO x and N-TiO x It is also an oxide diode in which two elements are joined together.

[0037] In other embodiments, the selection element layer 130 may have ovonic threshold switching (OTS) characteristics.

[0038] Figure 5 is a schematic graph showing the voltage-current curve of the selection element layer 130 having obonic threshold switching characteristics. Referring to Figure 5, the first curve 61 shows the voltage-current relationship when almost no current flows through the selection element layer 130. When the voltage gradually increases from a state where the voltage and current are 0, the voltage reaches the threshold voltage V T Until the voltage reaches the first voltage level (63), the selection element layer 130 is in a high-resistance state and almost no current flows. However, when the voltage reaches the threshold voltage V T As soon as it exceeds this value, the selection element layer 130 enters a low-resistance state, the current flowing through the selection element layer 130 increases rapidly, and the voltage applied to the selection element layer 130 becomes the saturation voltage V SThe voltage will drop to (second voltage level 64). The second curve 62 shows the voltage-current relationship when current flows more smoothly through the selection element layer 130. As the current flowing through the selection element layer 130 rises above the first current level 66, the voltage applied to the selection element layer 130 may rise slightly above the second voltage level 64. For example, while the current flowing through the selection element layer 130 rises considerably from the first current level 66 to the second current level 67, the voltage applied to the selection element layer 130 may rise slightly above the second voltage level 64. In other words, once current begins to flow through the selection element layer 130, the voltage applied to the selection element layer 130 will rise to the saturation voltage V S It can be maintained to a certain extent. If the current is reduced to below the maintenance current level (first current level 66), the selection element layer 130 is also converted to a high-resistance state, and the voltage is reduced to the threshold voltage V T The current can be effectively blocked until it rises to V. Due to such characteristics, the selection element layer 130 has a threshold voltage of the first voltage level 63 V. T It may have the following switching characteristics.

[0039] The select element layer 130 having ovonic threshold switching characteristics may also contain a first element including germanium (Ge) and / or tin (Sn), a second element including arsenic (As), antimony (Sb) and / or bismuth (Bi), and a third element including sulfur (S), selenium (Se) and / or tellurium (Te).

[0040] The first element content of the selected element layer 130 is 5.0 at% or more and 30.0 at% or less relative to the total element content. For example, the first element content is 7.0 at% or more, 10.0 at% or more, 25.0 at% or less, 23.0 at% or less, or 20.0 at% or less relative to the total element content.

[0041] The secondary element content of the selective element layer 130 is 5.0 at% or more and 50.0 at% or less relative to the total element content. For example, the secondary element content is also 7.0 at% or more, 10.0 at% or more, 15.0 at% or more, 20.0 at% or more, 45.0 at% or less, 40.0 at% or less, or 35.0 at% or less relative to the total element content.

[0042] The third element content of the selected element layer 130 is greater than 0.0 at% relative to the total element, and also 70.0 at% or less. For example, the third element content is also 10.0 at% or more, 15 at% or more, 20.0 at% or more, 25.0 at% or more, 30.0 at% or more, 35.0 at% or more, 40.0 at% or more, 65.0 at% or less, 60.0 at% or less, or 55.0 at% or less relative to the total element.

[0043] The selective element layer 130 and the phase change material layer 110 may be electrically connected. For example, a third electrode 120 may be further included between the selective element layer 130 and the phase change material layer 110. The third electrode 120 may be a metal, a conductive metal nitride, a conductive metal oxide, or a combination thereof. For example, the third electrode 120 may be one or more selected from carbon (C), titanium nitride (TiN), titanium silicon nitride (TiSiN), titanium carbon nitride (TiCN), titanium carbon silicon nitride (TiCSiN), titanium aluminum nitride (TiAlN), tantalum (Ta), tantalum nitride (TaN), tungsten (W), and tungsten nitride (WN).

[0044] Furthermore, a heating electrode (not shown) may be included between the third electrode 120 and the phase change material layer 110. The heating electrode may be formed integrally with the third electrode 120 or as a separate layer. The heating electrode may contain a conductive material that does not react with the phase change material layer 110 and can generate enough heat to cause a phase change in the phase change material layer 110. The heating electrode may contain a carbon-based conductive material. For example, the heating electrode may contain TiN, TiSiN, TiAlN, TaSiN, TaAlN, TaN, WSi, WN, TiW, MoN, NbN, TiBN, ZrSiN, WSiN, WBN, ZrAlN, MoAlN, TiAl, TiON, TiAlON, WON, TaON, carbon (C), silicon carbide (SiC), silicon carbon nitride (SiCN), carbon nitride (CN), titanium carbonitride (TiCN), tantalum carbonitride (TaCN), or a combination thereof.

[0045] The third electrode 120 is formed to a thickness such that the heat generated by the heating electrode (not shown) does not substantially affect the selection element layer 130. The third electrode 120 may also further include a thermal barrier layer, and may have a structure in which the thermal barrier layer and the electrode material layer are alternately stacked. The third electrode 120 may have a thickness of about 10 nm to about 100 nm.

[0046] The first electrode CL1 and the second electrode CL2 are also placed at both ends of the semiconductor unit elements MC1a and MC2a. Specifically, the first electrode CL1 may be electrically connected to the selection element layer 130, and the second electrode CL2 may be electrically connected to the phase change material layer 110.

[0047] The first electrode CL1 extends parallel to each other in the X direction and is also positioned between the two layers of the first insulating layer 200. The second electrode CL2 also extends parallel to each other in the Z direction and is also positioned between the two layers of the second insulating layer 210. On the drive side of the semiconductor devices 20 and 30, the first electrode CL1 is connected to either the word line or the bit line, and the second electrode CL2 is connected to the other one. One or more of the first electrode CL1 and the second electrode CL2 are also common electrodes for multiple semiconductor unit elements MC1a, MC1b, and MC2a. Specifically, referring to Figures 3A and 3B, the first electrode CL1 is also positioned extending in the Y direction between the first insulating layer 200 separated in the Z direction and can be commonly connected to multiple semiconductor unit elements MC1a or MC1b positioned at the same level. Furthermore, the second electrode CL2 may be arranged in the Z direction even if it is extended between the second insulating layers 210 that are separated in the Y direction, and may be commonly connected to multiple semiconductor unit elements MC1a, MC1b, and MC2a arranged at the same level.

[0048] The semiconductor devices 20 and 30 may include a substrate 100. For example, the substrate 100 may contain semiconductor materials such as silicon (Si), germanium (Ge), silicon germanium (SiGe), silicon carbide (SiC), gallium arsenide (GaAs), indium arsenide (InAs), and indium phosphide (InP), and may also contain insulating materials such as silicon oxide, silicon nitride, or silicon oxynitride.

[0049] The semiconductor devices 20 and 30 may further include an interlayer insulating layer (not shown) on the substrate 100. The interlayer insulating layer (not shown) is disposed between the substrate 100 and the first electrode CL1 and / or the second electrode CL2, and can serve to electrically isolate them. The interlayer insulating layer (not shown) may contain an oxide such as silicon oxide and / or a nitride such as silicon nitride.

[0050] The semiconductor devices 20 and 30 may further include a separation insulating layer 150. Referring to Figure 3B, the separation insulating layer 150 is in contact with the upper surface of the substrate 100 and extends in the Z direction (Z) on the upper surface of the substrate 100. The separation insulating layer 150 is also formed by penetrating the first electrode CL1 and the first insulating layer 200. Referring to Figure 3A, the separation insulating layer 150 extends along one side of the first electrode CL1 or along the Y direction and is positioned on both sides of the second insulating layer 210 or interposed between two first electrodes CL1 positioned adjacent to each other in the X direction.

[0051] The semiconductor devices 20 and 30 may further include a drive circuit region (not shown) on the substrate 100. This drive circuit region may include peripheral circuits, drive circuits, and core circuits that drive semiconductor unit elements or perform arithmetic processing. Such circuits may include, for example, a page buffer, a latch circuit, a cache circuit, a column decoder, a sense amplifier, a data in / out circuit, or a row decoder. Such circuits may also be arranged between the substrate and the semiconductor unit elements. In other words, the drive circuit region and the semiconductor elements are arranged sequentially on the substrate 100, and such an arrangement is also a COP (cell on peri) structure.

[0052] The drive circuit region may include one or more transistors (TRs) and wiring structures electrically connected to such transistors (TRs). The transistors (TRs) are also located on an active region (AC) of the substrate defined by an element isolation film. The transistors (TRs) may include a gate (G), a gate insulating film (GD), and a source / drain (SD). In addition, insulating spacers are located on both side walls of the gate (G), and an etching stop film is located on the gate (G) and / or on the insulating spacers. The etching stop film may contain an insulating material such as silicon nitride or silicon oxynitride.

[0053] The wiring structure is also arranged in an appropriate number and position depending on the layout of the drive circuit area, the type and arrangement of gates (G), etc. The wiring structure may have a multilayer structure of two or more layers. Specifically, the wiring structure includes interconnected contacts and wiring layers, which are sequentially stacked on the substrate 100. The contacts and wiring layers may each be independently made of metal, conductive metal nitride, metal silicide, or a combination thereof, and may include conductive materials such as tungsten, molybdenum, titanium, cobalt, tantalum, nickel, tungsten silicide, titanium silicide, cobalt silicide, tantalum silicide, and nickel silicide.

[0054] The wiring structure may include an interlayer insulating film that electrically isolates each component. The interlayer insulating film may also be placed between multiple transistors (TRs), between multiple wiring layers, and / or between multiple contacts. The interlayer insulating film may include silicon oxide, silicon nitride, silicon oxynitride, and the like.

[0055] The semiconductor device can also be manufactured by common methods known in the industry. Figures 6A to 6G are cross-sectional views showing part of the manufacturing process of a semiconductor device according to one embodiment.

[0056] Referring to Figure 6A, the structure L is formed by alternately stacking the first insulating layer 200 and the sacrificial layer 300 on the substrate 100. The first insulating layer 200 is also placed on the surface of the substrate 100 and on the top of the structure L.

[0057] Referring to Figure 6B, a vertical trench T is formed in the structure L in the Z direction. Substructures L1 and L2 can be formed on both sides of the vertical trench T.

[0058] Referring to Figure 6C, the sacrificial layer 300 is selectively removed, forming a horizontal hole H in the X-axis direction between the two first insulating layers 200.

[0059] Referring to Figure 6D, a selection element layer 130 is formed in a portion of the interior of the horizontal hole H. The selection element layer 130, together with the two first insulating layers 200, can form the first recess R1.

[0060] Referring to Figure 6E, a third electrode 120 is formed in a portion of the remaining interior of the horizontal hole H. The third electrode 120 is arranged extending in a direction parallel to the selection element layer 130 and the substrate 100, and together with the two first insulating layers 200, can form a second recess R2. The second recess R2 is also formed such that the distance d2 at which the first insulating layer 200 is exposed to the vertical trench T and the horizontal hole H is longer than the distance d1 between the two first insulating layers 200. For example, the distance d2 at which the first insulating layer 200 is exposed to the vertical trench T and the horizontal hole H is more than 1.0 times, 1.5 times or more, 2.0 times or more, 5.0 times or less, 4.5 times or less, or 4.0 times or less, compared to the distance d1 between the two first insulating layers 200.

[0061] Referring to Figure 6F, a phase change material layer 110 is formed along the side walls of the horizontal hole H and the vertical trench T. The phase change material layer 110 is formed by the alternating stacking of a first chalcogen layer 110a and a second chalcogen layer 110b.

[0062] Referring to Figure 6G, the second electrode CL2 is formed in the horizontal hole H and the remaining space of the trench T.

[0063] Furthermore, in other embodiments such as Figure 4, the steps shown in Figures 7A to 7E may be added between Figures 6F and 6G. Specifically, after forming a sacrificial layer SL in the horizontal hole H and the remaining space of the vertical trench T (Figure 7A), a portion of the sacrificial layer SL, a portion of the first insulating layer 200, and a portion of the phase change material layer 110 are removed (etched) to a length (in the X direction) where most of the phase change material layer 110 covering the first insulating layer 200 is removed (Figure 7B). In the phase change material layer 110, after selectively removing the portion exposed between the two layers of the first insulating layer 200 that is not covered by the remaining portion of the sacrificial layer SL (Figure 7C), another phase change material layer 110 can be formed in the removed position to have a height similar to that of the adjacent phase change material layer 110 (to a height that does not touch the sacrificial layer SL) (Figure 7D). Subsequently, the remaining portion of the sacrificial layer SL can be removed, and a trench T2 wider than the trench T in Figure 6F can be formed (Figure 7E). The formed trench T2 is also filled with the second electrode material CL2, as shown in Figure 6G.

[0064] Specifically, each component, such as the first electrode CL1 and the second electrode CL2, the first insulating layer 200 and the second insulating layer 210, the selection element layer 130, the third electrode 120, and the phase change material layer 110, can also be formed by methods known in the art. These components can also be formed independently by deposition methods such as atomic layer deposition (ALD), chemical vapor deposition (CVD), physical vapor deposition (PVD), or sputtering to have a desired composition and thickness. For example, the phase change material layer 110 can also be manufactured by atomic layer deposition (ALD) using a source containing germanium (Ge), tellurium (Te), and antimony (Sb) in sequence.

[0065] Furthermore, these components can also be patterned independently using methods known in the industry. Specifically, not only can embossed etching methods utilizing mask patterns be used, but damascene methods can also be employed.

[0066] According to the exemplary embodiments described above, a semiconductor device comprising a plurality of semiconductor unit elements may be provided. A semiconductor device comprising a phase-change material layer having a superlattice-like structure may also be provided. Such a semiconductor device can be driven with low power, can embody improved integration density, and can contribute to the miniaturization of electronic devices.

[0067] Although this embodiment has been described in detail above, the scope of the rights is not limited to these, and various modifications and improvements made by those skilled in the art using the basic concepts defined in the claims also fall within the scope of the rights. [Explanation of Symbols]

[0068] 20,30,101 Semiconductor equipment 110a, 1101a, 1102a First Cargogen Layer 110b, 1101b, 1102b Second Cargogen Layer 120 3rd electrode 150 Separation insulating layer 200 First insulating layer 210 Second insulating layer CL1 1st electrode CL2 2nd electrode MC, MC1a, MC1b, MC2a Semiconductor Unit Elements ME, 110, 1101, 1102 Phase change material layer SW, 130, 1301, 1302 Selected element layer

Claims

1. The device includes a substrate, a first insulating layer and a second insulating layer arranged spaced apart from each other in the direction normal to the substrate, and a semiconductor unit element arranged between the first insulating layer and the second insulating layer. The semiconductor unit element has a selective element layer and a phase change material layer that are arranged in a direction parallel to the substrate and extended in the same direction. The aforementioned phase change material layer is Ge ｘ Te １－ｘ The first chalcogen layer containing (0.3 ≤ x ≤ 0.7), and Sb ｙ Te １－ｙ It includes a second chalcogen layer containing (0.2 ≤ y ≤ 0.8), The first chalcogen layer and the second chalcogen layer are alternately stacked to form a superlattice-like structure. The selected element layer is arranged to form a recess while covering a portion of the surface of the first insulating layer and the second insulating layer. The phase change material layer is arranged along the recess portion and covers the first insulating layer, the selection element layer, and the second insulating layer, and the length of the surface adjacent to the first insulating layer is longer than the length of the surface adjacent to the selection element layer. A semiconductor device wherein the phase change material layer has a length of the surface adjacent to the first insulating layer that is greater than 1.0 times and less than or equal to 5.0 times the length of the surface adjacent to the selection element layer.

2. The semiconductor device according to claim 1, wherein the first chalcogen layer and the second chalcogen layer are arranged alternately one or more times in a direction parallel to the substrate.

3. The semiconductor device according to claim 1 or 2, wherein the first chalcogen layer and the second chalcogen layer each independently have a thickness of 1 nm or more in a direction parallel to the substrate and a thickness of 20 nm or less.

4. The semiconductor device according to any one of claims 1 to 3, wherein one or more of the first chalcogen layer and the second chalcogen layer each independently contain one or more dopant materials selected from the group consisting of C, N, In, Zn, Sc, and Sn.

5. The semiconductor device according to any one of claims 1 to 4, wherein the selection element layer and the phase change material layer are electrically connected.

6. The semiconductor device according to any one of claims 1 to 5, further comprising a heating electrode layer between the selection element layer and the phase change material layer.

7. The semiconductor device according to any one of claims 1 to 6, wherein the phase change material layer has a thickness of 30 nm or more and 100 nm or less.

8. The semiconductor device according to any one of claims 1 to 7, further comprising a first electrode electrically connected to the selection element layer and a second electrode electrically connected to the phase change material layer.

9. It contains multiple semiconductor unit elements, The semiconductor device according to claim 8, wherein the plurality of semiconductor unit elements include the first electrode or the second electrode as a common electrode.

10. The semiconductor device according to any one of claims 1 to 9, wherein the selection element layer includes a material having ovonic threshold switching characteristics.

11. The aforementioned selection element layer is A first element selected from the group consisting of germanium (Ge) and tin (Sn), A second element selected from the group consisting of arsenic (As), antimony (Sb), and bismuth (Bi), The semiconductor device according to claim 10, comprising a third element selected from the group consisting of sulfur (S), selenium (Se), and tellurium (Te).

12. circuit board and A first semiconductor element comprising a first selectable element layer and a first phase change material layer, which are arranged side by side and extending in a direction parallel to the substrate, A second semiconductor element comprising a second selective element layer and a second phase change material layer, which are arranged side by side and extending in a direction parallel to the substrate, The first semiconductor element and the second semiconductor element are separated from each other in the direction normal to the substrate, with an insulating layer in between. The first phase change material layer and the second phase change material layer are each independently of Ge ｘ Te １－ｘ The first chalcogen layer containing (0.3 ≤ x ≤ 0.7) and Sb ｙ Te １－ｙ A second chalcogen layer containing (0.2 ≤ y ≤ 0.8), and, The first chalcogen layer and the second chalcogen layer are arranged in an extended direction parallel to the substrate. The first chalcogen layer and the second chalcogen layer are alternately stacked to form a superlattice-like structure. The thickness of the insulating layer is 5 nm or more and 50 nm or less. The semiconductor device comprises a first phase-change material layer and a second phase-change material layer, each independently having a thickness of 30 nm or more and 100 nm or less in a direction parallel to the substrate.

13. The semiconductor device according to claim 12, wherein the first phase-change material layer and the second phase-change material layer are electrically insulated by the insulating layer.

14. The semiconductor device according to claim 12 or 13, wherein one or more of the first chalcogen layer and the second chalcogen layer each independently contain one or more dopant materials selected from the group consisting of C, N, In, Zn, Sc, and Sn.

15. The semiconductor device according to any one of claims 12 to 14, further comprising a first electrode electrically connected to either the first selection element layer or the second selection element layer.

16. The semiconductor device according to any one of claims 12 to 15, further comprising a second electrode electrically connected to the first phase-change material layer and the second phase-change material layer and extending in the direction normal to the substrate.

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