Hybrid PCB with planar antenna

Abstract

The present invention provides a printed circuit board formed of at least two layers, a first layer being thermally conductive and a second layer being thermally insulating, both layers providing structural support and / or mechanical rigidity to the printed circuit board, and a planar antenna being mounted on the second layer.

Description

Technical Field

[0001] The present invention relates to printed circuit boards, particularly to the field of printed circuit boards on which planar antennas are mounted.

Background Art

[0002] Printed circuit boards are a widely established and common part of modern electronic devices. Generally, a printed circuit board not only provides structural support for the electronic components of an electronic device, but also defines the electrical interconnections between the electronic components coupled to the printed circuit board.

[0003] It is common for an electronic device to have a plurality of printed circuit boards, each designed for a different function of the electronic device. By way of example, a connected lighting configuration may include printed circuit boards for each of the functions of lighting, control, and wireless / external communication.

Summary of the Invention

Problems to be Solved by the Invention

[0004] There is a continuing desire to reduce the size and / or number of printed circuit boards in order to make electronic devices more compact.

Means for Solving the Problems

[0005] The present invention is defined by the claims.

[0006] According to an example of one aspect of the present invention, a printed circuit board is provided, comprising: a first layer providing a core for the printed circuit board, formed of a thermally conductive material for diffusing or dissipating heat and providing structural support for the printed circuit board; a second layer formed of an electrically insulating and mechanically rigid material, the second layer being at least partially mounted on the first layer and suitable for supporting one or more electronic components requiring heat dissipation, wherein at least one electronic component mounted on the first layer dissipates heat through the first layer; and a planar antenna disposed on the second layer.

[0007] The present invention provides a printed circuit board for use in carrying out multiple functions, including external communication (via the planar antenna) and at least one other function (via an electronic component in the first portion of the second layer). This provides a more compact and space-efficient solution for electronic devices.

[0008] By providing the first (thermal conductive) layer, a heat sink / spreader for diffusing or dissipating heat from the electronic components is incorporated into the printed circuit board. For example, the first layer can dissipate heat directly to the external environment, or it can diffuse / conduct heat to a (further) heat sink (e.g., a housing for the printed circuit board).

[0009] A mechanically rigid (but electrically insulating) material forms a second layer which is attached to the first layer. The second layer provides two functions: to provide additional structural support to the printed circuit board, and to electrically insulate electronic components from the first layer and / or (if present) any other layers between the first and second layers.

[0010] As a result, multiple layers or elements perform two functions in an efficient manner, thus providing a more compact printed circuit board.

[0011] In some embodiments, the second layer is a first portion mounted on the first layer, and is for supporting one or more electronic components that require heat dissipation, wherein any of the electronic components mounted on the first portion has a first portion that dissipates heat through the first layer and a second portion that is not mounted on the first layer, and the planar antenna is located on the second portion of the second layer.

[0012] It has been observed that such layers near the antenna, particularly thermally conductive and / or electrically conductive layers, affect the efficiency and / or sensitivity of the antenna. Based on this understanding, it has been proposed to remove or omit the first layer beneath the antenna.

[0013] This method thereby improves the sensitivity and accuracy of the planar antenna, and thereby improves the operation of any PCB assembly including the disclosed printed circuit board.

[0014] Optionally, the second portion of the second layer is not completely enclosed by the first portion of the second layer. This method improves the efficiency and / or sensitivity of the antenna by reducing the amount of material surrounding the antenna to increase its sensitivity to incoming / outgoing electromagnetic waves.

[0015] The first layer may be formed of a metal. This provides a mechanically robust core for the printed circuit board with good thermal conductivity. Among commercially available reliable materials, metals have been found to possess the properties best suited to perform the two functions of thermal diffusion / dissipation and structural support. Examples of suitable metals include aluminum (preferred in terms of weight), iron, and / or steel.

[0016] The second layer is formed of FR4 material. This provides a mechanically robust core for the printed circuit board with good insulating properties.

[0017] The aforementioned planar antenna is preferably a meander antenna.

[0018] The printed circuit board may further have a first interconnection layer between the first layer and the second layer, the first interconnection layer being made of a conductive material. The first interconnection layer may be appropriately patterned to connect any relevant electronic components.

[0019] The printed circuit board may further have an insulating layer between the first interconnection layer and the first layer, and the insulating layer is formed of an electrically insulating material.

[0020] In some cases, the electrical insulating material is formed of a dielectric material.

[0021] Preferably, the thickness of the first layer is 1 mm or more. For example, the thickness of the first layer is preferably 2 mm or more, and more preferably 5 mm or more. In some examples, the thickness of the first layer is 10 mm or more. Increasing the thickness of the first layer (for example, up to 1 mm or more) strengthens the structural support for the rest of the printed circuit board.

[0022] The printed circuit board may further have a second interconnection layer attached to the second layer, wherein at least a portion of the second layer is positioned between the second interconnection layer and the first layer, and the second interconnection layer is made of a conductive material. The second interconnection layer can be appropriately patterned to connect any relevant electronic components.

[0023] The second interconnection layer may provide a ground plane for the planar antenna.

[0024] The planar antenna may be a radio frequency planar antenna, i.e., a planar antenna of a size and shape for providing and / or receiving radio frequency communications.

[0025] There is also provided a printed circuit board (PCB) assembly having the aforementioned printed circuit board and one or more electronic components attached to the second layer. When the second layer is formed to have a first portion and a second portion, the one or more electronic components are preferably attached to the second portion.

[0026] The one or more electronic components may include, for example, control logic, radio frequency communication processing devices, etc. The one or more electronic components may include, for example, one or more resistors, inductors, capacitors, microprocessors, transistors, transformers, diodes, etc.

[0027] The printed circuit board assembly may further have a housing for accommodating the printed circuit board and the one or more electronic components. In some examples, the housing is thermally coupled to the first layer and is configured to thermally dissipate and / or spread heat away from the first layer. In some examples, the housing is formed of a thermally conductive material such as metal.

[0028] A method of manufacturing a printed circuit board as disclosed herein is also proposed. The method includes providing a first layer that provides a core for the printed circuit board formed of a thermally conductive material for diffusing or dissipating heat, providing a second layer formed of an electrically insulating and mechanically rigid material on top of the first layer, removing at least a portion of the first layer, thereby defining in the second layer a first portion that is mounted on top of the first layer and supports one or more electronic components that require heat dissipation, and a second portion that is not mounted on top of the first layer, and providing a planar antenna in the second portion of the second layer.

[0029] The method may further include the step of providing a first interconnection layer on the first layer and the second layer, wherein the first interconnection layer is made of a conductive material, and the step of providing the second layer includes the step of providing the second layer on top of the first interconnection layer.

[0030] Another method for manufacturing a printed circuit board as disclosed herein has also been proposed. The method comprises the steps of: providing a first layer that provides a core for the printed circuit board, which is formed of a thermally conductive material for diffusing or dissipating heat; providing a first portion of a second layer, which is formed of an electrically insulating and mechanically rigid material, on the first layer, forming a second portion of the second layer separately from the first layer and the first portion of the second layer, and bonding the second portion of the second layer to the first portion of the second layer, thereby defining a second layer which includes a first portion mounted on the first layer for supporting one or more electronic components that require heat dissipation, and a second portion that is not mounted on the first layer; and providing a planar antenna on the second portion of the second layer.

[0031] These and other aspects of the present invention will be described and clarified with reference to the embodiments described below. [Brief explanation of the drawing]

[0032] For a better understanding of the present invention and to more clearly illustrate how it can be carried out, the accompanying drawings are referenced here, as merely one example. [Figure 1] This shows a cross-sectional view of a portion of a printed circuit board. [Figure 2] A printed circuit board is conceptually illustrated. [Figure 3] This is a flowchart illustrating the process for manufacturing printed circuit boards. [Figure 4] This is a flowchart illustrating an alternative method for manufacturing printed circuit boards. [Modes for carrying out the invention]

[0033] The present invention will be described with reference to the figures.

[0034] The detailed descriptions and specific examples illustrate exemplary embodiments of the apparatus, systems, and methods, but are for illustrative purposes only and should not be used to limit the scope of the invention. These and other features, aspects, and advantages of the apparatus, systems, and methods of the invention will be better understood from the following description, the appended claims, and the appended drawings. The figures are for illustrative purposes only and are not drawn to scale. The same reference numerals are used throughout the figures to indicate the same or similar parts.

[0035] A printed circuit board is provided, formed of at least two layers. The first layer is thermally conductive, and the second layer is thermally insulating. Both layers provide structural support and / or mechanical rigidity to the printed circuit board. A planar antenna is provided on the second layer.

[0036] The embodiments are based on the recognition that while a thermally conductive core for a printed circuit board provides good heat diffusion / dissipation, it may affect the operation of the antenna and may not provide sufficient structural support. The present invention proposes further providing an additional (second) layer of thermally insulating but structurally rigid material for mounting electronic components and a planar antenna.

[0037] Further embodiments recognize that a conductive core located near a planar antenna affects the operation of the planar antenna, for example, by reducing its sensitivity and / or accuracy. To keep the planar antenna away from the core, it has been proposed to divide the second layer into a first portion that is positioned on the core and a second portion that is not attached to the core. The second layer provides sufficient structural support for the planar antenna.

[0038] The disclosed method can be employed in any suitable printed circuit board configuration utilizing a planar antenna, and can be used in radio frequency printed circuit board assemblies in particular.

[0039] In relation to this disclosure, when a layer is mounted "on top of" another layer, these layers are configured such that one layer structurally supports the other. There may be additional layers positioned between layers, one mounted on top of the other.

[0040] In particular, immediately after the manufacture of a printed circuit board including a first virtual layer and a second virtual layer, if, for example, the first virtual layer is above the second virtual layer in the vertical direction such that a vertical virtual line (a line parallel to the direction of gravity) passes through both the first and second virtual layers, then the first virtual layer can be considered to be "above" the second virtual layer.

[0041] Figure 1 conceptually shows a cross-sectional view of a printed circuit board 100 according to an embodiment. Figure 1 is used to conceptually illustrate the proposed method and is merely a schematic representation.

[0042] The printed circuit board has a first layer 110 that provides a core for the printed circuit board 100. The first layer 110 is formed of a thermally conductive material configured to diffuse or dissipate heat. The first layer also provides structural support for the printed circuit board.

[0043] Examples of suitable materials for performing the required functions will be obvious to those skilled in the art and include metals such as aluminum, iron, or steel, and other materials such as ceramics (e.g., aluminum oxide or alumina (Al2O3) or aluminum nitride). Preferably, the first layer is 20 Wm² (e.g., at 20°C). -1 K -1 It is formed from a material with a thermal conductivity and a Young's modulus of 50 GPa or higher.

[0044] The first layer can be appropriately sized to achieve its desired function, for example, to provide structural support for at least the printed circuit board. For example, the first layer may have a thickness of 1 mm or more. In some examples, the thickness of the first layer is preferably 2 mm or more, and more preferably 5 mm or more. In some examples, the thickness of the first layer is 10 mm or more. Increasing the thickness of the first layer (for example, up to 1 mm or more) enhances the structural support for the rest of the printed circuit board.

[0045] The first layer 110 thereby serves as both a structural support for the printed circuit board 100 and a heat spreader / sink or heat spreader.

[0046] The printed circuit board 100 also has a second layer 120 which is at least partially mounted on the first layer. In the illustrated example, the second layer is only partially mounted on the first layer. The thickness of the second layer 120 may be 0.1 mm to 4 mm, for example 0.1 mm to 2 mm, for example 0.1 mm to 1 mm, or for example 0.5 mm.

[0047] The second layer is formed from an electrically insulating and mechanically rigid material. Examples of materials include FR4 (or FR-4) material, or other similar materials with a high dielectric constant or relative dielectric constant, such as ceramics.

[0048] The second layer is configured to support one or more electronic components that require heat dissipation. At least one electronic component 125 attached to the first part dissipates heat through the first layer. Thus, the first layer can directly dissipate heat from at least one electronic component 125 and / or diffuse / conduct heat to a heat sink / another heat sink for dissipation.

[0049] The second layer provides additional structural support for the printed circuit board, and in particular for the components placed on the printed circuit board. The second layer also functions to electrically isolate the electronic components from the first layer and / or any other layers between the first and second layers (if any).

[0050] The printed circuit board 100 also has a planar antenna 130, which is a planar antenna located on the second layer. The planar antenna 130 may be, for example, a meander antenna.

[0051] A planar antenna may be a radio frequency planar antenna, i.e., a planar antenna of a size and shape for providing and / or receiving radio frequency communications. Accordingly, a planar antenna may be configured to generate an electrical signal that changes in response to an incoming radio frequency wave, and / or to generate a radio frequency wave in response to a supplied electrical signal. Methods for constructing planar antennas for such purposes are well known in the art.

[0052] In other embodiments of the present invention, other types of planar antennas (i.e., non-radio frequency planar antennas) may also be employed.

[0053] Figure 1 illustrates a particularly advantageous version of the printed circuit board. In this version, the second layer is conceptually divisible into a first part 121 and a second part 122. This division is conceptually represented by a dotted line.

[0054] The first part 121 is mounted on the first layer and is configured to support one or more electronic components 125 that require heat dissipation. As previously described, any electronic components mounted on the first part dissipate heat through the first layer.

[0055] The second part 122 is not mounted on top of the first layer. More precisely, the second part 122 is structurally supported by the first layer 110 via the first part 121. Thus, the second part 122 is structurally supported by the second part 121 of the second layer.

[0056] The planar antenna 130 is positioned in the second portion 122 of the second layer. The material of the second layer 120 provides mechanical rigidity for supporting the antenna in the second portion 122 of the second layer. In particular, the second portion 122 of the second layer provides mechanical stability to the planar antenna 130.

[0057] In this configuration, the region of the first layer 110 is not near the planar antenna and the second portion 122 of the second layer. Therefore, the first layer does not provide direct structural support for the second portion 122 of the second layer 120 or the planar antenna 130 (more precisely, it only provides support via the first portion 121 of the second layer).

[0058] Preferably, the second portion 122 of the second layer 120 is not completely enclosed by the first portion of the second layer. Thus, the second portion 122 can effectively protrude from the first layer 110. This technique reduces the amount of material near the antenna, which can increase the antenna's sensitivity to electromagnetic radiation.

[0059] It will be understood that the printed circuit board 100 may include one or more electronic components 125 that require heat dissipation in order to form the printed circuit board assembly. However, this is not mandatory, and the printed circuit board 100 may instead have locations or zones where one or more electronic components 125 can be later coupled or connected, as is well known in the art.

[0060] Although only one electronic component 125 is shown in Figure 1, this is merely a schematic representation for illustrative purposes. In reality, a printed circuit board can be configured to mount any number of electronic components, for example, more than 10 components or more than 100 components.

[0061] Figure 1 also illustrates other optional features of the printed circuit board 100.

[0062] Some electronic components, such as LEDs, generate a considerable amount of heat. Therefore, it would be preferable to thermally bond such components more closely to the first layer 110 (which acts as a heat spreader / sink).

[0063] Therefore, in some examples, one or more additional electrical components 140 may be attached to the first layer 110 but not to the second layer 120. Thus, one or more electrical components may be directly structurally supported by the first layer 110 but not structurally supported by the second layer 120 (i.e., when the first layer is on a flat surface).

[0064] This allows one or more additional electrical components to be more closely thermally bonded to the first layer 110, improving heat dissipation of such components from the printed circuit board.

[0065] As previously stated, it will be understood that the printed circuit board 100 may include one or more additional electronic components 140. However, this is not mandatory, and the printed circuit board 100 may instead have locations or zones where one or more additional electronic components 140 can be later coupled or connected, as is well known in the art.

[0066] Although only one additional electronic component 140 is shown in Figure 1, this is merely a schematic representation for illustrative purposes. In reality, a printed circuit board can be configured to accommodate any number of additional electronic components, for example, more than 10 additional components or more than 100 additional components.

[0067] It is generally desirable to provide interconnection sections on the printed circuit board 100 and to connect components supported at these interconnection sections in order to perform a desired function. The printed circuit board may thereby have one or more interconnection layers 151, 152, 153 formed of a conductive material.

[0068] For example, a printed circuit board may have a first interconnection layer 151 between a first layer 110 and a second layer 120. The first interconnection layer 151 may provide electrical connections to any additional electronic components 140 that are mounted on the first layer 110 (but not on the second layer 120). The first interconnection layer 151 is formed of a conductive material.

[0069] The printed circuit board 100 may have a second interconnection layer 152 attached to the second layer 120. In particular, the second interconnection layer is positioned such that at least a portion of the second layer is located between the second interconnection layer and the first layer. The second interconnection layer 152 is also formed of a conductive material.

[0070] The second interconnection layer may also provide a ground plane for planar antennas.

[0071] It will be understood that the second interconnection layer 152 does not necessarily have to be located beneath the planar antenna 130 as shown in Figure 1. More precisely, both the second interconnection layer 152 and the planar antenna 130 may be (directly) attached to the second layer 120. In particular, the planar antenna 130 may effectively form part of the second interconnection layer 130, and / or the second interconnection layer may provide an electrical connection to the planar antenna 130.

[0072] The printed circuit board 100 may have a third interconnection layer 153 mounted between the first interconnection layer 151 and the second layer 120. The third interconnection layer 152 allows for improved ease of assembly or manufacture of the printed circuit board (for example, to allow for the separate manufacture of the first and second layers before they are coupled to each other via the first and second interconnection layers). The third interconnection layer 153 is also formed of a conductive material.

[0073] Examples of conductive materials for use as materials for the first, second, and / or third interconnection layers (if applicable) include copper, gold, or silver. Copper is generally preferred due to its low cost and ease of manufacture (for example, for soldering or similar processes).

[0074] Each interconnection layer 151, 152, 153 (if present) may consist of one or more electrical traces for connecting, for example, locations where electronic components are connected or should be connected. The electrical traces may form a predetermined connection pattern for achieving a desired communication objective. Techniques for forming such traces are well known in the art of printed circuit boards.

[0075] To prevent components from supplying current to the first layer 110 (which acts as a heat spreader / sink), the printed circuit board may further have an insulating layer 160 between the first interconnection layer 151 and the first layer 110. The insulating layer may have a thickness between 0.05 mm and 1 mm, for example, 0.1 mm.

[0076] The insulating layer is formed of an electrically insulating material such as a dielectric material (e.g., aluminum nitride or silicon carbide). Preferably, the insulating material has a capacitance of 20 Wm (e.g., at 20°C) to improve heat dissipation. -1 K -1 It has the above thermal conductivity.

[0077] The use of an insulating layer is particularly advantageous when the first layer is formed from a conductive material such as a metal (e.g., aluminum). This prevents the first layer from becoming charged and potentially posing a danger to any person who touches it (e.g., unintentionally).

[0078] The printed circuit board 100 may further have one or more vias 170 or interconnects passing through the second layer 120. This allows components mounted on the second layer 120 to electrically communicate with any components not mounted on the first layer through the vias and the first / second interconnect layers.

[0079] Each via is a hole penetrating the second layer 120 that is coated with or filled with a conductive material such as a metal (e.g., copper, gold, or silver).

[0080] The vias also serve to provide heat dissipation for components attached to the second layer, for example, by conducting heat to the first layer 110 through the vias. This method is particularly advantageous when the second layer is formed of an insulating material, such as FR4 material or similar.

[0081] Each via may have a plug made of a thermally conductive material that completely or partially fills the via, for example, to improve heat dissipation. Examples of thermally conductive materials include metals and some ceramics. In some examples, each via is a hole coated with metal (to provide electrical connections) and filled with a plug made of a thermally conductive material such as ceramic.

[0082] Although only one via is shown, it will be readily apparent to those skilled in the art that a printed circuit board may have any number of vias.

[0083] Figure 2 shows a perspective view of an example of a printed circuit board 100. For the sake of clarity, only two electronic components are shown, but those skilled in the art will readily understand that in practice, such a printed circuit board 100 can be configured to mount any number of electronic components.

[0084] Figure 2 more clearly illustrates how the planar antenna 130 may be attached to a second portion 122 of the second layer 120 that is not attached to the first layer 110 (for example, not directly structurally supported by the first layer 110).

[0085] This figure also more clearly shows how additional electronic components 140 can be mounted on the first layer 110 without being mounted on the second layer 120. In particular, the second layer 120 may have one or more cavities 129 where any such additional electronic components can be placed.

[0086] To simplify the explanation, other layers, such as the interconnection layer and / or insulating layer, are not directly shown in Figure 2. In particular, Figure 2 is useful for understanding the spatial relationship between the first and second layers.

[0087] Figure 3 is a flowchart illustrating a method 300 for manufacturing a printed circuit board as disclosed herein.

[0088] Method 300 includes step 310 of providing a first layer that provides a core for a printed circuit board, which is formed of a thermally conductive material to diffuse or dissipate heat. Step 310 may be carried out, for example, using a deposition technique or a cutting / dicing technique.

[0089] Method 300 also includes step 320 of providing a second layer, formed of an electrically insulating and mechanically rigid material, on top of the first layer. Step 320 can be carried out, for example, by depositing the second layer on top of the first layer. Alternatively, step 320 can be carried out by separately manufacturing the second layer and then bonding or otherwise attaching the second layer to the first layer.

[0090] Alternatively, steps 310 and 320 may be carried out by depositing the first layer onto the second layer, or by attaching or joining separately manufactured first and second layers to each other.

[0091] After performing steps 310 and 320, the first and second layers may have the same cross-sectional area (for example, when viewed from above).

[0092] The method also includes step 330 of removing at least a portion of the first layer. This thereby defines in the second layer a first portion which is mounted on the first layer and is for supporting one or more electronic components that require heat dissipation, and a second portion which is not mounted on the first layer.

[0093] Method 300 also includes step 340 of providing a planar antenna to a second portion of the second layer. Techniques for carrying out this step will be readily apparent to those skilled in the art. The techniques may include forming the planar antenna using deposition or printing techniques, which may be followed by an etching step as needed. Of course, some deposition techniques do not require an etching step to create the shape or form of the planar antenna.

[0094] Steps 330 and 340 can be carried out in reverse order, such that the planar antenna is installed in the second portion of the second layer before at least a portion of the first layer is removed.

[0095] Naturally, method 300 can be appropriately modified to include providing other optional layers on the printed circuit board.

[0096] For example, method 300 may further include step 350 of providing a first interconnection layer between a first layer and a second layer, the first interconnection layer being made of a conductive material. Step 320 may be modified accordingly to include providing a second layer on top of the first interconnection layer.

[0097] Similarly, method 300 may further include step 360 of providing a second interconnection layer on the second layer (such that the second layer is positioned between the first layer and the second interconnection layer). This can be carried out after step 320 and / or incorporated into the implementation of step 340. Thus, the planar antenna and the second interconnection layer can be manufactured or provided simultaneously or in the same process (e.g., the same deposition and optional etching process).

[0098] Method 300 may further include step 370 of providing an insulating layer between the first interconnection layer and the first layer. This can be carried out, for example, using a deposition technique. Of course, when step 370 is carried out, the first interconnection layer may not yet be present.

[0099] Figure 4 is a flowchart illustrating an alternative method 400 for manufacturing a printed circuit board as disclosed herein.

[0100] Method 400 includes step 410 of providing a first layer that provides a core for a printed circuit board, which is formed of a thermally conductive material for diffusing or dissipating heat.

[0101] Method 400 further comprises step 420 of providing a first portion of a second layer, formed of an electrically insulating and mechanically rigid material, on top of the first layer. The portion of the second layer provided on the first layer in this manner can perform the function of the first portion.

[0102] Steps 410 and 420 can be carried out in a manner similar to that of steps 310 and 320 described above (see Figure 3).

[0103] Method 400 further comprises step 430 of forming a second portion of the second layer, separate from the first layer and the first portion of the second layer.

[0104] The method then proceeds to perform step 440, which involves joining the second portion of the second layer to the first portion of the second layer. This can be carried out using any suitable joining technique.

[0105] The implementation of step 440 thereby defines a second layer having a first portion mounted on the first layer, the first portion for supporting one or more electronic components that require heat dissipation, and a second portion that is not mounted on the first layer.

[0106] Method 400 also includes step 450 of providing a planar antenna to the second portion of the second layer. This can be carried out in any manner similar to step 340 described above. Step 450 can be carried out before or after step 440.

[0107] In a certain modification of Method 400, step 450 is carried out as part of steps 420 and 440. In this method, step 420 includes step 421 of providing an initial second layer on top of the first layer, step 422 of providing a planar antenna on the second layer, and step 423 of etching or removing portions of the first and second layers near the planar antenna. The remaining (unremoved) portion of the second layer forms the first portion of the second layer. Then, in order to carry out both steps 440 and 450, the second portion (generated in step 430) is joined to the first portion.

[0108] Similar to method 300 described above, method 400 can be appropriately modified to include providing other optional layers on the printed circuit board.

[0109] For example, method 400 may further include step 460 of providing a first interconnection layer between a first layer and a second layer, the first interconnection layer being made of a conductive material. Step 420 may be modified accordingly to include providing a second layer on top of the first interconnection layer.

[0110] Similarly, method 400 may further include step 465 of providing a second interconnection layer on the second layer (such that the second layer is positioned between the first layer and the second interconnection layer). This can be carried out after step 420 and / or may be incorporated into the implementation of step 450 as needed. Thus, the planar antenna and the second interconnection layer can be manufactured or provided simultaneously or in the same process (e.g., the same deposition and optional etching process).

[0111] Method 400 may further include step 470 of providing an insulating layer between the first interconnection layer and the first layer. This can be carried out, for example, using deposition techniques. Of course, when step 470 is carried out, the first interconnection layer may not yet be present.

[0112] Other variations and modifications to the methods for manufacturing printed circuit boards described herein will be obvious to those skilled in the art.

[0113] Suitable deposition techniques for use in the proposed embodiments are well known in the field of circuit manufacturing and are not described here for the sake of clarity. Examples of deposition techniques include physical or chemical vapor deposition techniques, sputtering techniques, and the like.

[0114] A person skilled in the art will be able to understand and achieve, in carrying out the claimed invention, variations to the disclosed embodiments by studying the drawings, specification and appended claims. In the claims, the word “has” does not exclude other elements or steps, and singular nouns do not exclude plural nouns.

[0115] The mere fact that certain means are mentioned in different dependent claims does not mean that combinations of these means cannot be used to one's advantage.

[0116] Note that where the term “adapted to be…” is used in the claims or specification, it is intended to be equivalent to the term “configured to be…”. Note that where the term “configuration” is used in the claims or specification, it is intended to be equivalent to the term “system”, and vice versa.

[0117] No reference numeral in the claims should be construed as limiting the scope.

Claims

1. Printed circuit board, A first layer providing a core for the printed circuit board, formed of a thermally conductive material to diffuse or dissipate heat and provide structural support for the printed circuit board, This is the second layer, A first part mounted on the first layer, a first part for supporting one or more electronic components that require heat dissipation, and all electronic components mounted on the first part dissipate heat through the first layer, and A second layer including a second portion that is not attached to the first layer, The second layer is formed of an electrically insulating and mechanically rigid material, and the second layer is at least partially mounted on the first layer and is suitable for supporting one or more electronic components that require heat dissipation, and at least one electronic component mounted on the first part is connected to the second layer which dissipates heat through the first layer. A printed circuit board having a planar antenna disposed in the second portion of the second layer.

2. The printed circuit board according to claim 1, wherein the first layer is made of metal.

3. The printed circuit board according to claim 1, wherein the second layer is formed of FR4 material.

4. The printed circuit board according to claim 1, wherein the planar antenna is a meander antenna.

5. The printed circuit board according to claim 1, further comprising a first interconnection layer between the first layer and the second layer, wherein the first interconnection layer is made of a conductive material.

6. The printed circuit board according to claim 5, further comprising an insulating layer between the first interconnection layer and the first layer, wherein the insulating layer is made of an electrically insulating material.

7. The printed circuit board according to claim 6, wherein the electrical insulating material is formed of a dielectric material.

8. The printed circuit board according to claim 1, wherein the thickness of the first layer is 1 mm or more.

9. The printed circuit board according to claim 5, further comprising a second interconnection layer attached to the second layer, wherein at least a portion of the second layer is disposed between the second interconnection layer and the first layer, and the second interconnection layer is made of a conductive material.

10. The printed circuit board according to claim 9, wherein the second interconnection layer provides a ground plane for the planar antenna.

11. A method for manufacturing a printed circuit board according to any one of claims 1 to 10, The steps include providing a first layer that provides a core for the printed circuit board, which is formed of a thermally conductive material for diffusing or dissipating heat, The steps include providing a second layer, formed of an electrically insulating and mechanically rigid material, on top of the first layer, By removing at least a portion of the first layer, thereby in the second layer, A first portion mounted on the first layer, the first portion for supporting one or more electronic components that require heat dissipation, and A step of defining a second portion that is not attached to the first layer, A method comprising the step of providing a planar antenna to the second portion of the second layer.

12. The method further comprises the step of providing a first interconnection layer on the first layer and the second layer, wherein the first interconnection layer is formed of a conductive material. The method according to claim 11, wherein the step of providing the second layer is to provide the second layer on top of the first interconnection layer.

13. A method for manufacturing a printed circuit board according to any one of claims 1 to 10, The steps include providing a first layer that provides a core for the printed circuit board, which is formed of a thermally conductive material for diffusing or dissipating heat, A first portion of a second layer, formed from an electrically insulating and mechanically rigid material, is provided on the first layer. Apart from the first layer and the first portion of the second layer, a second portion of the second layer is formed. The second portion of the second layer is joined to the first portion of the second layer, thereby, The first portion mounted on the first layer, the first portion for supporting one or more electronic components that require heat dissipation, and A step of defining a second layer which includes the second portion that is not attached to the first layer, A method comprising the step of providing a planar antenna to the second portion of the second layer.

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