High-voltage feed-through capacitor
The high-voltage through-capacitor design uses cylindrical cases to ensure insulation and prevent resin leakage, addressing resin-related issues and enhancing reliability and stability.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- TDK CORP
- Filing Date
- 2022-09-13
- Publication Date
- 2026-04-23
AI Technical Summary
High-voltage through-capacitors sealed with resin encapsulants face issues such as resin leakage during manufacturing, which can lead to electrical short circuits and reliability problems.
A high-voltage through-capacitor design that uses a cylindrical first and second case to surround the through-conductor, eliminating the need for resin encapsulant, ensuring insulation through case fixation and air discharge suppression.
The design prevents resin leakage and associated defects, enhances insulation, and reduces the risk of electrical short circuits while maintaining moisture resistance and positional stability without using resin encapsulants.
Smart Images

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Abstract
Description
Technical Field
[0001] The present disclosure relates to a high-voltage through-capacitor.
Background Art
[0002] A known high-voltage through-capacitor includes a dielectric body, a first electrode, a second electrode, and a through-conductor (see, for example, Patent Document 1). A through-hole is formed in the dielectric body. The first electrode and the second electrode are provided on both surfaces of the dielectric body where the through-hole opens. The through-conductor is inserted into the through-hole and is electrically connected to the first electrode.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] The high-voltage through-capacitor as described above is sealed with a resin encapsulant for ensuring insulation. However, when using a resin encapsulant, there is a risk of problems such as resin leakage from the gaps of the product in the manufacturing line.
[0005] One aspect of the present disclosure aims to provide a high-voltage through-capacitor that does not use a resin encapsulant.
Means for Solving the Problems
[0006] A high-voltage through-hole capacitor according to one aspect of the present disclosure comprises a capacitor having a body having a through-hole extending in a first direction, a first electrode and a second electrode arranged opposite to each other in the body, a through-conductor inserted through the through-hole and electrically connected to the first electrode, a grounding fitting electrically connected to the second electrode, and a cylindrical first case and a second case surrounding the through-conductor, wherein the body has a first end face and a second end face facing each other in a first direction, a first protrusion provided on the first end face with an opening for the through-hole, and a second protrusion provided on the second end face with an opening for the through-hole, the first case is attached to the first protrusion and the second case is attached to the second protrusion.
[0007] In the above high-voltage through-hole capacitor, the first and second cases surround the through-hole conductor, so insulation can be ensured without using a resin encapsulant. The first case is attached to the first protrusion on the first end face of the base body, so the first case can be securely fixed. The second case is attached to the second protrusion on the second end face of the base body, so the second case can be securely fixed.
[0008] In one of the above embodiments, the element further has an outer surface extending in a first direction and connecting a first end face and a second end face, and an inner surface facing the outer surface in a direction perpendicular to the first direction and defining a through hole, and the first electrode may be placed on the inner surface and the second electrode on the outer surface. In this case, if the second electrode placed on the outer surface is used as the ground electrode, the distance between adjacent capacitors can be shortened.
[0009] In one of the above embodiments, the inner surface may have an exposed region exposed from the first electrode adjacent to the top surface of the second protrusion. In this case, even if the second electrode is arranged on the second end face, the first electrode and the second electrode can be sufficiently spaced apart to suppress the occurrence of an electrical short circuit.
[0010] In one embodiment described above, the first electrode includes a first electrode portion arranged on the inner surface and a second electrode portion arranged on the top surface of the first protrusion, and the through conductor may include a flange portion that faces the second electrode portion in a first direction and is electrically and physically connected to the second electrode portion. In this case, the flange portion can fix the position of the base body in the first direction while being electrically connected to the second electrode portion.
[0011] In one of the above embodiments, the second electrode includes a third electrode portion arranged on the outer surface and a fourth electrode portion arranged on the second end surface so as to surround the second protrusion, the grounding fitting is provided with an opening through which the second protrusion is inserted, and the fourth electrode portion may be electrically and physically connected to the periphery of the opening of the grounding fitting. In this case, the grounding fitting can fix the position of the element in the first direction while being electrically connected to the fourth electrode portion.
[0012] In one of the above embodiments, the insides of the through-hole, the first case, and the second case do not necessarily need to be filled with resin sealing material. Even in this case, insulation can still be ensured.
[0013] The high-voltage through-hole capacitor according to one of the above embodiments may further include a covering layer that covers the exposed portion of the base material. In this case, the moisture resistance of the base material can be improved. [Effects of the Invention]
[0014] One aspect of the present invention provides a high-voltage through-hole capacitor that does not use a resin encapsulant. [Brief explanation of the drawing]
[0015] [Figure 1] Figure 1 is a perspective view showing a high-voltage feedthrough capacitor according to one embodiment. [Figure 2] Figure 2 is an exploded perspective view showing a high-voltage feedthrough capacitor according to this embodiment. [Figure 3] Figure 3 is a cross-sectional view taken along the line III-III in Figure 1. [Figure 4]FIG. 4 is a perspective view showing a capacitor. [Figure 5] FIG. 5 is a cross-sectional view taken along the line V-V of FIG. 4. [Figure 6] FIG. 6 is a cross-sectional view of a capacitor according to a modified example.
Embodiments for Carrying Out the Invention
[0016] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant descriptions are omitted.
[0017] Referring to FIGS. 1 to 5, the configuration of the high-voltage through-type capacitor 1 according to the present embodiment will be described. FIG. 1 is a perspective view showing the high-voltage through-type capacitor according to the present embodiment. FIG. 2 is , book an exploded perspective view showing the high-voltage through-type capacitor according to the embodiment. FIG. 3 is a cross-sectional view taken along the line III-III of FIG. 1. FIG. 4 is a perspective view showing a capacitor. FIG. 5 is Figure 4 a cross-sectional view taken along the line V-V of
[0018] As shown in FIGS. 1 to 3, the high-voltage through-type capacitor 1 includes a plurality of capacitors C, a grounding fitting 20, a plurality of through conductors 30, a plurality of first cases 40, and a plurality of second cases 50. In the present embodiment, the high-voltage through-type capacitor 1 includes two capacitors C, two through conductors 30, two first cases 40, and two second cases 50. The pair of capacitors C have the same configuration as each other.
[0019] As shown in FIGS. 4 and 5, each capacitor C has a dielectric body 10, a first electrode 11, a second electrode 12, a first coating layer 13, and a second coating layer 14. The dielectric body 10 has a columnar shape with the first direction D1 as the axial direction. In the present embodiment, the dielectric body 10 has a cylindrical shape. The dielectric body 10 has a first end face 10a and a second end face 10b that face each other in the first direction D1. The first end face 10a and the second end face 10b define both end faces of the dielectric body 10 in the first direction D1. In this specification, the direction from the second end face 10b to the first end face 10a is the upward direction, and the first end face 10a is located above the second end face 10b.
[0020] The dielectric body 10 has a first convex portion 15 and a second convex portion 16. The first convex portion 15 is provided on the first end face 10a. The first convex portion 15 is provided at the central portion of the first end face 10a and protrudes in the first direction D1. The first convex portion 15 has a top face 15a. The second convex portion 16 is provided on the second end face 10b. The second convex portion 16 is provided at the central portion of the second end face 10b and protrudes in the first direction D1. The second convex portion 16 has a top face 16a. In the present embodiment, the top face 15a and the top face 16a have a circular shape. The top face 15a and the top face 16a have the same shape as each other. The protruding height of the first convex portion 15 from the first end face 10a is equal to the protruding height of the second convex portion 16 from the second end face 10b, and as an example, it is 1 mm.
[0021] A through hole 17 extending in the first direction D1 is formed in the dielectric body 10. The through hole 17 penetrates the dielectric body 10 in the first direction D1. The through hole 17 opens to the first convex portion 15 and the second convex portion 16. The through hole 17 opens at the central portion of the top face 15a and the central portion of the top face 16a. The through hole 17 penetrates the dielectric body 10 from the top face 15a to the top face 16a. In the present embodiment, the through hole 17 has a circular cross-sectional shape.
[0022] The base body 10 has an outer surface 10c and an inner surface 10d. The outer surface 10c extends in the first direction D1 and connects the first end surface 10a and the second end surface 10b. The outer surface 10c defines the outer circumference of the base body 10 when viewed from the first direction D1. The inner surface 10d faces the outer surface 10c in a direction perpendicular to the first direction D1. The inner surface 10d defines a through hole 17. The inner surface 10d extends in the first direction D1 and connects the top surface 15a and the top surface 16a. In the first direction D1, the length of the outer surface 10c is shorter than the length h1 of the inner surface 10d by the length of the first protrusion 15 and the second protrusion 16.
[0023] The element 10 is made of, for example, an insulating material. The element 10 includes, for example, a ceramic. The ceramic is, for example, BaTiO 3、 BaZrO 3、 CaTiO 3、 or it contains MgTiO3. The base material 10 may contain additives added to the ceramic. Additives include, for example, Si, Mg, Zr, Zn, Y, V, Al, or Mn.
[0024] The first electrode 11 and the second electrode 12 are arranged on the base body 10 facing each other. The first electrode 11 includes electrode portion 11a and electrode portion 11b. Electrode portion 11a is located on the inner surface 10d. Electrode portion 11a covers the entire inner surface 10d. The length of electrode portion 11a in the first direction D1 is equal to the length of the inner surface 10d in the first direction D1. Electrode portion 11b is located on the top surface 15a. Electrode portion 11b covers the entire top surface 15a. Electrode portion 11a and electrode portion 11b are connected to each other.
[0025] The second electrode 12 includes electrode portion 12a and electrode portion 12b. Electrode portion 12a is positioned on the outer surface 10c. Electrode portion 12a covers the entire outer surface 10c. 12b The electrode portion 12b is positioned on the second end face 10b so as to surround the second protrusion 16. The electrode portion 12b covers the entire second end face 10b. The electrode portion 12a and the electrode portion 12b are connected to each other.
[0026] The first electrode 11 and the second electrode 12 include a conductive metal material. The conductive metal material includes, for example, Ag. The first electrode 11 and the second electrode 12 may also include a magnetic material together with the conductive metal material. The magnetic material is, for example, Fe, Co, Ni, Cu, or Sr, or a combination thereof. The first electrode 11 and the second electrode 12 are formed, for example, by baking a conductive paste applied to the base body 10. The conductive paste for forming the first electrode 11 and the second electrode 12 includes the conductive metal material described above.
[0027] The first coating layer 13 is positioned on the first end face 10a so as to surround the first protrusion 15. The first coating layer 13 covers the entire first end face 10a. The first coating layer 13 faces the electrode portion 12b in the first direction D1 via the base body 10. The second coating layer 14 is positioned on the top face 16a. The second coating layer 14 covers the entire top face 16a. The second coating layer 14 faces the electrode portion 11b in the first direction D1 via the base body 10. The first coating layer 13 and the second coating layer 14 include, for example, a silicone resin or an epoxy resin. The first coating layer 13 and the second coating layer 14 are insulating. The first coating layer 13 and the second coating layer 14 provide moisture resistance to the base body 10 by covering the exposed parts of the base body 10, i.e., the first end face 10a and the top face 16a.
[0028] The height of the base body 10 (length D1 in the first direction of the base body 10) is 3 mm or more, and as an example, it is 7 mm. The height of the base body 10 is equivalent to the length h1 in the first direction of the inner surface 10d and the length h2 in the first direction of the electrode portion 11a. The diameter d1 of the base body 10 is 1.5 times or more the diameter d2 of the first protrusion 15. The diameter d1 is 2 times or more the diameter d3 of the through hole 17. As an example, the diameter d1 is 10.5 mm, the diameter d2 is 7.5 mm, and the diameter d3 is 4.5 mm.
[0029] As shown in Figures 1 to 3, the grounding fitting 20 is a flat plate member that has a rectangular shape when viewed from the first direction D1. The rectangular shape includes shapes with rounded corners and shapes with rounded corners. The grounding fitting 20 is provided with a plurality of openings 21 through which the second case 50 is inserted. In this embodiment, the grounding fitting 20 has two openings 21 side by side in the second direction D2. The openings 21 are circular in shape and have a diameter equal to the diameter (outer diameter) of the second case 50.
[0030] The grounding fitting 20 is electrically and physically connected to the second electrode 12. The grounding fitting 20 is grounded. The grounding fitting 20 has a peripheral edge 22 of the opening 21. The peripheral edge 22 faces the electrode portion 12a in the first direction D1 and is electrically and physically connected to the electrode portion 12a. The peripheral edge 22 is joined to the electrode portion 12b, for example, by solder or conductive paste. The grounding fitting 20 supports the base body 10 by the peripheral edge 22. The grounding fitting 20 can fix the position of the base body 10 in the first direction D1.
[0031] The length of the second direction D2 of the grounding fitting 20 is 20 mm or more and 50 mm or less, for example, 32 mm. The length of the third direction D3 of the grounding fitting 20 is 10 mm or more and 30 mm or less, for example, 20 mm. The diameter of the opening 21 is less than half the length of the second direction D2 of the grounding fitting 20. The grounding fitting 20 includes a conductive metal material. The conductive metal material includes, for example, Fe, Cu, or a Cu-Zn alloy.
[0032] A pair of through conductors 30 are inserted through the corresponding through holes 17 of the capacitor C. The through conductors 30 are electrically and physically connected to the first electrode 11. The through conductor 30 includes a main body portion 31, a tab portion 32, and a flange portion 33. The main body portion 31 is a rod-shaped member extending in the first direction D1. In this embodiment, the main body portion 31 has a circular cross-section. The cross-section of the main body portion 31 may have a shape other than a circle.
[0033] The main body 31 includes a portion 31a inserted through the through hole 17, a portion 31b protruding from the top surface 15a, and a portion 31c protruding from the top surface 16a. The portions 31a, 31b, and 31c are integrally formed. The portion 31a and the capacitor C face each other with space in between. The space between the portion 31a and the capacitor C is not filled with resin encapsulant. The internal space of the through hole 17 is not filled with resin encapsulant.
[0034] The tab portion 32 is connected to portion 31b. The tab portion 32 functions as a tab terminal. In this embodiment, the tab portion 32 has a rectangular flat plate shape with the second direction D2 as the thickness direction. The tab portions 32 of a pair of capacitors C are arranged so that their main surfaces face each other in the second direction D2. The tab portion 32 is provided with a through hole 32a that penetrates the tab portion 32 in the thickness direction (second direction D2).
[0035] The flange portion 33 is provided in a flange-like manner on the outer circumferential surface of the main body portion 31. The flange portion 33 is positioned at the boundary between portion 31a and portion 31b. In this embodiment, the flange portion 33 has a disc shape. The diameter of the flange portion 33 is larger than the diameter of the through hole 17 and is equal to the diameter of the top surface 15a. The flange portion 33 faces the electrode portion 11b in the first direction D1 and is electrically and physically connected to the electrode portion 11b. The flange portion 33 is joined to the electrode portion 11b by, for example, solder or conductive paste. The flange portion 33 covers the entire electrode portion 11b.
[0036] The length of the through conductor 30 in the first direction D1 is 30 mm or more and 60 mm or less, for example, 51.1 mm. The diameter of the main body 31 is 2 mm for example. The spacing (electrode width) between the tab portions 32 in the second direction D2 is 5 mm or more and 35 mm or less, for example, 6.1 mm. The through-conductor 30 includes a conductive metallic material. The conductive metallic material includes, for example, Fe, Cu, or a Cu-Zn alloy.
[0037] The first case 40 and the second case 50 are hollow cylindrical shapes that surround the through conductor 30. In this embodiment, the first case 40 and the second case 50 are hollow cylindrical shapes with both ends open. The first case 40 and the second case 50 may have shapes other than cylindrical.
[0038] The first case 40 is attached to the first protrusion 15. The inner diameter of the first case 40 is formed to be the same as the diameter of the first protrusion 15, and it is fitted into the first protrusion 15. The first case 40 is attached to the first protrusion 15 such that the inner surface of the first case 40 located at the lower end is in contact with the outer surface of the first protrusion 15. The lower end surface of the first case 40 is in contact with the first end surface 10a. The first case 40 is bonded to the first protrusion 15, for example, with adhesive resin.
[0039] The first case 40 surrounds the upper end of portion 31a, portion 31b, a part of the tab portion 32, and the flange portion 33 of the through conductor 30. The tab portion 32 includes a portion that protrudes from the first case 40. The through hole 32a is provided in the portion of the tab portion 32 that protrudes from the first case 40. The first case 40 and portion 31b face each other with space between them. The space between the first case 40 and portion 31b is not filled with resin encapsulant. The first case 40 and tab portion 32 face each other with space between them. The space between the first case 40 and tab portion 32 is not filled with resin encapsulant. The internal space of the first case 40 is not filled with resin encapsulant.
[0040] The second case 50 is attached to the second protrusion 16. The inner diameter of the second case 50 is formed to be the same as the diameter of the second protrusion 16, and it is fitted into the second protrusion 16. The second case 50 is attached to the second protrusion 16 such that the lower end surface of the inner surface of the second case 50 is in contact with the outer surface of the second protrusion 16. The lower end surface of the second case 50 is in contact with the second end surface 10b. The second case 50 is bonded to the second protrusion 16, for example, with adhesive resin.
[0041] The second case 50 surrounds the lower end of portion 31a and a portion of portion 31c of the through conductor 30. Portion 31c includes a portion that protrudes from the second case 50. The second protrusion 16 is inserted into the opening 21 of the grounding fitting 20 together with the lower end of the second case 50. The second case 50 and portion 31c face each other with space in between. The space between the second case 50 and portion 31c is not filled with resin sealant. The internal space of the second case 50 is not filled with resin sealant.
[0042] The length of the first case 40 in the first direction D1 is 1 / 2 or less of the length of the through conductor 30 in the first direction D1, for example, 20.6 mm. The length of the second case 50 in the first direction D1 is 1 / 2 or less of the length of the through conductor 30 in the first direction D1, for example, 15 mm. The inner diameters of the first case 40 and the second case 50 are equivalent to the diameters of the first protrusion 15 and the second protrusion 16, for example, 7.5 mm.
[0043] Case 40 and Case 50 contain insulating materials and are insulating. The insulating materials include, for example, polybutylene terephthalate (PBT), polyethylene terephthalate (PET), or modified melamine. The insulating materials may also contain inorganic materials. The inorganic materials include, for example, glass powder and ceramic powder. The glass powder includes, for example, industrial glass powder. The ceramic powder includes, for example, SiO2 powder, Al2O3 powder, talc (Mg3Si4O 10 (OH)2), aluminum nitride (AlN), or silicon nitride (Si3N4), or mixtures thereof.
[0044] As explained above, in the high-voltage through-hole capacitor 1, the first case 40 and the second case 50 surround the through-hole conductor 30, so that air discharge between the through-hole conductor 30 and the grounding fitting 20 can be suppressed. Therefore, insulation can be ensured even without sealing the through-hole conductor 30 with a resin encapsulant. The first case 40 is fitted into the first protrusion 15 provided on the first end face 10a of the base body 10, so the first case 40 can be securely fixed. The second case 50 is fitted into the second protrusion 16 provided on the second end face 10b of the base body 10, so the second case 50 can be securely fixed.
[0045] In the high-voltage through-hole capacitor 1, since no resin encapsulant is used, there is no risk of problems such as resin leaking from gaps in the product during the manufacturing line. The occurrence of characteristic defects and reliability defects caused by the quality of the resin itself (e.g., viscosity) is suppressed. The possibility of the quality of the resin itself causing malfunctions in the casting equipment and stopping the manufacturing line is also suppressed. In the high-voltage through-hole capacitor 1, since there are multiple capacitors C that are separate from each other, unlike a configuration in which multiple capacitors are provided as a single unit, a resin encapsulant to insulate the potential difference between the capacitors is unnecessary. By not using a resin encapsulant, there is no risk of problems caused by the difference in the coefficient of linear expansion between the resin and the ceramic.
[0046] The element 10 has an outer surface 10c and an inner surface 10d that face each other in a direction perpendicular to the first direction. The first electrode 11 is located on the inner surface 10d, and the second electrode 12 is located on the outer surface 10c. Therefore, the first electrode 11 and the second electrode 12 can face each other in a direction perpendicular to the first direction D1, thereby generating an electric field. The second electrode 12 located on the outer surface 10c is connected to a grounded grounding fitting 20. As a result, there is no potential difference between the second electrodes 12 of adjacent capacitors C, so the distance between capacitors C can be shortened.
[0047] The through conductor 30 includes a flange portion 33 that faces the electrode portion 11b located on the top surface 15a in the first direction D1 and is electrically and physically connected to the electrode portion 11b. Therefore, the flange portion 33 can fix the position of the base body 10 in the first direction D1 while being electrically connected to the electrode portion 11b.
[0048] The grounding fitting 20 includes a peripheral portion 22 that faces the electrode portion 12b located on the second end face 10b in the first direction D1 and is electrically and physically connected to the electrode portion 12b. Therefore, the grounding fitting 20 can fix the position of the base body 10 in the first direction D1 while being electrically connected to the electrode portion 12b.
[0049] A first coating layer 13 is provided on the first end surface 10a, which is the exposed part of the base body 10, and a second coating layer 14 is provided on the top surface 16a. Therefore, the moisture resistance of the base body 10 can be improved.
[0050] While embodiments of the present invention have been described above, the present invention is not necessarily limited to the embodiments described above, and various modifications are possible without departing from the spirit of the invention.
[0051] Figure 6 shows the cross-sectional configuration of a modified capacitor. As shown in Figure 6, the modified capacitor C1 differs from capacitor C (see Figure 5) in that the electrode portion 11a does not cover the entire inner surface 10d. The inner surface 10d has an exposed region 10e that is exposed from the electrode portion 11a. The exposed region 10e is located adjacent to the top surface 16a. A coating layer (not shown) may be provided on the exposed region 10e to improve moisture resistance. In this modified example, the length h2 of the electrode portion 11a is half the length h1 of the inner surface 10d, and is 3.5 mm as an example.
[0052] In capacitor C1, the inner surface 10d has an exposed region 10e that is exposed from the first electrode 11, adjacent to the top surface 16a. Therefore, the electrode portion 11a located on the inner surface 10d and the electrode portion 12b located on the second end surface 10b are sufficiently spaced apart, thereby suppressing the occurrence of electrical short circuits.
[0053] The high-voltage through-type capacitor 1 comprises two capacitors C and two through-conductors 30, but there are three or more capacitors C and three or more through conductors 30 It may have a single capacitor C It may also include one through conductor 30.
[0054] The above embodiments and modifications may be combined as appropriate.
[0055] As can be seen from the above-described embodiments and modifications, this specification includes the following embodiments. (Note 1) A capacitor having a body with a through hole extending in a first direction, and a first electrode and a second electrode arranged on the body facing each other, A through conductor inserted through the through hole and electrically connected to the first electrode, A grounding fitting electrically connected to the second electrode, It comprises a first case and a second case that are cylindrical in shape and surround the through conductor, The aforementioned body is The first end face and the second end face facing each other in the first direction, A first protrusion is provided on the first end face, through which the through hole opens, The second end face is provided with a second protrusion through which the through hole opens, The first case is attached to the first protrusion, The second case is attached to the second protrusion, High-voltage feed-through capacitor. (Note 2) The aforementioned body is An outer surface extending in the first direction and connecting the first end face and the second end face, It further has an inner surface that faces the outer surface in a direction perpendicular to the first direction and defines the through hole, The first electrode is arranged on the inner surface, The second electrode is located on the outer surface, High-voltage feedthrough capacitor as described in Appendix 1. (Note 3) The inner surface has an exposed region exposed from the first electrode, located adjacent to the top surface of the second protrusion. High-voltage feedthrough capacitor as described in Appendix 2. (Note 4) The first electrode is, The first electrode portion arranged on the inner surface, The first protrusion includes a second electrode portion positioned on the top surface of the first protrusion, The through conductor includes a flange portion that faces the second electrode portion in the first direction and is electrically and physically connected to the second electrode portion. High-voltage feedthrough capacitor as described in Appendix 2 or 3. (Note 5) The second electrode is, The third electrode portion arranged on the outer surface, It includes a fourth electrode portion arranged on the second end face so as to surround the second protrusion, The grounding fitting is provided with an opening through which the second protrusion is inserted. The four electrode portion is electrically and physically connected to the peripheral edge of the opening of the grounding fitting. A high-voltage feedthrough capacitor as described in any one of the appendices 2 to 4. (Note 6) The inside of the through hole, the first case, and the second case are not filled with resin sealing material. A high-voltage feedthrough capacitor as described in one of the notes 1 to 5. (Note 7) The above body further comprises a covering layer that covers the exposed portion, A high-voltage feedthrough capacitor as described in any one of the notes 1 to 6. [Explanation of Symbols]
[0056] 1... High voltage feed-through capacitor, 10... Element body, 10a... First end surface, 10b... Second end surface, 10c... Outer surface, 10d... Inner surface, 10e... Exposed area, 11... First electrode, 11a... Electrode part (first electrode part), 11b... Electrode part (second electrode part), 12... Second electrode, 12a... Electrode part (third electrode part), 12b... Electrode part (fourth electrode part), 13...first coating layer, 14...second coating layer, 15...first convex part, 15a...top surface, 16...second convex part, 16a...top surface, 17...through hole, 20...grounding fitting, 21...opening, 22...periphery, 30...through conductor, 33...flange part, 40...first case, 50...second case, C, C1...capacitor.
Claims
1. A capacitor having a body with a through hole extending in a first direction, and a first electrode and a second electrode arranged on the body facing each other, A through conductor inserted through the through hole and electrically connected to the first electrode, A grounding fitting electrically connected to the second electrode, It comprises a first case and a second case that are cylindrical in shape and surround the through conductor, The aforementioned body is The first end face and the second end face facing each other in the first direction, A first protrusion is provided on the first end face, through which the through hole opens, The second end face is provided with a second protrusion through which the through hole opens, The first case is attached to the first protrusion, The second case is attached to the second protrusion, The inside of the through hole, the first case, and the second case are not filled with resin sealing material. High-voltage feed-through capacitor.
2. The aforementioned body is An outer surface extending in the first direction and connecting the first end face and the second end face, It further has an inner surface that faces the outer surface in a direction perpendicular to the first direction and defines the through hole, The first electrode is arranged on the inner surface, The second electrode is located on the outer surface, A high-voltage feedthrough capacitor according to claim 1.
3. The inner surface has an exposed region that is exposed from the first electrode, located adjacent to the top surface of the second protrusion. The high-voltage feedthrough capacitor according to claim 2.
4. The first electrode is, The first electrode portion arranged on the inner surface, The first protrusion includes a second electrode portion positioned on the top surface of the first protrusion, The through conductor includes a flange portion that faces the second electrode portion in the first direction and is electrically and physically connected to the second electrode portion. The high-voltage feedthrough capacitor according to claim 2.
5. The second electrode is, The third electrode portion arranged on the outer surface, It includes a fourth electrode portion arranged on the second end face so as to surround the second protrusion, The grounding fitting is provided with an opening through which the second protrusion is inserted. The four electrode portion is electrically and physically connected to the peripheral edge of the opening of the grounding fitting. The high-voltage feedthrough capacitor according to claim 2.
6. The above body further comprises a covering layer that covers the exposed portion, A high-voltage feedthrough capacitor according to any one of claims 1 to 5.
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