Solar cell module manufacturing method

Abstract

To provide a method for manufacturing a solar cell module, achieving high yield.SOLUTION: A method for manufacturing a solar cell module according to an aspect of the present invention includes the steps of: forming a first internal isolation groove that cuts a first electrode layer at the boundary of an area where a solar cell sub-cell is formed; forming a first external isolation groove that cuts the first electrode layer on the outer edge of an area where the solar cell module is formed; forming a second internal isolation groove that cuts a first charge transport layer, a photoelectric conversion layer, and a second charge transport layer at the boundary of an area where the solar cell sub-cell is formed; forming a third internal isolation groove that cuts at least a second electrode layer of the first charge transport layer, the photoelectric conversion layer, the second charge transport layer, and the second electrode layer at the boundary of an area where the solar cell sub-cell is formed; and forming a second external isolation groove that cuts the first electrode layer, the first charge transport layer, the photoelectric conversion layer, the second charge transport layer, and the second electrode layer, on the outer edge of an area where the solar cell module is formed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This invention relates to a method for manufacturing solar cell modules. [Background technology]

[0002] A solar cell module is known in which multiple solar cell subcells are electrically connected in series on a single substrate. By modularizing the solar cell, the effective area decreases because the spaces between subcells become inactive regions, but the resistive loss, particularly at the electrodes on the light-receiving side, can be reduced. If the solar cell is properly modularized, the improvement in photoelectric conversion efficiency due to the reduction in resistive loss outweighs the decrease in effective area.

[0003] A solar cell module can be manufactured by a method that sequentially performs the following steps: laminating a first electrode layer onto a substrate; cutting the first electrode layer with a first laser irradiation; laminating a first charge transport layer, a photoelectric conversion layer, and a second charge transport layer; cutting the first charge transport layer, the photoelectric conversion layer, and the second charge conversion layer with a second laser irradiation; laminating a second electrode layer; and cutting the first charge transport layer, the photoelectric conversion layer, the second charge transport layer, and the second electrode layer with a third laser irradiation, thereby forming a plurality of electrically connected solar cell subcells by sequentially shifting the positions of the first, second, and third laser irradiations (see, for example, Patent Document 1).

[0004] Furthermore, in order to obtain a flexible, thin solar cell module, the use of a resin film as a substrate is being considered. As a method for manufacturing solar cells using a resin film as a substrate, a polyimide film has been proposed in which a varnish is applied to a substrate that supports an intermediate product during manufacturing to form a polyimide film, a first electrode, an electron transport layer, a photoelectric conversion layer, a hole transport layer, and a second electrode are formed on this polyimide film, and the solar cell is obtained by peeling the polyimide film from the substrate (see, for example, Patent Document 2). [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2011-189408 [Patent Document 2] International Publication No. 2020 / 026495 [Overview of the project] [Problems that the invention aims to solve]

[0006] When forming a solar cell module on a resin film formed on a support substrate, laser irradiation can cause the resin film to peel off from the support substrate at unexpected locations, potentially reducing the yield of the solar cell module. Therefore, the object of the present invention is to provide a solar cell module manufacturing method with a high yield. [Means for solving the problem]

[0007] A solar cell module manufacturing method according to one aspect of the present invention is a method for manufacturing a solar cell module having a plurality of solar cell subcells, comprising the steps of: laminating a resin substrate layer on one main surface of a support substrate; laminating a first electrode layer on the resin substrate layer; forming a first internal separation groove that cuts the first electrode layer at the boundary of a region where the solar cell subcells are formed by laser irradiation; forming a first external separation groove that cuts the first electrode layer at the outer edge of a region where the solar cell module is formed by laser irradiation; laminating a first charge transport layer on the first electrode layer; laminating a photoelectric conversion layer on the first charge transport layer; laminating a second charge transport layer on the photoelectric conversion layer; and forming a second internal separation groove that cuts the first charge transport layer, the photoelectric conversion layer, and the second charge transport layer at the boundary of a region where the solar cell subcells are formed by laser irradiation. The method comprises the steps of: laminating a second electrode layer onto the second charge transport layer; forming a third internal separation groove at the boundary of the region where the solar cell subcell is formed by laser irradiation, cutting at least the second electrode layer among the first charge transport layer, the photoelectric conversion layer, the second charge transport layer, and the second electrode layer; forming a second external separation groove at the outer edge of the region where the solar cell module is formed by laser irradiation, cutting the first electrode layer, the first charge transport layer, the photoelectric conversion layer, the second charge transport layer, and the second electrode layer; and peeling the resin substrate layer inside the region where the solar cell module is formed from the support substrate, wherein the intensity of the laser forming the first external separation groove is higher than the intensity of the laser forming the first internal separation groove, and the intensity of the laser forming the second external separation groove is higher than the intensity of the laser forming the third internal separation groove.

[0008] In the solar cell module manufacturing method described above, the resin of the resin substrate layer may be altered by laser irradiation to form the first external separation groove.

[0009] In the solar cell module manufacturing method described above, the step of laminating the resin substrate layers may include the step of coating the support substrate with a polyamic acid solution and the step of heating the coating film of the polyamic acid solution. [Effects of the Invention]

[0010] The solar cell module according to the present invention has a high yield. [Brief explanation of the drawing]

[0011] [Figure 1] This flowchart shows the procedure for a solar cell module manufacturing method according to one embodiment of the present invention. [Figure 2] Figure 1 is a schematic cross-sectional view showing a solar cell module formed on a support substrate using the solar cell module manufacturing method. [Figure 3] Figure 1 is a schematic plan view showing the laser irradiation position on the support substrate in the solar cell module manufacturing method. [Figure 4] Figure 1 is a schematic cross-sectional view illustrating the first internal isolation groove formation step and the first external isolation groove formation step of the solar cell module manufacturing method. [Figure 5] Figure 1 is a schematic cross-sectional view illustrating the first charge transport layer stacking process, the photoelectric conversion layer stacking process, and the second charge transport layer stacking process of the solar cell module manufacturing method. [Figure 6] Figure 1 is a schematic cross-sectional view illustrating the second internal separation groove formation step in the solar cell module manufacturing method. [Figure 7] Figure 1 is a schematic cross-sectional view illustrating the second electrode layer stacking process in the solar cell module manufacturing method. [Modes for carrying out the invention]

[0012] Embodiments of the present invention will be described below with reference to the drawings. Figure 1 is a flowchart showing the procedure for a solar cell module manufacturing method according to one embodiment of the present invention. Figure 2 is a schematic cross-sectional view showing a solar cell module 1 formed on a support substrate S by the solar cell module manufacturing method of Figure 1. Note that the dimensions of each component in the figures have been modified for clarity.

[0013] The solar cell module 1 manufactured by the method for manufacturing a solar cell module of FIG. 1 includes a resin base layer 11, a first electrode layer 12 laminated on the resin base layer 11, a first charge transport layer 13 laminated on the first electrode layer 12, a photoelectric conversion layer 14 laminated on the first charge transport layer 13, a second charge transport layer 15 laminated on the photoelectric conversion layer 14, and a second electrode layer 16 laminated on the second charge transport layer 15. As shown in FIG. 2, the solar cell module 1 is formed in a state where the resin base layer 11 is laminated on one main surface of the support substrate S and is surrounded by an invalid region E that is finally trimmed and not included in the solar cell module 1.

[0014] Further, the solar cell module 1 has a plurality of first inner separation grooves 21 formed to cut the first electrode layer 12, a plurality of second inner separation grooves 22 formed to cut the first charge transport layer 13, the photoelectric conversion layer 14, and the second charge transport layer 15, and a plurality of third inner separation grooves 23 formed to cut at least the second electrode layer 16 among the first charge transport layer 13, the photoelectric conversion layer 14, the second charge transport layer 15, and the second electrode layer 16. The first inner separation grooves 21, the second inner separation grooves 22, and the third inner separation grooves 23 are formed to approach each other in this order and define a plurality of solar cell sub-cells 2 that are electrically connected in series. The solar cell module 1 is provided with a connection portion 3 at one end for making an electrical connection to the first electrode layer 12 of the terminal solar cell sub-cell 2 via the second electrode layer 16, although it does not contribute to photoelectric conversion. The solar cell module 1 according to the present embodiment is intended to receive light from the resin base layer 11 side, but may be configured to receive light from the second electrode layer 16 side. Note that a larger solar cell module may be formed using a plurality of solar cell modules 1. That is, the solar cell module 1 may be used as a solar cell sub-module.

[0015] On the support substrate S, a first external isolation groove 31 is formed at the boundary between the solar cell module 1 and the inactive region E, cutting through the first electrode layer 12, and a second external isolation groove 32 is formed to cut through the first charge transport layer 13, the photoelectric conversion layer 14, the second charge transport layer 15, and the second electrode layer 16. Figure 3 shows the arrangement of the first internal isolation groove 21, the second internal isolation groove 22, and the third internal isolation groove 23, as well as the first external isolation groove 31 and the second external isolation groove 32, on the support substrate S.

[0016] The method for manufacturing a solar cell module 1 according to this embodiment for manufacturing such a solar cell module includes a step of laminating a resin base material layer 11 on one main surface of a support substrate S (S01: resin base material layer lamination step), a step of laminating a first electrode layer 12 on the resin base material layer 11 (S02: first electrode layer lamination step), a step of forming a first inner separation groove 21 for cutting the first electrode layer 12 at the boundary of the region where the solar cell sub-cell 2 is formed by laser irradiation (S03: first inner separation groove forming step), a step of forming a first outer separation groove 31 for cutting the first electrode layer 12 at the outer edge of the region where the solar cell module 1 is formed by laser irradiation (S04: first outer separation groove forming step), a step of laminating a first charge transport layer 13 on the first electrode layer 12 (S05: first charge transport layer lamination step), a step of laminating a photoelectric conversion layer 14 on the first charge transport layer 13 (S6: photoelectric conversion layer lamination step), a step of laminating a second charge transport layer 15 on the photoelectric conversion layer 14 (S7: second charge transport layer lamination step), a step of forming a second inner separation groove 22 for cutting the first charge transport layer 13, the photoelectric conversion layer 14, and the second charge transport layer 15 at the boundary of the region where the solar cell sub-cell 2 is formed by laser irradiation (S08: second inner separation groove forming step), a step of laminating a second electrode layer 16 on the second charge transport layer 15 (S09: second electrode layer lamination step), a step of forming a third inner separation groove 23 for cutting at least the second electrode layer 16 among the first charge transport layer 13, the photoelectric conversion layer 14, the second charge transport layer 15, and the second electrode layer 16 at the boundary of the region where the solar cell sub-cell 2 is formed by laser irradiation (S10: third inner separation groove forming step), a step of forming a second outer separation groove for cutting the first charge transport layer 13, the photoelectric conversion layer 14, the second charge transport layer 15, and the second electrode layer 16 at the outer edge of the region where the solar cell module 1 is formed by laser irradiation (S11: second outer separation groove forming step), and a step of peeling the resin base material layer 11 inside the region where the solar cell module 1 is formed from the support substrate S (S12: solar cell module peeling step).

[0017] In the resin substrate layer lamination process, a resin substrate layer 11 made of a resin such as polyimide, polyamide, or polyethylene terephthalate is laminated onto a support substrate S, such as a glass plate. The resin substrate layer 11 is a structural member that ensures the strength of the solar cell module 1. Preferably, the resin substrate layer 11 is laminated by a method that includes, for example, a step of coating a polyamic acid solution and a step of heating the coating film of the polyamic acid solution, thereby forming polyimide on the support substrate S. This makes it possible to form a resin substrate layer 11 with a small thickness and smooth surface. In particular, when forming a resin substrate layer 11 made of polyimide on a support substrate S made of a glass plate, the adhesion between the support substrate S and the resin substrate layer 11 can be appropriately controlled by forming a first external separation groove 31 and a second external separation groove 32.

[0018] The lower limit of the thickness of the resin substrate layer 11 is preferably 3 μm, and more preferably 10 μm. On the other hand, the upper limit of the thickness of the resin substrate layer 11 is preferably 50 μm, and more preferably 30 μm. By making the thickness of the resin substrate layer 11 equal to or greater than the lower limit, the strength of the solar cell module 1 can be ensured. Furthermore, by making the thickness of the resin substrate layer 11 equal to or less than the upper limit, flexibility can be imparted to the solar cell module 1, and the peeling prevention effect of the first external separation groove 31 becomes more pronounced.

[0019] In the first electrode layer lamination step of S02, the first electrode layer 12 is laminated onto the entire main surface of one of the resin substrate layers 11. The first electrode layer 12 can be laminated onto the resin substrate layer 11 by methods such as sputtering or vacuum deposition.

[0020] The first electrode layer 12 collects the first charge generated in the photoelectric conversion layer 14 through the first charge transport layer 13 and outputs it to an adjacent solar cell subcell 2 or to the outside. In this embodiment, the first electrode layer 12 is a positive electrode that collects holes. In this embodiment, the first electrode layer 12 can be formed from a transparent conductive oxide (TCO) that has conductivity and light transmittance. Examples of transparent conductive oxides that can form the first electrode layer 12 include indium oxide, tin oxide, zinc oxide, titanium oxide, and composite oxides thereof. Among these, indium-based composite oxides mainly composed of indium oxide are preferred. Indium oxide is particularly preferred from the viewpoint of high conductivity and transparency. Furthermore, it is preferable to add a dopant to the indium oxide in order to ensure reliability or higher conductivity. Examples of dopants include Sn, W, Zn, Ti, Ce, Zr, Mo, Al, Ga, Ge, As, Si, S, etc. A particularly suitable example is ITO (Indium Tin Oxide), which is indium oxide with added tin, and is widely known.

[0021] The lower limit of the thickness of the first electrode layer 12 is preferably 5 nm, and more preferably 10 nm. On the other hand, the upper limit of the thickness of the first electrode layer 12 is preferably 200 nm, and more preferably 150 nm. By making the thickness of the first electrode layer 12 above the lower limit, the photoelectric conversion efficiency can be improved by reducing the electrical resistance. Also, by making the thickness of the first electrode layer 12 below the upper limit, the photoelectric conversion efficiency can be improved by increasing the amount of light incident on the photoelectric conversion layer 14. The first electrode layer 12 may have a multilayer structure, such as a laminated structure of a polycrystalline ITO layer and an amorphous ITO layer.

[0022] In the first internal separation groove formation step of S03, the first internal separation groove 21 is formed by removing the first electrode layer 12 in a plurality of parallel linear shapes in a plan view by laser ablation. As the laser to be irradiated, for example, a THG (third harmonic) laser can be used. The intensity of the laser that forms the first internal separation groove 21 is set so as to reliably insulate the first electrode layer 12 between the solar cell subcells 2 and to minimize damage to the resin substrate layer 11. To reduce damage, it is preferable to irradiate the laser from the film surface side.

[0023] The width of the first internal separation groove 21 is preferably 10 μm to 200 μm, and more preferably 20 μm to 100 μm, considering that it is formed by laser ablation. This ensures reliable separation between solar cell subcells 2 and secures the effective area of ​​each solar cell subcell 2.

[0024] In the first external separation groove formation step of S04, the first electrode layer 12 is linearly removed by laser ablation to define the outer edge of the region where the solar cell module 1 is formed, thereby forming the first external separation groove 31 as shown in Figure 4. The intensity of the laser used to form the first external separation groove 31 is set higher than that of the laser used to form the first internal separation groove 21, thereby altering the resin of the resin substrate layer 11 at the back of the first external separation groove 31 by heat and improving the adhesion of the resin substrate layer 11 to the support substrate S. It is preferable to use IR rather than THG to apply more heat. It is also preferable to apply the laser from the substrate side to apply more heat. This prevents the resin substrate layer 11 from peeling off from the support substrate S in subsequent processes and handling between processes. To improve adhesion, it is preferable to form it with multiple lines rather than one.

[0025] Some of the first external isolation grooves 31 may be formed by replacing the first internal isolation grooves 21 on the outer edge of the solar cell module 1.

[0026] The order of the first internal separation groove formation step and the first external separation groove formation step may be reversed, or they may be performed in parallel. For example, the first internal separation groove 21 and the first external separation groove 31 may be formed by setting the laser head's movement path without distinguishing between them and sequentially adjusting the laser output.

[0027] In the first charge transport layer lamination step of S05, the first charge transport layer 13 is laminated on the first electrode layer 12. Preferably, the first charge transport layer 13 is filled into the inner surfaces of the first internal separation groove 21 and the first external separation groove 31. The first charge transport layer 13 is a layer that allows charges of the first polarity (photocarriers) generated in the photoelectric conversion layer 14 to pass through, and in this embodiment, it is a hole transport layer (HTL) that transmits holes to the first electrode layer 12. The first charge transport layer 13 can be formed by methods such as sputtering or vacuum deposition. If the first charge transport layer 13 contains organic matter, it can be formed by methods such as coating and drying a solution of organic matter.

[0028] The main material for the first charge transport layer 13, which is a hole transport layer, can be, for example, metal oxides such as nickel oxide (NiO) and copper oxide (Cu2O), or organic materials such as PTAA (Poly(bis(4-phenyl)(2,4,6-trimethylphenyl)amine)) and Spiro-MeOTAD. The first charge transport layer 13 may also be a self-assembled monolayer (SAM) formed from, for example, 2PACz ([2-(9H-Carbazol-9-yl)ethyl]phosphonic Acid), MeO-2PACz ([2-(3,6-Dimethoxy-9H-carbazol-9-yl)ethyl]phosphonic Acid), Me-4PACz ([4-(3,6-Dimethyl-9H-carbazol-9-yl)butyl]phosphonic Acid), etc. When the first charge transport layer 13 is formed by a self-assembled monolayer, there is a risk that the solvent in the material solution may penetrate between the support substrate S and the resin substrate layer 11 during coating, promoting the peeling of the resin substrate layer 11. Therefore, the effect of preventing the peeling of the resin substrate layer 11 by forming the first external separation groove 31 is particularly significant. The first charge transport layer 13 may also have a multilayer structure.

[0029] The thickness of the first charge transport layer 13 can vary greatly depending on its material, the composition of adjacent layers, etc., but can be, for example, 0.5 nm to 200 nm, and in particular, in the case of a self-assembled monolayer, it can be the thickness of the material molecules.

[0030] In the photoelectric conversion layer lamination process of S06, a photoelectric conversion layer 14 is laminated on the first charge transport layer 13. The photoelectric conversion layer 14 absorbs incident light and generates photocarriers (electrons and holes). The photoelectric conversion layer 14 may contain a perovskite compound.

[0031] The photoelectric conversion layer 14 containing a perovskite compound can be formed by sequentially depositing lead halide (PbX2) material and methylammonium halide (MAX) material, and then reacting these thin films at a reaction temperature, in the case where the perovskite compound is methylammonium lead halide (MAPbX3(CH3NH3PbX3)). For example, if the perovskite compound is methylammonium lead iodide (MAPbX3(CH3NH3PbX3)), the photoelectric conversion layer 14 can be formed by sequentially depositing lead halide (PbX2) material and methylammonium halide (MAX) material, and then reacting these thin films at a reaction temperature. y X (3-y) (CH3NH3PbI y X (3-y) In this case, the photoelectric conversion layer 14 is formed by sequentially depositing a lead halide (PbX2) material and a methylammonium iodide (MAI) material, and then reacting these thin films at the reaction temperature. The photoelectric conversion layer 14 can also be formed by methods such as the sol-gel method, in which a perovskite compound is synthesized in a liquid-phase coating film, or the coating method, in which a solution containing a pre-synthesized perovskite compound is applied.

[0032] As the perovskite compound contained in the photoelectric conversion layer 14, a compound represented by ABX3 can be used, which contains an organic atom A including at least one of monovalent organic ammonium ions and amidinium-based ions, a metal atom B that generates a divalent metal ion, and a halogen atom X including at least one of iodide ions I, bromide ions Br, chloride ions Cl, and fluoride ions F. In particular, when the photoelectric conversion layer 14 is formed by vapor deposition (dry process), methylammonium MA (CH3NH3) and formamidinium FA (CH(NH2)2) are preferred as organic atom A, lead Pb is preferred as metal atom B, and at least one of iodide I, bromide ions Br, and chloride ions Cl is preferred as halogen atom X.

[0033] Specifically, preferred perovskite compounds include methylammonium lead halides MAPbX3 (CH3NH3PbX3), MAPbI3, MAPbBr3, MAPbCl3, etc., or formamidinium lead halides FAPbX3 (CH(NH2)2PbX3), FAPbI3, FAPbBr3, FAPbCl3, etc. Note that the halogen atom X may include multiple types. Examples of perovskite compounds containing iodide I and other halogen atoms X include, for example, methylammonium lead iodide MAPbI y X (3-y) (CH3NH3PbI y X (3-y) ), MAPbI y Br (3-y) etc. (y is any positive integer). Also, (FAPbI3)z(MAPbBr3)100-z, etc., a mixture of methylammonium lead halide and formamidinium lead halide may be used (z is any positive integer).

[0034] The thickness of the photoelectric conversion layer 14 depends on the forming material, etc. In order to increase the light absorption rate while reducing the migration distance of the generated charges, it is preferably 100 nm or more and 1000 nm or less.

[0035] In the second charge transport layer lamination step of S07, the second charge transport layer 15 is laminated on the photoelectric conversion layer 14. Thereby, a laminate as shown in FIG. 5 is obtained. The second charge transport layer 15 is a layer that allows the charges of the second polarity generated in the photoelectric conversion layer 14 to pass through. In this embodiment, it is an electron transport layer (ETL) that transfers electrons to the second electrode layer 16. The second charge transport layer 15 can be formed by methods such as the sol-gel method, the coating method, etc.

[0036] Examples of main materials for the second charge transport layer 15, which is an electron transport layer, include fullerenes and PCBM. Examples of fullerenes include C60, C70, their hydrides, oxides, metal complexes, alkyl groups, and derivatives, such as PCBM ([6,6]-Phenyl-C61-Butyric Acid Methyl Ester). In particular, forming the second charge transport layer 15 from a material containing fullerene encapsulating lithium Li can improve electron transport efficiency. The second charge transport layer 15 may also have a multilayer structure.

[0037] The thickness of the second charge transport layer 15 can vary greatly depending on its material, the composition of adjacent layers, etc., but it can be, for example, 3 nm to 50 nm.

[0038] In the second internal separation groove formation step of S08, the first charge transport layer 13, the photoelectric conversion layer 14, and the second charge transport layer 15 are removed in multiple parallel linear directions by laser ablation, thereby forming multiple second internal separation grooves 22 as shown in Figure 6. The width of the second internal separation grooves 22 may be the same as the width of the first internal separation grooves 21, but may be larger than the width of the first internal separation grooves 21 in order to ensure connection of the second electrode layer 16 to the first electrode layer 12.

[0039] In the second electrode layer lamination process of S09, as shown in Figure 7, the second electrode layer 16 is laminated on the second charge transport layer 15. The second electrode layer 16 is an electrode that pairs with the first electrode layer 12, and in this embodiment, it is the negative electrode. The second electrode layer 16 is laminated so as to contact the first electrode layer 12 at the back of the second internal isolation groove 22 in order to electrically connect adjacent solar cell subcells 2 in series. The second electrode layer 16 may include a metal layer formed from, for example, copper, to reduce electrical resistance. The second electrode layer 16 may also have a multilayer structure including a transparent conductive oxide layer to improve adhesion with the second charge transport layer 15. The second electrode layer 16 can be laminated by methods such as sputtering, vacuum deposition, or plating.

[0040] The lower limit of the thickness of the second electrode layer 16 is preferably 10 nm, and more preferably 20 nm. On the other hand, the upper limit of the thickness of the second electrode layer 16 is preferably 200 nm, and more preferably 100 nm. By making the thickness of the second electrode layer 16 above the lower limit, the current collection resistance can be sufficiently reduced. Furthermore, by making the thickness of the second electrode layer 16 below the upper limit, the formation of the third internal separation groove 23 becomes easier.

[0041] In the third internal isolation groove formation step of S10, the first charge transport layer 13, photoelectric conversion layer 14, second charge transport layer 15, and second electrode layer 16 are removed in multiple parallel linear directions by laser ablation to form multiple third internal isolation grooves 23. As a result, a solar cell module 1 surrounded by an inactive region E is formed on the support substrate S, as shown in Figure 2. The width of the third internal isolation grooves 23 is the same as the width of the first internal isolation groove 21 and the first external isolation groove 31.

[0042] In the second external separation groove formation step of S11, a second external separation groove 32 is formed by laser ablation, which linearly removes at least the surface layer of the resin substrate layer 11, the first electrode layer 12, the first charge transport layer 13, the photoelectric conversion layer 14, the second charge transport layer 15, and the second electrode layer 16, defining the outer edge of the region where the solar cell module 1 is formed. The laser intensity for forming the second external separation groove 32 is preferably set higher than the laser intensity for forming the third internal separation groove 23, so that the resin substrate layer 11 is cut or its thickness is sufficiently reduced so that it can be easily fractured. For this reason, the laser intensity in the second external separation groove formation step is preferably set so that the heat input to the resin substrate layer 11 is greater than the heat input to the resin substrate layer 11 in the first external separation groove formation step. On the other hand, if the heat input is too high, separation becomes difficult due to deterioration, so it is desirable to use THG. In other words, the second external separation groove 32 divides the laminate of the resin substrate layer 11, the first charge transport layer 13, the photoelectric conversion layer 14, the second charge transport layer 15, and the second electrode layer 16 into the solar cell module 1 and the inactive region E.

[0043] In the illustrated example, the second external isolation groove 32 is formed inside the first external isolation groove 31, but it may also be formed outside the first external isolation groove 31, or it may be formed in the same position as the first external isolation groove 31 and overlapping with it. Alternatively, the second external isolation groove 32 may be formed in place of the third internal isolation groove 23 at the outer edge of the solar cell module 1. This improves the area ratio of the solar cell subcells 2 in the solar cell module 1. Note that when the second external isolation grooves 32 on both sides in the connection direction of the solar cell subcells 2 are formed in place of the third internal isolation groove 23, a connection portion 3 cannot be formed, but electrical connection can be made at the end face of the solar cell module 1 or at the first electrode layer 12 exposed in the area where a part of the resin substrate layer 11 has been removed.

[0044] The order of the third internal separation groove formation step and the second external separation groove formation step may be reversed, or they may be performed in parallel.

[0045] In the solar cell module peeling process of S12, the solar cell module 1 is separated by peeling the resin substrate layer 11 inside the second external separation groove 32 from the support substrate S. Because the second external separation groove 32 is formed by applying a relatively large amount of heat to the resin substrate layer 11, the resin substrate layer 11 can be peeled off from the support substrate S relatively easily, starting from the second external separation groove 32.

[0046] In the solar cell module manufacturing method according to this embodiment, which comprises the above steps, the first external separation groove 31 is formed, which prevents the resin substrate layer 11 from peeling off from the support substrate S during manufacturing, thereby improving the yield of the solar cell module 1. Furthermore, in the solar cell module manufacturing method according to this embodiment, the second external separation groove 32 is formed, which allows the solar cell module 1 to be selectively peeled off from the support substrate S relatively easily. This also prevents damage to the solar cell module 1 caused by excessive stress during peeling from the support substrate S.

[0047] Although embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above, and various modifications and variations are possible. For example, the solar cell module manufacturing method according to the present invention may include a step of laminating further layers such as an anti-reflective film or a protective film. [Explanation of symbols]

[0048] 1. Solar cell module 2 Solar cell subcells 3 Connection part 11 Resin base material layer 12 1st electrode layer 13 First charge transport layer 14 Photoelectric conversion layer 15 Second charge transport layer 16 Second electrode layer 21 1st internal separation groove 22 2nd internal separation groove 23 Third internal separation groove 31 1st external separation groove 32 2nd external separation groove E Invalid area S Support board

Claims

1. A method for manufacturing a solar cell module having multiple solar cell subcells, A process of laminating a resin substrate layer onto one main surface of the support substrate, The process of laminating a first electrode layer onto the resin substrate layer, A step of forming a first internal separation groove that cuts the first electrode layer at the boundary of the region where the solar cell subcell is formed by laser irradiation, A step of forming a first external separation groove that cuts the first electrode layer at the outer edge of the region where the solar cell module is formed by laser irradiation, The process involves laminating a first charge transport layer onto the first electrode layer, The process of laminating a photoelectric conversion layer onto the first charge transport layer, The process involves laminating a second charge transport layer onto the aforementioned photoelectric conversion layer, A step of forming a second internal separation groove that cuts through the first charge transport layer, the photoelectric conversion layer, and the second charge transport layer at the boundary of the region where the solar cell subcell is formed by laser irradiation, The process involves laminating a second electrode layer onto the second charge transport layer, A step of forming a third internal separation groove at the boundary of the region where the solar cell subcell is formed by laser irradiation, which cuts at least the second electrode layer among the first charge transport layer, the photoelectric conversion layer, the second charge transport layer, and the second electrode layer, A step of forming a second external separation groove that cuts through the first electrode layer, the first charge transport layer, the photoelectric conversion layer, the second charge transport layer, and the second electrode layer at the outer edge of the region where the solar cell module is formed by laser irradiation, A step of peeling the resin substrate layer inside the region where the solar cell module is formed from the support substrate, Equipped with, The steps of forming the first internal separation groove and forming the first external separation groove are performed before the step of laminating the first charge transport layer. The intensity of the laser forming the first external separation groove is higher than the intensity of the laser forming the first internal separation groove so as to alter the material of the resin substrate layer at the back of the first external separation groove, and the intensity of the laser forming the second external separation groove is higher than the intensity of the laser forming the third internal separation groove. Method for manufacturing solar cell modules.

2. The method for manufacturing a solar cell module according to claim 1, wherein the resin of the resin substrate layer is altered by laser irradiation to form the first external separation groove.

3. The module manufacturing method according to claim 1 or 2, wherein the step of laminating the resin substrate layer includes the steps of coating the support substrate with a polyamic acid solution and heating the coating film of the polyamic acid solution.

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