Detection device and detection method

Abstract

To detect deformation of an elastic member.SOLUTION: A detection device provided herein comprises an elastic member, measurement unit, and detection unit. The elastic member is arranged sandwiched between a first member and a second member at a joint joining the first member and the second member in an elastically deformable manner. The measurement unit is configured to measure electrical properties at multiple points on the elastic member. The detection unit is configured to detect deformation of the elastic member on the basis of the electrical properties at the multiple points measured by the measurement unit.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a detection device and a detection method.

Background Art

[0002] Patent Document 1 below discloses "a chamber having a processing chamber for performing processing on a substrate with an introduced gas and an exhaust chamber for exhausting the gas in the processing chamber, and a shield member provided at least partially near the side wall of the chamber, separating the processing chamber and the exhaust chamber, and having a hole communicating the processing chamber and the exhaust chamber in a part of a wall surface parallel to the side wall of the chamber, the shield member being drivable in the vertical direction, and a hollow relay member connected to a pipe connected to an instrument outside the chamber, drivable in the horizontal direction, driven in the central direction of the chamber when the shield member reaches the upper end, the end portion on the central direction side being connected to the shield member, and communicating the processing chamber and the pipe through the hole."

[0003] Non-Patent Document 1 below discloses that "it has been demonstrated that a highly sensitive strain sensor can be realized by embedding CNT (carbon nanotube) in resin."

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Non-Patent Documents

[0005]

Non-Patent Document 1

Summary of the Invention

[0006] This disclosure provides a technology for detecting the deformation of an elastic member. [Means for solving the problem]

[0007] A detection device according to one aspect of the present disclosure comprises an elastic member, a measuring unit, and a detection unit. The elastic member is positioned between the first and second members at a joint portion connecting the first and second members, and is configured to be elastically deformable. The measuring unit is configured to measure the electrical properties of multiple locations on the elastic member. The detection unit is configured to detect the deformation of the elastic member based on the electrical properties of multiple locations measured by the measuring unit. [Effects of the Invention]

[0008] According to this disclosure, deformation of an elastic member can be detected. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic diagram showing an example of the configuration of a substrate processing apparatus according to an embodiment. [Figure 2] Figure 2 is a schematic plan view showing an example of the configuration of an end effector according to an embodiment. [Figure 3] Figure 3 is a schematic cross-sectional view showing an example of the configuration of the pad portion of an end effector according to an embodiment. [Figure 4] Figure 4 is a schematic diagram showing an example of a container requiring airtightness according to the embodiment. [Figure 5] Figure 5 illustrates an example of a configuration for measuring the electrical properties of an elastic member according to the embodiment. [Figure 6] Figure 6 is a schematic diagram showing an example of a configuration for measuring resistance according to the embodiment. [Figure 7A] Figure 7A is a schematic diagram showing an example of a configuration for sealing the rotating shaft according to the embodiment. [Figure 7B]FIG. 7B is a diagram schematically showing an example of a configuration for sealing a rotating shaft according to an embodiment. [Figure 8A] FIG. 8A is a diagram schematically showing another example of a configuration for sealing a rotating shaft according to an embodiment. [Figure 8B] FIG. 8B is a diagram schematically showing another example of a configuration for sealing a rotating shaft according to an embodiment. [Figure 9] FIG. 9 is a flowchart showing an example of the flow of detection processing according to an embodiment. [Embodiment for Carrying Out the Invention]

[0010] Hereinafter, embodiments of the detection device and detection method disclosed in the present application will be described in detail with reference to the drawings. Note that the detection device and detection method disclosed are not limited by the present embodiment.

[0011] In components and devices that require airtightness, joining between members is performed via an elastic member such as an O-ring. In the joining between members via an elastic member, since it is necessary to apply some external force to the elastic member in order to utilize the fact that the elastic member is deformed and functions as a gas seal on the member surface, it is required that the external force be applied perpendicular and uniform to the elastic member. If an incorrect way of applying an external force occurs on the elastic member, there is a concern that the elastic member will not function as a gas seal, and leakage, damage due to abnormal deformation, displacement, etc. may occur.

[0012] However, an elastic member sandwiched between members is difficult to observe from the outside except in special cases where the members are made of a transparent material, and it is difficult to detect how it is deformed.

[0013] Therefore, a technique for detecting the deformation of an elastic member is expected.

[0014] [Embodiment] [Device Configuration] Next, embodiments will be described. Below, examples of components and devices that require airtightness will be described using a substrate processing apparatus. A substrate processing apparatus is an apparatus that transports a substrate such as a semiconductor wafer and performs substrate processing. Below, the case where the substrate processing apparatus performs a film-forming process as the substrate processing will be described as an example.

[0015] FIG. 1 is a configuration diagram schematically showing an example of the configuration of a substrate processing apparatus 200 according to an embodiment. As shown in FIG. 1, the substrate processing apparatus 200 has four process modules 201 to 204. The process modules 201 to 204 each have a chamber. Each chamber is evacuated by a vacuum pump and the inside is maintained at a predetermined degree of vacuum. The process modules 201 to 204 are each configured to be able to perform substrate processing inside the chamber. For example, the process modules 201 to 204 are configured to be able to perform a film-forming process inside the chamber.

[0016] The process modules 201 to 204 are respectively connected to four wall portions of a vacuum transfer chamber 301 having a heptagonal planar shape via gate valves G. The vacuum transfer chamber 301 is evacuated by a vacuum pump and the inside is maintained at a predetermined degree of vacuum. Three load lock chambers 302 are connected to the other three wall portions of the vacuum transfer chamber 301 via gate valves G1. An atmospheric transfer chamber 303 is provided on the opposite side of the vacuum transfer chamber 301 across the load lock chamber 302. The three load lock chambers 302 are connected to the atmospheric transfer chamber 303 via gate valves G2. The load lock chamber 302 controls the pressure between atmospheric pressure and vacuum when transporting the substrate W between the atmospheric transfer chamber 303 and the vacuum transfer chamber 301.

[0017] On the wall portion of the atmospheric transfer chamber 303 opposite to the wall portion to which the load lock chamber 302 is attached, three carrier attachment ports 305 for attaching a carrier (such as a FOUP) C for accommodating the substrate W are provided. Further, an alignment module 304 for aligning the substrate W is provided in the atmospheric transfer chamber 303. A downflow of clean air is formed inside the atmospheric transfer chamber 303.

[0018] A transport mechanism 306 is provided inside the vacuum transport chamber 301. The transport mechanism 306 is configured as a multi-joint arm. The transport mechanism 306 has two independently movable transport arms 307a and 307b. The transport mechanism 306 has end effectors 11 on the tip sides of the transport arms 307a and 307b that can support the substrate W. The substrate W is placed on the end effectors 11. The transport mechanism 306 transports the substrate W to process modules 201 to 204 and the load lock chamber 302.

[0019] A transport mechanism 308 is provided inside the atmospheric transport chamber 303. The transport mechanism 308 is configured as a multi-jointed arm. The transport mechanism 308 has an end effector 10 at its tip that can support the substrate W. The transport mechanism 308 is configured to transport the substrate W to the carrier C, the load lock chamber 302, and the alignment module 304.

[0020] The substrate processing apparatus 200 has a control unit 310. The operation of the substrate processing apparatus 200 is comprehensively controlled by the control unit 310. A user interface 311 and a storage unit 312 are connected to the control unit 310.

[0021] The user interface 311 consists of an operation unit such as a keyboard for the process manager to input commands to manage the substrate processing device 200, and a display unit such as a display that visualizes and shows the operating status of the substrate processing device 200. The user interface 311 accepts various operations. For example, the user interface 311 accepts predetermined operations to instruct the start and stop of substrate processing.

[0022] The memory unit 312 stores programs (software) for implementing various processes performed by the substrate processing device 200 under the control of the control unit 310, as well as data such as processing conditions and process parameters. The programs and data may be stored on a computer-readable storage medium (e.g., hard disk, CD, flexible disk, semiconductor memory, etc.). Alternatively, the programs and data can be transmitted online from other devices, for example, via a dedicated line.

[0023] The control unit 310 is, for example, a computer equipped with a processor, memory, etc. Based on instructions from the user interface 311, the control unit 310 reads programs and data from the storage unit 312 and controls each part of the substrate processing device 200 to transport the substrate W to the process modules 201 to 204 and perform substrate processing on the substrate W.

[0024] Next, an example of the configuration of the end effector 10 of the transport mechanism 308 will be described. Figure 2 is a schematic plan view showing an example of the end effector 10 according to the embodiment.

[0025] The end effector 10 has a flat shape, and its upper surface is the mounting surface 12 on which the substrate W is placed. The end effector 10 holds the substrate W on the mounting surface 12 side and transports it. The end effector 10 constitutes the arm at the tip of the transport mechanism 308. The end effector 10 is made of ceramics. The tip of the end effector 10 is branched into two. The end effector 10 has pads 20 at three locations: two at each branched tip and one at the base where it branches.

[0026] The pad 20 is formed from an elastic resin and is configured to be elastically deformable. Examples of resin materials include polyimide and PEEK (polyetheretherketone), which are elastic and have a high heat resistance temperature so as to be able to hold the high-temperature substrate W. The resin material may be a non-conductive material like polyimide, or a conductive material. If electric charge accumulates on the pad 20, the elements on the substrate W may be damaged when the pad 20 touches the substrate W. Therefore, if electric charge accumulates on the pad 20, it is preferable that the pad 20 be made of a conductive material.

[0027] The pad 20 is formed in an annular shape, with a suction port 21 in the center. The transport mechanism 308 has suction passages 13 formed inside up to the position of each pad 20. In Figure 2, the suction passages 13 formed inside the end effector 10 are shown by dashed lines. The suction passages 13 communicate with the suction port 21. The suction passages 13 are connected to an exhaust device (not shown) and exhaust air from them.

[0028] Figure 3 is a schematic cross-sectional view showing an example of the configuration of the pad 20 portion of the end effector 10 according to an embodiment. Figure 3 shows a cross-section of one pad 20 portion of the end effector 10. The substrate W is placed on the pad 20 of the end effector 10.

[0029] The suction port 21 of the pad 20 is in communication with the suction passage 13. When the suction passage 13 is exhausted by the exhaust device, the pad 20 is drawn in through the suction port 21 and adsorbs the substrate W. By adsorbing the substrate W, the pad 20 deforms under external force from the substrate W and adheres tightly to the underside of the substrate W, functioning as a gas seal. The pad 20 airtightly separates the space formed by the suction port 21 and the suction passage 13 from the space outside the pad 20.

[0030] The end effector 10 grips the substrate W by hermetically sealing the pad 20 to the underside of the substrate W and locally vacuum-suctioning the substrate W through the space surrounded by the pad 20 and the substrate W. By vacuum-suctioning the substrate W with the pad 20, the end effector 10 can firmly grip the substrate W and stably transport the substrate W.

[0031] Incidentally, the substrate processing apparatus 200 uses components and equipment that require airtightness. For example, in the substrate processing apparatus 200, airtight containers are used in process modules 201 to 204, the vacuum transport chamber 301, and the load lock chamber 302 to maintain the internal vacuum state. For example, in process modules 201 to 204, chambers are used as airtight containers. Also, in the substrate processing apparatus 200, airtight containers are used in the atmospheric transport chamber 303 to prevent the intrusion of particles from the outside. Furthermore, the end effector 10 uses pads 20 because airtightness is required for the adsorption of the substrate W.

[0032] In components and devices requiring airtightness, joining of components is performed via elastic members. For example, in containers requiring airtightness, such as chambers, joining of components is performed via elastic members. Furthermore, since airtightness is required for the adsorption of the substrate W by the end effector 10, the substrate W is adsorbed and held via the pad 20.

[0033] Figure 4 is a schematic diagram showing an example of an airtight container 40 according to the embodiment. The container 40 is a schematic diagram showing a container used, for example, in the chambers of process modules 201 to 204, the vacuum transport chamber 301, the load lock chamber 302, the atmospheric transport chamber 303, etc.

[0034] The container 40 is constructed by joining a first member 41 and a second member 42. An O-ring 44 is placed at the joint portion 43 where the first member 41 and the second member 42 are joined. The O-ring 44 is arranged around the joint portion 43 and is sandwiched between the first member 41 and the second member 42. The O-ring 44 is formed in an annular shape from an elastic resin and is configured to be elastically deformable. The container 40 is constructed by fastening the first member 41 and the second member 42 together with screws 45 or the like, with the O-ring 44 placed at the joint surface where the first member 41 and the second member 42 are joined. When the first member 41 and the second member 42 are fastened together with screws 45 or the like, the O-ring 44 deforms under external force and adheres tightly to the first member 41 and the second member 42, functioning as a gas seal. The first member 41 and the second member 42, when joined together, form the boundary between the space inside the container 40 and the space outside the container 40. The O-ring 44 airtightly separates the space inside the container 40 from the space outside the container 40.

[0035] In joining components via elastic members such as pads 20 and O-rings 44, some external force must be applied to the elastic members because the elastic members deform and function as gas seals on the surface of the components. For example, in Figure 3, the self-weight of the substrate W and the force of vacuum suction that attracts the substrate W correspond to the external force on pad 20. Also, for example, in Figure 4, the force generated by fastening with screws 45, etc., corresponds to the external force on O-rings 44. The external force is required to be applied perpendicularly and uniformly to the elastic members. If the external force is applied incorrectly to the elastic members, the elastic members will not function as gas seals, and there is a concern that leaks, damage due to abnormal deformation, or displacement may occur. For example, in Figure 3, if the external force is applied unevenly to pad 20, a gap will be created where part of pad 20 does not adhere closely to the lower surface of substrate W, making it impossible to vacuum-suction the substrate W, resulting in abnormal gripping of the substrate W. Furthermore, as shown in Figure 4, if an external force is applied unevenly to the O-ring 44, a gap may occur due to a lack of airtightness in a portion of the O-ring 44, or leakage may occur due to damage or displacement caused by abnormal deformation of the O-ring 44.

[0036] Incidentally, elastic members such as the pad 20 and O-ring 44 change their electrical properties in response to deformation. The elastic members may be made of any material and have any configuration, as long as the change in their electrical properties in response to deformation can be measured.

[0037] For example, the electrical properties of an elastic member change significantly in response to deformation, depending on the materials contained in the resin. Non-patent document 1 describes that a thin film formed by dispersing carbon nanotubes in a resin undergoes a large change in electrical resistance due to strain. Therefore, an elastic member may be formed using a resin containing carbon nanotubes. For example, a pad 20 or an O-ring 44 may be formed by kneading carbon nanotubes into a resin and then molding it.

[0038] Furthermore, by forming the elastic member from a resin that includes conductive parts, the change in electrical properties due to deformation becomes greater. Therefore, the elastic member may be formed from a resin that includes conductive parts. For example, the elastic member can be configured so that its resistance changes in response to deformation by forming a strain gauge equivalent circuit inside the resin using a 3D printer. Alternatively, the elastic member can be configured so that its resistance changes in response to deformation by layering resin using a 3D printer and embedding a metal that acts as a strain gauge during the layering. Another option is to form the elastic member by processing a conductive resin into a woven fabric, utilizing the change in the woven fabric's contact area due to deformation to create a structure that changes its resistance in response to deformation. Another option is to print a strain gauge on the surface of the elastic member using metallic ink to create a structure that changes its resistance in response to deformation. Finally, the elastic member can be configured so that its resistance changes in response to deformation by embedding a thin Cu film on the surface of the resin using photolithography and etching, and utilizing the thin Cu film as a strain sensor.

[0039] The pad 20 and O-ring 44 are configured so that their electrical characteristics can be measured at multiple locations. The substrate processing apparatus 200 measures the electrical characteristics at multiple locations on each of the pad 20 and O-ring 44, and detects deformation of the pad 20 and O-ring 44 based on the measured electrical characteristics at multiple locations. The substrate processing apparatus 200 functions as a detection device according to the present disclosure.

[0040] Figure 5 illustrates an example of a configuration for measuring the electrical characteristics of an elastic member 50 according to an embodiment. In Figure 5, the O-ring 44 and the pad 20 are shown as the elastic member 50. The elastic member 50 is formed in an annular shape. The elastic member 50 is configured so that its electrical characteristics can be measured at multiple locations. For example, the elastic member 50 has two electrodes placed at intervals at multiple locations along the circumferential direction. In Figure 5, two electrodes 51a and 51b are placed at two locations in a symmetrical positional relationship. Although Figure 5 shows the case where two electrodes 51a and 51b are placed at two locations on the elastic member 50, they may be placed at three or more locations. The placement locations may be at equal intervals, or there may be more electrodes in a specific part of the elastic member 50. The electrodes 51a and 51b may be fixed to the surface of the elastic member 50 by adhesive or the like, or they may be embedded inside the elastic member 50. The two electrodes 51a and 51b placed at multiple locations are each connected to the measurement unit 53 via wiring 52.

[0041] The measuring unit 53 measures the electrical characteristics of multiple locations on the elastic member 50 via the wiring 52. For example, the measuring unit 53 measures the resistance between two electrodes, each of which is positioned at multiple locations on the elastic member 50, by applying a voltage between them. In Figure 5, the measuring unit 53 measures the resistance between two electrodes 51a and 51b, which are positioned at two locations on the elastic member 50. The measuring unit 53 outputs data indicating the measured resistance to the control unit 310.

[0042] The control unit 310 detects the deformation of the elastic member 50 based on the electrical characteristics of multiple locations measured by the measurement unit 53. For example, the control unit 310 receives data on the resistance values ​​of multiple locations of the elastic member 50 from the measurement unit 53. The control unit 310 detects the deformation of the elastic member 50 from the resistance values ​​of multiple locations of the elastic member 50 indicated by the input data. In this embodiment, the control unit 310 corresponds to the detection unit of this disclosure.

[0043] For example, the normal range of resistance values ​​at multiple locations of the elastic member 50 when it is deformed normally is determined in advance by experiment or simulation. For example, if the elastic member 50 is the O-ring 44 shown in Figure 4, the resistance values ​​at multiple locations of the elastic member 50 when the first member 41 and the second member 42 are joined normally are determined by experiment or simulation. Then, the normal range of resistance values ​​at each of the multiple locations is determined from the actual resistance values ​​at each of the multiple locations obtained by experiment or simulation. For example, the normal range of resistance values ​​at each of the multiple locations is determined by considering a margin for the actual resistance values ​​at each of the multiple locations. The control unit 310 determines whether the resistance values ​​at multiple locations of the elastic member 50 measured by the measuring unit 53 are within their respective normal ranges. If the resistance values ​​at multiple locations of the elastic member 50 are within their respective normal ranges, the control unit 310 detects that the deformation of the elastic member 50 is normal. On the other hand, if the resistance value at any of the multiple locations of the elastic member 50 is outside the normal range, the control unit 310 detects that the deformation of the elastic member 50 is abnormal.

[0044] Furthermore, when the first member 41 and the second member 42 are properly joined, the elastic member 50 will be subjected to external forces in a substantially uniform manner and deform substantially uniformly. In this case, for example, the control unit 310 calculates the average value of the resistance values ​​measured at multiple locations by the measuring unit 53 and determines whether the resistance values ​​at multiple locations are within a predetermined allowable range from the average value. The allowable range is determined in advance by experiment or simulation. The control unit 310 detects that the deformation of the elastic member 50 is normal if the resistance values ​​at multiple locations of the elastic member 50 are within the allowable range from their respective average values. On the other hand, the control unit 310 detects that the deformation of the elastic member 50 is abnormal if the resistance value at any of the multiple locations of the elastic member 50 is outside the allowable range from the average value.

[0045] The control unit 310 outputs information based on the detection results. For example, the control unit 310 outputs information based on the detection results to an external device such as a management device that is able to communicate via a network (not shown). The control unit 310 also outputs information based on the detection results to the user interface 311. For example, if the control unit 310 detects an abnormal deformation of the pad 20, it outputs a warning of gripping abnormality to the user interface 311. This allows, for example, in Figure 3, to detect a gripping abnormality of the substrate W before moving the end effector 10, thereby suppressing damage to the substrate W due to dropping. The control unit 310 also outputs a warning to the user interface 311 if it detects an abnormal deformation of the elastic member 50. For example, if the control unit 310 detects an abnormal deformation of the O-ring 44, it outputs a warning of chamber coupling abnormality to the user interface 311. This allows, in Figure 4, to determine whether the chamber is properly coupled without going through a leak check of the chamber by vacuuming.

[0046] In the above embodiment, the case of detecting deformation of the elastic member 50 was described as an example. However, it is not limited to this. The control unit 310 may detect a joint abnormality based on the electrical characteristics of multiple locations measured by the measuring unit 53. For example, similar to the determination of abnormality detection when deformation of the elastic member 50 is detected, the control unit 310 may determine whether the resistance values ​​of multiple locations of the elastic member 50 are within their respective normal ranges, and if the resistance value at any of the multiple locations is outside the normal range, it may detect a joint abnormality. Alternatively, the control unit 310 may calculate the average value of the resistance values ​​of multiple locations of the elastic member 50, and if the resistance value at any of the multiple locations is outside the acceptable range from the average value, it may detect a joint abnormality. When the control unit 310 detects a joint abnormality, it may output a warning to the user interface 311 or an external device.

[0047] Furthermore, in the above embodiment, the case in which electrodes 51a and 51b are provided on the elastic member 50 to measure the resistance value was described as an example. However, it is not limited to this. The resistance value of the elastic member 50 can be measured by any method. When the elastic member 50 is irradiated with microwaves and the microwave reflection intensity is measured, there is a correlation between the resistance value and the microwave reflection intensity. Therefore, the resistance value of the elastic member 50 may be measured using microwaves. Figure 6 is a schematic diagram showing an example of a configuration for measuring the resistance value according to the embodiment. Figure 6 shows the case in which the resistance value of the O-ring 44 is measured using microwaves. The O-ring 44 is placed in the joint portion 43 that joins the first member 41 and the second member 42. The second member 42 is equipped with a measuring unit 60 that can transmit and receive microwaves. The second member 42 is provided with a transmission path 61 that can transmit microwaves from the measuring unit 60 to the O-ring 44. The measuring unit 60 irradiates the O-ring 44 with microwaves via the transmission path 61 and detects the microwave reflection intensity. The measurement unit 60 measures the resistance value of the O-ring 44 from the detected reflection intensity based on the correlation information between the resistance value and the microwave reflection intensity. The measurement unit 60 outputs data indicating the measured resistance value to the control unit 310. In this embodiment, the substrate processing apparatus 200 may measure the resistance values ​​of multiple locations on the O-ring 44 by providing the configuration shown in Figure 6 at multiple locations along the joint portion 43.

[0048] Furthermore, the above embodiment was described using the case where resistance is measured as an electrical characteristic as an example. However, it is not limited to this. The electrical characteristic may be any characteristic that changes in accordance with the deformation of the elastic member. For example, the electrical characteristic may be current value, impedance, reactance, etc. For example, the measuring unit 53 may apply a predetermined voltage between electrodes 51a and 51b at multiple locations provided on the elastic member 50 and measure the current value flowing between electrodes 51a and 51b as an electrical characteristic. Alternatively, for example, the measuring unit 53 may apply an AC voltage between electrodes 51a and 51b at multiple locations provided on the elastic member 50 and measure the impedance and reactance between electrodes 51a and 51b as electrical characteristics.

[0049] Furthermore, the above embodiments have described an example in which the technology of this disclosure is applied to the pads 20 of the chamber or end effector 10. However, it is not limited to this. For example, the technology of this disclosure may be applied to the seal of a rotating shaft.

[0050] Figures 7A and 7B schematically show an example of a configuration for sealing the rotating shaft 71 according to the embodiment. Figure 7A shows the configuration in cross-section. Figure 7B shows the configuration in plan view. Figures 7A and 7B show a part of the housing 70. As shown in Figure 7A, the housing 70 is configured to be the boundary between the lower space 74 and the upper space 75. The lower space 74 of the housing 70 is at atmospheric pressure. The upper space 75 of the housing 70 is depressurized to low pressure. A through hole 70a is formed in the housing 70. The rotating shaft 71 passes through the through hole 70a. The rotating shaft 71 is connected to a motor 72 and rotates by the driving force of the motor 72. The rotating shaft 71 has a recess 71a formed along the circumferential direction at a position corresponding to the through hole 70a. An O-ring 73 is placed in the recess 71a of the rotating shaft 71. The O-ring 73 is formed with an outer diameter slightly larger than the through-hole 70a, filling the space between the rotating shaft 71 and the side surface of the through-hole 70a. The O-ring 73 deforms when sandwiched between the housing 70 and the rotating shaft 71, functioning as a gas seal for the rotating shaft 71. The O-ring 73 allows for airtight separation of the atmospheric pressure space 74 and the low-pressure space 75. Figure 7B schematically shows the state when the rotating shaft 71 is rotating. The rotating shaft 71 rotates due to the driving force of the motor 72. The O-ring 73 rotates together with the rotating shaft 71. The outer surface of the O-ring 73 slides against the side surface of the through-hole 70a. The O-ring 73 is covered with vacuum grease, forming a lubricating surface between it and the side surface of the through-hole 70a. However, if normal lubrication does not occur and friction abnormalities occur due to misalignment of the rotating shaft 71, deterioration of the O-ring 73, depletion of vacuum grease, etc., the O-ring 73 will deform unevenly in the circumferential direction. If the O-ring 73 undergoes uneven deformation, abnormalities such as leakage will occur. Therefore, the O-ring 73 is configured so that the electrical characteristics of multiple locations can be measured, and the deformation of the O-ring 73 is detected from the electrical characteristics of multiple locations on the O-ring 73. In the configurations shown in Figures 7A and 7B, the O-ring 73 rotates together with the rotating shaft 71. For this reason, two electrodes are placed at intervals at multiple locations along the circumferential direction of the recess 71a of the rotating shaft 71, so that the resistance values ​​of multiple locations on the O-ring 73 can be measured.In Figure 7B, two electrodes 51a and 51b are positioned at two symmetrically adjacent locations on the recess 71a of the rotating shaft 71, respectively, allowing for the measurement of resistance values ​​at two locations. The resistance values ​​of multiple electrodes 51a and 51b can be measured by providing a slip ring on the rotating shaft 71 and connecting the wiring (not shown) connected to each electrode to the measuring unit 53 via the slip ring. The measuring unit 53 may also be provided on the rotating shaft 71. This configuration allows for the detection of deformation of the O-ring 73.

[0051] Figures 8A and 8B schematically show another example of a configuration for sealing the rotating shaft 71 according to the embodiment. Figure 8A shows the configuration in cross-section. Figure 8B shows the configuration in plan view. The configurations in Figures 8A and 8B are partially identical to the configurations in Figures 7A and 7B. The following describes mainly the differences. The housing 70 has a recess 70b formed along the circumferential direction on the side surface of the through hole 70a. An O-ring 73 is placed in the recess 70b. The rotating shaft 71 passes through the hole in the O-ring 73. The inner diameter of the O-ring 73 is formed to be slightly smaller than the diameter of the rotating shaft 71, filling the space between the rotating shaft 71 and the side surface of the through hole 70a. The O-ring 73 deforms when sandwiched between the housing 70 and the rotating shaft 71, and functions as a gas seal for the rotating shaft 71. Figure 8B schematically shows the state in which the rotating shaft 71 is rotating. The rotating shaft 71 rotates due to the driving force of the motor 72. The O-ring 73 is fixed in the recess 70b of the housing 70. The side surface of the rotating shaft 71 slides against the inner surface of the O-ring 73. The O-ring 73 is covered with vacuum grease, forming a lubricating surface between it and the side surface of the rotating shaft 71. However, if normal lubrication does not occur and friction abnormalities occur due to misalignment of the rotating shaft 71, deterioration of the O-ring 73, depletion of the vacuum grease, etc., the O-ring 73 will deform unevenly in the circumferential direction. Uneven deformation of the O-ring 73 can cause abnormalities such as leaks. Therefore, the O-ring 73 is configured so that the electrical characteristics of multiple locations can be measured, and the deformation of the O-ring 73 is detected from the electrical characteristics of multiple locations on the O-ring 73. In the configurations of Figures 8A and 8B, the O-ring 73 is fixed in the recess 70b of the housing 70. For this reason, two electrodes are placed at intervals at multiple locations along the circumferential direction of the recess 70b of the housing 70, so that the resistance values ​​of multiple locations on the O-ring 73 can be measured. In Figure 8B, two electrodes 51a and 51b are positioned at two symmetrically adjacent locations in the recess 70b of the housing 70, enabling measurement of resistance values ​​at two locations. The resistance values ​​of the two electrodes 51a and 51b at multiple locations can be measured by connecting the wiring (not shown) connected to each electrode to the measurement unit 53. This configuration allows for the detection of deformation of the O-ring 73.

[0052] Furthermore, in the above embodiment, the case in which the technology of this disclosure is applied to a substrate processing apparatus 200 to detect deformation of an elastic member was described as an example. However, it is not limited to this. The technology of this disclosure may be applied to any apparatus having a configuration in which members are joined together via an elastic member.

[0053] Next, the flow of the detection process according to the detection method according to the embodiment will be described. Figure 9 is a flowchart showing an example of the flow of the detection process according to the embodiment. The process shown in Figure 9 is executed, for example, at a predetermined timing when it is necessary to detect the deformation of the elastic member 50.

[0054] The measuring unit 53 measures the electrical characteristics of multiple locations on the elastic member 50 (step S10). For example, the measuring unit 53 measures the resistance between two electrodes, each of which is positioned at multiple locations on the elastic member 50, by applying a voltage between them.

[0055] The control unit 310 detects deformation of the elastic member 50 based on the electrical characteristics of multiple locations measured by the measuring unit 53 (step S11). For example, the control unit 310 determines whether the resistance values ​​at multiple locations of the elastic member 50 are within their respective normal ranges. If the resistance values ​​at multiple locations of the elastic member 50 are within their respective normal ranges, the control unit 310 detects that the deformation of the elastic member 50 is normal. On the other hand, if the resistance value at any of the multiple locations of the elastic member 50 is outside the normal range, the control unit 310 detects that the deformation of the elastic member 50 is abnormal.

[0056] The control unit 310 outputs information based on the detection results (step S12) and terminates the process shown in this flowchart. For example, the control unit 310 outputs information based on the detection results to an external device such as a management device that is able to communicate via a network (not shown). The control unit 310 also outputs information based on the detection results to the user interface 311.

[0057] The embodiments have been described above. As described above, the substrate processing apparatus 200 according to the embodiment includes elastic members (for example, pad 20, O-ring 44, elastic member 50, O-ring 73), measuring units (for example, measuring unit 53, measuring unit 60), and detection units (for example, control unit 310). The elastic members are placed between the first and second members at a joining portion (for example, joining portion 43) that joins the first and second members (for example, substrate W and end effector 10, first member 41 and second member 42, housing 70 and rotating shaft 71), and are configured to be elastically deformable. The measuring units are configured to measure the electrical characteristics of multiple locations on the elastic members. The detection units are configured to detect the deformation of the elastic members based on the electrical characteristics of multiple locations measured by the measuring units. As a result, the substrate processing apparatus 200 can detect the deformation of the elastic members.

[0058] Furthermore, the first and second members are configured to form a boundary between the first space and the second space (for example, the space formed by the suction port 21 and the suction passage 13, which is the space outside the pad 20; the space inside the container 40 and the space outside the container 40; and space 74 and space 75) when joined together. The elastic member is configured to hermetically separate the first space and the second space. As a result, the substrate processing apparatus 200 can separate the first space and the second space while maintaining airtightness using the first member, the second member and the elastic member. In addition, the substrate processing apparatus 200 can detect the amount and state of deformation of the elastic member during joining, and in particular can detect the presence or absence of abnormal deformation that may cause leakage or damage.

[0059] Furthermore, the elastic member is positioned along the joint. The measuring unit is configured to measure the electrical characteristics of multiple locations along the joint of the elastic member. This allows the substrate processing apparatus 200 to detect the deformation of the elastic member positioned along the joint.

[0060] Furthermore, the measuring unit is configured to measure the resistance values ​​at multiple locations on the elastic member. The detection unit is configured to detect the deformation of the elastic member based on the resistance values ​​at multiple locations measured by the measuring unit. As a result, the substrate processing apparatus 200 can detect the deformation of the elastic member.

[0061] Furthermore, the detection unit is configured to detect whether the deformation of the elastic member is normal or not based on whether the resistance values ​​at multiple locations measured by the measurement unit are within a predetermined normal range. This allows the substrate processing apparatus 200 to detect whether the deformation of the elastic member is normal or not.

[0062] Furthermore, the detection unit is configured to determine the average value of the resistance values ​​measured at multiple locations by the measurement unit, and to detect whether the deformation of the elastic member is normal based on whether the resistance values ​​at multiple locations are within a predetermined tolerance range from the average value. As a result, the substrate processing apparatus 200 can detect a state in which the elastic member is deformed substantially uniformly as a normal state.

[0063] Furthermore, the detection unit is configured to detect bonding abnormalities between the first and second members based on the electrical characteristics of multiple locations measured by the measurement unit. This enables the substrate processing apparatus 200 to detect bonding abnormalities between the first and second members.

[0064] Furthermore, the elastic member is formed from a resin that includes conductive parts. This allows the substrate processing apparatus 200 to detect the deformation of the elastic member with high sensitivity.

[0065] Furthermore, the elastic component is formed from a resin containing carbon nanotubes. This allows the substrate processing apparatus 200 to detect the deformation of the elastic component with high sensitivity.

[0066] Furthermore, the first and second members are joined together to form a chamber. The elastic member is configured as a seal that hermetically separates the space inside the chamber from the space outside the chamber. This allows the substrate processing apparatus 200 to detect abnormalities in the chamber seal.

[0067] Furthermore, the first component is a substrate W. The second component is an end effector 10 on which the substrate W is placed. The elastic component is provided on the mounting surface 12 of the end effector 10 on which the substrate W is placed, and is configured as a pad 20 with a suction port 21 that communicates with a suction passage 13 formed inside the end effector 10. As a result, the substrate processing device 200 can detect deformation of the pad 20 provided on the end effector 10 and can detect abnormal gripping of the substrate W by the end effector 10.

[0068] Furthermore, the first component is a housing 70 in which a through hole 70a is formed. The second component is a rotating shaft 71 that passes through the through hole 70a. The elastic component is configured as a seal that fills the space between the rotating shaft 71 and the side surface of the through hole 70a. As a result, the substrate processing apparatus 200 can detect abnormalities in the seal of the rotating shaft 71.

[0069] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. Indeed, the embodiments described above can be embodied in a variety of forms. Furthermore, the embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims.

[0070] Furthermore, the following additional information is disclosed regarding the above embodiments.

[0071] (Note 1) An elastic member is positioned between the first member and the second member at the joint portion that joins the first member and the second member, and is configured to be elastically deformable. A measuring unit configured to measure the electrical characteristics of multiple locations on the elastic member, A detection unit configured to detect deformation of the elastic member based on the electrical characteristics of multiple locations measured by the measurement unit, A detection device having the following features.

[0072] (Note 2) The first member and the second member are configured to form a boundary between the first space and the second space when joined together. The elastic member is configured to airtightly separate the first space and the second space. The detection device described in Appendix 1.

[0073] (Note 3) The elastic member is arranged along the joint portion, The measuring unit is configured to measure the electrical characteristics of multiple locations along the joint portion of the elastic member. The detection device described in Appendix 1 or 2.

[0074] (Note 4) The measuring unit is configured to measure the resistance values ​​at multiple locations on the elastic member. The detection unit is configured to detect the deformation of the elastic member based on the resistance values ​​at multiple locations measured by the measurement unit. A detection device as described in any one of the appendices 1 to 3.

[0075] (Note 5) The detection unit is configured to detect whether the deformation of the elastic member is normal based on whether the resistance values ​​at multiple locations measured by the measurement unit are within a predetermined normal range. The detection device described in Appendix 4.

[0076] (Note 6) The detection unit is configured to determine the average value of the resistance values ​​measured by the measurement unit, and to detect whether the deformation of the elastic member is normal based on whether the resistance values ​​at the multiple locations are within a predetermined allowable range from the average value. The detection device described in Appendix 4.

[0077] (Note 7) The detection unit is configured to detect a bonding abnormality between the first member and the second member based on the electrical characteristics of multiple locations measured by the measurement unit. A detection device as described in any one of the appendices 1 to 6.

[0078] (Note 8) The elastic member is formed of a resin that includes conductive parts. A detection device as described in any one of the appendices 1 to 7.

[0079] (Note 9) The elastic member is formed from a resin containing carbon nanotubes. A detection device as described in any one of the appendices 1 to 7.

[0080] (Note 10) The first member and the second member are joined together to form a chamber. The elastic member is configured as a seal that airtightly separates the space inside the chamber from the space outside the chamber. A detection device as described in any one of the appendices 1 to 9.

[0081] (Note 11) The first component is a substrate, The second member is an end effector on which the substrate is mounted, The elastic member is provided on the mounting surface of the end effector on which the substrate is placed, and is configured as a pad with a suction port that communicates with a suction passage formed inside the end effector. A detection device as described in any one of the appendices 1 to 9.

[0082] (Note 12) The first member is a housing in which a through hole is formed, The aforementioned second member is a rotating shaft that passes through the through hole, The elastic member is configured as a seal that fills the space between the rotating shaft and the side surface of the through hole. A detection device as described in any one of the appendices 1 to 9.

[0083] (Note 13) A step of measuring the electrical characteristics of multiple locations of an elastic member, which is positioned between the first member and the second member at the joint portion where the first member and the second member are joined, and which is configured to be elastically deformable, A step of detecting the deformation of the elastic member based on the electrical characteristics of multiple locations measured, A detection method that includes [details omitted]. [Explanation of symbols]

[0084] 10 End Effectors 12 Mounting surface 13 Suction passage 20 pads 21 Suction port 40 containers 41 First Member 42 Second Member 43 Joint part 44 O-rings 45 screws 50 Elastic members 51a, 51b electrode 52 Wiring 53 Measuring part 60 Measuring part 61 Transmission lines 70 Housing 70a through hole 70b recess 71 Rotation axis 71a Recess 72 Motors 73 O-rings 74 Space 75 Space 200 Substrate Processing Equipment 201-204 Process Modules 301 Vacuum Transfer Room 302 Load Lock Room 303 Air Conveyance Room 304 Alignment Module 308 Conveying mechanism 310 Control Unit 311 User Interface 312 Storage section W board

Claims

1. An elastic member is positioned between the first member and the second member at the joint portion where the first member and the second member are joined, and is configured to be elastically deformable. A measuring unit configured to measure the electrical characteristics of multiple locations on the elastic member, A detection unit configured to detect deformation of the elastic member based on the electrical characteristics of multiple locations measured by the measurement unit, A detection device having the following features.

2. The first member and the second member are configured to form a boundary between the first space and the second space when joined together. The elastic member is configured to airtightly separate the first space and the second space. The detection device according to claim 1.

3. The elastic member is arranged along the joint portion, The measuring unit is configured to measure the electrical characteristics of multiple locations along the joint portion of the elastic member. The detection device according to claim 1.

4. The measuring unit is configured to measure the resistance values ​​at multiple locations on the elastic member. The detection unit is configured to detect the deformation of the elastic member based on the resistance values ​​at multiple locations measured by the measurement unit. The detection device according to claim 1.

5. The detection unit is configured to detect whether the deformation of the elastic member is normal based on whether the resistance values ​​at multiple locations measured by the measurement unit are within a predetermined normal range. The detection device according to claim 4.

6. The detection unit is configured to determine the average value of the resistance values ​​measured by the measurement unit, and to detect whether the deformation of the elastic member is normal based on whether the resistance values ​​at the multiple locations are within a predetermined allowable range from the average value. The detection device according to claim 4.

7. The detection unit is configured to detect a junction abnormality between the first member and the second member based on the electrical characteristics of multiple locations measured by the measurement unit. The detection device according to claim 1.

8. The elastic member is formed of a resin that includes conductive parts. The detection device according to claim 1.

9. The elastic member is formed from a resin containing carbon nanotubes. The detection device according to claim 1.

10. The first member and the second member are joined together to form a chamber. The elastic member is configured as a seal that airtightly separates the space inside the chamber from the space outside the chamber. The detection device according to claim 1.

11. The first component is a substrate, The second member is an end effector on which the substrate is mounted, The elastic member is provided on the mounting surface of the end effector on which the substrate is placed, and is configured as a pad with a suction port that communicates with a suction passage formed inside the end effector. The detection device according to claim 1.

12. The first member is a housing in which a through hole is formed, The aforementioned second member is a rotating shaft that passes through the through hole, The elastic member is configured as a seal that fills the space between the rotating shaft and the side surface of the through hole. The detection device according to claim 1.

13. A step of measuring the electrical characteristics of multiple locations of an elastic member, which is positioned between the first member and the second member at the joint portion where the first member and the second member are joined, and which is configured to be elastically deformable, A step of detecting the deformation of the elastic member based on the electrical characteristics of multiple locations measured, A detection method that includes [details omitted].

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