Surge suppression device

Abstract

To provide a surge suppression device which can be thinned.SOLUTION: A surge suppression device 1 includes: a plurality of series circuit parts of resistors 2 and capacitors 3; an embedded resin 6 where the plurality of resistors 2 constituting the plurality of series circuit parts is embedded; and an installation member 7 where the plurality of capacitors 3 constituting the plurality of series circuit parts is installed. The plurality of resistors 2 is arranged in parallel, and the embedded resin 6 and the installation member 7 are aligned in a plane direction parallel to both a resistor longitudinal direction X that is a longitudinal direction of the resistors 2 and a resistor parallel direction Y at which the plurality of resistors 2 is aligned.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a surge suppression device.

Background Art

[0002] Patent Document 1 discloses a surge suppression device that is connected to the wiring between an inverter and a motor and suppresses the surge voltage generated due to the switching operation of the inverter. The surge suppression unit described in Patent Document 1 has three series circuit portions of a resistor and a capacitor, and in the three series circuit portions, the ends on the capacitor side are connected to each other.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a surge suppression device, when having a plurality of series circuit portions, there is a risk of causing an increase in size unless specifically devised. In a surge suppression device, for example, in order to enable mounting on a device or the like that is a source of surge voltage, thinning is required, but in Patent Document 1, there is no detailed disclosure regarding the structure of the surge suppression device.

[0005] The present invention has been made in view of the above circumstances, and an object thereof is to provide a surge suppression device that can be thinned.

Means for Solving the Problems

[0006] To achieve the above objective, the present invention provides a surge suppression device comprising: a plurality of series circuit sections in which resistors and capacitors are connected in series; a burying resin for burying the plurality of resistors constituting the plurality of series circuit sections; and an installation member for installing the plurality of capacitors constituting the plurality of series circuit sections, wherein the plurality of resistors are arranged in parallel, and the burying resin and the installation member are aligned in a plane direction parallel to both the longitudinal direction of the resistors, which is the longitudinal direction of the resistors, and the parallel direction of the resistors in which the plurality of resistors are arranged. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a surge suppression device that can be made thinner. [Brief explanation of the drawing]

[0008] [Figure 1] This is a circuit diagram showing the operating state of the surge suppression device in the first embodiment. [Figure 2] This is a plan view of the surge suppression device in the first embodiment. [Figure 3] This is a cross-sectional view taken along the line III-III in Figure 2. [Figure 4] This is a magnified view of the area around the installation component in Figure 2. [Figure 5] This is a magnified view of the area around the installation component in Figure 3. [Figure 6] This is a bottom view of the substrate in the first embodiment. [Figure 7] This is an enlarged cross-sectional view of the area near the installation member of the surge suppression device in the second embodiment. [Modes for carrying out the invention]

[0009] [First Embodiment] A first embodiment of the present invention will be described with reference to Figures 1 to 6. The embodiments described below are presented as preferred specific examples for carrying out the present invention, and while some parts specifically illustrate various technically preferable technical matters, the technical scope of the present invention is not limited to these specific embodiments.

[0010] Figure 1 is a circuit diagram showing the surge suppression device 1 in use. In this embodiment, the surge suppression device 1 is used by connecting it to, for example, the U-phase wiring 9u, V-phase wiring 9v, and W-phase wiring 9w between the motor 91 and the inverter 92. In this case, the surge suppression device 1 suppresses the application of surge voltage to the motor 91.

[0011] The surge suppression device 1 has three series circuit sections 101 to 103, each consisting of a resistor 2 and a capacitor 3 connected in series. In this embodiment, each series circuit section 101 to 103 has one resistor 2 and three capacitors 3 connected in series with the resistor 2. Furthermore, each series circuit section 101 to 103 has three balance resistors 4 connected in parallel with each capacitor 3. The resistor 2 side of each of the three series circuit sections 101 to 103 is connected to the U-phase wiring 9u, V-phase wiring 9v, or W-phase wiring 9w. In addition, the three series circuit sections 101 to 103 are star-connected by connecting the opposite sides of each resistor 2 to each other.

[0012] Figure 2 is a plan view of the surge suppression device 1. Figure 3 is a cross-sectional view taken along the line III-III in Figure 2. In addition to the surge suppression device 1, Figure 3 also shows the object to which the surge suppression device 1 is fixed 100 and bolts B1 and B2.

[0013] The surge suppression device 1 comprises three resistors 2 arranged in parallel, three terminals 5 connected to one side of each of the three resistors 2, a burying resin 6 for burying the three resistors 2, a mounting member 7 for mounting the capacitor 3, and a circuit board 8 on which the capacitor 3 and balance resistor 4 are mounted. The burying resin 6 and the mounting member 7 are aligned in a plane direction parallel to both the longitudinal direction of the resistors 2, which is the longitudinal direction of the resistors 2, and the parallel direction of the resistors 2, which is the direction in which the multiple resistors 2 are arranged, which is the direction in which the and which is the direction in which the resistors 2 are arranged, and which is the direction in which the resistors 2 are arranged, and which is the direction in which the resistors 2 are arranged, and which is the direction in which the resistors 2 are arranged, and which is the direction in which the resistors 2 are arranged, and which is the direction in which the resistors 2 are arranged, and which is the direction in which the resistors 2 are arranged, and which is the direction in which the resistors 2 are arranged, and which is the direction in which the resistors

[0014] As shown in Figure 3, the surge suppression device 1 is used by being fixed to a fixed object 100 located on one side in the height direction Z. In this embodiment, when the surge suppression device 1 is arranged between an inverter (see reference numeral 92 in Figure 1) and a motor (see reference numeral 91 in Figure 1), the fixed object 100 to which the surge suppression device 1 is fixed can be, for example, a motor case. Hereafter, one side in the height direction Z on which the fixed object 100 is arranged relative to the surge suppression device 1 will be referred to as the fixed side Z1, and the opposite side will be referred to as the non-fixed side Z2. Next, the various parts of the surge suppression device 1 will be described.

[0015] As shown in Figures 2 and 3, the resistor 2 comprises a resistive element 21 that is elongated in the longitudinal direction X of the resistor, and two cap electrodes 22 fitted to both ends of the resistive element 21. The resistive element 21 is not particularly limited, but can be, for example, a wire-wound resistor or a ceramic resistor. The cap electrodes 22 are formed from a conductive metal into a bottomed cylindrical shape.

[0016] Lead wires 11a and 11b are connected to the two cap electrodes 22 of the resistor 2, respectively. Of the two lead wires 11a and 11b connected to the resistor 2, one lead wire 11a is electrically connected to the terminal portion 5, and the other lead wire 11b is electrically connected to the substrate 8.

[0017] The terminal portion 5 has a plate-like shape with a thickness in the height direction Z. A bolt insertion hole 51 penetrating the terminal portion 5 in the height direction Z is formed in the terminal portion 5. A bolt (not shown) for electrically connecting the terminal portion 5 to a U-phase wiring (see reference numeral 9u in FIG. 1), a V-phase wiring (see reference numeral 9v in FIG. 1), or a W-phase wiring (see reference numeral 9w in FIG. 1) is inserted through the bolt insertion hole 51.

[0018] The embedded resin 6 has a flat shape in a plane direction parallel to both the resistor longitudinal direction X and the resistor parallel direction Y. The embedded resin 6 is a molded resin formed by molding three resistors 2. In this embodiment, the embedded resin 6 molds three terminal portions 5 in addition to the three resistors 2. In this embodiment, the embedded resin 6 integrally includes a rectangular parallelepiped portion 61 having a thickness in the height direction Z, three terminal holding portions 62 protruding from the rectangular parallelepiped portion 61 toward the three terminal portions 5 in the resistor longitudinal direction X, and two embedded resin fixing portions 63 protruding from both sides of the rectangular parallelepiped portion 61 in the resistor parallel direction Y.

[0019] The rectangular parallelepiped portion 61 embeds three resistors 2. In this embodiment, the resistors 2 are embedded in the embedded resin 6 while exposing both ends in the resistor longitudinal direction X from the embedded resin 6. However, it is not limited to this. For example, a configuration in which the entire resistor 2 is embedded in the embedded resin 6 and at least a part of two lead wires 11a and 11b connected to the resistor 2 protrudes from the embedded resin 6 may be adopted. As shown in FIG. 3, the resistors 2 are arranged eccentrically on the anti-fixing side Z2 of the embedded resin 6. Thereby, the heat transfer distance from the three resistors 2 to the capacitor 3 through the embedded resin 6, the installation member 7, etc. can be lengthened.

[0020] As shown in FIG. 2, the three terminal holding portions 62 are formed on the fixing side Z1 of the three terminal portions 5 and hold the three terminal portions 5. Each terminal holding portion 62 is formed wide so as to protrude on both sides in the resistor parallel direction Y from the terminal it holds. As shown in FIG. 3, the terminal portion 5 is embedded on the anti-fixing side Z2 of each terminal holding portion 62. In this embodiment, the end portion of the terminal portion 5 on the side of the rectangular parallelepiped portion 61 is embedded in the terminal holding portion 62 by the thickness thereof.

[0021] On the end face of the rectangular parallelepiped portion 61 of the terminal holding portion 62 on the side opposite to the terminal portion 5, a recess 621 is formed to increase the creepage distance between the terminal portion 5 and the fixing target 100 and improve the electrical insulation between the terminal portion 5 and the fixing target 100. The recess 621 is formed at a position overlapping the terminal portion 5 when viewed from the height direction Z. In the present embodiment, the recess 621 is formed in a width region substantially the same as the width region where the terminal portion 5 in the resistor parallel direction Y is formed, but is not limited thereto, and may be formed over the entire length of the terminal holding portion 62 in the resistor parallel direction Y. Also, if the creepage distance between the terminal portion 5 and the fixing target 100 can be increased, a protrusion instead of the recess 621 may be provided on the terminal holding portion 62.

[0022] The embedded resin fixing portion 63 is a portion for fixing the embedded resin 6 to the fixing target 100. A bolt insertion hole 631 penetrating in the height direction Z is formed in the embedded resin fixing portion 63. The embedded resin fixing portion 63 is fixed to the fixing target 100 by inserting the bolt B1 into the bolt insertion hole 631 and screwing it into the fixing target 100.

[0023] As shown in FIGS. 2 and 3, the embedded resin fixing portion 63 is formed at the end portion of the embedded resin 6 on the side of the installation member 7 in the resistor longitudinal direction X. And at least a part of the embedded resin fixing portion 63 is arranged at the same position as at least a part of an extended portion 72 (to be described later) of the installation member 7 in the resistor longitudinal direction X (that is, the arrangement direction of the embedded resin 6 and the installation member 7). A rib 632 for reinforcing the embedded resin fixing portion 63 is formed in the embedded resin fixing portion 63. Note that the embedded resin fixing portion 63 may be made of metal or the like to ensure rigidity. In this case, for example, the metal member constituting the embedded resin fixing portion 63 may be molded into the embedded resin 6.

[0024] As shown in Figure 3, the embedded resin mounting surface 64, which is the fixed-side Z1 surface of the embedded resin 6, is the surface that faces the fixed object 100 when the surge suppression device 1 is fixed to the fixed object 100. In this embodiment, the embedded resin mounting surface 64 is formed in a planar shape on the fixed-side Z1 surfaces of the rectangular parallelepiped portion 61, the three terminal holding portions 62, and the two embedded resin fixing portions 63.

[0025] An insertion recess 65 is formed at the end of the embedded resin mounting surface 64 on the side of the installation member 7 in the longitudinal direction X of the resistor, into which the extension portion 72 of the installation resin, described later, is inserted. The insertion recess 65 is a recess that is open to the fixed side Z1 in the height direction Z and to the side of the installation member 7 in the longitudinal direction X of the resistor.

[0026] The embedded resin 6 is made of an electrically insulating base resin containing a filler with a higher thermal conductivity than the base resin. The base resin is made of an electrically insulating resin such as PPS (polyphenylene sulfide) resin or epoxy resin. The filler can be made of, for example, metal powder or ceramic powder, and specifically can be powder such as aluminum oxide, boron nitride, or aluminum nitride. The thermal conductivity of the embedded resin 6 is preferably 3 W / (m·K) or higher. Alternatively, the thermal conductivity of the embedded resin 6 can be 10 W / (m·K) or lower. An installation member 7 is placed on one side of the embedded resin 6 in the longitudinal direction X of the resistor. In this embodiment, the embedded resin 6 and the installation member 7 are aligned in a direction that intersects the thickness direction (i.e., height direction Z) of the embedded resin 6.

[0027] Figure 4 is an enlarged view of the area around the mounting member 7 in Figure 2. Figure 5 is an enlarged view of the area around the mounting member 7 in Figure 3. For convenience, the sealing resin (see reference numeral 13 in Figure 5) described later is omitted from Figure 4.

[0028] The mounting member 7 integrally comprises a mounting portion 71 for mounting a substrate 8 having thickness in the height direction Z, an extension portion 72 extending from the mounting portion 71 toward the embedded resin 6 in the longitudinal direction X of the resistor, and two mounting member fixing portions 73 extending from the mounting portion 71 toward the side opposite to the side toward the longitudinal direction X of the resistor.

[0029] The mounting section 71 is formed in a case shape that is open to the non-fixed side Z2 in the height direction Z. The mounting section 71 has a rectangular bottom section 711 that is elongated in the parallel direction Y of the resistors, and a rectangular cylindrical side section 712 that is erected from the bottom section 711 to the non-fixed side Z2. A crimping section 74 is formed on the side from the bottom section 711 to the side where the side section 712 is erected in the height direction Z. The crimping section 74 fixes the substrate 8 by crimping, such as by heat crimping. However, the method of fixing the substrate 8 to the mounting section 71 is not limited to this.

[0030] The extension portion 72 extends from the fixed side Z1 end of the installation portion 71 toward the embedded resin 6 in the longitudinal direction X of the resistor. The extension portion 72 is formed in a rectangular plate shape that has thickness in the height direction Z and is long in the parallel direction Y of the resistor. The extension side end of the extension portion 72 is inserted into the insertion recess 65 of the embedded resin 6. The extension portion 72 is fixed to the inner surface of the insertion recess 65 by welding or the like. As a result, the installation member 7 is integrated with the embedded resin 6 at the extension portion 72. Alternatively, the embedded resin 6 and the installation member 7 may be integrated by molding the embedded resin 6 in such a way as to mold the installation member 7.

[0031] The extension portion 72 is located on the fixed side Z1 of the exposed conductive portion 12 that is exposed to the outside of the surge suppression device 1 in the conductive path from the resistor 2 to the capacitor 3 in each series circuit portion 101 to 103. In other words, the extension portion 72 is formed to block the space between the exposed conductive portion 12 and the fixed object 100. In this embodiment, the exposed conductive portion 12 consists of the portion of each resistor 2 that is exposed from the embedded resin 6 toward the installation member 7 in the longitudinal direction X of the resistor, and the portion of the lead wire 11b connected to that portion that is exposed from the sealing resin 13 described later.

[0032] The mounting member fixing portion 73 is the part for fixing the mounting member 7 to the object to be fixed 100. The mounting member fixing portion 73 has a bolt insertion hole 731 formed through it in the height direction Z. The mounting member fixing portion 73 is fixed to the object to be fixed 100 when a bolt B2 is inserted through the bolt insertion hole 731 and screwed into the object to be fixed 100.

[0033] As shown in Figure 2, the two mounting member fixing parts 73 are located at the ends of the surge suppression device 1 opposite to the three terminal parts 5. The embedded resin fixing part 63 is formed at approximately the center position between the three terminal parts 5 and the two mounting member fixing parts 73 in the longitudinal direction X of the resistor. By arranging the three terminal parts 5, the two embedded resin fixing parts 63, and the two mounting member fixing parts 73 as described above, the surge suppression device 1 can be fixed in a balanced manner to the object to be fixed 100 and the terminals to which the three terminal parts 5 are connected. As shown in Figures 4 and 5, the mounting member fixing part 73 has ribs 732 formed on it to reinforce it. The mounting member fixing part 73 may be made of metal or the like to ensure rigidity. In this case, for example, the metal member constituting the mounting member fixing part 73 may be molded onto the mounting member 7.

[0034] As shown in Figure 5, the mounting surface 75 of the mounting member 7, which is the fixed side Z1 surface, is the surface that faces the fixed object 100 when the surge suppression device 1 is fixed to the fixed object 100. In this embodiment, the mounting surface 75 is formed in a planar shape on the fixed side Z1 surfaces of the mounting portion 71, the extension portion 72, and the two mounting member fixing portions 73.

[0035] As shown in Figure 3, the mounting surface 75 of the installation member is formed on the same plane as the embedded resin mounting surface 64. This allows the surge suppression device 1 to face the embedded resin mounting surface 64 and the mounting surface 75 toward the flat portion of the object to be fixed 100, improving heat dissipation from the surge suppression device 1 to the object to be fixed 100. Here, the statement that the embedded resin mounting surface 64 and the mounting surface 75 are formed on the "same plane" means that they are designed to be positioned on the same plane, and it is acceptable if the positions of the embedded resin mounting surface 64 and the mounting surface 75 are slightly misaligned due to, for example, dimensional tolerances or assembly tolerances of each component. In this embodiment, the embedded resin mounting surface 64 and the mounting surface 75 are adjacent and formed flush.

[0036] The mounting member 7 is made of an electrically insulating material, and in this embodiment, it is made of an electrically insulating base resin containing a filler with a higher thermal conductivity than the base resin. The mounting member 7 can be made of the same resin as the embedded resin 6, but a different material may be used. The substrate 8 is housed inside the mounting member 7.

[0037] As shown in Figures 4 and 5, the substrate 8 is, for example, a printed circuit board (PCB). When it is necessary to mount a large number of capacitors 3 and a large number of balance resistors 4, as in the surge suppression device 1 of this embodiment, using the substrate 8 is highly feasible. The substrate 8 has a base material 81, front surface patterns 821, 822, heat dissipation vias 83, a heat dissipation back surface pattern 84, and a connection back surface pattern 85. The base material 81 is formed in a plate shape from an electrically insulating material.

[0038] The front surface patterns 821 and 822 are formed on the non-fixed side Z2 of the base material 81. Multiple (nine in this embodiment) capacitors 3 and multiple (nine in this embodiment) balance resistors 4 are mounted on the front surface patterns 821 and 822. In this embodiment, the capacitors 3 are chip capacitors, and the balance resistors 4 are chip resistors. For convenience, the three series circuit sections 101 to 103 will be referred to as the first series circuit section 101, the second series circuit section 102, and the third series circuit section 103, respectively, from one side in the parallel direction Y of the resistors.

[0039] As shown in Figure 4, the front surface patterns 821 and 822 include a first front surface pattern 821 that constitutes the first series circuit section 101 and a second front surface pattern 822 that constitutes the second series circuit section 102 and the third series circuit section 103.

[0040] The first front pattern 821 has a land 821a to which lead wires 11b extending from the resistor 2 of the first series circuit section 101 are connected. The first front pattern 821 also has three capacitors 3 and three balance resistors 4 of the first series circuit section 101 mounted on it. The three capacitors 3 of the first series circuit section 101 are arranged in the parallel direction Y of the resistors, and the three balance resistors 4 of the first series circuit section 101 are arranged in the parallel direction Y of the resistors on the resistor 2 side of the three capacitors 3 in the longitudinal direction X of the resistors.

[0041] The second front pattern 822 has two lands 822a to which two lead wires 11b extending from the resistors 2 of the second series circuit section 102 and the third series circuit section 103 are connected. Three capacitors 3 and three balance resistors 4 constituting the second series circuit section 102 and three capacitors 3 and three balance resistors 4 constituting the third series circuit section 103 are mounted on the conductive path between the two lands 822a in the second front pattern 822. The six capacitors 3 constituting the second series circuit section 102 and the third series circuit section 103 are arranged in the resistor parallel direction Y, and the six balance resistors 4 constituting the second series circuit section 102 and the third series circuit section 103 are arranged in the resistor parallel direction Y on the resistor 2 side of the six capacitors 3 in the resistor longitudinal direction X. By positioning capacitor 3 on the opposite side of resistor 2 from balance resistor 4, it becomes easier to secure a sufficient heat transfer distance between capacitor 3, which has relatively low heat resistance, and resistor 2.

[0042] The heat dissipation vias 83 are formed in the heat transfer path from the resistor 2 to the capacitor 3 in each series circuit section 101 to 103. In this embodiment, three heat dissipation vias 83 are provided, each located on the inner circumference side of one land 821a of the first front pattern and on the inner circumference side of two lands 822a of the second front pattern. In each series circuit section 101 to 103, the heat dissipation vias 83 play a role in diverting heat to the back side of the substrate 8 along the heat transfer path from the resistor 2 through the lead wire 11b and the first front pattern 821 or the second front pattern 822 to the capacitor 3.

[0043] Figure 6 is a bottom view of the substrate 8. In this embodiment, three heat dissipation back patterns 84 are provided. The three heat dissipation back patterns 84 are formed to be spaced apart from each other and are connected to different heat dissipation vias 83. Each heat dissipation back pattern 84 is formed to have a large surface area to improve heat dissipation while maintaining a predetermined distance from other energized parts so as not to be electrically connected to those parts.

[0044] The connecting back surface pattern 85 electrically connects the first front surface pattern 821 and the second front surface pattern 822. The connecting back surface pattern 85 electrically connects the end of the first front surface pattern 821 furthest from the land 821a to the portion of the second front surface pattern 822 between the second series circuit section 102 and the third series circuit section 103 via a plurality of connecting vias 86.

[0045] As shown in Figure 5, the components within the mounting section 71 are sealed with sealing resin 13. For example, the sealing resin 13 is made of a potting resin that has thermal conductivity. The sealing resin 13 is also filled between the substrate 8 and the bottom 711 of the mounting section 71, promoting heat transfer from the substrate 8 to the bottom 711 of the mounting section 71.

[0046] (Operation and effects of the first embodiment) In this embodiment of the surge suppression device 1, the embedded resin 6 and the mounting member 7 are aligned in a plane direction parallel to both the longitudinal direction X of the resistors and the parallel direction Y of the resistors (in this embodiment, the longitudinal direction X of the resistors). Therefore, the surge suppression device 1 can be made thinner in the height direction Z. Furthermore, the three resistors 2 that constitute the three series circuit sections 101 to 103 are embedded in the embedded resin 6, and the nine capacitors 3 that constitute the three series circuit sections 101 to 103 are installed on the mounting member 7. Therefore, the heat from the resistors 2 can be dissipated through the embedded resin 6, and by installing the capacitors 3 on the mounting member 7, which is a separate component from the embedded resin 6, the transfer of heat from the resistors 2 to the capacitors 3 can be suppressed. This improves the heat dissipation of the surge suppression device 1 and suppresses the overheating of the capacitors 3, which have relatively low heat resistance.

[0047] Furthermore, the embedded resin mounting surface 64 of the embedded resin 6 and the mounting surface 75 of the mounting member 7 are formed on the same plane. Therefore, the embedded resin mounting surface 64 and the mounting surface 75 can be easily positioned opposite the flat portion of the object to be fixed 100, improving heat dissipation from the embedded resin 6 and the mounting member 7 to the object to be fixed 100.

[0048] Furthermore, the installation member 7 has an installation section 71 for installing the capacitor 3 and an extension section 72 that extends from the installation section 71 toward the buried resin 6. The installation member 7 is integrated with the buried resin 6 at the extension section 72. Therefore, when external vibrations are applied to the surge suppression device 1, it is possible to suppress the independent vibration of the buried resin 6 and the installation member 7. As a result, in this embodiment, for example, stress on the exposed conductive part 12 is suppressed.

[0049] Furthermore, the extension portion 72 is located on the fixed side Z1 of the exposed conductive portion 12. That is, when the surge suppression device 1 is fixed to the object to be fixed 100, the extension portion 72 is formed to be interposed between the exposed conductive portion 12 and the object to be fixed 100. Therefore, electrical insulation between the exposed conductive portion 12 and the object to be fixed 100 can be ensured.

[0050] Furthermore, at least a portion of the extension portion 72 and at least a portion of the embedded resin fixing portion 63 are positioned at the same location in the direction of alignment between the embedded resin 6 and the installation member 7 (in this embodiment, the longitudinal direction X of the resistor). As a result, when the surge suppression device 1 is fixed to the fixing target 100 by the embedded resin fixing portion 63, the embedded resin 6 is pressed against the extension portion 72 and the extension portion 72 is pressed against the fixing target 100. Therefore, the heat transfer between the embedded resin 6 and the extension portion 72 can be improved, and the heat transfer between the extension portion 72 and the fixing target 100 can be improved. As a result, the heat transfer from the surge suppression device 1 to the fixing target 100 is improved. In addition, a step may occur at the connection portion between the extension portion 72 and the embedded resin 6, and as a result, when the surge suppression device 1 is fixed to the fixing target 100, the connection portion between the extension portion 72 and the embedded resin 6 tends to lift away from the fixing target 100. Therefore, in this embodiment, by positioning the embedded resin fixing part 63 at the aforementioned position, the fixing force of the embedded resin fixing part 63 is more easily applied to the connection between the extended part 72 and the embedded resin 6, thereby suppressing the lifting of the connection part away from the object to be fixed 100.

[0051] Furthermore, the embedded resin 6 is provided with an embedded resin fixing portion 63 for fixing to the object to be fixed 100, and the installation member 7 is provided with an installation member fixing portion 73 for fixing to the object to be fixed 100. Therefore, the embedded resin 6 and the installation member 7 can be fixed to the object to be fixed 100 independently. This makes it possible to suppress the independent vibration of the embedded resin 6 and the installation member 7, and prevent stress from being generated in, for example, the exposed conductive part 12. Moreover, when the surge suppression device 1 is fixed to the object to be fixed 100, both the heat dissipation from the embedded resin 6 to the object to be fixed 100 and the heat dissipation from the installation member 7 to the object to be fixed 100 can be improved.

[0052] Furthermore, the multiple capacitors 3 are mounted on a substrate 8 that has thickness in a direction intersecting both the longitudinal direction X of the resistors and the parallel direction Y of the resistors (in this embodiment, the height direction Z), and the substrate 8 is installed on the mounting member 7. This makes it possible to make the surge suppression device 1 thinner even when using the substrate 8.

[0053] Furthermore, the substrate 8 has front patterns 821 and 822 on which multiple capacitors 3 are mounted, heat dissipation vias 83 connected to the conductive path between the resistors 2 and the capacitors 3 in the front patterns 821 and 822, and a heat dissipation back pattern 84 formed on the side of the substrate 8 opposite to the side where the front patterns 821 and 822 are formed and connected to the heat dissipation vias 83. Therefore, the heat transferred from the resistors 2 to the front patterns 821 and 822 is released to the heat dissipation back pattern 84 through the heat dissipation vias 83 before reaching the capacitors 3, and is then dissipated from the heat dissipation back pattern 84. Therefore, the heat transferred from the resistors 2 to the capacitors 3 can be reduced, and the temperature of the capacitors 3 can be suppressed.

[0054] Furthermore, the embedded resin 6 contains a base resin and a filler with a higher thermal conductivity than the base resin. Therefore, the thermal conductivity of the embedded resin 6 can be increased. As a result, when the surge suppression device 1 is fixed to the object 100, the heat from the resistor 2 is efficiently dissipated to the object 100 via the embedded resin 6.

[0055] Furthermore, the mounting member 7 is made of resin and contains a base resin and a filler with a higher thermal conductivity than the base resin. Therefore, the thermal conductivity of the mounting member 7 can be increased. As a result, when the surge suppression device 1 is fixed to the object to be fixed 100, the heat from the component installed on the mounting member 7 (in this embodiment, the substrate 8 including the capacitor 3) is efficiently dissipated to the object to be fixed 100 via the mounting member 7.

[0056] As described above, this embodiment makes it possible to provide a surge suppression device that can be made thinner.

[0057] [Second Embodiment] Figure 7 is an enlarged cross-sectional view of the area around the installation member 7 of the surge suppression device 1 in this embodiment. Figure 7 is also a diagram corresponding to Figure 5 in the first embodiment.

[0058] This embodiment is an example in which the sealing resin (see reference numeral 13 in Figures 2, 3, and 5) of the installation member 7 is eliminated from the first embodiment, and a thermal conductive sheet 14 is added. The thermal conductive sheet 14 is formed in a plate shape from a material that has thermal conductivity and is easily deformable (for example, silicone). When installing the thermal conductive sheet 14 and the substrate 8 on the installation member 7, the thermal conductive sheet 14 and the substrate 8 are placed on the bottom 711 of the installation part 71 in that order, and the substrate 8 is pressed toward the fixing side Z1 to deform the thermal conductive sheet 14 and make it adhere to the substrate 8 and the bottom 711, and the thermal conductive sheet 14 and the substrate 8 are crimped together with the crimping part 74. In this embodiment, since there is no sealing resin (see reference numeral 13 in Figures 2, 3, and 5), the side portion 712 of the installation part 71 may be omitted, but it is preferable to form the side portion 712 to prevent interference between the substrate 8 and other members.

[0059] The other configurations of this embodiment are the same as those of the first embodiment. In addition, among the reference numerals used in the second embodiment and subsequent embodiments, those that are the same as those used in the previously described embodiments represent the same components, etc., as those in the previously described embodiments, unless otherwise specified.

[0060] (Operation and effects of the second embodiment) This embodiment also has the same functions and effects as the first embodiment.

[0061] (Summary of the embodiments) Next, the technical concept understood from the embodiments described above will be described using the reference numerals and other symbols from the embodiments. However, the reference numerals and other symbols in the following description are not limited to the components in the claims that are specifically shown in the embodiments.

[0062] [1] A surge suppression device (1) comprising: a plurality of series circuit sections (101-103) in which resistors (2) and capacitors (3) are connected in series; an embedding resin (6) for embedding the plurality of resistors (2) constituting the plurality of series circuit sections (101-103); and an installation member (7) for installing the plurality of capacitors (3) constituting the plurality of series circuit sections (101-103), wherein the plurality of resistors (2) are arranged in parallel, and the embedding resin (6) and the installation member (7) are aligned in a plane direction parallel to both the longitudinal direction of the resistors (2), which is the longitudinal direction of the resistors (2), and the parallel direction of the resistors (Y) in which the plurality of resistors (2) are lined up.

[0063] [2] The surge suppression device (1) according to [1], wherein the embedded resin mounting surface (64) of the embedded resin (6) that is located on the side of the object to be fixed (100) of the surge suppression device (1) and the mounting surface (75) of the installation member (7) that is located on the side of the object to be fixed (100) are formed on the same plane.

[0064] [3] The surge suppression device (1) according to [1] or [2], wherein the installation member (7) has an installation portion (71) for installing the capacitor (3) and an extension portion (72) extending from the installation portion (71) toward the buried resin (6), and the installation member (7) is integrated with the buried resin (6) at the extension portion (72).

[0065] [4] The surge suppression device (1) according to [3], wherein the portion of the conductive path from the resistor (2) to the capacitor (3) in each of the series circuit sections (101 to 103) that is exposed to the outside is defined as the exposed conductive section (12), and the side of the surge suppression device (1) that is fixed to the target (100) of the surge suppression device (1) is defined as the fixed side (Z1), and the extension (72) is located on the fixed side (Z1) of the exposed conductive section (12).

[0066] [5] The embedded resin (6) is provided with an embedded resin fixing portion (63) for fixing the surge suppression device (1) to the object to be fixed (100), and at least a part of the extended portion (72) and at least a part of the embedded resin fixing portion (63) are arranged at the same position in the direction (X) of alignment between the embedded resin (6) and the installation member (7), as described in [3] or [4].

[0067] [6] The embedded resin (6) is provided with an embedded resin fixing portion (63) for fixing the surge suppression device (1) to the object to be fixed (100), and the installation member (7) is provided with an installation member fixing portion (73) for fixing the object to be fixed (100), the surge suppression device (1) according to any one of [1] to [5].

[0068] [7] The surge suppression device (1) according to any one of [1] to [6], wherein the plurality of capacitors (3) are mounted on a substrate (8) having thickness in a direction (Z) that intersects both the longitudinal direction (X) of the resistor and the parallel direction (Y) of the resistor, and the substrate (8) is installed on the installation member (7).

[0069] [8] The surge suppression device (1) according to [7], wherein the substrate (8) has a front surface pattern (821, 822) on which the plurality of capacitors (3) are mounted, a heat dissipation via (83) connected to the conductive path between the resistor (2) and the capacitor (3) in the front surface pattern (821, 822), and a heat dissipation back surface pattern (84) formed on the side of the substrate (8) opposite to the side on which the front surface pattern (821, 822) is formed and connected to the heat dissipation via (83).

[0070] [9] The surge suppression device (1) according to any one of [1] to [8], wherein the embedded resin (6) contains a base resin and a filler with a higher thermal conductivity than the base resin.

[0071]

[10] The surge suppression device (1) according to any one of [1] to [9], wherein the installation member (7) is made of resin and contains a base resin and a filler having a higher thermal conductivity than the base resin.

[0072] (Note) Although embodiments of the present invention have been described above, the embodiments described herein do not limit the invention as defined in the claims. Furthermore, it should be noted that not all combinations of features described in the embodiments are necessarily essential for solving the problem of the invention. Moreover, the present invention can be implemented with appropriate modifications without departing from its spirit.

[0073] For example, in each of the above embodiments, a heat-conducting sheet that is easily deformable may be interposed between the embedded resin mounting surface and the mounting member mounting surface to reduce the gap between the embedded resin mounting surface and the mounting member mounting surface and the object to be fixed, thereby improving heat dissipation from the surge suppression device to the object to be fixed.

[0074] Furthermore, in each of the above embodiments, the direction in which the embedded resin and the installation member are aligned may coincide with the parallel direction of the resistors.

[0075] Furthermore, in each of the above embodiments, the embedded resin mounting surface and the mounting member mounting surface may be offset from each other, as long as they are aligned in a plane parallel to both the resistor parallel direction and the resistor parallel direction. For example, when it is necessary to attach a surge suppression device to a stepped portion of the object to be fixed, the offset between the embedded resin mounting surface and the mounting member mounting surface makes it easier to fix the surge suppression device to the object to be fixed.

[0076] Furthermore, in each of the above embodiments, configurations in which the resistor is changed to a non-long shape such as a circle or a sphere can also be considered as reference forms. [Explanation of Symbols]

[0077] 1... Surge suppression device 12... Exposed conductive part 100...Fixed object 101~103...Series circuit section 2…Resistor 3…Capacitor 6...Buried resin 63...Buried resin fixing part 64…Residual resin mounting surface 7…Installation component 71...Installation part 72...Extension part 73...Fixing part of the mounting member 75...Mounting surface of the mounting member 8... Circuit board 821... Front side pattern 822...Front surface pattern 83...Heat dissipation via 84...Heat dissipation back pattern X...Longitudinal direction of the resistor Y: parallel direction of resistors Z: height direction Z1…Fixed side

Claims

1. Multiple series circuit sections, each consisting of a resistor and a capacitor connected in series, A resin for embedding the plurality of resistors that constitute the plurality of series circuit sections, The system includes an installation member for installing the plurality of capacitors that constitute the plurality of series circuits, The aforementioned plurality of resistors are arranged in parallel. A surge suppression device in which the embedded resin and the installation member are arranged in a plane direction parallel to both the longitudinal direction of the resistor, which is the longitudinal direction of the resistor, and the parallel direction of the resistors in which the plurality of resistors are arranged, The installation member has an installation portion for installing the capacitor and an extension portion that extends from the installation portion toward the buried resin side. The aforementioned installation member is integrated with the embedded resin in the extended portion. In each of the series circuit sections, the portion of the conductive path from the resistor to the capacitor that is exposed to the outside is defined as the exposed conductive portion, and the side of the surge suppression device that is fixed to the surge suppression device is defined as the fixed side. The extended portion is located on the fixed side of the exposed conductive portion. Surge suppression device.

2. Multiple series circuit sections, each consisting of a resistor and a capacitor connected in series, A resin for embedding the plurality of resistors that constitute the plurality of series circuit sections, The system includes an installation member for installing the plurality of capacitors that constitute the plurality of series circuits, The aforementioned plurality of resistors are arranged in parallel. A surge suppression device in which the embedded resin and the installation member are arranged in a plane direction parallel to both the longitudinal direction of the resistor, which is the longitudinal direction of the resistor, and the parallel direction of the resistors in which the plurality of resistors are arranged, The installation member has an installation portion for installing the capacitor and an extension portion that extends from the installation portion toward the buried resin side. The aforementioned installation member is integrated with the embedded resin in the extended portion. The embedded resin is provided with an embedded resin fixing portion for fixing the surge suppression device to the object to be fixed. At least a portion of the extended portion and at least a portion of the embedded resin fixing portion are arranged at the same position in the direction of alignment between the embedded resin and the installation member. Surge suppression device.

3. Multiple series circuit sections, each consisting of a resistor and a capacitor connected in series, A resin for embedding the plurality of resistors that constitute the plurality of series circuit sections, The system includes an installation member for installing the plurality of capacitors that constitute the plurality of series circuits, The aforementioned plurality of resistors are arranged in parallel. A surge suppression device in which the embedded resin and the installation member are arranged in a plane direction parallel to both the longitudinal direction of the resistor, which is the longitudinal direction of the resistor, and the parallel direction of the resistors in which the plurality of resistors are arranged, The embedded resin is provided with an embedded resin fixing portion for fixing the surge suppression device to the object to be fixed. The aforementioned mounting member is provided with a mounting member fixing portion for fixing to the object to be fixed. Surge suppression device.

4. Multiple series circuit sections, each consisting of a resistor and a capacitor connected in series, A resin for embedding the plurality of resistors that constitute the plurality of series circuit sections, The system includes an installation member for installing the plurality of capacitors that constitute the plurality of series circuits, The aforementioned plurality of resistors are arranged in parallel. A surge suppression device in which the embedded resin and the installation member are arranged in a plane direction parallel to both the longitudinal direction of the resistor, which is the longitudinal direction of the resistor, and the parallel direction of the resistors in which the plurality of resistors are arranged, The plurality of capacitors are mounted on a substrate having thickness in a direction intersecting both the longitudinal direction of the resistor and the parallel direction of the resistor. The substrate is installed on the mounting member. Surge suppression device.

5. The embedded resin mounting surface, which is located on the side of the embedded resin where the surge suppression device is to be fixed, The mounting surface of the mounting member, which is located on the side of the mounting member to be fixed, is formed on the same plane as the mounting member. A surge suppression device according to any one of claims 1 to 4.

6. The substrate has a front surface pattern on which the plurality of capacitors are mounted, heat dissipation vias connected to the conductive path between the resistor and the capacitor in the front surface pattern, and a heat dissipation back surface pattern formed on the side of the substrate opposite to the side on which the front surface pattern is formed and connected to the heat dissipation vias. The surge suppression device according to claim 4.

7. The embedded resin contains a base resin and a filler with a higher thermal conductivity than the base resin. A surge suppression device according to any one of claims 1 to 4.

8. The aforementioned mounting member is made of resin and contains a base resin and a filler with a higher thermal conductivity than the base resin. A surge suppression device according to any one of claims 1 to 4.

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