Substrate processing equipment

Abstract

To provide a substrate processing device capable of making through-put good.SOLUTION: A substrate processing device 1 is equipped with a transfer block 5, a processing block 7, and a buffer portion 33. The transfer block 5 is equipped with a collectively conveying mechanism HTR storing a substrate W in a carrier C, and a first posture converting mechanism 15 converting the substrate W into a vertical posture. The processing block 7 is equipped with a batch processing region R1, a sheet processing region R3, a sheet substrate conveying region R2, and a batch substrate conveying region R4. In the batch processing region R1, batch processing tanks BT1 to BT6, and a second posture converting mechanism 31 to converting the substrate W into a horizontal posture are provided. In the sheet processing region R3, for example, a sheet processing chamber SW1 is provided. In the sheet substrate conveying region R2, a center robot CR is provided. In the batch substrate conveying region R4, a first conveying mechanism WTR1 is provided. The collectively conveying mechanism HTR conveys the substrate W to the first posture converting mechanism 15 and conveys the substrate W from the buffer portion 33.SELECTED DRAWING: Figure 1

Description

Technical Field

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[0003]

[0001] The present invention relates to a substrate processing apparatus for processing a substrate. Examples of the substrate include a semiconductor substrate, a substrate for an FPD (Flat Panel Display), a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a ceramic substrate, and a substrate for a solar cell. Examples of the FPD include a liquid crystal display device and an organic EL (electroluminescence) display device.

Background Art

[0002] As a conventional substrate processing apparatus, there is a hybrid type substrate processing apparatus including a batch type processing module (batch processing unit) for processing a plurality of substrates collectively and a single wafer type processing module (single wafer processing unit) for processing the substrates processed by the batch type processing module one by one (see, for example, Patent Documents 1 and 2).

[0003] The substrate processing apparatus of Patent Document 1 includes a load port used for receiving a cassette, a first robot, two rotation mechanisms for rotating a wafer between a vertical posture and a horizontal posture, two tanks arranged in a row between the two rotation mechanisms, a second robot capable of transporting a wafer in a vertical posture between the two rotation mechanisms and the two tanks, a plurality of single wafer type cleaning modules for performing cleaning and drying, and a third robot.

[0004] The plurality of single wafer type cleaning modules are arranged in a row. The first robot takes out five wafers at a time from the cassette and transports these five wafers to the first rotation mechanism. The third robot takes out a wafer from the second rotation mechanism and transports the wafer to the single wafer type cleaning module. The first robot takes out one wafer from one of the plurality of single wafer type cleaning modules and returns the wafer to the cassette.

[0005] ​The substrate processing apparatus described in Patent Document 2 comprises an loading / unloading section having a cassette mounting table, a single-wafer processing section (area), an interface section, and a batch processing section (area). The substrate processing apparatus described in Patent Document 3 includes a posture change mechanism. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Special Publication No. 2016-502275 [Patent Document 2] Japanese Patent Publication No. 2021-064652 [Patent Document 3] Japanese Patent Publication No. 2018-056341 [Overview of the project] [Problems that the invention aims to solve]

[0007] Conventional substrate processing devices have the following problems. For example, in the substrate processing device described in Patent Document 1, the first robot moves along multiple single-wafer cleaning modules, picks up five wafers at a time from a cassette, and transports these five wafers to the first rotating mechanism. The first robot also moves along multiple single-wafer cleaning modules, picks up one wafer from one of the modules, and returns that wafer to the cassette. As a result, the first robot is busy, which may reduce the throughput of the substrate processing device.

[0008] Furthermore, in the substrate processing apparatus described in Patent Document 2, the loading / unloading unit, the single-wafer processing unit, the interface unit, and the batch processing unit are arranged in this order. Therefore, in order to transport substrates from the loading / unloading unit to the batch processing unit, they must pass through the single-wafer processing unit. This may reduce the throughput of the substrate processing apparatus.

[0009] This invention has been made in view of these circumstances, and aims to provide a substrate processing apparatus that can improve throughput. [Means for solving the problem]

[0010] To achieve this objective, the present invention has the following configuration. That is, the substrate processing apparatus according to the present invention is a substrate processing apparatus that continuously performs batch processing for processing multiple substrates at once and single-wafer processing for processing substrates one by one, comprising a stocker block, a transfer block adjacent to the stocker block, a processing block adjacent to the transfer block, and a substrate mounting section for placing multiple substrates in a horizontal position with predetermined intervals between them in the vertical direction, wherein the stocker block houses at least one carrier for storing multiple substrates in a horizontal position with predetermined intervals between them in the vertical direction, and the carrier The transfer block comprises at least one carrier rack for board removal and storage on which the carrier is placed for loading and unloading boards, the transfer block comprises a board handling mechanism for removing and storing multiple boards at once from a carrier placed on the carrier rack, and a first attitude changing mechanism for changing the attitude of multiple boards at once from a horizontal attitude to a vertical attitude, the processing block comprises a batch processing area extending away from the transfer block, and one end of which is located close to the transfer block and the other end of which is located away from the transfer block The system comprises a single-wafer processing area extending in a direction toward the transfer block, a single-wafer substrate transport area interposed between the batch processing area and the single-wafer processing area, with one end adjacent to the transfer block and the other end extending toward the transfer block, and a batch substrate transport area provided along the batch processing area, with one end extending toward the transfer block and the other end extending toward the transfer block, wherein the batch processing area has multiple batch processing tanks arranged in the direction of the area's extension for immersing multiple substrates at once, and furthermore, multiple substrates are immersed together in a vertical position A second attitude change mechanism is provided to change the attitude from an upright to a horizontal position, a single-wafer processing chamber is provided in the single-wafer processing area for processing substrates one by one in the direction in which the area extends, a single-wafer substrate transport mechanism is provided in the single-wafer substrate transport area for transporting substrates between the second attitude change mechanism, the single-wafer processing chamber and the substrate placement section, a batch substrate transport mechanism is provided in the batch substrate transport area for transporting multiple substrates at once between the substrate transfer position determined in the transfer block, the multiple batch processing tanks and the second attitude change mechanism, and further,The substrate handling mechanism of the transfer block is characterized by transporting multiple substrates simultaneously to the first attitude changing mechanism and transporting multiple substrates simultaneously from the substrate mounting section.

[0011] According to the substrate processing apparatus of the present invention, the batch processing area, the single-wafer processing area, and the single-wafer substrate transport area are formed to extend from the transfer block side. Multiple batch processing tanks are arranged in the direction in which the batch processing area extends. Multiple single-wafer processing chambers are also arranged in the direction in which the single-wafer processing area extends. A single-wafer substrate transport mechanism is provided in the single-wafer substrate transport area sandwiched between the multiple batch processing tanks and the multiple single-wafer processing chambers. The batch substrate transport mechanism is provided in the batch substrate transport area along the multiple batch processing tanks. Therefore, the substrate processing apparatus of the present invention can transport substrates smoothly.

[0012] Let me explain in detail. The substrate handling mechanism of the transfer block can take out multiple substrates from the carrier all at once and transport those multiple substrates all at once to the first posture change mechanism. The batch substrate transport mechanism transports multiple substrates between the substrate transfer position, the batch processing tank, and the second posture change mechanism. The single-wafer substrate transport mechanism transports substrates between the second posture change mechanism, the single-wafer processing chamber, and the substrate placement section. The substrate handling mechanism also receives multiple substrates all at once from the substrate placement section and stores those multiple substrates all at once in the carrier.

[0013] Therefore, multiple substrates can be transported directly from the transfer block to the batch processing area without being transported to the single-wafer processing area before being transported to the batch processing area. Furthermore, the substrate handling mechanism transports multiple substrates simultaneously between the carrier, the first attitude change mechanism, and the substrate placement section without accessing each single-wafer processing chamber. This allows for rapid transport of multiple substrates from the carrier to the first attitude change mechanism, and also rapid transport of multiple substrates from the substrate placement section to the carrier. Consequently, the substrate processing apparatus of the present invention can transport substrates smoothly, thereby improving throughput.

[0014] Furthermore, in the substrate processing apparatus described above, it is preferable that the second attitude changing mechanism is provided on the opposite side of the transfer block, with the plurality of batch processing tanks in between.

[0015] Multiple substrates can be transported from the transfer block to the second attitude change mechanism while batch processing is performed in the batch processing tank, and then multiple substrates can be transported from the second attitude change mechanism to the transfer block while single-wafer processing is performed in the single-wafer processing chamber. As a result, multiple substrates W can be transported in a circular motion within the processing block, thereby enabling smooth transport of the substrates.

[0016] Furthermore, in the substrate processing apparatus described above, it is preferable that the second orientation changing mechanism is provided between two of the batch processing tanks among the plurality of batch processing tanks.

[0017] Since the second orientation change mechanism is installed between the two batch processing tanks, the distance from the second orientation change mechanism to each single-wafer processing chamber can be made relatively uniform. As a result, the single-wafer substrate transport mechanism can transport the substrates starting from near the center of the single-wafer substrate transport area. Therefore, the travel distance of the single-wafer substrate transport mechanism can be reduced, and the substrate transport efficiency can be improved.

[0018] Furthermore, in the substrate processing apparatus described above, it is preferable that the second attitude changing mechanism is provided between the transfer block and the plurality of batch processing tanks. This allows the second attitude changing mechanism to be positioned close to the transfer block. As a result, the substrate can be transported with the transfer block as the starting point.

[0019] Furthermore, in the substrate processing apparatus described above, it is preferable that the substrate mounting section is fixedly provided at either the boundary between the transfer block and the single-wafer substrate transport area, the transfer block, or the single-wafer substrate transport area. Since the substrate mounting section is fixed and does not move, the configuration of the substrate mounting section and its surroundings can be simplified.

[0020] Further, the above-described substrate processing apparatus further includes a mounting portion moving mechanism, the substrate mounting portion is provided to be movable in the single-sheet substrate transfer region, and the mounting portion moving mechanism preferably moves the substrate mounting portion in the direction in which the single-sheet substrate transfer region extends. Since the mounting portion is moved by the mounting portion moving mechanism, the single-sheet substrate transfer mechanism does not have to move close to the substrate handling mechanism, so that the transfer efficiency of the substrate can be improved.

[0021] Also, in the above-described substrate processing apparatus, it is preferable that the mounting portion moving mechanism moves the substrate mounting portion in the direction in which the single-sheet substrate transfer region extends so as to follow the single-sheet substrate transfer mechanism. Since the substrate mounting portion is moved following the single-sheet substrate transfer mechanism, the single-sheet substrate transfer mechanism can quickly transfer the substrate to the substrate mounting portion.

[0022] Also, in the above-described substrate processing apparatus, the single-sheet substrate transfer mechanism includes a mechanism main body and an upper rail provided above the single-sheet substrate transfer region and along the single-sheet substrate transfer region, and the mechanism main body is preferably suspended from the upper rail and configured to move along the upper rail. This prevents droplets falling from the wet substrate from contaminating the mechanism main body (for example, the advancing / retreating portion and the elevating / rotating portion). For example, if the mechanism main body is contaminated by droplets, the single-sheet substrate transfer mechanism may malfunction, but this can be prevented.

[0023] Also, in the above-described substrate processing apparatus, the second posture conversion mechanism preferably includes a substrate holding portion that holds a plurality of substrates in a vertical posture conveyed by the batch substrate transfer mechanism, a substrate extraction mechanism that can extract two or more substrates from the plurality of substrates held by the substrate holding portion, and a posture conversion portion that collectively converts the postures of the two or more substrates extracted by the substrate extraction mechanism from the vertical posture to the horizontal posture. Thereby, with respect to two or more substrates extracted by the substrate extraction mechanism, the posture conversion portion can perform posture conversion.

Advantages of the Invention

[0024] According to the substrate processing apparatus of the present invention, throughput can be improved.

Brief Description of the Drawings

[0025] [Figure 1] It is a plan view showing a schematic configuration of a substrate processing apparatus according to Example 1. [Figure 2] It is a side view showing a batch transfer mechanism. [Figure 3] (a) to (f) are side views for explaining a posture conversion unit and a pusher mechanism in a transfer block. <{ [Figure 4] (a) is a plan view showing a second posture conversion mechanism, and (b) is a front view showing the second posture conversion mechanism. [Figure 5] It is a side view for explaining a second transfer mechanism and a posture conversion unit. [Figure 6] (a) is a plan view showing an auxiliary chuck opening / closing unit of a posture conversion unit, and (b) is a side view showing an advancing / retreating unit of the posture conversion unit. [Figure 7] (a) and (b) are diagrams for explaining the operation of the advancing / retreating unit of the posture conversion unit. [Figure 8] It is a flowchart for explaining the operation of the substrate processing apparatus. [Figure 9] It is a flowchart for explaining the first half operation of the second posture conversion mechanism. [Figure 10] It is a flowchart for explaining the second half operation of the second posture conversion mechanism. [Figure 11] (a) to (d) are plan views for explaining the operation of the second posture conversion mechanism. [Figure 12] (a) to (d) are front views for explaining the operation of the second posture conversion mechanism. [Figure 13] (a) and (b) are plan views for explaining the operation of the second posture conversion mechanism, and (c) and (d) are front views for explaining the operation of the second posture conversion mechanism. [Figure 14](a) is a longitudinal cross-sectional view showing the pusher mechanism of the second attitude changing mechanism according to Embodiment 2, and (b) is a plan view showing the second attitude changing mechanism according to Embodiment 2. [Figure 15] This is a plan view showing the schematic configuration of the substrate processing apparatus according to Example 3. [Figure 16] (a) and (b) are side views illustrating the buffer section according to Example 3. [Figure 17] This is a plan view showing the schematic configuration of the substrate processing apparatus according to Example 4. [Figure 18] This is a plan view showing the schematic configuration of the substrate processing apparatus according to Example 5. [Figure 19] This is a plan view showing the schematic configuration of a substrate processing apparatus according to a modified example. [Figure 20] This is a side view showing a modified ceiling-mounted central robot. [Example 1]

[0026] Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. Figure 1 is a plan view showing the schematic configuration of the substrate processing apparatus 1 according to Embodiment 1. Figure 2 is a side view showing the batch transport mechanism HTR. Figures 3(a) to 3(f) are side views illustrating the attitude change section and pusher mechanism in the transfer block.

[0027] <1. Overall Structure> Refer to Figure 1. The substrate processing apparatus 1 comprises a stocker block 3, a transfer block 5, and a processing block 7. The stocker block 3, the transfer block 5, and the processing block 7 are arranged in a single horizontal row in this order.

[0028] The substrate processing apparatus 1 performs treatments on the substrate W, such as chemical treatment, cleaning, and drying. The substrate processing apparatus 1 performs batch processing and single-wafer processing on the substrate W in succession. That is, the substrate processing apparatus 1 performs batch processing and then single-wafer processing on the substrate W. Batch processing is a processing method in which multiple substrates W are processed at once. Single-wafer processing is a processing method in which substrates W are processed one by one.

[0029] In this specification, for convenience, the direction in which the stocker block 3, transfer block 5, and processing block 7 are aligned is called the "front-to-back direction X". The front-to-back direction X is horizontal. Of the front-to-back direction X, the direction from the transfer block 5 toward the stocker block 3 is called "forward". The direction opposite to forward is called "rear". The horizontal direction perpendicular to the front-to-back direction X is called the "width direction Y". One direction in the width direction Y is appropriately called "right". The direction opposite to right is called "left". The direction perpendicular to the horizontal is called the "vertical direction Z". For example, in Figure 1, front, rear, right, left, up, and down are shown as appropriate for reference.

[0030] <2. Storage Block> The stocker block 3 accommodates at least one carrier C. The stocker block 3 is provided with one or more (e.g., two) load ports 9. The stocker block 3 includes a carrier transport mechanism (robot) 11 and shelves 13.

[0031] The carrier transport mechanism 11 transports the carrier C between the load port 9 and the shelf 13. The carrier transport mechanism 11 is equipped with a gripping part that grips the projection on the upper surface of the carrier C, or a hand that supports the carrier C while in contact with the bottom surface of the carrier C. The shelf 13 is divided into shelf 13A for taking out and storing substrates W, and shelf 13B for storage.

[0032] The shelf 13A is positioned adjacent to the transfer block 5. The shelf 13A may be provided with a mechanism for attaching and detaching the lid of the carrier C. At least one shelf 13A is provided. The carrier C is placed on the shelf 13A. The carrier C stores multiple substrates W (e.g., 25) in a horizontal position with predetermined intervals (e.g., 10 mm intervals) between them in the vertical direction Z. The substrates W are aligned in the thickness direction of the substrates W. For example, a FOUP (Front Opening Unify Pod) can be used as the carrier C. A FOUP is a sealed container. The carrier C may be an open container, and is of any type. The shelf 13A corresponds to the carrier mounting shelf of the present invention.

[0033] <3. Transfer Block> The transfer block 5 is positioned adjacent to the rear X of the stocker block 3. The transfer block 5 includes a batch transport mechanism (robot) HTR and a first attitude change mechanism 15. The batch transport mechanism HTR corresponds to the substrate handling mechanism of the present invention.

[0034] The batch transport mechanism HTR is located on the right Y side within the transfer block 5. The batch transport mechanism HTR transports multiple substrates W (for example, 25) in a horizontal orientation all at once. The batch transport mechanism HTR retrieves and stores multiple substrates W in a single unit from the carrier C placed on the shelf 13A. Furthermore, the batch transport mechanism HTR is configured to be able to transfer multiple substrates W in a single unit between itself and the first orientation changing mechanism 15, and between itself and the buffer section 33, which will be described later. In other words, the batch transport mechanism HTR can transport multiple substrates W between the carrier C placed on the shelf 13A, the first orientation changing mechanism 15, and the buffer section 33.

[0035] Refer to Figure 2. The batch transport mechanism HTR is equipped with multiple (for example, 25) hands 17. In Figure 2, for illustrative purposes, the batch transport mechanism HTR is shown to be equipped with 3 hands 17. Each hand 17 holds one substrate W.

[0036] The HTR transport mechanism also includes a hand support section 19, a forward / backward section 20, and a lifting / rotating section 21. The hand support section 19 supports multiple hands 17, allowing the multiple hands 17 to move as a single unit. The forward / backward section 20 moves the multiple hands 17 forward and backward via the hand support section 19. The lifting / rotating section 21 rotates the forward / backward section 20 around the vertical axis AX1, thereby rotating the multiple hands 17, etc., around the vertical axis AX1. The lifting / rotating section 21 also raises and lowers the multiple hands 17, etc., by raising and lowering the forward / backward section 20. The lifting / rotating section 21 is fixed to the floor surface; that is, the lifting / rotating section 21 does not move horizontally. The forward / backward section 20 and the lifting / rotating section 21 are each equipped with electric motors. The HTR transport mechanism may also include a separate hand (not shown) for transporting a single substrate W, in addition to the hands 17 and the hand support section 19.

[0037] Refer to Figure 1. The first attitude changing mechanism 15 changes the attitude of multiple substrates W from a horizontal to a vertical position all at once. The first attitude changing mechanism 15 comprises an attitude changing unit 23 and a pusher mechanism 25. In Figure 1, the batch transport mechanism HTR, the attitude changing unit 23, and the pusher mechanism 25 are arranged in this order to the left Y. Figures 3(a) to 3(f) are diagrams illustrating the first attitude changing mechanism 15.

[0038] As shown in Figures 1 and 3(a), the attitude change unit 23 comprises a support base 23A, a pair of horizontal holding units 23B, a pair of vertical holding units 23C, and a rotation drive unit 23D. The pair of horizontal holding units 23B and the pair of vertical holding units 23C are provided on the support base 23A. The horizontal holding units 23B and the vertical holding units 23C receive multiple substrates W transported by the HTR transport mechanism. When the substrates W are in a horizontal position, the pair of horizontal holding units 23B support the substrates W from below while contacting the lower surface of each substrate W. When the substrates W are in a vertical position, the pair of vertical holding units 23C hold the substrates W.

[0039] The rotary drive unit 23D rotatably supports the support base 23A around the horizontal axis AX2. The rotary drive unit 23D also rotates the support base 23A around the horizontal axis AX2, thereby changing the orientation of the multiple substrates W held by the holding units 23B and 23C from horizontal to vertical.

[0040] As shown in Figures 1 and 3(f), the pusher mechanism 25 comprises a pusher 25A, a lifting and rotating section 25B, a horizontal moving section 25C, and a rail 25D. The pusher 25A supports the lower part of each of the multiple (e.g., 50) substrates W in a vertical position. For illustrative purposes, in Figures 3(a) to 3(f), the pusher 25A is configured to support six substrates W.

[0041] The lifting and rotating section 25B is connected to the underside of the pusher 25A. The lifting and rotating section 25B moves the pusher 25A up and down by extending and retracting. The lifting and rotating section 25B also rotates the pusher 25A around the vertical axis AX3. The horizontal movement section 25C supports the lifting and rotating section 25B. The horizontal movement section 25C moves the pusher 25A and the lifting and rotating section 25B horizontally along the rail 25D. The rail 25D is formed to extend in the width direction Y. The rotation drive section 23D, the lifting and rotating section 25B, and the horizontal movement section 25C are each equipped with electric motors.

[0042] The operation of the first attitude changing mechanism 15 will now be explained. The batch processing tanks BT1 to BT6 of the processing block 7, which will be described later, process, for example, 50 substrates W from two carriers C at once. The first attitude changing mechanism 15 changes the attitude of the 50 substrates W in batches of 25. The first attitude changing mechanism 15 also arranges multiple substrates W in a face-to-face manner at predetermined intervals (half-pitch). The half-pitch is, for example, 5 mm. The pusher mechanism 25 transports these 50 substrates W to the first transport mechanism WTR1.

[0043] The 25 substrates W within the first carrier C will be described as substrates W1 of the first substrate group. The 25 substrates W in the second carrier C will be described as substrates W2 of the second substrate group. Furthermore, in Figures 3(a) to 3(f), for illustrative purposes, it will be explained that there are 3 substrates W1 in the first substrate group and 3 substrates W2 in the second substrate group. Also, when substrates W1 and W2 are not specifically distinguished, they will be referred to as "substrate W".

[0044] Refer to Figure 3(a). The orientation change unit 23 receives the 25 substrates W1 of the first substrate group, which have been transported by the bulk transport mechanism HTR, with the holding units 23B and 23C. At this time, the 25 substrates W1 are in a horizontal orientation, with the device surface facing upward. The 25 substrates W1 are arranged at predetermined intervals (full pitch). The full pitch is, for example, 10 mm intervals. The full pitch is also called the normal pitch.

[0045] Half-pitch refers to a spacing that is half the distance of full-pitch. The device side of substrate W (W1, W2) is the side on which electronic circuits are formed and is called the "front surface." The back surface of substrate W is the side on which electronic circuits are not formed. The back surface is the side opposite the device side.

[0046] Refer to Figure 3(b). The attitude conversion unit 23 rotates the holding units 23B and 23C by 90 degrees around the horizontal axis AX2, converting the orientation of the 25 substrates W1 from horizontal to vertical. Refer to Figure 3(c). The pusher mechanism 25 raises the pusher 25A to a position higher than the holding units 23B and 23C of the attitude conversion unit 23. As a result, the pusher 25A receives the 25 substrates W from the holding units 23B and 23C. The 25 substrates W1 held by the pusher 25A face left Y. In Figures 3(a) to 3(f), the arrow AR attached to the substrate W indicates the orientation of the device surface of the substrate W.

[0047] Refer to Figure 3(d). The pusher mechanism 25 rotates the 25 vertically oriented substrates W 180 degrees around the vertical axis AX3. As a result, the 25 substrates W1 are inverted and facing to the right Y. Furthermore, the inverted 25 substrates W1 move half a pitch (e.g., 5 mm) to the left Y from their positions before rotation. The holding parts 23B and 23C of the attitude conversion unit 23 are also rotated -90 degrees around the horizontal axis AX2 to prepare for receiving the next substrate W2. Subsequently, the attitude conversion unit 23 receives the 25 substrates W2 of the second group of substrates transported by the batch transport mechanism HTR with the holding parts 23B and 23C. At this time, the 25 substrates W2 are in a horizontal position with the device surface facing upward. The attitude conversion unit 23 and the pusher mechanism 25 are operated in such a way that they do not interfere with each other.

[0048] Refer to Figure 3(e). The pusher mechanism 25 lowers the pusher 25A, which holds the 25 substrates W1 of the first substrate group, to the retracted position. Then, the attitude change unit 23 changes the attitude of the 25 substrates W2 from horizontal to vertical. After the attitude change, the 25 substrates W2 are facing left Y. Refer to Figure 3(f). Then, the pusher mechanism 25 raises the pusher 25A, which holds the 25 substrates W2 of the second substrate group. As a result, the pusher mechanism 25 receives another 25 substrates W2 from the attitude change unit 23.

[0049] As a result, the pusher 25A holds 50 substrates W (W1, W2) from the first substrate group and the second substrate group. The 50 substrates W are arranged alternately in groups of 25 W1 and 25 W2. The 50 substrates W are arranged at half-pitch intervals (e.g., 5 mm apart). Furthermore, the 25 W1 substrates face in the opposite direction to the 25 W2 substrates. Therefore, the 50 substrates W are arranged in a face-to-face manner. That is, two adjacent substrates W1 and W2 have their two device faces (or two back faces) facing each other.

[0050] Subsequently, the pusher mechanism 25 moves the pusher 25A, which holds the 50 substrates W, along the rail 25D to the substrate transfer position PP below the pair of chucks 49 and 50 of the first transport mechanism WTR1.

[0051] <4. Processing Block 7> The processing block 7 is adjacent to the transfer block 5. The processing block 7 is located behind X of the transfer block 5. The processing block 7 comprises a batch processing area R1, a single-wafer substrate transport area R2, a single-wafer processing area R3, and a batch substrate transport area R4. The substrate processing apparatus 1 comprises an electrical area R5.

[0052] <4-1. Batch processing area R1> The batch processing area R1 is adjacent to the transfer block 5, the single-wafer substrate transport area R2, and the batch substrate transport area R4. Furthermore, the batch processing area R1 is positioned between the single-wafer substrate transport area R2 and the batch substrate transport area R4. One end of the batch processing area R1 is adjacent to the transfer block 5, while the other end extends away from the transfer block 5, i.e., backward X.

[0053] The batch processing area R1 is provided with, for example, six batch processing tanks BT1 to BT6 and a second attitude changing mechanism 31. The six batch processing tanks BT1 to BT6 are arranged in a single line in the front-to-back direction X along which the batch processing area R1 extends. The second attitude changing mechanism 31 is positioned on the opposite side of the transfer block 5, with the six batch processing tanks BT1 to BT6 in between. That is, the six batch processing tanks BT1 to BT6 are positioned between the transfer block 5 and the second attitude changing mechanism 31. The second attitude changing mechanism 31 (pusher mechanism 61) is positioned on the extension of the line of the six batch processing tanks BT1 to BT6. Note that the number of batch processing tanks is not limited to six; there may be more than six.

[0054] Each of the six batch processing tanks BT1 to BT6 immerses multiple substrates W in a vertical position all at once. For example, the six batch processing tanks BT1 to BT6 consist of four chemical treatment tanks BT1 to BT4 and two water rinsing tanks BT5 and BT6. Specifically, two chemical treatment tanks BT1 and BT2 and water rinsing tank BT5 form one set. Another set consists of two chemical treatment tanks BT3 and BT4 and water rinsing tank BT6.

[0055] Each of the four chemical treatment tanks BT1 to BT4 performs etching treatment using a chemical solution. For example, phosphoric acid is used as the chemical solution. Chemical treatment tank BT1 stores the chemical solution supplied from a chemical solution discharge pipe (not shown). The chemical solution discharge pipe is provided on the inner wall of chemical treatment tank BT1. The three chemical treatment tanks BT2 to BT4 are each configured similarly to chemical treatment tank BT1.

[0056] The two rinsing tanks BT5 and BT6 each perform a pure water cleaning process to wash away the chemical solution adhering to multiple substrates W with pure water. Deionized water (DIW) is used as the pure water. The two rinsing tanks BT5 and BT6 each store the pure water supplied from a cleaning solution discharge pipe (not shown). The cleaning solution discharge pipe is provided on the inner wall of each rinsing tank BT5 and BT6.

[0057] Each of the six batch processing tanks BT1 to BT6 is equipped with six lifters LF1 to LF6. For example, lifter LF1 holds multiple substrates W in a vertical position, arranged at predetermined intervals (half-pitch). Lifter LF1 also raises and lowers the multiple substrates W between the processing position inside batch processing tank (chemical processing tank) BT1 and the transfer position above batch processing tank BT1. The other five lifters LF2 to LF6 are configured similarly to lifter LF1.

[0058] The second attitude conversion mechanism 31 simultaneously changes the orientation of multiple substrates W from vertical to horizontal. Details of the second attitude conversion mechanism 31 will be described later.

[0059] <4-2. Single-wafer substrate transport area R2>

[0060] The single-wafer substrate transport area R2 is adjacent to the transfer block 5, the batch processing area R1, the single-wafer processing area R3, and the electrical equipment area R5. Furthermore, the single-wafer substrate transport area R2 is interposed between the batch processing area R1 and the single-wafer processing area R3. One end of the single-wafer substrate transport area R2 is adjacent to the transfer block 5. The other end of the single-wafer substrate transport area R2 extends away from the transfer block 5, i.e., backward X.

[0061] The single-wafer substrate transport area R2 is provided with a center robot CR and a buffer section 33. The center robot CR transports substrates between the second posture changing mechanism 31, the single-wafer processing chambers SW1 to SW4 (described later), and the buffer section 33. The center robot CR is equipped with two hands 35, a forward / backward section 37, a lifting / rotating section 39, and a horizontal movement section 41 (including guide rails).

[0062] Each of the two hands 35 holds a single substrate W in a horizontal position. The forward / backward section 37 supports the hands 35 so that they can move, and moves the hands 35 forward and backward individually. The lifting / rotating section 39 rotates the hands 35 and the forward / backward section 37 around the vertical axis AX11. The lifting / rotating section 39 also raises and lowers the hands 35 and the forward / backward section 37. The guide rail is provided along the direction in which the single-wafer substrate transport area R2 extends, and is also provided on the floor surface of the single-wafer substrate transport area R2. The horizontal movement section 41 moves the hands 35 and the forward / backward section 37, etc., in the front-rear direction X along the guide rail. The forward / backward section 37, the lifting / rotating section 39, and the horizontal movement section 41 are each equipped with an electric motor.

[0063] For example, the forward / backward unit 37 advances two hands 35 to remove two substrates W from the second posture changing mechanism 31. After that, the forward / backward unit 37 may advance one hand 35 that holds one substrate W to transport one substrate W to one single-wafer processing chamber. The center robot CR may be equipped with one or three or more hands 35. If it is equipped with three or more hands 35, the center robot CR advances and retracts the three or more hands 35 individually.

[0064] The buffer unit 33 is equipped with multiple mounting shelves. Each of the multiple mounting shelves is in a horizontal position. Each of the multiple mounting shelves can hold one substrate W. The buffer unit 33 places the multiple substrates W in a horizontal position at predetermined intervals (full pitch) in the vertical direction Z. That is, the multiple mounting shelves are arranged at predetermined intervals (full pitch) and in the vertical direction Z. The buffer unit 33 is configured to hold at least 25 substrates W that can be transported by the batch transport mechanism HTR. The buffer unit 33 is configured to hold, for example, 50 substrates W.

[0065] As shown in Figure 1, the buffer section 33 is specifically positioned across the transfer block 5 and the single-wafer substrate transport area R2. That is, the buffer section 33 is provided at the boundary between the transfer block 5 and the single-wafer substrate transport area R2. Alternatively, the buffer section 33 may be provided only in the transfer block 5 or only in the single-wafer substrate transport area R2. Therefore, the buffer section 33 only needs to be fixedly provided at the boundary between the transfer block 5 and the single-wafer substrate transport area R2, on the transfer block 5, or on the single-wafer substrate transport area R2. Since the buffer section 33 is fixed and does not move, the configuration of the buffer section 33 and its surroundings can be simplified.

[0066] The buffer section 33 corresponds to the substrate mounting section of the present invention. The center robot CR corresponds to the single-wafer substrate transport mechanism of the present invention.

[0067] <4-3. Single-wafer processing area R3> The single-wafer processing area R3 is adjacent to the single-wafer substrate transport area R2 and the electrical equipment area R5. One end of the single-wafer processing area R3 is located close to the transfer block 5 via the electrical equipment area R5. The electrical equipment area R5 is equipped with the electrical circuits necessary for the substrate processing apparatus 1 and the control unit 59, which will be described later. The other end of the single-wafer processing area R3 extends away from the transfer block 5, i.e., to the rear X. The single-wafer processing area R3 is also provided along the batch processing area R1 and the single-wafer substrate transport area R2.

[0068] Multiple (for example, four) single-wafer processing chambers SW1 to SW4 are provided in the single-wafer processing area R3. The four single-wafer processing chambers SW1 to SW4 are arranged in the front-to-back direction X along the extension of the single-wafer processing area R3. Each single-wafer processing chamber SW1 to SW4 processes one substrate W at a time. The first single-wafer processing chamber SW1 is positioned furthest from the transfer block 5. The second single-wafer processing chamber SW2 is positioned in front of the first single-wafer processing chamber SW1, X in front of that chamber. The third single-wafer processing chamber SW3 is positioned in front of the second single-wafer processing chamber SW2, X in front of that chamber. The fourth single-wafer processing chamber SW4 is positioned in front of the third single-wafer processing chamber SW3, X in front of that chamber. The single-wafer processing chambers SW1 to SW4 may be arranged in multiple stages. For example, twelve single-wafer processing chambers may be arranged in four in the front-to-back direction X (horizontal direction) and three in the vertical direction Z.

[0069] For example, the single-wafer processing chambers SW1 and SW2 each include a rotation processing unit 45 and a nozzle 47. The rotation processing unit 45 includes a spin chuck that holds a single substrate W in a horizontal position and an electric motor that rotates the spin chuck around a vertical axis passing through the center of the substrate W. The spin chuck may hold the bottom surface of the substrate W by vacuum suction. The spin chuck may also have three or more chuck pins that grip the outer edge of the substrate W.

[0070] The nozzle 47 supplies processing liquid to the substrate W held by the rotating processing unit 45. The nozzle 47 moves between a standby position away from the rotating processing unit 45 and a supply position above the rotating processing unit 45. For example, pure water (DIW) and IPA (isopropyl alcohol) are used as processing liquids. The single-wafer processing chambers SW1 and SW2 may, for example, wash the substrate W with pure water and then perform a preliminary drying treatment with IPA, or form a liquid film of IPA on the upper surface of the substrate W.

[0071] Each of the single-wafer processing chambers SW3 and SW4 performs a drying process using, for example, a supercritical fluid. Carbon dioxide is used as the fluid. Each of the single-wafer processing chambers SW3 and SW4 comprises a chamber body (container) 48, a support tray, and a lid. The chamber body 48 has a processing space provided inside, an opening for placing the substrate W into this processing space, a supply port, and an exhaust port. The substrate W is housed in the processing space while being supported by the support tray. The lid closes the opening of the chamber body 48. For example, each of the single-wafer processing chambers SW3 and SW4 prepares the fluid to a supercritical state and supplies the supercritical fluid from the supply port to the processing space inside the chamber body 48. At this time, the processing space inside the chamber body 48 is exhausted from the exhaust port. The supercritical fluid supplied to the processing space performs a drying process on the substrate W.

[0072] The supercritical state is achieved by bringing the fluid to its specific critical temperature and pressure. Specifically, for carbon dioxide, the critical temperature is 31°C and the critical pressure is 7.38 MPa. In the supercritical state, the surface tension of the fluid becomes almost zero. Therefore, the gas-liquid interface does not affect the pattern on the substrate W. Consequently, pattern deformation on the substrate W is less likely to occur.

[0073] <4-4. Batch substrate transport area R4> The batch substrate transport area R4 is adjacent to the transfer block 5 and the batch processing area R1. The batch substrate transport area R4 is provided along the batch processing area R1. The batch substrate transport area R4 extends in the front-to-back direction X. The four areas R1, R2, R3, and R4 are provided so as to extend parallel to each other.

[0074] The batch substrate transport area R4 has a first transport mechanism (robot) WTR1. That is, the batch substrate transport area R4 is provided with the first transport mechanism WTR1. The first transport mechanism WTR1 transports multiple (e.g., 50) substrates W at once between the substrate transfer position PP defined in the transfer block 5, each of the six batch processing tanks BT1 to BT6, and the second posture changing mechanism 31.

[0075] The first transport mechanism WTR1 comprises a pair of chucks 49, 50 and a guide rail 53. Each of the chucks 49, 50 has 50 holding grooves to hold, for example, 50 substrates W. The two chucks 49, 50 each extend parallel to the Y direction (Figure 1) in a plan view. The first transport mechanism WTR1 opens and closes the two chucks 49, 50. The first transport mechanism WTR1 moves the pair of chucks 49, 50 along the guide rail 53. The first transport mechanism WTR1 is driven by an electric motor.

[0076] <5. Control Unit> The substrate processing apparatus 1 comprises a control unit 59 and a storage unit (not shown). The control unit 59 controls each component of the substrate processing apparatus 1. The control unit 59 comprises one or more processors, such as a central processing unit (CPU). The storage unit comprises at least one of ROM (Read-Only Memory), RAM (Random-Access Memory), and a hard disk. The storage unit stores the computer programs necessary to control each component of the substrate processing apparatus 1.

[0077] <6. Second attitude change mechanism> Figure 4(a) is a plan view showing the second attitude changing mechanism 31. Figure 4(b) is a front view showing the second attitude changing mechanism 31. Figure 5 is a side view illustrating the second transport mechanism WTR2 and the attitude changing unit 63. The second attitude changing mechanism 31 comprises a pusher mechanism 61, a second transport mechanism (second batch substrate transport mechanism) WTR2, and an attitude changing unit 63. The second transport mechanism WTR2 corresponds to the substrate extraction mechanism of the present invention.

[0078] <6-1. Pusher Mechanism> The pusher mechanism 61 receives multiple substrates W from the first transport mechanism WTR1. The pusher mechanism 61 holds the multiple substrates W in a vertical position and can rotate the multiple substrates W around the vertical axis AX4. The pusher mechanism 61 comprises a pusher 65 and a lifting and rotating section 67.

[0079] The pusher 65 holds multiple substrates W in a vertical position, which are transported by the first transport mechanism WTR1 and arranged at predetermined intervals (e.g., half-pitch). The lifting and rotating unit 67 raises and lowers the pusher 65 and rotates the pusher 65 around the vertical axis AX4. The lifting and rotating unit 67 is equipped with, for example, one or more electric motors. The pusher 65 corresponds to the substrate holding unit of the present invention.

[0080] <6-2. Second Batch Transfer Mechanism> The second transport mechanism (robot) WTR2 removes and transports multiple substrates W from the pusher 65. The second transport mechanism WTR2 includes two chucks (horizontal chucks) 69 and 70, an opening / closing section 71, a lifting / lowering section 73, and a horizontal movement section 75. As shown in Figure 5, the chucks 69 and 70 hold multiple substrates W in a vertical position by gripping the two sides of the outer edge of each substrate W in the radial direction.

[0081] Each of the two chucks 69 and 70 is equipped with multiple (e.g., 25) V-shaped retaining grooves 78 and multiple (e.g., 25) through grooves 80. The V-shaped retaining grooves 78 and through grooves 80 are arranged alternately, one at a time. The back of each V-shaped retaining groove 78 is formed in a V-shape in cross-section. In addition, the V-shaped retaining groove 78A of chuck 69 faces the V-shaped retaining groove 78B of chuck 70. As a result, a pair of V-shaped retaining grooves 78A and 78B hold one substrate W. The 25 pairs of V-shaped retaining grooves 78 of the two chucks 69 and 70 each hold 25 substrates W in a vertical position.

[0082] The through grooves 80 do not hold the substrate W. The V-shaped holding grooves 78 are arranged at predetermined intervals (e.g., full pitch). The through grooves 80 are also arranged at predetermined intervals (e.g., full pitch). As a result, the second transport mechanism WTR2 can remove every other substrate W from a plurality of substrates W arranged at half pitch.

[0083] The opening / closing section 71 shown in Figure 4(a) swings (rotates) the chuck 69 around the horizontal axis AX5 and swings the chuck 70 around the horizontal axis AX6. This allows the opening / closing section 71 to clamp and hold the substrate W, and to release the clamped state of the substrate W. When the substrate W is clamped by the pair of chucks 69 and 70, the width of the two inner portions of the V-shaped holding grooves 78A and 78B becomes smaller than the diameter of each substrate W. Therefore, the substrate W is held. The two horizontal axes AX5 and AX6 each extend in the front-to-back direction X where the substrate W is aligned. Also, horizontal axis AX5 extends parallel to horizontal axis AX6.

[0084] The lifting unit 73 raises and lowers the chucks 69, 70 and the opening / closing unit 71. The horizontal movement unit 75 moves the chucks 69, 70 and the lifting unit 73 in the width direction Y (see Figure 4(a)). The horizontal movement unit 75 moves the chucks 69, 70 between a position above the pusher 65 and a handover position to the attitude changing unit 63. The opening / closing unit 71, the lifting unit 73, and the horizontal movement unit 75 are each equipped with, for example, an electric motor.

[0085] Furthermore, it is preferable that the upper ends of each chuck 69 and 70 are lower than the upper ends of the substrates W they hold. Also, it is preferable that the lower ends of each chuck 69 and 70 are higher than the lower ends of the substrates W they hold. This allows the chucks 69 and 70 that hold the substrates W to be easily passed between the upper chuck 81 and the lower chuck 83, which will be described later. As a result, the chucks 69 and 70 can smoothly transfer the substrates W to the upper and lower chucks 81 and 83.

[0086] <6-3. Posture Change Section> Figure 6(a) is a plan view showing the auxiliary chuck opening / closing part 87 of the attitude changing unit 63. Figure 6(b) is a side view showing the forward / backward part 88 of the attitude changing unit 63. Figures 7(a) and 7(b) are diagrams illustrating the operation of the forward / backward part 88 of the attitude changing unit 63.

[0087] Refer to Figures 4(a), 4(b), 6(a), etc. The attitude changing unit 63 changes the attitude of the substrate W transported by the second transport mechanism WTR2 from vertical to horizontal. The attitude changing unit 63 comprises an upper chuck 81, a lower chuck 83, an upper chuck moving unit 84, two auxiliary chucks 85, 86, an auxiliary chuck opening / closing unit 87, a forward / backward unit 88, an upper and lower chuck rotating unit 89, a support arm 90, and a base frame 91.

[0088] The upper chuck 81 and the lower chuck 83 (hereinafter referred to as "upper and lower chucks 81, 83" as appropriate) radially grip the upper and lower outer edges of each of the multiple vertically positioned substrates W held by the two chucks 69, 70. This allows the upper chuck 81 and the lower chuck 83 to directly receive the substrates W from the two chucks 69, 70 of the second transport mechanism WTR2.

[0089] The upper chuck 81 is mounted on the support arm 90 so as to be movable vertically. The upper chuck moving part 84 can move the upper chuck 81 closer to the lower chuck 83 or further away from the lower chuck 83. The upper chuck moving part 84 is mounted on the support arm 90. The upper chuck moving part 84 includes, for example, a linear actuator having an electric motor. The lower chuck 83 is not movable and is fixed to the support arm 90.

[0090] As shown in Figure 5, the upper chuck 81 is equipped with a plurality (e.g., 25) first horizontal guide grooves 93. Similarly, the lower chuck 83 is equipped with a plurality (e.g., 25) second horizontal guide grooves 94. For example, the 25 first horizontal guide grooves 93 are configured to accommodate the outer edges of 25 substrates W. The 25 second horizontal guide grooves 94 are also configured to accommodate the outer edges of 25 substrates W. Each of the horizontal guide grooves 93 and 94 has a mounting surface 95 for placing one substrate W (see Figure 7(a)).

[0091] Furthermore, each of the horizontal guide grooves 93 and 94 has a width WD that is wider than the thickness TC of each substrate W. That is, from the entrance to the back of each horizontal guide groove 93 and 94, the width WD of each groove 93 and 94 is wider than the thickness TC of each substrate W. As a result, when the hand 35 of the center robot CR removes a single substrate W in a horizontal position from the horizontal guide grooves 93 and 94, it can lift the single substrate W in a horizontal position within the horizontal guide grooves 93 and 94. In other words, the horizontal guide grooves 93 and 94 have space that allows the substrate W to move freely.

[0092] Furthermore, when the upper chuck 81 and the lower chuck 83 grip the substrate W, a gap GP (space) is provided within the horizontal guide grooves 93 and 94 to allow the substrate W to move in the radial direction.

[0093] The auxiliary chucks 85 and 86 hold the underside of each substrate W. The two auxiliary chucks 85 and 86 are provided on both sides of the lower chuck 83 along the circumferential direction of each substrate W. Referring specifically to Figure 5, when the two chucks 69 and 70, the upper chuck 81 and the lower chuck 83 grip each substrate W, the first auxiliary chuck 85 is positioned between chuck 69 and the lower chuck 83. Also, the second auxiliary chuck 86 is positioned between chuck 70 and the lower chuck 83.

[0094] Similar to chucks 69 and 70, the two auxiliary chucks 85 and 86 each have multiple (e.g., 25) V-shaped retaining grooves 97. The back of each retaining groove 97 is formed in a V-shape in cross-section.

[0095] When the upper chuck 81 and lower chuck 83 hold the substrate W in a "vertical position," the auxiliary chucks 85 and 86 each hold the substrate W in a vertical position by accommodating the outer edge of the substrate W in the V-shaped holding groove 97. When the upper chuck 81 and lower chuck 83 hold the substrate W in a "horizontal position," the two auxiliary chucks 85 and 86 each release the substrate W from the V-shaped holding groove 97 and move away from the substrate W to a position that does not hinder the removal of the substrate W by the center robot CR.

[0096] The auxiliary chuck opening / closing section 87 is provided on the support arm 90 via a reciprocating section 88. The auxiliary chuck opening / closing section 87 swings (rotates) the first auxiliary chuck 85 around the horizontal axis AX7 and swings the second auxiliary chuck 86 around the horizontal axis AX8. This will be explained with reference to Figure 6(a). The auxiliary chuck opening / closing section 87 includes, for example, an electric motor 87A, a first gear 87B, a second gear 87C, a third gear 87D, a fourth gear 87E, a first shaft 87F, and a second shaft 87G.

[0097] The first gear 87B is fixed to the output shaft 87H of the electric motor 87A. The second gear 87C is fixed to the first shaft 87F. The first shaft 87F is rotatably supported around the horizontal axis AX7. A first auxiliary chuck 85 is also connected to the tip of the first shaft 87F. The third gear 87D is rotatably supported around the horizontal axis. The fourth gear 87E is fixed to the second shaft 87G. The second shaft 87G is rotatably supported around the horizontal axis AX8. A second auxiliary chuck 86 is also connected to the tip of the second shaft 87G.

[0098] Two gears 87B and 87C mesh together. Two gears 87B and 87D mesh together. Also, two gears 87D and 87E mesh together. When the electric motor 87A rotates the output shaft 87H in the forward direction, the auxiliary chucks 85 and 86 hold the substrate W. Conversely, when the electric motor 87A rotates the output shaft 87H in the reverse direction, the auxiliary chucks 85 and 86 separate from the substrate W, and the state in which they hold the substrate W is released.

[0099] The two horizontal axes AX7 and AX8 each extend in the front-to-back direction X, where the substrate W is aligned. Also, horizontal axis AX7 extends parallel to horizontal axis AX8. When the auxiliary chucks 85 and 86 are not holding the substrate W, the auxiliary chuck opening / closing section 87 moves the pair of auxiliary chucks 85 and 86 outward from the dashed line 101, as shown by the dashed line in Figure 5.

[0100] The reciprocating mechanism 88 is provided on the support arm 90, as shown in Figure 6(b). The reciprocating mechanism 88 moves the auxiliary chucks 85 and 86 forward and backward relative to the upper and lower chucks 81 and 83 in the front-to-back direction X in which the substrate W is aligned. The reciprocating mechanism 88 includes, for example, an electric motor 88A, a screw shaft 88B, a slider 88C, and a guide rail 88D.

[0101] The output shaft 88E of the electric motor 88A is connected to one end of the screw shaft 88B. The screw shaft 88B passes through the slider 88C, engaging with the nut portion 88F of the slider 88C. The guide rail 88D also passes through the slider 88C. The slider 88C can move freely relative to the guide rail 88D. The slider 88C is connected to the auxiliary chuck opening / closing section 87. The screw shaft 88B and the guide rail 88D extend in the front-to-back direction X, where the substrate W is aligned. When the electric motor 88A rotates the output shaft 88E forward, the auxiliary chucks 85 and 86 move forward relative to the upper and lower chucks 81 and 83. Conversely, when the electric motor 88A rotates the output shaft 88E backward, the auxiliary chucks 85 and 86 move backward relative to the upper and lower chucks 81 and 83.

[0102] When the orientation changing unit 63 changes the orientation of the substrate W from vertical to horizontal, the advancing and retracting unit 88 moves the two auxiliary chucks 85 and 86 so that the vertically oriented substrate W housed in the V-shaped holding groove 97 comes into contact with the mounting surface 95. This will be explained in detail with reference to Figures 7(a) and 7(b). In Figures 7(a) and 7(b), for the sake of illustration, the upper and lower chucks 81 and 83 are positioned at the left end of the substrate W, and the auxiliary chucks 85 and 86 are positioned at the right end of the substrate W.

[0103] Figure 7(a) shows the state immediately after the attitude change unit 63 receives the substrate W from the second transport mechanism WTR2 using the upper and lower chucks 81, 83 and auxiliary chucks 85, 86. Specifically, the outer edge of the substrate W is located at the back of the V-shaped holding groove 97 and in the center of the width WD of the horizontal placement guide grooves 93, 94.

[0104] The retractable section 88 is capable of moving the auxiliary chucks 85 and 86 between a contact position and a standby position. When changing the orientation of the substrate W, the retractable section 88 moves the auxiliary chucks 85 and 86 backward (to the rear X) from the standby position to the contact position. As a result, as shown in Figure 7(b), the back surface of the vertically oriented substrate W held by the V-shaped holding groove 97 comes into contact with or close to the mounting surfaces 95 of the horizontal guide grooves 93 and 94 of the upper and lower chucks 81 and 83, respectively.

[0105] When the auxiliary chucks 85 and 86 are not holding the substrate W, the substrate W can move freely within the horizontal guide grooves 93 and 94. However, when the orientation is changed, the substrate W moves within the horizontal guide grooves 93 and 94 and collides with them. This can potentially generate particles. Therefore, by using the reciprocating part 88 to bring the substrate W into contact with the mounting surface 95, the impact caused by the collision of the substrate W can be reduced. As a result, the generation of particles can be suppressed.

[0106] The upper and lower chuck rotating section 89 shown in Figure 4(b) rotates the upper and lower chucks 81 and 83 around a horizontal axis AX9 that is perpendicular to the alignment direction (front-to-back direction X) of the 25 substrates W held in a vertical position by the upper and lower chucks 81 and 83. This converts the orientation of the 25 substrates W received from the two chucks 69 and 70 from vertical to horizontal.

[0107] The upper and lower chuck rotating section 89 is provided on the foundation frame 91. The foundation frame 91 includes, for example, a beam member 91A extending horizontally in the front-rear direction X, and two column members 91B supporting both ends of this beam member. The upper and lower chuck rotating section 89 supports the upper and lower chucks 81 and 83 so that they can rotate around a horizontal axis AX9 via an L-shaped support arm 90. The upper and lower chuck rotating section 89 includes, for example, an electric motor.

[0108] <6. Operation Description> Next, the operation of the substrate processing apparatus 1 will be explained with reference to the flowcharts in Figures 8 to 10. Refer to Figure 1. An external transport robot (not shown) transports the two carriers C to the load port 9 in sequence.

[0109] [Step S01] Transfer of substrate from carrier The carrier transport mechanism 11 of the stocker block 3 transports the first carrier C from the load port 9 to the shelf 13A. The batch transport mechanism HTR of the transfer block 5 takes out 25 horizontally oriented substrates W1 from the first carrier C placed on shelf 13A and transports them to the orientation change unit 23. After that, the carrier transport mechanism 11 transports the empty first carrier C to shelf 13B. After that, the carrier transport mechanism 11 transports the second carrier C from the load port 9 to shelf 13A. The batch transport mechanism HTR takes out 25 horizontally oriented substrates W2 from the second carrier C placed on shelf 13A and transports them to the orientation change unit 23.

[0110] [Step S02] Change of posture to a vertical position The attitude conversion unit 23 receives 50 substrates W (W1, W2) on two carriers C. As shown in Figures 3(a) to 3(f), the attitude conversion unit 23 and the pusher mechanism 25 align the 50 substrates W in a face-to-face manner and at half-pitch (5 mm), and also convert the orientation of the 50 substrates W from horizontal to vertical. The pusher mechanism 25 transports the 50 vertically oriented substrates W to the substrate transfer position PP determined within the transfer block 5.

[0111] [Step S03] Chemical treatment (batch processing) The first transport mechanism WTR1 receives 50 vertically positioned substrates W from the pusher mechanism 25 at the substrate transfer position PP, and transports the 50 substrates W to one of the four lifters LF1 to LF4 of the four chemical treatment tanks BT1 to BT4.

[0112] For example, the first transport mechanism WTR1 transports 50 substrates W to the lifter LF1 of the chemical treatment tank BT1. The lifter LF1 receives the 50 substrates W at a position above the chemical treatment tank BT1. The lifter LF1 immerses the 50 substrates W in the phosphoric acid used as the treatment solution in the chemical treatment tank BT1. This performs an etching process on the 50 substrates W. After the etching process, the lifter LF1 lifts the 50 substrates W out of the phosphoric acid in the chemical treatment tank BT1. The same process as in the chemical treatment tank BT1 is performed when the 50 substrates are transported to the lifters LF2 to LF4 of the other chemical treatment tanks BT2 to BT4.

[0113] [Step S04] Pure water washing treatment (batch treatment) The first transport mechanism WTR1 receives 50 substrates W in a vertical position from, for example, the lifter LF1 (or lifter LF2), and transports the 50 substrates W to the lifter LF5 of the water washing tank BT5. The lifter LF5 receives the 50 substrates W at a position above the water washing tank BT5. The lifter LF5 immerses the 50 substrates W in the pure water in the water washing tank BT5. In this way, the 50 substrates W undergo a washing process.

[0114] When the first transport mechanism WTR1 receives 50 substrates W in a vertical position from either lifter LF3 or LF4, the first transport mechanism WTR1 transports the 50 substrates W to lifter LF6 in the water washing tank BT6. Lifter LF6 receives the 50 substrates W at a position above the water washing tank BT6. Lifter LF6 immerses the 50 substrates W in the pure water in the water washing tank BT6.

[0115] In this embodiment, the second attitude changing mechanism 31 is located on the opposite side of the transfer block 5, via six batch processing tanks BT1 to BT6. The first transport mechanism WTR1 transports 50 substrates W at once to the second attitude changing mechanism 31, for example, from batch processing tank BT1 (BT3) on the side closer to the transfer block 5, through batch processing tank BT5 (BT6) on the side further away from the transfer block 5.

[0116] [Step S05] Change of posture to horizontal position The second posture changing mechanism 31 changes the posture of the cleaned substrates W from a vertical posture to a horizontal posture all at once. However, the following problem arises: When changing the posture of 50 substrates W arranged at half-pitch intervals (5 mm spacing) all at once, one hand 35 of the center robot CR may not be able to properly enter the gap between two adjacent substrates W among the 50 substrates W.

[0117] Furthermore, when substrates W are aligned using a face-to-face method, some substrates W, after being converted to a horizontal orientation, may have their device surfaces facing upwards, while others may have their device surfaces facing downwards. For example, it is undesirable for the hand 35 of the center robot CR to come into contact with the device surface of the substrate W. Also, it is undesirable for substrates W with different device surface orientations to be transported to each single-wafer processing chamber SW1 to SW4.

[0118] Therefore, in this embodiment, the distance between two adjacent substrates W is increased, and the orientation of the device surfaces of the 50 substrates W is aligned with each other. This will be explained in detail with reference to the flowcharts in Figures 9 and 10, Figures 11(a) to 11(d), Figures 12(a) to 12(d), and Figures 13(a) to 13(d).

[0119] [Step S11] Transfer of the substrate to the pusher mechanism Refer to Figure 11(a). Figures 11(a) to 11(d) are plan views illustrating the operation of the second attitude change mechanism 31. The first transport mechanism WTR1 transports 50 substrates W from one of the lifters LF5 and LF6 to the pusher mechanism 61 of the second attitude change mechanism 31 (see Figure 1). The pusher 65 of the pusher mechanism 61 holds the 50 substrates W in a vertical orientation, arranged at half-pitch and face-to-face. The 50 substrates W are also aligned along the width direction Y.

[0120] Furthermore, the second transport mechanism WTR2 waits on the attitude changing unit 63 side so as not to interfere with the first transport mechanism WTR1. After the substrate W is transported to the pusher mechanism 61, the first transport mechanism WTR1 moves from above the pusher mechanism 61.

[0121] [Step S12] Rotation of the substrate around the vertical axis by the pusher mechanism. Refer to Figure 11(b). The lifting and rotating section 67 of the pusher mechanism 61 rotates the 50 substrates W counterclockwise around the vertical axis AX4 in a plan view by 90 degrees. This allows the pusher mechanism 61 to transfer the substrates W to the second transport mechanism WTR2, and also allows the device surface of each of the 25 substrates W1 of the first substrate group to face upward when the orientation is changed.

[0122] [Step S13] Transport of substrate (W1) by the second batch transport mechanism The second transport mechanism WTR2 moves to the substrate waiting side. That is, the second transport mechanism WTR2 moves so that the chucks 69 and 70 are positioned above the 50 substrates W held by the pusher 65. The opening / closing section 71 opens the chucks 69 and 70 so that the 50 substrates W can pass between them.

[0123] Refer to Figure 11(c). After the chucks 69 and 70 arrive above the substrate W, the lifting section 73 of the second transport mechanism WTR2 lowers the chucks 69 and 70 below the center of the substrate W. Then, the opening / closing section 71 closes the chucks 69 and 70, clamping the 50 substrates W. At this time, 25 substrates W1 are positioned in 25 V-shaped holding grooves 78, and 25 substrates W2 are positioned in 25 passing grooves 80.

[0124] After gripping the 50 substrates W with the chucks 69 and 70, the lifting unit 73 raises the chucks 69 and 70. This allows the second transport mechanism WTR2 to remove 25 substrates W1 arranged at full pitch (e.g., 10 mm intervals) from the 50 substrates W(W1, W2) held by the pusher 65. In other words, the 25 substrates W2 of the second substrate group remain on the pusher 65.

[0125] Refer to Figure 11(d). The second transport mechanism WTR2 transports 25 substrates W1 simultaneously between the upper and lower chucks 81 and 83 of the attitude changing unit 65. At this time, the upper chuck 81 is moved to an open position far from the lower chuck 83 by the upper chuck moving unit 84. The auxiliary chucks 85 and 86 are closed so as to hold the substrates W in a vertical position. Note that the auxiliary chucks 85 and 86 may also be in an open state.

[0126] Furthermore, the lifting and rotating section 67 of the pusher mechanism 61 rotates the 25 substrates W2 held by the pusher 65 180 degrees around the vertical axis AX4. This allows the device surface of each of the 25 substrates W2 of the second substrate group to face upward when the orientation is changed. Also, the 180-degree rotation causes the position of each substrate W2 to move backward X by half a pitch compared to before the rotation. Therefore, when transporting the 25 substrates W2, they can be placed in the V-shaped holding grooves 78 of the chucks 69 and 70. It is preferable that this 180-degree rotation of the substrates W2 be performed in steps S13 to S17.

[0127] [Step S14] Transfer of the circuit board (W1) to the attitude change unit. Refer to Figure 12(a). Figures 12(a) to 12(d) are front views illustrating the operation of the second attitude change mechanism 31, i.e., views from the single-wafer substrate transport area R2. Furthermore, Figure 12(a) is a front view of the state in which the second transport mechanism WTR2 has moved 25 substrates W1 between the upper and lower chucks 81 and 83, as shown in Figure 11(d).

[0128] Refer to Figure 12(b). The auxiliary chucks 85 and 86 are in a closed state so as to hold the substrates W in a vertical position. The lifting section 73 of the second transport mechanism WTR2 lowers the 25 substrates W1 held by the chucks 69 and 70 until the substrates W1 contact the V-shaped holding grooves 97 of the auxiliary chucks 85 and 86. That is, the lifting section 73 lowers the 25 substrates W1 until all 25 substrates W1 are held in the 25 V-shaped holding grooves 97. Once all 25 substrates W1 are held in the 25 V-shaped holding grooves 97 of the auxiliary chucks 85 and 86, the outer edges of the 25 substrates W1 are accommodated in the second horizontal guide groove 94 of the lower chuck 83.

[0129] Subsequently, the upper chuck movement unit 84 lowers the upper chuck 81 to bring it closer to the lower chuck 83. As a result, the outer edges of the 25 substrates W1 are accommodated in the first horizontal guide groove 93 of the upper chuck 81. The 25 substrates W1 are also held (gripped) by the upper and lower chucks 81, 83 and the auxiliary chucks 85, 86.

[0130] Refer to Figure 12(c). Subsequently, the opening / closing section 71 of the second transport mechanism WTR2 opens the chucks 69 and 70. This releases the 25 substrates W1 from being held. The 25 substrates W1 are then transferred to the attitude changing section 63. Subsequently, the lifting section 73 of the second transport mechanism WTR2 raises the chucks 69 and 70 above the substrates W. This moves the second transport mechanism WTR2 to a position where it does not interfere with the attitude changing section 63.

[0131] [Step S15] Contact of the mounting surface with the substrate (W1) As shown in Figure 6(b), the retractable section 88 retracts the auxiliary chucks 85 and 86 (moves them to the rear X). That is, the retractable section 88 brings the 25 substrates W1, each held in one of the 25 V-shaped holding grooves 97, into contact with the mounting surface 95 of the horizontal guide grooves 93 and 94 (see Figures 7(a) and 7(b)). This suppresses collisions caused by the movement of each substrate W1 during posture changes and the opening of the auxiliary chucks 85 and 86.

[0132] [Step S16] Posture change by the posture change unit Refer to Figure 12(d). Subsequently, the upper and lower chuck rotation unit 89 of the attitude change unit 63 rotates the upper and lower chucks 81, 83, etc., which hold the 25 substrates W1, 90 degrees counterclockwise around the horizontal axis AX9. This changes the orientation of the 25 substrates W1 of the first substrate group from vertical to horizontal. After the 90-degree rotation, the auxiliary chuck opening / closing unit 87 opens the auxiliary chucks 85, 86 to a position that does not interfere with the transport of the substrates W1 by the center robot CR. That is, the auxiliary chucks 85, 86 are moved to the position shown by the dashed line in Figure 5.

[0133] [Step S17] Transport of the substrate (W1) by the center robot After opening the auxiliary chucks 85 and 86, the center robot CR uses two hands 35 to sequentially remove the 25 horizontally positioned substrates W1 held by the upper and lower chucks 81 and 83, and transports the substrates W1 to the single-wafer processing chambers SW1 and SW2. The spacing between the substrates W is widened from half-pitch to full-pitch. Therefore, the hands 35 of the center robot CR can easily enter the gap between two adjacent substrates W, and can also easily remove the substrates W.

[0134] After the central robot CR transports the 25 boards W1 of the first board group from the attitude change unit 63, it then changes the attitude of the 25 boards W2 of the second board group. Steps S18 to S22 are similar to steps S13 to S17, so the overlapping parts will be explained briefly.

[0135] [Step S18] Transport of substrate (W2) by the second batch transport mechanism Refer to Figure 13(a). Figures 13(a) and 13(b) are plan views illustrating the operation of the second attitude changing mechanism 31. The second transport mechanism WTR2 moves so that the chucks 69 and 70 are positioned above the 25 substrates W2 held by the pusher 65.

[0136] Subsequently, the lifting section 73 of the second transport mechanism WTR2 lowers the chucks 69 and 70 below the center of the substrate W2. Then, the opening / closing section 71 closes the chucks 69 and 70, gripping the 25 substrates W2. In step S13, the substrates W2 are rotated 180 degrees, causing the position of each substrate W2 to move by half a pitch. Therefore, when the chucks 69 and 70 are closed, the 25 substrates W2 are positioned in the 25 V-shaped holding grooves 78.

[0137] Subsequently, the lifting section 73 raises the chucks 69 and 70. This causes the second transport mechanism WTR2 to lift the 25 substrates W2 held by the pusher 65.

[0138] Refer to Figure 13(b). Subsequently, the second transport mechanism WTR2 transports 25 substrates W2 at once between the upper and lower chucks 81 and 83 of the attitude changing unit 63. After the second transport mechanism WTR2 has transported 25 substrates W2, the pusher 65 will no longer be holding the substrates W. Therefore, the first transport mechanism WTR1 can transport the next 50 substrates W from either of the lifters LF3 or LF6 to the pusher 65.

[0139] [Step S19] Transfer of the circuit board (W2) to the attitude change unit. Refer to Figure 13(c). Figures 13(c) and 13(d) are front views of the second attitude changing mechanism 31. The 25 substrates W2 held by chucks 69 and 70 are positioned between the upper and lower chucks 81 and 83. The auxiliary chucks 85 and 86 are closed to hold the substrates W2 in a vertical position. The auxiliary chucks 85 and 86 are moved from the contact position (state in Figure 7(b)) to the standby position (state in Figure 7(a)) by the retractable part 88.

[0140] Subsequently, the lifting section 73 of the second transport mechanism WTR2 lowers the 25 substrates W2 held by the chucks 69 and 70 until the 25 V-shaped holding grooves 97 of each of the auxiliary chucks 85 and 86 hold the 25 substrates W2. Then, the upper chuck moving section 84 lowers the upper chuck 81. As a result, the 25 substrates W2 are held (gripped) by the upper and lower chucks 81 and 83 and the auxiliary chucks 85 and 86.

[0141] Subsequently, the opening / closing section 71 of the second transport mechanism WTR2 opens the chucks 69 and 70. This releases the 25 substrates W2, and the 25 substrates W2 are transferred to the attitude changing section 63. Then, the lifting section 73 of the second transport mechanism WTR2 raises the chucks 69 and 70 to a position above the substrates W where they do not interfere with the attitude changing section 63.

[0142] [Step S20] Contact of the mounting surface with the substrate (W2) Subsequently, the retractable section 88 brings the 25 substrates W2, each held in one of the 25 V-shaped holding grooves 97, into contact with the mounting surfaces 95 of the horizontal guide grooves 93 and 94 (see Figures 7(a) and 7(b)).

[0143] [Step S16] Posture change by the posture change unit Refer to Figure 13(d). Subsequently, the upper and lower chuck rotation unit 89 of the attitude change unit 63 rotates the upper and lower chucks 81, 83, etc., which hold the 25 substrates W2, 90 degrees counterclockwise around the horizontal axis AX9. This changes the orientation of the 25 substrates W2 from vertical to horizontal. After the 90-degree rotation, the auxiliary chuck opening / closing unit 87 opens the auxiliary chucks 85, 86 to the position shown by the dashed line in Figure 5.

[0144] [Step S17] Transport of the substrate (W2) by the center robot After opening the auxiliary chucks 85 and 86, the center robot CR sequentially removes the 25 horizontally positioned substrates W2 and transports them to either the first single-wafer processing chamber SW1 or the second single-wafer processing chamber SW2.

[0145] [Step S06] First sheet-fed processing Let's return to the explanation of the flowchart in Figure 8. For example, the center robot CR transports the substrates W (W1, W2) from the attitude change unit 63 to the first single-wafer processing chamber SW1. The first single-wafer processing chamber SW1 rotates the substrate W with the device surface facing upward using, for example, the rotation processing unit 45, while supplying pure water to the device surface from the nozzle 47. Subsequently, the first single-wafer processing chamber SW1 supplies IPA to the device surface (upper surface) of the substrate W from the nozzle 47 to replace the pure water in the substrate W with IPA.

[0146] [Step S07] Second sheet-fed processing (drying process) Subsequently, the central robot CR removes the substrate W, which is wet with IPA, from the first single-wafer processing chamber SW1 (SW2) and transports the substrate W to either the single-wafer processing chamber SW3 or SW4. Each of the single-wafer processing chambers SW3 and SW4 dries the substrate W using supercritical carbon dioxide (supercritical fluid). This drying process using supercritical fluid suppresses the collapse of the pattern on the patterned surface of the substrate W.

[0147] [Step S08] Transfer of substrate from buffer unit to carrier The central robot CR transports the dried substrates W from either the single-wafer processing chamber SW3 or SW4 to one of the loading shelves in the buffer section 33. When one lot (25 substrates) of substrates W1 are transported to the buffer section 33, the batch transport mechanism HTR transports all 25 substrates W1 at once from the buffer section 33 into the empty first carrier C placed on shelf 13A. Subsequently, the carrier transport mechanism 11 in the stocker block 3 transports the first carrier C to the load port 9.

[0148] Furthermore, once a batch of substrates W2 is placed in the buffer section 33, the batch transport mechanism HTR transports all 25 substrates W2 at once from the buffer section 33 into the empty second carrier C placed on the shelf 13A. Subsequently, the carrier transport mechanism 11 in the stocker block 3 transports the second carrier C to the load port 9. An external transport mechanism (not shown) transports the two carriers C sequentially to their next destinations.

[0149] In this embodiment, the batch processing area R1, the single-wafer processing area R3, and the single-wafer substrate transport area R2 are formed to extend from the transfer block 5 side. The six batch processing tanks BT1 to BT6 are arranged in the front-to-back direction X along which the batch processing area R1 extends. The four single-wafer processing chambers SW1 to SW4 are also arranged in the front-to-back direction X along which the single-wafer processing area R3 extends. A center robot CR is provided in the single-wafer substrate transport area R2, which is sandwiched between the six batch processing tanks BT1 to BT6 and the four single-wafer processing chambers SW1 to SW4. The first transport mechanism WTR1 is provided in the batch substrate transport area R4 along the six batch processing tanks BT1 to BT6. Therefore, the substrate processing apparatus 1 of this embodiment can smoothly transport the substrates W.

[0150] Let me explain in detail. The transfer block 5's batch transport mechanism HTR can take out multiple substrates W from the carrier C all at once and transport those multiple substrates W to the first posture change mechanism 15 all at once. The first transport mechanism WTR1 transports multiple substrates W between the substrate transfer position PP, the batch processing tanks BT1 to BT6, and the second posture change mechanism 31. The center robot CR transports substrates W between the second posture change mechanism 31, the four single-wafer processing chambers SW1 to SW4, and the buffer section 33. The batch transport mechanism HTR also receives multiple substrates W from the buffer section 33 all at once and stores those multiple substrates W in the carrier C all at once.

[0151] Therefore, multiple substrates W can be transported directly from the transfer block 5 to the batch substrate processing area R1 without being transported to the single-wafer processing area R3 before being transported to the batch substrate processing area R1. In addition, the batch transport mechanism HTR transports multiple substrates W in a batch between the carrier C, the first attitude change mechanism 15, and the buffer section 33 without accessing each single-wafer processing chamber SW1 to SW4. This allows for rapid transport of multiple substrates W from the carrier C to the first attitude change mechanism 15, and also rapid transport of multiple substrates W from the buffer section 33 to the carrier C. Thus, the substrate processing apparatus 1 of this embodiment can transport substrates W smoothly. As a result, throughput can be improved. Furthermore, since the single-wafer processing chambers SW1 to SW4 are provided in the direction in which the single-wafer substrate transport area R2 extends, a large number of single-wafer processing chambers can be provided.

[0152] Furthermore, the second attitude changing mechanism 31 is located on the opposite side of the transfer block 5, via six batch processing tanks BT1 to BT6. For example, the center robot CR transports multiple substrates W in a single batch from batch processing tank BT1 (BT4) on the side closer to the transfer block 5, through batch processing tank BT5 (BT6) on the side further away from the transfer block 5, to the second attitude changing mechanism 31.

[0153] Multiple substrates W can be transported from the transfer block 5 to the second attitude change mechanism 31 while batch processing is performed in the batch processing tanks BT1 to BT6. Then, while single-wafer processing is performed in the single-wafer processing chambers SW1 to SW4, multiple substrates W can be transported from the second attitude change mechanism 31 to the transfer block 5. As a result, multiple substrates W can be transported in a circular motion within the processing block 7, thereby enabling smooth transport of the substrates W.

[0154] Furthermore, the second attitude changing mechanism 31 includes a pusher 65 that holds multiple substrates W in a vertical orientation that have been conveyed by the first conveying mechanism WTR1, a second conveying mechanism WTR2 that can remove two or more substrates W from the multiple substrates W held by the pusher 65, and an attitude changing unit 63 that collectively changes the orientation of the two or more substrates W removed by the second conveying mechanism WTR2 from a vertical orientation to a horizontal orientation. As a result, the attitude changing unit 63 can perform an attitude change on the two or more substrates W removed by the second conveying mechanism WTR2. [Example 2]

[0155] Next, Embodiment 2 of the present invention will be described with reference to the drawings. Descriptions that overlap with those in Embodiment 1 will be omitted. Figure 14(a) is a longitudinal cross-sectional view showing the pusher mechanism 61 of the second attitude changing mechanism 31 according to Embodiment 2. Figure 14(b) is a plan view showing the second attitude changing mechanism 31 according to Embodiment 2.

[0156] Refer to Figure 14(a). The pusher mechanism 61 of the second attitude changing mechanism 31 of Embodiment 2 includes a standby tank 107 for storing liquid and two ejection pipes 109 for supplying, for example, pure water (DIW) as the liquid to the standby tank 107, so that the substrate W held by the pusher 65 is immersed in the liquid when the pusher 65 is lowered. The ejection pipes 109 are formed to extend linearly in the front-rear direction X or the width direction Y. The ejection pipes 109 are equipped with a plurality of nozzles 109A (holding nozzles) in the direction in which the ejection pipes 109 extend. Each of the plurality of nozzles 109A ejects pure water. The standby tank 107 stores the pure water ejected by the ejection pipes 109.

[0157] For example, as shown in Figure 11(d), when the attitude change unit 63 is performing an attitude change on the substrate W1, the waiting substrate W2 can be immersed in the pure water in the standby tank 107 to prevent the substrate W from drying out.

[0158] Note that the standby tank 107 does not need to store pure water. In this case, the nozzle 109A of the ejection pipe 109 may supply pure water to the substrate W held by the pusher 65 in a shower or mist manner. Also, the nozzle 109A may be positioned higher than the substrate W, as shown by the dashed line ejection pipe 109 in Figure 14(a). When pure water is supplied to the substrate W in a shower or mist manner, the standby tank 107 may or may not be provided.

[0159] Next, refer to Figure 14(b). The second attitude changing mechanism 31 includes a first group of nozzles 111 and a second group of nozzles 112. Nozzles 111 and 112 are nozzles for the attitude changing unit 63. Nozzles 111 and 112 each supply, for example, pure water (DIW) as a liquid in a shower or mist form to the substrate W held by the upper and lower chucks 81 and 83 of the attitude changing unit 63. In a plan view, the first group of nozzles 111 and the second group of nozzles 112 are arranged to sandwich the substrate W. The nozzles 111 and 112 are positioned higher than the substrate W. The nozzles 111 and 112 may also be configured to be movable so as not to interfere with the second transport mechanism WTR2.

[0160] The upper and lower chuck rotating section 89 positions the substrate W held by the upper and lower chucks 81 and 83 in either a vertical or oblique position. In this state, the nozzles 111 and 112 supply pure water in a shower or mist form to the substrate W held by the upper and lower chucks 81 and 83. The oblique position is the position in which the device surface of the substrate faces upward.

[0161] For example, when the center robot CR interrupts the transport of the substrate W, drying of the substrate W held by the upper and lower chucks 81 and 83 can be prevented. Also, when the substrate W is in a horizontal position during supply, it is difficult for the shower-like or mist-like pure water to reach the entire surface of the device. However, by positioning the substrate W in either a vertical position or an upward-facing inclined position, the shower-like or mist-like pure water can more easily reach the entire surface of the device.

[0162] The substrate processing apparatus 1 may employ both the configuration shown in Figure 14(a) and the configuration shown in Figure 14(b). Alternatively, the substrate processing apparatus 1 may employ only one of the configurations shown in Figure 14(a) or Figure 14(b). [Example 3]

[0163] Next, Embodiment 3 of the present invention will be described with reference to the drawings. Descriptions that overlap with Embodiments 1 and 2 will be omitted. Figure 15 is a plan view showing the schematic configuration of the substrate processing apparatus 1 according to Embodiment 3. Figures 16(a) and 16(b) are side views illustrating the buffer sections 114 and 116 according to Embodiment 3.

[0164] In Examples 1 and 2, the buffer section 33 is fixed to the floor surface at the boundary between the transfer block 5 and the single-wafer substrate transport area R2 without moving. In contrast, the two buffer sections 114 and 116 of Example 3 are movable in the front-to-back direction X along which the single-wafer substrate transport area R2 extends.

[0165] Refer to Figures 15 and 16(a). The substrate processing apparatus 1 comprises a first buffer section 114, a second buffer section 116, a horizontal movement section 118, and a horizontal movement section 120. The two buffer sections 114 and 116 each comprise a plurality (e.g., 25) of mounting shelves arranged at predetermined intervals (full pitch) in the vertical direction Z. The horizontal movement sections 118 and 120 correspond to the mounting section moving mechanisms of the present invention, respectively. In Figure 15, the horizontal movement section 120 is shown as being cut off midway, but the horizontal movement section 120 is configured similarly to the horizontal movement section 118.

[0166] Two buffer sections 114 and 116 are movably mounted in the single-wafer substrate transport area R2. A horizontal movement section 118 moves the first buffer section 114 in the forward / backward direction X. A horizontal movement section 120 moves the second buffer section 116 in the forward / backward direction X. Each of the two horizontal movement sections 118 and 120 is equipped with a linear actuator including an electric motor. Each of the horizontal movement sections 118 and 120 is mounted so as not to interfere with the center robot CR.

[0167] As shown in Figure 16(a), the buffer units 114 and 116 are moved, for example, between the vicinity of the fourth sheet processing chamber SW4 and the boundary between the sheet substrate transport area R2 and the transfer block 5. This will be explained in detail. The buffer units 114 and 116 are moved, for example, between the recovery position PP2 and the batch return position PP3.

[0168] The recovery position PP2 is the position adjacent to the transfer block 5 side of the fourth sheet-fiber processing chamber SW4 when viewed from the width direction Y (see Figure 16(a)). Alternatively, the recovery position PP2 is the position between the nearest fourth sheet-fiber processing chamber SW4 and the transfer block 5 when viewed from the width direction Y, and is further from the transfer block 5 than the batch return position PP3. The batch return position PP3 is a position accessible by the batch transport mechanism HTR, and is closer to the transfer block 5 than the recovery position PP2. Both positions PP2 and PP3 are preset positions.

[0169] The substrate processing apparatus 1 of Embodiment 3 operates as follows. For example, the horizontal movement unit 118 moves the first buffer unit 114 to the recovery position PP2.

[0170] The central robot CR transports the substrate W1, which has been dried in either the single-wafer processing chamber SW3 or SW4, to the first buffer section 114. Since the central robot CR does not need to move close to the batch transport robot HTR, the transport efficiency of the substrate W can be improved.

[0171] When 25 substrates W1 are transported to the first buffer unit 114, the horizontal movement unit 118 moves the first buffer unit 114 from the retrieval position PP2 to the bulk return position PP3. Subsequently, the bulk transport mechanism HTR transports the 25 substrates W1 in bulk from the first buffer unit 114 to the empty carrier C placed on the shelf 13A. When the first buffer unit 114 becomes empty, the horizontal movement unit 118 moves the empty first buffer unit 114 from the bulk return position PP3 to the retrieval position PP2.

[0172] After 25 substrates W1 are transported to the first buffer section 114, the center robot CR transports the substrates W2, which have been dried in either the single-wafer processing chamber SW3 or SW4, to the second buffer section 116 at the recovery position PP2.

[0173] When 25 substrates W2 are transported to the second buffer unit 116, the horizontal movement unit 120 moves the second buffer unit 116 from the retrieval position PP2 to the bulk return position PP3. Subsequently, the bulk transport mechanism HTR transports the 25 substrates W2 in bulk from the second buffer unit 116 to the empty carrier C placed on the shelf 13A. When the second buffer unit 116 becomes empty, the horizontal movement unit 120 moves the second buffer unit 116 from the bulk return position PP3 to the retrieval position PP2. In this way, the movement of the two buffer units 114 and 116 is repeated.

[0174] Next, a modified example of Embodiment 3 will be described. In Embodiment 3, the two buffer units 114 and 116 were moved between a preset retrieval position PP2 (a fixed position) and a combined return position PP3. In this regard, the retrieval position PP2 may not be set, and the two buffer units 114 and 116 may each be moved to follow the center robot CR.

[0175] As shown in Figure 16(b), the horizontal movement unit 118 moves the first buffer unit 114 in the forward / backward direction X to follow the center robot CR. The horizontal movement unit 120 also moves the second buffer unit 116 in the forward / backward direction X to follow the center robot CR. As a result, each buffer unit 114 and 116 moves in accordance with the center robot CR, allowing the center robot CR to quickly transport the substrate W to each buffer unit 114 and 116.

[0176] For example, when a predetermined number of substrates W1 (W2) (e.g., 25) are transported to the first buffer unit 114, the horizontal movement unit 118 moves the first buffer unit 114 to the batch return position PP3. As a result, the batch transport mechanism HTR can return the 25 substrates W1 (W2) to the carrier C. When the first buffer unit 114 is emptied by the batch transport mechanism HTR, the horizontal movement unit 118 moves the first buffer unit 114 again in the forward / backward direction X to follow the center robot CR.

[0177] Furthermore, according to this embodiment, the buffer sections 114 and 116 are each provided so as to be movable in the single-wafer substrate transport area R2. The horizontal movement sections 118 and 120 move the buffer sections 114 and 116 in the direction in which the single-wafer substrate transport area R2 extends. Since the buffer sections 114 and 116 are moved by the horizontal movement sections 118 and 120, the center robot CR does not need to move close to the batch transport mechanism HTR, thereby improving the transport efficiency of the substrates W.

[0178] Furthermore, the horizontal movement units 118 and 120 move the buffer units 114 and 116 respectively in the front-to-back direction X along which the single-wafer substrate transport area R2 extends, so as to follow the center robot CR. Since each buffer unit 114 and 116 moves in accordance with the center robot CR, the center robot CR can quickly transport the substrate W to each buffer unit 114 and 116. [Example 4]

[0179] Next, Embodiment 4 of the present invention will be described with reference to the drawings. Note that explanations that overlap with Embodiments 1 to 3 will be omitted. Figure 17 is a plan view showing the schematic configuration of the substrate processing apparatus 1 according to Embodiment 4.

[0180] In Examples 1 to 3, the second attitude changing mechanism 31 was provided on the opposite side of the transfer block 5, with six batch processing tanks BT1 to BT6 in between. The position of the second attitude changing mechanism 31 is not limited to this. For example, in Example 4, the second attitude changing mechanism 31 may be provided between two batch processing tanks BT5 and BT6 among a plurality (e.g., six) of batch processing tanks BT1 to BT6. Note that the two batch processing tanks are not limited to batch processing tanks BT5 and BT6.

[0181] Refer to Figure 17. The second attitude changing mechanism 31 is located between the two batch processing tanks BT5 and BT6. That is, the second attitude changing mechanism 31 is positioned between the three batch processing tanks BT1, BT2, and BT5 and the three batch processing tanks BT3, BT4, and BT6. In addition, the washing processing tanks BT5 and BT6 are positioned on both sides of the second attitude changing mechanism 31.

[0182] In Figure 17, the first transport mechanism WTR1 transports multiple substrates W in a single batch from the batch processing tank BT1 closer to the transfer block 5 to the second attitude changing mechanism 31, and also transports multiple substrates W in a single batch from the batch processing tank BT4 further away from the transfer block 5 to the second attitude changing mechanism 31. That is, multiple substrates (for example, 50) are transported in the order of one of the two chemical treatment tanks BT1 and BT2, and then to the water washing tank BT5, and also in the order of one of the two chemical treatment tanks BT3 and BT4, and then to the water washing tank BT6.

[0183] In this embodiment, since the second posture changing mechanism 31 is provided between the two batch processing tanks BT5 and BT6, the distance from the second posture changing mechanism 31 to each single-wafer processing chamber SW1 to SW4 can be made relatively uniform. As a result, the center robot CR can transport the substrate W from near the center of the single-wafer substrate transport area R2. Therefore, the travel distance of the center robot CR can be reduced, and the transport efficiency of the substrate W can be improved. [Example 5]

[0184] Next, Embodiment 5 of the present invention will be described with reference to the drawings. Note that explanations that overlap with Embodiments 1 to 4 will be omitted. Figure 18 is a plan view showing the schematic configuration of the substrate processing apparatus 1 according to Embodiment 5.

[0185] In Examples 1 to 3, the second attitude changing mechanism 31 was located on the opposite side of the transfer block 5, with six batch processing tanks BT1 to BT6 in between. The position of the second attitude changing mechanism 31 is not limited to this. For example, in Example 5, the second attitude changing mechanism 31 is located between the transfer block 5 and a plurality (e.g., six) batch processing tanks BT1 to BT6.

[0186] Refer to Figure 18. The second attitude change mechanism 31 is adjacent to the transfer block 5. The batch substrate transport mechanism WTR1 transports multiple substrates W at once from the batch processing tank BT1 (BT3) on the side furthest from the transfer block 5, through the batch processing tank BT5 (BT6) on the side closer to the transfer block 5, to the second attitude change mechanism 31.

[0187] In this embodiment, the second attitude changing mechanism 31 is positioned near the transfer block 5. Therefore, the substrate W can be transported with the transfer block 5 as the starting point. In addition, since the chemical treatment tanks BT1 to BT4 can be placed at a distance from the transfer block 5, adverse effects such as corrosion of mechanisms such as the HTR, the bulk transport mechanism of the transfer block 5, due to the chemical atmosphere can be suppressed. Furthermore, many single-wafer processing chambers SW1 to SW4 can be arranged along the single-wafer substrate transport area R2.

[0188] The present invention is not limited to the embodiments described above, and can be modified and implemented as follows.

[0189] (1) In each of the embodiments described above, the electrical equipment area R5 of the substrate processing apparatus 1 in Figure 1 was adjacent to the stocker block 3. In this respect, the electrical equipment area R5 of the substrate processing apparatus 1 in Figure 19 does not have to be adjacent to the stocker block 3. That is, one end of the electrical equipment area R5 in Figure 19 may be adjacent to the transfer block 5 and may extend in the front-to-back direction X to the single-wafer processing area R3.

[0190] (2) In each of the embodiments and modifications described above, the guide rail of the horizontal movement section 41 of the center robot CR is provided on the floor surface of the single-wafer substrate transport area R2. Alternatively, as shown in Figure 20, the guide rail 41A of the horizontal movement section 41 of the center robot CR may be provided above the single-wafer substrate transport area R2, and the lifting and rotating section 39 of the center robot CR may be suspended upside down from the guide rail 41A.

[0191] The central robot CR comprises a main mechanism 123 (two hands 35A, 35B, a forward / backward section 37, and a lifting / rotating section 39) and a horizontal movement section 41. The horizontal movement section 41 includes, for example, a guide rail 41A, a slider 41B, a screw shaft, and an electric motor. The guide rail 41A is provided above the single-wafer substrate transport area R2 and along the single-wafer substrate transport area R2 in the front-rear direction X. For example, the guide rail 41A is provided on the ceiling surface 125 of the single-wafer substrate transport area R2 (or processing block 7). Note that the guide rail 41A corresponds to the upper rail of the present invention.

[0192] The main body of the mechanism 123 is suspended from the guide rail 41A and moves in the forward / backward direction X along the guide rail 41A. This prevents droplets falling from the wet substrate W from contaminating, for example, the forward / backward section 37 and the lifting / rotating section 39. For example, contamination of the forward / backward section 37, etc., with droplets could cause the center robot CR to malfunction, but this can be prevented.

[0193] As shown in Figure 20, when the first hand 35A is positioned above the second hand 35B, the first hand 35A is used to transport the substrate W after drying, and the second hand 35B is used to transport the wet substrate W from the second posture changing mechanism 31 to one of the single-wafer processing chambers SW3 or SW4.

[0194] (3) In each of the embodiments and modifications described above, the single-wafer processing chambers SW3 and SW4 dried the substrate W using a supercritical fluid. In this regard, each of the single-wafer processing chambers SW3 and SW4 may be equipped with a rotation processing unit 45 and a nozzle 47, similar to each of the single-wafer processing chambers SW1 and SW2. In this case, each of the single-wafer processing chambers SW1 to SW4 supplies pure water and IPA to the substrate W in that order, for example, and then performs drying (spin drying) of the substrate W.

[0195] (4) In each of the embodiments and modifications described above, the second attitude changing mechanism 31 was configured as shown in Figure 4(a). However, for example, the second attitude changing mechanism 31 may be configured as having the same configuration as the first attitude changing mechanism 15 shown in Figures 3(a) to 3(f).

[0196] (5) In each of the embodiments and modifications described above, each batch processing tank BT1 to BT6 processed 50 substrates W arranged in a half-pitch and face-to-face manner. However, each batch processing tank BT1 to BT6 may process substrates W arranged in a face-to-back manner, where the device faces of all substrates W face the same direction. Each batch processing tank BT1 to BT6 may process 25 substrates W in one carrier C arranged at full pitch. Note that in Figure 11(b), when 50 substrates W are arranged in a face-to-back manner, the opening / closing unit 71 removes 25 substrates W1 or 25 substrates W by moving the two chucks 69 and 70 in the front-to-back direction X where the substrates W are aligned. [Explanation of Symbols]

[0197] 1 ... Substrate processing equipment 3… Storage block 5… Transfer Block 7 ... Processing block 13A ... Shelf HTR… Single-transport mechanism 15 ... First attitude change mechanism PP… Circuit board handover location R1 ... Batch processing area R2 ... Single-wafer substrate transport area R3 ... Single-wafer processing area R4 ... Batch substrate transport area 31… Second attitude change mechanism BT1~BT6 ... Batch processing tanks SW1~SW4 ... Single-wafer processing chamber CR... Center Robot 33 … Buffer section 41 … Horizontal moving part 41A ... Guide rail WTR1… First conveying mechanism 59 ... Control Unit 61… Pusher mechanism WTR2… Second transport mechanism 63 ... Posture change unit 114,116… Buffer section 118,120 … Horizontal moving part 123 ... Main body of the mechanism 125 ... Ceiling surface

Claims

1. A substrate processing apparatus that continuously performs batch processing, which processes multiple substrates at once, and single-wafer processing, which processes substrates one by one, Storage block and A transfer block adjacent to the aforementioned stocker block, A processing block adjacent to the aforementioned transfer block, It comprises a substrate mounting section for mounting multiple substrates in a horizontal position with predetermined intervals between them in the vertical direction, The stocker block houses at least one carrier for storing multiple substrates in a horizontal position with predetermined intervals between them in a vertical direction, and includes at least one carrier rack for substrate removal and storage on which the carrier is placed for loading and unloading substrates from the carrier. The transfer block includes a substrate handling mechanism for simultaneously removing and storing multiple substrates on a carrier placed on the carrier rack, It comprises a first attitude change mechanism that simultaneously changes the attitude of multiple circuit boards from a horizontal to a vertical orientation, The processing block includes a batch processing area extending away from the transfer block, A sheet-wafer processing area having one end located close to the transfer block and the other end extending away from the transfer block, Interposed between the batch processing area and the single-wafer processing area is a single-wafer substrate transport area, with one end adjacent to the transfer block and the other end extending away from the transfer block. The system includes a batch substrate transport area provided along the batch processing area, with one end extending to the transfer block and the other end extending away from the transfer block, The batch processing area is provided with multiple batch processing tanks arranged in the direction extending over the area for immersing multiple substrates at once, and further, a second attitude change mechanism is provided for changing the attitude of multiple substrates at once from a vertical to a horizontal position. The aforementioned single-wafer processing region is provided with a single-wafer processing chamber that processes substrates one by one in the direction in which the region extends. The single-wafer substrate transport area is provided with a single-wafer substrate transport mechanism that transports the substrate between the second attitude changing mechanism, the single-wafer processing chamber, and the substrate placement section. The batch substrate transport area is provided with a batch substrate transport mechanism that transports multiple substrates at once between a substrate transfer position determined within the transfer block, the multiple batch processing tanks, and the second attitude conversion mechanism. Furthermore, the substrate handling mechanism of the transfer block is characterized in that it transports multiple substrates together to the first attitude changing mechanism and also transports multiple substrates together from the substrate mounting section.

2. In the substrate processing apparatus according to claim 1, The substrate processing apparatus is characterized in that the second attitude changing mechanism is provided on the opposite side of the transfer block via the plurality of batch processing tanks.

3. In the substrate processing apparatus according to claim 1, The substrate processing apparatus is characterized in that the second attitude changing mechanism is provided between two of the plurality of batch processing tanks.

4. In the substrate processing apparatus according to claim 1, The substrate processing apparatus is characterized in that the second attitude changing mechanism is provided between the transfer block and the plurality of batch processing tanks.

5. In the substrate processing apparatus according to any one of claims 1 to 4, The substrate processing apparatus is characterized in that the substrate mounting section is fixedly provided at the boundary between the transfer block and the single-wafer substrate transport area, the transfer block, or the single-wafer substrate transport area.

6. In the substrate processing apparatus according to any one of claims 1 to 4, It is further equipped with a mounting section movement mechanism, The substrate mounting section is movably provided in the single-wafer substrate transport area, The substrate processing apparatus is characterized in that the mounting section moving mechanism moves the substrate mounting section in the direction in which the single-wafer substrate transport area extends.

7. In the substrate processing apparatus according to claim 6, The substrate processing apparatus is characterized in that the mounting portion moving mechanism moves the substrate mounting portion in the direction in which the single-wafer substrate transport area extends, so as to follow the single-wafer substrate transport mechanism.

8. In the substrate processing apparatus according to any one of claims 1 to 4, The single-wafer substrate transport mechanism comprises a mechanism body and an upper rail provided above and along the single-wafer substrate transport area. The substrate processing apparatus is characterized in that the main body of the mechanism is suspended from the upper rail and is configured to move along the upper rail.

9. In the substrate processing apparatus according to any one of claims 1 to 4, The second attitude changing mechanism includes a substrate holding section that holds multiple substrates in a vertical orientation that have been transported by the batch substrate transport mechanism, A substrate extraction mechanism capable of extracting two or more substrates from the plurality of substrates held by the substrate holding portion, A substrate processing apparatus comprising: an attitude conversion unit that collectively converts the orientation of the two or more substrates removed by the substrate removal mechanism from a vertical orientation to a horizontal orientation.

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