Cooling devices for electronic equipment

Abstract

To provide a cooling device for electronic apparatuses with which it is possible to downsize a cooling fan without reducing a discharge amount of a cooling air.SOLUTION: A first air blower unit blows air by rotation and has a first discharge surface that discharges air. A second air blower unit blows air by rotation and has a second discharge surface that discharges air and that is installed adjacent to the first air blower unit. A heat sink has a smaller width than a sum total of diameters of the first and second discharge surfaces, and has a plurality of fins arranged to a base unit upright in a thickness direction through which the heat of electronic components propagates. An edge of the fin in an upstream side of the blow direction faces the first discharge surface or the second discharge surface. An edge of fins located downstream of a boundary of the first and second discharge surfaces is located closer to the first and second discharge surfaces than the other edges. A duct covers the heat sink and the first and second air blower units and has a suction port on the upstream side and an exhaust port on the downstream side in the direction of air blow by the first and second air blower units.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] Embodiments of the present invention relate to a cooling device for an electronic device.

Background Art

[0002] Conventionally, electronic devices such as PCs (Personal Computers) include components that become hot, such as CPUs (Central Processing Units). Generally, a heat sink is attached to such components for heat dissipation. Then, heat dissipation is performed by the air sucked in by a fan installed on the upstream side flowing through the heat sink and being exhausted to the downstream side of the heat sink. (For example, Patent Document 1)

[0003] Recently, there has been a great demand for miniaturization of electronic devices, and miniaturization of the cooling fan that blows air to the heat sink has been required. However, when the cooling fan is miniaturized, the discharge amount of the cooling air decreases, so the cooling performance of the heat sink deteriorates, which is not preferable.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The problem to be solved by the present invention is to provide a cooling device for an electronic device that can achieve miniaturization of the cooling fan without reducing the discharge amount of the cooling air.

Means for Solving the Problems

[0005] The cooling device for an electronic device according to the embodiment includes a first blower unit, a second blower unit, a heat sink, and a duct. The first blower unit creates an air flow by blowing air due to rotation and has a first discharge surface that discharges the air. The second blower unit creates an air flow by blowing air due to rotation and has a second discharge surface that discharges the air, and is provided to the first blower unit Without leaving any gapsThey are installed adjacent to each other. The heat sink has a width smaller than the sum of the diameters of the first discharge surface and the second discharge surface, and multiple fins are arranged in the thickness direction on the base portion through which heat from the electronic components is conducted. ru. The duct covers the heat sink, the first air blower, and the second air blower, and has an intake port on the upstream side and an exhaust port on the downstream side in the direction of airflow by the first air blower and the second air blower. Furthermore, the first discharge surface and the second discharge surface are arranged symmetrically on the upstream side of the heat sink, with the central fin in the width direction of the heat sink in between, the upstream edge of the fin in the airflow direction facing the first discharge surface or the second discharge surface, the edge of the central fin located downstream of the boundary between the first discharge surface and the second discharge surface is located closer to the first and second discharge surfaces than the other edges, the edges of the fin facing the first and second discharge surfaces are located along a mountain-shaped imaginary line protruding from the center in the direction of the arrangement of the multiple fins, and the first angle formed by the central fin and the first discharge surface and the second angle formed by the central fin and the second discharge surface are arranged to be 45° or more, so that the airflow direction of the first air blower and the second air blower are directed toward the central fin, respectively. [Brief explanation of the drawing]

[0006] [Figure 1] Figure 1 is a perspective view showing an example of the external appearance of the cooling device according to the embodiment. [Figure 2] Figure 2 is a schematic perspective view showing an example of the structure of an electronic device to which a cooling device is attached. [Figure 3] Figure 3 is a perspective view showing an example of a ventilation hole provided in an electronic device. [Figure 4] Figure 4 is a perspective view showing an example of a duct shape. [Figure 5] Figure 5 is a schematic plan view of a cooling device illustrating the relationship between the orientation of the fan's discharge surface and the shape of the fin edges. [Figure 6] Figure 6 is a schematic plan view of a cooling device illustrating the relationship between the orientation of the fan's discharge surface and the shape of the fin edges. [Figure 7] Figure 7 is a schematic plan view of a cooling device illustrating the relationship between the orientation of the fan's discharge surface and the shape of the fin edges. [Modes for carrying out the invention]

[0007] Embodiments will be described with reference to the drawings. Figure 1 is a perspective view showing an example of the external appearance of the cooling device 200 of the first embodiment. Figure 2 is a perspective view schematically showing an example of the structure of the electronic device 100 to which the cooling device 200 is attached. For the sake of explanation, a three-dimensional coordinate system is also shown in the drawings. In the three-dimensional coordinate system, the width direction (left-right direction) of the cooling device 200 and the electronic device 100 is the X-axis direction, the depth direction (front-back direction) is the Y-axis direction, and the height direction (up-down direction) is the Z-axis direction. The positive direction of the Y-axis is the direction from the back side to the front side of the electronic device 100, and the positive direction of the Y-axis is defined as "forward". The positive direction of the Z-axis is the direction from bottom to top.

[0008] First, as shown in Figure 1, the cooling device 200 comprises a duct 1, a heat sink 2, and fans 3 and 4. The duct 1 has a roughly box-like shape and covers the heat sink 2 and the fans 3 and 4 that blow air onto the heat sink 2. An intake port 11 is provided on the upstream side of the airflow direction of the fans 3 and 4, and an exhaust port 12 is provided on the downstream side. The duct 1 causes the fans 3 and 4 to draw in air from the intake port 11 and discharge it from the exhaust port 12. The direction of airflow from the fans 3 and 4 is directed in the negative direction (rearward) of the Y-axis by the duct 1.

[0009] Hereafter, when simply referred to as "upstream," it means the upstream side (windward) based on the direction of airflow within duct 1 (negative direction of the Y-axis). Similarly, when simply referred to as "downstream," it means the downstream side (leeward) based on the direction of airflow within duct 1.

[0010] The heatsink 2 is generally made of a metal material with high thermal conductivity, such as aluminum or copper, and is attached to a heat-generating electronic component (heat source). This heat source is, for example, a CPU (Central Processing Unit). The heat generated by the CPU is conducted to the heatsink 2, and the heat from the heatsink 2 is dissipated into the surrounding air. This prevents malfunctions caused by CPU overheating.

[0011] The heatsink 2 comprises a base portion 21 and a plurality of fins 22. The base portion 21 receives heat conduction from the electronic components. The fins 22 are arranged vertically on the base portion 21 in a row in the thickness direction. The plurality of fins 22 are adjacent to each other with a predetermined distance between them. The base portion 21 is in contact with the CPU and receives heat conduction from the CPU. The fins 22 dissipate the heat conducted from the base portion 21, which is continuous with them, into the air (heat dissipation). Heat dissipation is promoted as air flowing through the duct 1 passes between the fins 22 of the heatsink 2.

[0012] The heatsink 2 is fixed to frames 81 and 82, which are arranged in layers at predetermined intervals, using coil springs 84 and screws 85. The motherboard 101 (see Figure 2) is sandwiched between frames 81 and 82.

[0013] Fan 3 is an example of a first air blower in this disclosure. Fan 4 is an example of a second air blower in this disclosure. Fan 3 has a first discharge surface that discharges air drawn in from the outside toward the heat sink 2. Fan 4 has a second discharge surface that discharges air drawn in from the outside toward the heat sink 2.

[0014] In this embodiment, fans 3 and 4 are the same size and are arranged symmetrically along the X-axis, passing through the center of the heatsink 2 in the width direction, with respect to a plane parallel to the fins 22 (a plane parallel to the YZ plane) at an angle of 90 degrees or more.

[0015] Fans 3 and 4 are axial fans that continuously supply air by rotating a propeller, which has one or more blades around a rotating shaft, using, for example, a transmission motor. The airflow from fans 3 and 4 creates an airflow between the fins 22. The air supplied by fans 3 and 4 carries the heat dissipated by the fins 22 and the base 21 downstream, promoting heat dissipation. In this way, fans 3 and 4 cool the heat sink 2.

[0016] In this embodiment, the intake port 11, the fan 3 or the fan 4, the heat sink 2, and the exhaust port 12 are arranged in this order from the upstream side to the downstream side of the air flow direction in the duct 1. The air sucked in by the fans 3 and 4 from the intake port 11 flows mainly around the fins 22 of the heat sink 2, takes away the heat of the fins 22, and is discharged from the exhaust port 12.

[0017] The duct 1 efficiently acts the air blown by the fan 3 on the heat dissipation of the heat sink 2 to improve the heat dissipation effect. Specifically, the duct 1 surrounds the heat sink 2 and demarcates the range through which the air sent by the fan 3 that cools the heat sink 2 flows. The gas in the duct 1 is replaced with the gas sucked in from the intake port 11 by the rotation of the fan 3 and is pushed out from the exhaust port 12. Thereby, the gas around the heat sink 2 is quickly replaced.

[0018] In order to fully exert the effect of the cooling device 200 as described above, it is desirable that there is no component (obstacle) that obstructs the exhaust under the windward side of the exhaust port 12. However, depending on the size of the electronic device 100 equipped with the cooling device 200 and the arrangement of the built-in components, etc., an obstacle may be arranged on the downstream side of the exhaust port 12.

[0019] As shown in FIG. 2, the electronic device 100 includes a motherboard 101, a CPU 102, a memory 103, a SSD (Solid State Drive) 104, a riser card 105, an I / O board 106, and a housing 110. The housing storing the above-mentioned respective components (motherboard 101, CPU 102, memory 103, SSD 104, riser card 105, I / O board 106).

[0020] The motherboard 101 is an example of a substrate on which an electronic component (CPU 102 in this embodiment) that is heat-dissipated by the heat sink 2 is mounted. Also, since the memory 103 and the SSD 104 also generate heat according to their operations, they can be heat sources. The heat from these heat sources is also dissipated by the flow of the gas in the housing 110 created by the blowing of the fans 3 and 4.

[0021] The I / O board 106 is connected to the motherboard 101 through a socket (slot) provided on the riser card 105. Since the I / O board 106 is arranged in parallel with the motherboard 101 by being connected to the socket provided on the riser card 105, it is possible to suppress the height dimension of the housing 110.

[0022] However, with the above-described arrangement, when the I / O board 106 is located on the downstream side of the exhaust port 12, the I / O board 106 becomes an obstacle that hinders exhaust. In this embodiment, the exhaust from the duct 1 is configured to avoid the I / O board 106.

[0023] FIG. 3 is a perspective view showing an example of the ventilation holes 161 to 167 provided in the electronic device 100. This perspective view shows the electronic device 100 as viewed from the back side.

[0024] The duct 1 is housed inside the housing 110 of the electronic device 100. The housing 110 is provided with ventilation holes 161, 162, 163 for taking in air sucked into the duct 1 and ventilation holes 164, 165, 167 for exhausting the air that has passed through the duct 1.

[0025] The ventilation holes 161, 162, 163 are provided in the front cover 111 that constitutes the front of the housing 110. The ventilation hole 164 is provided in the rear cover 112 that constitutes the back of the housing 110. The ventilation holes 165, 167 are provided in the I / O panel 113 that constitutes a part of the back of the housing 110. The I / O panel 113 has connection terminals for various peripheral devices for the electronic device 100.

[0026] In the electronic device 100 of this embodiment, the I / O board 106 is arranged behind the CPU 102. For this reason, the exhaust port 12 of the duct 1 is divided into an upper exhaust port 121 that opens upward and a lower exhaust port 122 that opens downward so that the exhaust avoids the I / O board 106 (see FIG. 1). Specifically, the exhaust port 12 is divided into the upper exhaust port 121 and the lower exhaust port 122 by a partition wall 13.

[0027] Figure 4 is a perspective view showing an example of the shape of duct 1. Duct 1 has an opening on the side where fans 3 and 4 are attached and on the side of the exhaust port 12.

[0028] Duct 1 comprises a top plate 10 and side walls 15-18. The top plate 10 constitutes the upper part of duct 1 in the Z-axis direction and faces the tip of the fins 22. Side walls 17 and 18 face both sides of the heatsink 2. Side walls 15 and 16 connect side walls 17 and 18 to the sides of fans 3 and 4 and enclose the space between fans 3 and 4 and the heatsink 2.

[0029] As described above, the duct 1 allows the air blown out by fans 3 and 4 to reach the heatsink 2 without leaking from the duct 1. The side walls 15 and 16 are examples of the first wall portion in this disclosure.

[0030] A branch wall 13 is provided on the downstream side (negative Y-axis side) of duct 1. The branch wall 13 comprises an upper wall portion 131 and a lower wall portion 132. The upper wall portion 131 and the lower wall portion 132 are connected by an edge along the X-axis on the upstream side in the airflow direction. Furthermore, the upper wall portion 131 and the lower wall portion 132 are inclined with respect to the airflow direction such that the distance between them increases as you move downstream in the airflow direction.

[0031] The air that passes between the fins 22 of the heatsink 2 reaches the branching wall 13. The upper wall 131 directs a portion of the air that has passed between the fins 22 of the heatsink 2 diagonally upward and discharges it from the upper exhaust port 121. The lower wall 132 directs the remaining air that has passed between the fins 22 of the heatsink 2 diagonally downward and discharges it from the lower exhaust port 122. In this way, the branching wall 13 directs the exhaust air to avoid a portion of the area downstream of itself, thereby branching the exhaust. Therefore, even if peripheral equipment such as the I / O board 106 (see Figure 3) is located downstream of the branching wall 13, the cooling performance of the heatsink 2 is not hindered.

[0032] Figures 5, 6, and 7 are schematic plan views of the cooling device 200 illustrating the relationship between the orientation of the discharge surfaces 32 and 42 of fans 3 and 4 and the shape of the edges of the fins 22. Note that Figures 5 to 7 show different examples.

[0033] First, let's describe fans 3 and 4, which are common to each example. Fan 3 has multiple blades that rotate around a rotation axis. Fan 3 draws in air from the intake port 11 and discharges it from the first discharge surface 32. The first discharge surface 32 is a circular area. Similarly, fan 4 has multiple blades that rotate around a rotation axis. Fan 4 draws in air from the intake port 11 and discharges it from the second discharge surface 42. The second discharge surface 42 is a circular area.

[0034] Fans 3 and 4 are the same size. The sizes of fans 3 and 4 are set such that the sum of the diameters of the first discharge surface 32 and the second discharge surface 42 is greater than the width of the heatsink 2.

[0035] Furthermore, the first discharge surface 32 from which fan 3 discharges air and the second discharge surface 42 from which fan 4 discharges air are arranged symmetrically on the upstream side of the heatsink 2, with the central fin 221 in the width direction (X-axis direction) of the heatsink 2 in between.

[0036] Furthermore, the casings of fan 3 and fan 4 are adjacent to each other without any gaps. Therefore, the casings of fan 3, fan 4, side walls 15 and 16, and top plate 10 (see Figure 4) surround the space upstream of the heatsink 2. As a result, the air supplied by fans 3 and 4 reaches the heatsink 2 without leaking outside the duct 1.

[0037] The side walls 15 and 16 of duct 1 are arranged so that the distance between them gradually narrows from the air intake 11 to the heat sink 2. As a result, the air supplied by fan 3 is directed towards the center in the width direction along side wall 15, and the air supplied by fan 4 is directed towards the center in the width direction along side wall 16.

[0038] Next, let's describe the example shown in Figure 5. In the heat sink 2 of this example, the edge of the fin 22 facing the first discharge surface 32 or the second discharge surface 42 (the upstream edge in the airflow direction) is located along a mountain-shaped imaginary line that protrudes in the center in the direction of the fin arrangement (X-axis direction). In other words, the edge of the fin 22 facing the first discharge surface 32 or the second discharge surface 42 is located in a mountain shape where the central fin 221 protrudes the most.

[0039] The edge of the central fin 221 is located downstream of the boundary between the first discharge surface 32 and the second discharge surface 42 (the position where the housings of fan 3 and fan 4 meet). The edge of this central fin 221 is closest to fans 3 and 4, and the distance between the edges of the other fins 22 and fans 3 and 4 is wider than the distance between the central fin 221 and fans 3 and 4. The edges of the fins 22 other than the central one are located further from the first discharge surface 32 or the second discharge surface 42 the further they are from the center.

[0040] In this example, fans 3 and 4 are positioned such that the angle between the first discharge surface 32 and the central fin 221 is equal to the angle between the second discharge surface 42 and the central fin 221, and the angle between the first discharge surface 32 and the second discharge surface 42 is 90° or greater. That is, the angle between the central fin 221 and either the first discharge surface 32 or the second discharge surface 42 is 45° or greater.

[0041] Furthermore, if the angle is made even smaller than in this example, that is, if the angle between fan 3 and fan 4 is made smaller than 90°, the angle between the direction of air discharged by fans 3 and 4 and the fins 22 will increase, increasing the resistance to the air changing direction along the fins 22, making the airflow more turbulent. Therefore, it is desirable that the angle between fan 3 and fan 4 be 90° or greater.

[0042] The central fin 221 functions as a wall along the height direction (Z-axis direction) between the position between fan 3 and fan 4 and the center position in the width direction (X-axis direction) of the heatsink 2. The central fin 221 separates the air supplied by fan 3 and the air supplied by fan 4, preventing interference between their flows. With this structure, the air supplied by fan 3 and fan 4 is directed to the heatsink 2 without mixing.

[0043] In this example, the edges of the fins 22 facing the first discharge surface 32 or the second discharge surface 42 each have end faces that are substantially parallel to the thickness direction (X-axis direction). Also, the airflow direction of the fans 3 and 4 in this example is not parallel to the Y-axis, but is inclined with respect to the Y-axis. Therefore, the end faces of the edges of the fins 22 are inclined with respect to the air discharge direction from the first discharge surface 32 or the second discharge surface 42, and are not perpendicular to it. Thus, the air supplied by the fans 3 and 4 is not obstructed by hitting the end faces of the fins 22.

[0044] If the edges of fin 22 were not protruding in a mountain shape, the air supplied by fan 3 and the air supplied by fan 4 would collide and mix in the center in the width direction, causing turbulence in the flow. In this case, the flow velocity may weaken, which is undesirable.

[0045] However, in this example, by making the edges of the fins 22 protrude in a mountain shape, the air supplied by fan 3 and the air supplied by fan 4 are prevented from mixing, and at the same time, there is no orthogonal surface facing the first discharge surface 32 or the second discharge surface 42, thereby improving the stability of the airflow within the duct 1.

[0046] Next, we will explain the example shown in Figure 6. In explaining this example, we will omit the explanation of the parts that are common to the example shown in Figure 5 and explain the parts that are different.

[0047] In this example, the angle between the first discharge surface 32 and the second discharge surface 42 is 180°. That is, the angle between the central fin 221 and either the first discharge surface 32 or the second discharge surface 42 is 90°.

[0048] In the heat sink 201 of this example, the edges of the fins 22 facing the first discharge surface 32 or the second discharge surface 42 each have end faces that are inclined with respect to the thickness direction (X-axis direction). Also, the airflow direction of the fans 3 and 4 in this example is parallel to the Y-axis. Therefore, the end faces of the edges of the fins 22 are inclined with respect to the air discharge direction from the first discharge surface 32 or the second discharge surface 42, and are not perpendicular to it. Thus, the air blown by the fans 3 and 4 is not obstructed by hitting the end faces of the fins 22.

[0049] The above example does not preclude the installation of fans 3 and 4 with an angle between them exceeding 180°. In other words, the angle between fans 3 and 4 can be set to be greater than 180° (for example, up to about 200°).

[0050] Next, we will explain the example shown in Figure 7. In explaining this example, we will omit the explanation of the parts that are common to the example shown in Figure 6 and explain the parts that are different.

[0051] In the heat sink 202 of this example, the edges of the fins 22 facing the first discharge surface 32 or the second discharge surface 42 are positioned along a W-shaped imaginary line that protrudes from the center and both ends in the direction of the fin alignment (X-axis direction). In other words, the edges of the fins 22 facing the first discharge surface 32 or the second discharge surface 42 are positioned to form a W shape with the central and end fins 22 protruding.

[0052] According to the heat sink 202 in this example, the total surface area of ​​the fins 22 can be made larger than that of the heat sink 201 in the example shown in Figure 6. Therefore, the heat sink 202 can have a higher heat dissipation capacity.

[0053] In the examples above, the placement of fans 3 and 4 is symmetrical with respect to the heatsink 2, but the implementation is not limited to these examples, and the placement of fans 3 and 4 does not have to be symmetrical with respect to the heatsink 2.

[0054] Fans 3 and 4 draw air into the intake port 11 to blow onto the heatsink 2, creating an airflow in the area facing the intake port 11. This airflow carries away and removes heat generated by components located near the intake port 11. In other words, the airflow created by fans 3 and 4 promotes heat dissipation not only from heat sources in contact with the base portion 21 of the heatsink 2, but also from components near the intake port 11. Therefore, fans 3 and 4 may be positioned with the intention of promoting heat dissipation from surrounding components.

[0055] As described above, the cooling device 200 of the embodiment comprises a fan (first air blower) 3, a fan (second air blower) 4, a heat sink 2, and a duct 1. Fan 3 creates airflow by rotating and has a first discharge surface 32 for discharging air, and fan 4 creates airflow by rotating and has a second discharge surface 42 for discharging air, and is installed adjacent to fan 3. Duct 1 covers the heat sink 2, fan 3, and fan 4, and has an intake port 11 on the upstream side in the direction of airflow by fans 3 and 4 and an exhaust port 12 on the downstream side. Heat sink 2 has a width smaller than the sum of the diameters of the first discharge surface 32 and the second discharge surface 42, and has a base portion 21 to which heat from electronic components such as CPU 102 is conducted, with a plurality of fins 22 arranged in the thickness direction, and the upstream edge of the fins 22 in the direction of airflow faces either the first discharge surface 32 or the second discharge surface 42. The edge of the central fin 221, located downstream of the boundary between the first discharge surface 32 and the second discharge surface 42, is positioned closer to the first discharge surface 32 and the second discharge surface 42 than the edges of the other fins 22.

[0056] With the above structure, the cooling device 200 can use multiple fans 3 and 4 to blow air onto the heat sink 2, and the central fin 221, which protrudes from the other fins 22, allows the airflow from each fan 3 and 4 to be directed towards the heat sink 2 without interfering with each other. As a result, when cooling the heat sink 2 with two fans 3 and 4, the sum of the diameters of the discharge surfaces 32 and 42 is greater than the width of the heat sink 2, energy loss can be suppressed and cooling can be performed efficiently. Therefore, even if a large-diameter fan cannot be used due to the height of the housing 110 of the electronic device 100, by employing multiple fans 3 and 4 that work together to supply an airflow equivalent to that of a large-diameter fan, it is possible to miniaturize the cooling fan (reduce the height dimension) without reducing the amount of cooling air discharged.

[0057] Although the fans 3 and 4 in each of the embodiments described above are of the same size, in practice, the sizes of the multiple fans 3 and 4 do not necessarily have to be the same, and they may have different outputs (obtainable wind speed and airflow).

[0058] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, modifications, and combinations are possible without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of Symbols]

[0059] 100...Electronic equipment, 101...Motherboard, 102...CPU, 103...Memory 104...SSD, 105...Riser card, 106...I / O board, 110...casing, 111...front cover, 112...rear cover 113...I / O panel, 161~167...Ventilation holes, 200...Cooling device, 1...Duct, 10...Top plate, 11...Air intake, 12... Exhaust port, 121... Upper exhaust port, 122... Lower exhaust port, 13...branch wall, 131...upper wall section, 132...lower wall section, 15-18... Side wall (first wall section), 2,201,202…heatsink, 21...base section, 22...fin, 221...central fin, 3...Fan (first air blower), 32...First discharge surface, 4...Fan (second air blower), 42...Second discharge surface, 81...frame, 82...frame, 84...string spring. [Prior art documents] [Patent Documents]

[0060] [Patent Document 1] Japanese Patent Publication No. 2003-283171

Claims

1. It creates an airflow by blowing air through rotation, and comprises a first blower having a first discharge surface for discharging the air, A device that creates airflow by blowing air through rotation, and has a second discharge surface for discharging the air, and is installed adjacent to the first blower without any gap, A heat sink having a width smaller than the sum of the diameters of the first discharge surface and the second discharge surface, with a base portion through which heat from electronic components is conducted, and having a plurality of fins arranged in the thickness direction, A duct covering the heat sink, the first air blower and the second air blower, having an intake port on the upstream side and an exhaust port on the downstream side in the direction of airflow by the first air blower and the second air blower, Equipped with, The first discharge surface and the second discharge surface are arranged symmetrically on the upstream side of the heat sink, with the central fin in the width direction of the heat sink in between. The upstream edge of the fin in the airflow direction faces the first discharge surface or the second discharge surface. The edge of the central fin located downstream of the boundary between the first discharge surface and the second discharge surface is located closer to the first and second discharge surfaces than the other edges. The edges of the fins facing the first and second discharge surfaces are positioned along a mountain-shaped imaginary line protruding from the center in the direction of alignment of the plurality of fins. A cooling device for electronic equipment, wherein the airflow directions of the first air blower and the second air blower are directed toward the central fin, and the first angle formed by the central fin and the first discharge surface and the second angle formed by the central fin and the second discharge surface are arranged to be 45° or more.

2. The edge of the fin facing the first discharge surface or the second discharge surface has an end face that is inclined with respect to the direction of air discharge from the first discharge surface or the second discharge surface. Cooling device for electronic equipment according to claim 1.

3. The angle between the first discharge surface and the second discharge surface is 90° or more and 200° or less. Cooling device for electronic equipment according to claim 1.

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