Installation mode determination system

Abstract

To enable automatic determination of mounting in a normal mode in each mounting point or mounting in a high accuracy mode in accordance with a current situation of a substrate before the mounting of a component.SOLUTION: A mounting mode determination system 10 of the present disclosure, is the mounting mode determination system 10 in a production line containing a mounting machine 14 that can switch a normal mode that normal mounting is performed and a high accuracy mode that mounting accuracy is higher than that of the normal mode as a mounting mode for mounting a component P to a substrate B. The mounting mode determination system 10 comprises: a data generation part 53 that generates state data of a circumference of a mounting location where the component P is mounted on the basis of a state of the current substrate B; and a mode determination part 54 that determines whether it is mounted in the normal mode in each mounting point on the basis of at least the state data or it is mounted in the high accuracy mode.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a mounting mode determination system.

Background Art

[0002] Component mounters for mounting components on a substrate usually have a normal mode and a high-precision mode that sacrifices tact but emphasizes mounting accuracy more than the normal mode. In fact, whether to use the high-precision mode is left to the judgment of the operator. Therefore, as a device that automatically sets whether to use the high-precision mode based on the peripheral situation data of the components mounted on the substrate, the device described in Japanese Patent Application Laid-Open No. 2020-129695 (hereinafter referred to as Patent Document 1) is known.

[0003] This device has a management computer. The CPU of the management computer sets the required accuracy for each mounting order of the sequence and allocates the sequence to a mounter having a specification accuracy capable of realizing the set required accuracy. Next, the required accuracy setting routine executed by the CPU of the management computer will be described. When the CPU of the management computer starts the required accuracy setting routine, first, it creates overall image data corresponding to the current sequence. The overall image data is data indicating where each component is arranged on the substrate when the components are mounted according to the sequence. For example, in the overall image data, when there are already peripheral components before the target component is mounted, the CPU calculates the distance between the mounting area of the peripheral component and the mounting area of the target component, that is, the component-to-component distance, as the peripheral situation data, and sets the required accuracy of the target component based on that component-to-component distance.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the above-mentioned device does not create peripheral situation data based on the actual position of the circuit board lands and the width of the solder before the components are mounted, but rather creates peripheral situation data based on overall data according to the sequence. Therefore, the required accuracy may be set in a way that does not match the actual conditions of the circuit board on which the components will be mounted. [Means for solving the problem]

[0006] The mounting mode determination system of the present disclosure is a mounting mode determination system in a production line including a mounting machine that can switch between a normal mode in which a normal mounting is performed and a high-precision mode in which the mounting accuracy is higher than that of the normal mode, as a mounting mode for mounting a component on a substrate, and comprises: a data creation unit that creates state data of the area around the mounting location on which the component is mounted based on the actual state of the substrate, and a mode determination unit that determines, at least for each mounting point, whether to mount in the normal mode or in the high-precision mode based on the state data. [Effects of the Invention]

[0007] According to this disclosure, it is possible to automatically determine whether to mount each mounting point in normal mode or in high-precision mode based on the actual condition of the substrate. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a diagram showing the configuration of the mounted mode determination system. [Figure 2] Figure 2 is a plan view of the mounting machine. [Figure 3] Figure 3 is a schematic diagram showing how parts picked up by the suction nozzle are transported. [Figure 4] Figure 4 is a block diagram showing the electrical configuration of the mounted mode determination system. [Figure 5]Figure 5 is a schematic diagram illustrating how the mounting mode is switched depending on the distance between a pair of lands. [Figure 6] Figure 6 is a schematic diagram showing how the mounting mode is switched depending on the lead pitch of the leaded component. [Figure 7] Figure 7 is a schematic diagram showing how the mounting mode is switched depending on the solder width of the solder applied to the substrate. [Figure 8] Figure 8 is a schematic diagram showing an implementation program that switches the mounting mode for each mounting point. [Figure 9] Figure 9 is a flowchart showing the procedure for switching the mounting mode based on the coating condition data created by the inspection machine. [Modes for carrying out the invention]

[0009] [Description of Embodiments in this Disclosure] First, the embodiments of this disclosure will be listed and described. (1) The mounting mode determination system of the present disclosure is a mounting mode determination system in a production line including a mounting machine that can switch between a normal mode in which normal mounting is performed and a high-precision mode in which the mounting accuracy is higher than that of the normal mode as a mounting mode for mounting components on a substrate, and comprises: a data creation unit that creates state data of the area around the mounting location on which the component is mounted based on the actual state of the substrate; and a mode determination unit that determines whether to mount in the normal mode or in the high-precision mode for each mounting point based on at least the state data.

[0010] Generally, mounting machines offer a normal mode and a high-precision mode that provides higher mounting accuracy than the normal mode. However, conventionally, the decision of when to use the high-precision mode was left to the operator. According to the mounting mode determination system described in (1) above, the data creation unit creates state data around the mounting location, and the mode determination unit determines whether to mount in normal mode or high-precision mode for each mounting point based on the state data. This allows for automatic determination of the mounting mode without leaving the decision to the operator. Furthermore, since state data is created based on the actual condition of the circuit board, it is possible to individually determine whether or not to switch to the mounting mode according to the condition of the circuit board.

[0011] (2) Preferably the mounting mode determination system is as described in (1), wherein the state data includes the distance between the narrowest part of a pair of adjacent lands on the substrate before component mounting, and the mode determination unit determines that the component should be mounted in the high-precision mode if the distance between the narrowest parts is less than a predetermined distance.

[0012] When the distance between the narrowest points of adjacent lands becomes small, the distance between the pair of components mounted on these lands also becomes small, which may cause the components to interfere with each other. According to the mounting mode determination system in (2) above, if the distance between the narrowest points of a pair of lands is less than a predetermined distance, the components are mounted in high-precision mode, thus avoiding interference between components.

[0013] (3) Preferably, the mode determination unit is the mounting mode determination system described in (1) or (2), which determines that the component is a leaded component and the lead pitch of the leaded component is less than a predetermined pitch, and that the component is mounted in the high-precision mode.

[0014] When the lead pitch of a leaded component becomes small, mounting defects such as the lead protruding from the land are more likely to occur. According to the mounting mode determination system in (3) above, if the lead pitch is less than a predetermined pitch, mounting is performed in high-precision mode, thus eliminating mounting defects caused by lead pitch.

[0015] (4) The state data includes the solder width which is the width dimension of the solder applied to the lands of the substrate, and when the solder width is less than a predetermined width, the mode determination unit determines that it is mounted in the high-precision mode. The mounting mode determination system according to any one of (1) to (3) is preferable.

[0016] When the solder width becomes small, it is likely to cause a mounting defect in which the component is mounted in a state of protruding from the solder. According to the mounting mode determination system of (4) above, when the solder width is less than a predetermined width, it is mounted in the high-precision mode, so that mounting defects caused by the solder width can be eliminated.

[0017] (5) The production line includes a printing machine, an inspection machine that inspects the state of the solder applied to the substrate by the printing machine and creates the solder application state data, and the mounting machine, and the mode determination unit sets the mounting mode based on the application state data transmitted from the inspection machine to the mounting machine. The mounting mode determination system according to any one of (1) to (4) is preferable.

[0018] According to the mounting mode determination system of (5) above, for example, an accurate solder width can be known from the application state data created by the inspection machine.

[0019] [Details of Embodiments of the Present Disclosure] A specific example of the mounting mode determination system 10 of the present disclosure will be described below with reference to the drawings. Note that the present disclosure is not limited to these examples, and is intended to be shown by the claims and to include all modifications within the meaning and scope equivalent to the claims.

[0020] [Component Mounting Line] Figure 1 shows a component mounting line 11. The component mounting line 11 is a production line that produces component mounted boards with components P mounted on them, and includes a printing press 12, an inspection machine 13, a mounting machine 14, and a reflow oven 15. The printing press 12, inspection machine 13, mounting machine 14, and reflow oven 15 are arranged in this order from the upstream side, and may be referred to as machines below, or as machines 12, 13, 14, and 15.

[0021] Each machine 12, 13, 14, and 15 is connected in series via a conveyor belt 16 (see Figure 2). The conveyor belt 16 transports the circuit board B to be worked on along the component mounting line 11.

[0022] The printing press 12 is a work device that performs a printing process on the circuit board B. The printing process involves printing solder paste onto the circuit board B. The inspection machine 13 is a work device that inspects the circuit board B after the solder has been applied. The mounting machine 14 is a work device that performs the process of mounting components P onto the circuit board B after inspection. The reflow oven 15 is a work device that heats the solder paste to solder the components P onto the circuit board B, thereby completing the component-mounted circuit board.

[0023] The printing press 12, inspection machine 13, mounting machine 14, and reflow oven 15 are connected to the server 18 via LAN 17. The server 18 is a device that manages the component mounting line 11. The server 18 stores production plan information, etc. The production plan information includes the types of substrates B and the types of components P used in production.

[0024] [Implementation machine] Figure 2 is a plan view of the mounting machine 14. The mounting machine 14 includes a pair of transport conveyors 16 arranged on a base 30 to transport the substrate B, component supply units 31 located on both the front and rear sides of both transport conveyors 16, and a component mounting head unit 32 provided above the base 30.

[0025] The parts supply units 31 are located at a total of four locations: the upstream and downstream ends of both the front and rear sides of the two transport conveyors 16. Multiple tape feeders 33, each holding multiple parts P, are arranged in parallel within these parts supply units 31.

[0026] As shown in Figure 3, the head unit 32 is movable between the component supply unit 31 and the circuit board B so that it can pick up components P from the component supply position of the component supply unit 31 and mount them on the circuit board B. Specifically, as shown in Figure 2, the head unit 32 is supported so as to be movable in the X-axis direction by a head unit support member 34 extending in the X-axis direction (the direction indicated by X in Figure 2), and this head unit support member 34 is supported so as to be movable in the Y-axis direction by a pair of guide rails 35 extending in the Y-axis direction (the direction indicated by Y in Figure 2) at both ends thereof. The head unit 32 is driven in the X-axis direction by an X-axis motor 36 and driven in the Y-axis direction by a Y-axis motor 37.

[0027] The head unit 32 has multiple heads 38 mounted in a row along the X-axis. Each head 38 is driven in the Z-axis direction (a direction perpendicular to both the X-axis and Y-axis directions, indicated by Z in Figure 2) by a lifting mechanism powered by a Z-axis motor 39, and is also driven in the rotational direction by a rotational drive mechanism powered by an R-axis motor 40.

[0028] Each head 38 is equipped with a suction nozzle 41 at its tip for picking up components P and mounting them in a predetermined position on the upper surface of the substrate B. Inside the head 38, a pneumatic supply means (not shown) supplies negative pressure during the suction of components P, during the transport of components P, and during the descent of the head 38, and positive pressure at the moment of mounting the components P. The pressure of the air supplied by the pneumatic supply means is measured by a pressure sensor 56 (see Figure 4).

[0029] As shown in Figure 2, part recognition cameras 42 are installed on the front and rear sides of both conveyor belts 16 on the base 30. The part recognition camera 42 captures the suction posture of the part P picked up by the suction nozzle 41 from below in the Z-axis direction, and can obtain an image of the underside of the part P. Near the part recognition camera 42, as shown in Figure 3, an illumination device 43 is provided to illuminate the part P picked up by the suction nozzle 41.

[0030] A side-view camera 44 is installed on the lower surface of the head unit support member 34. The side-view camera 44 extends downward from the center of the lower surface of the head unit support member 34, and at its lower end, it can capture an image of the suction posture of the component P that has been picked up by the suction nozzle 41 from the back in the Y-axis direction, thereby obtaining an image of the side of the component P. The other configurations are the same as those of the component recognition camera 42, and the obtained image is converted into an analog image signal, which is output to the image processing unit 45.

[0031] A pair of circuit board recognition cameras 57 are integrally mounted on both sides of the head unit 32. These circuit board recognition cameras 57 are used to capture images of the fiducial marks on circuit board B and recognize the position of circuit board B. The other configurations are the same as those of the component recognition camera 42, and the obtained images are converted into analog image signals, which are then output to the image processing unit 45.

[0032] [Electrical configuration of the mounted mode determination system] Next, the electrical configuration of the mounted mode determination system 10, centered on the controller 46, will be described with reference to Figure 4. The controller 46 includes an arithmetic processing unit 47, an implementation program storage means 48, a transport system data storage means 49, a motor control unit 50, an external input / output unit 51, an image processing unit 45, an inspection means 52, a data creation unit 53, and a mode determination unit 54. A display unit 55 is connected to the arithmetic processing unit 47, and a pressure sensor 56 is connected to the external input / output unit 51.

[0033] In this embodiment, the mounting program storage means 48, the transport system data storage means 49, the motor control unit 50, the external input / output unit 51, and the image processing unit 45 are provided in the mounting machine 14. The motor control unit 50 is connected to the X-axis motor 36, the Y-axis motor 37, the Z-axis motor 39, and the R-axis motor 40. The motor control unit 50 supplies the voltage and current necessary to drive each motor 36, 37, 39, and 40 based on the mounting program stored in the mounting program storage means 48. As a result, the component P is transported freely in the X-axis, Y-axis, Z-axis, and R-axis directions.

[0034] As shown in Figure 8, the implementation program includes information such as the type of component P, the mounting position of component P, and the type of head 38 to be used. The type of component P includes, for example, chip components and leaded components. Information such as the lead pitch of leaded components can be obtained by referring to the server 18.

[0035] The image processing unit 45 is connected to a component recognition camera 42, a side-view camera 44, and a substrate recognition camera 57. The image processing unit 45 recognizes component P based on the image captured by the component recognition camera 42, and inspects the adsorption state of component P based on this recognized image. The presence or absence of component P may be inspected using the side-view camera 44 instead of the component recognition camera 42, or it may be inspected using both the component recognition camera 42 and the side-view camera 44.

[0036] In this embodiment, the inspection means 52 and the data creation unit 53 are provided in the inspection machine 13, and the mode determination unit 54 is provided in the mounting machine 14. The data creation unit 53 does not necessarily have to be provided in the inspection machine 13; it may also be provided in the printer 12 or the server 18. The mode determination unit 54 does not necessarily have to be provided in the mounting machine 14; it may also be provided in the printer 12 or the server 18.

[0037] The inspection means 52 of the inspection machine 13 inspects the solder application state and the distance between pairs of lands applied to the actual substrate B. The inspection results from the inspection means 52 are transmitted to the data creation unit 53, which creates solder application state data. The solder application state data is transmitted from the data creation unit 53 of the inspection machine 13 to the mounting machine 14, and the mode determination unit 54 of the mounting machine 14 determines whether or not to mount the component P in high-precision mode based on the solder application state data and the type of component P.

[0038] [Example 1: Determination based on the distance between the narrowest parts of a pair of adjacent lands] Figure 5 illustrates how the distance between adjacent pairs of lands determines whether a component should be mounted in normal mode or high-precision mode. Figure 5 shows two first lands 20 on which chip components 23 are mounted, and nine second lands 21 on which each lead 25 of a leaded component 24 is mounted. Between the adjacent first lands 20 and second lands 21, a narrowest point 22 is formed where the distance is shortest. If the distance of the narrowest point 22 is less than a predetermined distance, mounting in normal mode may cause the chip component 23 and the leaded component 24 to collide, potentially resulting in a mounting defect.

[0039] Therefore, in Example 1, based on the inspection results from the inspection machine 13, the data creation unit 53 creates state data of the area around the narrowest part 22, including the distance of the narrowest part 22. If the distance of the narrowest part 22 in the state data is less than a predetermined distance, the mode determination unit 54 determines that it should be mounted in high-precision mode, and the mounting mode for the target chip component 23 and the mounting mode for the lead component 24 in the mounting program stored in the mounting program storage means 48 are switched from normal mode to high-precision mode. When the system switches to high-precision mode, both the mounting of the chip component 23 and the mounting of the lead component 24 are performed in high-precision mode.

[0040] The high-precision mode is a component mounting mode that prioritizes mounting accuracy over the normal mode, for example, to achieve a mounting accuracy of 15 μm, at the expense of cycle time. When mounted in high-precision mode, it is possible to mount components in more precise XY coordinate positions compared to the normal mode. Specific methods for mounting component P in high-precision mode include reducing acceleration immediately before mounting, performing vibration damping control before mark recognition, and performing unidirectional vibration before mounting. In this way, the chip component 23 and lead component 24 can be mounted in their correct positions, and collisions between the chip component 23 and lead component 24 can be avoided.

[0041] [Example 2: Determination based on lead pitch of leaded components] Figure 6 shows how the lead pitch of the lead component 24 determines whether to mount the lead component 24 in normal mode or in high-precision mode. The lead pitch is the distance between the centers of adjacent pairs of leads 25. Figure 6 illustrates the nine second lands 21 on which each lead 25 of the lead component 24 is mounted. If the lead pitch of the lead component 24 is less than a predetermined pitch, mounting in normal mode may result in the leads 25 of the lead component 24 protruding from the second lands 21, leading to a mounting defect.

[0042] Therefore, in Embodiment 2, the lead pitch information of the lead component 24 is obtained by referring to the component information stored in the server 18. If this lead pitch is less than a predetermined pitch, the mode determination unit 54 determines that it should be mounted in high-precision mode, and the mounting mode of the target lead component 24 in the mounting program stored in the mounting program storage means 48 is switched from normal mode to high-precision mode. Once the system switches to high-precision mode, the lead component 24 is mounted in high-precision mode. In this way, the lead component 24 can be mounted in the correct mounting position, and mounting defects in which the leads 25 of the lead component 24 protrude from the second land 21 can be avoided.

[0043] [Example 3: Determination based on the solder width of solder 26] Figure 7 shows how the solder width of the solder 26 applied to the second land 21 determines whether the leaded component 24 is mounted in normal mode or high-precision mode. The solder width is the dimension of the solder 26 in the direction perpendicular to the direction in which the solder 26 extends. In Figure 7, solder 26 is applied to the second land 21, and the solder width of the solder 26 is smaller than the land width of the second land 21. If the solder width of the solder 26 is less than a predetermined width, mounting in normal mode may result in the leads 25 of the leaded component 24 protruding from the solder 26, leading to a mounting defect.

[0044] Therefore, in Example 3, the solder width of the solder 26 is measured based on the inspection results from the inspection machine 13, and the solder application state data of the solder 26, including the solder width, is created by the data creation unit 53. If the solder width of the solder 26 in the application state data is less than a predetermined width, the mode determination unit 54 determines that it should be mounted in high-precision mode, and the mounting mode of the target lead component 24 in the mounting program stored in the mounting program storage means 48 is switched from normal mode to high-precision mode. When it switches to high-precision mode, the mounting of the lead component 24 is performed in high-precision mode. In this way, the lead component 24 can be mounted in the correct mounting position, and mounting defects in which the leads 25 of the lead component 24 protrude from the solder 26 can be avoided.

[0045] [An example of an implementation program that switches mounting modes for each mounting point] Figure 8 shows an example of an implementation program, where "No." indicates the mounting order, "Component" indicates the type of component, "X" indicates the X coordinate of the mounting point, "Y" indicates the Y coordinate of the mounting point, "R" indicates the R coordinate of the mounting point, "Head" indicates the type of head 38 to be used, and "High Precision Mode" indicates the mounting mode. If "High Precision Mode" is "Disabled," it means that the component is mounted in normal mode, and if it is "Enabled," it means that the component is mounted in high precision mode.

[0046] For example, if component C is a leaded component and the lead pitch is less than a predetermined pitch, the mode determination unit 54 determines that it should be mounted in high-precision mode, and the calculation processing unit 47 automatically changes the high-precision mode from disabled to enabled, and the modified mounting program is stored in the mounting program storage means 48. In Figure 8, this is shown as a table, but in reality, it is not displayed on the monitor, and the operator does not set the high-precision mode while looking at the monitor.

[0047] [Determination process for mounting mode based on solder width] Next, the process for determining the mounting mode based on the solder width of the solder 26 will be explained with reference to the flowchart in Figure 9. When the solder 26 is applied to the substrate B by the printing press 12, the substrate B is transported to the inspection machine 13 and the application state of the solder 26 is inspected. The data creation unit 53 creates application state data for the hand 26 based on the inspection results from the inspection machine 13 (step S10).

[0048] The coating state data created by the data creation unit 53 is transmitted from the inspection machine 13 to the mounter (mounting machine 14) (step S11). While mounting is being performed by the mounter (step S12), the target solder information is searched from the coating state data (step S13). If solder information is found (YES in step S14), it is determined whether the solder width is less than a predetermined width. If it is determined to be less than the predetermined width (YES in step S15), mounting is performed in high-precision mode (step S16).

[0049] On the other hand, if no solder information is found in step S14 (NO in step S14), or if it is determined in step S15 that the solder width is not less than the predetermined width (it is greater than or equal to the predetermined width) (NO in step S15), mounting is performed in normal mode (step S17). The processes from step S14 to step S17 are performed for each mounting point.

[0050] [Effects of the Embodiment] The mounting mode determination system 10 of this disclosure is a mounting mode determination system 10 in a component mounting line 11 including a mounting machine 14 that can switch between a normal mode in which a normal mounting is performed and a high-precision mode in which the mounting accuracy is higher than that of the normal mode as a mounting mode for mounting a component P on a substrate B, and comprises a data creation unit 53 that creates state data around the mounting location where the component P is mounted based on the state of the actual substrate B, and a mode determination unit 54 that determines whether to mount in normal mode or in high-precision mode for each mounting point based on at least the state data.

[0051] Generally, mounting machines offer a normal mode and a high-precision mode that provides higher mounting accuracy than the normal mode. However, conventionally, the decision of when to use the high-precision mode was left to the operator. With the above-described mounting mode determination system 10, the data creation unit 53 creates state data for the area around the mounting location, and the mode determination unit 54 determines whether to mount in normal mode or high-precision mode for each mounting point based on the state data. This allows for automatic determination of the mounting mode without leaving the decision to the operator. Furthermore, since state data is created based on the actual state of the substrate B, it is possible to individually determine whether or not to switch to the mounting mode according to the state of the substrate B.

[0052] The status data includes the distance between the narrowest part 22 between a pair of adjacent lands on the substrate B before component mounting. The mode determination unit 54 preferably determines that the component should be mounted in high-precision mode if the distance between the narrowest parts 22 is less than a predetermined distance.

[0053] When the distance between the narrowest parts 22 between adjacent lands decreases, the distance between the pair of components P mounted on these lands also decreases, which may cause the components P to interfere with each other. With the above configuration, if the distance between the narrowest parts 22 between a pair of lands is less than a predetermined distance, the components are mounted in high-precision mode, thus avoiding interference between the components P.

[0054] The mode determination unit 54 preferably determines that the component P is a leaded component 24 and the lead pitch of the leaded component 24 is less than a predetermined pitch, in order to mount it in high-precision mode.

[0055] When the lead pitch of lead component 24 becomes small, mounting defects such as the lead 25 protruding from the land are more likely to occur. With the above configuration, if the lead pitch is less than the predetermined pitch, mounting is performed in high-precision mode, thus eliminating mounting defects caused by the lead pitch.

[0056] The status data includes the solder width, which is the width dimension of the solder 26 applied to the pads on the substrate B. The mode determination unit 54 preferably determines that the board should be mounted in high-precision mode if the solder width is less than a predetermined width.

[0057] When the solder width is small, mounting defects are more likely to occur where the component P is mounted with the solder 26 protruding. With the above configuration, if the solder width is less than the predetermined width, mounting is performed in high-precision mode, thus eliminating mounting defects caused by solder width.

[0058] The component mounting line 11 includes a printing press 12, an inspection machine 13 that inspects the state of the solder 26 applied to the substrate B by the printing press 12 and creates solder application state data for the solder 26, and a mounting machine 14. Preferably, the mode determination unit 54 sets the mounting mode based on the application state data transmitted from the inspection machine 13 to the mounting machine 14.

[0059] According to the above configuration, for example, the exact solder width can be determined from the coating condition data created by the inspection machine 13.

[0060] [Other embodiments] (1) In the above embodiment, an example was given of implementing any one of Examples 1 to 3, but these Examples 1 to 3 may be combined and implemented. For example, even if the distance between the narrowest part 22 between a pair of adjacent lands is greater than or equal to a predetermined distance, if the lead pitch of the lead component 24 used is less than the predetermined pitch, the mode determination unit 54 may determine that it is mounted in high-precision mode.

[0061] (2) In the above embodiment, as in Example 2, the mode determination unit 54 determines that the component should be mounted in high-precision mode when the lead pitch of the lead component 24 is less than a predetermined pitch. However, if the component P used is a lead component 24, the mode determination unit 54 may determine that the component should be mounted in high-precision mode regardless of the size of the lead pitch.

[0062] (3) In the above embodiment, the solder width is measured by the inspection machine 13 after printing, and if the solder width is less than a predetermined width, the mode determination unit 54 determines that the components should be mounted in high-precision mode. However, if there are areas where mounting defects such as component misalignment occur frequently on the inspection machine after reflow, the data creation unit 53 may create state data showing the defect distribution, and based on this state data, the mode determination unit 54 may determine that areas where the defect rate is greater than a predetermined threshold should be mounted in high-precision mode. [Explanation of symbols]

[0063] 10: Mounting mode determination system 11: Component mounting line (production line) 12: Printing machine 13: Inspection machine 14: Mounting machine 15: Reflow oven 16: Conveyor belt 17: LAN 18: Server 20: First land 21: Second land 22: Narrowest part 23: Chip component 24: Lead component 25: Lead 26: Solder 30: Base 31: Parts supply unit 32: Head unit 33: Tape feeder 34: Head unit support member 35: Guide rail 36: X-axis motor 37: Y-axis motor 38: Head 39: Z-axis motor 40: R-axis motor 41: Suction nozzle 42: Parts recognition camera 43: Lighting device 44: Side view camera 45: Image processing unit 46: Controller 47: Calculation processing unit 48: Implementation program storage means 49: Transport system data storage means 50: Motor control unit 51: External input / output unit 52: Inspection means 53: Data creation unit 54: Mode determination unit 55: Display unit 56: Pressure sensor 57: Board recognition camera

Claims

1. A mounting mode determination system in a production line including a mounting machine that can switch between a normal mode in which a normal mounting is performed and a high-precision mode in which the mounting accuracy is higher than that of the normal mode, as a mounting mode for mounting leaded components onto a substrate, Server and The system includes a mode determination unit that obtains lead pitch information of the leaded component by referring to component information stored in the server, and determines whether to mount the component in the normal mode or the high-precision mode at each mounting point based on the lead pitch information, The mounting mode determination system includes a mode determination unit that determines that the component should be mounted in high-precision mode if the lead pitch of the lead component is less than a predetermined pitch.

2. A mounting mode determination system in a production line including a mounting machine that can switch between a normal mode in which components are mounted in the usual manner and a high-precision mode in which the mounting accuracy is higher than that of the normal mode, as a mounting mode for mounting components onto a substrate, A data creation unit creates state data of the area around the mounting location where the component is mounted, based on the actual state of the aforementioned circuit board. The system includes a mode determination unit that determines, at least based on the state data, whether to mount the device in the normal mode or in the high-precision mode at each mounting point, The aforementioned state data includes the solder width, which is the width dimension of the solder applied to the pads on the substrate. The mounting mode determination system includes a mode determination unit that determines to mount in high-precision mode when the solder width is less than a predetermined width.

3. The production line includes a printing press, an inspection machine that inspects the state of the solder applied to the substrate by the printing press and creates solder application state data, and a mounting machine. The mounting mode determination system according to claim 2, wherein the mode determination unit sets the mounting mode based on the coating state data transmitted from the inspection machine to the mounting machine.

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