High-power microscopic chip mounter

Abstract

The invention discloses a high-power microscopic chip mounter which comprises a base, a supporting frame and a carrying table are arranged on the base, a high-power microscope lens and an industrial camera are arranged on the supporting frame, the high-power microscope lens is provided with a plurality of objective lenses capable of being rotatably switched, and the industrial camera is connected with the opposite sides of the objective lenses of the high-power microscope lens; a vacuum transparent suction nozzle is movably arranged on the side edge of the support frame, the vacuum transparent suction nozzle is used for adsorbing a chip, and an objective lens of the high-power microscope lens is positioned above a transparent part of the vacuum transparent suction nozzle; the industrial camera can collect a front image of a substrate located on the carrying table and displayed in an objective lens of the high-power microscope lens and a front image of a chip adsorbed by the vacuum transparent suction nozzle. According to the invention, the objective lens end of the high-power microscope lens capable of rotating and switching different multiplying powers observes the substrate and the patch through the vacuum transparent suction nozzle, so that the high-power microscopic observation of the substrate and the patch is realized, the structure of the chip mounter is simplified, and the production efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a high-magnification micro-mounting machine. Background Technology

[0002] A pick-and-place machine is a device that accurately places surface mount components (SMPs) onto PCB pads by moving a placement head. During placement, a lens captures images of the SMP and the substrate surface. Current pick-and-place machines use lenses with integrated cameras for this purpose. The machine needs to align the SMP with the substrate images before placing the component. However, existing machines involve several steps: after capturing an image of the substrate, the nozzle picks up the SMP and lifts it up; the lens needs to rotate to capture the image from below, requiring rotation of the SMP angle and / or the lens angle. The captured image is then fed back to the machine's control system, which calculates whether the SMP is aligned with the substrate and places it on the substrate. This complex method of capturing images and determining alignment in existing pick-and-place machines negatively impacts production efficiency. Furthermore, most of these lenses are zoom lenses, which have limited image clarity. Also, each pick-and-place machine has only one optical lens, resulting in significant differences in image quality for chips of different sizes, which cannot meet the packaging requirements of different types of chips. Summary of the Invention

[0003] The purpose of this invention is to provide a high-magnification microscopic patching machine, which allows observation of substrates and patches through a vacuum transparent suction nozzle via the objective lens of a high-magnification microscope lens with rotatable and switchable magnification, thereby achieving high-magnification microscopic observation of substrates and patches. The patching machine has a simplified structure and improves production efficiency.

[0004] To solve the above-mentioned technical problems, the technical solution provided by the present invention is: a high-magnification micro-patch machine, including a base, a support frame and a stage on the base, a high-magnification microscope head and an industrial camera on the support frame, the high-magnification microscope head being provided with multiple rotatable and switchable objective lenses, and the industrial camera being connected to the opposite side of the objective lenses of the high-magnification microscope head; a vacuum transparent suction nozzle is movably provided on the side of the support frame, the vacuum transparent suction nozzle being used to adsorb chips, and the objective lens of the high-magnification microscope head being located above the transparent part of the vacuum transparent suction nozzle; the industrial camera is capable of acquiring the front image of the substrate on the stage and the front image of the chip adsorbed by the vacuum transparent suction nozzle as displayed in the objective lens of the high-magnification microscope head.

[0005] This invention employs the aforementioned technical solution. The objective lens of a high-magnification microscope is aligned with the substrate on the stage. An industrial camera acquires the frontal image and contour information of the substrate magnified by the high-magnification microscope. A vacuum transparent nozzle is used to pick up the chip and move it below the high-magnification microscope. The objective lens of the high-magnification microscope is aligned with the transparent portion of the vacuum transparent nozzle. The industrial camera acquires the magnified image from the high-magnification microscope to generate the chip image and contour information, which is then fed back to the control system of the pick-and-place machine. Different magnification objective lenses can be rotated and switched on the high-magnification microscope to achieve different magnification levels, adapting to different substrates and chips. Based on the positioning contour line of the substrate's placement position and the chip's contour, the chip is moved so that it coincides with the contour of the substrate's placement position, achieving rapid and accurate positioning. When acquiring image information of the substrate or chip, the high-magnification microscope takes images from directly above the substrate or chip, simplifying the structure of traditional pick-and-place machines that require rotating lenses and improving production efficiency.

[0006] The aforementioned high-magnification microscopy placement machine also has a chip fixture on its support frame. The chip fixture includes a base, a servo drive mechanism and a clamping mechanism mounted on the base. The servo drive mechanism drives the clamping mechanism to clamp the chip.

[0007] The aforementioned high-magnification micro-mounting machine has a clamping mechanism including a clamping member and a clamping part. The clamping member can be moved onto the base, and the clamping member extends forward to form the clamping part. The tail end of the clamping member is provided with a bearing, and the base is provided with a spring. The two ends of the spring are respectively connected to the base and the clamping member. The servo drive mechanism pushes the bearing through the drive rod to drive the clamping action of the clamping member.

[0008] The aforementioned high-magnification microscopy placement machine includes a servo drive mechanism comprising a servo motor and a lead screw and nut assembly. The servo motor is mounted on the upright plate of the base, and the lead screw and nut assembly is connected to the servo motor. A drive rod is connected to the nut seat of the lead screw and nut assembly. The drive rod is U-shaped, with an inclined surface on the inner side of its U-shape that abuts against a bearing. When the servo motor drives the lead screw and nut assembly, the nut seat moves downward along the lead screw, causing the drive rod connected to it to move downward. The drive rod pushes against the bearing through its U-shaped edge, causing the bearing to drive the clamping components to clamp the chip.

[0009] The aforementioned high-magnification microscopy mounting machine includes a vacuum transparent nozzle comprising a nozzle holder. The nozzle holder has a vacuum channel and an adsorption hole. The vacuum channel communicates with the adsorption hole, and the bottom of the adsorption hole penetrates the nozzle holder, while the top is sealed with a transparent cover. The vacuum transparent channel is connected to a vacuum pump for creating a vacuum or negative pressure state inside the nozzle holder. The bottom of the adsorption hole has an adsorption force to adsorb the chip, forming an optical channel for the high-magnification microscope lens to penetrate and observe the chip.

[0010] The aforementioned high-magnification microparticle mounter has a positioning hole on the side of the nozzle holder. This positioning hole is coaxial with the vacuum channel, and a sealing element is installed on the positioning hole. The coaxial arrangement of the positioning hole and the vacuum channel allows the nozzle holder to be opened to form a vacuum channel, and the sealing element is used to seal the positioning hole, so that the internal sealed environment is maintained during vacuuming, thus forming a vacuum or negative pressure state.

[0011] The aforementioned high-magnification micro-patch machine features a suction nozzle sealed within the suction port. The nozzle has a suction port communicating with the suction port and is made of high-temperature resistant and transparent quartz glass. Because the nozzle is heat-resistant and transparent, the lens, passing through the transparent cover and suction port, allows direct observation of the chip image attached to its base, thus generating the chip image and outline.

[0012] The aforementioned high-magnification microscopy placement machine includes a vacuum transparent nozzle comprising a nozzle holder. The end of the nozzle holder is equipped with a vacuum head, which is made of a transparent, high-temperature resistant material and has internal suction holes. The nozzle holder contains a vacuum channel, and the suction holes are connected to the vacuum channel. The vacuum channel is connected to a vacuum pumping device to create a vacuum or negative pressure state inside the nozzle holder, allowing the suction holes to have suction force to lift the chip. The lens then passes directly through the vacuum head to observe the chip.

[0013] The aforementioned high-magnification micro-patch machine is equipped with multiple high-magnification microscope lenses, which can be rotated and switched to different magnifications. An industrial camera is connected to each high-magnification microscope lens. The high-magnification microscope lenses, which can be rotated and switched to different magnifications, can magnify local areas of microchips and substrates of different sizes.

[0014] The aforementioned high-magnification microscopy placement machine has a support frame equipped with a first drive mechanism and a second drive mechanism. The first drive mechanism is connected to the second drive mechanism, and the second drive mechanism is connected to the high-magnification microscope head. The first and second drive mechanisms drive the high-magnification microscope head to move along a first direction and a second direction, respectively. The first drive mechanism drives the high-magnification microscope head to move along the first direction, and the second drive mechanism drives the high-magnification microscope head to move along the second direction, wherein the first and second directions are perpendicular to each other, controlling the lateral movement of the high-magnification microscope head to approach and move away from the chip holder.

[0015] The beneficial effects of this invention are as follows: A high-magnification microscope magnifies local areas of the substrate and the chip, while an industrial camera acquires high-definition images of the front of both the substrate and the chip. The industrial camera generates image and contour information, which is then fed back to the pick-and-place machine's control system. By comparing the chip image with the contour of the substrate's mounting area, rapid and accurate positioning is achieved, effectively improving production efficiency, chip mounting accuracy, and product quality. The chip fixture moves the chip from the first carrier plate to the second carrier plate. The high-magnification microscope moves close to the first carrier plate, its objective lens penetrating the transparent cover and observation slot to observe the chip surface. Alternatively, a vacuum transparent nozzle can be used to pick up the chip and move it to the first carrier plate, allowing the high-magnification microscope to observe the chip surface. After acquiring substrate information, the industrial camera generates image information and the contour lines for positioning the chip, providing a certain positioning function. This invention utilizes a high-magnification microscope to clearly acquire images of the substrate and the chip, enabling thorough screening and timely replacement of defective products, reducing rework. Images of the substrate and chip can be generated from only one direction, simplifying the equipment structure and improving production efficiency. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of the present invention; Figure 2 This is a schematic diagram of the internal structure of an embodiment of the present invention; Figure 3 This is a schematic diagram of the high-magnification microscope lens alignment chip fixture and vacuum transparent suction nozzle according to an embodiment of the present invention; Figure 4 yes Figure 3 Enlarged view of the local structure at position A in the middle; Figure 5 This is a schematic diagram of the structure of the drive mechanism connected to the high-magnification microscope lens according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of the drive mechanism connecting the chip fixture according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the drive mechanism connecting to the chip clamp from another angle in an embodiment of the present invention; Figure 8 This is a schematic diagram of the chip fixture according to an embodiment of the present invention; Figure 9 This is a schematic diagram of the internal assembly structure of the chip fixture according to an embodiment of the present invention; Figure 10 This is a structural schematic diagram of the chip fixture from the rear view angle according to an embodiment of the present invention; Figure 11 This is a schematic diagram of the connection structure of the servo drive mechanism according to an embodiment of the present invention; Figure 12 This is a schematic diagram of the external structure of the vacuum transparent suction nozzle according to an embodiment of the present invention; Figure 13 This is a cross-sectional structural diagram of the vacuum transparent suction nozzle according to an embodiment of the present invention; Figure 14 This is a cross-sectional structural schematic diagram of a vacuum transparent suction nozzle according to another embodiment of the present invention; Figure 15 yes Figure 14 A magnified structural diagram at position B in the middle; Figure 16 This is an exploded structural diagram of the vacuum transparent suction nozzle according to an embodiment of the present invention; Figure 17 This is a cross-sectional structural schematic diagram of a vacuum nozzle according to another embodiment of the present invention; Figure 18 yes Figure 17 Enlarged structural diagram at the midpoint; Figure 19 This is a schematic diagram of the platform structure according to an embodiment of the present invention.

[0017] Explanation of reference numerals in the attached drawings: Base 1, Support frame 11, Stage 12, Protective cover 13, First drive mechanism 111, Second drive mechanism 112, Third drive mechanism 113, Fourth drive mechanism 114, First carrier plate 121, Second carrier plate 122, Base plate 123, High-power microscope lens 2, Industrial camera 21, Objective lens 22, Chip fixture 3, Base 31, Servo drive mechanism 32, Clamping mechanism 33, Drive rod 34, Spring 35, Vertical plate 311, Clamping component 331. Clamping part 332, bearing 333, clamping rod 334, servo motor 321, lead screw and nut pair 322, nut seat 323, lead screw 324, pressure sensor 36, vacuum transparent nozzle 4, transparent part 4a, nozzle bracket 41, observation slot 42, transparent cover plate 43, adsorption hole 44, adsorption part 45, nozzle head 46, suction hole 47, vacuum channel 41a, positioning hole 411, seal 412, mounting hole 413, nozzle rod 48, vacuum hole 481, vacuum suction head 49. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0019] Reference Figure 1-19As shown, a high-magnification microscopy mounting machine includes a base 1, a support frame 11 and a stage 12 on the base 1. The support frame 11 is equipped with a high-magnification microscope head 2 and an industrial camera 21. The high-magnification microscope head 2 is provided with multiple rotatable and switchable objective lenses 22. The industrial camera 21 is connected to the opposite side of the objective lenses of the high-magnification microscope head 2. A vacuum transparent suction nozzle 4 is movably provided on the side of the support frame 11. The vacuum transparent suction nozzle 4 is used to adsorb chips. The objective lens of the high-magnification microscope head 2 is located above the transparent part 4a of the vacuum transparent suction nozzle 4. The industrial camera 21 can capture the front image of the substrate on the stage and the front image of the chip adsorbed by the vacuum transparent suction nozzle 4, which are displayed in the objective lens of the high-magnification microscope head 2.

[0020] In a specific implementation of this invention, the substrate is moved below the high-powered microscope lens 2, and the high-powered microscope lens 2 is moved above the substrate to capture a surface image of the substrate on the stage 12. A vacuum transparent suction nozzle 4 is movably disposed on the side of the support frame 11 to adsorb the chip on the stage 12. The chip is moved below the high-powered microscope lens 2, and the high-powered microscope lens 2 is moved above the vacuum transparent suction nozzle 4. An image of the adsorbed chip can be captured through its transparent part 4a.

[0021] like Figure 13 As shown, the vacuum channel 41a and the adsorption hole 44 are perpendicularly intersecting and interconnected. The vacuum channel 41a is arranged inside the nozzle support 41 along the length direction. The adsorption holes 44 are perpendicularly intersecting at the ends of the vacuum channel 41a. The bottom of the adsorption hole 44 passes through the nozzle support 41 and the top is covered by a transparent part 4a. The high-magnification microscope lens 2 can pass through the transparent part 4a and through the adsorption hole 44 to magnify the chip adsorbed at the bottom of the adsorption hole 44.

[0022] Reference Figure 2-5 As shown, the support frame 11 is equipped with a first drive mechanism 111 and a second drive mechanism 112. The first drive mechanism 111 is connected to the second drive mechanism 112, and the second drive mechanism 112 is connected to the high-magnification microscope lens 2. The first drive mechanism 111 drives the high-magnification microscope lens 2 to move along a first direction and a second direction via the second drive mechanism 112. Specifically, the first drive mechanism 111 drives the high-magnification microscope lens 2 to move back and forth parallel to the chip holder 3, and the second drive mechanism 112 drives the high-magnification microscope lens 2 to move laterally perpendicular to the first direction. In specific implementations, the first drive mechanism 111 and the second drive mechanism 112 can adopt a lead screw and nut pair structure, an electric cylinder, or other equipment, which can be selected according to the actual application.

[0023] like Figure 6 , 7As shown, a second drive mechanism 113 is provided on the side of the support frame 11. The third drive mechanism 113 drives the chip clamp 3 to reciprocate linearly relative to the high-magnification microscope lens 2. The direction of movement of the chip clamp 3 driven by the third drive mechanism 113 is the same as the first direction mentioned above.

[0024] A fourth drive mechanism 114 is also provided on the side of the support frame 11. The third drive mechanism 113 is connected to the fourth drive mechanism 114. The chip clamp 3 is mounted on the fourth drive mechanism 114. The fourth drive mechanism 114 drives the chip clamp 3 to move vertically up and down. The fourth drive mechanism 114 drives the chip clamp 3 to move vertically up and down, thereby enabling the chip clamp 3 to pick up and put down the chip.

[0025] like Figure 8 , 9 As shown, a chip clamp 3 is also provided on the support frame 11. The chip clamp 3 includes a base 31, a servo drive mechanism 32 and a clamping mechanism 33 disposed on the base 31, and the servo drive mechanism 32 drives the clamping mechanism 33 to clamp the chip. This invention can provide the chip clamp 3 and the vacuum transparent nozzle 4 separately, or it can provide both simultaneously. The vacuum transparent nozzle 4 is embedded in the chip clamp 3, achieving a compact structure that does not occupy extra space. Figure 3 , 4 As shown.

[0026] Further reference Figure 9-11 As shown, in this embodiment, the clamping mechanism 33 includes a clamping member 331 and a clamping part 332. The clamping member 331 is movable onto the base 31. The clamping member 331 extends forward to form the clamping part 332. The tail end of the clamping member 331 is provided with a bearing 333. The base 31 is provided with a spring 35. The two ends of the spring 35 are respectively connected to the base 31 and the clamping member 331. The servo drive mechanism 32 pushes the bearing 333 through the drive rod 34 to drive the clamping action of the clamping member 331.

[0027] Reference Figure 3 , 4 and Figure 8 As shown, when the chip clamp 3 and the vacuum transparent nozzle 4 are simultaneously provided in this invention, the vacuum transparent nozzle 4 is embedded in the chip clamp 3. A clamping member 331 extends forward to form a clamping portion 332, which is used to clamp the chip. Since the clamping member 331 extends forward a certain distance, a clamping rod 334 is connected to the inward side of the front end of the clamping member 331. The ends of the two clamping rods 334 that clamp the chip opposite each other form the clamping portion 332. As shown, the vacuum transparent nozzle 4 is located above the clamping portion 332, and its transparent portion 4a, the suction hole 44 for observing the chip through light, and the observation groove 42 are directly opposite the clamping portion 332.

[0028] When the two clamping members 331 open and the two clamping rods 334 move away from each other, the distance between the ends of the two clamping rods 334 holding the chip increases. When the vacuum transparent nozzle 4 adsorbs the chip, the objective lens 22 of the high-power microscope lens 2 is aligned with the transparent part 4a or the transparent cover plate 43 of the vacuum transparent nozzle 4, and the surface image of the chip adsorbed by the vacuum transparent nozzle 4 can be observed through the optical channel formed by the adsorption hole 43 and the observation groove 42. As the chip clamp 3 descends, it drives the vacuum transparent nozzle 4 to descend, and the chip adsorbed at the bottom of the adsorption hole 43 of the vacuum transparent nozzle 4 can be attached to the substrate below, completing the chip mounting.

[0029] When the chip is clamped using the chip holder 3, the clamping members 331 move towards each other, and the clamping rods 334 approach each other, forming a clamping part 332 at their ends, which clamps the chip. The clamping part 332 is located below the vacuum transparent suction nozzle 4, and the suction hole 44 of the vacuum transparent suction nozzle 4 is aligned with the chip clamped by the clamping part 332, allowing the high-powered microscope lens 2 to observe the chip clamped by the chip holder 3.

[0030] The present invention can set the chip clamp 3 and the vacuum transparent nozzle 4 separately, or set the chip clamp 3 and the vacuum transparent nozzle 4 simultaneously. The chip clamp 3 and the vacuum transparent nozzle 4 have a compact structure and will not interfere with each other. They can work independently or in cooperation.

[0031] like Figure 11 As shown, the servo drive mechanism 32 includes a servo motor 321 and a lead screw and nut assembly 322. The servo motor 321 is mounted on the upright plate 311 of the base 31. The lead screw and nut assembly 322 is connected to the servo motor 321. The drive rod 34 is connected to the nut seat 323 of the lead screw and nut assembly 322. The drive rod 34 is U-shaped, and its inner side of the U-shaped side is provided with an inclined surface that abuts against the bearing 333.

[0032] The drive rod 34 is U-shaped, with an inclined surface on the inner side of its U-shape that abuts against the bearing 333. When the servo motor 321 drives the drive rod 34 downward, the inclined surface on the inner side of the drive rod 34 abuts against the bearing 333 as it descends. The drive rod 34 pushes the bearing 333 through the inclined surface, causing the bearing 333 to move the clamping member 331 inward. The two clamping members 331 move towards each other, clamping the chip when they come together through the clamping part 332 extending from their heads. A pressure sensor 36 is fixedly connected to the inner side of one of the clamping members 331. When the clamping part 332 of the clamping member 331 clamps the chip, the impact of the chip on the clamping member 331 is transmitted to the tail end of the clamping member 331. The pressure sensor 36 detects this impact and calculates the clamping force of the clamping member 331 on the chip.

[0033] like Figure 12 , 14As shown in Figure -16, the vacuum transparent nozzle 4 includes a nozzle support 41. The nozzle support 41 is provided with a vacuum channel 41a and an adsorption hole 44. The vacuum channel 41a communicates with the adsorption hole 44. The bottom end of the adsorption hole 44 passes through the nozzle support 41, and a transparent cover plate 43 is sealed on the top. Furthermore, a positioning hole 411 is provided on the side of the nozzle support 41. The positioning hole 411 is coaxial with the vacuum channel 41a, and a sealing element 412 is sealed on the positioning hole 411. The positioning hole 411 allows the drill bit to pass through the sealing element 412, forming a vacuum channel 41a inside the nozzle support 41, which facilitates processing.

[0034] A suction head 46 is sealed to the inner wall of the adsorption hole 44. The suction head 46 has a suction hole 47 communicating with the adsorption hole 44. The suction head 46 is made of high-temperature resistant and transparent quartz glass. The suction head 46 can be sealed to the wall of the adsorption hole 44 by filling with sealant. A high-magnification microscope lens 2 can observe the surface of the adsorbed chip through the suction head 36, thereby generating a clear image. During the high-temperature bonding process, the quartz glass suction head 36 can withstand the high temperatures during the bonding process.

[0035] Further reference Figure 14 , 16 The nozzle support 41 has an integrally formed, downwardly extending, tapered suction portion 45 at its bottom end, with the nozzle head 46 extending axially outward from the suction portion 45. The nozzle support 41 has an observation groove 42, with the suction hole 44 coaxial with and axially penetrating the observation groove 42. It should be understood that the diameter of the observation groove 42 is larger than the diameter of the suction hole 44. The other end of the nozzle support 41 away from the suction hole 44 has a mounting hole 413, in which a nozzle rod 48 is installed. The nozzle rod 48 has a vacuum hole 481, which connects to a vacuum channel 41a. The nozzle rod 48 is connected to a ventilation device. By suctioning through the vacuum hole 481, a negative pressure or vacuum state is created in the observation groove 42, causing the chip located below the nozzle head 46 to be adsorbed onto the nozzle head 46.

[0036] In a specific implementation of this invention, the substrate is moved onto the stage 12. A high-powered microscope lens 2 is moved closer to the substrate, and an industrial camera 21 captures images of the mounting area on the substrate surface and generates outlines of the corresponding mounting positions. The chip clamp 3 clamps the chip and moves it to the mounting station. The high-powered microscope lens 2 moves closer to the chip clamp 3, and the objective lens of the high-powered microscope lens 2 is aligned with the chip. The industrial camera 21 on the eyepiece end acquires images of the chip and generates images, which are then fed back to the mounting machine. Alternatively, by moving the chip clamp 3, the vacuum transparent nozzle 4 is moved above the chip and the chip is adsorbed using a vacuum method. After adsorbing the chip, the chip clamp 3 moves the vacuum transparent nozzle 4 above the placed substrate. The high-powered microscope lens 2 moves above the vacuum transparent nozzle 4, and the objective lens is aligned with the observation slot 42. The high-powered microscope lens 2 observes the image of the chip through the transparent cover plate 43, the observation slot 42, and the adsorption hole 44, and generates image information of the chip through the industrial camera 21. After receiving images of the substrate and the chip, the pick-and-place machine uses an industrial camera 21 to generate a contour line on the system to locate the substrate mounting position. Then, when the chip is moved above the substrate, it is determined whether the chip's contour line coincides with the drawn contour line. When the image of the chip captured by the industrial camera 21 coincides with the contour line, it is determined that the chip is aligned with the contour line of the substrate mounting position. At this point, the chip can be attached to the substrate, completing the chip mounting process.

[0037] An industrial camera 21 is connected to the eyepiece end of the high-powered microscope lens 2. Through the transparent cover 43 and observation slot 42 on the vacuum transparent suction nozzle 4, the high-powered microscope lens 2 can observe images of the substrate and patch surfaces through the observation slot 42. Utilizing the characteristics of the high-powered microscope, the images captured by the industrial camera 21 are clearer, making it easier to detect defects on the substrate and patch surfaces, allowing for timely replacement of defective products and avoiding rework. Simultaneously, the outline drawn by the industrial camera 21 enables rapid patch positioning, effectively improving production efficiency.

[0038] like Figure 17 , 18 As shown, in some embodiments, the vacuum transparent nozzle 4 includes a nozzle support 41, and a vacuum head 49 is provided at the end of the nozzle support 41. The vacuum head 49 is made of transparent high temperature resistant material and has an adsorption hole 44 inside. The nozzle support 41 has a vacuum channel 41a inside, and the adsorption hole 44 is connected to the vacuum channel 41a.

[0039] The vacuum channel 41a is connected to the adsorption hole 44. During vacuuming, the adsorption hole 44 forms a vacuum or negative pressure state, and the adsorption hole 44 generates an adsorption force to pick up the chip located below it. The high-magnification microscope lens 2 can observe the chip adsorbed by the adsorption hole 44 through the transparent vacuum suction head 49.

[0040] exist Figure 17 , 18In the illustrated embodiment, multiple high-magnification microscope lenses 2 are provided, and different magnifications can be switched by rotation. By rotating and adjusting the high-magnification microscope lenses to switch between different magnifications, micro-chips of different sizes can be magnified, ensuring that the images captured by the industrial camera 21 are clear.

[0041] like Figure 19 As shown, the stage 12 includes a base plate 123, a first carrier plate 121 and a second carrier plate 122 movably disposed on the base plate 123, and the chip holder 3 can switch positions between the first carrier plate 121 and the second carrier plate 122. A protective cover 13 is provided on the support frame 11, which covers the high-magnification microscope lens 2, the chip holder 3 and the stage 12.

[0042] The movable first carrier plate 121 and the second carrier plate 122 can adjust their positions. When the second carrier plate 122 moves, it can fix the positions of the vacuum transparent suction nozzle 4 and the high-magnification microscope head 2. By moving the second carrier plate 122, the chip and the substrate can be aligned.

[0043] In a specific implementation of this invention, the substrate is first moved from the first carrier plate 121 to the second carrier plate 122. After the position of the substrate is determined, the first driving mechanism 111 and the second driving mechanism 112 drive the high-magnification microscope lens 2 to move close to the substrate. The industrial camera 21 first captures an image of the substrate and simultaneously outlines the contour of the substrate, which is then displayed on the screen of the pick-and-place machine control system. The chip clamp 3 is driven by the third driving mechanism 113 and the fourth driving mechanism 114 to clamp the chip on the first carrier plate 121 and move it to the second carrier plate 122. After the position of the chip is determined, the first driving mechanism 111 and the second driving mechanism 112 drive the high-magnification microscope lens 2 to move close to the chip clamp 3 to capture and acquire an image of the chip, thereby comparing the chip with the contour line of the substrate to achieve the positioning of the chip and the substrate for placement. Alternatively, the chip clamp 3 is moved to the first carrier plate 121, and the vacuum transparent nozzle 4 is controlled to descend and place on the chip to be placed. The vacuum transparent nozzle 4 picks up the chip, and then the chip holder 3 is moved onto the second carrier plate 122 by the third drive mechanism 113 and the fourth drive mechanism 114. The high-magnification microscope lens 2 approaches the chip holder 3, and the industrial camera 21 captures an image of the chip. At the same time, it compares whether the image of the chip is aligned with the outline basically drawn by the industrial camera 21. When it is determined that the image of the chip is aligned with the outline, that is, the chip is aligned with the substrate, the chip holder 3 descends, and the vacuum transparent nozzle 4 mounts the chip onto the substrate.

[0044] In summary, as described in the specification and figures, the present invention has been manufactured into actual samples and subjected to multiple usage tests. The results of these tests demonstrate that the present invention achieves its intended purpose, and its practical value is undeniable. The embodiments described above are merely illustrative examples and are not intended to limit the present invention in any way. Any person skilled in the art who makes partial modifications or alterations to the technical content disclosed in the present invention, without departing from the scope of the technical features of the present invention, shall still fall within the scope of the technical features of the present invention.

Claims

1. A high-magnification microsurgical mounting machine, comprising a base (1), wherein a support frame (11) and a stage (12) are provided on the base (1), characterized in that: The support frame (11) is equipped with a high-power microscope lens (2) and an industrial camera (21). The high-power microscope lens (2) is equipped with multiple rotatable and switchable objectives (22). The industrial camera (21) is connected to the opposite side of the objectives of the high-power microscope lens (2). A vacuum transparent suction nozzle (4) is movably provided on the side of the support frame (11). The vacuum transparent suction nozzle (4) is used to adsorb chips. The objectives of the high-power microscope lens (2) are located above the transparent part (4a) of the vacuum transparent suction nozzle (4). The industrial camera (21) can acquire the front image of the substrate on the stage and the front image of the chip adsorbed by the vacuum transparent suction nozzle (4) as displayed in the objectives of the high-power microscope lens (2).

2. The high-magnification microscopy mounting machine according to claim 1, characterized in that: The support frame (11) is also provided with a chip clamp (3), which includes a base (31), a servo drive mechanism (32) and a clamping mechanism (33) provided on the base (31). The servo drive mechanism (32) drives the clamping mechanism (33) to clamp the chip.

3. The high-magnification micro-mounting machine according to claim 2, characterized in that: The clamping mechanism (33) includes a clamping member (331) and a clamping part (332). The clamping member (331) is movable onto the base (31). The clamping member (331) extends forward to form the clamping part (332). The tail end of the clamping member (331) is provided with a bearing (333). The base (31) is provided with a spring (35). The two ends of the spring (35) are respectively connected to the base (31) and the clamping member (331). The servo drive mechanism (32) pushes the bearing (333) through the drive rod (34) and drives the clamping action of the clamping member (331).

4. The high-magnification micro-mounting machine according to claim 3, characterized in that: The servo drive mechanism (32) includes a servo motor (321) and a lead screw and nut pair (322). The servo motor (321) is mounted on the upright plate (311) of the base (31). The lead screw and nut pair (322) is connected to the servo motor (321). The drive rod (34) is connected to the nut seat (323) of the lead screw and nut pair (322). The drive rod (34) is U-shaped, and its inner side of the U-shaped side is provided with an inclined surface that abuts against the bearing (333).

5. The high-magnification micro-mounting machine according to claim 1, characterized in that: The vacuum transparent nozzle (4) includes a nozzle support (41), which is provided with a vacuum channel (41a) and an adsorption hole (44). The vacuum channel (41a) is connected to the adsorption hole (44). The bottom end of the adsorption hole (44) passes through the nozzle support (41), and a transparent cover plate (43) is sealed on the top.

6. The high-magnification microscopy mounting machine according to claim 5, characterized in that: The nozzle support (41) has a positioning hole (411) on its side. The positioning hole (411) is coaxial with the vacuum channel (41a). A sealing element (412) is provided on the positioning hole (411).

7. The high-magnification micro-mounting machine according to claim 5, characterized in that: The inner wall of the adsorption hole (44) is sealed with a suction head (46), and the suction head (46) is provided with a suction hole (47) that communicates with the adsorption hole (44). The suction head (46) is made of high temperature resistant and transparent quartz glass.

8. The high-magnification microscopy mounting machine according to claim 1, characterized in that: The vacuum transparent nozzle (4) includes a nozzle support (41), and a vacuum suction head (49) is provided at the end of the nozzle support (41). The vacuum suction head (49) is made of transparent high temperature resistant material and has an adsorption hole (44) inside. The nozzle support (41) has a vacuum channel (41a) inside, and the adsorption hole (44) is connected to the vacuum channel (41a).

9. The high-magnification microscopy mounting machine according to claim 1, characterized in that: The support frame (11) is provided with a first drive mechanism (111) and a second drive mechanism (112). The first drive mechanism (111) is connected to the second drive mechanism (112), and the second drive mechanism (112) is connected to the high-power microscope head (2). The first drive mechanism (111) and the second drive mechanism (112) drive the high-power microscope head (2) to move along the first direction and the second direction.

Images