Semiconductor equipment, power converters

Abstract

Provided are a semiconductor device and power conversion device with a semiconductor module, comprising: a first cooling member and a second cooling member disposed on both surfaces of the semiconductor module respectively and circulating refrigerants through the inside thereof; a connecting member connecting a first opening for inflow and outflow of the refrigerant to and from the first cooling member between the first and second cooling members, with a second opening for inflow and outflow of the refrigerant to and from the second cooling member between the second and first cooling members; and a seal member disposed on the outer periphery of the connecting member at a position between the first cooling member and the second cooling member, wherein the connecting member has a connecting member end portion extending into the interior of the second cooling member, and wherein the connecting member end portion includes a fixing portion formed by being bent along the inner wall surface of the second cooling member.

Description

Technical Field

[0001] The present invention relates to a semiconductor device and a power conversion device.

Background Art

[0002] In a structure of a power conversion device that cools a power module by providing a water channel so as to sandwich the upper and lower parts of the power module, regarding the seal part provided at the connection part between the power module and the upper and lower water channels, a force is applied in a direction in which the power module and the water channel are separated by the water pressure of the refrigerant passing through the inside of the water channel. Therefore, a structure for securing the reliability of the seal part by fixing the water channel with a leaf spring, a leaf spring holding member, a fastening member, etc. has become common. For example, in Patent Document 1 below, a configuration of a cooling device that can be manufactured at a low cost by forming a flow path by stacking parts on which fins are formed is disclosed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the technology described in Patent Document 1, the watertightness between the flow paths of the upper and lower water channels is sealed using an O-ring, and accordingly, bolt fastening is required to hold the O-ring. In order to reduce such bolt parts and realize a device having the same structure, an object of the present invention is to provide a semiconductor device and a power conversion device that achieve further reduction in the number of parts and improvement in productivity while maintaining cooling performance.

Means for Solving the Problems

[0005] A semiconductor device and a power converter having at least one semiconductor module on which semiconductor elements are mounted, comprising: a first cooling member and a second cooling member disposed on both sides of the semiconductor module and having a coolant flowing through their interiors; a connecting member connecting a first opening between the first cooling member and the second cooling member for the coolant to flow into and out of the first cooling member, and a second opening between the first cooling member and the second cooling member for the coolant to flow into and out of the second cooling member; and a sealing member disposed on the outer circumference of the connecting member at a position between the first cooling member and the second cooling member, wherein the connecting member has a connecting member end that extends into the interior of the second cooling member, and the connecting member end includes a fixing portion formed by bending along the inner wall surface of the second cooling member. [Effects of the Invention]

[0006] We can provide semiconductor devices and power converters that achieve further reductions in the number of parts and improved productivity while maintaining cooling performance. [Brief explanation of the drawing]

[0007] [Figure 1] Electrical circuit diagram of a power converter connected to a rotating electric machine. [Figure 2] Electrical circuit diagram of a single-phase semiconductor module [Figure 3] Overall perspective view of a semiconductor device according to the first embodiment of the present invention [Figure 4] Figure 3: Overall exploded view of the semiconductor device. [Figure 5] Cross-sectional view of the connection portion between cooling members of a semiconductor device according to the first embodiment of the present invention (cross-sectional view AA in Figure 3) [Figure 6] Diagram illustrating the method for forming the first fixing part according to the first embodiment of the present invention. [Figure 7] Cross-sectional view of the connection portion between cooling members of a semiconductor device according to a second embodiment of the present invention. [Figure 8] Cross-sectional view of the connection portion between cooling members of a semiconductor device according to a third embodiment of the present invention. [Figure 9]Cross-sectional view of the connection portion between cooling members of a semiconductor device according to a fourth embodiment of the present invention. [Figure 10] Overall perspective view of a semiconductor device according to a fifth embodiment of the present invention [Figure 11] Figure 10 is a cross-sectional view of the connection between cooling members of a semiconductor device.

[0008] Embodiments of the present invention will be described below with reference to the drawings. The following description and drawings are illustrative for illustrating the present invention, and have been omitted and simplified as appropriate for clarity of explanation. The present invention can also be carried out in various other forms. Unless otherwise specified, each component may be singular or plural.

[0009] The positions, sizes, shapes, and ranges of the components shown in the drawings may not represent their actual positions, sizes, shapes, and ranges in order to facilitate understanding of the invention. Therefore, the present invention is not necessarily limited to the positions, sizes, shapes, and ranges disclosed in the drawings.

[0010] (First embodiment and overall configuration of the present invention) (Figure 1) The power converter 1 is a device that converts DC power input from a DC power source 2 (a battery) into AC power and outputs it to a motor 6. The power converter 1 includes a capacitor 3, a control device 4, an upper arm 300U, and a lower arm 300L. The capacitor 3 smooths the DC power output from the DC power source 2 to the switching element of the power converter 1. The control device 4 controls the switching operation of the upper arm 300U and lower arm 300L, which are switching elements, related to power conversion.

[0011] (Figure 2) A semiconductor module 300 having the functions of a power module includes power semiconductor elements 321U, 321L, 322U, and 322L. The power semiconductor elements 321U and 321L are IGBTs (Insulated Gate Bipolar Transistors). The power semiconductor elements 322U and 322L are diodes. Note that the power semiconductor elements 321U, 321L, 322U, and 322L can be alternatively applied with FETs (Field Effect Transistors) or the like.

[0012] The semiconductor module 300 is composed of the upper arm 300U and the lower arm 300L described above. The upper arm 300U is composed of the power semiconductor element 321U and the diode 322U. The lower arm 300L is composed of the power semiconductor element 321L and the diode 322L. The upper arm 300U has a DC positive terminal 311 and a signal terminal 314. The lower arm 300L has a DC negative terminal 312 and a signal terminal 315.

[0013] The DC positive terminal 311 and the DC negative terminal 312 are connected to the capacitor 3 etc. described above, and supply power to the power semiconductor elements 321U, 321L, 322U, and 322L from outside the semiconductor module 300. The signal terminals 314 and 315 are connected to a control board including the control device 4 described above, whereby the switching operations of the power semiconductor elements 321U and 321L are controlled by the control device 4.

[0014] The semiconductor module 300 includes an AC terminal 313. The AC terminal 313 electrically connects the upper arm 300U and the lower arm 300L, and outputs the AC power converted from the DC power by the power semiconductor elements 321U and 321L, which are switching elements, to the outside of the semiconductor module 300. <m

[0015] (Figure 3) The semiconductor device 100 that constitutes the aforementioned power conversion device 1 has a configuration of a semiconductor unit with a cooler, and includes at least one semiconductor module 300 on which semiconductor elements are mounted, a first cooling member 101, and a second cooling member 201. As shown in FIG. 3, the semiconductor device 100 mounts three-phase semiconductor modules 300, thereby constituting a three-phase power conversion circuit. The three-phase semiconductor modules 300 are molded and sealed with a sealing resin 330.

[0016] The positive electrode terminals 311 of each semiconductor module 300 are each exposed from the sealing resin 330. The negative electrode terminals 312 of each semiconductor module 300 are exposed from the sealing resin 330. The AC terminals 313 of each semiconductor module 300 are exposed from the sealing resin 330. The signal terminals 314 and 315 of each semiconductor module 300 are each exposed from the sealing resin 330.

[0017] The first cooling member 101 and the second cooling member 201 are arranged on both sides of the semiconductor module 300 and are in contact with it respectively. Thus, the semiconductor module 300 is arranged sandwiched between the first cooling member 101 and the second cooling member 201, and is cooled by the refrigerant flowing inside the first cooling member 101 and the second cooling member 201.

[0018] The second cooling member 201 has at least four flange portions 202. Each flange portion 202 has a through hole 203. Fastening members such as screws and bolts are inserted into the through holes 203, whereby the semiconductor device 100 is fixed to a housing (not shown) of the power conversion device 1.

[0019] (FIG. 4) The semiconductor module 300 has multiple heat dissipation surfaces 340 for dissipating heat from inside the semiconductor module 300. The heat dissipation surfaces 340 are provided on both sides of the semiconductor module 300, although the back surface is not shown, and are exposed surfaces that are not molded and sealed by the aforementioned sealing resin 330. By having such heat dissipation surfaces 340, the semiconductor module 300 dissipates the heat generated inside the semiconductor module 300 to the outside.

[0020] Adhesive members 500 are placed between the semiconductor module 300 and the first cooling member 101, and between the semiconductor module 300 and the second cooling member 201. The adhesive members 500 are thermally conductive and insulating, and are provided so that the semiconductor module 300 is sandwiched between them. The adhesive members 500 are thermally connected to the heat dissipation surface 340. This improves the reliability of the connection between the semiconductor module 300 and the cooling members 101 and 201. Note that if an insulating layer is provided inside the semiconductor module 300, the adhesive members 500 do not necessarily have to be insulating.

[0021] The first cooling member 101 has a cover 110, a first fin 130, and a first fin base 140. The first cooling member 101 is also connected to a connecting member 150. These members are made of an aluminum-based alloy or a copper-based alloy and are joined together by a joining method such as brazing.

[0022] The first fin base 140 has two first fin base openings 141. The first fin base openings 141 are openings for allowing refrigerant to flow into and out of the first cooling member 101 between the first fin base 140 and the second cooling member 201. The first fin base openings 141 are formed at both ends of the first fin base 140 so as to sandwich the first fin 130 between them.

[0023] The first cooling member 101 has a first fin housing section 111, described later, which houses a first fin 130, which is a heat dissipation fin for dissipating heat from the semiconductor module 300. The first fin housing section 111 is housed in a first fin housing section 111 formed by a cover 110 and a first fin base 140, and is joined to the cover 110 and the first fin base 140, respectively.

[0024] The connecting member 150 has a connecting channel 151. The connecting member 150 is joined to the first fin base 140. The connecting member 150 is positioned so that a channel can be formed when the connecting channel 151 and the opening 141 of the first fin base are in communication.

[0025] The second cooling member 201 includes a water channel base 210, a frame 220, a second fin 230, and a second fin base 240. These members are made of an aluminum-based alloy or a copper-based alloy and are joined together integrally by a joining method such as brazing.

[0026] The water channel base 210 has two water channel base openings 211. The water channel base openings 211 allow refrigerant to flow into and out of the second cooling member 201. The water channel base openings 211 are formed on the water channel base 210 at both ends, with the second fin 230 in between. Of the two water channel base openings 211, one is an inlet for introducing refrigerant into the second cooling member 201 from the outside, and the other is an outlet for discharging refrigerant from the second cooling member 201 to the outside. The water channel base openings 211 are openings formed in the second cooling member 201 at a position opposite to the fixing portion 154, which will be described later.

[0027] The frame 220 has a second fin housing portion 221 that houses a second fin 230, which is a heat dissipation fin for dissipating heat from the semiconductor module 300. The second fin base 240 has two second fin base openings 241. The second fin base openings 241 are formed at both ends on the second fin base so as to sandwich the second fin 230 between them.

[0028] The two second fin base openings 241 are openings through which refrigerant flows in and out between the first cooling member 101 and the second cooling member 201. The refrigerant introduced from the water channel base opening 211 is supplied from the second cooling member 201 to the first cooling member 101 through one of the two second fin base openings 241, and is returned from the first cooling member 101 to the second cooling member 201 through the other of the two second fin base openings 241.

[0029] The second fin 230 is housed in the second fin housing 221, sandwiched on both sides by the waterway base 210 and the second fin base 240, and joined to each member. The frame 220 is sandwiched on both sides by the waterway base 210 and the second fin base 240, and joined to each member, thereby forming the second fin housing 221.

[0030] The first cooling member 101 and the second cooling member 201 are arranged such that a single flow path is formed when the connecting flow path 151 of the connecting member 150, the first fin base opening 141, and the second fin base opening 241 are connected. Therefore, the connecting member 150 connects the first fin base opening 141 and the second fin base opening 241.

[0031] The sealing member 400 is positioned on the outer circumference of the connecting member 150 between the first cooling member 101 and the second cooling member 201, and is positioned to be in contact with the connecting member 150 and the second fin base 240. This ensures watertightness at the connection between the connecting member 150 and the second cooling member 201.

[0032] Let's explain the flow of the refrigerant. When refrigerant is supplied to the second cooling member 201 from one of the two water channel base openings 211, the path through which the refrigerant flows is divided into two paths: one that flows to the second fin 230 of the second fin housing 221, and another that flows from the second fin base opening 241 to the first fin housing 111 via the connecting flow path 151. The refrigerant that has passed through the first fin 130 of the first fin housing 111 returns to the second cooling member 201 via the other connecting flow path 151, merges with the refrigerant that has passed through the second fin 230, and is discharged to the outside of the second cooling member 201 from the other water channel base opening 211.

[0033] (Figure 5) Figure 5 is a cross-sectional view of Figure 3, section AA. The first cooling member 101 has a cover 110 and a first fin base 140 that form a first fin housing 111. The first fin 130 is positioned within the first fin housing 111.

[0034] The connecting member 150 connects the first cooling member 101 and the second cooling member 201. Between the first cooling member 101 and the second cooling member 201, the outer circumference of the connecting member 150 has a seal member housing portion 152. The seal member housing portion 152 houses the seal member 400, and the seal member 400 is in close contact with the outer wall surface of the second fin base 240, thereby ensuring watertightness of the waterway between the first cooling member 101 and the second cooling member 201.

[0035] The second fin base 240 has a seal member installation portion 243. The seal member installation portion 243 is the portion surrounding the opening 241 of the second fin base and is part of the outer wall surface of the second fin base 240 into which the seal member 400 is in close contact. By the seal member 400 contacting and being in close contact with the seal member installation portion 243, watertightness of the waterway between the first cooling member 101 and the second cooling member 201 can be ensured.

[0036] In the second cooling member 201, the second fin base 240 includes an inclined portion 245 that slopes toward the first cooling member 101, and a flat portion 244 that extends from the inclined portion 245 to the outer circumferential surface of the connecting member 150 and makes contact with it. The seal member installation portion 243 is formed on the flat portion 244.

[0037] The connecting member 150 has a connecting member end 155 that extends into the interior of the second cooling member 201. The connecting member end 155 includes a fixing portion 154 formed by bending the connecting member end 155 to the inner wall surface of the second cooling member 201.

[0038] The connecting member 150 has a connecting channel wall 153 that comes into contact with the refrigerant flowing through the connecting channel 151 and the second cooling member 201. The connecting channel wall 153 is inserted into the second cooling member 201 through the second fin base opening 241. The connecting channel wall 153 is bent toward the inner wall surface of the channel of the second fin base 240 so that the seal member installation portion 243 is housed in the seal member housing portion 152. In this way, the seal member 400 and the seal member installation portion 243 come into contact, and a fixing portion 154 that holds the seal member 400 in the seal member housing portion 152 is formed inside the second cooling member 201.

[0039] The second fin base 240 has a flat portion 244 and an inclined portion 245, thereby forming a connecting flow path accommodating portion 242. The connecting flow path accommodating portion 242 has space to accommodate a fixed portion 154 formed within the second cooling member 201. Since the end portion 155 of the connecting member is bent to form the fixed portion 154, it is preferable that the height of the connecting flow path accommodating portion 242 is greater than the thickness of the fixed portion 154. In this way, the flow of refrigerant flowing towards the second fin 230 side in the second cooling member 201 is not obstructed by the thickness of the fixed portion 154, thus preventing a decrease in the cooling performance of the second cooling member 201 due to difficulty in refrigerant flow.

[0040] As shown in the figure, the diameter W2 of the water channel base opening 211 is larger than the inner diameter W1 of the tip of the fixing part 154. This makes it easier to insert the tool described later for forming the fixing part 154 through the water channel base opening 211 into the second cooling member 201, and since the fixing part 154 can be formed after the first cooling member 101 and the second cooling member 201 are assembled, productivity is improved.

[0041] In the first cooling member 101, the cover 110 has a cover brazing portion 112. The cover brazing portion 112 is formed in the cross-section of Figure 5 at a position where the sealing member 400 and the fixing portion 154 overlap in the thickness direction (vertical direction in Figure 5) of the semiconductor device 100.

[0042] The brazed cover portion 112 receives the force generated when the fixing portion 154 is pressed when the fixing portion 154 is formed using a fixing portion forming tool, which will be described later. This force is applied from the first fin base 140 to the first cover 110. This suppresses deformation of the first cooling member 101, which is likely to occur when the fixing portion 154 is formed.

[0043] The first fin 130 is larger in the longitudinal direction (left-right direction in Figure 5) than the second fin 230 in the cross-section of Figure 5. A portion of the first fin 130 is positioned in the first cooling member 101 in the stacking direction of the semiconductor device 100 (up-down direction in Figure 5) in the cross-section of Figure 5, overlapping with the sealing member 400 and the fixing part 154.

[0044] When the fixing portion 154 is formed using a tool that will be described later, the first fin 130 receives a force from the first fin base 140 that presses against the inside of the first cooling member 101, which is a force generated when the fixing portion 154 is pressed. This suppresses deformation of the first cooling member 101 that is likely to occur when the fixing portion 154 is formed.

[0045] (Figure 6) Figure 6(a) is a cross-sectional view of the connection between cooling members of the semiconductor device before the fixing portion 154 is formed; Figure 6(b) is a perspective view from viewpoint B of Figure 6(a), excluding the second cooling member 201 and the sealing member 400; Figure 6(c) is a cross-sectional view of the connection between cooling members of the semiconductor device after the fixing portion 154 is formed; and Figure 6(d) is a perspective view from viewpoint C of Figure 6(c), excluding the second cooling member 201, the sealing member 400, and the fixing portion forming tool 171.

[0046] As shown in Figure 6(a), the sealing member 400 is housed in the sealing member housing portion 152 of the first cooling member 101. A portion of the connecting member 150 is inserted into the second fin base opening 241. The connecting channel wall 153 of the connecting member 150 is pressed by a fixing portion forming tool 171 inserted from the water channel base opening 211 in the insertion direction 170, causing it to be bent in the opening direction. As a result, as shown in Figure 6(c), the connecting channel wall 153 and the second fin base 240 are joined by pressure, forming a fixing portion 154.

[0047] Since the fixing portion 154 is formed in close contact with the inner wall surface of the second fin base 240 from the second fin base opening 241, the force holding the sealing member 400 is increased, and high watertightness of the flow path can be obtained. However, as long as the force holding the sealing member 400 can be maintained, it is not necessary for the fixing portion 154 to be formed along the entire portion of the second fin base opening 241, and the fixing portion 154 may be formed only on a part of the second fin base opening 241.

[0048] In this way, the leaf springs and reinforcing plates that were required in the conventional structure to fix the connecting member 150, which connects to the first cooling member 101, to the second cooling member 201 become unnecessary, reducing the number of parts and improving productivity.

[0049] (Second Embodiment) (Figure 7) In the second embodiment, the connecting member 150 that was provided to connect the first cooling member 101 and the second cooling member 201 in the first embodiment is not provided. Instead, a portion of the first fin base 140 of the first cooling member 101 extends to the second cooling member 201 through the second fin base opening 241. This forms a connecting channel 151 in which the first fin base 140 and the connecting member 150 are integrally formed.

[0050] The first fin base 140 has the same shape as the second fin base 240, thereby securing space equivalent to the height of the aforementioned semiconductor module 300, which is placed between the first cooling member 101 and the second cooling member 201.

[0051] The aforementioned fixing part forming tool 171 presses the connecting flow channel wall 153 of the second fin base 240 from the second cooling member 201 side, thereby forming the fixing part 154. The sealing member 400 has a square cross-sectional shape and contacts the outer walls of the first fin base 140 and the second fin base 240, and is pressed and fixed in place as the fixing part 154 is formed. This reduces the number of parts and improves productivity.

[0052] (Third embodiment) (Figure 8) The first cooling member 101 includes a cover 110, a first frame 120, and a first fin base 140. The difference from the first embodiment described above is that the shape of the cover 110 is different, and the first frame 120 is also provided on the first cooling member 101.

[0053] The first frame 120 has a first fin housing portion 111. The first fin 130 is arranged in the first fin housing portion 111. The first frame 120 is part of the flow path wall of the first cooling member 101 and has a cover joint portion 122 and a first fin base joint portion 123 on both sides. The second cooling member 201 has the same structure as in the embodiment described above. The second frame 220 forms part of the flow path wall of the flow path formed inside the second cooling member 201.

[0054] The cover joint 122 connects the cover 110 to the first frame 120. The first fin base joint 123 connects the first frame 120 to the first fin base 140. The cover 110 is a flat plate-shaped member.

[0055] Therefore, the first cooling member 101 includes a first fin base 140 which is a base member that is joined to the heat dissipation fins 130, a first frame 120 which is a frame member that forms a space for housing the heat dissipation fins 130, and a first cover 110 which is a flat plate member that is positioned opposite the first fin base 140 with the first frame 120 in between, and is joined to the first frame 120, thereby forming a flow path inside the first cooling member 101.

[0056] Furthermore, the second cooling member 201 includes a second fin base 240, which is a base member to which the heat dissipation fins 230 are joined; a second frame 220, which is a frame member that forms a space for housing the heat dissipation fins 230; and a channel base 210, which is a flat plate member that is positioned opposite the second fin base 240 with the second frame 220 in between, and is joined to the second frame 220, thereby forming a flow path inside the second cooling member 201.

[0057] This structure allows for the placement of a load-receiving jig (not shown) on the outer surface of the cover 110 to receive pressure from the aforementioned fixing part forming tool 171 when forming the fixing part 154, thus simplifying the shape of the jig. Furthermore, the ease of bending when forming the fixing parts 154 and 164 is improved, resulting in increased productivity. Additionally, the design flexibility for the area placement of the cover seal member (details described later) that adheres tightly to the flat plate members 110 and 210 when the opening is not used is increased, contributing to miniaturization.

[0058] (Fourth Embodiment) (Figure 9) The fourth embodiment is a cover 110 of the third embodiment in which a first cover opening 110a is formed. The cooling member 101 is a flat plate member and has a cover opening 110a for inflowing and outflowing refrigerant, and a cover sealing member 410 for sealing the cover opening 110a, at a position facing the connecting member 150.

[0059] The cover opening 110a is formed in a position that overlaps with the fixing portion 154 and the sealing member 400 in the stacking direction on the cross-section shown in Figure 9. The cover sealing member 410 ensures watertightness to the refrigerant flowing inside the cover 110 by closing the cover opening 110a. Furthermore, by removing the cover sealing member 410 from the first cooling member 101, it is possible to accommodate a structure that further increases the layered structure of the water channels. The cover sealing member 410 is fixed to the first cooling member 101 by using a fixing member (not shown) that is fixed to the first cooling member 101 from the outside, or by applying an adhesive to the surface of the cooling member 101 and bonding it thereto.

[0060] The diameter W3 of the cover opening 110a is larger than the inner diameter W1 of the tip of the fixing part 154. This makes it easier to insert a load-receiving jig (not shown) of a size corresponding to the fixing part forming tool 171 into the first cooling member 101 from the cover opening 110a when forming the fixing part 154 with the aforementioned fixing part forming tool 171. In this way, deformation of the first cooling member 101 due to load can be suppressed, and productivity can be improved.

[0061] (Fifth embodiment) (Figure 10) The semiconductor device 100 may have a two-story structure by arranging three-phase semiconductor modules 300 in two layers. The two-story semiconductor device 100 has a first cooling member 101, a second cooling member 201, and a third cooling member 601. The third cooling member 601 has two cover seal members 410 for sealing the internal refrigerant. By having two cover seal members 410 on the third cooling member 601, it is possible to further increase the layered structure of the water channels by removing the cover seal members 410 and creating new openings.

[0062] The first cooling member 101 and the second cooling member 201 are arranged with a three-phase semiconductor module 300 in between them. Similarly, the first cooling member 101 and the third cooling member 601 are also arranged with a three-phase semiconductor module 300 in between them.

[0063] This configuration allows for the incorporation of more semiconductor modules 300 into the semiconductor device 100 compared to the embodiment described above, enabling the realization of a high-power semiconductor device 100 with two 3-phase outputs and parallel connections between the semiconductor modules 300. Note that the arrangement of the semiconductor modules 300 is not limited to the six shown in the figure; multiple modules may be arranged.

[0064] (Figure 11) The first cooling member 101 includes a first cover 110, a first frame 120, a first fin 130, and a second cover 140. The first cooling member 101 is also connected to a first connecting member 150 and a second connecting member 160, respectively.

[0065] The first cover 110 has a first cover opening 110a. The second cover 140 has a second cover opening 141. The first cooling member 101 has a first fin housing portion 111. The first fin 130 is housed in the first fin housing portion 111.

[0066] The first cooling member 101 has a first cover opening 110a, a second cover opening 141, and a first fin housing 111 that are in communication with each other, thereby forming a flow path through which refrigerant flows from the second cooling member 201 to the third cooling member 601.

[0067] The first cover 110 and the second cover 140 may have the same shape as shown in the figure. If the first cover 110 and the second cover 140 have the same shape, they can be manufactured using the same mold in press molding, thus improving productivity.

[0068] The second connecting member 160 has the same configuration as the first connecting member 150 and connects the first cooling member 101 and the third cooling member 601 via a water channel. The third fin base 640 has the same configuration as the second fin base 240. The fixing portion 164 formed within the third cooling member 601 has the same shape as the fixing portion 154 formed on the second cooling member 201, and the method of forming it is also the same.

[0069] The third fin 630, which is a heat dissipation fin for dissipating heat from the semiconductor module 300, is housed in a third fin housing 621 formed by the third frame 620 of the third cooling member 601. The cover seal member 410 can ensure the watertight seal of the third cooling member 601 by making close contact with the third cover opening 611 formed in the third cover 610 of the third cooling member 601.

[0070] If the first connecting member 150 and the second connecting member 160 have the same shape, the same mold can be used, thus improving productivity. As shown in Figure 11, the first connecting member 150 and the second connecting member 160 are positioned to overlap in the stacking direction in cross-section, making it possible to simultaneously form the first fixing portion 154 formed on the second cooling member 201 and the second fixing portion 164 formed on the third cooling member 601, thus improving productivity.

[0071] According to the embodiments of the present invention described above, the following effects and advantages are achieved.

[0072] (1) A semiconductor device having at least one semiconductor module 300 on which semiconductor elements are mounted, comprising: a first cooling member 101 and a second cooling member 201 arranged on both sides of the semiconductor module 300 and through which a coolant flows; a first opening 141 between the first cooling member 101 and the second cooling member 201 for the coolant to flow into and out of the first cooling member 101; a second opening 241 between the first cooling member 101 and the second cooling member 201 for the coolant to flow into and out of the second cooling member 201; a connecting member 150 connecting the two; and a sealing member 400 arranged on the outer circumference of the connecting member 150 at a position between the first cooling member 101 and the second cooling member 201. The connecting member 150 has a connecting member end 155 that extends into the interior of the second cooling member 201. The connecting member end 155 includes a fixing portion 154 formed by bending the connecting member end 155 along the inner wall surface of the second cooling member 201. In this way, we can provide a semiconductor device 100 that achieves further reduction in the number of parts and improved productivity while maintaining cooling performance.

[0073] (2) In the second cooling member 201, the diameter W2 of the third opening 211, which is formed at a position opposite to the fixing portion 154, is larger than the inner diameter W1 of the tip of the fixing portion 154. This allows the fixing portion forming tool 171, which forms the fixing portion 154, to be easily inserted into the second cooling member 201 through the third opening 211.

[0074] (3) The second cooling member 201 includes an inclined portion 245 that slopes toward the first cooling member 101 and a flat portion 244 that extends from the inclined portion 145 to the outer surface of the connecting member 150 and makes contact with it. This ensures that there is space in the flow path to accommodate the fixed portion 154, and the flow of refrigerant that flows toward the fin arrangement side is not obstructed by the thickness of the fixed portion 154, thereby preventing a decrease in cooling performance.

[0075] (4) The first cooling member 101 and the second cooling member 201 each have base members 140 and 240 that are joined to the heat dissipation fins 130 and 230, frame members 120 and 220 that form a space for housing the heat dissipation fins 130 and 230, and flat plate members 110 and 210 that are positioned opposite the base members 140 and 240 with the frame members 120 and 220 in between, and are joined to the frame members 120 and 220, thereby forming a flow path inside the first cooling member 101 and the second cooling member 201. This increases the design freedom for the area arrangement of the cover seal member on the flat plate members 110 and 210, thus contributing to miniaturization. In addition, the ease of bending when forming the fixing parts 154 and 164 is improved, thus improving productivity.

[0076] (5) The flat plate member 110 has a fourth opening 110a for inflowing and outflowing refrigerant at a position opposite to the connecting member 150. This allows the load-receiving jig corresponding to the fixing part forming tool 171 to be inserted into the cooling member 101, improving productivity. It also increases the design flexibility of the first cover opening 110a.

[0077] (6) The diameter W3 of the cover opening 110a is larger than the inner diameter W1 of the tip of the fixing part 154. This makes it easier to insert a load-receiving jig of a size corresponding to the fixing part forming tool 171 into the cooling member 101 from the opening 110a when forming the fixing part 154, thereby improving productivity.

[0078] (7) An adhesive member 500 is placed between the semiconductor module 300 and the first cooling member 101, and between the semiconductor module 300 and the second cooling member 201. This improves the connection reliability between the semiconductor module 300 and the cooling members 101 and 201.

[0079] (8) A power converter 1 is provided which includes the semiconductor device 100 having the above configuration. In this way, a power converter 1 can be provided which further reduces the number of parts and improves productivity while maintaining cooling performance.

[0080] It should be noted that the present invention is not limited to the embodiments described above, and various modifications and combinations of other configurations can be made without departing from the spirit of the invention. Furthermore, the present invention is not limited to having all the configurations described in the embodiments described above, and may also include configurations in which some of those configurations are omitted. [Explanation of symbols]

[0081] 1. Power converter 2 DC power supply 3 Capacitors 4. Control device 6 motors 100 Semiconductor Equipment 101 First cooling member 110 cover 110a First cover opening 111 First Fin Storage Section 112 Cover brazing section 120 First frame (frame member) 122 Cover joint 123 First fin base joint 130 First Fin 140 First fin base (second cover) 141 First fin base opening (second cover opening) 150 Connecting member (first connecting member) 151 Connecting channel 152 Sealing member housing section 153 Connecting channel wall 154 Fixed part (1st fixed part) 155 Connecting member end 160 Second connecting member 164 2nd fixed part 170 Insertion direction 171 Fixing part forming tool 201 Second cooling member 202 Flange section 203 Through hole 210 Waterway Base 211 Waterway base opening 220 frames (2nd frame) 221 Second Fin Storage Section 230 Second Fin 240 2nd fin base 241 Second fin base opening 242 Connecting channel housing section 243 Sealing material installation section 244 Plane section 245 Slope 300 semiconductor modules 311 Positive terminal 312 Negative terminal 313 AC terminal 314, 315 signal terminals 330 Sealing resin 400 sealing member 410 Cover sealing member 500 Adhesive Members 601 Third cooling member 610 Third Cover 611 Third cover opening 620 Third Frame 621 Third Fin Storage Section 630 Third Fin 640 3rd fin base

Claims

1. A semiconductor device having at least one semiconductor module on which semiconductor elements are mounted, The semiconductor module is provided with a first cooling member and a second cooling member, each positioned on both sides of the module and having a coolant circulating inside them. A connecting member that connects the first cooling member with the second cooling member, a first opening for inflowing and outflowing the refrigerant into the first cooling member, and a second opening for inflowing and outflowing the refrigerant into the second cooling member, The system comprises a sealing member positioned between the first cooling member and the second cooling member, and the sealing member positioned on the outer circumference of the connecting member, The connecting member has a connecting member end that extends into the interior of the second cooling member, The end of the connecting member includes a fixing portion formed by bending the end of the connecting member along the inner wall surface of the second cooling member. Semiconductor equipment.

2. In the second cooling member, the diameter of the third opening, which is formed at a position opposite the fixed portion and for inflowing and outflowing the refrigerant, is larger than the inner diameter of the tip of the fixed portion. The semiconductor device according to claim 1.

3. The second cooling member comprises an inclined portion that slopes toward the first cooling member, and a flat portion that extends from the inclined portion to the outer circumferential surface of the connecting member and makes contact with it. The semiconductor device according to claim 1.

4. The first cooling member and the second cooling member each include a base member that is joined to a heat dissipation fin, a frame member that forms a space for housing the heat dissipation fin, and a flat plate member that is positioned opposite the base member with the frame member in between, and is joined to the frame member, thereby forming a flow path inside the first cooling member and the second cooling member. The semiconductor device according to claim 1.

5. The flat plate member has a fourth opening at a position opposite to the connecting member for inflow and outflow of the refrigerant. The semiconductor device according to claim 4.

6. The diameter of the fourth opening is larger than the inner diameter of the tip of the fixing part. The semiconductor device according to claim 5.

7. An adhesive member is placed between the semiconductor module and the first cooling member, and between the semiconductor module and the second cooling member, respectively. The semiconductor device according to claim 1.

8. The semiconductor device comprises the semiconductor device described in any one of claims 1 to 6. Power converter.

Images